Display device

Abstract

Embodiments of the present application include: a substrate; a first wiring provided on the substrate; and a second wiring provided on the first wiring and electrically connected to the first wiring, wherein the first wiring and the second wiring include an overlapping region in which the first wiring overlaps the second wiring in a plan view, and at least one of the first wiring and the second wiring includes an opening in the overlapping region.

Description

Technical Field

[0001] One or more embodiments relate to the structure of a display device. Background Technology

[0002] With the development of display devices that visually display electrical signals, various display devices with excellent characteristics, such as relative thinness, light weight, and relatively low power consumption, have been introduced. For example, flexible display devices that can be folded or rolled up have been introduced. Recently, research on stretchable display devices that can deform in various forms is actively underway.

[0003] The information disclosed in this background section is only intended to enhance the understanding of the background art, and therefore, the information discussed in this background section does not necessarily constitute prior art. Summary of the Invention Technical issues

[0004] One or more embodiments include a display device that can ensure excellent scalability. However, these one or more embodiments are merely examples, and the scope of the embodiments according to this disclosure is not limited thereto. Solution to the problem

[0005] According to one or more embodiments, a display device includes: a substrate; a first wiring on the substrate; and a second wiring on the first wiring and electrically connected to the first wiring, wherein the first wiring and the second wiring include an overlap region in a plan view where the first wiring and the second wiring overlap, and at least one of the first wiring or the second wiring includes an opening in the overlap region.

[0006] According to one or more embodiments, the first wiring and the second wiring can be electrically connected to each other through a plurality of sub-contact holes arranged in a region other than the opening in the overlapping region.

[0007] According to one or more embodiments, the display device may further include: a first insulating layer disposed between the first wiring and the second wiring; and a second insulating layer on the second wiring, wherein the first insulating layer may fill an opening in the first wiring, and the second insulating layer may fill an opening in the second wiring.

[0008] According to one or more embodiments, a plurality of sub-contact holes may penetrate the first insulating layer.

[0009] According to one or more embodiments, the sum of the planar areas of the plurality of sub-contact holes can be constant, regardless of the number of the plurality of sub-contact holes.

[0010] According to one or more embodiments, the sum of the planar areas of a plurality of sub-contact holes may be equal to the planar areas of the contact holes to which the first wiring and the second wiring can be electrically connected without openings.

[0011] According to one or more embodiments, the opening may have an elliptical shape, a circular shape, or a rhomboid shape in a plane.

[0012] According to one or more embodiments, when the opening has an elliptical shape, the opening can be arranged such that the major axis of the elliptical shape is arranged in the direction in which the wiring defining the opening extends.

[0013] According to one or more embodiments, when the opening has a rhombus shape, the opening can be arranged such that the longer diagonal of the two diagonals of the rhombus shape is arranged in the direction in which the wiring defining the opening extends.

[0014] According to one or more embodiments, the first wiring may have a higher modulus than the second wiring.

[0015] According to one or more embodiments, each of the first wiring and the second wiring may include an opening in the overlapping area.

[0016] According to one or more embodiments, the first wiring may include an opening in the overlapping region, and the second wiring may be integrally formed with the overlapping region without an opening.

[0017] According to one or more embodiments, the display device may further include: a plurality of pixel circuits on a substrate; a plurality of light-emitting elements electrically connected to the plurality of pixel circuits respectively; and a bridge electrode connecting one of the plurality of light-emitting elements to one of the plurality of pixel circuits.

[0018] According to one or more embodiments, the first wiring may be arranged on the same layer as the source electrode or drain electrode included in the plurality of pixel circuits, and the second wiring may be arranged on the same layer as the bridge electrode.

[0019] According to one or more embodiments, a first wiring may be electrically connected to one of a plurality of pixel circuits, and a second wiring may be electrically connected to adjacent pixel circuits in the plurality of pixel circuits.

[0020] According to one or more embodiments, a display device includes: a substrate; a first wiring on the substrate; an insulating layer on the first wiring; and a second wiring on the insulating layer, wherein the first wiring and the second wiring include an overlap region in a plane where the first wiring and the second wiring overlap, the insulating layer includes an opening that overlaps with the overlap region, and a connecting material having a different modulus to each of the first wiring and the second wiring is disposed in the opening of the insulating layer.

[0021] According to one or more embodiments, the connecting material may have a lower modulus than each of the first wiring and the second wiring.

[0022] According to one or more embodiments, the connecting material may include liquid metal.

[0023] According to one or more embodiments, the liquid metal may include gallium indium eutectic alloy (EGaln) or gallium indium tin alloy (Galinstan).

[0024] According to one or more embodiments, the connecting material can contact the upper surface of the first wiring and the lower surface of the second wiring, and can electrically connect the first wiring to the second wiring.

[0025] According to one or more embodiments, the display device may further include: a plurality of pixel circuits on a substrate; a plurality of light-emitting elements electrically connected to the plurality of pixel circuits respectively; and a bridge electrode connecting one of the plurality of light-emitting elements to one of the plurality of pixel circuits.

[0026] According to one or more embodiments, the first wiring may be arranged on the same layer as the source electrode or drain electrode included in the plurality of pixel circuits, and the second wiring may be arranged on the same layer as the bridge electrode.

[0027] According to one or more embodiments, a first wiring may be electrically connected to one of a plurality of pixel circuits, and a second wiring may be electrically connected to adjacent pixel circuits in the plurality of pixel circuits. Beneficial effects of the present invention

[0028] The display device according to the embodiments can have excellent scalability and can reduce the contact resistance between wires when stretched. However, the beneficial effects of the present invention are merely illustrative, and the scope of this disclosure is not limited thereto. Attached Figure Description

[0029] Figure 1 This is a schematic perspective view of a display device according to an embodiment.

[0030] Figure 2a and Figure 2b It is shown Figure 1 A perspective view of the display device after it has been stretched in the first direction.

[0031] Figure 2c It is shown Figure 1 A perspective view of the display device after it has been stretched in the second direction.

[0032] Figure 2d It is shown Figure 1 A perspective view of the display device after it has been stretched in the first and second directions.

[0033] Figure 2e It is shown Figure 1 A perspective view of the display device after it has been stretched upwards by a third party.

[0034] Figure 3 This is a schematic plan view of a display device according to an embodiment.

[0035] Figure 4a and Figure 4b This is a plan view of a portion of the display area of ​​a display device according to an embodiment.

[0036] Figure 5 This is a cross-sectional view of a portion of the display device according to an embodiment, and corresponds to along... Figure 4a A cross-sectional view of the display device taken by lines Va-Va' and Vb-Vb'.

[0037] Figure 6 It is a schematic map showing Figure 5 The equivalent circuit diagram of the pixel circuit and the light-emitting diode.

[0038] Figures 7a to 7e This is a schematic diagram showing a cross-sectional view of the light-emitting diode of a display device according to an embodiment.

[0039] Figure 8 This is a plan view of a portion of the display area of ​​a display device according to an embodiment.

[0040] Figure 9 This is an enlarged plan view of a portion of the display device according to an embodiment, and corresponds to... Figure 8 Region A.

[0041] Figure 10 This is a cross-sectional view of a portion of the display device according to an embodiment, and corresponds to along... Figure 8 The line I-I' and Figure 9 The cross section of the display device is taken by line II-II'.

[0042] Figure 11 This is a plan view of a part of a display device according to another embodiment.

[0043] Figure 12 This is an enlarged plan view of a portion of a display device according to another embodiment, and corresponds to... Figure 11 Region B.

[0044] Figure 13 This is an enlarged plan view of a portion of a display device according to another embodiment.

[0045] Figure 14 This is an enlarged plan view of a portion of a display device according to another embodiment.

[0046] Figure 15 This is a cross-sectional view of a portion of the display device according to an embodiment, and corresponds to along... Figure 8 The line I-I' and Figure 14 The cross section of the display device is taken by line III-III'.

[0047] Figures 16a to 16g This is a perspective view schematically illustrating an embodiment of an electronic device including a display device according to an embodiment. Detailed Implementation

[0048] Because this disclosure can have many different variations, some aspects of these embodiments are illustrated in the accompanying drawings and described in the detailed description. The effects and features of this disclosure, as well as methods for achieving these effects and features, will become apparent when the various embodiments described with reference to the accompanying drawings. However, this disclosure can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0049] One or more embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Regardless of the drawing numbers, the same or corresponding elements are given the same reference numerals, and redundant descriptions thereof are omitted.

[0050] It will be understood that although terms such as “first” and “second” may be used in this document to describe various elements, these elements should not be limited by these terms, and these terms are only used to distinguish one element from another.

[0051] As used herein, the singular forms “a” and “the (said)” are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0052] Furthermore, it will be understood that the terms “comprising,” “including,” and “having” as used herein specify the presence of the described feature or element, but do not exclude the presence or addition of one or more other features or elements.

[0053] It will be understood that when a layer, area, or element is referred to as being "on" another layer, area, or element, it can be "directly on" that other layer, area, or element, or it can be "indirectly on" that other layer, area, or element, with one or more intermediate layers, areas, or elements between them.

[0054] In the accompanying drawings, the dimensions of the components may be exaggerated or reduced for ease of description. In other words, because the dimensions and thicknesses of the elements in the drawings are arbitrarily shown for ease of description, the following embodiments are not limited thereto.

[0055] When an embodiment can be implemented differently, a particular process sequence can be performed differently than the described sequence. For example, two consecutively described processes can be performed substantially simultaneously, or in the reverse order of their description.

[0056] In this specification, the expression "A and / or B" may mean A, B, or A and B. Furthermore, the expression "at least one of A and B" may mean A, B, or A and B.

[0057] In the embodiments described below, it will be understood that when an element, region, or layer is referred to as being connected to another element, region, or layer, it can be directly and / or indirectly connected to that other element, region, or layer. For example, in this specification, when a layer, region, or component is electrically connected to another layer, region, or component, that layer, region, or component can be directly electrically connected to that other layer, region, or component and / or can be indirectly electrically connected to that other layer, region, or component, with an intervening layer, region, or component situated between them.

[0058] In the following examples, the x-axis, y-axis, and z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other.

[0059] Figure 1 This is a schematic perspective view of the display device 1 according to an embodiment. Figure 2a and Figure 2b It is shown Figure 1 A perspective view of the display device 1 after it has been stretched in the first direction. Figure 2c It is shown Figure 1 A perspective view of the display device 1 after it has been stretched in the second direction. Figure 2d It is shown Figure 1 A perspective view of the display device 1 after it has been stretched in the first and second directions. Figure 2e It is shown Figure 1 A perspective view of the display device 1 after it has been stretched upwards in a third-party direction.

[0060] refer to Figure 1 The display device 1 may include a display area DA and a non-display area NDA. The display area DA may include multiple pixels. The display device 1 can provide an image (e.g., a predetermined image) by using light emitted from the multiple pixels. The non-display area NDA may be arranged outside the display area DA (e.g., on the periphery of the display area DA or outside the coverage area of ​​the display area DA). The entire display area DA may be surrounded by the non-display area NDA.

[0061] The display device 1 can be stretched or contracted in various directions. The display device 1 can be stretched in a first direction (e.g., the x-direction and / or the -x-direction) by an external force applied by an external object or a user. In an embodiment, as... Figure 2a and Figure 2b As shown, the display area DA and / or non-display area NDA of the display device 1 can be stretched in a first direction (e.g., the x-direction and / or the -x-direction). For example, as Figure 2a As shown, the display area DA and / or the non-display area NDA can be stretched in both the x and -x directions, or can be stretched in the x direction while being fixed to one side of the display device 1, as shown. Figure 2b As shown in the image.

[0062] The display device 1 can be stretched in a second direction (e.g., the y-direction and / or the -y-direction) by an external force applied by an external object or a user. In an embodiment, as... Figure 2c As shown, the display area DA and / or non-display area NDA of the display device 1 can be stretched in the y-direction and the -y-direction. In some embodiments, the display device 1 can be stretched in the y-direction or the -y-direction while being fixed on one side.

[0063] The display device 1 can be stretched in multiple directions (such as a first direction (e.g., x-direction and / or -x-direction) and a second direction (y-direction and / or -y-direction)) by external forces applied by an external object or a part of a person's body. Figure 2d As shown, the display area DA and / or the non-display area NDA of the display device 1 can be stretched in the ±x and ±y directions.

[0064] The display device 1 can be stretched in a third direction (e.g., the z-direction and / or -z-direction) by an external force applied by an external object or a part of a person's body. In an embodiment, Figure 2e A portion of the display device 1 (such as a portion of the display area DA) is shown to protrude in the z-direction. In some embodiments, a portion of the display device 1 (such as a portion of the display area DA) may protrude in the z-direction (or be recessed in the z-direction).

[0065] Figures 2a to 2e The display device 1 is shown to increase in a first direction, a second direction, and / or a third direction, but this disclosure is not limited thereto. In some embodiments, the display device 1 may deform in atypical shapes, such as bending or twisting along two or more axes.

[0066] Figure 3 This is a schematic plan view of the display device 1 according to an embodiment.

[0067] refer to Figure 3Various components included in the display device 1 are disposed on a substrate 100. The substrate 100 may include a display area DA and a non-display area NDA surrounding the display area DA. The display area DA may be covered by a protective layer and may be protected from the influence of external air or moisture.

[0068] Pixels P are arranged in the display area DA of the substrate 100. Each pixel P can display an image by using light emitted from a light-emitting element (such as a light-emitting diode). Each light-emitting diode can emit, for example, red, green, or blue light. Although in Figure 3 The figure shows a single pixel P, but as those skilled in the art will recognize, the display area DA may include any appropriate number of pixels depending on the design and size of the display device 1.

[0069] Each light-emitting diode (LED) can be electrically connected to pixel circuitry, and each pixel circuitry can include a transistor and a storage capacitor. Each pixel can be electrically connected to peripheral circuitry arranged in the non-display area (NDA). The peripheral circuitry arranged in the non-display area (NDA) can include a gate drive circuit (GDC) and a terminal block (PAD).

[0070] The gate drive circuit (GDC) may include a driver for providing electrical signals to the gate electrode of each of the transistors electrically connected to the light-emitting element. For example, the gate drive circuit (GDC) may apply a scan signal to each of the pixel circuits corresponding to pixel P via a scan line (SL). Furthermore, the gate drive circuit (GDC) may apply an emission control signal to each pixel circuit via an emission control line (EML).

[0071] The gate driving circuit GDC may include a first gate driving circuit GDC1 and a second gate driving circuit GDC2, which are arranged on both sides of the display area DA with the display area DA located between them. The second gate driving circuit GDC2 may be arranged on the opposite side of the first gate driving circuit GDC1 with respect to the display area DA, and may be approximately parallel to the first gate driving circuit GDC1. Some pixel circuits may be electrically connected to the first gate driving circuit GDC1, and other pixel circuits may be electrically connected to the second gate driving circuit GDC2. In some embodiments, the second gate driving circuit GDC2 may be omitted.

[0072] The terminal portion PAD can be disposed on one side of the substrate 100. The terminal portion PAD can be exposed by the insulating layer rather than covered by the insulating layer, and can be connected to the display circuit board 30. The display driver 32 can be disposed in the display circuit board 30.

[0073] The display driver 32 can generate control signals that are transmitted to the first gate drive circuit GDC1 and the second gate drive circuit GDC2. The display driver 32 can generate data signals, and the generated data signals can be transmitted to the pixel circuit of pixel P through the fan-out wiring FW and the data line DL connected to the fan-out wiring FW.

[0074] The display driver 32 can supply a first power supply voltage VDD to the drive voltage supply wiring W11 and a second power supply voltage VSS to the common voltage supply wiring W13. The first power supply voltage VDD can be applied to the pixel circuit of pixel P through the drive voltage line PL connected to the drive voltage supply wiring W11, and the second power supply voltage VSS can be applied to the counter electrode (or second electrode) of the light-emitting element connected to the common voltage supply wiring W13. The drive voltage supply wiring W11 can extend in the x-direction from the underside of the display area DA. The common voltage supply wiring W13 can have a loop shape with an open side, and therefore can partially surround the display area DA.

[0075] Figure 4a and Figure 4b This is a plan view of a portion of the display area DA of the display device 1 according to an embodiment.

[0076] refer to Figure 4a and Figure 4b The display area DA may include a first area 11 and a second area 12 located between the first areas 11. The first area 11 is a unit pixel and may include pixels that emit light differently from each other.

[0077] In some embodiments, Figure 4a and Figure 4b The image shows pixels with a diamond shape in the display area DA. ® The array comprises a blue pixel Pb, a red pixel Pr, and two green pixels Pg. A unit pixel can be the smallest repeating unit of pixels having an array (e.g., a defined or predetermined array), and in some embodiments, pixels can have various arrangements such as a striped arrangement, and each unit pixel can include a blue pixel Pb, a red pixel Pr, and a green pixel Pg.

[0078] The first region 11 can have a polygonal shape on a plane, such as having a shape like... Figure 4a The quadrilateral shape shown or as Figure 4b The hexagonal shape shown. The second region 12, which is the region between the first region 11, can be the region through which signal lines (e.g., scan lines, data lines, etc.) or voltage lines providing signals pass.

[0079] Figure 5 This is a cross-sectional view of a portion of the display area DA of the display device 1 according to an embodiment, and corresponds to the view along... Figure 4a A cross-sectional view of display device 1 taken by lines Va-Va' and Vb-Vb', and Figure 6 It is a schematic map showing Figure 5 The equivalent circuit diagram of the pixel circuit and the light-emitting diode (LED).

[0080] refer to Figure 5 The display device 1 may include a display layer 200, a protective layer 300, and a touch layer 400 on a substrate 100. The substrate 100 may include a stretchable material such as a stretchable polymer resin. In some embodiments, the substrate 100 may include an elastomer. The elastomer may include an organic elastomer, an organic-inorganic elastomer, or a combination thereof. For example, the substrate 100 may include a silicone elastomer such as polydimethylsiloxane, a styrene elastomer, an olefin elastomer, polyurethane, or a mixture thereof. The substrate 100 may have a single-layer or multi-layer structure.

[0081] The display layer 200 may include a pixel circuit PC disposed in the first region 11 and a light-emitting element (such as a light-emitting diode, LED) electrically connected to the pixel circuit PC. The pixel circuit PC may include transistors. In an embodiment, such as Figure 6 As shown, the pixel circuit PC may include a first transistor T1, a second transistor T2, and a storage capacitor Cst. The pixel circuit PC may be electrically connected to signal lines and voltage lines. The signal lines may include a scan line SL and a data line DL, and the voltage lines may include a first voltage line VDDL and a second voltage line VSSL.

[0082] The second transistor T2 can be electrically connected to the scan line SL and the data line DL. The scan line SL can provide the scan signal GW to the gate electrode of the second transistor T2. The second transistor T2 can transmit the data signal Dm input from the data line DL to the first transistor T1 according to the scan signal GW input from the scan line SL.

[0083] The storage capacitor Cst can be electrically connected to the second transistor T2 and the first voltage line VDDL, and can store a voltage corresponding to the difference between the voltage received from the second transistor T2 and the first power supply voltage VDD provided by the first voltage line VDDL.

[0084] The first transistor T1 is a driving transistor capable of controlling the drive current flowing through the light-emitting diode (LED). The first transistor T1 can be connected to a first voltage line VDDL and a storage capacitor Cst. The first transistor T1 can control the drive current flowing through the LED from the first voltage line VDDL according to the voltage value stored in the storage capacitor Cst. The LED can emit light with a specific brightness depending on the drive current. The first electrode of the LED can be electrically connected to the first transistor T1, and the second electrode can be electrically connected to the second voltage line VSSL, which supplies the second power supply voltage VSS.

[0085] Refer again Figure 5 The display layer 200 may include an insulating layer IL disposed between the components (semiconductor layers, electrodes, etc.) of the pixel circuit PC and / or between the pixel circuit PC and the light-emitting diode (LED).

[0086] Signal lines (e.g., scan lines, data lines, etc.) and / or voltage lines (e.g., first voltage line, second voltage line, etc.) electrically connected to the transistors of the pixel circuit PC can be electrically connected to the pixel circuit PC arranged in the first region 11, and in this respect, Figure 5 The diagram illustrates the connection wiring WL. The connection wiring WL described above can correspond to signal lines (e.g., scan lines, data lines, etc.) and / or voltage lines (e.g., first voltage line, second voltage line, etc.).

[0087] The protective layer 300 may be located on the light-emitting diode (LED) and may protect the LED from external forces and / or moisture. The protective layer 300 may include an inorganic protective layer and / or an organic protective layer. In some embodiments, the protective layer 300 may have a structure in which an inorganic protective layer containing an inorganic insulating material, an organic protective layer containing an organic insulating material, and an inorganic protective layer containing an inorganic insulating material are stacked.

[0088] In some embodiments, the protective layer 300 may comprise an organic material such as a resin, and may be a single layer comprising the aforementioned organic material. In some embodiments, the protective layer 300 may comprise a polyurethane epoxy acrylate. The protective layer 300 may comprise a photosensitive material such as a photoresist.

[0089] The touch layer 400 may be located on the protective layer 300. The touch layer 400 may include touch electrodes and touch insulating layers located below and above the touch electrodes, respectively.

[0090] Figures 7a to 7e This is a schematic diagram showing a cross-sectional view of a light-emitting diode (LED) of a display device according to an embodiment.

[0091] refer to Figure 7aA light-emitting diode (LED) may include an inorganic LED comprising inorganic materials. The LED may include a first semiconductor layer 231, a second semiconductor layer 232, an intermediate layer 233 between the first semiconductor layer 231 and the second semiconductor layer 232, a first electrode 235 electrically connected to the first semiconductor layer 231, and a second electrode 238 electrically connected to the second semiconductor layer 232. The first electrode 235 and the second electrode 238 of the LED may be electrically connected to a first electrode pad 241 and a second electrode pad 242 disposed on the same layer, respectively. The second electrode pad 242 may be a reference... Figure 6 It may be a portion of the second voltage line VSSL, or it may be a conductive layer electrically connected to the second voltage line VSSL.

[0092] In some embodiments, the first semiconductor layer 231 may include a p-type semiconductor layer. The p-type semiconductor layer may be selected from semiconductor materials having the composition InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1) (e.g., GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, etc.), and may be doped with p-type dopants such as Mg, Zn, Ca, Sr, Ba, etc.

[0093] The second semiconductor layer 232 may include, for example, an n-type semiconductor layer. The n-type semiconductor layer may be selected from semiconductor materials having the composition InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1) (e.g., GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, etc.), and may be doped with n-type dopants such as Si, Ge, Sn, etc.

[0094] The intermediate layer 233 is a region in which electrons and holes recombine, and as electrons and holes recombine, the energy level can transition to a lower energy level, generating light with a wavelength corresponding to that lower energy level. The intermediate layer 233 can be formed, for example, by comprising a semiconductor material having the compositional formula InxAlyGa1-x-yN (0≤x≤1, 0≤y≤1, 0≤x+y≤1), and can be formed in a single quantum well structure or a multiple quantum well (MQW) structure. Furthermore, it can include a quantum wire structure or a quantum dot structure.

[0095] Figure 7a The figure illustrates that the first semiconductor layer 231 includes a p-type semiconductor layer and the second semiconductor layer 232 includes an n-type semiconductor layer, but this disclosure is not limited thereto. In some embodiments, the first semiconductor layer 231 may include an n-type semiconductor layer and the second semiconductor layer 232 may include a p-type semiconductor layer.

[0096] Figure 7aThe figure shows the first electrode pad 241 and the second electrode pad 242 arranged on the same layer, but this disclosure is not limited thereto. Reference Figure 7b The first electrode pad 241 and the second electrode pad 242 can be arranged on different layers. For example, a dam layer 230 having an opening that overlaps at least a portion of the first electrode pad 241 can be located on the first electrode pad 241, and the second electrode pad 242 can be located on the dam layer 230. Figure 7b The structure of the light-emitting diode (LED) shown is as referenced. Figure 7a As described.

[0097] In some embodiments, such as Figure 7c As shown in the cross-sectional view, the second electrode pad 242 may be arranged on both sides of the first electrode pad 241. The dam layer 230 may include an opening that overlaps with at least a portion of the first electrode pad 241, and the second electrode pad 242 may be arranged around the opening of the dam layer 230. In some embodiments, the second electrode pad 242 may have a closed-loop shape surrounding the entire opening of the dam layer 230 and / or the entire first electrode pad 241. Figure 7c The structure of the light-emitting diode (LED) shown is as referenced. Figure 7a As described.

[0098] Figures 7a to 7c The diagram shows the first electrode 235 and the second electrode 238 of a light-emitting diode (LED) facing the same direction (e.g., downward direction, -z direction), but this disclosure is not limited thereto. Figure 7d As shown, the first electrode 235 and the second electrode 238 of the light-emitting diode (LED) can face opposite directions to each other.

[0099] The dam layer 230 may include openings that expose at least a portion of the first electrode pad 241, and the thickness of the dam layer 230 may be substantially the same as the thickness of the light-emitting diode (LED). The openings of the dam layer 230 may be filled with a filler material FM, and the second electrode pad 242 may be located on the dam layer 230 for electrical connection (e.g., contact) with the second electrode 238 of the LED. The filler material FM may be an insulating organic material.

[0100] refer to Figure 7e The light-emitting diode (LED) may include an organic light-emitting diode containing organic materials. The organic light-emitting diode may include a first electrode 221, a second electrode 225 facing the first electrode 221, and an emitting layer 223 between the first electrode 221 and the second electrode 225. A first functional layer 222 may be disposed between the first electrode 221 and the emitting layer 223, and a second functional layer 224 may be disposed between the emitting layer 223 and the second electrode 225.

[0101] The edge of the first electrode 221 may be covered by a dam layer 230 comprising an insulating material. The dam layer 230 may include an opening B-OP that overlaps with the center of the first electrode 221.

[0102] The first electrode 221 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or zinc aluminum oxide (AZO). In some embodiments, the first electrode 221 may include a reflective layer comprising silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), silver (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or a compound thereof. In some embodiments, the first electrode 221 may further include a layer comprising ITO, IZO, ZnO, AZO, or In2O3 above / below the reflective layer described above.

[0103] The emitting layer 223 may comprise a high-molecular-weight organic material or a low-molecular-weight organic material that emits light of a certain color (e.g., a set or predetermined color of light). The first functional layer 222 may comprise a hole transport layer (HTL) and / or a hole injection layer (HIL). The second functional layer 224 may comprise an electron transport layer (ETL) and / or an electron injection layer (EIL).

[0104] The second electrode 225 may include a conductive material with a low work function. For example, the second electrode 225 may include a transparent (or semi-transparent reflective) layer comprising Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), calcium (Ca), or alloys thereof. Alternatively, the second electrode 225 may further include a layer such as ITO, IZO, ZnO, AZO, or In2O3 on top of the transparent (or semi-transparent reflective) layer comprising the material described above.

[0105] Figure 8 This is a plan view of a portion of the display area of ​​a display device according to an embodiment. Figure 9 This is an enlarged plan view of a portion of the display device according to an embodiment, and corresponds to... Figure 8 Region A.

[0106] refer to Figure 8 The display area DA may include a first area 11 and a second area 12 between the first areas 11. As described above, the first area 11 is a unit pixel and may include pixels that emit light differently from each other. For example, according to some embodiments, the first area 11 may include a blue pixel, a red pixel, and two green pixels.

[0107] Multiple pixels can each include a pixel circuit PC (reference). Figure 6The pixels also include light-emitting diodes (LEDs) connected to pixel circuits (PCs). Therefore, the multiple pixel circuits (PCs) included in each of the multiple pixels can be arranged in the first region 11. In this case, the region where the multiple pixel circuits (PCs) are arranged can be referred to as pixel circuit region 13.

[0108] The second region 12 surrounding the plurality of first regions 11 can be the remaining region in the display region DA other than the first regions 11. The second region 12 is the region in which no pixels are arranged, and therefore pixel circuitry or light-emitting elements may not be arranged in the second region 12. However, the second region 12 is where connecting wiring WL (refer to) connecting adjacent pixels among the plurality of pixels is arranged. Figure 5 The area is connected to the wiring WL ( ). Figure 5 It can connect adjacent pixel circuits in multiple pixel circuits.

[0109] Specifically, the first wiring 21 and the second wiring 22 located on the first wiring 21 can be arranged in the display area DA. The first wiring 21 is a wiring arranged in the first area 11 and can be electrically connected to a plurality of pixel circuits PC in the pixel circuit area 13 (see reference). Figure 6 Any one of them.

[0110] The second wiring 22 can be arranged in the second region 12 and can electrically connect adjacent unit pixels. Specifically, one end of the second wiring 22 can be connected to the first wiring 21 arranged in any of the first regions 11, and the other end of the second wiring 22 can be connected to the first wiring 21 arranged in another adjacent first region 11. That is, the second wiring 22 can be the connecting wiring WL described above (see reference). Figure 5 The second wiring 22 may correspond to signal lines (e.g., scan lines, data lines, etc.) and / or voltage lines (e.g., first voltage line, second voltage line, etc.) that provide signals.

[0111] In an embodiment, the modulus of the first wiring 21 may be different from the modulus of the second wiring 22. Specifically, the first wiring 21 may have a higher modulus than the second wiring 22. Since the second wiring 22 comprises a material having a lower modulus than the first wiring 21, the second wiring 22 can release high stress when the display device is stretched, thereby reducing the stress on the pixel circuit region 13 including the first wiring 21 and improving device stability.

[0112] For example, the first wiring 21 may include a metal thin film comprising a low-resistance metallic material, and the second wiring 22 may include a metal nanostructure and an elastic polymer. The first wiring 21 may include a conductive material comprising molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may include multiple layers or a single layer comprising the materials described above. For example, the first wiring 21 may be provided as a three-layer metal thin film having a Ti / Al / Ti structure. The metal nanostructure of the second wiring 22 may include at least one of Ag nanoparticles, Ag nanosheets, and Ag nanowires, and the elastic polymer may include at least one of polydimethylsiloxane (PDMS), polyurethane (PU), and Ecoflex. However, this disclosure is not limited thereto, and both the first wiring 21 and the second wiring 22 may include a metal thin film. Alternatively, the first wiring 21 and the second wiring 22 may include a metal nanostructure and an elastic polymer, and may also include materials having moduli different from each other.

[0113] refer to Figure 9 The first wiring 21 and the second wiring 22 can extend in directions that intersect each other. For example, as... Figure 9 As shown, the first wiring 21 may extend in a first direction (e.g., the x-direction), and the second wiring 22 may extend in a second direction (e.g., the y-direction). However, the embodiment is not limited to this, and the first wiring 21 may extend in the second direction (e.g., the y-direction), and the second wiring 22 may extend in the first direction (e.g., the x-direction).

[0114] As the first wiring 21 and the second wiring 22 extend in directions that intersect each other, the first wiring 21 and the second wiring 22 may each include an overlapping region OA in which the first wiring 21 and the second wiring 22 overlap each other. In an embodiment, at least one of the first wiring 21 and the second wiring 22 may include an opening OP in the overlapping region OA. Specifically, the first wiring 21 may include a first opening 21OP in the overlapping region OA, and the second wiring 22 may include a second opening 22OP in the overlapping region OA.

[0115] The first opening 21OP and the second opening 22OP can extend or contract in the direction in which the display device is stretched. In this case, the first opening 21OP and the second opening 22OP can have an elliptical shape, a circular shape, or a rhombus shape in the plane. Specifically, when the first opening 21OP and the second opening 22OP have an elliptical shape, the first opening 21OP and the second opening 22OP can be formed such that the major axis of the elliptical shape of each of the first opening 21OP and the second opening 22OP is arranged in the direction in which the wiring defining the opening OP extends. For example, the first opening 21OP can be formed such that the major axis of its elliptical shape is arranged in a first direction (e.g., the x-direction), and the second opening 22OP can be formed such that the major axis of its elliptical shape is arranged in a second direction (e.g., the y-direction). Furthermore, when the first opening 21OP and the second opening 22OP have a rhombus shape, the first opening 21OP and the second opening 22OP can be formed such that the longer diagonal of the two diagonals of its rhombus shape is arranged in the direction in which the wiring defining the opening OP extends. For example, the first opening 21OP can be formed such that the long diagonal of the rhombus shape is arranged in a first direction (e.g., the x-direction), and the second opening 22OP can be formed such that the long diagonal of the rhombus shape is arranged in a second direction (e.g., the y-direction). This can be to increase the flexibility of the portion where the first wiring 21 contacts the second wiring 22 and reduce the stress that may occur during stretching.

[0116] Because the second wiring 22 serves as the connecting wiring WL (see reference) Figure 5 Since a signal or voltage must be applied to multiple pixels, the second wiring 22 needs to be electrically connected to the first wiring 21. In an embodiment, the first wiring 21 can be electrically connected to the second wiring 22 via a plurality of sub-contact holes SCH arranged in the overlapping region OA, excluding the opening OP. The plurality of sub-contact holes SCH can surround the opening OP in the overlapping region OA.

[0117] The first wiring 21 can be electrically connected to the second wiring 22 through two or more sub-contact holes SCH. For example, as Figure 8 As shown, four sub-contact holes SCH, including a first sub-contact hole SCH1, a second sub-contact hole SCH2, a third sub-contact hole SCH3, and a fourth sub-contact hole SCH4, can be arranged in the overlapping area OA. In this case, the sum of the planar areas of the multiple sub-contact holes SCH can be constant, regardless of the number of sub-contact holes SCH. Specifically, when assuming that the first wiring 21 is connected to the second wiring 22 through a contact hole without opening OP, the sum of the planar areas of the multiple sub-contact holes SCH can be the same as the planar area of ​​that single contact hole. For example, when... Figure 9As shown, when four sub-contact holes SCH are arranged between the first wiring 21 and the second wiring 22, the planar area of ​​one sub-contact hole SCH can be one-quarter of the area of ​​a normal contact hole. In some embodiments, when two sub-contact holes SCH are arranged between the first wiring 21 and the second wiring 22, the planar area of ​​one sub-contact hole SCH can be half the area of ​​a normal contact hole.

[0118] In other words, since an opening OP is arranged in the overlapping area OA of each wiring, the excellent scalability of the display device according to the embodiment can be ensured. Furthermore, since a plurality of sub-contact holes SCH are arranged around the opening OP, the contact resistance between the first wiring 21 and the second wiring 22 can be stabilized. Specifically, when the display device is stretched, the contact resistance between the first wiring 21 and the second wiring 22 may increase significantly. In this case, because the stress in the display device according to the embodiment can be released through the opening OP and distributed by arranging the plurality of sub-contact holes SCH, the increase in contact resistance between the first wiring 21 and the second wiring 22 can be reduced or prevented.

[0119] Figure 10 This is a cross-sectional view of a portion of the display device 1 according to an embodiment, and corresponds to along... Figure 8 The line I-I' and Figure 9 The cross section of display device 1 is taken by line II-II'.

[0120] refer to Figure 10 The substrate 100 may be a stretchable substrate that can be stretched or contracted in a certain direction (e.g., a set or predetermined direction). The substrate 100 may include insulating materials such as glass, quartz, and polymer resins. The substrate 100 may include an elastomer. The elastomer may include organic elastomers, organic-inorganic elastomers, or combinations thereof. For example, the substrate 100 may include silicone elastomers such as polydimethylsiloxane, styrene elastomers, olefin elastomers, polyurethane, or mixtures thereof. The substrate 100 may have a single-layer or multi-layer structure.

[0121] The buffer layer 111 may be located on the substrate 100, and the pixel circuit PC may be located on the buffer layer 111. The buffer layer 111 may include organic insulating materials, inorganic insulating materials, or organic-inorganic insulating materials, and may have a single-layer structure or a multi-layer structure.

[0122] A thin-film transistor (TFT) may include a semiconductor layer Act, a gate electrode GE, a source electrode SE, and a drain electrode DE. Figure 10 The figure illustrates a top-gate type where the gate electrode GE is located on the semiconductor layer Act and the gate insulating layer 113 is located between them. However, according to some embodiments, the thin-film transistor (TFT) can be a bottom-gate type.

[0123] The semiconductor layer Act may include polycrystalline silicon. Alternatively, the semiconductor layer Act may include amorphous silicon, oxide semiconductor, or organic semiconductor. The gate electrode GE may include a metal thin film comprising a low-resistance metallic material. The gate electrode GE may include a conductive material comprising Mo, Al, Cu, Ti, etc., and may include multiple layers or a single layer comprising the materials described above. For example, the gate electrode GE may be provided as a three-layer metal thin film having a Ti / Al / Ti structure.

[0124] The gate insulating layer 113 located between the semiconductor layer Act and the gate electrode GE may include organic insulating materials, inorganic insulating materials, or organic-inorganic insulating materials, and may have a single-layer structure or a multi-layer structure.

[0125] The source electrode SE and drain electrode DE can be disposed on the same layer (such as the second interlayer insulating layer 117) and can comprise the same material. The source electrode SE and drain electrode DE can comprise a metal thin film comprising a low-resistance metallic material. The source electrode SE and gate electrode GE can comprise a conductive material comprising Mo, Al, Cu, Ti, etc., and can comprise multiple layers or a single layer comprising the materials described above. For example, the source electrode SE and drain electrode DE can be provided as a three-layer metal thin film having a Ti / Al / Ti structure. The second interlayer insulating layer 117 can comprise an organic insulating material, an inorganic insulating material, or an organic-inorganic insulating material, and can have a single-layer or multi-layer structure.

[0126] The storage capacitor Cst may include a first electrode CE1 and a second electrode CE2 that overlap each other, with a first interlayer insulating layer 115 between them. The storage capacitor Cst may overlap with a thin-film transistor (TFT). In this respect, Figure 10 The diagram shows that the gate electrode GE of the thin-film transistor TFT is the first electrode CE1 of the storage capacitor Cst. In some embodiments, the storage capacitor Cst may not overlap with the thin-film transistor TFT. The storage capacitor Cst may be covered by a second interlayer insulating layer 117.

[0127] The first interlayer insulation layer 115 may be disposed between the gate insulation layer 113 and the second interlayer insulation layer 117. The first interlayer insulation layer 115 may include organic insulating material, inorganic insulating material or organic-inorganic insulating material, and may have a single-layer or multi-layer structure.

[0128] The second electrode CE2 of the storage capacitor Cst may include a conductive material and may have a single-layer or multi-layer structure. The second electrode CE2 may include a metal thin film comprising a low-resistance metallic material. The second electrode CE2 may include a conductive material comprising Mo, Al, Cu, Ti, etc., and may include multiple layers or a single layer comprising the materials described above. For example, the second electrode CE2 may be provided as a three-layer metal thin film having a Ti / Al / Ti structure.

[0129] A first organic insulating layer 119 may be located on a second interlayer insulating layer 117, and a second organic insulating layer 121 may be located on a first organic insulating layer 119. The first organic insulating layer 119 and the second organic insulating layer 121 may each comprise an organic insulating material such as polyimide.

[0130] The first bridge electrode BE1 may be located on the first organic insulating layer 119, and the second bridge electrode BE2 may be located on the second organic insulating layer 121. The first bridge electrode BE1 and the second bridge electrode BE2 can electrically connect the thin-film transistor (TFT) to the light-emitting diode (LED). The first bridge electrode BE1 and the second bridge electrode BE2 may include a metal thin film containing a low-resistance metallic material. The first bridge electrode BE1 and the second bridge electrode BE2 may include conductive materials containing Mo, Al, Cu, Ti, etc., and may include multiple layers or a single layer containing the materials described above. For example, the first bridge electrode BE1 and the second bridge electrode BE2 may be provided as a three-layer metal thin film having a Ti / Al / Ti structure.

[0131] The second voltage line VSSL may be located on the second organic insulating layer 121, and the third organic insulating layer 123 may be located on the second organic insulating layer 121 and the second voltage line VSSL. The third organic insulating layer 123 may include an organic insulating material such as polyimide. The second voltage line VSSL may be connected to the common voltage supply wiring 13 (reference). Figure 3 ) to make the second power supply voltage VSS (reference) Figure 6 The voltage is transmitted to the second electrode 238. In an embodiment, the second voltage line VSSL serves as the connection wiring WL (see reference). Figure 5 The second bridge electrode BE2, which may be disposed in the same layer as the second voltage line VSSL, may comprise a different material. Like the second wiring 22, the second voltage line VSSL may comprise a material having a lower modulus than the second bridge electrode BE2. For example, the second voltage line VSSL may comprise a metal nanostructure and an elastic polymer. However, the embodiments are not limited thereto, and in some embodiments, the second voltage line VSSL may comprise the same material as the second bridge electrode BE2.

[0132] First electrode pad 241 and second electrode pad 242 may be located on third organic insulating layer 123. First electrode pad 241 can be electrically connected to thin-film transistor (TFT) via a first bridge electrode BE1 located between first organic insulating layer 119 and second organic insulating layer 121, and a second bridge electrode BE2 located between second organic insulating layer 121 and third organic insulating layer 123. Light-emitting diodes (LEDs) on first electrode pad 241 and second electrode pad 242 are as shown in the reference. Figure 7a The light-emitting diode (LED) can be protected by a protective layer 300, and the protective layer 300 may include an inorganic protective layer and / or an organic protective layer, or may include an organic material such as a resin. Figure 10 The light-emitting diode is shown as a reference. Figure 7a The inorganic light-emitting diode described herein may, in some embodiments, be a reference light-emitting diode. Figure 7e The organic light-emitting diode described.

[0133] Next, when referring to the overlapping region OA of the first wiring 21 and the second wiring 22, the buffer layer 111, the gate insulating layer 113, the first interlayer insulating layer 115, and the second interlayer insulating layer 117 can be sequentially located on the substrate 100. The first wiring 21 can be located on the second interlayer insulating layer 117. The first wiring 21 can be disposed on the same layer as the source electrode SE and the drain electrode DE, and can include the same material as the source electrode SE and the drain electrode DE. For example, the first wiring 21 can include a conductive material containing Mo, Al, Cu, Ti, etc., and can include multiple layers or a single layer containing the materials described above. The first wiring 21 can be provided as a three-layer metal thin film having a Ti / Al / Ti structure.

[0134] A first organic insulating layer 119 may be located on the first wiring 21, and a second wiring 22 may be located on the first organic insulating layer 119. A second organic insulating layer 121 may be located on the second wiring 22. The second wiring 22 may be disposed in the same layer as the first bridge electrode BE1, but may comprise a different material than the first bridge electrode BE1. In an embodiment, the second wiring 22 may comprise a material having a lower modulus than the first wiring 21. Specifically, the second wiring 22 may comprise a metal nanostructure and an elastic polymer. The metal nanostructure may comprise at least one of Ag nanoparticles, Ag nanosheets, and Ag nanowires. The elastic polymer may comprise at least one of polydimethylsiloxane (PDMS), polyurethane (PU), and Ecoflex.

[0135] As described above, the first wiring 21 may include a first opening 21OP in the overlapping region OA. Because the first organic insulating layer 119 may be located on the first wiring 21, the first opening 21OP may be filled with the first organic insulating layer 119. Similarly, the second wiring 22 may include a second opening 22OP in the overlapping region OA, and the second opening 22OP may be filled with the second organic insulating layer 121.

[0136] Furthermore, the first wiring 21 can be routed through a plurality of sub-contact holes SCH surrounding the opening OP (see reference). Figure 9 The second wiring 22 is electrically connected to the second wiring 22. In one embodiment, the plurality of sub-contact holes SCH can each penetrate the first organic insulating layer 119. However, the embodiment is not limited thereto, and in some embodiments, when the second wiring 22 and the second bridge electrode BE2 are arranged on the same layer, the plurality of sub-contact holes SCH can each penetrate the first organic insulating layer 119 and the second organic insulating layer 121.

[0137] Figure 11 This is a plan view of a part of a display device according to another embodiment. Figure 12 This is an enlarged plan view of a portion of a display device according to another embodiment, and corresponds to... Figure 11 Region B. (Reference) Figure 11 and Figure 12 Features other than those of the first wiring 21 and the second wiring 22, such as those in Figures 8 to 10 As stated in [the text]. Using [the text]... Figures 8 to 10 The description replaces the description Figure 11 and Figure 12 Having and Figures 8 to 10 The accompanying drawings use the same reference numerals to describe the various parts, and the main differences are described below.

[0138] refer to Figure 11 and Figure 12 The first wiring 21 and the second wiring 22 located on the first wiring 21 can be arranged in the display area DA. The first wiring 21 can be electrically connected to a plurality of pixel circuits PC in the pixel circuit area 13 (see reference). Figure 6 Any one of the following. The second wiring 22 that electrically connects adjacent unit pixels can be the connection wiring WL (see reference). Figure 5 ).

[0139] In an embodiment, the first wiring 21 and the second wiring 22 may extend in the same direction. The first wiring 21 and the second wiring 22 may include an overlapping region OA where the first wiring 21 and the second wiring 22 overlap. In an embodiment, the first wiring 21 and the second wiring 22 may each include an opening OP in the overlapping region OA. For example, the first wiring 21 may include a first opening 21OP, and the second wiring 22 may include a second opening 22OP.

[0140] As described above, the first opening 21OP and the second opening 22OP can extend or contract in the direction in which the display device is stretched. Furthermore, the first opening 21OP and the second opening 22OP can have an elliptical, circular, or rhomboid shape in a plane. When the first wiring 21 and the second wiring 22 extend in the same direction, the first opening 21OP and the second opening 22OP can be arranged side-by-side such that the major axes of the elliptical shapes of the first opening 21OP and the second opening 22OP face the same direction.

[0141] Similarly, when the first opening 21OP and the second opening 22OP are arranged side by side, a plurality of sub-contact holes SCH can be arranged in the overlapping area OA, excluding the opening OP. The plurality of sub-contact holes SCH can electrically connect the first wiring 21 to the second wiring 22. For example... Figure 12 As shown, four sub-contact holes SCH can be arranged around the opening OP in the overlapping area OA, but the embodiment is not limited to this, and two or more sub-contact holes SCH can be arranged.

[0142] Figure 13 This is an enlarged plan view of a portion of a display device according to another embodiment. (See reference) Figure 13 Features other than those of the first wiring 21 and the second wiring 22, such as those in Figure 11 and Figure 12 As stated in [the text]. Using [the text]... Figure 11 and Figure 12 The description replaces the description Figure 13 Having and Figure 11 and Figure 12 The accompanying drawings use the same reference numerals to describe the various parts, and the main differences are described below.

[0143] refer to Figure 13 The first wiring 21 and the second wiring 22 may extend in the same direction. The first wiring 21 and the second wiring 22 may include an overlapping region OA where the first wiring 21 and the second wiring 22 overlap. In an embodiment, only one of the first wiring 21 and the second wiring 22 may include an opening OP in the overlapping region OA. For example, as... Figure 13As shown, the first wiring 21 may include a first opening 21OP in the overlapping region OA, but the second wiring 22 may not include the opening OP. In other words, the second wiring 22 may be integrally formed with the front surface of the overlapping region OA without an opening.

[0144] Similarly, when only the first wiring 21 includes an opening, a plurality of sub-contact holes SCH can be arranged in the overlapping area OA, excluding the opening OP. The plurality of sub-contact holes SCH can electrically connect the first wiring 21 to the second wiring 22. For example... Figure 13 As shown, four sub-contact holes SCH can be arranged around the opening OP in the overlapping area OA, but the embodiment is not limited to this, and two or more sub-contact holes SCH can be arranged.

[0145] As described above, the first wiring 21 may have a higher modulus than the second wiring 22. In other words, the second wiring 22 may comprise a material with higher elasticity than the first wiring 21. For example, the first wiring 21 may comprise a low-resistance metal thin film material, and the second wiring 22 may comprise a composite material of a metal nanostructure and an elastic polymer. That is, a first opening 21OP is formed in the first wiring 21 having a high modulus, thereby releasing the stress applied to the first region 11 when the wiring is stretched. Because the second wiring 22 is formed using a material with a low modulus, excellent elasticity can be ensured without the need for an opening. As a result, the display device according to some embodiments can stabilize the contact resistance between the first wiring 21 and the second wiring 22 while ensuring excellent elasticity.

[0146] Figure 14 This is an enlarged plan view of a portion of a display device according to another embodiment. Figure 15 This is a cross-sectional view of a portion of the display device 1 according to an embodiment, and corresponds to along... Figure 8 The line I-I' and Figure 14 The cross-section of display device 1 taken by line III-III'. (Reference) Figure 14 and Figure 15 Features other than those of the first wiring 21, the second wiring 22, and the connecting material 24, such as those in Figures 8 to 10 As stated in [the text]. Using [the text]... Figures 8 to 10 The description replaces the description Figure 14 and Figure 15 Having and Figures 8 to 10 The accompanying drawings use the same reference numerals to describe the various parts, and the main differences are described below.

[0147] refer to Figure 14 and Figure 15The first wiring 21 and the second wiring 22 located on the first wiring 21 can be arranged in the display area DA. The first wiring 21 can be electrically connected to a plurality of pixel circuits PC in the pixel circuit area 13 (see reference). Figure 6 Any one of the following. The second wiring 22 that electrically connects adjacent unit pixels can be the connection wiring WL (see reference). Figure 5 ).

[0148] In embodiments, the first wiring 21 and the second wiring 22 may comprise the same material. Specifically, the first wiring 21 may be disposed on the same layer as the source electrode SE and the drain electrode DE, and may comprise the same material as the source electrode SE and the drain electrode DE. The second wiring 22 may be disposed on the same layer as the first bridge electrode BE1, and may comprise the same material as the first bridge electrode BE1. That is, the first wiring 21 and the second wiring 22 may comprise a metal thin film comprising a low-resistance metallic material. For example, the first wiring 21 and the second wiring 22 may comprise conductive materials comprising Mo, Al, Cu, Ti, etc., and may comprise multilayers or single layers comprising the materials described above. However, the embodiments are not limited thereto, and in some embodiments, the first wiring 21 may have a higher modulus than the second wiring 22. For example, the first wiring 21 may comprise a metal thin film, and the second wiring 22 may comprise a composite material of a metal nanostructure and an elastic polymer.

[0149] refer to Figure 14 and Figure 15 The first wiring 21 and the second wiring 22 may exclude the opening OP in the overlapping area OA (see reference). Figure 9 And it can be done without multiple sub-contact holes (see reference). Figure 9 The first wiring 21 and the second wiring 22 are connected to each other. However, in a display device according to some embodiments, the connecting material 24 may be disposed between the first wiring 21 and the second wiring 22. Specifically, the first organic insulating layer 119 disposed between the first wiring 21 and the second wiring 22 may include an insulating layer opening 119OP overlapping the overlapping region 0A, and the connecting material 24 may be disposed in the insulating layer opening 119OP. Since the insulating layer opening 119OP penetrates the first organic insulating layer 119, the connecting material 24 can directly contact the upper surface of the first wiring 21 and the lower surface of the second wiring 22. The first wiring 21 can be electrically connected to the second wiring 22 through the conductive connecting material 24 instead of a contact hole.

[0150] In this configuration, the connecting material 24 may have a lower modulus than each of the first wiring 21 and the second wiring 22. In embodiments, the connecting material 24 may comprise a liquid metal. For example, the connecting material 24 may comprise a liquid metal comprising a gallium-indium eutectic alloy (EGaln) or a gallium-indium-tin alloy (Galinstan). That is, the connecting material 24 may comprise at least one of gallium (Ga), indium (In), or tin (Sn). Specifically, the eutectic Ga-In (EGaIn), a eutectic alloy of Ga and In, has a melting point lower than room temperature and therefore can be liquid at room temperature and has a low resistivity.

[0151] In other words, the display device according to some embodiments can have excellent scalability because the first wiring 21 is connected to the second wiring 22 using the connecting material 24. Furthermore, because the connecting material 24 comprises a liquid material with a low modulus, the contact resistance between the first wiring 21 and the second wiring 22 can be stabilized. Typically, when the display device is stretched, the contact resistance between the first wiring 21 and the second wiring 22 can increase significantly. In this case, when a liquid metal with a low modulus is disposed between the first wiring 21 and the second wiring 22, the first wiring 21 can be stably connected to the second wiring 22, and the contact resistance can be reduced, because the connecting material 24 can release stress even when the display device is stretched.

[0152] Figures 16a to 16g This is a schematic diagram illustrating perspective views of various embodiments of an electronic device including a display device according to an embodiment.

[0153] refer to Figure 16a The display device according to the embodiment can be used in a wearable electronic device 3100 that can be worn on any part of the body. The wearable electronic device 3100 may include a main body portion 3110 and a display portion 3120 included in the main body portion 3110. The display device according to the embodiment can be used as the display portion 3120 of the wearable electronic device 3100. The wearable electronic device 3100 can be modified. In an embodiment, the wearable electronic device 3100 can be used as a smartwatch or a smartphone, depending on the user's choice.

[0154] Figure 16b The figure illustrates a medical electronic device 3200. In an embodiment, the medical electronic device 3200 may include a main body portion 3210 and a light-emitting portion 3220. A display device according to an embodiment may be used as the light-emitting portion 3220 of the medical electronic device 3200. The light-emitting portion 3220 may emit light of a specific wavelength (e.g., infrared, visible light, etc.) toward the patient's body. In an embodiment, the main body portion 3210 may have a stretchable fibrous material and may have a structure that can be worn on the user's body.

[0155] Figure 16c An educational electronic device 3300 is illustrated. In an embodiment, the educational electronic device may include a display portion 3320 included within a frame 3310. The display portion 3320 may use a display device according to various embodiments. The display portion 3320 may provide images such as a turbulent sea, a snow-covered mountain, or a volcano with lava flowing over it, and the display portion 3320 may be stretched in a height direction (e.g., the z-direction) to reflect the height of the waves, mountains, or volcano. In some embodiments, a portion of the display portion 3320 may represent the movement of lava in three dimensions by sequentially changing its height according to the direction of lava flow. The educational electronic device 3300 may include a plurality of pins (or travel portions 3330) arranged on the rear surface of the display portion 3320 such that the display portion 3320 is stretched in the height direction. The pins 3330 may be implemented to move in a third direction (e.g., the z-direction or the -z-direction) such that the image expressed by the display portion 3320 has a three-dimensional height. Figure 16c The illustration shows an educational electronic device 3300, but its use is not limited as long as it provides image information (e.g., set or pre-defined image information).

[0156] Figures 16a to 16c The illustrations depict electronic devices whose shape can be deformed, but this disclosure is not limited thereto. As described in the following embodiments, the display device according to the embodiments can be used in electronic devices where the area that can express an image (e.g., a screen) is fixed.

[0157] Figure 16d A robot 3400 is shown as another electronic device according to an embodiment. The robot 3400 can detect movement or objects using a camera portion 3440 and can display images (e.g., set or predetermined images) to a user via display portions 3420 and 3430. In some embodiments, because the display device according to the embodiment can be stretched in various directions as described above, the display device can be assembled to a main frame having a hemispherical shape, and therefore, the robot 3400 may include hemispherical display portions 3420 and 3430.

[0158] Figure 16e A vehicle display device 3500 is shown as another electronic device according to an embodiment. The vehicle display device 3500 may include an instrument panel 3510, a central information display (CID) 3520, and / or a passenger display. Because the display device according to the embodiment can be stretched in various directions, the display device can be used in the instrument panel 3510, CID 3520, and / or passenger display without being constrained by the shape of the vehicle's interior frame.

[0159] Figure 16e The illustration shows each of the instrument cluster 3510, CID 3520, and / or passenger display separately, but this disclosure is not limited thereto. In some embodiments, at least two of the instrument cluster 3510, CID 3520, and passenger display may be integrally connected to each other.

[0160] In some embodiments, the vehicle display device 3500 may include a button 3540 capable of displaying a predetermined image. (See reference) Figure 16e In an enlarged view, the hemispherical button 3540 may include an object 3542 that moves in the z-direction or -z-direction to provide a button feel, and a display device located on the object 3542. In some embodiments, when the object 3542 has a three-dimensional circular surface, the display device may also have a three-dimensional circular surface.

[0161] Figure 16f The illustration shows an electronic device 3600 for advertising or exhibition according to an embodiment. In some embodiments, the electronic device 3600 for advertising or exhibition may be mounted in a fixed structure 3610 (such as a wall or column). When structure 3610 is as follows... Figure 13 When an uneven surface is included as shown in f, the electronic device 3600 for advertising or exhibition can be arranged along the uneven surface of the structure 3610. In some embodiments, the electronic device 3600 for advertising or exhibition can be mounted in the structure 3610 using heat-shrink film or the like.

[0162] Figure 16g A controller 3700 is shown as an electronic device according to an embodiment. The controller 3700 may include image-type buttons. For example, the controller 3700 may include a first button area 3720, a second button area 3730, and a third button area 3740, which are portions of a display portion 3710 that protrude (or recede) in the z-direction or in the -z-direction. In some embodiments, the first button area 3720 and the third button area 3740 may protrude in the z-direction, and the second button area 3730 may protrude (or recede) in the -z-direction.

[0163] It should be understood that the embodiments described herein should be considered in a descriptive sense only and are not intended to be limiting. The description of features or aspects within each embodiment should generally be considered as other similar features or aspects that may be used in other embodiments. Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit and scope defined by the following claims.

Claims

1. A display device, comprising: substrate; The first wiring is disposed on the substrate; as well as The second wiring is disposed on the first wiring and electrically connected to the first wiring, wherein... The first wiring and the second wiring include an overlapping area where the first wiring and the second wiring overlap in a plan view, and At least one of the first wiring or the second wiring includes an opening in the overlapping area.

2. The display device according to claim 1, wherein, The first wiring and the second wiring are electrically connected to each other through a plurality of sub-contact holes arranged in the area other than the opening in the overlapping area.

3. The display device according to claim 2, further comprising: A first insulating layer is disposed between the first wiring and the second wiring; as well as A second insulating layer is disposed on the second wiring, wherein... The first insulating layer fills the opening of the first wiring, and The second insulating layer fills the opening of the second wiring.

4. The display device according to claim 3, wherein, The plurality of sub-contact holes penetrate the first insulating layer.

5. The display device according to claim 2, wherein, The total planar area of ​​the plurality of sub-contact holes is constant and is independent of the number of the plurality of sub-contact holes.

6. The display device according to claim 2, wherein, The sum of the planar areas of the plurality of sub-contact holes is equal to the planar area of ​​the contact holes to which the first wiring and the second wiring could be electrically connected without the opening.

7. The display device according to claim 1, wherein, The opening in the plan view has an elliptical shape, a circular shape, or a rhomboid shape.

8. The display device according to claim 7, wherein, When the opening has an elliptical shape, the opening is arranged such that the major axis of the elliptical shape is arranged in the direction in which the wiring defining the opening extends.

9. The display device according to claim 7, wherein, When the opening has a rhombus shape, the opening is arranged such that the longer diagonal of the two diagonals of the rhombus shape is arranged in the direction in which the wiring defining the opening extends.

10. The display device according to claim 1, wherein, The first wiring has a higher modulus than the second wiring.

11. The display device according to claim 10, wherein, Each of the first wiring and the second wiring includes the opening in the overlapping area.

12. The display device according to claim 10, wherein, The first wiring includes the opening in the overlapping region, and the second wiring is integrally formed with the overlapping region without the opening.

13. The display device according to claim 1, further comprising: Multiple pixel circuits are disposed on the substrate; Multiple light-emitting elements are electrically connected to the multiple pixel circuits, respectively; as well as A bridge electrode connects one of the plurality of light-emitting elements to one of the plurality of pixel circuits.

14. The display device according to claim 13, wherein, The first wiring is arranged on the same layer as the source or drain electrodes included in the plurality of pixel circuits, and The second wiring is arranged on the same layer as the bridge electrode.

15. The display device according to claim 13, wherein, The first wiring is electrically connected to one of the plurality of pixel circuits, and The second wiring electrically connects adjacent pixel circuits among the plurality of pixel circuits.

16. A display device, comprising: substrate; The first wiring is disposed on the substrate; An insulating layer is disposed on the first wiring; as well as The second wiring is disposed on the insulating layer, wherein... The first wiring and the second wiring include an overlapping area in the plane where the first wiring and the second wiring overlap. The insulating layer includes an opening that overlaps with the overlapping region, and A connecting material with a different modulus than each of the first and second wirings is arranged in the opening of the insulating layer.

17. The display device according to claim 16, wherein, The connecting material has a lower modulus than each of the first wiring and the second wiring.

18. The display device according to claim 16, wherein, The connecting material includes liquid metal.

19. The display device according to claim 18, wherein, The liquid metal includes gallium indium eutectic alloy (EGaln) or gallium indium tin alloy (Galinstan).

20. The display device according to claim 16, wherein, The connecting material contacts the upper surface of the first wiring and the lower surface of the second wiring, and electrically connects the first wiring to the second wiring.

21. The display device according to claim 16, further comprising: Multiple pixel circuits are disposed on the substrate; Multiple light-emitting elements are electrically connected to the multiple pixel circuits, respectively; as well as A bridge electrode connects one of the plurality of light-emitting elements to one of the plurality of pixel circuits.

22. The display device according to claim 21, wherein, The first wiring is arranged on the same layer as the source or drain electrodes included in the plurality of pixel circuits, and The second wiring is arranged on the same layer as the bridge electrode.

23. The display device according to claim 21, wherein, The first wiring is electrically connected to one of the plurality of pixel circuits, and The second wiring electrically connects adjacent pixel circuits in the plurality of pixel circuits.

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