Integrated microdroplet solidification device and methods of use thereof
Patent Information
- Application Number
- CN202611272550.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-08-21
- Publication Date
- 2026-10-20
AI Technical Summary
上述流程不仅操作繁琐、设备成本高,更因微滴在转移过程中暴露于非受控环境,面临温度波动、机械扰动及环境污染等多重影响,易导致微滴粒径分布变宽、成分稳定性下降,一致性与重复性难以保障,严重限制了该技术在高精度科研与高标准生产中的应用
本发明提供的一体化微滴固化装置,能够有效降低微滴制备与固化过程中的外界污染风险,保障微滴制备的洁净性;可确保固化区域温度稳定可控,提升微滴固化质量与实验重复性;显著提升装置结构的紧凑性与空间利用率,简化操作流程,便于操作人员实时监控与精准调控工艺参数;同时保障整个装置运行的稳定性与可靠性,提高微滴制备与固化的整体效率,更好地适配科研与实际应用中对微滴制备高精度、高稳定性的需求。
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Abstract
Description
Technical Field
[0001] This invention belongs to the field of bioscience and technology, specifically relating to an integrated microdroplet solidification device and its usage method. Background Technology
[0002] With the continuous development and technological upgrading of the biotechnology field, microdroplet technology, with its significant characteristics of miniaturization and high throughput, is increasingly expanding and deepening its applications in drug development, functional cosmetics development, in vitro diagnostics, food analysis, and new material preparation. High-throughput detection technology based on microdroplets enables efficient and parallel analysis of samples combined with specific reagents, significantly shortening detection time, reducing reagent and sample consumption, and significantly improving detection sensitivity and accuracy. It has become an indispensable key technology in modern biomedical research, clinical diagnosis, and related industrialization processes. Against this backdrop, the stability, consistency, and cleanliness of microdroplet products directly affect the reliability of detection results, the repeatability of the process, and the quality of the final product, thus placing higher demands on their preparation process.
[0003] Currently, conventional microdroplet preparation and solidification typically employ a step-by-step, multi-device operation mode. The microdroplet generation stage usually requires a controlled environment such as a cleanroom, primarily because microdroplets are extremely small and have a large specific surface area, making them highly susceptible to adsorbing particles or microorganisms from the environment, introducing contamination risks that can affect subsequent testing or product performance. After generation, the microdroplets must be manually or using auxiliary equipment transferred to a freezing device for cooling and solidification. This process is not only cumbersome and costly, but also exposes the microdroplets to an uncontrolled environment during transfer, subjecting them to multiple influences such as temperature fluctuations, mechanical disturbances, and environmental pollution. This can easily lead to a wider microdroplet size distribution, decreased component stability, and difficulty in ensuring consistency and repeatability, severely limiting the application of this technology in high-precision scientific research and high-standard production. Summary of the Invention
[0004] To address the shortcomings of existing technologies, this invention provides an integrated microdroplet solidification device and its usage method, aiming to improve the cleanliness, consistency, and preparation efficiency of microdroplet products, while also improving the economics of microdroplet preparation.
[0005] A first aspect of the present invention is to provide an integrated microdroplet curing device, comprising: an upper chamber and a lower chamber; the upper chamber is provided with a microdroplet generating module for generating microdroplets; the lower chamber is provided with a curing chamber and a cooling chamber arranged vertically; wherein, the curing chamber is located below the microdroplet generating module and is used to receive and cure microdroplets; the cooling chamber is located directly below the curing chamber, and the two are separated by a common thermally conductive partition, which serves as both the bottom plate of the curing chamber and the top plate of the cooling chamber; the curing chamber is provided with a container for receiving microdroplets, and the container is placed on the thermally conductive partition; the cooling chamber is also provided with a cooling device attached to the lower surface of the thermally conductive partition.
[0006] As a further optimization of the integrated microdroplet curing device, the thermally conductive partition is a metal partition. The metal partition is preferably made of aluminum, copper, or an aluminum-copper alloy.
[0007] As a further optimization of the integrated microdroplet curing device, the upper opening of the upper chamber is provided with a closable upper chamber cover.
[0008] As a further optimization of the integrated microdroplet curing device, the side of the curing chamber is equipped with a chamber opening cap that can close the curing chamber opening.
[0009] As a further optimization of the integrated microdroplet curing device, the microdroplet generation module includes a microdroplet instrument, the output end of which is connected to a microdroplet conduit extending into the curing chamber.
[0010] As a further optimization of the integrated microdroplet curing device, the upper chamber is also equipped with a test tube rack and a vent valve. The test tube rack is used to support one or more test tubes containing raw materials for microdroplet preparation. One end of the vent valve is connected to an external compressed air source, and the other end is connected to the test tubes on the test tube rack through a pipeline. The output end of the test tube is connected to the input end of the microdroplet instrument.
[0011] As a further optimization of the integrated microdroplet curing device, the end port of the microdroplet conduit is located 30mm to 45mm directly above the opening of the container.
[0012] As a further optimization of the integrated microdroplet curing device, a curing lamp for irradiating and curing microdroplets is installed on the top of the curing chamber.
[0013] As a further optimization of the integrated microdroplet curing device, the cooling device is a semiconductor cooling chip.
[0014] As a further optimization of the integrated microdroplet curing device, an electrical chamber is also provided in the lower chamber, which integrates a power supply module that supplies power to the various electrical modules in the device.
[0015] As a further optimization of the integrated microdroplet curing device, a display screen is also included. The display screen is embedded in the top area of the upper chamber cover to display real-time observation of the microdroplet generation process, display process parameters including curing temperature, and support the setting of process parameters.
[0016] A second aspect of the present invention is to provide a method of using an integrated microdroplet curing device, comprising the following steps: S1: After the device is powered on and performs a self-test, the refrigeration components in the cooling chamber are activated. S2: Open the upper chamber cover, place the test tube containing the microdroplet preparation raw materials on the test tube rack inside the upper chamber, connect the air inlet of the test tube to the vent valve, and connect the liquid outlet of the test tube to the microdroplet generation module; then close the upper chamber cover, open the vent valve and start the microdroplet generation module. S3: Set droplet generation parameters and working time; S4: The droplet generation module works according to the set parameters, generating droplets from the raw materials and introducing them into the container in the solidification chamber; S5: The heat-conducting partition is cooled by the refrigeration device, thereby cooling the container and droplets placed on it, and the curing lamp in the curing chamber is turned on to irradiate and cure the droplets; S6: After curing is complete, turn off the curing lamp and cooling device, open the cap and take out the container.
[0017] Beneficial effects The integrated microdroplet curing device provided by this invention can effectively reduce the risk of external contamination during the microdroplet preparation and curing process, ensuring the cleanliness of microdroplet preparation; it can ensure stable and controllable temperature in the curing area, improving the quality of microdroplet curing and experimental repeatability; it significantly improves the compactness and space utilization of the device structure, simplifies the operation process, and facilitates real-time monitoring and precise control of process parameters by operators; at the same time, it ensures the stability and reliability of the entire device operation, improves the overall efficiency of microdroplet preparation and curing, and better meets the needs of high precision and high stability in microdroplet preparation in scientific research and practical applications. Attached Figure Description
[0018] Figures 1 to 6 This is a schematic diagram of the integrated microdroplet curing device.
[0019] Figure 7 and Figure 8 This is a schematic diagram of the internal structure of the lower compartment.
[0020] Figure 9 This is a schematic diagram of the internal structure of the curing chamber.
[0021] Figure 10 This describes the usage method of the integrated microdroplet curing device.
[0022] In the diagram, 1. Display screen; 2. Upper chamber cover; 3. Upper chamber body; 301. Test tube rack; 302. Vent valve; 4. Lower chamber body; 5. Chamber opening seal; 6. Microdropper; 601. Microdroplet conduit; 7. Curing chamber; 701. Container; 702. Curing lamp; 8. Cooling chamber; 801. Refrigeration device; 9. Electrical chamber. Detailed Implementation
[0023] The present invention is further illustrated below with specific embodiments. These embodiments are exemplary and intended to illustrate the problem and explain the present invention, and are not intended to be limiting.
[0024] Example 1 like Figures 1 to 9 The integrated microdroplet curing device shown has an overall split structure, with an upper chamber 3 at the top and a lower chamber 4 at the bottom, which together form the main supporting structure of the device.
[0025] The upper cover 2 fits snugly over the upper opening of the upper chamber 3. Closing the upper cover 2 seals the internal space of the upper chamber 3, thereby reducing contact with outside air during droplet preparation and lowering the risk of contamination. A display screen 1 is embedded in the top area of the upper cover 2. This display screen 1 is used to show real-time observations of the droplet generation process, as well as to display and set process parameters such as cooling temperature. This allows operators to monitor the droplet preparation status in real time and precisely control temperature parameters even with the upper cover 2 closed.
[0026] Inside the upper chamber 3, there is a test tube rack 301, a vent valve 302, and a microdroplet apparatus 6. The test tube rack 301 holds one or more test tubes containing raw materials for microdroplet preparation. One end of the vent valve 302 is connected to an external compressed air source, and the other end is connected to the test tubes on the test tube rack 301 via a pipeline. The output ends of these test tubes are all connected to the input end of the microdroplet apparatus 6. The vent valve 302 is equipped with an air filter element to purify the incoming compressed air, reducing contamination of the preparation process by impurities. The microdroplet apparatus 6 is selected and configured according to the specific microdroplet preparation requirements. It is placed inside the upper chamber 3, with its input end connected to the test tubes. During operation, it continuously generates microdroplets, which flow out from its microdroplet outlet.
[0027] The lower chamber 4 is divided into three functional areas: a curing chamber 7, a cooling chamber 8, and an electrical chamber 9. The curing chamber 7 has an opening on its side and is equipped with a closable cap 5 for easy material handling. The curing chamber 7 is located directly below the microdroplet generator 6. A container 701 is placed inside the curing chamber 7. The output end of the microdroplet generator 6 is connected to a microdroplet conduit 601, which extends from the top of the curing chamber 7 into the chamber. Microdroplets generated by the microdroplet generator 6 are introduced into the container 701 through the microdroplet conduit 601. The end of the microdroplet conduit 601 is located 30mm to 45mm directly above the container 701 to prevent microdroplets from merging. A curing lamp 702, which is an ultraviolet curing lamp, is installed at the top of the curing chamber 7. This lamp emits ultraviolet light to irradiate and cure the microdroplets held in the container 701.
[0028] The cooling chamber 8 is located directly below the curing chamber 7, separated by a shared metal partition. This partition serves as both the bottom plate of the curing chamber 7 and the top plate of the cooling chamber 8, forming a highly efficient heat conduction interface. A cooling device 801, preferably a semiconductor cooling chip, is installed inside the cooling chamber 8, tightly attached to the lower surface of the metal partition. During operation, the cooling device 801 rapidly cools the metal partition to below -30°C, then efficiently and evenly dissipates heat from the curing chamber 7 through the partition, achieving precise and rapid temperature control of the curing area and providing a stable and reliable low-temperature environment for the microdroplet curing process. This structural design offers significant advantages in microdroplet preparation: First, it is compact and highly efficient in heat transfer. The curing chamber 7 and cooling chamber 8 are separated by only one metal plate, avoiding the thermal resistance caused by multi-layer structures or intermediate media, and greatly improving cooling efficiency. Second, it provides uniform temperature distribution. The excellent thermal conductivity of the metal partition allows the cooling temperature to be uniformly transferred to the bottom surface of the curing chamber 7. Placing the container 701 on the metal partition ensures that all microdroplets in the container 701 are under consistent low-temperature curing conditions. Third, it offers rapid response and precise control. The semiconductor cooling chip acts directly on the metal partition, enabling rapid temperature adjustment and facilitating the real-time maintenance of the target low-temperature environment during curing, effectively improving the quality of microdroplet curing and experimental repeatability. Fourth, this structural layout also balances space utilization and ease of operation.
[0029] The electrical compartment 9 integrates an AC-to-DC power supply module, which is responsible for converting external AC power into safe DC power and providing a stable power supply to all power-consuming modules in the device, including the display screen 1, microdroplet device 6, curing lamp 702, and refrigeration device 801, ensuring the stable operation of the entire curing device.
[0030] The method of using the above-mentioned integrated microdroplet curing device is as follows: Figure 10 As shown, it includes the following steps: S1: The device performs a self-test upon power-on, turns on the external air compressor connected to the ventilation valve 302, and starts the refrigeration device 801 inside the cooling chamber 8.
[0031] S2: After the device passes self-test, open the upper chamber cover 2, place the test tube containing the liquid required for microdroplet preparation on the test tube rack 301 inside the upper chamber 3, and connect the air inlet of the test tube to the vent valve 302 through a pipeline, and connect the liquid outlet of the test tube to the liquid inlet of the microdroplet device 6. Then, close the upper chamber cover 2, open the vent valve 302 to allow filtered compressed air to flow smoothly into the test tube, providing stable pressure for liquid flow, and then turn on the microdroplet device 6.
[0032] S3: Set the droplet generation parameters of the droplet generator 6 and the working time for this droplet preparation through the human-computer interaction interface on the display screen 1.
[0033] S4: The microdropper 6 starts working according to the set parameters, generating microdroplets from the liquid in the test tube, and introducing them into the holding dish 701 in the curing chamber 7 through the microdroplet conduit 601. After the microdroplet generation is complete, the microdropper 6 is turned off.
[0034] S5: The cooling device 801 in the cooling chamber 8 is activated, cooling the container 701 and the microdroplets inside through the shared metal partition, and the curing lamp 702 in the curing chamber 7 is turned on to irradiate and cure the microdroplets.
[0035] S6: Continue curing until the curing process is complete, then turn off the curing lamp 702 and the cooling device 801, open the cap 5 on the side of the curing chamber 7, carefully remove the container 701 containing the cured microdroplet product, and finally turn off all power.
[0036] The above embodiments are exemplary and are intended to illustrate the technical concept and features of the present invention, so that those skilled in the art can understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the scope of protection of the present invention.
Claims
1. An integrated microdroplet curing device, characterized in that, include: Upper chamber (3) and lower chamber (4); the upper chamber (3) is equipped with a droplet generation module for generating droplets; The lower chamber (4) has a solidification chamber (7) and a cooling chamber (8) arranged vertically inside; wherein, the solidification chamber (7) is located below the microdroplet generation module and is used to receive and solidify microdroplets; the cooling chamber (8) is located directly below the solidification chamber (7), and the two are separated by a common heat-conducting partition, which serves as both the bottom plate of the solidification chamber (7) and the top plate of the cooling chamber (8); The curing chamber (7) is provided with a container (701) for receiving microdroplets, and the container (701) is placed on the heat-conducting partition; the cooling chamber (8) is also provided with a cooling device (801) attached to the lower surface of the heat-conducting partition.
2. The integrated microdroplet curing device according to claim 1, characterized in that, The heat-conducting partition is a metal partition.
3. The integrated microdroplet curing device according to claim 1, characterized in that, The upper opening of the upper chamber (3) is provided with an upper chamber cover (2) that can close the opening, and / or the side of the curing chamber (7) is provided with a chamber opening cover (5) that can close the opening of the curing chamber (7).
4. The integrated microdroplet curing device according to any one of claims 1 to 3, characterized in that, The droplet generation module includes a droplet generator (6), the output end of which is connected to a droplet conduit (601) extending into the solidification chamber (7).
5. The integrated microdroplet curing device according to claim 4, characterized in that, The upper chamber (3) is also equipped with a test tube rack (301) and a vent valve (302). The test tube rack (301) is used to carry one or more test tubes containing raw materials for microdroplet preparation. One end of the vent valve (302) is connected to an external compressed air source, and the other end is connected to the test tubes on the test tube rack (301) through a pipeline. The output end of the test tube is connected to the input end of the microdroplet instrument (6).
6. The integrated microdroplet curing device according to claim 4, characterized in that, The end port of the microdroplet conduit (601) is located 30 mm to 45 mm directly above the opening of the container (701).
7. The integrated microdroplet curing device according to claim 4, characterized in that, The curing chamber (7) is equipped with a curing lamp (702) for irradiating and curing microdroplets at its inner top.
8. The integrated microdroplet curing device according to claim 4, characterized in that, The refrigeration device (801) is a semiconductor refrigeration chip.
9. The integrated microdroplet curing device according to claim 4, characterized in that, The lower compartment (4) is further provided with an electrical compartment (9), which integrates a power supply module for supplying power to each electrical module in the device; and / or The integrated microdroplet curing device also includes a display screen (1), which is embedded in the top area of the upper cover (2) to display real-time observation of the microdroplet generation process, display process parameters including curing temperature, and support the setting of process parameters.
10. The method of using the integrated microdroplet curing device according to any one of claims 1-9, characterized in that, Includes the following steps: S1: After the device is powered on and performs a self-test, the refrigeration device (801) inside the cooling chamber (8) is turned on. S2: Open the upper chamber cover (2), place the test tube containing the microdroplet preparation raw material on the test tube rack (301) inside the upper chamber body (3), connect the air inlet of the test tube to the air valve (302), and connect the liquid outlet of the test tube to the microdroplet generation module; then close the upper chamber cover (2), open the air valve (302) and start the microdroplet generation module; S3: Set droplet generation parameters and working time; S4: The droplet generation module works according to the set parameters, generating droplets from the raw materials and introducing them into the container (701) in the solidification chamber (7); S5: The heat-conducting partition is cooled by the cooling device (801), thereby cooling the container (701) and microdroplets placed on it, and the curing lamp (702) in the curing chamber (7) is turned on to irradiate and cure the microdroplets; S6: After curing is complete, turn off the curing lamp (702) and the cooling device (801), open the cap (5) and take out the container (701).
