Attaching device

Abstract

The bonding apparatus includes a support mechanism, a sealing mechanism, and an internal pressure adjusting mechanism. The support mechanism supports the first workpiece and the second workpiece in a state in which bonding surfaces of the first workpiece and the second workpiece face each other in the chamber. The sealing mechanism is capable of selectively forming a sealed state in which the first region and the second region are sealed from each other and a released state in which the sealing between the two regions is released. The internal pressure adjusting mechanism is a mechanism that adjusts the internal pressure in the chamber, and is configured to be capable of adjusting the internal pressure of the first region and the internal pressure of the second region, respectively, in the case where the sealed state is formed by the sealing mechanism. The support mechanism and the sealing mechanism are configured to be capable of supporting the first workpiece and forming the sealed state in a state in which a back surface of the first workpiece is exposed to the second region.

Description

Technical Field

[0001] This invention relates to bonding technology for workpieces such as wafers and substrates. Background Technology

[0002] Patent Document 1 discloses a technique for bonding two workpieces (wafers, substrates, etc.) using an adhesive. Specifically, the technique involves bonding the two workpieces together by clamping them with two holding parts (holding parts that hold the two workpieces respectively) while an adhesive is present between them, thereby applying pressure to the back sides of the two workpieces.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2014-27118 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] On the other hand, in the technology disclosed in Patent Document 1, pressure can only be applied indirectly to the back side of the workpiece via the retaining part. Therefore, the structure and strength of the retaining part itself, as well as the structure of the force transmission mechanism that transmits force to the retaining part, can easily affect the way pressure is applied to the back side of the workpiece, resulting in the problem that it is difficult to apply uniform pressure to the back side of the workpiece (the side opposite to the contact surface). This problem makes it difficult to achieve a good fit across the entire range between the contact surfaces of the two workpieces.

[0008] Therefore, the object of the present invention is to achieve a good fit between the mating surfaces of two workpieces over the entire range.

[0009] Problem-solving methods

[0010] The bonding apparatus of this invention is a bonding apparatus for bonding a first workpiece and a second workpiece within a cavity, and includes a support mechanism, a sealing mechanism, and an internal pressure adjusting mechanism (mode 1). The support mechanism supports the first and second workpieces within the cavity with their bonding surfaces facing each other. The sealing mechanism is capable of selectively forming a sealing state within the cavity between a first region containing the bonding surface side of the first workpiece and a second region containing the back side side of the first workpiece, and a releasing state of releasing the seal between these two regions. The internal pressure adjusting mechanism is a mechanism for adjusting the internal pressure of the cavity, and is configured such that, when the sealing state is formed by the sealing mechanism, the internal pressure of the first region and the internal pressure of the second region can be adjusted separately. The support mechanism and the sealing mechanism are configured to support the first workpiece and form a sealing state with the back side of the first workpiece exposed to the second region.

[0011] According to method 1 above, when a sealed state is formed (a state that seals the first region and the second region), the back side of the first workpiece can be exposed to the second region. Therefore, by increasing the internal pressure of the second region, the back side of the first workpiece can be directly and uniformly pressurized using the gas in the second region. Furthermore, by making the internal pressure of the second region higher than that of the first region, the resulting pressure difference can be used to uniformly press the first workpiece toward the second workpiece.

[0012] The bonding device described in Method 1 above can also have the following structure (Method 2). The support mechanism can also include a ring portion supporting the periphery of the first workpiece from below and a platform portion supporting the second workpiece at a position below the first workpiece. The first workpiece can be supported by the ring portion with its bonding surface facing downwards, and the second workpiece can be supported by the platform portion with its bonding surface facing upwards. Furthermore, the sealing mechanism can also include an annular sealing portion, which can be used to clamp the periphery of the first workpiece from above between the sealing portion and the ring portion, thereby dividing the cavity into two regions, an inner and an outer region of the sealing portion and sealing the area between these two regions. Thus, the inner region of the sealing portion forms the second region, and the outer region of the sealing portion forms the first region.

[0013] According to the above-described method 2, by using the ring portion to support the periphery of the first workpiece from below, the first workpiece can be reliably prevented from falling into the cavity while keeping the portion of the first workpiece that is in contact with the second workpiece exposed without closing the contact surface (lower surface) of the first workpiece.

[0014] Furthermore, by using an annular sealing portion to clamp the periphery of the first workpiece from above between the sealing portion and the annular portion, a sealing state can be formed in both the inner and outer regions of the sealing portion (the inner second region and the outer first region), while simultaneously fixing the first workpiece to the annular portion. Thus, not only can the pressure difference between the first and second regions be used to uniformly press the first workpiece toward the second workpiece, but it also prevents any possible displacement or loosening of the first workpiece.

[0015] The bonding device described in Method 1 above can also have the following structure (Method 3). The support mechanism can also include a ring portion that supports the periphery of the first workpiece from below and a holding portion that holds the second workpiece at an upper position of the first workpiece. The first workpiece can be supported by the ring portion with its bonding surface facing upward, and the second workpiece can be held by the holding portion with its bonding surface facing downward. In addition, the sealing mechanism can also include an annular sealing portion, and the sealing portion can be used to clamp the periphery of the first workpiece from above between the sealing portion and the ring portion, thereby dividing the cavity into two regions, an inner and an outer region of the sealing portion and sealing the area between these two regions. Thus, the inner region of the sealing portion forms the first region, and the outer region of the sealing portion forms the second region.

[0016] According to the above method 3, by using the ring portion to support the periphery of the first workpiece from below, the first workpiece can be reliably prevented from falling into the cavity by keeping the pressure-requiring portion (the portion that overlaps with the second workpiece when viewed from above or below) on the back (lower surface) of the first workpiece exposed.

[0017] Furthermore, by using an annular sealing portion to clamp the periphery of the first workpiece from above between the sealing portion and the annular portion, a sealing state can be formed in both the inner and outer regions of the sealing portion (the inner first region and the outer second region), while simultaneously fixing the first workpiece to the annular portion. Thus, not only can the pressure difference between the first and second regions be used to uniformly press the first workpiece toward the second workpiece, but it also prevents any possible displacement or loosening of the first workpiece.

[0018] The bonding device described in method 2 or 3 above may further include a control unit (method 4) that performs the following processing: After the support mechanism supports the first and second workpieces and before the sealing mechanism forms a sealed state, the control unit reduces the internal pressure of the chamber to a predetermined pressure by controlling the internal pressure regulating mechanism. Then, the control unit forms a sealed state by controlling the sealing mechanism. Thereafter, the control unit controls the internal pressure regulating mechanism to make the internal pressure of the second region higher than the internal pressure of the first region.

[0019] According to the above method 4, before forming a sealed state, the internal pressure of the chamber (in other words, the internal pressure of both the first and second regions) is reduced to a specified pressure to increase the vacuum level, and then the first workpiece and the second workpiece are bonded together, thereby preventing air bubbles that would hinder the bonding from being located between the first workpiece and the second workpiece.

[0020] The bonding device described in Method 4 above can also have the following structure (Method 5). The ring portion can be configured such that, when viewed from above or below, a space of a predetermined width is formed between the second workpiece supported by the support mechanism and the ring portion, and a first workpiece of a size that can be supported by the ring portion can be used. The control unit can flex the periphery of the first workpiece toward the first region by making the internal pressure of the second region higher than the internal pressure of the first region, utilizing the space of the predetermined width.

[0021] According to the above method 5, by flexing the periphery of the first workpiece toward the first region, the poor fit between the periphery of the second workpiece (the workpiece with a smaller size than the first workpiece) and the first workpiece can be improved.

[0022] In any of the bonding devices described in methods 2 to 5 above, the support mechanism may include a fixing part, which temporarily fixes the first workpiece by clamping the peripheral portion of the first workpiece between the fixing part and the ring part (method 6).

[0023] According to the above method 6, before the sealing state is formed (before the first workpiece is fixed to the ring using the annular sealing part), the first workpiece W1 on the ring can also be temporarily fixed, thereby preventing the positional displacement or loosening of the first workpiece that may occur before the sealing state is formed.

[0024] The bonding device involved in any of the above methods 1 to 6 may also include the following alignment mechanism (method 7). This alignment mechanism adjusts the positional relationship between the first workpiece and the second workpiece based on an image obtained from the second region side using a camera.

[0025] In the aforementioned bonding device, the first workpiece can be supported and sealed while its back side is exposed to the second region. Therefore, the back side of the first workpiece can be photographed via the second region using a camera. Furthermore, if the first workpiece itself is translucent, the second workpiece can also be photographed using a camera. Since both the first and second workpieces can be photographed using a camera in this manner, according to method 7 described above, the positional relationship between the first and second workpieces can be determined based on the image obtained by the camera, and based on this positional relationship, an alignment mechanism can be used to adjust them to achieve the desired positional relationship.

[0026] Invention Effects

[0027] According to the present invention, a good fit can be achieved over the entire range between the mating surfaces of two workpieces. Attached Figure Description

[0028] Figure 1 This is a conceptual diagram illustrating the bonding device involved in the implementation method.

[0029] Figure 2 (A) and Figure 2 (B) is a conceptual diagram representing the state changes of the bonding device caused by the bonding process.

[0030] Figure 3 (A) and Figure 3 (B) is a conceptual diagram representing the state changes of the bonding device caused by the bonding process.

[0031] Figure 4 (A) and Figure 4 (B) is a conceptual diagram representing the state changes of the bonding device caused by the bonding process.

[0032] Figure 5 (A) and Figure 5 (B) is a conceptual diagram representing the state changes of the bonding device caused by the bonding process.

[0033] Figure 6 This is a conceptual diagram representing the state changes of the workpiece caused by the bonding process in the implementation method.

[0034] Figure 7 (A) and Figure 7 (B) is a conceptual diagram representing the state change of the workpiece caused by performing the bonding process in the first variation.

[0035] Figure 8 (A) is a conceptual diagram showing the bonding device involved in the second variation. Figure 8 (B) is a conceptual diagram showing the state change of the bonding device caused by performing the bonding process in the second variation. Detailed Implementation

[0036] [1] Implementation

[0037] [1-1] Adhesion device

[0038] Figure 1 This is a conceptual diagram illustrating the bonding apparatus according to the embodiment. In this embodiment, the bonding apparatus is a device that uses an adhesive or other resin to bond two workpieces (hereinafter referred to as "first workpiece W1" and "second workpiece W2" to distinguish them), and includes a chamber mechanism 1, a support mechanism 2, a sealing mechanism 3, an alignment mechanism 4, an internal pressure adjustment mechanism 5, and a control unit 9. The structure of each part will be described in detail below.

[0039] <Cavity Mechanism 1>

[0040] The chamber mechanism 1 includes a first chamber forming part 11, a second chamber forming part 12, and a drive part 13.

[0041] The first chamber forming portion 11 and the second chamber forming portion 12 are portions that form a closed space (hereinafter referred to as "chamber 10") for bonding the first workpiece W1 and the second workpiece W2, and are configured to selectively form and open the chamber 10.

[0042] Specifically, the first chamber forming part 11 and the second chamber forming part 12 are configured such that at least one of them moves in the vertical direction by means of the power of the drive part 13, approaches each other and combines to form a chamber 10, and opens the chamber 10 by separating from each other.

[0043] More specifically, the first chamber forming portion 11 is composed of a first cylindrical portion 111 and a top plate 112. The first cylindrical portion 111 is arranged such that its central axis is aligned with the vertical direction, and its upper end is closed by the top plate 112. The second chamber forming portion 12 is composed of a second cylindrical portion 121 and a bottom plate 122. The second cylindrical portion 121 is arranged such that its central axis is aligned with the vertical direction, and its lower end is closed by the bottom plate 122. The annular lower end face of the first cylindrical portion 111 and the annular upper end face of the second cylindrical portion 121 are in close contact without gap, thereby forming a chamber 10 between the top plate 112 and the bottom plate 122.

[0044] Furthermore, in this embodiment, in order to be able to use the camera 40 to film the interior of the chamber 10 from the outside of the top plate 112, a portion of the top plate 112 (in) Figure 1 The central part (in the example) is formed by a light-transmitting component 140X (quartz, etc.).

[0045] <Support mechanism 2 and sealing mechanism 3>

[0046] The support mechanism 2 is a mechanism that supports the first workpiece W1 and the second workpiece W2 in the chamber 10 with the mating surfaces F11 and F21 of the first workpiece W1 and the second workpiece W2 facing each other.

[0047] The sealing mechanism 3 is capable of selectively forming a sealed state Qs and a released state Qt within the chamber 10. Here, the sealed state Qs is a state that seals the first region R1, which includes the area on the mating surface F11 side of the first workpiece W1, and the second region R2, which includes the area on the back surface F12 side of the first workpiece W1. On the other hand, the released state Qt is a state that releases the seal between the first region R1 and the second region R2.

[0048] In this embodiment, the support mechanism 2 and the sealing mechanism 3 are configured to support the first workpiece W1 and form a sealed state Qs when the back surface F12 of the first workpiece W1 is exposed to the second region R2.

[0049] Specifically, the support mechanism 2 includes a ring portion 21 and a platform portion 22.

[0050] The ring portion 21 is the portion that supports the periphery of the first workpiece W1 from below. The first workpiece W1 is placed in the ring portion 21 with its mating surface F11 facing downward. According to the ring portion 21, the first workpiece W1 can be reliably prevented from falling into the chamber 10 while keeping the portion of the mating surface F11 (lower surface) of the first workpiece W1 that is mated with the second workpiece W2 exposed without closing it.

[0051] The stage portion 22 is the portion that supports the second workpiece W2 below the first workpiece W1 (the first workpiece W1 supported by the ring portion 21), and has a holding function (vacuum adsorption, electrostatic holding, etc.) for holding (fixing) the second workpiece W2 placed thereon. The second workpiece W2 is placed on the stage portion 22 with its contact surface F21 facing upward.

[0052] In addition, the sealing mechanism 3 includes an annular sealing part 31 and a driving part 32.

[0053] The sealing portion 31 is formed by clamping the periphery of the first workpiece W1 between the sealing portion 31 and the ring portion 21 from above (from the back side F12), dividing the cavity 10 into two regions, an inner and an outer region, and sealing the portion between these two regions. Figure 1 In the example, the sealing part 31 is an annular bellows that extends and retracts by the power of the driving part 32 and is installed on the lower surface of the top plate 112. Thus, by extending vertically downward, the periphery of the first workpiece W1 can be clamped between the sealing part 31 and the ring part 21 from above (from the back side F12 side).

[0054] According to the support mechanism 2 and the sealing mechanism 3, by using the annular sealing part 31 to clamp the periphery of the first workpiece W1 from above, a sealed state Qs can be achieved. The second region R2 is formed by the inner region of the sealing part 31 (the region where the back surface F12 of the first workpiece W1 is exposed), and the first region R1 is formed by the outer region of the sealing part 31 (the portion communicating with the region on the contact surface F11 side of the first workpiece W1). (See also...) Figure 4 (B) Furthermore, the first workpiece W1 can be fixed to the ring 21.

[0055] In addition to the above structure, the support mechanism 2 also includes a fixing part 23 and a driving part 24.

[0056] The fixing part 23 is the part that temporarily fixes the first workpiece W1 by clamping the peripheral portion of the first workpiece W1 between the fixing part 23 and the ring part 21. Figure 1In the example, the fixing part 23 is composed of a rod-shaped component that moves up and down by the power of the driving part 24, and is provided at multiple positions on the top plate 112. By moving the fixing part 23 downward, the periphery of the first workpiece W1 can be temporarily fixed between the fixing part 23 and the ring part 21 at multiple positions. The fixing part 23 may also have a holding function (vacuum adsorption, electrostatic holding, etc.) for lifting the first workpiece W1 from the ring part 21.

[0057] According to the aforementioned fixing part 23, before the sealing state Qs is formed (before the first workpiece W1 is fixed to the ring part 21 using the annular sealing part 31), the first workpiece W1 can also be temporarily fixed to the ring part 21, thereby preventing the positional shift or loosening of the first workpiece W1 that may occur before the sealing state Qs is formed.

[0058] <Alignment Mechanism 4>

[0059] The alignment mechanism 4 is a mechanism capable of adjusting the positional relationship between the first workpiece W1 and the second workpiece W2. In this embodiment, the alignment mechanism 4 is configured to adjust the aforementioned positional relationship by adjusting the position of the stage portion 22 in the horizontal plane. This positional relationship is adjusted based on an image captured by the camera 40 from the outside of the top plate 112 (in other words, from the second region R2 side). More specifically, as described below.

[0060] In this embodiment, as described above, the first workpiece W1 can be supported and a sealed state Qs can be formed with the back surface F12 of the first workpiece W1 exposed to the second region R2. Furthermore, a portion of the top plate 112 (in...) Figure 1 In the example, the central portion is formed by a light-transmitting component 140X (quartz, etc.). Therefore, the back surface F12 of the first workpiece W1 can be photographed via the second region R2 using the camera 40. Moreover, since the first workpiece W1 itself is light-transmitting, the second workpiece W2 can also be photographed using the camera 40. When both the first workpiece W1 and the second workpiece W2 can be photographed using the camera 40 in this way, the positional relationship between the first workpiece W1 and the second workpiece W2 (position of alignment marks, etc.) can be determined based on the image obtained by photographing using the camera 40, and based on this positional relationship, the alignment mechanism 4 can be used to adjust them to achieve the desired positional relationship.

[0061] Furthermore, in this embodiment, the alignment mechanism 4 is configured to move the stage portion 22 up and down. By moving the stage portion 22 upward, the mating surface F21 of the second workpiece W2 on the stage portion 22 can approach or contact the mating surface F11 of the first workpiece W1 supported by the ring portion 21.

[0062] <Internal pressure regulating mechanism 5>

[0063] The internal pressure regulating mechanism 5 is a mechanism for regulating the internal pressure of the chamber 10. In this embodiment, the internal pressure regulating mechanism 5 is configured to be able to regulate the internal pressure of the first region R1 and the internal pressure of the second region R2 respectively when the sealing mechanism 3 forms a sealed state Qs.

[0064] Specifically, the internal pressure regulating mechanism 5 includes a pressure reducing section 51 and a pressure increasing section 52.

[0065] The pressure reduction unit 51 is the part that reduces the internal pressure of the chamber 10 to a predetermined pressure by venting air from the chamber 10 using a vacuum pump or the like. Here, the predetermined pressure is a pressure lower than atmospheric pressure, for example, a pressure corresponding to the required vacuum level inside the chamber 10. In this embodiment, the pressure reduction unit 51 is configured such that after the pressure is reduced inside the chamber 10, even after the sealing mechanism 3 seals the first region R1 and the second region R2, the internal pressure of the first region R1 can be maintained at the predetermined pressure.

[0066] The pressurization unit 52 is the part that increases the internal pressure of the chamber 10 by supplying air into the chamber 10 through a compression pump or the like. In this embodiment, the pressurization unit 52 is configured to increase the internal pressure of the first region R1 and the second region R2 respectively when the sealing mechanism 3 seals the first region R1 and the second region R2.

[0067] <Control Department 9>

[0068] The control unit 9 consists of a processing device (CPU, etc.) and a storage device (RAM, ROM, etc.), and controls various parts of the bonding device (chamber mechanism 1, support mechanism 2, sealing mechanism 3, alignment mechanism 4, internal pressure adjustment mechanism 5, etc.). The bonding process described below is performed by executing a program through the control unit 9.

[0069] The aforementioned program is installed in the control unit 9. Before installation, it can be stored in a readable state on a portable storage medium (such as flash memory) or in a downloadable state on other servers. The bonding process described below is not limited to software implementation via program execution; it can also be implemented in hardware via processing circuitry built into the control unit 9.

[0070] [1-2] Adhesion treatment

[0071] Figure 2 (A) to Figure 5 (B) is a conceptual diagram showing the state changes of the bonding device as a result of performing the bonding process.

[0072] With the open chamber 10 in operation, the control unit 9 controls the handling robot (not shown) responsible for transporting the first workpiece W1 and the second workpiece W2 to place the second workpiece W2 on the platform 22 with its contact surface F21 facing upwards. Then, the first workpiece W1 is placed on the ring 21 with its contact surface F11 facing downwards (step S101). See [reference] Figure 2 (A)). In this embodiment, the workpiece W2, on which a resin layer Yr is formed on its bonding surface F21, is placed on the stage 22 with the resin layer Yr facing upwards. Here, the resin layer Yr is a layer containing resin (adhesive, etc.) for bonding the first workpiece W1 and the second workpiece W2.

[0073] Thus, the first workpiece W1 and the second workpiece W2 are supported by the support mechanism 2 with their mating surfaces F11 and F21 facing each other (in this embodiment, the resin layer Yr on the mating surface F21 is facing the mating surface F11).

[0074] After step S101, the control unit 9 controls the drive unit 13 of the chamber mechanism 1 to make the first chamber forming part 11 and the second chamber forming part 12 fit together without gap, thereby forming the chamber 10 (closed space) (step S102). See Figure 2 (B)).

[0075] Furthermore, in step S102, the control unit 9 controls the drive unit 24 of the support mechanism 2 to move the fixing part 23 downward. This allows the fixing part 23 to clamp the periphery of the first workpiece W1 between the fixing part 23 and the ring part 21 at multiple positions, thereby temporarily fixing the first workpiece W1. This prevents damage during the formation of the sealed state Qs (see reference). Figure 3 (B) The positional offset or relaxation of the first workpiece W1 that may have occurred before.

[0076] After step S102, the control unit 9 controls the pressure reduction unit 51 of the internal pressure regulating mechanism 5 to reduce the pressure inside the chamber 10, thereby reducing the internal pressure of the chamber 10 to a specified pressure (step S103). See below. Figure 3 (A)).

[0077] Here, during the decompression process in step S103, airflow may be generated within the chamber 10 due to the exhaust from the decompression unit 51. On the other hand, in this embodiment, the first workpiece W1 is fixed to the ring portion 21 by the fixing portion 23, and the second workpiece W2 is fixed to the platform portion 22 by the holding function of the platform portion 22. Therefore, even if airflow is generated within the chamber 10 during the decompression process, the first workpiece W1 and the second workpiece W2 will not experience any positional shift or loosening.

[0078] After step S103, the control unit 9 controls the drive unit 32 of the sealing mechanism 3 to extend the annular sealing part 31 vertically downward. This allows the sealing part 31 to clamp the periphery of the first workpiece W1 between the sealing part 31 and the ring part 21 from above (from the back side F12), thereby dividing the cavity 10 into two regions, an inner and an outer region, and sealing the area between these two regions (step S104). See [reference]. Figure 3 (B) Thus, the control unit 9, in a sealed state Qs, forms a second region R2 from the inner region of the sealing part 31 (the region where the back surface F12 of the first workpiece W1 is exposed), and a first region R1 from the outer region of the sealing part 31 (the portion that communicates with the region on the contact surface F11 side of the first workpiece W1). Furthermore, the control unit 9 fixes the first workpiece W1 to the ring part 21.

[0079] After step S104, the control unit 9 adjusts the positional relationship between the first workpiece W1 and the second workpiece W2 by controlling the alignment mechanism 4 (step S105). (See reference...) Figure 4 (A) In this embodiment, the control unit 9 adjusts the position of the stage unit 22 in the horizontal plane based on the image captured by the camera 40 from the outside of the top plate 112 (in other words, from the second region R2 side), thereby positioning the second workpiece W2 correctly relative to the first workpiece W1. As an example, the control unit 9 recognizes the alignment marks set on the first workpiece W1 and the second workpiece W2 based on the image captured by the camera 40, and simultaneously adjusts the position of the stage unit 22 in the horizontal plane so that these alignment marks coincide with each other.

[0080] Furthermore, in step S105, while maintaining the position within the adjusted horizontal plane, the control unit 9 controls the alignment mechanism 4 to move the stage 22 upward, thereby bringing the mating surface F21 of the second workpiece W2 on the stage 22 close to the mating surface F11 of the first workpiece W1, so that the resin layer Yr on the mating surface F21 comes into contact with the mating surface F11 (see reference). Figure 4 (A)).

[0081] Thus, while increasing the vacuum level in the first region R1 in step S104, in step S105, the resin layer Yr on the bonding surface F21 is brought into contact with the bonding surface F11. Therefore, even if a gap Xs (a small, enclosed space) is generated at this time due to the unevenness of the resin layer Yr surface, refer to... Figure 6The gap Xs is similar to the first region R1, exhibiting a high degree of vacuum. Therefore, by pressing the first workpiece W1 toward the second workpiece W2 in step S106 (described below), and then restoring the chamber 10 to atmospheric pressure after step S106 (i.e., exposing the bonded first workpiece W1 and second workpiece W2 to atmospheric pressure), the gap Xs can be eliminated using the pressing force from the outside. Therefore, by bonding through steps S104 and S105, air bubbles that hinder bonding can be prevented from being located between the first workpiece W1 and the second workpiece W2.

[0082] After step S105, the control unit 9 controls the pressurization unit 52 of the internal pressure regulating mechanism 5 to pressurize the second region R2, thereby making the internal pressure of the second region R2 higher than the internal pressure of the first region R1 (step S106). Figure 4 (B) Specifically, the control unit 9 controls the internal pressure regulating mechanism 5 to maintain the internal pressure of the first region R1 at a specified pressure while only increasing the internal pressure of the second region R2.

[0083] At this point, the back surface F12 of the first workpiece W1 is exposed to the second region R2. Therefore, by increasing the internal pressure of the second region R2 in step S106, the gas within the second region R2 can be used to directly and uniformly pressurize the back surface F12 of the first workpiece W1. Furthermore, by making the internal pressure of the second region R2 higher than that of the first region R1 in step S106, the resulting pressure difference can be used to uniformly press the first workpiece W1 toward the second workpiece W2. Thus, a good fit can be achieved over the entire range between the mating surfaces F11 and F21 of the two workpieces.

[0084] Furthermore, in this embodiment, the first workpiece W1 is fixed to the ring portion 21 by the sealing portion 31. Therefore, step S106 can not only achieve the above-mentioned uniform pressing, but also prevent the positional shift or loosening of the first workpiece W1 that may occur at this time.

[0085] After step S106, the control unit 9 controls the pressurization unit 52 of the internal pressure regulating mechanism 5 to pressurize the first region R1, thereby increasing the internal pressure of the first region R1 to approximately the same as the internal pressure of the second region R2 (step S107). See Figure 5 (A)).

[0086] After step S107, the control unit 9 controls the drive unit 32 of the sealing mechanism 3 to retract the annular sealing part 31 vertically upward, thereby changing the chamber 10 from the sealed state Qs to the released state Qt (step S108). See also Figure 5(B) After that, the control unit 9 restores the pressure inside the chamber 10 to atmospheric pressure and opens it, and takes out the bonded workpieces (first workpiece W1 and second workpiece W2) from the bonding device by controlling the handling robot (not shown).

[0087] [2] Variations

[0088] [2-1] First variation

[0089] like Figure 7 As shown in (A), when the thickness of the resin layer Yr on the bonding surface F21 decreases at the periphery of the second workpiece W2 (in other words, when the height of the resin layer Yr from the bonding surface F21 decreases), even if, as described above, the resin layer Yr on the bonding surface F21 is brought into contact with the bonding surface F11 while the vacuum level in the first region R1 is increased in steps S104 and S105, it is difficult to form a gap Xs (a closed small space) between the bonding surface F11 of the first workpiece W1 and the resin layer Yr at the periphery of the second workpiece W2. In other words, at the periphery of the second workpiece W2, only a gap Xt open to the first region R1 is formed between the bonding surface F11 of the first workpiece W1 and the resin layer Yr. Since such an open gap Xt will become atmospheric pressure when the pressure in the chamber 10 is restored to atmospheric pressure, it will remain as is after the bonding process, thus becoming a cause of poor bonding.

[0090] Therefore, in step S106 above, the control unit 9 can also increase the internal pressure of the second region R2 by making it higher than the internal pressure of the first region R1, and utilize the resulting pressure difference and the space between the second workpiece W2 supported by the platform 22 and the ring 21, such as... Figure 7 As shown in (B), the periphery of the first workpiece W1 is bent toward the first region R1.

[0091] Here, the size and shape of the flexural portion vary according to the width Lz of the aforementioned space. Therefore, by changing the structure (size, etc.) of the ring 21, the width Lz of the aforementioned space is adjusted, and a first workpiece W1 of a size that can be supported by the ring 21 is used, thereby adjusting the size and shape of the flexural portion. By determining a predetermined width suitable for the width Lz of the aforementioned space, it is also possible to make the resin layer Yr contact the contact surface F11 of the first workpiece W1 at the periphery of the second workpiece W2 (see reference). Figure 7 (B)).

[0092] According to this bonding process, even at the periphery of the second workpiece W2, gaps Xs (closed small spaces) caused by the unevenness of the resin layer Yr surface can be formed in a high-vacuum atmosphere (here, the first region R1), and these gaps Xs can be eliminated by applying pressure from the outside. Therefore, poor bonding between the periphery of the second workpiece W2 (a workpiece smaller than the first workpiece W1) and the first workpiece W1 can be improved.

[0093] [2-2] Second variation

[0094] Figure 8 (A) is a conceptual diagram showing the bonding device according to the second modification. Hereinafter, the parts of the bonding device according to the second modification that are different from the bonding device of the above embodiment will be described.

[0095] <Cavity Mechanism 1>

[0096] In this modified example, in order to be able to use the camera 40 to film the interior of the chamber 10 from the outside of the base plate 122, a portion of the base plate 122 (in) Figure 1 The central part (in the example) is formed by a light-transmitting component 140X (quartz, etc.).

[0097] <Support mechanism 2, sealing mechanism 3, and alignment mechanism 4>

[0098] In this modified example, the support mechanism 2 includes a ring portion 21 and a retaining portion 25.

[0099] The ring portion 21 is the same as the ring portion described in the above embodiment, and is the portion that supports the periphery of the first workpiece W1 from below. In this modified example, the first workpiece W1 is placed on the ring portion 21 with its contact surface F11 facing upward. According to the ring portion 21, the first workpiece W1 can be reliably prevented from falling into the chamber 10 by keeping the portion requiring pressure (the portion that overlaps with the second workpiece W2 when viewed from above or below) on the back surface F12 (lower surface) of the first workpiece W1 exposed without closing it.

[0100] The holding part 25 is positioned above the first workpiece W1 (the first workpiece W1 supported by the ring part 21) to hold the second workpiece W2, and has a holding function (vacuum adsorption, electrostatic holding, etc.) for achieving this holding. The second workpiece W2 is held by the holding part 25 with its contact surface F21 facing downward.

[0101] In this modified example, the positional relationship between the first workpiece W1 and the second workpiece W2 is adjusted by using the alignment mechanism 4 to adjust the position of the aforementioned holding part 25 in the horizontal plane. This positional relationship is adjusted based on an image captured by the camera 40 from the outside of the base plate 122 (in other words, from the second region R2 side).

[0102] The sealing mechanism 3 is the same as the sealing mechanism described in the above embodiments, including an annular sealing part 31 and a driving part 32.

[0103] On the other hand, in this modified example, by using the sealing part 31 to clamp the periphery of the first workpiece W1 between the sealing part 31 and the ring part 21 from above (from the contact surface F11 side), as a sealed state Qs, the inner region of the sealing part 31 forms the first region R1, and the outer region of the sealing part 31 (the part that communicates with the area exposed on the back surface F12 of the first workpiece W1) forms the second region R2 (see reference). Figure 8 (A)). Moreover, similar to the above embodiment, the first workpiece W1 is fixed to the ring portion 21.

[0104] In this modified example, in step S106, the internal pressure of the second region R2 is also made higher than the internal pressure of the first region R1 (refer to...). Figure 8 (B) Therefore, the gas in the second region R2 can be used to directly and uniformly pressurize the back surface F12 of the first workpiece W1. Furthermore, the pressure difference generated at this time can be used to uniformly press the first workpiece W1 towards the second workpiece W2. Thus, a good fit can be achieved over the entire range between the mating surfaces F11 and F21 of the two workpieces.

[0105] Furthermore, in this modified example, the first workpiece W1 is also fixed to the ring 21 by the sealing part 31. Therefore, step S106 can not only achieve the above-mentioned uniform pressing, but also prevent the positional displacement or loosening of the first workpiece W1 that may occur at this time.

[0106] [2-3] Other variations

[0107] The above-mentioned bonding device is not limited to the case of bonding the first workpiece W1 and the second workpiece W2 with resin (resin layer Yr), but can also be applied to the case of bonding the bonding surfaces F11 and F12 directly to each other and the case of bonding with materials other than resin (such as metal).

[0108] The aforementioned bonding device can also be appropriately modified so that the support mechanism 2 does not have a fixing part 23. In this case, instead of fixing part 23, the ring part 21 itself can be modified into a structure with a clamping function (vacuum adsorption, electrostatic clamping, etc.) for temporarily holding (fixing) the first workpiece W1.

[0109] The descriptions of the above embodiments and modifications should be considered exemplary in all respects, not restrictive. The scope of the invention is shown by the claims rather than by the above embodiments and modifications. Furthermore, the scope of the invention is intended to include all modifications within the meaning and scope equivalent to the claims.

[0110] In addition, a portion of the structure of the bonding device can be extracted from the above embodiments and variations as the subject of the invention, as can a portion or all of the bonding process and the program for performing the process.

[0111] Explanation of reference numerals in the attached figures

[0112] 1. Chamber structure

[0113] 2 Supporting Mechanism

[0114] 3 Sealing mechanism

[0115] 4 Alignment mechanism

[0116] 5. Internal pressure regulating mechanism

[0117] 9. Control Department

[0118] 10 chambers

[0119] 11 First chamber formation section

[0120] 12 Second Chamber Formation Section

[0121] 13 Drive Unit

[0122] 21 Ring Section

[0123] 22 Platform Section

[0124] 23 Fixing part

[0125] 24 Drive Unit

[0126] 25 Card Holder

[0127] 31 Sealing part

[0128] 32 Drive Unit

[0129] 40 cameras

[0130] 51 Decompression Section

[0131] 52. Intensifier Section

[0132] Lz width

[0133] Qs Sealed condition

[0134] Qt de-status

[0135] R1 First Area

[0136] R2 Second Region

[0137] W1 First workpiece

[0138] W2 Second workpiece

[0139] Xs gap

[0140] Xt Open Gap

[0141] Yr resin layer

[0142] 111 First cylindrical section

[0143] 112 Top Slab

[0144] 121 Second cylindrical section

[0145] 122 base plate

[0146] 140X Light-transmitting components

[0147] F11, F21 bonding surfaces

[0148] F12 back view.

Claims

1. A bonding device for bonding a first workpiece and a second workpiece within a cavity, characterized in that, include: A support mechanism that supports the first workpiece and the second workpiece in the cavity with their mating surfaces facing each other. A sealing mechanism, which, within the cavity, is capable of selectively forming a sealing state that seals a first region containing the area of ​​the contact surface of the first workpiece and a second region containing the area of ​​the back surface of the first workpiece, and releasing a state that releases the seal between the two regions. as well as An internal pressure regulating mechanism adjusts the internal pressure of the chamber, and is configured to adjust the internal pressure of the second region and the internal pressure of the first region separately when the sealing mechanism forms the sealed state. The support mechanism and the sealing mechanism are configured to support the first workpiece and form the sealing state when the back side of the first workpiece is exposed to the second region.

2. The bonding device according to claim 1, characterized in that: The support mechanism includes: A ring supporting the periphery of the first workpiece from below; and A platform portion supporting the second workpiece is located below the first workpiece. The first workpiece is supported by the ring portion with its contact surface facing downwards, and the second workpiece is supported by the platform portion with its contact surface facing upwards. The sealing mechanism includes an annular sealing portion, which divides the cavity into two regions, an inner and an outer region, by clamping the periphery of the first workpiece between the sealing portion and the annular portion from above and sealing the space between these two regions. Thus, the second region is formed by the inner region of the sealing portion, and the first region is formed by the outer region of the sealing portion.

3. The bonding device according to claim 1, characterized in that: The support mechanism includes: A ring supporting the periphery of the first workpiece from below; and The clamping part that holds the second workpiece is positioned above the first workpiece. The first workpiece is supported by the ring portion with its contact surface facing upwards, and the second workpiece is held by the retaining portion with its contact surface facing downwards. The sealing mechanism includes an annular sealing portion, which divides the cavity into two regions, an inner and an outer region, by clamping the periphery of the first workpiece between the sealing portion and the annular portion from above and sealing the space between these two regions. Thus, the first region is formed by the inner region of the sealing portion and the second region is formed by the outer region of the sealing portion.

4. The bonding device according to claim 2 or 3, characterized in that: It also includes the control unit, After the support mechanism supports the first workpiece and the second workpiece, and before the sealing mechanism forms the sealed state, the control unit controls the internal pressure regulating mechanism to reduce the internal pressure of the chamber to a specified air pressure. Then, the sealing state is achieved by controlling the sealing mechanism. Subsequently, by controlling the internal pressure regulating mechanism, the internal pressure in the second region is made higher than that in the first region.

5. The bonding device according to claim 4, characterized in that: The ring portion is configured such that, when viewed from above or below, a space of a predetermined width is formed between the second workpiece supported by the support mechanism and the ring portion, and the first workpiece is of a size capable of being supported by the ring portion. The control unit causes the periphery of the first workpiece to flex toward the first region by making the internal pressure of the second region higher than that of the first region, using the space of the specified width.

6. The bonding device according to any one of claims 2 to 5, characterized in that: The support mechanism includes a fixing part, which temporarily fixes the first workpiece by clamping the peripheral portion of the first workpiece between the fixing part and the ring part.

7. The bonding device according to any one of claims 1 to 6, characterized in that: It also includes alignment mechanisms, The alignment mechanism adjusts the positional relationship between the first workpiece and the second workpiece based on an image captured by a camera from the second region side.

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