Network communication data encryption transmission device

Abstract

This invention relates to the field of network data encryption transmission device technology, specifically a network communication data encryption transmission device, including a housing with side plates on both sides. The invention improves heat dissipation efficiency by utilizing a heat sink in conjunction with a cooling fan. Cold air from outside the housing enters the housing cavity through the air inlet via the gap between the housing and the inner partition plate, and through the first air guide hole. Under the action of the cooling fan, hot air inside the housing is discharged through the air outlets in the middle of the partition plate and the bottom plate, thereby improving the flow of hot and cold air inside and outside the housing. Simultaneously, when dust enters the gap between the housing and the inner partition plate with the cold air through the air inlet, the inner partition plate and the partition plate separate the dust from the circuit board, thus reducing the amount of dust entering the housing cavity. This solves the problem of dust accumulation and blockage of heat dissipation holes during long-term operation of network encryption devices, leading to premature aging of electronic components.

Description

Technical Field

[0001] This invention relates to the field of network data encryption transmission device technology, specifically a network communication data encryption transmission device. Background Technology

[0002] Network encryption devices are hardware devices that encrypt data transmitted over a network. They fall under the category of computer data security technology and employ hardware encryption mechanisms to protect data at the link, node, and terminal levels. Their characteristics include fast processing, high security, and ease of deployment. They are primarily used in commercial, military, and network communication security fields. The main functions of network encryption devices are achieved through encryption chips.

[0003] Currently, in existing technologies, network encryption devices are installed inside weak current boxes. The space inside the weak current box has limited mobility and is prone to dust accumulation. This can cause the network devices to overheat during long-term operation, leading to premature aging of internal electronic components. Therefore, there is a need to propose a network communication data encryption transmission device. Summary of the Invention

[0004] To address the shortcomings of existing technologies, such as the problem that existing network encryption devices are prone to dust accumulation and blockage of heat dissipation holes during long-term operation, leading to premature aging of electronic components, this invention proposes a network communication data encryption transmission device.

[0005] The technical solution adopted by the present invention to solve its technical problem is: a network communication data encryption transmission device, including a housing, side plates are provided on both sides of the housing, an air inlet is provided on the outer wall of the housing, a circuit board is provided in the inner cavity of the housing, and a ventilation and heat dissipation mechanism is provided in the inner cavity of the housing near the bottom of the circuit board;

[0006] The ventilation and heat dissipation mechanism includes an inner partition, which is disposed on the inner wall of the housing. A gap is provided between the inner partition and the inner wall of the housing. A partition plate is fixedly connected to the inner wall of the inner partition. The partition plate is disposed at the bottom of the circuit board. A heat dissipation sleeve is disposed at the bottom of the partition plate. A heat dissipation fan is disposed at the bottom of the heat dissipation sleeve. A base plate is disposed at the bottom of the housing. An air outlet is opened on the surface of the base plate. A first air guide hole is opened at the top of the inner partition.

[0007] Preferably, the bottom of the housing is provided with a lower edge, the base plate is inserted into the inner side of the lower edge, and a gap is provided between the base plate and the cooling fan.

[0008] Preferably, the surface of the partition plate is provided with a through groove, and one end of the heat dissipation sleeve is inserted into the inside of the through groove.

[0009] Preferably, a heat dissipation copper plate is fixedly connected to the inner side of the heat dissipation sleeve. The heat dissipation copper plate is distributed in a circle and passes through the axis of the heat dissipation sleeve.

[0010] Preferably, a bolt is provided at the bottom of the cooling fan, one end of which passes through the cooling fan and is threaded to the bottom of the heat sink.

[0011] Preferably, the air inlet is inclined, and a dustproof plate is provided on the outer wall of the housing near the upper edge of the air inlet, and the side cross-section of the dustproof plate is arc-shaped.

[0012] Preferably, a second air guide hole is provided on both sides of the inner partition, and the second air guide hole extends through the gap between the inner partition and the shell.

[0013] The advantages of this invention are: This invention improves heat dissipation efficiency by utilizing a heat sink in conjunction with a cooling fan. Cold air from outside the housing enters the housing cavity through the air inlet and the gap between the housing and the inner partition via the first air guide hole. Under the action of the cooling fan, hot air inside the housing is discharged through the air outlets in the middle of the partition plate and the bottom plate, thereby improving the flow of hot and cold air inside and outside the housing. At the same time, when dust enters the gap between the housing and the inner partition plate with the cold air through the air inlet, the inner partition plate and the partition plate separate the dust from the circuit board, thereby reducing the amount of dust entering the housing cavity. This solves the problem that network encryption devices are prone to dust accumulation and blockage of heat dissipation holes during long-term operation, leading to premature aging of electronic components. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a schematic diagram of the structure of the housing of the present invention, viewed from the side. Figure 3 This is a schematic diagram of the ventilation and heat dissipation mechanism of the present invention; Figure 4 This is a schematic diagram of the structure of the heat sink and cooling fan of the present invention; Figure 5 For the present invention Figure 2 Enlarged structural diagram of section A in the middle.

[0016] In the diagram: 1. Housing; 11. Air inlet; 12. Lower edge; 13. Dustproof plate; 2. Side plate; 3. Ventilation and heat dissipation mechanism; 31. Inner partition; 32. First air guide hole; 33. Partition plate; 34. Through groove; 35. Heat dissipation sleeve; 36. Cooling fan; 37. Base plate; 38. Air outlet; 39. Heat dissipation copper plate; 310. Bolt; 311. Second air guide hole; 4. Circuit board. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail. This application discloses a network communication data encryption transmission device. (Refer to...) Figures 1-5 A network communication data encryption transmission device includes a housing 1, with side plates 2 on both sides of the housing 1. An air inlet 11 is provided on the outer wall of the housing 1, and a circuit board 4 is provided in the inner cavity of the housing 1. A ventilation and heat dissipation mechanism 3 is provided in the inner cavity of the housing 1 near the bottom of the circuit board 4. The side plates 2, the housing 1, and the ventilation and heat dissipation mechanism 3 form a protective shell. The circuit board 4 is placed in the inner cavity of the side plates 2 and the housing 1. When the circuit board 4 is running stably, it will generate heat. The ventilation and heat dissipation mechanism 3 accelerates the entry of cold air from outside the housing 1 into the interior of the housing 1 through the air inlet 11, and at the same time accelerates the exhaust of hot air inside the housing 1, thereby accelerating the exchange of hot and cold air inside and outside the housing 1 and improving the heat dissipation effect. When dust enters the interior of the housing 1 with the cold air, the ventilation and heat dissipation mechanism 3 will separate the dust from the circuit board 4, thereby reducing the impact of dust on the internal electronic components. The ventilation and heat dissipation mechanism 3 includes an inner partition 31, which is disposed on the inner wall of the housing 1. A gap is provided between the inner partition 31 and the inner wall of the housing 1. A partition plate 33 is fixedly connected to the inner wall of the inner partition 31. The partition plate 33 is disposed at the bottom of the circuit board 4. A heat dissipation sleeve 35 is disposed at the bottom of the partition plate 33. A heat dissipation fan 36 is disposed at the bottom of the heat dissipation sleeve 35. A bottom plate 37 is disposed at the bottom of the housing 1. An air outlet 38 is opened on the surface of the bottom plate 37. A first air guide hole 32 is opened at the top of the inner partition 31. Heat radiation is generated through the circuit board 4 inside the housing 1 during operation. This causes the air inside the housing 1 to heat up. The heat dissipation effect is improved by using the heat dissipation sleeve 35 in conjunction with the cooling fan 36. The cold air outside the housing 1 enters the interior of the housing 1 through the air inlet 11, through the gap between the inner partition 31 and the housing 1, and through the first air guide hole 32. The dust is blocked in the gap between the housing 1 and the inner partition 31. The hot air inside the housing 1 is guided by the cooling fan 36 and discharged from the middle of the partition plate 33 through the air outlet 38 of the bottom plate 37. This achieves the purpose of improving the exchange of hot and cold air inside and outside the housing 1 and reducing the impact of dust on electronic components.

[0019] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4 The bottom of the housing 1 has a lower edge 12, and a base plate 37 is inserted into the inner side of the lower edge 12. A gap is provided between the base plate 37 and the cooling fan 36. A through groove 34 is opened on the surface of the partition plate 33. One end of the heat sink 35 is inserted into the through groove 34. A heat sink copper plate 39 is fixedly connected to the inner side of the heat sink 35. The heat sink copper plate 39 is distributed in a circle and passes through the axis of the heat sink 35. A bolt 310 is provided at the bottom of the cooling fan 36. One end of the bolt 310 passes through the cooling fan 36 and is threaded to the bottom of the heat sink 35. By utilizing the housing 1. The side plate 2 and the bottom plate 37 of the lower edge 12 of the shell 1 form a complete protective shell. A heat dissipation copper plate 39 is set in the axial hole of the heat dissipation sleeve 35 to accelerate the heat radiation out of the shell 1, thereby improving the heat dissipation efficiency. The heat dissipation sleeve 35 and the cooling fan 36 are fixed together to the bottom of the through groove 34 of the partition plate 33 by bolts 310. The heat dissipation sleeve 35 and the cooling fan 36 work together to exhaust the hot air in the shell 1. The hot air is discharged into the shell 1 through the through groove 34 of the partition plate 33 and then through the air outlet 38 of the bottom plate 37, thereby achieving the purpose of accelerating heat dissipation.

[0020] Reference Figure 2 and Figure 4The air inlet 11 is inclined, and a dustproof plate 13 is provided on the outer wall of the housing 1 near the upper edge of the air inlet 11. The side cross-section of the dustproof plate 13 is arc-shaped. The inner partition 31 has a second air guide hole 311 on both sides. The second air guide hole 311 extends through the gap between the inner partition 31 and the housing 1, and draws out the hot air inside the housing 1. This allows the cold air outside the housing 1 to enter the interior of the housing 1 through the air inlet 11, the gap between the housing 1 and the inner partition 31, and the first air guide hole 32, thereby achieving the purpose of exchanging hot and cold air inside and outside the housing 1. The dustproof plate 13 provided on the upper edge of the air inlet 11 reduces the probability of dust entering the housing 1. The dust enters the gap between the housing 1 and the inner partition 31 through the inclined air inlet 11 and stays there. The airflow generated by the cooling fan 36 will draw out the dust staying between the housing 1 and the inner partition 31 through the second air guide hole 311 and the air outlet 38, thereby achieving the purpose of separating the dust from the circuit board 4.

[0021] Working principle: In use, the circuit board 4 is installed on the housing 1. The housing 1, side plate 2, and bottom plate 37 of the lower edge 12 of the housing 1 form a complete protective shell. The ventilation and heat dissipation mechanism 3 improves the efficiency of hot and cold air exchange inside and outside the housing 1, thereby improving the heat dissipation effect. The cooling fan 36 and the heat dissipation sleeve 35 are fixed together to the bottom of the through groove 34 of the partition plate 33 with bolts 310. The heat radiation generated by the operation of the circuit board 4 causes the air inside the housing 1 to heat up. The cooling fan 36, together with the heat dissipation copper plate 39 on the heat dissipation sleeve 35, accelerates the heat dissipation effect. The cold air outside the housing 1 flows out from the heat dissipation plate 39. The air inlet 11 enters the interior of the housing 1 through the gap between the inner partition 31 and the housing 1 via the first air guide hole 32. The hot air inside the housing 1 is discharged by the cooling fan 36 through the through slot 34 and the air outlet 38 of the bottom plate 37. The dustproof plate 13 on the upper edge of the air inlet 11 blocks most of the dust from entering through the air inlet 11. A small amount of dust enters the gap between the housing 1 and the inner partition 31 and is guided by the airflow of the cooling fan 36 to be discharged through the second air guide hole 311 and the air outlet 38. This improves the efficiency of hot and cold air exchange inside and outside the housing 1 and reduces the impact of dust on electronic components.

[0022] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed invention.

Claims

1. A network communication data encryption transmission device, comprising a housing (1), characterized in that: The housing (1) is provided with side plates (2) on both sides, and an air inlet (11) is provided on the outer wall of the housing (1). A circuit board (4) is provided in the inner cavity of the housing (1), and a ventilation and heat dissipation mechanism (3) is provided in the inner cavity of the housing (1) near the bottom of the circuit board (4). The ventilation and heat dissipation mechanism (3) includes an inner partition (31), which is disposed on the inner wall of the housing (1). A gap is provided between the inner partition (31) and the inner wall of the housing (1). A partition plate (33) is fixedly connected to the inner wall of the inner partition (31). The partition plate (33) is disposed at the bottom of the circuit board (4). A heat dissipation sleeve (35) is disposed at the bottom of the partition plate (33). A heat dissipation fan (36) is disposed at the bottom of the heat dissipation sleeve (35). A bottom plate (37) is disposed at the bottom of the housing (1). An air outlet (38) is opened on the surface of the bottom plate (37). A first air guide hole (32) is opened at the top of the inner partition (31).

2. The network communication data encryption transmission device according to claim 1, characterized in that: The bottom of the housing (1) is provided with a lower edge (12), and the base plate (37) is inserted into the inner side of the lower edge (12). A gap is provided between the base plate (37) and the cooling fan (36).

3. The network communication data encryption transmission device according to claim 1, characterized in that: The partition plate (33) has a through groove (34) on its surface, and one end of the heat dissipation sleeve (35) is inserted into the inside of the through groove (34).

4. The network communication data encryption transmission device according to claim 1, characterized in that: A heat dissipation copper plate (39) is fixedly connected to the inner side of the heat dissipation sleeve (35). The heat dissipation copper plate (39) is distributed in a circle and passes through the axis of the heat dissipation sleeve (35).

5. The network communication data encryption transmission device according to claim 1, characterized in that: The bottom of the cooling fan (36) is provided with a bolt (310), one end of which passes through the cooling fan (36) and is threaded to the bottom of the heat sink (35).

6. The network communication data encryption transmission device according to claim 1, characterized in that: The air inlet (11) is inclined, and a dustproof plate (13) is provided on the outer wall of the housing (1) near the upper edge of the air inlet (11). The side cross section of the dustproof plate (13) is arc-shaped.

7. The network communication data encryption transmission device according to claim 1, characterized in that: The inner partition (31) has a second air guide hole (311) on both sides, and the second air guide hole (311) extends through the gap between the inner partition (31) and the shell (1).

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