Grounding device and vapor deposition apparatus

Abstract

This invention belongs to the technical field of vapor deposition equipment and discloses a grounding device and a vapor deposition apparatus. The grounding device includes a first connecting portion, a second connecting portion, and a deformable portion. The first connecting portion is conductively connected to a lower electrode, which is conductively connected to a substrate. The second connecting portion is conductively connected to a grounding portion, and the second connecting portion is conductively connected to the first connecting portion. At least one of the first and second connecting portions is connected to the deformable portion, which is deformable to maintain the conductive connection between the lower electrode, the first connecting portion, the second connecting portion, and the grounding portion. The deformable portion is fixedly connected between the first and second connecting portions and can elongate or compress as the vertical distance between the lower electrode and the bottom wall of the chamber changes, avoiding phenomena such as connection failure and shrinkage of the connection cross-section that would increase resistance, thereby ensuring a long-term and stable conductive connection between the lower electrode and the grounding portion.

Description

Technical Field

[0001] This invention relates to the field of vapor deposition equipment technology, and more particularly to a grounding device and a vapor deposition equipment. Background Technology

[0002] Thin film deposition technology is a core process in semiconductor manufacturing, optical coating, and functional material preparation. Among them, physical vapor deposition (PVD) and chemical vapor deposition (CVD) are widely used due to their high precision and controllability. However, electrostatic deposition often occurs during the deposition process, leading to a decrease in film quality and even causing microcracks or micro-short circuits, resulting in leakage current or breakdown risks and affecting the electrical performance of semiconductor devices.

[0003] In existing technologies, ion wind electrostatic eliminators or grounding devices are typically used to suppress electrostatic deposition during the deposition process. However, ion wind electrostatic eliminators require a continuous supply of inert gas and rely on high-voltage discharge. Their electrode tips are prone to failure due to long-term discharge oxidation, resulting in a decrease in electrostatic removal efficiency. Grounding devices, on the other hand, are limited by the contact between the device and the substrate, making it difficult to coordinate with the active and passive movement of the substrate during the deposition process. This can lead to fluctuations in contact resistance or even loss of connection between the device and the substrate, and an inability to maintain a stable charge discharge path.

[0004] Based on the above, there is an urgent need for a grounding device and a vapor deposition equipment to solve the aforementioned technical problems. Summary of the Invention

[0005] The first objective of this invention is to provide a grounding device that can ground a substrate in a long-term and stable manner, and can adapt to the active movement and passive displacement of the substrate during the deposition process.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A grounding device, installed in the vapor deposition equipment, includes:

[0008] A first connecting portion is electrically connected to the lower electrode in the vapor deposition apparatus, and the lower electrode is electrically connected to the substrate.

[0009] The second connecting part is electrically connected to the grounding part, and the second connecting part is electrically connected to the first connecting part;

[0010] A deformable portion is provided, at least one of the first connecting portion and the second connecting portion is connected to the deformable portion, the deformable portion being deformable to maintain the conductive connection between the lower electrode, the first connecting portion, the second connecting portion and the grounding portion when the relative positions of the lower electrode and the grounding portion change.

[0011] Preferably, the grounding device includes an elastic element that can deform along a preset direction. Along the preset direction, one end of the elastic element is configured as the first connecting portion, the other end of the elastic element is configured as the second connecting portion, and the middle portion of the elastic element is configured as the deformable portion. The first connecting portion and the second connecting portion are electrically connected through the deformable portion.

[0012] Preferably, the elastic element includes a helical spring, and the preset direction is the axial direction of the helical spring.

[0013] Preferably, the elastic element includes a first helical spring and a second helical spring, which are coaxially arranged and have opposite winding directions. The second helical spring passes through the first helical spring and is fixedly connected to it. The end of the first helical spring near the lower electrode and the end of the second helical spring near the lower electrode are fixedly connected to form the first connecting portion. The end of the first helical spring near the grounding portion and the end of the second helical spring near the grounding portion are fixedly connected to form the second connecting portion.

[0014] Preferably, the elastic element includes a spring sheet, which is V-shaped, U-shaped, or W-shaped; or,

[0015] The deformable part includes a deformable sheet-like bending structure in the shape of a V or U.

[0016] Preferably, the grounding device includes an elastic element, a first connecting element, and a second connecting element. The first connecting element has a first connecting portion, and the second connecting element is movably connected to the grounding portion and has a second connecting portion. The elastic element is drively connected to the second connecting element and has the deformable portion. The grounding device is configured as follows:

[0017] When the distance between the lower electrode and the grounding part decreases, the second connector moves away from the first connector, the deformable part deforms and generates elastic force, which is used to press the second connector against the first connector in the direction toward the first connector.

[0018] Preferably, the first connector has a first inclined surface at one end near the second connector, and the second connector has a second inclined surface at one end near the first connector. The first and second inclined surfaces are parallel and slidably abut against each other. The distance between the lower electrode and the grounding part can change in the vertical direction. The first inclined surface and the vertical direction are set at an angle greater than 0 degrees and less than 90 degrees.

[0019] The beneficial effects of the grounding device of the present invention are as follows:

[0020] The deformable part is fixedly connected between the first connecting part and the second connecting part, and can elongate or compress as the vertical distance between the lower electrode and the bottom wall of the chamber changes. This allows the vertical distance between the first connecting part and the second connecting part to change in a coordinated manner without negatively affecting the fixed connection between the first connecting part and the lower electrode or the fixed connection between the second connecting part and the bottom wall of the chamber. This avoids phenomena such as connection failure and shrinkage of the connection cross-section that would increase resistance, thereby ensuring a long-term and stable conductive connection between the lower electrode and the grounding part.

[0021] The second objective of this invention is to provide a vapor deposition apparatus that can reduce and avoid electrostatic deposition, thereby ensuring process quality.

[0022] To achieve this objective, the present invention adopts the following technical solution:

[0023] A vapor deposition apparatus includes a lower electrode and the aforementioned grounding device. The lower electrode is disposed within a chamber of the vapor deposition apparatus, and the bottom wall of the chamber is configured as a grounding portion. The grounding device is electrically connected between the lower electrode and the grounding portion.

[0024] Preferably, the vapor deposition apparatus includes at least two grounding devices, which are arranged symmetrically about the longitudinal midsection of the lower electrode.

[0025] Preferably, the spacing between two adjacent grounding devices is reduced along a direction away from the longitudinal midsection.

[0026] The beneficial effects of the vapor deposition apparatus of the present invention are as follows: the substrate and the lower electrode move as a whole, the conductive connection between the two is relatively stable and independent of the grounding device. Therefore, as long as the conductive connection between the lower electrode and the grounding part is ensured, the substrate can have long-term and stable grounding, thereby ensuring that the substrate surface is not affected by static electricity accumulation in vapor deposition processes such as PVD and CVD processes. This is conducive to achieving uniform deposition, improving the uniformity and density of the film, and ensuring the quality of the vapor deposition process and the performance of the product. Attached Figure Description

[0027] Figure 1 This is a three-dimensional schematic diagram of the grounding device in the vapor deposition equipment according to the first embodiment of the present invention;

[0028] Figure 2 This is a three-dimensional structural view of the elastic element in the first embodiment of the present invention;

[0029] Figure 3 This is a frontal schematic diagram of the grounding device in the vapor deposition equipment according to the first embodiment of the present invention;

[0030] Figure 4 This is a three-dimensional schematic diagram of the grounding device in the vapor deposition equipment according to the second embodiment of the present invention;

[0031] Figure 5 This is a three-dimensional structural view of the first type of spring sheet in the second embodiment of the present invention;

[0032] Figure 6 This is a three-dimensional structural view of the second type of spring sheet in the second embodiment of the present invention;

[0033] Figure 7 This is a three-dimensional structural view of the third type of spring sheet in the second embodiment of the present invention;

[0034] Figure 8 This is a frontal schematic diagram of the grounding device in a vapor deposition apparatus according to the second embodiment of the present invention;

[0035] Figure 9 This is a three-dimensional schematic diagram of the grounding device in the vapor deposition equipment according to the third embodiment of the present invention;

[0036] Figure 10 yes Figure 9 A magnified view of a portion of point A in the middle.

[0037] In the picture:

[0038] 100, Lower electrode; 200, Grounding part; 2001, Fixing part; 301, First longitudinal mid-section; 302, Second longitudinal mid-section;

[0039] 10. First connecting part; 20. Second connecting part; 30. Deformation part;

[0040] 1. Elastic element; 11. First helical spring; 12. Second helical spring; 13. Spring piece; 2. First connecting piece; 3. Second connecting piece. Detailed Implementation

[0041] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0042] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0045] In vapor deposition, the substrate is typically supported and electrically connected to the lower electrode 100, and a film is deposited on the substrate. In PVD processes (such as magnetron sputtering and vacuum evaporation), target atoms detach from the target surface through high-energy particle bombardment or thermal evaporation and subsequently deposit on the substrate. However, due to high-energy electron bombardment in the plasma environment and the accumulation of charge on the substrate surface, electrostatic adsorption effects are easily triggered, leading to non-uniform deposition of free particles or impurities on the substrate surface. Such defects can significantly reduce film density and even cause microcracks or micro-short circuits, affecting the electrical performance of semiconductor devices.

[0046] For CVD technologies (such as plasma-enhanced CVD and low-pressure CVD), precursor gases undergo chemical reactions on the substrate surface to form films. However, during the reaction, the substrate surface is prone to forming an electrostatic field due to gas ionization or charge transfer, which adsorbs dust or byproduct particles from the environment, leading to increased surface roughness of the film. This is especially true in nanoscale film deposition (such as silicon nitride dielectric layers), where such defects can cause leakage current or breakdown risks.

[0047] Furthermore, during the vapor deposition process, the relative positions of the lower electrode 100 and the inner wall of the cavity change. On one hand, the lower electrode 100 and the cavity are generally made of different materials with different coefficients of thermal expansion. During vapor deposition, because the lower electrode 100 and the cavity (bottom) are in different positions and experience different temperatures, the distance between the lower electrode 100 and the inner wall of the cavity changes before and during the vapor deposition process. On the other hand, in some embodiments, to optimize the quality of the deposited film, it is necessary to adjust specific process parameters, such as gas flow rate, pressure, plasma power, and substrate position. This necessitates that the lower electrode 100 actively or cooperatively move to ensure that the substrate is deposited in a suitable plasma distribution area within the cavity. Therefore, during deposition, the lower electrode 100 and the substrate undergo active movement and passive displacement, altering the distance between them and the inner wall of the cavity.

[0048] This invention provides a grounding device that can be installed in a vapor deposition apparatus, enabling long-term and stable grounding of the substrate, and adapting to both active and passive displacement of the substrate during the deposition process. The following describes the device according to the attached diagram. Figure 1 To be continued Figure 10 The grounding device and vapor deposition equipment provided by the present invention are described through multiple embodiments.

[0049] like Figure 1 , Figure 2 As shown, in one embodiment of the present invention, the top end of the lower electrode 100 is plate-shaped, which can be used to place and support the substrate and achieve a conductive connection with the substrate to facilitate vapor deposition. A grounding device is disposed in the chamber of the vapor deposition apparatus, and includes a first connecting portion 10, a second connecting portion 20, and a deformation portion 30. The first connecting portion 10 is conductively connected to the lower electrode 100, the second connecting portion 20 is conductively connected to the first connecting portion 10, and the second connecting portion 20 is conductively connected to the grounding portion 200 within the chamber. Specifically, in this embodiment, the chamber and the common grounding point of the vapor deposition apparatus are conductively connected, so that the inner wall of the chamber can all serve as grounding portions 200, and a conductive connection is achieved between the chamber and the second connecting portion 20 through a fixed connection, thereby grounding the substrate and achieving the effect of static electricity removal.

[0050] Simultaneously, the deformation part 30 is connected to at least one of the first connecting part 10 and the second connecting part 20, and the deformation part 30 is capable of deformation. This maintains the conductive connection between the lower electrode 100, the first connecting part 10, the second connecting part 20, and the grounding part 200 when the relative positions of the lower electrode 100 and the grounding part 200 change. This prevents the lower electrode 100 from experiencing connection failure or increased contact resistance at any point between the lower electrode 100, the first connecting part 10, the second connecting part 20, and the grounding part 200 due to changes in the position of the lower electrode 100 within the cavity. This ensures that the static electricity removal effect is not affected by changes in the position of the lower electrode 100 within the cavity, and guarantees a stable charge discharge path between the substrate and the grounding part 200.

[0051] Specifically, such as Figures 1 to 3 As shown, in one embodiment of the present invention, the grounding device includes an elastic member 1, which is capable of deforming along a preset direction. Along the preset direction, one end of the elastic member 1 is used as a first connecting portion 10, which can be fixedly connected to the lower electrode 100; the other end of the elastic member 1 is used as a second connecting portion 20, which can be fixedly connected to the grounding portion 200. The middle portion of the elastic member 1 serves as the aforementioned deformable portion 30, and the first connecting portion 10 and the second connecting portion 20 are electrically connected through the deformable portion 30.

[0052] When the lower electrode 100 and the substrate undergo active or passive movement, the distance between the first connecting part 10 and the second connecting part 20 changes, resulting in an increase or decrease in the vertical distance between the lower electrode 100 and the bottom wall of the chamber. When the grounding device is installed in the vapor deposition equipment, it is positioned with a preset direction parallel to the vertical direction. The upper end of the elastic member 1 serves as the first connecting part 10 and is welded to the lower electrode 100 (the lower electrode 100 can be made of stainless steel or other metal materials), while the lower end of the elastic member 1 serves as the second connecting part 20 and is welded to the bottom wall of the chamber. The deformable part 30 is fixedly connected between the first connecting part 10 and the second connecting part 20, and can extend or compress as the vertical distance between the lower electrode 100 and the bottom wall of the chamber changes. This allows the vertical distance between the first connecting part 10 and the second connecting part 20 to change in a coordinated manner without negatively affecting the fixed connection between the first connecting part 10 and the lower electrode 100 or the fixed connection between the second connecting part 20 and the bottom wall of the chamber. This avoids phenomena such as connection failure and shrinkage of the connection cross-section that would increase resistance, thereby ensuring a long-term and stable conductive connection between the lower electrode 100 and the grounding part 200.

[0053] In vapor deposition equipment, since the substrate and the lower electrode 100 move as a whole, the conductive connection between them is relatively stable and independent of the grounding device. Therefore, as long as the conductive connection between the lower electrode 100 and the grounding part 200 is ensured, the substrate can have long-term and stable grounding. This ensures that the substrate surface is not affected by static electricity accumulation in vapor deposition processes such as PVD and CVD, which is conducive to achieving uniform deposition, improving the uniformity and density of the film, and ensuring the quality of the vapor deposition process and the performance of the product.

[0054] Specifically, in the first embodiment of the present invention, the elastic element 1 includes a helical spring, the preset direction of which is the axial direction of the helical spring. One end of the helical spring is fixedly and electrically connected to the lower electrode 100, and the other end of the helical spring is fixedly and electrically connected to the bottom wall of the chamber. The middle part of the helical spring can be compressed and stretched along its axial direction, thereby forming the aforementioned deformable part 30.

[0055] More specifically, in the first embodiment of the present invention, the elastic element 1 includes a first helical spring 11 and a second helical spring 12. The inner diameter of the first helical spring 11 is larger than the outer diameter of the second helical spring 12. The first helical spring 11 and the second helical spring 12 are coaxially arranged, and the second helical spring 12 passes through the first helical spring 11. The axial directions of the first helical spring 11 and the second helical spring 12 are both arranged in a vertical direction. The ends of the first helical spring 11 and the second helical spring 12 near the lower electrode 100 are welded together to the lower electrode 100. The ends of the first helical spring 11 and the second helical spring 12 near the bottom wall of the chamber are also welded together to the bottom wall of the chamber. This enables a conductive connection between the lower electrode 100 and the bottom wall of the chamber, and reduces the resistance of the grounding device without increasing the space occupied by the elastic element 1, ensuring a stable and reliable grounding connection.

[0056] Preferably, such as Figure 2As shown, the first helical spring 11 and the second helical spring 12 have opposite winding directions; for example, the first helical spring 11 has a left-handed helical structure, and the second helical spring 12 has a right-handed helical structure. Taking the compression of the elastic element 1 as an example, the first helical spring 11 and the second helical spring 12 will each generate a rotational tendency consistent with their own helical direction, that is, one has a counterclockwise rotational tendency, and the other has a clockwise rotational tendency. When the ends of the first helical spring 11 and the second helical spring 12 are connected, the rotational tendencies of the first helical spring 11 and the second helical spring 12 can cancel each other out, thereby avoiding instability or connection failure caused by rotational torque. At the same time, this combination of opposite helical structures can change the natural frequency of the grounding device, that is, expand the vibration suppression range of the grounding device, which is beneficial to reduce the vibration time of the lower electrode 100, increase dynamic stability, and avoid vibration of the lower electrode 100 caused by chamber vibration and other reasons, thereby ensuring the process quality of the vapor deposition process.

[0057] It should be noted that the first helical spring 11 and the second helical spring 12 can be directly welded together at their ends, thereby achieving a fixed connection between the first helical spring 11 and the second helical spring 12. This allows the first helical spring 11 and the second helical spring 12 to simultaneously compress or stretch when there is a change in the vertical distance between the lower electrode 100 and the bottom wall of the chamber. In some embodiments, the ends of both the first helical spring 11 and the second helical spring 12 can be welded together to a connecting piece, and the connecting piece can be welded together with the lower electrode 100 and the bottom wall of the chamber. This forms a welding surface (i.e., the surface of the connecting piece) on the elastic element 1, which is conducive to the welding process, further facilitating the addition of the aforementioned grounding device to existing vapor deposition equipment.

[0058] Optionally, in some embodiments, a conical helical spring can be used as the elastic element 1, or both the first helical spring 11 and the second helical spring 12 described above can be conical helical springs. Compared with cylindrical helical springs where the spring diameter and pitch are constant, conical helical springs have nonlinear stiffness characteristics, that is, the stiffness gradually increases with the increase of compression, forming a nonlinear load-deformation relationship. This allows the spring's natural frequency to be dynamically adjusted during compression, avoiding resonance with the external excitation frequency and improving the stability of the lower electrode 100 and the substrate. Preferably, the large-diameter end of the conical helical spring is fixedly connected to the bottom wall of the chamber, thereby using the large-diameter end as the support base of the conical helical spring, reducing lateral displacement caused by eccentric load during compression, and improving motion stability and accuracy.

[0059] Continue to refer to Figure 1 , Figure 3As shown, one or more grounding devices can be installed in the chamber of the vapor deposition equipment and electrically connected to the lower electrode 100 to perform static electricity removal treatment on the lower electrode 100, thereby achieving a static electricity removal effect on the substrate. Exemplarily, in this embodiment, the top of the lower electrode 100 is configured as a support plate, which is a rectangular stainless steel plate. The support plate has two longitudinal mid-sections, one of which is perpendicular to the length direction of the support plate (for ease of explanation, this longitudinal mid-section is defined as the first longitudinal mid-section 301), and the other longitudinal mid-section is perpendicular to the width direction of the support plate (for ease of explanation, this longitudinal mid-section is defined as the second longitudinal mid-section 302). Along the length direction of the support plate, four of the aforementioned grounding devices are connected to the long edge of the lower electrode 100, and the four grounding devices are symmetrical about the first longitudinal mid-section 301 of the lower electrode 100. This symmetrical arrangement can greatly improve the overall static electricity removal effect on the lower electrode 100 and avoid the phenomenon of excessive local charge accumulation. Similarly, in this embodiment, along the width direction of the support plate, a plurality of grounding devices (not shown in the figure) are connected to the short edge of the lower electrode 100, and the plurality of grounding devices connected to the short edge are symmetrical about the second longitudinal midsection 302 of the lower electrode 100, which can also ensure the static electricity removal effect at the short edge of the lower electrode 100.

[0060] Furthermore, multiple grounding devices are connected to both long and short edges of the lower electrode 100. At the same time, the multiple grounding devices are symmetrically arranged about the first longitudinal mid-section 301 and the second longitudinal mid-section 302, thereby further improving the uniform static electricity removal effect on the entire lower electrode 100 and avoiding the phenomenon of local charge accumulation.

[0061] Preferably, in this embodiment, the spacing between two adjacent grounding devices is reduced along the direction away from the first longitudinal mid-section 301. For example, the spacing between two grounding devices close to the first longitudinal mid-section 301 is m, and the spacing between two grounding devices far from the first longitudinal mid-section 301 is n, where m > n. This is because the charge distribution density of the lower electrode 100, as a conductor, is closely related to the curvature of its surface; that is, the smaller the radius of curvature (i.e., the sharper the area), the greater the surface charge density. Therefore, the closer to the edge of the lower electrode 100 (i.e., the farther away from the longitudinal mid-section), the higher the charge density, resulting in a higher grounding requirement and thus necessitating the installation of more grounding devices. Similarly, the spacing between two adjacent grounding devices is also reduced along the direction away from the second longitudinal mid-section 302.

[0062] In summary, in this embodiment, multiple grounding devices are connected to the outer periphery of the support plate. These grounding devices are symmetrically arranged about the two longitudinal mid-sections of the lower electrode 100, and the spacing between adjacent grounding devices is reduced along the direction away from the longitudinal mid-sections. This ensures that the lower electrode 100 as a whole can achieve a relatively uniform static electricity removal effect, and ensures that the grounding resistance is lower in areas of the lower electrode 100 such as the corners where charge easily accumulates, thus achieving a fast and stable static electricity removal effect.

[0063] like Figure 4 , Figure 5 As shown, in the second embodiment provided by the present invention, the elastic element 1 is a spring sheet 13, such as a V-shaped spring sheet 13, a U-shaped spring sheet 13, or a W-shaped spring sheet 13, etc. Exemplarily, one end of the spring sheet 13 is used as a first connecting portion 10, which has a first horizontal surface. The first horizontal surface can be fixedly connected to the lower electrode 100 and electrically connected by means of welding, threaded connection, etc. The other end of the spring sheet 13 is used as a second connecting portion 20, which has a second horizontal surface. The second horizontal surface can be fixedly connected to the lower electrode 100 and electrically connected by means of welding, threaded connection, etc. The middle part of the spring sheet 13 has multiple V-shaped deformable sheet-like bending structures. These deformable sheet-like bending structures can deform along the direction from the first connecting portion 10 to the second connecting portion 20, thereby increasing or decreasing the distance between the first connecting portion 10 and the second connecting portion 20. In other words, while maintaining a fixed connection with the lower electrode 100 and the bottom wall of the chamber, the spring 13 also allows for changes in the relative distance between the lower electrode 100 and the bottom wall of the chamber. This allows it to adapt to both active and passive movements of the lower electrode 100 and the substrate while maintaining a conductive connection between the lower electrode 100 and the bottom wall of the chamber.

[0064] Specifically, such as Figure 5 As shown, in this embodiment, one end of the spring piece 13 is used as the first connecting part 10, and the other end of the spring piece 13 is used as the second connecting part 20. Two V-shaped deformable sheet-like bending structures are connected sequentially between the two ends. In some other embodiments, only one V-shaped deformable sheet-like bending structure can be provided between the two ends of the spring piece 13, or three, four, or more deformable sheet-like bending structures can be provided, or a U-shaped deformable sheet-like bending structure can be used instead of a V-shaped deformable sheet-like bending structure. These changes will not cause the conductive connection between the lower electrode 100 and the grounding part 200 to fail, and all fall within the scope of protection of this invention.

[0065] Furthermore, in some embodiments, such as Figure 6As shown, the width of the spring 13 is increased along the direction from one end to the other. For example, the width of the spring 13 gradually increases along the direction from the first connecting portion 10 to the second connecting portion 20, so that the spring 13 also has nonlinear stiffness characteristics similar to a conical helical spring, that is, the stiffness gradually increases with the increase of compression, forming a nonlinear load-deformation relationship. This allows the natural frequency of the spring 13 to be dynamically adjusted during compression, avoiding resonance with the external excitation frequency and improving the stability of the lower electrode 100 and the substrate.

[0066] Optionally, in some parallel embodiments, two spring pieces 13 with opposite bending directions can be arranged side-by-side between the lower electrode 100 and the bottom wall of the chamber. For example... Figure 7 As shown, two springs 13 with the same structure are arranged side by side along the width direction of the springs 13. The deformation part 30 of one spring 13 is W-shaped, while the deformation part 30 of the other spring 13 is inverted W-shape.

[0067] When the first connecting portions 10 of the two spring pieces 13 are fixedly connected, and the second connecting portions 20 of the two spring pieces 13 are fixedly connected, the bending tendencies of the two spring pieces 13 can cancel each other out, thereby avoiding instability or connection failure caused by bending torque. At the same time, this structural combination with opposite bending directions can change the natural frequency of the grounding device, that is, expand the vibration suppression range of the grounding device, which is beneficial to reducing the vibration time of the lower electrode 100, increasing dynamic stability, and avoiding vibration of the lower electrode 100 due to chamber vibration and other reasons, thereby ensuring the process quality of the vapor deposition process.

[0068] It should be noted that the two spring pieces 13 can be directly welded together at their ends, thereby achieving a fixed connection between the two first connecting parts 10 and the two second connecting parts 20. This allows the two spring pieces 13 to synchronously compress or stretch when there is a change in the vertical distance between the lower electrode 100 and the bottom wall of the chamber. In some embodiments, the ends of both spring pieces 13 can be welded to a connecting piece, and the connecting piece can be welded to the lower electrode 100 and the bottom wall of the chamber, respectively. This forms a welding surface (i.e., the surface of the connecting piece) on the elastic element 1 that is conducive to the welding process, further facilitating the addition of the aforementioned grounding device to existing vapor deposition equipment.

[0069] Similar to the first embodiment of the present invention, in the second embodiment, along the length direction of the support plate, four grounding devices are connected to the long edge of the lower electrode 100 as described above, and the four grounding devices are symmetrical about the first longitudinal mid-section 301 of the lower electrode 100. Along the width direction of the support plate, multiple grounding devices (not shown in the figure) are connected to the short edge of the lower electrode 100, and the multiple grounding devices connected to the short edge are symmetrical about the second longitudinal mid-section 302 of the lower electrode 100, thus achieving a symmetrical arrangement of grounding devices about the lower electrode 100 and ensuring the static electricity removal effect at the short edge of the lower electrode 100.

[0070] Furthermore, multiple grounding devices are connected to both long and short edges of the lower electrode 100. These grounding devices are symmetrically arranged about the first longitudinal mid-section 301 and the second longitudinal mid-section 302, thereby further improving the uniform static electricity removal effect on the entire lower electrode 100 and preventing localized charge accumulation. Additionally, the spacing between adjacent grounding devices is reduced along directions away from both the first and second longitudinal mid-sections 301 and 302, ensuring lower grounding resistance at areas prone to charge accumulation, such as the corners of the lower electrode 100, enabling rapid and stable static electricity removal.

[0071] It should be noted that in some embodiments, a more complex elastic element 1 may be provided. As long as the elastic element 1 includes the above-mentioned V-shaped or U-shaped deformable sheet-like bending structure, or includes the above-mentioned spring, it falls within the scope of protection of this invention.

[0072] like Figure 9 , Figure 10 As shown, in the third embodiment provided by the present invention, the grounding device includes an elastic member 1, a first connecting member 2, and a second connecting member 3. Both the first connecting member 2 and the second connecting member 3 are made of conductive material, such as metal. One end of the first connecting member 2 serves as the first connecting portion 10, which is fixedly connected to the lower electrode 100 and conductively connected to it. One end of the second connecting member 3 serves as the second connecting portion 20, which is conductively connected to the grounding portion 200, and the second connecting member 3 and the grounding portion 200 are movably connected. The elastic member 1 is drivenly connected to the second connecting member 3 and has the deformable portion 30. The lower electrode 100 can form a conductive connection directly with the grounding portion 200 through the first connecting member 2 and the second connecting member 3, thereby achieving static electricity removal treatment of the lower electrode 100 and the substrate placed on the lower electrode 100, reducing charge accumulation.

[0073] Specifically, when the lower electrode 100 and the substrate undergo active or passive movement, taking the reduction in distance between the lower electrode 100 and the grounding portion 200 as an example, the first connector 2 applies pressure to the second connector 3, causing the second connector 3 to move away from the first connector 2. While moving, the second connector 3 applies pressure or tension to the elastic member 1, causing the deformation portion 30 to deform and generate elastic force. This elastic force presses the second connector 3 tightly against the first connector 2 in the direction towards the first connector 2, thereby ensuring that the first connector 2 and the second connector 3 remain in contact and electrically connected.

[0074] More specifically, such as Figure 10 As shown, in this embodiment, the first connector 2 has a first inclined surface at one end near the second connector 3, and the second connector 3 has a second inclined surface at one end near the first connector 2. The first and second inclined surfaces are parallel and slidably abut against each other. When the lower electrode 100 and the substrate move actively or are passively displaced, the distance between the lower electrode 100 and the grounding part 200 increases or decreases. The second connector 3 is slidably mounted on the bottom wall of the chamber via a slide rail (not shown in the figure), and the bottom surface of the second connector 3 and the bottom wall of the chamber maintain slidable contact, so that the second connector 3 can slide under the push of the first connector 2 and maintain conductive connection with the grounding part 200. The first inclined surface is set at a 45-degree angle to the vertical direction, and the second inclined surface is also set at a 45-degree angle to the vertical direction. When the distance between the lower electrode 100 and the grounding part 200 increases or decreases, the second connector 3 will slide along the bottom wall of the chamber accordingly, so that the first connector 2 can descend and rise. Of course, in some embodiments, the first inclined surface and the second inclined surface may be inclined at other angles and in other vertical directions. The present invention does not limit the specific setting angle, as long as it is greater than 0 degrees and less than 90 degrees, so that the pressure applied by the first connecting member 2 to the second connecting member 3 can drive the second connecting member 3 to move in position.

[0075] The elastic element 1 also uses a spring, with one end of the spring fixedly connected to the second connecting element 3. A fixing part 2001 protrudes from the bottom wall of the chamber, and the fixing part 2001 is fixedly connected to the other end of the spring. In this embodiment, when the first connecting element 2 moves downward in the vertical direction, it drives the second connecting element 3 to move toward the fixing part 2001, causing the spring to compress and deform, generating elastic force. When the distance between the lower electrode 100 and the bottom wall of the chamber increases, the first connecting element 2 will follow the lower electrode 100 and move away from the second connecting element 3. This elastic force can push the second connecting element 3 toward the first connecting element 2, so that the first inclined surface and the second inclined surface maintain contact and conductive connection, thereby achieving stable grounding and avoiding the phenomenon that the grounding resistance is greater than the preset value.

[0076] It is understood that, in this embodiment, it is also preferable to arrange the multiple grounding devices symmetrically about the first longitudinal mid-section 301 and the second longitudinal mid-section 302 of the lower electrode 100, thereby achieving a more uniform static electricity removal effect. Furthermore, the spacing between adjacent grounding devices is controlled to decrease in a direction away from the longitudinal mid-section to avoid local charge accumulation at the edge. More preferably, the angles of the first inclined surfaces of the multiple grounding devices are also symmetrically arranged about the first longitudinal mid-section 301 and the second longitudinal mid-section 302, so that the opposite sides of the lower electrode 100 can be balanced under force, providing better support and vibration resistance, reducing the vibration time of the lower electrode 100, increasing dynamic stability, and helping to avoid vibration of the lower electrode 100 due to chamber vibration or other reasons, thereby ensuring the process quality of the vapor deposition process.

[0077] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0078] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A grounding device, installed in a vapor deposition apparatus, characterized in that, The grounding device includes: A first connecting portion is electrically connected to the lower electrode in the vapor deposition apparatus, and the lower electrode is electrically connected to the substrate. The second connecting part is electrically connected to the grounding part, and the second connecting part is electrically connected to the first connecting part; A deformable portion is provided, at least one of the first connecting portion and the second connecting portion is connected to the deformable portion, the deformable portion being deformable to maintain the conductive connection between the lower electrode, the first connecting portion, the second connecting portion and the grounding portion when the relative positions of the lower electrode and the grounding portion change.

2. The grounding device according to claim 1, characterized in that, The grounding device includes an elastic element that can deform along a preset direction. Along the preset direction, one end of the elastic element is configured as the first connecting portion, the other end of the elastic element is configured as the second connecting portion, and the middle portion of the elastic element is configured as the deformable portion. The first connecting portion and the second connecting portion are electrically connected through the deformable portion.

3. The grounding device according to claim 2, characterized in that, The elastic element includes a helical spring, and the preset direction is the axial direction of the helical spring.

4. The grounding device according to claim 3, characterized in that, The elastic element includes a first helical spring and a second helical spring, which are coaxially arranged and have opposite winding directions. The second helical spring passes through the first helical spring and is fixedly connected to it. The end of the first helical spring near the lower electrode and the end of the second helical spring near the lower electrode are fixedly connected to form the first connecting portion. The end of the first helical spring near the grounding portion and the end of the second helical spring near the grounding portion are fixedly connected to form the second connecting portion.

5. The grounding device according to claim 2, characterized in that, The elastic element includes a spring sheet, which is V-shaped, U-shaped, or W-shaped; or... The deformable part includes a deformable sheet-like bending structure in the shape of a V or U.

6. The grounding device according to claim 1, characterized in that, The grounding device includes an elastic element, a first connecting element, and a second connecting element. The first connecting element has a first connecting portion. The second connecting element is movably connected to the grounding portion and has a second connecting portion. The elastic element is drively connected to the second connecting element and has the deformable portion. The grounding device is configured as follows: When the distance between the lower electrode and the grounding part decreases, the second connector moves away from the first connector, the deformable part deforms and generates elastic force, which is used to press the second connector against the first connector in the direction toward the first connector.

7. The grounding device according to claim 6, characterized in that, The first connector has a first inclined surface at one end near the second connector, and the second connector has a second inclined surface at one end near the first connector. The first and second inclined surfaces are parallel and slidably abut against each other. The distance between the lower electrode and the grounding part can change in the vertical direction. The first inclined surface and the vertical direction are at an angle greater than 0 degrees and less than 90 degrees.

8. A vapor deposition apparatus, characterized in that, The device includes a lower electrode and a grounding device as described in any one of claims 1-7, wherein the lower electrode is disposed in the chamber of the vapor deposition apparatus, the bottom wall of the chamber is configured as a grounding portion, and the grounding device is electrically connected between the lower electrode and the grounding portion.

9. The vapor deposition apparatus according to claim 8, characterized in that, The vapor deposition apparatus includes at least two grounding devices, which are arranged symmetrically about the longitudinal midsection of the lower electrode.

10. The vapor deposition apparatus according to claim 9, characterized in that, The spacing between two adjacent grounding devices is reduced along a direction away from the longitudinal midsection.

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