Substrate chamfer fixing method

Abstract

This invention relates to the field of precision machining and manufacturing technology, and particularly to a method for fixing a substrate chamfering, comprising the following steps: S10, placing the substrate to be chamfered on a rotating adsorption part for adsorption, fixing, and rotating the substrate; S20, adsorbing the substrate onto the rotating adsorption part; S30, pressing the substrate downwards with a clamping mechanism provided on the rotating adsorption part; the clamping mechanism includes a rotating adsorption part for adsorption, fixing, and rotating the substrate, a support part for supporting and mounting other components of the substrate chamfering fixing method, a holding part for pressing and synchronously rotating with the substrate on the rotating adsorption part, and a driving part for driving the holding part to move to clamp or detach from the substrate. This invention, through the combined action of adsorption and clamping, effectively prevents the substrate from moving during grinding, thus improving the yield rate of chamfering processing.

Description

Technical Field

[0001] This invention relates to the field of precision machining and manufacturing technology, and in particular to a method for fixing the chamfer of a substrate. Background Technology

[0002] In the semiconductor and precision manufacturing fields, wafer-shaped substrate materials, such as crystal wafers and glass substrates, are core materials for manufacturing microelectronic devices, storage media, and other products. To ensure the yield of subsequent processes and the mechanical strength of the final product, the edges of these substrates need to be precisely chamfered or contoured. For example, in integrated circuit manufacturing, if the wafer edges are not chamfered, they are prone to chipping or stress concentration in subsequent processes; in the fabrication of glass hard disk platters, precise contour machining is also a prerequisite for ensuring the uniformity and dynamic stability of subsequent coatings. Currently, the common practice for chamfering wafer-shaped substrates without internal holes (such as conventional wafers) is to place the substrate on a rotating chuck, fix it by vacuum adsorption, and then rotate the substrate driven by the chuck, followed by grinding with a grinding wheel close to its edge. However, this fixation method relying on a single vacuum adsorption has significant limitations in practical applications. During the chamfering process, to prevent the substrate from shifting horizontally due to tangential forces, a sufficiently large adsorption force must be provided to increase the static friction between the substrate and the chuck. However, increasing the adsorption force can easily cause warping and deformation of thin substrates (such as ultrathin wafers or thin glass discs), affecting processing accuracy and even leading to scrap. If the adsorption force is reduced, the friction is insufficient, and the substrate is prone to slippage during polishing, resulting in chamfering failure and a lower processing yield. The drawbacks of adsorption fixation are even more pronounced when the substrate to be processed has an internal hole structure. Because the contact area between the substrate and the rotating chuck is significantly reduced due to the presence of the internal hole, the friction force provided under the same adsorption pressure is greatly reduced. If chamfering and polishing are to be performed on both the inner and outer edges simultaneously, the processing resistance on the substrate is greater. This places higher demands on the friction resistance of the fixation method, and the existing single vacuum adsorption method is no longer sufficient to meet the requirements for high-quality and high-efficiency chamfering of thin substrates with internal hole structures. Summary of the Invention

[0003] In view of the shortcomings of the prior art, the technical problem to be solved by the present invention is to provide a substrate chamfering and fixing method, so as to solve the problem that the friction generated by the existing substrate fixing device through adsorption fixing is not enough to simultaneously chamfer and grind the inner and outer edges of the substrate.

[0004] To solve the above-mentioned technical problems, the present invention provides a method for fixing the chamfer of a substrate, comprising the following steps: S10. Place the substrate to be chamfered on the rotating adsorption part used for adsorption and fixation and to drive the substrate to rotate. S20. Adsorb the substrate onto the rotating adsorption part; S30. Press the substrate downwards using the pressing mechanism provided on the rotating adsorption part.

[0005] Furthermore, the clamping mechanism includes: The support portion includes support components symmetrically arranged on both sides of the rotating adsorption portion along a first horizontal direction; The pressing part is disposed above the rotating adsorption part and includes a moving component and a follower component rotatably connected to the moving component for pressing and rotating synchronously with the substrate on the rotating adsorption part. The driving unit includes a first driving component corresponding to the support component and a second driving component disposed on the support component. The first driving components on both sides of the rotating adsorption unit operate synchronously to drive the holding part to move up and down, and the second driving component is used to drive the holding part to move horizontally.

[0006] Furthermore, the moving component includes a horizontally arranged moving plate, with both ends of the moving plate slidably connected to a first driving component, one end of the moving plate being fixedly connected to a second driving component, and a first mounting hole for mounting the follower component being vertically arranged on the moving plate.

[0007] Furthermore, the follower assembly includes an upper cover plate, a fixed ring plate, and a rotating unit rotatably connected to the fixed ring plate. The upper cover plate is attached to the upper surface of the moving plate. The fixed ring plate is an annular plate coaxially spaced with the first mounting hole. A first annular protrusion is radially protruding from the lower outer wall of the fixed ring plate. The upper surface of the first annular protrusion is attached to the lower surface of the moving plate. The moving plate and the fixed ring plate are connected by fasteners.

[0008] Furthermore, the rotating unit includes a lower moving ring plate and an upper moving ring plate coaxially arranged with the fixed ring plate. The lower moving ring plate is located below the fixed ring plate. The upper end face of the lower moving ring plate is recessed with a first bearing mounting groove for installing a first bearing component so that the lower moving ring plate is rotatably connected to the fixed ring plate. The upper moving ring plate is detachably connected to the upper end face of the lower moving ring plate. A second bearing mounting groove for installing a second bearing component is formed between the outer wall of the upper moving ring plate and the inner wall of the fixed ring plate.

[0009] Furthermore, the upper outer wall of the upper moving ring plate is radially provided with an upper ring protrusion, the lower surface of the upper ring protrusion is in close contact with the upper end face of the inner ring of the second bearing component, the inner wall of the fixed ring plate is radially provided with a lower ring protrusion, the upper surface of the lower ring protrusion is in close contact with the lower end face of the outer ring of the second bearing component, and the upper end of the fixed ring plate is detachably connected with an annular baffle for pressing the upper end face of the outer ring of the second bearing component and the upper end face of the upper moving ring plate together.

[0010] Furthermore, the moving component also includes an adjustment mechanism for adjusting the position of the rotation axis of the follower component in a first horizontal direction. The adjustment mechanism includes a fixed plate symmetrically arranged on both sides of the upper cover plate in the first horizontal direction and an adjustment stud passing through the fixed plate in the first horizontal direction. The fixed plate is detachably connected to the moving plate, and the adjustment stud is threadedly connected to the fixed plate.

[0011] Furthermore, the rotating adsorption unit includes a vertically arranged main shaft, a rotating seat coaxially arranged at the upper end of the main shaft, and an outer cylinder rotatably sleeved outside the main shaft. A main air passage is arranged inside the main shaft along its axis. An annular mounting groove is recessed on the upper end face of the rotating seat. A breathable block is filled in the annular mounting groove. A branch air passage is arranged inside the rotating seat to connect the annular mounting groove with the main air passage. An avoidance hole is recessed on the upper end face of the rotating seat along its axis. The inner diameter of the avoidance hole is larger than the inner diameter of the substrate.

[0012] Furthermore, the support assembly includes a vertically arranged first support plate and a second support plate fixedly connected to the lower outer wall of the first support plate. A positioning pin is vertically arranged at the upper end of the first support plate, and a positioning pin hole that cooperates with the positioning pin is provided on the movable plate. The second support plate is used to connect with a fixing component outside the device, and the rotating adsorption part is fixedly connected to the second support component through a first connecting plate.

[0013] Furthermore, the first driving component includes a first driving member disposed on the second support plate, a lifting plate that moves vertically up and down under the drive of the first driving member, and a slide rail disposed on the upper end of the lifting plate. The slide rail is disposed along a second horizontal direction that is perpendicular to the first horizontal direction. Both ends of the lower surface of the moving plate are provided with sliders that slide in cooperation with the slide rail. The first driving members on both sides of the rotating adsorption part operate synchronously to move the moving plate up and down. The second driving assembly includes a fixed frame fixedly connected to the lifting plate on one side of the rotating adsorption part, a second driving member disposed on the fixed frame, and a connecting seat that moves along the second horizontal direction under the drive of the second driving member, the connecting seat being fixedly connected to the moving plate.

[0014] In this invention, the first driving members on both sides of the rotating adsorption unit operate synchronously to move the moving plate upwards, causing the lower moving ring plate to disengage from the rotating seat. After the first driving members stop operating, the second driving member operates to move the moving plate along the slide rail away from the rotating seat. After the substrate to be chamfered is placed on the upper surface of the rotating seat, the external vacuum device is activated to adsorb the substrate onto the rotating seat. The second driving member operates to move the moving plate along the slide rail to a position where the lower moving ring plate is coaxial with the rotating seat, and then the second driving member stops operating. Then, the first driving members on both sides of the rotating adsorption unit operate synchronously to move the moving plate downwards and press it onto the surface of the substrate on the adsorption seat to complete the pressing of the substrate. The first driving member stops operating. When the external power device drives the rotating seat to rotate through the main shaft, the lower moving ring plate pressed onto the substrate rotates synchronously with the rotating seat. At this time, the outer and inner edges of the substrate can be chamfered simultaneously.

[0015] The position of the lower moving ring plate in the second horizontal direction is adjusted by the first driving member. When it is necessary to adjust the position of the lower moving ring plate in the first horizontal direction, the fixing member is loosened so that the upper cover plate and the fixed ring plate can move relative to the moving plate. At this time, the axial position of the lower moving ring plate in the first horizontal direction can be adjusted by rotating the adjusting studs on both sides of the upper cover plate, so that the axial position of the lower moving ring plate is coaxial with the rotating seat, preventing the lower moving ring plate from shaking when it follows the substrate to rotate, and improving the stability of the substrate chamfering grinding.

[0016] The substrate chamfering and fixing method of the present invention has at least the following beneficial effects.

[0017] (1) In this invention, the substrate is fixed and restricted by adsorption and clamping, which improves the restriction ability of the substrate and effectively prevents the substrate from moving during chamfering and grinding, thus improving the pass rate of chamfering. (2) Each component in the follower assembly is an annular plate with a through hole in the middle. The upper surface of the rotating seat also has a clearance hole in the middle, which makes it convenient for the grinding wheel to enter the clearance hole to chamfer the inner edge of the substrate. It is convenient to chamfer the inner and outer edges of the substrate with an inner hole at the same time. (3) In this solution, the rotation axis of the follower assembly is easy to adjust so that the axis of the lower moving ring plate is coaxial with the rotating seat, preventing the lower moving ring plate from shaking when it follows the substrate to rotate, which is beneficial to improving the stability of the substrate during chamfering and grinding. Attached Figure Description

[0018] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings...

[0019] Figure 1 This is a flowchart of a substrate chamfering and fixing method according to the present invention.

[0020] Figure 2This is a three-dimensional view of the rotating adsorption part and the pressing mechanism from the same perspective.

[0021] Figure 3 This is a three-dimensional view of the rotating adsorption unit and the clamping mechanism from another perspective.

[0022] Figure 4 This is a top view of the rotating adsorption unit and the clamping mechanism.

[0023] Figure 5 yes Figure 4 Sectional view of AA.

[0024] Figure 6 This is a schematic diagram of the clamping mechanism.

[0025] Figure 7 yes Figure 6 Enlarged view of section A.

[0026] Figure 8 This is a schematic diagram of the rotating adsorption section.

[0027] Figure 9 This is a structural diagram showing the connection between the lifting plate and the second support plate in the pressing mechanism.

[0028] The accompanying diagrams are labeled as follows.

[0029] Rotary adsorption unit-10; Main shaft-101; Main air passage-1011; Air inlet-1012; Rotary seat-102; Annular mounting groove-1021; Ventilation block-1022; Clearance hole-1023; Outer cylinder-103; Bearing assembly-104; Sealing sleeve-105; Air inlet ring groove-1051; Air inlet connector-106; Support assembly-20; First support plate-201; Positioning pin-2011; Second support plate-202; Guide column-2021; First connecting plate-203; Pressing part-30; Moving plate-301; First mounting hole-3011; Fixed plate-3012; Adjusting stud-3013; Guide pin-3014; Positioning pin hole-3015; Slider-3016; Elastic pad-3017; Top cover plate-30 2; Strip guide hole - 3021; ​​Fixed ring plate - 303; First ring protrusion - 3031; Strip guide groove - 30311; Limiting ring groove - 3032; Lower ring protrusion - 3033; Lower moving ring plate - 304; Limiting ring protrusion 3041; First bearing mounting groove - 3042; Upper moving ring plate - 305; Upper ring protrusion - 3051; First bearing component - 306; Second bearing component - 307; Second bearing mounting groove - 3071; Annular baffle - 308; Drive unit - 40; First drive assembly - 41; First drive component - 411; Lifting plate - 412; Guide hole - 4121; Slide rail - 413; Second drive assembly - 42; Fixing frame - 421; Second drive component - 422; Connecting seat - 423; Second connecting plate - 424; Base plate - 50. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0032] The substrate chamfering and fixing method of this specific embodiment is applicable to fixing the edge of a circular substrate during chamfering processing. The substrate includes, but is not limited to, wafers used in semiconductor manufacturing and glass substrates used in magnetic recording media manufacturing, such as glass hard disk platters, and other circular workpieces with internal hole structures.

[0033] This embodiment provides a method for fixing the chamfer of a substrate, such as... Figure 1 As shown, it includes the following steps: S10. Place the substrate to be chamfered on the rotating adsorption part used for adsorption and fixation and to drive the substrate to rotate. S20. Adsorb the substrate onto the rotating adsorption part; S30. Press the substrate downwards using the pressing mechanism provided on the rotating adsorption part.

[0034] like Figures 2-9 As shown, the rotating adsorption part 10 is used to adsorb and fix the substrate 50 and drive it to rotate. The pressing mechanism includes a support part, a holding part 30 for moving and pressing the substrate 50 on the rotating adsorption part 10, and a driving part 40 for driving the holding part 30 to move. The support part includes support components 20 symmetrically arranged on both sides of the rotating adsorption part 10 along a first horizontal direction. The holding part 30 is disposed above the rotating adsorption part 10. The holding part 30 includes a moving component and a follower component rotatably connected to the moving component for pressing and rotating synchronously with the substrate 50 on the rotating adsorption part 10. The driving part 40 includes a first driving component 41 corresponding to the support components 20 on both sides of the rotating adsorption part 10 and a second driving component 42 disposed on one of the support components 20. The first driving components 41 on both sides of the rotating adsorption part 10 operate synchronously to drive the holding part 30 to move up and down. The second driving component 42 is used to drive the holding part 30 to move horizontally. The substrate 50 is fixed and restricted by the adsorption and fixation of the rotating adsorption part 10 and the pressing and fixing of the pressing part 30, thereby improving the restriction capability of the substrate 50 and effectively preventing the substrate 50 from moving during chamfering and grinding. After the first driving component 41 drives the pressing part 30 to rise away from the substrate 50, the second driving component 42 drives it to move away from the space above the rotating adsorption part 10, so as not to block the rotating adsorption part 10 and to facilitate the picking and placing of the substrate 50 on the rotating adsorption part 10.

[0035] Combination Figure 8As shown, the rotating adsorption unit 10 includes a vertically arranged main shaft 101, a rotating seat 102 coaxially arranged at the upper end of the main shaft 101, and an outer cylinder 103 rotatably sleeved outside the main shaft 101. The rotating seat 102 is a circular seat body, and its upper surface is horizontally arranged. The upper end surface of the rotating seat 102 is recessed with a clearance hole 1023 along the axis of the rotating seat 102. The inner diameter of the clearance hole 1023 is larger than the inner diameter of the substrate 50, so that a cylindrical grinding wheel can enter the clearance hole 1023 to chamfer the inner edge of the substrate 50. An annular mounting groove 1021 is recessed on the end face. The annular mounting groove 1021 is coaxially arranged with the axis of the rotating seat 102. A vent block 1022 is filled in the annular mounting groove 1021. The vent block 1022 is preferably an annular porous ceramic part adapted to the annular mounting groove 1021. The upper surface of the vent block 1022 is flush with the upper surface of the rotating seat 102. The rotating seat 102 and the upper surface of the spindle 101 can be fixedly connected in the annular mounting groove 1021 by screws. A sealing ring is provided between the lower surface of the rotating seat 102 and the upper surface of the spindle 101 for sealing. A main air passage 1011 is provided inside the main shaft 101 along its axis. The upper end of the main air passage 1011 extends upward through the upper surface of the main shaft 101, and the lower end of the main air passage 1011 is closed. A branch air passage is provided inside the rotating seat 102, which connects the annular mounting groove 1021 to the main air passage 1011. An air inlet 1012 is provided on the main shaft 101, which connects the lower end cavity of the main air passage 1011 to the external space of the main shaft 101. A sealing sleeve 105 is fitted over the main shaft 101 at the air inlet 1012, which is rotatably and sealingly connected to the main shaft 101. An air inlet ring is recessed on the inner wall of the sealing sleeve 105 near the air inlet 1012. The groove 1051 and the sealing sleeve 105 are provided with an air inlet connector 106 that communicates with the air inlet ring groove 1051. The air inlet connector 106 can be connected to multiple pipes and the opening and closing of each pipe can be controlled separately to achieve the purpose of evacuating the main air passage 1011 and introducing high-pressure water or positive pressure gas into the main air passage 1011. Introducing high-pressure water can backwash the permeable block 1022 to prevent the air holes of the permeable block 1022 from being blocked. A bearing assembly 104 is provided between the outer cylinder 103 and the main shaft 101. The outer cylinder 103 and the main shaft 101 are rotatably connected through the bearing assembly 104. The lower end of the main shaft 101 is connected to an external power device to drive the main shaft 101 to rotate. When the substrate 50 to be chamfered is placed on the upper surface of the rotating seat 102, the external vacuum device generates negative pressure on the main air passage 1011, thereby adsorbing the substrate 50 onto the surface of the rotating seat 102.

[0036] Combination Figure 3 , Figure 6As shown, the support assembly 20 includes a vertically arranged first support plate 201 and a second support plate 202 fixedly connected to the lower outer wall of the first support plate 201. The first support plates 201 on both sides of the rotating adsorption part 10 are arranged in parallel, and the two first support plates 201 are symmetrically arranged on both sides of the rotating adsorption part 10 along a first horizontal direction, that is, the first support plates 201 on both sides of the rotating adsorption part 10 are arranged along a first horizontal direction. The second support plate 202 is used for fixed connection with other components outside the device, combined with Figure 2 As shown, the rotating adsorption part 10 is fixedly connected to the second support member through the first connecting plate 203. Specifically, one end of the first connecting plate 203 is bolted to the second support plate 202, and the other end of the first connecting plate 203 is bolted to the outer cylinder 103.

[0037] Combination Figure 2 , Figure 3 , Figure 6 , Figure 7As shown, the moving component includes a moving plate 301 horizontally arranged along a first horizontal direction and an adjustment mechanism for adjusting the position of the rotation axis of the follower component in the first horizontal direction. A first mounting hole 3011 for mounting the follower component is vertically arranged at the center of the moving plate 301. The first mounting hole 3011 is coaxially arranged with the rotating seat 102. Positioning pins 2011 are vertically arranged at the upper ends of the first support plates 201 on both sides of the rotating adsorption part 10. The upper part is provided with a positioning pin hole 3015 that mates with the positioning pin shaft 2011. The follower assembly includes an upper cover plate 302, a fixed ring plate 303, and a rotating unit rotatably connected to the fixed ring plate 303. The upper cover plate 302 is attached to the upper surface of the moving plate 301, and a circular through hole is provided in the middle of the upper cover plate 302. The fixed ring plate 303 is an annular plate coaxially and spaced with the first mounting hole 3011. A first annular protrusion 30 is radially protruding from the lower outer wall of the fixed ring plate 303. 31. The upper surface of the first annular protrusion 3031 is attached to the lower surface of the moving plate 301. The upper cover plate 302 and the fixed ring plate 303 are connected by multiple evenly distributed fasteners. The fasteners are preferably hexagon socket head cap screws. Specifically, the fixed ring plate 303 is provided with threaded holes that mate with the threads of the hexagon socket head cap screws. The diameter of the bolt through hole on the moving plate 301 is set to be larger than the diameter of the hexagon socket head cap screws. The diameter of the bolt hole on the upper cover plate 302 is the same as the diameter of the hexagon socket head cap screws. Due to the moving... The diameter of the bolt hole on plate 301 is larger than the diameter of the socket head cap screw. When the upper cover plate 302 moves horizontally under the action of external force, the retaining ring plate 303 moves with the upper cover plate 302. When the socket head cap screw does not move to contact the inner wall of the bolt hole on the moving plate 301, the moving plate 301 is not affected by the movement of the upper cover plate 302. Tightening the socket head cap screw can make the upper cover plate 302 and the retaining ring plate 303 clamp the moving plate 301, thereby making the cover plate and the retaining ring plate 303 firmly connected to the moving plate 301. The rotating unit includes a lower moving ring plate 304 and an upper moving ring plate 305 coaxially arranged with the fixed ring plate 303. The lower moving ring plate 304 is located below the fixed ring plate 303. A limiting ring protrusion 3041 is provided on the upper end surface of the lower moving ring plate 304. The limiting ring protrusion 3041 is coaxially arranged with the lower moving ring plate 304. A limiting ring groove 3032 is recessed on the lower end surface of the fixed ring plate 303, which slides with the limiting ring protrusion 3041 to prevent the lower moving ring plate 304 from moving. 04. The lower moving ring plate 304 has a first bearing mounting groove 3042 recessed on its upper end face for mounting a first bearing component 306 so that the lower moving ring plate 304 is rotatably connected to the fixed ring plate 303. The upper moving ring plate 305 is fastened to the upper end face of the lower moving ring plate 304 by screws. A second bearing mounting groove 3071 for mounting a second bearing component 307 is formed between the outer wall of the upper moving ring plate 305 and the inner wall of the fixed ring plate 303.The first bearing component 306 is a thrust bearing. The upper surface of the upper ring of the thrust bearing is tightly fitted with the lower surface of the fixed ring plate 303, and the lower surface of the lower ring of the thrust bearing is tightly fitted with the inner bottom wall of the first bearing mounting groove 3042. The second bearing component 307 is a double-direction thrust bearing or a single-direction thrust bearing with axial positioning function, preferably a double-direction thrust bearing. The upper outer wall of the upper moving ring plate 305 is radially provided with an upper ring protrusion 3051. The lower surface of the upper ring protrusion 3051 is tightly fitted with the upper end face of the inner ring of the second bearing component 307. Therefore, the lower moving ring plate 304 cannot move downward and slide down under the action of the upper ring protrusion 3051. The inner wall of the fixed ring plate 303 is radially provided with a lower ring protrusion 303. 3. The upper surface of the lower ring protrusion 3033 is tightly fitted with the lower end face of the outer ring of the second bearing member 307. The upper surface of the fixed ring plate 303 is screwed with an annular baffle 308 for pressing the upper end face of the outer ring of the second bearing member 307 and the upper end face of the upper moving ring plate 305. The lower surface of the lower moving ring plate 304 is fixedly connected with an annular elastic pad 3017. The inner diameter of the elastic pad 3017, the inner diameter of the lower moving ring plate 304 and the upper moving ring plate 305 are all larger than the inner diameter of the substrate 50. The elastic pad 3017 is used to contact the upper surface of the substrate 50 to press the substrate 50, preventing the follower assembly from hard contacting and crushing the substrate 50 when it moves downward and presses against the substrate 50.

[0038] Combination Figure 4As shown, the adjustment mechanism includes fixed plates 3012 symmetrically arranged on both sides of the upper cover plate 302 along a first horizontal direction and adjusting studs 3013 passing through the fixed plates 3012 along the first horizontal direction. The fixed plates 3012 are screwed to the moving plate 301, and the adjusting studs 3013 are threaded to the fixed plates 3012. Both sides of the upper cover plate 302 are provided with strip-shaped guide holes 3021 corresponding to the fixed plates 3012 along the first horizontal direction. The first annular protrusion 3031... The upper surface is recessed with a strip-shaped guide groove 30311 aligned with the upper strip-shaped hole. The movable plate 301 is vertically provided with a guide pin 3014 corresponding to the strip-shaped guide hole 3021. The guide pin 3014 is tightly fitted with the movable plate 301. The upper end of the guide pin 3014 is located inside the strip-shaped guide hole 3021 and is slidably connected to the inner wall of the strip-shaped guide hole 3021. The lower end of the guide pin 3014 is located inside the strip-shaped guide groove 30311 and is slidably connected to the inner wall of the strip-shaped guide groove 30311. When it is necessary to adjust the axial position of the follower component in the first horizontal direction, loosen the hexagonal bolts on the moving plate 301 that are used to fix the upper cover plate 302 and the fixed ring plate 303. At this time, by rotating the adjusting studs 3013 on both sides of the upper cover plate 302, the axial position of the lower moving ring plate 304 can be adjusted in the first horizontal direction, so that the axial position of the lower moving ring plate 304 is coaxial with the rotating seat 102, preventing the lower moving ring plate 304 from shaking when it follows the substrate 50 to rotate, and improving the stability of the substrate 50 during chamfering and grinding.

[0039] Combination Figure 3 , Figure 6 , Figure 9As shown, the first driving assembly 41 includes a first driving member 411 disposed on the second support plate 202, a lifting plate 412 that moves vertically up and down under the drive of the first driving member 411, and a slide rail 413 disposed on the upper end of the lifting plate 412. The slide rail 413 is disposed along a second horizontal direction that is perpendicular to the first horizontal direction. The lower surfaces of both ends of the moving plate 301 are provided with sliders 3016 that slide in cooperation with the slide rail 413. The first driving members 411 on both sides of the rotating adsorption part 10 operate synchronously to move the moving plate 301 up and down. The slider 3016 is provided with a T-shaped groove. The slide rail 413 is a T-shaped slide rail 413. The second support plate 202 is a U-shaped part. The first driving member 411 is a cylinder that is vertically disposed in the U-shaped groove of the second support plate 202. The two ends of the second support plate 202 are vertically disposed with guide posts 2021. The lower end surface of the lifting plate 412 is provided with guide holes 4121 that slide in cooperation with the guide posts 2021. The second driving assembly 42 includes a fixed frame 421 fixedly connected to the lifting plate 412 on one side of the rotating adsorption part 10, a second driving member 422 disposed on the fixed frame 421, and a connecting seat 423 that moves along the second horizontal direction under the drive of the second driving member 422. The connecting seat 423 is fixedly connected to the moving plate 301 through a second connecting plate 424. The second driving member 422 is a cylinder disposed along the second horizontal direction. The output shaft of the second driving member 422 is fixedly connected to the lifting plate 412. The second driving member 422 is connected to an external air source.

[0040] When the first driving members 411 on both sides of the rotating adsorption unit 10 operate synchronously, the moving plate 301 moves upward. The moving plate 301 moves upward and disengages from the positioning pin 2011, which restricts its horizontal movement. The lower moving ring plate 304 moves upward and disengages from the rotating seat 102. The first driving members 411 on both sides of the rotating adsorption unit 10 stop operating. Then, the second driving member 422 operates, driving the moving plate 301 to move along the slide rail 413 away from the rotating seat 102. The robot places the centered, chamfered substrate 50 coaxially with the rotating seat 102 on the upper surface of the rotating seat 102. The external vacuum device is activated to adsorb the substrate 50 onto the rotating seat 102. The second driving member 422 operates, moving the moving plate 301 along the slide rail 413 to a position where the lower moving ring plate 304 is coaxial with the rotating seat 102. The second driving member 422 then stops operating. Next, the first driving members 411 on both sides of the rotating adsorption unit 10 operate synchronously, driving the moving plate 301 to move smoothly downward, disengaging from the positioning pin 2011. Position pin 2011 is inserted into positioning pin hole 3015 on moving plate 301. Elastic pad 3017 at the bottom of lower moving ring plate 304 is pressed onto the surface of substrate 50 on adsorption seat, thus completing the pressing of substrate 50. The first driving member 411 stops running. When the external power equipment drives the rotating seat 102 to rotate through main shaft 101, the lower moving ring plate 304 pressed onto substrate 50 rotates synchronously with rotating seat 102. At this time, the outer edge and inner edge of substrate 50 can be chamfered synchronously.

[0041] When it is necessary to adjust the position of the lower moving ring plate 304 in the first horizontal direction, loosen the hex bolts used to fix the upper cover plate 302 and the fixed ring plate 303, so that the upper cover plate 302 and the fixed ring plate 303 can loosen their clamping on the moving plate 301, thereby allowing the upper cover plate 302 and the fixed ring plate 303 to move relative to the moving plate 301 in the first horizontal direction. At this time, by rotating the adjusting studs 3013 on both sides of the upper cover plate 302, the axial position of the lower moving ring plate 304 can be adjusted in the first horizontal direction, so that the axial position of the lower moving ring plate 304 is coaxial with the rotating seat 102, preventing the lower moving ring plate 304 from shaking when rotating with the substrate 50, and improving the stability of the substrate 50 during chamfering and grinding. After adjusting the axial position of the lower moving ring plate 304, tighten the hex bolts to clamp the moving plate 301 between the upper cover plate 302 and the fixed ring plate 303.

[0042] Understandably, since glass hard disk platters are made of different materials than wafers, their surface hardness, brittleness, and coefficient of thermal expansion differ. Wafers are relatively hard and tough crystalline materials, while glass is a hard and brittle amorphous material. Therefore, when using the method of this invention to fix glass hard disk platters, the vacuum adsorption force applied to the glass hard disk platters needs to be adjusted accordingly. The adsorption force applied to the glass hard disk platters should be 70% to 90% of the adsorption force applied to wafers of the same size to avoid indentations or micro-cracks on the surface of the glass hard disk platters due to excessive adsorption force. Simultaneously, when rounding the corners of the glass hard disk platters, the grinding speed and feed rate of the grinding wheel should be reduced accordingly to ensure that the glass hard disk platters do not move or chip during processing.

[0043] Understandably, in this embodiment, various driving components used to provide power, including but not limited to various motors, cylinders, hydraulic cylinders, electric telescopic rods, etc., are all connected to and controlled by the controller. Each cylinder is connected to a corresponding air source pipe, and the corresponding vacuum pumping equipment is connected to and controlled by the controller.

[0044] The above embodiments merely illustrate preferred implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention should be determined by the appended claims.

Claims

1. A method for fixing the chamfer of a substrate, characterized in that, Includes the following steps: S10. Place the substrate to be chamfered on the rotating adsorption part used for adsorption and fixation and to drive the substrate to rotate. S20. Adsorb the substrate onto the rotating adsorption part; S30. Press the substrate downwards using the pressing mechanism provided on the rotating adsorption part.

2. The method for fixing the chamfer of a substrate according to claim 1, characterized in that, The clamping mechanism includes: The support portion includes support components (20) symmetrically arranged on both sides of the rotating adsorption portion (10) along the first horizontal direction. The pressing part (30) is disposed above the rotating adsorption part (10) and includes a moving component and a follower component that is rotatably connected to the moving component for pressing and rotating synchronously with the substrate on the rotating adsorption part (10). The driving unit (40) includes a first driving component (41) corresponding to the support component (20) and a second driving component (42) disposed on the support component (20). The first driving components (41) on both sides of the rotating adsorption unit (10) operate synchronously to drive the holding unit (30) to move up and down, and the second driving component (42) is used to drive the holding unit (30) to move horizontally.

3. The method for fixing the chamfer of a substrate according to claim 2, characterized in that: The moving component includes a horizontally arranged moving plate (301), with both ends of the moving plate (301) slidably connected to a first driving component (41) and one end of the moving plate (301) fixedly connected to a second driving component (42). The moving plate (301) has a first mounting hole (3011) vertically arranged on it for mounting the follower component.

4. The method for fixing the chamfer of a substrate according to claim 3, characterized in that: The follower assembly includes an upper cover plate (302), a fixed ring plate (303), and a rotating unit rotatably connected to the fixed ring plate (303). The upper cover plate (302) is attached to the upper surface of the moving plate (301). The fixed ring plate (303) is an annular plate with a gap between it and the first mounting hole (3011). The lower outer wall of the fixed ring plate (303) is radially provided with a first annular protrusion (3031). The upper surface of the first annular protrusion (3031) is attached to the lower surface of the moving plate (301). The moving plate (301) and the fixed ring plate (303) are connected by fasteners.

5. The method for fixing the chamfer of a substrate according to claim 4, characterized in that: The rotating unit includes a lower moving ring plate (304) and an upper moving ring plate (305) coaxially arranged with the fixed ring plate (303). The lower moving ring plate (304) is located below the fixed ring plate (303). The upper end face of the lower moving ring plate (304) is recessed with a first bearing mounting groove (3042) for mounting a first bearing component (306) so that the lower moving ring plate (304) is rotatably connected to the fixed ring plate (303). The upper moving ring plate (305) is detachably connected to the upper end face of the lower moving ring plate (304). A second bearing mounting groove (3071) for mounting a second bearing component (307) is formed between the outer wall of the upper moving ring plate (305) and the inner wall of the fixed ring plate (303).

6. The method for fixing the chamfer of a substrate according to claim 5, characterized in that: The upper outer wall of the upper moving ring plate (305) is radially provided with an upper ring protrusion (3051), the lower surface of the upper ring protrusion (3051) is tightly fitted with the upper end face of the inner ring of the second bearing member (307), the inner wall of the fixed ring plate (303) is radially provided with a lower ring protrusion (3033), the upper surface of the lower ring protrusion (3033) is tightly fitted with the lower end face of the outer ring of the second bearing member (307), and the upper end of the fixed ring plate (303) is detachably connected with an annular baffle (308) for pressing the upper end face of the outer ring of the second bearing member (307) and the upper end face of the upper moving ring plate (305).

7. The method for fixing the chamfer of a substrate according to claim 4, characterized in that: The moving component further includes an adjustment mechanism for adjusting the position of the rotation axis of the follower component in a first horizontal direction. The adjustment mechanism includes a fixed plate (3012) symmetrically arranged on both sides of the upper cover plate (302) in the first horizontal direction and an adjustment stud (3013) passing through the fixed plate (3012) in the first horizontal direction. The fixed plate (3012) is detachably connected to the moving plate (301), and the adjustment stud (3013) is threadedly connected to the fixed plate (3012).

8. The method for fixing the chamfer of a substrate according to claim 1, characterized in that: The rotating adsorption unit (10) includes a vertically arranged main shaft (101), a rotating seat (102) coaxially arranged on the upper end of the main shaft (101), and an outer cylinder (103) rotatably sleeved outside the main shaft (101). A main air passage (1011) is arranged inside the main shaft (101) along the axis of the main shaft (101). An annular mounting groove (1021) is recessed on the upper end face of the rotating seat (102). A breathable block (1022) is filled in the annular mounting groove (1021). A branch air passage is arranged inside the rotating seat (102) to connect the annular mounting groove (1021) with the main air passage (1011). An avoidance hole (1023) is recessed on the upper end face of the rotating seat (102) along the axis of the rotating seat (102). The inner diameter of the avoidance hole (1023) is larger than the inner diameter of the substrate.

9. A method for fixing the chamfer of a substrate according to claim 3, characterized in that: The support assembly (20) includes a vertically arranged first support plate (201) and a second support plate (202) fixedly connected to the lower outer wall of the first support plate (201). A positioning pin (2011) is vertically arranged at the upper end of the first support plate (201). A positioning pin hole (3015) that cooperates with the positioning pin (2011) is provided on the moving plate (301). The second support plate (202) is used to connect with a fixing component outside the device. The rotating adsorption part (10) is fixedly connected to the second support component through a first connecting plate (203).

10. A method for fixing the chamfer of a substrate according to claim 9, characterized in that: The first driving component (41) includes a first driving member (411) disposed on the second support plate (202), a lifting plate (412) that is vertically raised and lowered under the drive of the first driving member (411), and a slide rail (413) disposed on the upper end of the lifting plate (412). The slide rail (413) is disposed along a second horizontal direction that is perpendicular to the first horizontal direction. The lower surfaces of both ends of the moving plate (301) are provided with sliders (3016) that slide in cooperation with the slide rail (413). The first driving members (411) on both sides of the rotating adsorption part (10) operate synchronously to make the moving plate (301) move up and down. The second drive assembly (42) includes a fixed frame (421) fixedly connected to the lifting plate (412) on one side of the rotating adsorption part (10), a second drive member (422) disposed on the fixed frame (421), and a connecting seat (423) that moves along the second horizontal direction under the drive of the second drive member (422). The connecting seat (423) is fixedly connected to the moving plate (301).

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