A substrate inner and outer circle chamfering device and method

Abstract

This invention relates to the field of precision machining and manufacturing technology, and particularly to a device and method for chamfering the inner and outer edges of a substrate. The chamfering device includes a frame for supporting and mounting other components of the device; a fixing part for adsorbing, fixing, and rotating the substrate, the fixing part being provided with a clearance groove coaxially arranged with the inner hole of the substrate, the clearance groove providing space for chamfering the inner edge of the substrate; a moving part, disposed on the frame, for driving the fixing part to move so that the substrate is positioned at a set processing position; and a grinding part, including an outer grinding assembly and an inner grinding assembly, for chamfering and grinding the outer and inner edges of the substrate on the fixing part, respectively. In this invention, the substrate can move arbitrarily in three-dimensional space, and the inner and outer edges of the substrate can be simultaneously ground and chamfered. Compared with the prior art that chamfers the outer and inner edges of the substrate step by step, the substrate grinding efficiency of this solution is higher.

Description

Technical Field

[0001] This invention relates to the field of precision machining and manufacturing technology, and in particular to a device and method for chamfering the inner and outer circles of a substrate. Background Technology

[0002] In the semiconductor and precision manufacturing fields, wafer-shaped substrate materials, such as crystal wafers and glass substrates, are core materials for manufacturing microelectronic devices, storage media, and other products. To ensure the yield of subsequent processes and the mechanical strength and reliability of the final product, precise chamfering and deburring of the edges of these substrates is a crucial step. For example, in integrated circuit manufacturing, if the sharp edges of a wafer are not chamfered, they are prone to chipping or stress concentration during subsequent processes such as transfer, photolithography, and etching, leading to chip failure. Similarly, in the fabrication of glass hard disk platters, precise contour machining is a prerequisite for ensuring the uniformity of subsequent magnetron sputtering coating and the dynamic stability of the platter under high-speed rotation. In existing technologies, for wafer-shaped substrates without internal holes, vacuum adsorption onto a rotating chuck is typically used, and a rotating grinding wheel is used to chamfer the outer edges. However, for circular substrates with internal holes, such as toroidal wafers used in specific packaging or sensor manufacturing, or glass hard disk platters, not only are the outer circular edges chamfered, but the edges of the internal holes also need to be chamfered. Currently, for such substrates with inner and outer circular structures, the processing of their inner and outer edges is often performed in steps. The operation typically requires first chamfering or contouring the outer circular edges of the substrate, and then changing tooling, fixtures, or adjusting equipment before processing the edges of the internal holes. This step-by-step processing method not only increases process flow and auxiliary time, leading to low overall processing efficiency, but also easily introduces positioning errors through multiple clamping, affecting the coaxiality of the inner and outer circular contours and the consistency of edge quality, making it difficult to meet the high efficiency and high precision requirements of modern precision manufacturing. Summary of the Invention

[0003] In view of the shortcomings of the prior art, the technical problem to be solved by the present invention is to provide a substrate inner and outer chamfering device and method to solve the problem that the existing substrate chamfering device needs to perform chamfering of substrates with inner holes in steps, resulting in long processing time and low efficiency.

[0004] To address the aforementioned technical problems, one aspect of the present invention provides a substrate inner and outer chamfering device, comprising: The frame is used to support and mount other components of the substrate inner and outer chamfering device; The fixing part is used to adsorb and fix the substrate and drive the substrate to rotate. The fixing part is provided with a clearance groove that is coaxially arranged with the inner hole of the substrate. The clearance groove provides the movement space when the inner edge of the substrate is chamfered. A movable part, disposed on the frame, is used to drive the fixed part to move so that the substrate is located at a set processing position; The grinding section includes an outer grinding assembly and an inner grinding assembly, which are used to chamfer and grind the outer and inner edges of the substrate on the fixing part, respectively.

[0005] Furthermore, the moving part includes: A lower moving component, disposed on the frame, is used to drive the fixed part to move along a first horizontal direction; An upper moving component is disposed on the lower moving component to drive the fixed part to move along a second horizontal direction that is perpendicular to the first horizontal direction; A vertical moving component is disposed on the upper moving component to drive the fixed part to move in the vertical direction. The fixed part is disposed on the vertical moving component.

[0006] Furthermore, the lower moving assembly includes a lower slide rail group fixedly connected to the frame and arranged along a first horizontal direction, a lower slide plate arranged horizontally and slidably connected to the lower slide rail group, and a lower driving member arranged on the frame for driving the lower slide plate to slide along the lower slide rail group; the upper moving assembly includes an upper slide rail group arranged along a second horizontal direction on the lower slide plate, an upper slide plate arranged horizontally and slidably connected to the upper slide rail group, and an upper driving member arranged on the lower slide plate for driving the upper slide plate to slide along the upper slide rail group; the vertical moving assembly includes a first connecting plate arranged on the upper slide plate, a first vertical slide rail group vertically arranged on the first connecting plate, a first vertical slide plate slidably connected to the first vertical slide rail group, and a first vertical driving member arranged on the first connecting plate for driving the vertical slide plate to move along the vertical slide rail group, and the fixing part is arranged on the first vertical slide plate.

[0007] Furthermore, the fixing part includes a first fixing cylinder that is vertically arranged and detachably connected to the first vertical sliding plate, a first main shaft that is coaxially inserted through the first fixing cylinder, a first rotary drive that is detachably connected to the first vertical sliding plate for driving the first main shaft to rotate, and a rotating seat that is coaxially arranged at the upper end of the first main shaft for adsorbing the substrate. The clearance groove is coaxially arranged on the upper surface of the rotating seat.

[0008] Furthermore, the external grinding assembly includes a second fixed cylinder that is vertically arranged and fixedly connected to the frame, a second main shaft that is coaxially inserted through the second fixed cylinder, an outer edge grinding wheel that is coaxially arranged at the upper end of the second main shaft, and a second rotary drive component that is placed at the lower end of the second fixed cylinder for driving the second main shaft to rotate.

[0009] Furthermore, the outer edge grinding wheel is provided with multiple V-shaped outer edge grinding grooves on its circumferential surface for grinding and chamfering the outer edge of the substrate.

[0010] Furthermore, the internal grinding assembly includes an internal grinding wheel vertically arranged for grinding and chamfering the inner edge of the substrate, and an internal grinding drive unit for driving the internal grinding wheel to move and rotate. The internal grinding drive unit includes a fixed plate horizontally arranged and fixedly connected to the frame, a horizontal slide rail assembly arranged on the fixed plate along a first horizontal direction, a horizontal slide plate slidably connected to the horizontal slide rail assembly, a horizontal drive member driving the horizontal slide plate to slide along the horizontal slide rail assembly, a vertical mounting plate fixedly connected to the horizontal slide plate, a second vertical slide rail assembly vertically arranged on the vertical mounting plate, a second vertical slide plate slidably connected to the second vertical slide rail assembly, a second vertical drive member arranged on the vertical mounting plate for driving the second vertical slide plate to slide along the second vertical slide rail assembly, and a third rotary drive member arranged on the second vertical slide plate for driving the internal grinding wheel to rotate. The output shaft of the third rotary drive member is vertically arranged downwards, and the internal grinding wheel is coaxially fixedly connected to the output shaft of the third rotary drive member. The maximum outer diameter of the internal grinding wheel is smaller than the inner diameter of the substrate.

[0011] Furthermore, the inner edge grinding wheel is provided with multiple V-shaped inner edge grinding grooves on its circumferential surface for grinding and chamfering the inner edge of the substrate.

[0012] Furthermore, another aspect of the present invention provides a method for chamfering the inner and outer circles of a substrate, which includes the following steps: S1. Control the moving part to drive the fixing part to move to the set pick-up and put-out position, place the substrate to be chamfered on the fixing part, vacuum the fixing part to adsorb and fix the substrate and drive the substrate to rotate. S2. Run the external grinding drive to rotate the outer edge grinding wheel on the external grinding assembly, and run the internal grinding assembly to rotate the inner edge grinding wheel. S3. Control the moving part to drive the fixed part to move so that the substrate gradually approaches the outer edge grinding wheel to grind and chamfer the outer edge of the substrate. Control the inner grinding drive unit to drive the inner edge grinding wheel to move and approach the inner edge of the substrate to grind and chamfer the inner edge of the substrate. S4. Control the internal grinding drive unit to drive the inner edge grinding wheel to move away from the substrate, and control the moving part to drive the fixed part to move to the material pick-up and drop-off position. S5. Stop adsorbing the substrate and remove the substrate from the fixing part; Furthermore, step S3 includes the following sub-steps: S31. Simultaneously grind and chamfer the inner and outer upper edges of the substrate: Control the moving part to drive the fixed part to move so that the outer upper edge of the substrate gradually approaches and contacts the upper inner wall of a certain V-shaped outer edge grinding groove on the outer edge grinding wheel; control the inner grinding drive unit to drive the inner edge grinding wheel to move so that the upper inner wall of a certain V-shaped inner edge grinding groove on the inner edge grinding wheel gradually approaches and contacts the inner upper edge of the substrate; or Simultaneous grinding and chamfering of the inner lower edge and outer lower edge of the substrate: control the moving part to drive the fixed part to move so that the outer lower edge of the substrate gradually approaches and contacts the lower inner wall of a certain V-shaped outer edge grinding groove on the outer edge grinding wheel; control the inner grinding drive unit to drive the inner edge grinding wheel to move so that the lower inner wall of a certain V-shaped inner edge grinding groove on the inner edge grinding wheel gradually approaches and contacts the inner lower edge of the substrate. S32. After chamfering the inner upper edge and outer upper edge of the substrate, control the inner grinding drive unit to drive the inner edge grinding wheel to move radially away from the substrate. Then, control the moving part to drive the fixing part to move downward so that the outer lower edge of the substrate gradually approaches and contacts the lower inner wall of the V-shaped outer edge grinding groove of the outer edge grinding wheel. Control the inner grinding drive unit to drive the inner edge grinding wheel to move so that the lower inner wall of the V-shaped inner edge grinding groove of the inner edge grinding wheel gradually approaches and contacts the inner lower edge of the substrate, and simultaneously grind and chamfer the inner lower edge and outer lower edge of the substrate; or After chamfering the inner lower edge and outer lower edge of the substrate, the inner grinding drive unit is controlled to drive the inner edge grinding wheel to move radially away from the substrate. Then, the moving part is controlled to drive the fixing part to move upward so that the outer upper edge of the substrate gradually approaches and contacts the upper inner wall of the V-shaped outer edge grinding groove of the outer edge grinding wheel. The inner grinding drive unit is controlled to drive the inner edge grinding wheel to move so that the upper inner wall of the V-shaped inner edge grinding groove of the inner edge grinding wheel gradually approaches and contacts the inner upper edge of the substrate, and the inner upper edge and outer upper edge of the substrate are simultaneously ground and chamfered.

[0013] Compared with the prior art, the present invention provides a substrate inner and outer chamfering device and method that has at least the following advantages: (1) In this invention, the substrate can be moved arbitrarily in three-dimensional space by means of the moving part. The rotating seat is provided with an active space for the inner edge grinding wheel to grind the chamfer. With the cooperation of the moving part and the inner grinding drive unit, the inner edge and outer edge of the substrate can be ground and chamfered at the same time. Compared with the prior art of chamfering the outer edge and inner edge of the substrate step by step, the substrate grinding efficiency of this solution is higher; (2) In this invention, the upper outer edge and the lower outer edge of the substrate can be adjusted by means of the moving part so that they are respectively aligned with the upper inner wall of the V-shaped outer edge grinding groove. Different parts of the inner wall and the lower inner wall are contacted for grinding and chamfering. The inner grinding drive unit can make different parts of the upper inner wall and the lower inner wall of the V-shaped inner groove on the inner edge of the grinding wheel contact the upper inner edge and the lower inner edge of the substrate for grinding and chamfering. This allows the grinding layer on the inner wall of the V-shaped outer edge grinding groove and the inner wall of the V-shaped inner edge grinding groove to be used for contact grinding and chamfering of the substrate, improving the utilization rate of grinding material on the outer edge grinding wheel and the inner edge grinding wheel, and extending the service life of the outer edge grinding wheel and the inner edge grinding wheel. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings...

[0015] Figure 1 This is a perspective view of the internal structure of a substrate inner and outer chamfering device according to the present invention.

[0016] Figure 2 This is a front view of the internal structure of a substrate inner and outer chamfering device according to the present invention.

[0017] Figure 3 yes Figure 2 A detailed view of a part of the image.

[0018] Figure 4 This is a partial structural diagram of the first main shaft.

[0019] Figure 5 yes Figure 1 A 3D view after removing some parts.

[0020] Figure 6 This is a perspective view of the substrate inner and outer chamfering device of the present invention after removing some components.

[0021] Figure 7 This is a three-dimensional view of some components of the fixing part.

[0022] Figure 8 Yes, this is a schematic diagram showing the interaction between the inner and outer edge grinding wheels and the substrate when chamfering the substrate.

[0023] Figure 9 This is an overall perspective view of a substrate inner and outer chamfering device according to the present invention.

[0024] Figure 10 This is a flowchart of a method for chamfering the inner and outer corners of a substrate according to the present invention.

[0025] The accompanying diagrams are labeled as follows.

[0026] Rack-10; Fixed part - 20; First fixed cylinder - 201; First main shaft - 202; Main air passage - 2021; Air inlet - 2022; Sealing sleeve - 2023; Air inlet ring groove - 20231; Air inlet connector - 2024; First rotary drive component - 203; Rotary seat - 204; Clearance groove - 2041; Support plate - 2051; Vertical slide block - 2052; First horizontal slide rail - 2053; First moving plate - 2054; Rotating ring - 2055; Third vertical drive component - 2056; Horizontal drive component - 2057; Second connecting plate - 206; Moving part - 30; Lower moving assembly - 301; Lower slide rail assembly - 3011; Lower sliding plate - 3012; Lower drive component - 3013; Upper moving assembly - 302; Upper slide rail assembly - 3021; ​​Upper sliding plate - 3022; Upper drive component - 3023; Vertical moving assembly - 303; First vertical slide rail assembly - 3031; First vertical sliding plate - 3032; First vertical drive component - 3033; First connecting plate - 3034; Grinding section - 40; External grinding assembly - 41; Internal grinding assembly - 42; Second fixed cylinder - 411; Second spindle - 412; Outer edge grinding wheel - 413; Second rotary drive component - 414; V-shaped outer edge grinding groove - 4131; Inner edge grinding wheel - 421; V-shaped inner edge grinding groove - 4211; Internal grinding drive unit - 422; Fixed plate - 4221; Horizontal slide rail assembly - 4222; Horizontal slide plate - 4223; Horizontal drive component - 4224; Vertical mounting plate - 4225; Second vertical slide rail assembly - 4226; Second vertical slide plate - 4227; Second vertical drive component - 4228; Third rotary drive component - 4229; Substrate-50. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0029] The substrate inner and outer circle chamfering device of this specific embodiment can be used not only for chamfering wafers with inner and outer circle structures, but also for chamfering disk-shaped substrate components with similar brittle properties as wafers and similar inner and outer circle structure features. For example, it can be used for chamfering the inner and outer circles of glass hard disk platters with inner and outer circle structures.

[0030] Example 1 This embodiment provides a substrate inner and outer chamfering device, such as... Figures 1-9 As shown, the system includes a frame 10 for supporting and mounting other components of the substrate chamfering device, a fixing part 20 mounted on the frame 10 for adsorbing, fixing, and rotating the substrate, a moving part 30 mounted on the frame 10 for driving the fixing part 20 to move the substrate to a set processing position, and a grinding part 40 for chamfering the outer and inner edges of the substrate on the fixing part 201. The frame 10 is a frame structure. The fixing part 20 is provided with a clearance groove 2041 coaxially arranged with the inner hole of the substrate. The clearance groove 2041 provides space for the chamfering component to move when chamfering the inner edge of the substrate. The grinding part 40 includes an outer grinding component 41 for chamfering the outer edge of the substrate and an inner grinding component 42 for chamfering the inner edge of the substrate. Thus, after the substrate to be chamfered is placed and fixed on the fixing part 20, the fixing part 20 can be moved to the processing position by the moving part 30, and the inner edge and outer edge of the substrate 50 can be chamfered and polished by the inner grinding assembly 42 and the outer grinding assembly 41.

[0031] Combination such as Figures 1-4 As shown, the moving part 30 includes a lower moving component 301 for driving the fixed part 20 to move along a first horizontal direction, an upper moving component 302 for driving the fixed part 20 to move along a second horizontal direction that is perpendicular to the first horizontal direction, and a vertical moving component 303 for driving the fixed part 20 to move along a vertical direction. With the above configuration, the moving part 30 can drive the substrate on the fixed part 20 to move in three dimensions, so that the substrate is located in a position that is convenient for chamfering.

[0032] The lower moving assembly 301 includes a lower slide rail group 3011 fixedly connected to the frame 10 and arranged along a first horizontal direction, a lower slide plate 3012 horizontally arranged and slidably connected to the lower slide rail group 3011, and a lower driving member 3013 arranged on the frame 10 for driving the lower slide plate 3012 to slide along the lower slide rail group 3011. The lower slide rail group 3011 includes two parallel slide rails fixedly connected to the frame 10. The lower driving member 3013 is a drive motor, preferably a servo motor. The lower driving member 3013 is fixed to the frame 10 by bolts. The lower driving member 3013 is externally connected to a power supply and a controller. The lower driving member 3013 drives the lower slide plate 3012 to move along the lower slide rail group 3011 through a screw and nut transmission method. The screw is coaxially fixedly connected to the output shaft of the lower driving member 3013, and the nut that cooperates with the screw is fixed to the lower slide plate 3012.

[0033] The upper moving component 302 is disposed on the lower moving component 301. The upper moving component 302 includes an upper slide rail assembly 3021 disposed along the lower slide plate 3012 in the second horizontal direction, an upper slide plate 3022 disposed horizontally and slidably connected to the upper slide rail assembly 3021, and an upper driving member 3023 disposed on the lower slide plate 3012 for driving the upper slide plate 3022 to slide along the upper slide rail assembly 3021. The second horizontal direction is perpendicular to the first horizontal direction. The upper slide rail assembly 3021 includes two horizontally parallel slide rails arranged on the lower slide plate 3012. The lower surface of the upper slide plate 3022 is provided with a sliding groove that slides and engages with the upper slide rail assembly 3021, or a slider that slides and engages with the upper slide rail assembly 3021 is fixedly connected. The upper drive component 3023 is a drive motor, preferably a servo motor. The upper drive component 3023 is fixed to the lower slide plate 3012 by bolts. The upper drive component 3023 is externally connected to a power supply and a controller. The upper drive component 3023 drives the upper slide plate 3022 to move along the upper slide rail assembly 3021 through a screw and nut transmission method. The screw is coaxially fixedly connected to the output shaft of the upper drive component 3023. The nut that engages with the screw is fixed to the bottom surface of the upper slide plate 3022. The lower slide plate 3012 is horizontally arranged.

[0034] The vertical moving assembly 303 includes a first connecting plate 3034 disposed on the upper sliding plate 3022, a first vertical slide rail assembly 3031 vertically disposed on the first connecting plate 3034, a first vertical sliding plate 3032 slidably connected to the first vertical slide rail assembly 3031, and a first vertical driving member 3033 disposed on the first connecting plate 3034 for driving the vertical sliding plate to move along the vertical slide rail assembly. The first connecting plate 3034 is an L-shaped plate including a horizontal part and a vertical part. The horizontal part of the first connecting plate 3034 is bolted to the upper sliding plate 3022. The first vertical slide rail assembly 3031 is disposed on the vertical part of the first connecting plate 3034 and includes two vertical and parallel slide rails. The first vertical slide rail assembly 3031 is fastened to the vertical part of the first connecting plate 3034 by bolts. The first vertical sliding plate 3032 is vertically disposed and connected to the first vertical slide rail assembly 3031. The sliding connection is provided. The first vertical drive member 3033 is disposed on the vertical part of the first connecting plate 3034. The first vertical drive member 3033 is a drive motor, preferably a servo motor. The first vertical drive member 3033 drives the first vertical slide plate 3032 to slide through a lead screw and nut transmission method. The lead screw is coaxially and fixedly connected to the output shaft of the first vertical drive member 3033. The nut that cooperates with the lead screw is fixed on the first vertical slide plate 3032. The fixing part 20 is disposed on the first vertical slide plate 3032.

[0035] Combination Figure 3 , Figure 4 As shown, the fixing part 20 includes a first fixing cylinder 201 that is vertically arranged and detachably connected to the first vertical sliding plate 3032, a first main shaft 202 that is coaxially inserted through the first fixing cylinder 201, a first rotary drive member 203 that is detachably connected to the first vertical sliding plate 3032 for driving the first main shaft 202 to rotate, a rotating seat 204 that is coaxially arranged at the upper end of the first main shaft 202 for adsorbing the substrate, and a follower mechanism that is arranged on the first fixing cylinder 201 for pressing the substrate on the rotating seat 204.

[0036] The first vertical slide plate 3032 is provided with an L-shaped second connecting plate 206 including a vertical part and a horizontal part. The vertical part of the second connecting plate 206 is attached to the first vertical slide plate 3032 and fastened to it with bolts. The horizontal part of the second connecting plate 206 is oriented away from the first vertical slide plate 3032. The first rotary drive member 203 is fastened to the first vertical slide plate 3032 with bolts. The first fixing cylinder 201 is a circular cylindrical body. The first fixing cylinder 201 and the first rotary drive member 203 are coaxially arranged on the horizontal part of the second connecting plate 206. The first fixing cylinder 201 and the horizontal part of the second connecting plate 206 are fastened to each other with bolts. The first main shaft 202 is coaxially arranged with the first fixing cylinder 201. The first main shaft 202 and the first fixing cylinder 201 are rotatably connected by a bearing assembly. The upper end of the first main shaft 202 extends upward beyond the upper end of the first fixing cylinder 201. The lower end of a main shaft 202 extends downward from the lower end of a first fixed cylinder 201 and passes downward through the horizontal part of a second connecting plate 206 before being fixedly connected to the output shaft of the first rotary drive 203. The first rotary drive 203 is a drive motor and is externally connected to a power supply and controller. The rotating seat 204 is coaxially disposed on the upper surface of the first main shaft 202. A sealing ring is provided between the bottom surface of the rotating seat 204 and the upper surface of the first main shaft 202 to seal the bottom surface of the rotating seat 204 and the upper surface of the first main shaft 202. The upper surface of the rotating seat 204 is horizontally disposed. The clearance groove 2041 is coaxially disposed on the upper surface of the rotating seat 204. The clearance groove 2041 is a blind hole with an inner diameter larger than the inner diameter of the substrate. The rotating seat 204 is fastened to the first main shaft 202 by bolts disposed in the clearance groove 2041.

[0037] A main air passage 2021 is provided inside the first main shaft 202 along its axis. The upper end of the main air passage 2021 extends upward through the upper surface of the first main shaft 202, and the lower end of the main air passage 2021 is closed. A plurality of suction holes are provided inside the rotating seat 204, with their lower ends communicating with the main air passage 2021 and their upper ends extending through the upper surface of the rotating seat 204. An air inlet 2022 is provided on the first main shaft 202, connecting the lower end cavity of the main air passage 2021 with the external space of the main shaft. An outer sleeve of the first main shaft 202 at the air inlet 2022 is fitted with a first... The main shaft 202 is rotatably connected to a sealing sleeve 2023. An air inlet ring groove 20231 is recessed on the inner wall of the sealing sleeve 2023 near the air inlet hole 2022. An air inlet connector 2024, communicating with the air inlet ring groove 20231, is provided on the sealing sleeve 2023. The air inlet connector 2024 can be connected to multiple external pipes, allowing control of the flow of each pipe. This enables vacuuming of the main air passage 2021 and the introduction of high-pressure water or positive-pressure gas into the main air passage 2021. Introducing high-pressure water can backwash the adsorption holes to prevent blockage. When the substrate to be chamfered is placed on the upper surface of the rotating base 204, a negative pressure is generated in the main air passage 2021 by an external vacuum device, thereby adsorbing and fixing the substrate 50 onto the surface of the rotating base 204.

[0038] Combination Figures 5-7As shown, the follower mechanism includes a support plate 2051 symmetrically arranged on both sides of the first fixed cylinder 201, a vertical slide block 2052 slidably connected to the support plate 2051, a first horizontal slide rail 2053 arranged along the first horizontal direction at the upper end of the vertical slide block 2052, a first moving plate 2054 arranged horizontally and slidably connected at both ends to the corresponding first horizontal slide rail 2053, a follower component mounted on the first moving plate 2054 for pressing the substrate, a third vertical drive member 2056 for driving the vertical slide block 2052 to slide up and down along the support plate 2051, and a transverse drive member 2057 for driving the first moving plate 2054 to slide along the first horizontal slide rail 2053. The support plates 2051 symmetrically arranged on both sides of the first fixed cylinder 201 are both vertically arranged, and the two support plates 2051 are arranged along the second horizontal direction. The third vertical drive member 2056 is a vertically arranged cylinder, which is fastened to the support plate 2051 by bolts. The output shaft of the third vertical drive member 2056 is arranged upward and connected to the vertical slide 2052. The third vertical drive member 2056 is connected to an external air source, and its operation is controlled by a controller. The horizontal drive member 2057 is a horizontally arranged cylinder, which is fastened to the vertical slide 2052 by bolts. The output shaft of the transverse drive component 2057 is fixedly connected to the first moving plate 2054 to drive the first moving plate 2054 to slide along the first horizontal direction. The first moving plate 2054 is provided with a mounting hole corresponding to the clearance groove 2041. The follower component includes a rotating ring 2055 disposed in the mounting hole. The rotating ring 2055 is rotatably connected to the first moving plate 2054 through a bidirectional thrust bearing. The inner diameter of the rotating ring 2055 is larger than the inner diameter of the substrate 50. The lower end of the rotating ring 2055 extends downward out of the lower end face of the first moving plate 2054. An elastic layer is disposed on the lower end face of the rotating ring 2055 that contacts the upper surface of the substrate 50.

[0039] In the above scheme, the third vertical drive member 2056 drives the vertical slide 2052 to move the first moving plate 2054 upward, causing the elastic layer on the lower surface of the rotating ring 2055 to leave the surface of the substrate 50. Then, the horizontal drive member 2057 drives the first moving plate 2054 to move along the first horizontal slide rail 2053 away from the top of the rotating seat 204, which facilitates the picking and placing of the substrate on the rotating seat 204. After the substrate 50 is placed on the rotating seat 204 and fixed by adsorption, the horizontal drive member 2057 can be run to drive the first moving plate 2054 to slide along the first horizontal slide rail 2053 to a position where the rotating ring 2055 is coaxial with the clearance groove 2041. Then, the third vertical drive member 2056 is run to move the first moving plate 2054 downward, causing the elastic layer at the bottom of the rotating ring 2055 to press the substrate 50 on the rotating seat 204. When the rotating seat 204 drives the substrate 50 to rotate, the rotating ring 2055 rotates synchronously with the substrate 50 and keeps pressing the substrate 50.

[0040] The external grinding assembly 41 includes a second fixed cylinder 411 that is vertically arranged and fixedly connected to the frame 10, a second main shaft 412 that is coaxially inserted through the second fixed cylinder 411, an outer edge grinding wheel 413 that is coaxially arranged at the upper end of the second main shaft 412, and a second rotary drive member 414 that is placed at the lower end of the second fixed cylinder 411 for driving the second main shaft 412 to rotate. The second fixed cylinder 411 is fixedly connected to the frame 10 through a connecting plate. The second rotary drive 414 is a drive motor. The second rotary drive 414 is fastened to the lower end of the second fixed cylinder 411 by bolts. The upper end of the second main shaft 412 extends upward beyond the second fixed cylinder 411. The upper end of the second main shaft 412 is coaxially fixedly connected to the output shaft of the second rotary drive 414. The outer edge grinding wheel 413 is fixedly connected to the upper end of the second main shaft 412. Multiple V-shaped outer edge grinding grooves 4131 are arranged coaxially and sequentially on the circumferential surface of the outer edge grinding wheel 413 for grinding and chamfering the outer edge of the substrate.

[0041] The internal grinding assembly 42 includes an internal grinding wheel 421 vertically arranged for grinding and chamfering the inner edge of the substrate, and an internal grinding drive unit 422 for driving the internal grinding wheel 421 to move and rotate. The internal grinding wheel 421 is generally a vertically arranged cylinder, and a plurality of V-shaped internal grinding grooves 4211 are arranged coaxially and sequentially on the circumferential surface of the internal grinding wheel 421 for grinding and chamfering the inner edge of the substrate. The internal grinding drive unit 422 includes a horizontally arranged fixed plate 4221 fixedly connected to the frame 10, a horizontal slide rail assembly 4222 arranged on the fixed plate 4221 along a first horizontal direction, a horizontal slide plate 4223 slidably connected to the horizontal slide rail assembly 4222, and a horizontal drive unit 4223 for driving the horizontal slide plate 4223 to slide along the horizontal slide rail assembly 4222. The components include: a moving member 4224; a vertical mounting plate 4225 fixedly connected to the horizontal sliding plate 4223; a second vertical slide rail assembly 4226 vertically disposed on the vertical mounting plate 4225; a second vertical sliding plate 4227 slidably connected to the second vertical slide rail assembly 4226; a second vertical driving member 4228 disposed on the vertical mounting plate 4225 for driving the second vertical sliding plate 4227 to slide along the second vertical slide rail assembly 4226; and a third rotary driving member 4229 disposed on the second vertical sliding plate 4227 for driving the inner edge grinding wheel 421 to rotate. The horizontal drive component 4224 is a drive motor. The horizontal drive component 4224 drives the horizontal slide plate 4223 to slide along the horizontal slide rail assembly 4222 via a screw and nut transmission method. The vertical mounting plate 4225 is vertically arranged. The second vertical drive component 4228 is a drive motor. The second vertical drive component 4228 drives the second vertical slide plate 4227 along the second vertical slide rail assembly 4226 via a screw and nut transmission method. The output shaft of the third rotary drive component 4229 is vertically arranged downwards. The inner edge grinding wheel 421 is coaxially fixedly connected to the output shaft of the third rotary drive component 4229. The maximum outer diameter of the inner edge grinding wheel 421 is smaller than the inner diameter of the substrate.

[0042] Understandably, although both wafers and glass hard disk platters have similar brittle properties, glass hard disk platters are more sensitive to heat. Excessive grinding speed can easily cause thermal damage or microcracks on the processed surface of the glass substrate. Therefore, when using this device to chamfer the inner and outer circles of glass hard disk platters, the rotational speeds of the outer edge grinding wheel 413 and the inner edge grinding wheel 421 should be appropriately reduced, and the feed rate should also be reduced. The specific rotational speeds can be reasonably determined based on the size of the outer edge grinding wheel 413 and the inner edge grinding wheel 421, and the specific feed rate can be reasonably determined based on parameters such as the thickness of the glass hard disk platter to be chamfered and the size of the chamfer, in order to prevent excessive grinding temperatures during chamfering from causing thermal damage or microcracks in the glass hard disk platters.

[0043] Understandably, in this embodiment, all driving components used to provide power, including but not limited to various motors, cylinders, hydraulic cylinders, electric telescopic rods, etc., are connected to and controlled by the controller. Each cylinder is connected to a corresponding air source pipe, each motor is connected to an external power supply, and the corresponding vacuuming equipment is connected to and controlled by the controller.

[0044] Example 2 This embodiment provides a method for chamfering the inner and outer corners of a substrate, such as... Figure 8 , Figure 10 As shown, it includes the following steps: S1. Control the moving part 30 to drive the fixing part 20 to move to the set material pick-up and put-out position, place the substrate 50 to be chamfered on the fixing part 20, vacuum the fixing part 20 to adsorb and fix the substrate 50 and drive the substrate 50 to rotate. S2. Run the external grinding drive to rotate the outer edge grinding wheel 413 on the external grinding assembly 41, and run the internal edge grinding wheel 421 on the internal grinding assembly 42 to rotate. S3. Control the moving part 30 to drive the fixed part 20 to move so that the substrate gradually approaches the outer edge grinding wheel 413 to grind and chamfer the outer edge of the substrate 50. Control the inner grinding drive unit 422 on the inner grinding assembly 42 to drive the inner edge grinding wheel 421 to move closer to the inner edge of the substrate 50 to grind and chamfer the inner edge of the substrate 50. S4. Control the inner grinding drive unit 422 on the inner grinding assembly 42 to drive the inner edge grinding wheel 421 to move away from the substrate 50, and control the moving part 30 to drive the fixing part 20 to move to the material pick-up and drop-off position. S5. Stop adsorbing the substrate 50 and remove the substrate 50 from the fixing part 20; Furthermore, step S3 includes the following sub-steps: S31. Simultaneously grind and chamfer the inner and outer upper edges of the substrate 50: Control the moving part 30 to drive the fixing part 20 to move so that the outer upper edge of the substrate 50 gradually approaches and contacts the upper inner wall of a certain V-shaped outer edge grinding groove 4131 on the outer edge grinding wheel 413; control the inner grinding drive unit 422 to drive the inner edge grinding wheel 421 to move so that the upper inner wall of a certain V-shaped inner edge grinding groove 4211 on the inner edge grinding wheel 421 gradually approaches and contacts the inner upper edge of the substrate 50; or Simultaneous grinding and chamfering of the inner lower edge and outer lower edge of the substrate 50: The control moving part 30 drives the fixed part 20 to move so that the outer lower edge of the substrate 50 gradually approaches and contacts the lower inner wall of a certain V-shaped outer edge grinding groove 4131 on the outer edge grinding wheel 413; the control inner grinding drive unit 422 drives the inner edge grinding wheel 421 to move so that the lower inner wall of a certain V-shaped inner edge grinding groove 4211 on the inner edge grinding wheel 421 gradually approaches and contacts the inner lower edge of the substrate 50. S32. After chamfering the inner upper edge and outer upper edge of the substrate 50, the inner grinding drive unit 422 is controlled to drive the inner edge grinding wheel 421 to move radially away from the substrate 50. Then, the moving part 30 is controlled to drive the fixing part 20 to move downward so that the outer lower edge of the substrate 50 gradually approaches and contacts the lower inner wall of the V-shaped outer edge grinding groove 4131 of the outer edge grinding wheel 413. The inner grinding drive unit 422 is controlled to drive the inner edge grinding wheel 421 to move so that the lower inner wall of the V-shaped inner edge grinding groove 4211 of the inner edge grinding wheel 421 gradually approaches and contacts the inner lower edge of the substrate 50, and the inner lower edge and outer lower edge of the substrate 50 are simultaneously ground and chamfered; or After chamfering the inner lower edge and outer lower edge of the substrate 50, the inner grinding drive unit 422 is controlled to drive the inner edge grinding wheel 421 to move radially away from the substrate 50. Then, the moving part 30 is controlled to drive the fixing part 20 to move upward so that the outer upper edge of the substrate 50 gradually approaches and contacts the upper inner wall of the V-shaped outer edge grinding groove 4131 of the outer edge grinding wheel 413. The inner grinding drive unit 422 is controlled to drive the inner edge grinding wheel 421 to move so that the upper inner wall of the V-shaped inner edge grinding groove 4211 gradually approaches and contacts the inner upper edge of the substrate 50, and the inner upper edge and outer upper edge of the substrate 50 are simultaneously ground and chamfered.

[0045] The above embodiments merely illustrate preferred implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention should be determined by the appended claims.

Claims

1. A device for chamfering the inner and outer corners of a substrate, characterized in that, include: The frame is used to support and mount other components of the substrate inner and outer chamfering device; The fixing part is used to adsorb and fix the substrate and drive the substrate to rotate. The fixing part is provided with a clearance groove that is coaxially arranged with the inner hole of the substrate. The clearance groove provides the movement space when the inner edge of the substrate is chamfered. A movable part, disposed on the frame, is used to drive the fixed part to move so that the substrate is located at a set processing position; The grinding section includes an outer grinding assembly and an inner grinding assembly, which are used to chamfer and grind the outer and inner edges of the substrate on the fixing part, respectively.

2. The substrate inner and outer chamfering device according to claim 1, characterized in that, The moving part includes: A lower moving component, disposed on the frame, is used to drive the fixed part to move along a first horizontal direction; An upper moving component is disposed on the lower moving component to drive the fixed part to move along a second horizontal direction that is perpendicular to the first horizontal direction; A vertical moving component is disposed on the upper moving component to drive the fixed part to move in the vertical direction. The fixed part is disposed on the vertical moving component.

3. The substrate inner and outer chamfering device according to claim 2, characterized in that: The lower moving assembly includes a lower slide rail group fixedly connected to the frame and arranged along a first horizontal direction, a lower slide plate arranged horizontally and slidably connected to the lower slide rail group, and a lower driving member arranged on the frame for driving the lower slide plate to slide along the lower slide rail group; the upper moving assembly includes an upper slide rail group arranged along a second horizontal direction on the lower slide plate, an upper slide plate arranged horizontally and slidably connected to the upper slide rail group, and an upper driving member arranged on the lower slide plate for driving the upper slide plate to slide along the upper slide rail group; the vertical moving assembly includes a first connecting plate arranged on the upper slide plate, a first vertical slide rail group arranged vertically on the first connecting plate, a first vertical slide plate slidably connected to the first vertical slide rail group, and a first vertical driving member arranged on the first connecting plate for driving the vertical slide plate to move along the vertical slide rail group, and the fixing part is arranged on the first vertical slide plate.

4. The substrate inner and outer chamfering device according to claim 3, characterized in that: The fixing part includes a first fixing cylinder that is vertically arranged and detachably connected to the first vertical sliding plate, a first main shaft that is coaxially inserted through the first fixing cylinder, a first rotary drive component that is detachably connected to the first vertical sliding plate for driving the first main shaft to rotate, and a rotating seat that is coaxially arranged at the upper end of the first main shaft for adsorbing and fixing the substrate. The clearance groove is coaxially arranged on the upper surface of the rotating seat.

5. The substrate inner and outer chamfering device according to claim 1, characterized in that: The external grinding assembly includes a second fixed cylinder that is vertically arranged and fixedly connected to the frame, a second main shaft that is coaxially inserted through the second fixed cylinder, an outer edge grinding wheel that is coaxially arranged at the upper end of the second main shaft, and a second rotary drive component that is placed at the lower end of the second fixed cylinder for driving the second main shaft to rotate.

6. The substrate inner and outer chamfering device according to claim 5, characterized in that: The outer edge grinding wheel is provided with multiple V-shaped outer edge grinding grooves on its circumferential surface for grinding and chamfering the outer edge of the substrate.

7. The substrate inner and outer chamfering device according to claim 1, characterized in that: The internal grinding assembly includes an internal edge grinding wheel that is vertically arranged for grinding and chamfering the inner edge of the substrate, and an internal grinding drive unit that drives the internal edge grinding wheel to move and rotate. The internal grinding drive unit includes a fixed plate horizontally arranged and fixedly connected to the frame, a horizontal slide rail assembly arranged on the fixed plate along a first horizontal direction, a horizontal slide plate slidably connected to the horizontal slide rail assembly, a horizontal drive member driving the horizontal slide plate to slide along the horizontal slide rail assembly, a vertical mounting plate fixedly connected to the horizontal slide plate, a second vertical slide rail assembly vertically arranged on the vertical mounting plate, a second vertical slide plate slidably connected to the second vertical slide rail assembly, a second vertical drive member arranged on the vertical mounting plate for driving the second vertical slide plate to slide along the second vertical slide rail assembly, and a third rotary drive member arranged on the second vertical slide plate for driving the internal grinding wheel to rotate. The output shaft of the third rotary drive member is vertically arranged downwards, and the internal grinding wheel is coaxially fixedly connected to the output shaft of the third rotary drive member. The maximum outer diameter of the internal grinding wheel is smaller than the inner diameter of the substrate.

8. The substrate inner and outer chamfering device according to claim 7, characterized in that: The inner edge grinding wheel has multiple V-shaped inner edge grinding grooves coaxially arranged on its circumferential surface to grind and chamfer the inner edge of the substrate.

9. A method for chamfering the inner and outer corners of a substrate, characterized in that... Includes the following steps: S1. Control the moving part to drive the fixing part to move to the set pick-up and put-out position, place the substrate to be chamfered on the fixing part, vacuum the fixing part to adsorb and fix the substrate and drive the substrate to rotate. S2. Running causes the outer edge grinding wheel on the outer grinding assembly to rotate, and running causes the inner edge grinding wheel on the inner grinding assembly to rotate; S3. Control the moving part to drive the fixed part to move so that the substrate gradually approaches the outer edge grinding wheel to grind and chamfer the outer edge of the substrate. Control the inner grinding drive unit to drive the inner edge grinding wheel to move and approach the inner edge of the substrate to grind and chamfer the inner edge of the substrate. S4. Control the inner grinding drive unit on the inner grinding assembly to drive the inner edge grinding wheel to move away from the substrate, and control the moving part to drive the fixed part to move to the material pick-up and drop-off position. S5. Stop adsorbing the substrate and remove the substrate from the fixing part.

10. The method for chamfering the inner and outer corners of a substrate according to claim 9, characterized in that, Step S3 includes the following sub-steps: S31. Simultaneously grind and chamfer the inner and outer upper edges of the substrate: Control the moving part to drive the fixed part to move so that the outer upper edge of the substrate gradually approaches and contacts the upper inner wall of a certain V-shaped outer edge grinding groove on the outer edge grinding wheel; control the inner grinding drive unit to drive the inner edge grinding wheel to move so that the upper inner wall of a certain V-shaped inner edge grinding groove on the inner edge grinding wheel gradually approaches and contacts the inner upper edge of the substrate; or Simultaneous grinding and chamfering of the inner lower edge and outer lower edge of the substrate: control the moving part to drive the fixed part to move so that the outer lower edge of the substrate gradually approaches and contacts the lower inner wall of a certain V-shaped outer edge grinding groove on the outer edge grinding wheel; control the inner grinding drive unit to drive the inner edge grinding wheel to move so that the lower inner wall of a certain V-shaped inner edge grinding groove on the inner edge grinding wheel gradually approaches and contacts the inner lower edge of the substrate. S32. After chamfering the inner upper edge and outer upper edge of the substrate, control the inner grinding drive unit to drive the inner edge grinding wheel to move radially away from the substrate. Then, control the moving part to drive the fixing part to move downward so that the outer lower edge of the substrate gradually approaches and contacts the lower inner wall of the V-shaped outer edge grinding groove of the outer edge grinding wheel. Control the inner grinding drive unit to drive the inner edge grinding wheel to move so that the lower inner wall of the V-shaped inner edge grinding groove of the inner edge grinding wheel gradually approaches and contacts the inner lower edge of the substrate. Simultaneously grind and chamfer the inner lower edge and outer lower edge of the substrate; or After chamfering the inner lower edge and outer lower edge of the substrate, the inner grinding drive unit is controlled to drive the inner edge grinding wheel to move radially away from the substrate. Then, the moving part is controlled to drive the fixing part to move upward so that the outer upper edge of the substrate gradually approaches and contacts the upper inner wall of the V-shaped outer edge grinding groove of the outer edge grinding wheel. The inner grinding drive unit is controlled to drive the inner edge grinding wheel to move so that the upper inner wall of the V-shaped inner edge grinding groove of the inner edge grinding wheel gradually approaches and contacts the inner upper edge of the substrate, and the inner upper edge and outer upper edge of the substrate are simultaneously ground and chamfered.

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