A circuit board plating correction device and operating system

Abstract

This invention relates to the field of circuit board electroplating technology, and discloses a circuit board electroplating correction device and operating system, including: an electroplating tank and an electric drive rail; a correction conveying mechanism, the correction conveying mechanism being disposed on the electric drive rail, the correction conveying mechanism including: an electric drive base, a reciprocating motor fixedly connected to the electric drive base, and a drive ring fixedly connected to the output shaft of the reciprocating motor. This circuit board electroplating correction device and operating system, utilizing the correction conveying mechanism, in conjunction with the continuous magnetic attraction constraint between the first and second magnetic blocks, and the linear guiding movement of the movable block within the hollow frame, automatically centers and eliminates the reciprocating swaying of the circuit board workpiece due to inertia during horizontal conveying, allowing the workpiece to enter the electroplating tank in a stable posture along the vertical axis, avoiding collisions with the tank wall or electroplating position deviations, and ensuring the positional accuracy of the circuit board electroplating layer.

Description

Technical Field

[0001] This invention relates to the field of circuit board electroplating technology, specifically to a circuit board electroplating correction device and operating system. Background Technology

[0002] When circuit boards undergo electroplating, a circuit board electroplating correction device and operating system are typically used to fix the circuit board to be processed using grippers. The board is then transported horizontally to the top of the electroplating tank by a conveyor component. Subsequently, the circuit board is immersed in the electroplating solution for electroplating coating by a vertical unloading action.

[0003] In similar existing equipment, when the clamped and fixed circuit board moves horizontally with the mechanism, it will oscillate and shake back and forth in the horizontal axis due to the inertia caused by starting and stopping. When the drive component pushes the circuit board, which is still in an oscillating state, downward into the electroplating tank, due to the lack of timely attitude correction and centering constraint, the circuit board often cuts into the electroplating solution at an skewed position. This can easily cause the circuit board to collide hard with the inner wall of the electroplating tank, resulting in workpiece damage. At the same time, it can also compromise the positional accuracy of the electroplating layer due to uneven electroplating spacing. Summary of the Invention

[0004] Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a circuit board electroplating correction device and operating system, which solves the problem that the swaying and shaking of circuit boards caused by inertia after horizontal transport cannot be automatically reset and corrected, resulting in tilting when the circuit boards enter the electroplating bath and affecting the positional accuracy of the electroplating layer.

[0005] Technical solution To achieve the above objectives, the present invention provides the following technical solution: A circuit board electroplating correction device and operating system include: an electroplating tank and an electric drive rail; a correction conveying mechanism, which is mounted on the electric drive rail and includes: an electric drive base, on which a reciprocating motor is fixedly connected, a drive ring is fixedly connected to the output shaft of the reciprocating motor, a drive shaft is rotatably connected to the inner wall of the drive ring, a drive block is fixedly connected to the side wall of the drive shaft, a mounting groove is provided at the bottom of the drive shaft, and a first magnetic block is fixedly connected in the mounting groove at the bottom of the drive shaft; a hollow frame, which is fixedly connected to the top of the electric drive base, a movable block is slidably connected to the inner wall of the hollow frame, a return spring is connected between the movable block and the inner wall of the hollow frame, a roller is rotatably connected to the top of the movable block, and a second magnetic block is fixedly connected to the top of the movable block; an air blowing mechanism, which is mounted on the correction conveying mechanism and is used to blow air onto the workpiece; and a rotary air jet mechanism, which is mounted at the output end of the air blowing mechanism and is used to rotate and blow air.

[0006] Preferably, the drive shaft penetrates the inner wall of the drive ring, and both ends of the drive ring abut against the drive shaft.

[0007] Preferably, there are two symmetrically arranged electric drive rails, and each of the two electric drive rails is connected to a set of electric drive bases, reciprocating motors, drive rings, drive shafts, and hollow frames.

[0008] Preferably, the bottom of the drive shaft is provided with a plurality of grippers, and a plurality of gripper arrays are provided at the bottom of the drive shaft.

[0009] Preferably, the top of the movable block has an arc-shaped concave surface, and two rollers are provided, which are symmetrically arranged on the arc-shaped concave surface.

[0010] Preferably, the air-blowing mechanism includes an upper support plate, which is fixedly connected to the top of two hollow frames. A lower support plate is fixedly connected to the top of the drive block. A corrugated airbag is connected between the lower support plate and the upper support plate. A one-way valve is fixedly connected to the top of the corrugated airbag. The bottom of the corrugated airbag is connected to a rotary jet mechanism.

[0011] Preferably, the rotary jet mechanism includes a delivery pipe, one end of which is fixed to the bottom of the corrugated airbag, and the other end of which is rotatably connected to a movable head block. The bottom of the movable head block is connected to an angled jet nozzle, and the jet direction of the angled jet nozzle forms a fixed tilt angle with the movable head block.

[0012] Preferably, four angled jet nozzles are provided, and the array of four angled jet nozzles is arranged at the bottom of the movable head block.

[0013] Preferably, a rolling bearing is fixedly embedded in the inner wall of the drive ring, and the outer wall of the drive shaft is fixedly connected to the inner ring of the rolling bearing.

[0014] An operating system for a circuit board electroplating correction device further includes the following operating steps: Step 1, Horizontal Conveying and Preparation: Fix the circuit board workpiece on several of the grippers, and control the two sets of electric drive bases on the two symmetrically arranged electric drive guides to move horizontally. The electric drive bases carry the entire correction and conveying mechanism to move along the electric drive guides to directly above the electroplating tank. During this horizontal movement, the circuit board workpiece located at the bottom of several grippers will oscillate back and forth due to inertia as the overall mechanism moves horizontally. Step 2, Vertical Drop and Magnetic Alignment: The reciprocating motor fixed to the electric drive base is activated. The output shaft of the reciprocating motor drives the drive ring fixedly connected to it to move downwards, simultaneously moving the drive shaft, the drive block, and several grippers below downwards. During this process, the bottom of the drive shaft begins to abut against and press against the two rollers rotatably connected to the top of the movable block, causing the movable block to move downwards along the inner wall of the hollow frame, and simultaneously compressing the return spring between the movable block and the inner wall of the hollow frame. Simultaneously, the first magnetic block fixed in the mounting groove at the bottom of the drive shaft and the second magnetic block fixed at the top of the movable block generate magnetic attraction due to the reduced distance. This magnetic attraction applies a central reset pull to the swinging drive shaft, thereby straightening the swaying drive shaft and the circuit board workpiece at the bottom under magnetic constraint, making its axis tend to be vertical. The circuit board workpiece enters the electroplating tank in a stable, vertically aligned posture for electroplating. Step 3, passive air intake during descent: During the vertical correction and descent process in Step 2, as the drive block moves downward, the relative distance between the lower support plate fixedly connected to its top and the stationary upper support plate increases, directly driving the corrugated airbag to produce tensile deformation. At this time, the one-way valve at the top of the corrugated airbag opens and draws air from the outside into the internal cavity of the corrugated airbag, completing the air intake. Step 4, Vertical Lifting and High-Pressure Exhaust: When the electroplating operation is completed and the circuit board workpiece needs to be removed, the reciprocating motor is controlled to rotate in reverse, driving the drive ring and several grippers below to move upward synchronously. During this upward movement, as the drive block moves upward, the relative distance between the lower support plate fixedly connected to its top and the stationary upper support plate decreases, directly driving the corrugated airbag to produce compression deformation. At this time, the one-way valve at the top of the corrugated airbag closes, and the gas inside the corrugated airbag is compressed to form high-pressure gas, which is then directionally discharged from its bottom and injected into one end of the delivery pipe of the rotary jet mechanism. Step 5: Self-driven rotary purging and liquid removal: High-pressure gas enters the inner cavity of the movable head block, which is rotatably connected to the other end of the conveying pipe, and is diverted to the four oblique jet nozzles arranged in a circumferential array at the bottom of the movable head block and sprayed outward at a fixed angle; when the high-pressure gas is ejected, it generates a recoil force opposite to the jet direction. The four recoil forces generate component forces in the tangential direction of the rotation plane at the bottom of the movable head block and are superimposed in the same direction to form a driving torque, which pushes the movable head block to rotate relative to the conveying pipe against friction, thereby driving the four oblique jet nozzles to perform circumferential rotary jetting operations synchronously, forming a cross-rotating air curtain in space, and performing droplet purging operations on the surface of the circuit board workpiece that moves upward out of the electroplating tank; Step Six: Reverse Horizontal Transport: After the droplet blowing operation is completed, control the two sets of electric drive bases to move horizontally in opposite directions along the two electric drive rails to transport the circuit board workpiece that has been electroplated and blown out by the airflow, thus completing the entire operating system operation process.

[0015] Beneficial effects Compared with the prior art, the present invention provides a circuit board electroplating correction device and operating system, which has the following beneficial effects: 1. The circuit board electroplating correction device and operating system utilize a correction conveying mechanism, combined with the continuous magnetic attraction constraint between the first and second magnetic blocks, and the linear guiding movement of the movable block within the hollow frame, to automatically center and eliminate the reciprocating swaying of the circuit board workpiece due to inertia during horizontal conveying. This allows the workpiece to enter the electroplating tank in a stable posture along the vertical axis, avoiding collisions with the tank wall or electroplating position shifts, and ensuring the positional accuracy of the circuit board electroplating layer.

[0016] 2. The circuit board electroplating correction device and operating system utilizes an air blowing mechanism. When the lower support plate and the stationary upper support plate undergo axial relative displacement, the corrugated airbag is driven to alternately generate tensile and compressive deformations. The airflow is directionally controlled by a one-way valve, thereby achieving passive air intake and exhaust without the need for external active control components, providing a high-pressure gas source for subsequent liquid removal operations.

[0017] 3. This circuit board electroplating correction device and operating system utilizes a rotary jet mechanism. High-pressure gas is introduced into the rotatably connected movable head block through a delivery pipe. The jet recoil force generated by the airflow ejected from the four oblique jet nozzles in a circumferential array is superimposed to form a driving torque, which pushes the movable head block to rotate against friction. This creates a high-density cross-rotating air curtain in space, eliminating the jet blind zone of a single oblique jet nozzle and increasing the sweeping frequency and airflow coverage area of ​​the airflow on the surface of the circuit board moving upward out of the electroplating tank. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the air blowing mechanism of the present invention; Figure 3 This is a schematic diagram of the structure of the first magnetic block of the present invention; Figure 4 This is a schematic diagram of the hollow frame structure of the present invention; Figure 5 For the present invention Figure 4 Enlarged structural diagram at point A; Figure 6 This is a schematic diagram of the conveying pipe of the present invention; Figure 7 This is a schematic diagram of the rotary jet mechanism of the present invention.

[0019] In the diagram: 1. Electroplating tank; 2. Electric drive guide rail; 3. Correction and conveying mechanism; 31. Electric drive base; 32. Reciprocating motor; 33. Drive ring; 34. Drive shaft; 35. Drive block; 36. Gripper; 37. Hollow frame; 38. First magnetic block; 39. Return spring; 310. Movable block; 311. Roller; 312. Second magnetic block; 4. Air blowing mechanism; 41. Upper support plate; 42. Corrugated airbag; 43. Lower support plate; 44. One-way valve; 5. Rotary jet mechanism; 51. Conveying pipe; 52. Movable head block; 53. Angled jet nozzle. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please see Figures 1-7A circuit board electroplating correction device and operating system, comprising: an electroplating tank 1 and an electric drive rail 2; a correction conveying mechanism 3, which is mounted on the electric drive rail 2 and includes: an electric drive base 31, on which a reciprocating motor 32 is fixedly connected, the output shaft of the reciprocating motor 32 is fixedly connected to a drive ring 33, a drive shaft 34 is rotatably connected to the inner wall of the drive ring 33, a drive block 35 is fixedly connected to the side wall of the drive shaft 34, a mounting groove is provided at the bottom of the drive shaft 34, and a first magnetic block 38 is fixedly connected in the mounting groove at the bottom of the drive shaft 34; a hollow frame 37, which is fixedly connected to the top of the electric drive base 31, and a movable block 310 is slidably connected to the inner wall of the hollow frame 37. A return spring 39 is connected between the movable block 310 and the inner wall of the hollow frame 37. A roller 311 is rotatably connected to the top of the movable block 310 to abut against the bottom of the drive shaft 34. A second magnetic block 312 is fixedly connected to the top of the movable block 310. First, the entire correction conveying mechanism 3 is carried by the electric drive base 31 and moves horizontally along the electric drive guide rail 2, thereby conveying the entire mechanism to the top of the electroplating tank 1. During this horizontal movement, since the drive shaft 34 is rotatably connected to the drive ring 33 and the drive shaft 34 is fixedly connected to the drive bar 35, and the bottom of the drive bar 35 is fixedly connected to the gripper 36, the circuit board workpiece located at the bottom of the gripper 36 will be moved by the horizontal displacement of the entire mechanism due to inertia. The system then enters a oscillating state. Next, the reciprocating motor 32, fixed to the electric drive base 31, is activated. The output shaft of the reciprocating motor 32 drives the drive ring 33, which is fixedly connected to it, to move downward. The drive ring 33, in turn, drives the drive shaft 34, which is rotatably connected to its inner wall, the drive block 35, which is fixed to the side wall of the drive shaft 34, and the gripper 36 below to move downward simultaneously. During the downward movement, the bottom of the drive shaft 34 begins to abut against and press against the roller 311, which is rotatably connected to the top of the movable block 310. Since the movable block 310 is slidably connected to the inner wall of the hollow frame 37 fixed to the top of the electric drive base 31, the roller 311 directly transmits the downward thrust received to the movable block 310, causing the movable block 310 to move along the inner wall of the hollow frame 37. The drive shaft moves downward and simultaneously compresses the return spring 39 located between the movable block 310 and the inner wall of the hollow frame 37. At the same time, the first magnetic block 38 fixed in the mounting groove at the bottom of the drive shaft 34 and the second magnetic block 312 fixed at the top of the movable block 310 approach each other and generate continuous magnetic attraction. At this time, the reciprocating swing motion generated by the drive shaft 34 and the drive bar 35 will be constrained by the dynamic magnetic attraction. As the downward movement goes deeper, the gap between the two magnetic blocks decreases, and the magnetic attraction gradually applies a central reset pull to the swinging drive shaft 34, so that the drive shaft 34, the drive bar 35 and the circuit board workpiece at the bottom of the gripper 36, which were originally swaying due to inertia, are gradually straightened under the magnetic constraint, and their axes tend to be vertical.Finally, under the damping action of the return spring 39 and the combined attraction of the two sets of magnetic blocks, the circuit board workpiece eliminates wobbling and enters the electroplating tank 1 in a stable, vertically corrected posture for electroplating. By utilizing the magnetic alignment constraint between the first magnetic block 38 and the second magnetic block 312, and coordinating the linear guiding movement of the movable block 310 within the hollow frame 37, the wobbling and swaying of the circuit board workpiece caused by inertia during horizontal transport are automatically eliminated. This ensures that the workpiece maintains a precise vertical alignment when falling vertically into the electroplating tank 1, preventing it from impacting the tank wall or shifting its electroplating position due to swaying, thus guaranteeing the accuracy of the circuit board electroplating layer's position and the uniformity of its thickness. An air-blowing mechanism 4, mounted on the correction and conveying mechanism 3, is used to blow air onto the workpiece. A rotary air-blowing mechanism 5, located at the output end of the air-blowing mechanism 4, is used for rotary air blowing. A rolling bearing is fixedly embedded in the inner wall of the drive ring 33, and the outer wall of the drive shaft 34 is fixedly connected to the inner ring of the rolling bearing.

[0022] The drive shaft 34 penetrates the inner wall of the drive ring 33, and both ends of the drive ring 33 abut against the drive shaft 34, restricting the degree of freedom of the drive shaft 34 to move axially or slip off relative to the drive ring 33. During reciprocating correction motion, this ensures that the thrust or oscillating force transmitted by the reciprocating motor 32 is accurately transmitted along a predetermined trajectory, improving the axial positioning accuracy and structural stability of the mechanical transmission. Two electric drive rails 2 are symmetrically arranged, each connected to a set of electric drive bases 31, reciprocating motors 32, drive rings 33, drive shafts 34, and hollow frames 37, forming a double-sided symmetrical distributed drive configuration. For circuit boards, this provides balanced overall support and synchronous driving force, eliminating structural tilting, off-center loading, or rail jamming caused by unilateral drive, meeting the stable transport requirements of large-size circuit boards. Several grippers 36 are arranged at the bottom of the drive shaft 34, and this array of grippers 36 achieves multi-point balanced clamping through an arrayed layout. This structure increases the contact area with the circuit board, evenly distributing the clamping force to multiple points on the circuit board. This prevents the circuit board from being locally bent, warped, or detached due to liquid resistance or its own weight in the electroplating bath 1, ensuring the rigid positioning of the circuit board during the alignment process. The top of the movable block 310 has an arc-shaped concave surface, and two rollers 311 are symmetrically arranged on this surface. The arc-shaped concave surface provides a concentrically converging rolling guide surface for the bottom of the drive shaft 34. When the drive shaft 34 wobbles at an angle and contacts downwards, the two rollers 311 move along the arc surface. Combined with the magnetic force of the first magnetic block 38 and the second magnetic block 312, the impact force during wobbling can be more smoothly converted into linear motion of the movable block 310 in the vertical direction, thus assisting in alignment and correction.

[0023] The air-blowing mechanism 4 includes an upper support plate 41, which is fixedly connected to the top of two hollow frames 37. A lower support plate 43 is fixedly connected to the top of the drive block 35. A corrugated airbag 42 is connected between the lower support plate 43 and the upper support plate 41. A one-way valve 44 is fixedly connected to the top of the corrugated airbag 42. The bottom of the corrugated airbag 42 is connected to the rotary jet mechanism 5. Since the two ends of the corrugated airbag 42 are respectively connected between the stationary upper support plate 41 and the moving lower support plate 43, the relative distance between the two plates changes alternately, directly driving the corrugated airbag 42 to produce compression and stretching deformation. The one-way valve 44 at the top of the corrugated airbag 42 controls the directional flow: when the corrugated airbag 42 is stretched and its internal volume increases, the one-way valve 44 opens and draws in air from the outside; when the corrugated airbag 42 is compressed and its internal volume decreases, the one-way valve 44 closes, and the high-pressure gas inside the corrugated airbag 42 is squeezed and can only be discharged directionally from the bottom and injected into the rotary jet mechanism 5.

[0024] The rotary jet mechanism 5 includes a delivery pipe 51, one end of which is fixed to the bottom of the corrugated airbag 42. The other end of the delivery pipe 51 is rotatably connected to a movable head block 52. The bottom of the movable head block 52 is connected to an angled jet nozzle 53. The jet direction of the angled jet nozzle 53 is set at a fixed angle of 45° with respect to the movable head block 52. High-pressure gas is expelled by the corrugated airbag 42 and enters one end of the delivery pipe 51, which is fixed to the bottom of the corrugated airbag 42, and moves along the internal channel of the delivery pipe 51 to the other end. Then, the high-pressure gas enters the inner cavity of the movable head block 52, which is rotatably connected to the other end of the delivery pipe 51. Finally, the airflow converges and is directionally discharged from the angled jet nozzle 53 connected to the bottom of the movable head block 52. The axis of the moving head block 52 is set at a fixed tilt angle of 45°, which causes a recoil force opposite to the jet direction when the high-pressure gas is ejected from the angled jet nozzle 53. This recoil force generates a component force in the tangential direction of the rotation plane of the moving head block 52. This component force forms a driving torque and pushes the moving head block 52 to rotate relative to the delivery pipe 51 against friction. This, in turn, drives the angled jet nozzle 53 to perform circumferential dynamic jetting operation during the rotation around the axis. The jet component achieves self-driven rotation by utilizing the jet recoil principle in fluid mechanics. The ejected high-pressure airflow forms a dynamic rotating air curtain in space, which expands the sweeping and action area of ​​the airflow. When the circuit board leaves the pool, it can achieve all-round droplet removal and improve the uniformity of the electroplating coating of the circuit board.

[0025] Four oblique jet nozzles 53 are arranged in an array at the bottom of the movable head block 52. The jet recoil principle of multi-point symmetrical jetting is used to achieve the same-direction superposition of torque, which increases the rotational torque driving the movable head block 52 to rotate and improves the dynamic balance of rotation. At the same time, the multi-point symmetrical force eliminates the radial off-center load force generated by the asymmetrical lateral thrust of a single oblique jet nozzle 53 and acting on the rotating connection, reducing mechanical wear and extending the service life of the rotating bearing structure. In addition, the synchronous rotation of the four oblique jet nozzles 53 forms a high-density cross-rotating air curtain in space, eliminating the jet blind zone and time interval when a single oblique jet nozzle 53 rotates, and increasing the sweeping frequency and airflow coverage area of ​​the high-pressure airflow on the circuit board surface.

[0026] An operating system for a circuit board electroplating correction device further includes the following operating steps: Step 1, Horizontal Conveying and Preparation: Fix the circuit board workpiece on several grippers 36, and control the two sets of electric drive bases 31 on the two symmetrically arranged electric drive guide rails 2 to move horizontally. The electric drive bases 31 carry the entire correction and conveying mechanism 3 to move along the electric drive guide rails 2 to directly above the electroplating tank 1. During this horizontal movement, the circuit board workpiece located at the bottom of several grippers 36 will oscillate back and forth due to inertia as the overall mechanism moves horizontally.

[0027] Step 2, Vertical Drop and Magnetic Alignment: The reciprocating motor 32, fixed to the electric drive base 31, is activated. The output shaft of the reciprocating motor 32 drives the drive ring 33, which is fixedly connected to it, to move downwards. Simultaneously, this drives the drive shaft 34, drive block 35, and several grippers 36 below to move downwards. During this process, the bottom of the drive shaft 34 begins to abut against and press against the two rollers 311 rotatably connected to the top of the movable block 310, causing the movable block 310 to move downwards along the inner wall of the hollow frame 37, and simultaneously compressing the rollers set on the movable block 310. The return spring 39 is between block 310 and the inner wall of the hollow frame 37; at the same time, the first magnetic block 38 fixed in the mounting groove at the bottom of the drive shaft 34 and the second magnetic block 312 fixed on the top of the movable block 310 generate magnetic attraction due to the reduced distance. The magnetic attraction applies a central reset pull to the swinging drive shaft 34, thereby straightening the swaying drive shaft 34 and the circuit board workpiece at the bottom under the magnetic restriction, so that its axis tends to be vertical. The circuit board workpiece enters the electroplating tank 1 in a stable posture after vertical correction for electroplating operation.

[0028] Step 3, passive air intake during descent: During the vertical correction and descent process in Step 2, as the drive block 35 moves downward, the relative distance between the lower support plate 43 fixedly connected to its top and the stationary upper support plate 41 increases, directly driving the corrugated airbag 42 to produce tensile deformation. At this time, the one-way valve 44 at the top of the corrugated airbag 42 opens and draws air from the outside into the internal cavity of the corrugated airbag 42, completing the air intake.

[0029] Step 4, Vertical Ascent and High-Pressure Exhaust: When the electroplating operation is completed and the circuit board workpiece needs to be removed, the reciprocating motor 32 is controlled to rotate in reverse, driving the drive ring 33 and several grippers 36 below to move upward synchronously. During this upward movement, as the drive block 35 moves upward, the relative distance between the lower support plate 43 fixedly connected to its top and the stationary upper support plate 41 decreases, directly driving the corrugated airbag 42 to produce compression deformation. At this time, the one-way valve 44 at the top of the corrugated airbag 42 closes, and the gas inside the corrugated airbag 42 is compressed to form high-pressure gas and is discharged directionally from its bottom and injected into one end of the delivery pipe 51 of the rotary jet mechanism 5.

[0030] Step 5: Self-driven rotary purging and liquid removal: High-pressure gas enters the inner cavity of the movable head block 52, which is rotatably connected to the other end of the conveying pipe 51, and is diverted to four oblique jet nozzles 53 arranged in a circumferential array at the bottom of the movable head block 52 and sprayed outward at a fixed angle; when the high-pressure gas is ejected, it generates a recoil force opposite to the jet direction. The four recoil forces generate component forces in the tangential direction of the rotation plane at the bottom of the movable head block 52 and are superimposed in the same direction to form a driving torque, which pushes the movable head block 52 to rotate relative to the conveying pipe 51 against friction, thereby driving the four oblique jet nozzles 53 to perform circumferential rotary jetting operations synchronously, forming a cross-rotating air curtain in space, and performing droplet purging operations on the surface of the circuit board workpiece that moves upward out of the electroplating tank 1.

[0031] Step Six: Reverse Horizontal Transport: After the droplet blowing operation is completed, control the two sets of electric drive bases 31 to move horizontally in the opposite direction along the two electric drive rails 2 to transport the circuit board workpiece that has been electroplated and blown out by the airflow, thus completing the entire operating system operation process.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A circuit board electroplating correction device, characterized in that, include: Electroplating tank (1) and electric drive rail (2); A calibration conveying mechanism (3) is mounted on an electric drive guide rail (2), and the calibration conveying mechanism (3) includes: An electric drive base (31) is provided, on which a reciprocating motor (32) is fixedly connected. The output shaft of the reciprocating motor (32) is fixedly connected to a drive ring (33). A drive shaft (34) is rotatably connected to the inner wall of the drive ring (33). A drive bar (35) is fixedly connected to the side wall of the drive shaft (34). An installation groove is provided at the bottom of the drive shaft (34). A first magnetic block (38) is fixedly connected in the bottom installation groove of the drive shaft (34). A hollow frame (37) is fixedly connected to the top of the electric drive base (31). A movable block (310) is slidably connected to the inner wall of the hollow frame (37). A return spring (39) is connected between the movable block (310) and the inner wall of the hollow frame (37). A roller (311) is rotatably connected to the top of the movable block (310). A second magnetic block (312) is fixedly connected to the top of the movable block (310). An air blowing mechanism (4) is provided on the correction conveying mechanism (3) and is used to blow the workpiece. A rotary jet mechanism (5) is provided at the output end of the blowing mechanism (4) and is used for rotating and blowing air.

2. The circuit board electroplating correction device according to claim 1, characterized in that, The drive shaft (34) penetrates the inner wall of the drive ring (33), and both ends of the drive ring (33) abut against the drive shaft (34).

3. The circuit board electroplating correction device according to claim 1, characterized in that, Two electric drive rails (2) are symmetrically arranged. Each of the two electric drive rails (2) is connected to an electric drive base (31), a reciprocating motor (32), a drive ring (33), a drive shaft (34), and a hollow frame (37).

4. The circuit board electroplating correction device according to claim 1, characterized in that, The bottom of the drive shaft (34) is provided with a plurality of grippers (36), and the plurality of grippers (36) are arranged in an array at the bottom of the drive shaft (34).

5. The circuit board electroplating correction device according to claim 1, characterized in that, The top of the movable block (310) is provided with an arc-shaped concave surface, and two rollers (311) are provided, which are symmetrically arranged on the arc-shaped concave surface.

6. The circuit board electroplating correction device according to claim 3, characterized in that, The air-blowing mechanism (4) includes an upper support plate (41), which is fixedly connected to the top of two hollow frames (37). The top of the drive block (35) is fixedly connected to a lower support plate (43). A corrugated airbag (42) is connected between the lower support plate (43) and the upper support plate (41). A one-way valve (44) is fixedly connected to the top of the corrugated airbag (42). The bottom of the corrugated airbag (42) is connected to the rotary jet mechanism (5).

7. The circuit board electroplating correction device according to claim 6, characterized in that, The rotary jet mechanism (5) includes a delivery pipe (51), one end of which is fixed to the bottom of the corrugated airbag (42), and the other end of which is rotatably connected to a movable head block (52). The bottom of the movable head block (52) is connected to an oblique jet nozzle (53), and the jet direction of the oblique jet nozzle (53) is set at a fixed angle to the movable head block (52).

8. The circuit board electroplating correction device according to claim 7, characterized in that, Four oblique jet nozzles (53) are provided, and the four oblique jet nozzles (53) are arranged in an array at the bottom of the movable head block (52).

9. The circuit board electroplating correction device according to claim 1, characterized in that, The inner wall of the drive ring (33) is fixedly embedded with a rolling bearing, and the outer wall of the drive shaft (34) is fixedly connected to the inner ring of the rolling bearing.

10. An operating system for a circuit board electroplating correction device, characterized in that, The circuit board electroplating correction device according to any one of claims 1-9 further includes the following operating steps: Step 1, Horizontal Conveying and Preparation: Fix the circuit board workpiece on several of the grippers (36), and control the two sets of electric drive bases (31) on the two symmetrically arranged electric drive guide rails (2) to move horizontally. The electric drive bases (31) carry the entire correction conveying mechanism (3) to move along the electric drive guide rails (2) to the top of the electroplating tank (1). During this horizontal movement, the circuit board workpiece located at the bottom of several grippers (36) will swing back and forth due to inertia as the overall mechanism moves horizontally. Step 2, Vertical Drop and Magnetic Alignment: The reciprocating motor (32) fixed to the electric drive base (31) is activated. The output shaft of the reciprocating motor (32) drives the drive ring (33) fixedly connected to it to move downwards, simultaneously driving the drive shaft (34), the drive block (35), and several grippers (36) below to move downwards. During this process, the bottom of the drive shaft (34) begins to abut against and press against the two rollers (311) rotatably connected to the top of the movable block (310), causing the movable block (310) to move downwards along the inner wall of the hollow frame (37), and simultaneously compressing the set. The return spring (39) between the movable block (310) and the inner wall of the hollow frame (37); at the same time, the first magnetic block (38) fixed in the mounting groove at the bottom of the drive shaft (34) and the second magnetic block (312) fixed at the top of the movable block (310) generate magnetic attraction due to the reduced distance. The magnetic attraction applies a central reset pull force to the swinging drive shaft (34), thereby straightening the swaying drive shaft (34) and the circuit board workpiece at the bottom under the magnetic constraint, so that its axis tends to be vertical. The circuit board workpiece enters the electroplating tank (1) in a stable posture after vertical correction for electroplating operation. Step 3, passive air intake during descent: During the vertical correction and descent process in Step 2, as the drive block (35) moves downward, the relative distance between the lower support plate (43) fixedly connected to its top and the stationary upper support plate (41) increases, directly driving the corrugated airbag (42) to produce tensile deformation. At this time, the one-way valve (44) at the top of the corrugated airbag (42) opens and draws air from the outside into the internal cavity of the corrugated airbag (42), completing the air intake. Step 4, Vertical Ascent and High-Pressure Exhaust: When the electroplating operation is completed and the circuit board workpiece needs to be removed, the reciprocating motor (32) is controlled to rotate in reverse, driving the drive ring (33) and several grippers (36) below to move upward synchronously; during this upward movement, as the drive block (35) moves upward, the relative distance between the lower support plate (43) fixedly connected to its top and the stationary upper support plate (41) decreases, directly driving the corrugated airbag (42) to produce compression deformation. At this time, the one-way valve (44) at the top of the corrugated airbag (42) closes, and the gas inside the corrugated airbag (42) is squeezed to form high-pressure gas and is discharged directionally from its bottom and injected into one end of the delivery pipe (51) of the rotary jet mechanism (5); Step 5, Self-driven Rotary Blowing and Liquid Removal: High-pressure gas enters the inner cavity of the movable head block (52) rotatably connected to the other end of the conveying pipe (51) and is diverted to the four inclined jet nozzles (53) arranged in a circumferential array at the bottom of the movable head block (52) and sprayed outward at a fixed angle; when the high-pressure gas is ejected, it generates a recoil force opposite to the jet direction. The four recoil forces generate component forces in the tangential direction of the rotation plane at the bottom of the movable head block (52) and are superimposed in the same direction to form a driving torque, which pushes the movable head block (52) to rotate relative to the conveying pipe (51) against friction, thereby driving the four inclined jet nozzles (53) to perform circumferential rotation jetting operations synchronously, forming a cross-rotating air curtain in space, and performing droplet blowing operations on the surface of the circuit board workpiece that moves upward out of the electroplating tank (1); Step 6, Reverse Horizontal Transport: After the droplet blowing operation is completed, control the two sets of electric drive bases (31) to move horizontally in the opposite direction along the two electric drive rails (2) to transport the circuit board workpiece that has been electroplated and blown out by the airflow, thus completing the entire operating system operation process.

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