Electronic component and board having the electronic component mounted thereon

Abstract

This disclosure provides an electronic component and a board on which the electronic component is mounted. The electronic component includes: a body including a dielectric layer and an inner electrode; an outer electrode disposed on the body and connected to the inner electrode; and a bonding portion including tin (Sn) and spherical particles containing copper (Cu). The spherical particles include a Cu-containing core, a Ni plating layer disposed on the core, and an alloy layer disposed on the Ni plating layer, wherein the alloy layer contains two or more of Sn, Ag, and Cu.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2025-0046872, filed on April 10, 2025, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to an electronic component and a board on which the electronic component is mounted. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs) are chip capacitors mounted on printed circuit boards in various types of electronic products, such as imaging devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones, mobile phones, and on-board chargers (OBCs) and DC-DC converters for electric vehicles, and can be used to charge or discharge them.

[0004] The dielectric layer included in an MLCC can have piezoelectric and electrostrictive properties. Therefore, when a DC or AC voltage is applied to an MLCC, a piezoelectric phenomenon can occur between the internal electrodes, thereby causing vibration.

[0005] Such vibrations can be transmitted through the external electrodes of the MLCC to the printed circuit board on which the MLCC is mounted, thereby generating vibrational sound. Vibrational sound can correspond to audible frequencies in the range of 20Hz to 20000Hz that cause discomfort to humans, and vibrational sound that causes discomfort can be defined as acoustic noise.

[0006] In sophisticated electronic devices such as smartphones, laptops, and automotive electronic components, this acoustic noise can not only negatively impact the user experience but also cause malfunctions in sensitive sensors or circuits. Therefore, developing technologies to reduce this noise has become an important consideration. Summary of the Invention

[0007] One aspect of this disclosure is to provide an electronic component having a structure capable of reducing acoustic noise that may be generated when the electronic component is mounted on a circuit board.

[0008] However, the various aspects of this disclosure are not limited to those set forth herein, and will be more readily understood in the process of describing specific exemplary embodiments of this disclosure.

[0009] According to one aspect of this disclosure, an electronic component is provided, the electronic component comprising: a body including a dielectric layer and an inner electrode; an outer electrode disposed on the body and connected to the inner electrode; and a bonding portion disposed on the outer electrode, the bonding portion comprising tin (Sn) and comprising spherical particles containing copper (Cu). The spherical particles may comprise a core containing Cu, a Ni plating layer disposed on the core, and an alloy layer disposed on the Ni plating layer, wherein the alloy layer may comprise two or more of Sn, Ag, and Cu.

[0010] According to an example embodiment of this disclosure, a junction comprising Sn and including spherical particles containing Cu can be disposed on the external electrode of an electronic component, and the spherical particles may include a core containing Cu, a Ni plating disposed on the core, and an alloy layer disposed on the Ni plating, wherein the alloy layer may include two or more of Sn, Ag, and Cu, thereby providing an electronic component with reduced acoustic noise.

[0011] According to another aspect of this disclosure, a board on which electronic components are mounted is provided, the board comprising: a substrate; electrode pads disposed on the substrate; and electronic components as described above disposed on the electrode pads.

[0012] However, the various advantages and effects of this disclosure are not limited to those set forth herein, and will be more readily understood in the process of describing specific exemplary embodiments of this disclosure. Attached Figure Description

[0013] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic perspective view of an electronic component according to an exemplary embodiment of the present disclosure; Figure 2 It is along Figure 1 A schematic cross-sectional view of line I-I'; Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line II-II'; Figure 4 This is a schematic enlarged plan view of the joint according to the example embodiment; Figure 5 yes Figure 2 A magnified view of region P; Figure 6 This is a schematic perspective view of an electronic component according to an example embodiment; Figure 7 It is along Figure 6 A schematic cross-sectional view taken from line III-III'; Figure 8 This is a schematic perspective view of an electronic component according to an example embodiment; Figure 9 It is along Figure 8 A schematic cross-sectional view of line IV-IV'; Figure 10 It is a schematic perspective view of a board with electronic components mounted thereon, according to an example embodiment; and Figure 11 It is along Figure 10 A schematic cross-sectional view of the line V-V'. Detailed Implementation

[0014] In the following description, exemplary embodiments of the present disclosure are illustrated with reference to the accompanying drawings. However, the present disclosure may be exemplified in many different forms and should not be construed as limited to the specific exemplary embodiments set forth herein. Additionally, exemplary embodiments of the present disclosure may be provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of description, the shape and size of elements in the drawings may be exaggerated, and elements denoted by the same reference numerals in the drawings may be the same elements.

[0015] For clarity of this disclosure, parts irrelevant to the description have been omitted, and dimensions (such as thickness) have been enlarged to clearly indicate layers and areas. Throughout the specification, similar parts having the same function within the same area are indicated by similar reference numerals. Throughout the specification, when an element is defined as "comprising" or "including" another element, unless otherwise expressly stated, this means that it may also include other elements, rather than excluding them.

[0016] In the accompanying drawings, the X direction can be the thickness direction (first direction), the Y direction can be the length direction (second direction), the Z direction can be the width direction (third direction), and the stacking direction of the inner electrode or dielectric layer can be either the thickness direction or the width direction.

[0017] Figure 1 This is a schematic perspective view of an electronic component according to an exemplary embodiment of the present disclosure.

[0018] Figure 2 It is along Figure 1 A schematic cross-sectional view taken from line I-I'.

[0019] Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line II-II'.

[0020] Figure 4 This is a schematic enlarged plan view of the joint according to an example embodiment.

[0021] Figure 5 yes Figure 2 A magnified view of region P.

[0022] In the following text, reference will be made to Figures 1 to 5 A detailed description of an electronic component 1000 according to an exemplary embodiment of the present disclosure is provided. The description of the electronic component 1000 according to the exemplary embodiment is equally applicable to the electronic components 1000' and 1000'' according to the exemplary embodiment described below, and to the board 1100 on which the electronic components are mounted.

[0023] An electronic component 1000 according to an exemplary embodiment of the present disclosure may include: a body 110 including a dielectric layer 111 and inner electrodes 121 and 122; outer electrodes 130 and 140 disposed on the body 110, the outer electrodes 130 and 140 being connected to the inner electrodes 121 and 122; and bonding portions 231 and 241, each of the bonding portions 231 and 241 including tin (Sn) 20 and including spherical particles 10 containing copper (Cu). The spherical particles 10 may include a core 11 containing Cu, a Ni plating layer 12 disposed on the core 11, and an alloy layer 13 disposed on the Ni plating layer 12. The alloy layer 13 may include two or more of Sn, Ag, and Cu.

[0024] The main body 110 may include a dielectric layer 111 and inner electrodes 121 and 122, and the dielectric layer 111 and inner electrodes 121 and 122 may be alternately disposed in a first direction. That is, in this disclosure, the first direction may refer to the stacking direction of the dielectric layer 111 and the inner electrodes 121 and 122.

[0025] The specific shape of the main body 110 is not limited. However, as Figure 1 As shown, the body 110 may have a hexahedral shape or a shape similar to a hexahedron. During the sintering process, the ceramic powder particles included in the body 110 may shrink, so that the body 110 may not have a hexahedral shape with perfectly straight lines, but may have a generally hexahedral shape.

[0026] The main body 110 may have: a first surface 1 and a second surface 2, which are opposite to each other in a first direction; a third surface 3 and a fourth surface 4, which are connected to the first surface 1 and the second surface 2, and are opposite to each other in a second direction perpendicular to the first direction; and a fifth surface 5 and a sixth surface 6, which are connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4, and are opposite to each other in a third direction perpendicular to the first direction and the second direction.

[0027] The dielectric layers 111 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other, such that the boundaries therebetween are not easily recognizable without using a scanning electron microscope (SEM). The number of stacked dielectric layers is not limited, and the number of stacked dielectric layers may be determined in consideration of the size of the electronic component. For example, the body may be formed by stacking 400 or more dielectric layers.

[0028] The dielectric layer 111 may be formed by the following steps: preparing a ceramic slurry including ceramic powder particles, an organic solvent and a binder, coating the slurry on a carrier film and drying the slurry to prepare a ceramic green sheet, and then sintering the ceramic green sheet. The ceramic powder particles are not limited as long as a sufficient capacitance can be obtained therewith, and may be, for example, barium titanate (BaTiO3)-based powder particles and CaZrO3-based paraelectric powder particles. As a more specific example, the barium titanate (BaTiO3)-based powder particles may be BaTiO3, (Ba 1-x Ca x )TiO3 (0<x<1), Ba(Ti 1-y Ca y )O3 (0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0<x<1, 0<y<1) and Ba(Ti 1-y Zr y )O3 (0<y<1), one or more of which may be used, and the CaZrO3-based paraelectric powder particles may be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0<x<1, 0<y<1).

[0029] The thickness td of the dielectric layer 111 is not limited.

[0030] For example, in order to more easily achieve high capacitance and miniaturization of the electronic component 1000, the average thickness td of the dielectric layer 111 may be 0.35 μm or less. In order to improve the reliability of the electronic component 1000 under high temperature and high voltage conditions, the average thickness td of the dielectric layer 111 may be 1 μm or more.

[0031] The average thickness td of the dielectric layers 111 may refer to an average thickness of one or more first dielectric layers among the plurality of first dielectric layers in the first direction.

[0032] The average thickness of the dielectric layer 111 in the first direction can be measured by scanning an image of the cross-section of the electronic component 1000 in the first and second directions using a SEM at a magnification of 10,000x. More specifically, the average thickness of a single dielectric layer 111 in the first direction can refer to the average thickness of a single dielectric layer 111 measured at four points spaced apart from each other in the second direction at equal intervals in the scanned image. The four points spaced apart from each other at equal intervals can be specified in the capacitor forming section Ac. Furthermore, when such an average measurement is performed on four dielectric layers 111, the average thickness of the dielectric layer 111 in the first direction can be more generalized.

[0033] The main body 110 may include: a capacitor forming portion Ac disposed in the main body 110, wherein the capacitor forming portion Ac forms a capacitor by including a first inner electrode 121 and a second inner electrode 122 alternately disposed with the dielectric layer 111; and covering portions 112 and 113 disposed on the upper and lower portions of the capacitor forming portion Ac in a first direction.

[0034] The capacitor forming portion Ac can be a part that contributes to the capacitance of the capacitor 100, and can be formed by repeatedly stacking a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 with a dielectric layer 111 between the first inner electrodes 121 and the second inner electrodes 122, and can refer to the region where the first inner electrodes 121 and the second inner electrodes 122 are stacked on each other in the first direction. In addition, the first inner electrode 121 can be disposed at the uppermost end of the capacitor forming portion Ac in the first direction, and the second inner electrode 122 can be disposed at the lowermost end of the capacitor forming portion Ac in the first direction.

[0035] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged opposite each other, and a dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be exposed on the third surface 3 and the fourth surface 4 of the body 110, respectively. That is, in the example embodiment, one end of the first inner electrode 121 in the second direction may contact the third surface 3, and one end of the second inner electrode 122 in the second direction may contact the fourth surface 4.

[0036] Reference Figure 2 The first inner electrode 121 can be connected to the first outer electrode 130, and the second inner electrode 122 can be connected to the second outer electrode 140.

[0037] The first inner electrode 121 is not connected to the second outer electrode 140, but is connected to the first outer electrode 130; the second inner electrode 122 is not connected to the first outer electrode 130, but is connected to the second outer electrode 140. That is, the first inner electrode 121 can be formed to be spaced apart from the fourth surface 4 by a predetermined distance, and the second inner electrode 122 can be formed to be spaced apart from the third surface 3 by a predetermined distance. Furthermore, the first inner electrode 121 and the second inner electrode 122 can be configured to be spaced apart from the fifth and sixth surfaces of the body 110.

[0038] The conductive metal included in the inner electrodes 121 and 122 may include one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti and alloys thereof, but this disclosure is not limited thereto.

[0039] The thickness te of each of the inner electrodes 121 and 122 is not limited.

[0040] To more easily achieve high capacitance and miniaturization of the electronic component 1000, the average thickness te of each of the inner electrodes 121 and 122 can be 0.35 μm or less. To improve the reliability of the electronic component 1000 under high temperature and high voltage conditions, the average thickness te of each of the inner electrodes 121 and 122 can be 1 μm or greater.

[0041] The average thickness te of each of the inner electrodes 121 and 122 may refer to the average thickness of one or more of the inner electrodes 121 and 122 in the first direction.

[0042] The average thickness of each of the inner electrodes 121 and 122 in the first direction can be measured by scanning an image of the cross-section of the electronic component 1000 in the first and second directions using a SEM at 10,000x magnification. More specifically, the average thickness of a single inner electrode in the first direction can refer to the average thickness of the single inner electrode measured at four points spaced apart from each other in the second direction at equal intervals in the scanned image. The four points spaced apart from each other at equal intervals can be specified in the capacitor forming section Ac. Furthermore, when such an average measurement is performed on the four inner electrodes 121 and 122, the average thickness of each of the inner electrodes 121 and 122 in the first direction can be more generalized.

[0043] Reference Figure 2 Cover portions 112 and 113 may be disposed on the upper and lower surfaces of the capacitor forming portion Ac in the first direction.

[0044] The covers 112 and 113 can be used to prevent damage to the internal electrodes due to physical and / or chemical stress.

[0045] Cover portions 112 and 113 may include the same material as the dielectric layer 111. That is, cover portions 112 and 113 may include ceramic materials, such as barium titanate (BaTiO3) based ceramic materials.

[0046] The thickness of each of the covering portions 112 and 113 is not limited. For example, the thickness of each of the covering portions 112 and 113 can be 20 μm or less.

[0047] The average thickness of each of the covers 112 and 113 may refer to the dimension in the first direction, and may be: the average dimension of each of the covers 112 and 113 in the first direction measured at five points spaced apart from each other at equal intervals on the upper or lower part of the capacitor forming part Ac.

[0048] Reference Figure 3 Edge portions 114 and 115 may be provided on the side surface of capacitor forming portion Ac.

[0049] Edge portions 114 and 115 may include a first edge portion 114 disposed on one side surface of the capacitor forming portion Ac (corresponding to the fifth surface 5 of the main body 110) and a second edge portion 115 disposed on the other side surface of the capacitor forming portion Ac (corresponding to the sixth surface 6 of the main body 110). That is, edge portions 114 and 115 may be disposed on the two side surfaces of the capacitor forming portion Ac in the width direction, respectively.

[0050] like Figure 3 As shown, the edges 114 and 115 may refer to the region between the two ends of each of the first inner electrode 121 and the second inner electrode 122 and the outer surface of the body 110 in a cross section cut along the width-thickness direction (WT) of the body 110.

[0051] Edges 114 and 115 can be used to prevent damage to the internal electrode due to physical and / or chemical stress.

[0052] Edges 114 and 115 can be formed by coating a conductive paste onto a ceramic green sheet (excluding the portion of the ceramic green sheet on which the edge will be formed) to form an internal electrode.

[0053] The width of each of the edge portions 114 and 115 is not limited. For example, the average width of each of the edge portions 114 and 115 can be 20 μm or less.

[0054] The average width of each of the edges 114 and 115 can refer to the average size of the region spaced between the inner electrode and the fifth surface in the third direction, and the average size of the region spaced between the inner electrode and the sixth surface in the third direction. The average width of each of the edges 114 and 115 can be the average size of the dimensions of each of the edges 114 and 115 in the third direction measured at five points spaced apart from each other at equal intervals on the side surface of the capacitor forming part Ac.

[0055] External electrodes 130 and 140 may be disposed on the main body 110, and specifically, may be disposed on the third surface 3 and the fourth surface 4 of the main body 110.

[0056] The external electrodes 130 and 140 may include a first external electrode 130 disposed on the third surface 3 of the body 110 and a second external electrode 140 disposed on the fourth surface 4 of the body 110.

[0057] The outer electrodes 130 and 140 may include electrode layers 131 and 141 disposed on the body 110, and the electrode layers 131 and 141 are respectively connected to the inner electrodes 121 and 122.

[0058] Specifically, the first external electrode 130 may include a first electrode layer 131 disposed on the main body 110, the first electrode layer 131 being connected to the first internal electrode 121, and the second external electrode 140 may include a second electrode layer 141 disposed on the main body 110, the second electrode layer 141 being connected to the second internal electrode 122.

[0059] The first electrode layer 131 and the second electrode layer 141 can be connected to the inner electrodes 121 and 122 respectively, and can be used to ensure the electrical connection between the outer electrodes 130 and 140 and the inner electrodes 121 and 122.

[0060] The first electrode layer 131 and the second electrode layer 141 may include a conductive metal. Materials with excellent conductivity can be used as the conductive metal, and the material is not limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof, and preferably, electrode layers 131 and 141 may include Cu to ensure conductivity and bonding strength by forming an alloy with the Ni inner electrode.

[0061] As a more specific example of the first electrode layer 131 and the second electrode layer 141, the electrode layer may be a sintered electrode comprising a conductive metal and glass, or a resin-based electrode comprising a conductive metal and resin.

[0062] The first electrode layer 131 and the second electrode layer 141 can be formed as a structure in which a sintered electrode and a resin-based electrode are sequentially formed on a body. Furthermore, the electrode layers can be formed by transferring a sheet including a conductive metal onto the body and / or by transferring a sheet including a conductive metal onto a sintered electrode.

[0063] Plating layers 132, 133, 142 and 143 may be disposed on electrode layers 131 and 141.

[0064] Platings 132, 133, 142, and 143 can be used to improve the sealing or mounting performance of electronic component 1000. The types of platings 132, 133, 142, and 143 are not limited, and the platings may include one or more of Ni, Sn, Pd, and alloys thereof, and may be formed in multiple layers.

[0065] As a more specific example of plating layers 132, 133, 142, and 143, plating layers 132, 133, 142, and 143 may be Ni plating layers including Ni or Sn plating layers including Sn. The plating layers may be formed in a structure where a Ni plating layer and a Sn plating layer are sequentially formed on electrode layers 131 and 141, or in a structure where a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed on electrode layers 131 and 141. Alternatively, the plating layers may also comprise multiple Ni plating layers and / or multiple Sn plating layers.

[0066] Reference Figure 1 and Figure 2 The joints 231 and 241 may be disposed on the external electrodes 130 and 140. The joints 231 and 241 may be disposed on the external electrodes 130 and 140 by solder (e.g., Figure 10 and Figure 11 Solder 191 and 192 in the above are bonded to the substrate described below (e.g., Figure 10 and Figure 11 The electrode pads of the substrate 180 are used to stably mount the capacitor 100 on the substrate 180.

[0067] The joints 231 and 241 may be provided on the external electrodes 130 and 140, and may be used to reduce or absorb vibrations transmitted from the capacitor 100 to the substrate 180.

[0068] The bonding portions 231 and 241 may include Sn20 to facilitate adhesion between the capacitor 100 and the substrate 180, and may include spherical particles 10 containing Cu to facilitate vibration absorption.

[0069] In the soldering process between capacitor 100 and substrate 180, the spreading area of ​​solder 191 or 192 can be reduced by including spherical particles 10 in the joints 231 and 241, thereby reducing the solder ramp height. Therefore, vibrations transmitted to the side surface of capacitor 100, where the displacement is most significant, can be suppressed, thereby reducing the acoustic noise of electronic component 1000.

[0070] Reference Figure 4 According to an example embodiment of the present disclosure, the spherical particle 10 may include a core 11 containing Cu, a Ni plating layer 12 disposed on the core 11, and an alloy layer 13 disposed on the Ni plating layer 12, wherein the alloy layer 13 contains two or more of Sn, Ag and Cu.

[0071] The core 11, which includes Cu, may include Cu, which has excellent thermal and electrical conductivity, and can therefore be used to improve the heat dissipation performance of electronic components.

[0072] Ni plating 12 can be disposed on core 11 and can be used to suppress the oxidation of Cu atoms contained in the core or to suppress the formation of excessive Cu-Sn intermetallic compounds (IMC) due to the bonding between Cu and Sn.

[0073] Alloy layer 13 may be disposed on Ni plating layer 12 and may include two or more of Sn, Ag, and Cu, thereby improving the wettability of joints 231 and 241. In this case, in the example embodiment, an alloy layer including two or more of Sn, Ag, and Cu may mean that the alloy layer includes an alloy of two or more of Sn, Ag, and Cu. The type of alloy including two or more of Sn, Ag, and Cu is not limited, and the alloy may be an alloy with one of Sn, Ag, and Cu as the main component.

[0074] Therefore, in the exemplary embodiments of this disclosure, the bonding portions 231 and 241 may include spherical particles 10, each spherical particle 10 including a core 11 containing Cu, a Ni plating layer 12 disposed on the core 11, and an alloy layer 13 disposed on the Ni plating layer 12, the alloy layer 13 including two or more of Sn, Ag and Cu, thereby reducing the acoustic noise of the electronic component 1000, while improving heat dissipation performance and enhancing the bonding strength between the electronic component 1000 and the substrate 180.

[0075] The method for analyzing the composition of each of the joints 231 and 241 is not limited. For example, the electronic component 1000 can be polished to a midpoint facing third-party direction, and compositional analysis can be performed using the energy-dispersive X-ray spectroscopy (EDS) mode of a scanning electron microscope (SEM), the EDS mode of a transmission electron microscope (TEM), or the EDS mode of a scanning transmission electron microscope (STEM). First, a thin section of the sample to be measured can be prepared from the region to be measured using a focused ion beam (FIB) device. Then, the damaged layer on the surface of the thin section sample can be removed using xenon (Xe) or argon (Ar) ions, and qualitative / quantitative analysis can be performed by area scanning analysis of each element to be measured from images obtained using a scanning electron microscope-energy-dispersive X-ray spectroscopy (SEM-EDS), a transmission electron microscope-energy-dispersive X-ray spectroscopy (TEM-EDS), or a scanning transmission electron microscope-energy-dispersive X-ray spectroscopy (STEM-EDS). In this case, the qualitative / quantitative analysis results of each element can be represented in a graph by converting the content of each element into, for example, weight percentage (wt%), atomic percentage (at%), or molar percentage (mol%), and can also be represented as the ratio of the content of one particular element to the content of another particular element.

[0076] The core 11 not only improves the conductivity and heat dissipation performance of the joints 231 and 241, but also reduces the transmission of vibrations. Specifically, in the example embodiments of this disclosure, since the core 11 includes Cu, the phenomenon of vibrations generated in the capacitor 100 being transmitted to the substrate 180 can be effectively reduced.

[0077] The content of Cu contained in core 11 is not limited. However, in order to maximize the effect of reducing acoustic noise according to this disclosure, the content of Cu in core 11 may be 90 at% or more relative to all elements contained in core 11 except oxygen.

[0078] The core 11 may have a spherical shape similar to that of the spherical particle 10, but it may not be a perfect sphere, and in the cross-section of the electronic component 1000 in the first and second directions, the core 11 may have a deformed circular or elliptical shape. That is, in the cross-section of the electronic component 1000 in the first and second directions, the core 11 may have a structure with a major axis b and a minor axis a.

[0079] The average diameter of nucleus 11 can be from 0.1 μm to 10 μm. In this case, the average diameter of nucleus 11 can be the average of the lengths of the major axis b and the minor axis a of nucleus 11.

[0080] In the example embodiment, the average thickness of the Ni coating 12 may be 30 μm or less. There is no lower limit to the average thickness of the Ni coating 12, for example, it may be 0.1 μm or more.

[0081] In the example embodiment, the average thickness of the alloy layer 13 may be 50 μm or less. There is no lower limit to the average thickness of the alloy layer 13; for example, it may be 0.1 μm or greater.

[0082] Each of the average diameter of the core 11, the average thickness of the Ni coating 12, and the average thickness of the alloy layer 13 can be the average of values ​​measured from multiple spherical particles 10 in two or more upper regions, two or more lower regions, two or more left regions, and two or more right regions at the center of the cross-section based on the joints 231 and 241 in the first and second directions, after clearly defining the boundaries between the various regions by performing the above compositional analysis. The average thickness of the Ni coating 12 and the alloy layer 13 can be the average of the thicknesses measured at four or more points spaced apart from each other at equal intervals along the contour line of the core.

[0083] The bonding portions 231 and 241 may be provided on the external electrodes 130 and 140, and a portion of the bonding portions 231 and 241 may be in direct contact with the external electrodes 130 and 140. Therefore, the adhesive strength between the bonding portions 231 and 241 and the external electrodes 130 and 140 can be improved.

[0084] Increasing the thickness of each of the joints 231 and 241 improves the acoustic noise reduction effect according to this disclosure. However, the thickness of each of the joints 231 and 241 can be appropriately adjusted taking into account the dimensions of the electronic assembly 1000. For example, the average thickness TS of the regions of the joints 231 and 241 that contact the external electrodes 130 and 140, respectively, in the first direction can be 10 μm or less.

[0085] The length of each of the joints 231 and 241 can be determined by taking into account the size of the electronic components to ensure the effect of reducing acoustic noise according to this disclosure. For example, refer to Figure 5 The ratio (LS / LE) of the average length LS of each of the joints 231 and 241 in the second direction to the length LE from the outer end surface of each of the outer electrodes 130 and 140 in the second direction to the inner end of each of the outer electrodes 130 and 140 in the second direction may be greater than or equal to 0.5 and less than or equal to 1.0.

[0086] In one example, the length of joint 231 or 241 may represent the dimension of joint 231 or 241 in a second direction, and the thickness of joint 231 or 241 may represent the dimension of joint 231 or 241 in a first direction. Unless contradicting another explicitly described definition, the length of an element described herein may be any one of an average length, a maximum length, a minimum length, or the length of the element measured in a predetermined region. In one example, the average length of an element in a certain direction may refer to the average of multiple length measurements of the element taken at multiple points spaced apart from each other at equal intervals (or alternatively, unequal intervals) on a surface of the element intersecting that direction. Optionally, the length may be the maximum or minimum length of the multiple measurements. In one example, an optical microscope or a scanning electron microscope (SEM) may be used for measurement, but this disclosure is not limited thereto. Other measurement methods and / or tools understood by those skilled in the art may be used, even if not described herein.

[0087] Each of the external electrodes 130 and 140 may include: a connecting portion disposed on a third surface 3 or a fourth surface 4 of the body 110; a lower strip extending from the connecting portion to a first surface 1; and an upper strip extending from the connecting portion to a second surface 2. Each of the external electrodes 130 and 140 may include a side strip extending from the connecting portion to a fifth surface 5 and a sixth surface 6.

[0088] Figure 6 This is a schematic perspective view of an electronic component according to an example embodiment. Figure 7 It is along Figure 6 A schematic cross-sectional view taken from line III-III'.

[0089] Reference Figure 6 and Figure 7 According to the example embodiment, the electronic component 1000' may include coupling portions 231, 232, 241, and 242 disposed on the upper and lower strip portions of the external electrodes 130 and 140. Therefore, the installation freedom of the electronic component 1000' can be improved.

[0090] Reference Figure 6 and Figure 7 According to the example embodiment, the joints 231, 232, 241, and 242 of the electronic component 1000' are disposed inward in a first direction relative to the outer surfaces of the outer electrodes 130 and 140. Therefore, throughout the electronic component 1000', the proportion of the increase in the dimension in the first direction due to the provision of the joints 231, 232, 241, and 242 can be reduced.

[0091] Figure 8 This is a schematic perspective view of an electronic component according to an example embodiment. Figure 9 It is along Figure 8A schematic cross-sectional view taken from line IV-IV'.

[0092] Reference Figure 8 and Figure 9 According to the example embodiment, the electronic component 1000'' may include joints 231, 232, 233, 241, 242, and 243 disposed on the connection portion, upper strip portion, and lower strip portion of the external electrodes 130 and 140. Therefore, the phenomenon of solder climbing along the side surfaces of the external electrodes 130 and 140 in the second direction can be suppressed.

[0093] In the example embodiment, when the joints provided on the upper and lower bands are defined as first joints 231, 232, 241, and 242, and the joints provided on the connecting portion are defined as second joints 233 and 243, and the ratio of the area of ​​the core 11 provided in the first joints 231, 232, 241, and 242 to the total area of ​​the first joints 231, 232, 241, and 242 is defined as R1, and the ratio of the area of ​​the core 11 provided in the second joints 233 and 243 to the total area of ​​the second joints 233 and 243 is defined as R2, then R1 > R2 can be satisfied. As an example, the ratio R1 of the area of ​​the core to the total area of ​​the joints can be greater than or equal to 0.15 and less than or equal to 0.45.

[0094] Figure 10 This is a schematic perspective view of a board on which electronic components are mounted, according to an example embodiment. Figure 11 It is along Figure 10 A schematic cross-sectional view of the line V-V'.

[0095] Reference Figure 10 and Figure 11 According to an example embodiment, a board 1100 on which electronic components are mounted may include a substrate 180, electrode pads 181 and 182 disposed on the substrate 180, and electronic components 1000 disposed on the electrode pads 181 and 182. Figure 10 and Figure 11 In the example embodiment of this disclosure, electronic component 1000 is shown disposed on electrode pads 181 and 182. However, electronic components 1000' and 1000'' according to the above example embodiment may also be disposed on electrode pads 181 and 182.

[0096] In an exemplary embodiment, electronic component 1000 can be bonded to electrode pads 181 and 182 via solder 191 and 192, and the solder 191 and 192 can climb a specific height HS along the outer surfaces of external electrodes 130 and 140 in a second direction via a reflow soldering process. As the height HS of the solder 191 and 192 climbing along the outer surfaces of external electrodes 130 and 140 in the second direction increases, the acoustic noise level of electronic component 1000 and the board 1100 on which the electronic component is mounted may increase. However, in an exemplary embodiment of this disclosure, bonding portions 231 and 241 include Sn and a Cu-containing core, and these bonding portions 231 and 241 can be disposed on the external electrodes such that the phenomenon of solder 191 and 192 climbing along the outer surfaces of external electrodes 130 and 140 in the second direction can be suppressed. Therefore, the height HS of the solder 191 and 192 climbing along the outer surfaces of the outer electrodes 130 and 140 in the second direction can be adjusted to 60 μm or less, thereby effectively reducing the acoustic noise of the electronic component 1000 and the board 1100 on which the electronic component is mounted.

[0097] In the example embodiment, the height HS of the solders 191 and 192 climbing along the outer surfaces of the outer electrodes 130 and 140 in the second direction can refer to the height from the end of each of the solders 191 and 192 toward the electrode pads 181 and 182 to the end of each of the solders 191 and 192 toward the outer electrodes 130 and 140.

[0098] Furthermore, in the electronic component 1000 according to the exemplary embodiments of the present disclosure, the electronic components 1000′ and 1000'' according to the exemplary embodiments, and various other exemplary embodiments thereof, the methods for adjusting the formation position, length, and thickness of the joints 231, 232, 233, 241, 242, and 243 are not limited. For example, the joints 231, 232, 233, 241, 242, and 243 can be formed by placing a mixture including spherical particles 10 and Sn2O according to the present disclosure on one or more of the connection and strip portions of each of the external electrodes 130 and 140 of the capacitor 100, followed by baking and curing. Afterwards, fine polishing, such as grinding, can be performed as needed to form the desired shape.

[0099] In an exemplary embodiment of this disclosure, spherical particles 10 can be formed by sequentially depositing Ni and Sn-Ag-Cu on the surface of spherical Cu particles. In this case, the depositing method used is not limited.

[0100] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

[0101] Furthermore, the term "example embodiment" as used herein does not refer to the same example embodiment, but is provided to emphasize a particular feature or characteristic that differs from a particular feature or characteristic of another example embodiment. However, the example embodiments provided herein are considered to be implementable by combining them entirely or partially with each other. For example, unless a contrary or contradictory description is provided herein, an element described in a particular example embodiment may be understood as a description relating to another example embodiment, even if it is not described in another example embodiment.

[0102] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the exemplary embodiments. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well.

Claims

1. An electronic component, comprising: The main body includes a dielectric layer and an internal electrode; An external electrode is disposed on the main body and connected to the internal electrode; and A bonding portion is disposed on the external electrode, the bonding portion comprising Sn and including spherical particles containing copper Cu. The spherical particle comprises a Cu core, a Ni plating layer disposed on the core, and an alloy layer disposed on the Ni plating layer, wherein the alloy layer comprises two or more of Sn, Ag, and Cu.

2. The electronic component according to claim 1, wherein, The main body includes: a first surface and a second surface, facing each other in a first direction where the dielectric layer and the inner electrode are alternately disposed; a third surface and a fourth surface, connected to the first surface and the second surface, facing each other in a second direction; and a fifth surface and a sixth surface, connected to the first surface to the fourth surface, facing each other in a third direction. Each of the external electrodes includes: a connecting portion disposed on the third surface or the fourth surface; an upper stripe extending from the connecting portion to the first surface; and a lower stripe extending from the connecting portion to the second surface. The connecting part is located on one of the upper and lower belt parts.

3. The electronic component according to claim 1, wherein, The main body includes: a first surface and a second surface, facing each other in a first direction where the dielectric layer and the inner electrode are alternately disposed; a third surface and a fourth surface, connected to the first surface and the second surface, facing each other in a second direction; and a fifth surface and a sixth surface, connected to the first surface to the fourth surface, facing each other in a third direction. Each of the external electrodes includes: a connecting portion disposed on the third surface or the fourth surface; an upper stripe extending from the connecting portion to the first surface; and a lower stripe extending from the connecting portion to the second surface. The connecting portion is provided on the upper belt portion and the lower belt portion.

4. The electronic component according to claim 1, wherein, The main body includes: a first surface and a second surface, facing each other in a first direction where the dielectric layer and the inner electrode are alternately disposed; a third surface and a fourth surface, connected to the first surface and the second surface, facing each other in a second direction; and a fifth surface and a sixth surface, connected to the first surface to the fourth surface, facing each other in a third direction. Each of the external electrodes includes: a connecting portion disposed on the third surface or the fourth surface; an upper stripe extending from the connecting portion to the first surface; and a lower stripe extending from the connecting portion to the second surface. The connecting portion is disposed on the connecting portion, the upper belt portion, and the lower belt portion.

5. The electronic component according to claim 4, wherein, When the joint includes a first joint provided on the upper band and the lower band and a second joint provided on the connecting part, the ratio of the area of ​​the core provided in the first joint to the total area of ​​the first joint is called R1, and the ratio of the area of ​​the core provided in the second joint to the total area of ​​the second joint is called R2, satisfying R1>R2.

6. The electronic component according to claim 1, wherein, The ratio of the area of ​​the core to the total area of ​​the junction is greater than or equal to 0.15 and less than or equal to 0.

45.

7. The electronic component according to claim 1, wherein, The main body includes: a first surface and a second surface, facing each other in a first direction where the dielectric layer and the inner electrode are alternately disposed; a third surface and a fourth surface, connected to the first surface and the second surface, facing each other in a second direction; and a fifth surface and a sixth surface, connected to the first surface to the fourth surface, facing each other in a third direction. The ratio of the average length of the joint in the second direction to the length from the outer end surface of the outer electrode in the second direction to the inner end of the outer electrode in the second direction is greater than or equal to 0.5 and less than or equal to 1.

0.

8. The electronic component according to claim 1, wherein, The main body includes: a first surface and a second surface, facing each other in a first direction where the dielectric layer and the inner electrode are alternately disposed; a third surface and a fourth surface, connected to the first surface and the second surface, facing each other in a second direction; and a fifth surface and a sixth surface, connected to the first surface to the fourth surface, facing each other in a third direction. The area of ​​the joint that contacts the external electrode has an average thickness of 10 μm or less in the first direction.

9. The electronic component according to claim 1, wherein, The average thickness of the Ni coating is 30 μm or less.

10. The electronic component according to claim 1, wherein, The average thickness of the alloy layer is 50 μm or less.

11. The electronic component according to claim 1, wherein, The content of Cu in the core is 90 at% or greater, relative to all elements except oxygen included in the core.

12. A board on which electronic components are mounted, the board comprising: substrate; Electrode pads are disposed on the substrate; as well as The electronic component according to any one of claims 1-11 is disposed on the electrode pad.

13. The plate according to claim 12, wherein, The board also includes solder, which contacts the electrode pads, the external electrode, and the bonding portion. The height from the end of the solder facing the electrode pad to the end of the solder facing the side surface of the outer electrode is 60 μm or less.

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