System and method for coupling a mid-wave infrared camera to a satellite platform thermal control configuration

CN122945320APending Publication Date: 2026-10-20SHANGHAI SATELLITE ENG INST
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Patent Information

Application Number
CN202610835642.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-06-10
Publication Date
2026-10-20

AI Technical Summary

Technical Problem

[0007]上述相关技术中,相机未布局在卫星平台内部利用卫星舱板进行散热,因此,需要提出一种技术方案以改善上述技术问题

Benefits of technology

1、本发明将相机布置在卫星平台内部,利用卫星舱板作为相机散热面,无需额外设计相机散热板、制冷机外贴热管及散热板支架,既降低了热控系统复杂度,又有效的减少了热控重量。

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides a thermal control coupling configuration system and method for a mid-wave infrared camera and a satellite platform. The system includes: a mid-wave infrared camera comprising a refrigerator and electronics, each with independent heat dissipation and operating temperature range; a satellite platform comprising a first satellite panel and a second satellite panel, respectively configured as heat dissipation surfaces for the refrigerator and electronics; pre-embedded heat pipes in the first satellite panel for dissipating heat from the refrigerator; pre-embedded heat pipes in the second satellite panel for dissipating heat from the electronics; and multi-layer thermal insulation components for covering non-installation areas. This invention utilizes the satellite panel as a heat dissipation surface for the camera's refrigerator and electronics, achieving a thermal control coupling design between the camera and the satellite platform. It eliminates the need for additional camera heat sinks, external heat pipes for the refrigerator, and heat sink supports. While meeting the thermal control requirements of different camera components, it reduces the complexity of the thermal control system and effectively reduces its weight.
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Description

Technical Field

[0001] This invention relates to the field of camera thermal control technology, specifically to a thermal control coupling configuration system and method for a mid-wave infrared camera and a satellite platform. Background Technology

[0002] As a crucial payload unit on a satellite, the operating temperature of the mid-wave infrared camera significantly impacts the accuracy of its radiometric measurements. During operation, the temperature of the refrigerator mounting surface needs to be controlled between -33°C and -28°C, while the electronics temperature needs to be controlled between -15°C and +30°C. The operating temperature ranges for the refrigerator and electronics differ, with the refrigerator's temperature requirements being particularly stringent. In the camera's thermal control design, to minimize mutual interference with the satellite platform's thermal design, the camera is typically mounted externally, insulated from the satellite module. This usually requires additional heat pipes, heat sinks, and mounting brackets to meet the temperature control needs of different parts of the camera; however, this approach demands substantial thermal control resources and is costly.

[0003] Patent document CN115291458B discloses an invention patent for a satellite-borne camera with multiple differential power consumption cooling units and a joint thermal control method and satellite, including: multiple differential power consumption coolers, external heat pipes, homogenized heat pipes, thermally conductive fillers, and a heat sink; the multiple differential power consumption coolers are disposed within the heat sink and connected to one end of the external heat pipes; the external heat pipes are inserted into the homogenized heat pipes. This document mainly solves the isothermal problem of multiple differential power consumption coolers.

[0004] Patent document CN102081281A discloses a multi-heat-source input heat pipe suitable for thermal control of space cameras, relating to the field of thermal control technology for space cameras. This document primarily addresses the problem in space camera thermal control where a single heat pipe cannot connect to multiple heat sources, leading to the need for multiple heat pipes to cool multiple thermal components, thus increasing the camera's weight and structural complexity.

[0005] Patent document CN104035264A discloses an integrated thermal control device for a small satellite and a space optical camera. The device includes multiple intersecting flexible connectors fixed to the sun-facing side of the space optical camera. These connectors employ a variable cross-section structure with intersecting spring notches. Multiple heat-insulating pads are placed one-to-one on the intersecting flexible connectors. A camera solar cell array is fixed together with the heat-insulating pads and the intersecting flexible connectors and is connected to the small satellite via cables. A multi-layered heat-insulating assembly is laid on the outer surface of the space optical camera and located between the camera solar cell array and the space optical camera. This document primarily addresses the issue of low power consumption for active thermal control of the camera provided by the small satellite.

[0006] Utility model patent CN200941653Y discloses a thermal control device for a CCD camera. This device includes a CCD camera, a camera heat pipe saddle, a heat sink, a heat pipe saddle, a heat pipe, an electric heating film, a sealing cover, a temperature relay, a camera support, and a sealing ring. The device transfers heat from the CCD camera to the heat sink via the heat pipe and uses a temperature relay to control the temperature of the electric heating film. It is primarily used to address the impact of excessive temperature fluctuations on image quality.

[0007] In the aforementioned technologies, the camera is not located inside the satellite platform and is not cooled by the satellite cabin panel. Therefore, a technical solution is needed to improve the above-mentioned technical problems. Summary of the Invention

[0008] To address the shortcomings of existing technologies, the purpose of this invention is to provide a thermal control coupling configuration system and method for a mid-wave infrared camera and a satellite platform.

[0009] A mid-wave infrared camera and satellite platform thermal control coupling configuration system according to the present invention includes: A mid-wave infrared camera includes a refrigerator and electronics; the refrigerator and electronics each have independent heat dissipation and operating temperature range. The satellite platform includes a first satellite panel and a second satellite panel, which are respectively configured as heat dissipation surfaces for the refrigerator and electronics; The first compartment has a pre-embedded heat pipe, which is embedded in the first satellite compartment and is directly heat-conductingly installed with the mid-wave infrared camera to dissipate the heat from the refrigerator. The second compartment has a pre-embedded heat pipe, which is embedded in the second satellite compartment and connected to the electronics via an external heat pipe for dissipating the heat of the electronics. Multi-layer thermal insulation components, including camera multi-layer thermal insulation components and first compartment multi-layer thermal insulation components; used to cover non-installation areas.

[0010] Preferably, the first and second satellite panels are aluminum skin with an aluminum honeycomb structure, and the outer surface is coated with thermally controlled white paint or attached with OSR sheets.

[0011] Preferably, the mounting base of the mid-wave infrared camera includes a camera cooling unit mounting surface, and multiple light-reducing grooves are opened at other locations besides the camera cooling unit mounting surface.

[0012] Preferably, the space between the camera cooling unit mounting surface and the contact surface of the first satellite module, the space between the external heat pipe and the electronic components, and the space between the external heat pipe and the second satellite module are all filled with thermally conductive filler.

[0013] Preferably, the pre-embedded heat pipes are tightly bonded to the aluminum skin on the upper and lower surfaces of the satellite cabin by applying thermally conductive adhesive, and the direction and length of the heat pipes are designed according to the required heat dissipation surface area.

[0014] Preferably, the fins on the non-mounting surface of the external heat pipe are removed to reduce the weight of the heat pipe, and after bending, it is fixed to the mounting surface of the electronics and the second satellite compartment with screws.

[0015] Preferably, heat insulation pads are added between the first satellite module and other connected modules, and the spacing between the pads is 120~180mm.

[0016] Preferably, the first satellite module is fixedly connected to other connected modules using titanium alloy screws with a preset thermal conductivity.

[0017] A method for thermal control coupling configuration of a mid-wave infrared camera and a satellite platform according to the present invention includes: Step S1: Calculate the required heat dissipation area of ​​the refrigerator and electronics based on the heat dissipation and operating temperature range of the mid-wave infrared camera. Step S2: Based on the calculation results, arrange the mid-wave infrared camera inside the satellite platform, select the first satellite panel as the heat dissipation surface of the refrigerator, and the second satellite panel as the heat dissipation surface of the electronics. Step S3: Install the mid-wave infrared camera directly to the first satellite module with thermal conductivity and pre-embed heat pipes in the first satellite module to diffuse the heat from the refrigerator; conduct the electronic heat to the second satellite module through external heat pipes and pre-embed heat pipes in the second satellite module to diffuse the electronic heat. Step S4: Insulate the first satellite module with the other connected modules and attach heating elements to the mid-wave infrared camera cooler and electronics for thermal compensation under low-temperature conditions, thus completing the thermal control coupling configuration.

[0018] Preferably, the non-installation area is covered with a multi-layer thermal insulation component to reduce heat exchange; the multi-layer thermal insulation component includes a camera multi-layer thermal insulation component and a first compartment multi-layer thermal insulation component.

[0019] Compared with the prior art, the present invention has the following beneficial effects: 1. This invention places the camera inside the satellite platform and uses the satellite cabin plate as the camera heat dissipation surface. There is no need to design an additional camera heat dissipation plate, external heat pipes for the refrigerator, and heat dissipation plate bracket. This reduces the complexity of the thermal control system and effectively reduces the weight of the thermal control system.

[0020] 2. The present invention utilizes the first satellite compartment plate and the second satellite compartment plate as heat dissipation surfaces for the refrigerator and electronic components, respectively, thereby meeting the heat dissipation requirements of the camera refrigerator and electronic components during long-term operation, and achieving thermal compensation of components under low-temperature conditions through heaters.

[0021] 3. The invention effectively improves the heat dissipation efficiency of the cabin by rationally arranging the pre-embedded heat pipes; the camera and satellite cabins adopt multi-layer heat insulation components, low thermal conductivity heat insulation pads and titanium alloy screws, which reduces the impact of external heat leakage and creates favorable conditions for the low-temperature working environment of the refrigeration unit. Attached Figure Description

[0022] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the thermal control coupling configuration between the mid-wave infrared camera and the satellite platform in this invention.

[0023] Figure 2 This is a flowchart of the present invention.

[0024] Explanation of reference numerals in the attached figures Detailed Implementation

[0025] The present invention will now be described in detail with reference to specific embodiments. These embodiments will help those skilled in the art to further understand the present invention, but do not limit the invention in any way. It should be noted that those skilled in the art can make several changes and improvements without departing from the concept of the present invention. These all fall within the scope of protection of the present invention.

[0026] like Figure 1 As shown, a mid-wave infrared camera and satellite platform thermal control coupling configuration system includes: The mid-wave infrared camera 2 includes a refrigerator and electronics; the refrigerator and electronics each have independent heat dissipation and operating temperature range. Satellite platform 1 includes a first satellite panel 5 and a second satellite panel 6, which are respectively configured as heat dissipation surfaces for the refrigerator and electronics; The first compartment panel has a pre-embedded heat pipe 7, which is embedded in the first satellite compartment panel 5 and is directly heat-conductingly installed with the mid-wave infrared camera 2 to diffuse the heat of the refrigerator. The second compartment has a pre-embedded heat pipe 8, which is embedded in the second satellite compartment 6 and connected to the electronics through an external heat pipe 4, for dissipating the heat of the electronics; Multi-layer thermal insulation components, including camera multi-layer thermal insulation component 9 and first compartment multi-layer thermal insulation component 10, are used to cover non-installation areas.

[0027] Among them, the first satellite panel 5 and the second satellite panel 6 are aluminum skin + aluminum honeycomb structures, and the outer surface is sprayed with low absorptivity and high emissivity thermal control white paint or pasted with OSR sheet. The camera cooling unit mounting surface 3 is located on the camera mounting base plate. In addition to the camera cooling unit mounting surface 3, multiple light-reducing grooves are opened on the other parts of the base plate. Thermally conductive filler is used to fill the space between the camera cooling unit mounting surface 3 and the first satellite compartment 5, between the external heat pipe 4 and the electronic components, and between the external heat pipe 4 and the second satellite compartment 6. The pre-embedded heat pipes are tightly bonded to the aluminum skin on the upper and lower surfaces of the cabin plate with thermally conductive adhesive. The direction and length of the heat pipes are designed according to the required heat dissipation surface area. External heat pipe 4 has its fins removed from the non-mounting surface to reduce its weight. After bending, it is fastened to the mounting surface of electronics and second satellite compartment 6 with screws. A 20mm×20mm×10mm low thermal conductivity epoxy fiberglass insulation pad 11 is added between the first satellite compartment 5 and other connected compartments, with a spacing of 120~180mm between the pads. The first satellite module 5 is fixedly connected to other connected modules using titanium alloy screws with low thermal conductivity.

[0028] like Figure 2 As shown, a design method for thermal control coupling between a mid-wave infrared camera and a satellite platform includes the following steps: Step 1: Calculate the required heat dissipation area of ​​the refrigerator and electronics based on the heat dissipation and operating temperature range of the mid-wave infrared camera 2. Step 2: Arrange the mid-wave infrared camera 2 inside the satellite platform 1, select the first satellite compartment 5 as the heat dissipation surface of the refrigerator and the second satellite compartment 6 as the heat dissipation surface of the electronics, and carry out thermal control coupling design with the satellite platform 1. Step 3: Install the mid-wave infrared camera 2 directly to the first satellite compartment 5 with thermal conductivity, and pre-embed a heat pipe below the refrigerator mounting surface inside the first satellite compartment 5 to facilitate the rapid diffusion of heat from the refrigerator to the heat dissipation surface of the first satellite compartment 5; install an external heat pipe 4 on the electronic surface, with the other end of the heat pipe thermally connected to the second satellite compartment 6, so that the heat from the electronics can be quickly conducted to the second satellite compartment 6 through the external heat pipe 4, and pre-embed a heat pipe below the external heat pipe 4 inside the second satellite compartment 6 to facilitate the rapid diffusion of heat from the electronics to the heat dissipation surface of the second satellite compartment 6; Step 4: The exposed surface of the mid-wave infrared camera 2 and the inner surface of the first satellite compartment panel 5, except for the camera installation area, are covered with multiple layers of heat insulation components to reduce heat exchange between the camera and other components inside the compartment. Step 5: The first satellite panel 5 is insulated from other connected panels to reduce the impact of heat leakage from other panels; Step 6: Attach heating elements to the refrigerator and electronics of the mid-wave infrared camera 2 for thermal compensation under low-temperature conditions.

[0029] Example 1 A design method for thermal control coupling between a mid-wave infrared camera and a satellite platform includes the following steps: Step 1: Calculate the required heat dissipation area of ​​the refrigerator and electronics based on the heat dissipation and operating temperature range of the mid-wave infrared camera 2. Step 2: Arrange the mid-wave infrared camera 2 inside the satellite platform 1, select the first satellite panel 5 as the heat dissipation surface of the refrigerator and the second satellite panel 6 as the heat dissipation surface of the electronics, and carry out thermal control coupling design with the satellite platform 1; wherein, the first satellite panel 5 and the second satellite panel 6 are aluminum skin + aluminum honeycomb structure, and the outer surface is sprayed with low absorptivity and high emissivity thermal control white paint or pasted OSR sheet. Step 3: The mid-wave infrared camera 2 is directly thermally mounted to the first satellite compartment 5, and a heat pipe is pre-embedded below the cooling unit mounting surface inside the first satellite compartment 5 to facilitate the rapid dissipation of heat from the cooling unit to the heat dissipation surface of the first satellite compartment 5; an external heat pipe 4 is installed on the electronic surface, with the other end of the external heat pipe 4 thermally connected to the second satellite compartment 6, allowing the electronic heat to be rapidly conducted to the second satellite compartment 6; a heat pipe is pre-embedded below the external heat pipe 4 inside the second satellite compartment 6 to facilitate the rapid dissipation of electronic heat to the heat dissipation surface of the second satellite compartment 6; the camera cooling unit mounting surface 3 is located on the camera mounting base plate. Except for the camera cooling unit mounting surface 3, multiple weight-reducing grooves are cut into the base plate to reduce the weight of the camera. Thermally conductive filler is filled between the camera cooling unit mounting surface 3 and the first satellite compartment 5, between the external heat pipe 4 and the electronics, and between the external heat pipe 4 and the second satellite compartment 6 to reduce contact thermal resistance. Thermally conductive adhesive is applied between the pre-embedded heat pipe and the aluminum skin on the upper and lower surfaces of the compartment to ensure tight adhesion. The heat pipe routing and length are designed according to the required heat dissipation surface area. The fins of the external heat pipe 4 are removed from the non-mounting surface to reduce the weight of the heat pipe. After bending, it is fastened to the mounting surfaces of the electronics and the second satellite compartment 6 with screws. Step 4: The exposed surface of the mid-wave infrared camera 2 and the inner surface of the first satellite compartment panel 5, except for the camera installation area, are covered with multiple layers of heat insulation components to reduce heat exchange between the camera and other components inside the compartment. Step 5: The first satellite panel 5 is insulated from other connected panels to reduce the heat leakage from other panels; 20mm×20mm×10mm low thermal conductivity epoxy fiberglass insulation pads 11 are added between the first satellite panel 5 and other connected panels, with a spacing of 120~180mm between the pads; the first satellite panel 5 and other connected panels are fixedly connected using low thermal conductivity titanium alloy screws. Step 6: Attach heating elements to the refrigerator and electronics of the mid-wave infrared camera 2 for thermal compensation under low-temperature conditions.

[0030] After the satellite enters orbit, this thermal control coupling system operates automatically based on the principle of thermodynamic transfer, achieving precise temperature control of various camera components. The system operates according to the basic thermal control principle of "heat generation → conduction and diffusion → radiation heat dissipation → temperature regulation," with the specific operating mechanism as follows: When the camera starts working, the heat generated by the refrigerator is directly conducted to the first satellite module 5 through the camera refrigerator mounting surface 3. Simultaneously, the pre-embedded heat pipes 7 on the first module rapidly diffuse the locally concentrated heat to the entire surface of the first satellite module 5, and finally, the heat is radiated to deep space through the outer surface of the first satellite module 5, ensuring that the refrigerator temperature does not exceed the upper limit of its operating temperature. The heat generated by the electronic components during operation is first conducted to the external heat pipes 4, then transferred to the second satellite module 6, and then diffused to the entire surface of the second satellite module 6 by the pre-embedded heat pipes 8. Finally, the heat is radiated to deep space through the outer surface of the second satellite module 6, ensuring that the electronic temperature does not exceed the upper limit of its operating temperature. When the satellite enters the shadow area or the temperature of the heat dissipation surface is too low, the temperature sensor detects that the temperature of the refrigerator or electronics is lower than the set temperature control threshold. The control system automatically activates the heater in the corresponding position to directly perform thermal compensation on the refrigerator and electronics to ensure that the temperature is not lower than the lower limit of the operating temperature.

[0031] Specifically, the required heat dissipation area for the refrigerator and electronics of the mid-wave infrared camera 2, as well as the direction and length of the pre-embedded heat pipes, need to be calculated based on the heat consumption and operating temperature range of the refrigerator and electronics, respectively. The first satellite compartment panel 5 is selected as the heat dissipation surface for the refrigerator, and the second satellite compartment panel 6 is selected as the heat dissipation surface for the electronics. The mid-wave infrared camera 2 is placed inside the compartment and directly thermally connected to the first satellite compartment panel 5. The heat from the refrigerator is rapidly transferred to the heat dissipation surface of the first satellite compartment panel 5 through the camera refrigerator mounting surface 3, and the heat from the electronics is rapidly transferred to the heat dissipation surface of the second satellite compartment panel 6 through the external heat pipes 4, which are fixed with screws. Thermally conductive fillers are filled between the contact surfaces of the camera refrigerator mounting surface 3 and the first satellite compartment panel 5, between the contact surfaces of the external heat pipes 4 and the electronics, and between the contact surfaces of the external heat pipes 4 and the second satellite compartment panel 6 to reduce contact thermal resistance. The pre-embedded heat pipes inside the first and second satellite compartment panels 5 and 6 can rapidly diffuse heat to the compartment. The heat dissipation surface of the plate achieves the purpose of heat dissipation for the refrigerator and electronics. Multiple layers of heat insulation components are wrapped around the exposed surface of the camera and the inner surface of the first satellite compartment 5, except for the camera mounting area, to reduce heat exchange between the camera and other components inside the compartment. These multiple layers of heat insulation components include a camera multi-layer heat insulation component 9 and a first compartment multi-layer heat insulation component 10. The camera multi-layer heat insulation component 9 is used to cover the exposed surface of the mid-wave infrared camera 2. The first compartment multi-layer heat insulation component 10 is used to cover the inner surface of the first satellite compartment 5, except for the mounting area of ​​the mid-wave infrared camera 2. A 20mm × 20mm × 10mm low thermal conductivity epoxy fiberglass heat insulation pad 11 is added between the first satellite compartment 5 and other connected compartments, and fixed with low thermal conductivity titanium alloy screws to reduce heat leakage from other compartments. To improve the heating efficiency of the heater under low-temperature conditions, silicone rubber is used to directly adhere the heating element to the refrigerator and electronics surfaces.

[0032] The heat dissipation surfaces of the first satellite compartment 5 and the second satellite compartment 6 adopt an aluminum skin + aluminum honeycomb lightweight structure. This structure has high heat transfer efficiency, is easy to embed heat pipes, and is lightweight, while meeting mechanical requirements. The size of the heat dissipation surface and the outer surface thermal control coating are selected according to the calculation results. The thermal control coating of the heat dissipation surface is generally a low absorptivity, high emissivity thermal control white paint or an OSR sheet.

[0033] To ensure camera mounting accuracy, the camera cooler mounting surface 3 and the camera mounting feet protrude approximately 0.5mm beyond the rest of the camera mounting base. Multiple weight-reducing grooves can be cut into the camera mounting base, except for the camera cooler mounting surface 3, to reduce camera weight. The area of ​​the cooler mounting surface 3 can be calculated using the following formula:

[0034] In the formula, A represents the area of ​​the refrigeration unit's mounting surface (m²). 2Q represents the heat consumption of the refrigeration unit, in W; h represents the heat transfer coefficient between the refrigeration unit mounting surface 3 and the first satellite module 5, in W / (m²). 2 ·k); t1 is the temperature of the refrigeration unit mounting surface 3, in °C; t2 is the temperature of the first satellite module 5, in °C.

[0035] To reduce contact thermal resistance and ensure heat conduction, the thermally conductive filler between the contact surfaces is RKTL-DRZ-1 thermally conductive silicone grease.

[0036] The selected embedded heat pipes should ensure a tight fit between the upper and lower aluminum skin surfaces of the compartment plate, reducing thermal resistance along the heat transfer path and enhancing heat dissipation efficiency. The routing and length of the embedded heat pipes should be designed according to the heat dissipation and operating temperature specifications, and the fins at the bends of the heat pipes should be removed. One end of the external heat pipe 4 overlaps with the electronic components, and the other end overlaps with the embedded heat pipe 8 of the second compartment plate. The fins on the non-mounting surfaces of the external heat pipe 4 should be removed to reduce the weight of the thermal control system without affecting heat transfer.

[0037] By directly attaching heating elements to the surfaces of the refrigerator and electronics using silicone rubber, efficient thermal compensation is achieved under low-temperature conditions, enabling temperature control of the refrigerator and electronics.

[0038] Those skilled in the art will understand that, besides implementing the system and its various devices, modules, and units provided by this invention in the form of purely computer-readable program code, the same functions can be achieved entirely through logical programming of the method steps, making the system and its various devices, modules, and units of this invention function in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers. Therefore, the system and its various devices, modules, and units provided by this invention can be considered as a hardware component, and the devices, modules, and units included therein for implementing various functions can also be considered as structures within the hardware component; alternatively, the devices, modules, and units for implementing various functions can be considered as both software modules implementing the method and structures within the hardware component.

[0039] Specific embodiments of the present invention have been described above. It should be understood that the present invention is not limited to the specific embodiments described above, and those skilled in the art can make various changes or modifications within the scope of the claims, which do not affect the essence of the present invention. Unless otherwise specified, the embodiments and features described in this application can be arbitrarily combined with each other.

Claims

1. A mid-wave infrared camera and satellite platform thermal control coupling configuration system, characterized in that, include: A mid-wave infrared camera (2) includes a refrigerator and electronics; the refrigerator and electronics each have independent heat dissipation and operating temperature range; The satellite platform (1) includes a first satellite panel (5) and a second satellite panel (6), which are respectively configured as heat dissipation surfaces for the refrigerator and electronics; The first compartment has a pre-embedded heat pipe (7), which is pre-embedded in the first satellite compartment (5) and is directly heat-conducted with the mid-wave infrared camera (2) for dissipating the heat of the refrigerator. The second compartment has a pre-embedded heat pipe (8), which is embedded in the second satellite compartment (6) and connected to the electronics through an external heat pipe (4) for dissipating the heat of the electronics; Multi-layer thermal insulation assembly, including camera multi-layer thermal insulation assembly (9) and first compartment multi-layer thermal insulation assembly (10); Used to cover areas that are not installed.

2. The mid-wave infrared camera and satellite platform thermal control coupling configuration system according to claim 1, characterized in that, The first satellite panel (5) and the second satellite panel (6) are aluminum skin plus aluminum honeycomb structure, and the outer surface is sprayed with thermal control white paint or pasted with OSR sheet.

3. The mid-wave infrared camera and satellite platform thermal control coupling configuration system according to claim 1, characterized in that, The mounting base of the mid-wave infrared camera (2) includes the camera cooler mounting surface (3), and multiple light-reducing grooves are opened in other positions except for the camera cooler mounting surface (3).

4. The mid-wave infrared camera and satellite platform thermal control coupling configuration system according to claim 1, characterized in that, Thermally conductive filler is used to fill the contact surfaces between the camera cooling unit mounting surface (3) and the first satellite compartment panel (5), between the external heat pipe (4) and the electronic components, and between the external heat pipe (4) and the second satellite compartment panel (6).

5. The mid-wave infrared camera and satellite platform thermal control coupling configuration system according to claim 2, characterized in that, The pre-embedded heat pipes are tightly bonded to the aluminum skin on the upper and lower surfaces of the satellite cabin by applying thermally conductive adhesive, and the direction and length of the heat pipes are designed according to the required heat dissipation surface area.

6. The mid-wave infrared camera and satellite platform thermal control coupling configuration system according to claim 1, characterized in that, The external heat pipe (4) has its fins removed from the non-mounting surface to reduce its weight. After bending, it is fixed to the mounting surface of the electronics and second satellite compartment (6) with screws.

7. The mid-wave infrared camera and satellite platform thermal control coupling configuration system according to claim 1, characterized in that, Insulation pads (11) are added between the first satellite panel (5) and other connected panels, and the spacing between the pads is 120~180mm.

8. The mid-wave infrared camera and satellite platform thermal control coupling configuration system according to claim 1, characterized in that, The first satellite module (5) is fixedly connected to other connected modules using titanium alloy screws with a preset thermal conductivity.

9. A method for thermal control coupling configuration of a mid-wave infrared camera and a satellite platform, employing the thermal control coupling configuration system of the mid-wave infrared camera and satellite platform as described in any one of claims 1-8, characterized in that, include: Step S1: Calculate the required heat dissipation area of ​​the refrigerator and electronics based on the heat dissipation and operating temperature range of the mid-wave infrared camera (2); Step S2: Based on the calculation results, arrange the mid-wave infrared camera (2) inside the satellite platform (1), select the first satellite panel (5) as the heat dissipation surface of the refrigerator, and the second satellite panel (6) as the heat dissipation surface of the electronics; Step S3: Install the mid-wave infrared camera (2) directly to the first satellite compartment (5) with heat conduction and pre-embed the first compartment heat pipe (7) in the first satellite compartment (5) to diffuse the heat of the refrigerator; conduct the electronic heat to the second satellite compartment (6) through the external heat pipe (4) and pre-embed the second compartment heat pipe (8) in the second satellite compartment (6) to diffuse the electronic heat; Step S4: Insulate the first satellite module (5) with other connected modules and attach heating pads to the refrigerator and electronics of the mid-wave infrared camera (2) for thermal compensation under low temperature conditions, thus completing the thermal control coupling configuration.

10. The method for thermal control coupling configuration of a mid-wave infrared camera and a satellite platform according to claim 9, characterized in that, The non-installation area is covered with a multi-layer thermal insulation assembly to reduce heat exchange; the multi-layer thermal insulation assembly includes a camera multi-layer thermal insulation assembly (9) and a first compartment multi-layer thermal insulation assembly (10).

Citation Information

Patent Citations

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