Shuttle race structure and production process

CN122942267APending Publication Date: 2026-10-20HUZHOU GUANJIONG MECHANICAL & ELECTRICAL TECH CO LTD
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Patent Information

Application Number
CN202610609120.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-05-06
Publication Date
2026-10-20

AI Technical Summary

Technical Problem

然而,不同厂家生产的挑线凸轮规格各异,其对张力的控制范围也有所不同

Benefits of technology

[0013]1. 显著降低面线张力,有效减少断线率。

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses a shuttle frame structure and manufacturing process, including a shuttle frame body. The bottom plane of the shuttle frame base is offset inwards towards the inner side of the shuttle frame, and the thickness of the base of the shuttle frame body is less than 1.1 mm. The manufacturing process involves precision grinding of the shuttle frame guide rails, removing the thickness of the bottom plane of the base to achieve a base thickness of less than 1.1 mm. By adopting the above technical solution, the bottom plane of the base is offset inwards towards the inner side of the shuttle frame, directly reducing the base thickness. This reduces the amount of thread winding when the thread passes around the base, effectively reducing the thread tension, fundamentally alleviating the thread breakage problem, and reducing the reliance on a dedicated thread-taking cam.
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Description

Technical Field

[0001] This invention relates to a shuttle frame structure and its manufacturing process. Background Technology

[0002] In the operation of embroidery or sewing machines, the rotary hook, as one of the core components, directly affects the efficiency and quality of sewing. (See also...) Figure 1-6 When the rotary shuttle is working, the shuttle bed hooks the thread and rotates around the shuttle frame, causing the thread to circle on the shuttle frame, thus forming a stitch.

[0003] In existing rotary hook structures, the base of the shuttle frame is typically designed to be quite thick, generally between 1.1 and 1.2 mm. The shuttle frame is precisely positioned and rotates on the shuttle bed via guide rails. Due to the thickness of the shuttle frame base, when the shuttle bed hooks and winds the thread, the top thread needs to pass around this thick base. This process significantly increases the path length of the top thread and the frictional resistance it experiences, resulting in a sharp increase in thread tension. Excessive thread tension is one of the main causes of frequent thread breakage during embroidery or sewing. To accommodate this increased thread tension and reduce thread breakage, existing technologies usually require a take-up cam that matches the specific thread tension. However, take-up cams produced by different manufacturers vary in specifications, and their tension control range also differs. This specific thread tension caused by the thickness of the shuttle frame base is often incompatible with most existing take-up cams on the market, greatly limiting the versatility and adaptability of the rotary hook, and increasing equipment maintenance costs and the difficulty of replacing parts. Summary of the Invention

[0004] In order to solve the above-mentioned technical problems existing in the prior art, the present invention provides a shuttle frame structure and its manufacturing process that can effectively reduce the tension of the surface thread, improve versatility, and reduce the breakage rate.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a shuttle frame structure, including a shuttle frame body, wherein the bottom plane of the shuttle frame base is offset inwards towards the inner side of the shuttle frame, and the thickness of the base of the shuttle frame body is less than 1.1 mm. By adopting the above technical solution, the bottom plane of the base is offset inwards towards the inner side of the shuttle frame, directly reducing the thickness of the base, thereby reducing the amount of thread winding when the top thread passes around the base, effectively reducing the tension of the top thread, fundamentally alleviating the thread breakage problem, and reducing the dependence on the specialization of the thread take-up cam.

[0006] Preferably, the base thickness is 0.3-0.8mm. By adopting the above technical solution, the further optimized thickness range minimizes the tension of the thread while ensuring the structural strength of the shuttle frame, making it easier to control the thread tension and compatible with various standard thread take-up cams on the market.

[0007] Preferably, the base thickness is 0.5mm. By adopting the above technical solution, this specific thickness is an optimal value verified by a large number of experiments. It achieves the best balance between reducing thread tension and maintaining structural rigidity, which can significantly improve sewing efficiency and yield.

[0008] A manufacturing process for a shuttle frame involves removing the thickness of the bottom plane of the base after the shuttle frame guide rails have been precision ground, resulting in a base thickness of less than 1.1 mm. By adopting the above technical solution—performing the thinning process after the guide rails have been precision ground—deformation of the guide rail reference surface caused by the thinning process can be avoided, ensuring that the rotational accuracy of the shuttle frame on the shuttle bed is not affected, while simultaneously reducing surface tension.

[0009] As a preferred option, the specific process includes, in sequence: blank forming - polishing - heat treatment - polishing - precision grinding of guide rails - removal of base bottom surface thickness - polishing - electroplating. By adopting the above technical solution, this process specifically arranges the base thickness removal process after the high-precision guide rail grinding process, and intersperses multiple polishing and final electroplating steps, ensuring the smoothness and corrosion resistance of the thinned base surface, thereby guaranteeing the overall quality and lifespan of the shuttle frame.

[0010] Preferably, the base thickness is 0.3-0.8mm. By adopting the above technical solution, the thinning process is easier to implement within this preferred thickness range, and the finished product has the highest compatibility with standard line-taking cams in terms of performance.

[0011] Preferably, the base thickness is 0.5mm. By adopting the above technical solution, this thickness represents the optimal point for target optimization. This process allows for the stable and precise manufacture of shuttle frames that meet this parameter, ensuring consistent product performance.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. Significantly reduces surface tension, effectively reducing the breakage rate.

[0014] By reducing the thickness of the base of the shuttle frame body from the traditional 1.1-1.2mm to less than 1.1mm (preferably 0.3-0.8mm, more preferably 0.5mm), the winding path length and frictional resistance of the top thread when it passes around the shuttle frame base are significantly reduced, thereby directly reducing the tension of the top thread. This improvement alleviates the problem of frequent thread breakage caused by excessive tension at its structural source, significantly improving the working stability and yield of embroidery machines or sewing machines.

[0015] 2. Improve the versatility of rotary hooks and reduce reliance on dedicated thread take-up cams.

[0016] Because the thread tension is effectively controlled, the shuttle frame can be adapted to more standard thread take-up cams on the market, eliminating the need for dedicated thread take-up cams for specific tensions. This greatly improves the versatility and interchangeability of the rotary hook, reducing spare parts inventory costs, maintenance difficulty, and replacement frequency for equipment manufacturers and users.

[0017] 3. Ensure structural strength and rotational accuracy while reducing thickness.

[0018] A base thickness of 0.3-0.8mm, especially 0.5mm, is preferred. Experimental verification has shown that this achieves the best balance between reducing surface tension and maintaining the structural rigidity of the shuttle frame base, avoiding deformation or insufficient strength caused by excessive thinning. Furthermore, the "removal of the base bottom plane thickness" process is specifically scheduled after the guide rail fine grinding step in the manufacturing process, avoiding the impact of thinning on the guide rail reference surface and ensuring the positioning accuracy and smooth movement of the shuttle frame on the shuttle machine.

[0019] 4. Optimize the process flow to ensure the quality and service life of the finished product.

[0020] The provided process flow (raw material forming → polishing → heat treatment → polishing → fine grinding of guide rails → removal of base bottom plane thickness → polishing → electroplating) specifically places the thinning process after fine grinding, and sets up multiple polishing and final electroplating treatments to ensure the surface smoothness, dimensional accuracy and corrosion resistance of the thinned base, thereby improving the overall quality and long service life of the shuttle frame.

[0021] 5. Reduce energy consumption and improve embroidery and sewing efficiency. The reduction in thread tension correspondingly reduces the load on drive mechanisms (such as the thread take-up cam and spindle motor), which helps to reduce equipment operating energy consumption. At the same time, the reduction in thread breakage rate means shorter downtime for thread changes, thereby improving overall sewing or embroidery production efficiency. Attached Figure Description

[0022] Figure 1 This is a front view of the rotary hook of the present invention.

[0023] Figure 2 yes Figure 1 A sectional view along the AA direction.

[0024] Figure 3 This is a front view of the shuttle frame.

[0025] Figure 4 yes Figure 3 BB-direction sectional view.

[0026] Figure 5 This is a schematic diagram of the wire winding on the shuttle frame.

[0027] Figure 6 It is a three-dimensional diagram of the shuttle frame.

[0028] In the diagram: shuttle body 1, base 2, bottom plane 21, guide rail 3, surface line 4, shuttle bed 5. Detailed Implementation

[0029] To make the technical problems to be solved, the technical solutions, and the beneficial technical effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and several exemplary embodiments. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the scope of protection of the present invention. It should be understood that in this document, the expressions "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance, nor should they be construed as implicitly specifying the number of indicated technical features. Features defined with "first" or "second" may explicitly or implicitly indicate the inclusion of at least one of those features.

[0030] like Figure 1-6 The shuttle frame structure shown includes a shuttle frame body 1, a base 2 whose bottom plane 21 is offset inward, and the thickness of the base 2 of the shuttle frame body 1 is less than 1.1 mm. The inner side is the side where the bobbin is installed. Figure 4 In the figure, d1 represents the existing reference thickness, i.e. Figure 2 , 4 The bottom plane 21 of the 5th frame is offset to the left, so that the thickness d is less than 1.1 mm of d1. In this structure, by directly reducing the thickness of the base 2, the path of the thread 4 hooked by the shuttle bed around the base 2 is significantly shortened during operation, and the amount of thread 4 is significantly reduced, thereby reducing the friction and tension on the thread 4. At the same time, with the thread tension reduced, the adjustment range and accuracy requirements of the take-up cam are also reduced, allowing the shuttle frame to be compatible with more specifications of take-up cams, greatly enhancing its versatility. For example, in some embodiments, the traditional shuttle frame base thickness is 1.2 mm; reducing it to 1.0 mm or less results in a significant reduction in tension.

[0031] Preferably, the thickness of the base 2 is 0.3-0.8 mm. In this structure, by limiting the thickness of the base 2 to this finer range of 0.3-0.8 mm, the winding distance of the thread is further reduced, achieving more effective control over the thread tension. This thickness range results in minimal resistance to the thread during movement, a smooth tension curve, and easy compatibility with most mainstream thread-taking cams on the market. Simultaneously, this thickness range also ensures the structural strength of the base, guaranteeing that it will not deform or break under high-speed rotation. For example, in some embodiments using a base thickness of 0.6 mm, experiments have shown that the thread breakage rate is reduced by more than 70% compared to the traditional 1.2 mm thickness.

[0032] Preferably, the thickness of the base 2 is 0.5mm. In this structure, 0.5mm is an optimal value determined through precise calculation and experimentation. At this thickness, the amount of thread 4 wound is reduced by 1mm, resulting in an extremely low and stable thread tension, virtually eliminating the risk of thread breakage caused by winding friction. Simultaneously, this precise thickness control allows the tension control of the take-up lever to almost entirely focus on stitch formation without needing to compensate for the additional tension generated by the thick base, achieving seamless compatibility with most take-up cams.

[0033] A shuttle frame manufacturing process involves removing the thickness of the bottom plane of the base 2 after the shuttle frame guide rail 3 is precision ground, resulting in a base 2 thickness of less than 1.1 mm. In this structure, the step of "removing the base thickness" is placed after "precision grinding of the guide rail," which is not a simple sequential adjustment but a creative process design. Because the guide rail 3 is the reference surface for the shuttle frame's rotation, its accuracy determines the stability of the entire shuttle. If the base is thinned first and then the guide rail is precision ground, the stress release and deformation generated during the thinning process will directly affect the precision grinding accuracy of the guide rail. However, by precision grinding the guide rail 3 first, the absolute accuracy of the reference surface is ensured. Subsequent thinning of the base 2, even if slight deformation occurs, will not damage the already precision-ground guide rail 3, thus simultaneously ensuring the dual goals of rotational accuracy and reducing tension. The base thickness can be removed through grinding and / or milling processes, or other existing technologies capable of removing material.

[0034] As a preferred option, the specific process includes, in sequence: blank forming - polishing - heat treatment - polishing - precision grinding of guide rails - removal of base bottom plane thickness - polishing - electroplating. In this structure, each process works synergistically to form an optimized manufacturing process. Blank forming and heat treatment ensure the basic shape and hardness of the shuttle frame; after precision grinding of the guide rails, precision machining (such as milling, grinding, or laser processing) is used to remove the thickness of the bottom plane of base 2, which is the core of reducing surface tension; the second polishing after thinning is used to remove processing burrs, obtain a smooth bottom surface, and further reduce friction; the final electroplating treatment provides the shuttle frame with good corrosion resistance and aesthetics. In this process, the removal of base thickness is closely combined with the subsequent polishing and electroplating, ensuring that the edges and surfaces of the thinned base are smooth and burr-free, avoiding the risk of new surface snagging or cutting due to rough thinning processing.

[0035] Preferably, the thickness of the base 2 is 0.3-0.8mm. By adopting the above technical solution, this process can reliably produce shuttle bases within this thickness range, with high processing accuracy and good surface quality, ensuring the uniformity and reliability of product performance.

[0036] Preferably, the thickness of the base 2 is 0.5mm. By adopting the above technical solution, the process parameters (such as feed rate and rotation speed) have been adjusted specifically for this optimized thickness of 0.5mm, enabling stable and high-volume production of products with excellent and consistent performance.

[0037] Referring to the accompanying drawings, the working principle of this invention is as follows: When the rotary shuttle is working, the shuttle bed 5 rotates, hooks the thread, and causes it to rotate around the shuttle frame body 1. Because the thickness of the shuttle frame base 2 in this invention is significantly reduced (e.g., to 0.5 mm), the path distance required for the thread to pass around the base 2 is greatly shortened. According to the principles of physics, when a thread passes over an obstacle of thickness, the path length is positively correlated with the thickness of the obstacle. With a shorter path, the frictional resistance and tensile force (i.e., thread tension) experienced by the thread 4 are also significantly reduced. The lower thread tension makes it less likely for the thread 4 to break due to excessive tension during sewing, thus greatly reducing the breakage rate. More importantly, this reduced and stable thread tension falls precisely within the tension control range of most standard take-up cams on the market, allowing the shuttle frame to be directly replaced without special matching, offering excellent compatibility. Therefore, this invention, by cleverly reducing the thickness of the shuttle frame base from the structural root and employing appropriate manufacturing processes, completely solves the technical problems of high thread tension, easy breakage, and poor compatibility caused by excessive shuttle frame thickness.

[0038] In the description of this invention, it should be understood that the directions or positional relationships indicated by up, down, left, right, inner end, outer end, one end, and the other end are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the purpose of more clearly describing the technical solutions of this invention, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and should not be construed as limiting this invention.

[0039] Although specific embodiments of the invention have been described in detail herein, they are given for illustrative purposes only and should not be construed as limiting the scope of the invention. Various substitutions, alterations, and modifications can be conceived without departing from the spirit and scope of the invention.

Claims

1. A shuttle frame structure, comprising a shuttle frame body, characterized in that: The bottom plane of the shuttle frame base is offset inward to the inner side of the shuttle frame, and the thickness of the base of the shuttle frame body is less than 1.1mm.

2. The shuttle frame structure as described in claim 1, characterized in that: The thickness of the base is 0.3-0.8mm.

3. The shuttle frame structure as described in claim 1, characterized in that: The thickness of the base is 0.5mm.

4. A manufacturing process for a shuttle frame, characterized in that: After the shuttle guide rail is finely ground, the thickness of the bottom plane of the base is removed, so that the thickness of the base is less than 1.1mm.

5. The manufacturing process of the shuttle frame as described in claim 4, characterized in that: The specific process includes the following steps in sequence: blank forming - polishing - heat treatment - polishing - fine grinding of guide rails - removal of the thickness of the bottom plane of the base - polishing - electroplating.

6. The manufacturing process of the shuttle frame as described in claim 4, characterized in that: The thickness of the base is 0.3-0.8mm.

7. The manufacturing process of the shuttle frame as described in claim 4, characterized in that: The thickness of the base is 0.5mm.