Method for producing a metal composite foil and metal composite foil

Abstract

This invention provides a method for preparing a metal composite foil and the metal composite foil itself. The preparation method includes the following steps: providing a first metal substrate, forming a plurality of hole structures on the first metal substrate; filling the hole structures with a second metal material, and continuously casting and rolling to obtain a composite preform; and processing the composite preform to obtain a metal composite foil. The method for preparing the metal composite foil and the metal composite foil provided by this invention, by creating hole structures on a first metal substrate, filling the hole structures with a second metal material, and performing post-processing on the formed composite preform, allows the first metal substrate to construct both a conductive and heat dissipation network while the second metal material assists in conductivity and heat dissipation. This maximizes the thermal and electrical conductivity of the metal composite foil without increasing or only slightly increasing its cost.

Description

Technical Field

[0001] This invention belongs to the field of composite metal technology, and more specifically, relates to a method for preparing a metal composite foil and the metal composite foil itself. Background Technology

[0002] Aluminum possesses advantages such as light weight, low price, good thermal and electrical conductivity, and ease of processing. However, due to its low hardness and tensile strength, aluminum is difficult to directly replace copper in applications requiring high hardness. Composite materials of aluminum and copper show promising application prospects. Copper-aluminum composite foil is a composite material that combines copper and aluminum through a specific process, possessing both the excellent electrical and thermal conductivity of copper and the low density, low cost, and corrosion resistance of aluminum. Currently, copper-aluminum composite foil is typically produced through solid-liquid or solid-solid composite processes, resulting in foils with one side copper and the other aluminum. However, compared to pure copper foil, the electrical and thermal conductivity of this composite copper foil is reduced to varying degrees due to the inherent properties of aluminum, posing a significant potential hazard in some applications. Summary of the Invention

[0003] The purpose of this invention is to provide a method for preparing a metal composite foil and the metal composite foil itself, so as to solve the technical problem of low electrical conductivity and thermal conductivity of copper-aluminum composite foil in the prior art.

[0004] To achieve the above objectives, the technical solution adopted by the present invention is: to provide a method for preparing a metal composite foil, comprising the following steps:

[0005] A first metal substrate is provided, and a plurality of hole structures are formed on the first metal substrate;

[0006] The pore structure is filled with a second metallic material, and a composite master blank is obtained by continuous casting and rolling.

[0007] The composite preform is processed to obtain a metal composite foil.

[0008] Optionally, the first metal substrate has a first side and a second side disposed opposite to each other.

[0009] The two ends of the hole structure respectively penetrate the first side and the second side, or,

[0010] One end of the hole structure extends through the first side, and the other end is located inside the first metal substrate.

[0011] Optionally, the step of filling the hole structure with a second metallic material includes:

[0012] The second metallic material is melted and cooled to a semi-molten state, then the semi-molten liquid is injected into the pore structure; or...

[0013] A second metal post made of a second metal material is provided, and the second metal post is inserted into the hole structure.

[0014] Optionally, the step of filling the hole structure with a second metallic material includes:

[0015] The first metal substrate is preheated, the second metal material is melted and cooled to a semi-molten state, and the semi-molten liquid is injected into the hole structure.

[0016] Optionally, in the step of forming a plurality of hole structures on the first metal substrate, the first metal substrate is under vacuum conditions.

[0017] Optionally, in the step of forming a plurality of hole structures on the first metal substrate, the hole structures are formed on the first metal substrate by means of laser or drilling.

[0018] Optionally, the step of processing the composite masterbatch to obtain the metal composite foil includes:

[0019] The composite preform is cold-rolled;

[0020] The composite preform was annealed in an inert gas environment;

[0021] The annealed composite masterbatch is then foil-rolled to form a metal composite foil.

[0022] Optionally, the first metal substrate is a copper substrate, and the second metal material is an aluminum material.

[0023] The present invention also provides a metal composite foil, which is manufactured using the above-described method for manufacturing metal composite foil. The metal composite foil includes a first metal substrate, the first metal substrate having a plurality of hole structures, and the interior of the hole structures being filled with a second metal material.

[0024] Optionally, the hole structure is a through hole penetrating the first metal substrate, or the hole structure is a blind hole.

[0025] The beneficial effects of the metal composite foil preparation method and the composite metal foil provided by this invention are as follows: Compared with the prior art, the preparation method of the metal composite foil of this invention forms a hole structure by opening holes in a first metal substrate, filling the hole structure with a second metal material, and performing post-processing on the formed composite master blank. In this way, while the first metal substrate constructs a conductive network and a heat dissipation network, the second metal material assists in conducting electricity and dissipating heat, thereby maximizing the thermal conductivity and electrical conductivity of the metal composite foil without increasing or only slightly increasing the cost. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 A schematic flowchart illustrating the preparation method of the metal composite foil provided in an embodiment of the present invention;

[0028] Figure 2 A cross-sectional view of a metal composite foil provided in an embodiment of the present invention;

[0029] Figure 3 This is a front view of a metal composite foil provided in an embodiment of the present invention.

[0030] The following are the labeling elements in the figure:

[0031] 10 - First metal substrate; 11 - Hole structure; 20 - Second metal pillar. Detailed Implementation

[0032] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0033] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0034] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0036] Aluminum possesses advantages such as light weight, low price, good thermal and electrical conductivity, and ease of processing. However, due to its low hardness and tensile strength, aluminum is difficult to directly replace copper in applications requiring high hardness. Composite materials of aluminum and copper show promising application prospects. Copper-aluminum composite foil is a composite material that combines copper and aluminum through a specific process, possessing both the excellent electrical and thermal conductivity of copper and the low density, low cost, and corrosion resistance of aluminum. Currently, copper-aluminum composite foil is typically produced through solid-liquid or solid-solid composite processes, resulting in foils with one side copper and the other aluminum. However, compared to pure copper foil, the electrical and thermal conductivity of this composite copper foil is reduced to varying degrees due to the inherent properties of aluminum, posing a significant potential hazard in some applications. However, pure copper foil is relatively expensive; therefore, improving the thermal and electrical conductivity of copper-aluminum composite foil is a pressing issue that needs to be addressed.

[0037] To address the above technical problems, this invention proposes a novel method for preparing a metal composite foil and the metal composite foil itself. A first metal substrate 10 is provided, and a plurality of hole structures 11 are formed on the first metal substrate 10. The hole structures 11 are filled with a second metal material. Without significantly increasing the cost of the metal composite foil, the first metal substrate 10 forms a complete conductive network and dissipates heat through the second metal material, thereby improving the thermal conductivity and electrical conductivity of the metal composite foil.

[0038] The preparation method of the metal composite foil provided in the embodiments of the present invention will now be described.

[0039] Please refer to the following: Figures 1 to 3 The preparation method of metal composite foil includes the following steps:

[0040] S10: Provide a first metal substrate 10, and form a plurality of hole structures 11 on the first metal substrate 10;

[0041] S20: The composite blank is obtained by filling the hole structure 11 with a second metal material and continuously casting and rolling.

[0042] S30: Process the composite preform to obtain a metal composite foil.

[0043] The first metal substrate 10 is made of a first metallic material, which is a type of metal material with electrical conductivity and heat dissipation properties. The first metal substrate 10 has a plate-like structure, and its dimensions in one direction are much smaller than its dimensions in other directions. The first metal substrate 10 is the basic structure for the fabrication of metal composite foils. The hole structure 11 formed on the first metal substrate 10 extends from one side of the first metal substrate 10 toward the thickness direction of the first metal substrate 10.

[0044] The second metallic material is a type of metallic material that possesses both electrical conductivity and heat dissipation properties. Since the first and second metallic materials are made of different materials, their electrical conductivity and heat dissipation properties also differ. Generally, among metallic materials, the electrical conductivity and heat dissipation properties are positively correlated; that is, the better the electrical conductivity of a metallic material, the better its heat dissipation, and vice versa.

[0045] The hole structure 11 of the first metal substrate 10 is filled with a second metal material, which forms a second metal pillar 20. This method can appropriately reduce the cost of the metal composite foil, which is relatively lower than that of pure copper foil. Moreover, it can form a stable conductive network (first metal substrate 10) and use the second metal material to assist in heat dissipation, thereby maximizing the thermal conductivity and electrical conductivity of the metal composite foil in this embodiment.

[0046] Continuous casting and rolling refers to the process of rolling and deforming molten metal while it is continuously casting and solidifying. Specifically, in this embodiment, a second metal material is filled into the hole structure 11, so that the first metal material and the second metal material are continuously rolled and formed.

[0047] The thickness of the composite preform is generally greater than that of the metal composite foil. Therefore, after obtaining the composite preform, it is necessary to perform rolling and thickness reduction processes to make the composite preform close to the thickness of the foil, thereby forming the metal composite foil.

[0048] The method for preparing the metal composite foil in the above embodiments involves forming a hole structure 11 by opening holes in a first metal substrate 10, filling the hole structure 11 with a second metal material, and then performing post-processing on the formed composite preform. In this way, while the first metal substrate 10 constructs a conductive network and a heat dissipation network, the second metal material assists in conducting electricity and dissipating heat, thereby maximizing the thermal and electrical conductivity of the metal composite foil without increasing or only slightly increasing its cost.

[0049] In some embodiments of the present invention, please refer to Figure 2 and Figure 3 The first metal substrate 10 has a first side and a second side disposed opposite to each other.

[0050] The two ends of the hole structure 11 pass through the first side and the second side respectively, or,

[0051] One end of the hole structure 11 extends through the first side, and the other end is located inside the first metal substrate 10.

[0052] The first metal substrate 10 has a plate-like structure, with the first side and the second side being opposite sides of the first metal substrate 10 in the thickness direction. In one embodiment, the two ends of the hole structure 11 extend through the first side and the second side, respectively. This can be understood as a through-hole structure that penetrates the first metal substrate 10. After the hole structure 11 is filled with a second metal material, both the first and second sides of the first metal substrate 10 are exposed with the second metal material. In another embodiment, one end of the hole structure 11 extends through the first side, and the other end is located inside the first metal substrate 10. This can also be understood as a blind hole structure that extends from the first side along the thickness direction of the first metal substrate 10 into its interior.

[0053] The hole structure 11 can be a through-hole structure, which can accommodate more second metal material, but both sides of the first metal substrate 10 are open, and both sides of the first metal substrate 10 need to be surface treated subsequently. The hole structure 11 can also be a blind hole structure 11, in which the first metal substrate 10 has only one side with exposed second metal material, and only one side needs to be surface treated.

[0054] In some embodiments, the shape and size of the cross-section of the hole structure 11 are not limited, and can be a circular, elliptical, square, or other structures. Correspondingly, the cross-sectional shape of the second metal column 20 is the same as the cross-sectional shape of the hole structure 11.

[0055] In some embodiments, the hole structure 11 may be a structure with a uniform cross-section or a structure with a gradually changing cross-section. For example, the hole structure 11 may be a cylindrical hole or a hemispherical hole, etc.

[0056] In some embodiments, the cross-sectional dimension of the second metal column 20 is equal to or slightly smaller than the dimension of the hole structure 11.

[0057] In some embodiments, the number of hole structures 11 is multiple, and they are arranged along a rectangular array or a circular array.

[0058] The electrical and thermal conductivity of the metal composite foil can be altered by changing the size, shape, depth, and arrangement of the hole structure 11. Users can change these parameters according to their needs, thereby modifying the electrical and thermal conductivity of the metal composite foil.

[0059] In some embodiments of the present invention, please refer to Figure 1The step of filling the hole structure 11 with a second metal material includes:

[0060] The second metallic material is melted and cooled to a semi-molten state, then the semi-molten liquid is injected into the hole structure 11; or,

[0061] A second metal post 20 made of a second metal material is provided, and the second metal post 20 is inserted into the hole structure 11.

[0062] The methods for filling the hole structure 11 include the above two: First, the second metal material is melted and cooled to a semi-molten state, and the semi-molten liquid is injected into the hole structure 11. The second metal material is initially solid, and after heating, it becomes molten. If the temperature of the molten second metal material is too high, it may damage the first metal substrate 10 if it is directly injected into the hole structure 11. Therefore, cooling the molten second metal material to a semi-molten state will not affect the injection of the second metal material, nor will it cause the temperature to be too high and damage the first metal substrate 10. Second, a second metal pillar 20 made of the second metal material is provided, and the second metal pillar 20 is inserted into the hole structure 11. The second metal pillar 20 is solid, that is, a solid second metal pillar 20 is first made, and the size of the second metal pillar 20 matches that of the hole structure 11. The second metal pillar 20 is inserted into the interior of the hole structure 11.

[0063] The second metal material can be injected into the hole structure 11 in a semi-molten state to form a second metal pillar 20, or the second metal material can be directly inserted into the hole structure 11 in a solid state.

[0064] In some embodiments, the first metal substrate 10 is preheated, the second metal material is melted and cooled to a semi-molten state, and the semi-molten liquid is injected into the hole structure 11. Before the semi-molten second metal material is injected into the hole structure 11, the first metal substrate 10 needs to be preheated to reduce the temperature difference between the first metal substrate 10 and the second metal material. If the temperature difference between the two is too large, the second metal material that first contacts the hole structure 11 may vaporize or solidify rapidly, which can easily generate thermal stress, leading to deformation, cracks, or interface peeling of the hole structure 11.

[0065] In some embodiments, a second metal pillar 20 made of a second metallic material is provided and inserted into the hole structure 11. Before inserting the second metal pillar 20 into the hole structure 11, the second metal pillar 20 needs to undergo an oxide removal treatment to avoid affecting the thermal conductivity and electrical conductivity of the metal composite foil. Specifically, when the second metal pillar 20 is placed in air, its surface is easily oxidized by oxygen in the air, forming a metal oxide on its surface; therefore, an oxide removal treatment is required for the second metal pillar 20.

[0066] In other embodiments, a second metal pillar 20 is formed by electroplating a second metal material in the hole structure 11. In this embodiment, the second metal pillar 20 fills the hole structure 11, thus the dimensions of the second metal pillar 20 and the hole structure 11 are perfectly matched, and the connection between the second metal pillar 20 and the first metal substrate 10 is more stable. Electroplating is a process that uses the principle of electrolysis to deposit a thin layer of another metal or alloy onto the surface of certain metals. It is a process that uses electrolysis to attach a metal film to the surface of a metal or other material part.

[0067] In other embodiments, a second metal material is deposited within the hole structure 11 to form a second metal pillar 20. After the second metal material fills the hole structure 11, the second metal pillar 20 is formed. In this embodiment, the second metal pillar 20 fills the hole structure 11, so the size of the second metal pillar 20 perfectly matches that of the hole structure 11, and the connection between the second metal pillar 20 and the first metal substrate 10 is more stable. Deposition is a chemical technology that mainly utilizes one or more gaseous compounds or elements containing thin film elements to chemically react on the surface of a substrate to form a thin film.

[0068] In some embodiments of the present invention, please refer to Figure 1 In the step of forming a plurality of hole structures 11 on the first metal substrate 10, the first metal substrate 10 is under vacuum conditions. During the formation of the plurality of hole structures 11, the first metal substrate 10 is prone to heat generation. If the first metal substrate 10 is in the air, it is prone to oxidation reaction with the oxygen in the air to form an oxide layer, which affects the electrical and thermal conductivity of the first metal substrate 10. When the first metal substrate 10 is placed under vacuum conditions for drilling, there is no air present, so no oxide layer is formed, and the chemical properties of the first metal substrate 10 do not change.

[0069] Specifically, when forming the hole structure 11 by laser cutting, a laser or similar device is generally used to achieve laser cutting. When forming the hole structure 11 by laser cutting, the edges of the hole structure 11 are smoother, and different shapes of hole structures 11 can be selected according to requirements. The cutting effect of laser cutting is better.

[0070] When forming the hole structure 11 by drilling, the cutting is generally achieved by rotating the drill bit. Therefore, the hole structure 11 formed by drilling is generally a circular hole structure. The processing cost is relatively low when forming the hole structure 11 by drilling.

[0071] In some embodiments of the present invention, please refer to Figure 1 The steps for processing the composite preform to obtain the metal composite foil include:

[0072] The composite preform is cold-rolled;

[0073] The composite preform was annealed in an inert gas environment;

[0074] The annealed composite masterbatch is then foil-rolled to form a metal composite foil.

[0075] Cold rolling of the composite preform can also reduce its thickness, allowing the second metal pillar 20 to bond with the first metal substrate 10, making the composite preform closer to the thickness of the foil. Cold rolling is typically performed at room temperature and is used to roll metal sheets through a rolling mill. The purpose is to reduce the thickness of the metal sheet through rolling, while simultaneously improving its surface quality, dimensional accuracy, and mechanical properties.

[0076] Inert gases are colorless and odorless monatomic gases at room temperature and pressure, and are difficult to react chemically. Because these gases essentially do not react with other elements, they are called inert gases. In an inert gas environment, the composite preform is chemically stable and will not react with oxygen or other elements. Annealing is a metal heat treatment process that involves slowly heating the metal to a certain temperature, holding it for a sufficient time, and then cooling it at an appropriate rate. Annealing the composite preform can eliminate internal stress, improve the plasticity and toughness of the material, and optimize the interface layer between the first metal substrate 10 and the second metal pillar 20.

[0077] Foil rolling is a special cold rolling process mainly used to produce foil materials with a thickness between 0.0015 and 0.012 mm. The foil rolling process is generally carried out using a foil rolling mill.

[0078] Annealing can eliminate internal stress in the composite preform, improving its plasticity and toughness. Foil rolling can further reduce the thickness of the composite preform, forming a metal composite foil.

[0079] In some embodiments, the inert gas environment may be a helium environment, an argon environment, a neon environment, etc.

[0080] In some embodiments, the annealed composite preform is foil rolled, and the thickness of the composite metal foil formed after foil rolling is 0.0015 to 0.012 mm.

[0081] In some embodiments of the present invention, the thermal conductivity of the first metal substrate 10 is greater than that of the second metal material. The material cost of the first metal substrate 10 is higher. Correspondingly, the cost of the metal composite foil is higher, but it has better electrical and thermal conductivity.

[0082] Optionally, the first metal substrate 10 is a copper substrate, and the second metal material is aluminum. That is, the first metal material is copper, and the second metal material is aluminum. In this embodiment, the manufactured metal composite foil is a copper-aluminum composite foil. Copper and aluminum are common metal materials with relatively low cost. Aluminum is lighter, and the use of aluminum-filled hole structure 11 can reduce the weight and cost of the metal composite foil.

[0083] Optionally, the first metallic material is silver, nickel, or other materials.

[0084] In some embodiments of the present invention, the thermal conductivity of the first metal substrate 10 is less than that of the second metal material, the material cost of the first metal substrate 10 is lower, and correspondingly, the cost of the metal composite foil is lower, while ensuring better electrical and thermal conductivity.

[0085] Optionally, the first metal substrate 10 is an aluminum substrate, and the second metal material is copper. In this embodiment, the manufactured metal composite foil is a copper-aluminum composite foil, with copper and aluminum being common metal materials.

[0086] In some embodiments of the present invention, the method for preparing the metal composite foil includes the following steps:

[0087] A first metal substrate 10 is provided, and under vacuum conditions, a plurality of hole structures 11 are formed on the first metal substrate 10 by drilling or laser.

[0088] The first metal substrate 10 is preheated, the second metal material is melted and cooled to a semi-molten state, the semi-molten liquid is injected into the hole structure 11, and continuous casting and rolling are performed to obtain a composite master blank.

[0089] The composite preform is cold-rolled;

[0090] The composite preform was annealed in an inert gas environment;

[0091] The annealed composite masterbatch is then foil-rolled to form a metal composite foil.

[0092] Please see Figure 2 and Figure 3 The present invention also provides a metal composite foil, which is manufactured by the metal composite foil preparation method of any of the above embodiments. The metal composite foil includes a first metal substrate 10, the first metal substrate 10 having a plurality of hole structures 11, the interior of the hole structures 11 being filled with a second metal material.

[0093] The first metal substrate 10 is made of a first metallic material, which is a type of metal material with electrical conductivity and heat dissipation properties. The first metal substrate 10 has a plate-like structure, and its dimensions in one direction are much smaller than its dimensions in other directions. The first metal substrate 10 is the basic structure for the fabrication of metal composite foils. The hole structure 11 formed on the first metal substrate 10 extends from one side of the first metal substrate 10 toward the thickness direction of the first metal substrate 10.

[0094] The second metallic material is a type of metallic material that possesses both electrical conductivity and heat dissipation properties. Since the first and second metallic materials are made of different materials, their electrical conductivity and heat dissipation properties also differ. Generally, among metallic materials, the electrical conductivity and heat dissipation properties are positively correlated; that is, the better the electrical conductivity of a metallic material, the better its heat dissipation, and vice versa.

[0095] The hole structure 11 of the first metal substrate 10 is filled with a second metal material, which forms a second metal pillar 20. By filling with the second metal material, the cost can be reduced, and a stable conductive network (first metal substrate 10) can be formed. The second metal material also assists in heat dissipation, thereby maximizing the thermal conductivity and electrical conductivity of the metal composite foil in this embodiment.

[0096] The metal composite foil provided by the present invention forms a hole structure 11 by opening holes in a first metal substrate 10, and fills the hole structure 11 with a second metal material. In this way, the first metal substrate 10 can construct both a conductive network and a heat dissipation network, while the second metal material assists in conducting electricity and dissipating heat. This maximizes the thermal conductivity and electrical conductivity of the metal composite foil without increasing or only slightly increasing the cost.

[0097] In some embodiments of the present invention, the hole structure 11 is a through hole penetrating the first metal substrate 10, or the hole structure 11 is a blind hole.

[0098] The first metal substrate 10 has a plate-like structure, with the first side and the second side being opposite sides of the first metal substrate 10 in the thickness direction. In one embodiment, the hole structure 11 is a through-hole structure 11, which penetrates through the first metal substrate 10. This can also be understood as the two ends of the hole structure 11 penetrating through the first side and the second side, respectively. After the hole structure 11 is filled with a second metal material, both the first side and the second side of the first metal substrate 10 are exposed with the second metal material. In another embodiment, the hole structure 11 is a blind hole structure 11. This can also be understood as one end of the hole structure 11 penetrating through the first side, and the other end located inside the first metal substrate 10. The hole structure 11 extends from the first side along the thickness direction of the first metal substrate 10 into the interior of the first metal substrate 10.

[0099] The hole structure 11 can be a through-hole structure, which can accommodate more second metal material, but both sides of the first metal substrate 10 are open, and both sides of the first metal substrate 10 need to be surface treated subsequently. The hole structure 11 can also be a blind hole structure, in which only one side of the first metal substrate 10 has exposed second metal material, and only one side needs to be surface treated.

[0100] In some embodiments, the shape and size of the cross-section of the hole structure 11 are not limited, and can be a circular, elliptical, square, or other structures. Correspondingly, the cross-sectional shape of the second metal column 20 is the same as the cross-sectional shape of the hole structure 11.

[0101] In some embodiments, the hole structure 11 may be a structure with a uniform cross-section or a structure with a gradually changing cross-section. For example, the hole structure 11 may be a cylindrical hole or a hemispherical hole, etc.

[0102] In some embodiments, the cross-sectional dimension of the second metal column 20 is equal to or slightly smaller than the dimension of the hole structure 11.

[0103] In some embodiments, the number of hole structures 11 is multiple, and they are arranged along a rectangular array or a circular array.

[0104] The electrical and thermal conductivity of the metal composite foil can be altered by changing the size, shape, depth, and arrangement of the hole structure 11. Users can change these parameters according to their needs, thereby modifying the electrical and thermal conductivity of the metal composite foil.

[0105] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A method for preparing a metal composite foil, characterized in that, Includes the following steps: A first metal substrate is provided, and a plurality of hole structures are formed on the first metal substrate; The pore structure is filled with a second metallic material, and a composite master blank is obtained by continuous casting and rolling. The composite preform is processed to obtain a metal composite foil.

2. The method for preparing the metal composite foil as described in claim 1, characterized in that, The first metal substrate has a first side and a second side disposed opposite to each other. The two ends of the hole structure respectively penetrate the first side and the second side, or, One end of the hole structure extends through the first side, and the other end is located inside the first metal substrate.

3. The method for preparing the metal composite foil as described in claim 1, characterized in that, The step of filling the hole structure with a second metallic material includes: The second metallic material is melted and cooled to a semi-molten state, then the semi-molten liquid is injected into the pore structure; or... A second metal post made of a second metal material is provided, and the second metal post is inserted into the hole structure.

4. The method for preparing the metal composite foil as described in claim 1, characterized in that, The step of filling the hole structure with a second metallic material includes: The first metal substrate is preheated, the second metal material is melted and cooled to a semi-molten state, and the semi-molten liquid is injected into the hole structure.

5. The method for preparing the metal composite foil as described in claim 1, characterized in that, In the step of forming a plurality of hole structures on the first metal substrate, the first metal substrate is under vacuum conditions.

6. The method for preparing the metal composite foil as described in claim 1, characterized in that, In the step of forming a plurality of hole structures on the first metal substrate, the hole structures are formed on the first metal substrate by means of laser or drilling.

7. The method for preparing the metal composite foil as described in claim 1, characterized in that, The steps of processing the composite preform to obtain the metal composite foil include: The composite preform is cold-rolled; The composite preform was annealed in an inert gas environment; The annealed composite masterbatch is then foil-rolled to form a metal composite foil.

8. The method for preparing the metal composite foil according to any one of claims 1-7, characterized in that, The first metal substrate is a copper substrate, and the second metal material is an aluminum material.

9. A metal composite foil, manufactured using the method for manufacturing metal composite foil according to any one of claims 1-8, characterized in that, It includes a first metal substrate, which has a plurality of hole structures, and the interior of the hole structures is filled with a second metal material.

10. The metal composite foil as described in claim 9, characterized in that: The hole structure is a through hole penetrating the first metal substrate, or the hole structure is a blind hole.

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