Substrate processing apparatus and control method for substrate processing apparatus

Abstract

The present application relates to a substrate processing apparatus and a control method of a substrate processing apparatus. The substrate processing apparatus 1 includes a mapping sensor 43 or the like that acquires substrate shape information including information of shapes of a plurality of substrates W, a transfer robot IR having a hand 51, and a control section. The control section 81 controls a speed and an acceleration of the hand 51 when the hand 51 that supports the substrate W moves in the housing rack C in the following manner. The control section 81 acquires a thickness of the substrate W using the substrate shape information, calculates a weight of a first substrate based on the thickness, and determines a speed and an acceleration of the hand when supporting the first substrate according to the weight of the first substrate. The control section 81 moves the hand that supports the first substrate in the first slot using the determined speed and acceleration.

Description

Technical Field

[0001] This invention relates to a substrate processing apparatus for processing substrates and a control method for the substrate processing apparatus. Examples of substrates include semiconductor substrates, FPD (Flat Panel Display) substrates, glass substrates for photomasks, optical disc substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of FPDs include liquid crystal display devices and organic EL (electroluminescence) display devices. Background Technology

[0002] The substrate processing apparatus includes an indexing section and a processing area (see, for example, Patent Document 1). The indexing section includes a receiving frame mounting section and a transport mechanism. The transport mechanism transports a substrate from the receiving frame on the receiving frame mounting section. The transport mechanism has a hand that supports a substrate in a horizontal position. The transport mechanism moves the hand. The speed and acceleration of the hand when the transport mechanism is not supporting the substrate are greater than the speed and acceleration of the hand when the transport mechanism is supporting the substrate.

[0003] Patent Document 2 discloses a method for controlling the transport speed of a special substrate (temperature measurement wafer, pressure measurement wafer, and ion density detection wafer) to be slower than that of a product substrate when the substrate is determined to be a special substrate (temperature measurement wafer, pressure measurement wafer, and ion density detection wafer) that is different from the product substrate based on the automatically determined substrate category.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2021-048359

[0007] Patent Document 2: Patent No. 6697984 Summary of the Invention

[0008] The problem the invention aims to solve

[0009] In recent years, there has been an increase in the processing of substrates that do not meet SEMI (Semiconductor Equipment and Materials International Standards) standards (e.g., substrates with two substrates bonded together, substrates with warping). Therefore, handling robots are required to transport these substrates.

[0010] When handling substrates that are not SEMI standard, the gap between two adjacent substrates in the vertical direction within the housing is sometimes smaller than that of SEMI standard substrates. Therefore, for example, when a hand enters the gap between the two substrates, there is a possibility that the lower surface of the upper substrate may be caught on the hand. In this case, for example, particles may be generated, thus contaminating the substrate.

[0011] Furthermore, if the weight of the substrate increases, the up-and-down amplitude of the hand increases during substrate handling. Therefore, for example, when storing the substrate in the receiving rack, there is a possibility that the substrate may come into contact with the shelf portion inside the receiving rack and be hooked by the shelf portion.

[0012] The present invention was made in view of the following circumstances, and its object is to provide a substrate processing apparatus capable of preventing substrates from being snagged, and a control method for the substrate processing apparatus.

[0013] means for solving problems

[0014] To achieve this objective, the present invention employs the following structure. That is, the substrate processing apparatus of the present invention processes a plurality of substrates, characterized in that it comprises: a receiving frame placement unit, the receiving frame having a plurality of slots arranged vertically at a predetermined spacing; a substrate shape information acquisition unit, which acquires substrate shape information including information on the shapes of the plurality of substrates respectively housed in the plurality of slots; a handling robot having a hand capable of supporting a first substrate in a horizontal posture, the handling robot removing the first substrate from a first slot among the plurality of slots or housing the first substrate in the first slot by moving the hand in both the horizontal and vertical directions; and a control unit; the control unit controls the speed and acceleration of the hand supporting the first substrate in the following manner when the hand moves within the receiving frame: using the substrate shape information to acquire the thickness of the first substrate; calculating the weight of the first substrate based on the thickness; determining the speed and acceleration of the hand supporting the first substrate according to the weight of the first substrate; and moving the hand supporting the first substrate within the first slot using the determined speed and acceleration.

[0015] According to the substrate processing apparatus of the present invention, the thickness of a first substrate is obtained using substrate shape information, the weight of the first substrate is calculated based on the thickness, and then the speed and acceleration of the hand supporting the first substrate are determined based on the weight of the first substrate. Therefore, vibrations caused by the speed and acceleration of the hand can be suppressed, thereby preventing the substrate from being snagged inside the housing.

[0016] Furthermore, in the aforementioned substrate processing apparatus, preferably, the control unit determines the speed and acceleration of the hand in such a way that the speed and acceleration of the hand decrease as the weight of the first substrate increases. Thus, the speed and acceleration of the hand are determined such that the speed and acceleration of the hand decrease as the weight of the first substrate increases.

[0017] Furthermore, in the aforementioned substrate processing apparatus, preferably, when the hand supporting the first substrate moves within the receiving frame, the control unit determines the speed and acceleration of the hand based on the weight of the first substrate, such that the full amplitude of the hand vibrating in the vertical direction falls within the slot height of the first slot. Thus, the speed and acceleration of the hand are determined such that the full amplitude of the hand vibrating in the vertical direction falls within the slot height.

[0018] Furthermore, in the aforementioned substrate processing apparatus, preferably, the control unit determines the speed and acceleration of the hand based on the weight of the first substrate, such that the full amplitude of the hand vibrating in the vertical direction falls within a corrected height obtained by subtracting the thickness of the first substrate from the height of the first slot. This allows the speed and acceleration of the hand to be determined by taking into account the corrected height of the first substrate's thickness.

[0019] Furthermore, in the aforementioned substrate processing apparatus, preferably, the control unit uses a lookup table to determine the speed and acceleration of the hand. The lookup table allows for easy determination of the hand's speed and acceleration.

[0020] Furthermore, in the aforementioned substrate processing apparatus, one example of the substrate shape information acquisition unit is a photoelectric sensor. Another example of the substrate shape information acquisition unit in the aforementioned substrate processing apparatus is a camera. Since a camera can collect information over a wide range, it is possible, for example, to simultaneously monitor the warping state of the substrate and acquire the gap between two substrates.

[0021] Furthermore, in the aforementioned substrate processing apparatus, preferably, when the hand without substrate support moves within the receiving frame, the control unit controls the speed and acceleration of the hand in the following manner: using the substrate shape information, it obtains the gap between the first substrate housed in the first slot and the second substrate housed in the second slot adjacent to the first slot on the lower side of the plurality of slots; when the hand without substrate support moves within the receiving frame, it determines the speed and acceleration of the hand such that the full amplitude of the hand vibrating in the vertical direction falls within the gap; using the determined speed and acceleration, it moves the hand without substrate support between the first substrate and the second substrate.

[0022] The speed and acceleration of the hand are determined by the full amplitude of the hand's movement across the gap without supporting the substrate. Therefore, vibrations caused by the hand's speed and acceleration can be suppressed, thereby preventing the substrate from being caught on the hand.

[0023] Furthermore, in the aforementioned substrate processing apparatus, preferably, the control unit determines the speed and acceleration of the hand such that the full amplitude of the hand without substrate support falls within a correction gap obtained by subtracting the thickness of the hand from the existing gap. The speed and acceleration of the hand can be determined by taking into account the thickness of the hand within the correction gap.

[0024] Furthermore, the substrate processing apparatus of the present invention processes a plurality of substrates, characterized in that it comprises: a receiving frame placement unit, the receiving frame having a plurality of slots arranged vertically at a predetermined spacing; a substrate shape information acquisition unit, which acquires substrate shape information including information on the shapes of the plurality of substrates respectively housed in the plurality of slots; a handling robot having a hand capable of supporting a first substrate in a horizontal posture, the handling robot removing the first substrate from a first slot among the plurality of slots or housing the first substrate in the first slot by moving the hand in both the horizontal and vertical directions; and a control unit; the control unit... When the hand without a supported substrate moves within the receiving frame, the control unit controls the speed and acceleration of the hand in the following manner: using the substrate shape information, it obtains the gap between the first substrate housed in the first slot and the second substrate housed in the second slot adjacent to the first slot on the lower side of the plurality of slots; when the hand without a supported substrate moves within the receiving frame, it determines the speed and acceleration of the hand such that the full amplitude of the hand vibrating in the vertical direction falls within the gap; using the determined speed and acceleration, it moves the hand without a supported substrate between the first substrate and the second substrate.

[0025] Furthermore, the control method of the substrate processing apparatus of the present invention, wherein the substrate processing apparatus processes a plurality of substrates, is characterized in that the substrate processing apparatus comprises: a receiving frame placement unit, the receiving frame having a plurality of slots arranged vertically at a predetermined spacing; a substrate shape information acquisition unit, which acquires substrate shape information including information on the shapes of the plurality of substrates respectively housed in the plurality of slots; and a handling robot having a hand capable of supporting a first substrate in a horizontal posture, the handling robot removing the first substrate from a first slot among the plurality of slots by moving the hand in both the horizontal and vertical directions. Alternatively, the first substrate may be housed in the first slot; the control method, when the hand supporting the first substrate moves within the receiving frame, controls the speed and acceleration of the hand in the following steps: a thickness acquisition step, using the substrate shape information to acquire the thickness of the first substrate; a weight calculation step, based on the thickness, calculating the weight of the first substrate; a determination step, based on the weight of the first substrate, determining the speed and acceleration of the hand supporting the first substrate; and a hand movement step, using the determined speed and acceleration to move the hand supporting the first substrate within the first slot.

[0026] Furthermore, the control method of the substrate processing apparatus of the present invention, wherein the substrate processing apparatus processes a plurality of substrates, is characterized in that the substrate processing apparatus comprises: a receiving frame placement unit, the receiving frame having a plurality of slots arranged vertically at a predetermined spacing; a substrate shape information acquisition unit, which acquires substrate shape information including information on the shapes of the plurality of substrates respectively housed in the plurality of slots; and a handling robot having a hand capable of supporting a first substrate in a horizontal posture, the handling robot removing the first substrate from a first slot among the plurality of slots or housing the first substrate in the first slot by moving the hand in both the horizontal and vertical directions; the control method, in the absence of When the hand supporting the substrate moves within the receiving frame, the speed and acceleration of the hand are controlled by the following steps: a gap acquisition step, using the substrate shape information to acquire the gap between the first substrate housed in the first slot and the second substrate housed in the second slot adjacent to the first slot on the lower side of the plurality of slots; a determination step, when the hand without supporting the substrate moves within the receiving frame, determining the speed and acceleration of the hand such that the full amplitude of the hand vibrating in the vertical direction falls within the gap; and a hand movement step, using the determined speed and acceleration to move the hand without supporting the substrate between the first substrate and the second substrate.

[0027] The effects of the invention

[0028] The substrate processing apparatus and the control method of the substrate processing apparatus according to the present invention can prevent the substrate from being snagged. Attached Figure Description

[0029] Figure 1 This is a top view showing the substrate processing apparatus of Embodiment 1.

[0030] Figure 2 This is a cross-sectional view of the storage rack.

[0031] Figure 3 This is the front view of the storage rack.

[0032] Figure 4 This is a top view of the substrate.

[0033] Figure 5 (a) is a longitudinal cross-sectional view showing a typical substrate, (b) is a longitudinal cross-sectional view showing a thick-edge substrate, and (c) is a longitudinal cross-sectional view showing a bonded substrate.

[0034] Figure 6 This is a longitudinal sectional view showing the substrate processing apparatus of Embodiment 1.

[0035] Figure 7 This is a side view showing the cover loading and unloading section.

[0036] Figure 8 This is a top view showing the mapping sensor in the standby position.

[0037] Figure 9 This is a top view showing the mapping sensor located at the detection position.

[0038] Figure 10 This is a block diagram showing the control system of the substrate processing apparatus.

[0039] Figure 11 The evaluation results show the relationship between the weight of the substrate and the full amplitude of the hand when the movement speed and acceleration of the hand change.

[0040] Figure 12 This is a flowchart used to explain the operation of the substrate processing device.

[0041] Figure 13 It is a longitudinal sectional view used to illustrate the mapping action.

[0042] Figure 14 This is an example diagram showing substrate shape information.

[0043] Figure 15 It is shown Figure 12A flowchart detailing the actions in step S03.

[0044] Figure 16 It is a graph showing the relationship between the weight of the substrate and the full amplitude of the hand for each of a plurality of combinations of velocity and acceleration.

[0045] Figure 17 A diagram used to illustrate velocity and acceleration.

[0046] Figure 18 This is a graph showing the full amplitude.

[0047] Figure 19 It is shown Figure 12 A flowchart detailing the actions in step S04.

[0048] Figure 20 It is a longitudinal sectional view used to illustrate the forward movement of a hand that is not supported by any substrate.

[0049] Figure 21 This is a longitudinal sectional view used to illustrate the backward movement of the hand supporting the substrate.

[0050] Figure 22 It is a longitudinal sectional view used to illustrate the forward movement of the hand supporting the substrate.

[0051] Figure 23 It is a longitudinal sectional view used to illustrate the backward movement of a hand that is not supported by any substrate.

[0052] Figure 24 This is a longitudinal sectional view showing the substrate processing apparatus of Embodiment 2.

[0053] Figure 25 (a) is a diagram illustrating the corrected height of the modified example, and (b) is a diagram illustrating the corrected gap of the modified example. Detailed Implementation

[0054] The following describes embodiments of the present invention.

[0055] Example 1

[0056] Hereinafter, Embodiment 1 of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a top view showing the substrate processing apparatus of Embodiment 1. Furthermore, without distinguishing between substrates W1 to W25, it is referred to as "substrate W". Without distinguishing between the general substrate WA, the thick-edge substrate WB, and the bonding substrate WC, it is also referred to as "substrate W". Without distinguishing between gaps CL1 to CL24, it is referred to as "gap CL".

[0057] In this specification, for convenience, the orientation of the indexer block 3 and the processing block 5 is referred to as the "front-back direction X". The front-back direction X is horizontal. The direction within the front-back direction X, for example, from the processing block 5 towards the indexer block 3, is called "front". The direction opposite to the front is called "rear". The horizontal direction orthogonal to the front-back direction X is called the "width direction Y". One direction within the "width direction Y" is appropriately called "right". The direction opposite to the right is called "left". The direction perpendicular to the horizontal direction is called the "vertical direction Z". In the various figures, for reference, front, rear, right, left, up, and down are appropriately shown.

[0058] <1. Structure of the substrate processing device>

[0059] Reference Figure 1 The substrate processing apparatus 1 processes substrate W. The substrate processing apparatus 1 has a indexing block 3 and a processing block 5.

[0060] <1-1. Indexer Block>

[0061] Indexer block 3 has a plurality of (e.g., 2) housings 7, a transport robot IR, a housing 9, and a plurality of (e.g., 2) cover loading and unloading parts 11.

[0062] Each receiving rack 7 has a receiving rack C. The receiving rack C houses a plurality of substrates (e.g., 25) arranged in a horizontal orientation along the vertical direction Z at a predetermined spacing (e.g., a spacing of 10 mm). As the receiving rack C, for example, a FOUP (Front Opening Unify Pod) can be used, but it is not limited to this. For example, the receiving rack can be a component called a cassette (open cassette) that does not block the cover 17 (described later) of the take-out outlet 15.

[0063] <1-1-1. Storage rack>

[0064] Figure 2 This is a cross-sectional view of the housing C. Figure 3 This is a front view of the housing C. The housing C has a container 13, an outlet 15, and a cover 17. The container 13 holds a plurality of substrates W. The outlet 15 is provided on the front of the container 13. The outlet 15 is an opening used for taking out and putting in the plurality of substrates W. The substrates W in the container 13 of the housing C are taken out through the outlet 15. In addition, the substrates W are stored through the outlet 15. When transporting the housing C, the outlet 15 is blocked by the cover 17.

[0065] Furthermore, the housing C has a plurality of shelf sections 19 and a plurality of slots. In this embodiment, for example, the housing C has 25 shelf sections 19 and 25 slots SL1 to SL25. 25 shelf sections 19 are provided inside the container 13.

[0066] Twenty-five shelf sections 19 are arranged vertically in the Z direction at a predetermined spacing (e.g., 10 mm). Each shelf section 19 has a pair of shelves 19A and 19B. Therefore, the housing C has 25 pairs of shelves 19A and 19B. Figure 3 As shown, shelf 19A is disposed on the inner wall 13A of the left side of container 13, and shelf 19B is disposed on the inner wall 13B of the right side of container 13. A substrate W is placed on each shelf section 19 (each pair of shelves 19A, 19B).

[0067] In addition, such as Figure 3 As shown, the groove-shaped space between two adjacent shelf sections 19 along the vertical direction Z is called a "slot". Furthermore, in the case of the uppermost shelf section 19, the space above the uppermost shelf section 19 is also called a "slot". 25 slots SL1 to SL25 are arranged along the vertical direction Z at a predetermined spacing (e.g., 10 mm). The lowermost slot is slot SL1, and the uppermost slot is slot SL25. The 25 slots SL1, SL2, SL3, ..., SL23, SL24, SL25 are arranged sequentially upwards. Each of the 25 slots SL1 to SL25 houses 25 substrates W.

[0068] <1-1-2. Types of Substrates>

[0069] Here, the types of substrate W will be explained. Figure 4 This is a top view of the substrate W. The basic shape of the substrate W is illustrated. The substrate W is formed in a circular plate shape. The substrate W has a peripheral portion 21 and a main portion 23. The main portion 23 is located inside the peripheral portion 21. Figure 4 In the middle, the boundary between the peripheral part 21 and the main part 23 is indicated by a dashed line.

[0070] Reference Figure 5 (a) ~ Figure 5 (c) The substrate W is classified into several types according to its shape. For example, the substrate W includes a general substrate WA, a thick-edge substrate WB, and a bonding substrate WC.

[0071] Reference Figure 5(a) Typically, the substrate WA is a generally circular substrate with uniform thickness. That is, the substrate WA is a substrate in which the thickness of the peripheral portion 21 is the same as the thickness of the main portion 23. The substrate WA is typically formed of, for example, silicon. The substrate WA is a substrate W in accordance with SEMI specifications. For example, the diameter of the substrate WA is 300 mm and its thickness is 0.775 mm.

[0072] Reference Figure 5 (b) The thick-edge substrate WB is a circular substrate with a thick peripheral portion 21 and a thin inner portion (main portion 23). The upper surface of the main portion 23 is subjected to back-side grinding. Figure 5 As shown in (b), the lower surface of the thick-edge substrate WB may or may not have a flexible resin film FM bonded to it. The resin film FM is bonded to the thick-edge substrate WB via an adhesive layer 25. The resin film FM is formed in a circular plate shape. The thickness of the resin film FM is, for example, approximately the same as the thickness of the main portion 23. Furthermore, the lower surface of the thick-edge substrate WB may be, for example, a device surface (semiconductor device surface) on which devices are formed.

[0073] Reference Figure 5 (c) The bonding substrate WC has a thick-edge substrate 27 and a support substrate 29. The thick-edge substrate 27 and Figure 5 The resin-free thick-edge substrate WB shown in (b) is constructed in a substantially similar manner. Devices are formed, for example, on the lower surface of the thick-edge substrate 27. The thick-edge substrate 27 is formed of, for example, silicon. A support substrate 29 is attached to the lower surface of the thick-edge substrate 27. The support substrate 29 is bonded to the thick-edge substrate 27 via an adhesive layer 25. The support substrate 29 is formed of glass.

[0074] <1-1-3. Cover Loading / Removing Part and Mapping Sensor>

[0075] Reference Figure 1 , Figure 6 , Figure 7 Two receiving rack mounting portions 7 are disposed in the front portion of the indexer block 3. That is, the two receiving rack mounting portions 7 are provided on the outer side of the wall portion 9A on the front side of the housing 9. The wall portion 9A has a passage opening 31 at a position corresponding to the take-out outlet 15 of the receiving rack C placed in the receiving rack mounting portion 7. Therefore, the wall portion 9A has two passage openings 31 (see reference). Figure 1 Each through-hole 31 is formed to be approximately the same size as the outlet 15.

[0076] Each access port 31 is opened and closed by the gate portion 33 of the cover loading and unloading section 11. Each of the two cover loading and unloading sections 11 has a gate portion 33, a gate advancing and retracting portion 35, a gate lifting portion 37, and a height sensor 38. The gate portion 33 can also remove the cover portion 17 from the receiving frame C or install the cover portion 17 onto the receiving frame C. The gate portion 33 holds the removed cover portion 17.

[0077] The gate advance / retractor 35 moves the gate section 33 forward and backward in the X direction. The gate lifting / lowering section 37 moves the gate section 33 in the vertical direction Z and also moves the mapping sensor 43 (described later) in the vertical direction Z. Both the gate advance / retractor 35 and the gate lifting / lowering section 37 have a screw shaft 39, a guide rail 40, and an electric motor (not shown). The height sensor 38 is, for example, a linear encoder or a rotary encoder. The height sensor 38 measures the height position of the gate section 33 and also measures the vertical Z-direction height position of the mapping sensor 43 (described later).

[0078] Reference Figure 8 , Figure 9 The indexing block 3 also includes a mapping sensor 43 and a sensor moving part 45. The mapping sensor 43 is disposed on the upper surface of the gate part 33 via the sensor moving part 45. The sensor moving part 45 has a sensor support member 47.

[0079] The sensor support member 47 is C-shaped. The mapping sensor 43 has a projector 43A and a receiver 43B. The projector 43A is disposed at the first end of the C-shaped sensor support member 47, and the receiver 43B is disposed at the second end of the sensor support member 47. The projector 43A and the receiver 43B are opposite to each other. The optical axis LT connecting the projector 43A and the receiver 43B extends horizontally along the width direction Y.

[0080] The sensor moving part 45 includes a guide rail, a screw shaft, and an electric motor (none shown). The sensor moving part 45 causes the mapping sensor 43 to enter the receiving frame C placed in the receiving frame mounting part 7. Figure 8 In this configuration, the mapping sensor 43 is moved to the standby position via the sensor moving part 45. In contrast, in... Figure 9 In the process, the mapping sensor 43 moves to the detection position via the sensor moving part 45. At this time, the optical axis LT of the mapping sensor 43 extending along the width direction Y intersects with the periphery of the substrate W when viewed from above.

[0081] Light emanating from the projector 43A is received by the receiver 43B. When the receiver 43B receives light, it detects that the substrate W is not present on the optical axis LT. Conversely, when the light emanating from the projector 43A is blocked by the substrate W, the receiver 43B cannot receive light. In this case, the receiver 43B detects that the substrate W is present on the optical axis LT. At the detection position, the mapping sensor 43, which is in operation between the projector 43A and the receiver 43B, moves along the vertical direction Z. This acquires information about the shape of the 25 substrates W housed in the 25 slots SL1 to SL25 of the housing C, i.e., substrate shape information (information on the presence or absence of the 25 substrates W within a specified range in the vertical direction Z).

[0082] Furthermore, the mapping sensor 43 may be a transmissive photoelectric sensor, but a reflective photoelectric sensor may also be used. The height sensor 38 and the mapping sensor 43 correspond to the substrate shape information acquisition unit of the present invention.

[0083] <1-1-4. Transport Robot>

[0084] Reference Figure 1 , Figure 6 The handling robot IR is, for example, a horizontally articulated robot that handles a substrate W. The handling robot IR has a hand 51. The hand 51 is capable of supporting a substrate W in a horizontal position. The handling robot IR moves the hand 51 in the horizontal direction (front-back direction X and width direction Y) and the vertical direction Z. Thus, the substrate W25 can be removed from, for example, slot SL25 of the 25 slots SL1 to SL25 of the housing C, and the substrate W can be stored in slot SL25.

[0085] In addition to the hand 51, the handling robot IR also includes a multi-joint arm 53, a lifting platform 55, and a height sensor 57. The hand 51 is attached to the top end of the multi-joint arm 53. The base end of the multi-joint arm 53 is rotatably connected to the lifting platform 55 about a vertical axis. The multi-joint arm 53 moves the hand 51 horizontally and changes its orientation. The lifting platform 55 moves both the hand 51 and the multi-joint arm 53 vertically (Z). The multi-joint arm 53 and the lifting platform 55 each have, for example, an electric motor. The height sensor 57 measures the vertical Z-position of the hand 51. The height sensor 57 is constructed, for example, a linear encoder or a rotary encoder.

[0086] <1-2. Processing Blocks>

[0087] Reference Figure 1 Processing block 5 has multiple processing units 61, a central robot CR, and a substrate mounting unit PS. The substrate mounting unit PS is disposed between the transport robot IR and the central robot CR. The substrate mounting unit PS can mount one or more substrates W.

[0088] The processing unit 61 performs a pre-set process on the substrate W. For example, each processing unit 61 has, for example, a holding and rotating part 63 and a nozzle 65. The holding and rotating part 63 includes a rotary chuck that holds a substrate W in a horizontal position and an electric motor that rotates the rotary chuck about a vertical axis passing through the center of the substrate W. The nozzle 65 sprays a processing liquid onto the upper surface of the substrate W held by the holding and rotating part 63.

[0089] The central robot CR has a hand 67 that supports a substrate W in a horizontal position. The central robot CR is capable of moving this hand 67. The central robot CR is capable of transporting the substrate W between multiple processing units 61 and substrate mounting units PS.

[0090] In addition to the hand 67, the central robot CR also has a forward / backward movement unit 69 and a lifting / rotating unit 71. The forward / backward movement unit 69 causes the hand 67 to move forward and backward. The lifting / rotating unit 71 rotates the hand 67 and the forward / backward movement unit 69 around the vertical axis AX1 to change the direction of the hand 67. Furthermore, the lifting / rotating unit 71 causes the hand 67 and the forward / backward movement unit 69 to move up and down in the vertical direction Z. Both the forward / backward movement unit 69 and the lifting / rotating unit 71 have one or more electric motors. Additionally, the forward / backward movement unit 69 has, for example, a screw shaft and a guide rail.

[0091] <1-3. Control System of the Substrate Processing Apparatus>

[0092] Figure 10 This is a block diagram showing the control system of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a control unit 81 and a storage unit 83. The control unit 81 controls various structures of the substrate processing apparatus 1 (e.g., the handling robot IR and the cover loading / unloading unit 11). The control unit 81 has one or more processors, such as a central processing unit (CPU). The storage unit 83 has at least one of, for example, ROM (Read-Only Memory), RAM (Random-Access Memory), and auxiliary storage devices (e.g., hard disk). The storage unit 83 stores computer programs required for controlling the various structures of the substrate processing apparatus 1.

[0093] Hereinafter, a summary of the feature portion of this embodiment will be described. Figure 11 This is an evaluation result showing the relationship between the weight of the substrate W and the total amplitude (and peak-to-peak amplitude) of the hand as the hand's movement speed and acceleration change. The horizontal axis represents the weight of the substrate W (gf: grams). The vertical axis represents the total amplitude (mm) in the vertical direction Z. Figure 11 In the evaluation, the handling robot IR has two hands with different heights 51.

[0094] in addition, Figure 11The "100%" and "100%" in the text represent 100% of the preset speed and 100% of the preset acceleration, respectively. The circular markings with a mesh pattern, "100%", "100%", and "UP", indicate "100% speed, 100% acceleration, upper hand". Additionally, the black triangle markings, "100%", "100%", and "LW", indicate "100% speed, 100% acceleration, lower hand".

[0095] in addition, Figure 11 The "50%" and "50%" in the text represent 50% of the preset speed and 50% of the preset acceleration, respectively. The white circular markings "50%, 50%, UP" represent "50% speed, 50% acceleration, upper hand". The white triangular markings "50%, 50%, LW" represent "50% speed, 50% acceleration, lower hand".

[0096] according to Figure 11 The evaluation results show that the greater the weight of the substrate W, the larger the full amplitude. Furthermore, it is known that larger speeds and accelerations result in larger full amplitudes. In addition, in... Figure 11 middle, Figure 5 The typical substrate WA of the SEMI specification shown in (a) weighs 125 gf.

[0097] Based on such Figure 11 As shown, when the hand 51 is not supported by the substrate W, the hand 51 is moved in the following manner. For example, when the gap between the two substrates W is small, the control unit 81 moves the hand 51 while reducing the speed and acceleration of the hand 51. As a result, vibration of the hand 51 can be suppressed.

[0098] Furthermore, when the hand 51 supports the substrate W, the hand 51 is moved as follows: The control unit 81 calculates the weight (ideal weight) of the substrate W based on its thickness (mm), and determines the speed and acceleration of the hand 51 such that the speed and acceleration of the hand 51 decrease as the weight of the substrate W increases. Then, the control unit 81 moves the hand 51 at the determined speed and acceleration. Therefore, vibration of the hand 51 can be suppressed.

[0099] In addition, the storage unit 83 stores the diameter of the substrate W (e.g., 300 mm), substrate shape information SH, slot height SHT in the vertical direction Z of each slot, information on the type of each substrate W stored in the housing C, substrate information in the housing C, thickness TK of the substrate W, gap CL, weight of the substrate W, and speed and acceleration of the hand 51.

[0100] <2. Operation of the substrate processing apparatus>

[0101] While referring to Figure 12 The flowchart illustrates the operation of the substrate processing apparatus 1. Figure 1 The container rack 7 shown contains the container rack C.

[0102] The receiving rack C houses 25 substrates W for use as products. The 25 substrates W include at least one of a general substrate WA, a thick-edge substrate WB, and a bonding substrate WC. For example, the 25 substrates W may also contain a mixture of general substrate WA, thick-edge substrate WB, and bonding substrate WC. Alternatively, the 25 substrates W may be composed of 25 bonding substrates WC. Furthermore, a mainframe computer (not shown) can send information about the type of each substrate W housed in the receiving rack C to the substrate processing apparatus 1.

[0103] [Step S01] Mapping

[0104] Figure 6 The cover loading / unloading unit 11 shown unloads the cover 17 of the housing C, which is placed in the housing rack mounting section 7, from the container 13 of the housing rack C via the gate section 33. Then, the gate section 33 is moved backward (retracted) while holding the cover 17 in place and the gate advance / retreat section 35 of the cover loading / unloading unit 11 is away from the housing rack C. This opens the passage 31 of the wall section 9A. Then, the gate lifting section 37 of the cover loading / unloading unit 11 lowers the gate section 33 slightly to a height position where the mapping sensor 43 can enter the housing rack C.

[0105] Then, the sensor moving part 45 causes the mapping sensor 43 to move from... Figure 8 The standby position shown is facing Figure 9 The detection position shown moves forward (advances). As a result, the mapping sensor 43 enters the housing C on the housing mount 7. Then, as... Figure 13 As shown, when the mapping sensor 43 is activated, the cover loading / unloading unit 11 lowers the gate unit 33 and the mapping sensor 43 via the gate lifting unit 37. This performs the mapping operation. Alternatively, the mapping operation can also be performed by raising the mapping sensor 43.

[0106] Through the mapping action, the mapping sensor 43 and the height sensor 38 are, for example, acquired. Figure 14The substrate shape information SH is shown. The substrate shape information SH includes information on the shape of the 25 substrates W housed in the 25 slots SL1 to SL25 respectively. Specifically, when the light receiver 43B detects light from the emitter 43A of the mapping sensor 43, the light receiver 43B detects that there is no substrate W on the optical axis LT. Conversely, when the light receiver 43B does not detect light from the emitter 43A, the light receiver 43B detects that there is substrate W on the optical axis LT. Furthermore, the height position of the mapping sensor 43, i.e., the optical axis LT, is measured by the height sensor 38. The acquired substrate shape information SH is stored in the storage unit 83.

[0107] [Step S02] Obtain the thickness of the substrate and the gap between two adjacent substrates.

[0108] The control unit 81 uses the substrate shape information SH to obtain the thickness TK (mm: millimeter) of the 25 substrates W. Specifically, as follows... Figure 14 As shown, the control unit 81 obtains 25 thicknesses TK (TK1 to TK25) of 25 substrates W from the substrate shape information SH stored in the storage unit 83.

[0109] In addition, for example, in Figure 5 In the case of the thick-edge substrate WB shown in (b), the total thickness TK of the thick-edge substrate WB and the resin film FM is obtained. Figure 5 In the case of the bonding substrate WC shown in (c), the total thickness TK of the thick edge substrate 27 and the support substrate 29 is obtained.

[0110] In addition, such as Figure 14 As shown, the control unit 81 uses the substrate shape information SH to, for example, obtain the gap CL24 (mm) between the substrate W25 housed in the slot SL25 and the substrate W24 housed in the adjacent slot SL24 located below the slot SL25. Specifically, the control unit 81 obtains 24 gaps CL1 to CL24 between adjacent two substrates W in all combinations of the 25 substrates W.

[0111] [Step S03] Determine the speed and acceleration of the hand supporting the substrate.

[0112] While referring to Figure 15 The flowchart illustrates the actions of step S03.

[0113] [Step S31] Calculate the weight of the substrate.

[0114] The control unit 81 calculates the weight of the substrate W based on the calculated thickness TK of the substrate W. For example, Figure 5 (a) ~ Figure 5The substrates W shown in (c), such as the general substrate WA, the thick-edge substrate WB, and the bonding substrate WC, are calculated as follows: Equations (1) to (3). In addition, the storage unit 83 stores substrate information in the housing C sent from the host computer.

[0115] The weight of a typical substrate WA is calculated as follows: (thickness TK of the typical substrate WA) × (diameter of the typical substrate WA) × (specific gravity of the typical substrate WA) ... Equation (1)

[0116] The weight of the thick-edge substrate WB = {(the combined thickness TK of the thick-edge substrate WB and the resin film FM) - (the thickness of the resin film FM)} × (the diameter of the thick-edge substrate WB) × (the specific gravity of the thick-edge substrate WB) - (the weight of the grinding space GR1) + (the weight of the resin film FM) ... Equation (2)

[0117] The weight of the bonding substrate WC = (the total thickness TK of the thick edge substrate 27 and the support substrate 29) × (the diameter of the thick edge substrate 27) × (the specific gravity of the thick edge substrate 27) - (the weight of the grinding space GR2) ... Equation (3)

[0118] For example, suppose the housing C houses a standard substrate WA, a thick-edge substrate WB, and a bonding substrate WC. In this case, regarding the standard substrate WA, the substrate information within the housing C includes its diameter and specific gravity (density). Regarding the thick-edge substrate WB, the substrate information within the housing C includes, in addition to its diameter and specific gravity, the weight of the grinding space GR1 portion, the weight of the resin film FM, and the thickness of the resin film FM. Regarding the bonding substrate WC, the substrate information within the housing C includes, in addition to the diameter and specific gravity of the thick-edge substrate 27, the weight of the grinding space GR2 portion. Furthermore, if the support substrate 29 is made of glass, the specific gravity of the support substrate 29 is approximately the same as that of the thick-edge substrate 27.

[0119] The calculated weight of the substrate W (usually the weight of the substrate WA, the weight of the thick-edge substrate WB, and the weight of the bonding substrate WC) is stored in the storage unit 83.

[0120] [Step S32] Obtain the full amplitude of the hand.

[0121] The control unit 81 determines the speed and acceleration of the hand 51 supporting the substrate W based on the weight of the substrate W, such that the full amplitude of the vibration in the vertical direction (vertical direction Z) falls within the slot height SHT of, for example, slot SL25. This operation will be explained in detail below. First, the full amplitude of the hand 51 corresponding to the weight of the substrate W is obtained. Figure 16 This is a graph showing the relationship between the weight of the substrate W and the full amplitude of the hand part 51 for each of the plurality of conditions SA10 to SA6, including velocity and acceleration. Additionally, Figure 16 It is also a two-dimensional lookup table (LUT) for determining the speed and acceleration of the hand 51 based on the weight and gap (slot height) of the substrate W. Figure 17 It is a diagram used to illustrate velocity and acceleration. Figure 18 This is a graph showing the full amplitude.

[0122] Furthermore, condition SA10 is 100% of the preset normal speed SP10 (i.e., normal speed SP10) and 100% of the preset normal acceleration AC10 (i.e., normal acceleration AC10). Condition SA9 is 90% of the normal speed SP10 (speed SP9) and 90% of the normal acceleration AC10 (acceleration AC9). Condition SA7 is 70% of the normal speed SP10 (speed SP7) and 70% of the normal acceleration AC10 (acceleration AC7).

[0123] The same applies to conditions SA8 and SA6. Therefore, the following relationships hold: Generally, velocity SP10 > velocity SP9 > velocity SP8 > velocity SP7 > velocity SP6. Additionally, generally, acceleration AC10 > acceleration AC9 > acceleration AC8 > acceleration AC7 > acceleration AC6 (see reference). Figure 17 ).

[0124] like Figure 16 As shown, for example, when the substrate W has a weight WT1, the control unit 81 acquires full amplitudes MA10, MA9, MA8, MA7, and MA6 as candidates for full amplitude. Additionally, for example, when the substrate W has a weight WT2, the control unit 81 acquires full amplitudes MB10, MB9, MB8, MB7, and MB6 as candidates for full amplitude.

[0125] [Step S33] Determine the velocity and acceleration that are equal to the full amplitude of the slot height.

[0126] The height of the 25 slots SL1 to SL25 is SHT (reference). Figure 13 The slot heights (SHT) are all the same size. For example, each of the 25 slots has a height of 6 mm. The control unit 81 obtains the slot heights (SHT) from the storage unit 83. Furthermore, the slot height (SHT) is the height (gap) between two adjacent shelf sections 19.

[0127] In addition, such as Figure 16 As shown, for example, when the substrate W has a weight WT1, the five full amplitudes MA10 to MA6 are less than the slot height SHT. Therefore, the control unit 81 determines the normal speed SP10 and normal acceleration AC10 of the condition SA10 that is closest to the slot height SHT as the speed and acceleration of the hand 51.

[0128] Additionally, for example, when the substrate W has a weight WT2, the four full amplitudes MB9 to MB6 are less than the slot height SHT. Therefore, the control unit 81 determines the speed SP9 and acceleration AC9 of the condition SA9 that is closest to the slot height SHT as the speed and acceleration of the hand 51.

[0129] In addition, it can be used Figure 16 The lookup table (LUT) shown determines the speed and acceleration of the hand 51 based on the weight of the substrate W and the slot height (SHT). In this case, for example, one condition (SA9) for speed and acceleration is obtained based on the weight (WT2) of the substrate W and the slot height (SHT). The speed and acceleration of the hand 51 are determined for each of the 25 substrates W.

[0130] [Step S34] There is no velocity or acceleration that can be used as a solution?

[0131] Furthermore, if the control unit 81 is unable to determine the speed and acceleration that will become the solution, it can stop the transport robot IR from transporting the substrate W and notify the operator of the situation through a notification unit (e.g., a buzzer, a light, or a display).

[0132] [Step S04] Determine the speed and acceleration of the hand when the substrate is not supported.

[0133] While referring to Figure 19 The actions of step S04 are explained.

[0134] [Step S41] Obtain the full amplitude of the hand.

[0135] The control unit 81 determines the speed and acceleration of the hand 51 by ensuring that the full amplitude of the hand 51, which is not supporting any substrate W, falls within the gap CL24 (CL). This operation will be explained in detail below. First, the full amplitude of the hand 51 corresponding to the weight of the hand 51, which is not supporting any substrate W, is obtained.

[0136] Reference Figure 16 When the hand 51 does not support any substrate W, the weight WT3 of the substrate W is 0 (zero) grams (gf). When the substrate W has a weight WT3 (0gf), the control unit 81 acquires full-amplitude MC10, MC9, MC8, MC7, and MC6 as candidates for full-amplitude.

[0137] [Step S42] Determine the velocity and acceleration that are equal to the full amplitude of the gap.

[0138] The control unit 81 reads 24 gaps CL (CL1 to CL24) from the storage unit 83. When the substrate W has a weight WT3 (0 gf), the full amplitudes MC7 and MC6 are smaller than, for example, gap CL24. Therefore, the control unit 81 determines the velocity SP7 and acceleration AC7 of the condition SA7 closest to gap CL24 as the velocity and acceleration of the hand 51. The control unit 81 similarly determines the velocity and acceleration of the hand 51 for the remaining 23 gaps CL1 to CL23.

[0139] [Step S43] There is no velocity or acceleration that can be a solution?

[0140] Furthermore, if the control unit 81 is unable to determine the speed and acceleration that will become the solution, it can stop the transport robot IR from transporting the substrate W and notify the operator of the situation through a notification unit (e.g., a buzzer, a light, or a display).

[0141] [Step S05] Transfer the substrate from the receiving rack

[0142] The control unit 81 moves the hand 51 using the speed and acceleration determined in steps S03 and S04. Additionally, the control unit 81 uses the transport robot IR to remove the substrate W from the receiving rack C placed in the receiving rack placement unit 7 and transport the substrate W to the substrate placement unit PS. This operation will be described in detail.

[0143] Reference Figure 20 The control unit 81 uses, for example, the speed SP7 and acceleration AC7 determined in step S04, to move the hand 51, which is not holding either substrate W, forward, and then moves the hand 51 between the two substrates W25 and W24. The hand 51 moves at a speed SP7 that is 70% of the normal speed SP10 and an acceleration AC7 that is 70% of the normal acceleration AC10. Therefore, vibration can be suppressed without excessively reducing the speed and acceleration of the hand 51, thereby preventing the substrate W from being snagged.

[0144] Reference Figure 21 Then, the control unit 81 raises the hand 51 to receive the substrate W25 in the slot SL25. Then, using the speed SP9 and acceleration AC9 determined in step S03, the control unit 81 moves the substrate W25 within the slot SL25 while retracting the hand 51 supporting the substrate W25. Thus, the substrate W25 is removed from the receiving holder C. At this time, the hand 51 moves at a speed SP9 that is 90% of the normal speed SP10 and an acceleration AC9 that is 90% of the normal acceleration AC10. Therefore, vibration can be suppressed without excessively reducing the speed and acceleration of the hand 51, thereby preventing the substrate W from being snagged.

[0145] Then, the control unit 81 transfers the substrate W25 removed from the receiving rack C to the substrate mounting unit PS. At this time, the hand unit 51 can transfer it at a normal speed SP10 and a normal acceleration AC10. In addition, the remaining 24 substrates W in the receiving rack C are also transferred from the receiving rack C to the substrate mounting unit PS in the same way. Furthermore, 25 substrates are taken out from the receiving rack C in a top-to-bottom order, but the order in which the 25 substrates W are taken out is not limited to this.

[0146] [Step S06] Processing the substrate

[0147] The central robot CR in processing block 5 receives substrate W from substrate placement unit PS and transports substrate W to any one of the plurality of processing units 61. Each processing unit 61 performs a pre-set process (e.g., cleaning) on ​​the transported substrate W. Then, the central robot CR receives the processed substrate W from the plurality of processing units 61 and returns substrate W to substrate placement unit PS.

[0148] [Step S07] Transfer the substrate to the receiving rack

[0149] The transfer robot IR in indexer block 3 receives, for example, substrate W25 from substrate placement unit PS and returns substrate W25 to slot SL25 of receiver C on receiver placement unit 7. The transfer robot IR moves substrate W25, supported by hand 51, from substrate placement unit PS to the vicinity of receiver C.

[0150] Reference Figure 22 Then, the control unit 81 uses the speed SP9 and acceleration AC9 determined in step S03 to move the substrate W25 into the receiving holder C, and while moving the substrate W25 within the slot SL25, it also moves the hand 51 supporting the substrate W25 forward. At this time, the hand 51 moves at a speed SP9 that is 90% of the normal speed SP10 and an acceleration AC9 that is 90% of the normal acceleration AC10. This prevents the substrate W25 from being caught.

[0151] Reference Figure 23 Then, the control unit 81 lowers the hand 51 according to a preset distance. This places the substrate W supported by the hand 51 into the shelf portion 19 at the lower part of the slot SL25. Then, the control unit 81 uses the speed SP7 and acceleration AC7 determined in step S04 to retract the hand 51 that is not holding any substrate W, causing the hand 51 to exit from the receiving frame C.

[0152] At this time, when the slot SL24 houses the substrate W24, the hand 51, which is not holding either substrate W, is moved back between the two substrates W25 and W24. This prevents the two substrates W25 and W24 from being caught by the hand 51. Furthermore, when the slot SL24 does not house any substrate W, the hand 51, which is not holding either substrate W, is moved back between substrate W25 and the assumed-to-be-present substrate W24. This prevents substrate W25 from being caught by the hand 51.

[0153] Similarly, the control unit 81 transports the remaining 24 substrates W from the substrate placement unit PS to the receiving rack C. When all 25 processed substrates W are stored in the receiving rack C, the cover removal unit 11 closes the take-out port 15 of the receiving rack C with the cover 17. Then, the receiving rack C is transported from the receiving rack placement unit 7.

[0154] According to this embodiment, the thickness TK of the substrate W is obtained using the substrate shape information SH. Based on the thickness TK, the weight of the substrate W is calculated. Then, based on the weight of the substrate W, the speed and acceleration of the hand 51 when supporting the substrate W are determined. Therefore, vibrations caused by the speed and acceleration of the hand 51 can be suppressed, thereby enabling the substrate to be hooked inside the housing C.

[0155] Furthermore, the speed and acceleration of the hand 51 are determined such that the speed and acceleration of the hand 51 decrease as the weight of the substrate W increases. In addition, the speed and acceleration of the hand 51 are determined such that the full amplitude of the hand 51 vibrating in the vertical direction (vertical direction Z) falls within the slot height SHT.

[0156] Furthermore, the speed and acceleration of the hand 51 are determined by the full amplitude of the unsupported substrate W falling within the gap CL. Therefore, vibrations caused by the speed and acceleration of the hand 51 can be suppressed, thereby preventing the substrate from being caught by the hand 51.

[0157] In addition, to determine the speed and acceleration of hand 51, it is only necessary to use Figure 16 The lookup table (LUT) shown can easily determine the speed and acceleration of the hand 51.

[0158] Furthermore, each substrate W corresponds to the first substrate of the present invention. When substrate W25 corresponds to the first substrate of the present invention, substrate W24 corresponds to the second substrate of the present invention. Additionally, when slot SL25 corresponds to the first slot of the present invention, slot SL24 corresponds to the second slot of the present invention.

[0159] Example 2

[0160] Next, Embodiment 2 of the present invention will be described with reference to the accompanying drawings. Furthermore, descriptions that are repeated in Embodiment 1 will be omitted. Figure 24This is a longitudinal cross-sectional view showing the substrate processing apparatus 1 of Embodiment 2.

[0161] In Embodiment 1, a mapping sensor 43 and a height sensor 38 are provided as a substrate information acquisition unit. In Embodiment 2, a camera 91 can be provided as a substrate information acquisition unit.

[0162] Reference Figure 24 The handling robot IR may also include a camera 91. The camera 91 is, for example, located at the top end of the articulated arm 53. After the cover loading / unloading section 11 lowers the gate portion 33 of the cover portion 17 of the holding container C, the camera 91 photographs the 25 substrates W inside the holding container C from the front of the holding container C. The camera 91 photographs the entirety or a portion of each substrate W. The camera 91 photographs the 25 substrates W with a pre-set focus. The camera 91 can acquire images of the 25 substrates W through multiple shots. The acquired images correspond to the substrate shape information of the present invention.

[0163] The control unit 81 obtains the thickness TK of each of the 25 substrates W from the acquired image (at least a two-dimensional image). Additionally, the control unit 81 obtains the 24 gaps CL between all adjacent pairs of substrates W from the acquired image. The control unit 81 detects the contour lines of the substrates W, for example, by extracting the edges of the substrates W from the acquired image. The control unit 81 obtains the thickness TK and the gaps CL based on these contour lines.

[0164] According to this embodiment, since the camera 91 is able to collect information over a wide range, it is possible, for example, to grasp the warping state of the substrate W while simultaneously acquiring the gap CL between the two substrates W.

[0165] The present invention is not limited to the above embodiments, and can be implemented in the following modified ways.

[0166] (1) In the embodiments described above, the mapping sensor 43 is disposed on the upper surface of the gate portion 33 via the sensor moving part 45. In this respect, the mapping sensor 43 may also be disposed on both sides of the C-shaped hand 51 of the handling robot IR. In this case, the mapping sensor 43 disposed on the hand 51 and the height sensor 57 of the handling robot IR correspond to the substrate shape information acquisition part of the present invention.

[0167] Alternatively, the mapping sensor 43 and the sensor moving part 45 may not be provided in the cover loading / unloading part 11. In this case, the sensor moving part 45 may be configured to move the mapping sensor 43 along the front-rear direction X and the vertical direction Z. Additionally, the sensor moving part 45 may also have a height sensor (not shown) to detect the vertical position of the mapping sensor 43 in the vertical direction Z.

[0168] (2) In the above embodiments and variations (1), the control unit 81 may, for example, determine the speed and acceleration of the hand 51 supporting the substrate W25 based on the weight of the substrate W25, such that the full amplitude of the vertical vibration falls within the corrected height RHT obtained by subtracting the thickness TK of the substrate W25 from the slot height SHT of the slot SL25. Figure 25 (a)). The speed and acceleration of the hand 51 can be determined by taking into account the correction height of the thickness TK of the substrate W25. The control unit 81 prepares 25 correction heights RHT corresponding to the 25 slot heights SHT of the 25 slots SL1 to SL25 respectively.

[0169] (3) In the above embodiments and variations, the control unit 81 may also determine the speed and acceleration of the hand 51 by ensuring that the full amplitude of the hand 51 without supporting any substrate W falls within the corrected gap CL obtained by subtracting the thickness HTK of the hand 51 from the gap CL (see reference). Figure 25 (b)). The speed and acceleration of the hand 51 can be determined by taking into account the correction gap RCL of the thickness HTK of the hand 51. The control unit 81 prepares 24 correction gaps RCL corresponding to 24 gaps CL respectively.

[0170] (4) In the above embodiments and modifications, in steps S03 and S04, the following steps are used: Figure 16 The velocity and acceleration of hand 51 are determined using a lookup table (LUT). In this regard, step S03 can also use a second lookup table, different from the first lookup table in step S04, to determine the velocity and acceleration.

[0171] (5) In the above embodiments and modifications, the transport robot IR may also have one hand 51, for a total of two hands 51. In addition, the transport robot IR may also have three or more hands 51 arranged at different heights. In addition, the transport robot IR may also have the same forward and backward movement as the forward and backward movement 69 of the central robot CR, instead of having a multi-joint arm 53.

[0172] (6) In the above embodiments and modifications, the speed of the hand 51 may be 100% or more (e.g., 110%) of the normal speed SP10. In addition, the acceleration of the hand 51 may be 100% or more of the normal acceleration.

[0173] (7) In the above embodiments and modifications, the normal speed SP10 and normal acceleration AC10 of the hand 51 when supporting the substrate W are the same as the normal speed SP10 and normal acceleration AC10 of the hand 51 when not supporting the substrate W. In this respect, the normal speed SP10 and normal acceleration AC10 of the hand 51 when supporting the substrate W may also be different from the normal speed SP10 and normal acceleration AC10 of the hand 51 when not supporting the substrate W.

[0174] (8) In the above embodiments and modifications, Figure 5 The bonding substrate WC shown in (c) may also have a substrate with the same thickness of peripheral portion 21 as that of main portion 23, in place of the thick-edge substrate 27.

[0175] Explanation of reference numerals in the attached figures: 1: Substrate processing device 7: Housing rack placement section IR: Transport Robot 11: Cover loading and unloading section SL1~SL25: Slots 37: Gate lifting section 38: Altitude sensor 43: Mapping Sensor 43A: Projector 43B: Photodetector 45: Sensor moving part 51: Hands 81: Control Department 83: Storage Department 91: Camera SHT: Slot Height RHT: Corrected Height CL1~CL24 (CL): Gap RCL: Correction gap LUT: Lookup Table C: Storage rack W: substrate

Claims

1. A substrate processing apparatus for processing a plurality of substrates, characterized in that, have: A receiving rack placement section for holding a receiving rack, the receiving rack having a plurality of slots arranged vertically at a predetermined interval; The substrate shape information acquisition unit acquires substrate shape information including information on the shapes of the plurality of substrates respectively housed in the plurality of slots; A handling robot has a hand capable of supporting a first substrate in a horizontal position. The robot removes the first substrate from a first slot among a plurality of slots or stores the first substrate in the first slot by moving the hand horizontally and vertically. Control Department; When the hand supporting the first substrate moves within the housing, the control unit controls the speed and acceleration of the hand in the following manner: The thickness of the first substrate is obtained using the substrate shape information; Based on the thickness, calculate the weight of the first substrate; The speed and acceleration of the hand supporting the first substrate are determined based on the weight of the first substrate. Using the determined speed and acceleration, the hand supporting the first substrate moves within the first slot.

2. The substrate processing apparatus as claimed in claim 1, characterized in that, The control unit determines the speed and acceleration of the hand in such a way that the speed and acceleration of the hand decrease as the weight of the first substrate increases.

3. The substrate processing apparatus as claimed in claim 1, characterized in that, When the hand supporting the first substrate moves within the housing, the control unit determines the speed and acceleration of the hand based on the weight of the first substrate, such that the full amplitude of the hand vibrating in the vertical direction falls within the height of the first slot.

4. The substrate processing apparatus as claimed in claim 1, characterized in that, The control unit determines the speed and acceleration of the hand based on the weight of the first substrate, such that the full amplitude of the hand vibrating in the up-down direction falls within a corrected height obtained by subtracting the thickness of the first substrate from the height of the first slot.

5. The substrate processing apparatus as claimed in claim 1, characterized in that, The control unit uses a lookup table to determine the speed and acceleration of the hand.

6. The substrate processing apparatus as claimed in claim 1, characterized in that, The substrate shape information acquisition unit is a photoelectric sensor.

7. The substrate processing apparatus as claimed in claim 1, characterized in that, The substrate shape information acquisition unit is a camera.

8. The substrate processing apparatus according to any one of claims 1 to 7, characterized in that, When the hand, which is not supported by a substrate, moves within the housing, the control unit controls the speed and acceleration of the hand in the following manner: Using the substrate shape information, the gap between the first substrate housed in the first slot and the second substrate housed in the second slot adjacent to the first slot on the lower side of the plurality of slots is obtained; When the unsupported hand moves within the housing, the speed and acceleration of the hand are determined such that the full amplitude of the hand vibrating in the vertical direction falls within the gap. Using the determined speed and acceleration, the hand that is not holding the substrate moves between the first substrate and the second substrate.

9. The substrate processing apparatus as claimed in claim 8, characterized in that, The control unit determines the speed and acceleration of the hand by ensuring that the full amplitude of the hand without a supported substrate falls within a corrected gap obtained by subtracting the thickness of the hand from the gap.

10. A substrate processing apparatus for processing a plurality of substrates, characterized in that, have: A receiving rack placement section for holding a receiving rack, the receiving rack having a plurality of slots arranged vertically at a predetermined interval; The substrate shape information acquisition unit acquires substrate shape information including information on the shapes of the plurality of substrates respectively housed in the plurality of slots; A handling robot has a hand capable of supporting a first substrate in a horizontal position. The robot removes the first substrate from a first slot among a plurality of slots or stores the first substrate in the first slot by moving the hand horizontally and vertically. Control Department; When the hand, which is not supported by a substrate, moves within the housing, the control unit controls the speed and acceleration of the hand in the following manner: Using the substrate shape information, the gap between the first substrate housed in the first slot and the second substrate housed in the second slot adjacent to the first slot on the lower side of the plurality of slots is obtained; When the unsupported hand moves within the housing, the speed and acceleration of the hand are determined such that the full amplitude of the hand vibrating in the vertical direction falls within the gap. Using the determined speed and acceleration, the hand that is not holding the substrate moves between the first substrate and the second substrate.

11. A control method for a substrate processing apparatus, wherein the substrate processing apparatus processes a plurality of substrates, characterized in that, The substrate processing apparatus includes: A receiving rack placement section for holding a receiving rack, the receiving rack having a plurality of slots arranged vertically at a predetermined interval; The substrate shape information acquisition unit acquires substrate shape information including information on the shapes of the plurality of substrates respectively housed in the plurality of slots; as well as A handling robot has a hand capable of supporting a first substrate in a horizontal position. The handling robot removes the first substrate from a first slot among a plurality of slots or stores the first substrate in the first slot by moving the hand in both horizontal and vertical directions. The control method controls the speed and acceleration of the hand supporting the first substrate as it moves within the receiving frame by the following steps: In the thickness acquisition process, the thickness of the first substrate is obtained using the substrate shape information; The weight calculation process calculates the weight of the first substrate based on the thickness. The process involves determining the speed and acceleration of the hand supporting the first substrate based on its weight. as well as In the hand movement process, the determined speed and acceleration are used to move the hand supporting the first substrate within the first slot.

12. A control method for a substrate processing apparatus, wherein the substrate processing apparatus processes a plurality of substrates, characterized in that, The substrate processing apparatus includes: A receiving rack placement section for holding a receiving rack, the receiving rack having a plurality of slots arranged vertically at a predetermined interval; The substrate shape information acquisition unit acquires substrate shape information including information on the shapes of the plurality of substrates respectively housed in the plurality of slots; as well as A handling robot has a hand capable of supporting a first substrate in a horizontal position. The handling robot removes the first substrate from a first slot among a plurality of slots or stores the first substrate in the first slot by moving the hand in both horizontal and vertical directions. The control method controls the speed and acceleration of the hand as it moves within the receiving frame without a supported substrate by the following steps: In the gap measurement process, the substrate shape information is used to obtain the gap between the first substrate housed in the first slot and the second substrate housed in the plurality of slots that is adjacent to the second slot on the lower side of the first slot. In the process of determining the hand, when the unsupported hand moves within the receiving frame, the speed and acceleration of the hand are determined such that the full amplitude of the hand vibrating in the vertical direction falls within the gap. as well as In the hand movement process, the determined speed and acceleration are used to move the hand, which is not holding the substrate, between the first substrate and the second substrate.

Images