An ultrasonic probe, an ultrasonic apparatus, and a detection method

Abstract

An ultrasonic probe, an ultrasonic device, and a detection method are disclosed. The ultrasonic probe includes: multiple transmitting transducers (1); multiple receiving transducers (2), each receiving transducer (2) including a receiving component (210) and an ultrasonic control circuit (220) electrically connected to the receiving component (210), the multiple receiving components (210) being arranged in an array; multiple scanning signal lines (S1) and multiple reading signal lines (S2), the scanning signal lines (S1) being located in the row gaps between adjacent receiving components (210), the reading signal lines (S2) being located in the column gaps between adjacent receiving components (210), multiple receiving components (210) in the same row being electrically connected to the same scanning signal line (S1) through corresponding ultrasonic control circuits (220), and multiple receiving components (210) in the same column being electrically connected to the same reading signal line (S2) through corresponding ultrasonic control circuits (220).

Description

[0001] This application is a divisional application. The original application has the application number 202180004004.5 and the original application date is December 17, 2021. The original application is entitled "An ultrasonic probe, ultrasonic device and detection method". The entire contents of the original application are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of semiconductor technology, and in particular to an ultrasonic probe, an ultrasonic device, and a detection method. Background Technology

[0003] Medical ultrasound imaging systems often use linear array probes and single-frequency scanning to acquire ultrasound images of the target. The imaging resolution of such systems is often limited by the probe's operating frequency and detection depth. Summary of the Invention

[0004] This disclosure provides an ultrasonic probe, an ultrasonic device, and a detection method. The ultrasonic probe includes: Multiple transmitting transducer units; Multiple receiving transducers, each receiving transducer including a receiving component and an ultrasonic control circuit electrically connected to the receiving component, wherein the multiple receiving components are arranged in an array; Multiple scanning signal lines and multiple readout signal lines are provided. The scanning signal lines are located in the row gaps between adjacent receiving components, and the readout signal lines are located in the column gaps between adjacent receiving components. Multiple receiving components in the same row are electrically connected to the same scanning signal line through corresponding ultrasonic control circuits, and multiple receiving components in the same column are electrically connected to the same readout signal line through corresponding ultrasonic control circuits.

[0005] In one possible implementation, the transmitting transducer unit includes: a first transmitting element that transmits a first acoustic wave signal, and a second transmitting element that transmits a second acoustic wave signal, wherein the frequency of the first acoustic wave signal is less than the frequency of the second acoustic wave signal; The receiving component includes: a first receiving element that receives a third acoustic signal fed back based on the first acoustic signal, and a second receiving element that receives a fourth acoustic signal fed back based on the second acoustic signal.

[0006] In one possible implementation, the first transmitting element and the second transmitting element are integrated in the same transmitting transducer unit; the first receiving element and the second receiving element are integrated in the same receiving transducer unit.

[0007] In one possible implementation, the transmitting transducer unit includes a first transmitting element and a plurality of second transmitting elements distributed around the first transmitting element.

[0008] In one possible implementation, the receiving component includes: a first substrate, a first electrode located on one side of the first substrate, a piezoelectric film layer located on the side of the first electrode away from the first substrate, and a second electrode located on the side of the piezoelectric film layer away from the first electrode.

[0009] In one possible implementation, the ultrasonic control circuit is located between the first substrate and the first electrode; the ultrasonic control circuit includes a first thin-film transistor electrically connected to the receiving component, and the first electrode is electrically connected to the source or drain of the first thin-film transistor.

[0010] In one possible implementation, the first electrodes of the different receiving components are independent of each other, and the second electrodes of each receiving component are an integral structure.

[0011] In one possible implementation, the plurality of transmitting transducers are arranged in an array; the distribution density of the plurality of transmitting transducers is less than the distribution density of the plurality of receiving components.

[0012] In one possible implementation, the first transmitting element and the second transmitting element are independent of each other; the first receiving element and the second receiving element are independent of each other; The first transmitting element and the first receiving element are integrated into one structure, and the second transmitting element and the second receiving element are integrated into one structure.

[0013] In one possible implementation, the receiving component includes: a second substrate, a third electrode located on one side of the second substrate, a cavity located on the side of the third electrode away from the second substrate, a diaphragm located on the side of the cavity away from the third electrode, and a fourth electrode located on the side of the diaphragm away from the cavity. The cavity of the first receiving element has a larger dimension in the direction parallel to the second substrate than the cavity of the second receiving element in the direction parallel to the second substrate.

[0014] In one possible implementation, the ultrasonic control circuit is located between the second substrate and the third electrode; The ultrasonic control circuit includes a second thin-film transistor electrically connected to the receiving component, and the third electrode is electrically connected to the source or drain of the second thin-film transistor.

[0015] In one possible implementation, the third electrodes of the different receiving components are independent of each other; the fourth electrodes of each receiving component are an integral structure.

[0016] In one possible implementation, the distribution density of the plurality of second receiving elements is greater than the distribution density of the plurality of first receiving elements.

[0017] This disclosure also provides an ultrasound device, which includes the ultrasound probe as provided in this disclosure, and a processing unit; the processing unit is electrically connected to the transmitting transducer and the receiving transducer, and is configured to provide an excitation signal to the transmitting transducer and to receive a feedback signal from the receiving transducer.

[0018] This disclosure also provides a method for detecting an ultrasonic probe as described in this disclosure, comprising: Control the transmitting transducer unit to emit ultrasonic signals; Apply the scan signal line by line to the scan signal line; The feedback signals received by each receiving component based on the ultrasonic signals are obtained by reading out the signal lines.

[0019] In one possible implementation, the control transmitter transducer unit emits an ultrasonic signal, loads the scanning signal line by line onto the scanning signal line, and acquires the feedback signals received by each receiving component based on the ultrasonic signal through the readout signal line, including: The system controls the first transmitting element to emit a first acoustic signal, loads the first scanning signal line line by line onto the scanning signal line, and obtains the third acoustic signal fed back by each of the first receiving elements based on the first acoustic signal through the readout signal line; wherein, the third acoustic signal includes the position information of the target object; The second transmitting element is controlled to emit a second acoustic signal toward the target object, and a second scanning signal is loaded line by line onto the scanning signal line. The fourth acoustic signal fed back by each second receiving element based on the second acoustic signal is obtained through the readout signal line, so as to perform imaging based on the information of the received fourth acoustic signal.

[0020] In one possible implementation, acquiring the fourth acoustic signal fed back by each of the second receiving elements based on the second acoustic signal via the readout signal line includes: The fourth acoustic signal acquired by the second receiving element is collected once at a first time interval, wherein the first time interval is less than half of the period of the fourth acoustic signal; The target object-related information is determined by acquiring multiple fourth acoustic signals at each interval of the first duration through the readout signal line, based on the second receiving element at each interval of the first duration.

[0021] In one possible implementation, determining the target object-related information includes: The coordinates of the target object are obtained using the following formula: ; Among them, T x (x) t y t , z t ) represents the center position of the transmitting transducer unit, t n For the sampling time, (x) n y n , z n ) for t n The coordinates of the receiving transducer unit that receives the signal at any given time. Attached Figure Description

[0022] Figure 1 This is a schematic diagram showing the connection relationship between the receiving transducer unit 2 and the signal lines (scanning signal lines and readout signal lines); Figure 2 This is one of the top-view schematic diagrams showing the distribution of the transmitting transducer unit and the receiving transducer unit provided in the embodiments of this disclosure; Figure 3 for Figure 2 A schematic diagram of the cross-section along the dashed line AB; Figure 4 for Figure 2 An enlarged schematic diagram of one of the transmitting transducer units; Figure 5 This is a second top view diagram showing the distribution of the transmitting and receiving transducers provided in an embodiment of this disclosure. Figure 6 This is one of the cross-sectional distribution diagrams of the transmitting transducer unit and the receiving transducer unit provided in the embodiments of this disclosure; Figure 7 This is a second cross-sectional schematic diagram of the distribution of the transmitting transducer unit and the receiving transducer unit provided in the embodiments of this disclosure; Figure 8 This is the third top view schematic diagram of the distribution of the transmitting transducer unit and the receiving transducer unit provided in the embodiments of this disclosure; Figure 9 Fourth top view of the distribution of the transmitting and receiving transducers provided in the embodiments of this disclosure; Figure 10 This is a schematic diagram of the ultrasonic testing method provided in the embodiments of this disclosure; Figure 11 This is a schematic diagram of a low-frequency ultrasound coarse scan. Figure 12 The low-frequency ultrasonic signal received by the receiving component at a certain moment (time period); Figure 13 This is a schematic diagram of high-frequency ultrasonic fine scanning; Figure 14 The high-frequency ultrasonic signal received by the receiving component at a certain moment (time period); Figure 15 A schematic diagram of multiple sampling signals from the receiving component array; Figure 16 This is a schematic diagram of target localization based on ultrasound graphics. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0024] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0025] To keep the following description of the embodiments of this disclosure clear and concise, detailed descriptions of known functions and known components are omitted.

[0026] This disclosure provides an ultrasonic probe, see [link to relevant documentation] Figures 1-5 As shown, where, Figure 1 This is a schematic diagram showing the connection relationship between the receiving transducer unit 2 and the signal lines (scanning signal lines and readout signal lines). Figure 2 This is a schematic diagram showing the distribution of a transmitting transducer unit and a receiving transducer unit. Figure 3 for Figure 2 A schematic diagram of the cross-section along the dashed line AB. Figure 4 for Figure 2 An enlarged schematic diagram of one of the transmitting transducer units. Figure 5This is a schematic diagram showing the distribution of another type of transmitting and receiving transducers. The ultrasonic probe includes: Multiple transmitting transducer units 1; Multiple receiving transducer units 2, each receiving transducer unit 2 includes a receiving component 210 and an ultrasonic control circuit 220 electrically connected to the receiving component 210, and the multiple receiving components 210 are arranged in an array. Multiple scanning signal lines S1 and multiple reading signal lines S2 are provided. The scanning signal lines S1 are located in the row gaps between adjacent receiving components 210, and the reading signal lines S2 are located in the column gaps between adjacent receiving components 210. Multiple receiving components 210 in the same row are electrically connected to the same scanning signal line S1 through corresponding ultrasonic control circuits 220, and multiple receiving components 210 in the same column are electrically connected to the same reading signal line S2 through corresponding ultrasonic control circuits 220.

[0027] In this embodiment, multiple receiving components 210 in the same row are electrically connected to the same scanning signal line S1 through corresponding ultrasonic control circuits 220, and multiple receiving components 210 in the same column are electrically connected to the same readout signal line S2 through corresponding ultrasonic control circuits 220. Compared with traditional ultrasonic probes, where each receiving component needs to be connected to an independent signal line and a large number of signal lines are required to obtain high image resolution, resulting in complex ultrasonic probe circuits and large size, the ultrasonic probe provided in this embodiment can achieve ultrasonic images with high image resolution while simplifying the ultrasonic probe circuit and thus simplifying the overall structure of the ultrasonic probe.

[0028] In one possible implementation, see Figure 2 , Figure 4 and Figure 5 As shown, the transmitting transducer unit 1 includes: a first transmitting element 11 that transmits a first acoustic signal, and a second transmitting element 12 that transmits a second acoustic signal, wherein the frequency of the first acoustic signal is lower than the frequency of the second acoustic signal; the receiving unit 210 includes: a first receiving element 21 that receives a third acoustic signal fed back based on the first acoustic signal, and a second receiving element 22 that receives a fourth acoustic signal fed back based on the second acoustic signal. Specifically, the first acoustic signal can be a low-frequency acoustic signal, for example, an acoustic signal with a frequency in the range of 1MHz to 2MHz; the second acoustic signal can be a high-frequency acoustic signal, for example, an acoustic signal with a frequency greater than 5MHz. Correspondingly, the first transmitting element 11 can be a low-frequency transmitting element, and the second transmitting element 12 can be a high-frequency transmitting element; the first receiving element 21 can be a low-frequency receiving element, and the second receiving element 22 can be a high-frequency receiving element.

[0029] In this embodiment, the transmitting transducer unit 1 includes a first transmitting element 11 that transmits a first acoustic signal and a second transmitting element 12 that transmits a second acoustic signal. The receiving component 210 includes a first receiving element 21 and a second receiving element 22. The ultrasonic probe is a high-low frequency composite structure. When performing ultrasonic detection, the target size and position are first roughly scanned by low-frequency ultrasonic waves. Based on the results of the rough scan, high-frequency ultrasonic waves are used to perform high-frequency high-resolution imaging in the local area, which is targeted and effective. Compared with the real-time sampling of the entire channel of the traditional ultrasonic probe, the ultrasonic probe provided in this embodiment can reduce the working time and power consumption of the ultrasonic probe while achieving high-resolution imaging, thus extending the service life of the ultrasonic probe.

[0030] In one possible implementation, see Figure 2 or Figure 4 As shown, the first transmitting element 11 and the second transmitting element 12 are integrated into the same transmitting transducer unit 1; the first receiving element 21 and the second receiving element 22 are integrated into the same receiving transducer unit 2.

[0031] In one possible implementation, see Figure 2 or Figure 4 As shown, the transmitting transducer unit 1 includes a first transmitting element 11 and a plurality of second transmitting elements 12, which are distributed around the first transmitting element 11. Specifically, the first transmitting element 11 can be located in the center and is made of a single piece of lead zirconate titanate piezoelectric ceramic (PZT) or perovskite polycrystalline piezoelectric ceramic ((1-x)Pb(Mg) 1 / 3 Nb 2 / 3 )O 3-x PbTiO3 (PMN-PT) piezoelectric material can be used to create a spherical shape with a diameter of up to 2λ. 低 ~5λ 低 (λ is the length of the low-frequency ultrasonic wave), achieving full-domain transmission / scanning; multiple second transmitting elements 12 are located outside the first transmitting element 11 and distributed in a ring structure. These multiple second transmitting elements 12 can be in a spherical focusing shape, or they can be a phased array structure. Through time delay control, the deflection of the focused beam can be achieved, realizing high-frequency phased focusing. Specifically, the first transmitting element 11 and the second transmitting elements 12 can be independently spaced apart, and different second transmitting elements 12 can also be independently spaced apart.

[0032] In one possible implementation, see Figure 6As shown, the receiving component 210 includes: a first substrate 211, a first electrode 212 located on one side of the first substrate 211, a piezoelectric film layer 213 located on the side of the first electrode 212 away from the first substrate 211, and a second electrode 214 located on the side of the piezoelectric film layer 213 away from the first electrode 212. Specifically, the ultrasonic control circuit 220 may be located between the first substrate 211 and the first electrode 212; the ultrasonic control circuit 220 includes a first thin-film transistor 221 electrically connected to the receiving component 210, and the first electrode 212 is electrically connected to the source 224 or drain 225 of the first thin-film transistor 221. This achieves integration of the receiving component 210 and the ultrasonic control circuit 220. Specifically, the piezoelectric film layer 213 can be made of a piezoelectric polymer material, specifically polyvinylidene fluoride (PVDF) or PVDF-TrFE copolymer. The receiving component 210 formed by this type of polymer piezoelectric film layer 213 has wideband receiving performance, and is further integrated with an ultrasonic control circuit to achieve selective sampling of ultrasonic signals. Specifically, the distance d between the centers of two adjacent first electrodes 212 in a direction parallel to the first substrate 211 can be less than half the wavelength of the sound wave. The sound velocity is chosen to be 1540 m / s, which is the sound velocity of the probe's acoustic lens material and human tissue. Since the frequency of medical ultrasound is several MHz, d is maximized when the frequency is 1 MHz, i.e., d < sound velocity / frequency = 1.5. 10 3 / 1 10 6 =1.5 10 -3 m=1.5mm, d<half wavelength=0.75mm; due to the small distance d between the centers of two adjacent first electrodes 212 in the direction parallel to the first substrate 211, a refined two-dimensional receiving array structure is realized, so as to have a high imaging image resolution.

[0033] Specifically, the ultrasonic control circuit 220 may also include other thin-film transistors and capacitors, wherein the first transistor 221 is a thin-film transistor in the ultrasonic control circuit 220 that is electrically connected to the receiving component 210; the ultrasonic probe may also include other signal lines, and the present invention is not limited thereto. Specifically, the specific circuit of the ultrasonic control circuit 220 may be the same as or similar to the structure of the pixel circuit in the display panel, or it may be the same as or similar to the circuit structure in the fingerprint recognition device.

[0034] For details, see Figure 6As shown, the first thin-film transistor 221 may specifically include a first active layer 222 located on one side of the first substrate 211, a first insulating layer 231 located on the side of the first active layer 222 away from the first substrate 211, a first gate 223 located on the side of the first insulating layer 231 away from the first active layer 222, a second insulating layer 232 located on the side of the first gate 223 away from the first insulating layer 231, a first source 224 and a first drain 225 located on the side of the second insulating layer 232 away from the first gate 223; a third insulating layer 234 may also be disposed between the first source 224 and the first electrode 212.

[0035] In one possible implementation, see Figure 6 As shown, the first electrodes 212 of different receiving components 210 are independent of each other, and the second electrodes 214 of each receiving component 210 are an integral structure.

[0036] In one possible implementation, see Figure 2 As shown, multiple transmitting transducers 1 are arranged in an array; the distribution density of multiple transmitting transducers 2 is less than the distribution density of multiple receiving components 210.

[0037] In one possible implementation, see Figure 5 As shown, the first transmitting element 11 and the second transmitting element 12 are independent of each other; the first receiving element 21 and the second receiving element 22 are independent of each other; the first transmitting element 11 and the first receiving element 21 are integrated into one structure, and the second transmitting element 12 and the second receiving element 22 are integrated into one structure. In this way, a device with an integrated transceiver transducer is realized.

[0038] Specifically, the first transmitting element 11 (first receiving element 21) can be used as a high-frequency transceiver transceiver unit, and the second transmitting element 12 (second receiving element 22) can be used as a low-frequency transceiver transceiver unit. The corresponding film thickness of the high-frequency transceiver transceiver unit and the low-frequency transceiver transceiver unit can be the same, but the diameter, side length, etc. can be different, thereby realizing the differentiation of the device operating frequency.

[0039] In one possible implementation, when the first transmitting element 11 and the first receiving element 21 are integrated, and the second transmitting element 12 and the second receiving element 22 are integrated, see [reference needed]. Figure 7As shown, the receiving component 210 includes: a second substrate 241, a third electrode 242 located on one side of the second substrate 241, a cavity 272 located on the side of the third electrode 242 away from the second substrate 241, a diaphragm 28 located on the side of the cavity 272 away from the third electrode 242, and a fourth electrode 244 located on the side of the diaphragm 28 away from the cavity; the dimension d2 of the cavity 272 of the first receiving element 21 (first transmitting element 11) in the direction parallel to the second substrate 241 is greater than the dimension d3 of the cavity 272 of the second receiving element 22 (second transmitting element 12) in the direction parallel to the second substrate 241.

[0040] Specifically, the orthographic projection shape of cavity 272 onto the second substrate 241 can be circular, such as... Figure 8 As shown; it can also be a square, such as Figure 5 As shown; it can also be a regular hexagon, such as Figure 9 As shown; among cavities 272 of the same shape, the smaller cavity 272 is the high-frequency transducer, and the larger cavity 272 is the low-frequency transducer.

[0041] In one possible implementation, see Figure 7 As shown, the ultrasonic control circuit 220 is located between the second substrate 241 and the third electrode 242; the ultrasonic control circuit 220 includes a second thin-film transistor 251 electrically connected to the receiving component, and the third electrode 242 is electrically connected to the source 254 or drain 255 of the second thin-film transistor 251. This achieves integration of the receiving component 210 and the ultrasonic control circuit 220.

[0042] Specifically, in such Figure 7 In the ultrasonic probe structure shown, the ultrasonic control circuit 220 may also include other thin-film transistors and capacitors. The second thin-film transistor 251 is a thin-film transistor in the ultrasonic control circuit 220 that is electrically connected to the receiving component 210. The ultrasonic probe may also include other signal lines; this invention is not limited thereto. Specifically, the specific circuit of the ultrasonic control circuit 220 may be the same as or similar to the structure of the pixel circuit in the display panel, or it may be the same as or similar to the circuit structure in a fingerprint recognition device.

[0043] For details, see Figure 6As shown, the second thin-film transistor 251 may specifically include a second active layer 252 located on one side of the second substrate 241, a fourth insulating layer 261 located on the side of the second active layer 252 away from the second substrate 241, a second gate 253 located on the side of the fourth insulating layer 261 away from the second active layer 252, a fifth insulating layer 262 located on the side of the second gate 253 away from the fourth insulating layer 261, a second source 254 and a second drain 255 located on the side of the fifth insulating layer 262 away from the second gate 253; a sixth insulating layer 263 may also be disposed between the second source 254 and the third electrode 242.

[0044] In one possible implementation, see Figure 7 As shown, the third electrodes 242 of different receiving components 210 are independent of each other; the fourth electrodes 244 of each receiving component 210 are an integral structure.

[0045] In one possible implementation, see Figure 5 , Figure 8 or Figure 9 As shown, the distribution density of the plurality of second receiving elements 22 is greater than the distribution density of the plurality of first receiving elements 21.

[0046] Based on the same inventive concept, this disclosure also provides an ultrasonic device, which includes an ultrasonic probe provided in this disclosure and a processing unit; the processing unit is electrically connected to a transmitting transducer unit and a receiving transducer unit, and is configured to provide an excitation signal to the transmitting transducer unit and receive a feedback signal from the receiving transducer unit.

[0047] Based on the same inventive concept, see [link to inventive concept] Figure 10 As shown in the embodiments of this disclosure, a method for detecting an ultrasonic probe as provided in the embodiments of this disclosure is also provided, comprising: Step S100: Control the transmitting transducer unit to transmit ultrasonic signals; Step S200: Apply scan signals line by line to the scan signal lines; Step S300: Obtain the feedback signals received by each receiving component based on the ultrasonic signals through the readout signal line.

[0048] In one possible implementation, the detection method provided in this disclosure, namely controlling the transmitting transducer unit to emit ultrasonic signals, loading scanning signals line by line onto the scanning signal line, and obtaining feedback signals received by each receiving component based on the ultrasonic signals through the readout signal line, may include: The system controls the first transmitting element to emit a first acoustic signal, loads the first scanning signal line line by line onto the scanning signal line, and obtains the third acoustic signal fed back by each first receiving element based on the first acoustic signal through the readout signal line; wherein, the third acoustic signal includes the position information of the target object; The system controls the second transmitting element to emit a second acoustic signal toward the target, loads the second scanning signal line line by line onto the scanning signal line, and obtains the fourth acoustic signal fed back by each second receiving element based on the second acoustic signal through the readout signal line, so as to perform imaging based on the information of the received fourth acoustic signal.

[0049] In one possible implementation, acquiring the fourth acoustic signal fed back by each of the second receiving elements based on the second acoustic signal via the readout signal line may include: The fourth acoustic signal acquired by the second receiving element is collected once every first time interval, wherein the first time interval is less than half of the period of the fourth acoustic signal; By reading out the signal line, multiple fourth acoustic signals acquired at each interval of the first time period according to each second receiving element are obtained, and relevant information about the target object is determined.

[0050] In this embodiment of the disclosure, compared with the full-channel real-time sampling of traditional two-dimensional ultrasound imaging systems, this embodiment of the disclosure will use a two-dimensional array integrated ultrasound control circuit to perform discontinuous "slice-like" sampling of the reflected ultrasound echoes, and finally achieve "ultrasound imaging" of the detection target by acquiring the "ultrasound pattern" of the signal.

[0051] Specifically, information related to determining the target object can include: obtaining the target object's coordinates using the following formula: ; Among them, T x (x) t y t , z t ) represents the center position of the transmitting transducer unit, t n For the sampling time, (x) n y n , z n ) for t n The coordinates of the receiving transducer unit that receives signals at any given time.

[0052] To better understand the detection method provided in this disclosure, the following detailed description is provided: Coarse scan: A low-frequency ultrasonic transducer emits a wide-beam scanning sound wave to quickly scan the area under test and obtain information about the size and location of the target object, as follows: Figure 11 As shown, at this time, the receiving component receives a signal at a certain moment (time period) as follows: Figure 12 As shown; Fine scan: Based on the target size and location information obtained from the coarse scan, the high-frequency ultrasonic transducer emits a focused beam at a fixed point, with a beamwidth of 2 mm to 3 mm, as follows. Figure 13 As shown, at this time, the receiving component receives a signal at a certain moment (time period) as follows: Figure 14 As shown; Echo signal acquisition: Utilizing the ultrasonic control circuit integrated in the device, at time t... 开始 ~t 结束 Within the time frame, any time point t1\t2\t3... is selected for signal integration and acquisition. The integration time is less than T / 2 (T is the period of the ultrasonic signal, the reciprocal of the frequency). Finally, based on the magnitude of the signal received by each receiving component, an ultrasonic pattern can be obtained. This pattern reflects the spatial distribution characteristics of the ultrasonic wave, but the scale of the wavefront reconstruction is affected by the size of the array elements.

[0053] Specifically, regarding the sampling method, when detecting the target object P(X,Y,Z), corresponding ultrasonic images were acquired at times t1, t2, and t3, respectively, as follows: Figure 15 As shown, r1, r2, and r3 represent the radii of the ultrasound pattern obtained. Then according to Figure 16 The geometric relationship shown can be used to solve for the coordinates (X, Y, Z) of point P. The solution formula is as follows: ; Among them, T x (x) t y t , z t ) represents the center position of the transmitting transducer unit, t n For the sampling time, (x) n y n , z n ) for t n The coordinates of the receiving transducer unit that receives signals at all times. For larger targets, imaging of the target can be achieved through mechanical / phased scanning of reflected ultrasonic beams.

[0054] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0055] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Therefore, if these modifications and variations to the embodiments of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include these modifications and variations.

Claims

1. An ultrasonic probe, wherein, include: Multiple transmitting transducers, the multiple transmitting transducers including: a first transmitting element that transmits a first acoustic wave signal, and a second transmitting element that transmits a second acoustic wave signal, wherein the frequency of the first acoustic wave signal is less than the frequency of the second acoustic wave signal; Multiple receiving transducers, each receiving transducer including a receiving component and an ultrasonic control circuit electrically connected to the receiving component, wherein the multiple receiving components are arranged in an array; the receiving transducers are used to receive a third acoustic signal fed back based on a first acoustic signal and to receive a fourth acoustic signal fed back based on a second acoustic signal. The receiving component includes: a first substrate, a first electrode located on one side of the first substrate, a piezoelectric film layer located on the side of the first electrode away from the first substrate, and a second electrode located on the side of the piezoelectric film layer away from the first electrode.

2. The ultrasonic probe as described in claim 1, wherein, The material of the piezoelectric film layer is poly(1,1-difluoroethylene) (PVDF) or PVDF-TrFE copolymer.

3. The ultrasonic probe as described in claim 1, wherein, The ultrasound probe also includes multiple scanning signal lines and multiple readout signal lines. The scanning signal lines are located in the row gaps between adjacent receiving components, and the readout signal lines are located in the column gaps between adjacent receiving components. Multiple receiving components in the same row are electrically connected to the same scanning signal line through corresponding ultrasound control circuits, and multiple receiving components in the same column are electrically connected to the same readout signal line through corresponding ultrasound control circuits.

4. The ultrasonic probe as described in claim 3, wherein, The ultrasonic control circuit is located between the first substrate and the first electrode; the ultrasonic control circuit includes a first thin-film transistor electrically connected to the receiving component, and the first electrode is electrically connected to the source or drain of the first thin-film transistor.

5. The ultrasonic probe as described in claim 1, wherein, The first electrodes of the different receiving components are independent of each other, while the second electrodes of each receiving component are an integral structure.

6. The ultrasonic probe as described in claim 1, wherein, The transmitting transducer unit includes a first transmitting element and a plurality of second transmitting elements, which are distributed around the first transmitting element.

7. The ultrasonic probe as described in claim 1, wherein, The plurality of transmitting transducers are arranged in an array; the distribution density of the plurality of transmitting transducers is less than the distribution density of the plurality of receiving components.

8. The ultrasonic probe as described in claim 1, wherein, The distance between the centers of two adjacent first electrodes in the direction parallel to the first substrate is less than half the wavelength of the received ultrasonic wave.

9. The ultrasonic probe as described in claim 1, wherein, The distance between the centers of two adjacent first electrodes in the direction parallel to the first substrate is less than 0.75 mm.

10. The ultrasonic probe as claimed in claim 1, wherein, The first transmitting element and the second transmitting element are independent of each other.

11. The ultrasonic probe as claimed in claim 1, wherein, One of the transmitting transducers covers several of the receiving transducers.

12. The ultrasonic probe as claimed in claim 1, wherein, The plurality of transmitting transducers are located on the side of the plurality of receiving transducers away from the area to be tested.

13. The ultrasonic probe as described in claim 12, wherein, The first acoustic signal emitted by the first transmitting element and the second acoustic signal emitted by the second transmitting element both pass through the receiving transducer unit to reach the area under test.

14. The ultrasonic probe according to any one of claims 1-13, wherein, The receiving component includes: a first receiving element that receives a third acoustic signal fed back based on the first acoustic signal, and a second receiving element that receives a fourth acoustic signal fed back based on the second acoustic signal; The first receiving element and the second receiving element are integrated into the same receiving transducer unit.

15. The ultrasonic probe according to any one of claims 1-13, wherein, The same receiving component is used both to receive the third acoustic signal fed back by the transducer unit based on the first acoustic signal and to receive the fourth acoustic signal fed back based on the second acoustic signal.

16. An ultrasonic probe, wherein, include: Multiple transmitting transducers, the multiple transmitting transducers including: a first transmitting element that transmits a first acoustic wave signal, and a second transmitting element that transmits a second acoustic wave signal, wherein the frequency of the first acoustic wave signal is less than the frequency of the second acoustic wave signal; Multiple receiving transducers, each receiving transducer including a receiving component and an ultrasonic control circuit electrically connected to the receiving component, wherein the multiple receiving components are arranged in an array; the receiving transducers are used to receive a third acoustic signal fed back based on a first acoustic signal and to receive a fourth acoustic signal fed back based on a second acoustic signal. The same receiving component is used both to receive the third acoustic signal fed back by the transducer unit based on the first acoustic signal and to receive the fourth acoustic signal fed back based on the second acoustic signal. In this configuration, one of the transmitting transducers covers several receiving transducers, and the transmitting transducers are located on the side of the receiving transducers away from the area to be tested. The first acoustic wave signal emitted by the first transmitting element and the second acoustic wave signal emitted by the second transmitting element both pass through the receiving transducers to reach the area to be tested.

17. An ultrasonic device, wherein, The device includes an ultrasound probe as described in any one of claims 1-16, and further includes a processing unit; the processing unit is electrically connected to the transmitting transducer and the receiving transducer, and is configured to provide an excitation signal to the transmitting transducer and to receive a feedback signal from the receiving transducer.

18. A method for detecting an ultrasonic probe as described in any one of claims 1-17, wherein, include: Control the transmitting transducer unit to emit ultrasonic signals; Apply the scan signal line by line to the scan signal line; The feedback signals received by each receiving component based on the ultrasonic signals are obtained by reading out the signal lines.

19. The detection method as described in claim 18, wherein, The control transmitter transducer unit emits ultrasonic signals, loads scanning signals line by line onto the scanning signal line, and acquires feedback signals received by each receiving component based on the ultrasonic signals through the readout signal line, including: The system controls the first transmitting element to emit a first acoustic signal, loads the first scanning signal line line by line onto the scanning signal line, and obtains the third acoustic signal fed back by each of the receiving components based on the first acoustic signal through the readout signal line; wherein, the third acoustic signal includes the position information of the target object; The second transmitting element is controlled to transmit a second acoustic signal to the target object, and a second scanning signal is loaded line by line onto the scanning signal line. The fourth acoustic signal fed back by each receiving component based on the second acoustic signal is obtained through the readout signal line, so as to perform imaging based on the information of the received fourth acoustic signal.

20. The detection method as described in claim 19, wherein, The step of acquiring the fourth acoustic signal fed back by each receiving component based on the second acoustic signal through the readout signal line includes: The fourth acoustic signal acquired by the second receiving element is collected once at a first time interval, wherein the first time interval is less than half of the period of the fourth acoustic signal; The target object-related information is determined by acquiring multiple fourth acoustic signals at each interval of the first duration through the readout signal line, based on the receiving components.

21. The detection method as described in claim 20, wherein, Determining the relevant information of the target object includes: The coordinates of the target object are obtained using the following formula: ； Among them, T x (x) t y t , z t ) represents the center position of the transmitting transducer unit, t n For the sampling time, (x) n y n , z n ) for t n The coordinates of the receiving transducer unit that receives the signal at any given time.

22. A method for detecting an ultrasonic probe as described in any one of claims 1-17, wherein, include: First, the first sound wave signal emitted by the first transmitting element is used to perform a coarse scan of the target. Based on the coarse scan results, the second transmitting element is used to transmit the second acoustic signal to perform high-frequency, high-resolution imaging in a local area.

23. The detection method of the ultrasonic probe according to claim 22, wherein, The method of using the second transmitting element to transmit the second acoustic signal for high-frequency, high-resolution imaging in a local area includes: using the second transmitting element to transmit a fixed-point focused beam.

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