Laser repair device

Abstract

According to an embodiment, a laser repair apparatus for repairing defects in an object includes: a laser beam generating unit that emits a laser beam; a beam expander that receives the laser beam and emits the laser beam with an expanded cross-sectional area; a digital micromirror device that includes a plurality of micromirrors that receive the laser beam emitted from the beam expander and disperse the laser beam into multiple beams for emission; and a lens unit that receives the multiple beams and converges the multiple beams to irradiate the object, wherein the cross-section of the laser beam incident on the digital micromirror device has a size capable of covering the entire area of ​​the plurality of micromirrors.

Description

Technical Field

[0001] This disclosure relates to laser repair devices and laser repair methods. Background Technology

[0002] Display devices such as liquid crystal displays (LCDs) and organic light emitting diode displays (OLEDs) include a display panel with multiple pixels capable of displaying images and multiple signal lines, as well as a cover window for protecting the display panel. Each pixel may include a pixel electrode for receiving data signals, and the pixel electrode may be connected to at least one transistor to receive data signals.

[0003] A display panel may include a substrate and multiple thin film layers stacked on the substrate. The thin film layers may include wiring patterns. Defects arising in the wiring patterns can be repaired using a laser repair device. Summary of the Invention

[0004] Technical issues

[0005] The implementation method can provide a laser repair device and laser repair method that can improve the lifespan of a digital micromirror device (DMD).

[0006] Solution

[0007] A laser repair apparatus according to one embodiment repairs defects in an object, wherein the laser repair apparatus includes: a laser beam generating unit that emits a laser beam; a beam expander that receives the laser beam and emits the laser beam with an expanded cross-sectional area; a digital micromirror device that includes a plurality of micromirrors that receive the laser beam emitted from the beam expander and disperse the laser beam into multiple beams for emission; and a lens unit that receives the multiple beams and converges the multiple beams to irradiate the object, wherein the cross-section of the laser beam incident on the digital micromirror device has a size capable of covering the entire area of ​​the plurality of micromirrors.

[0008] The laser beam emitted from the laser beam generating unit may include multiple wavelengths.

[0009] The laser repair device may further include: a filter located between the laser beam generating unit and the beam expander, which blocks a portion of the plurality of wavelengths included in the laser beam emitted from the laser beam generating unit.

[0010] The cross-sectional area of ​​the laser beam incident on the digital micromirror device can be between 2 and 16 times the total area of ​​the plurality of micromirrors.

[0011] The cross-section of the laser beam incident on the digital micromirror device may include a central portion and a peripheral portion surrounding the central portion. The laser repair device may further include an aperture located between the beam expander and the digital micromirror device, which blocks the peripheral portion of the laser beam incident on the digital micromirror device.

[0012] The aperture can be configured to reduce the cross-sectional area of ​​the laser beam incident on the digital micromirror device by 50% to 80%.

[0013] The intensity of the central portion can be more than 86.5% of the maximum intensity of the laser beam incident on the digital micromirror device.

[0014] The lens section may include objective lenses arranged adjacent to the object.

[0015] The lens section may include a tubular lens located on the opposite side of the object, with the objective lens as a reference.

[0016] The laser repair device may further include: a camera, for photographing the object and generating an image.

[0017] The laser repair device may further include: a computer that receives the image from the camera and determines the repair area of ​​the object.

[0018] A laser repair method according to one embodiment repairs defects in an object, wherein the laser repair method includes: a laser beam generating unit emitting a laser beam; a beam expander receiving the laser beam and emitting the laser beam with an expanded cross-sectional area; a digital micromirror device including multiple micromirrors receiving the laser beam emitted from the beam expander and dispersing the laser beam into multiple beams for emission; a lens unit receiving the multiple beams and converging the multiple beams to irradiate the object; the cross-section of the laser beam incident on the digital micromirror device covers the entire area of ​​the multiple micromirrors.

[0019] The laser beam emitted from the laser beam generating unit may include multiple wavelengths.

[0020] The laser repair apparatus may further include: using a filter located between the laser beam generating unit and the beam expander to block a portion of the plurality of wavelengths included in the laser beam emitted by the laser beam generating unit.

[0021] The cross-sectional area of ​​the laser beam incident on the digital micromirror device can be between 2 and 16 times the total area of ​​the plurality of micromirrors.

[0022] The cross-section of the laser beam incident on the digital micromirror device may include a central portion and a peripheral portion surrounding the central portion, and an aperture located between the beam expander and the digital micromirror device may block the peripheral portion of the laser beam incident on the digital micromirror device.

[0023] The aperture can reduce the cross-sectional area of ​​the laser beam incident on the digital micromirror device by 50% to 80%.

[0024] The intensity of the central portion can be more than 86.5% of the maximum intensity of the laser beam incident on the digital micromirror device.

[0025] The laser repair device may further include: using a camera to photograph the object and generating an image.

[0026] The laser repair device may further include: a computer using the image to determine the repair area of ​​the object.

[0027] Beneficial effects

[0028] According to the implementation method, the lifespan of digital micromirror devices included in laser repair apparatuses or used in laser repair methods can be improved.

[0029] Furthermore, beneficial effects can be recognized throughout the specification based on the implementation method. Attached Figure Description

[0030] Figure 1 This is a schematic diagram showing the constituent elements of a laser repair apparatus according to one embodiment.

[0031] Figure 2 It is a photograph showing the image of the subject and the area to be restored.

[0032] Figure 3 This is a schematic photograph of a digital micromirror device that emits an incident laser beam as multiple beams.

[0033] Figure 4 It is a photograph showing the object that has been repaired.

[0034] Figure 5 This is a perspective view illustrating an exemplary digital micromirror device.

[0035] Figure 6 It is shown in magnification Figure 5 An enlarged view of area VI.

[0036] Figure 7 It is a photograph showing the damaged microscope.

[0037] Figure 8This is a diagram showing high-magnification and low-magnification images presented on a digital micromirror device.

[0038] Figure 9 This is a diagram showing a low-magnification image.

[0039] Figure 10 This is a diagram showing a high-magnification image.

[0040] Figure 11 This is a diagram showing the shape of a laser beam emitted from a beam expander of a laser repair apparatus according to one embodiment incident on a digital micromirror device.

[0041] Figure 12 This is a diagram showing the shape of a relatively wide laser beam emitted from a beam expander incident on a digital micromirror device.

[0042] Figure 13 This is a diagram showing the shape of a laser beam emitted from a beam expander passing through an aperture and incident on a digital micromirror device.

[0043] Figure 14 It is a diagram showing the spatial distribution and curves of the laser beam emitted from the laser beam generation unit.

[0044] Figure 15 It is a graph showing the spatial distribution and curves of the laser beam emitted from the beam expander.

[0045] Figure 16 It is a graph showing the spatial distribution and curves of the laser beam passing through the aperture.

[0046] Explanation of reference numerals in the attached figures

[0047] 10: Laser repair device; 100: Laser beam generation unit

[0048] 200: Filter; 300: Beam expander

[0049] 400: Aperture; 500: Digital Micromirror System

[0050] 501: Microscope; 600: Lens section

[0051] 601: Tube lens; 602: Objective lens

[0052] 700: Camera; 800: Computer

[0053] TO: Object; LI: Laser beam

[0054] DL: Multibeam; RL: Reflected Beam

[0055] VDI, VDI': Image; RA: Restoration Area

[0056] CS: Cross section; CR: Center section

[0057] ER: Peripheral HMI: High-magnification image

[0058] LMI: Low-magnification image Detailed Implementation

[0059] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings to enable those skilled in the art to readily implement the present disclosure. The present disclosure can be implemented in many different forms and is not limited to the embodiments described herein.

[0060] For the purpose of clearly illustrating this disclosure, parts unrelated to the description have been omitted, and the same or similar constituent elements are given the same reference numerals throughout the specification.

[0061] Furthermore, the dimensions and thicknesses of the various structures shown in the accompanying drawings are arbitrarily illustrated for ease of explanation, and therefore this disclosure is not necessarily limited to the contents shown. In the drawings, thicknesses are shown enlarged to clearly illustrate multiple layers and regions. Also, in the drawings, the thicknesses of some layers and regions are exaggerated for ease of explanation.

[0062] Furthermore, when it is stated that a part of a layer, membrane, region, plate, etc., is "above" or "on" another part, this includes not only the case where it is directly "above" another part, but also the case where there is another part between them. Conversely, when it is stated that any part is "directly" "above" another part, it means that there is no other part between them. In addition, "above" or "on" the part that serves as a reference means being located above or below the part that serves as a reference, and does not necessarily mean being "above" or "on" in a direction opposite to gravity.

[0063] Furthermore, in the overall specification, when it is stated that any part "includes" any constituent element, unless specifically stated to the contrary, it means that other constituent elements may also be included without excluding other constituent elements.

[0064] Furthermore, in the overall instruction manual, when it is described as "on a plane," it means the view of the object from above, and when it is described as "on a cross section," it means the view of the object being cut vertically from the side.

[0065] A laser repair apparatus is a device that repairs defects in an object by generating a laser beam and modifying its path to direct the laser onto the object. For example, the object can be a component of a display device, namely a display panel. The display panel can be a device comprising multiple pixels and multiple signal lines to display an image. The display panel may include a substrate and multiple thin film layers stacked on the substrate.

[0066] Display panels are manufactured by depositing multiple thin film layers on a substrate. These thin film layers can include wiring patterns. In a display panel, the wiring patterns serve to transmit electrical signals and power to each pixel.

[0067] Defects in the wiring pattern may occur due to contamination or process errors during the display panel manufacturing process. For example, wiring pattern defects may include broken wires that prevent current flow due to disconnected wiring, or short circuits that result in unwanted electrical contacts due to wires that should be separate being connected.

[0068] The reliability of the wiring pattern directly affects the performance and image quality of the display panel. Defects in the wiring pattern can hinder the transmission of electrical signals, potentially causing problems in the image display. This can lead to a decline in product quality. Therefore, to ensure product reliability and performance, it may be necessary to accurately detect and repair defects in the wiring pattern.

[0069] When a thin film layer is deposited on a substrate to form a wiring pattern, the presence or absence of defects in the wiring pattern can be determined. The presence or absence of defects in the wiring pattern can be determined using an automated optical inspection (AOI) system. If defects are found through AOI, they can be repaired using a laser repair device.

[0070] The following is for reference Figure 1 We carefully examined the laser repair device, which can repair defects in objects such as display panels. The laser repair device can repair objects beyond just display panels.

[0071] Figure 1 This is a schematic diagram showing the constituent elements of a laser repair apparatus according to one embodiment.

[0072] The laser repair device 10 may include a laser beam generating unit 100, a filter 200, a beam expander 300, an aperture 400, a digital micromirror device 500, a lens unit 600, a camera 700, a computer 800, a reflector RM, and a transmissive mirror HM.

[0073] The laser beam generating unit 100 can generate and emit a laser beam L1. The laser beam generating unit 100 may include a gain medium, a resonator, and a pumping system. The laser beam may be high-brightness light formed by amplifying light generated in the gain medium through a resonator. The laser beam L1 emitted from the laser beam generating unit 100 may include multiple wavelengths. For example, the laser beam L1 emitted from the laser beam generating unit 100 may include wavelengths of 355 nm, 532 nm, and 1064 nm.

[0074] The beam expander 300 can expand the diameter of the incident laser beam LI and emit it. The beam expander 300 can receive the laser beam LI emitted from the laser beam generating unit 100 and emit the laser beam LI with an expanded cross-sectional area. For example, the beam expander 300 can be composed of two or more lenses and a drive motor. The drive motor can adjust the spacing between the lenses of the beam expander 300 to expand the cross-sectional area of ​​the laser beam LI. Furthermore, the beam expander 300 has the function of expanding the cross-sectional area of ​​the laser beam LI, and the shape or structure of the beam expander 300 is not limited.

[0075] The filter 200 can be an optical element that selectively allows or blocks laser beam LI to pass through based on specific properties. The filter 200 can block a portion of the multiple wavelengths included in the laser beam LI emitted from the laser beam generating unit 100. The filter 200 can be a band-pass filter. The filter 200 can be located between the laser beam generating unit 100 and the beam expander 300.

[0076] Aperture 400 is an optical element capable of limiting the cross-sectional area of ​​the laser beam LI. Aperture 400 can block a portion of the cross-section of the laser beam LI. Aperture 400 can be located between beam expander 300 and digital micromirror device 500. The cross-section of the laser beam LI incident on digital micromirror device 500 can include a central portion and a peripheral portion surrounding the central portion. Aperture 400 can block the peripheral portion of the laser beam LI incident on digital micromirror device 500.

[0077] The digital micromirror device 500 can disperse a laser beam LI to emit multiple beams DL. The digital micromirror device 500 may include multiple micromirrors that receive the laser beam LI emitted from the beam expander 300 and disperse the laser beam LI into multiple beams DL for emission. The multiple beams DL may be a shape in which the laser beam LI is divided into multiple beams. The cross-sectional shape of the multiple beams DL can be determined based on information about the repair area RA sent from the computer 800.

[0078] The lens section 600 can receive the multi-beam DL emitted from the digital micromirror device 500. The multi-beam DL incident on the lens section 600 can be focused and illuminate the object TO. The focusing of the multi-beam DL can mean that the multi-beam DL maintains its shape while its size is reduced.

[0079] Furthermore, the lens section 600 can transmit the reflected light RL from the object TO to the camera 700. The reflected light RL transmitted through the lens section 600 to the camera 700 can be used by the camera 700 to generate an image VDI of the object TO.

[0080] The lens section 600 may include a tube lens 601 and an objective lens 602. In the lens section 600, the objective lens 602 may be arranged adjacent to the object TO. The tube lens 601 may be located on the opposite side of the object TO with respect to the objective lens 602.

[0081] The magnification of the lens section 600 is adjustable. When the lens section 600 is at high magnification, the size of the multi-beam DL illuminating the object TO can be reduced to a high degree, and the image VDI of the object TO captured by the camera 700 can be magnified to a high degree. When the lens section 600 is at low magnification, the size of the multi-beam DL illuminating the object TO can be reduced to a low degree, and the image VDI of the object TO captured by the camera 700 can be magnified to a low degree.

[0082] Camera 700 can capture images of an object TO to generate an image VDI of the object TO. Camera 700 can capture images of the object TO using reflected light RL reflected from the object TO. The reflected light RL can be light emitted from a light source set up to identify defects in the object TO and reflected at the object TO. The state of the object TO can be determined using the image VDI captured by camera 700.

[0083] Computer 800 can receive an image VDI of a photographed object TO from camera 700 and determine the repair area RA of the object TO. The repair area RA can be a specific area on the object TO that needs to be irradiated with laser beam LI to repair defects. Computer 800 can send information about the repair area RA to digital micromirror device 500. Digital micromirror device 500 can adjust the angle of each of the micromirrors based on the received information about the repair area RA to generate a multi-beam DL with a shape corresponding to the repair area RA.

[0084] A reflector RM can reflect the laser beam LI to alter its path. The surface of the reflector RM can be coated with a high reflectivity to minimize laser beam LI loss. The laser repair apparatus 10 can use multiple reflectors RM to precisely control the path of the laser beam LI. A translucent mirror HM allows a portion of the laser beam LI to pass through and reflects the reflected light RL from the object TO.

[0085] The following is for reference Figures 2 to 4 Specifically observe the process of the laser repair device repairing defects in the object. Figure 2 It is a photograph showing the image of the subject and the area to be restored. Figure 3 This is a schematic photograph of a digital micromirror device that emits an incident laser beam as multiple beams. Figure 4 It is a photograph showing the object that has been repaired.

[0086] A camera can photograph an object and generate an image image (VDI). The VDI may include a wiring pattern of a thin film layer. The camera can send the VDI to a computer. The computer can analyze the VDI to distinguish the wiring pattern from other parts. Furthermore, the computer can compare the captured wiring pattern with pre-stored wiring patterns. Thus, the computer can determine the repair area (RA) for repairing defects in the wiring pattern. Figure 2 The left illustration can be an example of an image VDI, and the right illustration can be an example of a repaired area RA.

[0087] The computer can convert information about the repair area RA into digital signals and send them to the digital micromirror apparatus 500. The digital micromirror apparatus 500 can use the received information about the repair area RA to adjust the angle of each of the micromirrors, thereby emitting multiple beams. The shape of the multiple beams can correspond to the shape of the repair area RA. Figure 3 One example could be a laser beam LI incident on a digital micromirror device 500 and emitted as a multi-beam DL having a shape corresponding to the shape of the repair area RA.

[0088] The multi-beam laser (DL) emitted from the digital micromirror device 500 can be converged and reduced to a size suitable for repairing defects in the wiring pattern as it passes through the lens section. These defects can then be repaired by laser irradiation. Figure 4 This could be an example of an image VDI of the object being repaired.

[0089] The following is for reference Figure 5 and Figure 6 Specifically, observe the digital micromirror device. Figure 5 This is a perspective view illustrating an exemplary digital micromirror device. Figure 6 It is shown in magnification Figure 5 An enlarged view of area VI.

[0090] The digital micromirror device 500 may include multiple micromirrors 501. The digital micromirror device 500 can selectively illuminate an object with a laser beam received from a beam expander in multiple beams.

[0091] The angle of each of the micromirrors 501 can be adjusted based on information about the repair area. The angle of each of the micromirrors 501 can be changed to adjust the direction of light reflected from each of the micromirrors 501. For example, in a digital micromirror device 500, multiple micromirrors 501 can be arranged in a grid pattern on a static random access memory (static RAM) cell. The micromirrors 501 included in a digital micromirror device 500 can form, for example, a 1920 × 1080 matrix. A highly reflective material such as aluminum can be deposited on the surface of the micromirrors 501.

[0092] If information about the repair area is stored in the static random access memory (SRAM) unit of the digital micromirror device 500, the tilt angle of the micromirror 501 can be determined based on the stored information. The micromirror 501 can be tilted at a° or -a°. For example, the micromirror 501 can be tilted at 12° or -12°, but is not limited thereto. The state in which the micromirror 501 is tilted at a° can be referred to as the on state of the micromirror 501, and the state in which the micromirror 501 is tilted at -a° can be referred to as the off state of the micromirror 501. Alternatively, it can be set in the opposite way. When the micromirror 501 is in the on state, a laser beam can be irradiated onto the object; when the micromirror 501 is in the off state, the laser beam may not irradiate the object.

[0093] Each of the micromirrors 501 can be in an on or off state depending on the shape of the repair area. That is, a group of micromirrors 501 tilted at a° can correspond to the shape of the repair area.

[0094] The following is for reference Figure 7 Specifically, we observed the relationship between damage to the micromirror and the lifespan of the digital micromirror device. Figure 7 It is a photograph showing the damaged microscope.

[0095] Micromirror 501 can be damaged by the incident laser beam. In particular, the greater the intensity of the incident laser beam, the more severe the damage to micromirror 501 may be. Damage to micromirror 501 may hinder precise control and direction adjustment of the laser beam, thereby reducing the accuracy of the repair operation. Therefore, defects in the wiring pattern may not be properly repaired or additional damage may occur. Ultimately, damage to micromirror 501 may shorten the lifespan of the digital micromirror device 500 and reduce its overall performance.

[0096] The following is for reference Figures 8 to 10 By comparing the cases where the lens section is at high magnification and the cases where it is at low magnification, we can specifically observe the micromirror in the open state. Figure 8 This is a diagram showing high-magnification and low-magnification images presented on a digital micromirror device. Figure 9 This is a diagram showing a low-magnification image. Figure 10 This is a diagram showing a high-magnification image.

[0097] When a high-magnification lens is used in a laser repair device, the camera can generate highly magnified images. Because the defects are also magnified highly, the computer can use these highly magnified images to accurately determine the repair area. The accurately determined repair area can be a high-resolution repair area.

[0098] Because the high-magnification lens section can converge multiple beams to a high degree, high-magnification images can be formed in the digital micromirror device 500.

[0099] When a low-magnification lens is used in a laser repair device, the camera can generate images with low magnification. Since the defect is also magnified at a low level, the computer can use these low-magnification images to determine the repair area with low precision. The repair area determined with low precision can be a low-resolution repair area.

[0100] Because the low-magnification lens section allows for a low degree of convergence of multiple beams, a low-magnification image can be formed in the digital micromirror device 500.

[0101] Considering the scenario of photographing the same object using a camera, a high-magnification image (HMI) can be larger than a low-magnification image (LMI), even though the shape is the same. Ultimately, the number of micromirrors 501 in the digital micromirror device 500 that are in the active state can be determined by the magnification of the lens section.

[0102] Figure 9 Low-magnification imaging (LMI) can be achieved by having three micromirrors 501 in the on state to emit multiple beams. Figure 10 The high-magnification imaging (HMI) can emit multiple beams by having 12 micromirrors 501 in the on state. The shape and size of the multiple beams formed by the high-magnification imaging (HMI) and the low-magnification imaging (LMI) can have the same characteristics when irradiating the object. However, since the high-magnification imaging (HMI) can form a greater number of multiple beams than the low-magnification imaging (LMI), more precise restoration work on the object is possible.

[0103] The following is for reference Figures 11 to 13 Specifically, a laser repair device according to one embodiment is observed that can improve the lifespan of a digital micromirror device.

[0104] Figure 11 This is a diagram showing the shape of a laser beam emitted from a beam expander of a laser repair apparatus according to one embodiment incident on a digital micromirror device.

[0105] The cross-section CS of the laser beam LI incident on the digital micromirror device 500 can cover the entire digital micromirror device 500. Furthermore, the cross-section CS of the laser beam LI incident on the digital micromirror device 500 can have a size that covers an entire area of ​​multiple micromirrors. This entire area of ​​multiple micromirrors can include the reflection areas of all micromirrors. Therefore, the lifespan of the digital micromirror device 500 can be improved while reducing damage to the micromirrors.

[0106] The laser beam LI is expanded and incident on the digital micromirror device 500 as it passes through the beam expander 300. The cross-section CS of the expanded laser beam LI can cover the entire area of ​​the digital micromirror device 500. If the laser beam LI is expanded into a wide area, the intensity of the laser beam LI reaching each micromirror can be dispersed and reduced. The reduced intensity of the laser beam LI can mitigate damage to the micromirrors. Therefore, the lifespan and performance of the digital micromirror device 500 can be improved.

[0107] Conversely, if the laser beam is concentrated only on a portion of the micromirrors in a digital micromirror system (DMS), an extremely high intensity laser beam may be transmitted to that area. This concentrated beam could deliver excessive energy to the micromirrors in that region. Excessive energy could cause damage to the micromirror surface. Over time, this damage could worsen, and damaged micromirrors could make precise control of the laser beam difficult. Consequently, this could reduce the lifespan and performance of the DMS.

[0108] That is, by making the range of the laser beam L1 incident on the digital micromirror device 500 have a size that can cover the entire area of ​​the digital micromirror device 500, damage to the micromirror can be reduced and the lifespan of the digital micromirror device 500 can be increased. In addition, it can also result in extended maintenance cycles and reduced replacement costs for the digital micromirror device 500.

[0109] Figure 12 It is shown that... Figure 11 In contrast, the laser beam emitted from the beam expander and incident on the digital micromirror device has a wider cross-section and an incident shape.

[0110] The cross-sectional area of ​​the laser beam LI emitted from the beam expander 300 and incident on the digital micromirror device 500 is not limited. For example, the cross-sectional area of ​​the laser beam LI incident on the digital micromirror device 500 can be 2 to 16 times the total area of ​​the multiple micromirrors. Alternatively, the cross-sectional area of ​​the laser beam LI incident on the digital micromirror device 500 can be 4 to 9 times the total area of ​​the multiple micromirrors.

[0111] By further expanding the cross-sectional area of ​​the digital micromirror device 500, the intensity of the laser beam LI incident on the overall area of ​​the multiple micromirrors can be minimized. Therefore, this can help improve the lifetime of the digital micromirror device 500.

[0112] Figure 13 This diagram illustrates the process by which a laser beam emitted from a beam expander passes through an aperture and enters a digital micromirror device.

[0113] The cross-section of the laser beam LI may include a central portion CR and a peripheral portion ER. The peripheral portion ER may be the region surrounding the central portion CR. In the cross-section of the laser beam LI, the peripheral portion ER may be the region blocked by the aperture 400. In the cross-section of the laser beam LI, the central portion CR may be the region that passes through the aperture 400 and is incident on the digital micromirror device 500. For example, the intensity of the laser beam LI in the central portion CR may be more than 86.5% of the maximum intensity of the laser beam LI incident on the digital micromirror device 500. The peripheral portion ER may be the portion where the intensity of the laser beam LI is less than 86.5% of the maximum intensity of the laser beam LI.

[0114] The cross-section CS of the laser beam LI incident on the digital micromirror device 500 can be formed only by the region corresponding to the central portion CR. The region corresponding to the peripheral portion ER can be blocked by the aperture 400. The aperture 400 can reduce the cross-sectional area of ​​the laser beam LI incident on the digital micromirror device 500. For example, the aperture 400 can be configured to reduce the cross-sectional area of ​​the laser beam LI incident on the digital micromirror device 500 by 50% to 80%.

[0115] The laser beam LI can exhibit a cross-sectional intensity distribution that is highest at the center and gradually decreases with distance from the center. This intensity distribution can follow a Gaussian distribution.

[0116] Furthermore, the central portion CR can minimize intensity differences based on the position of the laser beam LI's cross-section. Therefore, if the entire area of ​​multiple micromirrors is covered by the region corresponding to the central portion CR, it may cause uniform damage to the micromirrors. To prevent damage from concentrating on specific micromirrors, the lifetime of the digital micromirror device 500 can be improved by arranging an aperture 400 that blocks the laser beam LI at the peripheral portion ER.

[0117] The following is for reference Figures 14 to 16 Carefully observe the relationship between the cross-sectional position and intensity of the laser beam. Figure 14 It is a diagram showing the spatial distribution and curves of the laser beam emitted from the laser beam generation unit. Figure 15 It is a graph showing the spatial distribution and curves of the laser beam emitted from the beam expander.

[0118] A laser beam LI passing through a beam expander can expand its cross-sectional area while maintaining its Gaussian distribution characteristics. (Comparison) Figure 14 and Figure 15 It can be seen that if the laser beam LI passes through the beam expander 300, the spatial distribution of the laser beam becomes wider.

[0119] As the cross-section of the laser beam LI is expanded, the intensity within the laser beam LI can change. Figure 14 This illustrates a high-intensity laser beam LI concentrated in a narrow area. Figure 15In this process, the maximum intensity can be relatively reduced when the same energy is distributed over a wider area. This can be a natural phenomenon based on the law of conservation of energy.

[0120] Figure 16 It is a graph showing the spatial distribution and curves of the laser beam passing through the aperture.

[0121] Figure 16 The process of using an aperture 400 to control the intensity distribution of the laser beam LI is shown.

[0122] Aperture 400 can selectively separate the central portion CR and the peripheral portion ER of the laser beam LI. Aperture 400 can block the peripheral portion ER in the cross section of the laser beam LI and allow only the central portion CR to be incident on the digital micromirror device.

[0123] By using an aperture 400 to ensure that the cross-section of the laser beam LI incident on the digital micromirror device covers the entire area of ​​multiple micromirrors, a uniform and low-intensity laser beam LI can be irradiated onto all micromirrors. This improves the lifespan of the digital micromirror device 500.

[0124] While the embodiments of this disclosure have been described in detail above, the scope of this disclosure is not limited thereto, and various modifications and improvements made by those skilled in the art using the basic concepts of this disclosure as defined in the appended claims also fall within the scope of this disclosure.

Claims

1. A laser repair device for repairing defects in an object, wherein, include: Laser beam generating unit, which emits a laser beam; A beam expander receives the laser beam and emits the laser beam with an expanded cross-sectional area; A digital micromirror device includes multiple micromirrors that receive the laser beam emitted from the beam expander and disperse the laser beam into multiple beams for emission. as well as The lens section receives and converges the multiple beams to illuminate the object. The cross-section of the laser beam incident on the digital micromirror device has a size that can cover the entire area of ​​the plurality of micromirrors.

2. The laser repair device according to claim 1, wherein, The laser beam emitted from the laser beam generating unit includes multiple wavelengths.

3. The laser repair device according to claim 2, wherein, Also includes: A filter is located between the laser beam generating unit and the beam expander, and blocks a portion of the multiple wavelengths included in the laser beam emitted from the laser beam generating unit.

4. The laser repair device according to claim 1, wherein, The cross-sectional area of ​​the laser beam incident on the digital micromirror device is between 2 and 16 times the total area of ​​the plurality of micromirrors.

5. The laser repair device according to claim 1, wherein, The cross-section of the laser beam incident on the digital micromirror device includes a central portion and a peripheral portion surrounding the central portion. The laser repair device also includes: An aperture is located between the beam expander and the digital micromirror device, and blocks the periphery of the laser beam incident on the digital micromirror device.

6. The laser repair device according to claim 5, wherein, The aperture is configured to reduce the cross-sectional area of ​​the laser beam incident on the digital micromirror device by 50% to 80%.

7. The laser repair device according to claim 5, wherein, The intensity at the center is more than 86.5% of the maximum intensity of the laser beam incident on the digital micromirror device.

8. The laser repair device according to claim 1, wherein, The lens section includes objective lenses arranged adjacent to the object.

9. The laser repair device according to claim 8, wherein, The lens section includes a tubular lens located on the opposite side of the object, with the objective lens as a reference.

10. The laser repair device according to claim 1, wherein, Also includes: The camera captures images of the object and generates a photographic image.

Images