A power module, motor controller, electric drive system and vehicle

Abstract

This invention discloses a power module, a motor controller, an electric drive system, and a vehicle. The power module includes at least one power unit; at least two DC transmission structures connected to the power unit; the current directions of the at least two DC transmission structures are opposite; and the at least two DC transmission structures are arranged in different layers. The technical solution provided in this embodiment, by spatially overlapping at least two DC transmission structures with opposite current directions, can form opposite magnetic fields, thereby canceling out parasitic capacitances, reducing the parasitic inductance of the power module, improving switching efficiency, and reducing switching losses.

Description

[0001] Cross-references and priority statements

[0002] This patent application claims priority to application No. 2025104449639, filed on April 9, 2025, entitled "A power module, an electric drive system and a vehicle", the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the present invention relate to the field of power device technology, and in particular to a power module, a motor controller, an electric drive system, and a vehicle. Background Technology

[0004] With the development of chip technology, the requirements for power modules are becoming increasingly stringent. Existing power modules are generally packaged in HPD or plastic packages, with each HPD or plastic-packaged module having a parasitic inductance between 4nH and 10nH. The large parasitic inductance of existing power modules leads to high switching losses. Summary of the Invention

[0005] This invention provides a power module, a motor controller, an electric drive system, and a vehicle to solve the problem that existing power modules have large parasitic inductance, resulting in high switching losses.

[0006] To address the aforementioned technical problems, the present invention adopts the following technical solution:

[0007] According to a first aspect of the present invention, this embodiment provides a power module, comprising:

[0008] At least one power unit;

[0009] At least two DC transmission structures are connected to the power unit; the current directions of the at least two DC transmission structures are opposite.

[0010] At least two of the aforementioned DC transmission structures are arranged in different layers.

[0011] Optionally, along the thickness direction of the power module, the projections of at least two of the DC transmission structures at least partially overlap.

[0012] Optionally, the at least two of the DC transmission structures include:

[0013] The first power trace is connected to the power unit and the negative terminal of the power supply.

[0014] The second power trace is connected to the power unit and the positive terminal of the power supply.

[0015] The current direction of the first power trace is opposite to the current direction of the second power trace, and the first power trace and the second power trace are disposed on different layers.

[0016] Along the thickness direction of the power module, the projections of the first power trace and the second power trace at least partially overlap.

[0017] Optionally, the power module further includes:

[0018] At least two conductive layers, at least a portion of the conductive layers forming the DC transmission structure;

[0019] The power unit is disposed between the two conductive layers.

[0020] Optionally, the power module further includes:

[0021] A second conductive layer, a portion of which forms the first power trace of the DC transmission structure;

[0022] A fifth conductive layer is disposed on one side of the second conductive layer, and a portion of the fifth conductive layer forms the second power trace of the DC transmission structure;

[0023] The at least one power unit is disposed in the region between the second conductive layer and the fifth conductive layer.

[0024] Optionally, the power module further includes:

[0025] A third conductive layer and a fourth conductive layer are disposed between the second conductive layer and the fifth conductive layer;

[0026] The third conductive layer includes a first through-hole disposed along the thickness direction of the power module, and the fourth conductive layer includes a second through-hole disposed along the thickness direction of the power module. The first through-hole and the second through-hole are at least partially disposed opposite each other, and at least a portion of at least one of the power units is disposed in the space between the first through-hole and the second through-hole.

[0027] Optionally, the power module includes a first side and a second side extending along a first direction, and a third side and a fourth side extending along a second direction; the first direction and the second direction intersect; the first side and the second side are arranged opposite to each other, the third side and the fourth side are arranged opposite to each other, and the third side and the fourth side are connected between the first side and the second side;

[0028] The power module further includes a middle region disposed between the first side and the second side; the middle region includes a first middle region near the first side and a second middle region near the second side; the first middle region and the second middle region are arranged along the second direction.

[0029] The power unit is located in the intermediate region; the first power trace is disposed in the first intermediate region of the second conductive layer, and at least a portion of the second power trace is disposed in the second intermediate region of the fifth conductive layer.

[0030] Optionally, the power module further includes:

[0031] At least one T-copper block and at least one T+copper block, wherein the T-copper block is connected to the first power trace and the T+copper block is connected to the second power trace;

[0032] At least one of the T+ copper blocks and / or at least one of the T- copper blocks are disposed in the space between the third through hole of the third conductive layer and the fourth through hole of the fourth conductive layer;

[0033] The third conductive layer includes a third through-hole disposed along the thickness direction of the power module, and the fourth conductive layer includes a fourth through-hole disposed along the thickness direction of the power module. The third through-hole and the fourth through-hole are at least partially disposed opposite to each other.

[0034] Optionally, the power module further includes:

[0035] A first edge region, the first edge region being located on the first edge; the first edge region includes a first sub-edge region, a second sub-edge region, and a third sub-edge region sequentially arranged along the first direction;

[0036] The T-copper block is disposed in the second sub-edge region;

[0037] The number of the at least one T+ copper block is two, and the two T+ copper blocks are respectively disposed in the first sub-edge region and the third sub-edge region.

[0038] Optionally, the power unit includes:

[0039] The lower bridge power unit and the upper bridge power unit are provided. The first end of the lower bridge power unit is connected to the first power trace, the second end of the lower bridge power unit is connected to the first end of the upper bridge power unit, and the second end of the upper bridge power unit is connected to the second power trace.

[0040] The lower bridge power unit is disposed in the first intermediate region; the upper bridge power unit is disposed in the second intermediate region.

[0041] Optionally, the lower bridge power unit includes at least one first power device, and the upper bridge power unit includes at least one second power device;

[0042] Along the thickness direction of the power module, the projection of at least one of the first power devices at least partially overlaps with the projection of the first power trace; and / or,

[0043] Along the thickness direction of the power module, the projection of at least one of the second power devices at least partially overlaps with the projection of the second power trace; and / or,

[0044] The at least one first power device is arranged along the first direction, and the at least one second power device is arranged along the first direction.

[0045] Optionally, the power module further includes:

[0046] At least one AC transmission structure is electrically connected to the output terminal of the power module.

[0047] Optionally, the power module further includes a phase copper block, the AC transmission structure being connected to the phase copper block, the phase copper block being disposed in the space between the fifth through-hole of the third conductive layer and the sixth through-hole of the fourth conductive layer, wherein the third conductive layer includes a fifth through-hole disposed along the thickness direction of the power module, the fourth conductive layer includes a sixth through-hole disposed along the thickness direction of the power module, and the fifth through-hole and the sixth through-hole are at least partially opposite to each other; and / or,

[0048] The power module further includes a second edge region located on the second side; the phase copper block is located in the second edge region.

[0049] Optionally, the AC transmission structure includes a first AC transmission structure and a second AC transmission structure, at least a portion of the second conductive layer forms the first AC transmission structure, at least a portion of the fifth conductive layer forms the second AC transmission structure, and both the first AC transmission structure and the second AC transmission structure are electrically connected to the output terminal of the power module.

[0050] Optionally, along the thickness direction of the power module, the projection of the first AC transmission structure at least partially overlaps with the projection of the upper bridge power unit; and / or,

[0051] Along the thickness direction of the power module, the projection of the second AC transmission structure at least partially overlaps with the projection of the lower bridge power unit; and / or,

[0052] The first AC transmission structure is located in the second intermediate region; and / or,

[0053] The second AC transmission structure is located in the first intermediate region.

[0054] Optionally, the second power trace includes:

[0055] At least one T+ power link portion, wherein at least a portion of the fifth conductive layer forms the at least one T+ power link portion, and the T+ power link portion is connected to the at least one T+ copper block;

[0056] Along the thickness direction of the power module, the projection of the T+ power link portion at least partially overlaps with the projection of the first power trace.

[0057] Optionally, the second power trace may also include a body portion;

[0058] The at least one T+ power link portion includes: a first T+ power link portion and a second T+ power link portion, and at least a portion of the fifth conductive layer forms the first T+ power link portion, the second T+ power link portion and the body portion, wherein the first T+ power link portion is connected to the body portion, the second T+ power link portion and the at least one T+ copper block.

[0059] Along the thickness direction of the power module, the orthographic projection of the first T+ power link portion at least partially overlaps with the projection of the first power trace; and / or,

[0060] Along the thickness direction of the power module, the orthographic projection of the second T+ power link portion at least partially overlaps with the projection of the first power trace; and / or,

[0061] Along the thickness direction of the power module, the projection of the main body overlaps at least partially with the projection of the upper bridge power unit.

[0062] Optionally, the power module further includes a third edge region and a fourth edge region, wherein the third edge region is disposed adjacent to the third side and the fourth edge region is disposed adjacent to the fourth side;

[0063] At least a portion of the first T+ power link is located in the third edge region, and at least a portion of the second T+ power link is located in the fourth edge region.

[0064] Optionally, the first power trace is connected to the source of the lower bridge power unit via a via; and / or,

[0065] The second power trace is connected to the drain of the upper bridge power unit via a via; and / or,

[0066] The first AC transmission structure is connected to the source of the upper bridge power unit via a via; and / or,

[0067] The second AC transmission structure is connected to the drain of the lower bridge power unit via a via; and / or,

[0068] The first AC transmission structure and the second AC transmission structure are connected by vias.

[0069] Optionally, the power module further includes at least one capacitor and a first conductive layer, wherein the first conductive layer is disposed on the side of the second conductive layer away from the fifth conductive layer, the capacitor is disposed on the first conductive layer, and the capacitor is connected in parallel with at least one of the power units through a laser aperture.

[0070] Optionally, the power module further includes:

[0071] A sixth conductive layer is disposed on the side of the fifth conductive layer away from the second conductive layer. The sixth conductive layer is used to connect a heat dissipation device.

[0072] According to a second aspect of the present invention, this embodiment provides a motor controller, including the power module described in any of the first aspects.

[0073] According to a third aspect of the present invention, this embodiment provides an electric drive system, including the power module described in any of the first aspects; and / or the motor controller described in the second aspect.

[0074] According to a fourth aspect of the present invention, this embodiment provides a vehicle including the power module described in any of the first aspects, and / or the motor controller described in the second aspect, and / or the electric drive system described in the third aspect.

[0075] The power module provided in this embodiment has at least two DC transmission structures connected to the power unit arranged in different layers. Since the current directions of the at least two DC transmission structures connected to the power unit are opposite, the magnetic fields generated by the current flowing through the at least two DC transmission structures connected to the power unit are opposite, thereby effectively canceling the parasitic inductance generated by the at least two DC transmission structures connected to the power unit, thereby reducing the parasitic inductance of the power module, improving the switching efficiency of the power module, and reducing the switching loss of the power module.

[0076] The following are the previously applied proposals:

[0077] This invention provides a power module, comprising:

[0078] At least two conductive layers;

[0079] The power unit is disposed between two conductive layers;

[0080] The first power trace and the second power trace are connected to the power unit. The direction of the current flowing through the first power trace is opposite to the direction of the current flowing through the second power trace. The first power trace and the second power trace are arranged in different layers.

[0081] The first power trace and the second power trace have at least partial overlap in their orthogonal projections on the same conductive layer.

[0082] Optional, the power module includes:

[0083] First conductive layer;

[0084] The second conductive layer is disposed on one side of the first conductive layer;

[0085] The third conductive layer is disposed on the side of the second conductive layer away from the first conductive layer;

[0086] The fourth conductive layer is disposed on the side of the third conductive layer away from the first conductive layer;

[0087] The fifth conductive layer is disposed on the side of the fourth conductive layer away from the first conductive layer;

[0088] The power unit is disposed on the third conductive layer and the fourth conductive layer;

[0089] The first power trace is disposed on the second conductive layer, and the second power trace is disposed on the fifth conductive layer;

[0090] The orthographic projection of the first power trace on the first conductive layer and the orthographic projection of the second power trace on the first conductive layer at least partially overlap.

[0091] Optionally, the power module includes a first side and a second side extending along a first direction, and a third side and a fourth side extending along a second direction; the first direction and the second direction intersect; the first side and the second side are arranged opposite to each other, the third side and the fourth side are arranged opposite to each other, and the third side and the fourth side are connected between the first side and the second side;

[0092] The power module also includes a middle region disposed between the first side and the second side; the middle region includes a first middle region near the first side and a second middle region near the second side; the first middle region and the second middle region are arranged along a second direction;

[0093] The power unit is located in the middle region between the third and fourth conductive layers; the first power trace is located in the first middle region of the second conductive layer, and the second power trace is located in the second middle region of the fifth conductive layer.

[0094] Optionally, the power module also includes a T-copper block and two T+copper blocks, which are disposed on the third conductive layer and the fourth conductive layer.

[0095] The power module also includes a first edge region located on a first side; the first edge region includes a first sub-edge region, a second sub-edge region, and a third sub-edge region arranged sequentially along a first direction;

[0096] The T-copper block is placed in the second sub-edge region, and the two T+copper blocks are placed in the first and third sub-edge regions respectively.

[0097] The T- copper block is connected to the first power trace, and the T+ copper block is connected to the second power trace.

[0098] Optionally, the power unit includes a first bridge arm and a second bridge arm, a first end of the first bridge arm is connected to a first power trace, a second end of the first bridge arm is connected to the first end of the second bridge arm at a neutral point, and a second end of the second bridge arm is connected to a second power trace.

[0099] The first bridge arm is disposed in the first intermediate region between the third conductive layer and the fourth conductive layer; the second bridge arm is disposed in the second intermediate region between the third conductive layer and the fourth conductive layer.

[0100] Optionally, the first bridge arm includes at least one first power device, and the second bridge arm includes at least one second power device;

[0101] The first power device is arranged along the first direction, and the second power device is arranged along the first direction.

[0102] Optionally, the power module also includes phase traces, which are disposed on the second conductive layer and the fifth conductive layer;

[0103] The power module also includes a phase copper block, with the phase traces connected to the phase copper block at the neutral point. The phase copper block is disposed on the third conductive layer and the fourth conductive layer. The power module also includes a second edge region, which is located on the second side. The phase copper block is located in the second edge region.

[0104] Optionally, the phase trace includes a first phase trace and a second phase trace, wherein the first phase trace is located in the second intermediate region of the second conductive layer and the second phase trace is located in the first intermediate region of the fifth conductive layer.

[0105] The first phase trace is connected between the first bridge arm and the phase copper block, and the second phase trace is connected between the phase copper block and the second bridge arm.

[0106] Optionally, the power module may also include:

[0107] Both the first T+ power link section and the second T+ power link section are disposed on the fifth conductive layer;

[0108] The power module also includes a third edge region and a fourth edge region, with the third edge region located on the third side and the fourth edge region located on the fourth side;

[0109] At least a portion of the first T+ power link is located in the third edge region, and at least a portion of the second T+ power link is located in the fourth edge region;

[0110] The first T+ power link unit is connected to the second T+ power link unit through the second power trace located in the second intermediate region to form a T+ network;

[0111] The T+ network is connected to the drain of the second bridge arm via a via.

[0112] Optionally, the power module also includes at least one capacitor located in the first conductive layer, which is connected in parallel with the power unit through a laser aperture.

[0113] Optionally, the power module may also include:

[0114] The sixth conductive layer is located on the side of the fifth conductive layer away from the first conductive layer. The sixth conductive layer is used to connect to external circuits. The sixth conductive layer is connected to the phase copper block, the T- copper block and the two T+ copper blocks through vias.

[0115] Optionally, the power module may also include:

[0116] Interlayer insulation layer: The interlayer insulation layer is disposed between adjacent conductive layers on both sides, and the interlayer insulation layer serves as insulation.

[0117] According to another aspect of the present invention, this embodiment provides an electric drive system including the power module proposed in any of the first aspects.

[0118] According to another aspect of the present invention, this embodiment provides a vehicle including a power module as proposed in any of the first aspects, or including an electric drive system as proposed in any of the second aspects.

[0119] The power module provided in this embodiment of the invention, by placing the power unit between two conductive layers and setting the first power trace and the second power trace connected to the power unit in different layers, makes the direction of the current flowing through the first power trace opposite to the direction of the current flowing through the second power trace. The orthogonal projections of the first power trace and the second power trace on the same conductive layer at least partially overlap, so that the magnetic field generated by the current flowing through the first power trace is opposite to the direction of the magnetic field generated by the current flowing through the second power trace. This effectively cancels out the parasitic inductance generated by the first power trace and the parasitic inductance generated by the second power trace, thereby reducing the parasitic inductance of the power module, improving the switching efficiency of the power module, and reducing the switching loss of the power module.

[0120] Note: The noun correspondence between later and earlier applications is as follows:

[0121] The lower bridge power unit corresponds to the first bridge arm. The upper bridge power unit corresponds to the second bridge arm. The phase routing corresponds to the AC transmission structure. The first AC transmission structure corresponds to the first phase routing. The second AC transmission structure corresponds to the second phase routing. Attached Figure Description

[0122] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments of the present invention will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of the present invention and these drawings without creative effort.

[0123] Figure 1 This is a schematic diagram of the structure of a power module provided in an embodiment of the present invention;

[0124] Figure 2 This is a cross-sectional schematic diagram of a power module provided in an embodiment of the present invention;

[0125] Figure 3 This is a cross-sectional schematic diagram of another power module provided in an embodiment of the present invention;

[0126] Figure 4 This is a circuit schematic diagram of a power module provided in an embodiment of the present invention;

[0127] Figure 5 This is a schematic diagram of the structure of the second conductive layer of a power module provided in an embodiment of the present invention;

[0128] Figure 6 This is a schematic diagram of the structure of the third conductive layer of a power module provided in an embodiment of the present invention;

[0129] Figure 7 This is a schematic diagram of the structure of the fourth conductive layer of a power module provided in an embodiment of the present invention;

[0130] Figure 8 This is a schematic diagram of the structure of the fifth conductive layer of a power module provided in an embodiment of the present invention;

[0131] Figure 9 This is a schematic diagram of the structure of the sixth conductive layer of a power module provided in an embodiment of the present invention. Detailed Implementation

[0132] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0133] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0134] Based on the above-mentioned technical problems, this embodiment proposes the following solutions:

[0135] Figure 1 This is a schematic diagram of the structure of a power module provided in an embodiment of the present invention. Figure 2 This is a cross-sectional schematic diagram of a power module provided in an embodiment of the present invention. Combined with... Figure 1 and Figure 2 The power module 100 provided in this embodiment of the invention includes at least one power unit 1; at least two DC transmission structures connected to the power unit 1; the current directions of the at least two DC transmission structures are opposite; and the at least two DC transmission structures are arranged in different layers.

[0136] Specifically, the power module 100 achieves AC / DC conversion and voltage boosting / pull-down functions through internal circuitry. For example, the IGBT module achieves efficient switching characteristics through gate control. The power module 100 can amplify the input signal and output high current or high voltage to drive high-power devices. The power module 100 can incorporate overcurrent, overtemperature, and short-circuit protection circuits, significantly improving the system reliability of the power module. The power module 100 includes a power unit 1. The power unit 1 includes power devices.

[0137] Power unit 1 is connected to the positive and negative terminals of the power supply via at least two DC transmission structures. Since power unit 1 may include a lower-bridge power unit and an upper-bridge power unit, for example, the lower-bridge power unit may be a lower-bridge switching circuit and the upper-bridge power unit may be an upper-bridge switching circuit. By configuring at least two of the DC transmission structures with opposite current directions and dissimilar layers, the two DC transmission structures located on different conductive layers of the power module's circuit board generate opposing magnetic fields in space. This causes the parasitic inductance of the first power trace 2 and the second power trace 3 to cancel each other out, thereby reducing the parasitic inductance of the power module.

[0138] The power module provided in this embodiment has at least two DC transmission structures connected to power unit 1 arranged in different layers. Since the current directions of the at least two DC transmission structures connected to power unit 1 are opposite, the magnetic fields generated by the current flowing through the at least two DC transmission structures connected to power unit 1 are opposite, thereby effectively canceling the parasitic inductance generated by the at least two DC transmission structures connected to power unit 1, thereby reducing the parasitic inductance of the power module, improving the switching efficiency of the power module, and reducing the switching loss of the power module.

[0139] Optionally, based on the above embodiments, combined with Figure 1 and Figure 2 Along the thickness direction of the power module 100, the projections of at least two of the DC transmission structures at least partially overlap.

[0140] Specifically, this configuration ensures that the current flowing through at least two DC transmission structures connected to power unit 1 is in the opposite direction, and the projections of the at least two DC transmission structures connected to power unit 1 along the thickness direction of the power module at least partially overlap. This results in the magnetic field generated by the current flowing through the at least two DC transmission structures connected to power unit 1 being in the opposite direction to the magnetic field generated by the current flowing through the second power trace 3. Consequently, the parasitic inductance generated by the first power trace 2 and the parasitic inductance generated by the second power trace 3 are effectively canceled out, effectively reducing the parasitic inductance of the power module, further improving the switching efficiency of the power module, and further reducing the switching losses of the power module.

[0141] Optionally, based on the above embodiments, combined with Figure 1 and Figure 2The at least two DC transmission structures include: a first power trace 2, connected to the power unit 1 and the negative terminal of the power supply; a second power trace 3, connected to the power unit 1 and the positive terminal of the power supply; the current direction of the first power trace 2 is opposite to the current direction of the second power trace 3, and the first power trace 2 and the second power trace 3 are disposed in different layers; along the thickness direction of the power module 100, the projections of the first power trace 2 and the second power trace 3 at least partially overlap.

[0142] Specifically, the first power trace 2 and the second power trace 3 connected to the power unit 1 are arranged in different layers, such that the direction of the current flowing through the first power trace 2 is opposite to the direction of the current flowing through the second power trace 3. The orthogonal projections of the first power trace 2 and the second power trace 3 on the same conductive layer at least partially overlap, so that the magnetic field generated by the current flowing through the first power trace 2 is opposite to the direction of the magnetic field generated by the current flowing through the second power trace 3. This further reduces the parasitic inductance generated by the first power trace 2 and the second power trace 3, further reduces the parasitic inductance of the power module, further improves the switching efficiency of the power module, and effectively reduces the switching loss of the power module.

[0143] Optionally, based on the above embodiments, combined with Figure 1 and Figure 2 The power module 100 further includes: at least two conductive layers, at least a portion of which form the DC transmission structure; and a power unit 1 disposed between the two conductive layers.

[0144] Specifically, the power unit 1 is disposed between the two conductive layers of the power module, so that the power unit 1 is embedded inside the circuit board of the power module, making the connection line between the power unit and the DC transmission structure shorter, effectively shortening the length of the DC current flow path of the power module, thereby effectively reducing the parasitic inductance of the power module.

[0145] An optional implementation method, combined with Figure 1 and Figure 2 The power module 100 provided in this embodiment of the invention includes at least two conductive layers; a power unit 1 disposed between the two conductive layers; a first power trace 2 and a second power trace 3 connected to the power unit 1, wherein the direction of the current flowing through the first power trace 2 is opposite to the direction of the current flowing through the second power trace 3; the first power trace 2 and the second power trace 3 are disposed in different layers; the orthographic projections of the first power trace 2 and the second power trace 3 on the same conductive layer at least partially overlap.

[0146] Specifically, power unit 1 is disposed between the two conductive layers of the power module, so that power unit 1 is embedded inside the circuit board of the power module, thereby shortening the length of the connection line of the power module and reducing the parasitic inductance of the power module.

[0147] Power unit 1 is connected to the positive and negative terminals of the battery via a first power trace 2 and a second power trace 3, respectively. Since power unit 1 includes a lower-bridge power unit 11 and an upper-bridge power unit 12 (for example, the lower-bridge power unit 11 can be a lower bridge arm, and the upper-bridge power unit 12 can be an upper bridge arm), the first power trace 2 and the second power trace 3 are configured to at least partially overlap in the orthogonal projections on the same conductive layer. The direction of the current flowing through the first power trace 2 is opposite to the direction of the current flowing through the second power trace 3, causing the first power trace 2 and the second power trace 3, located on different conductive layers, to at least partially overlap in space. This allows the magnetic field generated by the first power trace 2 to be opposite in direction to the magnetic field generated by the second power trace 3, thereby canceling out the parasitic inductance of the first power trace 2 and the second power trace 3, thus reducing the parasitic inductance of the power module.

[0148] For example, the parasitic inductance of the power module provided in this embodiment is less than 1nH, which is significantly lower than the parasitic inductance of existing power modules.

[0149] The power module provided in this embodiment, by placing the power unit 1 between two conductive layers and setting the first power trace 2 and the second power trace 3 connected to the power unit 1 in different layers, ensures that the direction of the current flowing through the first power trace 2 is opposite to the direction of the current flowing through the second power trace 3. The orthogonal projections of the first power trace 2 and the second power trace 3 on the same conductive layer at least partially overlap, so that the magnetic field generated by the current flowing through the first power trace 2 is opposite to the direction of the magnetic field generated by the current flowing through the second power trace 3. This effectively cancels out the parasitic inductance generated by the first power trace 2 and the parasitic inductance generated by the second power trace 3, thereby reducing the parasitic inductance of the power module, improving the switching efficiency of the power module, and reducing the switching losses of the power module.

[0150] Optional, Figure 3 This is a cross-sectional schematic diagram of another power module provided in an embodiment of the present invention. Figure 4 This is a circuit schematic diagram of a power module provided in an embodiment of the present invention. Based on the above embodiments, and combined with... Figure 3 and Figure 4The power module further includes: a second conductive layer M2, a portion of which forms a first power trace 2 of the DC transmission structure; a fifth conductive layer M5 disposed on one side of the second conductive layer M2, a portion of which forms a second power trace 3 of the DC transmission structure; and at least one power unit 1 disposed in the region between the second conductive layer M2 and the fifth conductive layer M5.

[0151] Specifically, at least one power unit 1 is disposed in the area between the second conductive layer M2 and the fifth conductive layer M5, so that the power unit 1 is embedded inside the circuit board of the power module, and the power unit can be connected to the DC transmission structure of the second conductive layer M2 and the fifth conductive layer M5 nearby, for example, by means of laser micro-holes or other methods through via holes, effectively shortening the length of the DC current flow path of the power module, thereby effectively reducing the parasitic inductance of the power module.

[0152] Optionally, based on the above embodiments, combined with Figure 3 and Figure 4 The power module may further include: a third conductive layer M3 and a fourth conductive layer M4, wherein the third conductive layer M3 and the fourth conductive layer M4 are disposed between the second conductive layer M2 and the fifth conductive layer M5; the third conductive layer M3 includes a first through hole disposed along the thickness direction of the power module 100, and the fourth conductive layer M4 includes a second through hole disposed along the thickness direction of the power module 100, wherein the first through hole and the second through hole are at least partially disposed opposite to each other, and at least a portion of at least one power unit 1 is disposed in the space between the first through hole and the second through hole.

[0153] Specifically, at least a portion of at least one power unit is disposed in the space between the first and second through-holes. This arrangement facilitates embedding the power unit into the multilayer circuit board of the power module, reducing the size of the power module. A third conductive layer M3 and a fourth conductive layer M4 are disposed between the second conductive layer M2 and the fifth conductive layer M5, such that the second conductive layer M2, which at least partially forms the first power trace 2, and the fifth conductive layer M5, which at least partially forms the second power trace 3, are located on opposite sides of the power unit 1. This arrangement facilitates ensuring that the projections of the first power trace 2 and the second power trace 3 along the thickness direction of the power module 100 at least partially overlap. Since the direction of the current flowing through the first power trace 2 is opposite to the direction of the current flowing through the second power trace 3, the magnetic field generated by the current flowing through the first power trace 2 is opposite to the direction of the magnetic field generated by the current flowing through the second power trace 3. Thus, the parasitic inductance generated by the first power trace 2 and the parasitic inductance generated by the second power trace 3 are effectively canceled out, thereby reducing the parasitic inductance of the power module 100, improving the switching efficiency of the power module 100, and thus reducing the switching loss of the power module 100.

[0154] An optional implementation method, combined with Figure 2 and Figure 3 The power module may include: a first conductive layer M1; a second conductive layer M2 disposed on one side of the first conductive layer M1; a third conductive layer M3 disposed on the side of the second conductive layer M2 away from the first conductive layer M1; a fourth conductive layer M4 disposed on the side of the third conductive layer M3 away from the first conductive layer M1; a fifth conductive layer M5 disposed on the side of the fourth conductive layer M4 away from the first conductive layer M1; a power unit 1 disposed on the third conductive layer M3 and the fourth conductive layer M4; a first power trace 2 disposed on the second conductive layer M2; and a second power trace 3 disposed on the fifth conductive layer M5; the orthographic projection of the first power trace 2 on the first conductive layer M1 and the orthographic projection of the second power trace 3 on the first conductive layer M1 at least partially overlap.

[0155] Specifically, the first conductive layer M1 can house the gate traces and related protection circuits of the power unit 1. The first power trace 2 is disposed on the second conductive layer M2. The first surface of the power unit 1 is located on the third conductive layer M3, and the second surface of the power unit 1 is located on the fourth conductive layer M4. Since the third conductive layer M3 and the fourth conductive layer M4 are located in the middle conductive layers of the power module, the power unit 1 is embedded inside the circuit board of the power module, which can effectively reduce the length of the first power trace 2 and the second power trace 3, thereby reducing the parasitic inductance of the first power trace 2 and the second power trace 3.

[0156] The second power trace 3 is disposed on the fifth conductive layer M5. The orthographic projection of the first power trace 2 onto the first conductive layer M1 and the orthographic projection of the second power trace 3 onto the first conductive layer M1 at least partially overlap, such that the first power trace 2 and the second power trace 3 at least partially overlap in space. Since the current flowing through the first power trace 2 and the second power trace 3 flows in opposite directions, this arrangement causes the magnetic field generated by the current flowing through the first power trace 2 to be opposite to the magnetic field generated by the current flowing through the second power trace 3. This causes the parasitic inductance of the first power trace 2 and the parasitic inductance of the second power trace 3 to cancel each other out, thereby reducing the total parasitic inductance of the power module, improving the switching efficiency of the power module, and reducing the switching losses of the power module.

[0157] Optional, Figure 5 This is a schematic diagram of the structure of the second conductive layer of a power module according to an embodiment of the present invention. Based on the above embodiments, see [link to other embodiments]. Figure 5The power module includes a first side a1 and a second side a2 extending along a first direction X, and a third side a3 and a fourth side a4 extending along a second direction Y; the first direction X and the second direction Y intersect; the first side a1 and the second side a2 are arranged opposite each other, the third side a3 and the fourth side a4 are arranged opposite each other, and the third side a3 and the fourth side a4 are connected between the first side a1 and the second side a2. The power module also includes a middle region disposed between the first side a1 and the second side a2; the middle region includes a first middle region S1 near the first side a1 and a second middle region S2 near the second side a2; the first middle region S1 and the second middle region S2 are arranged along the second direction Y. The power unit 1 is located in the middle region between the third conductive layer M3 and the fourth conductive layer M4; the first power trace 2 is disposed in the first middle region S1 of the second conductive layer M2, and the second power trace 3 is disposed in the second middle region S2 of the fifth conductive layer M5.

[0158] Specifically, the first direction X and the second direction Y can be perpendicular to each other. The first intermediate region S1 is located in the middle and close to the first side a1. The second intermediate region S2 is located in the middle and close to the second side a2. The first intermediate region S1 can be adjacent to both the third side a3 and the fourth side a4. The second intermediate region S2 is also adjacent to both the third side a3 and the fourth side a4. The first power trace 2 is set in the first intermediate region S1 of the second conductive layer M2, and the second power trace 3 is set in the second intermediate region S2 of the fifth conductive layer M5. This arrangement facilitates the connection of the first power trace 2 to the power unit 1 located in the third conductive layer M3 and the fourth conductive layer M4 through vias, reduces the wiring length of the first power trace 2 and the second power trace 3, and further reduces the parasitic inductance of the power module.

[0159] Optional, Figure 6 This is a schematic diagram of the structure of the third conductive layer of a power module provided in an embodiment of the present invention. Figure 7 This is a schematic diagram of the structure of the fourth conductive layer of a power module according to an embodiment of the present invention. Based on the above embodiments, and in conjunction with... Figure 6 and Figure 7 The power module may further include a T-copper block IN2 and at least one T+copper block IN1, wherein the T-copper block IN2 is connected to the first power trace 2, and the T+copper block IN1 is connected to the second power trace 3; at least one T+copper block IN1 and / or at least one T-copper block IN2 are disposed in the space between the third through hole of the third conductive layer M3 and the fourth through hole of the fourth conductive layer M4; wherein the third conductive layer M3 includes a third through hole disposed along the thickness direction of the power module 100, and the fourth conductive layer M4 includes a fourth through hole disposed along the thickness direction of the power module 100, and the third through hole and the fourth through hole are at least partially disposed opposite to each other.

[0160] Optionally, the power module further includes a first edge region S3, located on the first side a1; the first edge region S3 includes a first sub-edge region S31, a second sub-edge region S32, and a third sub-edge region S33 arranged sequentially along the first direction X; a T-copper block IN2 is disposed in the second sub-edge region S32. The number of at least one T+copper block IN1 is two, with the two T+copper blocks IN1 respectively disposed in the first sub-edge region S31 and the third sub-edge region S33. The T-copper block IN2 is connected to the first power trace 2, and the T+copper block IN1 is connected to the second power trace 3.

[0161] Specifically, T-copper block IN2 is used to connect to the negative terminal of the battery. T+copper block IN1 is used to connect to the positive terminal of the battery. The first power trace 2 is connected to the negative terminal of the battery through T-copper block IN2. The second power trace 3 is connected to the positive terminal of the battery through T+copper block IN1. T-copper block IN2 is placed in the second sub-edge region S32, and the two T+copper blocks IN1 are placed in the first sub-edge region S31 and the third sub-edge region S33 respectively, which facilitates the connection of T-copper block IN2 to the negative terminal of the battery and the connection of T+copper block IN1 to the positive terminal of the battery.

[0162] Optionally, based on the above embodiments, further combinations can be made... Figure 6 and Figure 7 The power unit 1 may include a lower bridge power unit 11 and an upper bridge power unit 12. The first end of the lower bridge power unit 11 is connected to the first power trace 2, the second end of the lower bridge power unit 11 is connected to the first end of the upper bridge power unit 12, and the second end of the upper bridge power unit 12 is connected to the second power trace 3. The lower bridge power unit 11 is disposed in the first intermediate region S1 between the third conductive layer M3 and the fourth conductive layer M4. The upper bridge power unit 12 is disposed in the second intermediate region S2 between the third conductive layer M3 and the fourth conductive layer M4.

[0163] Specifically, the lower bridge power unit 11 may include, for example, the lower bridge arm of power unit 1, and the upper bridge power unit 12 may include, for example, the upper bridge arm of power unit 1. The lower bridge power unit 11 is disposed in the first intermediate region S1. The second end of the lower bridge power unit 11 is connected to the first end of the upper bridge power unit 12 at the neutral point. By disposing the lower bridge power unit 11 in the first intermediate region S1 between the third conductive layer M3 and the fourth conductive layer M4, and disposing the upper bridge power unit 12 in the second intermediate region S2 between the third conductive layer M3 and the fourth conductive layer M4, it is easier to route the wiring reasonably, thereby reducing the length of the first power trace 2 and the second power trace 3, and thus reducing the noise inductance of the power module.

[0164] Optionally, based on the above embodiments, further combinations can be made... Figure 6 and Figure 7The lower bridge power unit 11 may include at least one first power device, and the upper bridge power unit 12 may include at least one second power device; along the thickness direction of the power module 100, the projection of at least one first power device at least partially overlaps with the projection of the first power trace 2; and / or, along the thickness direction of the power module, the projection of at least one second power device at least partially overlaps with the projection of the second power trace 3; and / or, at least one first power device is arranged along a first direction X, and at least one second power device is arranged along a first direction X.

[0165] Specifically, this configuration applies to situations where the lower bridge power unit 11 includes one or more power devices. It also applies to situations where the upper bridge power unit 12 includes one or more power devices. When the first power device includes at least two devices, the first power devices are arranged along the first direction X; when the second power device includes at least two devices, the second power devices are arranged along the first direction X. This configuration allows for a more concentrated arrangement of the power units 1, reducing the area occupied by the power units 1, thereby saving wiring space for the power units 1 and further reducing clutter in the power module.

[0166] Along the thickness direction of the power module 100, the projection of at least one of the first power devices at least partially overlaps with the projection of the first power trace 2; and / or, along the thickness direction of the power module, the projection of at least one of the second power devices at least partially overlaps with the projection of the second power trace 3. This arrangement facilitates the close connection of the source of the first power device in the lower bridge power unit 11 to the first power trace 2, and facilitates the close connection of the drain of the second power chip in the upper bridge power unit 12 to the second power trace 3 via vias. This arrangement shortens the transmission path of the DC current signal in the power module, reduces the series inductance of the power module, and improves the switching efficiency of the power module.

[0167] Optional, Figure 8 This is a schematic diagram of the structure of the fifth conductive layer of a power module according to an embodiment of the present invention. Based on the above embodiments, and in conjunction with... Figures 4 to 8 The power module may also include at least one AC transmission structure 4, which is electrically connected to the output terminal of the power module.

[0168] Specifically, the AC transmission structure is used to output AC current signals. The AC transmission structure is connected to the output terminal of the power module. The output terminal of the power module is used to connect to a load, such as a motor.

[0169] Optionally, the AC transmission structure 4 is disposed on the second conductive layer M2 and the fifth conductive layer M5.

[0170] Optionally, the power module further includes a phase copper block IN3, and the AC transmission structure 4 is connected to the phase copper block IN3. The phase copper block IN3 is disposed in the space between the fifth through hole of the third conductive layer M3 and the sixth through hole of the fourth conductive layer M4. The third conductive layer includes a fifth through hole disposed along the thickness direction of the power module, and the fourth conductive layer includes a sixth through hole disposed along the thickness direction of the power module. The fifth through hole and the sixth through hole are at least partially opposite to each other. And / or, the power module further includes a second edge region S4, which is located on the second side a2. The phase copper block IN3 is located in the second edge region S4.

[0171] Specifically, the AC transmission structure 4 of the power module is connected to the phase copper block IN3 at the neutral point N. The lower bridge power unit 11 and the upper bridge power unit 12 are connected to the phase copper block IN3 through the AC transmission structure 4. The phase copper block IN3 is located in the second edge region S4 to facilitate the connection between the phase copper block IN3 and the AC transmission structure 4 of the power module.

[0172] Optionally, based on the above embodiments, further combinations can be made... Figures 4 to 8 The AC transmission structure 4 includes a first AC transmission structure 41 and a second AC transmission structure 42. At least a portion of the second conductive layer M2 forms the first AC transmission structure 41, and at least a portion of the fifth conductive layer M5 forms the second AC transmission structure 42. Both the first AC transmission structure 41 and the second AC transmission structure 42 are electrically connected to the output terminal of the power module.

[0173] Optionally, along the thickness direction of the power module, the projection of the first AC transmission structure 41 at least partially overlaps with the projection of the upper bridge power unit 12; and / or, along the thickness direction of the power module, the projection of the second AC transmission structure 42 at least partially overlaps with the projection of the lower bridge power unit 11; and / or, the first AC transmission structure 41 is located in the second intermediate region S2; and / or, the second AC transmission structure 42 is located in the first intermediate region S1.

[0174] In one optional implementation, a first AC transmission structure 41 is connected between the lower bridge power unit 11 and the phase copper block IN3, and a second AC transmission structure 42 is connected between the phase copper block IN3 and the upper bridge power unit 12.

[0175] Specifically, the first AC transmission structure 41 located in the second intermediate region S2 of the second conductive layer M2 and the second power trace 3 located in the second intermediate region S2 of the fifth conductive layer M5 are directly opposite each other in the thickness direction of the power module. Since the current flowing through the first AC transmission structure 41 and the second power trace 3 flows in opposite directions, the parasitic inductance of the first AC transmission structure 41 and the second power trace 3 is improved. The second AC transmission structure 42 located in the first intermediate region S1 of the fifth conductive layer M5 and the first power trace 2 located in the first intermediate region S1 of the first conductive layer M1 are directly opposite each other in the thickness direction of the power module. Since the current flowing through the second AC transmission structure 42 and the first power trace 2 flows in opposite directions, the parasitic inductance of the second AC transmission structure 42 and the first power trace 2 is improved, thereby reducing the parasitic inductance of the power module, reducing the switching loss of the power module, and improving the switching efficiency of the power module.

[0176] Optionally, based on the above embodiments, further combinations can be made... Figures 4 to 8 The second power trace 3 includes: at least one T+ power link portion, at least a portion of the fifth conductive layer forms the at least one T+ power link portion, and the T+ power link portion is connected to the at least one T+ copper block; along the thickness direction of the power module, the projection of the T+ power link portion at least partially overlaps with the projection of the first power trace 2.

[0177] Specifically, the T+ power link is connected to the T+ copper block. The T+ power link is used to transmit the current signal flowing from the positive terminal of the power supply. The T+ power link is located in the fifth conductive layer. The projection of the T+ power link of the second power trace 3 at least partially overlaps with the projection of the first power trace 2. Since the direction of the current flowing through the first power trace 2 is opposite to the direction of the current flowing through the second power trace 3, the magnetic field generated by the current flowing through the first power trace 2 is opposite to the direction of the magnetic field generated by the current flowing through the T+ power link of the second power trace 3. This effectively cancels out the parasitic inductance generated by the first power trace 2 and the parasitic inductance generated by the T+ power link of the second power trace 3, further reducing the parasitic inductance of the power module, effectively improving the switching efficiency of the power module, and significantly reducing the switching losses of the power module.

[0178] Optionally, based on the above embodiments, further combinations can be made... Figures 4 to 8The second power trace 3 further includes a body portion; the at least one T+ power link portion includes: a first T+ power link portion 5 and a second T+ power link portion 6, at least a portion of the fifth conductive layer M5 forms the first T+ power link portion 5, the second T+ power link portion 6 and the body portion, the first T+ power link portion 5 is connected to the body portion, the second T+ power link portion 6 and the at least one T+ copper block. Along the thickness direction of the power module, the orthographic projection of the first T+ power link portion 5 at least partially overlaps with the projection of the first power trace 2; and / or, along the thickness direction of the power module, the orthographic projection of the second T+ power link portion 6 at least partially overlaps with the projection of the first power trace 2; and / or, along the thickness direction of the power module, the projection of the body portion at least partially overlaps with the projection of the upper bridge power unit.

[0179] Specifically, the body of the second power trace 3 corresponds to the second power trace 3 located in the second intermediate region S2. A first T+ power link 5 and a second T+ power link 6 are provided, allowing the body of the second power trace 3 to be connected to the corresponding T+ copper blocks via the first T+ power link 5 and the second T+ power link 6, respectively. On one hand, this further increases the overlap area of ​​the projections of the first power trace 2 and the second power trace 3 along the thickness direction of the power module, further reducing the parasitic inductance of the power module and effectively improving its switching efficiency. On the other hand, the connection of the first T+ power link 5 and the second T+ power link 6 to the corresponding T+ copper blocks facilitates improved current sharing of the second power trace 3, enhancing the stability and reliability of the power module's signal transmission.

[0180] Optionally, based on the above embodiments, further combinations can be made... Figures 4 to 8 The power module also includes a third edge region S5 and a fourth edge region S6. The third edge region S5 is located adjacent to the third side a3, and the fourth edge region S6 is located adjacent to the fourth side a4. At least a portion of the first T+ power link 5 is located in the third edge region S5, and at least a portion of the second T+ power link 6 is located in the fourth edge region S6.

[0181] The first T+ power link 5 is connected to the second T+ power link 6 through the second power trace 3 located in the second intermediate region S2 to form a T+ network; the T+ network is connected to the drain of the upper bridge power unit 12 through a via.

[0182] Specifically, by setting the first T+ power link 5 to be located in the third edge region S5 and the second T+ power link 6 to be located in the fourth edge region S6, the first T+ power link 5 is connected to the second T+ power link 6 through the second power trace 3 located in the second middle region S2 to form a T+ network. This facilitates the connection of the upper bridge power unit 12 of the power unit 1 to the T+ network through vias, thereby saving the wiring space of the power module, shortening the wiring length of the power module, further reducing the noise inductance of the power module, improving the switching efficiency of the power module, and reducing the switching power loss of the power module.

[0183] Optionally, based on the above embodiments, combined with Figures 1 to 8 The first power trace 2 is connected to the source of the lower bridge power unit 11 via a via; and / or, the second power trace 3 is connected to the drain of the upper bridge power unit 12 via a via; and / or, the first AC transmission structure 41 is connected to the source of the upper bridge power unit 12 via a via; and / or, the second AC transmission structure 42 is connected to the drain of the lower bridge power unit 11 via a via; and / or, the first AC transmission structure 41 and the second AC transmission structure 42 are connected via a via.

[0184] Optional, combined Figures 1 to 8 The power module also includes at least one capacitor C and a first conductive layer M1. The first conductive layer M1 is disposed on the side of the second conductive layer M2 away from the fifth conductive layer M5. The capacitor C is disposed on the first conductive layer M1 and is connected in parallel with at least one power unit 1 through a laser hole.

[0185] Specifically, based on the above embodiments, see below. Figure 5 The capacitor of the power module located in the first conductive layer M1 is an absorption capacitor. The capacitor is connected to the power unit 1 through a laser aperture. This configuration further reduces the parasitic inductance of the power module. For example, the parasitic inductance of the power module provided in this embodiment is less than or equal to 1nH when no capacitor is provided. When a capacitor is provided, the parasitic capacitance of the power module provided in this embodiment is less than or equal to 0.5nH.

[0186] Optional, Figure 9 This is a schematic diagram of the structure of the sixth conductive layer of a power module according to an embodiment of the present invention. Based on the above embodiments, and in conjunction with... Figures 3 to 9 The power module also includes a sixth conductive layer M6, which is disposed on the side of the fifth conductive layer M5 away from the first conductive layer M1. The sixth conductive layer M6 is used to connect external circuits, such as heat dissipation devices.

[0187] In one alternative implementation, the sixth conductive layer M6 is connected to the phase copper block IN3, the T-copper block IN2, and the two T+copper blocks IN1 via vias.

[0188] Specifically, the sixth conductive layer M6 is a single layer of copper. The sixth conductive layer M6 is connected to the external heat sink by welding or sintering.

[0189] Optionally, based on the above embodiments, see also... Figure 5 The power module may also include an interlayer insulation layer, which is disposed between adjacent conductive layers and serves as an insulation layer.

[0190] Specifically, the interlayer insulating layer between the first conductive layer M1 and the fifth conductive layer M5 is made of resin. The interlayer insulating layer between the fifth conductive layer M5 and the sixth conductive layer M6 can be made of insulating material.

[0191] Based on the same inventive concept, this embodiment provides a motor controller, including the power module proposed in any of the above embodiments, and has the beneficial effects of the power module proposed in any of the above embodiments, which will not be repeated here.

[0192] Based on the same inventive concept, this embodiment provides an electric drive system, including the power module proposed in any of the above embodiments, having the beneficial effects of the power module proposed in any of the above embodiments, and / or including the motor controller proposed in any of the above embodiments, having the beneficial effects of the motor controller proposed in any of the above embodiments, which will not be repeated here.

[0193] Based on the same inventive concept, this embodiment provides a vehicle including the power module proposed in any of the above embodiments, and / or including the motor controller proposed in any of the above embodiments, and / or including the electric drive system proposed in any of the above embodiments, having the beneficial effects of the power module proposed in any of the above embodiments, which will not be repeated here.

[0194] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A power module, characterized in that, include: At least one power unit; At least two DC transmission structures are connected to the power unit; the current directions of the at least two DC transmission structures are opposite. At least two of the aforementioned DC transmission structures are arranged in different layers.

2. The power module according to claim 1, characterized in that, Along the thickness direction of the power module, the projections of at least two of the DC transmission structures at least partially overlap.

3. The power module according to claim 1 or 2, characterized in that, The at least two of the DC transmission structures include: The first power trace is connected to the power unit and the negative terminal of the power supply. The second power trace is connected to the power unit and the positive terminal of the power supply. The current direction of the first power trace is opposite to the current direction of the second power trace, and the first power trace and the second power trace are disposed on different layers. Along the thickness direction of the power module, the projections of the first power trace and the second power trace at least partially overlap.

4. The power module according to any one of claims 1 to 3, characterized in that, The power module also includes: At least two conductive layers, at least a portion of the conductive layers forming the DC transmission structure; The power unit is disposed between the two conductive layers.

5. The power module according to claim 4, characterized in that, The power module also includes: A second conductive layer, a portion of which forms the first power trace of the DC transmission structure; A fifth conductive layer is disposed on one side of the second conductive layer, and a portion of the fifth conductive layer forms the second power trace of the DC transmission structure; The at least one power unit is disposed in the region between the second conductive layer and the fifth conductive layer.

6. The power module according to claim 5, characterized in that, The power module also includes: A third conductive layer and a fourth conductive layer are disposed between the second conductive layer and the fifth conductive layer; The third conductive layer includes a first through-hole disposed along the thickness direction of the power module, and the fourth conductive layer includes a second through-hole disposed along the thickness direction of the power module. The first through-hole and the second through-hole are at least partially disposed opposite each other, and at least a portion of at least one of the power units is disposed in the space between the first through-hole and the second through-hole.

7. The power module according to claim 6, characterized in that, The power module includes a first side and a second side extending along a first direction, and a third side and a fourth side extending along a second direction; the first direction and the second direction intersect; the first side and the second side are arranged opposite to each other, the third side and the fourth side are arranged opposite to each other, and the third side and the fourth side are connected between the first side and the second side; The power module further includes a middle region disposed between the first side and the second side; the middle region includes a first middle region near the first side and a second middle region near the second side; the first middle region and the second middle region are arranged along the second direction. The power unit is located in the intermediate region; the first power trace is disposed in the first intermediate region of the second conductive layer, and at least a portion of the second power trace is disposed in the second intermediate region of the fifth conductive layer.

8. The power module according to claim 7, characterized in that, The power module also includes: At least one T-copper block and at least one T+copper block, wherein the T-copper block is connected to the first power trace and the T+copper block is connected to the second power trace; At least one of the T+ copper blocks and / or at least one of the T- copper blocks are disposed in the space between the third through hole of the third conductive layer and the fourth through hole of the fourth conductive layer; The third conductive layer includes a third through-hole disposed along the thickness direction of the power module, and the fourth conductive layer includes a fourth through-hole disposed along the thickness direction of the power module. The third through-hole and the fourth through-hole are at least partially disposed opposite to each other.

9. The power module according to claim 8, characterized in that, The power module also includes: A first edge region, the first edge region being located on the first edge; the first edge region includes a first sub-edge region, a second sub-edge region, and a third sub-edge region sequentially arranged along the first direction; The T-copper block is disposed in the second sub-edge region; The number of the at least one T+ copper block is two, and the two T+ copper blocks are respectively disposed in the first sub-edge region and the third sub-edge region.

10. The power module according to any one of claims 7 to 9, characterized in that, The power unit includes: The lower bridge power unit and the upper bridge power unit are provided. The first end of the lower bridge power unit is connected to the first power trace, the second end of the lower bridge power unit is connected to the first end of the upper bridge power unit, and the second end of the upper bridge power unit is connected to the second power trace. The lower bridge power unit is disposed in the first intermediate region; the upper bridge power unit is disposed in the second intermediate region.

11. The power module according to claim 10, characterized in that, The lower bridge power unit includes at least one first power device, and the upper bridge power unit includes at least one second power device; Along the thickness direction of the power module, the projection of at least one of the first power devices at least partially overlaps with the projection of the first power trace; and / or, Along the thickness direction of the power module, the projection of at least one of the second power devices at least partially overlaps with the projection of the second power trace; and / or, The at least one first power device is arranged along the first direction, and the at least one second power device is arranged along the first direction.

12. The power module according to claim 10 or 11, characterized in that, The power module also includes: At least one AC transmission structure is electrically connected to the output terminal of the power module.

13. The power module according to claim 12, characterized in that, The power module further includes a phase copper block, and the AC transmission structure is connected to the phase copper block. The phase copper block is disposed in the space between the fifth through-hole of the third conductive layer and the sixth through-hole of the fourth conductive layer. The third conductive layer includes a fifth through-hole disposed along the thickness direction of the power module, and the fourth conductive layer includes a sixth through-hole disposed along the thickness direction of the power module. The fifth and sixth through-holes are at least partially opposite to each other; and / or, The power module further includes a second edge region located on the second side; the phase copper block is located in the second edge region.

14. The power module according to claim 12 or 13, characterized in that, The AC transmission structure includes a first AC transmission structure and a second AC transmission structure. At least a portion of the second conductive layer forms the first AC transmission structure, and at least a portion of the fifth conductive layer forms the second AC transmission structure. Both the first AC transmission structure and the second AC transmission structure are electrically connected to the output terminal of the power module.

15. The power module according to claim 14, characterized in that, Along the thickness direction of the power module, the projection of the first AC transmission structure at least partially overlaps with the projection of the upper bridge power unit; and / or, Along the thickness direction of the power module, the projection of the second AC transmission structure at least partially overlaps with the projection of the lower bridge power unit; and / or, The first AC transmission structure is located in the second intermediate region; and / or, The second AC transmission structure is located in the first intermediate region.

16. The power module according to claim 14 or 15, characterized in that, The second power trace includes: At least one T+ power link portion, wherein at least a portion of the fifth conductive layer forms the at least one T+ power link portion, and the T+ power link portion is connected to the at least one T+ copper block; Along the thickness direction of the power module, the projection of the T+ power link portion at least partially overlaps with the projection of the first power trace.

17. The power module according to claim 16, characterized in that, The second power trace also includes a body section; The at least one T+ power link portion includes: a first T+ power link portion and a second T+ power link portion, and at least a portion of the fifth conductive layer forms the first T+ power link portion, the second T+ power link portion and the body portion, wherein the first T+ power link portion is connected to the body portion, the second T+ power link portion and the at least one T+ copper block. Along the thickness direction of the power module, the orthographic projection of the first T+ power link portion at least partially overlaps with the projection of the first power trace; and / or, Along the thickness direction of the power module, the orthographic projection of the second T+ power link portion at least partially overlaps with the projection of the first power trace; and / or, Along the thickness direction of the power module, the projection of the main body overlaps at least partially with the projection of the upper bridge power unit.

18. The power module according to claim 17, characterized in that, The power module further includes a third edge region and a fourth edge region, wherein the third edge region is disposed adjacent to the third side and the fourth edge region is disposed adjacent to the fourth side; At least a portion of the first T+ power link is located in the third edge region, and at least a portion of the second T+ power link is located in the fourth edge region.

19. The power module according to any one of claims 14 to 18, characterized in that, The first power trace is connected to the source of the lower bridge power unit via a via; and / or, The second power trace is connected to the drain of the upper bridge power unit via a via; and / or, The first AC transmission structure is connected to the source of the upper bridge power unit via a via; and / or, The second AC transmission structure is connected to the drain of the lower bridge power unit via a via; and / or, The first AC transmission structure and the second AC transmission structure are connected by vias.

20. The power module according to claim 5, characterized in that, The power module further includes at least one capacitor and a first conductive layer. The first conductive layer is disposed on the side of the second conductive layer away from the fifth conductive layer. The capacitor is disposed on the first conductive layer and is connected in parallel with at least one of the power units through a laser aperture.

21. The power module according to claim 5, characterized in that, The power module also includes: A sixth conductive layer is disposed on the side of the fifth conductive layer away from the second conductive layer. The sixth conductive layer is used to connect a heat dissipation device.

22. A motor controller, characterized in that, Includes the power module as described in any one of claims 1 to 21.

23. An electric drive system, characterized in that, Includes the power module as described in any one of claims 1 to 21; and / or the motor controller as described in claim 22.

24. A vehicle, characterized in that, It includes the power module according to any one of claims 1 to 21, and / or the motor controller according to claim 22, and / or the electric drive system according to claim 23.

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