Display screen working condition monitoring method and system based on modularized sensing architecture
Patent Information
- Application Number
- CN202611013788.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-08
- Publication Date
- 2026-10-20
AI Technical Summary
实际操作中,局部发热严重的区域可能因采样稀疏而漏判临界高温,而工况平稳区域却承受无谓的高频采样,不仅浪费嵌入式处理器的计算资源,还挤占了有限的数据上传带宽,难以兼顾监测精度与系统效率
1)模块化传感模组通过扩展接口与显示屏接收卡通信,支持扩展传感子板的上电识别、热插拔检测及动态地址分配。在上电或热插拔时,模组通过集成电路总线发送探测指令读取子板设备标识符,并依据预设地址映射表分配唯一从机地址;当检测到地址冲突时,通过时序错位机制依次下发地址重配指令。这一设计使得传感系统可以根据显示屏的尺寸、分辨率及应用场景灵活增减传感子板,无需重新烧录固件或修改硬件布局,大幅降低了系统部署与升级成本。
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Abstract
Description
Technical Field
[0001] This invention relates to the field of display screen technology, and in particular to a method and system for monitoring the operating conditions of a display screen based on a modular sensing architecture. Background Technology
[0002] LED displays are widely used in large-size commercial displays, stage performances, and outdoor advertising. Their long-term operational reliability highly depends on the effective monitoring of operating parameters such as panel temperature, voltage fluctuations, and aging of light-emitting elements. Currently, the industry's common monitoring solution involves pre-installing several sensors during display assembly and using a dedicated data acquisition board to periodically poll the sensor values. This approach has long suffered from the following prominent problems: First, sensor configuration lacks flexibility. Once the display screen is designed at the factory, the type, quantity, and installation location of the sensors are fixed and cannot be adjusted according to differences in the on-site environment or new monitoring needs added later. When the display screen size changes, some panels are repaired or replaced, or new sensing dimensions such as humidity and vibration are needed, the entire data acquisition hardware usually has to be replaced, which is costly and time-consuming.
[0003] Second, the sampling strategy is out of touch with real-world operating conditions. Most existing systems use a globally uniform sampling interval, failing to differentiate between the actual heat load, current density, or aging rate differences in different areas of the display screen. In practice, areas with severe localized overheating may miss critical high temperatures due to sparse sampling, while areas with stable operating conditions are subjected to unnecessary high-frequency sampling. This not only wastes the computing resources of the embedded processor but also consumes limited data upload bandwidth, making it difficult to balance monitoring accuracy and system efficiency.
[0004] Third, the monitoring data and display control are isolated from each other. The collected values such as temperature and voltage are usually only recorded in the background log or used to trigger simple threshold alarms, rarely linked with the display driver circuit. The controller also cannot guide the sensors to adjust the sampling density or switch the working mode based on the current load fluctuations, power consumption margin, or operating conditions of the screen. When a certain area shows signs of degradation, the system often can only perform coarse protection such as uniformly reducing the brightness of the entire screen or directly shutting down the system, and cannot implement precise brightness correction or color temperature compensation for abnormal areas, causing normal areas to be affected as well, seriously affecting the viewing experience and user experience.
[0005] In summary, existing display screen condition monitoring technologies have significant shortcomings in terms of sensor architecture flexibility, sampling strategy adaptability, data and control fusion depth, and two-way collaborative capabilities. There is an urgent need for a new monitoring solution that can effectively address these issues. Summary of the Invention
[0006] To address at least one of the aforementioned technical problems, this invention provides a method and system for monitoring the operating conditions of a display screen based on a modular sensing architecture.
[0007] In a first aspect, the present invention provides a display screen condition monitoring method based on a modular sensing architecture, which is applied to a modular sensing module. The modular sensing module communicates with the display screen receiving card through an expansion interface and performs topology identification and address allocation of the expansion sensing daughter board when powered on or hot-swapped. The method includes: Multi-source operating condition data are collected based on a spatiotemporal coupling sampling strategy. The spatiotemporal coupling sampling strategy dynamically calculates the independent sampling weight of each sub-board to adjust the sampling frequency based on the spatial operating condition gradient and temporal operating condition mutation rate of the area where each extended sensor sub-board is located. Multi-source operating condition data are fused to calculate the multi-dimensional operating condition degradation index of the display screen, and an uplink data frame containing the multi-dimensional operating condition degradation index and spatiotemporal characteristic load is generated. The uplink data frame is sent to the display receiving card, so that the display receiving card can parse the uplink data frame, construct a regional compensation matrix based on the multi-dimensional operating condition degradation index, execute the corresponding display compensation or derating protection, and generate feedback control instructions. The system receives the feedback control command sent by the display receiving card and updates the spatiotemporal coupling sampling strategy for the next cycle.
[0008] Secondly, the present invention also provides a display screen condition monitoring system based on a modular sensing architecture, comprising: Modular sensing modules and display receiver cards; The modular sensing module includes: a main control unit, a basic sensing unit, an expansion interface unit, and a communication interface unit; The main control unit is used to execute the display screen condition monitoring method based on a modular sensing architecture as described in any one of claims 1 to 7; The basic sensing unit is used to collect basic operating condition data of the display screen, which includes at least temperature, light intensity and voltage. The expansion interface unit is used to mount at least one expansion sensor daughterboard and supports power-on identification, hot-plug detection and address allocation of the expansion sensor daughterboard. The communication interface unit is used to establish a bidirectional data communication link with the display receiving card; The display receiver card is connected to the modular sensing module via the bidirectional data communication link. It is used to receive and parse the uplink data frame, construct the regional compensation matrix according to the multidimensional operating condition degradation index, perform display compensation or derating protection actions, and generate the feedback control command to send to the modular sensing module.
[0009] Compared with the prior art, the beneficial effects of the present invention are as follows: 1) The modular sensing module communicates with the display receiver card via an expansion interface, supporting power-on identification, hot-swap detection, and dynamic address allocation for the expansion sensing daughterboard. Upon power-on or hot-swapping, the module sends a probe command via the integrated circuit bus to read the daughterboard device identifier and allocates a unique slave address according to a preset address mapping table. When an address conflict is detected, address reconfiguration commands are sequentially issued through a timing misalignment mechanism. This design allows the sensing system to flexibly add or remove sensing daughterboards based on the display size, resolution, and application scenario without reprogramming firmware or modifying the hardware layout, significantly reducing system deployment and upgrade costs.
[0010] 2) Traditional fixed sampling frequency schemes cannot balance monitoring accuracy and resource efficiency, while the dynamic sampling weight calculation mechanism of this invention comprehensively evaluates the monitoring priority of each sub-board from both spatial and temporal dimensions. Specifically, the Euclidean distance between the target sub-board and the operating condition data vectors of adjacent sub-boards is calculated as the spatial operating condition gradient, reflecting the degree of difference in operating conditions between regions; simultaneously, the magnitude of change in the operating condition data vectors between the current period and the previous period is calculated as the temporal operating condition mutation rate, capturing transient changes in operating conditions. The spatial normalized features and temporal mutation features are weighted and summed separately to obtain the independent sampling weight of each sub-board. Thus, regions with large operating condition gradients or high mutation rates receive higher sampling frequencies, while regions with stable operating conditions receive lower sampling frequencies, significantly reducing overall system power consumption and data transmission bandwidth usage while ensuring monitoring accuracy in key areas.
[0011] 3) This invention extracts temperature, voltage, and aging features from multi-source operating condition data, and normalizes them to obtain temperature state values, voltage state values, and aging state values, respectively. When calculating the multi-dimensional operating condition degradation index, it not only multiplies these three features by a preset linear weighting coefficient to obtain the linear degradation base value, but also creatively introduces a nonlinear coupling term—the product of the three features is cubed and then multiplied by a nonlinear coupling penalty coefficient to obtain a coupling penalty compensation value. This dual calculation architecture of "linear weighting + nonlinear coupling" reflects both the independent contribution of each individual factor to the display screen's degradation and captures the synergistic deterioration effect among temperature, voltage, and aging, enabling the degradation index to more accurately characterize the actual health status of the display screen.
[0012] 4) This invention divides the display screen into multiple monitoring areas corresponding to the positions of the extended sensor sub-boards, and independently calculates a multi-dimensional degradation index for each area. When the degradation index of a certain area exceeds a safety threshold, the system calculates a derating penalty based on the excess amount, and subtracts this penalty amount from the value to obtain the brightness limiting factor for that area. Combined with the brightness compensation coefficient and color temperature shift compensation of areas that have not triggered derating protection, a complete area-level compensation matrix is generated. Compared to the traditional globally unified control method, this area-level differentiated compensation strategy can accurately locate and independently control abnormal areas, protecting high-risk areas from further damage and avoiding the "one-for-all" global brightness down-modulation, thus maximizing the maintenance of the overall visual effect of the display screen.
[0013] 5) The modular sensing module sends uplink data frames containing multi-dimensional operating condition degradation indices and spatiotemporal characteristic loads to the display receiver card. The receiver card parses the data, constructs a compensation matrix, and performs display compensation or derating protection. Simultaneously, the receiver card calculates the system's overall power consumption margin based on the global pixel load rate and global average degradation index of the current frame. When the margin falls below a preset threshold, it generates a feedback control command containing a frequency reduction factor. The sensing module adjusts its basic sampling period accordingly, proportionally reducing the sampling frequency while maintaining the independent sampling weight ratio of each sub-board. This closed-loop mechanism deeply integrates the monitoring system and the display control system, achieving end-to-end intelligent collaboration from data acquisition, feature fusion, compensation execution to dynamic optimization of sampling strategies, significantly improving the stability and reliability of the display under complex operating conditions.
[0014] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the background art, the accompanying drawings used in the embodiments of the present invention or the background art will be described below.
[0016] Figure 1 A flowchart illustrating a display screen condition monitoring method based on a modular sensing architecture, provided in an embodiment of the present invention; Figure 2 A schematic diagram of a display screen condition monitoring system based on a modular sensing architecture, provided for an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of a subunit of the working condition coordination control module provided in an embodiment of the present invention. Detailed Implementation
[0017] To enable those skilled in the art to better understand the present invention, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0018] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.
[0019] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0020] Please see Figure 1 , Figure 1 This is a flowchart illustrating a display screen condition monitoring method based on a modular sensing architecture, provided by an embodiment of the present invention. The method is applied to a modular sensing module, which communicates with the display screen receiver card via an expansion interface, and performs topology identification and address allocation of the expansion sensing daughterboard upon power-on or hot-swapping. like Figure 1 As shown, the method includes: S10. Collect multi-source operating condition data based on a spatiotemporal coupling sampling strategy. The spatiotemporal coupling sampling strategy dynamically calculates the independent sampling weight of each sub-board to adjust the sampling frequency based on the spatial operating condition gradient and temporal operating condition mutation rate of the area where each extended sensor sub-board is located. S20. The multi-source operating condition data is fused, the multi-dimensional operating condition degradation index of the display screen is calculated, and an uplink data frame containing the multi-dimensional operating condition degradation index and the spatiotemporal characteristic load is generated. S30. The uplink data frame is sent to the display receiving card so that the display receiving card can parse the uplink data frame, construct a regional compensation matrix based on the multi-dimensional operating condition degradation index, execute the corresponding display compensation or derating protection, and generate feedback control instructions. S40. Receive the feedback control command sent by the display receiving card and update the spatiotemporal coupling sampling strategy for the next cycle.
[0021] In existing display screen condition monitoring technologies, the sensor architecture is mostly a factory-fixed design. Once the type, quantity, and layout of sensors are determined, they cannot be flexibly adjusted, making it difficult to adapt to changes in display screen size or newly added monitoring needs. Simultaneously, sampling strategies generally employ a globally uniform fixed frequency, which cannot dynamically allocate sampling resources based on the actual operating conditions of different areas, and easily leads to insufficient monitoring in critical areas while data collection is redundant in stable areas. Furthermore, there is a lack of an effective two-way collaboration mechanism between the monitoring system and the display control system. The collected operating data is usually only used for background recording or simple alarms, making it difficult to convert it into regional-level display compensation or protection actions in real time. Moreover, it cannot optimize the acquisition strategy based on the load status of the display, resulting in severely insufficient timeliness and accuracy of overall control.
[0022] To address the aforementioned problems, this invention provides a method for monitoring the operating conditions of a display screen based on a modular sensing architecture. Specifically, this method is applied to a modular sensing module that communicates with the display screen receiver card via an expansion interface. First, upon system power-on or hot-swapping of the expansion sensing sub-board, the module automatically performs topology identification and address allocation, assigning a unique slave address to each in-situ sub-board. Then, step S10 is executed: multi-source operating condition data is collected based on a spatiotemporal coupling sampling strategy. For each expansion sensing sub-board, the spatial operating condition gradient is determined based on the Euclidean distance between its operating condition data vector and that of its adjacent sub-boards. Simultaneously, the magnitude of the change in the operating condition data vector between the current cycle and the previous cycle is calculated as the temporal operating condition mutation rate. These two factors are then fused to dynamically calculate the independent sampling weight of each sub-board, and the sampling frequency for the next cycle is allocated according to the weight ratio. Next, step S20 is executed: the collected multi-source operating condition data is fused, extracting features such as temperature, voltage, and aging, and calculating the multi-dimensional operating condition degradation index of the display screen. This index, along with the spatiotemporal characteristic loads of each sub-board, is encapsulated into an uplink data frame. Then, step S30 is executed: the uplink data frame is sent to the display receiver card, which parses it and constructs a regional compensation matrix based on the multi-dimensional operating condition degradation index of each region, performs display compensation or derating protection actions, and generates feedback control commands. Finally, step S40 is executed: the module receives the feedback control command and updates the spatiotemporal coupling sampling strategy for the next cycle accordingly, forming a closed-loop iteration.
[0023] This method achieves flexible, on-demand deployment of sensing resources through modular sensing modules and hot-swappable expansion sensing daughterboards. It utilizes a spatiotemporally coupled sampling weight dynamic allocation mechanism to adaptively adjust the sampling frequency according to regional operating condition gradients and temporal abrupt change rates. Simultaneously, it establishes a bidirectional closed-loop communication link between the sensing module and the display receiver card—uplinking transmits a fused multi-dimensional operating condition degradation index to drive regional display compensation, and downlink receives feedback control commands to iteratively update the sampling strategy, thereby achieving complete closed-loop control of "perception-analysis-compensation-optimization".
[0024] In one embodiment, the dynamic identification and address allocation of the extended sensing daughterboard includes: The modular sensing module sends a detection command to a preset broadcast address via an integrated circuit bus; When an extended sensor board response is detected, the device identifier of the extended sensor board is read, and a unique slave address is assigned to the extended sensor board according to a preset address mapping table. When multiple extended sensor daughterboards are detected to have address conflicts, the timing misalignment mechanism is triggered to send address reconfiguration instructions to the conflicting daughterboards in sequence until all in-place extended sensor daughterboards have obtained a unique slave address.
[0025] The size of the display screen, the number of zones, and the user's requirements for monitoring dimensions often vary depending on the application scenario. Sensor subboards need to be added, removed, or replaced at any time during system operation. However, when multiple subboards are connected simultaneously, their default addresses may be the same, and the main control unit cannot know in advance which subboards are present. Without an automated identification and address allocation mechanism, it is impossible to distinguish the physical area to which each subboard belongs. Subsequently collected operating data will not correspond to the spatial location of the display screen, making area-level display compensation and derating protection impossible to implement.
[0026] Therefore, in this embodiment, the dynamic identification and address allocation of extended sensor daughterboards is triggered upon system power-on or hot-swapping of any extended sensor daughterboard. First, the main control unit of the modular sensor module sends a probe command to a preset broadcast address via the integrated circuit bus. This broadcast address is dedicated to the discovery phase of newly connected daughterboards, and all extended sensor daughterboards in an unassigned address state listen to this address and respond. When the module detects a response signal from a daughterboard, it immediately reads the preset device identifier inside the daughterboard. This identifier is a unique code fixed at the factory and used to distinguish the daughterboard's type, range, and calibration parameters. Based on the read device identifier, the module queries its internal preset address mapping table, assigns a unique slave address that is not currently occupied on the bus to the daughterboard, and sends it to the daughterboard to complete the configuration. If multiple daughterboards are detected to have address conflicts within the same detection cycle (i.e., multiple daughterboards responding with the same address), a timing misalignment mechanism is triggered: the module sends an address reconfiguration command to the conflicting daughterboards. However, the daughterboards do not respond simultaneously. Instead, they generate random delays based on their internal clocks or inherent delays caused by combinations of hardware pin levels, and sequentially negotiate address reconfiguration with the module until all in-place daughterboards obtain a unique address. After allocation, the module records the address-physical region mapping relationship of each daughterboard, providing a position reference for subsequent spatiotemporal coupling sampling.
[0027] This mechanism endows the sensing system with high field flexibility and operational reliability. Through automated detection, identification, and conflict resolution processes, users can arbitrarily expand or replace sensor sub-boards without manual address configuration, significantly reducing deployment and maintenance costs. At the same time, address allocation clearly defines the "identity" and spatial region of each sub-board, providing a foundation for subsequent regional differentiated sampling and display compensation, and avoiding data corruption or protection malfunctions caused by address confusion.
[0028] In one embodiment, the dynamic calculation of the independent sampling weights of each sub-board to adjust the sampling frequency includes: Obtain the operating condition data vector of the target extended sensing sub-board in the current cycle, and calculate the Euclidean distance between the operating condition data vectors of the target extended sensing sub-board and the adjacent sub-boards as the spatial operating condition gradient. Calculate the magnitude of the change in the operating condition data vector of the target extended sensing subboard between the current cycle and the previous cycle, and use it as the time operating condition mutation rate; The independent sampling weights of the target extended sensing sub-board are calculated based on the spatial operating condition gradient and the temporal operating condition abrupt change rate.
[0029] Further, the step of calculating the independent sampling weights of the target extended sensing sub-board based on the spatial condition gradient and the temporal condition abrupt change rate includes: The ratio of the spatial operating condition gradient to the maximum spatial operating condition gradient of all in-situ extended sensor sub-boards in the current period is used as the spatial normalization feature. The time-related abrupt change rate is subjected to exponential nonlinear amplification to obtain the time abrupt change characteristics; The spatial normalization feature is multiplied by a preset spatial weight adjustment coefficient to obtain a first weighted value, the temporal abrupt change feature is multiplied by a preset temporal weight adjustment coefficient to obtain a second weighted value, and the first weighted value and the second weighted value are summed to obtain the independent sampling weight. Based on the independent sampling weights, the sampling frequency of each extended sensing subboard is proportionally allocated in the next cycle.
[0030] This embodiment performs dynamic calculation of independent sampling weights for each sub-board. The fundamental reason for this is that the operating conditions between different areas of the display screen exhibit significant spatial non-uniformity and temporal time-varying characteristics. If a uniform fixed sampling frequency is used, areas with drastic fluctuations in operating conditions may miss abnormal peaks due to sparse sampling, causing safety hazards. Conversely, areas with long-term stable operating conditions may be subjected to unnecessary frequent sampling, wasting system computing resources and communication bandwidth. Therefore, there is an urgent need for a dual-dimensional evaluation mechanism that can simultaneously consider spatial operating condition gradients (differences between regions) and temporal operating condition abrupt change rates (historical changes in a single region). This mechanism would allow sampling resources to adaptively flow with real-time changes in operating conditions, focusing on high-risk areas and balancing monitoring accuracy and system efficiency.
[0031] In practice, the dynamic weight calculation process described above is executed iteratively on a periodic basis. At the beginning of each period, the module acquires the operating condition data vectors of all in-situ extended sensor sub-boards. Taking any target extended sensor sub-board as an example, this vector contains multi-dimensional parameters such as temperature, voltage, and aging characteristic values calculated based on historical data. First, the module acquires the operating condition data vector of the sub-board for the current period and traverses all its adjacent sub-boards (defined according to physical topology, including sub-boards in the top, bottom, left, right, and diagonal directions). It calculates the Euclidean distance between the target sub-board and the operating condition data vectors of each adjacent sub-board. Then, it takes the average or maximum value of the Euclidean distances of all adjacent sub-boards as the spatial operating condition gradient of the target sub-board for the current period. The larger this gradient value, the more significant the difference in operating conditions between the area where the target sub-board is located and the surrounding area, indicating that the area belongs to an abnormal operating condition or boundary transition area, requiring higher monitoring attention. Simultaneously, the module retrieves the operating condition data vector stored on the target subboard for the previous cycle, calculates the magnitude of change between the current cycle vector and the previous cycle vector, that is, summing the squares of the differences in each dimension and taking the square root to obtain the time-dependent operating condition abrupt change rate. The larger this abrupt change rate, the more drastic the change in the operating conditions of that region has occurred per unit time, possibly indicating a dynamic process such as heating, overload, or heat dissipation failure. Therefore, more frequent sampling is needed to capture the complete change trajectory.
[0032] After obtaining the two basic indicators mentioned above, the module enters the weight fusion calculation stage. For the spatial operating condition gradient, the module first finds the largest spatial operating condition gradient value among all in-situ sub-boards in the current period. It then divides the spatial operating condition gradient of the target sub-board by this maximum value to obtain a spatially normalized feature ranging from 0 to 1. This eliminates dimensional differences across different periods and numbers of sub-boards, making the relative spatial differences between sub-boards comparable. For the temporal operating condition abrupt change rate, considering that a small increase in the abrupt change rate may indicate a severe trend of deterioration in operating conditions, a simple linear mapping would weaken the sensitivity to critical changes. Therefore, the module performs exponential nonlinear amplification processing on the temporal operating condition abrupt change rate. For example, it uses the natural constant e as the base and the abrupt change rate as the exponent for calculation, so that larger abrupt change rates achieve an amplification effect far exceeding linear proportions, thus obtaining the temporal abrupt change feature.
[0033] Subsequently, the module multiplies the spatially normalized features by a preset spatial weight adjustment coefficient to obtain a first weighted value, and multiplies the temporal abrupt change features by a preset temporal weight adjustment coefficient to obtain a second weighted value. The sum of these two values yields the independent sampling weight of the target sub-board. These two adjustment coefficients can be flexibly configured according to the actual scenario. For example, the spatial weight coefficient can be appropriately increased in scenarios with high requirements for temperature uniformity, while the temporal weight coefficient can be increased in scenarios sensitive to transient overload. Finally, the module aggregates the independent sampling weights of all in-situ sub-boards and allocates the sampling frequency of each sub-board in the next cycle according to the proportion of each sub-board's weight to the total weight of all sub-boards. That is, sub-boards with higher weights receive more samples in the next cycle, thus achieving adaptive and differentiated allocation of sampling resources.
[0034] Through the above embodiments, an intelligent upgrade of the sampling frequency from "globally fixed" to "on-demand allocation" was achieved. This allows for the precise allocation of limited data acquisition and transmission resources to critical areas with large operating condition gradients and high abrupt change rates, while reducing the sampling density in stable areas. This significantly improves the overall effective resolution of monitoring with the same system overhead. The introduction of spatial operating condition gradients enables the system to accurately identify spatial anomalies such as local hotspots and local voltage drops, providing high-resolution, differentiated data support for the subsequent construction of regional compensation matrices.
[0035] Furthermore, the exponential nonlinear amplification of the temporal operating condition abrupt change rate makes the system highly sensitive to sudden deterioration of operating conditions, such as a sharp temperature rise due to cooling fan failure or a sudden surge in current. This allows for immediate triggering of encrypted sampling, providing valuable time margin for the receiving card to quickly implement derating protection. Spatial normalization eliminates the interference of dynamic changes in the number of sub-boards on weight calculation, ensuring the system maintains the rationality and stability of weight allocation even when hot-swapping sub-boards. The independent configurability of spatial and temporal adjustment coefficients gives the system adaptability to different application scenarios. Outdoor screens can emphasize temporal weights to cope with sudden weather changes, while indoor ultra-high-definition screens can emphasize spatial weights to ensure uniformity across the entire screen. Therefore, this dynamic weighting mechanism establishes an optimal balance between sampling resource constraints and monitoring accuracy, significantly improving the system's intelligence level and operational reliability.
[0036] In one embodiment, the calculation of the multidimensional operating condition degradation index of the display screen includes: Temperature, voltage and aging features are extracted from multi-source operating condition data and normalized to obtain temperature state value, voltage state value and aging state value respectively. The multidimensional operating condition degradation index is calculated based on temperature state value, voltage state value, and aging state value, including: The linear degradation baseline value is obtained by multiplying the temperature state value, voltage state value, and aging state value by their respective preset linear weighting coefficients and then summing them. Calculate the product of the temperature state value, voltage state value, and aging state value, and perform a cube root operation on the product to obtain the geometric mean feature. Multiply the geometric mean feature by a preset nonlinear coupling penalty coefficient to obtain the coupling penalty compensation value. The multidimensional operating condition degradation index is obtained by adding the linear degradation baseline value to the coupling penalty compensation value.
[0037] It should be noted that the effects of temperature, voltage, and aging on the health of a display screen are not simply a linear additive effect; there is a significant synergistic deterioration effect among the three. For example, high temperatures accelerate voltage drift, and abnormal voltage can exacerbate heat generation. Furthermore, aged light-emitting elements are more sensitive to temperature and voltage fluctuations. If only linear weighting is used, the actual damage caused by the combined effect of these three factors will be severely underestimated. Therefore, a nonlinear coupling penalty term needs to be introduced on top of the linear weighting to make the degradation index more accurately reflect the comprehensive health status under the interplay of multiple factors.
[0038] Specifically, in this embodiment, the module first extracts three core features from the multi-source operating condition data collected by each extended sensor sub-board: temperature features, voltage features, and aging features. Temperature features reflect the real-time thermal load of the area where the sub-board is located, voltage features characterize power supply stability, and aging features are calculated based on historical data such as cumulative operating time and brightness decay curves. For each type of feature, the module performs normalization processing: for example, temperature features can be converted into the ratio of the current temperature to the rated maximum operating temperature, voltage features can be converted into the absolute percentage of the current voltage deviating from the rated voltage, and aging features can be converted into the proportion of decayed lifespan to the total design lifespan, resulting in temperature state values, voltage state values, and aging state values all ranging from 0 to 1.
[0039] After obtaining the three state values, the module enters the fusion calculation stage of the degradation index. First, the temperature state value, voltage state value, and aging state value are multiplied by their respective preset linear weighting coefficients and summed to obtain the linear degradation baseline value, which reflects the cumulative effect of the independent contributions of each factor. Simultaneously, the module calculates the product of the three states and performs a cube root operation on the product to obtain a geometric mean feature. This feature characterizes the degree of synergy when all three are at a high level; the geometric mean only increases significantly when all three are high. Subsequently, this geometric mean feature is multiplied by a preset nonlinear coupling penalty coefficient to obtain the coupling penalty compensation value. Finally, the linear degradation baseline value and the coupling penalty compensation value are added to obtain the multidimensional operating condition degradation index for the monitored area corresponding to the sub-board. The larger the index value, the worse the health status of the area, and the more urgent the need to trigger compensation or protection.
[0040] By calculating a multi-dimensional degradation index and introducing a non-linear coupling penalty term in the form of a geometric mean on top of linear weighting, the synergistic effect of simultaneous deterioration of temperature, voltage, and aging is accurately captured. This makes the degradation index output more closely reflect the actual physical damage patterns of the display screen compared to a purely linear solution, significantly improving assessment accuracy. Secondly, the dual-branch architecture of linear and non-linear components clearly identifies the independent contributions and interaction effects of each factor, allowing maintenance personnel to quickly locate the main sources of degradation. Normalization eliminates the incomparability of different physical dimensions, giving the algorithm good cross-scenario versatility. Furthermore, the calculation involves only basic arithmetic operations, resulting in extremely low computational overhead. It can be completed in real-time on a low-cost MCU without adding extra hardware resources, providing a high-confidence decision-making basis for implementing regional differentiated compensation and precise derating protection at the receiving card end.
[0041] In one embodiment, a regional compensation matrix is constructed based on the multidimensional operating condition degradation index, and corresponding explicit compensation or derating protection is executed, including: The display screen is divided into multiple monitoring areas corresponding to the positions of the extended sensor sub-boards; For any monitoring area, when the multidimensional operating condition degradation index corresponding to the monitoring area exceeds the preset safety threshold, the area derating protection is triggered. The difference between the multidimensional operating condition degradation index of the monitoring area and the safety threshold is calculated. The difference is multiplied by the preset derating slope coefficient to obtain the derating penalty amount. The value minus the derating penalty amount is used as the brightness limiting factor of the monitoring area. The region-level compensation matrix is generated based on the brightness limitation factor of the monitored area, the brightness compensation coefficient of the area where derating protection is not triggered, and the color temperature offset compensation amount.
[0042] The degree of degradation in different areas of a display screen often exhibits significant spatial non-uniformity, meaning that local hotspots, uneven power supply, or differences in component aging result in varying health statuses across different monitored areas. If a traditional globally uniform derating solution is used, an anomaly in a single area will force a reduction in the brightness of the entire screen, unnecessarily affecting normally displaying areas and severely impairing the user's visual experience. Therefore, this embodiment aims to establish a differentiated compensation mechanism based on independent area assessment, enabling compensation and protection actions to precisely target the areas that truly require intervention, achieving refined control by "adjusting only where anomalies occur."
[0043] In practice, this process is executed on the display receiver card. The receiver card first divides the display area into multiple corresponding monitoring zones based on the physical installation locations of each extended sensor sub-board. The operational health status of each zone is characterized by a multi-dimensional operational health degradation index reported by its corresponding sub-board. Subsequently, the receiver card traverses all monitoring zones, determining whether the multi-dimensional operational health degradation index of each zone exceeds a preset safety threshold. This safety threshold is pre-calibrated by the display manufacturer based on screen type, usage environment, and safety redundancy requirements, representing the upper limit of the allowed operational health status for that zone.
[0044] For any monitored area, if its degradation index does not exceed the threshold, the area is determined to be in a safe operating state and derating protection does not need to be activated. The receiver card is configured with a basic brightness compensation coefficient and color temperature offset compensation amount to eliminate slight display deviations caused by normal aging or environmental changes. If the degradation index of a monitored area exceeds the safety threshold, area-level derating protection is triggered: The receiver card first calculates the difference between the multi-dimensional operating condition degradation index of the area and the safety threshold. This difference represents the severity level of the current degradation exceeding the safety boundary. Then, the difference is multiplied by a preset derating slope coefficient to obtain the derating penalty amount. The derating slope coefficient determines the steepness of the brightness drop after exceeding the threshold. The larger the coefficient, the more severe the brightness reduction under the same threshold exceedance. Finally, the derating penalty amount is subtracted from the value to obtain the brightness limit factor of the monitored area. The value of this factor is between 0 and 1 and is directly used as the global upper limit ratio of the drive current or PWM duty cycle of the area. After calculating the brightness limit factor and compensation parameters for all regions, the receiving card integrates them to generate a region-level compensation matrix. This matrix contains the brightness limit factor, brightness compensation coefficient, and color temperature shift compensation amount for each monitored region, and then sends this matrix to the display's driver control chip for execution. If a region is constrained by the brightness limit factor, its display brightness will be forcibly limited to the upper limit ratio corresponding to that factor, thereby actively reducing the heat generation and current stress in that region and delaying further degradation. Regions that have not triggered derating protection continue to operate normally with the compensated parameters, ensuring the maximum maintenance of the overall display effect.
[0045] This embodiment overcomes the limitations of traditional global uniform derating by precisely applying brightness limiting and color temperature compensation to the over-threshold region, while the normal region remains unaffected. This maximizes the overall display effect while ensuring hardware safety. Secondly, a linear penalty mechanism based on the over-threshold difference achieves a smooth, gradual reduction in brightness, avoiding abrupt jumps caused by hard threshold triggering and resulting in a natural visual transition. The coordinated configuration of the brightness limiting factor and color temperature offset compensation ensures that the drated region maintains color consistency even as brightness decreases, eliminating color differences at region boundaries. Furthermore, both the safety threshold and the derating slope coefficient are flexibly configurable, allowing the system to adapt to different application scenarios' display quality and hardware protection priorities. The end-to-end closed-loop architecture ensures that the compensation matrix is updated in real-time on a frame-by-frame basis, achieving frame-by-frame adaptive differentiated control.
[0046] In one embodiment, the process of generating the feedback control command includes: The receiving card calculates the global pixel load rate of the current frame and combines it with the global average multi-dimensional operating condition decay index to calculate the overall power consumption margin of the system; when the overall power consumption margin of the system is lower than the preset power consumption threshold, a feedback control command containing a frequency reduction factor is generated. The modular sensing module is used to receive the feedback control command, multiply the basic sampling period in the spatiotemporal coupling sampling strategy by the frequency reduction factor, and reduce the sampling frequency of each extended sensing sub-board according to a preset ratio while keeping the independent sampling weight ratio of each sub-board unchanged.
[0047] The feedback control command generation and response mechanism is as follows: During the processing cycle of each frame, the display receiver card first calculates the global pixel load rate of the current frame, which is the proportion of pixels in the current frame that are lit up. This proportion directly determines the instantaneous current demand of the drive circuit. Simultaneously, the receiver card globally averages the multi-dimensional degradation indices reported by all monitored areas to obtain the global average degradation index, which reflects the overall health margin level of the display screen. The receiver card uses the global pixel load rate and the global average degradation index as inputs and calculates the system's comprehensive power consumption margin according to a preset power consumption evaluation model. This margin represents the remaining available power redundancy space of the display screen while meeting basic display requirements.
[0048] When the overall power consumption margin is lower than the preset power consumption threshold, it indicates that the system is currently operating under high load and has insufficient overall health margin. Continuing to maintain high-frequency sampling will increase the module's processing load and communication bandwidth usage, potentially further encroaching on the display control system's resources. Therefore, the receiver card generates a feedback control command containing a down-frequency factor and sends it to the modular sensing module via the downlink communication link. Upon receiving the command, the module parses the down-frequency factor, multiplies the basic sampling period in the spatiotemporal coupling sampling strategy by this down-frequency factor, and maintains the proportional relationship of the independent sampling weights of each sub-board unchanged. That is, the relative sampling density between each sub-board remains at its original distribution, and the sampling frequency of all sub-boards is uniformly reduced according to a preset ratio, thereby reducing the overall sampling load without compromising the regional differentiated monitoring resolution.
[0049] The aforementioned feedback control mechanism achieves bidirectional closed-loop collaboration between the monitoring system and the display control system. On one hand, by incorporating screen load rate and health margin into the power margin assessment model, the sampling frequency can be dynamically adjusted according to the real-time operating status of the display system. Under high load, the frequency is actively reduced to release communication bandwidth and computing resources; under low load, the normal sampling frequency is restored to ensure monitoring density, achieving global optimal allocation of system resources. On the other hand, the frequency reduction operation only adjusts the global scaling factor of the basic sampling period, while the independent sampling weight ratio of each sub-board remains unchanged. This means that the differentiated monitoring priorities between regions are fully preserved, and even after frequency reduction, the system can still ensure that key areas with large operating condition gradients and high mutation rates receive relatively higher attention. This mechanism provides an effective buffer when system power consumption is tight, avoiding resource competition between the sensing module and the display control system, and improving the stability and reliability of the entire system under high-load, long-term operation scenarios.
[0050] See Figure 2 In one embodiment, the present invention also provides a display screen condition monitoring system based on a modular sensing architecture, comprising: Modular sensing module 10 and display receiver card 20; The modular sensing module 10 includes: a main control unit 101, a basic sensing unit 102, an expansion interface unit 103, and a communication interface unit 104; The main control unit 101 is used to execute the display screen condition monitoring method based on the modular sensing architecture as described in any of the preceding claims; The basic sensing unit 102 is used to collect basic operating condition data of the display screen, which includes at least temperature, light intensity and voltage. The expansion interface unit 103 is used to mount at least one expansion sensor daughter board and supports power-on identification, hot-plug detection and address allocation of the expansion sensor daughter board. Communication interface unit 104 is used to establish a bidirectional data communication link with the display receiving card; The display receiver card 20 is connected to the modular sensing module via the bidirectional data communication link. It is used to receive and parse the uplink data frame, construct the regional compensation matrix according to the multidimensional operating condition degradation index, perform display compensation or derating protection actions, and generate the feedback control command to send to the modular sensing module.
[0051] It is understood that the system provided in this embodiment has functions or includes modules that can be used to execute the methods described in the above method embodiments. The specific implementation can be referred to the description of the above method embodiments, and for the sake of brevity, it will not be repeated here.
[0052] In one embodiment, the modular sensing module 10 further includes an interface adaptive matching circuit, which is connected between the extended interface unit and the communication interface unit. The interface adaptive matching circuit is used to detect the interface level status at the connection point with external devices. When the detected interface level is the first preset level, the main control unit switches to the first communication mode. In the first communication mode, the extended interface unit interacts with the external extended sensor daughterboard according to the onboard parallel bus protocol. When the detected interface level is the second preset level, the main control unit switches to the second communication mode. In the second communication mode, the extended interface unit interacts with the external extended sensor board through a serial bridge protocol. The interface adaptive matching circuit maintains the same uplink data frame format and the same address allocation strategy in both modes.
[0053] The aforementioned adaptive matching circuitry enables the modular sensing module to be compatible with different types of external sensing devices. It supports both native high-bandwidth daughterboards for intensive data acquisition and universal serial sensors to meet low-cost or specific-dimensional monitoring needs, significantly broadening the system's applicability. Simultaneously, it shields the upper-layer software from the differences in underlying physical interfaces and protocols. Regardless of the type of sensing device connected to the expansion interface, the main control unit processes data using the same data frame format and address management strategy. This eliminates the need for separate branch logic in the firmware code for different interface types, reducing system complexity and maintenance costs. Automatic level detection and instant mode switching require no manual configuration or restart; this plug-and-play functionality further enhances the ease of field deployment.
[0054] See Figure 3 In one embodiment, the display receiver card 20 integrates a working condition coordination control module 201. The working condition coordination control module 201 includes: The data parsing unit 2010 is used to perform header parsing and load parsing on the received uplink data frame, and extract the multidimensional operating condition degradation index and the spatiotemporal characteristic load of each extended sensor sub-board. The area compensation matrix generation unit 2011 is used to generate a region-level brightness compensation matrix and a region-level color temperature offset compensation matrix corresponding to the physical area of the display screen, based on the position information of each extended sensor sub-board and the corresponding multi-dimensional working condition decay index. The protection strategy execution unit 2012 is used to send the regional brightness compensation matrix and the regional color temperature offset compensation matrix to the display screen's drive control chip, and to trigger the corresponding region's derating protection when the multi-dimensional working condition degradation index of any monitored region exceeds a preset safety threshold. The feedback instruction generation unit 2013 is used to generate the feedback control instruction based on the statistical characteristics of the global load rate of the current frame and the multi-dimensional operating condition degradation index of each region.
[0055] The aforementioned working condition collaborative control module integrates four core functions—data parsing, compensation calculation, protection execution, and feedback generation—within the receiver card, forming a complete closed loop from working condition data reception to display driver output. The seamless integration of data parsing and compensation generation eliminates the latency caused by multi-level transmission in traditional architectures, ensuring that the compensation matrix can be updated in real-time with frame cycles. The protection strategy execution unit integrates degradation index monitoring and derating triggering, achieving immediate abnormal response. The feedback instruction generation unit generates control instructions based on global load and regional health statistical characteristics, enabling real-time linkage between the sampling strategy and display load. With clear division of labor and a clear data flow among the four functional units, the receiver card completes the entire chain processing that traditional solutions require multiple processors within a single chip, significantly reducing system complexity and hardware costs.
[0056] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.
Claims
1. A method for monitoring the operating condition of a display screen based on a modular sensing architecture, characterized in that, It is applied to a modular sensing module, which communicates with the display receiver card through an expansion interface and performs topology identification and address allocation of the expansion sensing daughter board when powered on or hot-swapped. The method includes: Multi-source operating condition data are collected based on a spatiotemporal coupling sampling strategy. The spatiotemporal coupling sampling strategy dynamically calculates the independent sampling weight of each sub-board to adjust the sampling frequency based on the spatial operating condition gradient and temporal operating condition mutation rate of the area where each extended sensor sub-board is located. Multi-source operating condition data are fused to calculate the multi-dimensional operating condition degradation index of the display screen, and an uplink data frame containing the multi-dimensional operating condition degradation index and spatiotemporal characteristic load is generated. The uplink data frame is sent to the display receiving card, so that the display receiving card can parse the uplink data frame, construct a regional compensation matrix based on the multi-dimensional operating condition degradation index, execute the corresponding display compensation or derating protection, and generate feedback control instructions. The system receives the feedback control command sent by the display receiving card and updates the spatiotemporal coupling sampling strategy for the next cycle.
2. The display screen condition monitoring method based on a modular sensing architecture according to claim 1, characterized in that, The dynamic identification and address allocation of the extended sensing daughterboard includes: The modular sensing module sends a detection command to a preset broadcast address via an integrated circuit bus; When an extended sensor board response is detected, the device identifier of the extended sensor board is read, and a unique slave address is assigned to the extended sensor board according to a preset address mapping table. When multiple extended sensor daughterboards are detected to have address conflicts, the timing misalignment mechanism is triggered to send address reconfiguration instructions to the conflicting daughterboards in sequence until all in-place extended sensor daughterboards have obtained a unique slave address.
3. The display screen condition monitoring method based on a modular sensing architecture according to claim 1, characterized in that, The dynamic calculation of the independent sampling weights of each sub-board to adjust the sampling frequency includes: Obtain the operating condition data vector of the target extended sensing sub-board in the current cycle, and calculate the Euclidean distance between the operating condition data vectors of the target extended sensing sub-board and the adjacent sub-boards as the spatial operating condition gradient. Calculate the magnitude of the change in the operating condition data vector of the target extended sensing subboard between the current cycle and the previous cycle, and use it as the time operating condition mutation rate; The independent sampling weights of the target extended sensing sub-board are calculated based on the spatial operating condition gradient and the temporal operating condition abrupt change rate.
4. The display screen condition monitoring method based on a modular sensing architecture according to claim 3, characterized in that, The step of calculating the independent sampling weights of the target extended sensing sub-board based on the spatial condition gradient and the temporal condition abrupt change rate includes: The ratio of the spatial operating condition gradient to the maximum spatial operating condition gradient of all in-situ extended sensor sub-boards in the current period is used as the spatial normalization feature. The time-related abrupt change rate is subjected to exponential nonlinear amplification to obtain the time abrupt change characteristics; The spatial normalization feature is multiplied by a preset spatial weight adjustment coefficient to obtain a first weighted value, the temporal abrupt change feature is multiplied by a preset temporal weight adjustment coefficient to obtain a second weighted value, and the first weighted value and the second weighted value are summed to obtain the independent sampling weight. Based on the independent sampling weights, the sampling frequency of each extended sensing subboard is proportionally allocated in the next cycle.
5. The display screen condition monitoring method based on a modular sensing architecture according to claim 1, characterized in that, The calculation of the multi-dimensional operating condition degradation index of the display screen includes: Temperature, voltage and aging features are extracted from multi-source operating condition data and normalized to obtain temperature state value, voltage state value and aging state value respectively. The multidimensional operating condition degradation index is calculated based on temperature state value, voltage state value, and aging state value, including: The linear degradation baseline value is obtained by multiplying the temperature state value, voltage state value, and aging state value by their respective preset linear weighting coefficients and then summing them. Calculate the product of the temperature state value, voltage state value, and aging state value, and perform a cube root operation on the product to obtain the geometric mean feature. Multiply the geometric mean feature by a preset nonlinear coupling penalty coefficient to obtain the coupling penalty compensation value. The multidimensional operating condition degradation index is obtained by adding the linear degradation baseline value to the coupling penalty compensation value.
6. The display screen condition monitoring method based on a modular sensing architecture according to claim 1, characterized in that, Based on the multi-dimensional operating condition degradation index, a regional compensation matrix is constructed, and corresponding explicit compensation or derating protection is executed, including: The display screen is divided into multiple monitoring areas corresponding to the positions of the extended sensor sub-boards; For any monitoring area, when the multidimensional operating condition degradation index corresponding to the monitoring area exceeds the preset safety threshold, the area derating protection is triggered. The difference between the multidimensional operating condition degradation index of the monitoring area and the safety threshold is calculated. The difference is multiplied by the preset derating slope coefficient to obtain the derating penalty amount. The value minus the derating penalty amount is used as the brightness limiting factor of the monitoring area. The region-level compensation matrix is generated based on the brightness limitation factor of the monitored area, the brightness compensation coefficient of the area where derating protection is not triggered, and the color temperature offset compensation amount.
7. The display screen condition monitoring method based on a modular sensing architecture according to claim 1, characterized in that, The process of generating the feedback control command includes: The receiving card calculates the global pixel load rate of the current frame and combines it with the global average multi-dimensional operating condition decay index to calculate the overall power consumption margin of the system; when the overall power consumption margin of the system is lower than the preset power consumption threshold, a feedback control command containing a frequency reduction factor is generated. The modular sensing module is used to receive the feedback control command, multiply the basic sampling period in the spatiotemporal coupling sampling strategy by the frequency reduction factor, and reduce the sampling frequency of each extended sensing sub-board according to a preset ratio while keeping the independent sampling weight ratio of each sub-board unchanged.
8. A display screen condition monitoring system based on a modular sensing architecture, characterized in that, include: Modular sensing modules and display receiver cards; The modular sensing module includes: a main control unit, a basic sensing unit, an expansion interface unit, and a communication interface unit; The main control unit is used to execute the display screen condition monitoring method based on a modular sensing architecture as described in any one of claims 1 to 7; The basic sensing unit is used to collect basic operating condition data of the display screen, which includes at least temperature, light intensity and voltage. The expansion interface unit is used to mount at least one expansion sensor daughterboard and supports power-on identification, hot-plug detection and address allocation of the expansion sensor daughterboard. The communication interface unit is used to establish a bidirectional data communication link with the display receiving card; The display receiver card is connected to the modular sensing module via the bidirectional data communication link. It is used to receive and parse the uplink data frame, construct the regional compensation matrix according to the multidimensional operating condition degradation index, perform display compensation or derating protection actions, and generate the feedback control command to send to the modular sensing module.
9. The display screen condition monitoring system based on a modular sensing architecture according to claim 8, characterized in that, The modular sensing module further includes an interface adaptive matching circuit, which is connected between the expansion interface unit and the communication interface unit. The interface adaptive matching circuit is used to detect the interface level status at the connection point with external devices. When the detected interface level is the first preset level, the main control unit switches to the first communication mode. In the first communication mode, the extended interface unit interacts with the external extended sensor daughterboard according to the onboard parallel bus protocol. When the detected interface level is the second preset level, the main control unit switches to the second communication mode. In the second communication mode, the extended interface unit interacts with the external extended sensor board through a serial bridge protocol. The interface adaptive matching circuit maintains the same uplink data frame format and the same address allocation strategy in both modes.
10. The display screen condition monitoring system based on a modular sensing architecture according to claim 8, characterized in that, The display receiver card integrates a working condition coordination control module. The working condition collaborative control module includes: The data parsing unit is used to perform header parsing and payload parsing on the received uplink data frames, and extract the multidimensional operating condition degradation index and the spatiotemporal characteristic payload of each extended sensor sub-board. The area compensation matrix generation unit is used to generate a region-level brightness compensation matrix and a region-level color temperature offset compensation matrix corresponding to the physical area of the display screen, based on the position information of each extended sensor sub-board and the corresponding multi-dimensional working condition degradation index. The protection strategy execution unit is used to send the regional brightness compensation matrix and the regional color temperature offset compensation matrix to the display screen's drive control chip, and to trigger the corresponding region's derating protection when the multi-dimensional operating condition degradation index of any monitored region exceeds a preset safety threshold. The feedback instruction generation unit is used to generate the feedback control instruction based on the statistical characteristics of the global load rate of the current frame and the multi-dimensional operating condition degradation index of each region.