Heat dissipation structure and electronic device comprising same

Abstract

In an embodiment, an electronic device is provided. The electronic device can include a printed circuit board, an electronic component arranged on one surface of the printed circuit board, and a housing for dissipating heat of the electronic component. The housing can include a base portion for the electronic component, a cover portion arranged on a support of the base portion, and a plurality of fin portions coupled to the cover portion. Each of the plurality of fin portions can have a heat spreader region and a protruding region. A portion of the heat spreader region can protrude from a first surface of the cover portion, and another portion of the heat spreader region can protrude from a second surface of the cover portion opposite the first surface. The protruding region can be coupled to the support or the cover portion such that the heat spreader region is spaced apart from one surface of the base portion by a predetermined distance or more.

Description

Technical Field

[0001] This disclosure relates to a heat dissipation structure and an electronic device including the same. Background Technology

[0002] Electronic devices may include various electronic components to perform communication. These electronic components can generate heat. For example, heat generated in an electronic component can degrade the performance of that component and another electronic component. To dissipate the heat generated in the electronic component, the electronic device may include a heat dissipation structure.

[0003] The above information is provided as relevant technology to aid in understanding the purposes of this disclosure. No dispute or decision is made regarding whether any of the above descriptions can be applied as prior art in connection with this disclosure. Summary of the Invention

[0004] Technical solution In one embodiment, an electronic device is provided. The electronic device may include a printed circuit board (PCB), electronic components disposed on one side of the PCB, and a housing for heat dissipation of the electronic components. The housing may include a base portion, a cover portion, and a plurality of fin portions for the electronic components. The cover portion is disposed on a support of the base portion, and the plurality of fin portions are coupled to the cover portion. Each of the plurality of fin portions may have a heat sink region and a protruding region. A portion of the heat sink region may be configured to protrude from a first side of the cover portion, and another portion of the heat sink region may be configured to protrude from a second side of the cover portion, the second side being opposite to the first side. The protruding region may be coupled to the support or the cover portion such that the heat sink region is spaced apart from one side of the base portion by a predetermined distance or greater.

[0005] In one embodiment, a housing with a steam chamber is provided. The housing may include: a base portion having a support; a cover portion disposed on the support of the base portion; and a plurality of fin portions coupled to the cover portion. Each of the plurality of fin portions may have a heat sink region and a protruding region. A portion of the heat sink region may be configured to protrude from a first side of the cover portion, and another portion of the heat sink region may be configured to protrude from a second side of the cover portion, the second side opposite to the first side. The protruding region may be coupled to the support or the cover portion such that the heat sink region is spaced apart from one side of the base portion by a predetermined distance or greater. Attached Figure Description

[0006] Figure 1 A wireless communication system is shown.

[0007] Figure 2 The network entities are shown in a distributed deployment.

[0008] Figure 3a An example of the exterior of an electronic device, including a heat dissipation structure, is shown.

[0009] Figure 3b An example of an electronic device including a heat dissipation structure is shown.

[0010] Figure 4 A front view of the casing with a steam chamber is shown.

[0011] Figure 5 A perspective view of the shell with a steam chamber is shown.

[0012] Figure 6 An example of a component with a housing containing a steam chamber is shown.

[0013] Figure 7a and Figure 7b The connection structure between components of a housing with a steam chamber is shown.

[0014] Figures 8a to 8d An example of the deployment of a protruding area of ​​the housing for separating the cover portion and the base portion of the housing is shown.

[0015] Figure 9a and Figure 9b An example of a fin with a steam chamber is shown.

[0016] Figure 10 An example of the design of the column in the base section is shown.

[0017] Figure 11a and Figure 11b An example of an electronic device is shown, including a housing with a steam chamber.

[0018] Figure 12a and Figure 12b An example of an electronic device is shown, including a housing with a steam chamber. Detailed Implementation

[0019] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the scope of another embodiment. Singular expressions may include plural expressions unless the context clearly indicates otherwise. The terms used herein (including technical or scientific terms) may have the same meanings as commonly understood by one of ordinary skill in the art as described in this disclosure. Among the terms used in this disclosure, terms defined in general dictionaries may be interpreted as having the same or similar meaning as in the context of related art, and should not be construed as having an ideal or overly formal meaning unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure should not be construed as excluding embodiments of this disclosure.

[0020] In the various embodiments of this disclosure described below, a hardware approach will be described as an example.

[0021] However, because various embodiments of this disclosure include techniques using both hardware and software, various embodiments of this disclosure do not exclude a software-based approach.

[0022] The following description uses terms referring to components of electronic devices (e.g., communication modules, wireless communication modules, heat dissipation modules, substrates, printed circuit boards (PCBs), flexible PCBs (FPCBs), printed circuit board assemblies (PBAs), modules, antennas, antenna elements, circuit systems, processors, chips, components, and devices), and terms referring to RF-related components (e.g., front-end modules (FEMs), power amplifier modules (PAMs), FEMs including duplexers (FEMid), power amplifier modules including duplexers (PAMid), low-noise amplifier PAMs including duplexers (LPAMid)). The terms RF front-end (RFFE) and RF integrated circuit (RFIC), terms referring to the shape of components (e.g., opening area, opening portion, protruding area, protrusion, structure, structural body, support, and contact), terms referring to the connection between structures (e.g., connection portion, contact, support, contact structure, conductive member, and assembly), and terms referring to circuit systems (e.g., PCB, FPCB, signal line, feeder line, data line, RF signal line, antenna line, RF path, RF module, RF circuit, splitter, shunt, coupler, and combiner) are illustrative for ease of description. Therefore, this disclosure is not limited to the terms described below, and other terms with equivalent technical meanings may be used. Furthermore, terms such as “…unit,” “…device,” “…object,” and “…structure,” as used below, may refer to at least one shape structure or may refer to a unit with processing functionality.

[0023] Additionally, in this disclosure, the terms "greater than" or "less than" can be used to determine whether a particular condition is met or fulfilled; however, this is merely a descriptive term for illustrative purposes and does not exclude descriptions of "greater than or equal to" or "less than or equal to". A condition described as "greater than or equal to" may be replaced with "greater than", a condition described as "less than or equal to" may be replaced with "less than", and a condition described as "greater than or equal to and less than" may be replaced with "greater than and less than or equal to". Furthermore, in the following text, "A" to "B" refers to at least one element from A (inclusive) to B (inclusive). In the following text, "C" and / or "D" means including at least one of "C" or "D", i.e., {"C", "D", and "C" and "D"}.

[0024] Figure 1 A wireless communication system is shown.

[0025] Reference Figure 1 , Figure 1 A base station (110) and a terminal (120) are shown as part of a node that utilizes a wireless channel in a wireless communication system. Figure 1 Only one base station is shown, but the wireless communication system may also include another base station that is the same as or similar to base station (110).

[0026] A base station (110) is a network infrastructure that provides wireless access to a terminal (120). A base station (110) has a coverage area defined based on the distance at which signals can be transmitted. In addition to "base station", a base station (110) may also be referred to as an "access point (AP)," a "radio access network (RAN) node," an "eNodeB (eNB)," a "fifth-generation node," a "next-generation node B (gNB)," a "wireless point," a "transmit / receive point (TRP)," a "communication node," a "wireless communication device," a "wireless communication equipment," a "network node," a "network entity," or other terms with equivalent technical meanings.

[0027] The terminal (120), as a device used by a user, performs communication with the base station (110) via a wireless channel. The link from the base station (110) to the terminal (120) is called the downlink (DL), and the link from the terminal (120) to the base station (110) is called the uplink (UL). Additionally, although in Figure 1Not shown, but the terminal (120) and another terminal can communicate with each other via a wireless channel. In this case, the link (device-to-device link (D2D)) between the terminal (120) and the other terminal is called a side link, and the side link can be used interchangeably with the PC5 interface. In some other embodiments, the terminal (120) can be operated without user intervention. According to an embodiment, the terminal (120), as a device performing machine-type communication (MTC), may not be carried by the user. Additionally, according to an embodiment, the terminal (120) can be a narrowband (NB) Internet of Things (IoT) device.

[0028] In addition to “terminal”, terminal (120) may also be referred to as “user equipment (UE)”, “customer premises equipment (CPE)”, “mobile station”, “subscriber station”, “remote terminal”, “wireless terminal”, “electronic device”, “user equipment” or other terms with equivalent technical meaning.

[0029] Traditionally, in communication systems with relatively large base station cell radii, each base station is installed to include the functions of a digital processing unit (or distributed unit (DU)) and a radio frequency (RF) processing unit (or radio unit (RU)). However, with the use of high-frequency bands in fourth-generation (4G) and / or subsequent communication systems (e.g., 5G) and the shrinking cell coverage of base stations, the number of base stations required to cover a specific area has been increasing. The installation costs for operators to install these base stations have also been increasing. To minimize the installation costs of base stations, structures have been proposed where the DU and RU of a base station (e.g., base station (110)) are separated, one or more RUs are connected to a DU via a wired network, and one or more RUs are geographically distributed to cover a specific area. (See reference...) Figure 2 A more detailed description of the distributed layout.

[0030] Figure 2 Network entities are shown according to a distributed deployment. For example, network entities may include digital units (DUs) and radio units (RUs) (220) (or massive MIMO units (MMUs)). For example, network entities may be connected via a fronthaul link. Unlike backhaul between the base station and the core network, fronthaul refers to entities (e.g., DUs (210) and RUs (220)) between the wireless LAN and the base station. Figure 2In the diagram, DU (210) illustrates an example of a forward pass structure between one RU (220), but this is merely for ease of description and the present disclosure is not limited thereto. In other words, embodiments of the present disclosure can also be applied to a forward pass structure between one DU and multiple RUs. For example, embodiments of the present disclosure can be applied to a forward pass structure between one DU and two RUs. Additionally, embodiments of the present disclosure can be applied to a forward pass structure between one DU and three RUs.

[0031] Reference Figure 2 The base station (110) may include a DU (210) and an RU (220). A fronthaul (215) between the DU (210) and the RU (220) can be operated via an Fx interface. For the operation of the fronthaul (215), interfaces such as the Enhanced General Public Radio Interface (eCPRI) and Ethernet Radio (ROE) may be used, for example. According to implementation examples, in addition to DU, DU (210) may also be referred to as a baseband unit (BBU), digital BBU, baseband digital unit, processing unit, digital processing circuitry system, baseband processing circuitry system, baseband processing unit, and / or equivalent technical terms. According to implementation examples, in addition to RU, RU (220) may also be referred to as a remote unit, radio remote head (RRH), radio processing circuitry system, radio processing unit, antenna-integrated radio device, airborne radio device, airborne scale communication device, radio device, wireless communication device, and / or equivalent technical terms. Additionally, according to the implementation example, the network entity connected to DU (210) is described as RU (210) in this disclosure, but a large-scale multiple-input multiple-output unit (MMU) can be connected to DU (210) and used instead of RU (210).

[0032] With the development of communication technology and the increase in mobile data services, the bandwidth requirements for fronthaul between digital units and radio units have increased significantly. In deployments such as centralized / cloud radio access networks (C-RAN), the DU can be implemented to perform functions for Packet Data Convergence Protocol (PDCP), Radio Link Control (RLC), Media Access Control (MAC), and Physical (PHY), and the RU can be implemented to perform functions for the PHY layer in addition to performing radio frequency (RF) functions. The DU (210) can be responsible for the upper-layer functions of the wireless network.

[0033] For example, DU (210) can perform MAC layer functions and a portion of PHY layer functions. Here, "a portion of PHY layer" refers to functions performed at a relatively higher stage within the PHY layer functions, and as an example, may include channel coding (or channel decoding), scrambling (or descrambling), modulation (or demodulation), and layer mapping (or layer demapping). According to embodiments, DU (210) may be referred to as O-DU if it conforms to the O-RAN standard. Where necessary, in embodiments of this disclosure, DU (210) may be replaced with and represented as a first network entity for a base station (e.g., gNB). RU (220) can be responsible for lower-layer functions of the wireless network. For example, RU (220) can perform a portion of the PHY layer and RF functions. Here, "a portion of PHY layer" refers to functions performed at a relatively lower stage compared to DU (210) within the PHY layer functions, and as an example, may include iFFT transform (or FFT transform), CP insertion (CP removal), and digital beamforming. RU (220) may be referred to as “Access Unit (AU)”, “Access Point (AP)”, “Transmit / Receive Point (TRP)”, “Remote Radio Head (RRH)”, “Radio Unit (RU)”, or another term with equivalent technical meaning. According to embodiments, where RU (220) conforms to the O-RAN standard, RU (220) may be referred to as O-RU. Where necessary, in embodiments of this disclosure, RU (220) may be replaced with and represented as a second network entity for a base station (e.g., gNB).

[0034] exist Figure 2 In this description, the base station (110) is described as including a DU (210) and an RU (220), but embodiments of this disclosure are not limited thereto. The base station according to embodiments can be implemented in a distributed deployment based on a centralized unit (CU) and a distributed unit (DU), the CU being configured to perform upper-layer functions of the access network (e.g., Packet Data Convergence Protocol (PDCP) or Radio Resource Control (RRC)), and the DU being configured to perform lower-layer functions. As an example, the digital unit (DU) (210) can be implemented by being divided into CUs and DUs. The base station can be implemented in a structure in which CUs, DUs, and RUs are arranged sequentially between the core network (e.g., a 5G core (5GC) or a next-generation core (NGC)) and the radio network (RAN). The interface between the CU and the distributed unit (DU) can be referred to as an F1 interface.

[0035] Compared to a DU, a centralized unit (CU) can handle higher-layer functions by connecting to one or more DUs. For example, a CU can handle the functions of the Radio Resource Control (RRC) layer and the Packet Data Convergence Protocol (PDCP) layer, while DUs and RUs can handle lower-layer functions. A DU can perform a portion of the functions of the Radio Link Control (RLC), Media Access Control (MAC), and Physical (PHY) layers (high PHY), while an RU can handle the remaining functions of the PHY layer (low PHY). Additionally, as an example, digital units (DUs) can be included within a distributed unit (DU) depending on the distributed deployment implementation of the base station. In the following description, unless otherwise defined, the operation of the digital unit (DU) and the RU is described; however, various embodiments of this disclosure can be applied to both base station deployments including CUs and deployments where DUs are directly connected to the core network (i.e., CUs and DUs are implemented by being integrated into a base station as a single entity (e.g., an NG-RAN node)).

[0036] The term "casing" refers to the exterior of a device that houses internal components, such as electronic or mechanical devices. The casing protects and secures the components of the device. In the case of electrically powered electronic devices (such as network equipment) or physically moving mechanical devices, heat can be generated during operation. Because heat can adversely affect the operation of the device, the casing is typically designed with structures to dissipate heat to the outside. Recently, with the development of the electronics industry, electronic components are being mounted more tightly on printed circuit boards (PCBs) due to the high integration of circuit systems and the miniaturization of devices. Furthermore, the trend towards miniaturization of electronic devices has led to the emergence of high density and high mounting density of packages, including PCBs, as core components. When an electronic device is driven, heat can be generated from each electronic component on the PCB. If the heat generated from the electronic components on the PCB is not properly dissipated to the outside, the product's lifespan is shortened because functionality degrades due to heat. Therefore, to maintain optimized performance for the electronic components mounted on the PCB, it is necessary to maintain an environment suitable for the operating characteristics of each electronic component used in the device. Devices for dispersing and dissipating heat generated inside the device are inevitably needed.

[0037] Network communication devices such as base stations (110), terminals (120), RAN intelligent controllers (RICs), central units (CUs), units (DUs), units (RUs), massive MIMO units (MMUs), or access units (AUs) may include multiple electronic components for generating transmit signals to external electronic devices or processing receive signals from external electronic devices. During operation of the network communication device, at least one electronic component may generate heat. The network communication device may have a heat dissipation structure to disperse or dissipate the generated heat to the outside. Hereinafter, in this disclosure, the structure and related techniques of a heat dissipation structure for dissipating heat generated in network communication devices such as CUs, DUs, RUs, MMUs, and AUs will be described. Hereinafter, the network communication device may be referred to as an electronic device.

[0038] Figure 3a Examples of the exterior of electronic devices (e.g., base station (110), terminal (120), DU (210), RU (220), MMU or AU) including heat dissipation structures are shown.

[0039] Reference Figure 3a The electronic device may include a first housing (301) and a second housing (302). The first housing (301) may be referred to as the upper housing, and the second housing (302) may be referred to as the lower housing. The first housing (301) and the second housing (302) may be assembled to form a sealed space for protecting a printed circuit board assembly (PBA) from external influences. A PBA is an assembly of a circuit system including a board and multiple components mounted on the board. Like a PBA, components disposed in the internal space formed by the first housing (301) and the second housing (302) may generate heat according to operation. For example, operation may include transmitting and / or receiving signals for wireless communication and data computation. According to an embodiment, each of the first housing (301) and the second housing (302) may include multiple fins for heat dissipation.

[0040] The housing of the electronic device (e.g., a first housing (301) and / or a second housing (302)) can protect the PBA installed inside the electronic device from the influence of the external environment. For example, due to the various sizes of the electronic components of the PBA, the interior of the housing that contacts the PBA can have a shape with various heights. The exterior of the housing can include multiple fins to dissipate heat generated in the PBA to the outside (e.g., to the air). Such fins can be referred to as heat dissipation fins. To effectively dissipate heat, the fins can be in the shape of a plate with a wide surface area. The electronic components in the PBA can contact the bottom side of the housing. Thus, while the electronic components are operating (e.g., while the electronic components are processing wireless signals), the heat generated in the electronic components of the PBA can be dissipated to the outside air through the bottom side of the housing and the heat dissipation fins.

[0041] Figure 3b Examples of electronic devices (e.g., base station (110), terminal (120), DU (210), RU (220), MMU, or AU) including heat dissipation structures are shown. Figure 3b The text describes the cross-section inside the housing of the electronic device (e.g., the first housing (301) and / or the second housing (302)).

[0042] Reference Figure 3b The electronic device may include a housing (300). Multiple electronic components may be disposed inside the housing (300) of the electronic device. The housing (300) of the electronic device may protect the printed circuit board assembly (PBA) installed inside the product from external environmental influences. PBA refers to a board completed by soldering electronic components to a printed circuit board (PCB). A PCB is an insulating board on which conductive patterns (e.g., patterns configured with copper wires) are formed to enable electrical connections between electronic components, and a PBA can be manufactured by the connection between the electronic components and the conductive patterns. Due to the various component heights on the PBA, the interior of the housing (300) in contact with the PBA can have a shape with various heights.

[0043] The exterior of the housing (300) may include a heat sink (310) to dissipate heat generated in the PBA to the outside. The heat sink (310) of the housing (300) may be formed for heat dissipation. According to an embodiment, the heat sink (310) may include multiple fins. Each of the multiple fins may be referred to as a heat dissipation fin. To effectively dissipate heat, the fins may be in the shape of a plate with a wide surface area. For example, the housing (300) may be manufactured by a die casting method. The die casting method is a casting process and not only provides high productivity but also high precision because the parts are manufactured using molds. The die casting method includes methods of manufacturing parts using various metals such as aluminum, zinc, magnesium, copper, tin, lead, and iron. For example, the housing (300) may be formed from aluminum. Aluminum is lightweight, has high thermal conductivity, and has excellent corrosion resistance. As network communication devices become highly functional and highly integrated, the need for weight reduction of the housing (300) continues to arise. Various methods exist for weight reduction of the housing (300). For example, techniques for weight reduction can be implemented by using magnesium, which has a lower specific gravity than aluminum, a lightweight metal, or by reducing the fin thickness of the housing (300). For example, in order to diffuse and dissipate the heat from the high-heat-generating parts to the surrounding environment, a material with high thermal conductivity can be used instead of aluminum in the housing (300), or a separate component with high thermal conductivity (e.g., a graphite sheet, heat pipe, or steam chamber) can be attached to the interior of the housing (300).

[0044] The housing (300) can reduce the effects of corrosion on the PBA or electronic components due to exposure to external moisture or dust. Heat generated in the electronic components can be dissipated through the inside of the housing (300) into the fins and into the outside air. At least some components located on or in the PBA can be in contact with one side of the housing (300). While the electronic device is operating, heat generated in the components can be exhausted to the outside air through the bottom of the housing and the heat dissipation fins. Electronic components mounted on the PBA can have various temperature margins. For components with high heat generation or insufficient temperature margins in the electronic components, vapor chambers or heat pipes can be used in fins with a wider area for adequate heat dissipation to diffuse the heat generated in the components extensively to the heat sink (310) of the housing (300). Typically, vapor chambers or heat pipes can be located between the electronic components and the interior of the housing (300). However, because vapor chambers or heat pipes use copper, which has a higher specific gravity than aluminum, the electronic device may become heavier due to the additional heat dissipation components. It may be difficult to install a large number of heat dissipation components in the electronic device.

[0045] The housing (300) according to an embodiment of the present disclosure may have a structure having a vapor chamber inside the housing (300). The vapor chamber, which acts as a heat conductor for the refrigerant, may be configured to dissipate heat through the refrigerant inside the space of the metal plate. Since the space for the working fluid is fixed inside the housing (300), the housing (300) may function not only as a protection for the product from external influences but also as a vapor chamber for heat dissipation. For example, electronic components (340) (e.g., a first electronic component (341) and a second electronic component (342)) may be in contact with one side of the housing (300) through a thermal interface material (TIM). The heat from the electronic components (340) may heat the working fluid in the space inside the housing (300). Through the working fluid, the heat from the electronic components (340) may be transferred to the upper side of the internal space. The housing (300) may include a base portion with supports to have an internal space for functioning as a vapor chamber. The electronic device may include a first base portion (361) for the first electronic component (341). The electronic device may include a second base portion (362) for a second electronic component (342). A space may be formed between the base portion (360) and the cover portion (not shown) of the housing (300), and a space may be formed inside the heat sink (310) heat dissipation fins. A working fluid for heat dissipation may be disposed in at least some of these spaces. Heat of the electronic component (340) may be transferred to the heat dissipation fins by the working fluid. Since the heat dissipation fins are exposed to the outside and function as a cooler, heat of the electronic device may be dissipated to the outside. Since the housing (300) together acts as a vapor chamber, heat generated in the electronic component (340) may be rapidly diffused to the surrounding environment.

[0046] Figure 4 A front view of a housing (e.g., housing (300)) with a steam chamber is shown.

[0047] Reference Figure 4 The housing (300) may include a base portion (410), a cover portion (420), and a plurality of fin portions (430). The base portion (410) may correspond to the bottom side of the housing (300). The base portion (410) may transfer heat from electronic components (e.g., electronic components (340)) to the cover portion (420). To form a space (440a) for a working fluid inside the housing (300), the base portion (410) may include a support member. This support member may be formed to support the cover portion (420). Since the cover portion (420) is disposed on the support member of the base portion (410), the space (440a) may be formed between the base portion (410) and the cover portion (420). A working fluid (e.g., water) may be disposed in at least a portion of the space (440a). The plurality of fin portions (430) may be disposed on the cover portion (420). For example, the plurality of fin portions (430) may include a first fin portion (431), a second fin (432), a third fin (433), a fourth fin (434), a fifth fin (435), a sixth fin (436), and a seventh fin (437). A space may be formed within each of the plurality of fin portions (430) in which refrigerant can flow. In other words, each of the plurality of fin portions (430) may not be filled with metal material, but may form a separate space (440b) within it, either in a vacuum state or partially containing air. For space (440b), the end of each of the plurality of fin portions (430) may include an opening. At least a portion of spaces (440a) and (440b) may contain working fluid for a vapor chamber. Through the openings, at least a portion of the working fluid may move from space (440a) to space (440b) or from space (440b) to space (440a).

[0048] Figure 5 A perspective view of a housing (e.g., housing (300)) with a steam chamber is shown. Although in Figure 4 The space (440a) inside the housing (300) is shown, but Figure 5 This is a diagram showing the shell (300) as viewed from the outside.

[0049] Reference Figure 5The housing (300) may include a base portion (410), a cover portion (420), and multiple fin portions (430). The cover portion (420) of the housing (300) may include multiple slots (510). The multiple slots (510) may correspond to multiple fin portions (430) respectively. A corresponding fin may be inserted into each of the multiple slots (510), and a portion of the fin may be welded when inserted into the corresponding slot. By welding, the fin may be attached to the cover portion (420) as part of the housing (300).

[0050] pass Figures 4 to 5 The described housing (300) with a vapor chamber can have space for working fluid not only between the bottom side of the housing (e.g., the bottom side of the base portion (410)) and the cover portion (420), but also inside each fin. This space eliminates thermal resistance between the bottom side and each fin, enabling efficient heat dissipation and allowing for weight reduction and miniaturization of the product. To achieve the three-dimensional vapor chamber, sufficient space (440b) needs to be ensured inside each fin. For the injection of working fluid, the lower end of the fin may include an opening. The fin should not only be simply attached to the cover portion (420), but also be joined to the cover portion (420) so that fluid does not leak to the outside. For example, the base portion (410), the cover portion (420), and the multiple fin portions (430) can be joined by an aluminum brazing process. Because the fluid injected into the housing (300) should not escape to the outside, a seal is required during joining. As an example, the cover portion (420) can be constructed using an aluminum cladding material with different aluminum materials. The aluminum cladding material refers to a material constructed using aluminum materials with different melting points. By brazing near the lowest melting point, the molten aluminum material can penetrate into the fine gaps of the groove through capillary action, and the cover portion (420) and the multiple fin portions (430) can be joined together.

[0051] When corresponding fins in the multiple fin portions (430) are fitted into each slot (510) of the cover portion (420), a sufficient amount of molten aluminum material needs to be supplied so that no leakage occurs in the gaps between the slots. On the other hand, after filling the gaps between each fin and the slots (e.g., slots (510)) of the cover portion (420), the excess molten aluminum remaining can diffuse to the ends of the fins and may be configured to block the openings of the fins. Since the openings of a portion of the fins in the multiple fin portions (430) are blocked by the aluminum cladding, the working fluid may have difficulty flowing into the internal space of that portion of the fin. If the working fluid does not enter the internal space of that portion of the fin, the heat dissipation characteristics of the housing (300) may degrade. In this disclosure, in order to solve the above-mentioned problems in manufacturing a housing (300) with a vapor chamber, the shape of the components of the housing (300) is proposed. The shape of the component that will be described in the housing (300) is for ensuring space (e.g., space (440a) and / or space (440b)) inside the housing (300) for working fluid and for preventing the openings of each fin in the plurality of fin portions (430) of the housing (300) from being blocked due to molten aluminum.

[0052] 1. The shape of the openings in the heat dissipation fins Figure 6 An example of a component of a housing (e.g., housing (300)) having a steam chamber is shown. Figure 6 In this description, for ease of description, the (+) y-axis direction is referred to as the up direction and the (-) y-axis direction is referred to as the down direction, but this description is not to be construed as limiting the deployment of the housing (300) or electronic devices including the housing (300).

[0053] Reference Figure 6 The fin portion (431) can be inserted into the groove (510). A portion of the fin portion (431) may protrude above a first side (621) of the cover portion (420), and another portion of the fin portion (431) (e.g., portion (630)) may protrude below a second side (622) of the cover portion (420). Fluid can be injected into the fin portion (431) of the housing (300) having a steam chamber. The fin portion (431) may have an opening to allow fluid to be injected into the interior of the fin portion (431).

[0054] The depth to which the fin portion (431) is inserted into the groove (510) can be determined by various conditions. For the space between the base portion (410) and the cover portion (420), the fin portion (431) should be configured not to contact the bottom side (610) of the base portion (410). In addition, since the fin portion (431) is more exposed to the outside, heat dissipation performance can be improved. However, if the fin portion (431) is only located on the first side (621) of the cover portion (420), the opening at the lower end of the fin portion (431) may be partially blocked due to molten aluminum. Blockage of the opening indicates that the working fluid of the vapor chamber may not be able to move smoothly into the internal space of the fin portion (431), thereby causing a degradation in heat dissipation performance. Considering the above relationship, the fin portion (431) can be configured to penetrate the groove (510). As an example, the thickness of the cover portion (420) can be approximately 1.5 mm or more and less than 3.0 mm. A portion (630) of the fin portion (431) may protrude approximately 0.5 mm or more below the second side (622) of the cover portion (420). The fin portion (431) may include a protruding area such that a portion (630) of the fin portion (431) protrudes only a specific length and is fixed. Figures 8a to 8d Describe the highlighted area in detail.

[0055] As described above, the cover portion (420) can be constructed using aluminum cladding materials with different aluminum materials. For example, the cover portion (420) can be constructed using aluminum cladding materials with structures such as "Al40xx / A10xx or Al30xx / Al40xx" or "A10xx or Al30xx / Al40xx". The cover portion (420) can be joined to the fin portion (431) by an aluminum brazing process. The cover portion (420) can also be joined to the base portion (410) by an aluminum brazing process. While performing the aluminum brazing process, the molten aluminum of the cover portion (420) can fill all the slots (510) and flow into another gap. At this time, the fin portion (431) can protrude from the second side (622) of the cover portion (420) by a predetermined distance or greater, so that the molten aluminum does not flow into the opening of the fin portion (431). A portion (630) of the fin portion (431) is exposed in the space (440a). A portion (630) of the fin portion (431) can be shaped such that the opening is expanded by an expansion operation, thereby preventing the inflow of molten aluminum and filling the gap in the groove (510). For example, by expanding the fin portion (431) after it is inserted into the groove (510), a portion (630) of the fin portion (431) can be shaped such that both sides of the aluminum sheet contact the second side (622) of the cover portion (420). As another example, a portion (630) of the fin portion (431) can be inserted into the groove (510) of the cover portion (420) with its ends widened.

[0056] The base portion (410) may include a first column portion (651) and a second column portion (652). Each column portion provides space for fluid and performs the function of preventing the working fluid of the product in the space from deforming due to the temperature when the base portion (410) and the cover portion (420) are joined.

[0057] Although already Figure 6 The aluminum brazing process is described herein, but the embodiments disclosed herein are not limited thereto. In addition to the aluminum brazing process, various welding methods such as laser, friction stir welding (FSW), and / or friction stir welding processes can be used.

[0058] 2. Protruding areas of the heat dissipation fins Figure 7a and Figure 7b The connection structure between components of a housing (e.g., housing (300)) having a steam chamber is shown. Figure 7a The shape of the fins with internal space for the working fluid is shown in the diagram. Figure 7b The diagram shows the connection structure of the fin portion (431), the base portion (410), and the cover portion (420).

[0059] Reference Figure 7aThe fin portion (431) may include a heat sink region. The heat sink region may include a first connecting region (711), a second connecting region (712), and a heat dissipation region (720). The heat sink region may be engaged with a support of the cover portion (420) or the base portion (410) via each of its two sides. On the first side of the heat sink region (e.g., the region corresponding to the (+) y-axis direction), the first connecting region (711) may be engaged with a support of the cover portion (420) or the base portion (410). On the second side of the heat sink region (e.g., the region corresponding to the (-) y-axis direction), the second connecting region (712) may be engaged with a support of the cover portion (420) or the base portion (410). In the first connecting region (711), both aluminum sheets may be engaged. In the second connecting region (712), both aluminum sheets may be engaged. The heat dissipation region (720) between the first connecting region (711) and the second connecting region (712) may include a space in which a working fluid flows. The fin portion (431) can be formed by partially joining two aluminum sheets (e.g., a first aluminum sheet and a second aluminum sheet). Parts of the two aluminum sheets may be joined, and the other part may not be joined. The heat dissipation area (720) may include a joined area (721) and a non-jointed area (722). If the two aluminum sheets are not joined, a space in which the working fluid can flow can be formed inside the two aluminum sheets. The non-jointed area (722) may be shaped to expand by blowing air. The working fluid for the steam chamber can flow through the space of the non-jointed area (722). In other words, the path through which the working fluid flows can be formed in the space corresponding to the non-jointed area (722).

[0060] Reference Figure 7b The fin portion (431) can be connected to the base portion (410) and the cover portion (420). The first connection area (711) of the fin portion (431) can be inserted into a groove corresponding to the fin portion (431) and can contact the area of ​​the base portion (410). The protrusion (or protruding area) at the lower end of the first connection area (711) corresponding to the lower end of the fin portion (431) spacees the heat dissipation area (720) of the fin portion (431) from the base portion (410) by a predetermined distance. The predetermined space between the base portion (410) and the cover portion (420) can be maintained by the protrusion of the first connection area (711). However, if the first connection area (711) of the penetrating groove and the cover portion (420) are joined, there is still a possibility that the molten aluminum of the cover portion (420) will flow into the non-joined area (722) across the first connection area (711).

[0061] In this disclosure, to address the problem of the lower part of the fin portion (431) being blocked, the shape of the fin portion (431) and the structure in which the fin portion (431) is fastened to the base portion (410) or the cover portion (420) are described. When the fin portion (431) is inserted into the groove (510) of the cover portion (420), the fin portion (431) can be configured such that the lower end of the fin portion (431) (e.g., the non-engaging region (722)) maintains a predetermined height from the bottom side (610) of the base portion (410). The fin portion (431) may include a protruding region such that the fin portion (431) penetrates the groove (510) and crosses the cover portion (420) while having a predetermined height from the bottom side (610) of the base portion (410). In the following, it will be explained by Figures 8a to 8d Describe the highlighted area in detail.

[0062] Figures 8a to 8d An example of the deployment of a protruding area of ​​a housing (e.g., housing (300)) for separating the cover portion (e.g., cover portion (420)) and the base portion (e.g., base portion (410)) of the housing is shown.

[0063] Reference Figure 8a The top view (801a) is a diagram of the connection structure of the fin portion (431) and the base portion (410) viewed from above (e.g., in the (-) z-axis direction). The front view (802a) is a diagram of the connection structure of the fin portion (431) and the base portion (410) viewed from the front (e.g., in the (-) x-axis direction). The two ends of the heat sink region can be straight. The fin portion (431) can be configured such that each of the first connection region (711) and the second connection region (712) crosses the support of the base portion (410). For example, the first connection region (711) of the fin portion (431) can be connected to the support (821) of the base portion (410). However, because the fin portion (431) is inserted to the thickness of the cover portion (410), it is difficult for the fin portion (431) to have a portion protruding toward the second side (622) of the cover portion (410). Because there is no protruding portion, Figure 6 The extensions described in [the text] are difficult. Therefore, Figure 8a The structure may cause the molten aluminum of the cover portion (420) to block the opening of the heat dissipation area (720).

[0064] Reference Figure 8bThe top view (801b) is a diagram of the connection structure of the fin portion (431) and the base portion (410) viewed from above (e.g., in the (-) z-axis direction). The front view (802b) is a diagram of the connection structure of the fin portion (431) and the base portion (410) viewed from the front (e.g., in the (-) x-axis direction). The two ends of the heat sink region may include protrusions. The fin portion (431) may be in the shape of protruding from each of the first connecting region (711) and the second connecting region (712). For example, the first connecting region (711) of the fin portion (431) may have a protrusion (811) protruding in the (-) z-axis direction. The protrusion (811) of the first connecting region (711) may serve as a stop. The base portion (410) may be in the shape of a support (821) and a step portion (823). The step portion (823) may contact the protrusion (811). Through the protruding portion (811), the heat dissipation area (720) of the fin portion (431) can be spaced apart from the base portion (410) by a predetermined distance or a greater distance. Because a portion of the fin portion (431) protrudes below the second side (622) of the cover portion (420), the fin portion (431) can be... Figure 6 The extended shape described herein. However, in the y-axis direction, due to the engagement between the first connecting region (711) and the groove of the cover portion (420), there is a risk that molten aluminum will flow into the heat dissipation area (720) of the fin portion (431).

[0065] Reference Figure 8c The top view (801c) is a diagram showing the connection structure of the fin portion (431) and the base portion (410) as viewed from above (e.g., in the (-) z-axis direction). The front view (802c) is a diagram showing the connection structure of the fin portion (431) and the base portion (410) as viewed from the front (e.g., in the (-) x-axis direction). The two ends of the heat sink region may include protruding portions. Figure 8bUnlike other fins, the protruding portion can protrude in the xy plane. The fin portion (431) can be shaped such that each of the first connecting region (711) and the second connecting region (712) protrudes in the xy plane. For example, the first connecting region (711) of the fin portion (431) can have a protruding portion (813) protruding in the (+)y axis direction. The protruding portion (813) of the first connecting region (711) can serve as a stop. The base portion (410) can be shaped like a support member (821). The protruding portion (813) can be attached to the support member (821) of the base portion (410). The protruding portion (813) can overlap one side of the support member (821) of the base portion (410). When the protruding portion (813) is engaged on one side of the support member (821) of the base portion (410), the heat dissipation area (720) can be spaced apart from the bottom side of the base portion (410) by a predetermined distance or more. Furthermore, due to the protruding portion (813), the distance of the first connecting region (711) in the y-axis direction can be formed to be greater than that of the first connecting region (711). Figure 8a or Figure 8b The distance of the first connecting region (711) is long. Because a portion of the fin portion (431) protrudes below the second side (622) of the cover portion (420), the fin portion (431) can be... Figure 6 The extended shape described herein. The protrusion (813) may overlap the upper side of the support (821), and the first connecting region (711) may have a shape that is larger in the y-axis direction than the one described herein. Figure 8a or Figure 8b The first connecting region (711) is a wide joining region. Due to this shape, when joined, molten aluminum from the cover portion (420) will not block the lower part of the fin portion (431).

[0066] Reference Figure 8d The top view (801d) is a diagram showing the connection structure of the fin portion (431) and the base portion (410) as viewed from above (e.g., in the (-) z-axis direction). The front view (802d) is a diagram showing the connection structure of the fin portion (431) and the base portion (410) as viewed from the front (e.g., in the (-) x-axis direction). The two ends of the heat sink region may include protruding portions. Figure 8c As shown, the protrusion can project in the xy-plane. The fin portion (431) can be shaped such that each of the first connecting region (711) and the second connecting region (712) projects in the xy-plane. For example, the first connecting region (711) of the fin portion (431) can have a protrusion (815) projecting in the (+)y-axis direction. The protrusion (815) of the first connecting region (711) can serve as a stop. The protrusion (815) can be attached to the cover portion (420) of the base portion (410). Figure 8cUnlike other parts, the protruding portion (815) may not penetrate the groove of the cover portion (420). Therefore, the protruding portion (815) can be provided on the first side (621) of the cover portion (420). When the protruding portion (815) is engaged on the first side (621) of the cover portion (420), the heat dissipation area (720) can be spaced apart from the bottom side of the base portion (410) by a predetermined distance or a greater distance. In addition, due to the protruding portion (815), the distance of the first connecting area (711) in the y-axis direction can be formed to be greater than that of the first connecting area (711). Figure 8a or Figure 8b The distance of the first connecting region (711) is long. Because a portion of the fin portion (431) protrudes below the second side (622) of the cover portion (420), the fin portion (431) can be... Figure 6 The extended shape described herein. The protrusion (815) may overlap the upper side (e.g., the first side (622)) of the cover portion (420), and the first connecting region (711) may have a shape that is larger in the y-axis direction than the previous one. Figure 8a or Figure 8b The first connecting region (711) is a wide joining region. Due to this shape, when joined, molten aluminum from the cover portion (420) will not block the lower part of the fin portion (431).

[0067] Figure 9a and Figure 9b An example is shown of a fin (e.g., fin portion (431)) of a housing (e.g., housing (300)) having a steam chamber.

[0068] Reference Figure 9a It shows that according to Figure 8b The top view (802a) and front view (802b) show the shape of the heat dissipation fins. The fin portion (431) may include a first connecting region (711), a second connecting region (712), and a heat dissipation region (720). The heat dissipation region (720) may include a joining region (721) and a non-jointing region (722), and the space inside the non-jointing region (722) may be used as a path for the working fluid for the steam chamber. The protrusion (811) may be formed to extend from the first connecting region (711) in the (-) z-axis direction, and the heat dissipation region (720) may be spaced apart from the bottom side (610) of the base portion (410) by a predetermined distance or greater through the protrusion (811).

[0069] Reference Figure 9b It shows that according to Figure 8cThe top view (801c) and front view (802c) show the shape of the heat dissipation fins. The fin portion (431) may include a first connecting region (711), a second connecting region (712), and a heat dissipation region (720). The heat dissipation region (720) may include a joining region (721) and a non-jointing region (722), and the space inside the non-jointing region (722) may be used as a path for the working fluid for the steam chamber. The protrusion (811) may be formed to extend from the first connecting region (711) in the (+) y-axis direction, and the heat dissipation region (720) may be spaced apart from the bottom side (610) of the base portion (410) by a predetermined distance or greater through the protrusion (813).

[0070] Figure 9b The first connecting region (711) of the fin portion (431) can extend in one direction (e.g., the (-)y-axis direction) by more than Figure 9a The first connecting region (711) of the fin portion (431) is longer. The second connecting region (712) can extend in the opposite direction (e.g., the (+) y-axis direction) longer than the first connecting region (711). Figure 9a The first connecting region (711) of the fin portion (431) is longer. For example, when referring to the lower end of the fin portion (431), in Figure 9b The non-joining region (722), located in this direction (e.g., the (-)y-axis direction) after the first connecting region (711), can be positioned later than in Figure 9a The non-joining region (722) is located in the portion that begins after the first connecting region (711) in this direction (e.g., the (-)y-axis direction). For example, when referring to the lower end of the fin portion (431), in Figure 9b The non-junction region (722) located in the opposite direction (e.g., the (+) y-axis direction) after the second connection region (712) can be positioned later than the portion that begins in the second connection region (712). Figure 9b The non-joining region (722) is located in the opposite direction (e.g., the (+) y-axis direction) after the second connecting region (712). In other words, Figure 9b The distance between the support member (821) and the lower end of the non-jointing area (722) can be greater than Figure 9b The distance between the support (821) and the lower end of the non-jointed area (722) is long. As the distance from the support (821) to the non-jointed area (722) increases, the risk of molten aluminum flowing into the space inside the non-jointed area (722) can be reduced during processing.

[0071] To reduce the risk of clogging the opening while ensuring space in the steam chamber, the regions joined to the slot (e.g., the lower end of the boundary between the first connecting region (711) and the non-joined region (722), and the lower end of the boundary between the second connecting region (712) and the non-joined region (722)) can be formed to be more spaced from the support (821) than other regions. For example, the boundary between the first connecting region (711) and the non-joined region (722) can be formed to become further away from the support (821) as the boundary extends downward. The boundary between the second connecting region (712) and the non-joined region (722) can be formed to become further away from the support (821) as the boundary extends downward. According to an embodiment, as the non-joined region (722) of the heat dissipation region (720) extends downward, its width (e.g., its length in the y-axis direction) can become narrower. As an example, the width of the portion of the non-joined region (722) located below the protrusion (813) of each connecting region (e.g., the first connecting region (711) and / or the second connecting region (712)) may be narrower than the width of the portion of the non-joined region (722) located above the protrusion (813). Within the region of the non-joined region (722) of the heat dissipation region (720), the area engaging with the groove (510) or the cover portion (420) may be formed away from the support member (821).

[0072] 3. Columns in the matrix section Figure 10 An example of the design of a column for the base portion (e.g., base portion (410)) is shown.

[0073] Reference Figure 10 The base portion (410) may include multiple pillar portions (e.g., a first pillar portion (1001), a second pillar portion (1002), a third pillar portion (1003), a fourth pillar portion (1004), a fifth pillar portion (1005), a sixth pillar portion (1006), a seventh pillar portion (1007), an eighth pillar portion (1008), a ninth pillar portion (1009), a tenth pillar portion (1010), an eleventh pillar portion (1011), a twelfth pillar portion (1012), and a thirteenth pillar portion (1013)). Each pillar may be referred to as a boss.

[0074] The fin portion (431) can be inserted into the slot (510) of the cover portion (420), and the lower end of the fin portion (431) (e.g., portion (630)) can be extended. After the assembly of the fin portion (431) and the cover portion (420) is positioned on the base portion (410), a brazing process can be performed. Separate jigs can be used to ensure the quality of engagement with the base portion (410), the cover portion (420), and the multiple fin portions (430). However, as the size of the electronic device increases and the extension operations for the fin portion (430) increase, the flatness of the cover portion (420) (e.g., an indicator of how flat it is) may deteriorate. Deterioration of flatness may mean that one side of the cover portion (420) bends. When one side of the cover portion (420) bends, at least a portion of the pillar portion of the base portion (410) may not be engaged to the second side (622) of the cover portion (420). The heat dissipation performance of the vapor chamber of the housing (300) may be degraded due to the lack of joints among the multiple column sections.

[0075] The housing (300) according to an embodiment of the present disclosure may have pillar portions of varying heights to address the aforementioned problems. According to an embodiment, the housing (300) may include pillar portions of varying heights depending on their location. Each pillar portion may have a relatively low height as it moves closer to the outer periphery of the base portion (410) and a relatively high height as it moves closer to the center portion of the base portion (410). As an example, even if the cover portion (420) bends downwards at both ends, all pillar portions may still engage with the second side (622) of the cover portion (420) due to the height difference between the pillar portions. As a non-limiting example, the maximum height difference between the pillar portions may be designed to be approximately 0.3 mm or less. For example, the column height of the first group of column sections (e.g., the first column section (1001), the second column section (1002), the third column section (1003), the eleventh column section (1011), the twelfth column section (1012), and the thirteenth column section (1013)) may be different from the column height of the second group of column sections (e.g., the fourth column section (1004), the fifth column section (1005), the ninth column section (1009), and the tenth column section (1010)). The column height of the first group and the column height of the second group of column sections may have a height difference of a first distance (1020) (e.g., approximately 0.1 mm). The column height of the second group of column sections (e.g., the fourth column section (1004), the fifth column section (1005), the ninth column section (1009), and the tenth column section (1010)) may be different from the column height of the third group of column sections (e.g., the sixth column section (1006), the seventh column section (1007), and the eighth column section (1008)). The column heights of the second group and the third group can have a height difference of a second distance (1030) (e.g., approximately 0.1 mm).

[0076] Figure 11a and Figure 11b Examples of electronic devices (e.g., base station (110), terminal (120), DU (210), RU (220), MMU or AU) including housings with steam chambers are shown.

[0077] Reference Figure 11a The electronic device may include a housing (300). The housing (300) may include a base portion (410), a cover portion (420), and a plurality of fin portions (430). Due to a brazing process, the components of the housing (300) may be formed as a molten monolithic body. The housing (300) may be configured to dissipate heat generated in each electronic component to the outside. Each of the plurality of fin portions (430) may be exposed to air due to the electronic device being located outdoors, and may be configured to cool the heat generated.

[0078] The electronic device may include a PCB (1120). The PCB (1120) may be coupled to electronic components configured as a circuit system and may be formed as a PBA. Multiple electronic components may be disposed on one side of the PCB (1120). For example, electronic component (1130) may be disposed on one side of the PCB (1120). For example, electronic component (1130) may be a module (e.g., RFFE, FEM, FEMid, PAMid, or LPAmid) or a chip including a power amplifier. Heat generated in electronic component (1130) may be transferred to housing (300) through multiple components. For example, the electronic device may include a TIM (1140), a vapor chamber (1150), and a TIM (1160). As an example, each of the TIM (1140) and TIM (1160) may include a thermal pad, gel, or thermal grease. Because each of the TIMs (1140) and TIMs (1160) comprises metal and ceramic particles with thermal conductivity properties based on polymer materials, mechanical tolerances can be reduced and thermal conductivity at the interface can be improved due to the deployment of either TIM (1140) or TIM (1160). Heat generated in the electronic component (1130) can be dissipated through the vapor chamber (1150). Heat can come into contact with the vapor chamber (1150) and can diffuse to the surrounding environment through the area of ​​the vapor chamber (1150). The heat transferred through the vapor chamber (1150) and TIM (1160) can be transferred through the housing (300) to the multiple fin portions (430). However, because TIMs (1140) and TIM (1160) are added for attaching the individual vapor chambers (1150), the heat dissipation performance may be relatively reduced due to the thermal resistance of the TIMs. Therefore, utilizing… Figure 11a The deployment structure makes it difficult to maximize the heat dissipation performance of the vapor chamber of the casing (300).

[0079] Reference Figure 11b The electronic device may include a housing (300). The electronic device may include a PCB (1120). The electronic device may include electronic components (1130). The electronic device may include a TIM (1140). For each component, refer to Figure 11a The description. Figure 11b The electronic device may include a base portion (410) having an external shape that includes a portion adjacent to the electronic component (1130), thereby eliminating the need for a separate vapor chamber. For example, one side of the base portion (410) may protrude in one direction (e.g., the (-) z-axis direction) to contact the electronic component (1120) via a TIM (1140). A separate vapor chamber would use copper, which has high thermal conductivity but high specific gravity, but because... Figure 11b The steam chamber is omitted from the structure shown, therefore Figure 11b The structure is advantageous for weight reduction. However, heat from the electronic components (1130) is transferred to the cover portion (420) and multiple fin portions (430) via the working fluid within the internal space of the housing (300). Additional thermal resistance may occur as the internal space expands in the downward direction. An appropriate amount of working fluid moves while acquiring heat as it evaporates, but excessive fluid remains in a fluid state and may therefore act as a thermal resistor.

[0080] Figure 12a and Figure 12b Examples of electronic devices (e.g., base station (110), terminal (120), DU (210), RU (220), MMU or AU) including housings with steam chambers are shown.

[0081] Reference Figure 12a The electronic device may include a housing (300). The electronic device may include a PCB (1120). The electronic device may include electronic components (1130). The electronic device may include a TIM (1140). For each component, refer to Figure 11a and Figure 11bThe description is as follows. To correspond to the various heights of the PCB (1120) and the electronic component (1130), the base portion (410) of the housing (300) may have a block portion (1210). The block portion (1210) is an aluminum portion that can be used to fill the space between the bottom side of the base portion (410) and the electronic component (1130). For example, the block portion (1210) may be integrally manufactured or molded with the base portion (410). As another example, the block portion (1210) may be joined to the second side (622) of the base portion (410) as a separate aluminum block during an aluminum brazing process. The size of the block portion (1210) should be larger than the size of the electronic component (1130) which is a heat source. Since the block portion (1210) is filled with aluminum material, there is no thermal resistance at the interface, and therefore it can provide a higher thermal resistance than the component including... Figure 11a The structure of the steam chamber (1150) has high heat dissipation performance.

[0082] Reference Figure 12b The electronic device may include a housing (300). The electronic device may include a PCB (1120). The electronic device may include electronic components (1130). The electronic device may include a TIM (1140). For each component, refer to Figure 11a and Figure 11b The description is as follows. To correspond to the various heights of the PCB (1120) and electronic components (1130), the base portion (410) of the housing (300) may include a porous medium (1260). For example, the porous medium (1260) may be formed by sintering stainless steel, aluminum, copper and / or other metal powders. As another example, the porous medium (1260) may be formed by ceramic powder material.

[0083] An appropriate amount of working fluid moves while acquiring heat as it is thermally evaporated, but excessive fluid remains in a fluid state and may therefore act as a thermal resistor. The fluid tends to remain near the electronic component (1130). To reduce thermal resistance by decreasing the amount of fluid, a porous medium (1260) can be disposed within the space of the housing (300). The porous medium (1260) may include pores. For example, the porous medium (1260) may include pores with a unit size of approximately a few micrometers (µm). Due to its hydrophilicity and porous nature, the fluid can be absorbed by the porous medium (1260). The porous medium (1260) can absorb the fluid and allow the absorbed fluid to diffuse uniformly within the porous medium (1260). The fluid can exist within the porous medium (1260) and can be easily evaporated by a heat source (e.g., the heat of the electronic component (1130)).

[0084] In one embodiment, an electronic device is provided. The electronic device may include a printed circuit board (PCB), electronic components disposed on one side of the PCB, and a housing for heat dissipation of the electronic components. The housing may include a base portion, a cover portion, and a plurality of fin portions for the electronic components. The cover portion is disposed on a support of the base portion, and the plurality of fin portions are coupled to the cover portion. Each of the plurality of fin portions may have a heat sink region and a protruding region. A portion of the heat sink region may be configured to protrude from a first side of the cover portion, and another portion of the heat sink region may be configured to protrude from a second side of the cover portion, the second side being opposite to the first side. The protruding region may be coupled to the support or the cover portion such that the heat sink region is spaced apart from one side of the base portion by a predetermined distance or greater.

[0085] For example, at least a portion of the space between the base portion and the cover portion, and the internal space of each of the plurality of fin portions, may contain working fluid. The other portion of the heat sink region may include an opening for the internal space.

[0086] For example, the other part of the heat sink area may be in the shape in which the opening extends in the direction toward the second side.

[0087] For example, the cover portion can be formed based on a cladding of a first aluminum material and a second aluminum material with different melting points.

[0088] For example, the cover portion may include multiple slots. Each of the multiple fin portions may be configured to penetrate a corresponding slot among the multiple slots.

[0089] For example, the heat sink area may include: a first connection area in which a first aluminum sheet and a second aluminum sheet are joined on a first side; a second connection area in which the first aluminum sheet and the second aluminum sheet are joined on a second side opposite to the first side; and a heat dissipation area having an unjoined area of ​​the first aluminum sheet and the second aluminum sheet as a boundary. In each of the first connection area and the second connection area, a first engagement length corresponding to a first height from one side of the support member may be longer than a second engagement length corresponding to a second height, which is higher than the first height from one side of the support member.

[0090] For example, the base portion may include a plurality of pillars disposed on one side of the base portion. The plurality of pillars may include a first pillar and a second pillar, the first pillar having a first height and the second pillar having a second height higher than the first height. The second pillar may be positioned closer to the center of that side of the base portion than the first pillar.

[0091] For example, the base portion may include a vapor chamber portion having an internal space passing through the support member and an aluminum block portion between the vapor chamber portion and the electronic component.

[0092] For example, the space between the base portion and the cover portion may include a porous medium disposed on one side of the base portion.

[0093] For example, the electronic device may also include a thermal interface material (TIM). The TIM can contact the electronic component and the substrate portion.

[0094] For example, the electronic component may include at least one of a processor, a central processing unit (CPU), or a field-programmable gate array (FPGA).

[0095] For example, the electronic device may include a wireless unit (RU), a distributed unit (DU), a digital unit (DU), or a massive MIMO unit (MMU).

[0096] In one embodiment, a housing having a steam chamber is provided. The housing may include: a base portion having a support member; a cover portion disposed on the support member of the base portion; and a plurality of fin portions coupled to the cover portion. Each of the plurality of fin portions may have a heat sink region and a protruding region. A portion of the heat sink region may be configured to protrude from a first side of the cover portion, and another portion of the heat sink region may be configured to protrude from a second side of the cover portion, the second side opposite to the first side. The protruding region may be coupled to the support member or the cover portion such that the heat sink region is spaced apart from one side of the base portion by a predetermined distance or greater.

[0097] For example, at least a portion of the space between the base portion and the cover portion, and the internal space of each of the plurality of fin portions, may contain working fluid. The other portion of the heat sink region may include an opening for the internal space.

[0098] For example, the other part of the heat sink area may be in the shape in which the opening extends in the direction toward the second side.

[0099] For example, the cover portion can be formed based on a cladding of a first aluminum material and a second aluminum material with different melting points.

[0100] For example, the cover portion may include multiple slots. Each of the multiple fin portions may be configured to penetrate a corresponding slot among the multiple slots.

[0101] For example, the heat sink area may include: a first connection area in which a first aluminum sheet and a second aluminum sheet are joined on a first side; a second connection area in which the first aluminum sheet and the second aluminum sheet are joined on a second side opposite to the first side; and a heat dissipation area having an unjoined area of ​​the first aluminum sheet and the second aluminum sheet as a boundary. In each of the first connection area and the second connection area, a first engagement length corresponding to a first height from one side of the support member may be longer than a second engagement length corresponding to a second height, which is higher than the first height from one side of the support member.

[0102] For example, the base portion may include a plurality of pillars disposed on one side of the base portion. The plurality of pillars may include a first pillar and a second pillar, the first pillar having a first height and the second pillar having a second height higher than the first height. The second pillar may be positioned closer to the center of that side of the base portion than the first pillar.

[0103] For example, the space between the base portion and the cover portion may include a porous medium disposed on one side of the base portion.

[0104] For one or more embodiments, at least one of the components described in one or more of the preceding figures may be configured to perform one or more operations, techniques, processes, and / or methods as described in this disclosure. For example, a processor (e.g., a baseband processor) described in association with one or more of the preceding figures in this disclosure may be configured to operate according to one or more examples described in this disclosure. As another example, circuitry associated with user equipment (UE), base stations, network elements, etc., as described above in association with one or more of the preceding figures, may be configured to operate according to one or more examples described herein.

[0105] Unless otherwise explicitly stated, any of the embodiments described above may be combined with any other embodiment (or combination of embodiments). The above description of one or more implementations is provided for illustration and explanation, but is not intended to limit the scope of the embodiments or to exhaustively describe them as the precise forms disclosed. In view of the above teachings, modifications and variations are possible, or may be obtained from practice with various embodiments.

[0106] The methods according to embodiments described in the claims or specification of this disclosure can be implemented in hardware, software, or a combination of hardware and software.

[0107] When implemented as software, a computer-readable storage medium for storing one or more programs (software modules) can be provided. One or more programs stored in the computer-readable storage medium are configured to be executed by one or more processors in an electronic device. The one or more programs include instructions for causing the electronic device to perform the methods according to embodiments described in the claims or specification of this disclosure. The one or more programs can be included in and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., a compact disc read-only memory (CD-ROM)) or via an app store (e.g., the Play Store). TM This refers to the online distribution (e.g., downloading or uploading) of computer program products, or the direct distribution (e.g., downloading or uploading) between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium (such as the memory of a manufacturer's server, an app store's server, or a relay server).

[0108] Such programs (software modules, software) can be stored in random access memory, non-volatile memory (including flash memory, read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM)), disk storage devices, optical storage devices (e.g., compact disc-ROM (CD-ROM), digital versatile disc (DVD), or other formats), or cartridges. Alternatively, they can be stored in memory configured with some or all of these. Additionally, multiple configuration memories may be included.

[0109] Additionally, the program can be stored in an attachable storage device accessible via a communication network such as the Internet, intranet, local area network (LAN), wide area network (WAN), or storage area network (SAN), or a combination thereof. Such a storage device can be connected to an apparatus executing embodiments of this disclosure via an external port. Furthermore, a separate storage device located on a communication network can also be connected to an apparatus executing embodiments of this disclosure.

[0110] In the specific embodiments described above in this disclosure, the components included in this disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is suitably chosen according to the circumstances presented for ease of explanation, and this disclosure is not limited to singular or plural components, and components expressed in the plural can even be configured in the singular, or components expressed in the singular can be configured in the plural.

[0111] According to various embodiments, one or more components or operations described above may be omitted, or one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as the corresponding component of the multiple components performed one or more functions prior to integration. According to various embodiments, the operations performed by a module, program, or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more operations may be performed in a different order or omitted, or one or more other operations may be added.

[0112] Furthermore, specific embodiments have been described in detail in this disclosure, and of course, various modifications are possible without departing from the scope of this disclosure.

Claims

1. An electronic device, the electronic device comprising: Printed circuit board (PCB); Electronic components, the electronic components being disposed on one side of the PCB; A housing for heat dissipation of the electronic components. The housing includes a base portion for the electronic component, a cover portion, and multiple fin portions. The cover portion is disposed on a support member of the base portion, and the multiple fin portions are connected to the cover portion. Each of the plurality of fin portions has a heat sink region and a protruding region. Wherein, a portion of the heat sink area is configured to protrude from a first side of the cover portion, and another portion of the heat sink area is configured to protrude from a second side of the cover portion, the second side being opposite to the first side, and The protruding area is connected to the support or the cover portion of the base portion, such that the heat sink area is set to be spaced apart from one side of the base portion by a predetermined distance or greater.

2. The electronic device according to claim 1, in, At least a portion of the space between the base portion and the cover portion and the internal space of each of the plurality of fin portions contains working fluid, and The other portion of the heat sink region includes an opening for the interior space.

3. The electronic device according to claim 2, in, The other portion of the heat sink region has the shape in which the opening extends in the direction toward the second side.

4. The electronic device according to claim 1, in, The cover portion is formed based on a cladding of a first aluminum material and a second aluminum material with different melting points.

5. The electronic device according to claim 1, in, The cover portion includes multiple slots, and Each of the plurality of fin portions is configured to penetrate a corresponding slot among the plurality of slots.

6. The electronic device according to claim 1, in, The heat sink region includes: a first connection region, in which a first aluminum sheet and a second aluminum sheet are joined on a first side; a second connection region, in which the first aluminum sheet and the second aluminum sheet are joined on a second side of the heat sink region opposite to the first side; and a heat dissipation region having an unjoined area of ​​the first aluminum sheet and the second aluminum sheet as a boundary, and In each of the first connection region and the second connection region, the first engagement length corresponding to a first height from one side of the support member is longer than the second engagement length corresponding to a second height, the second height being higher than the first height from one side of the support member.

7. The electronic device according to claim 1, in, The base portion includes a plurality of pillars disposed on one side of the base portion. The plurality of columns includes a first column and a second column, the first column having a first height, and the second column having a second height that is higher than the first height. The second column is positioned closer to the center of the side of the base portion than the first column.

8. The electronic device according to claim 1, in, The matrix portion includes: A steam chamber portion having an internal space passing through the support member; and An aluminum block portion, located between the steam chamber portion and the electronic component.

9. The electronic device according to claim 1, wherein, The space between the substrate portion and the cover portion includes a porous medium disposed on one side of the substrate portion.

10. The electronic device according to claim 1, further comprising: Thermal interface materials (TIM). The TIM is in contact with the electronic components and the substrate portion.

11. The electronic device according to claim 1, wherein, The electronic component includes at least one of a processor, a central processing unit (CPU), or a field-programmable gate array (FPGA).

12. The electronic device according to claim 1, wherein, The electronic device includes a wireless unit (RU), a distributed unit (DU), a digital unit (DU), or a massive MIMO unit (MMU).

13. A housing having a steam chamber, the housing comprising: The base portion has a support member; A cover portion, the cover portion being disposed on the support member of the base portion; as well as Multiple fin portions, said multiple fin portions being connected to the cover portion, Each of the plurality of fin portions has a heat sink region and a protruding region. Wherein, a portion of the heat sink area is configured to protrude from a first side of the cover portion, and another portion of the heat sink area is configured to protrude from a second side of the cover portion, the second side being opposite to the first side, and The protruding area is connected to the support or the cover portion of the base portion, such that the heat sink area is set to be spaced apart from one side of the base portion by a predetermined distance or greater.

14. The housing according to claim 13, in, At least a portion of the space between the base portion and the cover portion and the internal space of each of the plurality of fin portions contains working fluid, and The other portion of the heat sink region includes an opening for the interior space.

15. The housing according to claim 14, in, The other portion of the heat sink region has the shape in which the opening extends in the direction toward the second side.

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