System and method for testing dust removal efficiency of semiconductor process off-gas treatment equipment

Abstract

This application discloses a system and method for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment, relating to the broader field of semiconductor manufacturing technology. The system includes a sampling device, a drying device, and a weighing device. A first sampling device is connected to the inlet pipe of the target test equipment, and a second sampling device is connected to the outlet pipe of the target test equipment. The sampling device includes a sampling tube, a filter, a controller, and a drive mechanism. The sampling tube is connected to either the inlet pipe or the outlet pipe; the filter is used to capture dust in the sampling gas; the controller is used to adjust the flow rate of the sampling gas in the sampling tube; one end of the drive mechanism is connected to the other end of the controller; the drying device is used to dry the dust captured in the filter; and the weighing device is used to weigh the dried dust. The sampling device can obtain actual dust mass data, and calculating the dust removal efficiency of the semiconductor process exhaust gas treatment equipment based on the actual dust mass data is more accurate.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more specifically, to a system and method for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment. Background Technology

[0002] In the manufacturing processes of semiconductors (such as integrated circuits, display panels, and photovoltaics), a large amount of process exhaust gas containing fine dust is generated. Correspondingly, this type of process exhaust gas can be treated using equipment such as scrubbing towers or wet electrostatic precipitators. Therefore, accurately assessing the dust removal efficiency of treatment equipment is crucial for validating equipment design, optimizing operating parameters, ensuring emission compliance, and extending equipment lifespan.

[0003] The inventors of this application have discovered that existing technologies evaluate the dust removal efficiency of processing equipment through theoretical calculations or indirect indicators. Therefore, these existing technologies lead to inaccurate performance evaluations of the processing equipment, resulting in longer design and optimization cycles.

[0004] The content in the background section is merely technology known to the public and does not necessarily represent existing technology in this field. Summary of the Invention

[0005] According to one aspect of this application, a system for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment is provided. The system includes sampling devices. A first sampling device is connected to the inlet pipe of a target test equipment, and a second sampling device is connected to the outlet pipe of the target test equipment. Each sampling device includes a sampling tube, a filter, a controller, and a drive mechanism. The sampling tube is connected to either the inlet pipe or the outlet pipe, and sampling gas flows through the sampling tube. One end of the filter is connected to the sampling tube to capture dust in the sampling gas and to allow the first residual gas in the sampling gas to pass through the filter. One end of the controller is connected to the other end of the filter to adjust the flow rate of the sampling gas in the sampling tube so that the flow rate of the sampling gas is equal to the flow rate of the gas in the inlet pipe, or so that the flow rate of the sampling gas is equal to the flow rate of the gas in the outlet pipe. One end of the drive mechanism is connected to the other end of the controller. The system also includes a drying device and a weighing device. The drying device is used to dry the dust captured in the filter; the weighing device is used to weigh the dried dust; wherein, driven by the driving mechanism, the sampling gas in the inlet pipe or outlet pipe enters the filter through the sampling tube, and after the dust in the sampling gas is captured by the filter, the first residual gas passes through the filter and enters the controller.

[0006] According to another aspect of this application, this application also provides a method for testing the dust removal efficiency of a semiconductor process exhaust gas treatment device. The method is performed based on the above-described system and includes: in response to a received sampling command, sampling gas in an inlet pipe or an outlet pipe to obtain sampled gas; in response to a received capture command, filtering the sampled gas in the inlet pipe and the outlet pipe to capture dust in the sampled gas; in response to a received weighing command, drying the captured dust and weighing it to obtain inlet dust g1 and outlet dust g2, respectively; determining the total mass Min of dust entering the target test device per unit time based on inlet dust g1; determining the total mass Mout of dust discharged from the target test device per unit time based on outlet dust g2; and determining the dust treatment efficiency η of the target test device based on Min and Mout.

[0007] According to the technical solution of this application, a sampling tube of a first sampling device is connected to the inlet pipe of the target testing equipment to collect gas from the inlet pipe. A sampling tube of a second sampling device is connected to the outlet pipe of the target testing equipment to collect gas from the outlet pipe. Dust in the gas from the sampling tube is captured by a filter, dried by a drying device, and then weighed. The sampling device in this application can obtain actual dust mass data, thus allowing for a more accurate calculation of the dust removal efficiency of the semiconductor process exhaust gas treatment equipment based on the actual dust mass data. Attached Figure Description

[0008] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0009] Figure 1 This diagram illustrates the structure of a system for testing the dust removal efficiency of a semiconductor process exhaust gas treatment device according to an embodiment of this application. Figure 2 A method 1000 for testing the dust removal efficiency of a semiconductor process exhaust gas treatment device according to an embodiment of this application is shown; Figure 3 A method 2000 for testing the dust removal efficiency of a semiconductor process exhaust gas treatment device according to an embodiment of this application is shown.

[0010] Explanation of reference numerals in the attached figures: 1. Sampling device; 11. First sampling device; 12. Second sampling device; 21. Sampling tube; 22. Filter; 23. Controller; 24. Drive mechanism; 25. Drying device; 26. Weighing device; 27. Dryer; 28. Water-air separator; 29. ​​Recovery pipeline; 3. Target testing equipment; 31. Inlet pipe; 32. Outlet pipe. Detailed Implementation

[0011] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0012] The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of these specific details, or other methods, components, materials, devices, etc. In these cases, well-known structures, methods, devices, implementations, materials, or operations will not be shown or described in detail.

[0013] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0014] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, rather than to describe a specific order.

[0015] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0016] refer to Figure 1 , Figure 1 A schematic diagram of a system for testing the dust removal efficiency of a semiconductor process exhaust gas treatment device, according to an embodiment of this application, is shown.

[0017] According to one aspect of this application, such as Figure 1 As shown, this application provides a system for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment. The system includes a sampling device 1.

[0018] In this embodiment of the application, sampling device 1 specifically refers to a device used to collect atmospheric or industrial process gas samples. There may be two or more sampling devices 1. These two or more sampling devices 1 may be a first sampling device 11 and a second sampling device 12.

[0019] Specifically, the first sampling device 11 is connected to the inlet pipe 31 of the target testing equipment 3 to collect the gas inside the inlet pipe 31. The second sampling device 12 is connected to the outlet pipe 32 of the target testing equipment 3 to collect the gas inside the outlet pipe 32.

[0020] like Figure 1 As shown, each sampling device 1 includes a sampling tube 21, a filter 22, a controller 23, and a drive mechanism 24.

[0021] The sampling tube 21 is used to collect the sampled gas. Specifically, the sampling tube 21 is connected to the inlet pipe 31 or the outlet pipe 32. The sampled gas flows through the sampling tube 21. Exemplarily, in the embodiments of this application, the sampling tube 21 of the first sampling device 11 is connected to the inlet pipe 31 of the target testing device 3 to collect the gas in the inlet pipe 31. The sampling tube 21 of the second sampling device 12 is connected to the outlet pipe 32 of the target testing device 3 to collect the gas in the outlet pipe 32.

[0022] The function of filter 22 is to enrich the target substance. Exemplarily, in an embodiment of this application, filter 22 is used to enrich dust in the sampling gas in sampling tube 21. Specifically, one end of filter 22 is connected to sampling tube 21 to capture dust in the sampling gas and to allow the first residual gas in the sampling gas to pass through filter 22.

[0023] The function of controller 23 is to control the gas flow rate. Specifically, one end of controller 23 is connected to the other end of filter 22 to adjust the flow rate of the sampling gas in sampling tube 21 so that the flow rate of the sampling gas is equal to the flow rate of the gas in inlet pipe 31, or equal to the flow rate of the gas in outlet pipe 32. Controller 23 can be a mass flow controller.

[0024] The function of the drive mechanism 24 is to drive the gas to flow in a specific direction. The specific type of the drive mechanism 24 is not limited in the embodiments of this application, as long as it can drive the airflow in a specific direction. For example, the specific type of the drive mechanism 24 can be a fan, a vacuum pump, etc. In this embodiment, a vacuum pump is used as an example for illustration. Specifically, one end of the drive mechanism 24 is connected to the other end of the controller 23.

[0025] like Figure 1 As shown, the system also includes a drying device 25 and a weighing device 26.

[0026] The drying device 25 is used to dry the dust captured in the filter 22. The specific type of the drying device 25 is not limited in the embodiments of this application, as long as it can evaporate moisture from the object. For example, the specific type of the drying device 25 can be a convection drying chamber, a conduction drying chamber, etc. In the embodiments of this application, a conduction drying chamber is used as an example for illustration.

[0027] Weighing device 26 is used to weigh the dried dust.

[0028] Driven by the drive mechanism 24, the sampling gas in the inlet pipe 31 or outlet pipe 32 enters the filter 22 through the sampling pipe 21, and the dust in the sampling gas is captured by the filter 22. The sampling gas passing through the filter 22 forms the first filtered gas, which then enters the controller 23.

[0029] The inventors of this application have discovered that in the prior art, theoretical calculations or indirect indicators are often relied upon to evaluate the dust removal efficiency of semiconductor process exhaust gas treatment equipment. Because such evaluation methods do not obtain actual data on the mass of captured dust, the evaluated dust removal efficiency of the semiconductor process exhaust gas treatment equipment is inaccurate.

[0030] In the above embodiments, the sampling tube 21 of the first sampling device 11 is connected to the inlet pipe 31 of the target testing equipment 3 to collect the gas inside the inlet pipe 31. The sampling tube 21 of the second sampling device 12 is connected to the outlet pipe 32 of the target testing equipment 3 to collect the gas inside the outlet pipe 32. Dust in the gas inside the sampling tube 21 is captured by the filter 22, dried by the drying device 25, and then weighed. The sampling device 1 in this application can obtain actual dust mass data, and calculations based on the actual dust mass data improve the accuracy of testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment.

[0031] In the embodiments of this application, such as Figure 1As shown, the sampling device 1 also includes a dryer 27. The function of the dryer 27 is to evaporate the moisture in the first filtered gas. Specifically, one end of the dryer 27 is connected to the other end of the filter 22, and the other end of the dryer 27 is connected to one end of the controller 23.

[0032] The inventors of this application have discovered that in the prior art, no dryer is installed upstream of the controller along the gas flow direction. This can cause moisture in the gas to enter the controller, resulting in a large error in the controller's control of the gas flow rate in the sampling tube, or even damage and failure of the controller.

[0033] In the above embodiment, a dryer 27 is provided upstream of the controller 23 along the gas flow direction, which can dry and evaporate the moisture in the first filter gas formed by the sampled gas passing through the filter 22, thereby improving the damage of the controller 23 caused by the moisture in the gas and extending the service life of the controller 23.

[0034] In the embodiments of this application, such as Figure 1 As shown, the sampling device 1 also includes a water-gas separator 28. In this embodiment, the water-gas separator 28 specifically refers to a pretreatment device for separating liquid water from gas. Exemplarily, when gas containing water mist enters the water-gas separator 28, the water and gas are separated by physical means, resulting in the output of dry gas, thereby protecting downstream equipment.

[0035] Specifically, one end of the water-air separator 28 is connected to the other end of the controller 23, and the other end of the water-air separator 28 is connected to one end of the drive mechanism 24.

[0036] During the operation of the sampling device 1, the first filtered gas enters the water-gas separator 28 through the controller 23 for solid-liquid separation to obtain the second filtered gas.

[0037] In the above embodiment, a water-gas separator 28 is provided upstream of the drive mechanism 24 along the gas flow direction to separate water and gas in the first filtered gas, and the water-gas separator 28 outputs relatively dry gas. This design results in less moisture in the gas entering the drive mechanism 24, thus maintaining the stability of the gas extraction by the drive mechanism 24.

[0038] In the embodiments of this application, such as Figure 1 As shown, the sampling device 1 also includes a recovery pipeline 29. Specifically, one end of the recovery pipeline 29 is connected to the other end of the drive mechanism 24. The other end of the recovery pipeline 29 can be connected to the target testing device 3 to form a closed-loop circulation. The other end of the recovery pipeline 29 can also be connected to other recovery devices to avoid directly releasing the gas into the air.

[0039] During the operation of sampling device 1, the second filtered gas is recovered after entering the recovery pipeline 29 through water-gas separator 28.

[0040] The inventors of this application have discovered that in the prior art, the sampling device does not have a recovery pipeline to recover the sampled gas, but instead directly discharges it into the air.

[0041] In the above embodiment, a recovery pipeline 29 is connected downstream of the drive mechanism 24 along the gas flow direction, and the recovery pipeline 29 is connected to the target testing device 3. This scheme creates a closed-loop circulation between the sampling device 1 and the target testing device 3, which can improve the situation where the gas is directly discharged into the air.

[0042] Optionally, in the above embodiment, a recovery pipeline 29 is connected downstream of the drive mechanism 24 along the gas flow direction, and the recovery pipeline 29 is connected to other recovery devices to avoid directly releasing the gas into the air. This scheme enables directional gas recovery between the target testing device 3, the sampling device 1, and the recovery device, which can improve the situation of directly releasing the gas into the air.

[0043] In the embodiments of this application, such as Figure 1 As shown, the filter 22 has filter media inside, and the filter media has a filtration accuracy greater than or equal to 0.1 μm. The material of the filter media is not limited in this embodiment, as long as it can achieve a filtration accuracy of 0.1 μm or higher. For example, the filter media material can be high-efficiency filter cotton, Teflon, etc. In this embodiment, high-efficiency filter cotton is used as an example for illustration.

[0044] The inventors of this application discovered that if the filtration accuracy of the filter material is less than 0.1 μm, some dust will pass through the filter 22 along with the first filtered gas. Therefore, the mass of dust obtained after weighing the filter material is lighter than the actual mass of the dust, leading to inaccurate testing of the dust removal efficiency of the target testing device 3.

[0045] In the above embodiment, the filter 22 is internally equipped with filter media with a filtration accuracy greater than or equal to 0.1 μm, resulting in high filtration accuracy. This allows the filter 22 to capture most of the dust from the sampled gas, making the mass of dust obtained after weighing the filter media closer to the actual mass of the dust, thereby improving the accuracy of the dust removal efficiency test of the target testing device 3.

[0046] refer to Figure 2 , Figure 2 A method 1000 for testing the dust removal efficiency of a semiconductor process exhaust gas treatment device according to an embodiment of this application is shown.

[0047] According to another aspect of this application, such as Figure 2As shown, this application provides a method 1000 for testing the dust removal efficiency of a semiconductor process exhaust gas treatment device. Method 1000 is used in a system as described in any of the embodiments above, and is executed by the system of any of the embodiments above. Method 1000 includes steps S100-S600.

[0048] In step S100, in response to the received sampling command, the gas in the inlet pipe or outlet pipe is sampled to obtain sampled gas.

[0049] According to the example embodiment, such as Figure 1 As shown, after receiving the sampling command, the system connects a sampling tube 21 of the sampling device 1 to the inlet pipe 31 and the outlet pipe 32 of the target test device 3, respectively.

[0050] Specifically, the sampling tube 21 of the first sampling device 11 can be connected to the inlet pipe 31, and the sampling tube 21 of the second sampling device 12 can be connected to the outlet pipe 32. Alternatively, the sampling tube 21 of the second sampling device 12 can be connected to the inlet pipe 31, and the sampling tube 21 of the first sampling device 11 can be connected to the outlet pipe 32. In this embodiment, the example of connecting the sampling tube 21 of the first sampling device 11 to the inlet pipe 31 and the sampling tube 21 of the second sampling device 12 to the outlet pipe 32 will be used for illustration.

[0051] After both the inlet pipe 31 and the outlet pipe 32 are connected to the sampling tube 21, the target testing equipment 3 is started to remove dust. At the same time, the two sampling tubes 21 are started to sample the gas from the inlet pipe 31 and the outlet pipe 32 respectively.

[0052] In step S200, in response to the received capture command, the sampled gas in the inlet pipe and outlet pipe is filtered to capture dust in the sampled gas.

[0053] According to the example embodiment, such as Figure 1 As shown, after receiving the capture command, the filter 22 in the first sampling device 11 filters the sampling gas delivered from the sampling tube 21 of the first sampling device 11. Specifically, the filter 22 captures and retains the dust in the sampling gas on the filter material of the filter 22, and allows the first residual gas in the sampling gas to pass through the filter 22.

[0054] The filter 22 in the second sampling device 12 filters the sampling gas delivered from the sampling tube 21 of the second sampling device 12. Specifically, the filter 22 captures and retains dust in the sampling gas on the filter material of the filter 22, and allows the first residual gas in the sampling gas to pass through the filter 22.

[0055] In step S300, in response to the received weighing command, the captured dust is dried and weighed to obtain inlet dust g1 and outlet dust g2 respectively.

[0056] According to the example embodiment, such as Figure 1 As shown, after receiving the weighing command, the system dries the filter media in the filter 22 of the first sampling device 11, collects the dust on the filter media, and weighs it to obtain the inlet dust g1. After drying the filter media in the filter 22 of the second sampling device 12, the system collects the dust on the filter media and weighs it to obtain the outlet dust g2.

[0057] In step S400, the total mass Min of dust entering the target test equipment per unit time is determined based on the intake dust g1.

[0058] According to the example embodiment, the total mass Min of dust entering the target test device 3 during the period from the start of sampling to the end of sampling is calculated based on the inlet dust g1.

[0059] In step S500, the total mass of dust Mout discharged by the target test device 3 per unit time is determined based on the exhaust dust g2.

[0060] According to the example embodiment, the total mass Mot of dust discharged by the target test device 3 during the period from the start of sampling to the end of sampling is calculated based on the exhaust dust g2.

[0061] In step S600, the dust handling efficiency η of the target test equipment is determined based on Min and Mout.

[0062] According to the example embodiment, the mass of dust processed by the target testing device 3 during the period from the start of sampling to the end of sampling can be calculated based on the difference between the total mass of dust entering the target testing device 3 (Min) and the total mass of dust discharged from the target testing device 3 (Mout). Then, the dust processing efficiency η of the target testing device can be calculated based on the ratio of the mass of dust processed by the target testing device 3 to the total mass of dust entering the target testing device 3 (Min).

[0063] It should be noted that there is no requirement for the order of steps S400 and S500, and they can be executed in parallel.

[0064] In the above embodiment, the total mass of dust entering the target test equipment 3, Min, during the period from the start of sampling to the end of sampling is calculated by measuring the actual inlet dust g1, and the total mass of dust discharged from the target test equipment 3, Mout, during the period from the start of sampling to the end of sampling is calculated by measuring the actual outlet dust g2. The dust removal efficiency η of the target test equipment is then determined based on Min and Mout. This scheme calculates the dust removal efficiency of the semiconductor process exhaust gas treatment equipment based on actual dust mass data, improving the accuracy of evaluating the dust removal efficiency of the semiconductor process exhaust gas treatment equipment.

[0065] refer to Figure 3 , Figure 3 A method 2000 for testing the dust removal efficiency of a semiconductor process exhaust gas treatment device according to an embodiment of this application is shown.

[0066] In the embodiments of this application, such as Figure 3 As shown, this application provides a method 2000 for testing the dust removal efficiency of a semiconductor process exhaust gas treatment device. Method 2000 is used in a system as described in any of the embodiments above, and is executed by the system of any of the embodiments above. Method 2000 includes steps S101, S102, and steps 110-610.

[0067] In response to a received sampling command, the gas in the inlet or outlet pipe is sampled to obtain sampled gas, including steps S101 and S102.

[0068] In step S101, in response to the received sampling command, the flow rate of the sampling gas in the sampling tube is controlled to be equal to the flow rate of the sampling gas in the inlet or outlet pipe connected to the sampling tube.

[0069] According to the example embodiment, such as Figure 1 As shown, the flow rates of the gas in the inlet pipe 31 and outlet pipe 32 are first measured using an anemometer. Then, based on the flow rates of the gas in the inlet pipe 31 and outlet pipe 32, the controller 23 is set to ensure that the flow rate of the sampling gas in the sampling tube 21 connected to the inlet pipe 31 is equal to the flow rate of the gas in the inlet pipe 31, and the controller 23 is set to ensure that the flow rate of the sampling gas in the sampling tube 21 connected to the outlet pipe 32 is equal to the flow rate of the gas in the outlet pipe 32.

[0070] In step S102, the gas in the inlet or outlet pipe is sampled to obtain sampled gas.

[0071] The inventors of this application discovered that in the prior art, the gas flow rate in the sampling tube is not equal to the gas flow rate in the inlet pipe, or the gas flow rate in the sampling tube is not equal to the gas flow rate in the outlet pipe. Therefore, actual sampling data cannot be obtained, leading to inaccurate calculations of the dust removal efficiency of the semiconductor process exhaust gas treatment equipment.

[0072] In the above embodiment, the controller 23 sets the flow rate of the sampling gas in the sampling tube 21 connected to the inlet pipe 31 to be equal to the flow rate of the gas in the inlet pipe 31, and sets the flow rate of the sampling gas in the sampling tube 21 connected to the outlet pipe 32 to be equal to the flow rate of the gas in the outlet pipe 32. This makes the data of the sampling gas passing through the sampling tube per unit time closer to the data of the gas passing through the inlet pipe 31 and the gas passing through the outlet pipe 32 per unit time. This improves the accuracy of evaluating the dust removal efficiency of semiconductor process exhaust gas treatment equipment.

[0073] It should be noted that steps S210 and S310 are the same as those described above. Figure 2 Steps S200 and S300 of method 1000 are the same and will not be repeated here.

[0074] like Figure 3 As shown, in step S410, the total mass of dust entering the target test equipment per unit time is determined based on the first ratio of the cross-sectional area S1 of the sampling tube connected to the inlet pipe to the cross-sectional area S2 of the inlet pipe, and the ratio of the inlet dust g1 to the first ratio.

[0075] According to the example embodiment, such as Figure 1 As shown, the proportion of the cross-sectional area S1 of the sampling tube 21 to the cross-sectional area S2 of the inlet pipe 31 can be calculated based on the first ratio of the cross-sectional area S1 of the sampling tube 21 connected to the inlet pipe 31 to the cross-sectional area S2 of the inlet pipe 31.

[0076] Since the intake dust g1 is the mass of dust entering the sampling tube 21 connected to the inlet pipe 31, the total mass Min of dust entering the target test device 3 during the period from the start of sampling to the end of sampling can be calculated based on the ratio of intake dust g1 to the first ratio.

[0077] like Figure 3 As shown, in step S510, the total mass of dust Mout discharged by the target test equipment per unit time is determined based on the second ratio of the cross-sectional area S3 of the sampling tube connected to the outlet pipe to the cross-sectional area S4 of the outlet pipe, and the ratio of the exhaust dust g2 to the second ratio.

[0078] According to the example embodiment, such as Figure 1As shown, the proportion of the cross-sectional area S3 of the sampling tube 21 connected to the outlet pipe 32 to the cross-sectional area S4 of the outlet pipe 32 can be calculated based on the second ratio of the cross-sectional area S3 of the sampling tube 21 connected to the outlet pipe 32 to the cross-sectional area S4 of the outlet pipe 32.

[0079] Since the outgoing dust g2 is the mass of dust entering the sampling tube 21 connected to the outlet pipe 32, the total mass of dust Mout discharged by the target test equipment during the period from the start of sampling to the end of sampling can be calculated based on the ratio of outgoing dust g2 to the second ratio.

[0080] like Figure 3 As shown, in step S610, the dust handling efficiency η of the target test equipment is determined based on Min and Mout, including: η=(Min-Mout) / Min×100%; Min = g1 × S2 / S1; Mout = g2 × S4 / S3; Where S1 is the cross-sectional area of ​​the sampling tube connected to the inlet pipe, S2 is the cross-sectional area of ​​the inlet pipe, S3 is the cross-sectional area of ​​the sampling tube connected to the outlet pipe, and S4 is the cross-sectional area of ​​the outlet pipe.

[0081] Finally, it should be noted that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions of the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A system for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment, characterized in that, include: Sampling devices, wherein a first sampling device is connected to the inlet pipe of the target testing equipment, and a second sampling device is connected to the outlet pipe of the target testing equipment, each sampling device comprising: A sampling tube is connected to the inlet pipe or the outlet pipe, and sampling gas flows through the sampling tube; A filter, one end of which is connected to the sampling tube, is used to capture dust in the sampling gas and to allow the first residual gas in the sampling gas to pass through the filter; The controller, with one end connected to the other end of the filter, is used to adjust the flow rate of the sampling gas in the sampling tube so that the flow rate of the sampling gas is equal to the flow rate of the gas in the inlet pipe, or so that the flow rate of the sampling gas is equal to the flow rate of the gas in the outlet pipe. The drive mechanism is connected at one end to the other end of the controller; The system also includes: A drying device for drying the dust captured in the filter; Weighing device for weighing the dried dust; Driven by the driving mechanism, the sampling gas in the inlet pipe or the outlet pipe enters the filter through the sampling tube. After the dust in the sampling gas is captured by the filter, the first residual gas passes through the filter and enters the controller.

2. The system for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment according to claim 1, characterized in that, The sampling device also includes: The dryer is connected at one end to the other end of the filter and at the other end to one end of the controller.

3. The system for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment according to claim 1, characterized in that, The sampling device further includes: The water-air separator has one end connected to the other end of the controller and the other end connected to one end of the drive mechanism; The first residual gas enters the water-gas separator through the controller for solid-liquid separation to obtain the second residual gas.

4. The system for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment according to claim 3, characterized in that, The sampling device also includes: The recovery pipeline is connected at one end to the other end of the drive mechanism; The second filtered gas is recovered after entering the recovery pipeline through the water-gas separator.

5. The system for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment according to claim 1, characterized in that, The filter is internally equipped with filter media, and the filter media has a filtration accuracy of ≥0.1μm.

6. A method for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment, characterized in that, The method is performed based on the system of any one of claims 1-5, and the method includes: In response to a received sampling command, the gas in the inlet pipe or the outlet pipe is sampled to obtain sampled gas; In response to a received capture command, the sampled gas in the inlet pipe and the outlet pipe is filtered to capture dust in the sampled gas; In response to the received weighing command, the captured dust is dried and weighed to obtain inlet dust g1 and outlet dust g2 respectively. The total mass Min of dust entering the target test equipment per unit time is determined based on the inlet dust g1. The total mass of dust Moout discharged by the target test equipment per unit time is determined based on the exhaust dust g2. The dust handling efficiency η of the target test equipment is determined based on Min and Mout.

7. The method for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment according to claim 6, characterized in that, The step of determining the total mass Min of dust entering the target testing equipment per unit time based on the inlet dust g1 includes: The total mass of dust entering the target testing equipment per unit time is determined based on the first ratio of the cross-sectional area S1 of the sampling tube connected to the inlet pipe to the cross-sectional area S2 of the inlet pipe, and the ratio of the inlet dust g1 to the first ratio.

8. The method for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment according to claim 6, characterized in that, The step of determining the total mass Moout of dust discharged by the target testing equipment per unit time based on the exhaust dust g2 includes: The total mass of dust Mot discharged by the target test equipment per unit time is determined based on the second ratio of the cross-sectional area S3 of the sampling tube connected to the outlet pipe to the cross-sectional area S4 of the outlet pipe, and the ratio of the exhaust dust g2 to the second ratio.

9. The method for testing the dust removal efficiency of semiconductor process exhaust gas treatment equipment according to claim 6, characterized in that, The step of sampling gas in the inlet pipe or the outlet pipe in response to a received sampling command to obtain sampled gas includes: In response to a received sampling command, the flow rate of the sampling gas in the sampling tube is controlled to be equal to the flow rate of the sampling gas in the inlet pipe or the outlet pipe to which the sampling tube is connected; The gas in the inlet pipe or the outlet pipe is sampled to obtain sampled gas.

10. The method for testing the dust removal efficiency of a semiconductor process exhaust gas treatment device according to claim 6, characterized in that, Determining the dust handling efficiency η of the target test equipment based on the Min and the Mout includes: η=(Min-Mout) / Min×100%; Min = g1 × S2 / S1; Mout = g2 × S4 / S3; Wherein, S1 is the cross-sectional area of ​​the sampling tube connected to the inlet pipe, S2 is the cross-sectional area of ​​the inlet pipe, S3 is the cross-sectional area of ​​the sampling tube connected to the outlet pipe, and S4 is the cross-sectional area of ​​the outlet pipe.

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