Clean type chip substrate automatic storage stereoscopic intelligent warehouse

Abstract

This application relates to the field of chip substrate storage and retrieval equipment technology, and provides a clean-type automated storage three-dimensional intelligent warehouse for chip substrates, comprising: a closed warehouse body, the closed warehouse body including multiple storage compartments, the interior of the closed warehouse body forming an activity space for a storage and retrieval mechanism, the storage compartments having openings, and the closed warehouse body also having a retrieval port; a retrieval drawer movably disposed in the closed warehouse body, the retrieval drawer being able to move between a closed position and an open position; and a storage and retrieval mechanism disposed in the activity space of the storage and retrieval mechanism, the storage and retrieval mechanism being used to extract and release a chip substrate from any storage compartment onto the retrieval drawer in the closed position, and to extract and release a chip substrate from the retrieval drawer in the closed position onto any storage compartment. This clean-type automated storage three-dimensional intelligent warehouse for chip substrates can balance the cleanliness of the storage space with the convenience and efficiency of the retrieval and placement operations.

Description

Technical Field

[0001] This application relates to the field of chip substrate storage and retrieval equipment technology, and more specifically, to a clean chip substrate automated storage three-dimensional intelligent warehouse. Background Technology

[0002] The chip substrate is a core component in the semiconductor packaging process, and its surface cleanliness directly affects the reliability and yield of subsequent processes such as die mounting, bonding, and molding. As integrated circuit manufacturing processes continue to shrink, the cleanliness requirements for the storage environment on the chip substrate are becoming increasingly stringent. Throughout the entire storage process, the chip substrate should be kept in a highly clean, temperature and humidity-controlled environment to avoid damage caused by particulate contamination, oxidation, moisture, or electrostatic discharge.

[0003] The storage of chip substrates in existing technologies mainly adopts the following two methods: In the cleanroom-type automated storage and retrieval intelligent storage chamber for chip substrates provided in this application, the openings of the storage compartments face the activity space of the storage and retrieval mechanism within the enclosed chamber. The storage and retrieval mechanism is also enclosed within this activity space. During the chip substrate storage and retrieval operation between the retrieval drawer and the storage compartment, the retrieval mechanism operates while the retrieval drawer is in the closed position. This means the storage and retrieval mechanism can perform retrieval and placement operations on chip substrates from the retrieval drawer and any storage compartment within the enclosed activity space. The entire storage and retrieval process is completed in a sealed environment, ensuring that the chip substrates in the storage compartments are virtually unaffected by dust and other impurities outside the enclosed chamber, thus balancing the cleanliness of the storage space with the convenience and efficiency of the retrieval and placement operations. Summary of the Invention

[0004] In view of this, this application provides a clean chip substrate automated storage three-dimensional intelligent warehouse that can balance the cleanliness of the storage space with the convenience and efficiency of retrieval and placement operations.

[0005] This application provides a cleanroom-type automated storage three-dimensional intelligent warehouse for chip substrates, wherein the cleanroom-type automated storage three-dimensional intelligent warehouse for chip substrates includes: A closed silo, comprising multiple storage compartments, with the interior of the closed silo forming a sealed space for a material storage and retrieval mechanism. Each storage compartment has an opening communicating with the space for the material storage and retrieval mechanism, and the closed silo is also provided with a retrieval port communicating with the space for the material storage and retrieval mechanism. A material retrieval drawer is movably disposed within the enclosed compartment. The material retrieval drawer is movable between a closed position and an open position. In the closed position, the material retrieval drawer is located within the enclosed compartment and the material retrieval port is closed. In the open position, the material retrieval drawer extends out of the enclosed compartment through the material retrieval port. The storage and retrieval mechanism is provided in the activity space of the storage and retrieval mechanism. The storage and retrieval mechanism is used to extract and release the chip substrate in any of the storage cells to the retrieval drawer in the closed position, and to extract and release the chip substrate on the retrieval drawer in the closed position to any of the storage cells.

[0006] Furthermore, the enclosed silo includes a first storage cabinet and a second storage cabinet arranged at intervals along its width direction. Both the first and second storage cabinets extend along the length direction of the enclosed silo. Each of the first and second storage cabinets has a plurality of storage compartments. The moving space of the storage and retrieval mechanism is located between the compartment openings of the first and second storage cabinets. The compartment openings of the first and second storage cabinets face each other.

[0007] Furthermore, the enclosed silo includes a first end cabinet and a second end cabinet connected to the two ends of the length direction of the first storage cabinet and the second storage cabinet, a cover plate connected to the upper end of the first storage cabinet, the second storage cabinet, the first end cabinet and the second end cabinet, and a bottom plate connected to the lower end of the first storage cabinet, the second storage cabinet, the first end cabinet and the second end cabinet. The first storage cabinet, the second storage cabinet, the first end cabinet, the second end cabinet, the cover plate and the bottom plate together enclose the activity space of the material storage and retrieval mechanism.

[0008] Furthermore, the material storage and retrieval mechanism includes a first electrically controlled horizontal linear guide rail extending along the length direction of the enclosed hopper, an electrically controlled lifting guide rail connected to the first electrically controlled horizontal linear guide rail, a second electrically controlled horizontal linear guide rail connected to the electrically controlled lifting guide rail, a first electrically controlled rotary table connected to the second electrically controlled horizontal linear guide rail, a first rotating arm connected to the first electrically controlled rotary table, and a first material retrieval mechanism connected to the first rotating arm. The first electrically controlled horizontal linear guide rail can drive the electrically controlled lifting guide rail to slide along the length direction of the enclosed hopper, the electrically controlled lifting guide rail can drive the second electrically controlled horizontal linear guide rail to move up and down, the second electrically controlled horizontal linear guide rail can drive the first electrically controlled rotary table to slide along the width direction of the enclosed hopper, the first electrically controlled rotary table can drive the first rotating arm to rotate around a vertical axis, and the first material retrieval mechanism can extract and release a chip substrate from any of the storage compartments onto a material retrieval drawer in a closed position, and can extract and release a chip substrate from a material retrieval drawer in a closed position into any of the storage compartments.

[0009] Furthermore, the material storage and retrieval mechanism also includes a third electrically controlled horizontal linear guide rail extending along the length of the enclosed silo, a fourth electrically controlled horizontal linear guide rail connected to the electrically controlled lifting guide rail, a second electrically controlled rotary table connected to the fourth electrically controlled horizontal linear guide rail, a second rotating arm connected to the second electrically controlled rotary table, and a second material retrieval mechanism connected to the second rotating arm. The first electrically controlled horizontal linear guide rail is located at the bottom of the material storage and retrieval mechanism's active space, the third electrically controlled horizontal linear guide rail is located at the top of the material storage and retrieval mechanism's active space, the lower end of the electrically controlled lifting guide rail is connected to the first electrically controlled horizontal linear guide rail, and the upper end of the electrically controlled lifting guide rail is connected to the third electrically controlled horizontal linear guide rail. The first and third electrically controlled horizontal linear guides can jointly drive the electrically controlled lifting guide to slide along the length direction of the enclosed silo. The electrically controlled lifting guide can drive the fourth electrically controlled horizontal linear guide to move up and down. The fourth electrically controlled horizontal linear guide can drive the second electrically controlled rotary table to slide along the width direction of the enclosed silo. The second electrically controlled rotary table can drive the second rotating arm to rotate around the vertical axis. The second picking mechanism can pick up and release the chip substrate in any of the storage compartments onto the picking drawer in the closed position, and can pick up and release the chip substrate on the picking drawer in the closed position into any of the storage compartments.

[0010] Furthermore, both the first and second material handling mechanisms are vacuum suction cups.

[0011] Furthermore, the material dispensing port is formed on the first storage cabinet, and the first storage cabinet is provided with a slide rail below the material dispensing port. The slide rail extends along the width direction of the enclosed hopper, and the material dispensing drawer is slidably disposed on the slide rail.

[0012] Furthermore, the number of material picking drawers is at least 6, and at least 6 material picking drawers are connected as one unit, or the number of slide rails corresponds to the number of at least 6 material picking drawers, and at least 6 material picking drawers are each independently set on their respective slide rails.

[0013] Furthermore, an electrically controlled locking mechanism is provided below the slide rail. When the material pick-up drawer is in the closed position, the electrically controlled locking mechanism can lock and fix the material pick-up drawer.

[0014] Furthermore, each of the storage compartments is equipped with a soft curtain at its opening. The upper end of the soft curtain is connected to the top of the opening of the corresponding storage compartment, and the lower end of the soft curtain is provided with a counterweight. The counterweight can press against the lower end of the opening of the corresponding storage compartment to close the opening of the corresponding storage compartment. A blowing mechanism is provided inside the storage compartment, which faces the opening. The blowing mechanism can blow up the corresponding soft curtain to open the opening of the corresponding storage compartment.

[0015] The beneficial effects of the clean-type automated storage three-dimensional intelligent warehouse for chip substrates provided in this application are as follows: In the cleanroom-type automated storage and retrieval intelligent storage chamber for chip substrates provided in this application, the openings of the storage compartments face the activity space of the storage and retrieval mechanism within the enclosed chamber. The storage and retrieval mechanism is also enclosed within this activity space. During the chip substrate storage and retrieval operation between the retrieval drawer and the storage compartment, the retrieval mechanism operates while the retrieval drawer is in the closed position. This means the storage and retrieval mechanism can perform retrieval and placement operations on chip substrates from the retrieval drawer and any storage compartment within the enclosed activity space. The entire storage and retrieval process is completed in a sealed environment, ensuring that the chip substrates in the storage compartments are virtually unaffected by dust and other impurities outside the enclosed chamber, thus balancing the cleanliness of the storage space with the convenience and efficiency of the retrieval and placement operations.

[0016] Other beneficial effects of the present invention will be described in detail below. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a perspective view of some components of a clean chip substrate automated storage three-dimensional intelligent compartment according to an embodiment of this application; Figure 2 for Figure 1 Enlarged view of point A in the middle; Figure 3 This is a schematic diagram of the internal structure of a clean chip substrate automated storage three-dimensional intelligent compartment according to an embodiment of this application; Figure 4 for Figure 3 Enlarged view of point B in the middle; Figure 5 for Figure 3 Enlarged view of point C in the middle; Figure 6This is a three-dimensional schematic diagram of a portion of the structure of a clean chip substrate automated storage three-dimensional intelligent compartment according to an embodiment of this application; Figure 7 for Figure 6 Enlarged view of point D in the middle; Figure 8 This is a three-dimensional schematic diagram of the material storage and retrieval mechanism in a clean chip substrate automated storage three-dimensional intelligent warehouse according to an embodiment of this application; Figure 9 for Figure 8 Enlarged view at point E in the middle; Figure 10 This is a simplified schematic diagram of a movable anti-fall mechanism in a clean chip substrate automated storage three-dimensional intelligent warehouse according to an embodiment of this application; Figure 11 This is a simplified schematic diagram of a clean chip substrate automated storage three-dimensional intelligent warehouse according to an embodiment of this application, where a soft curtain is installed at the opening of the storage compartment.

[0019] Explanation of reference numerals in the attached figures: 1-Chip substrate; 2-First storage cabinet; 3-Second storage cabinet; 4-First end cabinet; 5-Second end cabinet; 6-Cover plate; 7-Base plate; 8-First electrically controlled horizontal linear guide; 9-Electrically controlled lifting guide; 10-Second electrically controlled horizontal linear guide; 11-First electrically controlled rotary table; 12-First rotating arm; 13-First material handling mechanism; 14-Third electrically controlled horizontal linear guide; 15-Fourth electrically controlled horizontal linear guide; 16-Second electrically controlled... 17- Rotary table; 18- Second rotating arm; 19- Second material handling mechanism; 20- Anti-fall tray; 21- Miniature cylinder; 22- Slide rail; 23- Locking cylinder; 24- Vision sensor; 25- Soft curtain; 26- Counterweight; 30- Blowing nozzle; 100- Enclosed hopper; 101- Storage compartment; 102- Activity space for material handling mechanism; 103- Material handling port; 200- Material handling drawer; 201- Socket. Detailed Implementation

[0020] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. One or more embodiments of this application are exemplarily shown in the drawings to provide a more accurate and thorough understanding of the technical solutions disclosed herein. However, it should be understood that this application can be implemented in many different forms and is not limited to the embodiments described below.

[0021] In the accompanying drawings of this application, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0022] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously.

[0023] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0024] See Figures 1 to 10 This application provides a cleanroom-type automated storage three-dimensional intelligent warehouse for chip substrates, wherein the cleanroom-type automated storage three-dimensional intelligent warehouse for chip substrates includes: The enclosed silo 100 includes multiple storage compartments 101. The interior of the enclosed silo 100 forms a sealed storage and retrieval mechanism activity space 102. Each storage compartment 101 has an opening communicating with the storage and retrieval mechanism activity space 102. The enclosed silo 100 also has a retrieval port 103 communicating with the storage and retrieval mechanism activity space 102. A material retrieval drawer 200 is movably disposed in the enclosed silo 100. The material retrieval drawer 200 can move between a closed position and an open position. In the closed position, the material retrieval drawer 200 is located inside the enclosed silo 100 and the material retrieval port 103 is closed. In the open position, the material retrieval drawer 200 extends out of the enclosed silo 100 through the material retrieval port 103. The storage and retrieval mechanism is provided in the activity space 102 of the storage and retrieval mechanism. The storage and retrieval mechanism is used to extract and release the chip substrate 1 in any storage cell 101 to the retrieval drawer 200 which is in the closed position, and to extract and release the chip substrate 1 on the retrieval drawer 200 which is in the closed position to any storage cell 101.

[0025] The storage compartment 101 is used to store (stack) chip substrates 1, and the chip substrates 1 enter and exit the storage compartment 101 through the compartment opening. Specifically, the storage compartment 101 has a partition support structure on both sides inside for placing the chip substrates 1. The partition support structure can be a lateral groove or a lateral rib 30 provided on the two side walls of the storage compartment 101. The two ends of the chip substrates 1 are supported in the lateral groove or on the lateral rib 30, so that there is a gap between adjacent stacked chip substrates 1 without contact. The retrieval port 103 opened on the closed chamber 100 serves as the only channel for the chip substrates 1 to enter and exit the closed chamber 100.

[0026] The sealing fit between the picking drawer 200 and the picking port 103 can be achieved using sealing rings, sealing strips, or labyrinth seals. In the open position, the picking drawer 200 extends out of the closed compartment 100 through the picking port 103, allowing operators to place the chip substrate 1 into or remove it from the picking drawer 200 from the outside. The storage and retrieval mechanism can extract and release the chip substrate 1 from any storage compartment 101 onto the picking drawer 200 in the closed position (i.e., outbound operation), and extract and release the chip substrate 1 from the picking drawer 200 in the closed position onto any storage compartment 101 (i.e., inbound operation). Since the storage and retrieval mechanism is enclosed within the storage and retrieval mechanism activity space 102, and the retrieval drawer 200 can keep the retrieval port 103 closed during the storage and retrieval operation between the chip substrate 1 and the storage compartment 101, the chip substrate 1 in the storage compartment 101 is almost unaffected by dust and other impurities outside the enclosed compartment 100 during the entire storage and retrieval process.

[0027] In the cleanroom-type automated storage and intelligent storage system for chip substrates provided in this application, the opening of the storage compartment 101 faces the access space 102 of the storage and retrieval mechanism within the enclosed storage unit 100. The storage and retrieval mechanism is also enclosed within the access space 102 of the enclosed storage unit 100. During the storage and retrieval operation of the chip substrate 1 between the retrieval drawer 200 and the storage compartment 101, the retrieval mechanism operates when the retrieval drawer 200 is in the closed position. That is, the storage and retrieval mechanism can perform retrieval and placement operations on the chip substrate 1 on the retrieval drawer 200 and any storage compartment 101 within the enclosed access space 102. The storage and retrieval process of the storage and retrieval mechanism is completed in a closed environment, ensuring that the chip substrate 1 in the storage compartment 101 is almost unaffected by dust and other impurities outside the enclosed storage unit 100, thus balancing the cleanliness of the storage space with the convenience and efficiency of the retrieval and placement operations.

[0028] According to a specific embodiment of this application, the enclosed storage unit 100 includes a first storage cabinet 2 and a second storage cabinet 3 arranged at intervals along its width direction. Both the first storage cabinet 2 and the second storage cabinet 3 extend along the length direction of the enclosed storage unit 100. Each of the first storage cabinet 2 and the second storage cabinet 3 has multiple storage compartments 101. The storage and retrieval mechanism's activity space 102 is located between the openings of the storage compartments 101 in the first storage cabinet 2 and the openings of the storage compartments 101 in the second storage cabinet 3. The openings of the storage compartments 101 in the first storage cabinet 2 and the openings of the storage compartments 101 in the second storage cabinet 3 face each other. A narrow and elongated storage and retrieval mechanism activity space 102 can be formed between the first storage cabinet 2 and the second storage cabinet 3, allowing the storage and retrieval mechanism to simultaneously perform retrieval operations facing the openings of the storage compartments 101 on both sides. This maximizes storage density within a limited space while providing ample activity space for the storage and retrieval mechanism, improving space utilization and storage and retrieval efficiency.

[0029] According to one embodiment of this application, the enclosed storage unit 100 includes a first end cabinet 4 and a second end cabinet 5 connected to the two ends of the first storage cabinet 2 and the second storage cabinet 3 along their respective lengths, a cover plate 6 connected to the upper ends of the first storage cabinet 2, the second storage cabinet 3, the first end cabinet 4, and the second end cabinet 5, and a bottom plate 7 connected to the lower ends of the first storage cabinet 2, the second storage cabinet 3, the first end cabinet 4, and the second end cabinet 5. The first storage cabinet 2, the second storage cabinet 3, the first end cabinet 4, the second end cabinet 5, the cover plate 6, and the bottom plate 7 together enclose the storage and retrieval mechanism's activity space 102. The first end cabinet 4 and the second end cabinet 5 also isolate the storage and retrieval mechanism's activity space 102 from the outside of the enclosed storage unit 100. The first end cabinet 4 and the second end cabinet 5 can be provided with storage units facing the outside of the enclosed storage unit 100. In addition, an air filtration unit can be provided on the cover plate 6 to supply filtered clean air into the storage and retrieval mechanism's activity space 102 and create a positive pressure environment within the space to further prevent external pollutants from entering.

[0030] According to one embodiment of this application, the material storage and retrieval mechanism includes a first electrically controlled horizontal linear guide rail 8 extending along the length of the enclosed silo 100, an electrically controlled lifting guide rail 9 connected to the first electrically controlled horizontal linear guide rail 8, a second electrically controlled horizontal linear guide rail 10 connected to the electrically controlled lifting guide rail 9, a first electrically controlled rotary table 11 connected to the second electrically controlled horizontal linear guide rail 10, a first rotating arm 12 connected to the first electrically controlled rotary table 11, and a first material retrieval mechanism 13 connected to the first rotating arm 12. The first electrically controlled horizontal linear guide rail 8 is capable of driving the electrically controlled lifting guide rail 9 along the length of the enclosed silo 100. The electric lifting guide rail 9 can drive the second electric horizontal linear guide rail 10 to move up and down. The second electric horizontal linear guide rail 10 can drive the first electric rotary table 11 to slide along the width direction of the closed chamber 100. The first electric rotary table 11 can drive the first rotating arm 12 to rotate around the vertical axis. The first picking mechanism 13 can pick up the chip substrate 1 in any storage cell 101 and release it onto the picking drawer 200 in the closed position, and can pick up the chip substrate 1 on the picking drawer 200 in the closed position and release it into any storage cell 101.

[0031] In addition, the material storage and retrieval mechanism also includes a third electrically controlled horizontal linear guide rail 14 extending along the length of the enclosed silo 100, a fourth electrically controlled horizontal linear guide rail 15 connected to the electrically controlled lifting guide rail 9, a second electrically controlled rotary table 16 connected to the fourth electrically controlled horizontal linear guide rail 15, a second rotating arm 17 connected to the second electrically controlled rotary table 16, and a second material retrieval mechanism 18 connected to the second rotating arm 17. The first electrically controlled horizontal linear guide rail 8 is located at the bottom of the material storage and retrieval mechanism's active space 102, the third electrically controlled horizontal linear guide rail 14 is located at the top of the material storage and retrieval mechanism's active space 102, the lower end of the electrically controlled lifting guide rail 9 is connected to the first electrically controlled horizontal linear guide rail 8, and the upper end of the electrically controlled lifting guide rail 9 is connected to the third electrically controlled horizontal linear guide rail 14. The electrically controlled horizontal linear guide rail 8 and the third electrically controlled horizontal linear guide rail 14 can jointly drive the electrically controlled lifting guide rail 9 to slide along the length direction of the enclosed hopper 100. The electrically controlled lifting guide rail 9 can drive the fourth electrically controlled horizontal linear guide rail 15 to move up and down. The fourth electrically controlled horizontal linear guide rail 15 can drive the second electrically controlled rotary table 16 to slide along the width direction of the enclosed hopper 100. The second electrically controlled rotary table 16 can drive the second rotating arm 17 to rotate around the vertical axis. The second material picking mechanism 18 can pick up the chip substrate 1 in any storage compartment 101 and release it onto the material picking drawer 200 in the closed position, and can also pick up the chip substrate 1 on the material picking drawer 200 in the closed position and release it into any storage compartment 101. The first material picking mechanism 13 and the second material picking mechanism 18 can each respectively handle the material storage and retrieval work of the first storage cabinet 2 and the second storage cabinet 3, or they can both handle the material storage and retrieval work of the first storage cabinet 2 and the second storage cabinet 3. Furthermore, due to the dual material handling mechanism configuration in this embodiment, the two material handling mechanisms can work independently or collaboratively, which greatly improves the access efficiency of the chip substrate 1. At the same time, the upper and lower ends of the electrically controlled lifting guide rail 9 are respectively connected to the first electrically controlled horizontal linear guide rail 8 and the third electrically controlled horizontal linear guide rail 14, which makes the movement of the electrically controlled lifting guide rail 9 more stable and reliable.

[0032] According to a specific embodiment of this application, both the first material handling mechanism 13 and the second material handling mechanism 18 are vacuum suction cups, with the vacuum suction cups specifically facing downwards from the first rotating arm 12 or the second rotating arm 17.

[0033] See Figure 10According to one embodiment of this application, a movable anti-drop mechanism is further provided on the first rotating arm 12 and the second rotating arm 17. This movable anti-drop mechanism provides additional physical protection for the chip substrate 1 after the vacuum suction cup picks it up, preventing damage from a fall due to accidental failure of the vacuum suction cup. Specifically, the movable anti-drop mechanism includes an anti-drop support plate 19 and a drive assembly. The drive assembly is disposed on the first rotating arm 12 and the second rotating arm 17, and the anti-drop support plate 19 is drively connected to the corresponding drive assembly. After the vacuum suction cup picks up the upper surface of the chip substrate 1, the drive assembly drives the anti-drop support plate 19 to move below the picked-up chip substrate 1. When the vacuum suction cup is working normally to pick up the chip substrate 1, a certain gap is maintained between the anti-drop support plate 19 and the lower surface of the chip substrate 1, preventing contact with the chip substrate 1 and avoiding frictional damage to the chip substrate 1. When the vacuum chuck fails due to unforeseen circumstances (such as vacuum source interruption, chuck aging, or seal failure), the chip substrate 1 falls downwards under gravity. At this time, the anti-drop support 19 located below the chip substrate 1 catches the chip substrate 1, preventing it from falling onto the ground or other hard surfaces and causing damage. The anti-drop support 19 can be made of flexible materials, such as antistatic silicone, polyurethane, or soft plastic, to provide cushioning when catching the chip substrate 1, further reducing impact damage. The drive assembly can use components such as a miniature cylinder 20. The anti-drop support 19 is connected to the piston rod end of the miniature cylinder 20, and the cylinder's extension and retraction drive the anti-drop support 19 to move between the extended position (chuck) and the retracted position (away from the chuck). The control of the movable anti-drop mechanism can be linked with the vacuum chuck (first picking mechanism 13 and second picking mechanism 18). When the vacuum suction cup starts adsorption, the movable anti-drop mechanism remains in the retracted state; when the vacuum suction cup completes adsorption and begins to transport the chip substrate 1, the anti-drop support plate 19 extends to below the chip substrate 1; when the vacuum suction cup reaches the target position and is ready to release the chip substrate 1, the anti-drop support plate 19 retracts first, and then the vacuum suction cup releases the chip substrate 1.

[0034] According to one embodiment of this application, a material inlet 103 is formed on a first storage cabinet 2. A slide rail 21 is provided below the material inlet 103 in the first storage cabinet 2. The slide rail 21 extends along the width direction of the enclosed hopper 100, and a material drawer 200 is slidably mounted on the slide rail 21. The material drawer 200 can be slidable using either an electrically controlled drive (in which case the slide rail 21 is an electrically controlled guide rail) or a manually driven drive.

[0035] According to one embodiment of this application, the number of material picking drawers 200 is at least 6, and at least 6 material picking drawers 200 are connected as one unit, or the number of slide rails 21 corresponds to the number of at least 6 material picking drawers 200, and at least 6 material picking drawers 200 are independently arranged on their respective slide rails 21. This method is preferred in this application, which facilitates independent control of each material picking drawer 200. The purpose of setting multiple material picking drawers 200 is to improve the flexibility and efficiency of storage and retrieval operations. Different material picking drawers 200 can be used to store chip substrates 1 of different batches, different specifications or different process states, and can also be used for warehousing and outbound operations respectively to avoid cross-contamination.

[0036] According to one embodiment of this application, an electrically controlled locking mechanism is provided below the slide rail 21. When the material pick-up drawer 200 is in the closed position, the electrically controlled locking mechanism can lock and fix the material pick-up drawer 200. The electrically controlled locking mechanism is used to lock and fix the material pick-up drawer 200 when it is in the closed position, preventing the material pick-up drawer 200 from being opened unexpectedly due to accidental reasons (such as vibration, accidental contact, etc.), thereby ensuring the airtightness of the closed compartment 100 and the safety of the chip substrate 1. According to a specific embodiment of this application, the electrically controlled locking mechanism is a locking cylinder 22. A corresponding insertion hole 201 is provided at the bottom of the material pick-up drawer 200. When the material pick-up drawer 200 slides to the closed position, the piston rod of the locking cylinder 22 extends upward under pneumatic control and inserts into the insertion hole 201 at the bottom of the material pick-up drawer 200, thereby locking and fixing the material pick-up drawer 200. When it is necessary to open the material pick-up drawer 200, the piston rod of the locking cylinder 22 retracts, releasing the locking state.

[0037] In addition, a vision sensor 23 can be installed on the inner side of the upper end of the material picking port 103 to determine whether the material picking drawer 200 has accurately reached the closed position. The vision sensor 23 is connected to the control system signal. When the vision sensor 23 detects that the material picking drawer 200 has reached the closed position, the control system controls the electronic locking mechanism to lock and fix the material picking drawer 200. At the same time, the vision sensor 23 can also be used to detect whether the electronic locking mechanism has successfully locked the material picking drawer 200, and to detect status information such as whether there is a chip substrate 1 on the material picking drawer 200.

[0038] See Figure 11According to one embodiment of this application, a soft curtain 24 is installed at the opening of each storage compartment 101. The upper end of the soft curtain 24 is connected to the upper part of the opening of the corresponding storage compartment 101, and a counterweight 25 is provided at the lower end of the soft curtain 24. The counterweight 25 can press against the lower end of the opening of the corresponding storage compartment 101 to close the opening of the corresponding storage compartment 101. A blowing mechanism is provided inside the storage compartment 101 facing the opening. The blowing mechanism can blow up the corresponding soft curtain 24 to open the opening of the corresponding storage compartment 101. This embodiment is preferably combined with an embodiment in which a partition bearing structure is provided on both sides of the interior of the storage compartment 101. In this way, there is a gap between the stacked adjacent chip substrates 1, and the airflow blown by the blowing mechanism can pass through the gap between the adjacent chip substrates 1 to reach the soft curtain 24.

[0039] In this embodiment, the upper edge of the flexible curtain 24 can be fixedly installed on the wall above the storage compartment 101 opening by means of fixing strips, clamps, or adhesives. The flexible curtain 24 is made of flexible materials, such as antistatic PVC film, silicone film, or polyurethane film, which has good flexibility and durability. The width and height of the flexible curtain 24 match the width and height of the storage compartment 101 opening, and can completely cover the opening. The counterweight 25 can be made of materials such as metal strips or plastic strips and has a certain weight. The counterweight 25 is fixedly connected to the lower edge of the flexible curtain 24, and pulls the flexible curtain 24 straight downward under the action of gravity. The counterweight 25 can press against the lower end of the corresponding storage compartment 101 opening, so that the flexible curtain 24 remains taut and closes the corresponding storage compartment 101 opening in its natural state. Through the gravity of the counterweight 25, the flexible curtain 24 always remains closed when there is no external force, effectively preventing particles in the storage and retrieval mechanism's activity space 102 from entering the storage compartment 101. The purging mechanism may include a purging nozzle 26 and an air supply line. The purging nozzle 26 is located inside the storage cell 101 and faces the opening. The air supply line is connected to the purging nozzle 26 and supplies compressed air or clean nitrogen to the purging nozzle 26. When it is necessary to open the opening of a storage cell 101, the control system controls the purging mechanism corresponding to that storage cell 101 to start. Compressed air or clean nitrogen is sprayed from the purging nozzle 26, blowing the soft curtain 24 from the inside out, opening the opening, and the storage and retrieval mechanism can then perform the chip substrate 1 retrieval operation. After the storage and retrieval operation is completed, the purging mechanism stops supplying air, and the soft curtain 24 automatically falls back under the gravity of the counterweight 25, re-closing the opening. The purging mechanism can be connected to the main air supply source through independent branch purging pipes. Each storage cell 101 corresponds to one branch purging pipe and one purging nozzle 26, and the on / off state is independently controlled by a solenoid valve. In addition to opening the soft curtain 24, the purging mechanism can also purge and clean the inside of the storage compartment 101 and the surface of the chip substrate 1 before storage and retrieval operations, removing any particles that may be present on the surface of the chip substrate 1, and further ensuring the cleanliness of the chip substrate 1.

[0040] In summary, the automated three-dimensional intelligent storage chamber for clean chip substrates provided in this application can be widely applied to semiconductor packaging and testing, chip substrate manufacturing, and various electronic component production sites requiring high-cleanliness storage conditions. Through the coordinated design of the enclosed chamber 100, multi-cell three-dimensional storage, sealed access space 102 for the material handling mechanism, and access drawer 200, automated access to the chip substrate 1 in a highly clean environment is achieved, effectively solving the technical defects of both open storage and sealed cabinet storage. The dual access mechanism configuration and three-dimensional storage structure significantly improve access efficiency and storage density. The movable anti-drop mechanism catches the chip substrate 1 in case of accidental vacuum suction cup failure, effectively preventing damage from falls and greatly improving the safety and reliability of the access process. The soft curtain 24 and the blowing mechanism further enhance the sealing and cleanliness of each cell 101. This three-dimensional intelligent chamber has a reasonable structural design, high degree of automation, good cleanliness maintenance, convenient operation, and is safe and reliable.

[0041] It should be noted that the above embodiments only illustrate preferred embodiments of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting this application. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of this application, such as combining different features in various embodiments, and these should all fall within the protection scope of this application.

Claims

1. A clean-type automated storage three-dimensional intelligent warehouse for chip substrates, characterized in that, The clean chip substrate automated storage three-dimensional intelligent warehouse includes: A closed silo, comprising multiple storage compartments, with the interior of the closed silo forming a sealed space for a material storage and retrieval mechanism. Each storage compartment has an opening communicating with the space for the material storage and retrieval mechanism, and the closed silo is also provided with a retrieval port communicating with the space for the material storage and retrieval mechanism. A material retrieval drawer is movably disposed within the enclosed compartment. The material retrieval drawer is movable between a closed position and an open position. In the closed position, the material retrieval drawer is located within the enclosed compartment and the material retrieval port is closed. In the open position, the material retrieval drawer extends out of the enclosed compartment through the material retrieval port. The storage and retrieval mechanism is provided in the activity space of the storage and retrieval mechanism. The storage and retrieval mechanism is used to extract and release the chip substrate in any of the storage cells to the retrieval drawer in the closed position, and to extract and release the chip substrate on the retrieval drawer in the closed position to any of the storage cells.

2. The clean-type automated storage three-dimensional intelligent warehouse for chip substrates according to claim 1, characterized in that, The enclosed silo includes a first storage cabinet and a second storage cabinet arranged at intervals along its width. Both the first and second storage cabinets extend along the length of the enclosed silo. Each of the first and second storage cabinets has multiple storage compartments. The space for the storage and retrieval mechanism is located between the openings of the storage compartments in the first and second storage cabinets. The openings of the storage compartments in the first and second storage cabinets face each other.

3. The clean-type automated storage three-dimensional intelligent warehouse for chip substrates according to claim 2, characterized in that, The enclosed silo includes a first end cabinet and a second end cabinet connected to the two ends of the length direction of the first storage cabinet and the second storage cabinet, a cover plate connected to the upper end of the first storage cabinet, the second storage cabinet, the first end cabinet and the second end cabinet, and a bottom plate connected to the lower end of the first storage cabinet, the second storage cabinet, the first end cabinet and the second end cabinet. The first storage cabinet, the second storage cabinet, the first end cabinet, the second end cabinet, the cover plate and the bottom plate together enclose the activity space of the material storage and retrieval mechanism.

4. The clean-type automated storage three-dimensional intelligent warehouse for chip substrates according to claim 2, characterized in that, The storage and retrieval mechanism includes a first electrically controlled horizontal linear guide rail extending along the length of the enclosed hopper, an electrically controlled lifting guide rail connected to the first electrically controlled horizontal linear guide rail, a second electrically controlled horizontal linear guide rail connected to the electrically controlled lifting guide rail, a first electrically controlled rotary table connected to the second electrically controlled horizontal linear guide rail, a first rotating arm connected to the first electrically controlled rotary table, and a first retrieval mechanism connected to the first rotating arm. The first electrically controlled horizontal linear guide rail can drive the electrically controlled lifting guide rail to slide along the length of the enclosed hopper, the electrically controlled lifting guide rail can drive the second electrically controlled horizontal linear guide rail to move up and down, the second electrically controlled horizontal linear guide rail can drive the first electrically controlled rotary table to slide along the width of the enclosed hopper, the first electrically controlled rotary table can drive the first rotating arm to rotate around a vertical axis, and the first retrieval mechanism can extract and release a chip substrate from any of the storage compartments onto a retrieval drawer in a closed position, and can extract and release a chip substrate from a retrieval drawer in a closed position into any of the storage compartments.

5. The clean-type automated storage three-dimensional intelligent warehouse for chip substrates according to claim 4, characterized in that, The material storage and retrieval mechanism further includes a third electrically controlled horizontal linear guide rail extending along the length of the enclosed silo, a fourth electrically controlled horizontal linear guide rail connected to the electrically controlled lifting guide rail, a second electrically controlled rotary table connected to the fourth electrically controlled horizontal linear guide rail, a second rotating arm connected to the second electrically controlled rotary table, and a second material retrieval mechanism connected to the second rotating arm. The first electrically controlled horizontal linear guide rail is located at the bottom of the activity space of the material storage and retrieval mechanism, the third electrically controlled horizontal linear guide rail is located at the top of the activity space of the material storage and retrieval mechanism, the lower end of the electrically controlled lifting guide rail is connected to the first electrically controlled horizontal linear guide rail, and the upper end of the electrically controlled lifting guide rail is connected to the third electrically controlled horizontal linear guide rail. The first and third electrically controlled horizontal linear guides can jointly drive the electrically controlled lifting guide to slide along the length of the enclosed hopper. The electrically controlled lifting guide can drive the fourth electrically controlled horizontal linear guide to move up and down. The fourth electrically controlled horizontal linear guide can drive the second electrically controlled rotary table to slide along the width of the enclosed hopper. The second electrically controlled rotary table can drive the second rotating arm to rotate around the vertical axis. The second material handling mechanism can extract and release the chip substrate from any of the storage compartments onto the material handling drawer in the closed position, and can extract and release the chip substrate from the material handling drawer in the closed position onto any of the storage compartments.

6. The clean-type automated storage three-dimensional intelligent warehouse for chip substrates according to claim 5, characterized in that, Both the first and second material handling mechanisms are vacuum suction cups.

7. The clean-type automated storage three-dimensional intelligent warehouse for chip substrates according to claim 2, characterized in that, The material dispensing port is formed on the first storage cabinet, and the first storage cabinet is provided with a slide rail below the material dispensing port. The slide rail extends along the width direction of the enclosed silo, and the material dispensing drawer is slidably disposed on the slide rail.

8. The clean-type automated storage three-dimensional intelligent warehouse for chip substrates according to claim 7, characterized in that, The number of material picking drawers is at least 6, and at least 6 material picking drawers are connected as one unit, or the number of slide rails corresponds to the number of at least 6 material picking drawers, and at least 6 material picking drawers are independently set on their respective slide rails.

9. The clean-type automated storage three-dimensional intelligent warehouse for chip substrates according to claim 7, characterized in that, An electronically controlled locking mechanism is provided below the slide rail. When the material pick-up drawer is in the closed position, the electronically controlled locking mechanism can lock and fix the material pick-up drawer.

10. The clean-type automated storage three-dimensional intelligent warehouse for chip substrates according to any one of claims 1 to 9, characterized in that, Each of the storage compartments is equipped with a soft curtain at its opening. The upper end of the soft curtain is connected to the top of the opening of the corresponding storage compartment, and the lower end of the soft curtain is equipped with a counterweight. The counterweight can press against the lower end of the opening of the corresponding storage compartment to close the opening of the corresponding storage compartment. A blowing mechanism is provided inside the storage compartment and faces the opening. The blowing mechanism can blow up the corresponding soft curtain to open the opening of the corresponding storage compartment.

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