A BOM data checking method and device and electronic equipment

Abstract

This application provides a BOM data verification method, apparatus, and electronic device. The method includes: acquiring BOM data to be verified and a corresponding coordinate file; performing a self-check on the BOM data to obtain a self-check anomaly prompt; the self-check process includes: determining multiple components belonging to a first category of materials from the BOM data according to preset material classification rules; matching and comparing the first reference number and the second reference number to determine the difference anomaly between the BOM data and the coordinate file, and generating a matching anomaly prompt; generating verification feedback information based on the self-check anomaly prompt and the matching anomaly prompt, and outputting corrected target BOM data in response to a correction instruction for the verification feedback information. This application solves the problem of BOM data redundancy.

Description

Technical Field

[0001] This invention relates to the field of electronic design automation technology, and in particular to a BOM data verification method, apparatus, and electronic device. Background Technology

[0002] In the hardware R&D and manufacturing process of electronic products, the Bill of Materials (BOM) serves as the data hub connecting the design and production ends. BOM data not only directly determines the accuracy of procurement and material preparation but also plays a guiding role in production stages such as surface mount technology (SMT) and through-hole soldering. As electronic products develop towards higher density and higher integration, the types and quantities of components on a single board are increasing dramatically. Therefore, the accuracy and conciseness of the BOM data directly determine the product delivery cycle and manufacturing cost.

[0003] Existing BOM verification techniques typically include the following: First, relying on manual line-by-line review of the BOM. This manual verification process depends on the engineer's meticulousness and is prone to oversights. Second, using simple spreadsheet tools or conventional comparison software to compare the BOM with coordinate files, primarily checking for missing reference numerals (excess / insufficient materials), consistency of package names corresponding to reference numerals, and verification of BOM coding by calling up the material library. These existing techniques are mainly used for "error reporting" and "error correction," focusing on identifying missing, duplicate, or spelling errors in data.

[0004] However, existing technologies have an insurmountable flaw: they cannot normalize multiple components with minute data differences. Specifically, in schematic design, subtle differences in component selection by designers (e.g., resistance values ​​of 1kΩ, 1.1kΩ, and 0.9kΩ) often result in multiple components with identical material types (all resistors) and package information (all 0402 packages), but with only minor differences in parameter values, being separated into independent material entries. Existing verification methods can only detect whether these entries are consistent in physical properties, but cannot automatically bridge these minute data differences and merge them into a single universal material. This leads to an excessive number of redundant material entries in the BOM and an explosive growth in the variety of materials. This directly increases the difficulty of procurement and material preparation, and significantly increases the number of material changes and loading during SMT assembly, severely impacting production preparation efficiency. Summary of the Invention

[0005] The purpose of this invention is to provide a BOM data verification method, apparatus, and electronic device to solve the problem that it is impossible to normalize and merge components with minor parameter differences but the same function and packaging, resulting in BOM data redundancy and reduced production preparation efficiency.

[0006] According to a first aspect of the present invention, a BOM data verification method is provided, comprising: acquiring BOM data to be verified and a corresponding coordinate file, wherein the BOM data includes at least a first digit, material type, parameter value and first packaging information, and the coordinate file includes at least a second digit and second packaging information; Perform a self-check on the BOM data and generate a corresponding self-check error message when a self-check error occurs. The self-check process includes: determining multiple components belonging to the first category of materials from the BOM data according to preset material classification rules; if at least two of the multiple components have the same material type, the same first packaging information, and the difference in parameter values ​​is within a preset tolerance range, then generate a normalization and merging prompt for the at least two components. Based on the matching and comparison of the first bit and the second bit, it is identified whether the first bit and the second bit correspond one by one, and whether the corresponding first encapsulation information and the second encapsulation information are consistent, so as to determine whether there is a difference or anomaly between the BOM data and the coordinate file, and generate a matching anomaly prompt when there is a difference or anomaly. Verification feedback information is generated based on the self-test anomaly prompts and the matching anomaly prompts.

[0007] In one possible embodiment, the preset tolerance range is such that, under the same material type, the absolute value of the difference between any two parameter values ​​is less than or equal to 10% of one of the parameter values.

[0008] In one possible embodiment, it further includes: According to the preset material classification rules, multiple components belonging to the second category of materials are identified from the BOM data, and the first packaging information corresponding to the second category of materials is extracted. If the first packaging information corresponding to the second type of material includes preset auxiliary material characteristic characters, an auxiliary material addition prompt will be generated.

[0009] In one possible embodiment, the preset auxiliary material feature character is a high-power packaging feature character, and the high-power packaging feature character includes at least TO-220 or TO-247.

[0010] In one possible embodiment, the BOM data further includes material codes; the step of determining multiple components belonging to the first category and the second category of materials from the BOM data according to preset material classification rules includes: Identify the prefix characters of the material codes corresponding to each component in the BOM data; Components that satisfy the first preset prefix are classified as the first type of material, and components that satisfy the second preset prefix are classified as the second type of material; The first category of materials consists of surface mount (SMT) materials, and the second category consists of through-hole (DIP) materials.

[0011] In one possible embodiment, the BOM data further includes material code, numerical usage field, remarks information, and material optimization level; The generation of corresponding self-check exception prompts when self-check exceptions are found also includes: The number of separators in the first digit of the BOM data is parsed. The theoretical usage is determined by adding one to the number of separators. The theoretical usage is then compared with the numerical usage field recorded in the BOM data. If they do not match, a usage mismatch error message is generated. Identify the material optimization level of each component in the BOM data. If the material optimization level belongs to a preset set of restricted levels, generate a restricted level exception prompt. The system identifies whether there are components in the BOM data that have the same material code but different remarks. If so, a duplicate material error message is generated.

[0012] In one possible embodiment, the coordinate file further includes a target field; determining whether there are any discrepancies between the BOM data and the coordinate file includes: When a certain first bit exists and no corresponding second bit exists, it is determined that there is a multi-material anomaly. When a certain first bit number does not exist, but a corresponding second bit number exists, determine whether the target field corresponding to the second bit number in the coordinate file contains a preset reserved character identifier; if it does, it is determined to be a normal reserved component; if it does not, it is determined that there is a shortage of materials. When the first bit number matches the second bit number, the corresponding first encapsulation information and the second encapsulation information are compared. If they do not match, it is determined that there is an encapsulation mismatch anomaly.

[0013] In one possible embodiment, the method further includes: correcting the BOM data in response to a correction instruction for the verification feedback information, and outputting the corrected target BOM data.

[0014] According to a second aspect of the present invention, a BOM data verification device is provided, comprising: The data acquisition module is used to acquire the BOM data to be verified and the corresponding coordinate file. The BOM data includes at least the first digit, material type, parameter value and first packaging information. The coordinate file includes at least the second digit and second packaging information. The self-check processing module is used to perform self-check processing on the BOM data and generate a corresponding self-check error prompt when a self-check error exists. The self-check processing includes: determining multiple components belonging to the first type of material from the BOM data according to preset material classification rules; if at least two of the multiple components have the same material type, the same first packaging information, and the difference in parameter values ​​is within a preset tolerance range, then generating a normalization and merging prompt for the at least two components. The matching and comparison module is used to perform a matching and comparison based on the first bit and the second bit to determine whether there is a difference or anomaly between the BOM data and the coordinate file, and to generate a matching anomaly prompt when there is a difference or anomaly. The feedback module is used to generate verification feedback information based on the self-test anomaly prompt and the matching anomaly prompt.

[0015] According to a third aspect of the present invention, an electronic device is provided, comprising: an input unit, a memory, at least one processor, and an output unit, wherein the memory stores program instructions executable on the processor, and the processor can execute a BOM data verification method by calling the program instructions.

[0016] According to the present invention, by performing self-inspection and prioritizing the locking of the first category of materials according to preset material classification rules, the components with slight differences in parameter values ​​but consistent packaging are automatically identified and a unified merging prompt is generated using a preset tolerance range. This eliminates redundant entries in the bill of materials, reduces the types of materials, saves procurement costs, and reduces the occupation of SMT material stations. At the same time, by establishing a mapping between the design-end BOM and the physical coordinate file based on the bidirectional matching comparison of the first and second digits, potential problems at the physical production level, such as excess or insufficient materials or inconsistent packaging, can be identified and prompted in a timely manner, avoiding production line stoppages or batch scrapping caused by discrepancies between virtual data and actual boards. Furthermore, by uniformly generating verification feedback information based on self-inspection anomaly prompts and matching anomaly prompts, and responding to correction instructions to output corrected target BOM data, a complete logical closed loop is constructed from internal redundancy cleanup, external physical consistency verification to closed-loop correction output. This eliminates the tedious steps of manual inspection, thereby improving the accuracy of BOM data and production delivery efficiency. Attached Figure Description

[0017] Figure 1 A flowchart illustrating the steps of a BOM data verification method is shown. Figure 2 A flowchart illustrating the logical execution of a BOM data verification method is shown. Figure 3 A structural block diagram of a BOM data verification device is shown. Figure 4A block diagram of an electronic device is shown. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the application. The singular forms “a,” “said,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, and “multiple” generally includes at least two unless the context clearly indicates otherwise.

[0020] It should be understood that although the terms first, second, third, etc., may be used in the embodiments of this application, these descriptions should not be limited to these terms. These terms are only used to distinguish the descriptions. For example, first may also be referred to as second without departing from the scope of the embodiments of this application, and similarly, second may also be referred to as first.

[0021] Depending on the context, the words “if” or “suppose” as used here can be interpreted as “when” or “in response to determination” or “in response to detection.” Similarly, depending on the context, the phrases “if determination” or “if detection (of the stated condition or event)” can be interpreted as “when determination” or “in response to determination” or “when detection (of the stated condition or event)” or “in response to detection (of the stated condition or event).”

[0022] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or device that includes said element.

[0023] It should be noted that any symbols and / or numbers present in the specification that are not marked in the accompanying drawings are not reference numerals.

[0024] The optional embodiments of this application are described in detail below with reference to the accompanying drawings.

[0025] Figure 1 A BOM data verification method is shown, including steps S100 to S400.

[0026] S100: Obtain the BOM data to be verified and the corresponding coordinate file. The BOM data shall include at least the first digit, material type, parameter value and first packaging information. The coordinate file shall include at least the second digit and second packaging information. BOM (Bill of Materials) data refers to a collection of attribute information for all components on a circuit board during the design and manufacturing process of electronic products. It is typically exported from EDA (Electronic Design Automation). The first digit is a character code used in the BOM to uniquely identify the location of a component in the circuit diagram (e.g., R1, C2). The material type distinguishes the physical or electrical properties of the component (e.g., resistor, capacitor, chip). The parameter value characterizes the specific size and specifications of the component (e.g., resistance 10kΩ, capacitance 10uF). The first package information refers to the physical pad size and shape identifier (e.g., 0603, 0805, TO-220) occupied by the component when soldered on the printed circuit board (PCB) as defined in the BOM.

[0027] A coordinate file is a file exported after the PCB layout design is completed. It records the spatial positions, rotation angles, and package characteristics of all physical components on the actual PCB board. The second reference designator and the second package information correspond to the actual component reference designator and package type in the actual PCB layout, respectively. The second reference designator and the first reference designator are theoretically related, used to indicate the specific physical mounting coordinates of the component on the PCB board. The second package information and the first package information are also theoretically related, used to indicate the actual physical dimensions and pin spacing required for the component on the PCB board pads.

[0028] S200, perform self-check processing on BOM data, and generate corresponding self-check error prompts when self-check anomalies are found. The self-check processing includes: determining multiple components belonging to the first category of materials from the BOM data according to preset material classification rules; if there are at least two components with the same material type, the same first packaging information, and the difference in parameter values ​​within the preset tolerance range, then generate a normalization and merging prompt for at least two components. Self-inspection refers to the review of the logical rigor, data compliance, and material redundancy of the BOM data itself before cross-file comparison. The core purpose of this process is to clean up and standardize internal logical errors, redundant data, and items that do not conform to production specifications within the BOM data itself before physically matching it with external coordinate files, thereby avoiding distortion of the final verification results due to inherent flaws in the BOM data.

[0029] Bill of Materials (BOM) data typically covers a variety of physical components, including but not limited to surface mount resistors, surface mount capacitors, surface mount inductors, surface mount diodes, surface mount transistors, surface mount integrated circuits, through-hole resistors, through-hole capacitors, through-hole inductors, through-hole diodes, through-hole transistors, through-hole integrated circuits, and various connectors.

[0030] In the self-inspection process, it is necessary to first identify multiple components belonging to the first category of materials from the BOM data according to the preset material classification rules. The first category of materials usually refers to surface mount (SMT) materials. In the circuit boards of electronic products, surface mount materials account for the vast majority of the total number of materials (usually more than 80%). Furthermore, due to the characteristics of miniaturization, high precision, and high consistency of surface mount devices, it is very easy for similar models and minimal parameter differences to occur, resulting in serious redundancy in the bill of materials, increasing procurement costs and reducing inventory turnover efficiency.

[0031] The preset material classification rules can be based on packaging form, such as directly reading the material type field and the first packaging information field in the BOM data, and identifying whether the packaging information contains standard surface mount package identifiers (e.g., 0603, 0805, SOT-23, QFN, etc.). If such identifiers are present, the component is determined to belong to the first category of materials. Alternatively, it can be based on installation method, such as dividing material types into different attribute groups. For example, capacitors and resistors are classified as first-category materials, while structural components or connectors are classified into other categories, thus filtering first-category materials based on attribute groups.

[0032] Same material type means that these components have completely identical physical property classifications (e.g., all are surface mount resistors or all are surface mount capacitors). Same first package information means that these components have completely identical external dimensions and pin arrangement specifications on the circuit board (e.g., all are 0603 packages). Parameter value refers to the electrical characteristic value required by the component in the circuit design (e.g., resistance of 10kΩ or capacitance of 10uF). Preset tolerance range is a pre-set maximum allowable range used to measure the difference between two parameter values.

[0033] In the actual R&D and BOM (Bill of Materials) formulation of electronic products, due to factors such as differences in selection habits during multi-module collaborative development, direct adoption of reference design parameters for different chips, and failure to proactively round off theoretical calculation values ​​to standard components (i.e., actively aligning and approximately replacing precise but non-standard parameter values ​​obtained from theoretical calculations with the values ​​of conventional general-purpose components in the industry), BOM data often contains redundant components with identical material types and packages, but only minor differences in parameter values ​​(i.e., within the tolerance range of engineering equivalent substitution). If left unchecked, these functionally equivalent components will not only excessively occupy feeder resources in the SMT (Surface Mount Technology) assembly stage and reduce production line utilization, but also disperse procurement batches, significantly increasing material procurement costs and increasing the risk of inventory obsolescence. Therefore, by introducing an automated comparison mechanism with a preset tolerance range, these redundant components with merging value can be identified and a normalization and merging prompt can be generated, thereby completing the normalization and standardization of materials, effectively reducing the difficulty of supply chain management and actual manufacturing costs.

[0034] In an optional implementation, the preset tolerance range is: under the same material type, the absolute value of the difference between any two parameter values ​​is less than or equal to 10% of one of the parameter values.

[0035] Specifically, if both component A and component B are surface mount resistors and their first package information is "0603", with component A having a parameter value of 10kΩ and component B having a parameter value of 10.5kΩ, and the difference between them being 0.5kΩ, and this difference accounts for 5% of the value of component A, which is less than 10%, then the two components are determined to meet the unification and merging conditions, and a unification and merging prompt is generated.

[0036] It should be noted that, in addition to the 10% tolerance range, different tolerance ranges can be set according to different types of materials. For example, for precision resistors (1% accuracy), a preset tolerance range of 5% can be set; for ordinary capacitors (10% accuracy), a preset tolerance range of 15% can be set. Alternatively, it can be set to dynamically adjust according to the parameter value, for example, a tolerance of 1Ω when the parameter value is less than 100Ω, and a tolerance of 10% when the parameter value is greater than 100Ω.

[0037] In some possible implementations, the method further includes: determining multiple components belonging to the second category of materials from the BOM data according to preset material classification rules, and extracting the first packaging information corresponding to the second category of materials; If the first packaging information corresponding to the second type of material includes preset auxiliary material characteristic characters, an auxiliary material addition prompt will be generated.

[0038] The second category of materials refers to through-hole (DIP) materials, which are the counterpart to the first category of materials (surface mount technology, SMT materials). Because through-hole materials are usually larger and have thicker leads, they need to be soldered onto the circuit board through vias. Therefore, in the actual production and assembly process, these materials often require additional physical accessories to assist in their installation.

[0039] The purpose of extracting the first package information corresponding to the second type of material is to identify the specific physical specifications of the plug-in material. In a specific example, the preset auxiliary material characteristic character is specifically set as a high-power package characteristic character, which includes at least "TO-220" or "TO-247". This characteristic character is set because "TO-220" and "TO-247" packages are typical high-power discrete device packages (such as power transistors, MOSFETs, or voltage regulators). These devices generate a lot of heat during operation. In order to ensure that the device can dissipate heat properly and be securely fixed on the circuit board, auxiliary materials such as heat sinks, insulating pads, fastening screws, or thermal grease are often required in actual production. If only the high-power device itself is recorded in the BOM data, and the supporting auxiliary materials are omitted, the lack of heat sinks will directly lead to the product being unable to be assembled during production line assembly, or the product will burn out due to poor heat dissipation after forced assembly.

[0040] It should be noted that the preset auxiliary material characteristic characters are not limited to "TO-220" or "TO-247", but can be set according to different auxiliary material requirements. For example, for high-power plug-in packages such as "TO-3P" and "TO-126", corresponding heat dissipation auxiliary materials also need to be added; or, according to the heat dissipation solutions customized by different manufacturers, specific engineering description characters such as "with heat sink" can be used as characteristic characters to trigger the addition of auxiliary materials.

[0041] In an optional implementation, the BOM data further includes material codes, and multiple components belonging to the first and second categories of materials are identified from the BOM data according to preset material classification rules, including: Identify the prefix characters of the material codes corresponding to each component in the BOM data; Components that meet the first preset prefix are classified as first-class materials, and components that meet the second preset prefix are classified as second-class materials; The first category of materials consists of surface mount (SMT) materials, and the second category consists of through-hole (DIP) materials.

[0042] Each component in the BOM data has a unique material code, which serves as its identifier. The material code typically follows a set format, especially the first few characters, which often directly represent the component's major category. Therefore, after reading the BOM data, the material codes of all components are extracted. The specific steps are: using character extraction functionality to obtain the prefix characters (e.g., the first two numeric characters) of the material code corresponding to each component in the BOM data, and then classifying the components based on these prefix characters.

[0043] In a specific example, the first preset prefix is ​​set to the number "11", and the second preset prefix is ​​set to the number "12". Then, by traversing each line of the BOM data, the first two digits of the material code field are extracted. If the extracted first two digits match "11", the component is classified as a first-category material (i.e., SMT surface mount material), which is automatically picked up and mounted by surface mount equipment. If the extracted first two digits match "12", the component is classified as a second-category material (i.e., DIP through-hole material), which requires insertion of pins into PCB vias by a through-hole machine before wave soldering.

[0044] It should be noted that the first and second categories of materials are not necessarily limited to SMT surface mount components and DIP through-hole components. As long as components are divided into at least two categories through preset material classification rules, and differentiated verification logic is applied to different categories to adapt to different production processes, technological requirements, or management needs, they should all fall within the scope of this application's embodiments. For example, in a specific application scenario, the system can classify high-value or demanding core components such as main control chips and memory chips into the first category of materials, while classifying conventional resistors, capacitors, or structural components into the second category of materials. This allows for the application of stricter parameter verification logic to the first category of materials, with a focus on preventing significant production losses due to incorrect selection of core components.

[0045] It's understandable that the preset material classification rules aren't limited to recognizing "material code prefix characters." For example, they can also be implemented by recognizing the "material type" field in the BOM data (such as directly extracting attribute information like "resistor," "capacitor," or "integrated circuit"), or the "installation method" field (such as directly extracting the "surface mount" or "plug-in" attributes). Correspondingly, the first and second preset prefixes aren't limited to numbers; they can also be English letters, specific symbols, or a string containing a specific meaning, as long as it can distinguish at least two types of materials according to the rule.

[0046] In an optional implementation, the BOM data also includes a numerical usage field, remarks information, and material optimization level; and generates corresponding self-check anomaly prompts when self-check anomalies exist, further including: The system parses the number of separators in the first digit of the BOM data, adds one to the number of separators to determine the theoretical usage, and compares the theoretical usage with the numerical usage field recorded in the BOM data. If they are inconsistent, a usage mismatch error message is generated.

[0047] Specifically, the number of separators refers to the number of punctuation marks used to separate multiple independent position numbers in the first position number field. In a specific example, if the first position number string is "R1,R2,R3", the number of separators is two commas.

[0048] Determining the theoretical usage by adding one to the number of delimiters is based on the common pattern in string concatenation: N delimiters will divide the string into N+1 independent position numbers. For example, 0 delimiters mean only 1 position number, and 1 delimiter means 2 position numbers. Therefore, one must be added to the identified number of delimiters to equal the actual number of components in that row. The numerical usage field refers to the "Quantity" integer column specifically set up in the BOM table to record the actual total number of components assembled in that row. If the calculated theoretical usage does not match the value recorded in the numerical usage field (for example, the theoretical usage is calculated as 3, but the numerical usage field records 5), it means that there is a duplicate or omission in the BOM, and the system will immediately generate a usage mismatch error message.

[0049] It should be noted that the type of separator is not limited to commas; it can also be semicolons, pause marks, spaces, or newlines.

[0050] Identify the material optimization level of each component in the BOM data. If the material optimization level belongs to the preset set of restricted levels, generate a restricted level exception prompt and output the corresponding recommended alternative component solution based on the preset list of alternative components.

[0051] Specifically, material optimization level refers to the attribute field set in the BOM table to distinguish the priority and compliance of material procurement. It usually includes "Preferred", "Optional", "Caution", "Prohibited", and "Prohibited Procurement". The restricted level set refers to a set of levels that belong to strictly restricted or negative status (such as "Prohibited Procurement", "Prohibited", and "Caution") pre-configured by the system. The preset alternative component list refers to a mapping table stored in advance in the system database. This table records the correspondence between restricted material codes and their corresponding alternative material codes with equivalent electrical performance and better level, and includes the complete parameter attributes of the alternative materials.

[0052] In a specific example, if the material optimization level of component A is "prohibited", after checking the alternative list, it is found that component B (preferred level) is fully compatible with the electrical parameters of component A. The interface will immediately generate a restricted level exception prompt and directly output component B as the recommended solution.

[0053] For example, if component C's material optimization level is "Prohibited from Procurement" (meaning the material has been discontinued or blacklisted by the company's supply chain), the system will generate a restricted level anomaly alert and, based on the alternative component list, will forcibly output component D, which is in a normal procurement status, as the recommended alternative. Similarly, if component E's material optimization level is "Choose with Caution" (meaning the material is allowed, but there are potential supply chain risks such as long lead times, large price fluctuations, or exclusive distribution), the system will also generate a restricted level anomaly alert to provide early risk warning and prioritize outputting component F, which has a more stable supply, as the recommended alternative.

[0054] Identify whether there are components in the BOM data with the same material code but different remarks. If so, generate a duplicate material exception prompt.

[0055] Specifically, remarks information refers to free text fields appended to the material code in the BOM (Bill of Materials) to describe the material’s specific use, batch differences, specification details, or special process requirements.

[0056] In a specific example, a component with material code 12345 might have a description of "red casing"; however, in another line, the same material code 12345 might have a description of "black casing." This discrepancy between the same physical material code and different descriptions can easily lead to the mistaken belief that they are two different materials, resulting in duplicate orders. Therefore, when this situation is detected, a duplicate order exception alert is generated.

[0057] It should be noted that, in addition to usage mismatch, restricted levels, and duplicate materials, other self-checking processes can be added: For example, tag number missing check: identify whether there are blank tag number fields or tag numbers that do not conform to the specifications (such as missing numbers) in the BOM data. Parameter value invalidity check: identify whether the parameter values ​​in the BOM data are "0", "none", or illegal characters outside the range. Material code existence check: send the material code to the middleware system; if the code does not exist or has expired in the middleware system, an exception message is generated. Version number check: identify whether the BOM data has the correct version number (such as V1.0) to prevent the use of an expired version of the BOM for production.

[0058] S300, based on the first bit and the second bit, match and compare to determine whether there is a difference or anomaly between the BOM data and the coordinate file, and generate a matching anomaly prompt when there is a difference or anomaly. Matching and comparison refers to the system treating the first digit in the BOM data and the second digit in the coordinate file as two independent sets of identifiers, performing a one-to-one cross-comparison and verification to confirm whether there are corresponding identical items in the other set. This is to discover inconsistencies in the component composition between the two data sets, and to determine the differences and anomalies between them. Finally, the differences and anomalies are generated to produce corresponding matching anomaly prompts.

[0059] In some possible implementations, the coordinate file also includes a target field; identifying discrepancies between the BOM data and the coordinate file includes: When a certain first digit exists and a corresponding second digit does not exist, it is determined that there is a multi-material anomaly. When a certain first bit number does not exist, but a corresponding second bit number exists, determine whether the target field corresponding to the second bit number in the coordinate file contains a preset reserved character identifier; if it does, it is determined to be a normal reserved component; if it does not, it is determined that there is a shortage of materials. When the first bit number matches the second bit number, the corresponding first encapsulation information and the second encapsulation information are compared. If they do not match, it is determined that there is an encapsulation mismatch anomaly.

[0060] The target field in the coordinate file describes the special status attributes of the component on the PCB board. This target field can be a Comment column in the coordinate file or a marker column specifically set by the software system to distinguish specific components. The default reserved character identifier is specifically set to the character "NC", which represents the "not soldered" or "reserved" attribute. If the target field corresponding to a certain second position number in the coordinate file contains the character "NC", it means that the component belongs to a reserved position and does not need to be reflected in the BOM. Therefore, it is determined to be a normal reserved component, and no error message is generated. Conversely, if the target field does not contain the character, it means that the component actually exists on the PCB board and needs to be soldered, but it is not registered in the BOM data. In this case, the system determines that there is a shortage of components.

[0061] It should be noted that whether it is a self-inspection anomaly prompt generated by the self-inspection process (such as unification and merging, usage mismatch, restricted level, duplicate material, etc.) or a matching anomaly prompt generated by the matching comparison (such as excess material, insufficient material, packaging mismatch, etc.), verification feedback information can be generated in a unified way and centrally displayed on the interface (for example, through pop-up prompts or highlighting next to the corresponding item) for easy and intuitive viewing.

[0062] In a specific example, when the system traverses the coordinate file and finds that the second position number "C10" does not exist in the BOM data, the system further reads the coordinate file and finds that "NC" is written in the target field corresponding to "C10". Then, it determines that "C10" is a normal reservation and skips it without reporting an error. If the system finds that the second position number "C20" does not exist in the BOM data and the target field corresponding to "C20" is empty, then it determines that "C20" has a material shortage exception.

[0063] When the system finds the first number "R100" when it is traversing the BOM data, but does not find "R100" when it is traversing the coordinate file, the system determines that "R100" is an abnormality of multiple materials.

[0064] When the system matches the same tag number in both sets of data (e.g., both the first and second tags are "U1"), the system will continue to extract the first encapsulation information (from the BOM data) and the second encapsulation information (from the coordinate file) corresponding to that tag number and compare them character by character. If the two encapsulation information strings are different (e.g., 0603 in the BOM and 0805 in the coordinate file), it is determined that the tag number has an encapsulation mismatch anomaly.

[0065] S400 generates verification feedback information based on self-test anomaly prompts and matching anomaly prompts; Verification feedback information refers to a structured set of verification feedback data formed by uniformly retrieving, summarizing, classifying, and formatting the above-mentioned different types of prompts (such as self-check anomaly prompts and matching anomaly prompts); this verification feedback information is used to centrally present the judgment results generated by each verification step.

[0066] In some possible implementations, the method further includes: correcting the BOM data in response to a correction instruction for the verification feedback information, and outputting the corrected target BOM data.

[0067] A correction instruction refers to a trigger signal generated in response to confirmation, modification, or replacement actions issued in response to various self-test anomaly or difference anomaly prompts in the verification feedback information. This trigger signal is used to drive the system to perform data maintenance operations. The trigger signal is directly mapped to the corresponding data field in the BOM data to correct the abnormal data field and output the corrected target BOM data.

[0068] Specifically, the system visually outputs verification feedback information, including self-test anomaly prompts and matching anomaly prompts, through a graphical user interface (GUI). The correction command can be a human-machine interaction signal triggered by the operator through an input device based on the visual interface (e.g., a trigger signal generated by clicking the corresponding "Confirm Merge" or "Add Auxiliary Materials" controls on the interface); or, the correction command can be a program call command automatically generated by the underlying logic judgment module in the background according to a pre-configured automatic maintenance strategy. After receiving and parsing the human-machine interaction signal or program call command, the processor drives the underlying data processing module to perform objective physical storage state change actions such as overwriting, deleting, or inserting corresponding fields in the BOM data, thereby completing the automated correction of the BOM data.

[0069] In some possible implementations, the BOM data is corrected in response to a correction instruction for the verification feedback information, including: In response to the correction instruction for the usage mismatch error message, the corresponding numerical usage field in the BOM data is modified; Specifically, the theoretical usage value is directly written into the corresponding numerical usage field in the BOM data to overwrite the original value in that field.

[0070] In response to the correction instruction for the abnormal indication of the restricted level, the component whose material optimization level belongs to the preset restricted level set is replaced with the recommended alternative component; Specifically, based on the material code of the restricted component, a search is performed in the preset list of alternative components. After finding the corresponding alternative component code, the material code of the original component in the BOM data is replaced with the material code of the alternative component. At the same time, the material name, parameter values, description and other attribute information of the component are automatically updated to make it consistent with the complete data of the alternative component.

[0071] In response to the correction instruction for the duplicate material anomaly, components with the same material code in the BOM data are merged into a group; Specifically, when multiple data rows with the same material code are located, one row is selected as the retained row (e.g., the row containing the first digit R1) and used as the unique representative of that material code. The numerical usage values ​​corresponding to other redundant rows are extracted and added to the numerical usage field of the retained row. Then, the other redundant data rows are deleted.

[0072] In some possible implementations, the BOM data is corrected in response to a correction instruction for the verification feedback information, including: In response to the correction command for the material shortage anomaly, the corresponding second reference number and related component information in the coordinate file are added to the BOM data; Specifically, based on the second digit corresponding to the missing first digit, the second packaging information, parameter values, and material code corresponding to that digit are extracted in reverse, and this complete data is inserted into the BOM data as a new row.

[0073] In response to the correction command for the multi-material anomaly, the first digit information that only exists in the BOM data is deleted from the BOM data; Specifically, if the first digit that cannot be matched in the coordinate file is located, the first digit is removed from the digit field of the row containing the BOM data.

[0074] In response to a correction instruction for a package mismatch exception, modify the first package information corresponding to the first digit in the BOM data; Specifically, the second encapsulation information extracted from the coordinate file is used as the target data to directly replace the first encapsulation information corresponding to that position in the BOM data.

[0075] In some possible implementations, the BOM data is corrected in response to a correction instruction for the verification feedback information, including: In response to a correction instruction for a unification merge prompt, at least two components are merged into a single target component, and the corresponding component's numerical usage field in the BOM data is updated.

[0076] Specifically, from multiple components that meet the unification and merging criteria, one component is selected as the target component (i.e., the retained component). This target component carries the material attributes (i.e., material type, parameter values, and first packaging information) of all the components to be merged. The system processes the tag information corresponding to other components (e.g., deleting the independent data row) and adds the numerical usage corresponding to these components to the numerical usage field of the target component, thereby completing the merging.

[0077] In a specific example, if component A (first tag number R1) and component B (first tag number R2) meet the requirements of having the same material type, the same package, and parameter differences within a preset tolerance range, after the system responds to the merge command, it retains component A as the target component, deletes the data row containing component B, and adds the value usage of component B (1) to the value usage field of component A, updating the value usage of component A from 1 to 2. It should be noted that although component B's tag number R2 no longer exists as a separate row in the BOM list, the physical location information corresponding to tag number R2 is still retained in the coordinate file. Therefore, during actual production placement, the system can still accurately place the material based on the position in the coordinate file, preventing missed or incorrect placement.

[0078] In some possible implementations, the BOM data is corrected in response to a correction instruction for the verification feedback information, including: In response to the confirmation command for adding auxiliary materials, the complete component information corresponding to the auxiliary materials is added to the BOM data; Specifically, based on the identified components containing characteristic characters such as TO-220 or TO-247, the corresponding auxiliary material information is retrieved from the preset auxiliary material list library; a new data row is generated based on the retrieval results, and the complete attribute data such as the auxiliary material's code, name, parameters, and packaging are filled into the row, which is then inserted into the BOM data.

[0079] In some possible implementations, correcting the BOM data in response to a correction instruction for the verification feedback information further includes: In response to the new component instruction, obtain the new material code; Based on the newly added material code, retrieve the corresponding complete component attribute data from the preset material management system.

[0080] Specifically, upon receiving a new component instruction, the system reads the input material code and sends it to the pre-defined material management system (middle platform system). It then retrieves complete attribute data corresponding to the code, including material name, material type, parameter values, and packaging information. After the retrieval is complete, a new BOM record is automatically created using this data, and the corresponding fields are filled in according to the BOM format, thus completing the automatic mounting of the new component.

[0081] In one possible implementation, before performing a matching comparison based on the first and second digits, the following steps are also included: According to the preset sorting rules, the first number in the BOM data and the second number in the coordinate file are rearranged to obtain the sorted first number sequence and second number sequence. Matching and comparison based on the first digit and the second digit includes: matching and comparison based on the sequence of the first digit and the sequence of the second digit; The preset sorting rules include: arranging according to alphabetical order and numerical order.

[0082] Specifically, since the BOM data and coordinate files directly exported from EDA are usually generated according to the order in which the schematic was drawn or placed, their tag numbers are often completely disordered. For example, the tag numbers in the BOM data may be listed in the order of R10, R2, R1, C5, while the tag numbers in the coordinate file may be completely different, listed in the order of C5, R1, R10, R2. If a global traversal search is performed directly on these two disordered sets, when matching a certain tag number, a full search in another file is often required. This will multiply the computational load and make it very easy to miss matches, seriously affecting the verification efficiency and data accuracy.

[0083] The preset sorting rule can be as follows: first, sort by the alphabetical order of the English letters in the position number (A to Z); then, if the English letters are identical, sort by the numerical value following the letter in a second-level ascending order. The numerical sorting is based on the actual numerical value of the numbers, not on the string length. For example, the sorted result would be C1, C2, C10, C100, R1, R2, R10, instead of the string-ordered C1, C10, C100, C2. This natural sorting method combining letters and numbers ensures that the position number sequence exhibits an increasing relationship, significantly simplifying the subsequent comparison process.

[0084] After obtaining the two sorted sequences, the matching logic is further simplified. Global traversal is no longer needed; instead, the matching is performed sequentially or item-by-item, based on the order of the first and second position sequences. For example, starting from the beginning of the sequence, the R1 corresponding to the first position in the sorted first position sequence is compared with the R1 corresponding to the first position in the sorted second position sequence; then, the second position R2 is compared with R2, and so on. This order-based matching method reduces computational intensity, and the consistency of the two sequences ensures the accuracy and efficiency of the anomaly identification process.

[0085] Figure 2 A detailed logical execution flow diagram of a BOM data verification method is shown, and its specific process is as follows: Step 1: Obtain the BOM data to be verified and the corresponding coordinate file, and then proceed to Step 2; Step 2: Identify the material code prefix characters corresponding to each component in the BOM data, classify the components that meet the first preset prefix into the first category of materials (SMT surface mount type), and classify the components that meet the second preset prefix into the second category of materials (DIP insertion type); then execute steps 3 and 5 in parallel. Step 3: For the first type of material, determine whether there are at least two components with the same material type, the same first packaging information, and a difference in parameter values ​​within the preset tolerance range (10%). If yes, proceed to step 4; otherwise, proceed to step 7. Step 4: For at least two components that meet the conditions, generate a normalization merge suggestion and proceed to Step 7; Step 5: For the second type of material, extract its first packaging information and determine whether the packaging information contains preset auxiliary material characteristic characters (such as TO-220 or TO-247). If yes, proceed to step 6; otherwise, proceed to step 7. Step Six: Determine if additional ingredients are needed, generate an ingredient addition prompt, and proceed to Step Seven; Step 7: Perform a global self-check on the BOM data: compare whether the theoretical usage and numerical usage fields are consistent, identify whether the material optimization level belongs to the restricted set, and identify whether there are components with the same material code but different remarks information; if any of the above situations exist, proceed to step 8, otherwise proceed to step 9; Step 8: Generate the corresponding error messages such as dosage mismatch, restricted level, or duplicate material, and then proceed to Step 9; Step 9: Rearrange the first digit in the BOM data and the second digit in the coordinate file according to alphabetical order and numerical order, and then proceed to Step 10; Step 10: Based on the permuted sequence, perform matching and comparison to determine if any of the following situations exist: the first number exists but the second number is missing (excess material); the first number does not exist but the second number exists, and the target field does not have reserved identifiers such as "NC" (insufficient material); the number is the same but the first and second encapsulation information is inconsistent (encapsulation mismatch); if they exist, proceed to Step 11; otherwise, proceed to Step 12. Step 11: Generate matching exception prompts for excess material exception, insufficient material exception, or packaging mismatch exception, and then proceed to Step 12; Step 12: Summarize the self-check anomaly prompts and matching anomaly prompts generated in the above steps to generate verification feedback information; proceed to Step 13; Step 13: Determine if a correction instruction for the verification feedback information has been received. If yes, execute the corresponding data modification (such as updating usage, replacing restricted parts, supplementing missing materials, merging redundant components, etc.) and output the corrected target BOM data; if no, wait for the correction instruction or respond to the user's exit instruction and use the current BOM data as the target BOM data.

[0086] Figure 3 A structural block diagram of a BOM data verification device is shown; like Figure 3As shown, this application also provides a BOM data verification device 600, comprising: The data acquisition module 601 is used to acquire the BOM data to be verified and the corresponding coordinate file. The BOM data includes at least the first digit, material type, parameter value and first packaging information. The coordinate file includes at least the second digit and second packaging information. The self-check processing module 602 is used to perform self-check processing on the BOM data and generate a corresponding self-check error prompt when a self-check error exists. The self-check processing includes: determining multiple components belonging to the first type of material from the BOM data according to preset material classification rules; if at least two of the multiple components have the same material type, the same first packaging information, and the difference in parameter values ​​is within a preset tolerance range, then generating a normalization and merging prompt for the at least two components. The matching and comparison module 603 is used to perform a matching and comparison based on the first bit and the second bit to determine whether there is a difference or anomaly between the BOM data and the coordinate file, and to generate a matching anomaly prompt when there is a difference or anomaly. Feedback module 604 generates verification feedback information based on the self-test anomaly prompt and the matching anomaly prompt.

[0087] Figure 4 This is a block diagram of an electronic device 700 according to an exemplary embodiment.

[0088] like Figure 4 As shown, one embodiment of this application provides an electronic device 700. The electronic device 700 includes a memory 701, a processor 702, and an input / output (I / O) interface 703. The memory 701 stores instructions. The processor 702 executes the BOM data verification method of this application by calling the instructions stored in the memory 701. The processor 702 is connected to both the memory 701 and the I / O interface 703, for example, via a bus system and / or other forms of connection mechanisms (not shown). The memory 701 can be used to store programs and data, including the program for the BOM data verification method involved in the embodiments of this application. The processor 702 executes various functional applications and data processing of the electronic device 700 by running the program stored in the memory 701.

[0089] In this embodiment, the processor 702 can be implemented in at least one of the following hardware forms: digital signal processor (DSP), field programmable gate array (FPGA), and programmable logic array (PLA). The processor 702 can be one or a combination of several of the following: central processing unit (CPU) or other processing units with data processing capability and / or instruction execution capability.

[0090] The memory 701 in this embodiment may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. Volatile memory may include, for example, random access memory (RAM) and / or cache memory. Non-volatile memory may include, for example, read-only memory (ROM), flash memory, hard disk drive (HDD), or solid state drive (SSD).

[0091] In this embodiment, the I / O interface 703 can be used to receive input instructions (such as numeric or character information, and to generate key signal inputs related to user settings and function control of the electronic device 700), and can also output various information (such as images or sounds) to the outside. In this embodiment, the I / O interface 703 may include one or more of the following: a physical keyboard, function keys (such as volume control keys, power buttons, etc.), a mouse, a joystick, a trackball, a microphone, a speaker, and a touch panel.

[0092] In some embodiments, this application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps in the above-described method embodiments.

[0093] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these. The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described; however, as long as the combinations of these technical features are not contradictory, they should be considered within the scope of this specification.

[0094] In some embodiments, this application provides a computer program product comprising a computer program that, when executed by a processor, performs any of the methods described above.

[0095] Although the operations are described in a specific order in the accompanying drawings, this should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all of the operations shown to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0096] The methods, apparatus, devices, and storage media of this application can be implemented using standard programming techniques, and various method steps can be implemented using rule-based logic or other logic. It should also be noted that the terms "apparatus" and "module" as used herein and in the claims are intended to include implementations using one or more lines of software code and / or hardware implementations and / or devices for receiving input.

[0097] Any step, operation, or procedure described herein may be performed or implemented using one or more hardware or software modules, either alone or in combination with other devices. In one embodiment, the software module is implemented using a computer program product comprising a computer-readable medium containing computer program code, which is executable by a computer processor to perform any or all of the described steps, operations, or procedures.

[0098] The foregoing description of implementations of this application has been provided for illustrative and descriptive purposes. The foregoing description is not exhaustive and is not intended to limit this application to the exact forms disclosed. Various modifications and variations may exist in accordance with the foregoing teachings, or may arise from practice of this application. These embodiments were chosen and described to illustrate the principles of this application and its practical application, enabling those skilled in the art to utilize this application in various implementations and modifications to suit the specific purpose of the concept.

[0099] Regarding the apparatus in the above embodiments, the specific manner in which each module performs its operation has been described in detail in the embodiments related to the method, and will not be elaborated upon here.

[0100] It can be further understood that, unless otherwise specified, "connection" includes both direct connections where no other components exist between the two parties and indirect connections where other components exist between them.

[0101] It is further understood that although the operations are described in a specific order in the accompanying drawings in the embodiments of this application, this should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all the operations shown to be performed to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0102] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the field of this application that are not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0103] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

[0104] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A method for verifying BOM data, characterized in that, include: Obtain the BOM data to be verified and the corresponding coordinate file. The BOM data includes at least the first digit, material type, parameter value and first packaging information. The coordinate file includes at least the second digit and second packaging information. Perform a self-check on the BOM data and generate a corresponding self-check error message when a self-check error occurs. The self-check process includes: determining multiple components belonging to the first category of materials from the BOM data according to preset material classification rules; if at least two of the multiple components have the same material type, the same first packaging information, and the difference in parameter values ​​is within a preset tolerance range, then generate a normalization and merging prompt for the at least two components. Based on the matching and comparison of the first bit and the second bit, it is identified whether the first bit and the second bit correspond one by one, and whether the corresponding first encapsulation information and the second encapsulation information are consistent, so as to determine whether there is a difference or anomaly between the BOM data and the coordinate file, and generate a matching anomaly prompt when there is a difference or anomaly. Verification feedback information is generated based on the self-test anomaly prompts and the matching anomaly prompts.

2. The BOM data verification method as described in claim 1, characterized in that: The preset tolerance range is defined as follows: under the same material type, the absolute value of the difference between any two parameter values ​​is less than or equal to 10% of one of the parameter values.

3. The BOM data verification method as described in claim 1, characterized in that, Also includes: According to the preset material classification rules, multiple components belonging to the second category of materials are identified from the BOM data, and the first packaging information corresponding to the second category of materials is extracted. If the first packaging information corresponding to the second type of material includes preset auxiliary material characteristic characters, an auxiliary material addition prompt will be generated.

4. The BOM data verification method as described in claim 3, characterized in that: The preset auxiliary material characteristic characters are high-power packaging characteristic characters, and the high-power packaging characteristic characters include at least TO-220 or TO-247.

5. The BOM data verification method as described in claim 3, characterized in that, The BOM data also includes material codes; The step of determining multiple components belonging to the first and second categories of materials from the BOM data according to preset material classification rules includes: Identify the prefix characters of the material codes corresponding to each component in the BOM data; Components that satisfy the first preset prefix are classified as the first type of material, and components that satisfy the second preset prefix are classified as the second type of material; The first category of materials consists of surface mount (SMT) materials, and the second category consists of through-hole (DIP) materials.

6. The BOM data verification method as described in claim 1, characterized in that, The BOM data also includes material codes, numerical usage fields, remarks information, and material optimization levels; The generation of corresponding self-check exception prompts when self-check exceptions are found also includes: The number of separators in the first digit of the BOM data is parsed. The theoretical usage is determined by adding one to the number of separators. The theoretical usage is then compared with the numerical usage field recorded in the BOM data. If they do not match, a usage mismatch error message is generated. Identify the material optimization level of each component in the BOM data. If the material optimization level belongs to a preset set of restricted levels, generate a restricted level exception prompt. The system identifies whether there are components in the BOM data that have the same material code but different remarks. If so, a duplicate material error message is generated.

7. The BOM data verification method as described in claim 1, characterized in that, The coordinate file also includes a target field; Determining whether there are any discrepancies between the BOM data and the coordinate file includes: When a certain first bit exists and no corresponding second bit exists, it is determined that there is a multi-material anomaly. When a certain first bit number does not exist, but a corresponding second bit number exists, determine whether the target field corresponding to the second bit number in the coordinate file contains a preset reserved character identifier; if it does, it is determined to be a normal reserved component; if it does not, it is determined that there is a shortage of materials. When the first bit number matches the second bit number, the corresponding first encapsulation information and the second encapsulation information are compared. If they do not match, it is determined that there is an encapsulation mismatch anomaly.

8. A BOM data verification method as described in claim 1, characterized in that, Before the matching and comparison based on the first bit number and the second bit number, the method further includes: According to the preset sorting rules, the first number in the BOM data and the second number in the coordinate file are rearranged to obtain the sorted first number sequence and second number sequence. The matching comparison based on the first bit number and the second bit number includes: matching comparison based on the first bit number sequence and the second bit number sequence; The preset sorting rules include: arranging according to alphabetical order and numerical order.

9. A BOM data verification method as described in any one of claims 1-8, characterized in that, Also includes: In response to the correction instruction for the verification feedback information, the BOM data is corrected, and the corrected target BOM data is output.

10. A BOM data verification device, characterized in that, include: The data acquisition module is used to acquire the BOM data to be verified and the corresponding coordinate file. The BOM data includes at least the first digit, material type, parameter value and first packaging information. The coordinate file includes at least the second digit and second packaging information. The self-check processing module is used to perform self-check processing on the BOM data and generate a corresponding self-check error prompt when a self-check error exists. The self-check processing includes: determining multiple components belonging to the first type of material from the BOM data according to preset material classification rules; if at least two of the multiple components have the same material type, the same first packaging information, and the difference in parameter values ​​is within a preset tolerance range, then generating a normalization and merging prompt for the at least two components. The matching and comparison module is used to perform a matching and comparison based on the first bit and the second bit to determine whether there is a difference or anomaly between the BOM data and the coordinate file, and to generate a matching anomaly prompt when there is a difference or anomaly. The feedback module is used to generate verification feedback information based on the self-test anomaly prompt and the matching anomaly prompt.

11. An electronic device, characterized in that, include: The device includes an input unit, a memory, at least one processor, and an output unit, wherein the memory stores program instructions that can be executed on the processor, and the processor can execute the BOM data verification method as described in any one of claims 1 to 9 by calling the program instructions.

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