Silicon steel sheet processing method, device, apparatus, medium, and program product

Abstract

This disclosure provides a method, apparatus, equipment, medium, and program product for processing silicon steel sheets, relating to the field of transformer technology. The method includes: obtaining the current position of a silicon steel sheet roll; identifying the sheet type of at least one silicon steel sheet to be processed to obtain a first number of action points, wherein each action point corresponds to a cutting tool; calculating the distance between each of the first number of action points and its corresponding cutting tool; comparing each distance, and determining the action point with the shortest distance as the action point to be executed. According to embodiments of this disclosure, it can adapt to the processing needs of silicon steel sheets of different specifications and types, reducing the need to develop dedicated programs for new sheet types and improving the production line's ability to handle diversified products.

Description

Technical Field

[0001] This disclosure relates to the field of transformer technology, and in particular to a method, apparatus, equipment, medium, and process product for processing silicon steel sheets. Background Technology

[0002] Silicon steel sheets are a key material for the core of power transformers. Currently, in the production process of silicon steel sheet cross-cutting lines, the sequence of cutting and punching, the position of the punches on the sheets, and the coordination of feeding all require precise calculations to ensure that each silicon steel sheet meets the design standards. Any error in this process may result in unusable finished products.

[0003] In related technologies, a separate program is usually required to control the production process of each silicon steel sheet of a specific shape. Whenever there is a demand for new models or specifications of silicon steel sheets, a new production program needs to be developed, which increases the complexity and time cost of production and also reduces the flexibility of the production line.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] This disclosure provides a method, apparatus, equipment, medium, and procedure for processing silicon steel sheets, which at least to some extent improves the problem of insufficient flexibility in current silicon steel sheet processing solutions.

[0006] Other features and advantages of this disclosure will become apparent from the following detailed description, or may be learned in part from practice of this disclosure.

[0007] According to one aspect of this disclosure, a method for processing silicon steel sheets is provided, comprising:

[0008] Get the current position of the silicon steel sheet roll;

[0009] The shape of at least one silicon steel sheet to be processed is identified to obtain a first number of action points, wherein each action point corresponds to a tool.

[0010] Calculate the distance between each of the first number of action points and the corresponding tool;

[0011] Compare each distance and determine the action point with the shortest distance as the action point to be executed.

[0012] According to another aspect of this disclosure, a silicon steel sheet processing apparatus is provided, comprising:

[0013] The location acquisition module is used to obtain the current position of the silicon steel sheet roll;

[0014] The sheet type recognition module is used to identify the sheet type of at least one silicon steel sheet to be processed and obtain a first number of action points, wherein each action point corresponds to a tool.

[0015] The calculation module is used to calculate the distance between each action point and the corresponding tool in the first number of action points;

[0016] The comparison module is used to compare each distance and determine the action point with the shortest distance as the action point to be executed.

[0017] According to another aspect of this disclosure, an electronic device is provided, comprising: a memory for storing instructions; and a processor for calling the instructions stored in the memory to implement the above-described silicon steel sheet processing method.

[0018] According to another aspect of this disclosure, a computer-readable storage medium is provided that stores computer instructions thereon, which, when executed by a processor, implement the above-described silicon steel sheet processing method.

[0019] According to another aspect of this disclosure, a computer program product is provided, which stores instructions that, when executed by a computer, cause the computer to perform the above-described silicon steel sheet processing method.

[0020] According to yet another aspect of this disclosure, a chip is provided, including at least one processor and an interface;

[0021] An interface is used to provide program instructions or data to at least one processor;

[0022] At least one processor is used to execute program instructions to implement the silicon steel sheet processing method described above.

[0023] The silicon steel sheet processing method, apparatus, equipment, medium, and program products provided in this disclosure can calculate the distance between each action point and the corresponding tool based on the current position of the silicon steel sheet, and compare these distances to determine the execution action point under the shortest path. This is more flexible than the traditional method that requires writing specific programs for each type of sheet, and can adapt to the processing needs of silicon steel sheets of different specifications and types more quickly. It reduces the need to develop special programs for new sheet types and improves the production line's ability to cope with diversified products.

[0024] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0026] Obviously, the accompanying drawings described below are merely some embodiments of this disclosure. Those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0027] Figure 1 This diagram illustrates a process flow chart for processing silicon steel sheets according to an embodiment of the present disclosure.

[0028] Figure 2 A schematic diagram of the sheet type of a silicon steel sheet is shown in an embodiment of this disclosure;

[0029] Figure 3 This diagram illustrates a flowchart of determining the action point based on distance in an embodiment of this disclosure.

[0030] Figure 4 This diagram illustrates the silicon steel sheet processing procedure in an embodiment of the present disclosure.

[0031] Figure 5 This diagram illustrates a distance calculation flowchart in an embodiment of the present disclosure.

[0032] Figure 6 This diagram illustrates various preset elements in embodiments of the present disclosure;

[0033] Figure 7 This invention discloses schematic diagrams of various cutting tools in embodiments thereof;

[0034] Figure 8 This diagram illustrates a silicon steel sheet processing apparatus according to an embodiment of the present disclosure;

[0035] Figure 9 A structural block diagram of an electronic device according to an embodiment of the present disclosure is shown. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this disclosure, and not all of them. The components of the embodiments of this disclosure described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this disclosure provided in the accompanying drawings is not intended to limit the scope of the claimed disclosure, but merely represents selected embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without inventive effort are within the scope of protection of this disclosure.

[0037] A silicon steel sheet cross-cutting line is used to produce silicon steel sheets and mainly includes an uncoiling and feeding mechanism, a main conveyor, a punching mechanism, a punching moving mechanism, and a material handling mechanism. The silicon steel sheet cross-cutting line processes coiled silicon steel sheets into specific sheet shapes through punching and shearing actions after uncoiling. During operation, the main conveyor shaft rollers press down, and the static friction generated by the rollers and the silicon steel coil causes the coil to move back and forth within the track. Once it reaches the designated position, the punching mechanism performs punching, V-cutting, and cutting actions.

[0038] In related technologies, a common programming approach is to write a corresponding program for each type of wafer according to customer requirements. During production, the customer selects the corresponding wafer type, calls the corresponding program, and arranges the subsequent actions of the equipment based on the parameters corresponding to that wafer type. This approach has the following problems:

[0039] 1. A corresponding program needs to be developed for each type of screen. Initially, only a dozen or so screen types may be developed. When customers require new screen types, the program developers need to develop them again, which takes a long time.

[0040] 2. All processing points need to be listed. When processing a large number of wafers at once, it will consume a lot of register resources.

[0041] 3. Listing the locations takes a long time, which affects production efficiency;

[0042] 4. If an abnormality occurs during production and the machine is stopped, production cannot resume from where it left off when production resumes.

[0043] The silicon steel sheet processing solution provided in this disclosure can at least solve one of the above problems. The defects of the above solutions and the proposed solutions are all results obtained by the inventors after practice and careful research. Therefore, the discovery process of the above problems and the solutions proposed by this disclosure below should be considered as contributions made by the inventors to this disclosure.

[0044] The following detailed description of this exemplary implementation method is provided in conjunction with the accompanying drawings and embodiments.

[0045] Figure 1 A flowchart of a silicon steel sheet processing method according to an embodiment of this disclosure is shown, such as... Figure 1 As shown, the silicon steel sheet processing method provided in this embodiment includes S101-S104.

[0046] In S101, obtain the current position of the silicon steel sheet roll.

[0047] Silicon steel sheets can be cut into various sizes and shapes according to actual needs.

[0048] The acquisition of the current position of silicon steel sheet coils mainly includes two working conditions: one is during the initial processing, and the other is during the processing.

[0049] Before the initial processing of the silicon steel sheet roll, a virtual coordinate system for the machine tool is established. This virtual coordinate system allows the current position of the silicon steel sheet roll to be determined. For example, to determine the relative position of the cutting tool used for shearing, before formal processing, the head of the silicon steel sheet roll is moved to, for example, a 45° tool position. After the 45° tool descends, this position is identified as the origin of the coordinate system. Using the feed path of the silicon steel sheet roll as the coordinate axis and the feed direction as the positive direction, the specific coordinates of each tool on the coordinate axis can be determined based on the relative positions of each tool and the 45° tool. After the virtual coordinate system is established, the head of the formed silicon steel sheet roll is retracted to the tool closest to the feed inlet of the silicon steel sheet roll. This completes the positioning of the current position of the silicon steel sheet roll.

[0050] During the processing of silicon steel sheet rolls, for example, after the tool for punching round holes makes its cut, the current position of the silicon steel sheet roll can be obtained based on the position of the punched round hole in the aforementioned virtual coordinates.

[0051] In S102, the shape of at least one silicon steel sheet to be processed is identified to obtain a first number of action points, wherein each action point corresponds to a tool.

[0052] The sheet type of silicon steel sheet refers to the specific shape and size of the silicon steel sheet after it has been cut and shaped during the manufacturing process.

[0053] by Figure 2 The example shown is a silicon steel sheet to be processed, illustrating the acquisition of action points. Since the silicon steel sheet roll is a rectangular strip, the desired processing shape is as follows... Figure 2 The sheet shape shown first requires analysis of its feature elements, including four circular holes 11-14, a 45° edge 2, a V-groove 3, and a 135° edge 4. The tools required to machine these feature elements include a circular hole punch, a 45° tool, a V-groove tool, and a 135° tool. Further analysis of the required motion points reveals that since there are four circular holes, the circular hole punch needs to operate four times, resulting in four motion points. The 45° edge 2, V-groove 3, and 135° edge 4 each require one motion from their respective tools, totaling three motion points. Therefore… Figure 2 The pattern shown corresponds to 7 motion points.

[0054] When the first number of action points is preset to 5 action points, only 5 of the 7 action points are recorded. When the first number of action points is preset to 10 action points, except for the current action points... Figure 2 The silicon steel sheet shown will continue to identify the next silicon steel sheet type to be processed, and then obtain 3 more action points.

[0055] Generally, the preset value of the first number of action points is greater than the total number of action points on a single silicon steel sheet. Therefore, when acquiring action points, it is necessary to identify the sheet type of multiple silicon steel sheets to be processed.

[0056] It is important to note that, on the one hand, the silicon steel sheet to be processed refers to a silicon steel sheet that has not completed the processing of all feature elements, including both completely unprocessed silicon steel sheets and partially processed silicon steel sheets; on the other hand, at least one silicon steel sheet to be processed does not refer to all silicon steel sheets to be processed, but rather the number of silicon steel sheets to be processed that need to be identified in order to obtain a first number of action points. For example, if the first number of action points is preset to 5, and the number of action points on a single silicon steel sheet is greater than or equal to 5, then only one silicon steel sheet to be processed needs to be identified; if the first number of action points is preset to 10, then at least two silicon steel sheets need to be identified. Traditional processing methods require pre-identifying the action points corresponding to all silicon steel sheets and storing them in registers for execution. However, the wafer type identification in this disclosure is real-time, and only the wafer type of at least one silicon steel sheet to be processed needs to be identified, greatly shortening the wafer type identification time. Furthermore, since only a preset first number of action points are stored, the requirement for register space is greatly reduced, which is beneficial for reducing hardware costs.

[0057] In S103, the distance between each of the first number of action points and the corresponding tool is calculated.

[0058] After identifying at least one type of sheet to be processed and obtaining a first number of action points, the distance between each action point and the corresponding tool is calculated based on the specific position of the tool. This distance refers to the distance that the action point moves to the corresponding tool by moving the silicon steel sheet roll.

[0059] by Figure 2 Taking the silicon steel sheet shown as an example, in some embodiments, when the first number of action points is preset to 5, it includes the current... Figure 2 Five of the seven action points of the sheet type shown are, according to the feeding direction (assuming the feeding direction is from right to left), the five action points are 45° edge 2, round hole 11, round hole 12, V-groove 3 and round hole 13. Combining the coordinates of the tool, the current position of the silicon steel sheet roll and the spacing of each element on the sheet type, the distance between each of the five action points and the corresponding tool can be calculated, producing five distance data, which is the distance that the silicon steel sheet roll needs to move.

[0060] In some embodiments, when the first number of action points is preset to 10, it will include the current number of action points. Figure 2 The seven motion points of the shown piece and the three motion points of the next piece to be processed will calculate ten distance data between the ten motion points and the corresponding cutting tool.

[0061] In S104, each distance is compared, and the action point with the shortest distance is determined as the action point to be executed.

[0062] The first number of action points calculated in the previous step are compared with the distances to the corresponding tools to obtain the action point with the shortest distance. This action point is then determined as the execution action point, which is understood as the next machining action to be performed. For example, in the embodiment described above, when the first number of action points is preset to 10, the corresponding 10 distance data are compared and determined. If... Figure 2 If the distance corresponding to the circular hole 11 is the shortest, the silicon steel sheet is rolled up to the position corresponding to the circular hole 11 and moved to the bottom of the circular hole punching tool. The action point corresponding to the circular hole 11 is then executed to complete the punching action of the circular hole 11.

[0063] By determining the action point with the shortest distance as the execution point, the ineffective displacement of silicon steel sheet rolls can be reduced, effectively improving the production efficiency of silicon steel sheets.

[0064] In some embodiments, after step S104 is completed, the actual number of the first number of action points is reduced by one, and steps S101-S104 will be executed again. That is, during the silicon steel sheet processing, S101-S104 are executed cyclically.

[0065] The embodiments of this disclosure select the action point to be executed from a first number of action points, rather than calculating the order of all action points, thereby reducing the calculation time and providing greater flexibility.

[0066] In some embodiments, such as Figure 3 As shown, the above S104 compares each distance and determines the action point with the shortest distance as the action point to be executed, which may include S301-S303.

[0067] In S301, it is determined whether there are any unfinished silicon steel sheets detached from the silicon steel sheet roll at the action point with the shortest execution distance.

[0068] In S302, if no unfinished silicon steel sheets are detached from the silicon steel sheet roll, the action point with the shortest distance is determined as the action point to be executed.

[0069] In S303, if an unfinished silicon steel sheet is detached from the silicon steel sheet roll, the action point with the second shortest distance is selected as the action point to be executed.

[0070] The following is combined Figure 4 right Figure 3The method is further explained below. Assuming the silicon steel sheet roll is fed from right to left, for example, if, among the first number of action points, the distance between action point 401 and its corresponding cutter is less than the distance between action point 402 and its corresponding cutter, and action point 401 is the shortest distance action point, if a 45° cutter is used to cut action point 401 first, the silicon steel sheet in region 403 on the silicon steel sheet roll will detach from the silicon steel sheet roll. However, action point 402 in region 403 has not yet been punched, meaning the silicon steel sheet to which action point 402 belongs has not yet been processed. If the silicon steel sheet in region 403 detaches from the silicon steel sheet roll at this time, it will be impossible to accurately punch action point 402. Therefore, in this case, the shortest distance action point cannot be determined as the execution action point, that is, action point 401 cannot be used as the execution action point. Instead, among the first number of action points, the action point with the second shortest distance from its corresponding cutter should be selected as the execution action point.

[0071] In the embodiments of this disclosure, when selecting the action point, it also considers whether there are any unfinished silicon steel sheets detached from the silicon steel sheet roll, which can avoid the tool making empty cuts and better ensure the processing quality of each silicon steel sheet.

[0072] In some embodiments, such as Figure 5 As shown, S103 calculates the distance between each action point and the corresponding tool in the first number of action points, including S501-S503.

[0073] In S501, the spacing between the first number of action points is determined;

[0074] In S502, the position of the tool corresponding to each action point is determined;

[0075] In S503, the distance between each action point and the corresponding tool is calculated based on the current position of the silicon steel sheet roll, the spacing between the first number of action points, and the position of the corresponding tool.

[0076] In actual production, the size of the produced product and the distribution of its action points are related to the intervals between these action points. After determining the intervals between action points, it is necessary to determine the corresponding tool relationships to ensure that the corresponding tool performs the punching action after the material is fed into place.

[0077] In some embodiments, the silicon steel sheet processing method further includes: in response to a user's editing operation, selecting and arranging a plurality of preset elements to generate at least one silicon steel sheet to be processed, wherein each preset element corresponds to at least one action point. That is, the embodiments of this disclosure also provide a sheet pattern editing and design interface, allowing users to edit and design new sheet patterns based on preset elements.

[0078] In some embodiments, identifying the sheet type of at least one silicon steel sheet to be processed to obtain a first number of action points includes: identifying each preset element in the sheet type, and obtaining the first number of action points based on the preset elements. The sheet type in this embodiment is designed by the user based on preset elements, and each preset element corresponds to at least one action point; therefore, the action points in the sheet type can be identified based on the action points associated with the preset elements.

[0079] Figure 6 Several preset elements are shown. Figure 7 Several cutting tools are shown, among which element 601 is a round hole. The shape of element 601 is punched out on a silicon steel sheet roll using only a few tools. Figure 7 One of the cutting tools 701 makes a cut, thus element 601 corresponds to one action point. To punch the shape of element 602 onto the silicon steel sheet roll, it is necessary to use... Figure 7 The two tools in the element 602, for example, need to make one cut each with tool 702 and tool 703, which means a total of two cuts. Thus, the element 602 corresponds to two action points.

[0080] Compared with the traditional operating method, the embodiments disclosed herein have the following beneficial effects:

[0081] On the one hand, since only some of the silicon steel sheets to be processed need to be identified and only a preset number of action points need to be obtained, only a small amount of register resources are needed, reducing resource waste; and only the action points to be executed need to be determined from the first number of action points, the amount of calculation is small, which helps to shorten the calculation time, reduce the program running time, and improve the production cycle time.

[0082] On the other hand, as the equipment continues to operate, the number of film types produced by end users will gradually increase, and this disclosed solution can basically meet the needs of several thousand common film types. Customers can edit the required film types themselves to carry out production.

[0083] On the other hand, this disclosure has fewer procedures for determining the execution action points. When an abnormal shutdown occurs, the program can be re-executed using existing parameters, enabling continued production after the shutdown and greatly improving production efficiency. In contrast, under the traditional operating method, due to the lengthy program, all programs need to be re-run from the beginning once the machine stops.

[0084] On the other hand, all chip types are calculated and run by the same program, which reduces the uncertainties that may occur during human development, reduces the amount of program, makes it easier to maintain later, and reduces the abnormal phenomena that may occur during program execution.

[0085] In embodiments of this disclosure, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0086] In this disclosure, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0087] Furthermore, although the steps of the method in this disclosure are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result.

[0088] In some embodiments, certain steps may be omitted, multiple steps may be combined into one step for execution, and / or one step may be broken down into multiple steps for execution.

[0089] Based on the same inventive concept, this disclosure also provides a silicon steel sheet processing apparatus, as described in the following embodiments. Since the principle by which this apparatus solves the problem is similar to that of the method embodiments described above, the implementation of this apparatus embodiment can refer to the implementation of the method embodiments described above, and repeated details will not be repeated.

[0090] Figure 8 This diagram illustrates a silicon steel sheet processing apparatus according to an embodiment of the present disclosure, as shown below. Figure 8 As shown, the silicon steel sheet processing device includes a position acquisition module 801, a sheet type recognition module 802, a calculation module 803, and a comparison module 804.

[0091] The location acquisition module 801 is used to acquire the current position of the silicon steel sheet roll;

[0092] The sheet type recognition module 802 is used to recognize the sheet type of at least one silicon steel sheet to be processed and obtain a first number of action points, wherein each action point corresponds to a tool.

[0093] The calculation module 803 is used to calculate the distance between each action point and the corresponding tool in the first number of action points;

[0094] The comparison module 804 is used to compare each distance and determine the action point with the shortest distance as the action point to be executed.

[0095] In some embodiments, the comparison module 804 is used to determine whether there are any unfinished silicon steel sheets detached from the silicon steel sheet roll at the action point with the shortest execution distance; if there are no unfinished silicon steel sheets detached from the silicon steel sheet roll, then the action point with the shortest distance is determined as the action point to be executed.

[0096] In some embodiments, the comparison module 804 is further configured to select the second shortest action point as the action point if any unfinished silicon steel sheet is detached from the silicon steel sheet roll.

[0097] In some embodiments, the calculation module 803 is used to determine the spacing between a first number of action points; determine the position of the tool corresponding to each action point; and calculate the distance between each action point and the corresponding tool based on the current position of the silicon steel sheet roll, the spacing between the first number of action points, and the position of the corresponding tool.

[0098] In some embodiments, the silicon steel sheet processing apparatus includes a sheet design module.

[0099] The sheet design module is used to respond to the user's editing operations, select and arrange multiple preset elements, and generate at least one silicon steel sheet to be processed, wherein each preset element corresponds to at least one action point.

[0100] In some embodiments, the sheet type recognition module 802 is used to recognize each preset element in the sheet type and obtain a first number of action points based on the preset elements.

[0101] The concepts of "first" and "second" mentioned in this disclosure are used only to distinguish different devices, modules or units, and are not used to define the order of functions performed by these devices, modules or units or their interdependencies.

[0102] Regarding the silicon steel sheet processing apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the silicon steel sheet processing method, and will not be elaborated upon here.

[0103] It should be noted that although several modules or units of the device used for action execution are mentioned in the detailed description above, this division is not mandatory.

[0104] In fact, according to embodiments of this disclosure, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0105] Some of the block diagrams shown in the accompanying drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0106] The following reference Figure 9 The present disclosure describes the electronic device provided in the embodiments thereof. Figure 9 The electronic device 900 shown is merely an example and should not impose any limitation on the functionality and scope of use of the embodiments disclosed herein.

[0107] Figure 9 This diagram illustrates the architecture of an electronic device 900 provided in an embodiment of the present invention. Figure 9 As shown, the electronic device 900 includes, but is not limited to, at least one processor 910 and at least one memory 920.

[0108] Memory 920 is used to store instructions.

[0109] In some embodiments, memory 920 may include a readable medium in the form of volatile memory cells, such as random access memory (RAM) 9201 and / or cache memory 9202, and may further include read-only memory (ROM) 9203.

[0110] In some embodiments, the memory 920 may also include a program / utility 9204 having a set (at least one) program module 9205, such program module 9205 including but not limited to: an operating system, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.

[0111] In some embodiments, the memory 920 may store an operating system. This operating system may be a real-time operating system (RTX), such as Linux, UNIX, Windows, or OS X.

[0112] In some embodiments, the memory 920 may also store data.

[0113] As an example, processor 910 can read data stored in memory 920, which may be stored at the same memory address as the instruction, or the data may be stored at a different memory address than the instruction.

[0114] The processor 910 is configured to invoke instructions stored in the memory 920 to implement the steps described in the "Exemplary Methods" section above, according to various exemplary embodiments of this disclosure. For example, the processor 910 can execute the steps of the above-described embodiments of the silicon steel sheet processing method.

[0115] It should be noted that the processor 910 described above can be a general-purpose processor or a special-purpose processor. The processor 910 may include one or more processing cores, and the processor 910 executes various functional applications and data processing by running instructions.

[0116] In some embodiments, processor 910 may include a central processing unit (CPU) and / or a baseband processor.

[0117] In some embodiments, the processor 910 may determine an instruction based on the priority identifier and / or function category information carried in each control instruction.

[0118] In this disclosure, the processor 910 and the memory 920 can be configured separately or integrated together.

[0119] As an example, the processor 910 and memory 920 can be integrated on a single board or a system-on-a-chip (SOC).

[0120] like Figure 9 As shown, the electronic device 900 is embodied in the form of a general-purpose computing device. The electronic device 900 may also include a bus 930.

[0121] Bus 930 can represent one or more of several types of bus structures, including a memory bus or memory controller, peripheral bus, graphics acceleration port, processor, or a local bus using any of the various bus structures.

[0122] Electronic device 900 can also communicate with one or more external devices 940 (e.g., keyboard, pointing device, Bluetooth device, etc.), and with one or more devices that enable a user to interact with electronic device 900, and / or with any device that enables electronic device 900 to communicate with one or more other computing devices (e.g., router, modem, etc.). Such communication can be performed through input / output (I / O) interface 950.

[0123] Furthermore, the electronic device 900 can also communicate with one or more networks (such as local area networks (LANs), wide area networks (WANs), and / or public networks, such as the Internet) via the network adapter 960.

[0124] like Figure 9 As shown, the network adapter 960 communicates with other modules of the electronic device 900 via the bus 930.

[0125] It should be understood that, although not shown in the figure, other hardware and / or software modules may be used in conjunction with electronic device 900, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0126] It is understood that the structure illustrated in the embodiments of this disclosure does not constitute a specific limitation on the electronic device 900. In other embodiments of this disclosure, the electronic device 900 may include... Figure 9 This may involve more or fewer components, or combining certain components, or splitting certain components, or different component arrangements. Figure 9 The components shown can be implemented in hardware, software, or a combination of both.

[0127] This disclosure also provides a computer-readable storage medium storing computer instructions thereon, which, when executed by a processor, implement the silicon steel sheet processing method described in the above method embodiments.

[0128] In this embodiment of the disclosure, the computer-readable storage medium is a computer instruction that can be sent, propagated, or transmitted for use by or in conjunction with an instruction execution system, apparatus, or device.

[0129] As an example, a computer-readable storage medium is a non-volatile storage medium.

[0130] In some embodiments, more specific examples of computer-readable storage media in this disclosure may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, USB flash drives, portable hard drives, or any suitable combination of the foregoing.

[0131] In this embodiment of the disclosure, the computer-readable storage medium may include data signals propagated in baseband or as part of a carrier wave, wherein computer instructions (readable program code) are carried.

[0132] The transmitted data signal can take many forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof.

[0133] In some examples, computational instructions contained on a computer-readable storage medium may be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber, RF, etc., or any suitable combination thereof.

[0134] This disclosure also provides a computer program product that stores instructions that, when executed by a computer, cause the computer to perform the silicon steel sheet processing method described in the above method embodiments.

[0135] The aforementioned instructions can be program code. In practice, the program code can be written using any combination of one or more programming languages.

[0136] Programming languages ​​include object-oriented programming languages—such as Java and C++—as well as conventional procedural programming languages—such as the "C" language or similar programming languages.

[0137] The program code can be executed entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0138] In cases involving remote computing devices, the remote computing devices can be connected to user computing devices via any type of network, including local area networks (LANs) or wide area networks (WANs), or they can be connected to external computing devices (e.g., via the Internet using an Internet service provider).

[0139] This disclosure also provides a chip, including at least one processor and an interface;

[0140] An interface is used to provide program instructions or data to at least one processor;

[0141] At least one processor is used to execute program instructions to implement the silicon steel sheet processing method described in the above method embodiments.

[0142] In some embodiments, the chip may further include a memory for storing program instructions and data, the memory being located within or outside the processor.

[0143] Those skilled in the art will understand that all or part of the steps of the above embodiments can be specifically implemented in the following forms: a completely hardware implementation, a completely software implementation (including firmware, microcode, etc.), or a combination of hardware and software implementations, which can be collectively referred to as "circuit", "module" or "system".

[0144] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein.

[0145] This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A method for processing silicon steel sheets, characterized in that, include: Get the current position of the silicon steel sheet roll; The shape of at least one silicon steel sheet to be processed is identified to obtain a first number of action points, wherein each action point corresponds to a tool; Calculate the distance between each of the first number of action points and the corresponding tool; Compare each of the distances and determine the action point with the shortest distance as the action point to be executed.

2. The silicon steel sheet processing method according to claim 1, characterized in that, The step of comparing each distance and determining the action point with the shortest distance as the action point to be executed includes: Determine whether any unfinished silicon steel sheets have detached from the silicon steel sheet roll at the action point with the shortest distance. If no unfinished silicon steel sheet is detached from the silicon steel sheet roll, the action point with the shortest distance is determined as the action point.

3. The silicon steel sheet processing method according to claim 2, characterized in that, Also includes: If any unfinished silicon steel sheet detaches from the silicon steel sheet roll, the action point with the second shortest distance is selected as the action point.

4. The silicon steel sheet processing method according to claim 2 or 3, characterized in that, The calculation of the distance between each of the first number of action points and the corresponding tool includes: Determine the spacing between the first number of action points; Determine the position of the tool corresponding to each of the aforementioned action points; Based on the current position of the silicon steel sheet roll, the spacing between the first number of action points, and the position of the corresponding cutter, the distance between each action point and the corresponding cutter is calculated.

5. The silicon steel sheet processing method according to claim 1, characterized in that, Also includes: In response to the user's editing operation, multiple preset elements are selected and arranged to generate at least one silicon steel sheet to be processed, wherein each preset element corresponds to at least one action point.

6. The silicon steel sheet processing method according to claim 5, characterized in that, The process of identifying the type of at least one silicon steel sheet to be processed to obtain a first number of action points includes: Identify each of the preset elements in the pattern, and obtain the first number of action points based on the preset elements.

7. A silicon steel sheet processing device, characterized in that, include: The location acquisition module is used to obtain the current position of the silicon steel sheet roll; A sheet type recognition module is used to recognize the sheet type of at least one silicon steel sheet to be processed, and obtain a first number of action points, wherein each action point corresponds to a cutting tool; The calculation module is used to calculate the distance between each action point and the corresponding tool in the first number of action points; The comparison module is used to compare each distance and determine the action point with the shortest distance as the action point to be executed.

8. An electronic device, characterized in that, include: Memory, used to store instructions; A processor is configured to invoke instructions stored in the memory to implement the silicon steel sheet processing method as described in any one of claims 1-6.

9. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, they implement the silicon steel sheet processing method according to any one of claims 1-6.

10. A computer program product, characterized in that, The computer program product stores instructions that, when executed by a computer, cause the computer to perform the silicon steel sheet processing method according to any one of claims 1-6.

Images