Thin film capacitor and method of manufacturing the same, metalized thin film web roll and method of manufacturing the same, and containerized metalized thin film web roll and method of manufacturing the same

Abstract

This disclosure relates to a thin-film capacitor and a method for manufacturing the same, a metallized thin-film roll and a method for manufacturing the same, and a container-mounted metallized thin-film roll and a method for manufacturing the same. The thin-film capacitor includes a first metallized film and a second metallized film. The first metallized film comprises: a first dielectric film; a first metal film disposed on the first dielectric film; and a first natural oxide film formed on the first metal film. The second metallized film comprises: a second dielectric film; a second metal film disposed on the second dielectric film; and a second natural oxide film formed on the second metal film. The thickness of the first natural oxide film and the thickness of the second natural oxide film are the same.

Description

Technical Field

[0001] This disclosure generally relates to film capacitors and methods for manufacturing the same, metallized film rolls and methods for manufacturing the same, and container-packaged metallized film rolls and methods for manufacturing the same. More specifically, this disclosure relates to film capacitors having metallized films and methods for manufacturing the same, metallized film rolls and methods for manufacturing the same, and container-packaged metallized film rolls and methods for manufacturing the same. Background Technology

[0002] Patent Document 1 discloses a metallized film capacitor. In this metallized film capacitor, a metallized film is used, which has a vapor-deposited metal film on one side of a dielectric film, and then has an oil coating on the vapor-deposited metal film.

[0003] Prior art literature

[0004] Patent documents

[0005] Patent Document 1: JP Japanese Patent Application Publication No. 2007-080907

[0006] However, in the metallized thin-film capacitor of Patent Document 1, the thickness of the oil coating may deviate when forming the oil coating on the vapor-deposited metal film. If the thickness of the oil coating deviates, the degree of natural oxidation of the vapor-deposited metal film will also deviate. This will result in localized electric field concentration. Therefore, the metallized thin-film capacitor of Patent Document 1 may suffer from reduced reliability. Summary of the Invention

[0007] The purpose of this disclosure is to provide a thin-film capacitor and a method for manufacturing the same, which can suppress local electric field concentration and improve reliability; a metallized thin-film roll and a method for manufacturing the same; and a container-mounted metallized thin-film roll and a method for manufacturing the same.

[0008] The thin-film capacitor disclosed herein includes a first metallized film and a second metallized film. The first metallized film comprises: a first dielectric film; a first metal film disposed on the first dielectric film; and a first natural oxide film formed on the first metal film. The second metallized film comprises: a second dielectric film; a second metal film disposed on the second dielectric film; and a second natural oxide film formed on the second metal film. The thickness of the first natural oxide film and the thickness of the second natural oxide film are the same.

[0009] The metallized film roll body disclosed herein is a metallized film roll body formed by winding a strip-shaped metallized film roll, the metallized film roll comprising: a strip-shaped dielectric film roll; and a plurality of metal films with given patterns arranged side by side in the width direction of the dielectric film roll. A protective agent is applied to one or both sides of the plurality of metal films with given patterns in the width direction of the metallized film roll.

[0010] The metallized film roll winding according to one aspect of this disclosure is a metallized film roll winding formed by winding a strip-shaped metallized film roll, the metallized film roll comprising: a strip-shaped dielectric film roll; and a plurality of metal films of a given pattern arranged side by side in the width direction of the dielectric film roll. A protective agent is applied to both end faces or one end face of the metallized film roll winding.

[0011] One aspect of this disclosure relates to a container for a metallized film roll, comprising: a metallized film roll formed by winding a strip of metallized film; and a container for receiving the metallized film roll. The metallized film roll comprises: a strip of dielectric film; and a plurality of metal films of a given pattern arranged side-by-side in the width direction of the dielectric film roll.

[0012] The method for manufacturing a metallized thin film roll according to one aspect of this disclosure includes the following steps: preparing a strip-shaped dielectric thin film roll; forming a metallized thin film roll by disposing of a plurality of metal films with given patterns arranged side by side in the width direction of the dielectric thin film roll on one or both sides of the dielectric thin film roll; applying a protective agent to both sides or one side of the plurality of metal films with given patterns in the width direction of the metallized thin film roll; and winding the metallized thin film roll.

[0013] The method for manufacturing a metallized thin film roll body according to one aspect of this disclosure includes the following steps: preparing a strip-shaped dielectric thin film roll; forming a metallized thin film roll by disposing of a plurality of metal films of a given pattern arranged side by side in the width direction of the dielectric thin film roll on one or both sides of the dielectric thin film roll; winding the metallized thin film roll to obtain a metallized thin film roll body; and applying a protective agent to both end faces or one end face of the metallized thin film roll body.

[0014] The method for manufacturing a container-mounted metallized film roll body according to one aspect of this disclosure includes the following steps: preparing a strip-shaped dielectric film roll; forming a metallized film roll by disposing of a plurality of metal films of a given pattern arranged side by side in the width direction of the dielectric film roll on one or both sides of the dielectric film roll; winding the metallized film roll to obtain a metallized film roll body; and housing the metallized film roll body in a container.

[0015] The method for manufacturing a thin-film capacitor according to one aspect of this disclosure includes the following steps: dividing the metallized thin-film roll or the container-containing metallized thin-film roll into a plurality of metal films of a given pattern to obtain a plurality of metallized films; and overlapping and winding a pair of metallized films among the plurality of metallized films.

[0016] The effects of the invention

[0017] According to this disclosure, local electric field concentration can be suppressed, thereby improving reliability. Attached Figure Description

[0018] Figure 1 This is a schematic cross-sectional view showing the film capacitors according to embodiments 1 to 3.

[0019] Figure 2 This is a schematic perspective view showing the manufacturing process of the winding body used in the thin-film capacitor according to embodiments 1 to 3.

[0020] Figure 3 This is a schematic perspective view showing the film capacitors according to embodiments 1 to 3.

[0021] Figure 4 This is a schematic top view showing the metallized film roll used in the manufacture of the film capacitors according to embodiments 1 to 3.

[0022] Figure 5 This is a schematic perspective view showing the metallized thin film roll according to the first embodiment.

[0023] Figure 6 This is a flowchart illustrating a method for manufacturing a metallized thin film roll according to the first embodiment.

[0024] Figure 7 This is a schematic perspective view showing the metallized thin film roll according to the second embodiment.

[0025] Figure 8 This is a flowchart illustrating a method for manufacturing a metallized thin film roll according to the second embodiment.

[0026] Figure 9 This is a schematic perspective view showing the container-containing metallized film roll winding according to the third embodiment.

[0027] Figure 10 This is a flowchart illustrating the manufacturing method of the container-mounted metallized film roll according to the third embodiment.

[0028] Explanation of reference numerals in the attached figures

[0029] 1. Film capacitor

[0030] 2 Metalized film

[0031] 20 Metallized film rolls

[0032] 20A Metallized Film Roll Wrapper

[0033] 20B Container-Contained Metallized Film Rolls

[0034] 21 No. 1 Metalized Film

[0035] 22 2nd metallized film

[0036] 30 Dielectric Thin Film Rolls

[0037] 31 First dielectric thin film

[0038] 32 Second dielectric thin film

[0039] 40 Metallic films with given patterns

[0040] 41 First metal film

[0041] 42 Second metal film

[0042] 51 First natural oxide film

[0043] 52 Second natural oxide film

[0044] 8 Protective agents

[0045] 9. Containers. Detailed Implementation

[0046] 1. Summary

[0047] The following is for reference. Figures 1-3 The following describes the thin-film capacitor 1 according to this embodiment. The figures are schematic, and the ratios of the size and thickness of each component in each figure are not necessarily limited to reflecting the actual size ratios.

[0048] The arrows in each figure indicating directions are not intended to specify the direction of use of the film capacitor 1, but are merely annotations for ease of understanding and do not accompany the actual product.

[0049] exist Figure 1 In this context, we define the up-down, left-right, and front-back directions.

[0050] The vertical direction is the thickness direction of the metallization film 2 (the first metallization film 21 and the second metallization film 22). If the film capacitor 1 is a so-called wound type, then Figure 1 The up and down directions are equivalent to... Figure 2 The radial direction of an imaginary circle centered on axis J1. Alternatively, the film capacitor 1 can also be a so-called stacked type.

[0051] The left and right directions are the width directions of the metallized thin film 2. Figure 1 The left and right directions are equivalent to Figure 2 The direction parallel to axis J1.

[0052] The front-back direction is the direction orthogonal to the up-down and left-right directions. That is, the front-back direction is perpendicular to... Figure 1 The direction is orthogonal to the paper. If the film capacitor 1 is a so-called wound type, then Figure 1 The front and back directions are equivalent to Figure 2 The circumferential direction θ1 or its tangential direction.

[0053] like Figure 1 As shown, the thin-film capacitor 1 according to this embodiment includes: a metallized thin film 2; and end-face electrodes 400 (a first end-face electrode 401 and a second end-face electrode 402). Multiple combinations 200 formed by the first metallized thin film 21 and the second metallized thin film 22 are stacked vertically.

[0054] exist Figure 1 In the illustration, for ease of understanding, the first metallization film 21 and the second metallization film 22 are shown as separate vertically, but in reality, the first metallization film 21 and the second metallization film 22 are in contact vertically. Specifically, the first dielectric film 31 of the first metallization film 21 and the second natural oxide film 52 of the second metallization film 22 are in contact vertically. Figure 1 Although not shown in the figure, the first natural oxide film 51 of the first metallization film 21 and the second dielectric film 32 of the second metallization film 22 are in contact vertically.

[0055] Thus, the thin-film capacitor 1 according to this embodiment includes a first metallization film 21 and a second metallization film 22.

[0056] The first metallized thin film 21 has: a first dielectric thin film 31; a first metal film 41 disposed on the first dielectric thin film 31; and a first natural oxide film 51 formed on the first metal film 41.

[0057] On the other hand, the second metallization film 22 has: a second dielectric film 32; a second metal film 42 disposed on the second dielectric film 32; and a second natural oxide film 52 formed on the second metal film 42.

[0058] Here, the natural oxide film 5 (the first natural oxide film 51 and the second natural oxide film 52) is a thin film of oxides that is naturally formed by exposing the surface of the metal film 4 (the first metal film 41 and the second metal film 42) to the atmosphere.

[0059] Thus, the natural oxide film 5 forms spontaneously without any special treatment, and therefore, the thickness of the first natural oxide film 51 and the second natural oxide film 52 are the same. This reduces the thickness deviation between the dielectric film 3 sandwiched between the first metal film 41 and the second metal film 42 and the natural oxide film 5. Furthermore, in this specification, the phrase "the thickness of the first natural oxide film 51 and the second natural oxide film 52 are the same" means that the difference between the thickness of the first natural oxide film 51 and the second natural oxide film 52 is within 10% of the thickness of the first natural oxide film 51.

[0060] Therefore, the thin-film capacitor 1 according to this embodiment can suppress local electric field concentration and improve reliability.

[0061] 2. Details

[0062] (1) First implementation method

[0063] (1.1) Metallized film roll winding

[0064] First, refer to Figure 4 as well as Figure 5 The metallized film roll winding 20A according to the first embodiment will be described below. The figures are schematic, and the size and thickness ratios of the constituent elements in each figure are not necessarily limited to reflecting actual dimensional ratios. The arrows indicating directions in the figures are merely annotations for ease of understanding and do not represent actual objects.

[0065] Figure 5 The metallized thin film roll 20A shown is used in the manufacture of the thin film capacitor 1. The metallized thin film roll 20A is obtained by winding the metallized thin film roll 20.

[0066] exist Figure 4 Metallized film roll 20 is shown. In Figure 4In this context, we define the forward / backward, left / right, and up / down directions.

[0067] The front-to-back direction is the long side direction of the metallized film roll 20. Figure 4 The front and back directions are Figure 5 The metallized thin film roll 20A shown corresponds to the circumferential direction θ2 or its tangential direction.

[0068] The left and right directions are the width directions of the metallized film roll 20. Figure 4 The left and right directions are Figure 5 The direction corresponding to the axis J2 in the metallized thin film roll 20A shown is shown.

[0069] The vertical direction is the thickness direction of the metallized thin film roll 20. Figure 4 The up-down direction is orthogonal to the front-back and left-right directions. That is, the up-down direction is... Figure 4 The direction perpendicular to the paper. Figure 4 The up and down directions are Figure 5 The radial direction of the metallized thin film roll 20A shown corresponds to the imaginary circle centered on axis J2.

[0070] Metallized film rolls

[0071] The metallized thin film roll 20 is formed into a strip. For example... Figure 4 As shown, the metallized thin film roll 20 includes a dielectric thin film roll 30, a plurality of metal films with given patterns 40, and a protective agent 8. Additionally, Figure 5 The metallized film roll 20 is shown in a simplified illustration.

[0072] Dielectric Thin Film Rolls

[0073] The dielectric film roll 30 is formed into a strip. The long side direction of the dielectric film roll 30 is consistent with the long side direction of the metallized film roll 20.

[0074] The material of the dielectric film roll 30 is not particularly limited, and examples include polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polycarbonate (PC), polystyrene (PS), etc.

[0075] The thickness of the dielectric film roll 30 is not particularly limited, for example, it can be more than 1 μm and less than 10 μm.

[0076] like Figure 4As shown, the dielectric film roll 30 has at least one patterned region F and at least one end region 6. In the first embodiment, the number of patterned regions F is set to n (n is an integer of 2 or more), and the number of end regions 6 is set to 2 for explanation.

[0077] [Pattern Area]

[0078] The patterned region F is the region of the metal film 40 that forms the given pattern described later. That is, the patterned region F corresponds one-to-one with the metal film 40 of the given pattern.

[0079] n patterned regions F are arranged side-by-side along the width (left-right direction) of the dielectric film roll 30. Here, the n patterned regions F are designated from left to right as patterned region F1, patterned region F2, ..., patterned region F(n-1)... n-1 The nth pattern region F n That is, among the n pattern regions F, the leftmost pattern region F is the first pattern region F1, and the rightmost pattern region F is the nth pattern region F2. n There are n pattern regions F extending along the long side (front-back direction).

[0080] exist Figure 4 In the diagram, a dashed line is used to represent the boundary line of two adjacent pattern regions F in the width direction. As will be explained again in the section "(1.4) Manufacturing Method of Film Capacitor" later, if the metallized film roll 20 is cut along the aforementioned boundary line, multiple (n) metallized films 2 are obtained. Thus, the pattern region F corresponds one-to-one with the metallized film 2.

[0081] [End region]

[0082] End regions 6 are the areas where the protective agent 8 is applied, as described later. End regions 6 are located on either side or one side (here, both sides) of the entire n patterned regions F. In the first embodiment, the two end regions 6 are the left end region 6a and the right end region 6b. Furthermore, the metal film 40 of the given pattern described later may not be formed in the end regions 6, but other metal films (hereinafter also referred to as "residual metal films") may also be formed.

[0083] The left end region 6a is located to the left of the first pattern region F1 and extends in the front-back direction. Figure 4 In the middle, the boundary lines of the adjacent left end region 6a and the first pattern region F1 in the width direction are shown by two dashed lines.

[0084] On the other hand, the right end region 6b is located in the nth pattern region F n It extends to the right side, in the front-back direction. Figure 4In the diagram, the nth adjacent pattern region F in the width direction is indicated by a two-dotted line. n And the boundary line of the right end region 6b.

[0085] As will be explained again in the section “(1.4) Method for manufacturing film capacitor”, if the metallized film roll 20 is cut at the boundary line mentioned above, the unwanted end region 6 can be removed in the manufacturing of the film capacitor 1.

[0086] ≪Metallic film with a given pattern≫

[0087] A metal film 40 with a given pattern is formed for each pattern region F. That is, a metal film 40 with a given pattern corresponds one-to-one with a pattern region F. In this way, multiple (n) metal films 40 with given patterns are arranged side by side in the width direction of the dielectric film roll 30.

[0088] In the first embodiment, the metal film 40 with a given pattern extends continuously in the front-back direction. An excess portion 300 exists on the left or right side of the metal film 40 with the given pattern. In other words, the excess portion 300 exists at one end (left or right) in the width direction for each pattern region F. The excess portion 300 is the portion where the metal film 40 is not formed, which is the exposed portion of the dielectric film roll 30. The excess portion 300 extends in the front-back direction.

[0089] Here, the metal film 40 with the given pattern is not limited to extending continuously in the front-back direction. Other patterns of the metal film 40 include those described in Japanese Patent Application Publication No. 2004-134561, Japanese Patent Application Publication No. 2-033910, and Japanese Utility Model Publication No. 3-101508.

[0090] The metal film 40 is formed, for example, by vapor deposition such as vacuum evaporation. The material of the metal film 40 is not particularly limited; examples include aluminum (Al), gold (Au), magnesium (Mg), zinc (Zn), tin (Sn), nickel (Ni), chromium (Cr), iron (Fe), copper (Cu), titanium (Ti), and their alloys.

[0091] The thickness of the metal film 40 is not particularly limited; for example, it can be between 5 nm and 30 nm.

[0092] Protective Agent

[0093] Protective agent 8 is used to inhibit the intrusion of atmospheric and moisture into the interior of the metallized film roll 20A, and to protect the metal film 40 inside the metallized film roll 20A from the influence of atmospheric and moisture.

[0094] There are no particular limitations on the protective agent 8; for example, silicone oils and fluorinated oils are examples. The protective agent 8 can be any other than an oil, as long as it makes it difficult for atmosphere and moisture to pass through.

[0095] The protective agent 8 is applied in the width direction of the metallized film roll 20 to both sides or one side (here, both sides) of a plurality of (n) given patterned metal films 40. Specifically, in the first embodiment, the protective agent 8 is applied to the end regions 6. If no remaining metal film is formed in the end regions 6, the protective agent 8 is applied directly to the dielectric film roll 30. On the other hand, if a remaining metal film is formed in the end regions 6, the protective agent 8 is applied indirectly to the dielectric film roll 30 through the remaining metal film.

[0096] The protective agent 8 extends in the front-to-back direction in the end region 6. Therefore, the protective agent 8... Figure 5 The metallized thin film roll 20A shown is arranged in a circumferential θ2 spiral pattern near its end faces 7 (left end face 7a and right end face 7b). Additionally, in Figure 5 For ease of explanation, a portion of the metallized film roll 20 is extracted from the metallized film roll 20A.

[0097] <Effects>

[0098] According to the metallized film roll 20A of the first embodiment, the protective agent 8 can be said to function as a breakwater, so that the atmosphere and moisture are difficult to penetrate into the interior of the metallized film roll 20A.

[0099] Here, in the metallized film roll 20A, the end face 7 can be cited as a path for the intrusion of air and moisture. In the first embodiment, the protective agent 8 is arranged in a circumferential θ2 vortex shape near the end face 7 (left end face 7a and right end face 7b) of the metallized film roll 20A. As a result, the intrusion of air and moisture into the interior of the metallized film roll 20A can be suppressed.

[0100] Without the protective agent 8, oxidation at the ends progresses more readily compared to the interior of the metallized film roll 20A. This thus promotes uneven oxidation. For example, in Figure 4 In the middle, the first pattern region F1 and the nth pattern region F n The metal film 40 is easily oxidized, as are the fourth pattern region F4 and the (n-3)th pattern region F. n-3 The metal film is difficult to oxidize.

[0101] In contrast, in the first embodiment, the presence of the protective agent 8 promotes natural oxidation. For example, in Figure 4 In the middle, the first pattern region F1 to the nth pattern region F nthe metal films 40 are uniformly and naturally oxidized. As a result, the quality of the plurality of (n) metallized films 2 becomes uniform.

[0102] Therefore, with respect to the film capacitor 1 manufactured using the metallized film coil wound body 20A according to the first embodiment, variations in quality such as electrostatic capacitance can be reduced.

[0103] (1.2) Method for manufacturing metallized film coil wound body

[0104] Next, referring to Figures 4-6 the method for manufacturing the metallized film coil wound body 20A according to the first embodiment will be described.

[0105] As shown in Figure 6 the method for manufacturing the metallized film coil wound body 20A includes step S1A, step S2A, step S3A, and step S4A. A series of operations from step S1A to step S4A can be performed in a chamber.

[0106] <S1A: Preparation of dielectric film coil>

[0107] In step S1A, a strip-shaped dielectric film coil 30 is prepared. The dielectric film coil 30 is, for example, wound and disposed as a wound body in the chamber.

[0108] <S2A: Formation of metallized film coil>

[0109] In step S2A, the metallized film coil 20 as shown in Figure 4 is formed. Specifically, the inside of the chamber is brought into a vacuum state, and metal is vapor-deposited on the dielectric film coil 30 while the dielectric film coil 30 is drawn out from the wound body of the dielectric film coil 30. In this way, a plurality of (n) metal films 40 of a predetermined pattern are provided on one surface or both surfaces (here, one surface) of the dielectric film coil 30. In this way, the metallized film coil 20 is formed. As already described, the plurality of (n) metal films 40 of a predetermined pattern are arranged side by side in the width direction of the dielectric film coil 30.

[0110] The formed metallized film coil 20 is once wound and continuously disposed as a wound body in the chamber in a vacuum state.

[0111] <S3A: Application of protective agent>

[0112] In step S3A, the protective agent 8 is applied onto the metallized film roll 20. Specifically, in a chamber under a vacuum state, while the metallized film roll 20 is unwound from the wound body of the metallized film roll 20, the protective agent 8 is applied to the end region 6 of the metallized film roll 20. The application of the protective agent 8 can be performed, for example, by spraying using a nozzle. In this way, in the width direction of the metallized film roll 20, the protective agent 8 is applied to both sides or one side (here, both sides) of the entirety of the plurality (n) of the metal films 40 in the predetermined pattern.

[0113] In addition, in Figure 6 the flowchart shown, the operation of step S3A is performed after the operation of step S2A, but the method for manufacturing the metallized film roll wound body 20A according to the first embodiment further includes performing the operations of step S2A and step S3A in parallel at the same time. That is, the method for manufacturing the metallized film roll wound body 20A according to the first embodiment further includes applying the protective agent 8 while performing metal vapor deposition on the dielectric film roll 30. In this way, if the protective agent 8 is applied without waiting for the entire metal vapor deposition operation to end, the operation time can be shortened. In this case, it is of course unnecessary to temporarily wind the metallized film roll 20 before applying the protective agent 8.

[0114] <S4A: Winding of metallized film roll>

[0115] In step S4A, the metallized film roll 20 is wound. Specifically, in a chamber under a vacuum state, as Figure 5 shown, the metallized film roll 20 is wound around the axis J2 in the circumferential direction θ2, so that the metallized film roll wound body 20A is obtained.

[0116] In addition, in Figure 6 the flowchart shown, the operation of step S4A is performed after the operation of step S3A, but the method for manufacturing the metallized film roll wound body 20A according to the first embodiment further includes performing the operations of step S3A and step S4A in parallel at the same time. That is, the method for manufacturing the metallized film roll wound body 20A according to the first embodiment further includes winding the metallized film roll 20 coated with the protective agent 8 while applying the protective agent 8 to the metallized film roll 20. In this way, if the metallized film roll 20 coated with the protective agent 8 is wound without waiting for the entire application operation of the protective agent 8 to end, the operation time can be shortened.

[0117] As already described, the manufacturing method of the metallized film roll 20A according to the first embodiment further includes performing steps S2A and S3A simultaneously and in parallel, and further includes performing steps S3A and S4A simultaneously and in parallel. That is, the manufacturing method of the metallized film roll 20A according to the first embodiment also includes performing all operations of steps S2A, S3A and S4A simultaneously and in parallel.

[0118] <Effects>

[0119] According to the manufacturing method of the metallized film roll 20A according to the first embodiment, a metallized film roll 20A that is difficult for air and moisture to penetrate into can be obtained. This is because the protective agent 8 functions as a breakwater. In the metallized film roll 20A, the end face 7 can be considered as a path for air and moisture intrusion. In the first embodiment, the protective agent 8 is arranged in a circumferential vortex shape along θ2 near the end face 7 (left end face 7a and right end face 7b) of the metallized film roll 20A. This suppresses the intrusion of air and moisture into the interior of the metallized film roll 20A.

[0120] Without the protective agent 8, when the chamber is returned from a vacuum state to an atmospheric pressure state, atmospheric air and moisture rapidly intrude from the end face 7 of the metallized film roll 20A. Therefore, oxidation progresses more readily at the ends compared to the interior of the metallized film roll 20A. This results in uneven oxidation. For example, in… Figure 4 In the middle, the first pattern region F1 and the nth pattern region F n The metal film 40 is easily oxidized, as are the fourth pattern region F4 and the (n-3)th pattern region F. n-3 The metal film is difficult to oxidize.

[0121] In contrast, in the first embodiment, the presence of the protective agent 8 inhibits the rapid intrusion of air and moisture, promoting uniform natural oxidation. For example, in Figure 4 In the middle, the first pattern region F1 to the nth pattern region F n The metal film 40 is uniformly oxidized naturally. As a result, the quality of the multiple (n) metallized films 2 becomes uniform.

[0122] Therefore, the quality deviation of the film capacitor 1 manufactured using the metallized film roll winding body 20A according to the first embodiment can be reduced.

[0123] (1.3) Film capacitors

[0124] Next, refer to Figures 1-4The first embodiment of the thin-film capacitor 1 will be described below. The thin-film capacitor 1 according to the first embodiment includes a first metallized film 21 and a second metallized film 22. The thin-film capacitor 1 also includes a terminal electrode 400.

[0125] As will be explained again in the section “(1.4) Method for manufacturing film capacitor”, the first metallized film 21 and the second metallized film 22 are any two metallized films 2 selected from a plurality (n) of metallized films 2 obtained from the metallized film roll 20A.

[0126] like Figure 1 As shown, the first metallization film 21 and the second metallization film 22 are positioned opposite each other in the vertical direction.

[0127] <1st metallized film>

[0128] The first metallized thin film 21 has a first dielectric thin film 31, a first metal film 41 and a first natural oxide film 51.

[0129] ≪First Dielectric Thin Film≫

[0130] The first dielectric film 31 corresponds to the p-th patterned region F in the metallized film roll 20. p The dielectric film roll 30 (p is an integer greater than 1 and less than n). Therefore, the material and thickness of the first dielectric film 31 are the same as those of the dielectric film roll 30.

[0131] ≪First Metallic Film≫

[0132] The first metal film 41 corresponds to the p-th pattern region F in the metallized thin film roll 20. p The metal film 40. Therefore, the material and thickness of the first metal film 41 are the same as those of the metal film 40.

[0133] The first metal film 41 is disposed on the first dielectric film 31. Figure 1 In this case, a metal film 41 is directly disposed on the upper surface of the first dielectric film 31.

[0134] A first surplus portion 301 exists to the right of the first metal film 41 in the width direction of the first dielectric film 31. The first surplus portion 301 corresponds to the p-th pattern region F in the metallized film roll 20. p The first surplus portion 300. The first surplus portion 301 is the portion where the first metal film 41 is not provided, and is the portion where the first dielectric film 31 is exposed. The first surplus portion 301 extends in the front-back direction.

[0135] ≪First Natural Oxide Film≫

[0136] The first natural oxide film 51 is formed on the first metal film 41. The first natural oxide film 51 is a thin film of oxides that is naturally formed by exposing the surface of the first metal film 41 to the atmosphere.

[0137] <Second metallized film>

[0138] The second metallized film 22 has a second dielectric film 32, a second metal film 42 and a second natural oxide film 52.

[0139] ≪Second Dielectric Thin Film≫

[0140] The second dielectric film 32 corresponds to the qth pattern region F in the metallized film roll 20. q The dielectric film roll 30 (q is an integer greater than or equal to n and q ≠ p). Therefore, the material and thickness of the second dielectric film 32 are the same as those of the dielectric film roll 30.

[0141] ≪Second Metallic Film≫

[0142] The second metal film 42 corresponds to the qth pattern region F in the metallized thin film roll 20. q The metal film 40. Therefore, the material and thickness of the second metal film 42 are the same as those of the metal film 40.

[0143] The second metal film 42 is disposed on the second dielectric film 32. Figure 1 In this process, the second metal film 42 is directly disposed on the upper surface of the second dielectric film 32.

[0144] A second surplus portion 302 exists to the left of the second metal film 42 along the width direction of the second dielectric film 32. The second surplus portion 302 corresponds to the q-th pattern region F in the metallized film roll 20. q The second excess portion 300. The second excess portion 302 is the portion where the second metal film 42 is not provided, and is the portion where the second dielectric film 32 is exposed. The second excess portion 302 also extends in the front-back direction.

[0145] ≪Second Natural Oxide Film≫

[0146] The second natural oxide film 52 is formed on the second metal film 42. The second natural oxide film 52 is a thin film of oxides that is naturally formed by exposing the surface of the second metal film 42 to the atmosphere.

[0147] Thus, the first natural oxide film 51 and the second natural oxide film 52 form spontaneously without any special treatment. Therefore, the thickness of the first natural oxide film 51 and the thickness of the second natural oxide film 52 are the same.

[0148] ≪End face electrode≫

[0149] In the first embodiment, the end surface electrode 400 includes a first end surface electrode 401 and a second end surface electrode 402. The first end surface electrode 401 is connected to the first metal film 41, but is not connected to the second metal film 42. On the other hand, the second end surface electrode 402 is connected to the second metal film 42, but is not connected to the first metal film 41.

[0150] The metal constituting the end surface electrode 400 is not particularly limited, and examples thereof include zinc (Zn), tin (Sn), alloys thereof, and the like.

[0151] <Operational Effect>

[0152] The film capacitor 1 according to the first embodiment is manufactured using the metallized film web roll wound body 20A. As described above, regarding the metallized film web roll wound body 20A, the quality of a plurality of (n) metallized films 2 is uniform. This reduces the variation in thickness of the dielectric film 3 and the natural oxide film 5 sandwiched between the first metal film 41 and the second metal film 42.

[0153] Therefore, according to the film capacitor 1 according to the first embodiment, local electric field concentration can be suppressed, and reliability can be improved.

[0154] (1.4) Manufacturing Method of Film Capacitor

[0155] Next, reference is made to Figures 1-4 to describe the manufacturing method of the film capacitor 1 according to the first embodiment. The manufacturing method of the film capacitor 1 includes step S5 and step S6. The manufacturing method of the film capacitor 1 may further include step S7.

[0156] <S5: Dividing Step>

[0157] In step S5, the metallized film web 20 is divided to obtain a plurality of metallized films 2. That is, the metallized film web 20 in the metallized film web roll wound body 20A is divided for each metal film 40 of a predetermined pattern, so that a plurality of metallized films 2 are obtained. That is, when Figure 4 the illustrated metallized film web 20 is cut and divided along the boundary lines indicated by the two-dot chain lines, a plurality of (n) metallized films 2 and the end region 6 are obtained. In addition, the end region 6 is removed because it is not required in the manufacture of the film capacitor 1.

[0158] <S6: Winding Step>

[0159] In step S6, a pair of metallized films 2 among the plurality of metallized films 2 are overlapped and wound.

[0160] A pair of metallized films 2 are a first metallized film 21 and a second metallized film 22. The first metallized film 21 and the second metallized film 22 are any two metallized films 2 selected from a plurality of (n) metallized films 2 obtained from a metallized film roll 20.

[0161] In the first embodiment, as Figure 2 shown, a cylindrical wound body 10 is obtained by stacking the first metallized film 21 and the second metallized film 22 and winding them in the circumferential direction θ1 around the axis J1. If the cylindrical wound body 10 is pressed in one direction perpendicular to the axis J1, a flattened oblate cylindrical wound body 10 is obtained (refer to Figure 3 ). In addition, the wound body 10 may remain in a cylindrical shape as it is.

[0162] <S7: Spraying Step>

[0163] In step S7, metal is sprayed on the end face of the wound body 10 to form an end face electrode 400. Specifically, metal is sprayed on one end of the wound body 10 (one end face in the direction of the axis J1) to form a first end face electrode 401. On the other hand, metal is sprayed on the other end of the wound body 10 (the other end face in the direction of the axis J1) to form a second end face electrode 402.

[0164] When step S7 is completed, the film capacitor 1 as shown Figure 3 is obtained.

[0165] <Operational Effects>

[0166] The method for manufacturing the film capacitor 1 according to the first embodiment uses a metallized film roll wound body 20A. As described above, regarding the metallized film roll wound body 20A, the quality of the plurality of (n) metallized films 2 is made uniform.

[0167] For this reason, in the film capacitor 1 obtained by the method for manufacturing the film capacitor 1 according to the first embodiment, the variation in the thickness of the dielectric film 3 and the natural oxide film 5 sandwiched between the first metal film 41 and the second metal film 42 is reduced.

[0168] Therefore, according to the method for manufacturing the film capacitor 1 according to the first embodiment, it is possible to manufacture a highly reliable film capacitor 1 in which local electric field concentration is suppressed.

[0169] (2) Second Embodiment

[0170] Next, referring to Figure 7 and Figure 8to describe the metallized film coil winding body 20A and the manufacturing method thereof according to the second embodiment. In the second embodiment, the same reference numerals are assigned to the same constituent elements as those in the first embodiment, and detailed descriptions thereof may be omitted.

[0171] (2.1) Metallized film coil winding body

[0172] In the second embodiment, the protective agent 8 is not applied to the end region 6 of the metallized film coil 20. Instead, as shown in Figure 7 , the protective agent 8 is applied to both side end faces or one side end face (here, both side end faces) of the metallized film coil winding body 20A. Specifically, the protective agent 8 is applied to the left end face 7a and the right end face 7b of the metallized film coil winding body 20A. Further, in the second embodiment, the protective agent 8 is also applied to the end region 6 of the metallized film coil 20.

[0173] <Operational Effects>

[0174] The second embodiment also achieves the same operational effects as the first embodiment.

[0175] In particular, in the second embodiment, the protective agent 8 is disposed on the end faces 7 (the left end face 7a and the right end face 7b) of the metallized film coil winding body 20A. This can suppress the intrusion of air and moisture into the interior of the metallized film coil winding body 20A.

[0176] Therefore, regarding the film capacitor 1 manufactured using the metallized film coil winding body 20A according to the second embodiment, variations in quality such as electrostatic capacitance can be reduced.

[0177] (2.2) Method for manufacturing metallized film coil winding body

[0178] Next, with reference to Figure 7 and Figure 8 , the manufacturing method of the metallized film coil winding body 20A according to the second embodiment will be described.

[0179] As shown in Figure 8 , the manufacturing method of the metallized film coil winding body 20A includes step S1B, step S2B, step S3B, and step S4B. At least a series of operations from step S1B to step S3B can be performed in a chamber. If technically possible, it is preferable that the operation of step S4B is also performed in the chamber.

[0180] <S1B: Preparation of dielectric film coil>

[0181] Step S1B is the same as step S1A of the first embodiment.

[0182] <S2B: Formation of Metallized Film Web Coil>

[0183] Step S2B is the same as step S2A of the first embodiment.

[0184] <S3B: Winding of Metallized Film Web Coil>

[0185] Step S3B is substantially the same as step S4A of the first embodiment. Herein, the protective agent 8 is not applied to the end region 6 of the metallized film web coil 20 that is not wound in step S3B.

[0186] <S4B: Application of Protective Agent>

[0187] In step S4B, the protective agent 8 is applied to the metallized film web coil wound body 20A. That is, the protective agent 8 is applied to both end faces or one end face (here, both end faces) of the metallized film web coil wound body 20A. Specifically, by applying the protective agent 8 to the left end face 7a and the right end face 7b of the metallized film web coil wound body 20A, Figure 7 the metallized film web coil wound body 20A as shown is obtained. Preferably, the application of the protective agent 8 is performed as early as possible after the metallized film web coil wound body 20A is taken out of the chamber.

[0188] <Operational Effects>

[0189] The second embodiment also achieves the same operational effects as the first embodiment.

[0190] Particularly in the second embodiment, the protective agent 8 is disposed on the end faces 7 (the left end face 7a and the right end face 7b) of the metallized film web coil wound body 20A. This can suppress the intrusion of the atmosphere and moisture into the interior of the metallized film web coil wound body 20A.

[0191] Therefore, with respect to the film capacitor 1 manufactured using the metallized film web coil wound body 20A according to the second embodiment, variations in quality such as electrostatic capacitance can be reduced.

[0192] (2.3) Film Capacitor and Manufacturing Method Thereof

[0193] Since the film capacitor 1 and the manufacturing method thereof according to the second embodiment are common to the film capacitor 1 and the manufacturing method thereof according to the first embodiment, detailed descriptions thereof are omitted.

[0194] (3) Third Embodiment

[0195] Next, referring to Figure 9 and Figure 10The container-mounted metallized film roll 20B and its manufacturing method according to the third embodiment will be described. In the third embodiment, the same reference numerals are used as in the first and second embodiments for the same constituent elements, and detailed descriptions are sometimes omitted.

[0196] (3.1) Container containing metallized film rolls

[0197] The container-containing metallized film roll 20B comprises a metallized film roll 20A and a container 9.

[0198] <Metallized film roll winding>

[0199] In the third embodiment, the protective agent 8 is not applied to the end region 6 of the metallized film roll 20. Furthermore, the protective agent 8 is also not applied to the end face 7 of the metallized film roll 20A. Instead, in the third embodiment, a container 9 is used, as described later. Alternatively, in the third embodiment, the protective agent 8 may be applied to the end region 6 of the metallized film roll 20, or it may be applied to the end face 7 of the metallized film roll 20A.

[0200] <container>

[0201] Container 9 houses a metallized film roll 20A. Container 9 has a housing space 90, configured to be openable and closable. The metallized film roll 20A is housed within the housing space 90. Alternatively, a desiccant and / or a deoxidizer may be housed together with the metallized film roll 20A within the housing space 90.

[0202] The desiccant absorbs moisture within the containment space 90. There are no particular limitations on the desiccant; examples include silica gel, calcium chloride, calcium oxide, and molecular sieves.

[0203] The deoxidizer absorbs oxygen within the containment space 90. There are no particular limitations on the type of deoxidizer; for example, iron powder-based deoxidizers are shown.

[0204] The material of container 9 can be either resin or metal, as long as it is difficult for air and moisture to pass through; there are no particular restrictions.

[0205] <Effects>

[0206] The third embodiment also achieves the same effect as the first embodiment.

[0207] In particular, in the third embodiment, the metallized film roll 20A is housed in the container 9. Furthermore, a desiccant and a deoxidizer are also housed in the container 9. This prevents atmospheric and moisture vapor from penetrating the interior of the metallized film roll 20A.

[0208] Therefore, for the film capacitor 1 manufactured using the container-equipped metallized film coil winding body 20B according to the third embodiment, variations in quality such as electrostatic capacitance can be reduced.

[0209] (3.2) Method for manufacturing a container-equipped metallized film coil winding body

[0210] Next, with reference to Figure 9 and Figure 10 the method for manufacturing the container-equipped metallized film coil winding body 20B according to the third embodiment will be described.

[0211] As shown in Figure 10 , the method for manufacturing the container-equipped metallized film coil winding body 20B includes step S1C, step S2C, step S3C, and step S4C. A series of operations from step S1C to step S3C can be performed in a chamber.

[0212] <S1C: Preparation of dielectric film coil>

[0213] Step S1C is the same as step S1A of the first embodiment.

[0214] <S2C: Formation of metallized film coil>

[0215] Step S2C is the same as step S2A of the first embodiment.

[0216] <S3C: Winding of metallized film coil>

[0217] Step S3C is substantially the same as step S4A of the first embodiment. Here, the protective agent 8 is not applied to the end region 6 of the metallized film coil 20 to be wound in step S3C. Further, the protective agent 8 is not applied to the end face 7 of the wound metallized film coil winding body 20A either.

[0218] <S4C: Storing into container>

[0219] In step S4C, the metallized film coil winding body 20A is stored into the container 9. Thereby, the container-equipped metallized film coil winding body 20B as shown in Figure 9 can be obtained. Preferably, the storing into the container 9 is performed as early as possible after the metallized film coil winding body 20A is taken out from the chamber.

[0220] <Operational effects>

[0221] The third embodiment also exerts the same operational effects as the first embodiment.

[0222] In particular, in the third embodiment, the metallized film roll 20A is housed in the container 9. Furthermore, sometimes a desiccant and a deoxidizer are also housed together in the container 9. This prevents atmospheric and moisture from penetrating the interior of the metallized film roll 20A.

[0223] Therefore, the film capacitor 1 manufactured using the container-mounted metallized film roll winding body 20B according to the third embodiment can reduce the deviation in quality such as electrostatic capacitance.

[0224] (3.3) Film capacitors and their manufacturing methods

[0225] Regarding the film capacitor 1 and its manufacturing method according to the third embodiment, since they are common to the film capacitor 1 and its manufacturing method according to the first embodiment, detailed descriptions are omitted. Furthermore, needless to say, in the third embodiment, whenever the film capacitor 1 is manufactured, the metallized film roll 20A, formed by winding the metallized film roll 20, is taken out of the container for use.

[0226] 3. Variations

[0227] The first to third implementation methods can also be combined appropriately.

[0228] For example, the first embodiment and the second embodiment can be combined. Specifically, a protective agent 8 can also be applied to the end face 7 of the metallized film roll 20A involved in the first embodiment.

[0229] Furthermore, the first embodiment and the third embodiment can be combined. Specifically, the metallized film roll 20A according to the first embodiment can also be housed in the container 9.

[0230] Furthermore, the second and third embodiments can be combined. Specifically, the metallized film roll 20A involved in the second embodiment can also be housed in the container 9.

[0231] Furthermore, in the third embodiment, a bag may be used instead of the container 9. Both the container 9 and the bag are common because they can contain and seal the metallized film roll 20A.

[0232] 4. Method

[0233] As is clear from the above embodiments and variations, this disclosure includes the following methods. In the following, reference numerals are added in parentheses only for the purpose of clearly indicating the correspondence with the embodiments.

[0234] The first type is a thin-film capacitor (1), comprising a first metallized film (21) and a second metallized film (22). The first metallized film (21) comprises: a first dielectric film (31); a first metal film (41) disposed on the first dielectric film (31); and a first natural oxide film (51) formed on the first metal film (41). The second metallized film (22) comprises: a second dielectric film (32); a second metal film (42) disposed on the second dielectric film (32); and a second natural oxide film (52) formed on the second metal film (42). The thickness of the first natural oxide film (51) and the thickness of the second natural oxide film (52) are the same.

[0235] This method can suppress local electric field concentration and improve reliability.

[0236] The second method involves winding a metallized thin film roll (20A) formed by winding a strip-shaped metallized thin film roll (20). The metallized thin film roll (20) comprises: a strip-shaped dielectric thin film roll (30); and a plurality of metal films (40) with given patterns arranged side by side in the width direction of the dielectric thin film roll (30). In the width direction of the metallized thin film roll (20), a protective agent (8) is applied to both sides or one side of the plurality of metal films (40) with given patterns.

[0237] This method can reduce quality deviations in components such as electrostatic capacitance.

[0238] The third method involves winding a metallized film roll (20A) formed by winding a strip-shaped metallized film roll (20). The metallized film roll (20) comprises: a strip-shaped dielectric film roll (30); and a plurality of metal films (40) with given patterns arranged side by side in the width direction of the dielectric film roll (30). A protective agent (8) is applied to both end faces or one end face of the metallized film roll (20A).

[0239] This method can reduce quality deviations in components such as electrostatic capacitance.

[0240] The fourth method is to use a container to hold a metallized film roll (20B), comprising: a metallized film roll (20A) formed by winding a strip of metallized film roll (20); and a container (9) for holding the metallized film roll (20A). The metallized film roll (20) comprises: a strip of dielectric film roll (30); and a plurality of metal films (40) with a given pattern arranged side by side in the width direction of the dielectric film roll (30).

[0241] This method can reduce quality deviations in components such as electrostatic capacitance.

[0242] The fifth method is a manufacturing method of a metallized thin film roll (20A), comprising the following steps: preparing a strip-shaped dielectric thin film roll (30); forming a metallized thin film roll (20) by providing a plurality of metal films (40) of a given pattern arranged side by side on one or both sides of the dielectric thin film roll (30) in the width direction of the dielectric thin film roll (30); applying a protective agent (8) to both sides or one side of the plurality of metal films (40) of the given pattern in the width direction of the metallized thin film roll (20); and winding the metallized thin film roll (20).

[0243] This method can reduce quality deviations in components such as electrostatic capacitance.

[0244] The sixth method is a manufacturing method of a metallized thin film roll (20A), comprising the following steps: preparing a strip-shaped dielectric thin film roll (30); forming a metallized thin film roll (20) by providing a plurality of metal films (40) of a given pattern arranged side by side on one or both sides of the dielectric thin film roll (30) in the width direction of the dielectric thin film roll (30); winding the metallized thin film roll (20) to obtain a metallized thin film roll (20A); and applying a protective agent (8) to both end faces or one end face of the metallized thin film roll (20A).

[0245] This method can reduce quality deviations in components such as electrostatic capacitance.

[0246] The seventh method is a manufacturing method for a container-mounted metallized film roll (20B), comprising the following steps: preparing a strip-shaped dielectric film roll (30); forming a metallized film roll (20) by providing a plurality of metal films (40) of a given pattern arranged side by side on one or both sides of the dielectric film roll (30) in the width direction of the dielectric film roll (30); winding the metallized film roll (20) to obtain a metallized film roll (20A); and housing the metallized film roll (20A) in a container (9).

[0247] This method can reduce quality deviations in components such as electrostatic capacitance.

[0248] The eighth method is a method for manufacturing a film capacitor (1), comprising the following steps: dividing the metallized film roll (20) in a metallized film roll winding body (20A) based on the second or third method or a container-type metallized film roll winding body (20B) based on the fourth method into a plurality of metal films (40) with a given pattern to obtain a plurality of metallized films (2); and overlapping and winding a pair of metallized films (2) among the plurality of metallized films (2).

[0249] According to this method, highly reliable thin-film capacitors that suppress local electric field concentration can be manufactured (1).

Claims

1. A thin-film capacitor comprising a first metallization film and a second metallization film, The first metallized thin film has the following characteristics: First dielectric thin film; A first metal film disposed on the first dielectric thin film; and The first natural oxide film formed on the first metal film, The second metallization film has the following characteristics: Second dielectric thin film; A second metal film disposed on the second dielectric thin film; and The second native oxide film formed on the second metal film, The thickness of the first natural oxide film is the same as the thickness of the second natural oxide film.

2. A metallized film roll assembly, formed by winding a strip-shaped metallized film roll. The metallized thin film roll material comprises: Forming a strip-shaped dielectric thin film roll; and Multiple metal films of a given pattern are arranged side by side along the width direction of the dielectric film roll. A protective agent is applied to both sides or one side of the plurality of given patterned metal film rolls in the width direction.

3. A metallized film roll assembly, formed by winding a strip-shaped metallized film roll. The metallized thin film roll material comprises: Forming a strip-shaped dielectric thin film roll; and Multiple metal films of a given pattern are arranged side by side along the width direction of the dielectric film roll. A protective agent is applied to both ends or one end of the metallized film roll.

4. A container for holding a metallized film roll, comprising: A metallized film roll formed by winding a strip of metallized film; and A container for housing the metallized film roll. The metallized thin film roll material comprises: Forming a strip-shaped dielectric thin film roll; and Multiple metal films of a given pattern arranged side by side in the width direction of the dielectric film roll.

5. A method for manufacturing a metallized thin film roll, comprising the following steps: Prepare to form a strip-shaped dielectric thin film roll; A metallized film roll is formed by disposing of a plurality of metal films of a given pattern arranged side by side in the width direction of the dielectric film roll on one or both sides of the dielectric film roll. A protective agent is applied to both sides or one side of the plurality of given patterned metal films in the width direction of the metallized film roll; and The metallized film roll is wound up.

6. A method for manufacturing a metallized thin film roll, comprising the following steps: Prepare to form a strip-shaped dielectric thin film roll; A metallized film roll is formed by disposing of a plurality of metal films of a given pattern arranged side by side in the width direction of the dielectric film roll on one or both sides of the dielectric film roll. The metallized film roll is wound to obtain a metallized film roll body; and A protective agent is applied to both ends or one end of the metallized film roll.

7. A method for manufacturing a container-mounted metallized film roll, comprising the following steps: Prepare to form a strip-shaped dielectric thin film roll; A metallized film roll is formed by disposing of a plurality of metal films of a given pattern arranged side by side in the width direction of the dielectric film roll on one or both sides of the dielectric film roll. The metallized film roll is wound to obtain a metallized film roll body; and The metallized film roll is housed in a container.

8. A method for manufacturing a thin-film capacitor, comprising the following steps: The metallized film roll in the metallized film roll body according to claim 2 or 3, or the metallized film roll body in the container according to claim 4, is divided according to each of the plurality of given patterned metal films to obtain a plurality of metallized films; and One pair of metallized films from the plurality of metallized films are overlapped and wound together.

Images