A method for assembling a tuning fork crystal oscillator with integrated circuit

Abstract

This invention discloses a method for assembling a tuning fork crystal oscillator with integrated circuitry, belonging to the field of quartz crystal oscillator manufacturing technology. The method includes: prefabricating an integrated substrate and laying conductive circuitry; mounting and interconnecting the CMOS chip with gold wire ball bonding; horizontally pushing the tuning fork crystal and applying adhesive to form a suspended support; functional testing and frequency calibration before packaging; vacuum packaging; upper and lower coordinated clamping and cutting to achieve single-unit separation; and finished product testing and packaging. This invention introduces an adaptive support assembly device in key processes, including a lifting component located below an insulating plate and an upper pressing mechanism located above the insulating plate. The lifting component selectively supports the island-shaped portion from the bottom via a first electric push rod, and the upper pressing mechanism presses it down from above via a flexible pressure plate, forming upper and lower coordinated clamping. The device also integrates a photoelectric detection module for leveling, a moving component for selective positioning, and a flexible pressure plate with an integrated cutter for precise cutting.

Description

Technical Field

[0001] This invention relates to the field of quartz crystal oscillator manufacturing technology, and in particular to a method for assembling a tuning fork crystal oscillator with integrated circuitry. Background Technology

[0002] Tuning fork crystal oscillators are the core components of real-time clock modules.

[0003] Application number CN201920060022.5 discloses a tuning fork quartz crystal package structure, realizing a flat surface-mount package of the tuning fork crystal. Based on this, a tuning fork crystal oscillator with integrated circuitry is further developed, integrating the CMOS oscillator circuit chip and the tuning fork crystal into the same package.

[0004] During assembly, the base employs an array structure of insulating plates, forming multiple suspended island-like sections through perforation. Each island-like section is connected to the insulating plate body only via a connecting part. This suspended structure leads to the following technical problems: First, insufficient rigidity; the island-like sections are prone to vibration or sinking during CMOS chip mounting and gold wire ball soldering processes, resulting in chip misalignment and poor solder joints. Second, the overall arching and deformation of the insulating plate causes the visual alignment reference to fail, affecting subsequent sealing quality. Third, individual component separation is difficult; traditional mechanical punching of the connecting parts easily produces burrs and microcracks, affecting the product's appearance and electrical performance. Fourth, the environmental control requirements within the packaging cavity are high; the integrated circuitry is sensitive to moisture, necessitating the guarantee of packaging reliability.

[0005] Existing assembly equipment mostly uses integral clamps or vacuum adsorption platforms, which cannot selectively support individual island-shaped parts, nor can they achieve coordinated clamping from top to bottom, online leveling, and precise cutting functions, making it difficult to meet the high-precision batch assembly requirements of tuning fork crystal oscillators with integrated circuits. Summary of the Invention

[0006] The purpose of this invention is to solve the problems of insufficient rigidity, arching and deformation of the insulating plate, poor quality of individual component separation, and insufficient humidity control in the packaging cavity caused by the suspension of the island part in the assembly process of the tuning fork crystal oscillator with integrated circuit in the prior art. Therefore, a tuning fork crystal oscillator with integrated circuit is proposed.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A method for assembling a tuning fork crystal oscillator with integrated circuitry includes the following steps: S1: Prefabricated integrated base, providing an insulating board, forming multiple island-shaped sections on the insulating board, laying conductive lines, installing a metal base and metal leads, forming a support column and CMOS chip mounting stage; S2: The CMOS oscillator circuit chip is mounted on the IC mounting stage of the island section, and the chip pins are electrically connected to the conductive lines by gold wire ball soldering, and then filled with bottom filler material for curing. S3: Push the tuning fork wafer horizontally to the support column position, apply conductive material in spots, and after curing, form a raised step structure to create a space between the tuning fork wafer and the upper surface of the island-shaped part. S4: Before packaging, the integrated circuit of the CMOS chip and tuning fork wafer is functionally tested and frequency calibrated using a probe station. S5: Place the sealing cover over the base and perform vacuum sealing; S6: The connection between the island-shaped part and the insulating plate is cut off by a coordinated clamping method from top and bottom, thereby achieving single-unit separation; S7: Conduct electrical performance testing, aging screening, and packaging of individual products; In steps S2 to S6, an adaptive support assembly device is used in conjunction with the processing. The adaptive support assembly device includes a lifting component located below the insulating plate and an upper pressing mechanism located above the insulating plate. The lifting component selectively lifts and supports the island-shaped part from below, and the upper pressing mechanism flexibly presses it from above, forming a coordinated clamping from above and below.

[0008] In some embodiments, the lifting assembly includes a slide, a first electric push rod, a thin pad, and a pressure sensor. The first electric push rod has a first electromagnetic pin self-locking structure, and the pressure sensor has a preset pressure threshold P1.

[0009] In some embodiments, the pressing mechanism includes a lifting assembly and a pressure plate, wherein the pressure plate is made of a flexible material.

[0010] In some embodiments, during step S2, when the CMOS chip is mounted and gold wire ball is soldered, the lifting component lifts the target island portion until the pressure reaches P1 and locks it, and the pressure plate of the upper pressing mechanism presses down to form a coordinated clamping action with the lifting component.

[0011] In some embodiments, during step S4, the lifting assembly lifts and supports the island-shaped part during probe testing to ensure stable contact between the probe and the pad; at the same time, the photoelectric detection module detects the horizontal state of the insulating plate. If arching deformation occurs, the pressing mechanism moves to the center of the insulating plate and presses down, cooperating with the inner limiting groove of the support block to level it.

[0012] In some embodiments, in step S6, the specific operation of the individual separation is as follows: the lifting assembly lifts the island-shaped part until the pressure reaches P1 and locks it; the upper pressing mechanism presses down, the pressure plate contacts the upper surface of the island-shaped part, and the cutter on the outside of the pressure plate aligns with the connecting part; when the pressure rises to the threshold P2, the first electric push rod retracts and moves down, compressing the thin pad layer; the cutter continues to press down to cut off the connecting part, thereby realizing the individual separation of the island-shaped part.

[0013] In some embodiments, the adaptive support assembly device further includes a moving component, which includes a support plate, a chute, and a conveyor belt drive mechanism. The conveyor belt drive mechanism drives the lifting component to move horizontally, so that the lifting component corresponds to different island sections.

[0014] In some embodiments, the conveyor belt transmission mechanism includes a conveyor groove, a conveyor belt, transmission teeth, a transmission gear, a servo motor, and a reducer. The transmission gear meshes with the transmission teeth on the inner side of the conveyor belt. The conveyor belt is provided with a second electromagnetic pin, and the slide is provided with a second insertion hole that corresponds to and cooperates with the second electromagnetic pin.

[0015] In some embodiments, the pressing mechanism is provided in two sets, including a first pressing mechanism and a second pressing mechanism; the first pressing mechanism is used to level the insulating board, and the second pressing mechanism is used to process the island-shaped part, and the two work alternately or in parallel.

[0016] Compared with the prior art, the present invention provides a method for assembling a tuning fork crystal oscillator with integrated circuitry, which has the following beneficial effects.

[0017] 1. This invention replaces the traditional ceramic base with an insulating plate, and forms a suspended island-shaped part on the insulating plate through array slots. The conductive lines of the chip, the conductive lines of the integrated circuit, and the interconnect conductive lines are integrated and laid on the island-shaped part. The electrical connection path between the metal leads, the support pillars and the tuning fork chip is integrated into the base body, realizing circuit integration at the base level. The material cost per piece is reduced by about two-thirds. At the same time, the array layout supports mass production and greatly simplifies the process flow.

[0018] 2. By setting up an adaptive support assembly device, the present invention selectively lifts and supports the suspended island from below during the CMOS chip mounting, gold wire ball soldering, dispensing curing and probe testing processes. The upper pressure mechanism clamps it from above, and the pressure sensor provides real-time feedback to control the lifting force, thereby increasing the local rigidity of the island, improving the mounting position accuracy, reducing the gold wire ball soldering failure rate, and ensuring that the chip position remains accurate and the adhesive layer thickness uniformity is controllable during the dispensing curing process.

[0019] 3. This invention monitors the horizontal state of the insulating board in real time through a photoelectric detection module. When the insulating board is detected to be arched upward due to stress release, the pressing mechanism moves to the center of the insulating board and presses down. In conjunction with the limiting groove on the inner side of the support block, the four corners of the insulating board are constrained to achieve leveling. This systematically eliminates problems such as failure of positioning reference, cracking of gold wire solder joints, and failure of airtightness of sealing cover caused by the arching of the insulating board.

[0020] 4. In the monomer separation process of this invention, the lifting component and the pressing mechanism form a coordinated clamping action. The cutter on the outside of the pressure plate cuts into the connecting part while the island-shaped part is fixedly clamped. When the pressure sensor detects that the value reaches the threshold P2, the first electric push rod retracts and moves downward, making the cutting force precisely controllable. The cutting surface is flat, burr-free, and free of microcracks, avoiding the impact damage caused by traditional punching methods and effectively protecting the CMOS chip and tuning fork wafer on the island-shaped part.

[0021] Other advantages, objectives and features of the invention will be set forth in part in the description which follows; and in part will be apparent to those skilled in the art upon examination of the following description; or may be learned from practice of the invention. Attached Figure Description

[0022] Figure 1 This is a flowchart of the assembly process of the present invention.

[0023] Figure 2 This is a schematic diagram of the structure of the insulating plate of the present invention.

[0024] Figure 3 This is a schematic diagram of the support block of the present invention.

[0025] Figure 4 This is a schematic diagram of the upper pressure mechanism of the present invention.

[0026] Figure 5 This is a schematic diagram of the limiting groove of the present invention.

[0027] Figure 6 This is a schematic diagram of the photoelectric detection module of the present invention.

[0028] Figure 7 This is a schematic diagram of the support mechanism of the present invention.

[0029] Figure 8 This is a schematic diagram of the lifting assembly of the present invention.

[0030] Figure 9 This is a schematic diagram of the structure of a conveyor belt and transmission gears.

[0031] Figure 10 This is a schematic diagram of the structure of the second electromagnetic pin and the slide table of the present invention.

[0032] Figure 11 This is a schematic diagram of the structure of the horizontal linear movement component of the present invention.

[0033] Figure 12 This is a schematic diagram of the structure of the double pressing mechanism of the present invention.

[0034] In the picture: 1. Insulating board; 11. Array slot; 12. Island section 12; 14. Metal lead wire; 2. Support block; 21. Limiting slot; 3. Support mechanism; 31. Lifting assembly; 311. Slide table; 312. Telescopic component; 316. Thin pad layer; 32. Moving assembly; 321. Support plate; 322. Slide groove; 323. Slide track; 324. Conveying groove; 325. Conveyor belt; 326. Transmission gear; 328. Transmission gear; 331. Second electromagnetic pin; 332. Moving groove; 333. Second insertion hole; 334. Rigid plate; 4. Pressing mechanism; 41. Lifting assembly; 42. Horizontal linear moving assembly; 421. Guide frame; 422. Second electric push rod; 43. Pressure plate; 45. Sliding mechanism; 451. Support leg; 5. Photoelectric detection module; 51. Laser emitting end; 52. Laser receiving end. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0036] Reference Figures 1 to 12 This invention discloses a method for assembling a tuning fork crystal oscillator with integrated circuitry, comprising the following steps: S1: Prefabricated integrated base, providing an insulating plate 1, forming multiple island-shaped parts 12 on the insulating plate 1, laying out conductive lines including wafer conductive lines, integrated circuit conductive lines and interconnect conductive lines, installing a metal base and metal leads 14, forming a support pillar and CMOS chip mounting stage; S2: The CMOS oscillator circuit chip is mounted on the IC mounting stage of the island section 12. The chip pins are electrically connected to the integrated circuit conductive lines through gold wire ball soldering or conductive connection process. The wafer input pins of the CMOS chip are electrically connected to the wafer conductive lines through interconnect conductive lines, and the bottom filler material is filled and cured. S3: Push the tuning fork chip horizontally to the support column position, apply conductive material, and after curing, form a raised step structure to separate the tuning fork chip from the upper surface of the island part 12. S4: Before packaging, the integrated circuit of the CMOS chip and tuning fork wafer is functionally tested and frequency calibrated using a probe station. S5: Place the sealing cover over the base and perform vacuum sealing to form a hermetically sealed cavity; S6: The connection between the island-shaped part 12 and the insulating plate 1 is cut off by a coordinated clamping method from top and bottom to achieve single-unit separation; S7: Conduct electrical performance testing, aging screening, and packaging of individual products.

[0037] Understandably, during the S2 processing described above, since the island-shaped portion 12 is in a suspended state, the mounting pressure, the downward pressure of the solder head, and the thermosetting stress can all easily cause the island-shaped portion 12 to sink or vibrate and deform, directly affecting the mounting position accuracy of the CMOS chip and the quality of the gold wire solder joints. Therefore, an adaptive support assembly device is introduced in this step to selectively lift and support the target island-shaped portion 12 from below.

[0038] Specifically, the adaptive support assembly device includes a lifting component 31 located below the insulating plate 1 and an upper pressing mechanism 4 located above the insulating plate 1. During processing, the lifting component 31 moves to directly below the target island portion 12 and is lifted upwards by a first electric push rod, with the thin pad layer 316 flexibly contacting the bottom surface of the island portion 12. A pressure sensor monitors the lifting pressure in real time, and when the pressure reaches a preset threshold P1, the first electromagnetic pin locks, providing rigid support to the bottom of the island portion 12. Simultaneously, the upper pressing mechanism 4 presses down from above via a flexible pressure plate 43, forming a coordinated clamping action with the lifting component 31 to prevent displacement or deformation of the island portion 12 due to processing force. The function of this adaptive support assembly device is to increase the local stiffness of the suspended island portion 12, thereby improving the positioning accuracy of the CMOS chip and reducing the rate of poor solder joints in gold wire ball bonding.

[0039] Understandably, during the dispensing and curing process in S3, the curing shrinkage of the conductive material may cause the tuning fork wafer to shift or the adhesive layer thickness to be uneven. At this time, the lifting component 31 of the adaptive support assembly device maintains support for the bottom of the island portion 12, and the pressure plate 43 of the upper pressing mechanism 4 presses down to assist in fixing it, ensuring the tuning fork wafer maintains a precise position during curing and making the adhesive layer thickness uniform and controllable. After curing, the lifting component 31 retracts, the island portion 12 returns to its suspended state, and the tuning fork wafer is supported in mid-air by the raised step structure of the conductive material, ensuring its free vibration.

[0040] It is understandable that during the probe test in S4, the probe has contact force with the pad. If the island 12 is suspended, the contact force may cause the island 12 to undergo micro-displacement, resulting in poor probe contact or scratching of the pad. The lifting component 31 of the adaptive support assembly device lifts and supports the island 12 at the test station, so that the probe and the pad form a stable contact, improving the repeatability of the test.

[0041] Simultaneously, the photoelectric detection module 5 (laser triangular displacement sensor) of the device monitors the horizontal status of the insulating plate 1 in real time. If the insulating plate 1 is found to arch upwards due to stress release, the pressing mechanism 4 of the device moves to the center of the insulating plate 1 and presses down through the pressure plate 43. This, combined with the limiting groove 21 on the inner side of the support block 2, constrains the four corners of the insulating plate 1, achieving leveling. After leveling, the photoelectric detection module 5 confirms that the levelness meets the standard before continuing the test. This leveling function avoids systematic positioning deviations caused by the arching of the insulating plate 1.

[0042] Understandably, before the installation of the S5 sealing cover, the lifting components 31 of the adaptive support assembly device are all retracted to avoid interfering with the placement of the sealing cover; after sealing is completed, the device is used to perform helium mass spectrometry leak detection to ensure that the airtightness meets the standards.

[0043] It is understandable that when the above-mentioned S6 performs single-unit separation, in the traditional mechanical punching method, the punching force acts directly on the connecting part. Since the island part 12 is suspended, bending moment and tearing stress are generated during punching, resulting in burrs and microcracks on the cut surface.

[0044] This step utilizes the upper and lower coordinated clamping and cutting function of the adaptive support assembly device: the lifting component 31 lifts the target island 12 until the pressure reaches P1 and locks; the upper pressing mechanism 4 moves above the target island 12, the flexible pressure plate 43 presses down and contacts the upper surface of the island 12, and the cutter on the outside of the pressure plate 43 aligns with the connecting part; as the pressure is applied, the pressure sensor detects a value that rises to the threshold P2, the first electric push rod retracts and moves downward, the thin pad 316 is compressed and deformed, and the island 12 moves downward accordingly; the cutter continues to press down, and under the upper and lower clamping and fixing state, the connecting part breaks under the action of precisely controlled shearing force.

[0045] The advantages of this method are: a smooth cut surface without tearing or micro-cracks; and controllable cutting force, avoiding impact damage to the CMOS chip and tuning fork wafer.

[0046] Example 1 The adaptive support assembly device mentioned in steps 2 to 7 above has the following specific structure: In this first embodiment, the core technical problem that the present invention first solves is that the suspended structure of the island portion 12 lacks bottom support during processing, resulting in insufficient rigidity and reduced processing accuracy. In the prior art, the island portion 12 is only connected to the main body of the insulating plate 1 through the connecting part. During processes such as conductive line etching and chip mounting, the island portion 12 is prone to vibration or sinking.

[0047] Therefore, this embodiment introduces a lifting assembly 31 that selectively lifts and supports from below, which improves the local rigidity of the island portion 12 through four-point support, and controls the lifting force through pressure sensor feedback to avoid damage caused by excessive lifting.

[0048] Please continue reading. Figures 2 to 6 This embodiment provides an adaptive support assembly device for a tuning fork crystal oscillator base array, including an insulating plate 1, a support block 2, a support mechanism 3, and an upper pressing mechanism 4.

[0049] An array of slots 11 running vertically through the insulating plate 1 is provided.

[0050] The array slot 11 has an island-shaped part 12 inside, and the island-shaped part 12 is integrally connected to the main body of the insulating plate 1 through a connecting part.

[0051] The array slots 11 are of a certain number and are distributed in parallel at equal intervals.

[0052] like Figure 7 As shown, the island-shaped portions 12 within the array slot 11 are also evenly distributed within the array slot 11. Each island-shaped portion 12 is provided with a metal lead 14, which extends from the upper and lower sides of the island-shaped portion 12.

[0053] Please continue reading. Figure 3 and Figure 5 At the four ends of the insulating plate 1, there are support blocks 2 respectively. The support blocks 2 are used to support the four ends of the insulating plate 1. Limiting grooves 21 are opened on the inner side of the support blocks 2, and the limiting grooves 21 correspond to the end positions of the insulating plate 1.

[0054] Please continue reading. Figure 7 Below the array slot 11 is a support mechanism 3, which includes a lifting component 31 and a moving component 32.

[0055] like Figure 8 As shown, the lifting assembly 31 is used to lift from below to support the bottom of the island-shaped part 12. The lifting assembly 31 specifically includes a slide 311, and a telescopic member 312 is provided on the top of the slide 311. The telescopic member 312 is a first electric push rod, which has a self-locking structure (not shown in the figure).

[0056] As a type of self-locking structure, the self-locking structure has a first electromagnetic pin on the fixed end of the first electric push rod. The telescopic end of the first electric push rod has a first insertion hole (not shown in the figure) that corresponds to and mates with the first electromagnetic pin. In use, the first electromagnetic pin is energized and extended, then inserted into the first insertion hole to fix the height of the first electric push rod.

[0057] There are four first electric push rods, and the four first electric push rods are located outside the metal lead wire 14 of the island 12. That is to say, the first electric push rods and the metal lead wire 14 are staggered. This arrangement avoids interference between the lifting assembly 31 and the metal lead wire 14, and at the same time achieves four-point uniform support for the bottom of the island 12.

[0058] In this design, the telescopic ends of the two first electric actuators located outside the metal lead 14 can be connected to each other. To ensure lifting stability, one of the first electric actuators can be replaced with a non-powered follow-up telescopic rod; the telescopic end of this rod is fixedly connected to the telescopic end of the powered first electric actuator. That is, it is driven and locked by a single powered first electric actuator. This design reduces the number of drive sources and simplifies the control system while ensuring support stability.

[0059] Please continue reading. Figure 8 A thin, deformable pad 316 is provided at the top of the telescopic end of the first electric push rod. The function of the thin pad 316 is to adapt to the micro-unevenness of the bottom surface of the island part 12 through its elastic deformation during the lifting process, so as to avoid stress concentration and surface damage caused by hard contact.

[0060] A pressure sensor (not shown in the figure) is provided at the telescopic end of the thin pad layer 316 and the first electric push rod. The pressure sensor is used to detect the lifting pressure of the first electric push rod on the island part 12. The pressure sensor has a preset pressure threshold P1.

[0061] When the first electric push rod pushes upward, the pressure threshold reaches P1, indicating that the bottom of the island section 12 has been lifted. At this time, the first electromagnetic pin is energized to lock the extension end of the first electric push rod.

[0062] like Figure 9 and Figure 10 As shown, the moving component 32 is used to stably control the horizontal movement of the lifting component 31 corresponding to the array slot 11. In this way, the lifting component 31 can be aligned with the island-shaped part 12 to achieve the lifting of a certain island-shaped part 12.

[0063] The moving component 32 includes a support plate 321 for supporting the lifting component 31. The support plate 321 has a groove 322 inside that corresponds to and cooperates with the slide table 311. The top of the groove 322 has a slide rail 323. The position of the slide rail 323 corresponds to the position of the first electric push rod, so that the telescopic end of the first electric push rod can extend upward through the slide rail 323.

[0064] Inside the support plate 321, outside the slide groove 322, a conveyor groove 324 is provided. Inside the conveyor groove 324, a conveyor belt 325 is driven. Inside the conveyor belt 325, there are drive teeth 326. It can be understood that gear mounting cavities are provided at both ends inside the support plate 321. Inside the gear mounting cavities, there are drive gears 328. The drive gears 328 are driven by a servo motor and a reducer (not shown in the figure), and the drive gears 328 mesh with the drive teeth 326 inside the conveyor belt 325.

[0065] A second electromagnetic pin 331 is provided on the conveyor belt 325. A moving groove 332 is provided in the middle of the conveyor groove 324, which extends through the slide groove 322. A second insertion hole 333 is provided at the position of the slide table 311 corresponding to the second electromagnetic pin 331.

[0066] The portion of the conveyor belt 325 corresponding to the second electromagnetic pin 331 is a rigid plate 334, which does not participate in steering. In other words, during operation, when the transmission gear 328 starts, the transmission teeth 326 on the inner side of the conveyor belt 325 drive the conveyor belt 325 in both forward and reverse directions. However, the movement path of the second electromagnetic pin 331 is controlled to one side of the transmission groove 324 and will not be transferred to the other side.

[0067] That is, at the position of the conveyor groove 324 on one side, the second electromagnetic pin 331 can be energized and extended to lock with the second socket 333 on the slide 311, thereby fixing a slide 311 and the conveyor belt 325 locally. Then, when the servo motor drives forward and reverse, it controls the slide 311 to move horizontally, which means it can correspond with multiple island parts 12.

[0068] It should be noted that multiple fixed lifting components 31 can also be set on the support plate 321, that is, an independent lifting mechanism is set under each island part 12.

[0069] However, this method has the following drawbacks: First, the equipment cost increases significantly, as each island section 12 requires an independent drive and control system; second, the device is bulky and difficult to arrange in high-density arrays; and third, the synchronous control of each lifting mechanism is complex, resulting in large cumulative errors. In contrast, this embodiment, as a preferred embodiment, uses a single lifting component 31 in conjunction with a moving component 32, achieving selective movement and positioning through a conveyor belt 325 transmission mechanism. This significantly reduces equipment cost and structural complexity while ensuring functionality.

[0070] Please continue reading. Figure 6 On both sides of the insulating plate 1, there are photoelectric detection modules 5, which are used to detect the horizontal state of the insulating plate 1.

[0071] The photoelectric detection module 5 can be a laser triangulation sensor, including a laser emitter 51 and a laser receiver 52. The laser emitter 51 emits a laser beam to the lower surface of the insulating plate 1, and the laser receiver 52 receives the laser beam reflected by the lower surface of the insulating plate 1. By detecting the phase change or spot position shift of the reflected laser, the height value of each detection point on the insulating plate 1 is calculated.

[0072] When the insulating plate 1 arches upwards, the height of the detection point changes, and the photoelectric detection module 5 outputs an abnormal signal. If the island part 12 is processed at this time, the following harmful problems will occur: First, the planar position of the island part 12 will be systematically shifted, causing the positioning reference of the vision alignment system to fail, which in turn will cause the CMOS chip mounting position deviation to exceed the accuracy requirements; Second, the connection between the island part 12 and the main body of the insulating board 1 generates an additional bending moment. In subsequent hot processes such as gold wire ball welding, the stress release causes the island part 12 to spring back, resulting in cracked or incomplete welds. Third, the arching deformation causes the height of each island part 12 in the array to be inconsistent, resulting in uneven gap between the sealing cover and the metal base. During vacuum sealing, there may be local incomplete welds and failure of airtightness.

[0073] Therefore, maintaining the horizontal state of the insulating plate 1 is crucial to ensuring assembly accuracy.

[0074] In this regard, such as Figure 4 , Figure 6 and Figure 11 As shown, an upper pressing mechanism 4 is provided above the insulating plate 1. The upper pressing mechanism 4 includes a lifting assembly 41 and a horizontal linear movement assembly 42.

[0075] The lifting assembly 41 is used to perform lifting functions during or after processing. The lifting assembly 41 is a cylinder. A pressure plate 43 is provided at the telescopic end at the bottom of the cylinder.

[0076] The horizontal linear movement component 42 is used to control the horizontal movement of the lifting component 41, so that it can follow the lifting component 31 below and work together on the same island section 12.

[0077] The horizontal linear movement component 42 includes a guide frame 421, which is slidably connected to the lifting component 41, i.e., the cylinder horizontal limit. The bottom end of the lifting component 41 passes through the bottom of the guide frame 421 and is fixedly connected to the pressure plate 43.

[0078] On one side of the guide frame 421, a second electric push rod 422 is provided. The fixed end of the second electric push rod 422 is fixedly connected to the guide frame 421, and the telescopic end of the second electric push rod 422 passes through one side of the guide frame 421 and is fixedly connected to the lifting assembly 41, i.e., the cylinder.

[0079] Used to drive the cylinder to move horizontally, it can realize that the pressure plate 43 corresponds to each of the multiple island parts 12 respectively.

[0080] The advantage of both acting together on the same island 12 is that the island 12 can be stably pressed down by the upward support force from below and the four-point support, and then the pressure plate 43 above moves down under the drive of the lifting assembly 41, without worrying about displacement between the island 12 and the insulating plate 1.

[0081] When processing certain steps that require pressure, such as curing conductive lines and pressing bottom filling materials, the pressure plate 43 presses down to apply pressure and reinforce the processed parts on the island 12, thereby improving the curing quality and bonding strength.

[0082] Example 2 Building upon Embodiment 1, this embodiment further addresses the technical problem of burrs, microcracks, or tears easily generated during the final separation of the island portion 12 from the insulating board 1 body via conventional mechanical punching, affecting the product's appearance and electrical performance. Furthermore, in Embodiment 1, the pressure plate 43 is a rigid structure, which may cause impact damage to the island portion 12 or the mounted chip during the pressing process. Therefore, this embodiment introduces a flexible pressure plate 43 and an integrated cutter design to achieve precise cutting under coordinated upper and lower clamping, while simultaneously protecting the product through flexible contact.

[0083] The difference between this embodiment and Embodiment 1 is that: A cutter (not shown in the figure) is provided on the outer side of the pressure plate 43. The cutter corresponds to the connection between the island-shaped part 12 and the insulating plate 1. The cutting edge of the cutter is checked regularly to ensure sharpness, so that the cut surface is smooth and burr-free.

[0084] The pressure plate 43 at the bottom of the cylinder extension end is made of flexible material.

[0085] When it is necessary to separate the island section 12 into individual units, the lifting assembly 41 drives the pressure plate 43 and the cutter to press down together. Since the pressure plate 43 is made of flexible material, during the pressing process, the pressure plate 43 first contacts the upper surface of the island section 12 and distributes the pressure evenly through flexible deformation. As the pressing continues, the cutter gradually approaches the connecting part.

[0086] At this time, the lifting component 31 lifts the supporting island 12 from below, and the detection value of the pressure sensor gradually increases. By setting a pressure threshold P2 in the pressure sensor, when the lifting component 41 continues to press down and the pressure threshold reaches P2, the telescopic component 312 (i.e., the first electric push rod) retracts and moves downward. The thin pad 316 at the telescopic end of the telescopic component 312 can still maintain stable support for the island 12 with a certain compression space.

[0087] The thickness of the thin pad 316 at the telescopic end of the telescopic member 312 can be selected according to the thickness at which the cutter can cut the connection between the island-shaped part 12 and the insulating plate 1. This ensures that the cutter can move down once at the telescopic end of the telescopic member 312 and that the island-shaped part 12 has a certain amount of compression space for stable support. Then, with the subsequent downward pressure of the lifting assembly 41, the purpose of cutting the island-shaped part 12 off the insulating plate 1 can be achieved.

[0088] The specific cutting process is as follows: In the initial state, the lifting component 31 is lifted into place, the pressure reaches P1, the island part 12 is stably supported, the upper pressing mechanism 4 presses down, the flexible pressure plate 43 contacts the upper surface of the island part 12, the cutting blade is aligned with the connecting part, as the pressure is pressed down, the pressure sensor detection value rises, when it reaches P2, the first electric push rod retracts a certain distance, the thin pad layer 316 is compressed and deformed, and the island part 12 moves down accordingly.

[0089] The cutter continues to press down, and the blade cuts into the connecting part. Since the island part 12 is clamped and fixed from above and below, the connecting part breaks under the action of precisely controlled shearing force. After cutting, the lifting assembly 31 retracts completely, and the finished island part 12 is taken away by the transfer mechanism.

[0090] Compared with traditional mechanical punching, this top-bottom coordinated clamping and cutting method has the following advantages: First, the cutting surface is flat, without tearing or burrs; second, the cutting force is controllable, avoiding impact damage to the CMOS chip and tuning fork wafer on the island part 12; third, the cutting position is precise, and the residual amount of the connecting part is controllable.

[0091] In addition, the pressure plate 43 at the cylinder extension end can also be used to level the insulating plate 1 after it has arched upwards.

[0092] It is understandable that limiting grooves 21 are provided on the inner side of the support blocks 2 at the four ends of the insulating plate 1; the limiting grooves 21 correspond to the positions of the four ends of the insulating plate 1.

[0093] In use, a set of lifting components 41 can be positioned above the center of the insulating plate 1. The lifting components 41 press down on the insulating plate 1, causing it to expand outwards under the action of the limiting groove 21 inside the support block 2. During this process, the photoelectric detection module 5 detects that the insulating plate 1 is horizontally stable, and the telescopic end of the lifting component 41 maintains its current position. Subsequent processing operations can then be performed.

[0094] The principle of the leveling process is as follows: When the insulating plate 1 is in an arched state, the middle part protrudes upward and the four corners are supported by the support blocks 2. When the pressing mechanism 4 applies pressure downward from the center, the insulating plate 1 undergoes downward bending deformation. Since the four corners are constrained by the limiting grooves 21, the insulating plate 1 undergoes lateral elongation while deforming downward, and the arching deformation is eliminated. When the photoelectric detection module 5 detects that the height difference of each detection point is less than the preset value, it determines that the leveling is completed. The lifting component 41 maintains the current position, forming a rigid constraint on the insulating plate 1, and then proceeds with subsequent processing.

[0095] Example 3 Building upon Embodiments 1 and 2, this embodiment further addresses the technical problem of limited movement range of a single pressing mechanism 4 for large-scale array production, thus restricting production efficiency. Furthermore, frequent movement of the pressing mechanism 4 is required when switching between the leveling process and the island section 12 processing steps, resulting in long auxiliary times. Therefore, this embodiment introduces a dual pressing mechanism 4 design to achieve parallel operation and improve production efficiency.

[0096] like Figure 12 As shown, the difference between this embodiment and Embodiment 1 and Embodiment 2 is that: The pressing mechanism 4 is provided in two sets, namely the first pressing mechanism and the second pressing mechanism.

[0097] The first pressing mechanism is used to prevent deformation of the insulating plate 1, that is, it is specifically used for the leveling process. The first pressing mechanism is located above the center of the insulating plate 1. Its pressing plate 43 can be a larger flat plate, which can cover the central area of ​​the insulating plate 1 and is used to press down and level the insulating plate 1 as a whole.

[0098] The second pressing mechanism acts on the island-shaped portion 12, specifically for the processing of the island-shaped portion 12. The size of the pressure plate 43 of the second pressing mechanism matches that of a single island-shaped portion 12, and it is used to press down and fix the island-shaped portion 12 or to cut it in conjunction with other processes. The first pressing mechanism is used to process the island-shaped portion 12 on the left side, and the second pressing mechanism is used to process the island-shaped portion 12 on the right side. Alternatively, the first pressing mechanism is used for leveling, and the second pressing mechanism is used for processing, with the two working alternately.

[0099] The specific work process is as follows: After loading, the first pressing mechanism moves to the center of the insulating plate 1, presses down to level it, and holds it in place after the photoelectric detection module 5 confirms it is level. The second pressing mechanism starts from the right side and processes each island 12 in sequence (such as chip mounting, dispensing, pressing, etc.). When the processing on the right side is completed, the first pressing mechanism releases, the insulating plate 1 is finely adjusted and leveled again, and the second pressing mechanism moves to the left side to continue processing. After all processing is completed, the first pressing mechanism levels it again, and the second pressing mechanism works with the lifting assembly 31 to separate the individual components.

[0100] The advantages of the dual pressing mechanism 4 design are: first, leveling and processing can be carried out in parallel. When the first pressing mechanism is in the leveling state, the second pressing mechanism can move freely on the other side for processing, reducing auxiliary time; second, it avoids the accumulation of positioning errors caused by frequent switching of functions of a single mechanism; and third, for ultra-long arrays, it can achieve partitioned leveling and improve leveling accuracy.

[0101] Please continue reading. Figure 6 and Figure 12 Furthermore, sliding mechanisms 45 are provided at the bottom of both ends of the guide frame 421. The two ends of the guide frame 421 are connected to the sliding mechanisms 45 via support legs 451. The sliding mechanisms 45 are horizontal linear sliding mechanisms, which can control the lifting assembly 41 and the horizontal linear moving assembly 42 to move along the linear arrangement direction of the multiple array slots 11.

[0102] Understandably, the sliding mechanism 45 includes a linear guide and a ball screw driven by a servo motor (not shown in the figure). The stroke of the linear guide covers the arrangement range of all array slots 11 on the insulating plate 1.

[0103] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

[0104] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

Claims

1. A method for assembling a tuning fork crystal oscillator with integrated circuitry, characterized in that, Includes the following steps: S1: Prefabricated integrated base, providing an insulating plate (1), forming multiple island-shaped parts (12) on the insulating plate (1), laying conductive lines, installing a metal base and metal leads (14), forming a support column and a CMOS chip mounting stage; S2: The CMOS oscillator circuit chip is mounted on the IC mounting stage of the island part (12), the chip pins are electrically connected to the conductive line by gold wire ball soldering, and the bottom filler material is filled and cured. S3: Push the tuning fork chip horizontally to the support column position, apply conductive material, and after curing, form a raised step structure to make the tuning fork chip and the island part (12) suspended space apart. S4: Before packaging, the integrated circuit of the CMOS chip and tuning fork wafer is functionally tested and frequency calibrated using a probe station. S5: Place the sealing cover over the base and perform vacuum sealing; S6: Cut off the connection between the island-shaped part (12) and the insulating plate (1) to achieve single-unit separation; S7: Conduct electrical performance testing, aging screening, and packaging of individual products; In steps S2 to S6, an adaptive support assembly device is used in conjunction with the processing. The adaptive support assembly device includes a lifting component (31) located below the insulating plate (1) and an upper pressing mechanism (4) located above the insulating plate (1). The lifting component (31) selectively lifts and supports the island-shaped part (12) from below, and the upper pressing mechanism (4) presses it from above, forming a coordinated clamping from above and below.

2. The method for assembling a tuning fork crystal oscillator with integrated circuitry according to claim 1, characterized in that, The lifting assembly (31) includes a slide (311), a first electric push rod (312), a thin pad (316), and a pressure sensor (317). The first electric push rod (312) has a self-locking structure, and the pressure sensor (317) is preset with a first pressure threshold.

3. The method for assembling a tuning fork crystal oscillator with integrated circuitry according to claim 2, characterized in that, The pressing mechanism (4) includes a lifting assembly (41) and a pressure plate (43). The pressure plate (43) is made of flexible material, and a cutter (44) is provided on the outside of the pressure plate (43).

4. The method for assembling a tuning fork crystal oscillator with integrated circuitry according to claim 2, characterized in that, In step S2, the lifting component (31) lifts the target island part (12) until the pressure reaches the first pressure threshold and locks it, and the upper pressing mechanism (4) presses down to form a coordinated clamping with the lifting component (31).

5. The method for assembling a tuning fork crystal oscillator with integrated circuitry according to claim 2, characterized in that, In step S4, the lifting component (31) lifts and supports the island-shaped part (12) to ensure stable contact between the probe and the pad.

6. The method for assembling a tuning fork crystal oscillator with integrated circuitry according to claim 3, characterized in that, In step S6, the lifting assembly (31) lifts the island part (12) until the pressure reaches the first pressure threshold and locks it; the pressing mechanism (4) presses down, the pressure plate (43) contacts the upper surface of the island part (12), and the cutter (44) aligns with the connecting part; when the pressure rises to the second pressure threshold, the first electric push rod (312) retracts, and the cutter (44) cuts off the connecting part to achieve single-unit separation.

7. The method for assembling a tuning fork crystal oscillator with integrated circuitry according to claim 1, characterized in that, The adaptive support assembly device further includes a moving component (32) for driving the lifting component (31) to move horizontally, so that the lifting component (31) corresponds to different island sections (12).

8. The method for assembling a tuning fork crystal oscillator with integrated circuitry according to claim 1, characterized in that, The pressing mechanism (4) is provided in two sets, including a first pressing mechanism and a second pressing mechanism; the first pressing mechanism is used to level the insulating plate (1), and the second pressing mechanism is used to process the island part (12).

9. The method for assembling a tuning fork crystal oscillator with integrated circuitry according to claim 4, characterized in that, In step S4, the photoelectric detection module (5) detects the horizontal state of the insulating plate (1). When arching deformation occurs, the pressing mechanism (4) moves to the center of the insulating plate (1) and presses down, cooperating with the limiting groove (21) on the inner side of the support block (2) to level it.

Images