Semiconductor heating disc welding device and welding station switching method thereof

Abstract

This invention relates to the field of welding technology, specifically to a semiconductor heating plate welding device and its welding station switching method. The device includes a welding module and a moving frame. A rotating table and a rotating sleeve are rotatably mounted on the moving frame. Multiple sets of clamping plates are provided on the rotating sleeve. Clamping components are provided on the moving frame, and the multiple sets of clamping plates synchronously approach the center of the rotating table along the radial direction of the follower plate to perform clamping actions. Alternating components are provided on the moving frame, and the multiple sets of clamping plates can alternately perform clamping actions. Through the synchronous action of the multiple sets of clamping components, the base plate and the cover plate are pushed to the center of the rotating table, forcibly ensuring their concentricity. During the welding process, the alternating components drive the two sets of clamping components to work alternately, so that at any given time, at least one set of clamping components clamps the workpiece. This completely avoids the movement path of the welding module (no clamping interference) and ensures the continuous formation of the circumferential weld, eliminating the risk of porosity and cracks at the arc initiation and extinguishing points.

Description

Technical Field

[0001] This invention relates to the field of welding technology, specifically to a semiconductor heating plate welding device and a welding station switching method thereof. Background Technology

[0002] Semiconductor heating plates are core temperature control components in semiconductor wafer fabrication equipment. Their main function is to provide a highly uniform and stable temperature field for the wafer through built-in precision resistance wires or heat conduction channels, ensuring the consistency of process reactions. Typically, heating plates are formed by vacuum brazing or laser welding of a high thermal conductivity aluminum alloy or stainless steel base plate and a cover plate with flow channels or wiring grooves. Due to the stringent requirements of semiconductor processes on wafer flatness and heat conduction uniformity, the base plate and cover plate must maintain extremely high concentricity and flatness after welding, and the weld seam must have excellent airtightness to prevent heat transfer fluid leakage or vacuum failure.

[0003] In existing manufacturing processes, the welding of the base plate and the cover plate typically employs a traditional fixture-type laser welding device. The workflow of this type of device is generally as follows: first, the base plate and the cover plate are manually stacked and initially aligned using locating pins. Then, the components are placed on the rotary table of the welding station. To prevent thermal deformation during the welding process and to ensure a tight fit, operators usually use heavy graphite blocks or metal pressure blocks to press down on the cover plate, or directly clamp it from the outside using a fixed rigid fixture.

[0004] The high temperatures generated during welding cause thermal expansion and micro-warping of the metal sheet. Traditional graphite block caps are rigid constraints and cannot provide damping force to follow the movement. They cannot effectively absorb high-frequency micro-vibrations during welding, nor can they suppress the local warping tendency of the workpiece after heating, resulting in an unstable welding interface and easy formation of undercut or lack of fusion defects. When using a clamp for holding, in order to ensure clamping stability, the clamp usually needs to cover a large arc length of the workpiece's outer circumference. When the workpiece rotates with the rotary table for circumferential welding, the clamp body will inevitably periodically block the welding head. To avoid collision with the welding torch, the equipment has to frequently start and stop, raise the welding head, or weld in sections, resulting in a large number of lap joints in the weld, which seriously weakens the vacuum sealing performance and mechanical strength of the heating plate. Summary of the Invention

[0005] The purpose of this invention is to provide a semiconductor heating plate welding device and a welding station switching method thereon, so as to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A semiconductor heating plate welding apparatus includes a chassis, in which a welding module is installed; It also includes a slide rail installed inside the chassis; a movable frame is provided on the chassis, and a slider that slides and engages with the slide rail is installed on the movable frame; and the movable frame is connected to the output end of the ejection module. A rotary table and a rotating sleeve are rotatably mounted on the movable frame; a follower plate is slidably fitted on the rotating sleeve, and multiple sets of clamping plates are provided on the follower plate; The movable frame is provided with a clamping member, which can drive the follower plate closer to the rotary table, so as to drive multiple sets of clamping plates to synchronously approach the center of the rotary table along the radial direction of the follower plate, so as to perform a clamping action. The movable frame is provided with alternating components. When the rotating sleeve drives the follower plate to rotate, multiple sets of clamping plates can move alternately along the radial direction of the follower plate to alternately perform clamping actions.

[0007] The semiconductor heating plate welding device described above: multiple sets of clamping plates form two sets of clamping assemblies, wherein the clamping plates in the two sets of clamping assemblies are alternately arranged; when the alternating member is activated, the two sets of clamping assemblies can alternately perform clamping actions.

[0008] The semiconductor heating plate welding device described above includes: a clamping member comprising multiple sets of guide rods mounted on the follower plate, wherein the multiple sets of guide rods are equidistantly arranged along the circumference of the follower plate; a movable block is slidably mounted on the guide rod; multiple sets of compression springs are sleeved on the guide rod, and the multiple sets of compression springs are respectively disposed at both ends of the movable block, wherein the two ends of the compression springs abut against the guide rod and the movable block respectively; multiple sets of radial grooves are formed on the follower plate and are equidistantly arranged along its circumference; a sliding column is mounted on the movable block and slidably engages with the radial groove; the clamping plate and the sliding column are connected by a buffer member.

[0009] The semiconductor heating plate welding device described above includes: the clamping member further includes a fixed plate mounted on the rotating sleeve, the fixed plate having a slot, a column mounted on the moving block, and a drive column mounted on the column that slides in cooperation with the slot; a cylinder and a limiting sleeve are mounted on the moving frame, and a push rod rotatably mounted on the follower plate and connected to the output end of the cylinder, the push rod slidingly engaging with the limiting sleeve.

[0010] As described above, the semiconductor heating plate welding device includes an inclined surface and a horizontal surface. During the process of the cylinder driving the follower plate closer to the rotary table, the elastic force of the compression spring will drive the moving block to move towards the center of the follower plate, so as to drive the clamping plate to perform a clamping action through the buffer. During this process, the drive column can slide on the inclined surface. When the alternating component moves, the drive column can slide back and forth on the horizontal surface, thereby driving the clamping plate to perform clamping or releasing actions.

[0011] The semiconductor heating plate welding device described above: the buffer includes an extrusion plate mounted on the slide column, a telescopic sleeve mounted on the extrusion plate, a telescopic column mounted on the clamping plate that slides and engages with the telescopic sleeve, a buffer spring provided inside the telescopic sleeve, and the two ends of the buffer spring abutting against the telescopic sleeve and the telescopic column respectively.

[0012] The semiconductor heating plate welding device described above: the alternating component includes a motor mounted on the moving frame, the output end of the motor being connected to the rotating sleeve via a belt; a drive plate is mounted on the top rod, and a roller that rolls with the outer surface of the drive plate is rotatably mounted on the column.

[0013] The semiconductor heating plate welding device described above: the outer surface of the drive plate includes multiple sets of sequentially connected proximal surfaces, expansion surfaces, and distal surfaces; and a stepped surface is provided between the proximal surface and the distal surface; wherein when the roller engages with the proximal surface, the drive column is located at the end of the horizontal plane near the top rod; when the roller engages with the distal surface, the drive column is located at the end of the horizontal plane away from the top rod; when the roller rolls on the expansion surface, the drive column moves from the end near the top rod to the end away from the top rod, thereby driving the clamping plate to perform a release action; during the process of the roller moving from the distal surface to the proximal surface, the roller crosses the stepped surface, and the drive column moves from the end away from the top rod to the end near the top rod to perform a clamping action.

[0014] In the semiconductor heating plate welding apparatus described above: when one of the rollers moves to the junction of the proximal surface and the expansion surface, the adjacent rollers cross the stepped surface from the distal surface to the proximal surface.

[0015] A welding station switching method, using the aforementioned semiconductor heating plate welding device, includes the following steps: Step 1: Place the parts to be welded into the machine. The ejector module pushes the moving frame out of the machine housing so that the rotary table is exposed. After the parts are stacked, the ejector module drives the moving frame to reset so that the parts are moved to the welding station. Step 2: Drive the clamping component to move, thereby driving the clamping plate to move synchronously towards the center, so as to clamp the outer periphery of the part in a synchronous manner, so as to complete the centering and clamping of the part. Step 3: Weld the parts using the welding module. During the welding process, the alternating component drives the rotating sleeve to rotate, which in turn drives the parts and the rotary table to rotate through the clamping component, so as to change different welding positions. The alternating component can drive multiple sets of clamping components to alternately clamp the parts, thereby avoiding the welding module. Step 4: After welding is completed, the moving frame is pushed out of the chassis through the ejector module, and the parts are released to facilitate the replacement of the next set of parts.

[0016] Compared with the prior art, the beneficial effects of the present invention are: 1. By synchronously operating multiple sets of clamping components, multiple sets of clamping plates move synchronously towards the center. At the moment of clamping, the base plate and the cover plate are pushed to the center of the rotary table at the same time, which forces the concentricity of the two to be guaranteed, reduces the cumulative error caused by clamping, and avoids defects such as edge biting and incomplete fusion caused by eccentricity. 2. During the welding process, the alternating component drives the two sets of clamping components to work alternately, so that at any time at least one set of clamping components clamps the workpiece. This not only completely avoids the movement path of the welding module (no clamping interference), but also ensures the continuous formation of the circumferential weld, eliminating the risk of porosity and cracks at the arc initiation and extinguishing points. Attached Figure Description

[0017] Figure 1 A schematic diagram of a semiconductor heating plate welding device; Figure 2 This is a schematic diagram of the moving frame in a semiconductor heating plate welding device. Figure 3 This is a schematic diagram of the follower plate in a semiconductor heating plate welding device. Figure 4 A cross-sectional view of the semiconductor heating plate welding device; Figure 5 for Figure 4 Schematic diagram of the structure at point A; Figure 6 for Figure 4 Schematic diagram of the structure at point B; Figure 7 This is a schematic diagram of the push rod in a semiconductor heating plate welding device. Figure 8 This is a schematic diagram of the drive disk in a semiconductor heating plate welding device. Figure 9 This is a schematic diagram of the clamping plate in a semiconductor heating plate welding device. Figure 10 This is a schematic diagram of the moving block in a semiconductor heating plate welding device.

[0018] In the diagram: 1. Chassis; 101. Slide rail; 2. Welding module; 3. Moving frame; 301. Slider; 302. Limiting sleeve; 4. Rotary table; 5. Rotate the sleeve; 6. Follower plate; 601. Radial groove; 7. Top rod; 8. Drive plate; 801. Proximal surface; 802. Expanding surface; 803. Distal surface; 9. Guide rod; 10. Moving block; 1001. Sliding bar; 11. Compression spring; 12. Extrusion plate; 1201. Telescopic sleeve; 13. Clamping plate; 1301. Telescopic column; 14. Buffer spring; 15. Column; 1501. Roller; 1502. Drive column; 16. Fixed plate; 1601. Inclined surface; 1602. Horizontal surface; 17. Cylinder; 18. Electric motor. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Furthermore, elements in this invention are referred to as being "fixed to" or "set on" another element, which may be directly on the other element or may also include an intervening element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or may also include an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementations.

[0021] Please see Figures 1-10 As an embodiment of the present invention, a semiconductor heating plate welding device includes a chassis 1, wherein a welding module 2 is installed inside the chassis 1; It also includes a slide rail 101 installed inside the chassis 1; a movable frame 3 is provided on the chassis 1, and a slider 301 that slides and engages with the slide rail 101 is installed on the movable frame 3; and the movable frame 3 is connected to the output end of the ejection module. A rotating platform 4 and a rotating sleeve 5 are rotatably mounted on the movable frame 3; a follower plate 6 is slidably fitted on the rotating sleeve 5, and multiple sets of clamping plates 13 are provided on the follower plate 6. The movable frame 3 is provided with a clamping member, which can drive the follower plate 6 to approach the rotary table 4, so as to drive multiple sets of clamping plates 13 to synchronously approach the center of the rotary table 4 along the radial direction of the follower plate 6, so as to perform a clamping action. The movable frame 3 is provided with an alternating component. When the rotating sleeve 5 drives the follower plate 6 to rotate, multiple sets of clamping plates 13 can move alternately along the radial direction of the follower plate 6 to alternately perform clamping actions.

[0022] As a further embodiment of the present invention, multiple sets of clamping plates 13 form two sets of clamping assemblies, wherein the clamping plates 13 in the two sets of clamping assemblies are alternately arranged; when the alternating member is activated, the two sets of clamping assemblies can alternately perform clamping actions.

[0023] In this embodiment, the moving frame 3 is ejected from the housing 1 by the ejection module so that the rotary table 4 is exposed from the housing 1; after the parts are stacked (base plate at the bottom, cover plate at the top), the moving frame 3 is reset by the ejection module so that the parts are moved to the welding station. The driving clamping component moves, thereby driving the clamping plate 13 to move synchronously towards the center, so as to clamp the outer periphery of the part in a synchronous manner, thus completing the centering and clamping of the part; during the clamping process, multiple sets of clamping plates 13 can synchronously position and clamp the base plate and the cover plate, which can effectively reduce the difficulty of centering and maintain the concentricity of the base plate and the cover plate during welding, thereby improving the welding quality and accuracy.

[0024] The parts are welded by the welding module 2. During the welding process, the rotating sleeve 5 is driven to rotate by the alternating component, which in turn drives the parts and the rotating table 4 to rotate through the clamping component, so as to change different welding positions. The alternating component can drive multiple sets of clamping components to clamp the parts alternately, thereby avoiding the welding module 2 and preventing the clamping plate 13 from affecting the welding efficiency of the welding module 2.

[0025] After welding is completed, the moving frame 3 is pushed out of the housing 1 by the ejection module, and the parts are released, making it convenient to replace the next set of parts.

[0026] During the clamping process, multiple clamping components perform clamping actions synchronously, which improves the uniformity of force applied to the cover plate and the base plate, avoids minor misalignment caused by unilateral force, and ensures that the two maintain a very high degree of concentricity throughout the welding process. During the welding process, multiple clamping components are driven by alternating parts to perform clamping actions alternately, realizing dynamic closed-loop management of clamping force during the welding process. That is, at any time, the workpiece is in an effective clamping state in the circumferential direction, which not only avoids physical interference of the fixture with the welding module 2 and ensures the continuous formation of the circumferential weld, but also effectively suppresses the warping tendency of the workpiece caused by heat deformation through the continuous circumferential friction torque.

[0027] As a further embodiment of the present invention, the clamping member includes multiple sets of guide rods 9 mounted on the follower plate 6, and the multiple sets of guide rods 9 are equidistantly arranged along the circumference of the follower plate 6; a moving block 10 is slidably mounted on the guide rod 9, and multiple sets of compression springs 11 are sleeved on the guide rod 9, and the multiple sets of compression springs 11 are respectively disposed at both ends of the moving block 10, and the two ends of the compression springs 11 respectively abut against the guide rod 9 and the moving block 10; multiple sets of radial grooves 601 are formed on the follower plate 6 and are equidistantly arranged along its circumference; a sliding column 1001 is mounted on the moving block 10 and slidably engaged with the radial groove 601; the clamping plate 13 and the sliding column 1001 are connected by a buffer member.

[0028] In this embodiment, in the initial state, the compression spring 11 away from the center of the follower plate 6 is in a compressed state, and the compression spring 11 close to the center is in a stretched state.

[0029] As the follower plate 6 slides outward within the rotating sleeve 5, the elastic force of the compression spring 11, which is far from the center, drives the moving block 10 to move towards the center on the guide rod 9, thereby compressing another compression spring 11. During the movement, the moving block 10 drives the sliding column 1001 to slide in the radial groove 601, thereby causing the clamping plates 13 to move closer together through the buffer to clamp the base plate and the cover plate. Since multiple sets of clamping plates 13 move synchronously, the base plate and the cover plate can be pushed to the center of the rotating table 4 (the three remain concentric). At the same time, during the clamping process, multiple sets of clamping components perform clamping actions synchronously, which improves the uniformity of force applied to the cover plate and the base plate, avoids minor misalignment caused by unilateral force, and ensures that the two maintain a very high degree of concentricity throughout the welding process.

[0030] The compression springs 11 on both sides of the moving block 10 can effectively improve the damping of the device, effectively absorb the high-frequency micro-vibration during welding, prevent the clamping plate 13 from generating micro-friction at the contact interface with the workpiece, and further ensure the welding stability.

[0031] As a further embodiment of the present invention, the clamping member further includes a fixing plate 16 mounted on the rotating sleeve 5, the fixing plate 16 having a slot, a column 15 mounted on the moving block 10, and a drive column 1502 mounted on the column 15 that slides with the slot; a cylinder 17 and a limiting sleeve 302 are mounted on the moving frame 3, and a push rod 7 connected to the output end of the cylinder 17 is rotatably mounted on the follower plate 6, the push rod 7 slidingly engaging with the limiting sleeve 302.

[0032] As a further embodiment of the present invention, the slot includes an inclined surface 1601 and a horizontal surface 1602; during the process of the cylinder 17 driving the follower plate 6 to approach the rotary table 4, the elastic force of the compression spring 11 will drive the moving block 10 to move towards the center of the follower plate 6, so as to drive the clamping plate 13 to perform a clamping action through the buffer member. During this process, the drive column 1502 can slide on the inclined surface 1601. When the alternating member is in motion, the drive column 1502 can slide back and forth on the horizontal plane 1602, thereby driving the clamping plate 13 to perform clamping or releasing actions.

[0033] In this embodiment, during the process of the cylinder 17 driving the push rod 7 to extend, the push rod 7 slides in the limiting sleeve 302 toward the rotary table 4, thereby pushing the follower plate 6 to move synchronously.

[0034] During this process, under the elastic force of the compression spring 11 away from the center, the drive column 1502 remains in contact with the inclined plane 1601 and slides on the inclined plane 1601 in the horizontal direction, thereby causing the moving block 10 to move towards the center. This causes the clamping plate 13 to move towards the center synchronously through the buffer, thereby performing clamping and centering actions to ensure the concentricity of the base plate and the cover plate. Furthermore, the clamping of the two effectively reduces the impact of vibration and thermal deformation on welding quality and precision during the welding process.

[0035] When the alternating component moves, it can drive the moving block 10 to move back and forth on the guide rod 9. During this process, the drive column 1502 slides back and forth on the horizontal plane, thereby realizing that multiple sets of clamping components alternately perform clamping actions. This not only avoids the physical interference of the fixture with the welding module 2 and ensures the continuous forming of the circumferential weld, but also effectively suppresses the warping tendency of the workpiece caused by heat deformation through the continuous circumferential friction torque.

[0036] As a further embodiment of the present invention, the buffer includes a compression plate 12 mounted on the sliding column 1001, a telescopic sleeve 1201 mounted on the compression plate 12, a telescopic column 1301 mounted on the clamping plate 13 that slides and engages with the telescopic sleeve 1201, and a buffer spring 14 disposed inside the telescopic sleeve 1201, with both ends of the buffer spring 14 abutting against the telescopic sleeve 1201 and the telescopic column 1301 respectively.

[0037] In this embodiment, as the moving block 10 moves toward the center, it drives the clamping plate 13 to move synchronously through the squeezing plate 12 and the buffer spring 14. When the clamping plate 13 contacts the base plate and the cover plate, the squeezing plate 12, which continues to move, will compress the buffer spring 14, and the telescopic column 1301 will slide inward within the telescopic sleeve 1201.

[0038] The elastic force of the buffer spring 14 ensures that each clamping plate 13 can fit tightly against the workpiece surface without forcing the workpiece to undergo plastic deformation to adapt to the fixture. This not only improves the uniformity of force application but also effectively absorbs high-frequency micro-vibrations and thermal expansion displacement during the welding process, ensuring that the base plate and cover plate maintain extremely high concentricity and stability throughout the entire welding cycle.

[0039] As a further embodiment of the present invention, the alternating component includes a motor 18 mounted on the movable frame 3, the output end of the motor 18 being connected to the rotating sleeve 5 via a belt; a drive disc 8 is mounted on the top rod 7, and a roller 1501 that rolls with the outer surface of the drive disc 8 is rotatably mounted on the column 15.

[0040] As a further embodiment of the present invention, the outer surface of the drive disk 8 includes multiple sets of sequentially connected proximal surfaces 801, expansion surfaces 802, and distal surfaces 803; and a stepped surface is provided between the proximal surface 801 and the distal surface 803; wherein when the roller 1501 engages with the proximal surface 801, the drive column 1502 is located at one end of the horizontal surface 1602 near the top rod 7; when the roller 1501 engages with the distal surface 803, the drive column 1502 is located at the horizontal surface 1602. At the end away from the top rod 7; when the roller 1501 rolls on the expansion surface 802, the drive column 1502 moves from the end near the top rod 7 to the end away from the top rod 7, thereby driving the clamping plate 13 to perform a release action. During the process of the roller 1501 moving from the distal surface 803 to the proximal surface 801, the roller 1501 crosses the stepped surface, and the drive column 1502 moves from the end away from the top rod 7 to the end near the top rod 7 to perform a clamping action.

[0041] In this embodiment, during the welding process, the motor 18 drives the rotating sleeve 5 to rotate via a belt, thereby causing the follower plate 6 to rotate. This applies rotational force to the base plate and cover plate through the clamping member, thereby driving the rotary table 4 to rotate and achieving all-round contact between the outer periphery of the base plate and cover plate and the welding module 2.

[0042] After the follower plate 6 slides down until the drive column 1502 contacts the horizontal surface 1602, it stops sliding. At this time, the rollers 1501 on the multiple sets of columns 15 all abut against the proximal surface 801, thereby realizing that multiple sets of clamping components can simultaneously clamp and center the base plate and the cover plate.

[0043] When the follower plate 6 rotates, it will drive the column 15 and the roller 1501 on it to rotate synchronously and roll relative to each other along the outer contour curve of the drive plate 8. Since the drive plate 8 is fixed (the top rod 7 is restricted by the limiting sleeve 302), the relative movement of the roller 1501 and the contour of the drive plate 8 causes the moving block 10 to move back and forth.

[0044] When the roller 1501 rolls from the proximal surface 801 through the expansion surface 802 to the distal surface 803, the roller 1501 is radially pushed apart, forcing the column 15 to move the moving block 10 and the drive column 1502 along the horizontal plane 1602 away from the axis. This causes the pressing plate 12 to move, which in turn moves the clamping plate 13 through the buffer. During this process, the spring force of the buffer spring 14 decreases, performing a release action to avoid the welding module 2 and clear the welding channel. Conversely, when the roller 1501 rolls down the stepped surface from the distal surface 803 back to the proximal surface 801, the roller 1501 is radially retracted, and the drive column 1502 moves along the horizontal plane 1602 closer to the axis under the action of the pressing spring 11, causing the clamping plate 13 to be radially pushed forward, performing a clamping action.

[0045] By alternating multiple sets of clamping components, welding module 2 can act on the workpiece surface at any rotation angle, achieving continuous welding without dead angles. This not only eliminates the difference in microstructure and properties in the weld lap area, but also avoids the risk of porosity and cracks caused by frequent arc starting and extinguishing, improving the airtightness and mechanical properties of the weld. This is crucial for the vacuum sealing and heat conduction uniformity required by the semiconductor heating plate, and effectively suppresses workpiece chatter and eccentricity. It can control concentricity fluctuations throughout the welding process, avoiding stubborn problems such as undercut and incomplete fusion caused by workpiece displacement.

[0046] As a further embodiment of the present invention, when one of the rollers 1501 moves to the connection between the proximal surface 801 and the expansion surface 802, the adjacent roller 1501 moves from the distal surface 803 across the stepped surface to the proximal surface 801.

[0047] In this embodiment, taking two adjacent rollers 1501 as an example, during the clamping process, the two rollers 1501 respectively abut against two adjacent proximal surfaces 801, one of which is close to the connection between the proximal surface 801 and the expansion surface 802, and the other is close to the step surface; at this time, both sets of clamping components perform clamping actions, which can effectively improve the clamping force and positioning capability.

[0048] During the rotation of the follower plate 6, a roller 1501 rolls onto the expansion surface 802, causing the moving block 10 to move away from the axis (until it rolls onto the distal surface 803), thereby separating the clamping plate 13 connected to it from the base plate and the cover plate, realizing the release action, thus avoiding the welding module 2.

[0049] Meanwhile, another set of rollers 1501 rolls on the proximal surface 801, and the clamping plate 13 connected to it always remains in a clamping state. When one roller 1501 rolls from the distal surface 803 to the proximal surface 801, the other roller 1501 rolls to the junction of the proximal surface 801 and the expansion surface 802.

[0050] Therefore, during the welding process, a clamping component performs a clamping action at any given moment, avoiding the risk of momentary instability that may occur during alternating clamping. As the workpiece rotates and engages with the welding module 2, it is always subject to rigid constraints in at least one direction, effectively suppressing radial runout and circumferential slippage. This improves the control of concentricity fluctuations during welding, providing mechanical assurance for the high-precision sealing weld of the semiconductor heating plate.

[0051] After welding is completed, the follower plate 6 is reset by the cylinder 17. During the reset process, the moving block 10 is moved away from the axis by the squeezing action of the drive column 1502 and the inclined surface 1601, so that multiple clamping components can perform release actions synchronously.

[0052] A welding station switching method, using the aforementioned semiconductor heating plate welding device, includes the following steps: Step 1: Place the parts to be welded and push the moving frame 3 out of the housing 1 through the ejection module so that the rotary table 4 is exposed in the housing 1; after the parts are stacked, the moving frame 3 is reset through the ejection module so that the parts are moved to the welding station. Step 2: Drive the clamping component to move, thereby driving the clamping plate 13 to move synchronously towards the center, so as to clamp the outer periphery of the part synchronously, so as to complete the centering and clamping of the part. Step 3: Weld the parts through welding module 2. During the welding process, the alternating component drives the rotating sleeve 5 to rotate, thereby driving the parts and the rotating table 4 to rotate through the clamping component, so as to change different welding positions. The alternating component can drive multiple sets of clamping components to alternately clamp the parts, thereby avoiding the welding module 2. Step 4: After welding is completed, the moving frame 3 is pushed out of the housing 1 through the ejection module, and the parts are released to facilitate the replacement of the next set of parts.

[0053] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0054] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor heating plate welding apparatus, characterized in that, Includes a chassis, within which a welding module is installed; It also includes a slide rail installed inside the chassis; a movable frame is provided on the chassis, and a slider that slides and engages with the slide rail is installed on the movable frame; and the movable frame is connected to the output end of the ejection module. A rotary table and a rotating sleeve are rotatably mounted on the movable frame; a follower plate is slidably fitted on the rotating sleeve, and multiple sets of clamping plates are provided on the follower plate; The movable frame is provided with a clamping member, which can drive the follower plate closer to the rotary table, so as to drive multiple sets of clamping plates to synchronously approach the center of the rotary table along the radial direction of the follower plate, so as to perform a clamping action. The movable frame is provided with alternating components. When the rotating sleeve drives the follower plate to rotate, multiple sets of clamping plates can move alternately along the radial direction of the follower plate to alternately perform clamping actions.

2. The semiconductor heating plate welding apparatus according to claim 1, characterized in that, The multiple sets of clamping plates form two sets of clamping assemblies, wherein the clamping plates in the two sets of clamping assemblies are alternately arranged; when the alternating member is activated, the two sets of clamping assemblies can alternately perform clamping actions.

3. The semiconductor heating plate welding apparatus according to claim 2, characterized in that, The clamping component includes multiple sets of guide rods mounted on the follower plate, with the multiple sets of guide rods equidistantly arranged along the circumference of the follower plate; a movable block is slidably mounted on the guide rod, and multiple sets of compression springs are sleeved on the guide rod, with the multiple sets of compression springs respectively disposed at both ends of the movable block, and the two ends of the compression springs respectively abutting against the guide rod and the movable block; multiple sets of radial grooves are formed on the follower plate, with radial grooves equidistantly arranged along its circumference, and a sliding column is mounted on the movable block that slidably engages with the radial groove; the clamping plate and the sliding column are connected by a buffer component.

4. The semiconductor heating plate welding apparatus according to claim 3, characterized in that, The clamping component also includes a fixing plate mounted on the rotating sleeve, the fixing plate having a slot, a column mounted on the moving block, and a drive column mounted on the column that slides in cooperation with the slot; a cylinder and a limiting sleeve are mounted on the moving frame, and a push rod connected to the output end of the cylinder is rotatably mounted on the follower plate, the push rod slidingly engaging with the limiting sleeve.

5. The semiconductor heating plate welding apparatus according to claim 4, characterized in that, The slot includes an inclined surface and a horizontal surface; during the process of the cylinder driving the follower plate closer to the rotary table, the elastic force of the compression spring will drive the moving block to move towards the center of the follower plate, so as to drive the clamping plate to perform a clamping action through the buffer. During this process, the drive column can slide on the inclined surface. When the alternating component moves, the drive column can slide back and forth on the horizontal surface, thereby driving the clamping plate to perform clamping or releasing actions.

6. The semiconductor heating plate welding apparatus according to claim 5, characterized in that, The buffer includes a compression plate mounted on the sliding column, a telescopic sleeve mounted on the compression plate, a telescopic column mounted on the clamping plate that slides and engages with the telescopic sleeve, and a buffer spring disposed inside the telescopic sleeve, with both ends of the buffer spring abutting against the telescopic sleeve and the telescopic column, respectively.

7. A semiconductor heating plate welding apparatus according to claim 6, characterized in that, The alternating component includes a motor mounted on the movable frame, the output end of the motor being connected to the rotating sleeve via a belt; a drive disc is mounted on the top rod, and a roller that rolls with the outer surface of the drive disc is rotatably mounted on the column.

8. A semiconductor heating plate welding apparatus according to claim 7, characterized in that, The outer surface of the drive disc includes multiple sets of sequentially connected proximal surfaces, expansion surfaces, and distal surfaces; and a stepped surface is provided between the proximal surface and the distal surface; when the roller engages with the proximal surface, the drive column is located at the end of the horizontal plane closer to the top rod; when the roller engages with the distal surface, the drive column is located at the end of the horizontal plane away from the top rod; when the roller rolls on the expansion surface, the drive column moves from the end closer to the top rod to the end away from the top rod, thereby driving the clamping plate to perform a release action; during the process of the roller moving from the distal surface to the proximal surface, the roller crosses the stepped surface, and the drive column moves from the end away from the top rod to the end closer to the top rod to perform a clamping action.

9. A semiconductor heating plate welding apparatus according to claim 8, characterized in that, When one of the rollers moves to the junction of the proximal surface and the expansion surface, the adjacent roller moves from the distal surface across the stepped surface to the proximal surface.

10. A welding station switching method, employing the semiconductor heating plate welding apparatus as described in any one of claims 1-9, characterized in that, Includes the following steps: Step 1: Place the parts to be welded into the machine. The ejector module pushes the moving frame out of the machine housing so that the rotary table is exposed. After the parts are stacked, the ejector module drives the moving frame to reset so that the parts are moved to the welding station. Step 2: Drive the clamping component to move, thereby driving the clamping plate to move synchronously towards the center, so as to clamp the outer periphery of the part in a synchronous manner, so as to complete the centering and clamping of the part. Step 3: Weld the parts using the welding module. During the welding process, the alternating component drives the rotating sleeve to rotate, which in turn drives the parts and the rotary table to rotate through the clamping component, so as to change different welding positions. The alternating component can drive multiple sets of clamping components to alternately clamp the parts, thereby avoiding the welding module. Step 4: After welding is completed, the moving frame is pushed out of the chassis through the ejector module, and the parts are released to facilitate the replacement of the next set of parts.

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