Refrigeration device for a wax block clamp of a pathology microtome

Abstract

This application discloses a cooling device for a paraffin block clamp of a pathology slide machine, belonging to the technical field of pathology slide equipment. The cooling device includes a heat-conducting clamp seat, a slot on one side of the heat-conducting clamp seat, a detachable mounting structure on the side of the heat-conducting clamp seat away from the slot, and a cooling module disposed between the detachable mounting structure and the heat-conducting clamp seat. This cooling device directly conducts cooling energy to the heat-conducting clamp seat via a semiconductor cooling chip, combined with an aluminum heat sink and air-cooled heat dissipation components for stable heat dissipation. It provides continuous directional cooling of the paraffin block without the need for mid-process disassembly for freezing, improving slide preparation efficiency. Simultaneously, the temperature control module monitors the temperature of the heat-conducting clamp seat in real time and automatically starts and stops the semiconductor cooling chip according to a set value to achieve constant temperature control, preventing the paraffin block from softening due to overheating or cracking due to overcooling, improving slide formation quality, and ensuring accurate and reliable pathological diagnostic results.

Description

Technical Field

[0001] This application relates to the field of pathological sectioning equipment technology, specifically a cooling device for a paraffin block clamp of a pathological sectioning machine. Background Technology

[0002] Paraffin sectioning is a core foundational technique for pathological diagnosis. During the sectioning process, the paraffin block is prone to softening due to increased temperature at room temperature, leading to section curling, breakage, and uneven thickness, which affects the quality of the section and subsequent pathological diagnostic results.

[0003] The current industry standard practice is to repeatedly remove the wax block from the microtome fixture, freeze it in a refrigerator or icebox until it hardens, and then reinstall it in the microtome for slicing. This method requires frequent removal and installation of the wax block and waiting for natural cooling, which artificially interrupts the continuous slicing workflow and results in low overall work efficiency. At the same time, it is difficult to control the temperature drop when the wax block is removed from the microtome, which can easily cause it to crack due to overcooling. After being reinstalled in the microtome, it will quickly warm up and soften due to room temperature, resulting in large temperature fluctuations and poor stability of slice quality. Furthermore, a Chinese utility model patent with publication number CN207081602U discloses a cooling device for a paraffin slicer to help maintain the hardness of the wax block. It creates a sealed, low-temperature environment through a heat-insulating cover and a cooling device, allowing the wax block to maintain a suitable hardness continuously during slicing without the need to remove the ice bath for cooling. However, this device relies solely on the on / off cycle of the cooling device or a fixed power output for crude cooling. When the ambient temperature fluctuates, the actual temperature inside the cover is difficult to maintain stably within the ideal range, easily leading to fluctuations in the hardness of the wax block. When the temperature is too high, the wax block becomes soft and difficult to slice; when the temperature is too low, the wax block becomes brittle and prone to cracking.

[0004] Therefore, this application provides a cooling device for the paraffin block clamp of a pathology slide machine to solve the above-mentioned problems. Summary of the Invention

[0005] This application provides a cooling device for the paraffin block clamp of a pathology slide machine, which aims to solve the problems mentioned in the background art, such as low efficiency of repeated manual freezing of paraffin blocks, unstable slide quality, rough temperature control, poor temperature adaptability, and weak universality and compatibility of the existing technology.

[0006] To achieve the above objectives, this application provides the following technical solution: a cooling device for a pathology slide clamp, comprising a heat-conducting clamp seat, a slot formed on one side of the heat-conducting clamp seat for clamping the wax block embedding box, a detachable mounting structure disposed on the side of the heat-conducting clamp seat away from the slot for detaching from the pathology slide clamp, and a cooling module disposed between the detachable mounting structure and the heat-conducting clamp seat for providing cooling to the heat-conducting clamp seat; The cooling module includes a cooling plate fixedly connected to the side of the heat-conducting clamp seat away from the slot, a thermoelectric cooling chip fixedly connected to the side of the cooling plate away from the heat-conducting clamp seat for cooling, an aluminum heat sink fixedly connected to the side of the thermoelectric cooling chip away from the cooling plate for dissipating heat from the hot end of the thermoelectric cooling chip, and an air-cooled heat dissipation component disposed on the side of the aluminum heat sink away from the thermoelectric cooling chip and connected to the detachable mounting structure for removing heat from the surface of the aluminum heat sink. The cold end and hot end of the thermoelectric cooling chip are respectively attached to the cooling plate and the aluminum heat sink. The thermally conductive clamp holder is equipped with a temperature control module for monitoring and regulating the temperature of the thermally conductive clamp holder and the thermoelectric cooler. By featuring a detachable installation structure, the entire device can be directly mounted onto the original clamps of existing pathology microtome machines without requiring structural modifications to the microtome itself. It is compatible with many brands of conventional microtome machines on the market, offering strong versatility and low modification costs. Simultaneously, a cooling plate is added between the cold end of the thermoelectric cooler and the thermally conductive clamp holder in the cooling module, rapidly transforming the point-like cold source generated by the thermoelectric cooler into a surface-like cold source and evenly conducting it to the entire area of ​​the thermally conductive clamp holder, thus stimulating the wax in the slot. The embedding cassette ensures uniform cooling across all parts, achieving a constant temperature throughout the paraffin block. This prevents localized overcooling and cracking or softening due to uneven cooling distribution, which can lead to difficulties in sectioning. Combined with an aluminum heat sink and air-cooled components, it provides stable heat dissipation and continuous directional cooling of the paraffin block, eliminating the need for mid-process disassembly for freezing and improving sectioning efficiency. Furthermore, a temperature control module monitors the real-time temperature of the heat-conducting clamp and automatically activates and deactivates the semiconductor cooling chip based on the set temperature, achieving constant temperature control and preventing the paraffin block from softening due to overheating or cracking due to overcooling. This improves the quality of section formation and ensures accurate and reliable subsequent pathological diagnostic results.

[0007] Preferably, in order to ensure the heat conduction effect of the heat-conducting fixture, the heat-conducting fixture is made of aluminum alloy. By utilizing the high thermal conductivity of aluminum alloy, the cold energy generated by the semiconductor cooling chip can be quickly and evenly transferred to the wax block embedding box at the slot position. At the same time, the heat-conducting fixture is not easily deformed and can stably hold the wax block embedding box, ensuring the stability of the slicing operation.

[0008] Preferably, in order to remove heat from the surface of the aluminum heat sink, the air-cooled heat dissipation assembly includes a concave frame fixedly connected to the thermally conductive clamp seat and located on the side of the aluminum heat sink away from the thermoelectric cooler, and cooling fans fixedly connected to the concave frame and located above and below the aluminum heat sink respectively; the cooling fans are neatly fixed to the outside of the aluminum heat sink by the concave frame, and the symmetrically arranged cooling fans can form a directional convection air field, thereby removing the heat accumulated on the surface of the aluminum heat sink, avoiding overheating of the hot end of the thermoelectric cooler, and ensuring the continuous and stable cooling operation of the cooling module.

[0009] Preferably, in order to constrain the direction of heat dissipation airflow, the air-cooled heat dissipation assembly further includes a through-slot frame fixedly connected to the concave frame and covering the outer side of the cooling fan near the aluminum heat sink, and a guide plate fixedly connected to the side of the through-slot frame away from the cooling fan for guiding airflow to the surface of the aluminum heat sink. The guide plate is inclined towards the side of the aluminum heat sink. The guide plate inclinedly arranged in the through-slot frame can guide the airflow to the surface of the aluminum heat sink fins, increase the contact area between the airflow and the heat sink, and improve the heat exchange and heat dissipation effect.

[0010] Preferably, to adapt to different brands and models of pathology microtome clamps, the detachable mounting structure includes an elastic U-shaped component fixedly disposed on the side of the concave frame away from the aluminum heat sink for engaging with the pathology microtome clamp, and an eccentric quick-release handle fixedly connected to both sides of the elastic U-shaped component for pressing the elastic U-shaped component against the pathology microtome clamp. Through the elastic adaptive clamping of the elastic U-shaped component and the tool-free quick-release handle, it can adapt to the external dimensions of different microtome clamps, achieving universal installation and quick disassembly, thus improving the device's model compatibility and ease of operation.

[0011] Preferably, to achieve real-time monitoring and temperature control of the thermally conductive fixture, the temperature control module includes an NTC temperature sensor fixedly installed inside the thermally conductive fixture for monitoring the temperature inside the fixture, and a digital display temperature controller fixedly installed on the thermally conductive fixture for displaying the temperature and controlling the thermoelectric cooler. The NTC temperature sensor is connected to the input terminal of the digital display temperature controller, and the thermoelectric cooler is connected to the output terminal of the digital display temperature controller. The NTC temperature sensor collects temperature signals in real time and transmits them to the digital display temperature controller, thereby sensing the actual temperature of the thermally conductive fixture in real time. The temperature value is intuitively visible. The digital display temperature controller then controls the working state of the thermoelectric cooler, which can stably maintain the wax block in a suitable low temperature range, avoid sudden temperature changes caused by ambient temperature fluctuations, prevent the slices from curling and breaking, and prevent the wax block from cracking, thus improving the stability of the slice quality.

[0012] Preferably, in order to reduce cold loss and suppress water vapor condensation on the low-temperature surface, the fixture cooling device further includes a heat insulation and anti-condensation module wrapped around the heat-conducting fixture seat for heat insulation and anti-condensation; by the heat insulation and anti-condensation module completely covering the heat-conducting fixture seat, a heat-insulating and vapor-proof protective layer is formed, which can block the conduction of external room temperature to the heat-conducting fixture seat, reduce cold loss, reduce the workload of the cooling module, and at the same time block water vapor in the air from contacting the low-temperature surface, reduce condensation, prevent condensation dripping water from corroding the microtome circuit and sliced ​​samples, and improve the safety of the device and its adaptability to the laboratory.

[0013] Preferably, in order to achieve heat preservation and cold insulation as well as active heating to inhibit condensation, the heat insulation and anti-condensation module includes a heat-insulating cotton layer wrapped around the inner wall of the outer surface of the heat-conducting clamp seat for heat preservation, a receiving cavity opened on the heat-conducting clamp seat and located around the perimeter of the slot, and a heating wire for heating fixedly installed in the receiving cavity. The heating wire is connected to the output terminal of the digital display temperature controller. By setting the heat-insulating cotton layer, the heat loss of the heat-conducting clamp seat can be reduced, and the cooling efficiency can be improved. At the same time, the heating wire arranged around the slot can slightly heat up in a high-humidity environment, destroy the conditions for water vapor condensation, inhibit the formation of condensation from the source, protect the wax block clamping area from being dry and clean, and prevent water vapor condensation from affecting the slicer circuit.

[0014] Preferably, to improve thermal conductivity, the contact surfaces of the thermoelectric cooler and the aluminum heat sink, as well as the contact surfaces of the heat exchange plate and the thermally conductive fixture, are coated with thermally conductive silicone grease. By filling the microscopic gaps between the contact surfaces with thermally conductive silicone grease, a continuous thermally conductive medium layer is formed, which effectively reduces the thermal resistance of the assembly contact surfaces. This accelerates the transfer of cold energy from the thermoelectric cooler through the heat exchange plate to the thermally conductive fixture, making the cold energy distribution more uniform and the conduction more efficient. It also accelerates the removal of heat from the hot end of the thermoelectric cooler to the aluminum heat sink, improving the cooling and heat dissipation efficiency and ensuring the long-term stable operation of the thermoelectric cooler.

[0015] The cooling device for the paraffin block clamp of this pathology slicer has a detachable installation structure, which allows the entire device to be directly assembled onto the original clamp of the existing pathology slicer without structural modification of the slicer body. It is compatible with conventional slicers of multiple brands on the market, with strong versatility and low modification cost. The paraffin block clamping cooling device of this pathological sectioning machine uses a semiconductor cooling chip in the cooling module. The cold end of the chip is attached to the heat-conducting clamping seat, and the hot end is attached to an aluminum heat sink. Utilizing the principle of semiconductor temperature difference cooling, the semiconductor cooling chip generates cold energy and directly conducts it to the heat-conducting clamping seat, continuously and constantly cooling the paraffin block in the slot. This allows for continuous directional cooling of the paraffin block without the need to disassemble the paraffin block for freezing midway, thus improving the efficiency of sectioning work. The cooling device of the paraffin block clamp of the pathology slide machine absorbs heat from the hot end of the semiconductor cooling chip through an aluminum heat sink, and then the forced convection of the air-cooled heat dissipation component removes the heat accumulated on the surface of the aluminum heat sink, which can ensure the long-term stable operation of the semiconductor cooling chip. The cooling device of the paraffin block clamp of the pathological sectioning machine is equipped with a temperature control module to monitor the real-time temperature of the heat-conducting clamp seat and automatically start and stop the operation of the semiconductor cooling chip according to the set temperature to achieve constant temperature control, avoid the paraffin block from softening due to overheating or cracking due to overcooling, improve the quality of section forming, and ensure the accuracy and reliability of subsequent pathological diagnosis results. The cooling device of the paraffin block clamp of this pathological slicer can reduce the loss of cold energy from the heat-conducting clamp seat by setting up a heat insulation cotton layer, thereby improving the cooling efficiency. At the same time, the heating wires arranged around the slot can slightly heat up in high humidity environments, destroy the conditions for water vapor condensation, inhibit the formation of condensation from the source, protect the paraffin block clamping area from being dry and clean, and prevent water vapor condensation from affecting the slicer circuit. The cooling device of the paraffin block clamp of this pathology slide machine fills the microscopic gaps between each mating surface with thermally conductive silicone grease to form a continuous thermally conductive medium layer. This effectively reduces the heat transfer resistance of the assembly contact surface, which not only accelerates the transfer of cold energy from the thermoelectric cooler to the heat-conducting clamp seat through the heat-dampening plate, making the cold energy distribution more uniform and the conduction more efficient, but also accelerates the heat dissipation from the hot end of the thermoelectric cooler to the aluminum heat sink, improving the cooling and heat dissipation conduction efficiency and ensuring the long-term stable operation of the thermoelectric cooler. Attached Figure Description

[0016] Figure 1 A schematic diagram of the application structure of the cooling device for the paraffin block clamp of a pathology slide machine; Figure 2 A schematic diagram of the cooling device for the paraffin block clamp of a pathology slide machine; Figure 3 A schematic diagram of the heat-conducting clamp seat in the cooling device of the paraffin block clamp of a pathology slide machine; Figure 4 This is an exploded structural diagram of the cooling module in the cooling device of the paraffin block clamp of a pathology slide machine. Figure 5 A cross-sectional schematic diagram of the air-cooled heat dissipation component in the cooling device of the paraffin block clamp of a pathology slide machine; Figure 6 This is a schematic diagram of the heat insulation and anti-condensation module in the cooling device of the paraffin block clamp of a pathology slide machine.

[0017] In the picture: 1. Thermally conductive clamp holder; 11. Slot; 2. Detachable installation structure; 21. Flexible U-shaped component; 22. Eccentric quick-release handle; 3. Refrigeration module; 31. Semiconductor refrigeration chip; 32. Aluminum heat sink; 33. Air-cooled heat dissipation assembly; 331. Concave frame; 332. Cooling fan; 333. Through slot frame; 334. Air guide plate; 4. Temperature control module; 41. Digital display temperature controller; 5. Heat insulation and anti-condensation module; 51. Insulation cotton layer; 52. Receiving cavity; 53. Heating wire. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] Example 1 This embodiment provides a cooling device for the paraffin block clamp of a pathology slide machine, such as... Figures 1-6 As shown, the cooling device for the paraffin block clamp of the pathology slide machine includes a heat-conducting clamp seat 1, a slot 11 formed on one side of the heat-conducting clamp seat 1 for clamping the paraffin block embedding box, a detachable mounting structure 2 disposed on the side of the heat-conducting clamp seat 1 away from the slot 11 for detaching from the pathology slide machine clamp, and a cooling module 3 disposed between the detachable mounting structure 2 and the heat-conducting clamp seat 1 for providing cooling to the heat-conducting clamp seat 1; the cooling module 3 includes a cooling plate fixedly connected to the side of the heat-conducting clamp seat 1 away from the slot 11, and a cooling plate fixedly connected to the side of the cooling plate away from the heat-conducting clamp seat 1 for cooling... The system includes a thermoelectric cooler 31, an aluminum heat sink 32 fixedly connected to the side of the thermoelectric cooler 31 away from the heat exchange plate for heat dissipation of the hot end of the thermoelectric cooler 31, and an air-cooled heat dissipation assembly 33 disposed on the side of the aluminum heat sink 32 away from the thermoelectric cooler 31 and connected to the detachable mounting structure 2 for removing heat from the surface of the aluminum heat sink 32. The cold end and hot end of the thermoelectric cooler 31 are respectively attached to the heat exchange plate and the aluminum heat sink 32. A temperature control module 4 is provided on the heat-conducting clamp seat 1 for monitoring and regulating the temperature of the heat-conducting clamp seat 1 and the thermoelectric cooler 31.

[0020] In order to ensure the heat conduction effect of the heat conduction fixture 1, the heat conduction fixture 1 is made of aluminum alloy. By utilizing the high thermal conductivity of aluminum alloy itself, the cold energy generated by the semiconductor cooling chip 31 can be quickly and evenly transferred to the wax block embedding box at the slot 11. At the same time, the heat conduction fixture 1 is not easily deformed and can stably hold the wax block embedding box, ensuring the stability of the slicing operation.

[0021] In use, the entire device is first detachably assembled and fixed onto the original fixture of the existing pathology slide machine using the detachable mounting structure 2 located on the outside of the heat-conducting clamp seat 1. No structural modifications to the slide machine are required for rapid installation and model compatibility. After the device is installed and positioned, the operator sets the desired cooling target temperature via the temperature control module 4 and connects the power for 1 to 2 minutes of pre-cooling. Subsequently, the semiconductor cooling chip 31 inside the cooling module 3 generates both cooling and heating simultaneously using the semiconductor temperature difference cooling effect. The point-like cold source generated at the cold end of the semiconductor cooling chip 31 is first transferred to the closely fitted cooling plate 34, whose area covers the entire area of ​​the slot 11, enabling the concentrated cooling output from the cold end of the semiconductor cooling chip 31 to be rapidly distributed along the cooling plate. Laterally diffused, the cold energy is transformed into a uniform planar cold source. Then, through the large-area contact surface between the cooling plate 34 and the heat-conducting fixture 1, the cold energy is evenly transferred to the entire area of ​​the heat-conducting fixture 1, effectively preventing localized overcooling or overheating on the surface of the heat-conducting fixture 1. Since the heat-conducting fixture 1 is made entirely of aluminum alloy, it possesses excellent thermal conductivity, allowing for rapid, uniform, and efficient transfer of the cold energy generated by the semiconductor cooling chip 31 to the entire area of ​​the heat-conducting fixture 1. After the heat-conducting fixture 1 cools to the set constant temperature range, a standard laboratory-grade tissue embedding cassette is embedded into the slot 11 on the side of the heat-conducting fixture 1. The regular groove structure of the slot 11 enables the adaptation, positioning, and secure fixing of various general-purpose embedding cassettes. After the wafer is properly installed, the cooling output from the thermoelectric cooler 31 is continuously conducted through the thermally conductive clamp 1 to the wax embedding box fixed in the slot 11. This provides in-situ, directional, and continuous cooling and cold preservation for the internal tissue wax block, stabilizing its low-temperature hardness and preventing softening at room temperature that could lead to quality defects such as slice curling, breakage, and uneven thickness. Meanwhile, the residual heat generated by the thermoelectric cooler 31 during operation is conducted outwards from its hot end. Utilizing the tight fit between the hot end of the thermoelectric cooler 31 and the aluminum heat sink 32, the accumulated heat is quickly transferred to the aluminum heat sink 32 for large-area heat dissipation. Furthermore, the forced convection airflow continuously generated by the air-cooled heat dissipation component 33 on the outside of the aluminum heat sink 32 actively removes heat from the surface of the aluminum heat sink 32. The dissipated residual heat promptly dissipates heat and relieves pressure at the hot end of the thermoelectric cooler 31, preventing heat accumulation and temperature rise that could lead to a decrease in cooling performance. This ensures that the cooling module 3 outputs cooling capacity stably and continuously for a long time. Throughout the entire slicing operation and cooling process, the temperature control module 4 installed on the heat-conducting fixture 1 continuously collects and monitors the real-time temperature data of the heat-conducting fixture 1. It automatically adjusts the start-up and shutdown status of the thermoelectric cooler 31 according to a preset temperature threshold in a closed-loop manner. When the temperature of the heat-conducting fixture 1 is higher than the set low temperature value, the thermoelectric cooler 31 is automatically activated to enhance cooling. When the temperature drops back to the set constant temperature range, the cooling operation is automatically stopped. This achieves precise constant temperature control, ensuring that the wax block in the heat-conducting fixture 1 and the slot 11 is always stably maintained within a reasonable low temperature range.This method prevents the paraffin blocks from softening due to excessively high temperatures, making sectioning difficult, while also avoiding the risk of cracking and breakage caused by excessively low temperatures. It significantly reduces the risk of paraffin block cracking, allowing for continuous operation without significant temperature re-entry without disassembling and removing the paraffin blocks. This eliminates the tedious step of repeatedly removing and placing the paraffin blocks in the freezer for cooling, maintaining a smooth and consistent sectioning workflow, and improving the quality of pathological section formation and the overall efficiency of routine pathological testing.

[0022] Specifically, the air-cooled heat dissipation assembly 33 includes a concave frame 331 fixedly connected to the heat-conducting clamp seat 1 and located on the side of the aluminum heat sink 32 away from the semiconductor cooling chip 31, and a heat dissipation fan 332 fixedly connected to the concave frame 331 and located above and below the aluminum heat sink 32 respectively; in addition, the air-cooled heat dissipation assembly 33 also includes a through-slot frame 333 fixedly connected to the concave frame 331 and covering the outer side of the end of the heat dissipation fan 332 near the aluminum heat sink 32, and a guide plate 334 fixedly connected to the through-slot frame 333 away from the heat dissipation fan 332 for guiding airflow to the surface of the aluminum heat sink 32, the guide plate 334 being inclined towards one side of the aluminum heat sink 32.

[0023] When the thermoelectric cooler 31 enters the cooling operation state, it first relies on the concave frame 331, which is fixed on the heat-conducting clamp 1 and located on the side of the aluminum heat sink 32 away from the thermoelectric cooler 31, as the overall support base. Since the concave frame 331 is not a closed cavity, its two sides away from the heat-conducting clamp 1 are open. Therefore, outside air can flow through the aluminum heat sink 32 and then be discharged from both sides, forming a horizontal ventilation channel. When the cooling fans 332 at the top and bottom of the concave frame 331 are simultaneously powered on and start running, continuously generating a stable convective airflow, outside cold air is drawn in under the drive of the cooling fans 332, and after passing through the surface of the fins of the aluminum heat sink 32 to remove heat, it is discharged from both sides, preventing hot air from accumulating inside the concave frame 331. However, when the cooling fans 332 start, the concave frame 331 is equipped with a cover. The cooling fan 332 has a slot frame 333 on the outer side near the aluminum heat sink 32, and the guide plate 334 inside the slot frame 333 is arranged at an angle towards the aluminum heat sink 32. Therefore, the airflow entering the slot frame 333 from the cooling fan 332 can be precisely guided and directly directed to the fin surface of the aluminum heat sink 32 by the directional guidance and angle deflection of the guide plate 334. This effectively increases the contact heat exchange area between the airflow and the aluminum heat sink 32, enhances the air convection heat exchange effect, and quickly removes a large amount of excess heat accumulated on the surface of the aluminum heat sink 32. This allows for timely and continuous heat dissipation and cooling of the hot end of the thermoelectric cooler 31, effectively avoiding the problem of heat accumulation and excessive temperature rise at the hot end of the thermoelectric cooler 31, which would cause a decrease in cooling power and cooling effect. This ensures that the thermoelectric cooler 31 can always maintain a stable and efficient cooling output.

[0024] Furthermore, the detachable mounting structure 2 includes an elastic U-shaped member 21 fixedly disposed on the side of the concave frame 331 away from the aluminum heat sink 32 for engaging with the pathology slicer fixture, and an eccentric quick-release handle 22 fixedly connected to both sides of the elastic U-shaped member 21 for pressing the elastic U-shaped member 21 against the pathology slicer fixture; through the elastic U-shaped member 21 and the eccentric quick-release handle 22.

[0025] It should be added that the eccentric quick-release handle 22 consists of a handle body, an eccentric wheel, a rotating shaft, and a pressure block. The eccentric wheel is rotatably mounted on one end of the handle body via the rotating shaft. The pressure block contacts the outer edge of the eccentric wheel and faces the inner side of the elastic U-shaped part 21. At the same time, a positioning pin or positioning step can be set at the bottom of the inner side of the elastic U-shaped part 21 (not shown in the figure), which cooperates with the reference surface or positioning hole of the microtome fixture to ensure that the position of the slot 11 is consistent with the blade, so that the distance between the wax block embedding box and the blade is constant and the slice thickness is stable.

[0026] When assembling and using the device, the elastic U-shaped part 21, made of metal or engineering plastic with a certain degree of elasticity, can be adapted to the thickness of the clamps of different brands of microtome. The operator directly fastens the elastic U-shaped part 21 to the outside of the pathology microtome clamp. Relying on the elastic restoring force of the elastic U-shaped part 21, the two side walls are pressed tightly against the surface of the clamp, achieving initial clamping and positioning. Then, when the operator turns the handle body on the eccentric quick-release handle 22, the eccentric wheel rotates around the axis, and its long radius direction gradually squeezes the pressure block, causing the pressure block to press against the inside of the elastic U-shaped part 21, thereby pressing the side wall of the elastic U-shaped part 21 tightly against the surface of the pathology microtome clamp, generating sufficient static friction force to achieve a firm fixation without slippage. Conversely, turning the handle body in the opposite direction, the short radius direction of the eccentric wheel contacts the pressure block, the pressure block retracts and releases the clamp, and the entire device can be disassembled by hand without any tools. It is compatible with a variety of conventional microtome models, has strong versatility, and is easy to operate.

[0027] Furthermore, the temperature control module 4 includes an NTC temperature sensor fixedly installed in the heat-conducting fixture 1 for monitoring the temperature inside the heat-conducting fixture 1, and a digital display temperature controller 41 fixedly installed on the heat-conducting fixture 1 for displaying and controlling the temperature of the semiconductor cooling chip 31. The NTC temperature sensor is connected to the input terminal of the digital display temperature controller 41, and the semiconductor cooling chip 31 is connected to the output terminal of the digital display temperature controller 41.

[0028] During the cooling operation of the device, the NTC temperature sensor first collects real-time temperature change data inside the heat-conducting clamp 1. Simultaneously, the temperature signal collected by the NTC temperature sensor is transmitted in real-time to the digital display temperature controller 41, which is electrically connected to its input. After receiving the temperature signal, the digital display temperature controller 41 displays the actual temperature value of the heat-conducting clamp 1 in real-time, allowing operators to intuitively view the real-time operating temperature. Operators can pre-set a suitable constant temperature range on the digital display temperature controller 41. Subsequently, the digital display temperature controller 41 establishes a logic control relationship through a built-in relay and electrically links the relay output to the semiconductor cooling chip 31. This allows the digital display temperature controller 41 to control the start and stop status of the semiconductor cooling chip 31 by switching the built-in relay on and off. When the NTC temperature sensor detects that the internal temperature of the heat-conducting clamp 1 is higher than the preset upper temperature limit, the digital display temperature controller 41... The control relay is activated, connecting the power supply to the thermoelectric cooler 31 and starting its cooling operation. This continuously delivers cooling energy to the heat-conducting fixture 1 to achieve temperature reduction. When the NTC temperature sensor detects that the internal temperature of the heat-conducting fixture 1 has dropped to the preset constant temperature target range, the digital display temperature controller 41 controls the built-in relay to disconnect the circuit, cutting off the power supply to the thermoelectric cooler 31 and pausing its cooling process. This prevents excessive cooling and low temperatures. Through the closed-loop control process of continuous temperature measurement feedback from the NTC temperature sensor, real-time comparison of the set temperature by the digital display temperature controller 41, and precise on / off control of the thermoelectric cooler 31 by the built-in relay, the wax block in the heat-conducting fixture 1 and the slot 11 can be stably maintained at a constant low temperature range. This prevents the wax block from softening and curling, cracking, or becoming uneven in thickness due to temperature rise at room temperature, and also prevents the wax block from becoming brittle and cracking due to excessively low cooling temperatures.

[0029] Example 2 Unlike Example 1, as Figure 2 , Figure 5 and Figure 6 As shown, in order to reduce the loss of cold energy and suppress the condensation of water vapor on the low-temperature surface, the clamp refrigeration device also includes a heat insulation and anti-condensation module 5 wrapped around the heat-conducting clamp seat 1 for heat insulation and anti-condensation. The heat insulation and anti-condensation module 5 includes a heat insulation cotton layer 51 wrapped around the inner wall of the outer surface of the heat-conducting clamp seat 1 for heat insulation, a receiving cavity 52 opened on the heat-conducting clamp seat 1 and located around the perimeter of the slot 11, and a heating wire 53 fixedly installed in the receiving cavity 52 for heating. The heating wire 53 is connected to the output end of the digital display temperature controller 41.

[0030] During normal refrigeration and slicing operations, an insulation cotton layer 51, which wraps around the entire inner surface of the heat-conducting clamp seat 1, provides passive insulation and cold-locking through its porous insulation structure. This reduces the outward loss of cold energy from the heat-conducting clamp seat 1, ensuring the refrigeration effect. Simultaneously, it prevents humid and hot air from penetrating the low-temperature surface of the heat-conducting clamp seat 1, suppressing large-area condensation at the source. Furthermore, the digital temperature controller 41 monitors the ambient humidity and the surface temperature of the heat-conducting clamp seat 1 in real time. When the relative humidity is greater than 70% or the surface temperature of the heat-conducting clamp seat 1 is lower than the dew point temperature +1°C, the digital temperature controller 41 activates the heating wire 53 to supply power. The electrical circuit has a heating wire 53 with a power of ≤5W, which ensures that the heating wire 53 generates only a small amount of heat, just enough to disrupt the conditions for water vapor condensation without significantly affecting the low-temperature environment of the wax block area. This achieves the purpose of preventing condensation without raising the temperature of the wax block. When the ambient humidity drops to ≤70% and the surface temperature is higher than the dew point +2℃, the digital display temperature controller 41 disconnects the power supply to the heating wire 53, stopping the heating and avoiding ineffective energy consumption. The heating wire 53 covers all low-temperature exposed surfaces, ensuring no dead corners for condensation. This maintains the low-temperature cooling effect of the heat-conducting fixture 1 and effectively prevents condensation dripping water from corroding the slicer circuit and the sliced ​​sample, ensuring the stable operation of the device.

[0031] Example 3 Unlike Embodiments 1 and 2, in order to improve the cooling and heat dissipation efficiency, the contact surfaces of the semiconductor cooling chip 31 and the aluminum heat sink 32, as well as the contact surfaces of the heat dissipation plate and the heat-conducting fixture seat 1, are coated with thermally conductive silicone grease.

[0032] By utilizing the ability of thermally conductive grease to fill the gaps in the microscopic contact surfaces, air gaps can be eliminated between the cold end of the thermoelectric cooler 31 and the heat spreader 34, between the heat spreader 34 and the thermally conductive fixture 1, and between the hot end of the thermoelectric cooler 31 and the aluminum heat sink 32, significantly reducing the thermal resistance of each contact surface. When the device is powered on, the cold energy generated by the cold end of the thermoelectric cooler 31 is first rapidly conducted to the heat spreader 34 via the thermally conductive grease, and then uniformly conducted from the heat spreader 34 to the thermally conductive fixture 1 via the thermally conductive grease, forming a continuous low-thermal-resistance cold energy transfer path, improving the efficiency and uniformity of cold energy transfer. At the same time, the heat generated by the hot end of the thermoelectric cooler 31 can also be quickly transferred to the aluminum heat sink 32 for heat dissipation through the thermally conductive grease, avoiding the problem of obstructed heat conduction and reduced heat transfer efficiency caused by the presence of an air insulation layer at the contact surface. This design ensures both the cooling speed and constant temperature effect of the heat-conducting clamp seat 1, and accelerates the heat dissipation rate of the hot end of the semiconductor cooling chip 31, ensuring the long-term stable and efficient operation of the cooling module.

[0033] It should be noted that the heat exchange plate 34 is made of copper or 6063 aluminum alloy, which utilizes its high thermal conductivity to rapidly diffuse the concentrated cooling output from the cold end of the thermoelectric cooler 31 into a uniform planar cold source, ensuring a consistent temperature across the entire heat-conducting fixture 1. The thermoelectric cooler 31 is a TEC1-12706 model with a maximum cooling power of approximately 60W, providing sufficient and stable cooling output to meet the continuous cooling requirements of the wax block. The cooling fan 332 is an axial fan with an airflow of 20 CFM and a speed of 4000 rpm, which, together with the aluminum heat sink 32, forms forced convection to promptly remove the heat from the thermoelectric cooler 31. The heat exchanger prevents overheating at the hot end, which could lead to a decrease in cooling efficiency. The digital temperature controller 41 has a set temperature range of -5℃ to 5℃. It uses an NTC temperature sensor to control the start and stop of the semiconductor cooling chip 31 in real time, keeping the wax block in the optimal low-temperature hardness range. This prevents the wax block from softening and curling due to excessively high temperatures, and also prevents the wax block from cracking due to excessively low temperatures. The heating wire 53 has a power of 10W. When the ambient humidity is high, the digital temperature controller 41 automatically turns on the wire to heat up, raising the local temperature around the slot 11 to 2℃ to 5℃. This disrupts the conditions for water vapor condensation, inhibits condensation from the source, and protects the wax block and the slicer circuit from moisture.

[0034] The above description is merely a preferred embodiment of this application, but the scope of protection of this application is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this application, based on the technical solution and concept of this application, should be included within the scope of protection of this application.

Claims

1. A cooling device for the paraffin block clamp of a pathology slide machine, characterized in that: It includes a heat-conducting clamp seat (1), a slot (11) formed on one side of the heat-conducting clamp seat (1) for mounting the wax block embedding box, a detachable mounting structure (2) disposed on the side of the heat-conducting clamp seat (1) away from the slot (11) for disassembling and assembling with the pathology slide clamp, and a cooling module (3) disposed between the detachable mounting structure (2) and the heat-conducting clamp seat (1) for providing cooling to the heat-conducting clamp seat (1); The cooling module (3) includes a cooling plate fixedly connected to the side of the heat-conducting clamp seat (1) away from the slot (11), a semiconductor cooling chip (31) fixedly connected to the side of the cooling plate away from the heat-conducting clamp seat (1) for cooling, an aluminum heat sink (32) fixedly connected to the side of the semiconductor cooling chip (31) away from the cooling plate for dissipating heat from the hot end of the semiconductor cooling chip (31), and an air-cooled heat dissipation assembly (33) disposed on the side of the aluminum heat sink (32) away from the semiconductor cooling chip (31) and connected to the detachable mounting structure (2) for removing heat from the surface of the aluminum heat sink (32). The cold end and the hot end of the semiconductor cooling chip (31) are respectively attached to the cooling plate and the aluminum heat sink (32). The heat-conducting fixture (1) is provided with a temperature control module (4) for monitoring the temperature of the heat-conducting fixture (1) and regulating the temperature of the semiconductor cooling chip (31).

2. The cooling device for the paraffin block clamp of the pathological sectioning machine according to claim 1, characterized in that: The heat-conducting clamp seat (1) is made of aluminum alloy.

3. The cooling device for the paraffin block clamp of the pathology sectioning machine according to claim 1, characterized in that: The air-cooled heat dissipation assembly (33) includes a concave frame (331) fixedly connected to the heat-conducting clamp seat (1) and located on the side of the aluminum heat sink (32) away from the semiconductor cooling chip (31), and a heat dissipation fan (332) fixedly connected to the concave frame (331) and located above and below the aluminum heat sink (32).

4. The cooling device for the paraffin block clamp of the pathological sectioning machine according to claim 3, characterized in that: The air-cooled heat dissipation assembly (33) further includes a through-slot frame (333) fixedly connected to the concave frame (331) and covering the outer side of the end of the heat dissipation fan (332) near the aluminum heat sink (32), and a guide plate (334) fixedly connected to the side of the through-slot frame (333) away from the heat dissipation fan (332) for guiding airflow to the surface of the aluminum heat sink (32). The guide plate (334) is inclined towards one side of the aluminum heat sink (32).

5. The cooling device for the paraffin block clamp of the pathology sectioning machine according to claim 3, characterized in that: The detachable mounting structure (2) includes an elastic U-shaped part (21) fixedly disposed on the side of the concave frame (331) away from the aluminum heat sink (32) for engaging with the pathology slicer fixture, and an eccentric quick-release handle (22) fixedly connected to both sides of the elastic U-shaped part (21) for pressing the elastic U-shaped part (21) against the pathology slicer fixture.

6. The cooling device for the paraffin block clamp of the pathology sectioning machine according to claim 1, characterized in that: The temperature control module (4) includes an NTC temperature sensor fixedly installed in the heat-conducting clamp seat (1) for monitoring the temperature inside the heat-conducting clamp seat (1) and a digital display temperature controller (41) fixedly installed on the heat-conducting clamp seat (1) for temperature display and control of the semiconductor cooling chip (31). The NTC temperature sensor is connected to the input terminal of the digital display temperature controller (41), and the semiconductor cooling chip (31) is connected to the output terminal of the digital display temperature controller (41).

7. The cooling device for the paraffin block clamp of the pathology sectioning machine according to claim 6, characterized in that: The clamp cooling device also includes a heat insulation and anti-condensation module (5) wrapped around the heat-conducting clamp seat (1) for heat insulation and anti-condensation.

8. The cooling device for the paraffin block clamp of the pathology sectioning machine according to claim 7, characterized in that: The heat insulation and anti-condensation module (5) includes a heat insulation cotton layer (51) wrapped around the inner wall of the outer surface of the heat-conducting clamp seat (1) for heat preservation, a receiving cavity (52) opened on the heat-conducting clamp seat (1) and located around the perimeter of the slot (11), and a heating wire (53) fixedly installed in the receiving cavity (52) for heating. The heating wire (53) is connected to the output end of the digital display temperature controller (41).

9. The cooling device for the paraffin block clamp of the pathology sectioning machine according to claim 1, characterized in that: The contact surfaces of the semiconductor cooling chip (31) and the aluminum heat sink (32) as well as the contact surfaces of the heat dissipation plate and the heat-conducting fixture seat (1) are all coated with thermally conductive silicone grease.

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