Graphene thermal bridge heat sink capacitor

Abstract

This invention discloses a graphene thermal bridge heat dissipation capacitor, relating to the field of capacitors. The key technical features include a capacitor housing, multiple capacitor cores, a terminal assembly, an aluminum plate heat dissipation section, and graphene thermal bridges. The graphene thermal bridges are located between adjacent capacitor cores and / or between a capacitor core and the aluminum plate heat dissipation section. Graphene thermally conductive units are biased and form a first gap. The heat absorption end on the core side and the output end on the aluminum plate side both correspond to the central heat concentration area. This invention can directionally transfer heat from the center of the core to the aluminum plate heat dissipation section, while also considering heat dissipation efficiency and electrical safety.

Description

Technical Field

[0001] This invention relates to the field of capacitors, and particularly to a graphene thermal bridge heat dissipation capacitor. Background Technology

[0002] DC-supported capacitors are commonly used in DC-supported filtering applications for busbar capacitors, such as in new energy vehicle controllers, wind power converters, and large-capacity energy storage devices. In these applications, the capacitors need to withstand large ripple currents and are usually used in conjunction with water-cooled heat dissipation structures to meet the temperature rise control requirements under high power density conditions.

[0003] Existing large-capacity bus capacitors typically employ a copper busbar soldering structure for electrical connection and current collection. In this type of structure, the copper busbar not only carries current but also participates in heat transfer to some extent. However, with increasing demands for cost reduction, the material and processing costs of the copper busbar and solder wire are putting significant pressure on the overall cost of the capacitor.

[0004] Even with reduced copper busbar usage, decreased reliance on solder structures, or optimized electrical connection structures, capacitors still need to meet heat dissipation requirements under high ripple current conditions. Especially in applications with water cooling capabilities, effectively transferring the heat generated by the capacitor core during operation to the aluminum heat sink and further dissipating it through a water-cooling structure is a crucial factor affecting capacitor temperature rise control and lifespan stability. Summary of the Invention

[0005] The purpose of this invention is to provide a graphene thermal bridge heat dissipation capacitor, which has the advantages of improving heat dissipation efficiency under high ripple current conditions and reducing dependence on copper busbar soldering for heat dissipation.

[0006] The above-mentioned technical objective of the present invention is achieved through the following technical solution: A graphene thermal bridge heat dissipation capacitor, comprising: Capacitor casing; Multiple capacitor cores are disposed within the capacitor housing. Each capacitor core includes a central heat concentration region and end electrode regions located on both sides of the central heat concentration region. A terminal assembly, wherein the terminal assembly is electrically connected to the end electrode region; An aluminum plate heat dissipation section is disposed on one side of the capacitor housing; A graphene thermal bridge is disposed inside the capacitor housing and located between two adjacent capacitor cores and / or between the capacitor core and the aluminum plate heat dissipation part; The graphene thermal bridge is biased relative to the capacitor core and forms a first gap with the capacitor core. The graphene thermal conductive unit includes a core-side heat-absorbing end facing the capacitor core and an aluminum plate-side output end facing the aluminum plate heat dissipation part. The projections of the core-side heat-absorbing end and the aluminum plate-side output end in the thickness direction of the capacitor core are both located in the central heat concentration area.

[0007] Further configuration: The graphene thermal bridge includes a first graphene thermal conductive sheet and a second graphene thermal conductive sheet that are layered along the thickness direction of the capacitor shell. A second gap is formed between adjacent first and second graphene thermal conductive sheets; The first graphene thermal conductive sheet and the second graphene thermal conductive sheet are staggered and their orthogonal projections along the thickness direction of the capacitor shell overlap to form a projection overlap thermal coupling area. An insulating and thermally conductive isolation layer is provided in the projection overlap thermal coupling area. The first graphene thermal conductive sheet, the second graphene thermal conductive sheet, and the insulating thermally conductive isolation layer together form a stepped heat conduction path from the central heat concentration area toward the aluminum plate heat dissipation part.

[0008] Further configuration: The insulating and thermally conductive isolation layer is at least one of the following: insulating and thermally conductive film, ceramic thermally conductive sheet, boron nitride thermally conductive sheet, alumina thermally conductive sheet, or polyimide thermally conductive film.

[0009] Further configuration: the width of the first gap formed by the graphene thermal bridge being offset relative to the capacitor core is not less than 5mm.

[0010] Further configuration: The aluminum plate heat dissipation part is provided with an aluminum plate side heat collection area on the side facing the capacitor core, and there are multiple graphene heat conduction units, with the aluminum plate side output ends of the multiple graphene heat conduction units all facing the aluminum plate side heat collection area.

[0011] Further configuration: The outer peripheral edge of the insulating thermally conductive isolation layer extends beyond the outer peripheral edge of the projected overlapping thermal coupling area, so as to form an insulating extension edge outside the projected overlapping boundary of the first graphene thermally conductive sheet and the second graphene thermally conductive sheet.

[0012] Further configuration: Within the projected overlapping thermal coupling area, a silicone substrate is disposed between the first graphene thermal conductive sheet and the insulating thermally conductive isolation layer. The surface of the silicone substrate facing the first graphene thermal conductive sheet is formed with continuous alternating peak undulations and valley depressions. The top of the undulating crest section abuts against the first graphene thermal conductive sheet, and the trough recess section forms a deformation release cavity between itself and the first graphene thermal conductive sheet, so that the undulating crest section maintains contact with the first graphene thermal conductive sheet after thermal shock.

[0013] Further configuration: The graphene thermal conductive unit includes a heat-absorbing section near the central heat concentration area, an output section near the aluminum plate heat dissipation section, and a bent connecting section connecting the heat-absorbing section and the output section; The core-side heat absorption ends are located on both sides of the heat absorption section and on the side of the output section facing away from the aluminum plate heat dissipation part, respectively, while the aluminum plate-side output end is located on the side facing the aluminum plate heat dissipation part.

[0014] Further configuration: It also includes a polarity connection side plate assembly, which includes a first polarity connection side plate and a second polarity connection side plate. The first polarity connection side plate and the second polarity connection side plate are respectively disposed on opposite sides of the plurality of capacitor cores and are electrically connected to the end electrode regions of different polarities respectively. The first polarity connection side plate is located on one side of the aluminum plate heat dissipation part. A groove is opened on the surface of the first polarity connection side plate. The bent connection section is snapped into the groove. The heat absorption section extends through the first polarity connection side plate to one side of the capacitor core. The output section is located on the side of the first polarity connection side plate facing the aluminum plate heat dissipation part.

[0015] Further configuration: The first polarity connection side plate and / or the second polarity connection side plate are provided with heat dissipation windows, which are provided corresponding to the central heat concentration area of ​​the capacitor core.

[0016] In summary, the present invention has the following beneficial effects: First, this invention, by incorporating graphene thermal bridges within the capacitor casing, allows the heat generated during capacitor core operation to be transferred to the aluminum plate heat dissipation section via graphene thermal conductive units. Both the heat absorption end on the core side and the output end on the aluminum plate side of the graphene thermal conductive unit correspond to the central heat concentration area, concentrating the heat conduction path on the main heat-generating locations of the capacitor core. This reduces heat diffusion and retention in the encapsulation medium, air gaps, or non-primary heat dissipation structures within the casing, thereby improving heat dissipation capability under high ripple current conditions.

[0017] Secondly, the graphene thermal bridge of the present invention is offset relative to the capacitor core and forms a first gap with the capacitor core. This first gap limits the proximity of the graphene thermally conductive unit to the end electrode region and terminal assembly, ensuring that the graphene thermal bridge absorbs heat near the central heat concentration area while not directly contacting the end structure that performs the electrical connection function. Therefore, the capacitor can maintain the necessary electrical isolation distance while introducing a high thermal conductivity path, reducing the risk of electrical safety issues caused by assembly deviations, thermal deformation, or edge displacement of the thermally conductive components.

[0018] Third, the first and second graphene thermal conductive sheets of this invention are layered along the thickness direction of the capacitor shell and form a projected overlapping thermal coupling region through a staggered structure. An insulating thermally conductive isolation layer is located within the projected overlapping thermal coupling region, preventing direct electrical contact between adjacent graphene thermal conductive sheets, while still enabling interlayer heat transfer through the overlapping area. This structure transforms the monolithic direct heat conduction path into a stepped heat conduction path, allowing heat to gradually transition from the central heat concentration area to the aluminum plate heat dissipation section, while simultaneously reducing the possibility of electrical risks caused by edge contact between graphene sheets.

[0019] Fourth, the outer peripheral edge of the insulating thermally conductive isolation layer of the present invention extends beyond the outer peripheral edge of the projected overlapping thermal coupling area, forming an insulating epitaxial edge. This insulating epitaxial edge can cover the relatively misaligned area between the first and second graphene thermally conductive sheets near the projected overlapping boundary. When the capacitor experiences local displacement due to vibration, thermal expansion and contraction, or assembly tolerances, the insulating epitaxial edge can still maintain interlayer edge isolation, enabling the layered graphene thermally conductive structure to have more stable electrical isolation capabilities during long-term use.

[0020] Fifth, the silicone substrate of the present invention is disposed within the projected overlapping thermal coupling region. The undulating sections of the surface of the silicone substrate abut against the first graphene thermal conductive sheet, and the trough recesses form a deformation release cavity between the silicone substrate and the first graphene thermal conductive sheet. During thermal shock, the deformation release cavity provides local deformation space for the silicone substrate, and the undulating sections can continue to maintain contact with the first graphene thermal conductive sheet after deformation release, thereby reducing the possibility of separation, blistering, or increased contact thermal resistance at the interlayer thermal coupling interface due to thermal cycling.

[0021] Sixth, the graphene thermal conductive unit of the present invention includes a heat absorption section, an output section, and a bent connecting section. The bent connecting section connects the heat absorption section near the central heat concentration area to the output section near the aluminum plate heat dissipation part. This bent structure allows the graphene thermal conductive unit to adapt to the spatial relationship between the capacitor core, the polarity connection side plate assembly, and the aluminum plate heat dissipation part, establishing a heat conduction channel from the center of the core to the aluminum plate side without significantly changing the arrangement of the terminal assembly, the upper busbar, and the lower busbar.

[0022] Seventh, the first polarity connection side plate of the present invention is provided with a groove, and the bent connection section is snapped into the groove, so that the graphene heat-conducting unit can be positioned with the help of the first polarity connection side plate. The heat-absorbing section extends through the first polarity connection side plate to the side of the capacitor core, and the output section is located on the side of the first polarity connection side plate facing the aluminum plate heat dissipation part, so that the thermal bridge installation position and the electrical connection side plate position form a matching relationship, reducing the need for additional positioning parts, and facilitating the control of the relative distance between the graphene heat-conducting unit and the capacitor core and the aluminum plate heat dissipation part.

[0023] Eighth, the first polarity connection side plate and / or the second polarity connection side plate of the present invention are provided with heat dissipation windows, which correspond to the central heat concentration area. The heat dissipation windows reduce the obstruction of the heat conduction path between the central heat concentration area and the graphene thermal bridge by the polarity connection side plate assembly, allowing the heat generated in the middle of the capacitor core to be transferred more directly to the graphene thermal bridge. Thus, while reducing the amount of copper busbars, reducing reliance on solder structures, or optimizing the electrical connection structure, the capacitor can still form a continuous heat dissipation path with the help of the graphene thermal bridge, the aluminum plate heat dissipation part, and the external water cooling structure, meeting the temperature rise control requirements under high ripple current conditions. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of a graphene thermal bridge heat dissipation capacitor. Figure 2 This is a schematic diagram of the internal assembly structure of a graphene thermal bridge heat dissipation capacitor. Figure 3 yes Figure 2 A schematic diagram of the exploded structure; Figure 4 This is a schematic diagram showing the relative positions of the capacitor core and the graphene thermal bridge. Figure 5 This is a schematic diagram of the structure in which the graphene thermal conductive unit forms the first gap between multiple capacitor cores; Figure 6 This is a schematic diagram of the stacked structure of the first graphene thermal conductive sheet, the second graphene thermal conductive sheet, and the insulating thermally conductive isolation layer; Figure 7 It is a structural schematic diagram of the silicone matrix, the undulating peak section, the trough depression section, and the deformation release cavity.

[0025] In the diagram, 100 represents the capacitor casing; 110 represents the aluminum heat sink. 200. Capacitor core; 210. Central heat concentration area; 220. End electrode area; 300. Terminal assembly; 310. Pin; 320. Upper bus; 330. Lower bus; 400. Graphene thermal bridge; 411. Core-side heat absorption end; 412. Aluminum plate-side output end; 413. Heat absorption section; 414. Output section; 415. Bending connection section; 420. First gap; 421. Second gap; 440. First graphene thermal conductive sheet; 450. Second graphene thermal conductive sheet; 470. Insulating thermal conductive isolation layer; 471. Insulating outer edge; 480. Silicone matrix; 481. Wave crest section; 482. Wave trough section; 483. Deformation release cavity; 500, Polar connection side panel assembly; 510, First polar connection side panel; 511, Recessed groove; 512, Heat dissipation window; 520, Second polar connection side panel. Detailed Implementation

[0026] The present invention will be further described in detail below with reference to the accompanying drawings.

[0027] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0028] like Figures 1 to 3 As shown, the present invention provides a graphene thermal bridge heat dissipation capacitor, including a capacitor housing 100, a plurality of capacitor cores 200, a terminal assembly 300, an aluminum plate heat dissipation part 110, a graphene thermal bridge 400, and a polarity connection side plate assembly 500. The plurality of capacitor cores 200 are disposed within the capacitor housing 100. The terminal assembly 300 is disposed at the end of the capacitor housing 100 and is used to lead outwards the electrodes of the plurality of capacitor cores 200. The aluminum plate heat dissipation part 110 is disposed on one side of the capacitor housing 100 and is used for heat exchange with an external water-cooling structure. The graphene thermal bridge 400 is disposed within the capacitor housing 100 and is located on the heat conduction path between the capacitor cores 200 and the aluminum plate heat dissipation part 110.

[0029] like Figure 2 and Figure 3 As shown, the terminal assembly 300 includes pins 310, an upper bus 320, and a lower bus 330. The upper bus 320 is connected to a portion of the pins 310, and the lower bus 330 is connected to another portion of the pins 310, allowing multiple capacitor cores 200 to be connected externally through bus structures of different polarities. A polarity connection side plate assembly 500 is disposed on opposite sides of the multiple capacitor cores 200 and is used to mate with the end electrode regions 220 of the capacitor cores 200. Thus, the terminal assembly 300, the upper bus 320, the lower bus 330, and the polarity connection side plate assembly 500 together form an electrical connection path and perform the functions of current collection and external connection.

[0030] like Figures 1 to 3As shown, the aluminum plate heat sink 110 is located on one side of the capacitor housing 100. The side of the aluminum plate heat sink 110 facing the inside of the capacitor housing 100 is used to receive heat transferred from the capacitor core 200, while the side of the aluminum plate heat sink 110 facing away from the inside of the capacitor housing 100 is used for heat exchange with the external water-cooling structure. The heat generated by the capacitor core 200 under high ripple current conditions is transferred to the aluminum plate heat sink 110 via the graphene thermal bridge 400, and then released from the aluminum plate heat sink 110 to the external water-cooling structure. Through the above arrangement, the heat of the capacitor core 200 can be transferred to the aluminum plate heat sink 110 along a shorter heat conduction path, without mainly relying on copper busbars or soldered structures for heat dissipation.

[0031] like Figure 3 and Figure 4 As shown, each capacitor core 200 includes a central heat concentration region 210 and end electrode regions 220 located on both sides of the central heat concentration region 210. The central heat concentration region 210 is located in the middle of the capacitor core 200, and corresponds to the area where heat easily accumulates inside the capacitor core 200 when the capacitor is subjected to large ripple current. The end electrode regions 220 are used to form electrical connections with the terminal assembly 300, the upper bus 320, the lower bus 330, or the polarity connection side plate assembly 500. The central heat concentration region 210 mainly corresponds to the heat dissipation requirement, while the end electrode regions 220 mainly correspond to the current collection and extraction requirement. By dividing the capacitor core 200 into the above regions, the graphene thermal bridge 400 can be arranged around the central heat concentration region 210, while the end electrode regions 220 continue to perform the electrical connection function.

[0032] like Figure 4 As shown, the heat absorption position of the graphene thermal bridge 400 corresponds to the central heat concentration region 210 of the capacitor core 200. The graphene thermal bridge 400 does not primarily absorb heat from the end electrode region 220, but instead establishes a heat conduction path around the central heat concentration region 210 of the capacitor core 200. Therefore, the heat generated in the center of the capacitor core 200 can first be transferred to the graphene thermal bridge 400, and then through the graphene thermal bridge 400 to the aluminum plate heat dissipation section 110.

[0033] like Figures 3 to 5 As shown, the graphene thermal bridge 400 can be located between two adjacent capacitor cores 200, between a capacitor core 200 and the aluminum plate heat dissipation part 110, or simultaneously between two adjacent capacitor cores 200 and between a capacitor core 200 and the aluminum plate heat dissipation part 110. The graphene thermal bridge 400 includes at least one graphene thermally conductive unit, which is used to form a heat conduction bridge between the capacitor core 200 and the aluminum plate heat dissipation part 110.

[0034] like Figure 4 and Figure 5As shown, the graphene thermally conductive unit is offset relative to the capacitor core 200, forming a first gap 420 between them. This first gap 420 is not intended to move the graphene thermally conductive unit entirely away from the capacitor core 200, but rather to ensure that the graphene thermally conductive unit is close to the central heat concentration region 210 while avoiding the end electrode region 220, the terminal assembly 300, or the areas in the polarity connection side plate assembly 500 that perform electrical connection functions. In this way, the graphene thermally conductive unit can receive heat generated in the center of the capacitor core 200 while maintaining an electrically safe distance from high-potential connection areas.

[0035] In some embodiments, the first gap 420 may be formed between the graphene thermally conductive unit and the corresponding position of the end electrode region 220, or between the graphene thermally conductive unit and the terminal assembly 300, the polar connection side plate assembly 500, or other high-potential connection structures. That is, the first gap 420 is used to define the clearance distance between the graphene thermally conductive unit and the electrical connection region, without requiring the graphene thermally conductive unit to be far away from the capacitor core 200 at all locations. The width of the first gap 420 may be not less than 5 mm to reduce the possibility of insulation risk caused by the graphene thermal bridge 400 being too close to the electrical connection structure.

[0036] like Figure 4 and Figure 5 As shown, the graphene thermal conductive unit includes a core-side heat-absorbing end 411 facing the capacitor core 200 and an aluminum plate-side output end 412 facing the aluminum plate heat dissipation part 110. The core-side heat-absorbing end 411 is arranged near the central heat concentration region 210 of the capacitor core 200 to receive the heat generated by the capacitor core 200 during operation and concentrated in the central region. The aluminum plate-side output end 412 is arranged towards the aluminum plate heat dissipation part 110 to transfer the heat absorbed by the graphene thermal conductive unit to the aluminum plate heat dissipation part 110.

[0037] like Figure 4 As shown, the projections of the heat-absorbing end 411 on the core side and the output end 412 on the aluminum plate side in the thickness direction of the capacitor core 200 are both located within the central heat concentration region 210. Through this projection relationship, the heat absorption and output positions of the graphene heat-conducting unit are arranged around the central heat-generating position of the capacitor core 200, so that the heat generated in the center of the capacitor core 200 can be transferred along the graphene heat-conducting unit to the aluminum plate heat dissipation part 110, without having to first detour to the end electrode region 220 before diffusing outward.

[0038] In some embodiments, an aluminum plate-side heat collection area is formed on the side of the aluminum plate heat dissipation section 110 facing the capacitor core 200. This aluminum plate-side heat collection area can be a localized region of the aluminum plate heat dissipation section 110 facing the capacitor core 200, or it can be a continuous region on the aluminum plate heat dissipation section 110 opposite to the plurality of aluminum plate-side output ends 412. With the aluminum plate-side output ends 412 of the plurality of graphene heat-conducting units all facing the aluminum plate-side heat collection area, the heat generated by the plurality of capacitor cores 200 can first be collected in the aluminum plate-side heat collection area, and then transferred to the external water-cooling structure via the aluminum plate heat dissipation section 110. This arrangement ensures that the heat dissipation paths of the plurality of capacitor cores 200 have a consistent heat output direction, which helps to reduce local heat retention.

[0039] like Figure 6 As shown, in some alternative embodiments, the graphene thermal bridge 400 includes a first graphene thermal conductive sheet 440 and a second graphene thermal conductive sheet 450 layered along the thickness direction of the capacitor housing 100. A second gap 421 is formed between the first graphene thermal conductive sheet 440 and the second graphene thermal conductive sheet 450, so that the two layers of graphene thermal conductive sheets are arranged at intervals in the thickness direction. The first graphene thermal conductive sheet 440 and the second graphene thermal conductive sheet 450 are staggered, and their orthogonal projection portions along the thickness direction of the capacitor housing 100 overlap, thereby forming a projection overlap thermal coupling region.

[0040] like Figure 6 As shown, an insulating and thermally conductive isolation layer 470 is disposed within the projected overlapping thermal coupling region. The insulating and thermally conductive isolation layer 470 is located between the first graphene thermally conductive sheet 440 and the second graphene thermally conductive sheet 450, preventing direct electrical contact between the two sheets. Simultaneously, the insulating and thermally conductive isolation layer 470 has thermal conductivity, allowing heat to be transferred from one graphene thermally conductive sheet to the other within the projected overlapping thermal coupling region.

[0041] Through the cooperation of the first graphene thermal conductive sheet 440, the second graphene thermal conductive sheet 450, and the insulating thermally conductive layer 470, the graphene thermal bridge 400 forms a stepped heat conduction path extending from the central heat concentration region 210 toward the aluminum plate heat dissipation section 110. This stepped heat conduction path does not involve directly bonding the two graphene thermal conductive sheets together, but rather achieving heat transfer through projected overlapping thermal coupling areas while maintaining interlayer electrical isolation. Therefore, the graphene thermal bridge 400 can simultaneously meet the requirements of interlayer thermal conductivity and electrical isolation.

[0042] In some embodiments, the insulating thermally conductive layer 470 can be at least one of an insulating thermally conductive film, a ceramic thermally conductive sheet, a boron nitride thermally conductive sheet, an alumina thermally conductive sheet, or a polyimide thermally conductive film. All of the above materials can provide an insulating separation between the first graphene thermally conductive sheet 440 and the second graphene thermally conductive sheet 450, while simultaneously providing a heat transfer medium for the projected overlapping thermal coupling region.

[0043] like Figure 6 As shown, the outer peripheral edge of the insulating thermally conductive isolation layer 470 extends beyond the outer peripheral edge of the projected overlapping thermal coupling region, and forms an insulating outer edge 471 outside the projected overlapping boundary of the first graphene thermally conductive sheet 440 and the second graphene thermally conductive sheet 450. The insulating outer edge 471 extends outward along the boundary of the projected overlapping thermal coupling region, covering the area where the first graphene thermally conductive sheet 440 and the second graphene thermally conductive sheet 450 may approach each other near the misalignment boundary.

[0044] During capacitor assembly, the first graphene thermal conductive sheet 440 and the second graphene thermal conductive sheet 450 may experience slight misalignment due to installation tolerances. During capacitor operation, the first graphene thermal conductive sheet 440, the second graphene thermal conductive sheet 450, and the insulating thermally conductive layer 470 may also undergo dimensional changes due to alternating heating and cooling. The insulating outer edge 471 can remain positioned between the edges of the two graphene thermal conductive sheets under these conditions, reducing the possibility of contact between the two layers at the edges. When the insulating outer edge 471 cooperates with the projected overlapping thermal coupling region, the projected overlapping thermal coupling region ensures interlayer heat transfer, while the insulating outer edge 471 provides electrical isolation redundancy for the projected overlapping boundary, enabling the layered misaligned graphene thermal bridge 400 to maintain the stability of the interlayer thermal conduction path and the interlayer electrical isolation path even under the influence of vibration, thermal expansion and contraction, and assembly deviations.

[0045] like Figure 7 As shown, in a further embodiment, a silicone substrate 480 is disposed within the projected overlapping thermal coupling region. The silicone substrate 480 is located between the first graphene thermally conductive sheet 440 and the insulating thermally conductive isolation layer 470. The surface of the silicone substrate 480 facing the first graphene thermally conductive sheet 440 is formed with continuously alternating peak undulation segments 481 and valley recess segments 482. The top of the peak undulation segment 481 abuts against the first graphene thermally conductive sheet 440, and a deformation release cavity 483 is formed between the valley recess segment 482 and the first graphene thermally conductive sheet 440.

[0046] like Figure 7As shown, the undulating crest section 481 serves as the main contact area between the silicone substrate 480 and the first graphene thermal conductive sheet 440. The trough recessed section 482 is recessed relative to the undulating crest section 481 in a direction away from the first graphene thermal conductive sheet 440, so that the deformation release cavity 483 is located between adjacent undulating crest sections 481. When the capacitor undergoes thermal expansion and contraction during thermal shock, the silicone substrate 480 can generate local elastic deformation. The deformation release cavity 483 provides deformation space for the compression, displacement, and recovery of the undulating crest section 481. In this way, the undulating crest section 481 can still maintain contact with the first graphene thermal conductive sheet 440 after being compressed. The trough recessed section 482 and the deformation release cavity 483 can absorb the local deformation caused by the interlayer size change, reducing the possibility of the thermal coupling interface between the first graphene thermal conductive sheet 440 and the insulating thermally conductive layer 470 detaching or bulging due to thermal cycling.

[0047] In some embodiments, the silicone substrate 480 may be bonded to the insulating and thermally conductive isolation layer 470, or it may be integrally formed or pre-composite with the insulating and thermally conductive isolation layer 470 to form a thermally conductive buffer layer. The thermally conductive buffer layer can maintain the thermally conductive contact between the first graphene thermally conductive sheet 440 and the insulating and thermally conductive isolation layer 470, and can also compensate for interlayer assembly tolerances and thermal deformation through the wave crest undulation section 481 and the deformation relief cavity 483.

[0048] like Figure 2 , Figure 3 and Figure 5 As shown, in this embodiment, the graphene thermal conductive unit includes a heat-absorbing section 413, an output section 414, and a bent connecting section 415 connecting the heat-absorbing section 413 and the output section 414. The heat-absorbing section 413 is arranged near the central heat concentration region 210 of the capacitor core 200, and the output section 414 is arranged near the aluminum plate heat dissipation part 110. The bent connecting section 415 is used to change the extension direction of the graphene thermal conductive unit, so that the heat-absorbing section 413 and the output section 414 can be located on the capacitor core 200 side and the aluminum plate heat dissipation part 110 side, respectively.

[0049] like Figure 5 As shown, the heat-absorbing section 413 can extend between two adjacent capacitor cores 200, so that both sides of the heat-absorbing section 413 can face the central heat concentration area 210 of the adjacent capacitor core 200. The output section 414 is located on the side close to the aluminum plate heat dissipation part 110, so that the heat absorbed by the heat-absorbing section 413 can be transferred to the output section 414 through the bent connecting section 415, and then transferred from the output section 414 to the aluminum plate heat dissipation part 110. The bent connecting section 415 forms a spatial transition between the heat-absorbing section 413 and the output section 414, so that the graphene thermal conductive unit can be adapted to the assembly position between the capacitor core 200, the polarity connection side plate assembly 500 and the aluminum plate heat dissipation part 110.

[0050] In some embodiments, the core-side heat-absorbing end 411 can be located on both sides of the heat-absorbing section 413 and on the side of the output section 414 facing away from the aluminum plate heat dissipation part 110, respectively, so that the graphene heat-conducting unit can receive heat transferred from the middle of the capacitor core 200 from multiple directions. The aluminum plate-side output end 412 is located on the side of the output section 414 facing the aluminum plate heat dissipation part 110, so that heat is concentrated and transferred to the aluminum plate heat dissipation part 110 along the output section 414. With the above structure, the graphene heat-conducting unit does not need to be completely attached to the surface of the capacitor core 200, and a heat-conducting channel from the middle of the core to the aluminum plate heat dissipation part 110 can be formed while maintaining the first gap 420.

[0051] like Figure 2 and Figure 3 As shown, the bent graphene thermal conductive unit can be arranged near the polar connection side plate assembly 500. The bent connection section 415 allows the heat absorption section 413 to pass through or bypass a local area of ​​the polar connection side plate assembly 500 and approach the capacitor core 200, while the output section 414 can be located on the side of the polar connection side plate assembly 500 facing the aluminum plate heat dissipation section 110. In this way, the graphene thermal conductive unit can establish a thermal bridge path using the assembly space near the polar connection side plate assembly 500 without significantly changing the arrangement of the terminal assembly 300, the upper busbar 320, and the lower busbar 330.

[0052] like Figure 2 and Figure 3 As shown, in some embodiments, the polarity connection side plate assembly 500 includes a first polarity connection side plate 510 and a second polarity connection side plate 520. The first polarity connection side plate 510 and the second polarity connection side plate 520 are respectively disposed on opposite sides of a plurality of capacitor cores 200 and are electrically connected to end electrode regions 220 of different polarities, so as to form lateral electrical connection paths of different polarities inside the capacitor housing 100.

[0053] like Figure 3 As shown, the first polarity connection side plate 510 is located on one side of the aluminum plate heat dissipation part 110, and a groove 511 is formed on the surface of the first polarity connection side plate 510. The bent connection section 415 is snapped into the groove 511, so that the graphene heat conduction unit is kept in a predetermined position relative to the first polarity connection side plate 510. After the groove 511 limits the bent connection section 415, the heat absorption section 413 can pass through the first polarity connection side plate 510 and extend to the side of the capacitor core 200, and the output section 414 can be located on the side of the first polarity connection side plate 510 facing the aluminum plate heat dissipation part 110.

[0054] Through the aforementioned slot 511 positioning structure, the first polarity connection side plate 510 not only forms an electrical connection path but also provides an assembly positioning reference for the graphene heat-conducting unit. After the bent connection section 415 mates with the slot 511, the first gap 420 between the graphene heat-conducting unit and the capacitor core 200 is more easily kept stable, and the heat transfer position between the graphene heat-conducting unit and the aluminum plate heat dissipation part 110 is also easier to align. As a result, the graphene thermal bridge 400 can maintain a predetermined thermal bridge posture inside the capacitor, reducing the impact of assembly deviations on the heat conduction path and electrical isolation distance.

[0055] like Figure 2 and Figure 3 As shown, the first polarity connection side plate 510 and the second polarity connection side plate 520 are located on opposite sides of the capacitor core 200. The end electrode region 220 cooperates with the polarity connection side plate of the corresponding polarity, so that the current of the capacitor core 200 can be transferred to the terminal assembly 300 through the side plate structure. After the graphene thermal conductive unit cooperates with the groove 511 of the first polarity connection side plate 510, the thermal bridge path and the electrical connection path are close to each other in space but remain separated, so that the capacitor can simultaneously arrange the electrical connection structure and the thermal conductive structure within the limited housing space.

[0056] like Figure 2 and Figure 3 As shown, in some embodiments, heat dissipation windows 512 are provided on the first polarity connection side plate 510 and / or the second polarity connection side plate 520. The heat dissipation windows 512 are provided corresponding to the central heat concentration region 210 of the capacitor core 200, so that a heat transfer region with less obstruction is formed between the central heat concentration region 210 and the graphene thermal bridge 400.

[0057] The polarity connection side plate assembly 500 is disposed on opposite sides of the plurality of capacitor cores 200 and is used to form an electrical connection with the end electrode region 220. When the polarity connection side plate assembly 500 covers the side of the capacitor core 200, if the side plate structure continuously covers the central heat concentration region 210, the heat transfer from the central heat concentration region 210 to the graphene thermal bridge 400 will be blocked by the side plate structure. By providing heat dissipation windows 512 on the first polarity connection side plate 510 and / or the second polarity connection side plate 520, the shading area of ​​the polarity connection side plate assembly 500 on the central heat concentration region 210 can be reduced, making it easier for the heat generated in the middle of the capacitor core 200 to be transferred to the location of the graphene thermal bridge 400.

[0058] The heat dissipation window 512 is positioned corresponding to the central heat concentration area 210 and is not a typical weight-reduction hole. The heat dissipation window 512 is arranged around the main heat-generating area of ​​the capacitor core 200, allowing the polarity connection side plate assembly 500 to provide a heat transfer channel for the central part of the core while fulfilling its electrical connection function. Thus, the electrical connection path can still be formed through the end electrode area 220, the polarity connection side plate assembly 500, and the terminal assembly 300, while the heat conduction path can be formed through the central heat concentration area 210, the area near the heat dissipation window 512, the graphene thermal bridge 400, and the aluminum plate heat dissipation section 110.

[0059] In some embodiments, the heat dissipation window 512 can be an opening penetrating the first polarity connection side plate 510 or the second polarity connection side plate 520, or it can be a partial notch or a thinned area. As long as the heat dissipation window 512 can reduce the obstruction of the heat transfer path between the central heat concentration area 210 and the graphene thermal bridge 400 by the polarity connection side plate assembly 500, it can be used to implement the heat dissipation window 512 structure of the present invention.

[0060] like Figures 3 to 5 As shown, the graphene thermal bridge 400 can be arranged differently depending on the number and arrangement of the capacitor cores 200 and the position of the aluminum plate heat dissipation section 110. In some embodiments, the graphene thermal bridge 400 is located between two adjacent capacitor cores 200, allowing the heat in the middle of the two adjacent capacitor cores 200 to be transferred together to the graphene thermal bridge 400 located between them. This arrangement is suitable for structures in which multiple capacitor cores 200 are arranged side by side and there is an assembly gap between adjacent cores.

[0061] In other embodiments, the graphene thermal bridge 400 is located between the capacitor core 200 and the aluminum plate heat dissipation section 110, allowing the heat generated by the capacitor core 200 to be directly transferred to the aluminum plate heat dissipation section 110 via the graphene thermal bridge 400. This arrangement is suitable for structures where the capacitor core 200 is positioned close to the aluminum plate heat dissipation section 110, and where a directional heat conduction path needs to be established between the capacitor core 200 and the aluminum plate heat dissipation section 110.

[0062] In some embodiments, the graphene thermal bridge 400 is located both between two adjacent capacitor cores 200 and between a capacitor core 200 and the aluminum plate heat sink 110. The graphene thermal bridge 400 located between two adjacent capacitor cores 200 absorbs heat from the central region of the adjacent cores, while the graphene thermal bridge 400 located between the capacitor core 200 and the aluminum plate heat sink 110 further transfers heat to the aluminum plate heat sink 110. Through the above combined arrangement, the central heat of multiple capacitor cores 200 can be collected to the aluminum plate heat sink 110 via graphene thermal bridges 400 at different locations. The above different arrangements can be used individually or in combination.

[0063] like Figures 5 to 7 As shown, the graphene heat-conducting unit can adopt different structural forms depending on the heat dissipation path and assembly space. The graphene heat-conducting unit can be a single-piece heat-conducting sheet, with one side close to the central heat concentration area 210 of the capacitor core 200 and the other side close to the aluminum plate heat dissipation part 110. The graphene heat-conducting unit can also adopt a layered staggered structure, which includes a first graphene heat-conducting sheet 440, a second graphene heat-conducting sheet 450, and an insulating thermally conductive isolation layer 470 located between them. The graphene heat-conducting unit can also adopt a bent structure, which includes a heat-absorbing section 413, an output section 414, and a bent connecting section 415 connecting the heat-absorbing section 413 and the output section 414.

[0064] Layered staggered structures and bent structures can be used individually or in combination. For example, the heat absorption section 413 or output section 414 in the bent graphene thermal conductive unit can further adopt a layered staggered structure composed of a first graphene thermal conductive sheet 440 and a second graphene thermal conductive sheet 450; a silicone substrate 480 can also be set in the projected overlapping thermal coupling area in the layered staggered structure to maintain interlayer thermal conductive contact during thermal shock. Through the above structural changes, the graphene thermal conductive unit can adapt to different capacitor core 200 arrangements and internal space conditions of the housing.

[0065] like Figure 3 and Figure 5 As shown, the first gap 420 can be formed by the offset arrangement of the graphene heat-conducting unit relative to the capacitor core 200, or by restricting the position of the bent connecting section 415 by the groove 511. After the bent connecting section 415 is engaged in the groove 511, the insertion depth and offset direction of the heat-absorbing section 413 relative to the capacitor core 200 are restricted, and the position of the output section 414 relative to the aluminum plate heat dissipation part 110 is also restricted. In this way, the graphene heat-conducting unit is less likely to shift towards the end electrode region 220 during assembly or use, thereby helping to maintain the stability of the first gap 420.

[0066] In other embodiments, the first gap 420 can be formed by an insulating gasket, a limiting protrusion, a positioning groove on the inner wall of the housing, or a limiting edge on the side plate. The insulating gasket can be disposed between the graphene heat-conducting unit and the capacitor core 200, and the limiting protrusion or positioning groove can restrict the insertion position of the graphene heat-conducting unit. The above positioning methods can be used alone or in conjunction with the groove 511, as long as they can ensure that the graphene heat-conducting unit is close to the central heat concentration area 210 while maintaining a safe distance from the electrical connection area, they can all be used to form the first gap 420.

[0067] like Figure 6 and Figure 7As shown, the insulating and thermally conductive isolation layer 470 can be disposed alone within the projected overlapping thermal coupling region, or it can be disposed in combination with the silicone substrate 480. When the insulating and thermally conductive isolation layer 470 is disposed alone, it is located between the first graphene thermally conductive sheet 440 and the second graphene thermally conductive sheet 450, and is used to maintain electrical isolation between the two graphene thermally conductive sheets and to transfer heat through the projected overlapping thermal coupling region.

[0068] In some embodiments, a silicone substrate 480 is disposed between the insulating thermally conductive layer 470 and the first graphene thermally conductive sheet 440. The side of the silicone substrate 480 facing the first graphene thermally conductive sheet 440 forms a undulating peak section 481 and a recessed trough section 482. The undulating peak section 481 contacts the first graphene thermally conductive sheet 440, and the recessed trough section 482 forms a deformation release cavity 483 between itself and the first graphene thermally conductive sheet 440. This structure is suitable for scenarios where the first graphene thermally conductive sheet 440 is more susceptible to thermal expansion and contraction or more prone to minute displacement.

[0069] In some embodiments, a silicone substrate 480 is disposed between the insulating thermally conductive layer 470 and the second graphene thermally conductive sheet 450. In this case, the silicone substrate 480 can be used to compensate for assembly gaps and thermal deformation between the second graphene thermally conductive sheet 450 and the insulating thermally conductive layer 470. In still other embodiments, silicone substrates 480 can be disposed on both opposite sides of the insulating thermally conductive layer 470, so that both the first graphene thermally conductive sheet 440 and the second graphene thermally conductive sheet 450 form a buffered thermally conductive contact with the insulating thermally conductive layer 470 through the silicone substrate 480.

[0070] The undulating crest section 481 and the trough recessed section 482 can be disposed on only one side of the silicone substrate 480, or they can be disposed on opposite sides of the silicone substrate 480. When the undulating crest section 481 and the trough recessed section 482 are disposed on opposite sides of the silicone substrate 480, the silicone substrate 480 can compensate for the local displacement of the first graphene thermal conductive sheet 440 and the second graphene thermal conductive sheet 450, so that the projected overlapping thermal coupling area can still maintain a relatively stable interlayer thermal conductive contact under thermal shock and vibration conditions.

[0071] When the insulating and thermally conductive insulating layer 470 is combined with the silicone substrate 480, the insulating and thermally conductive insulating layer 470 mainly provides interlayer insulation and thermal conductivity channels, while the silicone substrate 480 mainly provides contact compensation and deformation release. When the two are combined, the projected overlapping thermal coupling region can maintain heat transfer between the first graphene thermal conductive sheet 440 and the second graphene thermal conductive sheet 450, and also reduce the possibility of increased contact thermal resistance at the interlayer contact interface due to thermal cycling, vibration, or assembly tolerances.

[0072] Through the above structure, the terminal assembly 300, upper busbar 320, lower busbar 330, and polarized connection side plate assembly 500 form an electrical connection path, while the graphene thermal bridge 400 and aluminum plate heat dissipation section 110 form a heat conduction path. The electrical connection path mainly corresponds to the end electrode region 220, and the heat conduction path mainly corresponds to the central heat concentration region 210, thus spatially separating the electrical connection function and the heat conduction function. The bias setting of the graphene heat conduction unit and the first gap 420 ensure that the graphene thermal bridge 400 is close to the central heat concentration region 210 while avoiding the end electrode region 220 and the high-potential connection structure. The layered staggered graphene thermal bridge 400 forms a stepped heat conduction path through the first graphene thermal conductive sheet 440, the second graphene thermal conductive sheet 450, and the insulating thermally conductive isolation layer 470. The silicone substrate 480, the undulating peak section 481, the trough recessed section 482, and the deformation relief cavity 483 together form a thermal shock compensation structure. Thus, the graphene thermal bridge heat dissipation capacitor can guide the heat from the center of multiple capacitor cores 200 to the aluminum plate heat dissipation section 110, and further dissipate it through an external water-cooling structure.

[0073] The above embodiments are merely explanations of the present invention and are not intended to limit the present invention. After reading this specification, those skilled in the art can make modifications to these embodiments without contributing any inventive step, but as long as they are within the scope of the claims of the present invention, they are protected by patent law.

Claims

1. A graphene thermal bridge heat dissipation capacitor, characterized in that, include: Capacitor casing (100); Multiple capacitor cores (200) are disposed within the capacitor housing (100). Each capacitor core (200) includes a central heat concentration region (210) and end electrode regions (220) located on both sides of the central heat concentration region (210). Terminal assembly (300) electrically connected to the end electrode region (220); An aluminum plate heat dissipation part (110) is disposed on one side of the capacitor housing (100); The graphene thermal bridge (400) includes at least one graphene thermal conductive unit. The graphene thermal bridge (400) is disposed in the capacitor housing (100) and located between two adjacent capacitor cores (200) and / or between the capacitor core (200) and the aluminum plate heat dissipation part (110). The graphene thermal bridge (400) is biased relative to the capacitor core (200) and forms a first gap (420) with the capacitor core (200). The graphene thermal conductive unit includes a core-side heat-absorbing end (411) facing the capacitor core (200) and an aluminum plate-side output end (412) facing the aluminum plate heat dissipation part (110). The projections of the core-side heat-absorbing end (411) and the aluminum plate-side output end (412) in the thickness direction of the capacitor core (200) are both located in the central heat concentration region (210).

2. The graphene thermal bridge heat dissipation capacitor according to claim 1, characterized in that: The graphene thermal bridge (400) includes a first graphene thermal conductive sheet (440) and a second graphene thermal conductive sheet (450) that are layered along the thickness direction of the capacitor housing (100). A second gap (421) is formed between adjacent first graphene thermal conductive sheet (440) and second graphene thermal conductive sheet (450). The first graphene thermal conductive sheet (440) and the second graphene thermal conductive sheet (450) are staggered and overlap along the thickness direction of the capacitor housing (100) to form a projection overlap thermal coupling area. An insulating and thermally conductive isolation layer (470) is provided in the projected overlapping thermal coupling area. The first graphene thermal conductive sheet (440), the second graphene thermal conductive sheet (450), and the insulating thermally conductive isolation layer (470) together form a stepped heat conduction path from the central heat concentration area (210) toward the aluminum plate heat dissipation part (110).

3. The graphene thermal bridge heat dissipation capacitor according to claim 2, characterized in that: The insulating and thermally conductive isolation layer (470) is at least one of the following: insulating and thermally conductive film, ceramic thermally conductive sheet, boron nitride thermally conductive sheet, alumina thermally conductive sheet or polyimide thermally conductive film.

4. The graphene thermal bridge heat dissipation capacitor according to claim 1, characterized in that: The width of the first gap (420) formed by the graphene thermal bridge (400) being offset relative to the capacitor core (200) is not less than 5 mm.

5. The graphene thermal bridge heat dissipation capacitor according to claim 1, characterized in that: The aluminum plate heat dissipation part (110) is provided with an aluminum plate side heat collection area on the side facing the capacitor core (200). There are multiple graphene heat conduction units, and the aluminum plate side output end (412) of the multiple graphene heat conduction units is arranged facing the aluminum plate side heat collection area.

6. The graphene thermal bridge heat dissipation capacitor according to claim 2, characterized in that: The outer peripheral edge of the insulating thermally conductive isolation layer (470) extends beyond the outer peripheral edge of the projected overlapping thermal coupling area to form an insulating outer edge (471) outside the projected overlapping boundary of the first graphene thermally conductive sheet (440) and the second graphene thermally conductive sheet (450).

7. The graphene thermal bridge heat dissipation capacitor according to claim 6, characterized in that: Within the projected overlapping thermal coupling region, a silicone substrate (480) is disposed between the first graphene thermal conductive sheet (440) and the insulating thermally conductive isolation layer (470). The silicone substrate (480) has continuously alternating peak undulations (481) and valley depressions (482) formed on the side surface facing the first graphene thermal conductive sheet (440). The top of the undulating crest section (481) abuts against the first graphene thermal conductive sheet (440), and the trough recess section (482) forms a deformation release cavity (483) between the first graphene thermal conductive sheet (440) so that the undulating crest section (481) remains in contact with the first graphene thermal conductive sheet (440) after thermal shock.

8. The graphene thermal bridge heat dissipation capacitor according to claim 1, characterized in that: The graphene thermal conductive unit includes a heat-absorbing section (413) near the central heat concentration area (210), an output section (414) near the aluminum plate heat dissipation section (110), and a bent connecting section (415) connecting the heat-absorbing section (413) and the output section (414). The core-side heat absorption end (411) is located on both sides of the heat absorption section (413) and the output section (414) is located on the side away from the aluminum plate heat dissipation part (110), while the aluminum plate-side output end (412) is located on the side facing the aluminum plate heat dissipation part (110).

9. The graphene thermal bridge heat dissipation capacitor according to claim 8, characterized in that: It also includes a polarity connection side plate assembly (500), which includes a first polarity connection side plate (510) and a second polarity connection side plate (520). The first polarity connection side plate (510) and the second polarity connection side plate (520) are respectively disposed on opposite sides of the plurality of capacitor cores (200) and are electrically connected to the end electrode regions (220) of different polarities respectively. The first polarity connection side plate (510) is located on one side of the aluminum plate heat dissipation part (110). A groove (511) is opened on the surface of the first polarity connection side plate (510). The bent connection section (415) is snapped into the groove (511). The heat absorption section (413) extends through the first polarity connection side plate (510) to one side of the capacitor core (200). The output section (414) is located on the side of the first polarity connection side plate (510) facing the aluminum plate heat dissipation part (110).

10. The graphene thermal bridge heat dissipation capacitor according to claim 9, characterized in that: A heat dissipation window (512) is provided on the first polarity connection side plate (510) and / or the second polarity connection side plate (520), and the heat dissipation window (512) is provided in the central heat concentration area (210) of the capacitor core (200).

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