High-performance environment-friendly wafer dicing liquid and preparation method thereof

Abstract

This invention discloses a high-performance, environmentally friendly wafer dicing solution and its preparation method. The dicing solution, by weight percentage, comprises 85%–92% ultrapure deionized water, 1.5%–4.0% nonionic surfactant, 0.5%–2.0% water-soluble polymer, 0.3%–1.5% organic corrosion inhibitor, 0.2%–1.0% extreme pressure anti-wear agent, 0.1%–0.5% chelating agent, 0.2%–0.8% environmentally friendly rust inhibitor, and 0.2%–1.0% nonionic antistatic agent. The dicing solution of this invention exhibits a dynamic surface tension ≤25 mN / m, good silicon powder suspension and dispersion performance, excellent corrosion resistance, thermal friction control, and electrostatic protection effects, and is entirely environmentally friendly and non-toxic. The preparation method is simple, controllable, and produces a stable and uniform product. The dicing solution of this invention has comprehensive performance that is comparable to and surpasses that of high-end foreign products. The raw materials are readily available domestically and the cost is controllable, achieving domestic substitution, ensuring the self-sufficiency and security of the semiconductor industry chain, and is suitable for large-scale industrial production.

Description

Technical Field

[0001] This invention relates to the field of dicing solutions, and in particular to a high-performance, environmentally friendly wafer dicing solution and its preparation method. Background Technology

[0002] Wafer dicing is a core and critical step in the back-end processes of semiconductor chip manufacturing. The quality of the dicing process directly determines the chip yield and long-term reliability. During wafer dicing, the high-speed rotation of the dicing blade causes friction and cutting action with the wafer substrate, generating a large amount of submicron-sized silicon powder and solid debris. This is accompanied by intense frictional heat generation and electrostatic discharge. All of these issues can seriously affect the wafer dicing accuracy and the integrity of the chip structure.

[0003] Currently, the international market for high-end wafer dicing solutions is dominated by foreign brands such as KETECA from Singapore. While these products have certain performance advantages in preventing debris accumulation, reducing dust pollution, and protecting wafer devices, their core technologies are monopolized by foreign manufacturers, resulting in high product prices and increased production costs for domestic semiconductor companies. At the same time, there is a potential risk of supply chain disruptions, and the chemical composition of some foreign products still has significant room for improvement in terms of environmental friendliness and non-toxicity.

[0004] While domestically developed and produced wafer dicing solutions have certain advantages in terms of cost and supply chain, they generally suffer from numerous technical defects, specifically: 1) Insufficient surface tension control precision and poor wetting and penetration, failing to quickly penetrate into the dicing kerf, leading to easy accumulation of dicing debris on the adhesive pad surface, affecting dicing continuity; 2) Weak ability to suspend and remove fine silicon powder, causing silicon powder to easily adhere to the wafer surface and dicing blade, resulting in wafer surface contamination, accelerated blade wear, and reduced dicing precision; 3) Inadequate corrosion resistance, easily corroding metal electrodes and bump structures such as gold, silver, and copper on the wafer, damaging the chip's electrical performance; 4) Limited thermal management and friction control capabilities, failing to effectively reduce thermal friction during the dicing process, easily leading to microcracks and edge chipping on the wafer, and difficulty in suppressing electrostatic discharge, causing irreversible damage to the chip's sensitive circuits; 5) Some products contain chemical components that are harmful to the environment and pose a threat to the health of operators, failing to meet the environmental and safety requirements of modern industry.

[0005] In summary, developing a domestically produced wafer dicing solution with performance indicators that reach or even surpass international advanced levels, controllable production costs, a secure and independent supply chain, and environmental friendliness is of great strategic significance and significant economic value for breaking foreign technological monopolies, ensuring the autonomy and security of my country's semiconductor industry chain, and reducing the production costs of domestic semiconductor companies. Summary of the Invention

[0006] In view of this, the present invention addresses the shortcomings of existing technologies, and its main objective is to provide a high-performance, environmentally friendly wafer dicing solution that effectively solves the technical defects of existing wafer dicing solutions, such as high surface tension, weak dust removal ability, poor corrosion resistance, insufficient thermal friction and electrostatic suppression, and poor environmental performance. This dicing solution, through scientific formulation and proportioning design, achieves comprehensive performance including low surface tension, efficient dust suspension and removal, excellent corrosion resistance, and effective suppression of thermal friction and electrostatics, and all components are environmentally friendly and non-toxic. Furthermore, the present invention provides a method for preparing this dicing solution, which is simple, controllable, suitable for large-scale industrial production, and produces a dicing solution with stable and uniform performance.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A high-performance, environmentally friendly wafer dicing solution, by weight percentage, comprises the following components: ultrapure deionized water: 85%–92%; nonionic surfactant: 1.5%–4.0%; water-soluble polymer: 0.5%–2.0%; organic corrosion inhibitor: 0.3%–1.5%; extreme pressure anti-wear agent: 0.2%–1.0%; chelating agent: 0.1%–0.5%; environmentally friendly rust inhibitor: 0.2%–0.8%; nonionic antistatic agent: 0.2%–1.0%. The nonionic surfactant is one of polyether-modified siloxane or acetylenic diol surfactants, or a compound of polyether-modified siloxane and acetylenic diol surfactants. The nonionic surfactant can reduce the dynamic surface tension of the dicing solution to below 25 mN / m.

[0008] As a preferred embodiment, the water-soluble polymer is one of polyvinylpyrrolidone and sodium polyacrylate, or a compound of polyvinylpyrrolidone and sodium polyacrylate, used to encapsulate the submicron-sized silicon powder generated during dicing and to stably suspend the silicon powder in the dicing solution.

[0009] As a preferred embodiment, the organic corrosion inhibitor is benzotriazole or its derivative, used to form a dense protective film on the surface of copper, aluminum, or silver metals to prevent metal corrosion.

[0010] As a preferred embodiment, the extreme pressure anti-wear agent is one of glycerol, water-soluble polyether, or a compound of glycerol and water-soluble polyether, used to form a lubricating film at the high temperature and high pressure cutting interface to reduce friction and heat generation.

[0011] As a preferred embodiment, the chelating agent is one or a combination of two of disodium ethylenediaminetetraacetate and sodium citrate; the environmentally friendly rust inhibitor is one or a combination of two of sodium molybdate and borate ester.

[0012] As a preferred embodiment, the nonionic antistatic agent is one of polyethylene glycol ester, alkylolamide, or a compound of polyethylene glycol ester and alkylolamide, used to quickly conduct away the static charge generated during the cutting process and prevent electrostatic discharge.

[0013] As a preferred option, all components are selected from environmentally friendly, low-toxicity, or non-toxic substances, and the overall formulation complies with RoHS standards; the resistivity of the ultrapure deionized water is ≥18.2 MΩ. cm.

[0014] This invention also discloses a method for preparing a high-performance, environmentally friendly wafer dicing solution, comprising the following steps: a. Preparation of materials: Weigh each component raw material by weight percentage. All raw materials must be of industrial grade or higher purity. If it is a compound component, mix the compound raw materials in advance. b. Heating: Add ultrapure deionized water to a reactor equipped with a stirring and temperature control device, and heat to 30-40℃; c. Stepwise addition and stirring: Keep the stirring in the reactor at a constant speed, and add each component in the following order: nonionic surfactant → water-soluble polymer → organic corrosion inhibitor → extreme pressure anti-wear agent → chelating agent → environmentally friendly rust inhibitor → nonionic antistatic agent. After each component is added, continue stirring for 15-20 minutes to ensure that it is completely dispersed and dissolved evenly. d. Homogenization by stirring at constant temperature: After all components have been added, maintain the temperature inside the reactor at 35±5℃ and stir continuously for 1-2 hours until the solution is homogeneous and transparent. e. Cooling and filtration: The solution is naturally cooled to room temperature and then filtered through a 0.1μm precision filter to obtain the high-performance environmentally friendly wafer dicing solution.

[0015] As a preferred embodiment, in step c, the stirring speed is 250-300 r / min; in step d, the stirring speed is 250-300 r / min.

[0016] As a preferred option, in step c, the stirring time for the compound component or the single component is 15-20 minutes, which can be adjusted to 18 minutes depending on the dissolution characteristics of the raw materials.

[0017] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution: 1. Excellent anti-chip accumulation capability: By adding a specific ratio of nonionic surfactant, the dynamic surface tension of the dicing solution is reduced to below 25 mN / m, which enables rapid wetting and efficient rinsing of the wafer dicing kerf, preventing the deposition of dicing chips on the adhesive pad from the source and ensuring the continuity of the dicing process.

[0018] 2. Achieve efficient dust removal and suspension: The steric hindrance and adsorption of water-soluble polymers can effectively encapsulate and stably suspend submicron-sized ultrafine silicon powder, allowing the silicon powder to be quickly discharged with the dicing liquid flow, continuously keeping the cutting blade and wafer surface clean, and significantly extending the service life of the cutting blade.

[0019] 3. Excellent corrosion and rust prevention performance: Organic corrosion inhibitors and environmentally friendly rust inhibitors work together to form a dense protective film on the metal surface, providing comprehensive protection for metal electrodes, bumps, and bonding pads on the wafer, effectively preventing corrosion and rust, and ensuring the long-term electrical reliability of the chip.

[0020] 4. Significantly improves thermal management and friction control: The extreme pressure anti-wear agent forms a stable lubricating film at the high temperature and high pressure cutting interface, which greatly reduces the friction coefficient between the cutting blade and the wafer, reduces frictional heat generation, reduces the thermal and mechanical stress of the wafer, effectively reduces defects such as wafer microcracks and edge chipping, improves the mechanical strength of the chip, and significantly improves the ball shear strength of subsequent chip processes.

[0021] 5. Achieve efficient electrostatic protection: Non-ionic antistatic agents can quickly and continuously conduct away static charges generated during the cutting process, avoid static accumulation, effectively prevent irreversible damage to sensitive circuits inside the chip by electrostatic discharge (ESD), and ensure chip yield.

[0022] 6. Environmentally friendly and safe and in compliance with industry standards: All components are made from environmentally friendly, low-toxic or non-toxic raw materials, and the overall formula complies with RoHS standards. This not only protects the health of production operators, but also reduces the difficulty of subsequent wastewater treatment and the environmental burden, meeting the green production requirements of the modern semiconductor industry.

[0023] 7. Significant advantages of domestic substitution: All raw materials used in the dicing solution of this invention are readily available chemical raw materials in China, the raw material cost is controllable, the preparation method is simple and convenient to operate, suitable for large-scale industrial production, and the comprehensive performance of the prepared dicing solution is comparable to or even surpasses that of similar high-end foreign products in some aspects, successfully breaking the technological monopoly of foreign manufacturers, ensuring the self-sufficiency and security of my country's semiconductor industry chain, and at the same time significantly reducing the wafer dicing process cost of domestic semiconductor companies.

[0024] 8. Stable and uniform product performance: The preparation method of this invention ensures that each component is uniformly dispersed and fully dissolved through step-by-step feeding, constant temperature homogenization stirring, and precision filtration. The prepared scribing solution is a uniform, transparent, and stable system without stratification or precipitation. Its performance remains stable during storage and use, and it can meet the process requirements of large-scale industrial production of semiconductors. Detailed Implementation

[0025] This invention discloses a high-performance, environmentally friendly wafer dicing solution, which, by weight percentage, comprises the following components: ultrapure deionized water: 85%–92%; nonionic surfactant: 1.5%–4.0%; water-soluble polymer: 0.5%–2.0%; organic corrosion inhibitor: 0.3%–1.5%; extreme pressure anti-wear agent: 0.2%–1.0%; chelating agent: 0.1%–0.5%; environmentally friendly rust inhibitor: 0.2%–0.8%; and nonionic antistatic agent: 0.2%–1.0%.

[0026] The nonionic surfactant is one of polyether-modified siloxane, acetylsadiol surfactant, or a compound of polyether-modified siloxane and acetylsadiol surfactant. The nonionic surfactant can reduce the dynamic surface tension of the dicing solution to below 25 mN / m, ensuring that the dicing solution can quickly wet and penetrate into the wafer dicing gap, fundamentally preventing the adhesion and accumulation of dicing debris on the adhesive pad.

[0027] The water-soluble polymer is one of polyvinylpyrrolidone and sodium polyacrylate, or a compound of polyvinylpyrrolidone and sodium polyacrylate. Through the steric hindrance effect and adsorption of the molecular chain, it encapsulates and disperses the submicron-sized silicon powder generated during dicing, so that the silicon powder is stably suspended in the dicing solution and quickly discharged from the dicing area with the liquid flow, thereby continuously maintaining the cleanliness of the dicing area and the wafer surface.

[0028] The organic corrosion inhibitor is benzotriazole or its derivatives. Benzotriazole or its derivatives can form a dense and stable chemical protective film on the surface of metals such as copper, aluminum, and silver, effectively isolating the dicing solution from contact with the metal surface and preventing the dicing solution from corroding the adhesive pad and wafer metal bumps.

[0029] The extreme pressure anti-wear agent is one of glycerol and water-soluble polyether, or a compound of glycerol and water-soluble polyether. At the high temperature and high pressure interface of wafer dicing, the extreme pressure anti-wear agent can quickly form a uniform lubricating film, which greatly reduces the friction between the dicing blade and the wafer, reduces the generation of frictional heat, thereby reducing the thermal stress of the wafer and reducing the occurrence of wafer breakage and cracking. At the same time, it helps to improve the ball shear strength of subsequent chip processing.

[0030] The chelating agent is one or a combination of two of disodium ethylenediaminetetraacetate and sodium citrate, which can chelate metal ions in the dicing solution and the dicing environment, prevent metal ion deposition from contaminating the wafer and dicing blade, and improve the chemical stability of the dicing solution.

[0031] The environmentally friendly rust inhibitor is one or a combination of sodium molybdate and borate ester, which works synergistically with organic corrosion inhibitors to further enhance the rust and corrosion prevention effect of the scribing solution on metal parts. Moreover, this type of rust inhibitor is environmentally friendly and low in toxicity, meeting environmental protection requirements.

[0032] The nonionic antistatic agent is one of polyethylene glycol ester and alkylolamide, or a compound of polyethylene glycol ester and alkylolamide. It can quickly conduct away the static charge generated during wafer dicing, effectively prevent irreversible damage to the chip's sensitive circuits caused by electrostatic discharge, and ensure the integrity of the chip's electrical performance.

[0033] All components are selected from environmentally friendly, low-toxicity, or non-toxic substances. The overall formula complies with RoHS standards, is environmentally friendly, poses no threat to the health of operators, and has low difficulty in subsequent wastewater treatment, resulting in a small environmental burden. The resistivity of the ultrapure deionized water is ≥18.2MΩ. cm.

[0034] This invention also discloses a method for preparing a high-performance, environmentally friendly wafer dicing solution, comprising the following steps: a. Material preparation: Weigh each component raw material by weight percentage. All raw materials must be of industrial grade or higher purity. If it is a compound component, mix the compound raw materials in advance for later use.

[0035] b. Heating: Add ultrapure deionized water to a reactor equipped with a stirring and temperature control device, and heat to 30-40℃.

[0036] c. Step-by-step addition and stirring: Maintain uniform stirring within the reactor. Add each component in the following order: nonionic surfactant → water-soluble polymer → organic corrosion inhibitor → extreme pressure anti-wear agent → chelating agent → environmentally friendly rust inhibitor → nonionic antistatic agent. After adding each component, continue stirring for 15-20 minutes to ensure complete dispersion and uniform dissolution. The stirring speed should be 250-300 rpm. For compound components or single components, the stirring time is 15-20 minutes, which can be adjusted to 18 minutes depending on the solubility characteristics of the raw materials.

[0037] d. Homogenization by constant temperature stirring: After all components have been added, maintain the temperature inside the reactor at 35±5℃ and continue stirring for 1-2 hours until the solution is uniform and transparent. The stirring speed is 250-300r / min.

[0038] e. Cooling and filtration: The solution is naturally cooled to room temperature and then filtered through a 0.1μm precision filter to obtain the high-performance environmentally friendly wafer dicing solution.

[0039] All raw materials used in this invention are commercially available industrial-grade raw materials, wherein the resistivity of ultrapure deionized water is ≥18.2MΩ. cm; polyether-modified siloxanes and acetylacetonate surfactants are industrial-grade surfactants; polyvinylpyrrolidone (K30) and sodium polyacrylate are industrial-grade water-soluble polymers; benzotriazole and methylbenzotriazole are industrial-grade organic corrosion inhibitors; glycerol and water-soluble polyether (PEG-200) are industrial-grade extreme pressure anti-wear agents; disodium ethylenediaminetetraacetate and sodium citrate are industrial-grade chelating agents; sodium molybdate and borate esters are industrial-grade environmentally friendly rust inhibitors; alkylolamides and polyethylene glycol esters are industrial-grade nonionic antistatic agents.

[0040] The present invention will be further described in detail below with reference to several embodiments and comparative examples: Example 1: A high-performance, environmentally friendly wafer dicing solution is prepared in 1000 kg batches. The components and their corresponding weights are as follows: ultrapure deionized water: 900 kg (90.0 wt%); polyether-modified siloxane: 3.0 kg (3.0 wt%); polyvinylpyrrolidone: 1.2 kg (1.2 wt%); benzotriazole: 0.8 kg (0.8 wt%); glycerol: 0.6 kg (0.6 wt%); disodium ethylenediaminetetraacetate: 0.3 kg (0.3 wt%); sodium molybdate: 0.5 kg (0.5 wt%); alkylolamide: 0.6 kg (0.6 wt%).

[0041] The preparation method of the above-mentioned scribing solution includes the following steps: Weigh each raw material according to the above weight and set aside.

[0042] Add 900 kg of ultrapure deionized water to a reaction vessel equipped with stirring and temperature control, and heat to 35°C.

[0043] Stir at a constant speed of 300 r / min. First, add 3.0 kg of polyether-modified siloxane and stir for 20 minutes until completely dispersed and dissolved. Then, add 1.2 kg of polyvinylpyrrolidone and stir for 20 minutes until completely dispersed and dissolved. Then, add 0.8 kg of benzotriazole, 0.6 kg of glycerol, 0.3 kg of disodium ethylenediaminetetraacetate, 0.5 kg of sodium molybdate, and 0.6 kg of alkylolamide in sequence, stirring for 20 minutes after each addition.

[0044] After all components have been added, maintain the reactor temperature at 35°C and continue stirring at 300 rpm for 1.5 hours until the solution is homogeneous and transparent.

[0045] The solution was allowed to cool naturally to room temperature and then filtered through a 0.1 μm precision filter to obtain streak solution A.

[0046] Example 2: A high-performance, environmentally friendly wafer dicing solution is prepared in 1000 kg batches. The components and their corresponding weights are as follows: ultrapure deionized water: 880 kg (88.0 wt%); acetylenic diol surfactant: 3.5 kg (3.5 wt%); sodium polyacrylate: 1.5 kg (1.5 wt%); methylbenzotriazole: 1.0 kg (1.0 wt%); water-soluble polyether: 0.8 kg (0.8 wt%); sodium citrate: 0.4 kg (0.4 wt%); borate ester: 0.6 kg (0.6 wt%); polyethylene glycol ester: 0.7 kg (0.7 wt%).

[0047] The preparation method of the above-mentioned scribing solution includes the following steps: Weigh each raw material according to the above weight and set aside.

[0048] Add 880 kg of ultrapure deionized water to a reaction vessel equipped with stirring and temperature control, and heat to 30°C.

[0049] Stir at a constant speed of 250 r / min. First, add 3.5 kg of acetylation diol surfactant and stir for 15 minutes until completely dispersed and dissolved. Then add 1.5 kg of sodium polyacrylate and stir for 15 minutes until completely dispersed and dissolved. Then add 1.0 kg of methylbenzotriazole, 0.8 kg of water-soluble polyether, 0.4 kg of sodium citrate, 0.6 kg of borate ester, and 0.7 kg of polyethylene glycol ester in sequence, stirring for 15 minutes after each component is added.

[0050] After all components have been added, maintain the reactor temperature at 30°C and continue stirring at 250 r / min for 2 hours until the solution is homogeneous and transparent.

[0051] The solution was allowed to cool naturally to room temperature and then filtered through a 0.1 μm precision filter to obtain streak buffer B.

[0052] Example 3: A high-performance, environmentally friendly wafer dicing solution is prepared in 1000 kg batches. The components and their corresponding weights are as follows: ultrapure deionized water: 910 kg (91.0 wt%); polyether-modified siloxane + acetylenic diol surfactant compound: 2.0 kg (1.2 kg polyether-modified siloxane + 0.8 kg acetylenic diol surfactant, 2.0 wt%); polyvinylpyrrolidone + sodium polyacrylate compound: 0.8 kg (0.5 kg polyvinylpyrrolidone + 0.3 kg sodium polyacrylate, 0.8 wt%); benzotriazole: 0.5 kg (0.5 wt%); glycerol + water-soluble polyether compound: 0.4 kg (0.2 kg glycerol + 0.2 kg water-soluble polyether, 0.4 wt%); disodium ethylenediaminetetraacetate + sodium citrate compound: 0.2 kg (0.1 kg disodium ethylenediaminetetraacetate + 0.1 kg sodium citrate). Sodium citrate, 0.2 wt%; Sodium molybdate + borate ester compound: 0.3 kg (0.2 kg sodium molybdate + 0.1 kg borate ester, 0.3 wt%); Alkyl alcohol amide + polyethylene glycol ester compound: 0.4 kg (0.2 kg alkyl alcohol amide + 0.2 kg polyethylene glycol ester, 0.4 wt%); the balance is ultrapure deionized water, to be made up to 1000 kg.

[0053] The preparation method of the above-mentioned scribing solution includes the following steps: Weigh each raw material according to the above weight, and pre-mix the nonionic surfactant, water-soluble polymer, extreme pressure anti-wear agent, chelating agent, environmentally friendly rust inhibitor, and nonionic antistatic agent separately for later use.

[0054] Add 910 kg of ultrapure deionized water to a reaction vessel equipped with stirring and temperature control, and heat to 40°C.

[0055] Stir at a constant speed of 280 r / min. First, add 2.0 kg of nonionic surfactant compound and stir for 18 minutes until completely dispersed and dissolved. Then, add 0.8 kg of water-soluble polymer compound and stir for 18 minutes until completely dispersed and dissolved. Then, add 0.5 kg of benzotriazole, 0.4 kg of extreme pressure anti-wear agent compound, 0.2 kg of chelating agent compound, 0.3 kg of environmentally friendly rust inhibitor compound, and 0.4 kg of nonionic antistatic agent compound in sequence. Stir for 18 minutes after each component is added.

[0056] After all components have been added, maintain the reactor temperature at 40°C and continue stirring at 280 r / min for 1 hour until the solution is homogeneous and transparent.

[0057] The solution was allowed to cool naturally to room temperature and then filtered through a 0.1 μm precision filter to obtain streak buffer C.

[0058] Comparative example: A commercially available brand of ordinary wafer dicing solution was used as a comparative example, without any modification treatment.

[0059] Performance testing The scribing solution A prepared in Example 1, the scribing solution B prepared in Example 2, and the scribing solution C prepared in Example 3 of this invention were compared with commercially available ordinary scribing solution in a comprehensive performance comparison test. The test items, test standards, and test results are shown in the table below:

[0060] Performance test results show that the high-performance environmentally friendly wafer dicing solutions prepared in Examples 1, 2, and 3 of this invention are significantly superior to commercially available ordinary dicing solutions in all key performance indicators, including surface tension, silicon powder suspension rate, corrosion resistance, friction control, electrostatic decay, blade life extension, ball shear strength improvement, biodegradability, and storage stability. Among them, Example 2 is the optimal single-component ratio scheme, and Example 3 is the optimal compound component scheme, both of which fully meet the process requirements of high-end wafer dicing and achieve the goal of domestic substitution for advanced foreign products of the same kind.

[0061] The above description is merely a preferred embodiment of the present invention and does not constitute any limitation on the technical scope of the present invention. Therefore, any minor modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A high-performance, environmentally friendly wafer dicing solution, characterized in that: The product, by weight percentage, comprises the following components: ultrapure deionized water: 85%–92%; nonionic surfactant: 1.5%–4.0%; water-soluble polymer: 0.5%–2.0%; organic corrosion inhibitor: 0.3%–1.5%; extreme pressure anti-wear agent: 0.2%–1.0%; chelating agent: 0.1%–0.5%; environmentally friendly rust inhibitor: 0.2%–0.8%; nonionic antistatic agent: 0.2%–1.0%. The nonionic surfactant is one of polyether-modified siloxane or acetylenic diol surfactants, or a compound of polyether-modified siloxane and acetylenic diol surfactants. The nonionic surfactant can reduce the dynamic surface tension of the scribing solution to below 25 mN / m.

2. The high-performance environmentally friendly wafer dicing solution according to claim 1, characterized in that: The water-soluble polymer is one of polyvinylpyrrolidone and sodium polyacrylate, or a compound of polyvinylpyrrolidone and sodium polyacrylate, used to encapsulate the submicron-sized silicon powder generated by dicing and to stably suspend and disperse the silicon powder in the dicing solution.

3. The high-performance environmentally friendly wafer dicing solution according to claim 1, characterized in that: The organic corrosion inhibitor is benzotriazole or its derivative, used to form a dense protective film on the surface of copper, aluminum, and silver metals to prevent metal corrosion.

4. The high-performance environmentally friendly wafer dicing solution according to claim 1, characterized in that: The extreme pressure anti-wear agent is one of glycerol and water-soluble polyether, or a compound of glycerol and water-soluble polyether, used to form a lubricating film at the high temperature and high pressure cutting interface to reduce friction and heat generation.

5. The high-performance environmentally friendly wafer dicing solution according to claim 1, characterized in that: The chelating agent is one or a combination of two of disodium ethylenediaminetetraacetate and sodium citrate; the environmentally friendly rust inhibitor is one or a combination of two of sodium molybdate and borate ester.

6. The high-performance environmentally friendly wafer dicing solution according to claim 1, characterized in that: The nonionic antistatic agent is one of polyethylene glycol ester and alkylolamide, or a compound of polyethylene glycol ester and alkylolamide, used to quickly conduct away static charge generated during the cutting process and prevent electrostatic discharge.

7. A high-performance environmentally friendly wafer dicing solution according to any one of claims 1-6, characterized in that: All components are selected from environmentally friendly, low-toxicity, or non-toxic substances, and the overall formula complies with RoHS standards; the resistivity of the ultrapure deionized water is ≥18.2MΩ. cm.

8. A method for preparing a high-performance, environmentally friendly wafer dicing solution as described in any one of claims 1-7, characterized in that, Includes the following steps: a. Preparation of materials: Weigh each component raw material by weight percentage. All raw materials must be of industrial grade or higher purity. If it is a compound component, mix the compound raw materials in advance. b. Heating: Add ultrapure deionized water to a reactor equipped with a stirring and temperature control device, and heat to 30-40℃; c. Stepwise addition and stirring: Keep the stirring in the reactor at a constant speed, and add each component in the following order: nonionic surfactant → water-soluble polymer → organic corrosion inhibitor → extreme pressure anti-wear agent → chelating agent → environmentally friendly rust inhibitor → nonionic antistatic agent. After each component is added, continue stirring for 15-20 minutes to ensure that it is completely dispersed and dissolved evenly. d. Homogenization by stirring at constant temperature: After all components have been added, maintain the temperature inside the reactor at 35±5℃ and stir continuously for 1-2 hours until the solution is homogeneous and transparent. e. Cooling and filtration: The solution is naturally cooled to room temperature and then filtered through a 0.1μm precision filter to obtain the high-performance environmentally friendly wafer dicing solution.

9. The method for preparing a high-performance environmentally friendly wafer dicing solution according to claim 8, characterized in that: In step c, the stirring speed is 250-300 r / min; in step d, the stirring speed is 250-300 r / min.

10. The method for preparing a high-performance environmentally friendly wafer dicing solution according to claim 8, characterized in that: In step c, the stirring time for the compound components or single components is 15-20 minutes, which can be adjusted to 18 minutes depending on the solubility characteristics of the raw materials.

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