Touchpad device

Abstract

A touchpad device includes a protective layer, a multilayer touch circuit board, an adhesive layer, and a pressure sensing element. The adhesive layer is disposed between the protective layer and the multilayer touch circuit board. The pressure sensing element is disposed on the multilayer touch circuit board. One layer of the multilayer touch circuit board or the adhesive layer is configured as a heterogeneous material and includes high-deformation regions and low-deformation regions. The pressure sensing element is adjacent to or at least partially overlaps with the vertical projection range of the high-deformation regions. This ensures that the pressure sensing element can effectively capture deformation (i.e., improve sensitivity), thereby achieving more accurate pressure detection.

Description

Technical Field

[0001] This disclosure relates to a touchpad device. Background Technology

[0002] The current development trend of touchpad devices is from simple touch functionality to the integration of touch, force sensing, and haptic feedback. A conventional touchpad device places a force sensor on an elastic member (e.g., a metal bracket) and fixes the elastic member to a touch circuit board, as illustrated in Chinese Patent Application Publication No. 107025017B. However, this conventional technology has disadvantages such as a large number of components, complex assembly process, high overall cost, and large overall thickness.

[0003] Therefore, how to propose a touchpad device that can solve the above problems is one of the issues that the industry is currently eager to invest research and development resources to address. Summary of the Invention

[0004] In view of this, one objective of this disclosure is to provide a touchpad device that can solve the above-mentioned problems.

[0005] To achieve the above objectives, according to one embodiment of this disclosure, a touchpad device includes a protective layer, a multilayer touch circuit board, an adhesive layer, and a pressure sensing element. The adhesive layer is disposed between the protective layer and the multilayer touch circuit board. The pressure sensing element is disposed on the multilayer touch circuit board. One layer of the multilayer touch circuit board or the adhesive layer is configured as a heterogeneous material and includes high-deformation regions and low-deformation regions. The pressure sensing element is adjacent to or at least partially overlaps with the vertical projection range of the high-deformation regions.

[0006] In one or more embodiments disclosed herein, the adhesive layer includes a high-deformation region. The high-deformation region is a through-hole.

[0007] In one or more embodiments disclosed herein, the pressure sensing element is a strain gauge. The pressure sensing element is disposed on the side of the multilayer touch circuit board away from the protective layer.

[0008] In one or more embodiments disclosed herein, the multilayer touch circuit board includes a first circuit board stack, a second circuit board stack, and a bonding layer. The first circuit board stack is disposed on the side of the bonding layer away from the protective layer. The second circuit board stack is located on the side of the first circuit board stack away from the bonding layer. The bonding layer is bonded between the first circuit board stack and the second circuit board stack and includes a high-deformation region.

[0009] In one or more embodiments disclosed herein, the pressure sensing element is a strain gauge. The pressure sensing element is disposed on the side of the multilayer touch circuit board away from the protective layer.

[0010] In one or more embodiments disclosed herein, the equivalent hardness of the combination of the protective layer, the adhesive layer and the first circuit board stack is greater than the equivalent hardness of the second circuit board stack.

[0011] In one or more embodiments disclosed herein, the bonding layer is made of polypropylene. The thickness of the bonding layer is from 50 μm to 500 μm.

[0012] In one or more embodiments disclosed herein, the high-deformation region is a through-hole.

[0013] In one or more embodiments disclosed herein, the pressure sensing element is a self-capacitive force sensor. The pressure sensing element is disposed within a multilayer touch circuit board.

[0014] In one or more embodiments disclosed herein, a pressure sensing element is disposed on a second circuit board stack. The first circuit board stack includes a metal layer. The pressure sensing element is configured to sense the capacitance value between the pressure sensing element and the metal layer.

[0015] In one or more embodiments disclosed herein, the equivalent hardness of the combination of the protective layer, the adhesive layer and the first circuit board stack is greater than the equivalent hardness of the second circuit board stack.

[0016] In one or more embodiments disclosed herein, the bonding layer is made of polypropylene. The thickness of the bonding layer is from 50 μm to 500 μm.

[0017] In one or more embodiments disclosed herein, the high-deformation region is a through-hole.

[0018] In one or more embodiments disclosed herein, the touchpad device further includes a metal support and an elastic element. The metal support is located on the side of the multilayer touch circuit board away from the protective layer. The elastic element is disposed between the multilayer touch circuit board and the metal support. A pressure sensing element is configured to sense the capacitance value between the pressure sensing element and the metal support.

[0019] In one or more embodiments disclosed herein, the elastic element is located within the vertical projection range of the high deformation region.

[0020] In summary, in the touchpad device disclosed herein, by making the pressure sensing element adjacent to or at least partially overlapping the vertical projection range of a high-deformation region of one layer or adhesive layer in a multilayer touch circuit board, it is ensured that the pressure sensing element can effectively capture deformation (i.e., improve sensitivity), thereby achieving more accurate pressure detection. By placing the high-deformation region in the bonding layer between the first and second circuit board stacks, the location and degree of deformation can be more precisely controlled, thereby optimizing pressure sensing performance. By making the equivalent hardness of the combination of the protective layer, adhesive layer, and first circuit board stack greater than the equivalent hardness of the second circuit board stack, it is ensured that pressure is mainly concentrated in the high-deformation region. By placing the pressure sensing element within the multilayer touch circuit board, in addition to simplifying circuit design, interference from the external environment can be reduced, thereby improving sensing reliability. By placing the elastic element within the vertical projection range of the high-deformation region, the touchpad device can have better deformation to vertical vibration, thereby enhancing the vertical vibration sensing effect.

[0021] The above description is only used to illustrate the problem to be solved by this disclosure, the technical means to solve the problem, and the effects produced, etc. The specific details of this disclosure will be described in detail in the following implementation method and related drawings. Attached Figure Description

[0022] To make the above and other objects, features, advantages and embodiments disclosed herein more apparent and understandable, the accompanying drawings are described below:

[0023] Figure 1 A schematic diagram illustrating an electronic device according to an embodiment of this disclosure;

[0024] Figure 2 For illustration Figure 1 A cross-sectional schematic diagram of the touchpad device in the diagram;

[0025] Figure 3 For illustration Figure 2 A top view of some components of the touchpad device;

[0026] Figure 4 For illustration Figure 2 A schematic diagram of the touch electrode layer of the touch sensing element in the image;

[0027] Figure 5 For illustration Figure 4 A partial enlarged view of the first touch electrode layer in the image;

[0028] Figure 6 For illustration Figure 4 Another enlarged view of the first touch electrode layer in the image;

[0029] Figure 7To illustrate a functional block diagram of a touch sensing element according to an embodiment of this disclosure;

[0030] Figure 8 For illustration Figure 2 A cross-sectional view of the circuit board in the diagram;

[0031] Figure 9 To illustrate a top view of a coil layer and magnet assembly according to an embodiment of this disclosure;

[0032] Figure 10 To illustrate a top view of a coil layer and magnet assembly according to another embodiment of this disclosure;

[0033] Figure 11A For illustration Figure 2 Region M in the comparison example is shown in the enlarged view.

[0034] Figure 11B For illustration Figure 2 Region M in the second embodiment is shown in an enlarged view.

[0035] Figure 11C For illustration Figure 2 Region M in the third embodiment is shown in an enlarged view.

[0036] Figure 11D For illustration Figure 2 Region M in the fourth embodiment is shown in an enlarged view.

[0037] Figure 12 To illustrate the pressure output signal diagrams of the touchpad devices designed using the comparative example, the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment, respectively;

[0038] Figure 13A , Figure 13B , Figure 13C as well as Figure 13D Cross-sectional schematic diagrams of the touchpad devices according to different embodiments of the present disclosure are shown respectively;

[0039] Figure 14A , Figure 14B , Figure 14C as well as Figure 14D Cross-sectional schematic diagrams of the touchpad devices according to different embodiments of the present disclosure are shown respectively;

[0040] Figure 15 This is a cross-sectional schematic diagram illustrating one embodiment of the touchpad device disclosed herein.

[0041] [Symbol Explanation]

[0042] 100: Electronic devices

[0043] 110: Host

[0044] 111: Shell section

[0045] 111a: Groove

[0046] 120: Monitor

[0047] 200, 300A, 300B, 300C, 300D, 400A, 400B, 400C, 400D, 500: Touchpad device

[0048] 210: Protective layer

[0049] 210a: Junction area

[0050] 210b: Non-junction region

[0051] 220, 320, 320A, 320B, 320C, 420, 420A, 420B, 420C, 520: Multilayer touch circuit boards

[0052] 221, 321b, 321b': Touch sensing element

[0053] 221a, 321b1: First touch electrode layer

[0054] 221b, 321b2: Second touch electrode layer

[0055] 221c: Processing Unit

[0056] 222, 322b, 422b, 522b: Coil layer

[0057] 222a: First coil unit

[0058] 222a1,222a2,222b1,222b2: Straight bundle segments

[0059] 222b: Second coil unit

[0060] 223,321d: Shielding layer

[0061] 224, 321c, 321f, 322c: Insulation layer

[0062] 225, 321a, 322a: Solder mask layer

[0063] 226: Nickel layer

[0064] 227: Gold Layer

[0065] 228: Overlay

[0066] 230: Adhesive layer

[0067] 231,323a: High deformation region

[0068] 232,323b: Low deformation region

[0069] 240, 440, 441: Pressure sensing element

[0070] 250, 350: Magnet assembly

[0071] 251,351: First magnet

[0072] 252,352: Second magnet

[0073] 253: The Third Magnet

[0074] 260: Support component

[0075] 270: Elastic component

[0076] 321, 321A, 321B: First circuit board stack

[0077] 322, 322A, 422, 422A, 522: Second circuit board stack

[0078] 321g, 322d, 422d: Metal layer

[0079] 321e, 323: Bonding layer

[0080] 540: Grounding Unit

[0081] A1: First sensing area

[0082] A2: Second sensing area

[0083] D: Arrangement direction

[0084] G: Gap

[0085] M: Region

[0086] P: Line spacing

[0087] S1, S2: Distance

[0088] T: Thickness

[0089] VP: Vertical projection range

[0090] W: Width Detailed Implementation

[0091] The following describes several embodiments of this disclosure with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is, in some embodiments of this disclosure, these practical details are not essential. Furthermore, for the sake of simplicity in the drawings, some conventional structures and elements will be shown in a simple schematic manner.

[0092] Please refer to Figure 1 This is a schematic diagram illustrating an electronic device 100 according to an embodiment of the present disclosure. Figure 1 As shown, in this embodiment, the electronic device 100 includes a main unit 110, a display 120, and a touchpad device 200. The touchpad device 200 is disposed within the main unit 110 and exposed by a recess 111a in the housing portion 111 of the main unit 110. The touchpad device 200 is an input device disposed on the main unit 110, but this disclosure is not limited thereto. Furthermore, the touchpad device 200 has a rectangular area composed of length and width, and the left and right width W can be extended according to different models (e.g., ...). Figure 1 The elongated shape shown in the image is not sized according to... Figure 1 The length shown is limited. In practical applications, the touchpad device 200 can also be an electronic product that uses a touchpad as an input or operation interface (e.g., a personal digital assistant, a keyboard with a touchpad, etc.). In other words, the concept of the touchpad device 200 disclosed herein can be applied to any electronic product that uses a touchpad as an input or operation interface. The structure, function, and connection and operation relationship between some of the components included in the touchpad device 200 will be described in detail below.

[0093] Please refer to Figure 2 It is a drawing Figure 1 A cross-sectional view of the touchpad device 200. (See diagram below.) Figure 2 As shown, in this embodiment, the touchpad device 200 includes a protective layer 210, a multilayer touch circuit board 220, an adhesive layer 230, a plurality of pressure sensing elements 240, and a plurality of elastic elements 270. The protective layer 210 has a bonding area 210a and a non-bonding area 210b. The adhesive layer 230 is disposed between the protective layer 210 and the multilayer touch circuit board 220, and has a low-deformation region 232 corresponding to the bonding area 210a and a plurality of high-deformation regions 231 corresponding to the non-bonding area 210b. The multilayer touch circuit board 220 is disposed on the side of the adhesive layer 230 away from the protective layer 210, and includes touch sensing elements 221 (visible). Figure 7The multilayer touch circuit board 220 and the coil layer 222 are also included. A pressure sensing element 240 is disposed on the multilayer touch circuit board 220. The touch panel device 200 further includes a support member 260 and a magnet assembly 250 disposed on the support member 260. The support member 260 is fixed to the bottom surface of a recess 111a in the housing portion 111 (e.g., by screws), wherein the recess 111a in the housing portion 111 is located on the outer surface of the housing portion 111. An elastic member 270 is disposed between the multilayer touch circuit board 220 and the support member 260. The magnet assembly 250 disposed on the support member 260 and the coil layer 222 disposed on the multilayer touch circuit board 220 constitute a vibration module. The elastic member 270 is configured to reduce vibration noise and effectively release vertical vibration stress.

[0094] For example, the bonding area 210a of the protective layer 210 may be defined by the area where the bottom surface of the protective layer 210 is bonded to the low deformation area 232 of the adhesive layer 230, while the non-bonding area 210b of the protective layer 210 may be defined by the area where the bottom surface of the protective layer 210 is not bonded to the low deformation area 232 of the adhesive layer 230 (i.e., corresponding to the high deformation area 231), but this disclosure is not limited thereto.

[0095] Please refer to Figure 3 It is a drawing Figure 2 A top view of some components of the touchpad device 200. (See attached image.) Figure 2 and Figure 3 As shown, in this embodiment, the high-deformation region 231 is a through slot, but this disclosure is not limited thereto. Specifically, the pressure sensing element 240 is located within the vertical projection range VP of the high-deformation region 231. The vertical projection range VP of the high-deformation region 231 can be defined, for example, by the projection of the high-deformation region 231 onto the alignment direction D of the protective layer 210 and the adhesive layer 230, but this disclosure is not limited thereto. This ensures that the pressure sensing element 240 can effectively capture deformation (i.e., improve sensitivity), thereby achieving more accurate pressure detection.

[0096] Furthermore, the elastic element 270 is located within the vertical projection range VP of the high deformation region 231 in the arrangement direction D of the protective layer 210 and the adhesive layer 230. By providing the high deformation region 231 on the adhesive layer 230 disposed between the protective layer 210 and the multilayer touch circuit board 220, and by making the elastic element 270, which serves as a fulcrum, correspond to the high deformation region 231 in the arrangement direction D of the protective layer 210 and the adhesive layer 230, the touch panel device 200 can have better deformation for vertical vibration, thereby achieving the effect of enhancing vertical vibration feedback.

[0097] In some embodiments, the material of the adhesive layer 230 includes pressure-sensitive adhesive (PSA), but this disclosure is not limited thereto.

[0098] In some implementations, such as Figure 2 As shown, the adhesive layer 230 has a thickness T of approximately 50 μm to approximately 500 μm. If the thickness T of the adhesive layer 230 is less than 50 μm, it cannot provide sufficient compression when the user presses the protective layer 210. If the thickness T of the adhesive layer 230 is greater than 500 μm, it will affect the touch sensing element 221 (visible). Figure 7 The generation of the detection capacitor signal.

[0099] In some embodiments, the Young's modulus of the elastic element 270 is in the range of 0.55 MPa to 0.8 MPa. An elastic element 270 having a Young's modulus within the aforementioned range can effectively reduce vibration noise and effectively release vertical vibration stress.

[0100] In some embodiments, the material of the elastic element 270 may be silicone, but this disclosure is not limited thereto.

[0101] In some embodiments, the support 260 is a silicon steel sheet. The silicon steel sheet has a magnetic conductivity, which constrains the dispersion of the magnetic field, making the magnetic field more concentrated, thereby making the magnetic field lines more concentrated within the same range.

[0102] like Figure 3 As shown, in this embodiment, one of the high deformation regions 231 (e.g., the upper high deformation region 231) is adjacent to the edge of the adhesive layer 230 (e.g., the upper edge of the adhesive layer 230) and is separated by a distance S1, and the distance S1 is greater than approximately 2 mm. By limiting the distance S1 from the high deformation region 231 to the adjacent edge of the adhesive layer 230 as described above, the problem of the adhesive layer 230 failing to adhere to the protective layer 210 can be avoided. Furthermore, Figure 3 The upper high deformation region 231 in the middle and the right or left edge of the adhesive layer 230 can also be separated from the aforementioned distance S1. Figure 3 The lower high deformation region 231 in the middle can also be separated from the lower edge, left edge or right edge of the adhesive layer 230 by the aforementioned distance S1.

[0103] like Figure 3 As shown, in this embodiment, one of the high deformation regions 231 (e.g., the upper high deformation region 231) has a width W. The width W is greater than approximately 10 mm. By limiting the width W of the high deformation region 231 to the aforementioned range, the problem of insufficient deformation of the adhesive layer 230 during vibration can be avoided. Specifically, the high deformation region 231 is elongated, and the aforementioned width W is the smaller lateral dimension of the high deformation region 231. In contrast, the larger lateral dimension of the high deformation region 231 is its length. Figure 3 The lower high deformation region 231 in the middle can also have the aforementioned width W.

[0104] Please refer to Figure 4 , Figure 5 as well as Figure 6 . Figure 4 For illustration Figure 2 A schematic diagram of the touch electrode layer of the touch sensing element 221 in the diagram. Figure 5 For illustration Figure 4 A partial enlarged view of the first touch electrode layer 221a in the image. Figure 6 For illustration Figure 4 Another enlarged view of the first touch electrode layer 221a in the image. (See image below.) Figures 4 to 6 As shown, in this embodiment, the touch sensing element 221 includes a first touch electrode layer 221a. The first touch electrode layer 221a has a first sensing area A1 and a second sensing area A2. The first sensing area A1 and the second sensing area A2 are arranged in the same direction D (see reference). Figure 2 The second sensing area A2 corresponds to the bonding area 210a and the non-bonding area 210b, respectively (that is, the second sensing area A2 corresponds to the high deformation area 231). The line width of the second sensing area A2 is greater than the line width of the first sensing area A1.

[0105] It should be noted that, according to Gauss's law, capacitance is proportional to the permittivity of the dielectric. Therefore, when a user touches the protective layer 210, the touch sensing element 221 will detect a difference in capacitance signals between the bonding area 210a and the non-bonded area 210b (because the permittivity of the adhesive layer 230 is greater than that of the high-deformation region 231). This difference will result in the touch sensing element 221 detecting a significantly greater capacitance signal when the user touches the protective layer 210 above the bonding area 210a than when touching the protective layer 210 above the non-bonded area 210b. In this embodiment, by making the linewidth of the second sensing area A2 corresponding to the high-deformation region 231 greater than the linewidth of the first sensing area A1, the difference in the detected capacitance signals between the bonding area 210a and the non-bonded area 210b can be compensated by increasing the area. In other words, the touch sensing element 221 in this embodiment compensates for the difference in detected capacitance signals by using an electrode structure.

[0106] In some embodiments, the touch sensing element 221 further includes a second touch electrode layer 221b (see...). Figure 8 Furthermore, the second touch electrode layer 221b may also have the same or similar regions as the first sensing area A1 and the second sensing area A2 of the first touch electrode layer 221a.

[0107] Please refer to Figure 7 This is a functional block diagram illustrating a touch sensing element 221 according to an embodiment of this disclosure. Figure 7As shown, in this embodiment, the touch sensing element 221 further includes a processing unit 221c. The processing unit 221c is electrically connected to the first touch electrode layer 221a and the second touch electrode layer 221b, and is configured to detect user touches on the protective layer 210 via the first touch electrode layer 221a and the second touch electrode layer 221b, and generate a corresponding detection capacitance signal. Specifically, the processing unit 221c is also configured to compensate for the difference in detection capacitance signals between the first sensing area A1 and the second sensing area A2. In other words, the touch sensing element 221 in this embodiment compensates for the difference in detection capacitance signals using software.

[0108] Please refer to Figure 8 It is a drawing Figure 2 A cross-sectional view of the multi-layer touch circuit board 220. (See diagram below.) Figure 8 As shown, in this embodiment, the multilayer touch circuit board 220 further includes a shielding layer 223. The first touch electrode layer 221a, the second touch electrode layer 221b, the shielding layer 223, and the coil layer 222 are stacked sequentially from top to bottom and electrically isolated by an insulating layer 224. The multilayer touch circuit board 220 further includes two solder resist layers 225. The two solder resist layers 225 are respectively disposed on the upper and lower sides of the multilayer touch circuit board 220, and respectively cover and contact the first touch electrode layer 221a and the coil layer 222.

[0109] like Figure 8 As shown, in this embodiment, the coil layer 222 is made of copper. The multilayer touch circuit board 220 further includes a nickel layer 226. The nickel layer 226 covers the coil layer 222. By covering the coil layer 222 with the nickel layer 226, the magnetic lines of force generated by the magnet assembly 250 on the coil layer 222 can be effectively concentrated. In this embodiment, the multilayer touch circuit board 220 further includes a gold layer 227. The gold layer 227 covers the nickel layer 226. By covering the nickel layer 226 with the gold layer 227, oxidation of the nickel layer 226 can be prevented. In this embodiment, the nickel layer 226 and the gold layer 227 are embedded in the solder mask layer 225. The multilayer touch circuit board 220 further includes a cover layer 228 with an insulating function. The cover layer 228 covers the gold layer 227 to prevent the gold layer 227 from being exposed from the solder mask layer 225.

[0110] like Figure 2 and Figure 8 As shown, in this embodiment, the pressure sensing element 240 is configured to generate a force sensing signal in response to deformation of the multilayer touch circuit board 220 (e.g., due to a user pressing the protective layer 210). When the pressure sensing element 240 generates a force sensing signal, Figure 7 The processing unit 221c shown is also configured to control the vibration module to generate different vibration forces based on touch operation and force sensing signals, thereby providing haptic feedback. Additionally, as... Figure 8 As shown, the pressure sensing element 240 is embedded in the solder mask layer 225, and the pressure sensing element 240 is also covered by a cover layer 228, so that the pressure sensing element 240 is not exposed from the solder mask layer 225.

[0111] Please refer to Figure 9 This is a top view illustrating the coil layer 222 and magnet assembly 250 according to an embodiment of this disclosure. Figure 9 As shown, in this embodiment, the coil layer 222 includes a first coil unit 222a and a second coil unit 222b connected together. The first coil unit 222a and the second coil unit 222b can be electrically coupled to an external controller (not shown). By making the distance S2 between the two coil units of the coil layer 222 substantially equal to the line spacing P of the coil units (i.e., there is no reserved assembly tolerance between the first coil unit 222a and the second coil unit 222b), the area utilization rate of the multilayer touch circuit board 220 can be improved.

[0112] like Figure 9 As shown, and in conjunction with reference Figure 2 In this embodiment, the magnet assembly 250 includes a first magnet 251, a second magnet 252, and a third magnet 253. The first magnet 251 has a first magnetic pole. The first magnetic pole is arranged in the direction D (referencing a reference). Figure 2 The first magnet 251 faces the first coil unit 222a. The second magnet 252 has a second magnetic pole. The second magnetic pole faces the second coil unit 222b in the arrangement direction D. The third magnet 253 has a third magnetic pole. The third magnetic pole faces the gap G between the first coil unit 222a and the second coil unit 222b in the arrangement direction D. The third magnet 253 is seamlessly arranged side by side between the first magnet 251 and the second magnet 252. The polarity of the third magnetic pole is different from the polarity of the first magnetic pole and the polarity of the second magnetic pole. Corresponding to the aforementioned design where there is no reserved assembly tolerance between the first coil unit 222a and the second coil unit 222b, by making two adjacent magnets of the magnet group 250 (i.e., the first magnet 251 and the third magnet 253, or the second magnet 252 and the third magnet 253) face the first coil unit 222a and the second coil unit 222b with magnetic poles of opposite polarities, the two magnets can be seamlessly arranged side by side.

[0113] Specifically, such as Figure 9As shown, the first coil unit 222a and the second coil unit 222b have the same winding method and are connected in series. The first coil unit 222a includes two straight beam segments 222a1 and 222a2. The straight beam segments 222a1 and 222a2 are arranged vertically side by side. The second coil unit 222b includes two straight beam segments 222b1 and 222b2. The straight beam segments 222b1 and 222b2 are arranged vertically side by side. The first magnet 251 is located on a portion of the straight beam segment 222a1 (within...). Figure 9 The lower half of the middle) and a portion of the straight beam segment 222a2 (in Figure 9 Below the upper half of the linear beam segment 222b1, and with the first magnetic pole facing the linear beam segments 222a1 and 222a2 having the N pole polarity. The second magnet 252 is located in a portion of the linear beam segment 222b1 (in the upper half of the segment). Figure 9 The lower half of the middle) and a portion of the straight beam segment 222b2 (in Figure 9 Below the upper half of the linear beam segment 222a2, and facing the second magnetic pole of the linear beam segment 222b1, 222b2, the polarity of the second magnetic pole is N. The third magnet 253 is located in a part of the linear beam segment 222a2 (in the upper half of the segment). Figure 9 The lower half of the middle), a part of the straight beam segment 222b1 (in Figure 9 Below the upper half of the coil unit 222a and below the gap G between the first coil unit 222a and the second coil unit 222b, and with the polarity of the third magnetic pole facing the straight beam segments 222a2 and 222b1 being the S pole. Current flows from the outer edge contact of the second coil unit 222b (located in...) Figure 9 The current flows in from the lower right of the first coil unit 222a and out from the inner edge contact of the second coil unit 222b. Then, the current flowing out of the second coil unit 222b flows out from the outer edge contact of the first coil unit 222a (located at the lower right of the first coil unit 222a). Figure 9 The current flows in from the center right side (via the bottom pull wire) and flows out from the inner edge contact of the first coil unit 222a (via the bottom pull wire). With the above configuration, the magnet assembly 250 and the coil layer 222 can form a vertical vibration module.

[0114] Please refer to Figure 10 This is a top view illustrating a coil layer 222 and a magnet assembly 350 according to another embodiment of this disclosure. Figure 10As shown, in this embodiment, the magnet assembly 350 includes a first magnet 351 and a second magnet 352. The first magnet 351 has a first magnetic end. The first magnetic end faces the first coil unit 222a in the arrangement direction D. The second magnet 352 has a second magnetic end. The second magnetic end faces the second coil unit 222b in the arrangement direction D. The first magnet 351 and the second magnet 352 are seamlessly arranged side by side. The polarity of the first magnetic end is different from the polarity of the second magnetic end. Corresponding to the aforementioned design where there is no pre-reserved assembly tolerance between the first coil unit 222a and the second coil unit 222b, by having the first magnet 351 and the second magnet 352 face the first coil unit 222a and the second coil unit 222b respectively with magnetic ends of opposite polarities, the first magnet 351 and the second magnet 352 can be seamlessly arranged side by side.

[0115] Specifically, such as Figure 10 As shown, the first magnet 351 is located below the straight beam segments 222a1 and 222a2, and the polarity of the first magnetic end facing the straight beam segments 222a1 and 222a2 is N pole. The second magnet 352 is located below the straight beam segments 222b1 and 222b2, and the polarity of the second magnetic end facing the straight beam segments 222b1 and 222b2 is S pole. Current flows in from the inner edge contact of the second coil unit 222b and exits from the outer edge contact of the second coil unit 222b (located at...). Figure 10 The current flows out from the lower right of the first coil unit 222a. Then, the current flowing out of the second coil unit 222b flows out again from the outer edge contact of the first coil unit 222a (located at the lower right of the first coil unit 222a). Figure 10 The current flows in from the center right side (via the bottom pull wire) and flows out from the inner edge contact of the first coil unit 222a (via the bottom pull wire). With the above configuration, the magnet assembly 350 and the coil layer 222 can also form a vertical vibration module.

[0116] It should be noted that, Figure 2 This can be considered a first embodiment of the present disclosure, wherein the pressure sensing element 240 is entirely located within the vertical projection range VP of the high deformation region 231 (i.e., the pressure sensing element 240 is completely superimposed on the vertical projection range VP). Additionally, please refer to... Figure 11A It is a drawing Figure 2 Region M in the comparison example is an enlarged view. For example... Figure 11A As shown, the pressure sensing element 240 is located outside the vertical projection range VP of the high deformation region 231 (that is, the pressure sensing element 240 does not overlap with the vertical projection range VP).

[0117] Please refer to Figure 11B , Figure 11C as well as Figure 11D . Figures 11B to 11D To draw separately Figure 2Region M in the diagram is shown in enlarged views in the second, third, and fourth embodiments. Figure 11B As shown, the pressure sensing element 240 is located outside the vertical projection range VP of the high deformation region 231, and adjacent to the vertical projection range VP. Figure 11C As shown, the pressure sensing element 240 spans the boundary of the vertical projection range VP of the high deformation region 231 (i.e., the pressure sensing element 240 partially overlaps with the vertical projection range VP). Figure 11D As shown, the pressure sensing element 240 is located within the vertical projection range VP of the high deformation region 231 and is aligned with the boundary of the vertical projection range VP.

[0118] Please refer to Figure 12 The diagram illustrates the pressure output signals of the touchpad devices designed using the comparative example, the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment, respectively. Figure 12 This is a diagram of the pressure output signal obtained when the protective layer 210 of the touchpad device 200 is pressed with a force of 150g. (Example) Figure 12 As shown, the comparative example has the lowest signal strength. Figure 11C The third embodiment shown has the strongest signal strength, while Figure 2 The first embodiment shown Figure 11B The second embodiment shown is similar to Figure 11D The signal strength of the fourth embodiment shown is between the maximum and minimum. Therefore, by making the pressure sensing element 240 adjacent to or at least partially overlapping the vertical projection range VP of the high deformation region 231, it is indeed possible to ensure that the pressure sensing element 240 can effectively capture deformation (i.e., improve sensitivity), thereby achieving more accurate pressure detection.

[0119] Please refer to Figure 13A This is a cross-sectional schematic diagram illustrating a touchpad device 300A according to one embodiment of the present disclosure. Figure 13A As shown, the touchpad device 300A includes a protective layer 210, a multilayer touch circuit board 320, an adhesive layer 230, multiple pressure sensing elements 240, a magnet assembly 250, a support member 260, and multiple elastic members 270. The protective layer 210, adhesive layer 230, pressure sensing elements 240, magnet assembly 250, support member 260, and elastic members 270 are the same as or similar to... Figure 2The embodiments shown are described above and will not be repeated here. It should be noted that the multilayer touch circuit board 320 in this embodiment includes a first circuit board stack 321, a second circuit board stack 322, and a bonding layer 323. The first circuit board stack 321 is disposed on the side of the adhesive layer 230 away from the protective layer 210. The second circuit board stack 322 is located on the side of the first circuit board stack 321 away from the adhesive layer 230. The bonding layer 323 is bonded between the first circuit board stack 321 and the second circuit board stack 322, and includes a low-deformation region 323b and a high-deformation region 323a. It should be noted that by configuring the combined equivalent hardness of the protective layer 210, adhesive layer 230, and first circuit board stack 321 to be greater than the equivalent hardness of the second circuit board stack 322, it can be ensured that pressure is mainly concentrated in the high-deformation region 323a.

[0120] Conversely, if the equivalent hardness of the combination of the protective layer 210, the adhesive layer 230 and the first circuit board stack 321 is less than the equivalent hardness of the second circuit board stack 322, the aforementioned combination may reduce the deformation of the bonding layer 323 when pressed, resulting in a decrease in the sensitivity of pressure detection.

[0121] Specifically, such as Figure 13A As shown, the first circuit board stack 321 of the multilayer touch circuit board 320 includes a solder resist layer 321a, a touch sensing element 321b, an insulating layer 321c, and a shielding layer 321d, which are stacked sequentially from the adhesive layer 230 toward the bonding layer 323. The second circuit board stack 322 of the multilayer touch circuit board 320 includes a solder resist layer 322a, a coil layer 322b, and an insulating layer 322c, which are stacked sequentially from the elastic member 270 toward the bonding layer 323. However, the stacking of the first circuit board stack 321 and the stacking of the second circuit board stack 322 are not limited to this embodiment and can be flexibly adjusted according to actual needs (e.g., rigidity requirements).

[0122] Since the equivalent hardness of the multilayer touch circuit board 320 can be adjusted by the stacking of the first circuit board stack 321 and / or the stacking of the second circuit board stack 322, the material of the protective layer 210 is not limited to glass, and other softer materials such as Mylar, PET, FR4, etc. can also be selected.

[0123] In some embodiments, the bonding layer 323 is made of polypropylene (PP). The thickness of the bonding layer 323 is from about 50 μm to about 500 μm. If the thickness of the bonding layer 323 is less than 50 μm, it cannot provide sufficient compression when the user presses the protective layer 210. If the thickness of the bonding layer 323 is greater than 500 μm, it will affect the generation of the detection capacitance signal of the touch sensing element 321b.

[0124] Please refer to Figure 13B This is a cross-sectional schematic diagram illustrating a touchpad device 300B according to one embodiment of the present disclosure. Figure 13B As shown, the touchpad device 300B includes a protective layer 210, a multilayer touch circuit board 320A, an adhesive layer 230, multiple pressure sensing elements 240, a magnet assembly 250, a support member 260, and multiple elastic elements 270. The protective layer 210, adhesive layer 230, pressure sensing elements 240, magnet assembly 250, support member 260, and elastic elements 270 are the same as or similar to... Figure 2 The embodiments shown are therefore described in the preceding text and will not be repeated here. It should be noted that, compared to... Figure 13A The multilayer touch circuit board 320 shown in this embodiment further includes a metal layer 322d in its second circuit board stack 322A. The metal layer 322d is stacked on the bonding layer 323 and the insulating layer 322c. Therefore, the multilayer touch circuit board 320A of this embodiment is more advanced than... Figure 13A The multi-layer touch circuit board shown has 320 layers.

[0125] Please refer to Figure 13C This is a cross-sectional schematic diagram illustrating a touchpad device 300C according to one embodiment of the present disclosure. Figure 13B As shown, the touchpad device 300C includes a protective layer 210, a multilayer touch circuit board 320B, an adhesive layer 230, multiple pressure sensing elements 240, a magnet assembly 250, a support member 260, and multiple elastic elements 270. The protective layer 210, adhesive layer 230, pressure sensing elements 240, magnet assembly 250, support member 260, and elastic elements 270 are the same as or similar to... Figure 2 The embodiments shown are therefore described in the preceding text and will not be repeated here. It should be noted that, compared to... Figure 13B The multilayer touch circuit board 320A shown in this embodiment further includes a bonding layer 321A in the first circuit board stack 321A of the multilayer touch circuit board 320B, and the touch sensing element 321b' includes a first touch electrode layer 321b1 and a second touch electrode layer 321b2 stacked on the upper and lower sides of the bonding layer 321e. Therefore, the multilayer touch circuit board 320B of this embodiment is more advanced than... Figure 13B The multi-layer touch circuit board 320A shown has two more layers.

[0126] Please refer to Figure 13D This is a cross-sectional schematic diagram illustrating a touchpad device 300D according to one embodiment of the present disclosure. Figure 13BAs shown, the touchpad device 300D includes a protective layer 210, a multilayer touch circuit board 320C, an adhesive layer 230, multiple pressure sensing elements 240, a magnet assembly 250, a support member 260, and multiple elastic elements 270. The protective layer 210, adhesive layer 230, pressure sensing elements 240, magnet assembly 250, support member 260, and elastic elements 270 are the same as or similar to... Figure 2 The embodiments shown are therefore described in the preceding text and will not be repeated here. It should be noted that, compared to... Figure 13C The multilayer touch circuit board 320B shown in this embodiment, the first circuit board stack 321A of the multilayer touch circuit board 320C further includes an insulating layer 321f and a metal layer 321g. The insulating layer 321f is stacked between the first touch electrode layer 321b1 and the second touch electrode layer 321b2, and the bonding layer 321e is instead stacked between the second touch electrode layer 321b2 and the shielding layer 321d. The metal layer 321g is stacked between the bonding layer 323 and the insulating layer 321c. Therefore, the multilayer touch circuit board 320C of this embodiment is superior to... Figure 13C The multi-layer touch circuit board 320B shown has two more layers.

[0127] At Figure 2 In the embodiment shown, the pressure sensing element 240 is a strain gauge, and the pressure sensing element 240 is disposed on the side of the multilayer touch circuit board 220 away from the protective layer 210, but this disclosure is not limited thereto.

[0128] Please refer to Figure 14A This is a cross-sectional schematic diagram illustrating a touchpad device 400A according to one embodiment of the present disclosure. Figure 14A As shown, the touchpad device 400A includes a protective layer 210, a multi-layer touch circuit board 420, an adhesive layer 230, a magnet assembly 250, a support member 260, and multiple elastic members 270. The protective layer 210, adhesive layer 230, magnet assembly 250, support member 260, and elastic members 270 are the same as or similar to... Figure 2 The embodiments shown are therefore described in the preceding text and will not be repeated here. It should be noted that, compared to... Figure 13A The multilayer touch circuit board 320 shown in this embodiment further includes a pressure sensing element 440 in the coil layer 422b of the second circuit board stack 422. The shielding layer 321d of the first circuit board stack 321 is made of metal, therefore the pressure sensing element 440 is configured to sense the capacitance value between the pressure sensing element 440 and the shielding layer 321d. Additionally, the support member 260 is a metal bracket, therefore the pressure sensing element 440 is also configured to sense another capacitance value between the pressure sensing element 440 and the support member 260. In other words, this embodiment simultaneously senses different capacitance values ​​using the pressure sensing element 440.

[0129] Please refer to Figure 14B This is a cross-sectional schematic diagram illustrating a touchpad device 400B according to one embodiment of the present disclosure. Figure 14B As shown, the touchpad device 400B includes a protective layer 210, a multilayer touch circuit board 420A, an adhesive layer 230, a magnet assembly 250, a support member 260, and multiple elastic members 270. The protective layer 210, adhesive layer 230, magnet assembly 250, support member 260, and elastic members 270 are the same as or similar to... Figure 2 The embodiments shown are therefore described in the preceding text and will not be repeated here. It should be noted that, compared to... Figure 14A The multilayer touch circuit board 420 shown in this embodiment further includes another metal layer 422d in its second circuit board stack 422A. The metal layer 422d includes another pressure sensing element 441. The pressure sensing element 441 is configured to sense the capacitance value between the pressure sensing element 441 and the shielding layer 321d. The pressure sensing element 440 is configured to sense another capacitance value between the pressure sensing element 440 and the support member 260. In other words, this embodiment senses different capacitance values ​​using pressure sensing elements 440 and 441 respectively. Furthermore, the multilayer touch circuit board 420A of this embodiment is more... Figure 14A The multi-layer touch circuit board shown has one more layer than 420.

[0130] Please refer to Figure 14C This is a cross-sectional schematic diagram illustrating a touchpad device 400C according to one embodiment of the present disclosure. Figure 14C As shown, the touchpad device 400C includes a protective layer 210, a multilayer touch circuit board 420B, an adhesive layer 230, a magnet assembly 250, a support member 260, and multiple elastic members 270. The protective layer 210, adhesive layer 230, magnet assembly 250, support member 260, and elastic members 270 are the same as or similar to... Figure 2 The embodiments shown are described above, and therefore will not be repeated here. It should be noted that the multilayer touch circuit board 420B in this embodiment is... Figure 14B The first circuit board stack 321 shown is replaced with Figure 13C The first circuit board stack 321A is shown. Therefore, the multilayer touch circuit board 420B of this embodiment is superior to... Figure 14B The multi-layer touch circuit board 420A shown has two more layers.

[0131] Please refer to Figure 14D This is a cross-sectional schematic diagram illustrating a touchpad device 400D according to one embodiment of the present disclosure. Figure 14DAs shown, the touchpad device 400D includes a protective layer 210, a multilayer touch circuit board 420C, an adhesive layer 230, a magnet assembly 250, a support member 260, and multiple elastic members 270. The protective layer 210, adhesive layer 230, magnet assembly 250, support member 260, and elastic members 270 are the same as or similar to... Figure 2 The embodiments shown are described above, and therefore will not be repeated here. It should be noted that the multilayer touch circuit board 420B in this embodiment is... Figure 14C The first circuit board stack 321A shown is replaced with Figure 13D The first circuit board stack 321B is shown. Therefore, the multilayer touch circuit board 420C of this embodiment is superior to... Figure 14C The multi-layer touch circuit board 420B shown has two more layers.

[0132] Please refer to Figure 15 This is a cross-sectional schematic diagram illustrating a touchpad device 500 according to one embodiment of the present disclosure. Figure 15 As shown, the touchpad device 500 includes a protective layer 210, a multi-layer touch circuit board 520, an adhesive layer 230, a magnet assembly 250, a support member 260, and multiple elastic members 270, wherein the protective layer 210, adhesive layer 230, magnet assembly 250, support member 260, and elastic members 270 are the same as or similar to... Figure 2 The embodiments shown are therefore described in the preceding text and will not be repeated here. It should be noted that, compared to... Figure 14B The second circuit board stack 422A shown in this embodiment has a multilayer touch circuit board 520 where the coil layer 422b containing the pressure sensing element 440 is replaced with a coil layer 522b containing the ground unit 540. Therefore, in this embodiment, the capacitance value is sensed only by the pressure sensing element 441. Since the element used to sense the capacitance value is entirely inside the multilayer touch circuit board 520, environmental interference can be avoided.

[0133] From the detailed description of the specific embodiments disclosed above, it is evident that in the touchpad device of this disclosure, by making the pressure sensing element adjacent to or at least partially overlapping the vertical projection range of a high-deformation region of one layer or adhesive layer in the multilayer touch circuit board, it is ensured that the pressure sensing element can effectively capture deformation (i.e., improve sensitivity), thereby achieving more accurate pressure detection. By setting the high-deformation region in the bonding layer between the first circuit board stack and the second circuit board stack, the location and degree of deformation can be controlled more precisely, thereby optimizing pressure sensing performance. By making the equivalent hardness of the combination of the protective layer, adhesive layer, and first circuit board stack greater than the equivalent hardness of the second circuit board stack, it is ensured that pressure is mainly concentrated in the high-deformation region. By setting the pressure sensing element within the multilayer touch circuit board, in addition to simplifying circuit design, interference from the external environment can be reduced, thereby improving the reliability of sensing. By setting the elastic element within the vertical projection range of the high-deformation region, the touchpad device can have better deformation to vertical vibration, thereby achieving the effect of enhanced vertical vibration sensing.

[0134] Although the present disclosure has been described above with reference to embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various modifications and refinements without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the appended claims.

Claims

1. A touchpad device, characterized in that, Include: A protective layer; A multi-layer touch circuit board; An adhesive layer is disposed between the protective layer and the multilayer touch circuit board; and A pressure sensing element is disposed on the multi-layer touch circuit board. One layer of the multilayer touch circuit board or the adhesive layer is made of a heterogeneous material and includes a high-deformation region and a low-deformation region. The pressure sensing element is adjacent to or at least partially overlaps with a vertical projection range of the high deformation region.

2. The touchpad device as claimed in claim 1, characterized in that, The adhesive layer includes the high deformation region, and the high deformation region is a through slot.

3. The touchpad device as described in claim 2, characterized in that, The pressure sensing element is a strain gauge, and the pressure sensing element is located on the side of the multilayer touch circuit board away from the protective layer.

4. The touchpad device as claimed in claim 1, characterized in that, The multi-layer touch circuit board includes: A first circuit board stack is disposed on the side of the adhesive layer away from the protective layer; A second circuit board stack is located on the side of the first circuit board stack away from the adhesive layer; and A bonding layer is bonded between the first board stack and the second board stack, and includes the high deformation region.

5. The touchpad device as claimed in claim 4, characterized in that, The pressure sensing element is a strain gauge, and the pressure sensing element is located on the side of the multilayer touch circuit board away from the protective layer.

6. The touchpad device as claimed in claim 5, characterized in that, The combined equivalent hardness of the protective layer, the adhesive layer, and the first circuit board stack is greater than the equivalent hardness of the second circuit board stack.

7. The touchpad device as claimed in claim 5, characterized in that, The bonding layer is made of polypropylene and has a thickness of 50 μm to 500 μm.

8. The touchpad device as claimed in claim 5, characterized in that, The high-deformation region is a through-groove.

9. The touchpad device as claimed in claim 4, characterized in that, The pressure sensing element is a self-capacitive force sensor, and the pressure sensing element is disposed within the multilayer touch circuit board.

10. The touchpad device as claimed in claim 9, characterized in that, The pressure sensing element is disposed on the second circuit board stack, the first circuit board stack includes a metal layer, and the pressure sensing element is configured to sense a capacitance value between the pressure sensing element and the metal layer.

11. The touchpad device as claimed in claim 9, characterized in that, The combined equivalent hardness of the protective layer, the adhesive layer, and the first circuit board stack is greater than the equivalent hardness of the second circuit board stack.

12. The touchpad device as claimed in claim 9, characterized in that, The bonding layer is made of polypropylene and has a thickness of 50 μm to 500 μm.

13. The touchpad device as claimed in claim 9, characterized in that, The high-deformation region is a through-groove.

14. The touchpad device as claimed in claim 9, characterized in that, Further includes: A metal bracket is located on the side of the multilayer touch circuit board away from the protective layer; and An elastic element is disposed between the multi-layer touch circuit board and the metal bracket. The pressure sensing element is configured to sense a capacitance value between the pressure sensing element and the metal bracket.

15. The touchpad device as claimed in claim 14, characterized in that, The elastic element is located within the vertical projection range of the high deformation region.

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