A conductive busbar and a method for manufacturing a conductive busbar

Abstract

This application provides a conductive bus and a method for preparing the conductive bus. The conductive bus includes a conductive substrate and a graphite layer. At least a portion of the outer surface of the conductive substrate is provided with a graphite layer; the graphite layer includes a deposition layer and a growth layer, with the deposition layer disposed on the outer surface of the conductive substrate and the growth layer disposed on the deposition layer. The conductive bus of this application has high conductivity and occupies little space.

Description

Technical Field

[0001] This application relates to the field of battery technology, and in particular to a conductive bus and a method for preparing the conductive bus. Background Technology

[0002] In power transmission systems, conductive busbars are key components, playing a crucial role in collecting and transmitting electrical energy. Due to inherent material limitations, conductive busbars have relatively low conductivity. In applications requiring higher current carrying capacity, technologies often increase the cross-sectional area of ​​the busbar to enhance its conductivity. However, increasing the cross-sectional area increases the weight of the conductive busbar and occupies more space, limiting the compactness and miniaturization of the device. Summary of the Invention

[0003] This application provides a conductive bus with high conductivity and small footprint, and a method for preparing the conductive bus.

[0004] The technical solution of this application embodiment is implemented as follows:

[0005] This application provides a conductive bus, including:

[0006] Conductive substrate;

[0007] A graphite layer is disposed on the outer surface of at least a portion of the conductive substrate; the graphite layer includes a deposition layer and a growth layer, the deposition layer being disposed on the outer surface of the conductive substrate, and the growth layer being disposed on the deposition layer.

[0008] In one embodiment, the conductive bus further includes a reinforcing layer, the conductive substrate includes a connecting portion and a main body segment connected to the connecting portion, at least a portion of the main body segment is provided with the graphite layer, at least a portion of the connecting portion is provided with the reinforcing layer, and the material type of the reinforcing layer is different from the material type of the conductive substrate and the material type of the graphite layer.

[0009] In one embodiment, the conductive substrate includes two connecting portions, located at opposite ends of the main body segment along its extension direction; and / or,

[0010] The connecting portion has a connecting surface, and at least one of the connecting surface and the side of the connecting portion opposite to the connecting surface is provided with the reinforcing layer.

[0011] In one embodiment, a portion of the connecting part forms a first connecting hole, and a portion of the reinforcing layer is open to form a second connecting hole, wherein the first connecting hole and the second connecting hole communicate with each other.

[0012] In one embodiment, the conductive substrate is made of T2 copper; and / or,

[0013] The reinforcing layer is made of either silver or nickel; and / or,

[0014] The thickness of the reinforcing layer is less than or equal to 0.1 mm.

[0015] In one embodiment, the thickness of the deposited layer is less than the thickness of the growth layer; and / or,

[0016] The deposition layer was formed by chemical vapor deposition; and / or,

[0017] The growth layer is formed by either high-temperature high-pressure method or redox method.

[0018] In one embodiment, the thickness of the deposited layer is less than or equal to ≤5 μm; and / or,

[0019] The thickness of the growth layer is greater than or equal to three times the thickness of the deposition layer, and less than or equal to eight times the thickness of the deposition layer.

[0020] In one embodiment, at least one end of the main body segment is bent along the extension direction to connect with the connecting portion.

[0021] A second aspect of this application provides a method for preparing a conductive bus, the method being used to prepare the conductive bus described in any one of the above claims, the method comprising the following steps:

[0022] Prepare the conductive substrate;

[0023] The deposition layer is formed by depositing the outer surface of at least a portion of the conductive substrate using chemical vapor deposition.

[0024] The growth layer is formed on the deposition layer by one of the high-temperature and high-pressure method and the redox method.

[0025] In one embodiment, the conductive bus further includes a reinforcing layer, and the conductive substrate includes a connecting portion and a main body segment connected to the connecting portion; the preparation method further includes:

[0026] The connecting portion is shielded, and the deposition layer is formed by chemical vapor deposition on the outer surface of at least a portion of the main body segment;

[0027] The reinforcing layer is provided at the connection portion.

[0028] The embodiments of this application have the following beneficial effects:

[0029] This application provides a conductive bus and a method for preparing the conductive bus. The conductive bus includes a conductive substrate and a graphite layer. At least a portion of the outer surface of the conductive substrate is provided with a graphite layer. The graphite layer includes a deposition layer and a growth layer. The deposition layer is disposed on the outer surface of the conductive substrate, and the growth layer is disposed on the deposition layer. Therefore, on the one hand, by providing a graphite layer on the conductive substrate, the conductivity and current-carrying capacity of the conductive bus is improved, reducing heat generation and energy loss caused by current flow. Furthermore, since the current-carrying capacity is improved not by increasing the cross-sectional area of ​​the conductive substrate, but by using a graphite layer, the conductivity can be significantly improved while reducing the space occupied. On the other hand, by providing a growth layer on the deposition layer, the thickness of the graphite layer can be increased, thereby further improving the conductivity and current-carrying capacity of the conductive bus. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of a conductive bus according to an embodiment of this application;

[0031] Figure 2 yes Figure 1 Exploded view of the conductive busbar;

[0032] Figure 3 yes Figure 1 A schematic diagram of the cross-section of a conductive busbar;

[0033] Figure 4 This is a flowchart of a method for preparing a conductive bus according to an embodiment of this application.

[0034] Explanation of reference numerals in the attached figures

[0035] 10. Conductive substrate; 11. Main body segment; 12. Connecting part; 20. Graphite layer; 21. Deposition layer; 22. Growth layer; 30. Reinforcing layer. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on this application. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In the following description, references are made to “some embodiments,” which describe a subset of all possible embodiments. However, it is understood that “some embodiments” may be the same subset or different subsets of all possible embodiments and may be combined with each other without conflict.

[0038] In the description of the embodiments of this application, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly defined.

[0039] Unless otherwise defined, all technical and scientific terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in the embodiments of this application is for the purpose of describing the embodiments of this application only and is not intended to limit this application.

[0040] One embodiment of this application provides a conductive bus; please refer to [link / reference]. Figure 1 , Figure 2 and Figure 3 The conductive bus includes a conductive substrate 10 and a graphite layer 20.

[0041] A graphite layer 20 is disposed on the outer surface of at least a portion of the conductive substrate 10; the graphite layer 20 includes a deposition layer 21 and a growth layer 22, the deposition layer 21 is disposed on the outer surface of the conductive substrate 10, and the growth layer 22 is disposed on the deposition layer 21.

[0042] Specifically, the conductive substrate 10 refers to the main body of the conductive bus, which provides mechanical support and basic conductive path for the conductive bus.

[0043] The type of material of the conductive substrate 10 is not limited, as long as it has the ability to conduct electricity and carry current.

[0044] For example, the conductive substrate 10 is made of T2 copper. Thus, by combining the graphite layer 20, which has a higher conductivity than copper, with the T2 copper conductive substrate 10, a composite conductive busbar with an overall conductivity higher than that of T2 copper is formed, thereby improving the conductivity and current carrying capacity of the conductive busbar.

[0045] The graphite layer 20 refers to a structural layer made of graphite that covers the surface of the conductive substrate 10.

[0046] The location of the graphite layer 20 on the conductive substrate 10 is not limited.

[0047] For example, the conductive substrate 10 is a strip structure with four planes, and the graphite layer 20 may be located on only one of the planes of the conductive substrate 10; or it may be located on two of the planes of the conductive substrate 10 (which may be two planes arranged opposite each other or two planes intersecting); or it may be located on three of the planes of the conductive substrate 10; or it may be located on all four planes of the conductive substrate 10.

[0048] It should be noted that the graphite layer 20 can be located over the entire plane of the strip-shaped conductive substrate 10. This significantly reduces the resistance of the conductive bus and improves its overall conductivity, enabling uniform and efficient current transmission. Alternatively, it can be located only over a portion of the plane of the strip-shaped conductive substrate 10. This improves the conductivity of the conductive bus while reducing the amount of graphite material used, thus lowering costs.

[0049] For example, the conductive substrate 10 has a columnar structure, and the graphite layer 20 is located on the arc-shaped outer surface of the conductive substrate 10.

[0050] It should be noted that the graphite layer 20 can be located over the entire arc-shaped outer surface of the columnar conductive substrate 10. This significantly reduces the resistance of the conductive bus and improves its overall conductivity, enabling uniform and efficient current transmission. Alternatively, it can be located only over a portion of the arc-shaped outer surface of the columnar conductive substrate 10. This improves the conductivity of the conductive bus while reducing the amount of graphite material used, thus lowering costs.

[0051] The deposition layer 21 refers to the graphene layer formed by deposition on the outer surface of the conductive substrate 10. Its specific formation method can be determined according to actual needs.

[0052] For example, the deposition layer 21 is formed by chemical vapor deposition. As a result, the deposition layer 21 can be formed well on the outer surface of the conductive substrate 10.

[0053] The thickness of the sedimentary layer 21 is unlimited.

[0054] For example, the thickness of the deposited layer 21 is less than or equal to ≤5 μm. For instance, the thickness of the deposited layer 21 is 1 μm, 2 μm, 3 μm, 4 μm, or 5 μm. Therefore, keeping the thickness of the deposited layer 21 within the above range effectively improves the overall conductivity of the conductive bus. On the other hand, it avoids the higher cost resulting from a thicker deposited layer 21.

[0055] The growth layer 22 refers to the graphite layer 20 that grows on the sedimentary layer 21, which serves as the substrate. The specific formation method can be determined according to actual needs.

[0056] For example, the growth layer 22 is formed by either a high-temperature, high-pressure method or a redox method. This allows for the effective formation of the growth layer 22 on the deposition layer 21.

[0057] The thickness of growth layer 22 is unlimited.

[0058] For example, the thickness of the growth layer 22 is greater than or equal to three times the thickness of the deposition layer 21, and less than or equal to eight times the thickness of the deposition layer 21. For instance, the thickness of the growth layer 22 is three, five, or eight times the thickness of the deposition layer 21. Therefore, maintaining the thickness of the growth layer 22 within the aforementioned range effectively improves the overall conductivity of the conductive bus and provides better protection for the deposition layer 21. Furthermore, it avoids the higher cost resulting from a thicker growth layer 22.

[0059] The conductive bus in this embodiment includes a conductive substrate 10 and a graphite layer 20. A graphite layer 20 is disposed on the outer surface of at least a portion of the conductive substrate 10. The graphite layer 20 includes a deposition layer 21 and a growth layer 22. The deposition layer 21 is disposed on the outer surface of the conductive substrate 10, and the growth layer 22 is disposed on the deposition layer 21. Therefore, on the one hand, by disposing of the graphite layer 20 on the conductive substrate, the conductivity and current-carrying capacity of the conductive bus is improved, reducing heat generation and energy loss caused by overcurrent. Furthermore, since the current-carrying capacity is improved not by increasing the cross-sectional area of ​​the conductive substrate 10, but by using the graphite layer 20, the conductivity can be significantly improved while reducing the space occupied. On the other hand, by disposing of the growth layer 22 on the deposition layer 21, the thickness of the graphite layer 20 can be increased, thereby further improving the conductivity and current-carrying capacity of the conductive bus.

[0060] In one embodiment, please refer to Figure 1 and Figure 2 The conductive bus also includes a reinforcing layer 30. The conductive substrate 10 includes a connecting portion 12 and a main body segment 11 connected to the connecting portion 12. At least a portion of the main body segment 11 is provided with a graphite layer 20, and at least a portion of the connecting portion 12 is provided with a reinforcing layer 30. The material type of the reinforcing layer 30 is different from the material type of the conductive substrate 10 and the graphite layer 20. On the one hand, by providing a reinforcing layer 30 at the connecting portion 12, and the reinforcing layer 30 being made of a different material than the conductive substrate 10 and the graphite layer 20, the performance at the connecting portion 12 can be improved according to the actual situation.

[0061] Specifically, the connection part 12 refers to the part on the conductive substrate 10 used to connect the conductive busbar to external electrical components (such as wires and electrical components).

[0062] The main body segment 11 refers to the part on the conductive substrate 10 that carries current and provides the main conductive path to realize the current transmission function.

[0063] The connecting part 12 and the main body section 11 can be integrally formed or separately formed.

[0064] The number of connecting parts 12 is unlimited.

[0065] For example, the conductive substrate 10 includes two connecting portions 12, which are located at opposite ends of the main body segment 11 along its extending direction. Thus, the connecting portions 12 at both ends of the main body segment 11 can be connected to external components, reducing the difficulty of alignment and positioning during the installation of the conductive busbar and facilitating its installation.

[0066] The reinforcing layer 30 refers to the functional layer provided on the connection part 12, which can improve the performance of the conductive bus connection part 12.

[0067] It should be noted that the graphite layer 20 may be provided in a part of the main body segment 11, or the graphite layer 20 may be provided in the entire area of ​​the main body segment 11.

[0068] It should be noted that the reinforcing layer 30 may be provided in a portion of the connection part 12. For example, when the connection part 12 is connected to an external electrical component, the reinforcing layer 30 is only provided on the side of the connection part 12 closest to the electrical component, and the connection part 12 is connected to the electrical component through the reinforcing layer 30. This improves the performance of the connection part 12 of the conductive bus while reducing material usage and lowering production costs.

[0069] Alternatively, a reinforcing layer 30 can be provided over the entire area of ​​the connecting portion 12. This would further improve the performance of the connecting portion 12.

[0070] The material type of the reinforcing layer 30 is not limited.

[0071] For example, the reinforcing layer 30 is made of either silver or nickel. This improves the corrosion resistance of the connection 12 in the environment where the conductive busbar is used.

[0072] The thickness of the reinforcing layer 30 is unlimited.

[0073] For example, the thickness of the reinforcing layer 30 is less than or equal to 0.1 mm. For instance, the thickness of the reinforcing layer 30 is 0.01 mm, 0.05 mm, or 0.1 mm. Thus, by keeping the reinforcing layer 30 within the above range, the contact conductivity of the conductive busbar connection portion 12 can be improved while reducing production costs.

[0074] The connection method between the reinforcing layer 30 and the connecting part 12 is not limited.

[0075] For example, the reinforcing layer 30 is welded to the connecting part 12.

[0076] In one embodiment, please refer to Figure 2The connecting portion 12 has a connecting surface, and at least one of the connecting surface and the side of the connecting portion 12 facing away from the connecting surface is provided with a reinforcing layer 30. This facilitates the improvement of the performance at the connecting portion 12. For example, when the reinforcing layer 30 is made of silver, it reduces the possibility of poor conductivity at the contact points between the connecting portion 12 and other components, thus improving the overall conductivity and current carrying capacity and enhancing the contact conductivity of the connecting portion 12.

[0077] Specifically, the connecting surface refers to the surface on which the connecting part 12 contacts and connects with external electrical components.

[0078] It should be noted that the reinforcing layer 30 can be provided only on the connecting surface, or only on the side of the connecting part 12 away from the connecting surface, or both the connecting surface and the side of the connecting part 12 away from the connecting surface can be provided with the reinforcing layer 30.

[0079] In one embodiment, please refer to Figure 2 A first connecting hole is formed through a portion of the connecting part 12, and a second connecting hole is formed by opening a portion of the reinforcing layer 30. The first connecting hole and the second connecting hole communicate with each other. Therefore, by providing the first and second connecting holes, the connection between the connecting part 12 and external electrical components is facilitated, ensuring the reliability of the connection.

[0080] Specifically, the first connection hole refers to a hole formed by mechanical processing (such as drilling, stamping, etc.) to penetrate a portion of the connection part 12 of the conductive busbar. It is mainly used for mechanical or electrical connection with external electrical components (such as bolts, wire terminals) to achieve a stable connection and current transmission between the conductive busbar and external equipment.

[0081] The second connecting hole refers to the hole formed by opening up the area on the reinforcing layer 30 corresponding to the first connecting hole.

[0082] External electrical components pass through the first connection hole and the second connection hole respectively to connect with the connection part 12.

[0083] The shape and size of the first and second connecting holes are not limited, as long as they allow external electrical components to pass through and connect the connecting part 12 to the external electrical components.

[0084] In one embodiment, please refer to Figure 3 The thickness of the deposition layer 21 is less than the thickness of the growth layer 22.

[0085] Specifically, the deposition layer 21 is formed by deposition (such as chemical vapor deposition), which is relatively expensive. The growth layer 22, on the other hand, is formed by growth on the deposition layer 21 (such as by high-pressure chromatography or redox methods), which is less expensive. Therefore, by placing the growth layer 22 on the deposition layer 21, and ensuring that the thickness of the deposition layer 21 is less than the thickness of the growth layer 22, the overall thickness of the graphite layer 20 can be increased, thereby significantly improving the overall conductivity of the busbar. Furthermore, it can also reduce the production cost of the graphite layer 20.

[0086] In one embodiment, please refer to Figure 1 and Figure 2 At least one end of the main body segment 11 is bent along the extension direction to connect with the connecting portion 12. This bent design of the main body segment 11 allows the conductive busbar to adapt to complex internal spaces of equipment, improving the compactness of the structure.

[0087] Specifically, the bending direction of the main body segment 11 is not limited.

[0088] For example, the main body segment 11 can be bent along the thickness direction, or the main body segment 11 can be bent along the width direction, with the width direction and the thickness direction being perpendicular.

[0089] The angle of the bend in the main body section 11 is unlimited.

[0090] For example, the bending angle of the main body segment 11 can be acute, right, or obtuse. Therefore, different bending angles can meet different installation space and connection requirements.

[0091] It should be noted that the connection between the main body segment 11 and the connecting part 12 can be achieved through a single bend. Alternatively, the main body segment 11 can be bent multiple times to connect with the connecting part 12.

[0092] The second embodiment of this application provides a method for preparing a conductive bus. This method is used to prepare the conductive bus of any embodiment. Please refer to [link to relevant documentation]. Figure 4 The preparation method includes the following steps:

[0093] Step S1: Prepare conductive substrate 10.

[0094] Step S2: A deposition layer 21 is formed on the outer surface of at least a portion of the conductive substrate 10 by chemical vapor deposition.

[0095] Step S3: Form a growth layer 22 on the deposition layer 21 by one of the high temperature and high pressure method and the redox method.

[0096] Specifically, based on the requirements for conductivity and spatial layout in actual application scenarios, the dimensions of the conductive bus, the bending direction of the conductive substrate 10, the bending angle of the conductive substrate 10, and the number of bends in the conductive substrate 10 are determined. The conductive substrate 10 is then prepared using corresponding metal processing techniques to meet specific morphological and installation requirements. A deposition layer 21 is formed on the outer surface of the conductive substrate 10 using chemical vapor deposition, providing an adhesion base for the subsequent growth layer 22. Using the deposition layer 21 as a substrate, a growth layer 22 is formed on the deposition layer 21 using either a high-temperature, high-pressure method or a redox method. This layered preparation method increases the overall thickness of the graphite layer 20 while saving production costs, thereby improving the conductivity and current carrying capacity of the conductive bus and reducing heat generation and energy loss caused by overcurrent. Therefore, the conductive bus prepared using this method is suitable for super-fast charging battery systems or other locations and applications with high conductivity and current carrying requirements.

[0097] In one embodiment, the conductive bus further includes a reinforcing layer 30, and the conductive substrate 10 includes a connecting portion 12 and a main body segment 11 connected to the connecting portion 12; the preparation method further includes:

[0098] Step S1: Block the connecting part 12, and deposit a deposition layer 21 on the outer surface of at least a portion of the main body section 11 by chemical vapor deposition.

[0099] Step S2: Provide a reinforcing layer 30 on the connecting part 12.

[0100] It should be noted that step S2 can be after step S1. Depending on the actual situation, step S2 can also be before step S1.

[0101] Because the graphite layer 20 has poor mechanical properties, it is not conducive to the connection and installation of the conductive bus connection 12 with external electrical equipment. Therefore, by shielding the connection 12 before depositing the deposition layer 21 on the outer surface of at least a portion of the main body section 11 using chemical vapor deposition, the formation of the deposition layer 21 at the connection between the connection 12 and the reinforcing layer 30 can be avoided. This reduces the risk of insufficient connection strength between the reinforcing layer 30 and the connection 12, which could lead to the reinforcing layer 30 detaching. At the same time, it facilitates the connection and installation of the conductive bus connection 12 with external electrical equipment.

Claims

1. A conductive bus, characterized in that, include: Conductive substrate; A graphite layer is disposed on the outer surface of at least a portion of the conductive substrate; the graphite layer includes a deposition layer and a growth layer, the deposition layer being disposed on the outer surface of the conductive substrate, and the growth layer being disposed on the deposition layer.

2. The conductive bus according to claim 1, characterized in that, The conductive bus also includes a reinforcing layer. The conductive substrate includes a connecting portion and a main body segment connected to the connecting portion. At least a portion of the main body segment is provided with the graphite layer. At least a portion of the connecting portion is provided with the reinforcing layer. The material type of the reinforcing layer is different from the material type of the conductive substrate and the material type of the graphite layer.

3. The conductive bus according to claim 2, characterized in that, The conductive substrate includes two connecting portions, located at opposite ends of the main body segment along its extension direction; and / or, The connecting portion has a connecting surface, and at least one of the connecting surface and the side of the connecting portion opposite to the connecting surface is provided with the reinforcing layer.

4. The conductive bus according to claim 2 or 3, characterized in that, A portion of the connecting part extends through to form a first connecting hole, and a portion of the reinforcing layer is open to form a second connecting hole. The first connecting hole and the second connecting hole are connected.

5. The conductive bus according to any one of claims 2-4, characterized in that, The conductive substrate is made of T2 copper; and / or, The reinforcing layer is made of either silver or nickel; and / or, The thickness of the reinforcing layer is less than or equal to 0.1 mm.

6. The conductive bus according to any one of claims 1-5, characterized in that, The thickness of the deposited layer is less than the thickness of the growth layer; and / or, The deposition layer was formed by chemical vapor deposition; and / or, The growth layer is formed by either high-temperature high-pressure method or redox method.

7. The conductive bus according to any one of claims 1-6, characterized in that, The thickness of the deposited layer is less than or equal to ≤5 μm; and / or, The thickness of the growth layer is greater than or equal to three times the thickness of the deposition layer, and less than or equal to eight times the thickness of the deposition layer.

8. The conductive bus according to any one of claims 2-5, characterized in that, The main body segment is bent at least one end along the extension direction to connect with the connecting portion.

9. A method for preparing a conductive bus, characterized in that, The preparation method is used to prepare the conductive bus according to any one of claims 1-8, and the preparation method includes the following steps: Prepare the conductive substrate; The deposition layer is formed by depositing the outer surface of at least a portion of the conductive substrate using chemical vapor deposition. The growth layer is formed on the deposition layer by one of the high-temperature and high-pressure method and the redox method.

10. The method for preparing a conductive bus according to claim 9, characterized in that, The conductive bus further includes a reinforcing layer, and the conductive substrate includes a connecting portion and a main body segment connected to the connecting portion; the preparation method further includes: The connecting portion is shielded, and the deposition layer is formed by chemical vapor deposition on the outer surface of at least a portion of the main body segment; The reinforcing layer is provided at the connection portion.

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