High temperature and wear resistant integrated circuit integrated connection assembly
Patent Information
- Application Number
- CN202611391803.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-09-09
- Publication Date
- 2026-10-20
AI Technical Summary
[0004]本发明的主要目的在于提供一种耐高温耐磨损集成电路集成连接组件,可以有效解决背景技术中提出的操作步骤繁琐、持续通电产生的热量难以及时散发和易导致电路板点位虚接、松动的问题
[0015]与现有技术相比,本发明具有如下有益效果:将压板下压时,压板通过其下方的倾斜面顶动两个推柱向两侧移动,能够带动导电套套设在插头的外部,使两侧导电杆的线路导通,同时推柱带动推杆挤压推入杆顶入液压缸内,经活塞挤压液压油后由推出杆将滑座顶出,使连杆下端的导电块下移并与电路板安装点位快速压紧连接,内部线路导通与外侧电路板点位的压接由一次下压动作同步完成,连接效率高,并且在当压板升起时,拉簧快速拉动两个推柱合并复位,使导电套与插头自动分离断电,同时还带动导电块复位抬起,实现连接的快速断开与重复使用;
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Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit connection, and in particular to a high-temperature and wear-resistant integrated circuit connection component. Background Technology
[0002] High-temperature and wear-resistant integrated circuit interconnection components are used to connect and connect multiple integrated circuit boards during the installation of integrated circuit boards, and are widely used in integrated circuit board applications.
[0003] However, existing connection components often require multiple steps to connect the internal circuitry and the mounting points on the external circuit board. This process is cumbersome, inefficient, and necessitates manual disconnection and resetting after connection. It fails to meet the requirements for repeated use and rapid assembly / disassembly, and repeated disassembly and assembly exacerbates component wear, affecting lifespan. Furthermore, existing connection components lack effective heat dissipation structures, making it difficult to dissipate heat generated by continuous power supply. This leads to excessively high temperatures at the connection points, increasing contact resistance, contact erosion, or component deformation. They also exhibit poor high-temperature resistance. The circuit board needs to operate stably for extended periods in high-temperature environments. Although some components are equipped with cooling fans, their air ducts are always open or rely on manual start-stop, making it impossible to synchronize with the connection and operation status of the components. They continue to blow air even when not generating heat, resulting in ineffective energy consumption and inconvenience. In addition, existing connection components mostly rely on manual direct force to crimp the circuit board, resulting in uneven pressure that can easily lead to loose connections or loosening of circuit board points. Furthermore, the lack of a guiding structure during the crimping process makes conductive parts prone to misalignment, causing poor contact or even damage to the circuit board. The various connection components are also scattered, resulting in low integration and a loose structure, making it inconvenient to install and use on integrated circuit boards. Summary of the Invention
[0004] The main objective of this invention is to provide a high-temperature and wear-resistant integrated circuit connection component that can effectively solve the problems mentioned in the background art, such as cumbersome operation steps, difficulty in timely dissipation of heat generated by continuous power supply, and easy occurrence of loose connections and loosening of circuit board points.
[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:
[0006] A high-temperature and wear-resistant integrated circuit connection assembly includes a mounting base. A base plate is fixedly mounted on the bottom of the mounting base, and a top cover is fixedly mounted on the top end of the mounting base. Connecting plates are fixedly mounted on both sides of the mounting base. Multiple guide rods are fixedly mounted on the top end of the top cover. Multiple pressure plates are provided on the top end of the top cover and sleeved on the outside of the guide rods. Multiple air inlet structures are fixedly mounted on the top end of the top cover between two pressure plates. Multiple sets of through push posts are movably mounted on both sides of the top end of the mounting base below the pressure plates. A conductive sleeve is fixedly mounted on the lower end of each push post. A clip is integrally formed on the outside of the conductive sleeve. A movably connected conductive plate is inserted into the inside of the clip. A push rod is fixedly mounted on the opposite side of every two push posts. Multiple through conductive rods are fixedly mounted on both sides of the inside of the mounting base. A connecting structure for connecting circuit boards is fixedly mounted on the opposite ends of two push rods and two conductive rods. Two plugs are integrally formed on the adjacent ends of two conductive rods.
[0007] As a further embodiment of the present invention, pull rings are fixedly installed on both sides of the upper end of the pressure plate, and air guide grooves are opened inside the pressure plate.
[0008] As a further embodiment of the present invention, the air intake structure includes an air guide pipe, an air intake pipe and a fan. The air guide pipe is fixedly installed on the upper end of the top cover, the air intake pipe is integrally formed on the top of the air guide pipe, and the fan is fixedly installed on the upper end of the air intake pipe.
[0009] As a further embodiment of the present invention, the pressure plate moves up and down around the guide rod. When the pressure plate is lowered, it is located between the two push columns and pushes them to move to both sides. When the pressure plate is lowered, it passes through the top cover. At the same time, the end of the air guide pipe is connected to the air guide groove.
[0010] As a further embodiment of the present invention, when the pusher moves, it causes the conductive sleeve to be fitted onto the outside of the plug, and one end of the conductive rod is located between the two plugs and is cut and shaped with fins.
[0011] As a further embodiment of the present invention, the push rod is placed above the top cover, and a tension spring is fixedly installed between the two push rods.
[0012] As a further embodiment of the present invention, the connecting structure includes a hydraulic cylinder, a push rod, an eject rod, a guide rail, a slide block, a connecting rod, and a conductive block. The hydraulic cylinder is fixedly installed on one side of the mounting base, the push rod is movably installed on the upper end of the hydraulic cylinder, the eject rod is movably installed on the lower end of the hydraulic cylinder, the guide rail is fixedly installed on one end of the conductive rod, the slide block is slidably installed on the outside of the guide rail, the connecting rod is fixedly installed on the lower end of the slide block, and the conductive block is fixedly installed on the lower end of the connecting rod.
[0013] As a further embodiment of the present invention, the end of the push rod is fixedly connected to the push rod, the lower end of the push rod is fixedly connected to the slide block, and both the push rod and the push rod are fixedly connected to the piston in the hydraulic cylinder.
[0014] As a further embodiment of the present invention, the slide block slides linearly around the outer side of the guide rail, and the conductive block is located above the connecting plate.
[0015] Compared with the prior art, the present invention has the following beneficial effects: When the pressure plate is pressed down, the pressure plate pushes the two push columns to move to both sides through the inclined surface below it, which can drive the conductive sleeve to be fitted on the outside of the plug, so that the circuit of the conductive rod on both sides is connected. At the same time, the push column drives the push rod to squeeze the push rod into the hydraulic cylinder. After the piston squeezes the hydraulic oil, the push rod pushes the slide block out, so that the conductive block at the lower end of the connecting rod moves down and quickly presses and connects with the circuit board mounting point. The internal circuit connection and the pressing of the external circuit board point are completed simultaneously by one pressing action, which has high connection efficiency. Furthermore, when the pressure plate is raised, the tension spring quickly pulls the two push columns to merge and reset, so that the conductive sleeve and the plug are automatically separated and de-energized. At the same time, it also drives the conductive block to reset and lift, realizing the quick disconnection and reuse of the connection.
[0016] When the pressure plate is lowered, the end of the air duct and the air guide channel automatically connect. The air generated by the fan passes through the air inlet pipe, air duct and air guide channel in sequence, and is input from the bottom of the pressure plate to the bottom of the top cover, directly blowing onto the conductive rod for air cooling. At the same time, the fins cut and shaped between the two plugs at one end of the conductive rod increase the heat dissipation area. The air cooling and fin heat dissipation work together to form a dual heat dissipation structure, which effectively suppresses the temperature rise of the connection part under the power-on state, avoids the increase of contact resistance, contact burning or component deformation caused by high temperature, and enables the component to work stably for a long time in a high temperature environment. Moreover, the air duct and air guide channel only connect to deliver air when the pressure plate is lowered, the circuit is connected and heat is generated. When the pressure plate is raised and the connection is disconnected, the air duct is automatically disconnected. The heat dissipation time is automatically matched with the working state, without the need for manual start and stop. This ensures timely cooling under heat and avoids ineffective air delivery when no load, thus reducing energy consumption.
[0017] The hydraulic cylinder converts the horizontal displacement of the push column into the vertical clamping force of the conductive block through hydraulic transmission. The transmission is smooth and the pressure is uniform, which makes the conductive block fit tightly with the circuit board position and is not easy to loosen and cause poor connection. At the same time, the slide slides linearly around the guide rail to guide the downward movement of the conductive block, ensuring that the conductive block is vertically aligned with the circuit board mounting position and avoiding misalignment that may cause poor contact or damage to the circuit board. The overall integration is high and the structure is compact, making it easy to install and use on integrated circuit boards. Attached Figure Description
[0018] Figure 1 This is an overall structural diagram of a high-temperature and wear-resistant integrated circuit interconnect assembly according to the present invention;
[0019] Figure 2 This is a top view of a high-temperature and wear-resistant integrated circuit interconnect assembly according to the present invention.
[0020] Figure 3 This is a cross-sectional view of a mounting base in a high-temperature and wear-resistant integrated circuit interconnect assembly according to the present invention.
[0021] Figure 4 This is an enlarged view of the air intake structure in a high-temperature and wear-resistant integrated circuit interconnect assembly of the present invention;
[0022] Figure 5 This is an enlarged view of the pressure plate in a high-temperature and wear-resistant integrated circuit interconnect assembly of the present invention;
[0023] Figure 6 This is an enlarged view of the conductive rod in a high-temperature and wear-resistant integrated circuit interconnect assembly of the present invention;
[0024] Figure 7 This is an enlarged view of the connection structure in a high-temperature and wear-resistant integrated circuit interconnect assembly of the present invention.
[0025] In the diagram: 1. Mounting base; 2. Base plate; 3. Top cover; 4. Connecting plate; 5. Guide rod; 6. Pressure plate; 7. Pull ring; 8. Air inlet structure; 9. Air duct; 10. Air inlet pipe; 11. Fan; 12. Push column; 13. Tension spring; 14. Conductive sleeve; 15. Jacket; 16. Conductive plate; 17. Push rod; 18. Connecting structure; 19. Hydraulic cylinder; 20. Push rod; 21. Push rod; 22. Guide rail; 23. Slide seat; 24. Connecting rod; 25. Conductive block; 26. Conductive rod; 27. Plug; 28. Fin; 29. Air guide groove. Detailed Implementation
[0026] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.
[0027] like Figures 1-7 As shown, a high-temperature and wear-resistant integrated circuit interconnect component is described. (See reference...) Figures 1-7The system includes a mounting base 1, a base plate 2 fixedly mounted at the bottom of the mounting base 1, a top cover 3 fixedly mounted at the top of the mounting base 1, connecting plates 4 fixedly mounted on both sides of the mounting base 1, multiple guide rods 5 fixedly mounted at the top of the top cover 3, multiple pressure plates 6 sleeved on the outside of the guide rods 5 at the top of the top cover 3, multiple air inlet structures 8 fixedly mounted between the two pressure plates 6 at the top of the top cover 3, multiple sets of through push rods 12 movably mounted on both sides below the pressure plates 6 at the top of the mounting base 1, conductive sleeves 14 fixedly mounted at the lower end of the push rods 12, a clip 15 integrally formed on the outside of the conductive sleeve 14, a movably connected conductive plate 16 inserted inside the clip 15, push rods 17 fixedly mounted on opposite sides of every two push rods 12, multiple through conductive rods 26 fixedly mounted on both sides inside the mounting base 1, a connecting structure 18 for connecting circuit boards fixedly mounted on opposite ends of two push rods 17 and opposite ends of two conductive rods 26, and two plugs 27 integrally formed at adjacent ends of two conductive rods 26.
[0028] See Figure 3 and Figure 4 Pull rings 7 are fixedly installed on both sides of the upper end of the pressure plate 6, and air guide grooves 29 are opened inside the pressure plate 6.
[0029] See Figure 2 and Figure 4 The air intake structure 8 includes an air guide pipe 9, an air intake pipe 10, and a fan 11. The air guide pipe 9 is fixedly installed on the upper end of the top cover 3, the air intake pipe 10 is integrally formed on the top of the air guide pipe 9, and the fan 11 is fixedly installed on the upper end of the air intake pipe 10.
[0030] See Figures 2-4 The pressure plate 6 moves up and down around the guide rod 5. When the pressure plate 6 is lowered, it is located between the two push columns 12 and pushes them to move to both sides. When the pressure plate 6 is lowered, it passes through the top cover 3. At the same time, the end of the air duct 9 is connected to the air duct 29.
[0031] See Figure 1 , Figure 3 and Figure 6 When the pusher 12 moves, it causes the conductive sleeve 14 to be placed on the outside of the plug 27. One end of the conductive rod 26 is located between the two plugs 27 and is cut and shaped with fins 28.
[0032] Specifically, the pressure plate 6 is pressed down, and the pressure plate 6 pushes the two push pins 12 to move to both sides through the inclined surface below, thereby driving the conductive sleeve 14 to be put on the outside of the plug 27 to establish a connection, realizing the opening of the circuit of the conductive rods 26 on both sides. When the pressure plate 6 falls, the air guide groove 29 is connected to the air guide pipe 9, and the fan 11 is connected to the external power switch to run, generating air force that is input into the air guide groove 29 through the air inlet pipe 10 and the air guide pipe 9, and input from the bottom of the pressure plate 6 to the bottom of the top cover 3, cooling down the conductive and heated copper rods 26. Combined with the heat dissipation of the fins 28 on the outside of the rods 26, the effect is further improved.
[0033] See Figure 3 The push rod 17 is placed above the top cover 3, and a tension spring 13 is fixedly installed between the two push rods 12.
[0034] Specifically, when the push column 12 moves, it also drives the push rod 17 to move to one side. The tension spring 13 tightens the two push columns 12. When the pressure plate 6 rises, the tension spring 13 quickly pulls the two push columns 12 together, causing the conductive sleeve 14 to separate from the plug 27.
[0035] See Figure 6 and Figure 7 The connecting structure 18 includes a hydraulic cylinder 19, a push rod 20, an eject rod 21, a guide rail 22, a slide 23, a connecting rod 24, and a conductive block 25. The hydraulic cylinder 19 is fixedly installed on one side of the mounting base 1. The push rod 20 is movably installed on the upper end of the hydraulic cylinder 19. The eject rod 21 is movably installed on the lower end of the hydraulic cylinder 19. The guide rail 22 is fixedly installed on one end of the conductive rod 26. The slide 23 is slidably installed on the outside of the guide rail 22. The connecting rod 24 is fixedly installed on the lower end of the slide 23. The conductive block 25 is fixedly installed on the lower end of the connecting rod 24.
[0036] See Figure 6 and Figure 7 The end of the push rod 20 is fixedly connected to the push rod 17, and the lower end of the push rod 21 is fixedly connected to the slide block 23. Both the push rod 20 and the push rod 21 are fixedly connected to the piston inside the hydraulic cylinder 19.
[0037] See Figure 6 and Figure 7 The slide block 23 slides linearly around the outer side of the guide rail 22, and the conductive block 25 is located above the connecting plate 4.
[0038] Specifically, the circuit board is placed above the connecting plate 4. The hydraulic cylinder 19 is filled with hydraulic oil, and the upper and lower ends of the hydraulic cylinder 19 are sealed by pistons. When the push rod 17 moves to one side, it squeezes the push rod 20 into the hydraulic cylinder 19. Therefore, the upper piston squeezes the hydraulic oil in the hydraulic cylinder 19, causing the hydraulic oil to release pressure downward. Then, the hydraulic oil in the hydraulic cylinder 19 releases pressure on the lower piston, pushing out the push rod 21. The push rod 21 then pushes the slide block 23 to slide linearly around the outside of the guide rail 22, causing the conductive block 25 at the lower end of the connecting rod 24 to move downward and quickly connect with the circuit board mounting point. The current is transmitted through the conductive block 25, connecting rod 24, slide block 23, guide rail 22, conductive rod 26, conductive sleeve 14 and conductive plate 16.
[0039] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.
Claims
1. A high-temperature and wear-resistant integrated circuit interconnect assembly, comprising a mounting base (1), a base plate (2) fixedly mounted on the bottom of the mounting base (1), a top cover (3) fixedly mounted on the upper end of the mounting base (1), and connecting plates (4) fixedly mounted on both sides of the mounting base (1), characterized in that: Multiple guide rods (5) are fixedly installed on the upper end of the top cover (3). Multiple pressure plates (6) are provided on the upper end of the top cover (3) and sleeved on the outside of the guide rods (5). Multiple air inlet structures (8) are fixedly installed on the upper end of the top cover (3) between two pressure plates (6). Multiple sets of through push columns (12) are movably installed on both sides of the upper end of the mounting base (1) below the pressure plates (6). A conductive sleeve (14) is fixedly installed on the lower end of the push column (12). The outer side of the conductive sleeve (14) is integrally formed. There is a sleeve (15), and a conductive plate (16) is inserted inside the sleeve (15). A push rod (17) is fixedly installed on the opposite side of each pair of push rods (12). Multiple through conductive rods (26) are fixedly installed on both sides inside the mounting base (1). A connecting structure (18) for connecting circuit boards is fixedly installed on the opposite ends of the two push rods (17) and the opposite ends of the two conductive rods (26). Two plugs (27) are integrally formed at the adjacent ends of the two conductive rods (26).
2. The high-temperature and wear-resistant integrated circuit interconnect assembly according to claim 1, characterized in that: Pull rings (7) are fixedly installed on both sides of the upper end of the pressure plate (6), and air guide grooves (29) are opened inside the pressure plate (6).
3. The high-temperature and wear-resistant integrated circuit interconnect assembly according to claim 2, characterized in that: The air intake structure (8) includes an air guide pipe (9), an air intake pipe (10) and a fan (11). The air guide pipe (9) is fixedly installed on the upper end of the top cover (3). The air intake pipe (10) is integrally formed on the top of the air guide pipe (9). The fan (11) is fixedly installed on the upper end of the air intake pipe (10).
4. The high-temperature and wear-resistant integrated circuit interconnect assembly according to claim 2, characterized in that: The pressure plate (6) moves up and down around the guide rod (5). When the pressure plate (6) is lowered, it is located between the two push columns (12) and pushes them to move to both sides. When the pressure plate (6) is lowered, it passes through the top cover (3). At the same time, the end of the air duct (9) is connected to the air duct (29).
5. The high-temperature and wear-resistant integrated circuit interconnect assembly according to claim 4, characterized in that: When the pusher (12) moves, it causes the conductive sleeve (14) to be placed on the outside of the plug (27). One end of the conductive rod (26) is located between the two plugs (27) and is cut and shaped with fins (28).
6. The high-temperature and wear-resistant integrated circuit interconnect assembly according to claim 1, characterized in that: The push rod (17) is placed above the top cover (3), and a tension spring (13) is fixedly installed between the two push rods (12).
7. The high-temperature and wear-resistant integrated circuit interconnect assembly according to claim 1, characterized in that: The connecting structure (18) includes a hydraulic cylinder (19), a push rod (20), an eject rod (21), a guide rail (22), a slide (23), a connecting rod (24), and a conductive block (25). The hydraulic cylinder (19) is fixedly installed on one side of the mounting base (1). The push rod (20) is movably installed on the upper end of the hydraulic cylinder (19). The eject rod (21) is movably installed on the lower end of the hydraulic cylinder (19). The guide rail (22) is fixedly installed on one end of the conductive rod (26). The slide (23) is slidably installed on the outside of the guide rail (22). The connecting rod (24) is fixedly installed on the lower end of the slide (23). The conductive block (25) is fixedly installed on the lower end of the connecting rod (24).
8. The high-temperature and wear-resistant integrated circuit interconnect assembly according to claim 7, characterized in that: The end of the push rod (20) is fixedly connected to the push rod (17), and the lower end of the push rod (21) is fixedly connected to the slide (23). Both the push rod (20) and the push rod (21) are fixedly connected to the piston in the hydraulic cylinder (19).
9. The high-temperature and wear-resistant integrated circuit interconnect assembly according to claim 7, characterized in that: The slide block (23) slides linearly around the outside of the guide rail (22), and the conductive block (25) is located above the connecting plate (4).