Display module and display device

Abstract

This invention discloses a display module and a display device. The display module includes: a display panel and a circuit board; the display panel includes a display area and a non-display area at least partially surrounding the display area; the non-display area includes a first non-display area and at least one second non-display area; the first non-display area is provided with a first panel pad, and the second non-display area is provided with a second panel pad; the circuit board includes a first circuit board and at least one second circuit board; the first circuit board includes a first circuit board pad and a first connection pad; the first circuit board pad is bonded and electrically connected to the first panel pad; the second circuit board includes a second circuit board pad and a second connection pad; the second circuit board pad is bonded and electrically connected to the second panel pad; the first connection pad and the second connection pad are connected by wire bonding. The technical solution of this invention reduces the clearance space required for the display module by using wire bonding to electrically connect the first and second circuit boards.

Description

Technical Field

[0001] The present invention relates to display technology, and more particularly to a display module and a display device. Background Technology

[0002] With the development of display technology, display devices are gradually moving towards higher screen-to-body ratios, narrower bezels, and thinner designs. Flexible display panels can be bent to the non-light-emitting side of the display panel, thereby reducing the width of the bezel on the front of the display device.

[0003] In existing three-sided bent display panels, signals on the left and right sides are typically transmitted through a secondary flexible circuit board and electrically connected to the main flexible circuit board via connectors. However, the connectors have a certain structural height, requiring clearance during assembly, which increases the local thickness of the display module and hinders the design of thinner and lighter display devices. Summary of the Invention

[0004] The present invention provides a display module and a display device, wherein a first circuit board and a second circuit board are electrically connected by means of metal wire bonding, thereby reducing the clearance space required for the display module.

[0005] In a first aspect, the present invention provides a display module, the display module comprising: a display panel and a circuit board; The display panel includes a display area and a non-display area that at least partially surrounds the display area; the non-display area includes a first non-display area and at least one second non-display area; the first non-display area is provided with a first panel pad, and the second non-display area is provided with a second panel pad; The circuit board includes a first circuit board and at least one second circuit board; the first circuit board includes a first circuit board pad and a first connection pad; the first circuit board pad is bonded and electrically connected to the first panel pad. The second circuit board includes a second circuit board pad and a second connection pad; the second circuit board pad is bonded and electrically connected to the second panel pad; The first connection pad and the second connection pad are connected by wire bonding.

[0006] In a second aspect, the present invention provides a display device, which includes the display module of the first aspect.

[0007] The technical solution of this invention involves setting a first panel pad in a first non-display area and a second panel pad in a second non-display area of ​​the display panel. This allows the first circuit board pad to be electrically bonded to the first panel pad, and the second circuit board pad to be electrically bonded to the second panel pad. This enables the first circuit board to provide signals necessary for normal operation to the display panel via its first and second panel pads, respectively. Simultaneously, by connecting the first connection pad of the first circuit board and the second connection pad of the second circuit board via wire bonding, a signal transmission path is formed between the first and second circuit boards. This allows signal transmission between the first and second circuit boards, ensuring the synchronization of signals transmitted by the first and second circuit boards, and thus guaranteeing the display panel's ability to display images correctly. Furthermore, compared to using connectors to connect the first and second circuit boards, the wire bonding typically forms an arc structure. This arc structure has a smaller structural height, reducing the clearance space required for the display module, simplifying the display module design, and facilitating a reduction in the overall thickness of the display module, thus achieving a thinner and lighter design for the display module and display device. Attached Figure Description

[0008] Figure 1 This is a schematic diagram of the structure of a display module in the prior art; Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of another display module provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of a partial film layer structure of a display module provided in an embodiment of the present invention; Figure 5 This is a partial bottom view structural diagram of a display module provided in an embodiment of the present invention; Figure 6 This is a partial bottom view of another display module provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of a partial film layer structure of another display module provided in an embodiment of the present invention; Figure 8 This is a schematic diagram of a partial film layer structure of another display module provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of a partial film layer structure of another display module provided in an embodiment of the present invention; Figure 10 This is a partial bottom view structural diagram of another display module provided in an embodiment of the present invention; Figure 11This is a partial bottom view structural diagram of another display module provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0009] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0010] Figure 1 This is a structural diagram of a display module in the prior art. For example... Figure 1 As shown, the display module 010 includes a display panel 011. The display panel 011 includes a display area AA0 and a non-display area NA0 that is at least partially surrounding the display area AA0. The display area AA0 is used to display images, and the non-display area NA0 is used to house structures such as driving circuits, signal lines, and bonding terminals. The non-display area NA0 includes a first non-display area NA01 and a second non-display area NA02 located on different sides of the display area AA0. Both the first non-display area NA01 and the second non-display area NA02 can be bent to the non-light-emitting side of the display panel to reduce the bezel width on the corresponding side of the display panel.

[0011] The first non-display area NA01 is provided with a first bonding area BA01 and a plurality of first-type signal bonding terminals 012 located in the first bonding area BA01. The plurality of first-type signal bonding terminals 012 are used for bonding and connecting with the first flexible circuit board FPC01. The second non-display area NA02 is provided with a second bonding area BA02 and a plurality of second-type signal bonding terminals 013 located in the second bonding area BA01. The second flexible circuit board FPC02 is bonded and connected with the plurality of second-type signal bonding terminals 013. One of the first flexible circuit board FPC01 and the second flexible circuit board FPC02 can be used as a main flexible circuit board, and the other can be used as a secondary flexible circuit board. The main flexible circuit board and the secondary flexible circuit board are electrically connected to each other to transmit the signals required for the normal operation of the display panel 011 between them.

[0012] In existing technologies, the primary flexible circuit board and the secondary flexible circuit board are typically electrically connected via connector 014. For example, the primary and secondary flexible circuit boards can use zero insertion force (ZIF) connectors. A ZIF connector can be placed in one of the primary and secondary flexible circuit boards, and the connection end of the other board can be inserted into the ZIF connector to achieve electrical connection between the primary and secondary flexible circuit boards. Alternatively, the primary and secondary flexible circuit boards can also use board-to-board (BTB) connectors. BTB connectors can be placed on both the primary and secondary flexible circuit boards, allowing them to engage with each other to achieve electrical connection.

[0013] However, ZIF or BTB connectors typically include an insulating shell, conductive terminals, and mating or snap-fit ​​structures, resulting in a certain structural height. Furthermore, the connector is usually located on the back of the display module 010, requiring clearance between it and the battery, mid-frame, or other assembly structures within the display module 010. This increases the design complexity of the display module 010 and the local thickness of the connector mounting area, hindering the design of a thinner and lighter display module 010.

[0014] To address the aforementioned technical problems, embodiments of the present invention provide a display module, comprising: a display panel and a circuit board; the display panel includes a display area and a non-display area at least partially surrounding the display area; the non-display area includes a first non-display area and at least one second non-display area; the first non-display area is provided with a first panel pad, and the second non-display area is provided with a second panel pad; the circuit board includes a first circuit board and at least one second circuit board; the first circuit board includes a first circuit board pad and a first connection pad; the first circuit board pad is bonded and electrically connected to the first panel pad; the second circuit board includes a second circuit board pad and a second connection pad; the second circuit board pad is bonded and electrically connected to the second panel pad; the first connection pad and the second connection pad are connected by wire bonding.

[0015] By employing the above technical solution, a first panel pad is provided in the first non-display area of ​​the display panel, and a second panel pad is provided in the second non-display area. This allows the first circuit board pad to be electrically bonded to the first panel pad, and the second circuit board pad to be electrically bonded to the second panel pad. This enables the first circuit board to provide the display panel with the signals required for normal operation through its first and second panel pads, respectively. Simultaneously, by connecting the first connection pad of the first circuit board and the second connection pad of the second circuit board via wire bonding, a signal transmission path is formed between the first and second circuit boards. This allows for signal transmission between the first and second circuit boards, ensuring the synchronization of the signals transmitted by the first and second circuit boards, and thus guaranteeing the display panel's ability to display images correctly. Furthermore, compared to using connectors to connect the first and second circuit boards, the wire bonding typically forms an arc structure. This arc structure has a smaller structural height, reducing the clearance space required for the display module, simplifying the display module design, and contributing to a reduction in the overall thickness of the display module, achieving a thinner and lighter design for the display module and display device.

[0016] The above are the core inventive points of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0017] Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of another display module provided in an embodiment of the present invention, combined with... Figure 2 and Figure 3 The display module 001 includes: a display panel 10 and a circuit board 20; the display panel 10 includes a display area AA and a non-display area NA that at least partially surrounds the display area AA; the non-display area NA includes a first non-display area NA1 and at least one second non-display area NA2; the first non-display area NA1 is provided with a first panel pad 11, and the second non-display area NA2 is provided with a second panel pad 12; the circuit board 20 includes a first circuit board 21 and at least one second circuit board 22; the first circuit board 21 includes a first circuit board pad 211 and a first connecting pad 212; the first circuit board pad 211 is bonded and electrically connected to the first panel pad 11; the second circuit board 22 includes a second circuit board pad 221 and a second connecting pad 222; the second circuit board pad 221 is bonded and electrically connected to the second panel pad 12; the first connecting pad 212 and the second connecting pad 222 are bonded and connected by a metal wire 30.

[0018] The display panel 10 includes a display area AA and a non-display area NA that is at least partially surrounding the display area AA. The display area AA may include multiple pixels and multiple display signal lines. Each pixel may include an electrically connected light-emitting element and a pixel circuit. The pixel circuit can drive the light-emitting element to emit light for display purposes. The light-emitting element may include, but is not limited to, organic light-emitting diodes (OLEDs), miniature organic light-emitting diodes (MOLEDs), and miniature light-emitting diodes (MLEDs). The pixel circuit may consist of active and / or passive devices. Active devices may include, for example, three-terminal or four-terminal devices such as transistors. Passive devices may include at least one of two-terminal or single-terminal devices such as capacitors, resistors, and inductors. In an example embodiment, the pixel circuit may be a "2T1C", "7T1C", or "8T1C" structure, where "T" represents a transistor and "C" represents a capacitor. The display signal lines may include, for example, gate signal lines and data signal lines. When the pixel circuit drives the light-emitting element to emit light for display purposes, the display area AA displays a corresponding image. The non-display area NA can be used to set up driving circuits, signal lines, panel pads, and other non-display light-emitting structures for the normal operation of the display panel 10; the panel pads can be used to bond circuit boards, driving chips, etc.; the signal lines can be electrically connected to the panel pads, as well as the display signal lines of the driving circuit or display area, so that the display signals provided by the circuit board and / or driving chip can be provided to the driving circuit and / or display signal lines through the signal lines; the driving circuit can include a gate driving circuit and a data driving circuit. The data driving circuit provides data signals to the data signal lines according to the display signals it receives, and transmits them to each pixel circuit through the data signal lines. The gate driving circuit provides gate driving signals to the gate signal lines according to the display signals it receives, so as to control the pixel circuit to perform signal writing and / or provide driving signals to the light-emitting elements to drive the light-emitting elements to perform display light emission.

[0019] Continue to refer to Figure 2 and Figure 3 The non-display area NA includes a first non-display area NA1 and at least one second non-display area NA2. The first non-display area NA1 and the second non-display area NA2 are located on different sides of the display area AA. In an optional embodiment, the first non-display area NA1 and the display area AA can be arranged along a first direction X, and the second non-display area NA2 and the display area AA can be arranged along a second direction Y. The first direction X and the second direction Y intersect.

[0020] The first non-display area NA1 is provided with at least a first panel pad 11, and the second non-display area NA2 is provided with at least a second panel pad 12. The first panel pad 11 and the second panel pad 12 can be electrically connected to the signal lines in the display area AA and / or the non-display area NA through corresponding signal lines, so as to provide the received signals to the corresponding signal lines, and to provide them to the pixels in the display area AA and / or the driving circuits in the non-display area NA through the signal lines, so as to control the driving circuits and pixels to work normally, so that the display area AA can display the image.

[0021] The circuit board 20 includes a first circuit board 21 and at least one second circuit board 22. The first circuit board 21 and the second circuit board 22 may be provided with corresponding conductive lines and devices to enable signal transmission, conversion, etc. The first circuit board 21 includes a first circuit board pad 211 and a first connecting pad 212. The first circuit board pad 211 is electrically connected to the first panel pad 11, so that the conductive lines and devices in the first circuit board 21 are sequentially connected to the signal lines in the first non-display area NA1 through the first circuit board pad 211 and the first panel pad 11, thereby enabling the first circuit board 21 to provide corresponding signals to the first non-display area NA1 of the display panel 10. The second circuit board 22 includes a second circuit board pad 221 and a second connecting pad 222. The second circuit board pad 221 is electrically connected to the second panel pad 12, so that the conductive lines and devices in the second circuit board 22 are sequentially connected to the signal lines in the second non-display area NA2 through the second circuit board pad 221 and the second panel pad 12, thereby enabling the second circuit board 22 to provide corresponding signals to the second non-display area NA2 of the display panel 10. The first connection pad 212 and the second connection pad 222 are bonded together by a metal wire 30, so that the conductive lines and devices in the first circuit board 21 can form a signal transmission path with the conductive lines and devices in the second circuit board 22 through the first connection pad 212 and the second connection pad 222.

[0022] The metal wires bonding the first connecting pad 212 and the second connecting pad 222 can be formed by thermo-ultrasonic bonding. For example, the metal wires used to form the metal wires are assembled into a bonding wedge of a bonding tool. The positioning device of the bonding tool identifies the pad positions of the first connecting pad 212 and the second connecting pad 222 to determine the first bonding position of the first connecting pad 212 and the second bonding position of the second connecting pad 222, respectively. The bonding wedge with the assembled metal wires is then moved above the first bonding position. After the bonding wedge is lowered to the first bonding position, pressure is applied to the bonding wedge, and ultrasonic vibration and heating are performed to melt the metal wires, causing the melted metal wires to form the first connecting pad 212. A first bonding point is formed; after the first bonding point is formed, the bonding wedge is controlled to move to the second bonding position, and the metal wire is pulled out in an arc shape; after the bonding wedge moves to the second bonding position, the bonding wedge is controlled to apply the corresponding pressure again, and ultrasonic vibration is performed, and the metal wire is heated to melt the metal wire, so that the melted metal wire forms a second bonding point on the second connecting pad 222; thus, the first bonding point formed on the first connecting pad 212, the second bonding point formed on the second connecting pad 222, and the arc shape between the first bonding point and the second bonding point constitute the metal wire 30 for bonding the first connecting pad 212 and the second connecting pad 222, so that the first connecting pad 212 and the second connecting pad 222 can transmit signals through the metal wire 30.

[0023] It should be noted that, when forming the metal line, the above is only an example of forming the first bonding point at the first connecting pad and then forming the second bonding point at the second connecting pad. However, in the embodiments of the present invention, the second bonding point can also be formed at the second connecting pad first and then the first bonding point can be formed at the first connecting pad. The formation order of the first bonding point and the second bonding point can be designed according to actual needs, and the embodiments of the present invention do not make specific limitations on this.

[0024] Understandably, during wire bonding, the height of the curved lead pulled out by the bonding wedge cannot be too low or too high. If the height is too low, the curved lead will be overstretched, potentially causing breakage at the connection point with the first or second bonding point. If the height is too high, the curved lead is prone to collapse, potentially touching adjacent devices and causing short circuits, and may be damaged during subsequent packaging. Therefore, to ensure the stability and accuracy of the connection between the metal wire and the first and second connecting pads, the height of the metal wire is within a certain range, preventing excessive protrusion. By bonding the first and second connecting pads via metal wire bonding, the clearance space required during display module assembly can be effectively reduced, simplifying the display module design and reducing the overall thickness of the display module 001, thus achieving a thinner and lighter design for both the display module 001 and the display device.

[0025] In an alternative embodiment, reference is made to... Figure 4 The highest point of the metal line 30 away from the first circuit board 21 and the second circuit board 22 is the highest protrusion point 31; in the thickness direction Z of the display module 001, the distance between the highest protrusion point 31 and the first circuit 21 is D1, and the distance between the highest protrusion point 31 and the second circuit board 22 is D2; wherein, D1≤0.2mm, and / or, D2≤0.2mm.

[0026] Specifically, the arc-shaped lead of the metal line 30 between the first connecting pad 212 and the second connecting pad 222 has a highest protrusion point 31. The maximum protrusion height of the metal line 30 relative to the first circuit board 21 can be D1, and the maximum protrusion height of the metal line 30 relative to the second circuit board 22 can be D2. D1 and D2 can be the same or different. For example, when the surfaces of the first circuit board 21 and the second circuit board 22 are basically at the same height, D1 and D2 can be the same or similar; when there is a height difference between the first circuit board 21 and the second circuit board 22 in the thickness direction Z, D1 and D2 can be different. By limiting at least one of D1 and D2 to no more than 0.2 mm, the degree of protrusion of the arc formed by the metal line 30 in the thickness direction Z can be limited, avoiding the formation of high local protrusions of the metal line 30 in the connection area of ​​the first circuit board 21 and the second circuit board 22. Thus, compared to using ZIF connectors or BTB connectors to connect the first circuit board 21 and the second circuit board 22, bonding the first circuit board 21 and the second circuit board 22 with metal wire 30 and further limiting the maximum protrusion height of the metal wire 30 can effectively reduce the overall structural height of the connection area of ​​the first circuit board 21 and the second circuit board 22, reduce the clearance space required between the display module 001 and the battery, mid-frame, back cover or other assembly structures in the display device, thereby simplifying the design of the display module 001 and reducing the local thickness of the display module 001, which is conducive to the thinner and lighter design of the display module 001 and the display device.

[0027] It is understandable that, since the bonding of the first connecting pad 212 and the second connecting pad 222 using the metal wire 30 requires the formation of corresponding arc-shaped leads, the material of the metal wire 30 needs to have a certain degree of ductility. Simultaneously, because the metal wire 30 is used for signal transmission between the first circuit board 21 and the second circuit board 22, the metal wire 30 needs to have good conductivity. In an optional embodiment, the material of the metal wire 30 may include at least one of aluminum, gold, silver, and copper.

[0028] Aluminum, gold, silver, and copper all have good electrical conductivity and ductility, which facilitates the formation of the first bonding point, the second bonding point, and the arc-shaped lead connecting the first bonding point and the second bonding point during the bonding process of the metal wire 30. It can also ensure that the metal wire 30 has a low transmission impedance, thereby improving the signal transmission accuracy between the first circuit board 21 and the second circuit board 22 while ensuring the stability of the bonding of the metal wire 30.

[0029] It is understandable that aluminum wires are lightweight, low-cost, and have a mature bonding process; gold wires have good ductility and oxidation resistance; and silver and copper wires have good conductivity. Therefore, based on the surface material of the first connecting pad 212 and the second connecting pad 222, the type of signal to be transmitted, the current carrying capacity, and the bonding process requirements, the appropriate metal wire 30 can be selected. This ensures the bonding strength and electrical connection reliability while also considering the manufacturing cost and process compatibility of the display module 001.

[0030] It is also understandable that, since the first circuit board 21 is bonded to the first panel pad 11 located in the first non-display area NA1, and the second circuit board 21 is bonded to the second panel pad 12 located in the second non-display area NA2, and the first non-display area NA1 and the second non-display area NA2 are located on different sides of the display area AA, the first circuit board 21 and the second circuit board 22 are bonded to different sides of the display panel, resulting in a relatively large distance between them, which is not conducive to the bonding connection between the first circuit board 21 and the second circuit board 22. In this case, both the first circuit board 21 and the second circuit board 22 can be flexible circuit boards, giving them the characteristics of being bendable or foldable. By bending at least the first connecting pad 212 of the first circuit board 21 and the second connecting pad 222 of the second circuit board 22 to the side away from the light-emitting surface of the display panel 10, the first connecting pad 212 of the first circuit board 21 and the second connecting pad 222 of the second circuit board 22 can have a shorter distance on the side away from the light-emitting surface of the display panel 10, so as to facilitate the bonding connection of the first connecting pad 212 and the second connecting pad 222.

[0031] When both the first circuit board 21 and the second circuit board 22 are flexible circuit boards, the first circuit board 21 and the second circuit board 22 may respectively include a flexible substrate, conductive lines disposed on the flexible substrate, and a cover film covering at least part of the conductive lines. The cover film may have openings at predetermined positions to expose the corresponding circuit board pads and connection pads.

[0032] Furthermore, after the first circuit board 21 and the second circuit board 22 are bonded together via metal wire 30, signal transmission can occur between them, and both circuit boards 21 and 22 can provide signals to the display panel 10. To ensure the synchronization of the signals provided by the first circuit board 21 and the second circuit board 22 to the display panel, one of the first circuit board 21 and the second circuit board 22 can be designated as a main circuit board and the other as a secondary circuit board. The main circuit board receives external signals and provides them to the secondary circuit board, controlling the signals provided by the secondary circuit board to the display panel. This ensures that the main circuit board and the secondary circuit board provide signals to the display panel synchronously, preventing the display effect of the display panel 10 from being affected by the asynchronous signals provided by the first circuit board 21 and the second circuit board 22.

[0033] For example, the first circuit board 21 can serve as the main circuit board, and the second circuit board 22 can serve as the auxiliary circuit board. The first circuit board 21 can be used to electrically connect with the system motherboard of the display device. The first circuit board 21 can receive signals required for the normal operation of the display panel provided by the system motherboard and provide these signals to the first panel pad 11 of the first non-display area NA1, so as to provide signal lines to the first non-display area NA1 through the first panel pad 11. At the same time, the first circuit board 21 can also provide signals required for the normal operation of the display panel 10 to the second circuit board 22; the second circuit board 22 can transmit the corresponding signals to the signal lines in the second non-display area NA2. Thus, the signal can be transmitted sequentially through the conductive lines in the first circuit board 21, the first connecting pad 212, the metal line 30, the second connecting pad 222, and the conductive lines in the second circuit board 22 to the second panel pad 12, and further to the corresponding signal lines in the second non-display area NA2 or the display area AA. In other embodiments, the main and auxiliary relationship of the first circuit board 21 and the second circuit board 22 can also be interchanged, and the embodiments of the present invention do not limit this. For ease of description, unless otherwise specified, the embodiments of the present invention use the first circuit board 21 as the main circuit board and the second circuit board 22 as the secondary circuit board as an example to illustrate the technical solutions of the embodiments of the present invention.

[0034] In an optional embodiment, when the first circuit board 21 is the main circuit board, with reference to the actual view of the display panel 10, the first non-display area NA1 can be the lower step area of ​​the display panel 10, so that corresponding data driving circuits, power signal lines, and fan-out signal lines can be provided in the first non-display area NA1. At least one of the data driving circuits, power signal lines, and fan-out signal lines can be electrically connected to the first circuit board 21 through the first panel pad 11 to receive signals transmitted by the first circuit board 21 through the first panel pad 11. Correspondingly, the second non-display area NA2 can be one of the left and right edges of the display panel 10. The second non-display area NA2 can be provided with gate driving circuits and driving circuit control signal lines, etc. At least one of the gate driving circuits and driving circuit control signal lines can be electrically connected to the second circuit board 21 through the second panel pad 12 to receive signals transmitted by the second circuit board 22 through the second panel pad 12.

[0035] Since the first panel pad 11, data drive circuit, power signal line, and fan-out signal line in the first non-display area NA1, and the second panel pad 12, gate drive circuit, and drive circuit control signal line in the second non-display area NA2 are all non-light-emitting devices, when the sizes of the first non-display area NA1 and the second non-display area NA2 as viewed from the light-emitting side of the display panel 100 are large, the display panel 10 will have a large bezel size when displaying images, which is not conducive to a high screen-to-body ratio of the display panel 10. In this case, by reducing the size of the first non-display area NA1 and the second non-display area NA2 as viewed from the light-emitting side of the display panel 10, the bezel size of the display panel 10 can be reduced accordingly.

[0036] In an optional embodiment, the first non-display area NA1 may include a first bending area BA1 and a first pad area BAA1; the first pad area BAA1 is bent through the first bending area BA1 to the non-light-emitting side of the display panel 10; a first panel pad 11 is disposed in the first pad area BAA1; and / or, the second non-display area NA2 includes a second bending area BA2 and a second pad area BAA2; the second pad area BAA2 is bent through the second bending area BA2 to the non-light-emitting side of the display panel 10; a second panel pad 12 is disposed in the second pad area BAA2.

[0037] The non-light-emitting side of the display panel 10 can be understood as the side opposite to the light-emitting side of the display panel 10. That is, when viewing the image displayed by the display panel 10 from the light-emitting side, the non-light-emitting side of the display panel 10 cannot be seen.

[0038] The first non-display area NA1 includes a first bending area BA1 and a first pad area BAA1. The first bending area BA1 is a region capable of bending, and the first pad area BAA1 is the area where the first panel pads 11 are set. The first pad area BAA1 can be bent through the first bending area BA1 to the non-light-emitting side of the display panel 10. At the same time, because the first panel pads 11 of the first pad area BAA1 are bonded and electrically connected to the first circuit board pads 211 of the first circuit board 21, when the first pad area BAA1 is bent through the first bending area BA1 to the non-light-emitting side of the display panel 10, the first circuit board 21 will also bend to the non-light-emitting side of the display panel 10. In addition, the first non-display area NA1 also includes a first circuit setting area CSA1, which can be used to set data driving circuits, power signal lines, and fan-out signal lines, etc. The first circuit setting area CSA1 can be located between the first bending area BA1 and the first pad area BAA1. That is, when the first bending area BA1 is not bent, along the first direction Y where the display area AA and the first non-display area NA1 are arranged, the first bending area BA1, the first circuit setting area CSA1, and the first pad area BAA1 are arranged sequentially. The first bending area BA1 can connect the display area AA and the first circuit setting area CSA1, and the first pad area BAA1 is located on the side of the first circuit setting area CSA1 away from the first bending area BA1. When the first bending area BA1 is bent, both the first circuit setting area CSA1 and the first pad area BAA1 are located on the non-light-emitting side of the display panel 10, and the first circuit setting area CSA1 and the first pad area BAA1 do not occupy the area of ​​the light-emitting side of the display panel 10. This can reduce the bezel width formed by the first non-display area NA1 on the light-emitting side and increase the area ratio of the display area AA on the light-emitting side of the display panel 10.

[0039] Similarly, the second non-display area NA2 includes a second bending area BA2 and a second pad area BAA2. The second bending area BA2 is a region capable of bending, and the second pad area BAA2 is the area where the second panel pads 12 are disposed. The second pad area BAA2 bends through the second bending area BA2 to the non-light-emitting side of the display panel 10. Simultaneously, because the second panel pads 12 of the second pad area BAA2 are electrically connected to the second circuit board pads 221 of the second circuit board 22, when the second pad area BAA2 bends through the second bending area BA2 to the non-light-emitting side of the display panel 10, the second circuit board 22 also bends accordingly to the non-light-emitting side of the display panel 10. Furthermore, the second non-display area NA2 also includes a second circuit setting area CSA2, which can be used to set gate drive circuits and drive circuit control signal lines, etc. The second circuit setting area CSA2 can be located between the second bending area BA2 and the second pad area BAA2. That is, when the second bending area BA2 is not bent, the second non-display area NA2 and the display area AA are arranged in the second direction X. The second bending area BA2, the second circuit setting area CSA2, and the second pad area BAA2 can be arranged sequentially. When the second bending area BA2 is bent, both the second circuit setting area CSA2 and the second pad area BAA2 are located on the non-light-emitting side of the display panel 10, and the second circuit setting area CSA2 and the second pad area BAA2 do not occupy the area of ​​the light-emitting side of the display panel 10. This reduces the bezel width formed by the second non-display area NA2 on the light-emitting side and increases the area ratio of the display area AA on the light-emitting side of the display panel 10.

[0040] It is understood that when the first non-display area NA1 includes the first bending area BA1 and the second non-display area NA2 includes the second bending area BA2, at least a portion of the first non-display area NA1 and the second non-display area NA2 will be bent to the non-light-emitting side of the display panel 10. This allows the display panel 10 to have a structure with bending on at least two sides, reducing the width of the bezels on at least two sides of the display panel 10, which is beneficial for achieving a narrow bezel. Meanwhile, since the non-display area NA includes at least one second non-display area NA2, meaning the non-display area NA can include one or more second non-display areas NA2, the specific number of second non-display areas NA2 can be designed according to actual needs, and this embodiment of the invention does not impose a specific limitation on this.

[0041] In an alternative embodiment, such as Figure 2 and Figure 3As shown, the non-display area NA includes two second non-display areas NA2; the two second non-display areas NA2 are located on opposite sides of the display area AA along the second direction X. When the first bending area BA1 of the first non-display area NA1 is bent, and the second bending areas BA2 of the two second non-display areas NA2 are both bent, the display panel 10 can form a three-sided bent structure, allowing the display panel 10 to meet the requirement of extremely narrow variations. This embodiment of the invention does not specifically limit the number of bending sides of the display panel 10. For ease of description, unless otherwise specified, this embodiment of the invention uses a display panel 10 including one first non-display area NA1 and two second non-display areas NA2 as an example to illustrate the technical solution of this embodiment.

[0042] It is understandable that after bending both the first circuit board 21 and the second circuit board 22 to the non-light-emitting side of the display panel 10, the first connecting pad 211 of the first circuit board 21 and the second connecting pad 212 of the second circuit board 22 can be bonded to the non-light-emitting side of the display panel 10 via metal wires 30, enabling signal transmission between them. Simultaneously, since the metal wires 30 have certain transmission impedance and contact impedance, and the magnitude of these impedances affects the accuracy of signal transmission, the accuracy of the signal transmitted via the metal wires 30 can be controlled by adjusting their impedance.

[0043] Optional, Figure 5 This is a partial structural schematic diagram of a display module provided in an embodiment of the present invention, for reference. Figure 5 The metal wire 30 includes a connecting wire 32, a first connecting end point 33, and a second connecting end point 34. The connecting wire 32 is bonded to a first connecting pad 212 through the first connecting end point 33, and the connecting wire 32 is bonded to a second connecting pad 222 through the second connecting end point 34. In the width direction intersecting the extension direction of the connecting wire 32, the width of the first connecting end point 33 is greater than the width of the connecting wire 32, and the width of the second connecting end point 34 is greater than the width of the connecting wire 32.

[0044] Specifically, the first connection endpoint 33 and the second connection endpoint 34 are located at the two ends of the connection line 32, respectively. The connection line 32 is bonded to the first connection pad 212 through the first connection endpoint 33 and to the second connection pad 222 through the second connection endpoint 34. That is, the first connection endpoint 33 is the first bonding point connected to the first connection pad 212, the second connection endpoint 34 is the second bonding point connected to the second connection pad 222, and the connection line 33 is the arc lead between the first connection endpoint 33 and the second connection endpoint, so that the first circuit board 21 can form a conductive path with the second circuit board 22 through the first connection pad 212, the first connection endpoint 33, the connection line 32, the second connection endpoint 34, and the second connection pad 222 in sequence.

[0045] Because the first connection endpoint 33 has contact resistance with the first connection pad 212, and the second connection endpoint 34 has contact resistance with the second connection pad 222, there is contact resistance between the first connection endpoint 33 and the first connection pad 212, and between the second connection endpoint 34 and the second connection pad 222. By making the width of the first connection endpoint 33 greater than the width of the connection line 32, and the width of the second connection endpoint 34 greater than the width of the connection line 32, in the width direction intersecting the extension direction of the connection line 32, that is, the first connection endpoint 33 and the second connection endpoint 34 have relatively large widths, the contact area between the metal line 30 and the first connection pad 212 and the second connection pad 222, respectively, can be increased, thereby reducing the contact resistance at the bonding position, improving the accuracy of signal transmission by the metal line 30, and thus improving the accuracy of the signals provided to the display panel by the first circuit board 21 and the second circuit board 22, which is beneficial to improving the display effect of the display module.

[0046] Meanwhile, the width of the second connection endpoint 34 being greater than the width of the connection line 32 can be designed according to actual needs. The extent to which the width of the second connection endpoint 34 is greater than the width of the connection line 32 can be controlled by controlling at least one of the pressure, ultrasonic vibration, and heat applied by the bonding tool during the metal wire formation process. In this case, by setting the first connection endpoint 33 and the second connection endpoint 34 to have relatively large widths, it is beneficial to improve the bonding strength between the metal wire 30 and each connection pad, and reduce the risk of the metal wire 30 detaching from the connection pad or poor contact.

[0047] Furthermore, compared to the first connection endpoint 33 and the second connection endpoint 34, the connecting line 32 has a smaller width, which reduces the space occupied by the connecting line 32 itself, maintains a larger spacing between adjacent metal lines 30, and reduces the risk of short circuits or signal crosstalk caused by contact between adjacent metal lines 30. At the same time, by setting the connecting line 32 to have a smaller width, it is possible to set more metal lines 30 in a limited connection area to meet the needs of multi-channel signal transmission between the first circuit board 21 and the second circuit board 22. Therefore, by setting the metal lines 30 to a structure with wider connection endpoints (33 and 34) and narrower connecting lines 32, it is possible to balance the requirements of low contact impedance at the bonding position, high bonding strength, and insulation spacing between connecting lines 32.

[0048] Based on the above embodiments, optionally, refer to the following: Figure 5 The width of the connecting line 32 is W0, where 10um≤W0≤40um; and / or, the width of the first connecting endpoint 33 is W01, and the width of the second connecting endpoint 34 is W02, where 10um≤W01≤60um, 10um≤W02≤60um.

[0049] Specifically, the width of the connecting line 32 is W0. By setting the width W0 of the connecting line 32 to be no less than 10μm, the connecting line 32 can have sufficient conductive cross-sectional area and mechanical strength, reducing the line impedance of the connecting line 32 and lowering the risk of breakage during bonding, encapsulation, or use in the display module. By setting the width W0 of the connecting line 32 to be no more than 40μm, the lateral space occupied by a single connecting line 32 can be reduced, the spacing between adjacent connecting lines 32 can be increased, and the risk of mutual interference or short circuit between adjacent connecting lines 32 can be reduced.

[0050] The width of the first connection endpoint 33 is W01, and the width of the second connection endpoint 34 is W02. By making the widths W01 of the first connection endpoint 33 and W02 of the second connection endpoint 34 both greater than the width W0 of the connecting line 32, the effective contact area between the metal line 30 and the first connecting pad 212 and the second connecting pad 222 can be increased, reducing the contact impedance at the connection position. By setting the widths W01 of the first connection endpoint 33 and W02 of the second connection endpoint 34 to no more than 60μm, the connection endpoints can avoid occupying excessive pad area or extending to adjacent connecting pads, reducing the risk of mutual interference or short circuits between adjacent bonding points.

[0051] Therefore, by limiting the widths and relative relationships of the connecting line 32, the first connecting endpoint 33, and the second connecting endpoint 34, it is possible to reduce mutual interference between adjacent metal lines 30 and adjacent connecting endpoints while ensuring that the metal line 30 has a small line impedance and high bonding reliability. This helps to achieve stable and compact multi-channel signal transmission between the first circuit board 21 and the second circuit board 22.

[0052] Optional, such as Figure 6 As shown, the first circuit board 21 includes a plurality of first connection pads 212 arranged along the third direction Y'; the second circuit board 22 includes a plurality of second connection pads 222 arranged along the third direction Y'; each first connection pad 212 and each second connection pad 222 are correspondingly bonded by metal wires 30; the corresponding first connection pads 212 and second connection pads 222 overlap in the fourth direction X'; wherein, the third direction Y' overlaps with the fourth direction X', and both the third direction Y' and the fourth direction X' are parallel to the light-emitting surface of the display module 001.

[0053] Specifically, the first circuit board 21 includes a plurality of first connection pads 212 arranged along the third direction Y', and the second circuit board 22 includes a plurality of second connection pads 222 arranged along the third direction Y'. The plurality of first connection pads 212 and the plurality of second connection pads 222 can be configured in a one-to-one correspondence, so that each first connection pad 212 can be bonded to each second connection pad 222 respectively through metal wires 30, thereby forming multiple independent signal transmission paths between the first circuit board 21 and the second circuit board 22.

[0054] The first and second bonding pads 212 and 222, corresponding to the bonding connections, can overlap in the fourth direction X', allowing the metal line 30 to extend along a shorter path between the first and second bonding pads 212 and 222. This facilitates the bonding tool in sequentially completing the bonding between the corresponding sets of bonding pads and reduces the length and arc height of the metal line 30. The third direction Y' overlaps with the fourth direction X', and both the third and fourth directions Y' are parallel to the light-emitting surface of the display module 001. Simultaneously, one of the third and fourth directions Y' can be parallel to or intersect with the first direction X, and the other can be parallel to or intersect with the second direction Y. For example, the third direction Y' can be parallel to the first direction Y, and the fourth direction X' can be parallel to the second direction Y. The specific design can be tailored to actual needs, and this invention does not impose specific limitations on this.

[0055] Based on the above embodiments, optionally, refer to the following: Figure 6 In the third direction Y´, the width of the first connection pad 212 is W1, and the spacing between two adjacent first connection pads 212 is L1; in the third direction Y´, the width of the second connection pad 222 is W2, and the spacing between two adjacent second connection pads 222 is L2; ​​where W1≥W2, L1≤L2.

[0056] It is understood that the first circuit board 21 can serve as the main flexible circuit board, and the second circuit board 22 can serve as the secondary flexible circuit board. The first circuit board 21 can be electrically connected to the system motherboard or display driver control circuit of the display device to receive the drive signals and power signals required for the operation of the display panel 10, and transmit at least a portion of these signals to the second circuit board 22. For example, the first circuit board 21 can transmit drive circuit control signals such as clock signals and fixed voltage signals required by the gate drive circuit to the second circuit board 22. By making the width W1 of the first connecting pad 212 greater than or equal to the width W2 of the second connecting pad 222, the first connecting pad 212 on the main flexible circuit board can have a larger bonding area, which is beneficial for the bonding tool to accurately form the first connecting endpoint 33 of the metal wire 30 on the first connecting pad 212, and can increase the contact area between the first connecting endpoint 33 and the first connecting pad 212, reducing the contact resistance at the bonding position. Meanwhile, the first circuit board 21 serves as the input and transfer side for drive signals and power signals. By setting a large first connection pad 212 on the first circuit board 21, the electrical connection stability and bonding reliability of the above signals when they are transmitted from the first circuit board 21 to the second circuit board 22 can also be improved.

[0057] Furthermore, by making the spacing L1 between two adjacent first connection pads 212 less than or equal to the spacing L2 between two adjacent second connection pads 222, even with a relatively large width of the first connection pads 212, the first pad group composed of multiple first connection pads 212 and the second pad group composed of multiple second connection pads 222 can have similar overall extension lengths. This facilitates a one-to-one correspondence between the first connection pads 212 and the second connection pads 222. Moreover, the relatively small width of the second connection pads 222 allows for a larger spacing between adjacent second connection pads 222. This increases the insulation gap between the second connection endpoints 34 of adjacent metal lines 30, reducing the risk of short circuits caused by contact between adjacent metal lines 30 used for transmitting different signals during bonding or use. It also reduces the possibility of mutual interference between different signals such as drive signals and power signals, thereby improving the stability of multi-channel signal transmission between the first circuit board 21 and the second circuit board 22.

[0058] Optional, continue to refer to Figure 6 On the third direction Y', the width of the first connection pad 212 is W1, and the spacing between two adjacent first connection pads 212 is L1; on the third direction Y', the width of the second connection pad 222 is W2, and the spacing between two adjacent second connection pads 222 is L2; ​​W1≥25um, L1≥25um; and / or, W2≥25um, L2≥25um.

[0059] Specifically, by setting the width W1 of the first connection pad 212 and the width W2 of the second connection pad 222 to not less than 25μm, each connection pad can have an effective bonding area that meets the requirements of metal wire bonding, ensuring that the first connection endpoint 33 and the second connection endpoint 34 can be stably formed within the corresponding connection pad, reducing the risk of the connection endpoints exceeding the edge of the connection pad, insufficient bonding strength, or poor contact.

[0060] Meanwhile, by setting the spacing L1 between adjacent first connection pads 212 and the spacing L2 between adjacent second connection pads 222 to not less than 25μm, sufficient insulation space can be ensured between adjacent connection pads, reserving operating and extension space for bonding tools and metal wires 30, avoiding overlap between adjacent connection endpoints, and reducing the risk of contact or signal interference between adjacent metal wires 30. Therefore, by limiting the width of the first and second connection pads 212 and the spacing between adjacent connection pads, it is possible to meet the design requirements for the line width and connection endpoint size of the metal wires 30 while also considering bonding reliability, signal transmission performance, and isolation between adjacent signals.

[0061] Optional, such as Figure 7 As shown, the display module 001 further includes: an adhesive structure 40; the first circuit board 21 includes a first circuit structure area 201 and a first connection area 202 located on one side of the first circuit structure area 201, and a first connection pad 212 is disposed in the first connection area 202; the second circuit board 22 includes a second circuit structure area 203 and a second connection area 204 located on one side of the second circuit structure area 203, and a second connection pad 222 is disposed in the second connection area 204; the first connection area 202 is bonded to the second connection area 204 through the adhesive structure 40, so that the first connection area 202 and the second connection area 204 are relatively fixed, which facilitates subsequent bonding connection.

[0062] The first circuit structure area 201 can be used to set the conductive lines and circuit board devices in the first circuit board 21. The first connection area 202 can extend outward from the edge of the first circuit structure area 201 and is used to set a plurality of first connection pads 212. Correspondingly, the second circuit structure area 203 can be used to set the conductive lines and circuit board devices in the second circuit board 22. The second connection area 204 can extend outward from the edge of the second circuit structure area 203 and is used to set a plurality of second connection pads 222. By concentrating the first connection pads 212 and the second connection pads 222 in the first connection area 202 and the second connection area 204 respectively, a relatively independent connection area can be formed between the first circuit board 21 and the second circuit board 22. This facilitates the alignment and wire bonding of the first connection pads 212 and the second connection pads 222 and reduces the impact of the wire bonding process on other circuit structures in the first circuit structure area 201 and the second circuit structure area 203.

[0063] Optional, continue to refer to Figure 7 In the thickness direction Z of the display module 001, the first connection area 202 and the second connection area 204 overlap; the bonding structure 40 is located between the first connection area 202 and the second connection area 204.

[0064] Specifically, at least a portion of the first connection area 202 and at least a portion of the second connection area 204 can overlap along the thickness direction Z of the display module 001. An adhesive structure 40 is disposed between the first connection area 202 and the second connection area 204 to bond and fix the first connection area 202 and the second connection area 204 to each other. The adhesive structure 40 can avoid the effective bonding surfaces of the first connection pad 212 and the second connection pad 222, allowing both the first connection pad 212 and the second connection pad 222 to be exposed towards the side where the bonding tool is located, thus simplifying the bonding connection operation via the metal wire 30. For example, the adhesive structure 40 can be disposed in the portion of the overlapping area of ​​the first connection area 202 and the second connection area 204 where no connection pads are provided. Provided that the first connection pad 212 and the second connection pad 222 can be bonded together via the metal wire 30, the specific shape and placement of the adhesive structure 40 are not limited in this embodiment of the invention.

[0065] Optional, continue to refer to Figure 7 In the thickness direction Z of the display module 001, the thickness of the bonding structure 40 is T1; where 0.01mm≤T1≤0.1mm.

[0066] Specifically, by setting the thickness T1 of the bonding structure 40 to not less than 0.01 mm, the bonding structure 40 can have sufficient bonding effect to form a continuous and stable bonding interface, and can compensate for the flatness deviation of the surfaces of the first circuit board 21 and the second circuit board 22 to a certain extent, thereby improving the bonding strength between the first connection area 202 and the second connection area 204.

[0067] Meanwhile, by setting the thickness T1 of the bonding structure 40 to no more than 0.1 mm, it is possible to avoid the bonding structure 40 being too thick, which would significantly increase the stacking height of the connection position between the first circuit board 21 and the second circuit board 22 in the thickness direction Z of the display module 001. It also reduces the height difference between the two circuit boards, facilitating control of the bridging length, arc height, and position of the highest protrusion of the metal line 30. Therefore, by limiting the thickness T1 of the bonding structure 40 to between 0.01 mm and 0.1 mm, while ensuring sufficient bonding strength and fixing effect, the connection position between the first circuit board 21 and the second circuit board 22 can have a smaller total thickness. This reduces the clearance space required for the display module 001, which is beneficial for the thinner and lighter design of the display module 001 and the display device.

[0068] For example, the bonding structure 40 may include pressure-sensitive adhesive, non-conductive adhesive film, or other insulating bonding materials, which can be selected according to actual needs. This embodiment of the invention does not specifically limit this. The bonding structure 40 can pre-attach and fix the first connection area 202 and the second connection area 204 before the metal wire 30 is bonded, so as to restrict the relative movement of the first circuit board 21 and the second circuit board 22 in the direction parallel to the light-emitting surface of the display module 001 and in the thickness direction Z, and can suppress relative rotation, warping, or misalignment between the first circuit board 21 and the second circuit board 22, so that the corresponding first connection pad 212 and the second connection pad 222 can maintain a predetermined positional relationship, which facilitates the bonding tool to accurately form the bonding points at both ends of the metal wire 30. Meanwhile, after bonding is completed, the bonding structure 40 can also maintain the relative position between the first circuit board 21 and the second circuit board 22. When the first circuit board 21 or the second circuit board 22 is subjected to assembly force, bending force, vibration or external pulling, the bonding structure 40 can withstand and disperse at least part of the force, reducing the direct transmission of the above forces to the metal wire 30 and its first connection end 33 and second connection end 34. This prevents the first circuit board 21 and the second circuit board 22 from shifting relative to each other and pulling the metal wire 30, reducing the risk of metal wire 30 breakage, bonding end detachment or poor contact, and helps to improve the mechanical stability and electrical connection reliability of the connection structure between the first circuit board 21 and the second circuit board 22 during assembly and use.

[0069] It is understood that when the first circuit board 21 and the second circuit board 22 overlap in the thickness direction of the display module, in the area where the first circuit board 21 and the second circuit board 22 overlap, the first circuit board 21 may be located on the side of the second circuit board 22 away from the display panel, or the second circuit board 22 may be located on the side of the first circuit board 21 away from the display panel. The specific design can be made according to actual needs, and the embodiments of the present invention do not make specific limitations in this regard.

[0070] In an alternative embodiment, such as Figure 8 As shown, in the overlapping first connection area 202 and second connection area 204, the second connection area 204 is located on the side of the first connection area 202 away from the display panel 10; the first circuit board 21 also includes a first circuit board substrate 213; the first connection pad 212 is located on the side of the first circuit board substrate 213 away from the display panel 10; the second circuit board 22 also includes a second circuit board substrate 223; the second connection pad 222 is located on the side of the second circuit board substrate 223 away from the display panel 10; the bonding structure 40 is respectively bonded to the surface of the first circuit board substrate 213 away from the display panel 10 and the surface of the second circuit board substrate 223 close to the display panel 10.

[0071] Specifically, in the thickness direction Z of the display module 001, the second connection area 204 is at least partially stacked on the side of the first connection area 202 facing away from the display panel, so that the first circuit board 21 and the second circuit board 22 can form a stacked structure at the connection position. The first circuit board 21 also includes a first circuit board substrate 213, which can be a flexible insulating substrate, for example, it can include a polyimide material. The first connection pad 212 is disposed on the surface of the first circuit board substrate 213 facing away from the display panel 10. The second circuit board 22 also includes a second circuit board substrate 223, which can also be a flexible insulating substrate. The second connection pad 222 is disposed on the surface of the second circuit board substrate 223 facing away from the display panel 10. Thus, the first connection pad 212 and the second connection pad 222 are both located on the side of the respective circuit board substrate facing away from the display panel 10, and can be exposed towards the same side of the display module 001.

[0072] By positioning both the first connecting pad 212 and the second connecting pad 222 on the side opposite to the display panel 10, the first connecting pad 212 and the second connecting pad 222 can be located on the same operating side of the bonding tool. During wire bonding, it is unnecessary to flip the first circuit board 21 or the second circuit board 22, nor is it necessary to perform bonding from opposite sides of the display module 001 separately. The bonding tool can sequentially complete the bonding between the wire 30 and the first connecting pad 212 and the second connecting pad 222 from the same side, thereby simplifying the wire bonding process, reducing the operational difficulty of the bonding tool, and improving the alignment accuracy between the first connecting pad 212 and the second connecting pad 222. Furthermore, by positioning the first connecting pad 212 and the second connecting pad 222 on the same side, the bridging path of the wire 30 between the two connecting pads can also be shortened.

[0073] The second circuit board 22, facing the display panel 10, is bonded to the side of the first circuit board 21 facing away from the display panel 10 via an adhesive structure 40. The adhesive structure 40 can be located in the overlapping area of ​​the first connection area 202 and the second connection area 204, avoiding the effective bonding surfaces of the first connection pad 212 and the second connection pad 222. This ensures that the relative positions of the first circuit board 21 and the second circuit board 22 are fixed without affecting the bonding of the metal lines 30. The adhesive structure 40 maintains a stable positional relationship between the two connection pads before bonding and reduces the pulling on the metal lines 30 caused by the relative movement of the first circuit board 21 and the second circuit board 22 after bonding, thereby improving the bonding efficiency, mechanical stability, and electrical connection reliability between the first circuit board 21 and the second circuit board 22.

[0074] In another alternative embodiment, refer to Figure 9 In the thickness direction Z of the display module 001, the first circuit board 21 and the second circuit board 22 do not overlap; the first circuit board 21 also includes a first circuit board substrate 213; the first connecting pad 212 is located on the side of the first circuit board substrate 213 away from the display panel 10; the second circuit board 22 also includes a second circuit board substrate 223; the second connecting pad 222 is located on the side of the second circuit board substrate 223 away from the display panel 10; the bonding structure 40 is respectively bonded to the side of the first circuit board substrate 213 away from the first connecting pad 212 and the side of the second circuit board substrate 223 away from the second connecting pad 222.

[0075] Specifically, the first circuit board 21 and the second circuit board 22 can also be arranged side by side along a direction parallel to the light-emitting surface of the display module 001, so that the first connection area 202 and the second connection area 204 are adjacent in the horizontal direction. The first connection area 202 and the second connection area 204 can be in contact with each other or have a predetermined gap.

[0076] The first circuit board 21 further includes a first circuit board substrate 213, with the first connection pad 212 located on the side of the first circuit board substrate 213 facing away from the display panel 10; the second circuit board 22 further includes a second circuit board substrate 223, with the second connection pad 222 located on the side of the second circuit board substrate 223 facing away from the display panel 10. Thus, both the first connection pad 212 and the second connection pad 222 are exposed facing away from the display panel 10, and the bonding tool can approach the first connection pad 212 and the second connection pad 222 from the same side of the display module 001, and bond the corresponding first connection pad 212 and the second connection pad 222 together via the metal wire 30.

[0077] The bonding structure 40 is located on the side of the first circuit board 21 and the second circuit board 22 near the display panel 10, and is respectively bonded to the surface of the first circuit board substrate 213 opposite to the first connecting pad 212 and the surface of the second circuit board substrate 223 opposite to the second connecting pad 222. By bonding the bonding structure 40 to the first circuit board substrate 213 and the second circuit board substrate 223 respectively, the bonding structure 40 can restrict the relative movement of the first circuit board 21 and the second circuit board 22 in the direction parallel to the light-emitting surface of the display module 001 and in the thickness direction Z. The bonding structure 40 can also bear and disperse the forces generated by assembly, vibration or external pulling, reduce the direct transmission of forces to the metal wire 30, thereby reducing the risk of metal wire 30 breakage, bonding end detachment or poor contact, and improving the mechanical stability and electrical connection reliability between the first circuit board 21 and the second circuit board 22.

[0078] Compared to the structure where the first circuit board 21 and the second circuit board 22 overlap along the thickness direction Z, by arranging the first circuit board 21 and the second circuit board 22 side by side in the horizontal direction, the stacking thickness of the first circuit board 21 and the second circuit board 22 in the connection area can be further reduced, thereby further reducing the local structural height of the display module 001 and reducing the space required for the battery, middle frame, back cover or other structures to avoid the connection area of ​​the first circuit board 21 and the second circuit board 22.

[0079] Optional, see reference Figure 10 and Figure 11 The first connection area 202 includes a first connection sub-area 2021 and at least one second connection sub-area 2022 arranged along the third direction Y'; the second connection sub-area 2022 is located on the side of the first connection sub-area 2021 close to the second circuit board 22; in the third direction Y', the second connection sub-area 2022 overlaps with the second connection area 204; in the fourth direction X', the first connection sub-area 2021 overlaps with the second connection area 204; the third direction Y' overlaps with the fourth direction X', and both the third direction Y' and the fourth direction X' are parallel to the light-emitting surface of the display module 001.

[0080] Specifically, the first connection sub-region 2021 and the second connection sub-region 2022 together form a notch for accommodating the second connection region 204. The second connection region 204 of the second circuit board 22 extends at least partially into the notch, so that the second connection region 204 is embedded in the first connection region 202 of the first circuit board 21. The first connection pad 212 can be disposed in the first connection sub-region 2021, and the second connection pad 222 can be disposed in the second connection region 204. After the second connection region 204 extends into the notch formed by the first connection region 202, the plurality of first connection pads 212 and the plurality of second connection pads 222 can be disposed adjacently and correspond one-to-one, so that each first connection pad 212 can be bonded to the corresponding second connection pad 222 through the metal wire 30.

[0081] It should be noted that the first connection area 202 and the second connection area 204 can be located at the same or similar heights, so that the first circuit board 21 and the second circuit board 22 form an embedded connection structure along the direction parallel to the light-emitting surface of the display module 001.

[0082] refer to Figure 10 As shown, the first connection region 202 may include a first connection sub-region 2021 and at least two second connection sub-regions 2022. Along the third direction Y', the at least two second connection sub-regions 2022 are located on opposite sides of the second connection region 204; along the fourth direction X', the first connection sub-region 2021 overlaps with the second connection region 204. Thus, the first connection sub-region 2021 and the at least two second connection sub-regions 2022 can surround the second connection region 204 from three sides, causing the second connection region 204 to be embedded within the approximately U-shaped notch formed by the first connection region 202.

[0083] In this enclosed embedded structure, the second connection sub-regions 2022 located on opposite sides of the second connection area 204 can limit the second connection area 204 in the fourth direction X', and the first connection sub-region 2021 can also limit the second connection area 204 in the fourth direction X', thereby helping to maintain a stable relative position between the first connection pad 212 and the second connection pad 222. The first connection area 202 and the second connection area 204 can also be fixed to each other by the adhesive structure 40 to further reduce the possibility of the second circuit board 22 shifting, rotating or warping relative to the first circuit board 21, thereby reducing the risk of the relative displacement of the circuit board pulling the metal wire 30, causing the metal wire 30 to break or the bonding end to fall off.

[0084] refer to Figure 11As shown, the first connection region 202 may include a first connection sub-region 2021 and a second connection sub-region 2022. The second connection sub-region 2022 is located on the side of the second connection region 204 along the third direction Y', and the first connection sub-region 2021 is located on the side of the second connection region 204 along the fourth direction X'. Thus, the first connection sub-region 2021 and the second connection sub-region 2022 can respectively form a semi-enclosure of the second connection region 204 from two adjacent sides, so that the second connection region 204 is at least partially embedded in the approximately L-shaped notch formed by the first connection region 202.

[0085] By embedding the second connection area 204 of the second circuit board 22 into the notch formed by the first circuit board 21, at least a portion of the second connection area 204 can be accommodated using the space surrounding the first connection area 202. Compared to a structure in which the first circuit board 21 and the second circuit board 22 are arranged completely side by side, the embedded connection structure can reduce the overall area occupied by the first connection area 202 and the second connection area 204 in the direction parallel to the light-emitting surface of the display module 001, making the connection structure between the first circuit board 21 and the second circuit board 22 more compact.

[0086] Meanwhile, since the first connecting pad 212 and the second connecting pad 222 can be arranged adjacent to each other within the notch, the distance between the corresponding first connecting pad 212 and the second connecting pad 222 can be shortened, thereby reducing the bridging length and arc height of the metal line 30, so as to reduce the clearance space of the connection area in the thickness direction Z of the display module 001, which is conducive to the compact arrangement of the internal structure of the display module 001 and the lightweight design of the display device.

[0087] Based on the above embodiments, optionally, refer to the following: Figure 7 , Figure 8 and Figure 9 The display module 001 also includes a protective adhesive layer 50; in the thickness direction Z of the display module 001, the protective adhesive layer 50 covers the first connecting pad 212, the second connecting pad 222 and the metal line 30.

[0088] Specifically, in the thickness direction Z of the display module 001, the protective adhesive layer 50 can cover at least a portion of the surface of the first connecting pad 212 and the second connecting pad 222, the connecting line 32 of the metal line 30, the first connecting end point 33 and the second connecting end point 34, so that the first connecting pad 212, the second connecting pad 222 and the metal line 30 are at least partially covered within the protective adhesive layer 50.

[0089] The protective adhesive layer 50 can be formed at the connection position of the first circuit board 21 and the second circuit board 22 by means of dispensing, coating or spraying after the bonding of the metal lines 30 is completed, and after curing, it covers the metal lines 30 and the bonding areas at both ends. The protective adhesive layer 50 has insulating properties. By covering the first connecting pad 212, the second connecting pad 222 and the metal lines 30 with the protective adhesive layer 50, adjacent metal lines 30, adjacent connecting pads and connection areas can be insulated from other conductive structures in the display module 001. This reduces the risk of short circuits caused by contact between the metal lines 30 or connecting pads and surrounding conductive structures, and can prevent dust, conductive particles or other foreign objects from entering between adjacent metal lines 30 and causing signal interference, thereby improving the stability of multi-channel signal transmission between the first circuit board 21 and the second circuit board 22.

[0090] It is also understandable that after the protective adhesive layer 50 cures, it can limit the metal wire 30 from shaking, warping, or excessive deformation, and can disperse the vibration, impact, and pulling forces generated during the assembly, transportation, or use of the display module 001. At the same time, the protective adhesive layer 50 can also isolate or prevent moisture, oxygen, and corrosive substances in the external environment from contacting the metal wire 30 and the connecting pads, thereby improving the long-term reliability of the electrical connection structure between the first circuit board 21 and the second circuit board 22.

[0091] In one exemplary embodiment, the material of the protective adhesive layer 50 may include a UV-curable adhesive, such as a UV-curable epoxy resin adhesive or a UV-curable acrylic resin adhesive. UV-curable adhesives can cure rapidly under UV light irradiation, which helps to shorten the curing time of the protective adhesive layer 50 and reduces the possibility of thermal impact on the first circuit board 21, the second circuit board 22, and the metal wire 30 during the curing process. In another exemplary embodiment, the material of the protective adhesive layer 50 may also include a moisture-curing adhesive, such as polyurethane adhesive or silicone. Moisture-curing adhesives can utilize ambient moisture for curing and are suitable for connection areas that are not easily exposed to direct UV light. After curing, polyurethane adhesive and silicone can possess a certain degree of flexibility and cushioning capacity, enabling them to accommodate the small relative displacements generated during bending, vibration, or thermal expansion and contraction of the first circuit board 21 and the second circuit board 22, reducing the risk of damage to the metal wire 30 and bonding endpoints caused by the internal stress of the protective adhesive layer 50.

[0092] Based on the above embodiments, optionally, refer to the following: Figure 7 , Figure 8 and Figure 9The display module 001 further includes a filling structure 60; the filling structure 60 is located on the side of the protective adhesive layer 50 near the display panel 10, and the filling structure 60 fills the gap between the first circuit board 21 and the second circuit board 22; wherein, the viscosity of the material of the filling structure 60 is less than the viscosity of the material of the protective adhesive layer 50.

[0093] It is understandable that when the first circuit board 21 and the second circuit board 22 are overlapped along the thickness direction Z of the display module 001, the filling structure 60 can fill the space between the opposing surfaces of the first circuit board 21 and the second circuit board 22, or fill the area of ​​height difference formed by the edges of the two circuit boards. When the first circuit board 21 and the second circuit board 22 are arranged side by side along a direction parallel to the light-emitting surface of the display module 001, the filling structure 60 can fill the gap between adjacent edges of the first circuit board 21 and the second circuit board 22. When the second circuit board 22 is at least partially embedded in the notch formed by the first circuit board 21, the filling structure 60 can also fill the assembly gap between the second connection area 204 and the first connection area 202. Thus, the filling structure 60 can be applied to different connection forms, such as overlapping, side by side, or embedded arrangement of the first circuit board 21 and the second circuit board 22.

[0094] The viscosity of the material in the filler structure 60 is lower than that of the material in the protective adhesive layer 50, giving the filler structure 60 better flowability. During the formation of the filler structure 60, the filler material can flow along the gap between the first circuit board 21 and the second circuit board 22, thereby reducing the possibility of residual voids or air bubbles between the first circuit board 21 and the second circuit board 22 and improving the filling integrity of the connection area by the filler structure 60.

[0095] After the filler structure 60 cures, it connects and supports the first circuit board 21 and the second circuit board 22, limiting relative movement, warping, or vibration between the two circuit boards. This further reduces the risk of metal wire 30 breakage, detachment of the first connection endpoint 33 or the second connection endpoint 34, and poor contact of the connection pads. Furthermore, the filler structure 60 isolates the first circuit board 21, the second circuit board 22, and conductive structures in the connection area, reducing the risk of short circuits, leakage, or signal interference caused by foreign objects, moisture, or conductive particles entering the gap between the two circuit boards. This further improves the mechanical stability, insulation performance, and electrical connection reliability of the connection structure between the first circuit board 21 and the second circuit board 22.

[0096] Based on the same inventive concept, embodiments of the present invention also provide a display device, which includes the display module provided in any embodiment of the present invention. Therefore, this display device possesses the technical features of the display module provided in the embodiments of the present invention and can achieve the beneficial effects of the display module provided in the embodiments of the present invention. Similarities can be found in the above description of the display module provided in the embodiments of the present invention, and will not be repeated here.

[0097] For example, Figure 12 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention, such as... Figure 12 As shown, the display device 002 includes the display module 001 provided in this embodiment of the invention. The display device 002 provided in this embodiment of the invention can be any electronic product with display function, including but not limited to the following categories: mobile phones, televisions, laptops, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, in-vehicle displays, medical devices, industrial control equipment, touch interactive terminals, etc., and this embodiment of the invention does not make any special limitations on these.

[0098] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display module, characterized in that, include: Display panels and circuit boards; The display panel includes a display area and a non-display area that at least partially surrounds the display area; the non-display area includes a first non-display area and at least one second non-display area; the first non-display area is provided with a first panel pad, and the second non-display area is provided with a second panel pad; The circuit board includes a first circuit board and at least one second circuit board; the first circuit board includes a first circuit board pad and a first connection pad; the first circuit board pad is bonded and electrically connected to the first panel pad. The second circuit board includes a second circuit board pad and a second connection pad; the second circuit board pad is bonded and electrically connected to the second panel pad; The first connection pad and the second connection pad are connected by wire bonding.

2. The display module according to claim 1, characterized in that, The highest point of the metal wire that is away from the first circuit board and the second circuit board is the highest convex point. In the thickness direction of the display module, the distance between the highest protrusion point and the first circuit is D1, and the distance between the highest protrusion point and the second circuit board is D2; wherein, D1≤0.2mm, and / or, D2≤0.2mm.

3. The display module according to claim 1, characterized in that, The first non-display area is arranged along a first direction with the display area, and the second non-display area is arranged along a second direction with the display area; the first direction and the second direction intersect. The first non-display area includes a first bending area and a first pad area; the first pad area is bent through the first bending area to the non-light-emitting side of the display panel; the first panel pad is disposed in the first pad area; and / or, The second non-display area includes a second bending area and a second pad area; the second pad area is bent through the second bending area to the non-light-emitting side of the display panel; the second panel pad is disposed in the second pad area.

4. The display module according to claim 1, characterized in that, The material of the metal wire includes at least one of aluminum, gold, silver and copper.

5. The display module according to claim 1, characterized in that, The metal wire includes a connecting wire, a first connecting end point, and a second connecting end point; The connecting line is bonded to the first connecting pad via the first connecting endpoint, and the connecting line is bonded to the second connecting pad via the second connecting endpoint; In the width direction intersecting the extension direction of the connecting line, the width of the first connecting endpoint is greater than the width of the connecting line, and the width of the second connecting endpoint is greater than the width of the connecting line.

6. The display module according to claim 5, characterized in that, The width of the connecting line is W0, where 10um ≤ W0 ≤ 40um; and / or, The width of the first connection endpoint is W01, and the width of the second connection endpoint is W02, wherein 10um≤W01≤60um and 10um≤W02≤60um.

7. The display module according to claim 1, characterized in that, The first circuit board includes a plurality of first connection pads arranged along a third direction; the second circuit board includes a plurality of second connection pads arranged along the third direction. Each of the first connection pads and each of the second connection pads are bonded to each other via the metal wires; the corresponding first connection pads and second connection pads overlap in the fourth direction; wherein, the third direction overlaps with the fourth direction, and both the third direction and the fourth direction are parallel to the light-emitting surface of the display module.

8. The display module according to claim 7, characterized in that, In the third direction, the width of the first connection pad is W1, and the spacing between two adjacent first connection pads is L1; In the third direction, the width of the second connection pad is W2, and the spacing between two adjacent second connection pads is L2; Where W1≥W2, L1≤L2.

9. The display module according to claim 7, characterized in that, In the third direction, the width of the first connection pad is W1, and the spacing between two adjacent first connection pads is L1; In the third direction, the width of the second connection pad is W2, and the spacing between two adjacent second connection pads is L2; W1≥25um, L1≥25um; and / or, W2≥25um, L2≥25um.

10. The display module according to claim 1, characterized in that, Also includes: Bonded structure; The first circuit board includes a first circuit structure area and a first connection area located on one side of the first circuit structure area, and the first connection pad is disposed in the first connection area; The second circuit board includes a second circuit structure area and a second connection area located on one side of the second circuit structure area, wherein the second connection pad is disposed in the second connection area; The first connection area is bonded to the second connection area through the adhesive structure.

11. The display module according to claim 10, characterized in that, In the thickness direction of the display module, the first connection area overlaps with the second connection area; the bonding structure is located between the first connection area and the second connection area.

12. The display module according to claim 11, characterized in that, In the overlapping first connection area and the second connection area, the second connection area is located on the side of the first connection area that is away from the display panel; The first circuit board further includes a first circuit board substrate; the first connection pad is located on the side of the first circuit board substrate opposite to the display panel; The second circuit board further includes a second circuit board substrate; the second connection pad is located on the side of the second circuit board substrate opposite to the display panel; The bonding structure is respectively bonded to the side surface of the first circuit board substrate facing away from the display panel and the side surface of the second circuit board substrate close to the display panel.

13. The display module according to claim 10, characterized in that, In the thickness direction of the display module, the first circuit board and the second circuit board do not overlap; The first circuit board further includes a first circuit board substrate; the first connection pad is located on the side of the first circuit board substrate opposite to the display panel; The second circuit board further includes a second circuit board substrate; the second connection pad is located on the side of the second circuit board substrate opposite to the display panel; The bonding structure is respectively bonded to the side of the first circuit board substrate opposite to the first connecting pad and the side of the second circuit board substrate opposite to the second connecting pad.

14. The display module according to claim 13, characterized in that, The first connection area includes a first connection sub-area and at least one second connection sub-area arranged along a third direction; the second connection sub-area is located on the side of the first connection sub-area closer to the second circuit board; In the third direction, the second connecting sub-region overlaps with the second connecting region; in the fourth direction, the first connecting sub-region overlaps with the second connecting region; the third direction overlaps with the fourth direction, and both the third direction and the fourth direction are parallel to the light-emitting surface of the display module.

15. The display module according to claim 10, characterized in that, In the thickness direction of the display module, the thickness of the bonding structure is T1; wherein, 0.01mm≤T1≤0.1mm.

16. The display module according to claim 1, characterized in that, Also includes: Protective adhesive layer; In the thickness direction of the display module, the protective adhesive layer covers the first connection pad, the second connection pad, and the metal line.

17. The display module according to claim 16, characterized in that, Also includes: Filled structure; The filling structure is located on the side of the protective adhesive layer near the display panel, and the filling structure fills the gap between the first circuit board and the second circuit board; The viscosity of the filling material is lower than the viscosity of the protective adhesive layer material.

18. The display module according to claim 3, characterized in that, The non-display area includes two second non-display areas; the two second non-display areas are located on opposite sides of the display area along the second direction.

19. The display module according to claim 1, characterized in that, The circuit board is a flexible circuit board.

20. A display device, characterized in that, include: The display module according to any one of claims 1-19.

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