A radio frequency transceiver chip and electronic device

Abstract

This invention proposes an RF transceiver chip and electronic device. During cross-calibration of the j-th RF channel, a coupling path switching module couples the RF signal output from the RF output terminal of the transmit link in the j-th RF channel to the feedback input terminal of the receive link in the i-th RF channel as a cross-feedback signal. The cross-feedback processing result is transmitted to a control module. Based on the cross-feedback processing result, a first-type nonlinear distortion characterization quantity of the RF power amplifier in the j-th RF channel is determined. The RF signal transmitted from the j-th RF channel is coupled to the receive link in the i-th RF channel as a cross-feedback signal. Utilizing the natural physical distance between the two independent RF channels in the chip layout, the feedback signal is ensured to be free from direct crosstalk from the high-power signal of the same channel. This physically suppresses co-frequency crosstalk and noise floor rise of the feedback observation path caused by the transmitted signal of the same channel, significantly improving the isolation index.

Description

Technical Field

[0001] This invention relates to the field of communication technology, and more specifically, to a radio frequency transceiver chip and electronic device. Background Technology

[0002] In ultra-high-speed wireless communication systems such as Wi-Fi 7 (IEEE 802.11be), the radio frequency power amplifier (PA) is the main source of nonlinearity in the signal link. To achieve a high power-added efficiency (PAE) for the PA, its operating point is usually pushed closer to the saturation region, but this significantly degrades the linearity of the device.

[0003] To achieve an extremely low bit error rate under 4096-QAM high-order modulation, the transmitter must employ digital predistortion (DPD) technology to compensate for the nonlinear distortion of the power amplifier (PA).

[0004] How to accurately obtain the nonlinear distortion characteristics of RF power amplifiers has become an urgent problem to be solved. Summary of the Invention

[0005] The purpose of this invention is to provide a radio frequency transceiver chip and electronic device to improve the above-mentioned problems.

[0006] To achieve the above objectives, the technical solutions adopted in the embodiments of the present invention are as follows: In a first aspect, embodiments of the present invention provide a radio frequency transceiver chip, the radio frequency transceiver chip including a control module, a coupling path switching module, and N radio frequency channels, the radio frequency channels including a receiving link and a transmitting link; The outputs of all receiving links and the inputs of all transmitting links are connected to the control module; The feedback input terminals of all receiving links and the RF output terminals of all transmitting links are connected to the coupling path switching module. When performing cross-calibration on the j-th RF channel, the coupling path switching module is used to couple the RF signal output from the RF output terminal of the transmit link in the j-th RF channel to the feedback input terminal of the receive link in the i-th RF channel as a cross-feedback signal. Among them, the i-th radio frequency channel is the radio frequency channel that is physically farthest from the j-th radio frequency channel in the radio frequency transceiver chip; The receiving link in the i-th radio frequency channel is used to process the cross-feedback signal and transmit the cross-feedback processing result to the control module; The control module is used to determine the first type of nonlinear distortion characterization quantity of the RF power amplifier in the j-th RF channel based on the cross-feedback processing result.

[0007] Secondly, embodiments of the present invention provide an electronic device including the aforementioned radio frequency transceiver chip.

[0008] Compared to existing technologies, the RF transceiver chip and electronic device provided in this embodiment of the invention, when performing cross-calibration on the j-th RF channel, uses a coupling path switching module to couple the RF signal output from the RF output terminal of the transmit link in the j-th RF channel to the feedback input terminal of the receive link in the i-th RF channel as a cross-feedback signal; transmits the cross-feedback processing result to the control module; and determines the first type of nonlinear distortion characterization quantity of the RF power amplifier in the j-th RF channel based on the cross-feedback processing result. The RF signal transmitted from the j-th RF channel is coupled to the receive link in the i-th RF channel as a cross-feedback signal. Utilizing the natural physical distance between the two independent RF channels in the chip layout, the isolation of the feedback path is increased from 20-30dB in the traditional single-channel configuration to over 40-50dB, ensuring that the feedback signal is not directly interfered with by the high-power signal of the same channel. This physically suppresses the co-frequency crosstalk and noise floor rise of the transmitted signal of the same channel to the feedback observation path, significantly improving the isolation index.

[0009] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0010] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the structure of the radio frequency transceiver chip provided in an embodiment of the present invention.

[0012] Figure 2 This is a schematic diagram of the transmission link and the receiving link provided in an embodiment of the present invention. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0014] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0015] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, in the description of this invention, terms such as "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0016] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0017] In the description of this invention, it should be noted that the terms "upper," "lower," "inner," "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of this invention is usually placed when in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0018] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0019] The following detailed description of some embodiments of the present invention is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0020] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of the radio frequency transceiver chip provided in an embodiment of the present invention. The radio frequency transceiver chip includes a control module, a coupling path switching module, and N radio frequency channels. In the figure, Ci represents the i-th radio frequency channel, Cj represents the j-th radio frequency channel, N is greater than or equal to 2, 1≤i≤N, 1≤j≤N, and j≠i. The radio frequency channel includes a receiving link and a transmitting link. It should be understood that a radio frequency power amplifier is provided in each transmitting link.

[0021] The outputs of all receive links and the inputs of all transmit links are connected to the control module.

[0022] The feedback input terminals of all receiving links and the RF output terminals of all transmitting links are connected to the coupling path switching module; the RF input terminals of all receiving links are used to connect to the RF antenna.

[0023] DPDi represents the feedback input terminal of the receive link of the i-th RF channel, DPDj represents the feedback input terminal of the receive link of the j-th RF channel, RFOi represents the RF output terminal of the transmit link of the i-th RF channel, RFOj represents the RF output terminal of the transmit link of the j-th RF channel, RFIi represents the RF input terminal of the receive link of the i-th RF channel, and RFIj represents the RF input terminal of the receive link of the j-th RF channel.

[0024] When performing cross-calibration on the j-th RF channel, the coupling path switching module is used to couple the RF signal output from the RF output terminal of the transmit link in the j-th RF channel to the feedback input terminal of the receive link in the i-th RF channel as a cross-feedback signal.

[0025] Among them, the i-th radio frequency channel is the radio frequency channel that is physically farthest from the j-th radio frequency channel in the radio frequency transceiver chip.

[0026] It should be understood that the control module can send data to the transmit link in the RF channel, and after processing by the transmit link in the RF channel, send RF signals back.

[0027] The receiving link in the i-th RF channel is used to process the cross-feedback signal and transmit the cross-feedback processing result to the control module.

[0028] The control module is used to determine the first type of nonlinear distortion characterization of the RF power amplifier in the j-th RF channel based on the cross-feedback processing results.

[0029] In the RF transceiver chip provided in this embodiment of the invention, the RF signal transmitted by the j-th RF channel is coupled to the receiving link in the i-th RF channel as a cross-feedback signal. Utilizing the natural physical distance between the two independent RF channels in the chip layout, the isolation of the feedback path is increased from 20-30dB in the traditional single-channel configuration to over 40-50dB. This ensures that the feedback signal is not directly interfered with by the high-power signal of the same channel, physically suppressing the co-frequency crosstalk and noise floor increase of the transmitted signal of the same channel on the feedback observation path, significantly improving the isolation performance.

[0030] Optionally, when performing self-calibration on the i-th RF channel, the coupling path switching module is used to couple the RF signal output from the RF output terminal of the transmit link in the i-th RF channel to the feedback input terminal of the receive link in the i-th RF channel as a self-feedback signal. The receiving link in the i-th radio frequency channel is used to process the self-feedback signal and transmit the self-feedback processing result to the control module; The control module is used to determine the second type of nonlinear distortion characterization quantity of the RF power amplifier in the i-th RF channel based on the self-feedback processing result.

[0031] In scenarios where isolation requirements are not high, such as when using a self-loopback path for resonant point calibration (including LO / TX / RX resonant point calibration), using a self-loopback path can simplify implementation complexity and is unaffected by isolation requirements. Another example is using a sub-commutation path to enable the DAC to output single tones, looping back to the ADC as a calibration reference signal for the ADC circuit; this scenario also has low isolation requirements.

[0032] The radio frequency transceiver chip provided in this embodiment of the invention supports switching between radio frequency channel self-calibration and cross-calibration, providing a hardware foundation for resource scheduling under multi-link operation (MLO).

[0033] Based on the current isolation test results of the link, it can independently select the self-calibration or cross-calibration mode to flexibly cope with thermal distortion or interference fluctuations when multiple links are running concurrently.

[0034] Alternatively, please continue to refer to Figure 1 The coupling path switching module includes N coupling attenuators (ATTj in the figure represents the j-th coupling attenuator) and N switches (Sj in the figure represents the j-th switch).

[0035] The RF output terminal (RFOj) of the transmit link of the j-th RF channel is connected to the input terminal of the j-th coupling attenuator (ATTj), the output terminal of the j-th coupling attenuator is connected to the first terminal of the j-th switch (Sj), the second terminal of the j-th switch is connected to the feedback input terminal (DPDi) of the receive link of the i-th RF channel, and the third terminal of the j-th switch is connected to the feedback input terminal (DPDj) of the receive link of the j-th RF channel.

[0036] In the figure, 1, 2, and 3 represent the first, second, and third terminals of the j-th switch Sj, respectively. When the first and second terminals of the j-th switch Sj are turned on, the j-th RF channel is cross-calibrated. When the first and third terminals of the i-th switch Si (not shown in the figure) are turned on, the i-th RF channel is self-calibrated.

[0037] Optionally, the control module is also used to adjust the gain of the j coupling attenuators in real time according to the transmit power level (TxPower) of the transmit link of the j-th RF channel.

[0038] This limits the power of the feedback signal, ensuring that the signal strength entering the receiving link of the i-th RF channel is within the set range, preventing signal saturation, and avoiding the impact of saturation on the accuracy of the nonlinear distortion characterization.

[0039] Alternatively, please refer to Figure 2 , Figure 2 This is a schematic diagram of the transmit and receive links provided in an embodiment of the present invention. The transmit link includes a digital-to-analog converter (DAC), a transmitter low-pass filter (TXLPF), an up-conversion mixer (UP-MIX), and a radio frequency power amplifier (PA) connected in sequence.

[0040] The input terminal of the digital-to-analog converter is used as the input terminal of the transmission link and is connected to the control module; The output of the RF power amplifier serves as the RF output of the transmit link and is connected to the coupling path switching module.

[0041] Alternatively, please continue to refer to Figure 2 The receiving link includes a phase shifter (PS), a first transconductance unit (GM1), a downconversion mixer (DN-MIX), a transimpedance amplifier (TIA), a receiver low-pass filter (RXLPF), and an analog-to-digital converter (ADC) connected in sequence.

[0042] The input of the phase shifter serves as the feedback input of the receiving link and is connected to the coupling path switching module.

[0043] The output of the analog-to-digital converter is connected to the control module as the output of the receiving link.

[0044] Optionally, the RF transceiver chip may also include a phase-locked loop (PLL, not shown in the figure). The downconversion mixer (DN-MIX) and upconversion mixer (UP-MIX) in the i-th RF channel are connected to a phase-locked loop; The downconversion mixer (DN-MIX) and upconversion mixer (UP-MIX) in the j-th RF channel are connected to a phase-locked loop.

[0045] The phase-locked loop is used to provide coherent local oscillator signals to the down-conversion mixer (DN-MIX) and up-conversion mixer (UP-MIX) in the i-th RF channel and the down-conversion mixer (DN-MIX) and up-conversion mixer (UP-MIX) in the j-th RF channel.

[0046] Even in cross-channel mode, because the local oscillators are from the same source, the feedback signal does not have frequency offset drift, allowing the isolated feedback samples to be precisely aligned with the original transmitted signal in the digital domain. This ensures that the transmitted signal and the cross-link feedback signal are completely synchronized on the physical local oscillator, eliminating the frequency offset and phase rotation caused by the independent operation of the PLL. This allows the system to achieve high-precision coherent sampling in the digital domain without complex carrier recovery.

[0047] Optionally, the phase shifter is used to compensate for the path phase, and the residual substrate coupling interference can be further canceled by the phase cancellation principle, thereby extracting pure Tx nonlinear characteristics.

[0048] Optionally, the receiving link also includes a low-noise amplifier (LNA) and a second transconductance unit (GM2).

[0049] The input of the low-noise amplifier serves as the RF input of the receiving link, the output of the low-noise amplifier is connected to the input of the second transconductance unit, and the output of the second transconductance unit is connected to the input of the downconversion mixer (DN-MIX).

[0050] This invention also provides an electronic device, including the radio frequency transceiver chip described above.

[0051] In summary, the RF transceiver chip and electronic device provided in this embodiment of the invention, when performing cross-calibration on the j-th RF channel, uses a coupling path switching module to couple the RF signal output from the RF output terminal of the transmit link in the j-th RF channel to the feedback input terminal of the receive link in the i-th RF channel as a cross-feedback signal; transmits the cross-feedback processing result to the control module; and determines the first type of nonlinear distortion characterization quantity of the RF power amplifier in the j-th RF channel based on the cross-feedback processing result. The RF signal transmitted from the j-th RF channel is coupled to the receive link in the i-th RF channel as a cross-feedback signal. Utilizing the natural physical distance between the two independent RF channels in the chip layout, the isolation of the feedback path is increased from 20-30dB in the traditional single-channel configuration to over 40-50dB, ensuring that the feedback signal is not directly interfered with by the high-power signal of the same channel. This physically suppresses the co-frequency crosstalk and noise floor rise of the transmitted signal of the same channel to the feedback observation path, significantly improving the isolation index.

[0052] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

[0053] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A radio frequency transceiver chip, characterized in that, The radio frequency transceiver chip includes a control module, a coupling path switching module, and N radio frequency channels, wherein each radio frequency channel includes a receiving link and a transmitting link. The outputs of all receiving links and the inputs of all transmitting links are connected to the control module; The feedback input terminals of all receiving links and the RF output terminals of all transmitting links are connected to the coupling path switching module. When performing cross-calibration on the j-th RF channel, the coupling path switching module is used to couple the RF signal output from the RF output terminal of the transmit link in the j-th RF channel to the feedback input terminal of the receive link in the i-th RF channel as a cross-feedback signal. Among them, the i-th radio frequency channel is the radio frequency channel that is physically farthest from the j-th radio frequency channel in the radio frequency transceiver chip; The receiving link in the i-th radio frequency channel is used to process the cross-feedback signal and transmit the cross-feedback processing result to the control module; The control module is used to determine the first type of nonlinear distortion characterization quantity of the RF power amplifier in the j-th RF channel based on the cross-feedback processing result.

2. The radio frequency transceiver chip as described in claim 1, characterized in that, When performing self-calibration on the i-th radio frequency channel, the coupling path switching module is used to couple the radio frequency signal output from the radio frequency output terminal of the transmit link in the i-th radio frequency channel to the feedback input terminal of the receive link in the i-th radio frequency channel as a self-feedback signal. The receiving link in the i-th radio frequency channel is used to process the self-feedback signal and transmit the self-feedback processing result to the control module; The control module is used to determine the second type of nonlinear distortion characterization quantity of the RF power amplifier in the i-th RF channel based on the self-feedback processing result.

3. The radio frequency transceiver chip as described in claim 2, characterized in that, The coupling path switching module includes N coupling attenuators and N switches; The RF output terminal of the transmit link of the j-th RF channel is connected to the input terminal of the j-th coupling attenuator. The output terminal of the j-th coupling attenuator is connected to the first terminal of the j-th switch. The second terminal of the j-th switch is connected to the feedback input terminal of the receive link of the i-th RF channel. The third terminal of the j-th switch is connected to the feedback input terminal of the receive link of the j-th RF channel.

4. The radio frequency transceiver chip as described in claim 3, characterized in that, The control module is also used to adjust the gain of the j coupling attenuators in real time according to the transmit power level of the transmit link of the j-th RF channel.

5. The radio frequency transceiver chip as described in claim 1, characterized in that, The transmission link includes a digital-to-analog converter, a transmitter low-pass filter, an up-conversion mixer, and an RF power amplifier connected in sequence. The input terminal of the digital-to-analog converter serves as the input terminal of the transmission link and is connected to the control module. The output terminal of the radio frequency power amplifier serves as the radio frequency output terminal of the transmission link.

6. The radio frequency transceiver chip as described in claim 5, characterized in that, The receiving link includes a phase shifter, a first transconductance unit, a downconversion mixer, a transimpedance amplifier, a receiving low-pass filter, and an analog-to-digital converter connected in sequence. The input terminal of the phase shifter serves as the feedback input terminal of the receiving link; The output of the analog-to-digital converter serves as the output of the receiving link and is connected to the control module.

7. The radio frequency transceiver chip as described in claim 6, characterized in that, The radio frequency transceiver chip also includes a phase-locked loop; The downconversion mixer and the upconversion mixer in the i-th radio frequency channel are connected to the phase-locked loop; The downconversion mixer and the upconversion mixer in the j-th radio frequency channel are connected to the phase-locked loop; The phase-locked loop is used to provide coherent local oscillator signals to the downconverter and upconverter in the i-th RF channel and the downconverter and upconverter in the j-th RF channel.

8. The radio frequency transceiver chip as described in claim 6, characterized in that, The phase shifter is used to compensate for the path phase.

9. The radio frequency transceiver chip as described in claim 6, characterized in that, The receiving link also includes a low-noise amplifier and a second transconductance unit. The input terminal of the low-noise amplifier serves as the RF input terminal of the receiving link, and the output terminal of the low-noise amplifier is connected to the input terminal of the second transconductance unit. The output terminal of the second transconductance unit is connected to the input terminal of the downconversion mixer.

10. An electronic device, characterized in that, Includes the radio frequency transceiver chip according to any one of claims 1-9.

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