Power converter unit

Abstract

A power converter unit (10) is proposed, having a support structure (12), a first transistor device (14), and a first capacitor device (16). The support structure (12) has a first wall (18), and the first transistor device (14) and the first capacitor device (16) are located on opposite sides of the first wall (18). The first capacitor device (16) is thermally coupled to the first wall (18), and the first wall (18) forms a capacitor heat sink (20) for the first capacitor device (16). The first transistor device (14) includes one or more transistor power modules (22), and each transistor power module (22) has a transistor heat sink (24). The support structure (12) has a first coolant conduit (26) formed at least partially by the first wall (18). The first coolant conduit (26) is arranged to expose the capacitor heat sink and the transistor heat sink (24) of each transistor power module (22) to coolant. The first coolant conduit (26) has a first conduit portion (44), one or more second conduit portions (46), and a third conduit portion (48). The first coolant conduit (26) is arranged to guide coolant through the first conduit portion (44) in a first flow direction (50), through the second conduit portion (46) in a second flow direction (52), and through the third conduit portion (48) in a third flow direction (54). The second flow direction (52) is transverse to the first flow direction (50) and the third flow direction (54). Each second conduit portion (46) is partially formed by a transistor heat sink (24) of one of the transistor power modules (22).

Description

Technical Field

[0001] The proposed technology generally relates to the field of power converters, and more specifically to compact power inverters and / or rectifiers that form part of a powertrain for driving vehicles.

[0002] background A power inverter is a power electronic device that converts direct current (DC) to alternating current (AC). A power rectifier is a power electronic device that converts AC to DC. A power inverter / rectifier can convert either AC to DC or DC to AC.

[0003] Power inverters are key components in the powertrains of electric and hybrid electric vehicles, which have a battery as the power source and an electric motor as the prime mover. The power inverter converts DC power from the battery into AC power to drive the electric motor. If the powertrain is modified to include a power inverter / rectifier, it can also convert AC power from the electric motor into DC power to charge the battery, for example, when braking with the electric motor. Inverters and rectifiers are also used to step up or down the voltage between the battery and the electric motor.

[0004] Power inverters are typically based on transistors. Transistors can be arranged in transistor power modules that provide the physical housing for the transistors. Transistors are typically soldered or sintered onto a power electronics substrate that carries them. The substrate provides electrical contacts, thermal contacts, and electrical insulation as needed. Heat is generated by the transistors during operation. Power inverters typically include capacitors to provide a more stable DC voltage to the transistors. These also generate heat during operation. Generally, the heat generated by the capacitors is less than the heat generated by the transistors.

[0005] The proposed technology aims to provide a compact power converter architecture with efficient cooling. Another objective is to provide a power converter architecture for high-performance applications, such as in electric or hybrid electric vehicles (e.g., cars, airplanes, and ships).

[0006] Overview In a first aspect of the proposed technology, a power converter unit includes: a support structure, a first transistor device, and a first capacitor device. The support structure is arranged to support or at least partially support the first transistor device and the first capacitor device. The support structure has a first wall, and the first transistor device and the first capacitor device are located on opposite sides of the first wall. The first capacitor device is thermally coupled to or thermally connected to the first wall, and the first wall forms or at least partially forms a capacitor heat sink for the first capacitor device. The first transistor device includes one or more transistor power modules, and each transistor power module has a transistor heat sink. The support structure has a first coolant conduit, at least partially or partially formed by the first wall, and the first coolant conduit is arranged or configured to expose the capacitor heat sink formed by the first wall to a coolant or thermally conditioning liquid, and to expose the transistor heat sink of each transistor power module of the first transistor device to a coolant or thermally conditioning liquid. In other words, the first coolant conduit is arranged or configured to expose the capacitor heat sink formed by the first wall and the transistor heat sink of each transistor power module of the first transistor device to a coolant or thermally conditioning liquid. It should be understood that the coolant is conducted in the first coolant conduit. The features of the proposed power converter unit collectively contribute to a compact power converter unit.

[0007] It should be understood that the first transistor device may include multiple transistor power modules. The transistor heat sinks of the transistor power modules may then be unconnected or spaced apart from each other. Alternatively, the heat sinks of the transistor power modules may then collectively form a combined transistor heat sink or a combined transistor heat sink. In other words, in the first aspect of the proposed technology, the first transistor device includes multiple transistor power modules having a combined transistor heat sink or a combined transistor heat sink, and a first coolant conduit is arranged or configured to expose the combined transistor heat sink of the transistor power modules of the first transistor device to a coolant or thermally conditioned liquid.

[0008] It should be understood that the first coolant conduit may guide coolant through the support structure, or be arranged or configured to guide coolant through the support structure. It should also be understood that the capacitor heatsink formed by the first wall and the transistor heatsink or combined transistor heatsink of each transistor power module may be exposed to the same coolant. Exposure of a structure or component to coolant means that the coolant contacts the structure or component. The first wall is specified to form a capacitor heatsink for the first capacitor device. In other words, the first wall is arranged to serve as a capacitor heatsink for the first capacitor device. The first coolant conduit is specified to be arranged to expose the capacitor heatsink to coolant. In other words, the capacitor heatsink is arranged or configured to be exposed to coolant as coolant passes through the first coolant conduit, or the first coolant conduit is arranged or configured to allow coolant to remove heat from the capacitor heatsink as coolant passes through the first coolant conduit. The first coolant conduit is specified to be arranged to expose the transistor heatsink or combined transistor heatsink of each transistor power module to coolant. In other words, the transistor heatsink of each transistor power module or the combined transistor heatsink of the transistor power modules is arranged or configured to be exposed to coolant as coolant passes through the first coolant conduit, or the first coolant conduit is arranged or configured to allow coolant to remove heat from the transistor heatsink of each transistor power module or the combined transistor heatsink of the transistor power modules as coolant passes through the first coolant conduit.

[0009] A radiator is understood as a passive heat exchanger that transfers heat generated by electronic or mechanical equipment to a fluid medium (such as air or liquid coolant), where the heat is dissipated. It should be understood that the first coolant conduit is arranged or configured to carry or guide the liquid coolant. In other words, the coolant can be a liquid coolant.

[0010] In a second aspect of the proposed technology, a powertrain includes: a battery pack, a power converter unit according to the first aspect of the proposed technology, and an electric motor, which are arranged to cooperate and supply power to the powertrain. It should be understood that the powertrain can be an all-electric powertrain or a hybrid electric powertrain. For the latter, the powertrain may further include a combustion engine arranged to supply energy to the powertrain.

[0011] In a third aspect of the proposed technology, a means of transportation includes a power transmission system according to a second aspect of the proposed technology, the power transmission system being arranged to provide motive power to the means of transportation. It should be understood that the means of transportation can be a car, an airplane, or a boat. For example, the power transmission system can be arranged to supply power to the wheels of a car or the propeller of an airplane or boat.

[0012] The power converter unit may be a power inverter unit for converting DC to AC. Alternatively, the power converter unit may be a power rectifier unit for converting AC to DC. Alternatively, the power converter unit may be a power inverter / rectifier unit for both converting DC to AC and AC to DC. It should be understood that the first transistor device and the first capacitor device may be arranged to cooperate in the conversion. The first transistor device and the first capacitor device may be operatively connected via wires and / or busbars.

[0013] The support structure can be arranged to fully support the first transistor device and the first capacitor device. This means that the support structure itself can support the first transistor device and the first capacitor device. It should be understood that the support structure can have connecting elements such as screws that connect the first transistor device and the first capacitor device to the support structure. The power converter unit can be a static power converter unit, which does not depend on moving parts during conversion.

[0014] The first transistor device and the first capacitor device are positioned on opposite sides of the first wall. The first capacitor device can be positioned directly opposite the first transistor device relative to the first wall. In other words, the first transistor device and the first capacitor device can be positioned side by side. A first coolant conduit can pass between the first transistor device and the first capacitor device. This contributes to a more compact architecture.

[0015] It should be understood that the first wall is a flat structure, or that it defines a planar geometry. It should also be understood that the first wall has a first wall side or outer side, and an opposing second wall side or inner side. Furthermore, it should be understood that the first wall side faces a first direction, and the second wall side faces an opposite second direction. A first transistor device or a transistor power module of a first transistor device may be positioned on or at the first wall side, and a first capacitor device or a capacitor of a first capacitor device may be positioned on or at the second wall side.

[0016] The first transistor device may be located on the first wall side of the first wall, and the first capacitor device may be located on the second wall side of the first wall.

[0017] For example, the first wall can be made of metal such as aluminum alloy.

[0018] The first transistor device is specified to include one or more transistor power modules. The first transistor device may have multiple transistor power modules. For example, it may have three transistor power modules. The transistor power modules may be arranged or aligned in a row.

[0019] The first transistor device may be attached to or supported by the first wall. More specifically, each transistor power module may be attached to or supported by the first wall.

[0020] Each transistor power module's transistor heatsink or the combined transistor heatsink of transistor power modules may have a protrusion extending into a first coolant conduit. The protrusion may cover the entire transistor heatsink or the entire combined transistor heatsink, or be distributed across the entire transistor heatsink or the entire combined transistor heatsink. Each transistor power module's transistor heatsink or the combined transistor heatsink of transistor power modules may have a heatsink base from which the protrusion extends. The heatsink base may define a base plane. It should be understood that the protrusion is arranged or configured to dissipate heat into the coolant and allow the coolant to pass laterally through the protrusion. The protrusion may be a fin. Alternatively, the protrusion may be a pin. Each pin may have a tip. It should be understood that the pin extends between the heatsink base and the tip. Each pin may define a cylindrical geometry, or each pin may taper gradually from the heatsink base to the tip. The tip of the protrusion may be located at a first wall.

[0021] Each transistor power module may include a power electronics substrate and one or more transistors, one or more of which are supported by the substrate. The substrate may surround one or more transistors. The substrate may support a transistor heatsink or a combined transistor heatsink for the transistor power module. One or more transistors may be thermally coupled to, or thermally connected to, a transistor heatsink or a combined transistor heatsink. The substrate may be arranged to conduct heat from one or more transistors to the transistor heatsink or the combined transistor heatsink. The substrate may have electrical leads and terminals, wherein the terminals are accessible from the outside of the substrate, and the electrical leads are operatively connected to the terminals and one or more transistors. The substrate may have a base structure. The base structure may be an electrically insulating ceramic base structure. The base structure may surround or encapsulate the transistors. The base structure may also surround or encapsulate the electrical leads. One or more transistors may be MOSFETs.

[0022] It should be understood that the first transistor device may include multiple transistor power modules. The first transistor device may be a single unit. In other words, transistor power modules may be structurally connected to form a single unit. More specifically, the power electronics substrate or base structure of the transistor power modules may form a single combined power electronics substrate or combined base structure, or they may be structurally connected to form a single unit. Additionally or alternatively, the heat sinks of the transistor power modules may collectively form a combined transistor heat sink as described above. In other words, the heat sinks of the transistor power modules may be structurally connected to form a single unit. More specifically, the heat sink bases of the transistor power modules may collectively form a combined transistor heat sink base. In other words, the heat sink bases of the transistor power modules may be structurally connected to form a single unit.

[0023] The first capacitor assembly may include multiple capacitors. Each capacitor may be thermally coupled to or thermally connected to the first wall. The capacitors may be arranged in one or more rows. Each capacitor may have a cylindrical geometry with a base side, and the capacitor may be oriented with its base side facing the first wall. Each capacitor may have terminals, or more specifically, a pair of terminals. It should be understood that the capacitors can be charged and discharged via their terminals. Each capacitor may be a radial capacitor with its terminals (e.g., solder terminals) located on the base side.

[0024] Each capacitor may be a film capacitor, or more specifically, a high-voltage film capacitor. The first capacitor device may have a combined capacitance in the range of 100μF to 500μF, or 200μF to 400μF.

[0025] The first capacitor device may include a busbar device located between the capacitor device or the capacitor and the first wall. It should be understood that the busbar device may extend between the capacitor and the first wall, for example, to allow the busbar device to be connected in a circuit. The first transistor device and the first capacitor device may be operatively connected via the busbar device. Capacitors may be operatively connected via the busbar device, for example, to collectively function as a single capacitor, such as in a parallel circuit. It should be understood that the terminals of each capacitor may be attached to the busbar device, for example, by soldering.

[0026] The first capacitor device, capacitor, or capacitor terminals may be thermally connected to or thermally connected to the busbar device. The busbar device may be thermally connected to or thermally connected to the first wall or, more precisely, the capacitor heat sink formed by the first wall. In other words, the first capacitor device, capacitor, or capacitor terminals may be thermally connected to or thermally connected to the first wall or, more precisely, the capacitor heat sink formed by the first wall via the busbar device.

[0027] The busbar assembly can be a flat structure, or it can define or delineate the planar geometry between the capacitor assembly and the first wall, or at the capacitor. The busbar assembly can be located between the capacitor and the first wall. The busbar assembly can be aligned with or parallel to the first wall. In other words, the busbar assembly can be transverse to the aforementioned second direction. The busbar assembly can include one or more flat busbars or be composed of one or more flat busbars. For example, the busbar can be a metal sheet, such as a copper sheet.

[0028] The capacitor can be supported by a busbar assembly, and the busbar assembly can be supported by a support structure.

[0029] The first capacitor device is specified to be thermally connected to the first wall. The power converter unit may also include a first thermal conductor arranged to conduct heat from the first capacitor device to the first wall, or more precisely, to a capacitor heat sink formed by the first wall. More specifically, the first thermal conductor may be arranged to conduct heat from a busbar arrangement of the first capacitor device. In other words, the first capacitor device or its busbar may be thermally connected to, or thermally connected to, the first wall or its busbar arrangement via the first thermal conductor to the first wall or, more precisely, the capacitor heat sink formed by the first wall. It should be understood that the first thermal conductor contacts the first wall and the first capacitor device or its busbar arrangement. The first thermal conductor is understood to be a structure that allows heat to be transferred within the structure.

[0030] The first heat conductor may be located between the capacitor device and the first wall. More specifically, the first heat conductor may be located between the busbar device and the first wall. The first heat conductor may fill or partially fill the space formed between the first capacitor device and the first wall, or more precisely, the space formed between the busbar device and the first wall. The first heat conductor may be flat, or it may define a planar geometry. The first heat conductor may be aligned with or parallel to the first wall. In other words, the first heat conductor may be transverse to the aforementioned second direction.

[0031] The first thermal conductor can be a thermal interface material, which is understood as a material inserted between two components to enhance the thermal connection between the two components. For example, the first thermal conductor may include a thermal pad, thermal paste, and / or a curable thermal gap filler.

[0032] In addition to or as a substitute for the first heat conductor, the first capacitor device (or more precisely, the busbar device) may be directly thermally connected to the first wall (or more precisely, the capacitor heat sink formed by the first wall), or directly thermally connected to the first wall (or more precisely, the capacitor heat sink formed by the first wall). For example, the first capacitor device or the busbar device may be in direct contact with the first wall or the capacitor heat sink.

[0033] The first coolant conduit may have a first conduit portion, one or more second conduit portions, and a third conduit portion, wherein each of the second conduit portions connects to or interconnects the first and third conduit portions. It should be understood that each of the second conduit portions may be directly connected to the first and third conduit portions, meaning there are no additional conduit portions between them. It should also be understood that each of the second conduit portions may connect to or interconnect the first and third conduit portions at or within a first wall.

[0034] It should be understood that the first coolant conduit may include or have multiple second conduit sections. The second conduit sections may be connected in parallel with the first and third conduit sections, or connected between the first and third conduit sections. The second conduit sections may extend independently of each other between the first and third conduit sections. In other words, the second conduit sections may be disconnected from each other between the first and third conduit sections. It should also be understood that, for example, if the transistor power module has a combined transistor heatsink, the first coolant conduit may include or have a single second conduit section.

[0035] The first wall can separate one or more second conduit portions from the first conduit portion. More specifically, for each second conduit portion, the first wall can have or form a wall portion located between or separating the second conduit portion and the first conduit portion. The wall portion can be planar, or more specifically, a flat structure. The wall structure can be rectangular, or rectangular in shape. Similarly, the first wall can separate one or more second conduit portions from a third conduit portion.

[0036] The first coolant conduit may be arranged or configured to guide coolant through a first conduit section in a first flow direction. It should be understood that this may be at the first wall. The first coolant conduit may be arranged or configured to guide coolant through one or more second conduit sections in a second flow direction. It should be understood that this may be at the first wall. The first coolant conduit may be arranged or configured to guide coolant through a third conduit section in a third flow direction.

[0037] The first and third conduit portions may extend parallel to each other within or at the first wall. The first and third flow directions may be parallel. Alternatively, the first and third flow directions may be opposite. This allows the coolant inlet and outlet to be located on the same side of the support structure. The first and third flow directions may also be the same. This allows the coolant inlet and outlet to be located on opposite sides of the support structure. In other words, the power converter unit may have an inlet for receiving coolant and an outlet for discharging coolant, wherein the first conduit portion is connected to the inlet and the third conduit portion is connected to the outlet, or vice versa, the first conduit portion is connected to the outlet and the third conduit portion is connected to the inlet. The inlet and outlet may be located on the same side of the support structure. Alternatively, the inlet and outlet may be located on opposite sides of the support structure.

[0038] The second flow direction can be transverse to or perpendicular to the first flow direction and / or the third flow direction. As specified above, the first coolant conduit can have multiple second conduit sections. The second flow direction can then be the same or parallel within the second conduit sections. This contributes to a more compact power converter unit.

[0039] A first conduit portion may pass between a first transistor device and a first capacitor device. Similarly, one or more second conduit portions may pass between the first transistor device and the first capacitor device. This contributes to a more compact power converter unit. The first transistor device may have multiple transistor power modules arranged in a row. This row of transistor power modules may be aligned with the first conduit portion or a first flow direction. In other words, multiple transistor power modules may be lined up along the first conduit portion. The first capacitor device may include multiple capacitors arranged in one or more rows. One or more rows of capacitors may be aligned with the first conduit portion or a first flow direction. In other words, multiple capacitors may be arranged along the first conduit portion. The architecture described herein contributes to a more compact power converter, especially if it has a rectangular cuboid shape.

[0040] The first conduit portion may be formed by, partially formed by, or at least partially formed by the first wall. More specifically, the entire first conduit portion may be formed by the first wall. In other words, the first conduit portion may be located within the first wall. The first wall is specified to form a capacitor heat sink for the first capacitor device. The first conduit portion may be partially formed by the capacitor heat sink.

[0041] The first wall is specified to be a flat structure. The first conduit portion may be elongated in the first flow direction. The first conduit portion may be flat, consistent with the first wall. More specifically, the first coolant conduit may have an average height and average width transverse to the first flow direction, wherein the average height is aligned with the first wall side and / or the second wall side, or transverse to the first direction and / or the second direction, and the average width is transverse to the first wall side and / or the second wall side, or aligned with the first direction and / or the second direction, wherein the average height is greater than the average width. For example, the average height may be 5 to 25 times, or 10 to 20 times, the average width. In other words, the first conduit portion may have two opposing wide sides and two opposing narrow sides, wherein the wide sides of the first conduit portion are aligned with the first wall side and / or the second wall side, or face the first direction and / or the second direction. It should be understood that the wide and narrow sides of the first conduit portion together delineate the cross-section of the first conduit portion transverse to the first flow direction. The two opposing wide sides of the first conduit portion may be planar and parallel. For example, transverse to the first flow direction, the wide side can be 5 to 25 times wider than the narrow side, or 10 to 20 times wider.

[0042] Each transistor heatsink of a transistor power module or a combined transistor heatsink of transistor power modules may be exposed to coolant at or within one of the second conduit portions. Each of one or more second conduit portions may be partially formed by a transistor heatsink of a transistor power module or a combined transistor heatsink of transistor power modules. Each of one or more second conduit portions may be partially formed by a first wall or by a wall portion located between the second conduit portion and the first conduit portion. It should be understood that the transistor heatsink and the wall portion forming the second conduit portion may be located on opposite sides of the second conduit portion. More generally, each of one or more second conduit portions may be formed by a first wall or a wall portion located between the second conduit portion and the first conduit portion, and by one or more transistor heatsinks of transistor power modules.

[0043] The transistor heatsink of the specified transistor power module may be unconnected. The power converter unit or the first wall may include one or more gaskets, each gasket sealing one of the transistor power modules or a transistor heatsink of the transistor power module to the first wall. It should be understood that the gaskets are arranged or configured to prevent coolant from passing between the transistor power module or transistor heatsink and the first wall. The specified transistor power module has a combined transistor heatsink. The power converter unit or the first wall may include gaskets, wherein the gaskets seal the transistor power module or more specifically the combined transistor heatsink to the first wall. It should be understood that the gaskets are arranged or configured to prevent coolant from passing between the transistor power module or combined transistor heatsink and the first wall.

[0044] The above specifies that the first transistor device can have multiple transistor power modules. It should be understood that the first coolant conduit can then have a corresponding number of second conduit sections. In other words, the number of transistor power modules and the number of second conduit sections can be the same.

[0045] For each of one or more second conduit portions jointly formed by a first wall and one or more transistor power modules, the second conduit portion may have two opposing wide sides and two opposing narrow sides. One of the wide sides may be formed by a transistor power module, a transistor heatsink of a transistor power module, or a heatsink base of a transistor heatsink of a transistor power module. If a combined transistor heatsink is present, one of the wide sides may be formed by a transistor power module, a combined transistor heatsink of a transistor power module, or a heatsink base of a combined transistor heatsink of a transistor power module. The other wide side may be formed by the first wall or a wall portion located between the second conduit portion and the first conduit portion. This contributes to a more compact power converter unit. The wide sides of the second conduit portion may be aligned with the first wall side and / or the second wall side, or face the first direction and / or the second direction. It should be understood that the wide and narrow sides of the second conduit portion together delineate the cross-section of the second conduit portion transverse to the second flow direction. The two opposing wide sides of the second conduit portion may be planar and parallel. The second conduit portion may be elongated in the second flow direction. Alternatively, for example, if the transistor power module has a combined transistor heat sink, the second conduit portion may be elongated, either laterally or perpendicularly to the second flow direction.

[0046] The protrusion of the transistor heat sink can extend from the heat sink base toward the first wall or the wall portion located between the second conduit portion and the first conduit portion. The protrusion can extend transversely to the second flow direction. The protrusion can extend transversely to two opposite wide sides of the second conduit portion. The protrusion may be a pin. The end of each pin can be positioned at the first wall. The end can be spaced apart from the first wall. Alternatively, the end can contact the first wall.

[0047] The specification specifies that the transistor heatsink of each transistor power module or the combined transistor heatsink of the transistor power modules may have a protrusion extending into the first coolant conduit. Further, it specifies that each of the second conduit portions may be partially formed by the transistor heatsink of one of the transistor power modules or the combined transistor heatsink of the transistor power modules. In other words, the transistor heatsink of each transistor power module or the combined transistor heatsink of the transistor power modules may have a protrusion extending into the second conduit portion partially formed by the transistor heatsink or the combined transistor heatsink. It should be understood that the protrusion forms a partially hollowed-out structure that allows coolant to pass through the protrusion and extend through the second conduit portion.

[0048] Each transistor heatsink of a transistor power module or a combined transistor heatsink of a transistor power module can be outlined as a rectangle having a pair of opposing first edges and a pair of opposing second edges. The first edge can be longer than the second edge. In other words, the first edge can be a long edge, and the second edge can be a short edge. The first edge can be aligned with a second flow direction. This means that the second edge is transverse to the second flow direction. Alternatively, the first edge can be transverse to the second flow direction. This means that the second edge is aligned with the second flow direction. This contributes to more uniform cooling of the transistor heatsink or combined transistor heatsink. In other words, the transistor heatsink or combined transistor heatsink can be elongated. For example, it can be outlined as a rectangle, as described above. The elongated transistor heatsink or elongated combined transistor heatsink can be aligned with the second flow direction or oriented parallel to the second flow direction. Alternatively, the elongated transistor heatsink or elongated combined transistor heatsink can be transverse to the second flow direction or oriented perpendicular to the second flow direction. Again, this contributes to more uniform cooling of the transistor heatsink.

[0049] Each second conduit section may have a first orifice connecting or fluidly connecting the first and second conduit sections, and a second orifice connecting or fluidly connecting the second and third conduit sections. It is understood that the first and second orifices are arranged or configured to allow coolant to flow from the first conduit section to the third conduit section via the second conduit section, or vice versa. It should also be understood that each of the first and second orifices may be formed by a first wall.

[0050] The first orifice can be elongated. Similarly, the second orifice can be elongated. The first orifice can be aligned with or extend parallel to a first flow direction through the first conduit portion. The first orifice can extend transversely to or perpendicular to a second flow direction in the second conduit portion. The second orifice can extend transversely to or perpendicular to the second flow direction in the second conduit portion. The second orifice can be aligned with or extend parallel to a third flow direction through the third conduit portion. The elongated first orifice and the elongated second orifice can be parallel or extend in parallel.

[0051] The first and second holes can be aligned with opposite second edges of a rectangle outlined by a transistor heatsink or a combined transistor heatsink. The first hole can be located at one of the second edges, and the second hole can be located at the other second edge. Alternatively, the first and second holes can be aligned with opposite first edges of a rectangle outlined by a transistor heatsink or a combined transistor heatsink. The first hole can be located at one of the first edges, and the second hole can be located at the other first edge.

[0052] More generally, the second conduit portion may have a first end and a second end. A first orifice may be located at the first end, and a second orifice may be located at the second end. More specifically, a first edge may extend between the first end and the second end, and a second edge may be located at the first end and the second end, respectively. Alternatively, the second edge may extend between the first end and the second end, and the first edge may be located at the first end and the second end, respectively.

[0053] The second catheter portion is specified to have two opposing wide sides and two opposing narrow sides. Each of the first and second orifices can extend from one narrow side to the other. In other words, each of the first and second orifices can extend across the entire width of the second catheter portion between the two opposing narrow sides. It should be understood that the opposing wide sides can extend from a first end to a second end of the second catheter portion, and the opposing narrow sides can extend from a first end to a second end of the second catheter portion. It should also be understood that each of the wide sides can be rectangular, and each of the narrow sides can be rectangular.

[0054] The specification stipulates that if the transistor power module has a combined transistor heatsink, the first coolant conduit may have a single second conduit portion. Each second conduit portion may then have multiple first holes connecting or fluidly connecting the first and second conduit portions, and multiple second holes connecting or fluidly connecting the second and third conduit portions. It is understood that the first and second holes are arranged or configured to allow coolant to flow from the first conduit portion to the third conduit portion via the second conduit portion, or vice versa. It should also be understood that each of the first and second holes may be formed by a first wall.

[0055] The first orifice can be elongated. Similarly, the second orifice can be elongated. The first orifice can be aligned with or extend parallel to a first flow direction through the first conduit portion. The first orifice can extend transversely to or perpendicular to a second flow direction in the second conduit portion. The second orifice can extend transversely to or perpendicular to a second flow direction in the second conduit portion. The second orifice can be aligned with or extend parallel to a third flow direction through the third conduit portion. The elongated first orifice can be parallel or extend parallel. Similarly, the elongated second orifice can be parallel or extend parallel. The elongated first orifice can be aligned or collinear. Similarly, the elongated second orifice can be aligned or collinear. The elongated first orifice and the elongated second orifice can be parallel or extend parallel. It should be understood that the first orifices can be spaced apart from each other, and the second orifices can be spaced apart from each other.

[0056] The first and second holes can be aligned with opposite first edges of the rectangle outlined by the combined transistor heat sink. The first hole can be located at one of the first edges, and the second hole can be located at the other first edge.

[0057] More generally, the second conduit portion may have a first end and a second end. A first orifice may be located at the first end, and a second orifice may be located at the second end. More specifically, a second edge may extend between the first end and the second end, and the first edge may be located at the first end and the second end, respectively.

[0058] The second conduit portion is specified to have two opposing wide sides and two opposing narrow sides. A first orifice may be located between the narrow sides. Similarly, a second orifice may be located between the narrow sides. It should be understood that the opposing wide sides may extend from a first end to a second end of the second conduit portion, and the opposing narrow sides may extend from a first end to a second end of the second conduit portion. It should also be understood that each of the wide sides may be rectangular, and each of the narrow sides may be rectangular.

[0059] One or more second conduit portions may be arranged or configured to restrict the flow of coolant through the first coolant conduit. It should be understood that if multiple second conduit portions are present, they may be arranged or configured to collectively restrict the flow of coolant through the first coolant conduit. For example, the aforementioned protrusions on a transistor heatsink or a combined transistor heatsink can restrict flow. Additionally or alternatively, a first orifice and / or a second orifice in each second conduit portion may restrict flow. If multiple second conduit portions are present, this facilitates a uniform distribution of coolant flow among the multiple second conduit portions. If multiple first orifices and multiple second orifices are present, the first orifices and / or second orifices may collectively restrict the flow of coolant through each second conduit portion, thereby restricting the flow of coolant through the first coolant conduit.

[0060] The third conduit portion may be formed at least partially by the first wall. In other words, the third conduit portion may be partially formed by the first wall, or the entire third conduit portion may be formed by the first wall. The third conduit portion may be elongated in the third flow direction.

[0061] The power converter unit may further include a second transistor device and a second capacitor device. A support structure is arranged to at least partially support the second transistor device and the second capacitor device. The support structure has a second wall, and the second transistor device and the second capacitor device are located on opposite sides of the second wall. The second capacitor device is thermally connected to or thermally connected to the second wall, and the second wall forms a capacitor heat sink for the second capacitor device. The second transistor device includes one or more transistor power modules, and each transistor power module has a transistor heat sink. The support structure has a second coolant conduit at least partially formed by the second wall. The second coolant conduit is arranged or configured to expose the capacitor heat sink formed by the second wall to coolant, and to expose the transistor heat sink of each transistor power module of the second transistor device to coolant. In other words, the second coolant conduit is arranged or configured to expose the capacitor heat sink formed by the second wall and the transistor heat sink of each transistor power module of the second transistor device to coolant. It should be understood that the coolant is conducted in the second coolant conduit. The first capacitor device and the second capacitor device are located between the first wall and the second wall. The support structure may be arranged to fully support the second transistor device and the second capacitor device.

[0062] As with the first transistor device, the second transistor device may have multiple transistor power modules, and the heat sinks of the transistor power modules may collectively form a joint transistor heat sink. In other words, the second transistor device includes multiple transistor power modules having a joint transistor heat sink, and a second coolant conduit is arranged or configured to expose the joint transistor heat sink of the transistor power modules of the second transistor device to coolant.

[0063] The first and second walls can be aligned and positioned side-by-side. The second capacitor device can be located at or alongside the first capacitor device. The first and second capacitor devices can be located between the first and second transistor devices. It should be understood that the first and second walls are spaced apart to allow the first and second capacitor devices to be located between the first and second walls.

[0064] It should be understood that the second wall has a first wall side or outer side, and an opposite second wall side or inner side. The first wall side of the first wall and the first wall side of the second wall can face opposite directions. Similarly, the second wall side of the first wall and the second wall side of the second wall can face opposite directions. In other words, the first wall side of the second wall can face a second direction, and the second wall side of the second wall can face the opposite first direction.

[0065] The first transistor device can be located on the first wall side of the first wall, and the first capacitor device can be located on the second wall side of the first wall. Similarly, the second transistor device can be located on the first wall side of the second wall, and the second capacitor device can be located on the second wall side of the second wall. In other words, the first wall and the second wall can be located between the first transistor device and the second transistor device.

[0066] The first transistor device and the second transistor device may each include the same number of transistor power modules. The first capacitor device and the second capacitor device may each include the same number of capacitors. The first transistor device may include three transistor power modules arranged to cooperate and generate a first three-phase AC. Similarly, the second transistor device may include three transistor power modules arranged to cooperate and generate a second three-phase AC independent of the first three-phase AC. More generally, the first transistor device may be arranged to generate the first AC, and the second transistor device may be arranged to generate the second AC independent of the first AC. Alternatively, the first transistor device may include three transistor power modules, the second transistor device may include three transistor power modules, and the first and second transistor devices may be arranged to cooperate and generate a six-phase AC. More generally, the first and second transistor devices may be arranged to generate a single AC.

[0067] The first capacitor device and the second capacitor device can be disconnected from each other. Alternatively, the first capacitor device and the second capacitor device can be operatively connected to function together as a single capacitor, for example in a parallel circuit.

[0068] The second transistor device, the second capacitor device, the second wall, and the second coolant conduit may be arranged in a mirror-symmetric manner with respect to the first transistor device, the first capacitor device, the first wall, and the first coolant conduit. Mirror symmetry can be relative to a plane of symmetry between the first and second capacitor devices. It should be understood that the plane of symmetry is parallel to the first and second walls, or transverse to the first and second directions.

[0069] The second transistor device, the second capacitor device, the second wall, and the second coolant conduit may be arranged to and / or may include any of the features described above for the first transistor device, the first capacitor device, the first wall, and the first coolant conduit. For example, the second coolant conduit may have a first conduit portion, one or more second conduit portions, and a third conduit portion, which are arranged to and / or include any of the features described above.

[0070] The second capacitor device is specified to be thermally connected to the second wall. The power converter unit may also include a second thermal conductor arranged to conduct heat from the second capacitor device to the second wall, or more precisely, to the capacitor heat sink formed by the second wall. The second thermal conductor may be arranged and / or may include any features of the first thermal conductor.

[0071] The first wall can be a monolithic structure or a single-unit structure. Similarly, the second wall can be a monolithic structure or a single-unit structure. It is specified that both the first and second walls can be made of metal. The complete supporting structure can be made of metal, such as aluminum alloy. The supporting structure can have or form a monolithic or single-unit structure. For example, a monolithic structure can be machined from a single piece of material. This means it is not assembled from several parts. This helps reduce the risk of leakage from the first and second coolant conduits. The first and second walls can form part of the monolithic structure of the supporting structure.

[0072] The first and second walls can be aligned and positioned side-by-side. The supporting structure may have a third wall connected to the first and second walls. The third wall may be transverse to the first and second walls. The third wall may form part of the overall structure of the supporting structure. The supporting structure may have a base or bottom connected to the first and second walls. The base may be transverse to the first and second walls. The first and second walls may be located on opposite sides of the base. The base may be connected to the third wall. The base may be transverse to the third wall. The base may form part of the overall structure of the supporting structure. The supporting structure may include a fourth wall. The fourth wall may be connected to the first and second walls. The fourth wall may be connected to the base. The third and fourth walls may be located on opposite sides of the base. The fourth wall may form part of the overall structure of the supporting structure. If an element forms part of the overall structure, it should be understood that the element may have additional components that are not part of the overall structure.

[0073] The first wall, second wall, third wall, fourth wall, and base define an internal space having an open end on the opposite side of the internal space relative to the base. It should be understood that the first capacitor device and the second capacitor device are located within the internal space, and the open end allows the first capacitor device and the second capacitor device to be positioned within the internal space.

[0074] The supporting structure can outline a cuboid. More specifically, the first wall, second wall, third wall, fourth wall, and base can outline the five sides of the cuboid. It should be understood that the first and second walls outline opposite sides of the cuboid, and the third and fourth walls outline opposite sides of the cuboid.

[0075] The third ductal portion can be positioned closer to the base than the first ductal portion. The third ductal portion can be partially formed by the base.

[0076] The support structure may form a first manifold connecting to a first coolant conduit and a second coolant conduit. It should be understood that the first manifold is arranged or configured to distribute coolant to or collect coolant from the first coolant conduit and the second coolant conduit. More specifically, the support structure may form a first manifold connecting to a first conduit portion of the first coolant conduit and a first conduit portion of the second coolant conduit. It should be understood that the first manifold is arranged or configured to distribute coolant to or collect coolant from the first conduit portion. The first manifold may be formed of a third wall.

[0077] The support structure may form a second manifold connecting to a first coolant conduit and a second coolant conduit, wherein each of the first and second coolant conduits extends independently of or parallel to each other between the first and second manifolds. It should be understood that the second manifold is arranged or configured to distribute coolant to or collect coolant from the first and second coolant conduits. More specifically, the support structure may form a second manifold connected to a third conduit portion of both the first and second coolant conduits. It should be understood that the second manifold is arranged or configured to distribute coolant to or collect coolant from the third conduit portion. The second manifold may be formed by a base or at least partially formed by a base.

[0078] The power converter unit specified above may have an inlet for receiving coolant and an outlet for discharging coolant. A first conduit portion may be connected to the inlet via a first manifold, and a third conduit portion may be connected to the outlet via a second manifold; alternatively, the first conduit portion may be connected to the outlet via a first manifold, and the third conduit portion may be connected to the inlet via a second manifold. The inlet and outlet may be formed by a third wall. Alternatively, the inlet may be formed by a third wall, and the outlet may be formed by a fourth wall, or vice versa. Attached Figure Description

[0079] A more complete understanding of the above and other features and advantages of the proposed technology will become apparent from the following detailed description of preferred embodiments of the proposed technology, taken in conjunction with the accompanying drawings: Figure 1a and Figure 1b This is a perspective view of the power converter unit. Figure 1c and Figure 1d This is a side view of the power converter unit. Figure 2 This is a perspective view of the support structure of the power converter unit. Figures 3a to 3d These are different cross-sectional views of the power converter unit. Figure 4a and Figure 4b These are, respectively, a side view of the support structure of another power converter unit and a cross-sectional view of that other power converter unit. Figure 5a and Figure 5b These are, respectively, a side view of the support structure of another power converter unit and a cross-sectional view of that other power converter unit. Figure 6 This is a side view of the support structure of another power converter unit.

[0080] Detailed description of the attached figures Figures 1a to 1d Different views of a static power converter unit 10 are shown, which can be arranged to convert DC to a first three-phase AC and a second three-phase AC, and to convert the first three-phase AC and the second three-phase AC back to DC. The power converter unit 10 has a first transistor device 14, a first capacitor device 16, a second transistor device 78, and a second capacitor device 80, which are operatively connected by wires (not shown) and cooperate in the conversion. The first transistor device 14 and the first capacitor device 16 generate the first three-phase AC, and the second transistor device 78 and the second capacitor device 80 generate the second three-phase AC. In an alternative embodiment, the first transistor device 14, the first capacitor device 16, the second transistor device 78, and the second capacitor device 80 jointly convert DC to a six-phase AC and convert the six-phase AC back to DC.

[0081] The power converter unit 10 has a support structure 12 made of aluminum alloy. The power converter unit 10 in... Figure 2The structure is shown in the diagram and has a first wall 18 and a second wall 82 aligned and positioned side-by-side. A support structure 12 has a third wall 90 connected to and transverse to the first wall 18 and the second wall 82. The support structure 12 has a base 94 connecting the first wall 18, the second wall 82, and the third wall 90 and transverse to them. The first wall 18 and the second wall 82 are positioned on opposite sides of the base 94. The base 94 is also transverse to the third wall 90. The support structure 12 also has a fourth wall 92 connected to the first wall 18, the second wall 82, and the base 94. The third wall 90 and the fourth wall 92 are positioned on opposite sides of the base 94. Thus, the first wall 18, the second wall 82, the third wall 90, the fourth wall 92, and the base 94 define an interior space 96 having an open end 98 on the opposite side of the interior space 96 relative to the base 94. Each of the first wall 18, the second wall 82, the third wall 90, the fourth wall 92, and the base 94 is a planar structure. Thus, the support structure 12 outlines a rectangular cuboid, wherein the first wall 18 and the second wall 82 outline opposite sides of the rectangular cuboid, and the third wall 90 and the fourth wall 92 outline opposite sides of the rectangular cuboid.

[0082] The first wall 18 has an outer first wall side 28 and an inner opposing second wall side 30. The first wall side 28 faces a first direction, and the second wall side 30 faces the opposite second direction. Similarly, the second wall 82 has an outer first wall side 86 and an inner opposing second wall side 88. Thus, the first wall side 28 of the first wall 18 and the first wall side 86 of the second wall 82 face opposite directions, and the second wall side 30 of the first wall 18 and the second wall side 88 of the second wall 82 face opposite directions.

[0083] A first capacitor device 16 and a second capacitor device 80 are located within an interior space 96, and an opening 98 allows the first capacitor device 16 and the second capacitor device 80 to be mounted within the interior space 96. The first capacitor device 16 is supported by a first wall 18, and the second capacitor device 80 is supported by a second wall 82. The first capacitor device 16 is positioned at a second wall side 30 of the first wall 18, and the second capacitor device 80 is positioned at a second wall side 88 of the second wall 82. Only the first capacitor device 16 has been described in detail, but the second capacitor device 80 shares the features of the first capacitor device 16.

[0084] The first capacitor device 16 has eight capacitors 38 arranged in two rows. Each capacitor 38 is a radial capacitor and has a cylindrical geometry, with its base side facing the first wall 18. The terminals (not shown) of the capacitors 38 are located on the base side. The first capacitor device 16 has a busbar device 40 located between the capacitors 38 and the first wall 18. The busbar device 40 is a flat structure aligned with the first wall and consists of a plurality of busbars in the form of copper sheets located between the capacitors 38 and the first wall 18. The terminals (not shown) of the capacitors 38 are attached to the busbars. The busbar device 40 is operable to connect the capacitors 38 in parallel to function as a single capacitor, and the first transistor device 14 is connected to the first capacitor device 16 via the busbar device 40.

[0085] A gap 42 exists between the busbar assembly 40 and the first wall 18. The gap 42 is filled with a flat first thermal conductor (not shown) in the form of thermally conductive paste. In an alternative embodiment, the first thermal conductor (not shown) is a thermal pad or a curable thermal gap filler. The first thermal conductor (not shown) is aligned with and contacts the first wall 18 and the busbar assembly 40. Thus, the first thermal conductor 104 is arranged to conduct heat from the first capacitor assembly 16 to the first wall 18, and the first capacitor assembly 16 is thermally coupled to the first wall 18 via the busbar assembly 40. More specifically, each capacitor 38 is thermally coupled to or thermally connected to the first wall 18. Arranged in this way, the first wall 18 forms a capacitor heat sink 20 for the first capacitor assembly 16. The second wall 82 forms a capacitor heat sink for the second capacitor assembly 80 in a similar manner.

[0086] The first transistor device 14 and the second transistor device 78 are located outside the interior space 96. The first transistor device 14 is supported by a first wall 18, and the second transistor device 78 is supported by a second wall 82. The first transistor device 14 is located on a first wall side 28 of the first wall 18, and the second transistor device 78 is located on a first wall side 88 of the second wall 82. This means that the first transistor device 14 and the first capacitor device 16 are located on opposite sides of the first wall 18, and the second transistor device 78 and the second capacitor device 80 are located on opposite sides of the second wall 82. Only the first transistor device 14 has been described in detail, but the second transistor device 78 shares the features of the first transistor device 14.

[0087] The first transistor device 14 includes three transistor power modules 22 in the form of power MOSFETs, arranged in a row and attached to a first wall 18. Each transistor power module 22 has a transistor heat sink 24. Each transistor heat sink 24 has a heat sink base 34 and a pin-shaped protrusion 32 extending from the base 34. Each pin has an end 36 and extends from the base 34 to the end 36, tapering gradually. The outline of the transistor heat sink 24 of each transistor power module 22 is rectangular, having a pair of opposing first edges 70 and a pair of opposing second edges 72, the second edges 72 being shorter than the first edges 70.

[0088] refer to Figures 3a to 3d The support structure 12 has a first coolant conduit 26 formed by a first wall 18 and a second coolant conduit 84 formed by a second wall 82, which can guide liquid coolant. Only the first coolant conduit 26 is described in detail, but the second coolant conduit 84 shares the features of the first coolant conduit 26.

[0089] The first coolant conduit 26 has a first conduit portion 44, three second conduit portions 46, and a third conduit portion 48. The three second conduit portions 46 are connected in parallel to the first conduit portion 44 and the third conduit portion 48. The first coolant conduit 26 can be constructed from... Figure 3c The arrow in the middle indicates the first flow direction 50, which guides the coolant, and the second conduit section 46 can be guided by the... Figure 3a The arrow in the diagram indicates the second flow direction 52, which guides the coolant, and the third conduit section 48 can be guided by... Figure 3c and Figure 3d The arrow in the diagram indicates the third flow direction 54, which guides the coolant. The first conduit portion 44 and the third conduit portion 48 are elongated and extend parallel within the first wall 18, and the first flow direction 50 and the third flow direction 54 are opposite. The second flow direction 52 is transverse to both the first flow direction 50 and the second flow direction 52.

[0090] The complete first conduit portion 44 is formed by the first wall 18. The first conduit portion 44 has two opposing wide sides 60 and two opposing narrow sides 62. The wide sides 60 of the first conduit portion 44 are planar, parallel, and aligned with the first wall side 28 and the second wall side 30, as shown. Figure 3a As shown. The first coolant conduit 26 has an average height and an average width transverse to the first flow direction 50, and the average height is approximately fourteen times the average width. The average height is aligned with the first wall side 28 and the second wall side 30, and the average width is transverse to the first wall side 28 and the second wall side 30. Thus, the first conduit portion 44 is flat and consistent with the first wall 18.

[0091] The first conduit portion 44 passes between the first transistor device 14 and the first capacitor device 16. The row of transistor power modules 22 and the two rows of capacitors 38 are aligned with the first flow direction 50. Thus, the first coolant conduit 26 is arranged to expose the capacitor heat sink 20 formed by the first wall 18 to the coolant. The second coolant conduit 84 is arranged in a similar manner to expose the capacitor heat sink 20 formed by the second wall 82 to the coolant.

[0092] Each second catheter portion 46 has two opposing wide sides 66 and two opposing narrow sides 68, as shown below. Figure 3b The cross-section is shown. One of the wide sides 66 is formed by the heat sink base 34 of one of the transistor power modules 22, and the other wide side 66 is formed by the first wall 18. The first edge 70 of the rectangle outlined by the transistor heat sink 24 is aligned with the second flow direction 52. The wide side 66 is aligned with the first wall side 28 and the second wall side 30. The two opposing wide sides 66 are planar and parallel. The protrusion 32 of the transistor heat sink 24 is transverse to the second flow direction 52 (as shown in the cross-section). Figure 3a As can be seen in the diagram, each protrusion 32 extends from the heat sink base 34 toward the first wall 18, and the end 36 of each protrusion 32 is positioned at and spaced apart from the wide side 66 formed by the first wall 18. The first wall 18 forms a planar and rectangular wall portion 110, which is located between and separates the second conduit portion 46 from the first conduit portion 46. Using the architecture described herein, each of the second conduit portions 46 is jointly formed by the first wall 18 and one or more transistor power modules 22.

[0093] Each second conduit portion 46 has an elongated first hole 74 formed by a first wall 18, which connects the first conduit portion 44 and the second conduit portion 46. Each second conduit portion 46 also has an elongated second hole 76 formed by the first wall 18, which connects the second conduit portion 46 and the third conduit portion 48. Thus, coolant can flow via the second conduit portion 46 between the first conduit portion 44 and the third conduit portion 48. The first hole 74 is aligned with a first flow direction 50, the second hole 76 is aligned with a third flow direction 54, and both holes 74 and 76 are transverse to a second flow direction 52. The first hole 74 is aligned with and located at one of the second edges 72 of the rectangle outlined by the transistor heat sink 24, and the second hole 76 is aligned with and located at the other second edge 72 of the rectangle outlined by the transistor heat sink 24. Both the first hole 74 and the second hole 76 extend across the entire width of the second conduit portion 46 between two opposing narrow sides 68. The first hole 74, the second hole 76, and the protrusion 32 of the transistor heat sink 24 together restrict the flow of coolant through the second conduit portion 46.

[0094] Each second conduit portion has a first end 112 and a second end 114. A first edge 70 of a rectangle outlined by the transistor heat sink 24 extends between the first end 112 and the second end 114, and a second edge 72 is located at the first end 112 and the second end 114, respectively. A rectangular and opposite wide side 66 of the second conduit portion 46 extends from the first end 112 to the second end 114, and a rectangular and opposite narrow side 68 of the second conduit portion 46 extends from the first end 112 to the second end 114.

[0095] Each transistor power module 22 is sealed to the first wall 18 by a gasket 64. Arranged in such a way that each of the second conduit portions 46 is formed by the first wall 18 and one of the transistor power modules 22 (or more specifically, the transistor heatsink 24 of one of the transistor power modules 22). A protrusion 32 of the heatsink 24 of the transistor power module 22 extends into the first coolant conduit 26, or more specifically, into the second conduit portion 46, and coolant can flow laterally through the protrusion 32. The first coolant conduit 26 is arranged to expose the transistor heatsink 24 of each transistor power module 22 of the first transistor device 14 to the coolant. The second coolant conduit 84 is arranged similarly to expose the transistor heatsink 24 of each transistor power module 22 of the second transistor device 78 to the coolant.

[0096] The third conduit portion is formed by the first wall 18 and the base 94. This means that the third conduit portion 48 is positioned closer to the base 94 than the first conduit portion 44.

[0097] The second capacitor device 80 is located at the first capacitor device 16, and the first capacitor device 16 and the second capacitor device 80 are located between the first transistor device 14 and the second transistor device 78. The power converter unit 10 has a plane of symmetry (not shown) between the first capacitor device 16 and the second capacitor device 80, parallel to the first wall 18 and the second wall 82. The second transistor device 78, the second capacitor device 80, the second wall 82, and the second coolant conduit 84 are arranged in a mirror-symmetrical manner with respect to the first transistor device 14, the first capacitor device 16, the first wall 18, and the first coolant conduit 26. The second transistor device 78, the second capacitor device 80, the second wall 82, and the second coolant conduit 84 are arranged to be identical to and share the features of the first transistor device 14, the first capacitor device 16, the first wall 18, and the first coolant conduit 26.

[0098] There is also a gap between the second wall 82 and the busbar assembly of the second capacitor assembly 80, and this gap is filled with a flat second thermal conductor (not shown) in the form of thermal grease.

[0099] Support structure 12 is a three-part structure, such as Figure 2 As shown. The support structure 12 has an integral structure 108 forming a first wall 18, a second wall 82, and a fourth wall 92. A third wall 90 is formed by the integral structure 108 and a side plate 104 attached to and sealed to the integral structure 108, and a base 94 is formed by the integral structure 108 and a base plate 106 attached to and sealed to the integral structure 108. The integral structure, side plate 104, and base plate 108 are made of aluminum alloy.

[0100] The third wall 90 forms a first manifold 100 that connects to the first conduit portion 44 of the first coolant conduit 26 and the first conduit portion 44' of the second coolant conduit 84, such as Figure 1c As shown. The side plate 104 of the third wall 90 forms an inlet 56, and the first conduit portion 44 of the first coolant conduit 26 and the first conduit portion 44' of the second coolant conduit 84 are connected to the inlet 56 via a first manifold 100. The base 94 forms a second manifold 102, which connects to the third conduit portion 48 of the first coolant conduit 26 and the third conduit portion 48' of the second coolant conduit 84, as shown. Figure 3d As shown. The third wall 90 forms the outlet 58, and the third conduit portion 48 of the first coolant conduit 26 and the third conduit portion 48' of the second coolant conduit 84 are connected to the outlet 58 via the second manifold 102.

[0101] exist Figure 4a and Figure 4bAnother embodiment of the power converter unit 10 is shown in the figure, wherein Figure 4a A side view of the support structure 12 is shown. Figure 4b It shows the corresponding Figure 3b The longitudinal cross-sectional view of the power converter unit 10. The transverse cross-sectional view of the power converter unit 10. Figure 3a The same as in. Figure 4a and Figure 4b The embodiments basically correspond to Figures 1a to 3d The embodiment differs, but in that the transistor power modules 22 are structurally connected such that each of the first transistor device 14 and the second transistor device 78 is a single unit. Each transistor power module 22 is sealed to the first wall 18 by a gasket 64. Arranged in this way, each of the second conduit portions 46 is formed by the first wall 18 and the combined transistor power modules 22.

[0102] exist Figure 5a and Figure 5b Another embodiment of the power converter unit 10 is shown in the figure, wherein Figure 5a A side view of the support structure 12 is shown. Figure 5b It shows the corresponding Figure 3b The longitudinal cross-sectional view of the power converter unit 10. The transverse cross-sectional view of the power converter unit 10. Figure 3a The same as in. Figure 5a and Figure 5b The embodiments basically correspond to Figures 1a to 3d The embodiment differs from the one described above, but in that the transistor heat sinks of the transistor power module 22 are structurally connected as a single unit to form a combined transistor heat sink 24. Furthermore, the first coolant conduit 26 has a single second conduit portion 46.

[0103] The second catheter portion 46 has two opposing wide sides 66 and two opposing narrow sides 68, as shown in the image. Figure 5b The cross-section is shown. One of the wide sides 66 is formed by the heat sink base 34 of the combined transistor heat sink 24, and the other wide side 66 is formed by the first wall 18, or more specifically, by a planar and rectangular wall portion 110 formed by the first wall 18 and located between and separating the second conduit portion 46 and the first conduit portion 46. As in the previous embodiment, the rectangular and opposite wide side 66 of the second conduit portion 46 extends from the first end 112 to the second end 114 of the second conduit portion 46, and the rectangular and opposite narrow side 68 extends from the first end 112 to the second end 114 of the second conduit portion 46.

[0104] The first edge of the rectangle outlined by the transistor heat sink 24 corresponds to Figure 3aThe second edge 72 is transverse to the second flow direction 52. The second edge 72 of the rectangle outlined by the transistor heat sink 24 is aligned with the second flow direction 52. The second edge 72 extends between the first end 112 and the second end 114 of the second conduit portion 46, and the first edge (corresponding to) Figure 3a 72) is located at the first end and the second end respectively.

[0105] The wide side 66 of the second conduit portion is aligned with the first wall side 28 and the second wall side 30. As in the previous embodiment, the two opposing wide sides 66 are planar and parallel, and the protrusions 32 of the transistor heat sink 24 extend transversely to the second flow direction 52 from the heat sink base 34 toward the first wall 18. The end 36 of each protrusion 32 is positioned at and spaced apart from the wide side 66 formed by the first wall 18. Using the architecture described herein, the second conduit portion 46 is formed jointly by the first wall 18 and the combined transistor heat sink 24 of the single-unit first transistor device 14.

[0106] The second conduit portion 46 has an elongated first hole 74 formed by the first wall 18, which connects the first conduit portion 44 and the second conduit portion 46. The second conduit portion 46 also has an elongated second hole 76 formed by the first wall 18, which connects the second conduit portion 46 and the third conduit portion 48. In this way, coolant can flow through the second conduit portion 46 between the first conduit portion 44 and the third conduit portion 48. The first hole 74 is aligned with a first flow direction 50 (see [reference]). Figure 3c The second hole 76 is aligned with the third flow direction 54 (see...). Figure 3c Both holes 74 and 76 are transverse to the second flow direction 52. The first hole 74 corresponds to one of the first edges of the rectangle outlined by the combined transistor heatsink 24 (corresponding to...). Figure 3a The second hole 76 is aligned with and located at the first edge, and the second hole 76 is aligned with the other first edge of the rectangle outlined by the combined transistor heat sink 24 (corresponding to...). Figure 3a 72) is aligned with and located at the other first edge. The first hole 74 and the second hole 76 both extend across the entire width of the second conduit portion 46 between the two opposing narrow sides 68. The first hole 74, the second hole 76, and the protrusion 32 of the combined transistor heat sink 24 together restrict the flow of coolant through the second conduit portion 46.

[0107] The power converter unit or the first wall may include a gasket, wherein the gasket seals the transistor power module or more specifically the combined transistor heatsink to the first wall. It should be understood that the gasket is arranged or configured to prevent coolant from passing between the transistor power module or combined transistor heatsink and the first wall.

[0108] The transistor power module 22 and the combined transistor heatsink 24 are sealed to the first wall 18 by a single gasket 64. A second conduit portion 46 is then formed by the first wall 18 and the combined transistor power module 22 (or more specifically, the combined transistor heatsink 24). A protrusion 32 of the combined transistor heatsink 24 of the transistor power module 22 extends into the first coolant conduit 26, or more specifically, into the second conduit portion 46, and coolant can flow laterally through the protrusion 32. Thus, the first coolant conduit 26 is arranged to expose the combined transistor heatsink 24 of the first transistor device 14 to coolant.

[0109] The second transistor device 78 and the second coolant conduit 84 are arranged in a similar manner to expose the combined transistor heat sink 24 of the transistor power module 22 of the second transistor device 78 to the coolant.

[0110] Figure 6 A support structure 12 is shown according to another embodiment of the power converter unit 10. This embodiment substantially corresponds to... Figure 5a and Figure 5b The embodiment differs in that the first wall 18 forms three first holes 74 instead of a single first hole, and three second holes 76 instead of a single second hole. The first holes 74 are spaced apart from each other, and the second holes 76 are spaced apart from each other. The first holes and the second holes 76 are distributed between the narrow sides 62 of the second conduit portion 46. The first holes 74 and the second holes 76 are arranged to allow coolant to flow between the first conduit portion 46 and the third conduit portion 48 via a single second conduit portion 46.

[0111] The first orifice 74 and the second orifice 76 are elongated and are located at the first end 112 and the second end 114 of the second conduit portion 46, respectively. The first orifice 74 is aligned with the first flow direction 50 (see...). Figure 3c And transverse to the second flow direction 52, and the second hole 76 transverse to the second flow direction 52 and aligned with the third flow direction 54 (see...). Figure 3c The first hole 74 is parallel and collinear, the second hole 76 is parallel and collinear, and the first hole 74 and the second hole 76 are parallel.

[0112] The first hole 74 and the second hole 76 are opposite to the first edge of the rectangle outlined by the combined transistor heat sink 24 (corresponding to) Figure 3a 72) is aligned. The first hole 74 is located in one of the first edges (corresponding to 72). Figure 3a At position 72), and the second hole 76 is located at another first edge (corresponding to...). Figure 3a (72) in the middle.

[0113] The second coolant conduit 84 is arranged in a similar manner to expose the combined transistor heat sink 24 of the transistor power module 22 of the second transistor device 78 to the coolant.

[0114] Project List 10 Power Converter Units 12 Supporting Structure 14 First transistor device 16 First Capacitor Device 18 First Wall 20 Capacitor Heatsink 22 Transistor Power Module 24. Transistor heat sink or combined transistor heat sink 26 First Coolant Pipe 28 The first side of the first wall 30 The second side of the first wall 32. Protrusion 34. Radiator base 36 End 38 capacitors 40 Busbar Device 42 gap 44 First catheter section 46 Second catheter section 48 Third catheter section 50 First flow direction 52 Second flow direction 54 Third flow direction 56 Entrances 58 Exports 60 Wide side of the first catheter section 62 Narrow side of the first catheter section 64 Washer 66. Wide side of the second catheter section 68 Narrow side of the second catheter section The first edge of the 70 transistor heatsink The second edge of the 72 transistor heatsink 74 First hole or multiple first holes 76 Second hole or multiple second holes 78 Second transistor device 80 Second Capacitor Device 82 Second Wall 84 Second Coolant Pipe 86 The first side of the second wall 88 The second side of the second wall 90 Third Wall 92 The Fourth Wall 94 Base 96 Interior Space 98 Open end 100 First manifold 102 Second manifold 104 Side Panel 106 substrate 108 Overall Structure 110 Wall section 112 First End 114 Second end.

Claims

1. A power converter unit (10), comprising: - Supporting structure (12), - First transistor device (14), and - First capacitor device (16), wherein, The support structure (12) is arranged to at least partially support the first transistor device (14) and the first capacitor device, the support structure (12) having a first wall (18), and the first transistor device (14) and the first capacitor device (16) being located on opposite sides of the first wall (18). The first capacitor device (16) is thermally connected to the first wall (18), and the first wall (18) forms a capacitor heat sink (20) for the first capacitor device (16). The first transistor device (14) includes one or more transistor power modules (22), and each transistor power module (22) has a transistor heat sink (24). The support structure (12) has a first coolant conduit (26) formed at least partially by the first wall (18), the first coolant conduit (26) being arranged such that the capacitor heat sink formed by the first wall (18) and the transistor heat sink (24) of each transistor power module (22) of the first transistor device (14) are exposed to coolant, wherein, The first coolant conduit (26) has a first conduit portion (44), one or more second conduit portions (46) and a third conduit portion (48), each of the second conduit portions (46) connecting the first conduit portion (44) and the third conduit portion (48). The first coolant conduit (26) is arranged to guide the coolant through the first conduit portion (44) in a first flow direction (50), through the one or more second conduit portions (46) in a second flow direction (52), and through the third conduit portion (48) in a third flow direction (54), the second flow direction (52) being transverse to the first flow direction (50) and the third flow direction (54), and each of the one or more second conduit portions (46) is partially formed by the transistor heat sink (24) of one of the transistor power modules (22).

2. The power converter unit (10) according to claim 1, wherein, Each of the one or more second conduit portions (46) is partially formed by the first wall (18).

3. The power converter unit (10) according to claim 2, wherein, Each of the one or more second conduit portions (46) is formed by the first wall (18) and one of the transistor power modules (22).

4. The power converter unit (10) according to any one of claims 1 to 3, wherein, The first conduit portion (44) and the third conduit portion (48) extend parallel to each other at the first wall (18).

5. The power converter unit (10) according to claim 4, wherein, The first conduit portion (44) and the third conduit portion (48) are at least partially formed by the first wall (18).

6. The power converter unit (10) according to any one of claims 1 to 5, wherein, The first conduit portion (44) passes between the first transistor device (14) and the first capacitor device (16), and the one or more second conduit portions (46) pass between the first transistor device (14) and the first capacitor device (16).

7. The power converter unit (10) according to claim 5 or 6, wherein, The first flow direction (50) and the third flow direction (54) are parallel.

8. The power converter unit (10) according to claim 7, wherein, The first flow direction (50) and the third flow direction (54) are opposite.

9. The power converter unit (10) according to any one of claims 1 to 8, wherein, Each second conduit portion has a first hole (74) connecting the first conduit portion (44) and the second conduit portion and a second hole (76) connecting the second conduit portion and the third conduit portion (48), the first hole (74) being elongated and aligned with the first flow direction (50), and the second hole (76) being elongated and aligned with the third flow direction (54).

10. The power converter unit (10) according to any one of claims 1 to 9, wherein, The first transistor device (14) includes a plurality of transistor power modules (22), the first coolant conduit (26) includes a plurality of second conduit portions (46), and the second conduit portions (46) are connected in parallel between the first conduit portion (44) and the third conduit portion (48).

11. The power converter unit (10) according to claim 10, wherein, The second catheter portion (46) extends independently between the first catheter portion (44) and the third catheter portion (48).

12. The power converter unit (10) according to any one of claims 1 to 11, wherein, The power converter unit (10) further includes: - Second transistor device (78), and - Second capacitor device (80), wherein, The support structure (12) is arranged to at least partially support the second transistor device (78) and the second capacitor device (80), the support structure (12) having a second wall (82), and the second transistor device (78) and the second capacitor device (80) being located on opposite sides of the second wall (82). The second capacitor device (80) is thermally connected to the second wall (82), and the second wall (82) forms a capacitor heat sink for the second capacitor device (80). The second transistor device (78) includes one or more transistor power modules, and each transistor power module has a transistor heat sink. The support structure (12) has a second coolant conduit (84) formed at least partially by the second wall (82), the second coolant conduit (84) being arranged such that the capacitor heat sink formed by the second wall (82) and the transistor heat sink of each transistor power module of the second transistor device (78) are exposed to coolant, and The first capacitor device (16) and the second capacitor device (80) are located between the first wall (18) and the second wall (82).

13. The power converter unit (10) according to claim 12, wherein, The second transistor device (78), the second capacitor device (80), the second wall (82) and the second coolant conduit (84) are arranged in a mirror-symmetric manner with respect to the first transistor device (14), the first capacitor device (16), the first wall (18) and the first coolant conduit (26).

14. The power converter unit (10) according to claim 12 or 13, wherein, The support structure (12) forms a first manifold (100) connected to the first coolant conduit (26) and the second coolant conduit (84).

15. The power converter unit (10) according to claim 14, wherein, The support structure (12) forms a second manifold (102) connected to the first coolant conduit (26) and the second coolant conduit (84), and each of the first coolant conduit (26) and the second coolant conduit (84) extends independently between the first manifold (100) and the second manifold (102).

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