Coating apparatus

Abstract

This application discloses a coating equipment, belonging to the field of wafer processing technology. The disclosed coating equipment includes a process chamber, a support device, a first spray element, and a second spray element. The support device is used to support the wafer and is movably disposed within the process chamber. The first spray element and the second spray element are spaced apart within the process chamber. The first spray element sprays a first gas, and the second spray element sprays a second gas. When the support device moves relative to the process chamber to a first position, the support device faces the first spray element; when the support device moves relative to the process chamber to a second position, the support device faces the second spray element. This solution addresses the problem of frequent maintenance required in coating equipment of related technologies.

Description

Technical Field

[0001] This application belongs to the field of wafer processing technology, specifically relating to a coating equipment. Background Technology

[0002] In coating equipment, spray elements are typically used to deliver different media, such as different types of process gases, into the process chamber so that these different process gases can react to process the wafer. Specifically, the spray elements are connected to different storage bottles outside the process chamber for storing different media via delivery pipelines, and the delivery pipelines are equipped with control valves to ensure that only one type of medium is delivered at a time.

[0003] During the actual wafer processing, the spray unit can deliver different media to the process chamber one after another. However, since different media will remain on the spray unit and react, the spray unit is easily blocked, which affects the processing effect on the wafer. As a result, operators need to frequently maintain the coating equipment, which can easily affect the production efficiency of the coating equipment.

[0004] In summary, the coating equipment involved in the relevant technologies suffers from the problem of requiring frequent maintenance. Summary of the Invention

[0005] This application discloses a coating equipment to solve the problem that coating equipment involved in related technologies requires frequent maintenance.

[0006] To solve the above-mentioned technical problems, this application adopts the following technical solution: A coating apparatus includes a process chamber, a support device, a first spray element, and a second spray element. The carrier device is used to carry the wafer, and the carrier device is movably disposed in the process chamber. The first spray member and the second spray member are disposed at intervals in the process chamber. The first spray member is used to spray a first gas, and the second spray member is used to spray a second gas. When the carrier device moves to a first position relative to the process chamber, the carrier device faces the first spray element; when the carrier device moves to a second position relative to the process chamber, the carrier device faces the second spray element.

[0007] The technical solution adopted in this application can achieve the following beneficial effects: In this application, since the carrier device is movably disposed within the process chamber, and the first and second spray elements are spaced apart within the process chamber, when the carrier device moves relative to the process chamber to the first position, it faces the first spray element; when the carrier device moves relative to the process chamber to the second position, it faces the second spray element. The first and second spray elements spray different gases for wafer processing, ensuring that the type of gas remaining on the same spray element is essentially only one type. This can, to a certain extent, prevent the first and second spray elements from becoming clogged, thereby avoiding affecting the wafer processing effect. Furthermore, operators do not need to frequently maintain the coating equipment. Therefore, the coating equipment disclosed in this application can solve the problem of frequent maintenance required by coating equipment in related technologies. Attached Figure Description

[0008] Figure 1 This is a top-sectional view of the coating equipment disclosed in the embodiments of this application; Figure 2 This is a schematic diagram of the front section structure of the first coating equipment disclosed in the embodiments of this application; Figure 3 and Figure 4 This is a schematic diagram of the structure of the first type of flow guide disclosed in the embodiments of this application from different perspectives; Figure 5 This is a schematic diagram of the structure of the first or second spray component disclosed in the embodiments of this application; Figure 6 This is a side sectional view of the first or second spray component disclosed in the embodiments of this application; Figure 7 for Figure 6 Enlarged view of point A in the middle; Figure 8 This is a schematic diagram of the structure of the third spray component disclosed in the embodiments of this application; Figure 9 This is a side sectional view of the third spray component disclosed in the embodiments of this application; Figure 10 for Figure 9 Enlarged view of point B in the middle; Figure 11 This is a schematic diagram of the front section of the second coating apparatus disclosed in the embodiments of this application; Figure 12 and Figure 13 These are schematic diagrams of the chip storage box from different perspectives disclosed in the embodiments of this application. Figure 14 and Figure 15 These are schematic diagrams of the structure of the second type of flow guide disclosed in the embodiments of this application from different perspectives; Figure 16This is a top view of the filler structure disclosed in the embodiments of this application; Figure 17 This is a cross-sectional structural diagram of the filler disclosed in the embodiments of this application.

[0009] Explanation of reference numerals in the attached figures: 100 - Process chamber; 110 - Furnace door; 200-Carrying device, 210-First carrying device, 220-Second carrying device, 230-Third carrying device, 240-Fourth carrying device, 250-Carrying boat, 260-Wafer storage box, 261-Outer shell, 262-Pressure plate, 263-Opening; 310-First spray component, 311-First sub-spray component, 312-Second sub-spray component, 320-Second spray component, 321-Third sub-spray component, 322-Fourth sub-spray component, 330-Third spray component, 340-First conveying channel, 350-Spray hole, 351-First through hole, 352-Second through hole, 360-Second conveying channel; 400-chip; 500 - Filler, 510 - First surface, 520 - First mounting component; 600 - air guide, 610 - air inlet, 620 - air outlet; 700 - Exhaust pipe, 710 - First pipe body, 711 - Vent hole, 720 - Second pipe body; 810-Heating element, 820-Cooling element, 830-Drive mechanism, 831-Drive source, 832-Drive shaft, 833-Rotating element, 834-Sealing device, 840-Particle collection device, 850-Isolation valve, 860-Vacuum pump, 870-Exhaust gas treatment device; 910 - First Source Bottle, 920 - Second Source Bottle, 930 - Third Source Bottle, 940 - Fourth Source Bottle. Detailed Implementation

[0010] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0011] The coating equipment disclosed in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0012] Please refer to Figures 1-17This application discloses a coating equipment, which includes a process chamber 100, a support device 200, a first spray element 310, and a second spray element 320.

[0013] The process chamber 100 is a basic component of the coating equipment. Specifically, it is the place where the wafer 400 is processed in the coating equipment. The carrier device 200 is used to carry the wafer 400. That is, the carrier device 200 can provide a base for setting the wafer 400. The carrier device 200 is movably disposed in the process chamber 100 so that the wafer 400 on the carrier device 200 can move with the carrier device 200 in the process chamber 100.

[0014] The first spray element 310 and the second spray element 320 are disposed at a distance within the process chamber 100. The first spray element 310 is used to spray a first gas, and the second spray element 320 is used to spray a second gas. The first gas and the second gas are different process gases required for processing the wafer 400. Optionally, the shape of the first spray element 310 and the shape of the second spray element 320 can both be plate-shaped or tubular. Of course, the embodiments of this application do not impose specific limitations on this.

[0015] When the carrier device 200 moves to the first position relative to the process chamber 100, the carrier device 200 faces the first spray member 310. At this time, the first spray member 310 can work, that is, the first spray member 310 can spray the first gas onto the wafer 400 carried on the carrier device 200. When the carrier device 200 moves to the second position relative to the process chamber 100, the carrier device 200 faces the second spray member 320. At this time, the second spray member 320 can work, that is, the second spray member 320 can spray the second gas onto the wafer 400 carried on the carrier device 200. The first gas and the second gas will react on the wafer 400 to form a deposit, thereby achieving the purpose of processing the wafer 400.

[0016] Optionally, the process chamber 100 can be a polygonal cavity or a circular cavity. Of course, the embodiments of this application do not impose specific limitations on this.

[0017] In this application, since the carrier device 200 is movably disposed within the process chamber 100, and the first spray element 310 and the second spray element 320 are spaced apart within the process chamber 100, when the carrier device 200 moves relative to the process chamber 100 to the first position, the carrier device 200 faces the first spray element 310; when the carrier device 200 moves relative to the process chamber 100 to the second position, the carrier device 200 faces the second spray element 320. The first spray element 310 and the second spray element 320 spray different gases for processing the wafer 400, ensuring that the type of gas remaining on the same spray element is essentially only one type. This can, to a certain extent, prevent the first spray element 310 and the second spray element 320 from becoming clogged, thereby avoiding affecting the processing effect on the wafer 400. Furthermore, operators do not need to frequently maintain the coating equipment. Therefore, the coating equipment disclosed in this application can solve the problem of frequent maintenance required by coating equipment involved in related technologies.

[0018] Alternatively, please refer to Figure 1 To prevent the first gas sprayed by the first spray element 310 from diffusing to the second spray element 320, and to prevent the second gas sprayed by the second spray element 320 from diffusing to the first spray element 310, the coating equipment may further include a third spray element 330. The third spray element 330 is disposed within the process chamber 100 and located between adjacent first and second spray elements 310 and 320. The third spray element 330 sprays an inert gas to separate the first and second gases, thus preventing mutual diffusion and reaction at the first spray element 310 or the second spray element 320. Therefore, this arrangement further prevents blockage of the first and second spray elements 310 and 320. Optionally, the inert gas can be nitrogen. Of course, in other embodiments, the coating equipment may not include the third spray element 330.

[0019] In this embodiment, since the inert gas does not react with the first gas and the second gas, and also does not react with the wafer 400, the inert gas provided by the third spray member 330 can not only separate the first gas and the second gas, but also serve as a purging gas to purge excess first gas and second gas in the process chamber 100.

[0020] Alternatively, please refer to Figure 1 , Figure 16 and Figure 17The coating equipment may also include a filler 500, and the number of carrier devices 200 may be at least two. Each carrier device 200 is arranged at intervals on the circumference of the process chamber 100. The filler 500 may be located between two adjacent carrier devices 200, and the filler 500 is arranged opposite to the third spraying device 330.

[0021] In this embodiment, since the filler 500 is located between two adjacent support devices 200, it can fill at least part of the space between the two adjacent support devices 200. This avoids process failure due to incomplete purging by the inert gas caused by residual first and second gases at the corners inside the process chamber 100. Furthermore, it prevents the first and second gases from flowing into the space between the two adjacent support devices 200, where resistance is lower, without passing through the wafer 400. This arrangement ensures the processing effect on the wafer 400. Of course, in other embodiments, the coating equipment may not include the filler 500.

[0022] Optionally, the filler 500 has a first surface 510 opposite to the third sprayer 330, which may be a plane.

[0023] In another embodiment, the first surface 510 can be an arc-shaped surface, and the arc-shaped surface bends toward the third spray member 330. The inert gas provided by the third spray member 330 can be sprayed toward the first surface 510. Since the first surface 510 is an arc-shaped surface, the inert gas can move along the direction of the arc-shaped surface. The arc-shaped first surface 510 has less resistance to the inert gas, that is, the first surface 510 can guide the inert gas, thereby making it easier for the inert gas to separate the first gas and the second gas.

[0024] Alternatively, please refer to Figures 5 to 10 At least one of the first spray member 310, the second spray member 320, and the third spray member 330 is provided with a first conveying channel 340 and a plurality of spray holes 350. The first conveying channel 340 of the first spray member 310 is used to convey a first gas, the first conveying channel 340 of the second spray member 320 is used to convey a second gas, and the first conveying channel 340 of the third spray member 330 is used to convey an inert gas. The spray holes 350 on the first spray member 310 and the second spray member 320 can face the carrying device 200, and the spray holes 350 on the third spray member 330 can face the filler 500.

[0025] In this embodiment, each spray hole 350 is connected to the first conveying channel 340, and each spray hole 350 includes a first through hole 351 and a second through hole 352 that are connected. The first through hole 351 connects the first conveying channel 340 and the second through hole 352, and the diameter of the first through hole 351 is smaller than the diameter of the second through hole 352. This allows the pressure of at least one of the first gas, the second gas, and the inert gas to decrease as it flows from the first through hole 351 to the second through hole 352, thereby reducing the gas spray area. This achieves the effect of concentrated spraying of at least one of the first gas, the second gas, and the inert gas, resulting in better uniformity of the processed wafer 400, uniformity of the spacing between the first gas and the second gas, and uniformity of the purging process chamber 100. Of course, in other embodiments, the diameter of the first through hole 351 can be equal to or greater than the diameter of the second through hole 352.

[0026] Optionally, in the above embodiments, the first conveying channel 340 can extend in the horizontal direction, and the number of the first conveying channels 340 can be at least two. Each first conveying channel 340 can be spaced apart along the height direction of the coating equipment, and each first conveying channel 340 is connected to a plurality of spray holes 350. Optionally, at least one of the first spray member 310, the second spray member 320, and the third spray member 330 may be provided with a second conveying channel 360. The second conveying channel 360 may extend along the height direction of the coating equipment, that is, the extension direction of the first conveying channel 340 is perpendicular to the extension direction of the second conveying channel 360. There may be two second conveying channels 360, which are respectively distributed at opposite ends of the first conveying channel 340, so that the second conveying channel 360 is connected to each of the first conveying channels 340. This application can convey at least one of the first gas, the second gas, and the inert gas into the spray hole 350 by conveying at least one of the first gas, the second gas, and the inert gas into the two second conveying channels 360. Moreover, at least one of the first gas, the second gas, and the inert gas can be simultaneously conveyed to multiple first conveying channels 340 through the two second conveying channels 360.

[0027] Optionally, the number of carrier devices 200 can be one.

[0028] In another embodiment, please refer to Figure 1 The number of carrier devices 200 can be at least two, including a first carrier device 210 and a second carrier device 220 arranged circumferentially in the process chamber 100, and each carrier device 200 can rotate around the axis of the process chamber 100. Since multiple carrier devices 200 can carry multiple wafers 400, this can increase the output of wafers 400 processed by the coating equipment to a certain extent.

[0029] Optionally, when the first carrier device 210 faces one of the first spray member 310 and the second spray member 320, the second carrier device 220 faces the other of the first spray member 310 and the second spray member 320. That is, the first carrier device 210 and the second carrier device 220 can simultaneously face different spray members. In this case, the first spray member 310 and the second spray member 320 can work simultaneously, thereby simultaneously spraying the wafer 400 carried on the first carrier device 210 and the second carrier device 220. It can be seen that this arrangement can improve the efficiency of processing the wafer 400 to a certain extent. Of course, in other embodiments, when the first carrier device 210 faces one of the first spray member 310 and the second spray member 320, the second carrier device 220 may not face either the first spray member 310 or the second spray member 320. That is, at the same time, only one of the first carrier device 210 and the second carrier device 220 faces either the first spray member 310 or the second spray member 320.

[0030] In this embodiment, since the first spray element 310 and the second spray element 320 can work simultaneously, that is, the first gas and the second gas will enter the process chamber 100 at the same time, the third spray element 330 can also work so that the inert gas provided by the third spray element 330 can more effectively separate the first gas and the second gas, thereby avoiding mutual diffusion between the first gas and the second gas.

[0031] Alternatively, each support device 200 may include only the first support device 210 and the second support device 220 described above.

[0032] In another embodiment, please refer to Figure 1 Each carrier device 200 may also include a third carrier device 230 and a fourth carrier device 240. In the circumferential direction of the process chamber 100, the first carrier device 210, the second carrier device 220, the third carrier device 230 and the fourth carrier device 240 are arranged sequentially and evenly. That is, the included angle between any two of the first carrier device 210, the second carrier device 220, the third carrier device 230 and the fourth carrier device 240 can be 90 degrees. The first carrier device 210, the second carrier device 220, the third carrier device 230 and the fourth carrier device 240 can carry more wafers 400, thereby further increasing the output of wafers 400 processed by the coating equipment.

[0033] Optionally, the number of the first spray element 310 and the number of the second spray element 320 can both be one.

[0034] In another embodiment, the number of first spray elements 310 is at least two, including a first sub-spray element 311 and a second sub-spray element 312, and the number of second spray elements 320 is at least two, including a third sub-spray element 321 and a fourth sub-spray element 322. The first sub-spray element 311, the second sub-spray element 312, the third sub-spray element 321 and the fourth sub-spray element 322 are evenly arranged in the circumferential direction of the process chamber 100. During the rotation of each support device 200, the first sub-spray element 311, the second sub-spray element 312, the third sub-spray element 321 and the fourth sub-spray element 322 can all face different support devices 200. At this time, the first sub-spray element 311, the second sub-spray element 312, the third sub-spray element 321 and the fourth sub-spray element 322 can work simultaneously to further improve the efficiency of processing the wafer 400.

[0035] Alternatively, please refer to Figure 1 The coating equipment may also include a first source bottle 910, a second source bottle 920, a third source bottle 930, and a fourth source bottle 940. The first source bottle 910 can be connected to the first sub-spraying component 311 through a first process pipeline. The third source bottle 930 can be connected to the second sub-spraying component 312 through a second process pipeline. The second source bottle 920 can be connected to the third sub-spraying component 321 through a third process pipeline. The fourth source bottle 940 can be connected to the fourth sub-spraying component 322 through a fourth process pipeline. That is, the first source bottle 910 and the third source bottle 930 can provide a first gas to the first spraying component 310, and the second source bottle 920 and the fourth source bottle 940 can provide a second gas to the second spraying component 320.

[0036] Specifically, the first source bottle 910 and the third source bottle 930 can store a liquid first medium. The first source bottle 910 and the third source bottle 930 can use a source bottle bubbling method or a source bottle heating and evaporation method to turn the liquid first medium into a first gas, and carry it to the first spray element 310 by a carrier gas. The second source bottle 920 and the fourth source bottle 940 can store a liquid second medium. The second source bottle 920 and the fourth source bottle 940 can also use a source bottle bubbling method or a source bottle heating and evaporation method to turn the liquid second medium into a second gas, and carry it to the second spray element 320 by a carrier gas. The carrier gas can be an inert gas, and the type of inert gas can be the same as the aforementioned inert gas. In addition to carrying the first gas and the second gas, the inert gas can also purge excess, i.e., unreacted first gas and second gas, to outside the process chamber 100.

[0037] Optionally, to facilitate the control of the working status of the first sub-sprayer 311, the third sub-sprayer 321, the second sub-sprayer 312, and the fourth sub-sprayer 322, diaphragm valves can be installed on each of the above-mentioned process pipelines corresponding to the first source bottle 910, the second source bottle 920, the third source bottle 930, and the fourth source bottle 940. The diaphragm valves can control the on / off status of each process pipeline.

[0038] Optionally, in the above embodiments, since the number of the first spray member 310 and the number of the second spray member 320 are both at least two, correspondingly, the number of the third spray member 330 can also be at least two. Please refer to [reference needed] for details. Figure 1 At this time, a third spray member 330 can be provided between the first sub-spray member 311 and the third sub-spray member 321, between the third sub-spray member 321 and the second sub-spray member 312, between the second sub-spray member 312 and the fourth sub-spray member 322, and between the fourth sub-spray member 322 and the first sub-spray member 311, so that the third spray member 330 can separate the first gas and the second gas at each location.

[0039] Optionally, before specifically processing the wafer 400, the coating equipment disclosed in this application can first open the furnace door 110 provided on the side wall of the process chamber 100, and sequentially place the first carrier device 210, the second carrier device 220, the third carrier device 230 and the fourth carrier device 240 carrying the wafer 400 into the process chamber 100, and then close the furnace door 110. At this time, the vacuum pump 860 and the exhaust pipe 700 described later can be used to evacuate the process chamber 100. During the evacuation process, the heating element 810 described later can be used to heat the process chamber 100 so that the temperature inside the process chamber 100 reaches the temperature required for the process, and stabilize for a reasonable time so that the wafer 400 also reaches the temperature required for the process.

[0040] At this point, the wafer 400 processing operation can be performed. Specifically, during the initial wafer 400 processing, this application can first orient the first sub-spray member 311 toward the first support device 210, the third sub-spray member 321 toward the second support device 220, the second sub-spray member 312 toward the third support device 230, and the fourth sub-spray member 322 toward the fourth support device 240. Please refer to [reference needed] for details. Figure 1 At this time, only the first sub-sprayer 311 and the second sub-sprayer 312 can be operated so that the first gas first adheres to the corresponding wafers 400 in the first carrier device 210 and the third carrier device 230.

[0041] Secondly, by rotating the first support device 210, the second support device 220, the third support device 230, and the fourth support device 240 clockwise relative to the process chamber 100, the first sub-sprayer 311 faces the fourth support device 240, the third sub-sprayer 321 faces the first support device 210, the second sub-sprayer 312 faces the second support device 220, and the fourth sub-sprayer 322 faces the third support device 230. At this time, the first sub-sprayer 311, the third sub-sprayer 321, the second sub-sprayer 312, and the fourth sub-sprayer 322 can work simultaneously, so that the second gas reaches the first support device. The first gas provided by the first sub-sprayer 311 and the second sub-sprayer 312 can adhere to the wafers 400 in the first carrier device 210 and the third carrier device 230, thereby forming a deposit on the wafers 400 in the first carrier device 210 and the third carrier device 230, thus achieving the purpose of processing the wafers 400 in the first carrier device 210 and the third carrier device 230. The first gas provided by the first sub-sprayer 311 and the second sub-sprayer 312 can adhere to the wafers 400 in the fourth carrier device 240 and the second carrier device 220.

[0042] Then, by rotating the first carrier device 210, the second carrier device 220, the third carrier device 230, and the fourth carrier device 240 clockwise relative to the process chamber 100 again, the first sub-sprayer 311 faces the third carrier device 230, the third sub-sprayer 321 faces the fourth carrier device 240, the second sub-sprayer 312 faces the first carrier device 210, and the fourth sub-sprayer 322 faces the second carrier device 220. At this time, the third sub-sprayer 321 and the fourth sub-sprayer 322 can work, so that the second gas reaches the corresponding wafers 400 in the fourth carrier device 240 and the second carrier device 220, thereby reacting with the first gas originally attached to the corresponding wafers 400 in the fourth carrier device 240 and the second carrier device 220, thereby forming a deposit that is deposited on the corresponding wafers 400 in the fourth carrier device 240 and the second carrier device 220, thereby achieving the purpose of processing the corresponding wafers 400 in the fourth carrier device 240 and the second carrier device 220.

[0043] This allows for the processing of the corresponding wafers 400 within the first carrier device 210, second carrier device 220, third carrier device 230, and fourth carrier device 240. It should be noted that during the rotation of the first carrier device 210, second carrier device 220, third carrier device 230, and fourth carrier device 240 relative to the process chamber 100, the first sub-sprayer 311, third sub-sprayer 321, second sub-sprayer 312, and fourth sub-sprayer 322 must all be in a stopped state. Furthermore, after each application of the first or second gas to the corresponding wafers 400 within the first carrier device 210, second carrier device 220, third carrier device 230, and fourth carrier device 240 by the first sub-sprayer 311, third sub-sprayer 321, second sub-sprayer 312, and fourth sub-sprayer 322, the excess first or second gas must be purged off with inert gas. Furthermore, by repeatedly performing the above-mentioned operation steps, multiple layers of the above-mentioned deposits can be deposited on the corresponding wafers 400 in the first carrier device 210, the second carrier device 220, the third carrier device 230 and the fourth carrier device 240, thereby meeting the usage requirements.

[0044] Finally, after the wafer 400 is finished being processed, i.e., the first sub-spray unit 311, the third sub-spray unit 321, the second sub-spray unit 312 and the fourth sub-spray unit 322 are all in a stopped state, at this time, inert gas can be introduced into the process chamber 100, specifically through the third spray unit 330 mentioned above, so that the internal pressure of the process chamber 100 reaches the standard atmospheric pressure, the furnace door 110 is opened, and the processed wafer 400 is taken out and placed in the waiting area for the next processing process.

[0045] Optionally, the carrier device 200 can be a carrier boat 250 or a wafer storage box 260. The carrier boat 250 can be used to carry a whole wafer 400, that is, when processing the front side of the wafer 400, the carrier boat 250 can be used to carry the wafer 400. The wafer storage box 260 can be used to carry a half wafer 400, that is, when processing the cut surface of the half wafer 400, the wafer storage box 260 can be used to carry the wafer 400. In this embodiment, the carrier boat 250 or the wafer storage box 260 can be selectively placed in the process chamber 100. That is, the coating equipment disclosed in this application can be used to process both whole wafers 400 and half wafers 400, which makes the coating equipment disclosed in this application have a wider range of applications and higher utilization. Of course, in other embodiments, only the carrier boat 250 or the wafer storage box 260 can be placed in the process chamber 100.

[0046] Alternatively, please refer to Figure 2The carrier boat 250 has multiple carrier surfaces spaced apart along the height direction of the coating equipment. These carrier surfaces can be horizontal, and each carrier surface is used to support a pair of back-to-back stacked wafers 400. The front side of the wafer 400 can contact the carrier surface, allowing the multiple pairs of stacked wafers 400 within the carrier boat 250 to be arranged parallel to the ground. This ensures that under the influence of gravity, each pair of back-to-back stacked wafers 400 adheres more tightly, avoiding back-side plating issues and eliminating the need for additional clamping devices to hold each pair of wafers 400 together, thus preventing damage to the wafers 400. Alternatively, in other embodiments, the side of the wafer 400 can contact the carrier surface, allowing the multiple pairs of stacked wafers 400 within the carrier boat 250 to be arranged perpendicular to the ground.

[0047] Alternatively, please refer to Figure 12 and Figure 13 The wafer storage box 260 is used to store multiple stacked half wafers 400. Specifically, the wafer storage box 260 may include a detachably connected outer shell 261 and a pressure plate 262. The outer shell 261 and the pressure plate 262 can form a mounting groove for placing the half wafers 400. The cut surface of the half wafers 400 is located at the opening of the mounting groove, that is, at the opening 263 of the wafer storage box 260. The opening 263 can face the first spray member 310 or the second spray member 320. The pressure plate 262 can squeeze the multiple half wafers 400 so that the half wafers 400 are tightly attached, thereby achieving the purpose of processing only the cut surface of the half wafers 400.

[0048] In this embodiment, please refer to Figure 11 The number of wafer receiving boxes 260 can be at least two, and each wafer receiving box 260 can be arranged sequentially along the height direction of the coating equipment, that is, the wafer receiving boxes 260 are placed in multiple layers to make full use of the height space of the coating equipment, thereby enabling more half-wafers 400 to be processed at one time. It can be seen that this arrangement is beneficial for mass production of half-wafers 400. Of course, in other embodiments, the number of wafer receiving boxes 260 can also be one.

[0049] Alternatively, please refer to Figures 1 to 4 , Figure 11 , Figure 14 and Figure 15 The coating equipment may further include a flow guide 600, which is sleeved outside the support device 200. One end of the flow guide 600 has an air inlet 610, and the other end has an air outlet 620. The air inlet 610 and the air outlet 620 are connected. The air inlet 610 faces the first spray member 310 or the second spray member 320, so that the flow guide 600 is in the flow path of the first gas or the second gas (specifically... Figure 4 and Figure 15The guide element 600 forms a closed space around the wafer 400 (in the direction indicated by the middle arrow) to facilitate the flow of the first or second gas. This means the guide element 600 allows the first or second gas to pass more evenly across the surface of the wafer 400, resulting in more uniform processing of the wafer 400. Optionally, the guide element 600 can be cylindrical or generally rectangular. Of course, in other embodiments, the coating apparatus may not include the guide element 600.

[0050] In this embodiment, when the supporting device 200 is a supporting boat 250, please refer to the following for details. Figures 2 to 4 The flow guide 600 and the carrier boat 250 can be set in a one-to-one correspondence, that is, a larger flow guide 600 can be fitted around the periphery of a larger carrier boat 250.

[0051] In this embodiment, when the carrier device 200 is a wafer storage box 260, please refer to the following for details. Figure 11 , Figure 14 and Figure 15 Since there are at least two wafer receiving boxes 260, and each wafer receiving box 260 is arranged sequentially along the height direction of the coating equipment, the number of flow guides 600 can also be at least two, so that they can be arranged in a one-to-one correspondence with each wafer receiving box 260. That is, a smaller flow guide 600 can be fitted around the periphery of a smaller wafer receiving box 260. In addition, in order to facilitate the spacing of each flow guide 600, multiple support members can be installed on the side wall of the filler 500 mentioned above. Each support member can be arranged sequentially along the height direction of the coating equipment, and each flow guide 600 can correspond to each support member. That is, each support member can support each flow guide 600 to ensure the stability of the arrangement of each flow guide 600.

[0052] Therefore, for different types and sizes of carrier devices 200, this application can use different sizes of guide members 600 to achieve the effect of guiding flow, so as to adapt to different types and sizes of carrier devices 200. Moreover, this setting method can further improve the processing uniformity of the wafer 400.

[0053] Optionally, as can be seen from the foregoing, the number of carrier devices 200 is at least two, and each carrier device 200 is arranged at intervals in the circumferential direction of the process chamber 100. Correspondingly, the number of guide members 600 in the circumferential direction of the process chamber 100 can also be at least two, so that the guide members 600 and the carrier devices 200 can be arranged in a one-to-one correspondence.

[0054] Optionally, the coating equipment may also include an exhaust pipe 700, which includes a first pipe body 710 and a second pipe body 720 connected to each other. The first pipe body 710 is located inside the process chamber 100, and the second pipe body 720 is located outside the process chamber 100. The exhaust pipe 700 can be installed on the top cover of the process chamber 100 by fasteners. The first pipe body 710 is provided with an exhaust hole 711. The exhaust pipe 700 can discharge excess first gas, second gas and inert gas from the process chamber 100.

[0055] In this embodiment, the air outlet 620 can face the exhaust hole 711, and the cross-sectional area of ​​the air outlet 620 is smaller than the cross-sectional area of ​​the air inlet 610. The cross-sections of the air outlet 620 and the air inlet 610 are perpendicular to the axial direction of the guide member 600. Since the cross-sectional area of ​​the air outlet 620 is smaller than that of the air inlet 610, the edge of the air outlet 620 contracts in the direction of the axis of the guide member 600, so as to face the exhaust hole 711. This facilitates the concentration and guidance of excess first gas, second gas, and inert gas to the exhaust hole 711, where they are discharged. Of course, in other embodiments, the cross-sectional area of ​​the air outlet 620 can also be equal to or greater than the cross-sectional area of ​​the air inlet 610.

[0056] Optionally, as described above, the number of carrier devices 200 can be at least two. The carrier devices 200 can be spaced apart around the circumference of the process chamber 100. To facilitate the discharge of excess first gas, second gas, and inert gas from each carrier device 200 through the exhaust port 711, the first pipe 710 can be located in the central area of ​​the process chamber 100, and each carrier device 200 can surround the first pipe 710. This arrangement allows for the sharing of exhaust pipes 700, which simplifies the structural complexity of the coating equipment to some extent. Of course, in other embodiments, the number of exhaust pipes 700 can be equal to the number of carrier devices 200, and they correspond one-to-one.

[0057] Optionally, the number of exhaust vents 711 can be one.

[0058] In another embodiment, to increase the exhaust rate, please refer to... Figure 2 and Figure 11 The first tube 710 can extend along the height direction of the coating equipment, and the number of exhaust holes 711 can be at least two. Each exhaust hole 711 is spaced apart in the extension direction of the first tube 710. Multiple exhaust holes 711 can further improve the exhaust rate.

[0059] In this application, to facilitate the removal of excess first gas, second gas and inert gas, the coating equipment may also include a vacuum pump 860, which is connected to the second tube 720. The vacuum pump 860 is used to extract excess first gas, second gas and inert gas from the process chamber 100. Generally, the farther an exhaust port 711 is from the vacuum pump 860, the weaker the suction force on the first gas, second gas, or inert gas around that exhaust port 711, meaning the exhaust rate of that exhaust port 711 is slower. To ensure the exhaust rate at all points within the process chamber 100, optionally, the diameter of each exhaust port 711 can gradually increase in the direction away from the second pipe 720, meaning the exhaust port 711 farthest from the vacuum pump 860 has the largest diameter. This facilitates the flow of excess first gas, second gas, and inert gas from that exhaust port 711 to that exhaust port 711, ensuring a relatively uniform exhaust rate throughout the process chamber 100. Of course, in other embodiments, the diameters of all exhaust ports 711 can also be equal.

[0060] Optionally, the coating equipment may also include a particle collection device 840, an isolation valve 850, and an exhaust gas treatment device 870. The particle collection device 840, the isolation valve 850, the vacuum pump 860, and the exhaust gas treatment device 870 are arranged sequentially and at intervals on the second pipe body 720. The isolation valve 850 is used to open or close the second pipe body 720, the particle collection device 840 is used to collect excess reactant particles, and the exhaust gas treatment device 870 is used to purify the exhaust gas.

[0061] Optionally, the coating equipment may further include at least two heating elements 810, each of which may be spaced apart within the process chamber 100. Specifically, heating elements 810 may be provided on the inner top wall, inner side wall, and inner bottom wall of the process chamber 100, and each heating element 810 may be positioned close to each supporting device 200. Multiple heating elements 810 can quickly heat the temperature inside the process chamber 100 to the required process temperature, and can make the temperature more uniform throughout the process chamber 100. Of course, in other embodiments, the number of heating elements 810 may also be one.

[0062] Optionally, the coating equipment may further include at least two cooling elements 820, each of which may be spaced apart on the outer wall of the process chamber 100. Specifically, cooling elements 820 may be welded onto the top, outer, and bottom walls of the process chamber 100. Multiple cooling elements 820 can cool the outer wall of the process chamber 100 to a reasonable temperature to prevent burns to operators. Of course, in other embodiments, the number of cooling elements 820 may also be one.

[0063] Optionally, as can be seen from the foregoing, the number of carrier devices 200 is at least two. In order to facilitate the rotation of each carrier device 200 relative to the process chamber 100, the coating equipment may also include a drive mechanism 830. The drive mechanism 830 may include a drive source 831, a drive shaft 832 and a rotating component 833 connected in sequence. The drive source 831 is located outside the process chamber 100. One end of the drive shaft 832 passes through the third through hole on the process chamber 100 and enters the process chamber 100 to be connected to the rotating component 833. That is, the rotating component 833 is rotatably located inside the process chamber 100.

[0064] In this embodiment, the rotating component 833 is connected to each of the supporting devices 200 to drive each supporting device 200 to rotate around the axis of the process chamber 100. That is, the same rotating component 833 is simultaneously connected to different supporting devices 200, allowing the different supporting devices 200 to move simultaneously. Therefore, this arrangement can achieve the effect of multiple supporting devices 200 being driven by the same driving mechanism 830, making the structure of the coating equipment disclosed in this application simpler. Optionally, the rotating component 833 can be a rotating disk, meaning the rotating component 833 has a relatively large area to facilitate connection with multiple supporting devices 200, thereby facilitating the simultaneous rotation of multiple supporting devices 200 around the axis of the process chamber 100. Of course, in other embodiments, the number of driving mechanisms 830 can be equal to the number of supporting devices 200, and they can correspond one-to-one.

[0065] Optionally, the drive source 831 can be a reduction gearbox or a reduction timing belt. Of course, this application embodiment does not impose specific limitations on this.

[0066] Optionally, to ensure the airtightness of the process chamber 100, the drive mechanism 830 may further include a sealing device 834. The sealing device 834 is sleeved outside the drive shaft 832, and the drive shaft 832 can rotate relative to the sealing device 834. The sealing device 834 is installed at the third through hole, and the sealing device 834 is sealed to both the third through hole and the drive shaft 832 to ensure the airtightness of the process chamber 100. The sealing device 834 may adopt a magnetic fluid sealing method or other sealing methods.

[0067] Optionally, to facilitate the placement of the filler 500 between two adjacent support devices 200, the filler 500 can be mounted on the rotating member 833 via the first mounting member 520, so that the rotating member 833 can simultaneously drive the support device 200 and the filler 500 to rotate. That is, this arrangement can ensure that the filler 500 is always located in the space between two adjacent support devices 200.

[0068] Optionally, the carrier device 200 can rotate about the axis of the process chamber 100 to approach the first spray member 310 or the second spray member 320. When the carrier device 200 is facing the first spray member 310 or the second spray member 320, the carrier device 200 can stop moving relative to the process chamber 100. That is, during the processing of the wafer 400 on the carrier device 200, the carrier device 200 needs to remain stationary relative to the process chamber 100 to allow the coating equipment to stably process the wafer 400, thereby ensuring the processing effect of the wafer 400. Of course, in other embodiments, when the carrier device 200 is facing the first spray member 310 or the second spray member 320, the carrier device 200 can also move slightly relative to the process chamber 100.

[0069] Optionally, when the first spray component 310, the second spray component 320, the third spray component 330, and the heating component 810 are specifically installed on the process chamber 100, multiple sheet metal connectors can be used to stably install the first spray component 310, the second spray component 320, the third spray component 330, and the heating component 810 on the process chamber 100, so as to ensure the working stability of the first spray component 310, the second spray component 320, the third spray component 330, and the heating component 810.

[0070] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0071] The above description is merely an embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this application should be included within the scope of the claims of this application.

Claims

1. A coating equipment, characterized in that, It includes a process chamber (100), a support device (200), a first spray element (310), and a second spray element (320). The carrier device (200) is used to carry the wafer (400), and the carrier device (200) is movably disposed in the process chamber (100). The first spray member (310) and the second spray member (320) are disposed at intervals in the process chamber (100). The first spray member (310) is used to spray a first gas, and the second spray member (320) is used to spray a second gas. When the carrier (200) moves to a first position relative to the process chamber (100), the carrier (200) faces the first spray member (310); when the carrier (200) moves to a second position relative to the process chamber (100), the carrier (200) faces the second spray member (320).

2. The coating equipment according to claim 1, characterized in that, The coating equipment further includes a third spray element (330), which is disposed in the process chamber (100) and located between the adjacent first spray element (310) and second spray element (320). The third spray element (330) is used to spray inert gas so that the inert gas separates the first gas and the second gas.

3. The coating equipment according to claim 2, characterized in that, The coating equipment also includes a filler (500), and the number of the carrier devices (200) is at least two. The carrier devices (200) are spaced apart on the circumference of the process chamber (100). The filler (500) is located between two adjacent carrier devices (200), and the filler (500) is arranged opposite to the third spraying device (330).

4. The coating equipment according to claim 3, characterized in that, The filler (500) has a first surface (510) opposite to the third sprayer (330), the first surface (510) being an arcuate surface and the arcuate surface curving toward the third sprayer (330).

5. The coating equipment according to claim 2, characterized in that, At least one of the first spray member (310), the second spray member (320) and the third spray member (330) is provided with a first conveying channel (340) and a plurality of spray holes (350). Each spray hole (350) is connected to the first conveying channel (340). Each spray hole (350) includes a first through hole (351) and a second through hole (352) that are connected. The first through hole (351) connects the first conveying channel (340) and the second through hole (352), and the diameter of the first through hole (351) is smaller than the diameter of the second through hole (352).

6. The coating equipment according to claim 1, characterized in that, The number of the support devices (200) is at least two, including a first support device (210) and a second support device (220) arranged circumferentially in the process chamber (100), and each of the support devices (200) can rotate about the axis of the process chamber (100). When the first support device (210) is facing one of the first spray member (310) and the second spray member (320), the second support device (220) is facing the other of the first spray member (310) and the second spray member (320).

7. The coating equipment according to claim 6, characterized in that, Each of the aforementioned support devices (200) further includes a third support device (230) and a fourth support device (240). In the circumferential direction of the process chamber (100), the first support device (210), the second support device (220), the third support device (230) and the fourth support device (240) are arranged sequentially and evenly. The number of the first spray element (310) is at least two, including a first sub-spray element (311) and a second sub-spray element (312). The number of the second spray element (320) is at least two, including a third sub-spray element (321) and a fourth sub-spray element (322). The first sub-spray element (311), the second sub-spray element (312), the third sub-spray element (321) and the fourth sub-spray element (322) are evenly arranged in the circumferential direction of the process chamber (100). During the rotation of each of the bearing devices (200), the first sub-spray element (311), the second sub-spray element (312), the third sub-spray element (321) and the fourth sub-spray element (322) can all face different bearing devices (200).

8. The coating equipment according to claim 1, characterized in that, The carrier device (200) is a carrier boat (250) or a wafer storage box (260), and the carrier boat (250) or the wafer storage box (260) can be selectively placed in the process chamber (100), wherein: The carrier boat (250) has a plurality of carrier surfaces spaced apart along the height direction of the coating equipment. The carrier surfaces are horizontal, and each carrier surface is used to support a pair of wafers (400) stacked back to back. The wafer storage box (260) is used to store multiple stacked wafers (400). The number of wafer storage boxes (260) is at least two, and each wafer storage box (260) is arranged sequentially along the height direction of the coating equipment.

9. The coating equipment according to claim 1, characterized in that, The coating equipment also includes a flow guide (600), which is sleeved outside the support device (200). One end of the flow guide (600) is provided with an air inlet (610) and the other end is provided with an air outlet (620). The air inlet (610) faces the first spray member (310) or the second spray member (320). The flow guide (600) and the bearing device (200) are respectively configured in a one-to-one correspondence.

10. The coating equipment according to claim 9, characterized in that, The coating equipment also includes an exhaust pipe (700), which includes a first pipe body (710) and a second pipe body (720) connected to each other. The first pipe body (710) is located inside the process chamber (100), and the second pipe body (720) is located outside the process chamber (100). The first pipe body (710) is provided with an exhaust hole (711), and the air outlet (620) faces the exhaust hole (711). The cross-sectional area of ​​the air outlet (620) is smaller than the cross-sectional area of ​​the air inlet (610).

11. The coating equipment according to claim 10, characterized in that, The first tube (710) is located in the central region of the process chamber (100), and there are at least two support devices (200). The support devices (200) are spaced apart in the circumference of the process chamber (100), and each support device (200) surrounds the first tube (710).

12. The coating equipment according to claim 10, characterized in that, The first tube (710) extends along the height direction of the coating equipment, and the number of exhaust holes (711) is at least two. Each exhaust hole (711) is spaced apart in the extension direction of the first tube (710), and the diameter of each exhaust hole (711) gradually increases in the direction away from the second tube (720).

13. The coating equipment according to claim 1, characterized in that, The coating equipment further includes at least two heating elements (810), each of the heating elements (810) being spaced apart within the process chamber (100); and / or, The coating equipment also includes at least two cooling elements (820), each of which is spaced apart on the outer wall of the process chamber (100).

14. The coating equipment according to claim 1, characterized in that, The coating equipment also includes a drive mechanism (830), which includes a drive source (831), a drive shaft (832), and a rotating component (833) connected in sequence. The rotating component (833) is rotatably disposed in the process chamber (100). The number of the bearing devices (200) is at least two. The rotating component (833) is connected to each of the bearing devices (200) to drive each of the bearing devices (200) to rotate around the axis of the process chamber (100).

15. The coating equipment according to claim 1, characterized in that, The support device (200) can rotate about the axis of the process chamber (100) to approach the first spray member (310) or the second spray member (320). When the support device (200) is facing the first spray member (310) or the second spray member (320), the support device (200) stops moving relative to the process chamber (100).

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