Horizontal inclined chemical vapor deposition apparatus
Patent Information
- Application Number
- CN202611012836.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-08
- Publication Date
- 2026-10-20
AI Technical Summary
[0003]对晶圆进行镀膜加工的过程中,相关的喷气设备用于喷洒覆膜所需的反应气体,但是通过一般扩散加压的方式引导化合物覆盖在晶圆外表面时,容易出现晶圆片外表面覆盖膜层厚度不均,进而影响晶圆实际品质的问题,所以需要进行改进
1.该装置可以通过化学气相沉积的方式,对放置在长容纳管内部的晶圆进行覆膜处理加工,由于长容纳管通过内支撑部件托举在操作箱的内部,而内支撑部件经过改装,可以在晶圆覆膜的过程中使长容纳管进行小幅度的偏转,并以环绕内加热箱轴心的方式进行转动,从而通过重力作用使药剂更容易向晶圆侧边的位置挥发,避免晶圆中部聚集较厚的膜层,从而避免出现晶圆片外表面覆盖膜层厚度不均,进而影响晶圆实际品质的问题。
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Abstract
Description
Technical Field
[0001] This invention belongs to the field of chemical vapor deposition technology, specifically a horizontally inclined chemical vapor deposition device. Background Technology
[0002] Chemical vapor deposition (CVD) is an advanced technology widely used in the fabrication of semiconductor, optoelectronic, and thin film materials. The quality of the deposited thin film is crucial to the performance of the final product. There are many process classifications, among which sub-atmospheric pressure CVD is a thermal reaction method without a radio frequency (RF) system. During film growth, its "reflow" capability is better than other CVD methods, resulting in stronger film growth at the inner wall of the chamber. Film growth occurs at all locations within the chamber during the growth process.
[0003] During the wafer coating process, the relevant jetting equipment is used to spray the reaction gas required for coating. However, when the compound is guided to cover the outer surface of the wafer by general diffusion and pressurization, uneven coating thickness on the outer surface of the wafer is likely to occur, which will affect the actual quality of the wafer. Therefore, improvements are needed. Summary of the Invention
[0004] To address the shortcomings of existing technologies, the technical solution adopted by this invention to solve its technical problems is: a horizontally inclined chemical vapor deposition apparatus, comprising an operating box, a closed cover, an internal temperature control component, a reaction vessel, and a pressurizing component. The closed cover is rotatably mounted on the upper part of the operating box, the internal temperature control component is located inside the operating box, the reaction vessel is located at the axis of the internal temperature control component, and the pressurizing component is symmetrically arranged on the left and right sides of the reaction vessel. The internal temperature control component includes an internal heating chamber and an internal support component; An expansion groove is provided on the upper surface of the inner heating box. The inner diameter of the expansion groove is much larger than the actual outer diameter of the reaction vessel. The inner support component is set on the upper surface of the inner heating box through the expansion groove. The internal heating chamber is equipped with a temperature controller. Preheating plates are symmetrically arranged on both sides of the upper surface of the internal heating chamber through expansion grooves. The left and right sides of the internal heating chamber are separated by the internal support component in the middle, thereby providing different temperature zones to the left and right sides of the reaction vessel. The internal support components include an arc-shaped container plate, a modified telescopic cylinder, and a rubber frame plate; The arc-shaped container plate is symmetrically inserted with flat baffles on both sides. The lower surface of the arc-shaped container plate is inserted into the inner wall of the expansion groove. Under normal circumstances, the modified telescopic cylinder will support the reaction vessel through the rubber frame plate at the top. After the closing cover at the top of the operation box is placed, the reaction vessel is covered by the device. At this time, its axis is parallel to the axis of the top of the inner heating box. The modified telescopic cylinders are evenly inserted into the inner cavity of the arc-shaped container plate, and independent air pumps are evenly arranged inside the arc-shaped container plate. The bottom end of the modified telescopic cylinder is connected to the inner cavity of the independent air pump, and the lower surface of the rubber frame plate is inserted into the top of the modified telescopic cylinder. The tubular reaction vessel inserted into the operation box is clamped and fixed by the rubber frame plate. The modified telescopic cylinder is pressurized by remotely controlling the independent air pumps at different locations to achieve the effect of pushing the rubber frame plate at a specific point, thereby causing the clamped reaction vessel to deflect away from the axis.
[0005] Furthermore, the modified telescopic cylinder includes: The elastic sleeve has its bottom end inserted into the inner cavity of the arc-shaped container plate, and its top end is inserted into a fixed cylinder shell. After the internal pressure of the elastic sleeve is controlled, the elastic sleeve will expand and contract, thereby changing the distance of the top rubber frame plate. At this time, the reaction vessel that is in close contact with the rubber frame plate will also undergo corresponding tilting movement. The heat insulation soft cylinders on both sides still maintain the function of sealing the internal temperature control components from the external environment, but will deform accordingly with the tilt of the reaction vessel. A receiving groove is provided in the middle of the inner wall of the fixed cylinder shell, and guide grooves are symmetrically provided on both sides of the inner wall of the fixed cylinder shell. The top axis of the inner wall of the fixed cylinder shell is engaged with the outer surface of the rubber frame plate.
[0006] Furthermore, the modified telescopic cylinder also includes: A sliding impact plate, wherein buffer airbags are evenly distributed on the upper surface of the sliding impact plate, and both sides of the sliding impact plate are slidably connected to the inner wall of the fixed cylinder shell through guide grooves; An elliptical rotating rod is evenly inserted into the outer surface of the controller's rotating shaft. The outer surface of the elliptical rotating rod is slidably connected to the lower surface of the sliding impact plate, and the lower surface of the controller is inserted into the bottom of the inner wall of the fixed cylinder.
[0007] Furthermore, the pressurizing component includes: A guide rail, the inner wall of which is slidably connected to a pressure cylinder; A docking sleeve, the inner wall of which is inserted into the end of the reaction vessel, and the lower part of which is threadedly connected to the outer surface of the reaction vessel by fastening bolts; The pressure gauge is inserted into the upper part of the inner cavity of the docking sleeve; The pressure control tube is symmetrically inserted into the front and rear sides of the inner cavity of the docking sleeve, and the bottom end of the pressure control tube is inserted into the inner cavity of the pressure cylinder.
[0008] Further, the reaction vessel includes: A long receiving tube, both ends of which extend to the outside of the operating box, and heat-insulating soft tubes are symmetrically sleeved on both sides of the outer surface of the long receiving tube, and the outer surface of the heat-insulating soft tubes is inserted into the side of the operating box. A control link is provided, with a fixed disk inserted at its left end and a remote control turntable inserted at its right end. The outer surface of the remote control turntable is inserted into the right side of the inner wall of the long receiving tube. A control motor is provided on the inner wall of the control link, which can drive the fixed disk holding the wafer to rotate by driving the control link to rotate.
[0009] Furthermore, the reaction vessel also includes: A parallel guide tube is provided on the left side of the inner wall of the long receiving tube, and a limit baffle is inserted at the right end of the parallel guide tube, so that the drug source is restricted to the position of the limit baffle. A guiding blowing plate is set in the middle of the inner wall of the long receiving tube, and the gas after the drug source evaporates will be blown from left to right through the guiding blowing plate; An inner scanning ring is located on the left side of the remote control turntable. The inner scanning ring can replace the human eye to observe the coating status of the wafer on the right side.
[0010] Furthermore, the guide blower includes: The built-in remote control wheel is inserted into the inner wall of the long receiving tube by means of a clip. The outer surface of the built-in remote control wheel is engaged with the middle part of the outer surface of the guide blowing plate by means of a toothed groove. The built-in remote control wheel drives the guide blowing plate to rotate around the axis. The inner cavity of the guide blowing plate is uniformly provided with expansion nozzles. Both sides of the outer surface of the guide blowing plate are rotatably connected to the inner wall of the long receiving tube. The reaction gas enters the expansion nozzle on the left side of the guide blowing plate to achieve a gathering effect, and then is ejected through the expansion nozzle on the right side, so that the gas particles entering the right temperature zone are more evenly distributed.
[0011] Furthermore, the remote control turntable includes: The waste recycling shell has a dust collection bin inside its cavity. The left end of the control linkage is inserted into the axis on the right side of the outer surface of the waste recycling shell. The outer surface of the waste recycling shell is slidably connected to the inner wall of the long receiving tube. The guide mesh plate is evenly inserted into the left side of the inner cavity of the waste recycling shell through the ring-cut groove. The waste generated by the combination will be collected inside the waste recycling shell. Then the airflow will pass through the right side opening of the waste recycling shell and enter the right side pressurizing component, thereby balancing the pressure inside the long receiving tube. The rotating jaws are slidably connected to the left side of the outer surface of the waste recycling shell via a sliding groove. The inner wall of the rotating jaws holds a wafer. The wafer is held by three sets of rotating jaws with springback biased towards the axis. Since the rotating jaws connect the upper and lower components together through the return structure in the middle, after the rotating jaws hold the wafer, the wafer can continue to move closer to the waste recycling shell under the action of external force. At this time, the upper structure of the rotating jaws continues to bend inward towards the side closer to the waste recycling shell. The sensitive pressure gauge is located at the center of the axis on the left side of the outer surface of the waste recycling shell.
[0012] The beneficial effects of this invention are as follows: 1. This device can perform coating processing on wafers placed inside a long containment tube using chemical vapor deposition. Since the long containment tube is supported inside the operating box by an internal support component, and the internal support component has been modified to allow the long containment tube to deflect slightly during the wafer coating process and rotate around the axis of the inner heating box, the reagent can more easily evaporate to the side of the wafer through gravity, avoiding the accumulation of a thick film layer in the center of the wafer. This avoids the problem of uneven film thickness on the outer surface of the wafer, which would affect the actual quality of the wafer.
[0013] 2. When the rubber support plate holds the long housing tube, the sliding impact plate, under the action of thrust, repeatedly impacts the rubber support plate above through the airbag at the top, so that the supported long housing tube is slightly affected by vibration. Due to the buffering effect of the airbag, the long housing tube will not be subjected to strong impact, thus protecting the tube structure. At this time, larger particles covering the outer surface of the wafer will fall off, thus ensuring that the coating particles are relatively smooth and delicate, avoiding the problem of large particles agglomerating, which would lead to insufficient film density and affect wafer quality.
[0014] 3. During the wafer coating process, a remote-controlled turntable drives the fixed disk to rotate, which in turn grips the wafer on the left side of the waste recycling shell via rotating claws. This prevents incomplete coverage of the wafer in a fixed state, which could easily lead to coating dead spots. The inner scanning ring monitors the coating status of the wafer's outer surface and removes the wafer in a timely manner after coating is completed, avoiding the problem of excessively thick coating layers.
[0015] 4. Due to the pressurization effect, the gas flows from left to right and pressurizes the wafer. At this time, the residual gas will flow from the guide plate through the waste recycling shell into the pressurization component on the right. The generated waste particles will be retained inside the waste recycling shell to achieve recycling, thereby reducing production costs and realizing green production. When the wafer surface is pressurized, it will squeeze the sensitive pressure gauge, thereby regulating the actual pressure inside the long containment tube, ensuring the flow rate while avoiding excessive pressure on the wafer. Attached Figure Description
[0016] Figure 1 This is the front view of the present invention; Figure 2 This is a cross-sectional view of the present invention; Figure 3 This is a schematic diagram of the pressurizing component of the present invention; Figure 4 This is a schematic diagram of the internal temperature control component of the present invention; Figure 5 This is a schematic diagram of the internal support component of the present invention; Figure 6 This is a cross-sectional view of the sliding impact plate of the present invention; Figure 7 This is a cross-sectional view of the long receiving tube of the present invention; Figure 8 This is a cross-sectional view of the guide vane of the present invention; Figure 9 This is a schematic diagram of the internal fixing plate of the present invention.
[0017] In the diagram: 1. Control box; 2. Closed lid; 3. Internal temperature control component; 4. Insulated flexible cylinder; 5. Reaction vessel; 6. Pressurization component; 31. Internal heating box; 32. Expansion groove; 33. Preheating plate; 7. Internal support component; 71. Arc-shaped container plate; 72. Flat baffle; 73. Rubber frame plate; 8. Modified telescopic cylinder; 81. Elastic sleeve; 82. Fixed cylinder shell; 83. Sliding impact plate; 84. Elliptical rotating rod; 51. Long receiving tube; 52. Control... 53. Linkage rod; 54. Remote control turntable; 55. Parallel guide tube; 56. Limiting baffle; 57. Built-in remote control wheel; 58. Guide blowing plate; 59. Inner scanning ring; 50. Fixed plate; 51. Expanding blowing port; 52. Gear groove; 591. Waste recycling shell; 592. Guide mesh plate; 593. Sensitive pressure gauge; 594. Rotating chuck; 61. Guide slide rail; 62. Pressure cylinder; 63. Docking sleeve; 64. Pressure control pipe; 65. Pressure gauge. Detailed Implementation
[0018] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the invention to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described to better illustrate the principles and practical application of the invention, and to enable those skilled in the art to understand the invention and design various embodiments with various modifications suitable for a particular purpose.
[0019] Example 1, please refer to Figures 1-6The present invention provides a technical solution: a horizontally inclined chemical vapor deposition device, including an operation box 1, a closing cover 2, an internal temperature control component 3, a reaction vessel 5, and a pressurizing component 6. The closing cover 2 is rotatably disposed on the upper part of the operation box 1, the internal temperature control component 3 is disposed inside the operation box 1, the reaction vessel 5 is disposed at the axis of the internal temperature control component 3, and the pressurizing component 6 is symmetrically disposed on the left and right sides of the reaction vessel 5. The internal temperature control component 3 includes an internal heating box 31 and an internal support component 7; An expansion groove 32 is provided on the upper surface of the inner heating box 31. The inner diameter of the expansion groove 32 is much larger than the actual outer diameter of the reaction vessel 5. The inner support component 7 is set on the upper surface of the inner heating box 31 through the expansion groove 32. The internal heating box 31 is equipped with a temperature controller. Preheating plates 33 are symmetrically arranged on both sides of the upper surface of the internal heating box 31 through expansion grooves 32. The left and right sides of the internal heating box 31 are separated by the internal support component 7 in the middle, thereby providing different temperature zones for the left and right sides of the reaction vessel 5. The internal support component 7 includes an arc-shaped container plate 71, a modified telescopic cylinder 8, and a rubber frame plate 73; Flat baffles 72 are symmetrically inserted on both sides of the arc-shaped container plate 71. The lower surface of the arc-shaped container plate 71 is inserted into the inner wall of the expansion groove 32. Under normal circumstances, the modified telescopic cylinder 8 will support the reaction vessel 5 through the rubber frame plate 73 at the top. After the closing cover 2 is placed on the top of the operation box 1, the reaction vessel 5 is covered by the device. At this time, its axis is parallel to the axis of the top of the inner heating box 31. The modified telescopic cylinder 8 is evenly inserted into the inner cavity of the arc-shaped container plate 71, and independent air pumps are evenly arranged inside the arc-shaped container plate 71. The bottom end of the modified telescopic cylinder 8 is connected to the inner cavity of the independent air pump, and the lower surface of the rubber frame plate 73 is inserted into the top of the modified telescopic cylinder 8. The tubular reaction vessel 5 inserted into the operation box 1 is clamped and fixed by the rubber frame plate 73. The modified telescopic cylinder 8 is pressurized by remotely controlling the independent air pumps in different parts to achieve the effect of pushing the rubber frame plate 73 at a specific point, thereby causing the clamped reaction vessel 5 to deflect away from the axis.
[0020] Modified telescopic cylinder 8 includes: The elastic sleeve 81 is inserted into the inner cavity of the arc-shaped container plate 71 at its bottom end and a fixed cylinder shell 82 is inserted into the top end of the elastic sleeve 81. After the internal pressure of the elastic sleeve 81 is controlled, the elastic sleeve 81 will expand and contract, thereby changing the distance of the top rubber frame plate 73. At this time, the reaction container 5, which is in close contact with the rubber frame plate 73, will also undergo corresponding tilting movement. The heat insulation soft cylinders 4 on both sides still maintain the function of sealing the internal temperature control component 3 from the external environment, but will deform accordingly with the tilt of the reaction container 5. A receiving groove is provided in the middle of the inner wall of the fixed cylinder shell 82, and guide grooves are symmetrically provided on both sides of the inner wall of the fixed cylinder shell 82. The top axis of the inner wall of the fixed cylinder shell 82 is engaged with the outer surface of the rubber frame plate 73.
[0021] The modified telescopic cylinder 8 also includes: The sliding impact plate 83 has buffer airbags evenly arranged on its upper surface, and both sides of the sliding impact plate 83 are slidably connected to the inner wall of the fixed cylinder shell 82 through guide grooves. Elliptical rotating rod 84 is evenly inserted into the outer surface of the controller shaft. The outer surface of the elliptical rotating rod 84 is slidably connected to the lower surface of the sliding impact plate 83, and the lower surface of the controller is inserted into the bottom of the inner wall of the fixed cylinder shell 82.
[0022] The pressurizing component 6 includes: A guide rail 61 is provided, and a pressure cylinder 62 is slidably connected to the inner wall of the guide rail 61. The inner wall of the docking sleeve 63 is inserted into the end of the reaction vessel 5, and the lower part of the docking sleeve 63 is threaded to the outer surface of the reaction vessel 5 by fastening bolts. Pressure gauge 65 is inserted into the upper part of the inner cavity of the docking sleeve 63; The pressure control tube 64 is symmetrically inserted into the front and rear sides of the inner cavity of the docking sleeve 63, and the bottom end of the pressure control tube 64 is inserted into the inner cavity of the pressure cylinder 62.
[0023] Open the top closed cover 2, set the drug source and the wafer to be coated inside the long receiving tube 51, then connect the docking sleeves 63 to both ends of the long receiving tube 51 and reinforce them, and then put the closed cover 2 on the operation box 1 to complete the preparation work.
[0024] The internal heating chamber 31 controls the temperature of the drug source on the left side and the wafer on the right side of the long container tube 51 by the temperature on the left and right sides respectively. Then, the drug source volatilizes under the heating effect of the temperature zone. Under the pressure of the pressurizing component 6, the gas generated by volatilization moves to the wafer on the right side and then covers the outer surface of the wafer to undergo a chemical reaction, so that a dense film is formed on the outer surface of the wafer.
[0025] Under normal circumstances, the long container tube 51 is supported by the inner support component 7 inside the operating box 1. With the closing cover 2 on the top, the long container tube 51 is kept horizontal. As the pressurizing component 6 guides the volatile reagent to flow from left to right, the center of the wafer is more likely to come into contact with the reagent gas, and the coating at this position is also thicker. Therefore, during the reaction, the inner support component 7 will change the advancing distance of the rubber frame plate 73 to make the long container tube 51 deflect slightly and rotate around the axis of the inner heating box 31. Thus, the reagent is more likely to evaporate to the side of the wafer through gravity, avoiding the accumulation of a thick film layer in the center of the wafer.
[0026] When the rubber support plate 73 supports the long receiving tube 51, the controller drives the elliptical rotating rod 84 to rotate continuously. At this time, the sliding impact plate 83, under the action of thrust, repeatedly impacts the rubber support plate 73 above through the airbag at the top, so that the supported long receiving tube 51 is slightly affected by vibration. At this time, the larger particles covering the outer surface of the wafer will fall off, thus ensuring that the coated particles are relatively smooth.
[0027] Example 2, please refer to Figures 1-9 The present invention provides a technical solution: based on Example 1, the reaction vessel 5 includes: The long receiving tube 51 extends to the outside of the operating box 1 at both ends. The outer surfaces of the long receiving tube 51 are symmetrically fitted with heat-insulating soft tubes 4, and the outer surfaces of the heat-insulating soft tubes 4 are inserted into the sides of the operating box 1. The control link 52 has a fixed disk 59 inserted at its left end and a remote control turntable 53 inserted at its right end. The outer surface of the remote control turntable 53 is inserted into the right side of the inner wall of the long receiving tube 51. A control motor is provided on the inner wall of the control link 52, which can drive the fixed disk 59 holding the wafer to rotate by driving the control link 52 to rotate.
[0028] Reaction vessel 5 also includes: Parallel guide tube 54 is located on the left side of the inner wall of the long receiving tube 51. A limit baffle 55 is inserted into the right end of the parallel guide tube 54, and the drug source is restricted to the position of the limit baffle 55. The guide blowing plate 57 is located in the middle of the inner wall of the long receiving tube 51. The gas after the drug source evaporates will be blown from left to right through the guide blowing plate 57. The inner scanning ring 58 is located on the left side of the remote control turntable 53. The inner scanning ring 58 can replace the human eye to observe the coating status of the wafer on the right side.
[0029] Guide blow plate 57 includes: The built-in remote control wheel 56 is inserted into the inner wall of the long receiving tube 51 through a clip. The outer surface of the built-in remote control wheel 56 is engaged with the middle of the outer surface of the guide blowing plate 57 through a toothed groove 572. The built-in remote control wheel 56 drives the guide blowing plate 57 to rotate axially. The inner cavity of the guide blowing plate 57 is uniformly provided with expansion nozzles 571. Both sides of the outer surface of the guide blowing plate 57 are rotatably connected to the inner wall of the long receiving tube 51. The reaction gas enters the expansion nozzle 571 on the left side of the guide blowing plate 57 to achieve a gathering effect, and then is ejected through the expansion nozzle 571 on the right side, so that the gas particles entering the right temperature zone are more evenly distributed.
[0030] Remote control turntable 53 includes: Waste recycling shell 591, the inner cavity of waste recycling shell 591 is provided with a dust collection bin, the right side of the outer surface of waste recycling shell 591 is inserted into the left end of control linkage 52, and the outer surface of waste recycling shell 591 is slidably connected to the inner wall of long receiving tube 51. The guide mesh plate 592 is evenly inserted into the left side of the inner cavity of the waste recycling shell 591 through the ring-cut groove. The waste generated by the chemical reaction will be collected inside the waste recycling shell 591. Then the airflow will pass through the right opening of the waste recycling shell 591 and enter the right pressurizing component 6, thereby balancing the pressure inside the long receiving tube 51. Rotating jaw 594 is slidably connected to the left side of the outer surface of the waste recycling shell 591 via a sliding groove. The inner wall of the rotating jaw 594 holds a wafer. The wafer is held by three sets of rotating jaws 594 with spring-back biased axial positions. Since the rotating jaw 594 connects the upper and lower components together through the return structure in the middle, after the rotating jaw 594 holds the wafer, the wafer can continue to move closer to the waste recycling shell 591 under the action of external force. At this time, the upper structure of the rotating jaw 594 continues to bend inward towards the side closer to the waste recycling shell 591. The sensitive pressure gauge 593 is located at the center of the axis on the left side of the outer surface of the waste recycling shell 591.
[0031] The filled reagent shell is placed at the left end of the parallel guide tube 54 by a push rod. Then the push rod pushes the reagent shell to the right along the parallel guide tube 54 until the bottom of the reagent shell is inserted into the inner cavity of the limiting baffle 55, thereby fixing the reagent shell. During the pressurization process, the volatilized reagent powder will gather on the left side of the guide blow plate 57 and then be sprayed out from the expansion nozzle 571 on the right side of the guide blow plate 57. At this time, the built-in remote control wheel 56 will drive the guide blow plate 57 to rotate at high speed, so that the reagent powder is diffused more evenly to the right wafer part.
[0032] During the wafer coating process, the fixed disk 59 is driven to rotate by the remote control turntable 53. The wafer is held by the rotating claw 594 on the left side of the waste recycling shell 591 to avoid incomplete coverage of the wafer in a fixed state, which could easily lead to coating dead corners. The coating status of the wafer's outer surface is monitored by the inner scanning ring 58, and the wafer is removed in time after coating is completed to avoid the problem of excessive coating thickness.
[0033] Due to the pressurization effect, the gas flows from left to right and pressurizes the wafer. At this time, the residual gas will flow from the guide plate 592 through the waste recycling shell 591 into the pressurization component 6 on the right. The generated waste particles will be retained inside the waste recycling shell 591 to achieve recycling. When the wafer surface is pressurized, it will squeeze the sensitive pressure gauge 593, thereby regulating the actual pressure inside the long receiving tube 51, ensuring the flow rate while avoiding excessive pressure on the wafer.
[0034] After the wafer coating is completed, open the closed cover 2, release the pressure components 6 at both ends, pull out the control linkage 52 from inside the long receiving tube 51, pull open the rotating jaws 594 that hold the wafer, and remove the coated wafer. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art or related fields based on the embodiments of the present invention without inventive effort should fall within the scope of protection of the present invention. Structures, devices, and operating methods not specifically described and explained in the present invention, unless otherwise specified or limited, shall be implemented according to conventional means in the art.
Claims
1. A horizontally inclined chemical vapor deposition apparatus, comprising an operating box (1), a closing cover (2), an internal temperature control component (3), a reaction vessel (5), and a pressurizing component (6), wherein the closing cover (2) is rotatably disposed on the upper part of the operating box (1), the internal temperature control component (3) is disposed inside the operating box (1), the reaction vessel (5) is disposed at the axis of the internal temperature control component (3), and the pressurizing component (6) is symmetrically disposed on the left and right sides of the reaction vessel (5); Its features are: The internal temperature control component (3) includes an internal heating box (31) and an internal support component (7); An expansion groove (32) is provided on the upper surface of the inner heating box (31), and the inner support component (7) is provided on the upper surface of the inner heating box (31) through the expansion groove (32); The inner heating box (31) is equipped with a temperature controller, and preheating plates (33) are symmetrically arranged on both sides of the upper surface of the inner heating box (31) through expansion grooves (32). The inner support component (7) includes an arc-shaped container plate (71), a modified telescopic cylinder (8), and a rubber frame plate (73). The arc-shaped container plate (71) is symmetrically fitted with flat baffles (72) on both sides, and the lower surface of the arc-shaped container plate (71) is fitted with the inner wall of the expansion groove (32). The modified telescopic cylinder (8) is evenly inserted into the inner cavity of the arc-shaped container plate (71), and an independent air pump is evenly arranged inside the arc-shaped container plate (71). The bottom end of the modified telescopic cylinder (8) is connected to the inner cavity of the independent air pump, and the lower surface of the rubber frame plate (73) is inserted into the top of the modified telescopic cylinder (8). The tubular reaction container (5) inserted into the operation box (1) is clamped and fixed by the rubber frame plate (73). The modified telescopic cylinder (8) is pressurized by the independent air pumps at different locations via remote control, thereby achieving the effect of pushing the rubber frame plate (73) at a specific point, and thus causing the clamped reaction container (5) to deflect away from the axis.
2. The horizontally inclined chemical vapor deposition apparatus according to claim 1, characterized in that: The modified telescopic cylinder (8) includes: An elastic sleeve (81) is inserted into the inner cavity of an arc-shaped container plate (71) at its bottom end, and a fixed cylinder shell (82) is inserted into the top end of the elastic sleeve (81). The inner wall of the fixed cylindrical shell (82) has a receiving groove in the middle, and guide grooves are symmetrically provided on both sides of the inner wall of the fixed cylindrical shell (82). The top of the inner wall of the fixed cylindrical shell (82) is engaged with the outer surface of the rubber frame plate (73).
3. The horizontally inclined chemical vapor deposition apparatus according to claim 2, characterized in that: The modified telescopic cylinder (8) also includes: The sliding impact plate (83) has buffer airbags evenly arranged on its upper surface, and both sides of the sliding impact plate (83) are slidably connected to the inner wall of the fixed cylinder shell (82) through guide grooves. Elliptical rotating rod (84) is evenly inserted into the outer surface of the controller shaft. The outer surface of the elliptical rotating rod (84) is slidably connected to the lower surface of the sliding impact plate (83), and the lower surface of the controller is inserted into the bottom of the inner wall of the fixed cylinder shell (82).
4. The horizontally inclined chemical vapor deposition apparatus according to claim 1, characterized in that: The pressurizing component (6) includes: A guide slide rail (61) is provided, and a pressure cylinder (62) is slidably connected to the inner wall of the guide slide rail (61). A docking sleeve (63) is inserted into the end of the reaction vessel (5) through an inner wall, and the lower part of the docking sleeve (63) is threaded to the outer surface of the reaction vessel (5) through a fastening bolt. Pressure gauge (65) is inserted into the upper part of the inner cavity of the docking sleeve (63); The pressure control tube (64) is symmetrically inserted into the front and rear sides of the inner cavity of the docking sleeve (63), and the bottom end of the pressure control tube (64) is inserted into the inner cavity of the pressure cylinder (62).
5. The horizontally inclined chemical vapor deposition apparatus according to claim 1, characterized in that: The reaction vessel (5) includes: A long receiving tube (51) has both ends extending to the outside of the operating box (1). A heat-insulating soft tube (4) is symmetrically sleeved on both sides of the outer surface of the long receiving tube (51). The outer surface of the heat-insulating soft tube (4) is inserted into the side of the operating box (1). A control link (52) is provided, with a fixed plate (59) inserted at its left end and a remote control turntable (53) inserted at its right end. The outer surface of the remote control turntable (53) is inserted into the right side of the inner wall of the long receiving tube (51).
6. The horizontally inclined chemical vapor deposition apparatus according to claim 5, characterized in that: The reaction vessel (5) also includes: Parallel guide tube (54) is provided on the left side of the inner wall of the long receiving tube (51), and a limit baffle (55) is inserted into the right end of the parallel guide tube (54). A guide blowing plate (57) is disposed in the middle of the inner wall of the long receiving tube (51); An inner scanning ring (58) is located on the left side of the remote control turntable (53).
7. The horizontally inclined chemical vapor deposition apparatus according to claim 6, characterized in that: The guide blow plate (57) includes: Built-in remote control wheel (56), the outside of the built-in remote control wheel (56) is inserted into the inner wall of the long receiving tube (51) through a clip, and the outer surface of the built-in remote control wheel (56) is engaged with the middle part of the outer surface of the guide blowing plate (57) through a toothed groove (572). The inner cavity of the guide blow plate (57) is uniformly provided with expansion nozzles (571), and both sides of the outer surface of the guide blow plate (57) are rotatably connected to the inner wall of the long receiving tube (51).
8. The horizontally inclined chemical vapor deposition apparatus according to claim 7, characterized in that: The remote control turntable (53) includes: Waste recycling shell (591), the inner cavity of the waste recycling shell (591) is provided with a dust collection bin, the right side of the outer surface of the waste recycling shell (591) is inserted into the left end of the control linkage (52), and the outer surface of the waste recycling shell (591) is slidably connected to the inner wall of the long receiving tube (51). A guide mesh plate (592) is evenly inserted into the left side of the inner cavity of the waste recycling shell (591) through a ring-cut groove; Rotating claw (594), the rotating claw (594) is slidably connected to the left side of the outer surface of the waste recycling shell (591) through a sliding groove, and a wafer is clamped in the inner wall of the rotating claw (594); A sensitive pressure gauge (593) is located at the center of the axis on the left side of the outer surface of the waste recycling shell (591).