Display device

Abstract

The display device provided in this disclosure includes: a display panel, the display panel including pixels; a temperature sensing panel located on one side of the display panel; the temperature sensing panel includes a substrate, a first temperature sensing line, a second temperature sensing line and a temperature measuring element, wherein the first temperature sensing line and the second temperature sensing line are intersecting, a temperature measuring element is provided at the intersection of the first temperature sensing line and the second temperature sensing line, and the orthographic projection of an area defined by the intersection of the first temperature sensing line and the second temperature sensing line on the substrate overlaps with the orthographic projection of at least one pixel on the substrate.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a display device. Background Technology

[0002] Display devices used in special environments, such as head-up displays and outdoor displays, generally face the problem of difficulty in effectively monitoring and controlling product temperature. When the screen is exposed to strong light or displays at high brightness, the temperature in some areas rises rapidly. If heat dissipation is not timely and effective, the display panel temperature will exceed the standard, accelerating material aging, shortening product life, and in severe cases, even causing safety hazards. Summary of the Invention

[0003] In view of this, the present disclosure provides a display device for accurately measuring the temperature distribution at different locations on the screen surface, achieving non-invasive, low-cost, and high spatial resolution temperature monitoring of the screen surface, with a wide range of applications.

[0004] Therefore, the display device provided in this disclosure includes: A display panel, the display panel comprising pixels; A temperature-sensing panel is located on one side of the display panel; the temperature-sensing panel includes a substrate, a first temperature-sensing line, a second temperature-sensing line, and a temperature-sensing element, wherein the first temperature-sensing line and the second temperature-sensing line are intersected, the temperature-sensing element is provided at the intersection of the first temperature-sensing line and the second temperature-sensing line, and the orthographic projection of an area defined by the intersection of the first temperature-sensing line and the second temperature-sensing line on the substrate overlaps with the orthographic projection of at least one pixel on the substrate.

[0005] In some embodiments, in the display device provided in the present disclosure, the temperature sensing panel further includes a transistor, the temperature sensing element includes a thermistor material, the gate of the transistor is electrically connected to the first temperature sensing line, the first electrode of the transistor is electrically connected to the second temperature sensing line, the second electrode of the transistor is electrically connected to one end of the temperature sensing element, and the other end of the temperature sensing element is grounded.

[0006] In some embodiments, in the display device provided in the present disclosure, the orthographic projection of the transistor on the substrate overlaps with the orthographic projection of the first temperature sensing line and / or the temperature measuring element on the substrate.

[0007] In some embodiments, in the display device provided in the present disclosure, the first temperature sensing line includes a thermistor material, the first temperature sensing line and the second temperature sensing line are electrically connected at their intersection, and a portion of the first temperature sensing line located between two adjacent second temperature sensing lines serves as a temperature measuring element.

[0008] In some embodiments, in the display device provided in the present disclosure, the thermosensitive material includes at least one of doped metal oxides, organic conductive polymers, carbon nanotubes, and graphene polymers.

[0009] In some embodiments, in the display device provided in the present disclosure, the temperature sensing element includes a sensing capacitor, the sensing capacitor includes a driving electrode and a sensing electrode placed opposite each other, and a transparent dielectric layer located between the driving electrode and the sensing electrode, one of the driving electrode and the sensing electrode being multiplexed with the first temperature sensing line, and the other being multiplexed with the second temperature sensing line.

[0010] In some embodiments, in the display device provided in the present disclosure, the transparent dielectric layer of each temperature sensing element is integrally disposed on the same layer.

[0011] In some embodiments, in the display device provided in the present disclosure, the material of the transparent dielectric layer includes barium titanate composites and / or polymer-based dielectric materials.

[0012] In some embodiments, in the display device provided in the present disclosure, the materials of the first temperature sensing line and the second temperature sensing line include at least one of indium tin oxide, silver nanowires, graphene, and conductive polymers.

[0013] In some embodiments, in the display device provided in the present disclosure, the display panel includes a black matrix, and the orthographic projections of the first temperature sensing line and / or the second temperature sensing line on the substrate overlap with the orthographic projections of the black matrix on the substrate.

[0014] In some embodiments, in the display device provided in the present disclosure, the orthographic projections of the first temperature sensing line and / or the second temperature sensing line on the substrate overlap with the orthographic projections of the pixel on the substrate.

[0015] In some embodiments, in the display device provided in the present disclosure, the temperature-sensing panel further includes an electrochromic functional layer, which is located on the side of the layer containing the temperature sensing element away from the substrate.

[0016] In some embodiments, the display device provided in the present disclosure further includes a micro fan array, the micro fan array being located on the side of the display panel away from the temperature sensing panel and / or at least one side of the display panel perpendicular to the substrate.

[0017] In some embodiments, in the display device provided in the present disclosure, the micro fan array includes micro fans, each micro fan corresponding to at least one intersection defining an area of ​​the first temperature sensing line and the second temperature sensing line, and each micro fan is independently adjustable.

[0018] In some embodiments, the display device provided in this disclosure further includes an adhesive layer located between the display panel and the temperature-sensing panel.

[0019] The beneficial effects of this disclosure are as follows: The display device provided in this disclosure includes a display panel, which includes pixels; and a temperature-sensing panel located on one side of the display panel. The temperature-sensing panel includes a substrate, a first temperature-sensing line, a second temperature-sensing line, and a temperature-sensing element. The first and second temperature-sensing lines are intersecting, and the temperature-sensing element is located at the intersection of the first and second temperature-sensing lines. The orthographic projection of an area defined by the intersection of the first and second temperature-sensing lines on the substrate overlaps with the orthographic projection of at least one pixel on the substrate. By directly placing the temperature-sensing panel on one side of the display panel, the physical distance error of temperature sensors mounted on circuit boards in related technologies is eliminated. Furthermore, no modifications to the internal structure of the display panel are required, enabling convenient installation and maintenance. It is suitable for products of different sizes and types, and the measurement accuracy can be customized according to requirements, significantly reducing costs and exhibiting strong versatility and flexibility. At the same time, the temperature-sensing element can accurately locate the temperature at different positions on the surface, overcoming the deficiency of related technologies in accurately locating high-temperature positions. Attached Figure Description

[0020] Figure 1a This is a schematic diagram of the structure of a display device provided in an embodiment of the present disclosure; Figure 1b for Figure 1a A schematic diagram of the structure of the central display panel; Figure 1c for Figure 1a Schematic diagram of the medium temperature sensing panel; Figure 2a This is a schematic diagram of the structure of a temperature sensing panel provided in an embodiment of the present disclosure; Figure 2b For along Figure 2a A schematic diagram of the cross-sectional structure of line I-I' in the temperature sensing panel shown; Figure 2c for Figure 2a The equivalent circuit diagram of the temperature sensing panel is shown. Figure 2d for Figure 2a The diagram shown illustrates the principle of a temperature-sensing panel monitoring a single point temperature. Figure 2e for Figure 2a The temperature scan diagram of the first row in the temperature sensing panel shown; Figure 2f for Figure 2a The temperature monitoring flowchart of the temperature sensing panel is shown below; Figure 3a This is another structural schematic diagram of the temperature sensing panel provided in this disclosure; Figure 3b for Figure 3a The temperature monitoring flowchart of the temperature sensing panel is shown below; Figure 4a This is another structural schematic diagram of the temperature sensing panel provided in this disclosure; Figure 4b For along Figure 4a A schematic diagram of the cross-sectional structure of line II-II' in the temperature sensing panel shown; Figure 4c for Figure 4a The temperature monitoring flowchart for the temperature sensing panel is shown. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. It should be noted that, for clarity, the thickness of layers, films, panels, regions, etc., is enlarged in the drawings. Exemplary embodiments are described in this disclosure with reference to cross-sectional views as schematic diagrams of idealized embodiments. Thus, deviations from the shape of the figures will be expected as a result of, for example, manufacturing techniques and / or tolerances. Therefore, the embodiments described in this disclosure should not be construed as limited to the specific shape of the regions shown in this disclosure, but rather include deviations in shape caused, for example, by manufacturing processes. For example, a region illustrated or described as flat may typically have rough and / or non-linear characteristics; a sharp corner illustrated may be rounded, etc. Therefore, the regions shown in the figures are schematic in nature, and their dimensions and shapes are not intended to illustrate the precise shape of the regions or reflect true proportions; their purpose is merely to illustrate the content of this disclosure. And throughout, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. To keep the following description of the embodiments of this disclosure clear and concise, detailed descriptions of known functions and known components are omitted.

[0022] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure and the claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “inner,” “outer,” “upper,” and “lower” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0023] In the following description, when an element or layer is referred to as "on" or "connected to" another element or layer, the element or layer may be directly on or directly connected to the other element or layer, or there may be intermediate elements or intermediate layers. When an element or layer is referred to as "located on one side of" another element or layer, the element or layer may be directly on or directly connected to the other element or layer, or there may be intermediate elements or intermediate layers. However, when an element or layer is referred to as "directly on" or "directly connected to" another element or layer, no intermediate elements or intermediate layers are present. The term "and / or" includes any and all combinations of one or more of the related listed items.

[0024] In some embodiments, temperature sensors can be mounted on a circuit board (e.g., a printed circuit board, PCB) inside the display device, at a certain distance from the screen surface. This makes it impossible to directly and accurately measure the temperature at different locations on the screen surface, thus hindering the location of high-temperature areas and the implementation of appropriate solutions. While some high-end screens integrate temperature sensing functions within the panel, using changes in parameters such as current and oscillation frequency to detect temperature, this method requires the creation of new mask sheets, resulting in complex and costly processes. Furthermore, it is limited to specific screen models and sizes, failing to adapt to different sizes and types of screens (such as LCD and OLED), lacking versatility and flexibility. Moreover, most related technologies can only detect single-point temperatures or overall average temperatures, making it difficult to achieve high spatial resolution temperature distribution monitoring and accurately locate localized high-temperature areas. This leads to the system being unable to promptly identify the location of the overheated area and take targeted measures when localized overheating occurs on the screen. Often, only global passive cooling or brightness reduction measures are implemented, resulting in low heat dissipation efficiency and negatively impacting the user experience.

[0025] To address the aforementioned technical problems, this disclosure provides a display device. Figure 1a This is a schematic diagram of the structure of the display device provided in the embodiments of this disclosure. Figure 1b for Figure 1a A schematic diagram of the structure of the central display panel. Figure 1c for Figure 1a A schematic diagram of the medium-temperature sensing panel. (See attached diagram) Figures 1a to 1c The display device provided in this embodiment includes a temperature sensing panel 001 and a display panel 002. Optionally, the temperature sensing panel 001 and the display panel 002 can be fixed by an adhesive layer (e.g., optical adhesive).

[0026] The display panel 002 includes pixels P, which may include red sub-pixels R, green sub-pixels G, and blue sub-pixels B; optionally, pixels P may also include white sub-pixels, cyan sub-pixels, yellow sub-pixels, orange sub-pixels, etc. The display panel 002 can be an LCD display panel, an OLED display panel, an LED display panel, a Micro LED display panel, a MiniLED display panel, etc.

[0027] Optionally, the temperature sensing panel 001 is located on one side of the display panel 002, for example, on the side where the display surface of the display panel 002 is located or on the back side opposite to the display surface. Since the temperature sensing panel 001 is located closer to the display surface when it is on the side where the display surface is located, it can better monitor the temperature of the display panel 002. Therefore, this disclosure uses the example of the temperature sensing panel 001 being located on the side where the display surface of the display panel 002 is located for description. Optionally, the temperature sensing panel 001 includes a substrate 101, a first temperature sensing line 102, a second temperature sensing line 103, and a temperature measuring element 104. The first temperature sensing line 102 and the second temperature sensing line 103 are arranged intersectingly. For example, the first temperature sensing line 102 extends along the row direction X, and the second temperature sensing line 103 extends along the column direction Y. The first temperature sensing line 102 and the second temperature sensing line 103 are arranged perpendicularly to each other. Temperature sensing elements 104 are provided at the intersection of the first temperature sensing line 102 and the second temperature sensing line 103. The orthographic projection of a region S defined by the intersection of the first temperature sensing line 102 and the second temperature sensing line 103 onto the substrate 101 overlaps with the orthographic projection of at least one pixel P onto the substrate 101. The fewer pixels P corresponding to the intersection region S of the first temperature sensing line 102 and the second temperature sensing line 103, the denser the first temperature sensing line 102 and the second temperature sensing line 103 are. Correspondingly, the more intersections of the first temperature sensing line 102 and the second temperature sensing line 103 are, the more temperature sensing elements 104 are placed at the intersections, and the higher the temperature monitoring accuracy. Therefore, in specific implementations, the monitoring accuracy can be flexibly selected according to the actual application scenario. For example, in high-end applications with stringent temperature control requirements, such as automotive head-up displays, medical display devices, and gaming monitors, more temperature sensing elements 104 can be set, while in ordinary applications with less stringent temperature control requirements, such as televisions and advertising screens, the number of temperature sensing elements 104 can be reduced accordingly.

[0028] In the display device provided in the embodiments of this disclosure, by directly setting the temperature sensing panel 001 on one side of the display panel 002, such as the side where the display surface is located or the side where the back is located opposite the display surface, the physical distance error of the temperature sensor due to its installation on the circuit board in the related technology is eliminated; and no modification is required to the internal structure of the display panel 002, realizing convenient installation and maintenance, applicable to products of different sizes and types, and the measurement accuracy can be customized according to requirements, significantly reducing costs and having strong versatility and flexibility; at the same time, the temperature sensing element 104 can be used to accurately locate the temperature at different positions on the surface, overcoming the defect of related technologies that make it difficult to accurately locate high temperature positions.

[0029] In some embodiments, to reduce the impact on light transmittance, the substrate 101, the first temperature-sensing line 102, and the second temperature-sensing line 103 in the temperature-sensing panel 001 are preferably made of transparent materials. Optionally, the substrate 105 may include flexible materials such as polyethylene terephthalate (PET), polydimethylsiloxane (PDMS), and transparent polyimide (CPI), or rigid glass-based materials. The materials of the first temperature-sensing line 102 and the second temperature-sensing line 103 include at least one of indium tin oxide, silver nanowires, graphene, and conductive polymers. Because the temperature-sensing element 104 is located at the intersection of the first temperature-sensing line 102 and the second temperature-sensing line 103, the area occupied by the temperature-sensing element 104 is small, so the overall impact on light transmittance is not significant. Based on this, the temperature-sensing element 104 can be made of transparent or opaque materials. In this disclosure, "transparent" can be understood as having a visible light transmittance of greater than or equal to 70%.

[0030] In some embodiments, Figure 2a A schematic diagram of a temperature sensing panel 001 provided in an embodiment of this disclosure is given. Figure 2b For along Figure 2a The diagram shows a cross-sectional view of line I-I' in the temperature sensing panel 001. Figure 2a and Figure 2b As shown, the temperature-sensing panel 001 also includes a transistor 105. Optionally, to reduce the impact on light transmittance, the orthogonal projection of the transistor 105 on the substrate 101 overlaps with the orthogonal projection of the first temperature-sensing line 102 and / or the temperature-sensing element 104 on the substrate 101. For example, the orthogonal projection of the transistor 105 on the substrate 101 is located within the orthogonal projection of the first temperature-sensing line 102 on the substrate 101. Optionally, the temperature-sensing element 104 includes a thermistor material, which may include at least one of transparent and temperature-sensitive materials such as doped metal oxides, organic conductive polymers, carbon nanotubes, and graphene polymers, thereby both sensing temperature and reducing the impact on light transmittance. Optionally, the gate GE of the transistor 105 is electrically connected to the first temperature-sensing line 102, the first electrode SE of the transistor 105 is electrically connected to the second temperature-sensing line 103, the second electrode DE of the transistor 105 is electrically connected to one end of the temperature-sensing element 104, and the other end of the temperature-sensing element 104 is grounded. This allows the vertically intersecting first and second temperature sensing lines 102 and 103 to form a temperature measurement matrix. Each intersection point is equipped with a temperature sensing element 104. A transistor 105 acts as a control switch, enabling full-screen line-by-line scanning. This allows for monitoring single-point temperature changes, precise temperature coordinate positioning, and thus obtaining the temperature distribution across the entire screen. This embodiment requires a small number of first and second temperature sensing lines 102 and 103, making it suitable for large-size screens. The single-layer structure of the first and second temperature sensing lines 102 and 103 is simple, with mature technology and low cost. The scanning speed is fast, supporting millisecond-level full-screen refresh rates.

[0031] In some embodiments, for Figure 2a The temperature-sensing panel 001 shown can have thermistor materials as temperature sensing elements 104 placed at multiple preset positions on the substrate 101 (i.e., the intersection of the subsequently fabricated first temperature-sensing lines 102 and second temperature-sensing lines 103). The thermistor material can have a high temperature coefficient of resistance, meaning its resistance changes significantly with temperature, for example, a temperature coefficient of resistance greater than 1500 ppm / °C, to ensure temperature sensing sensitivity. Optional materials include doped metal oxides, organic conductive polymers, carbon nanotubes, and composite materials of graphene polymers. A transparent conductive material layer, such as indium tin oxide, silver nanowires, graphene, or conductive polymers, is then formed through sputtering, evaporation, or coating processes. This conductive layer is then patterned into equally spaced first temperature-sensing lines 102 using photolithography or laser etching processes. Adjacent first temperature-sensing lines 102 are insulated from each other and independently led to a flexible circuit board interface at the edge of the temperature-sensing panel 001. The linewidth and spacing of the first temperature sensing line 102 can be flexibly designed according to resolution requirements. Optionally, the linewidth and spacing can be controlled between 5μm and 50μm (e.g., 10μm, 20μm, 30μm, 40μm, etc.) to ensure high light transmittance. Then, a transistor 105 adjacent to the temperature sensing element 104 is integrated on the first temperature sensing line 102 as a switch. The transistor 105 can adopt a bottom-gate or top-gate structure, with its gate GE connected to the first temperature sensing line 102, its second electrode DE electrically connected to one end of the temperature sensing element 104, and its first electrode SE electrically connected to the subsequent second temperature sensing line 103. Finally, a transparent conductive material layer, such as indium tin oxide, silver nanowires, graphene, or conductive polymer, is formed on the layer containing the transistor 105 by sputtering, evaporation, or coating processes. The conductive layer is then patterned into equally spaced second temperature-sensing lines 103 using photolithography or laser etching. Adjacent second temperature-sensing lines 103 are insulated from each other and independently led to a flexible circuit board interface at the edge of the temperature-sensing panel 001. The line width and spacing of the second temperature-sensing lines 103 can be flexibly designed according to resolution requirements. Optionally, the line width and spacing can be controlled between 5μm and 50μm (e.g., 10μm, 20μm, 30μm, 40μm, etc.) to ensure high light transmittance.

[0032] In some embodiments, such as Figure 2a and Figure 2bAs shown, the temperature sensing panel 001 may also include a common ground line 106, a first transparent protective layer 107, a second transparent protective layer 108, a first insulating layer 109, a second insulating layer 110, and a third insulating layer 111. Optionally, the second transparent protective layer 108 covers the second temperature sensing line 103 and its surrounding area, serving to insulate and prevent external environmental corrosion; the first transparent protective layer 107 is located below the common ground line 106, used to isolate the first temperature sensing line 102 from the substrate 101. The gate GE of transistor 105 can be electrically connected to the first temperature sensing line 102. The second insulating layer 110, third insulating layer 111, and fourth insulating layer 112 have interconnected openings for connecting the second electrode DE of transistor 105 to one end of the temperature sensing element 104, which includes a thermistor. The fourth insulating layer 112 also has an opening for connecting the first electrode SE of transistor 105 to the second temperature sensing line 103. The other end of the temperature sensing element 104, including the thermistor, is electrically connected to the bottom common ground line 106, thus forming a complete signal transmission path. When an on-state voltage is applied to the first temperature sensing line 102, all transistors 105 in that row are turned on, connecting the thermistor of the corresponding temperature sensing element 104 to the measurement circuit. When an off-state voltage is applied to the first temperature sensing line 102, the transistor 105 is in a high-resistance state, and the thermistor of the temperature sensing element 104 in that row is isolated from the second temperature sensing line 103. By using a switching structure, the temperature sensing elements 104 in each row can be made to operate independently during line-by-line scanning.

[0033] Figure 2c for Figure 2a The equivalent circuit diagram of the temperature sensing panel 001 shown is available in [reference]. Figure 2cThe first temperature sensing line 102 is connected to the gate of transistor 105 for outputting a switch control signal; the second temperature sensing line 103 is connected to the first terminal of transistor 105 for injecting a constant current and reading a voltage signal; the second terminal of transistor 105 is connected to one end of temperature sensing element 104, and the other end of temperature sensing element 104 is grounded or connected to a common reference voltage. All temperature sensing elements 104 can share a common ground line 106. By applying on / off signals to transistor 105, it is possible to control whether each row of temperature sensing elements 104 is connected to the measurement circuit, thereby achieving precise temperature positioning. Specifically, when the system is working, the row drive circuit applies an on-state voltage to the first temperature sensing line 102 row by row, turning on all transistors 105 in that row. At the same time, a constant current source injects a known constant current into the corresponding column through each second temperature sensing line 103. The current flows through the turned-on transistors 105, through the temperature sensing elements 104, to the common ground line 106, generating a voltage across the temperature sensing element 104. The voltage on each second temperature sensing line 103 is simultaneously measured and converted into digital by the corresponding analog-to-digital converter. The controller calculates the resistance value of each temperature sensing element 104 according to Ohm's law, and then converts it into a temperature value through a pre-stored resistance-temperature lookup table. When a row is scanned, the row drive circuit applies a turn-off voltage to the row electrode, turning off all transistors 105 in that row. At this time, the electrical path between each temperature sensing element 104 and the corresponding second temperature sensing line 103 in that row is cut off. Even if there is still a constant current in the second temperature sensing line 103, it cannot flow through the temperature sensing element 104 in that row. Therefore, the temperature sensing element 104 in non-working rows does not participate in voltage measurement and will not cause crosstalk to the measurement results of the current scanned row. Then the system switches to the next row and repeats the above process until all rows are scanned, thus generating a full-screen real-time two-dimensional temperature distribution map.

[0034] Figure 2d for Figure 2a The diagram shown illustrates the principle of temperature sensing panel 001 monitoring a single point temperature. Figure 2dThe specific illustration shows the operating states of the first temperature sensing element 1041 and the second temperature sensing element 1042 when the first temperature sensing line 102 in the first row is turned on. When the system starts scanning the first temperature sensing line 102 in the first row, the row drive circuit applies an on-state voltage to the first temperature sensing line 102 in the first row, causing all transistors 105 connected to the first row to conduct; simultaneously, an off-state voltage is applied to the first temperature sensing line 102 in the second row and all subsequent non-scanning rows, causing the transistors 105 in these rows to be in the off state. Since the transistors 105 in the first row are turned on, the constant current injected by the constant current source flows sequentially through the second temperature sensing line 103 in the first column, the first and second terminals of the transistors 105 in the first row, and the first temperature sensing element 1041, finally reaching the common ground line 106, forming a complete current loop, from which the voltage value of the first temperature sensing element 1041 can be obtained. This voltage is measured by the analog-to-digital converter and used to calculate the resistance value and corresponding temperature of the first temperature sensing element 1041. One end of the second temperature sensing element 1042 in the second row of the first column is connected to the second terminal of the transistor 105 in the second row, and the other end is connected to the common ground line 106. However, since the transistor 105 in the second row is in the off state, there is a high impedance open circuit between its first and second terminals. The current injected by the constant current source through the second temperature sensing line 103 in the first column cannot flow to the second temperature sensing element 1042 through the transistor 105 in the second row. No current flows through the branch where the second temperature sensing element 1042 is located, so it has no effect on the voltage of the second temperature sensing line 103 in the first column.

[0035] Figure 2e for Figure 2a The temperature scan diagram of the first row in the temperature sensing panel 001 shown is as follows. Figure 2f for Figure 2a The temperature monitoring flowchart for the temperature sensor panel 001 is shown below. (See also...) Figure 2e and Figure 2f At the start of the scan, the system sequentially selects the first temperature sensing line 102 row by row, applying an on-state voltage V_on to the current row, making the thermistor material between the current row and each column of the second temperature sensing line 103 measurable. Simultaneously, all second temperature sensing lines 103 enter reading mode, sequentially acquiring the sensing signal V_sense from each column. This voltage signal is proportional to the resistance value of the thermistor material in the temperature sensing element 104. After acquiring all columns of the current row, the system switches to the next row and repeats the above process until all rows are scanned. After all the original voltage signals are measured, they are converted from analog to digital and the resistance value Ry of the temperature sensing element 104 at each intersection is calculated according to Ohm's law. By calling the factory-stored resistance-temperature lookup table, the resistance value Ry is converted into the corresponding temperature value T, ultimately generating a two-dimensional temperature matrix covering the entire screen surface, achieving real-time monitoring of the full-screen temperature distribution.

[0036] In some embodiments, Figure 3a This diagram illustrates yet another structural schematic of the temperature-sensing panel 001 provided in this disclosure. See also... Figure 3a The first temperature sensing line 102 may include a thermistor material. The first temperature sensing line 102 and the second temperature sensing line 103 are electrically connected at their intersections. The portion of one first temperature sensing line 102 located between two adjacent second temperature sensing lines 103 serves as a temperature sensing element 104. This is equivalent to dividing each row of first temperature sensing lines 102 into multiple series-connected temperature-sensing resistors as temperature sensing elements 104. By measuring the voltage division values ​​at different nodes (i.e., the connection points of adjacent temperature-sensing resistors) on the first temperature sensing line 102, the resistance value of each temperature-sensing resistor and its corresponding temperature can be deduced, thereby achieving temperature monitoring based on resistive voltage division. It can be seen that... Figure 3a The temperature sensor panel 001 shown is Figure 2a The structure of the temperature sensing panel 001 shown is slightly different; the difference lies in that... Figure 3a The temperature sensing panel 001 shown does not require multiple transistors 105 in each row, making it relatively simple and using a mature technology. Optionally, Figure 3a The temperature-sensing panel 001 shown only requires patterning a material with a high temperature coefficient of resistance (e.g., a temperature coefficient of resistance greater than 1500 ppm / °C to ensure temperature sensitivity; optional materials include doped metal oxides, organic conductive polymers, carbon nanotubes, graphene polymer composites, etc.) on the substrate 101 to form multiple parallel first temperature-sensing lines 102. For example, each first temperature-sensing line 102 can correspond to a row of pixels P on the screen. Each first temperature-sensing line 102 is composed of multiple temperature-sensing resistors connected in series, and each temperature-sensing resistor is a temperature-sensing element 104. The two ends of the first temperature-sensing line 102 can be led out to the edge of the temperature-sensing panel 001, respectively, as the input terminal and ground terminal of that row. Then, the voltage of each node is led out to the edge of the temperature-sensing panel 001 through the second temperature-sensing line 103, as the column signal reading terminal.

[0037] Figure 3b for Figure 3a The temperature monitoring flowchart for the temperature sensor panel 001 is shown below. Figure 3bAs shown, for any row's first temperature sensing line 102, a known reference voltage V_ref is applied to its first end, and its last end is grounded. There are N temperature sensing resistors R1, R2, ..., RN connected in series on this row. The node voltages between adjacent resistors are denoted as V1, V2, ..., V(N-1), and the voltage at the grounded end is 0. According to the voltage divider principle, the voltage value of each node is equal to the sum of the voltage drops of all resistors after that node. In unselected rows, all second temperature sensing lines 103 are set to a high-resistance state or grounded to ensure that no current loop is formed with the row being measured. During measurement, the system sequentially reads the voltage values ​​of each node in the row, obtaining a voltage vector [V1, V2, ..., V(N-1)]. Since V_ref is known, and the voltage drop at V_ref = Vm + Rm, a system of N equations containing N unknowns (R1 to RN) can be established, where m is an integer greater than or equal to 1 and less than or equal to N-1. After collecting voltage data from all rows, the system establishes a system of equations containing multiple unknown resistance values ​​based on the voltage divider principle. Using a recursive or matrix solving method, the precise resistance value Ry of each temperature sensor is calculated. A pre-stored resistance-temperature lookup table is then used to convert the resistance values ​​into temperature values ​​T, ultimately generating a two-dimensional temperature matrix covering the entire screen.

[0038] In some embodiments, Figure 4a This diagram illustrates yet another structural schematic of the temperature sensing panel 001 provided in this disclosure. Figure 4b for Figure 4a Schematic diagram of the cross-sectional structure of line II-II'. See also Figure 4a and Figure 4b The temperature sensing element 104 includes a sensing capacitor C, enabling temperature monitoring through the temperature-dependent characteristics of the sensing capacitor C. Optionally, a substrate 101 and a counter substrate 113 are respectively provided on the upper and lower sides of the sensing capacitor C. The sensing capacitor C includes a driving electrode C1 and a sensing electrode C2 placed opposite each other, and a transparent dielectric layer C3 located between the driving electrode C1 and the sensing electrode C2. Optionally, the material of the transparent dielectric layer C1 includes barium titanate composites and / or polymer-based dielectric materials, etc. To simplify the process, the transparent dielectric layer C3 of each temperature sensing element 104 is integrally formed on the same layer. To reduce the impact on light transmittance, one of the driving electrode C1 and the sensing electrode C2 is reused with the first temperature sensing line 102, and the other is reused with the second temperature sensing line 103. This disclosure illustrates an example where the driving electrode C1 is reused with the first temperature sensing line 102, and the sensing electrode C2 is reused with the second temperature sensing line 103.

[0039] In some embodiments, multiple rows of horizontally arranged first temperature-sensing lines 102 can be formed on a substrate 101. A transparent dielectric layer C3 with a high dielectric temperature coefficient is coated on top of the first temperature-sensing lines 102. The dielectric layer material can be selected from materials such as barium titanate composites, polymer-based dielectric materials, or other transparent materials with significant dielectric constant temperature change characteristics. Multiple columns of vertically arranged second temperature-sensing lines 103 are formed on top of the transparent dielectric layer C3, and the second temperature-sensing lines 103 are arranged perpendicularly to the first temperature-sensing lines 102. A sensing capacitor C is formed at each intersection point of the first temperature-sensing line 102 and the second temperature-sensing line 103. The capacitance value of the sensing capacitor C is determined by the dielectric constant of the transparent dielectric layer C3 at the intersection point and the facing area of ​​the driving electrode C1 and the sensing electrode C2 on both sides of the transparent dielectric layer C3. Since the dielectric constant of the transparent dielectric layer C3 changes with temperature, the capacitance value of the sensing capacitor C also changes accordingly, thereby realizing temperature sensing. The advantage of the sensing capacitor scheme is that it utilizes the interlayer sensing capacitance effect, and the multiple rows do not interfere with each other. Meanwhile, the structure naturally supports touch detection, enabling the integration of temperature monitoring and touch sensing on the same thin film.

[0040] Figure 4c for Figure 4a The temperature monitoring flowchart for the temperature sensor panel 001 is shown below. Figure 4c As shown, the system controller applies an AC excitation signal with a fixed frequency and amplitude to the first temperature sensing line 102 in the first row. At this time, multiple induced capacitors C are formed between the first temperature sensing line 102 in this row and the second temperature sensing lines 103 in all columns. The second temperature sensing lines 103 in all columns are connected to the capacitance detection circuit, which sequentially detects the capacitance value of the induced capacitors C at each column of the intersection. The capacitance detection circuit can use techniques such as charge amplification, charge-discharge, or AC bridge to achieve high-precision measurement. Since the induced capacitors C are implemented through an upper and lower layer structure, the measurement of one row will not affect other rows. After the capacitance values ​​of all columns in the first row have been collected, the controller turns off the excitation signal of the first temperature sensing line 102 in the first row and instead excites the first temperature sensing line 102 in the second row, repeating the above process until all rows are scanned. After each frame scan is completed, the system obtains a capacitance value matrix of X rows × Y columns. By using a pre-calibrated capacitance-temperature relationship curve, each capacitance value is converted into a corresponding temperature value, thus obtaining a two-dimensional temperature distribution map of the screen surface.

[0041] In some embodiments, the present disclosure may uniformly divide the display area AA of the display panel 002 into a grid array of X rows × Y columns, with each grid unit corresponding to a temperature measurement area. Each temperature measurement area is provided with a temperature sensing element 104, which correspondingly requires X rows of first temperature sensing lines 102 and Y columns of second temperature sensing lines 103. It can be seen that the density of the temperature measurement area is determined by the X and Y values. The larger the values, the higher the spatial resolution, but the number of first temperature sensing lines 102 and second temperature sensing lines 103 and the signal processing complexity also increase accordingly. At the same time, the orthographic projection of the first temperature sensing line 102 and / or the second temperature sensing line 103 on the substrate 101 may overlap with the orthographic projection of the pixel P on the substrate 101 and block the pixel P. Therefore, the materials selected for the first temperature sensing line 102 and / or the second temperature sensing line 103 should maintain extremely high transmittance (such as indium tin oxide, silver nanowires, etc.), and the width can be 5μm~50μm, for example, 5μm~25μm. In practical implementation, this solution is suitable for applications requiring moderate temperature measurement resolution and a balance between performance and cost. Optionally, the entire display area AA can be divided into 3... 3 to 50 With 50 grids, it can meet the monitoring needs of most screen temperature distributions.

[0042] In some embodiments, the first temperature sensing line 102 and the second temperature sensing line 103 may be disposed in the black matrix BM region, that is, the orthographic projection of the first temperature sensing line 102 and / or the second temperature sensing line 103 on the substrate 101 overlaps with the orthographic projection of the black matrix BM on the substrate 101. Each temperature sensing element 104 at the intersection of the first temperature sensing line 102 and the second temperature sensing line 103 may correspond to one or more pixels P, and the temperature measurement density can be independently set according to the screen size and temperature monitoring requirements, without being limited by the display resolution. The material requirements for the first temperature sensing line 102 and the second temperature sensing line 103 are relatively relaxed; they can be transparent or opaque, as long as the line width does not exceed the black matrix BM. Optionally, this solution requires setting a positioning mark on the temperature sensing panel 001 to ensure precise alignment with the black matrix BM during bonding, so that the first temperature sensing line 102, the second temperature sensing line 103, and the temperature sensing element 104 are precisely arranged in the non-transparent area between pixels P, thereby not affecting the display effect. This solution can achieve pixel-level temperature measurement resolution and accurately capture local overheating points, but it requires high bonding accuracy. It is particularly suitable for high-end application scenarios with stringent temperature control requirements, such as automotive head-up displays, medical display devices, and gaming monitors.

[0043] In some embodiments, this disclosure can also perform differentiated and precise proactive intervention on overheated areas of the screen based on real-time temperature distribution data, realizing the integration of passive heat dissipation and temperature monitoring and active cooling.

[0044] For example, this disclosure allows for the arrangement of a micro-fan array on the back or side of the display panel 002, with each micro-fan corresponding to one or more temperature measurement areas. The system independently adjusts the speed of each micro-fan based on real-time temperature distribution data, achieving precise regional air cooling that is compatible with existing heat dissipation architectures and easy to integrate. By precisely locating overheated points and focusing heat dissipation only on these overheated areas, the energy waste associated with uniform, high-speed operation of all fans is avoided.

[0045] In some embodiments, this disclosure can also adjust the local brightness of overheated areas of the screen based on real-time temperature distribution data. When the temperature of a certain area exceeds a set threshold, the controller, through the display driver circuit and backlight local dimming technology, appropriately reduces the brightness of the corresponding pixels and backlight in that area to reduce heat generation in that area; non-overheated areas maintain their original brightness, without affecting the overall display effect. This solution requires no additional hardware and directly utilizes the local dimming function of existing display driver ICs. The temperature sensing panel 001 transmits the temperature distribution data to the system controller, which sends brightness adjustment commands to the overheated areas through the display driver interface. The brightness reduction can be dynamically adjusted according to the degree of temperature rise, achieving precise temperature control. This solution is applicable to all display technologies that support local dimming and features zero cost, fast response, and simple implementation.

[0046] In some embodiments, the electrochromic functional layer can also be integrated into the temperature-sensing panel 001. The electrochromic functional layer may include a first electrode and a second electrode disposed in separate layers, and an electrochromic material (such as tungsten trioxide, nickel oxide, etc.) disposed across the entire surface between the first electrode and the second electrode. Optionally, one of the first electrode and the second electrode may include multiple independently controlled block electrodes, and the other may be a surface electrode covering all the block electrodes. Each block electrode may correspond to a temperature measuring area, thereby enabling independent control of the zones. The specific working principle is as follows: the temperature measuring element 104 monitors the temperature distribution of each temperature measuring area of ​​the display panel 002 in real time and transmits the temperature data to the controller. When the controller determines that the temperature exceeds the set threshold, it controls the block electrode at the corresponding position to switch the electrochromic material to a low light transmittance / high heat insulation state. In the high heat insulation state (i.e., dark coloring state), the infrared blocking rate can reach 95%~99%, accurately blocking external solar radiation heat sources. Once the temperature in the area drops to a safe range, the controller reverses the voltage polarity, causing the electrochromic material to return to a transparent state. At this point, the overall light transmittance of the temperature-sensing panel 001 can reach over 90%. This solution is suitable for outdoor display devices exposed to direct sunlight, such as vehicle head-up displays and outdoor advertising machines. It effectively prevents localized overheating caused by focused sunlight, achieving targeted and precise radiative heat insulation and cooling, and greatly improving heat dissipation efficiency.

[0047] In some embodiments, the display device provided in this disclosure can be any product or component with display function, such as a vehicle head-up display, medical display device, gaming monitor, outdoor display screen, television, projector, 3D printer, virtual reality device, mobile phone, tablet computer, laptop computer, digital photo frame, navigator, smartwatch, fitness wristband, personal digital assistant, etc. Optionally, the display device provided in this disclosure includes, but is not limited to, components such as: radio frequency unit, network module, audio output & input unit, sensor, display unit, user input unit, interface unit, and control chip. Optionally, the control chip is a central processing unit, digital signal processor, system-on-a-chip (SoC), etc. For example, the control chip may also include memory, power module, etc., and achieve power supply and signal input / output functions through separately provided wires, signal lines, etc. For example, the control chip may also include hardware circuits and computer-executable code, etc. The hardware circuit may include conventional very large-scale integrated circuits (VLSI) or gate arrays, as well as existing semiconductors or other discrete components such as logic chips, transistors, etc.; the hardware circuit may also include field-programmable gate arrays, programmable array logic, programmable logic devices, etc. In addition, the display device provided in the embodiments of this disclosure may include more or fewer of the above-mentioned components, or combine certain components, or have different component arrangements.

[0048] As can be seen from the above, this disclosure employs an independent temperature-sensing panel 002, which is directly attached to the surface of the display panel 002 via an adhesive layer to achieve temperature monitoring. The temperature-sensing panel 002 utilizes a matrix electrode layout, employing various addressing methods such as electrode matrix scanning, resistive voltage division, and sensing capacitance to achieve accurate temperature measurement at different locations. Furthermore, this disclosure proposes an active heat dissipation control scheme based on temperature distribution, integrating temperature sensing and active cooling. This disclosure requires no modification to the internal structure of the original display panel 002; by simply attaching it to the screen surface, it can accurately measure the temperature distribution at different locations on the screen surface, achieving non-invasive, low-cost, and high spatial resolution temperature monitoring of the screen surface, with a wide range of applications.

[0049] Although preferred embodiments of this disclosure have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this disclosure.

[0050] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this disclosure without departing from the spirit and scope of the embodiments of this disclosure. Therefore, if these modifications and variations to the embodiments of this disclosure fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include these modifications and variations.

Claims

1. A display device, characterized in that, include: A display panel, the display panel comprising pixels; A temperature-sensing panel is located on one side of the display panel; the temperature-sensing panel includes a substrate, a first temperature-sensing line, a second temperature-sensing line, and a temperature-sensing element, wherein the first temperature-sensing line and the second temperature-sensing line are intersected, the temperature-sensing element is provided at the intersection of the first temperature-sensing line and the second temperature-sensing line, and the orthographic projection of an area defined by the intersection of the first temperature-sensing line and the second temperature-sensing line on the substrate overlaps with the orthographic projection of at least one pixel on the substrate.

2. The display device as claimed in claim 1, characterized in that, The temperature sensing panel further includes a transistor, the temperature sensing element includes a thermistor material, the gate of the transistor is electrically connected to the first temperature sensing line, the first electrode of the transistor is electrically connected to the second temperature sensing line, the second electrode of the transistor is electrically connected to one end of the temperature sensing element, and the other end of the temperature sensing element is grounded.

3. The display device as claimed in claim 2, characterized in that, The orthographic projection of the transistor on the substrate overlaps with the orthographic projection of the first temperature sensing line and / or the temperature measuring element on the substrate.

4. The display device as claimed in claim 1, characterized in that, The first temperature sensing line includes a thermistor material, and the first temperature sensing line and the second temperature sensing line are electrically connected at their intersection. A portion of the first temperature sensing line located between two adjacent second temperature sensing lines serves as a temperature sensing element.

5. The display device as described in claim 2 or 4, characterized in that, The thermosensitive material includes at least one of doped metal oxides, organic conductive polymers, carbon nanotubes, and graphene polymers.

6. The display device as claimed in claim 1, characterized in that, The temperature sensing element includes a sensing capacitor, which includes a driving electrode and a sensing electrode placed opposite each other, and a transparent dielectric layer located between the driving electrode and the sensing electrode. One of the driving electrode and the sensing electrode is multiplexed with the first temperature sensing line, and the other is multiplexed with the second temperature sensing line.

7. The display device as claimed in claim 6, characterized in that, The transparent dielectric layer of each of the temperature sensing elements is integrally formed on the same layer.

8. The display device as claimed in claim 6, characterized in that, The transparent dielectric layer is made of barium titanate composites and / or polymer-based dielectric materials.

9. The display device as claimed in claim 1, characterized in that, The materials of the first temperature sensing wire and the second temperature sensing wire include at least one of indium tin oxide, silver nanowires, graphene, and conductive polymers.

10. The display device as claimed in claim 1, characterized in that, The display panel includes a black matrix, and the orthographic projection of the first temperature sensing line and / or the second temperature sensing line on the substrate overlaps with the orthographic projection of the black matrix on the substrate.

11. The display device as claimed in claim 1, characterized in that, The orthographic projections of the first temperature sensing line and / or the second temperature sensing line on the substrate overlap with the orthographic projections of the pixel on the substrate.

12. The display device as claimed in claim 1, characterized in that, The temperature-sensing panel also includes an electrochromic functional layer, which is located on the side of the layer containing the temperature sensing element away from the substrate.

13. The display device as claimed in claim 1, characterized in that, It also includes a micro fan array located on the side of the display panel away from the temperature sensing panel and / or at least one side of the display panel perpendicular to the substrate.

14. The display device as claimed in claim 13, characterized in that, The micro fan array includes micro fans, each of which corresponds to at least one intersection defining a region defined by the first temperature sensing line and the second temperature sensing line, and each micro fan is independently adjustable.

15. The display device according to any one of claims 1-4 and 6-14, characterized in that, It also includes an adhesive layer located between the display panel and the temperature-sensing panel.

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