A bill of materials inspection method and related apparatus

Abstract

This application provides a bill of materials (BOM) inspection method and related equipment. The BOM inspection method includes: determining a first similarity between the material detail records in the BOM and each first material ledger record in a component library file based on a prefix field of the material detail records; determining multiple second material ledger records in each of the first material ledger records based on the first similarity, wherein the first similarity of the second material ledger records is greater than a first similarity threshold; determining a second similarity between each first segment field of the material detail record and the corresponding second segment field in the second material ledger record; and determining the inspection result of the material detail records based on the various second similarities. This application improves the accuracy of BOM inspection.

Description

Technical Field

[0001] This application relates to the field of materials technology, and in particular to a bill of materials checking method and related equipment. Background Technology

[0002] Before manufacturing electronic components, it is necessary to procure the materials required for the production. The bill of materials (BOM) consisting of detailed records of the required materials needs to be checked to ensure the accuracy of the material details and to avoid producing defective components based on incorrect material lists.

[0003] In the exemplary technology, the correctness of the material detail record is determined by whether the hash value of the material detail record is consistent with the hash value of the material ledger record in the component library file.

[0004] However, there may be slight inconsistencies between the material ledger records and the material details records, resulting in different hash values ​​and misjudgments. In other words, there is a problem with the low accuracy of checking the bill of materials. Summary of the Invention

[0005] Based on the above-mentioned technological status, this application provides a bill of materials (BOM) inspection method and related equipment to solve the problem of low accuracy in BOM inspection.

[0006] To achieve the above-mentioned technical objectives, this application proposes the following technical solution: Firstly, this application provides a method for checking a bill of materials, including: Based on the prefix field of the material details record in the bill of materials, determine the first similarity between the material details record and each first material ledger record in the component library file; Based on the first similarity, multiple second material ledger records are determined in each of the first material ledger records, wherein the first similarity of the second material ledger records is greater than the first similarity threshold. Determine the second similarity between each first segment field of the material details record and the corresponding second segment field in the second material ledger record; Based on the various second similarities of the material detail records, the inspection result of the material detail records is determined; wherein, if all the second similarities between the material detail records and any of the second material ledger records are greater than or equal to the second similarity threshold, the inspection result of the material detail records is determined to be a pass; if the second similarity threshold between the material detail records and each of the second material ledger records contains a second similarity less than the second similarity threshold, the inspection result of the material detail records is determined to be a fail.

[0007] In some implementations, determining the first similarity between the material detail record and each first material ledger record in the component library file based on the prefix field of the material detail record in the bill of materials includes: The coding field of the material details field is segmented to obtain multiple third segment fields; Determine the third similarity between each of the third segment fields and the fourth segment field corresponding to the first material ledger record in the component library file; If the third similarity between the material detail record and each of the first material ledger records contains a third similarity less than the third similarity threshold, the first similarity between the material detail record and each of the first material ledger records in the component library file is determined based on the prefix field of the material detail record in the bill of materials.

[0008] In some implementations, after determining the third similarity between each of the third segment fields and the fourth segment field corresponding to the first material ledger record in the component library file, the method further includes: If the third similarity scores of the material detail record and any of the first material ledger records are all greater than or equal to the third similarity threshold, the material detail record is determined to have passed the inspection.

[0009] In some implementations, segmenting the encoded field of the material details field includes: The encoded field is segmented according to a set field length, wherein the set field length is less than a length threshold.

[0010] In some embodiments, after determining the inspection result of the material detail record based on each of the second similarities of the material detail record, the method further includes: Based on the type of the first segment field in the material details record, determine the weight of the second similarity corresponding to the first segment field; The target comprehensive score of the material details record is determined based on the weight of each of the first segment fields and the second similarity. Based on the inspection results of each of the material details records and the target comprehensive score, an inspection report of the material list is output, wherein the target comprehensive score is used to sort the inspection results of the corresponding material details records in the inspection report.

[0011] In some implementations, determining the target comprehensive score of the material details record based on the weights corresponding to each of the first segment fields and the second similarity includes: Based on the weights corresponding to each first segment field of the material detail record and each second similarity of the second material ledger record, the initial comprehensive score between the material detail record and each of the second material ledger records is determined. The highest initial comprehensive score is determined as the target comprehensive score for the material details record.

[0012] In some implementations, before determining the first similarity between the material detail record and each first material ledger record in the component library file based on the prefix field of the material detail record in the bill of materials, the method further includes: Obtain the component library file; The initial material ledger records in the component library file are preprocessed to obtain each first material ledger record. The preprocessing includes format processing and segmentation processing of the initial material ledger records.

[0013] Secondly, this application provides a bill of materials checking apparatus, including a memory and a processor, wherein, The memory is connected to the processor and is used to store programs; The processor is used to implement the bill of materials checking method as described in the first aspect or any implementation thereof by running a program in the memory.

[0014] Thirdly, this application provides a computer program product, including computer instructions, which, when executed by a processor, implement the bill of materials checking method as described in the first aspect or any implementation thereof.

[0015] Fourthly, this application provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the bill of materials checking method as described in the first aspect or any implementation thereof.

[0016] This application provides a bill of materials (BOM) inspection method and related equipment. Based on the prefix fields of the material detail records in the BOM, a first similarity is determined between the material detail records and each first material ledger record in the component library file. Using this first similarity, multiple first material ledger records with similarity greater than a similarity threshold are identified as second material ledger records. Furthermore, a second similarity is determined between each first segment field in the material detail record and its corresponding second segment field in the second material ledger record. Based on these second similarities, the inspection result of the material detail record is determined. In this application, when the similarity between each segment field of the material detail record and the segment fields of the material ledger record is greater than the similarity threshold, the material detail record is deemed to have passed the inspection. It does not require the material detail record to be completely identical to the material ledger record, thus allowing for minor inconsistencies and improving the accuracy of BOM inspection. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0018] Figure 1 A flowchart of a bill of materials checking method provided in this application embodiment Figure 1 .

[0019] Figure 2 A flowchart of a bill of materials checking method provided in this application embodiment Figure 2 .

[0020] Figure 3 A flowchart of a bill of materials checking method provided in this application embodiment Figure 3 .

[0021] Figure 4 A flowchart of a bill of materials checking method provided in this application embodiment Figure 4 .

[0022] Figure 5 This is a schematic diagram of the functional modules of a bill of materials checking device provided in an embodiment of this application.

[0023] Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that the user information (including but not limited to electrical equipment information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties. Furthermore, the collection, use and processing of the relevant data must comply with relevant laws, regulations and standards, and corresponding operation entry points are provided for users to choose to authorize or refuse.

[0026] Before manufacturing electronic components, it is necessary to procure the materials required for the production. The bill of materials (BOM) consisting of detailed records of the required materials needs to be checked to ensure the accuracy of the material details and to avoid producing defective components based on incorrect material lists.

[0027] In the exemplary technology, the correctness of the material detail record is determined by whether the hash value of the material detail record is consistent with the hash value of the material ledger record in the component library file.

[0028] However, there may be slight inconsistencies between the material ledger records and the material details records, resulting in different hash values ​​and misjudgments. In other words, there is a problem with the low accuracy of checking the bill of materials.

[0029] To address the aforementioned technical problems, this application provides a bill of materials (BOM) checking method. The following detailed description of the BOM checking method proposed in this application is provided through various embodiments.

[0030] Reference Figure 1 , Figure 1 A flowchart of a bill of materials checking method provided in this application embodiment Figure 1 .like Figure 1 As shown, the bill of materials checking method provided in this embodiment includes: Step S101: Determine the first similarity between the material detail records and each first material ledger record in the component library file based on the prefix field of the material detail records in the bill of materials.

[0031] In this embodiment, the executing entity is the bill of materials checking device. For ease of description, the term "device" will be used to refer to the bill of materials checking device. The device can be any terminal device with bill of materials checking function.

[0032] The device acquires the bill of materials (BOM) and component library files. The BOM contains detailed records of the components to be produced, and there are multiple detailed records, including material name, material model, and material usage. The component library files include multiple material ledger records, which specify the names of materials that can be purchased, the quantities of materials in stock, and the models of materials that can be purchased.

[0033] The bill of materials can be a document entered by the user, while the component library file can be a document formed by the material purchasing regulations written by the enterprise or organization, and the file is stored in the device.

[0034] After obtaining the bill of materials and component library files, the device needs to determine whether the material details in the bill of materials are correct based on the material ledger records in the component library files.

[0035] To this end, the device determines a first similarity between the prefix field of the material details record and each first material ledger record in the component library file. For example, the prefix field represents the unique identity of the material in the material details record, such as the name of the material; the first material ledger record also has a prefix field, and the similarity between the prefix field of the material details record and the prefix field of the first material ledger record is calculated, and this similarity is defined as the first similarity.

[0036] Step S102: Based on the first similarity, determine multiple second material ledger records in each first material ledger record, wherein the first similarity of the second material ledger records is greater than the first similarity threshold.

[0037] After obtaining each first similarity score, multiple second material ledger records are determined in each first material ledger record, and the first similarity score of the second material ledger record is greater than the first similarity threshold. That is, the first material ledger record corresponding to the first similarity score greater than the first similarity threshold is used as the second material ledger record.

[0038] Step S103: Determine the second similarity between each first segment field in the material details record and the corresponding second segment field in the second material ledger record.

[0039] After determining the second material ledger record, the similarity between each first segment field of the material detail record and the corresponding second segment field in the second material ledger record is determined, and this similarity is defined as the second similarity.

[0040] In one example, the second similarity can be determined using edit distance. D[i][j] represents the minimum edit distance between the first i characters of string A (material details record) and the first j characters of string B (second material ledger record). The boundary conditions are set as follows: D[0][j]=j, D[i][0]=i. The state transition is: D[i][j]=min(D[i-1][j]+1, D[i][j-1]+1, D[i-1][j-1]+cost), where cost=0 when A[i]=B[j], otherwise cost=1. The calculation is terminated early when D[i][j] exceeds the preset threshold. The normalized similarity is calculated to obtain the second similarity, i.e., Similarity=1-Distance / max(len(A),len(B)). len() refers to the length function.

[0041] Step S104: Determine the inspection result of the material detail record based on each second similarity of the material detail record; wherein, if each second similarity of the material detail record and any second material ledger record is greater than or equal to the second similarity threshold, the inspection result of the material detail record is determined to be a pass; if the second similarity threshold between the material detail record and each second material ledger record contains a second similarity less than the second similarity threshold, the inspection result of the material detail record is determined to be a fail.

[0042] Using the above method, the material detail record and each second material ledger record have multiple second similarities. If all the second similarities of any second material ledger record are greater than or equal to the second similarity threshold, it can be determined that the material detail record is similar to that second material ledger record. Therefore, it can be determined that the inspection result of the material detail record is passed, that is, the material detail record has no errors or omissions. If at least one of the second similarities of each second material ledger record is less than the second similarity threshold, it can be determined that the material detail record has no similar material ledger record in the component library file. That is, it can be determined that the inspection result of the material detail record is failed. In other words, if the second similarity threshold between the material detail record and each second material ledger record contains a second similarity value less than the second similarity threshold, it can be determined that the inspection result of the material detail record is failed.

[0043] In this embodiment, based on the prefix fields of the material detail records in the bill of materials, a first similarity is determined between the material detail records and each first material ledger record in the component library file. Using this first similarity, multiple first material ledger records with similarity greater than a similarity threshold are identified as second material ledger records. Furthermore, a second similarity is determined between each first segment field in the material detail record and its corresponding second segment field in the second material ledger record. Based on these second similarities, the inspection result of the material detail record is determined. In this application, when the similarity between each segment field of the material detail record and the segment fields of the material ledger record is greater than the similarity threshold, the material detail record is deemed to have passed the inspection. It is not required that the material detail record and the material ledger record be completely identical; that is, minor inconsistencies are allowed, thus improving the accuracy of the bill of materials inspection.

[0044] Reference Figure 2 , Figure 2 A flowchart of a bill of materials checking method provided in this application embodiment Figure 2 ,based on Figure 1 In the embodiment shown, step S101 includes: Step S201: The coding field of the material details field is segmented to obtain multiple third segment fields.

[0045] In this embodiment, the device segments the coded field of the material details field to obtain multiple third segment fields. For example, if the coded field is BOM-2024-001, the segmentation result is "BOM-2024" and "-001". The device can segment the coded field according to a set field length, and the set field length is less than a length threshold. For example, the set field length is 8, that is, the coded field is segmented according to the length of 8 characters.

[0046] Step S202: Determine the third similarity between each third segment field and the fourth segment field corresponding to the first material ledger record in the component library file.

[0047] The coding field in the first material ledger record in the component library file is also pre-segmented according to the set field length, that is, the first material ledger record is associated with multiple fourth segment fields.

[0048] Each third segment field has a corresponding fourth segment field in the first material ledger record. For example, third segment field 'a' is the first 8 characters of the coded field, and fourth segment field 'c' is the first 8 characters of the coded field in the first material ledger record. Since third segment field 'a' and fourth segment field 'c' are corresponding, it is necessary to calculate the third similarity between third segment field 'a' and fourth segment field 'c'. This third similarity can be calculated using the hash value of third segment field 'a' and the hash value of fourth segment field 'c'.

[0049] Step S203: If the third similarity between the material detail record and each first material ledger record contains a third similarity less than the third similarity threshold, determine the first similarity between the material detail record and each first material ledger record in the component library file based on the prefix field of the material detail record in the bill of materials.

[0050] There are multiple third similarities between the material details record and the first material ledger record. Since there are multiple first material ledger records, if each first material ledger record contains a value less than the third similarity threshold, the device cannot detect whether the material details record is correct based on the encoding field. Therefore, it determines the first similarity between the material details record and each first material ledger record in the component library file based on the prefix field of the material details record in the bill of materials. That is, it performs fuzzy matching of the prefix field and the segment field to determine whether the material details record is correct.

[0051] If the third similarity scores of the material detail record and any first material ledger record are all greater than or equal to the third similarity threshold, the material detail record is determined to pass the check, that is, the material detail record passes the exact match and does not need to enter the fuzzy match.

[0052] In this embodiment, when the material details record fails to pass the exact match, a fuzzy match is performed to ensure that the material details record can be checked.

[0053] Figure 3 A flowchart of a bill of materials checking method provided in this application embodiment Figure 3 ,based on Figure 1 or Figure 2 In the embodiment shown, after step S104, the method further includes: Step S301: Determine the weight of the second similarity corresponding to the first segment field based on the type of the first segment field in the material details record.

[0054] In this embodiment, regular expressions can be used to segment the material details record. For example, the material details record can be segmented into first segment fields such as material code, material name, specifications, location number, usage, packaging, and loss. That is, the first segment fields have their respective types.

[0055] The device determines the weight of the second similarity corresponding to the first segment field based on the type to which the first segment field belongs. For example, the weight of the material code is 0.35, the weight of the material name is 0.25, the weight of the specification model is 0.2, the weight of the packaging is 0.1, and the weight of the quantity is 0.1.

[0056] Step S302: Determine the target comprehensive score of the material details record based on the weights corresponding to each first segment field and the second similarity.

[0057] After determining the weights, the device determines the target comprehensive score of the material details record based on the weights corresponding to each first segment field and the second similarity.

[0058] In one example, the target comprehensive score is Score=Σ(Wi×Si), where Wi is the weight of the i-th first segment field and Si is the score of the second similarity transformation of the i-th first segment field (between 0 and 1).

[0059] In another example, based on the weights corresponding to the first segment fields of the material detail record and the second similarity of the second material ledger records, an initial comprehensive score is determined between the material detail record and each second material ledger record. The initial comprehensive score is Score=Σ(Wi×Si). The device uses the largest initial comprehensive score as the target comprehensive score for the material detail record.

[0060] Step S303: Based on the inspection results of each material detail record and the target comprehensive score, output the inspection report of the bill of materials. The target comprehensive score is used to sort the inspection results of the corresponding material detail record in the inspection report.

[0061] After obtaining the target comprehensive score of each material detail record, an inspection report for each material detail record in the bill of materials is output based on the inspection results of each material detail record and the target comprehensive score. The target comprehensive score is used to sort the inspection results of the corresponding material detail record in the inspection results.

[0062] In this embodiment, a comprehensive score is determined for the material details record, and an inspection report for the bill of materials is generated based on the comprehensive score.

[0063] Figure 4 A flowchart of a bill of materials checking method provided in this application embodiment Figure 4 .based on Figures 1 to 3 In any of the embodiments shown, prior to step S101, the method further includes: Step S401: Obtain the component library file.

[0064] Step S402: Preprocess the initial material ledger records in the component library file to obtain each first material ledger record. The preprocessing includes format processing and segmentation processing of the initial material ledger records.

[0065] In this embodiment, the device acquires a component library file and preprocesses the initial material ledger records in the component library file. Preprocessing includes formatting and segmentation of the initial material ledger records. Formatting includes removing extra spaces, standardizing capitalization, and standardizing special characters. Furthermore, the bill of materials also requires the same formatting processing.

[0066] The segmentation process involves building a two-layer hash index for the component library file. This involves determining the hash value of the prefix field of the first material ledger record, segmenting the first material ledger record, calculating the hash value of the segmented fields, and building a hash index based on each hash value to facilitate subsequent similarity calculations.

[0067] In this embodiment, by preprocessing the component library files, inaccurate material detail record checks are avoided due to incorrect formatting of the material ledger records.

[0068] Corresponding to the above-described bill of materials checking method, this application also provides a bill of materials checking device. Figure 5 This is a schematic diagram of a bill of materials checking device provided in an embodiment of this application. The bill of materials checking device 500 provided in this embodiment includes: The first determining module 510 is used to determine the first similarity between the material detail record and each first material ledger record in the component library file based on the prefix field of the material detail record in the bill of materials. The second determining module 520 is used to determine multiple second material ledger records in each first material ledger record based on the first similarity, wherein the first similarity of the second material ledger records is greater than the first similarity threshold. The third determining module 530 is used to determine the second similarity between each first segment field of the material details record and the corresponding second segment field in the second material ledger record; The fourth determining module 540 is used to determine the inspection result of the material detail record based on each second similarity of the material detail record; wherein, if each second similarity of the material detail record and any second material ledger record is greater than or equal to the second similarity threshold, the inspection result of the material detail record is determined to be a pass; if the second similarity threshold between the material detail record and each second material ledger record contains a second similarity less than the second similarity threshold, the inspection result of the material detail record is determined to be a fail.

[0069] In some implementations, the bill of materials checking device 500 is also used for: The coding field of the material details field is segmented to obtain multiple third segment fields; Determine the third similarity between each third segment field and the fourth segment field corresponding to the third segment field in the first material ledger record of the component library file; If the third similarity between the material detail record and each first material ledger record contains a third similarity less than the third similarity threshold, the first similarity between the material detail record and each first material ledger record in the component library file is determined based on the prefix field of the material detail record in the bill of materials.

[0070] In some implementations, the bill of materials checking device 500 is also used for: If the third similarity scores of the material detail record and any first material ledger record are all greater than or equal to the third similarity threshold, the material detail record is determined to pass the inspection.

[0071] In some implementations, the bill of materials checking device 500 is also used for: The encoded field is segmented according to the set field length, and the set field length is less than the length threshold.

[0072] In some implementations, the bill of materials checking device 500 is also used for: Based on the type of the first segment field in the material details record, determine the weight of the second similarity corresponding to the first segment field; The target comprehensive score of the material details record is determined based on the weight of each field in the first segment and the second similarity. Based on the inspection results of each material detail record and the target comprehensive score, an inspection report of the bill of materials is output. The target comprehensive score is used to sort the inspection results of the corresponding material detail record in the inspection report.

[0073] In some implementations, the bill of materials checking device 500 is also used for: Based on the weights corresponding to each first segment field of the material details record and the second similarity of each second material ledger record, the initial comprehensive score between the material details record and each second material ledger record is determined. The highest initial comprehensive score is determined as the target comprehensive score for the material details record.

[0074] In some implementations, the bill of materials checking device 500 is also used for: Obtain the component library files; The initial material ledger records in the component library file are preprocessed to obtain each first material ledger record. The preprocessing includes format processing and segmentation of the initial material ledger records.

[0075] The bill of materials (BOM) checking device and the bill of materials (BOM) checking method provided in the above embodiments of this application belong to the same application concept. They can execute the BOM checking method provided in any of the above embodiments of this application, and possess the corresponding functional modules and beneficial effects of executing the BOM checking method. Technical details not described in detail in this embodiment can be found in the specific processing content of the BOM checking method provided in the above embodiments of this application, and will not be repeated here.

[0076] The functions implemented by each module in the bill of materials checking device can be implemented by the same or different processors, and this application embodiment does not limit this.

[0077] It should be understood that the modules in the above bill of materials checking device can be implemented in the form of processor calling firmware. For example, the system includes a processor connected to a memory containing instructions. The processor calls the instructions stored in the memory to implement any of the above methods or to implement the functions of each module of the device. The processor can be a general-purpose processor, such as a CPU or microprocessor, and the memory can be internal to the device or external to the system. Alternatively, the modules in the system can be implemented in the form of hardware circuits. By designing the hardware circuits, some or all of the module functions can be implemented. The hardware circuits can be understood as one or more processors. For example, in one implementation, the hardware circuit is an ASIC, and the functions of some or all of the above modules are implemented by designing the logical relationships of the components within the circuit. In another implementation, the hardware circuit can be implemented using a PLD, such as an FPGA, which can include a large number of logic gates. The connection relationships between the logic gates are configured through configuration files to implement the functions of some or all of the above modules. All modules of the above bill of materials checking device can be implemented entirely by processor calling firmware, entirely by hardware circuits, or partially by processor calling firmware with the remaining parts implemented by hardware circuits.

[0078] In this application embodiment, a processor is a circuit with signal processing capabilities. In one implementation, the processor can be a circuit with instruction reading and execution capabilities, such as a CPU, microprocessor, GPU, or DSP. In another implementation, the processor can implement certain functions through the logical relationships of hardware circuits. These logical relationships are fixed or reconfigurable. For example, the processor may be a hardware circuit implemented as an ASIC or PLD, such as an FPGA. In a reconfigurable hardware circuit, the process of the processor loading a configuration document and configuring the hardware circuit can be understood as the processor loading instructions to implement the functions of some or all of the above modules. Furthermore, it can also be a hardware circuit designed for artificial intelligence, which can be understood as an ASIC, such as an NPU, TPU, or DPU.

[0079] As can be seen, each module in the bill of materials checking device can be one or more processors (or processing circuits) configured to implement the above methods, such as: CPU, GPU, NPU, TPU, DPU, microprocessor, DSP, ASIC, FPGA, or a combination of at least two of these processor types.

[0080] Furthermore, the modules in the above-mentioned bill of materials checking device can be integrated in whole or in part, or they can be implemented independently. In one implementation, these modules are integrated together and implemented in the form of a System-on-Chip (SoC). The SoC may include at least one processor for implementing any of the above methods or implementing the functions of the modules of the device. The at least one processor can be of different types, such as CPU and FPGA, CPU and artificial intelligence processor, CPU and GPU, etc.

[0081] This application provides a schematic diagram of the structure of an electronic device, see [link]. Figure 6 As shown, the electronic device includes a memory 600 and a processor 610; wherein the memory 600 is connected to the processor 610 and is used to store programs; the processor 610 is used to implement the bill of materials checking method disclosed in any of the above embodiments by running the programs stored in the memory 600.

[0082] Specifically, the aforementioned electronic device may further include: a bus, a communication interface 620, an input device 630, and an output device 640. The electronic device may also include a data transceiver module, an image monitoring module, and a signal monitoring module.

[0083] The processor 610, memory 600, communication interface 620, input device 630, and output device 640 are interconnected via a bus. Among them: A bus can include a pathway for transmitting information between various components in an electronic device.

[0084] The processor 610 can be a general-purpose processor, such as a general-purpose central processing unit (CPU), a microprocessor, etc., or an application-specific integrated circuit (ASIC), or one or more integrated circuits used to control the execution of the program of the present invention. It can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), an off-the-shelf programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components.

[0085] The processor 610 may include a main processor, as well as a baseband chip, modem, etc.

[0086] The memory 600 stores a program that executes the technical solution of this invention, and may also store an operating system and other key business functions. Specifically, the program may include program code, which includes computer operation instructions. More specifically, the memory 600 may include read-only memory (ROM), other types of static storage devices capable of storing static information and instructions, random access memory (RAM), other types of dynamic storage devices capable of storing information and instructions, disk storage, flash memory, etc.

[0087] Input device 630 may include a device for receiving user input data and information, such as a keyboard, mouse, camera, scanner, light pen, voice input device, touch screen, pedometer, or gravity sensor.

[0088] Output device 640 may include devices that allow information to be output to a user, such as a display screen, printer, speaker, etc.

[0089] The communication interface 620 may include a device that uses any transceiver to communicate with other devices or communication networks, such as Ethernet, Radio Access Network (RAN), Wireless Local Area Network (WLAN), etc.

[0090] The processor 610 executes the program stored in the memory 600 and calls other devices, and can be used to implement each step of any of the bill of materials checking methods provided in the above embodiments of this application.

[0091] It should be noted that electronic devices can be in-vehicle terminals, mobile phones, wearable devices, or servers, etc.

[0092] This application also proposes a chip, which includes a processor and a data interface. The processor reads and runs a program stored in the memory through the data interface to execute the bill of materials checking method described in any of the above embodiments. For the specific processing procedure and its beneficial effects, please refer to the above embodiments of the bill of materials checking method.

[0093] In addition to the methods and apparatus described above, embodiments of this application may also be computer program products, which include computer program instructions that, when executed by a processor, cause the processor to perform the steps in the bill of materials checking methods according to various embodiments of this application as described in any of the foregoing embodiments of this specification.

[0094] Computer program products can be written in any combination of one or more programming languages ​​to perform the operations of the embodiments of this application. The programming languages ​​include object-oriented programming languages ​​such as Java and C++, as well as conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on the user's computing device, partially on the power device, as a standalone firmware package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0095] Furthermore, embodiments of this application may also be storage media storing a computer program, which is executed by a processor to perform the steps of the bill of materials checking method according to various embodiments of this application as described in any of the above embodiments of this specification, specifically implementing the steps of the bill of materials checking method as described above.

[0096] For the foregoing method embodiments, in order to simplify the description, they are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, because according to this application, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to this application.

[0097] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For apparatus embodiments, since they are basically similar to method embodiments, the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0098] The steps in the methods of the various embodiments of this application can be adjusted, merged, or deleted in order according to actual needs, and the technical features described in each embodiment can be replaced or combined.

[0099] The units of the apparatus in the various embodiments of this application can be merged, divided, and deleted according to actual needs.

[0100] It should be understood that the disclosed terminals, devices, and methods can be implemented in other ways, given the several embodiments provided in this application. For example, the terminal embodiments described above are merely illustrative. For instance, the division of modules or sub-modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple sub-modules or modules may be combined or integrated into another module, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or modules, and may be electrical, mechanical, or other forms.

[0101] The modules or submodules described as separate components may or may not be physically separate. The components that constitute a module or submodule may or may not be physical modules or submodules; that is, they may be located in one place or distributed across multiple network modules or submodules. Some or all of the modules or submodules can be selected to achieve the purpose of this embodiment's solution, depending on actual needs.

[0102] Furthermore, the functional modules or sub-modules in the various embodiments of this application can be integrated into one processing module, or each module or sub-module can exist physically separately, or two or more modules or sub-modules can be integrated into one module. The integrated modules or sub-modules described above can be implemented in hardware or as firmware functional modules or sub-modules.

[0103] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer firmware, or a combination of both. To clearly illustrate the interchangeability of hardware and firmware, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or firmware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0104] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented directly using hardware, firmware units executed by a processor, or a combination of both. The firmware unit can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.

[0105] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0106] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for checking a bill of materials, characterized in that, include: Based on the prefix field of the material details record in the bill of materials, determine the first similarity between the material details record and each first material ledger record in the component library file; Based on the first similarity, multiple second material ledger records are determined in each of the first material ledger records, wherein the first similarity of the second material ledger records is greater than the first similarity threshold. Determine the second similarity between each first segment field of the material details record and the corresponding second segment field in the second material ledger record; Based on the various second similarities of the material detail records, the inspection result of the material detail records is determined; wherein, if all the second similarities between the material detail records and any of the second material ledger records are greater than or equal to the second similarity threshold, the inspection result of the material detail records is determined to be a pass; if the second similarity threshold between the material detail records and each of the second material ledger records contains a second similarity less than the second similarity threshold, the inspection result of the material detail records is determined to be a fail.

2. The bill of materials inspection method according to claim 1, characterized in that, The step of determining the first similarity between the material detail records and each first material ledger record in the component library file based on the prefix field of the material detail records in the bill of materials includes: The coding field of the material details field is segmented to obtain multiple third segment fields; Determine the third similarity between each of the third segment fields and the fourth segment field corresponding to the first material ledger record in the component library file; If the third similarity between the material detail record and each of the first material ledger records contains a third similarity less than the third similarity threshold, the first similarity between the material detail record and each of the first material ledger records in the component library file is determined based on the prefix field of the material detail record in the bill of materials.

3. The bill of materials detection method according to claim 2, characterized in that, After determining the third similarity between each of the third segment fields and the fourth segment field corresponding to the first material ledger record in the component library file, the method further includes: If the third similarity scores of the material detail record and any of the first material ledger records are all greater than or equal to the third similarity threshold, the material detail record is determined to have passed the inspection.

4. The bill of materials inspection method according to claim 2, characterized in that, The segmentation of the encoded field of the material details field includes: The encoded field is segmented according to a set field length, wherein the set field length is less than a length threshold.

5. The bill of materials inspection method according to claim 1, characterized in that, After determining the inspection result of the material detail record based on each second similarity of the material detail record, the method further includes: Based on the type of the first segment field in the material details record, determine the weight of the second similarity corresponding to the first segment field; The target comprehensive score of the material details record is determined based on the weight of each of the first segment fields and the second similarity. Based on the inspection results of each of the material details records and the target comprehensive score, an inspection report of the material list is output, wherein the target comprehensive score is used to sort the inspection results of the corresponding material details records in the inspection report.

6. The bill of materials inspection method according to claim 5, characterized in that, The step of determining the target comprehensive score of the material details record based on the weights corresponding to each of the first segment fields and the second similarity includes: Based on the weights corresponding to each first segment field of the material detail record and each second similarity of the second material ledger record, the initial comprehensive score between the material detail record and each of the second material ledger records is determined. The highest initial comprehensive score is determined as the target comprehensive score for the material details record.

7. The bill of materials inspection method according to any one of claims 1-6, characterized in that, Before determining the first similarity between the material detail record and each first material ledger record in the component library file based on the prefix field of the material detail record in the bill of materials, the method further includes: Obtain the component library file; The initial material ledger records in the component library file are preprocessed to obtain each first material ledger record. The preprocessing includes format processing and segmentation of the initial material ledger records.

8. A bill of materials checking device, characterized in that, Including memory and processor, among which, The memory is connected to the processor and is used to store programs; The processor is used to implement the bill of materials checking method as described in any one of claims 1-7 by running the program in the memory.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, which, when executed by a processor, implements the bill of materials checking method as described in any one of claims 1-7.

10. A computer program product, characterized in that, It includes computer instructions that, when executed by a processor, implement the bill of materials checking method as described in any one of claims 1-7.

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