Circuit board structure, display screen, display device and attaching method

Abstract

This application relates to a circuit board structure, a display screen, a display device, and an attachment method, specifically in the field of insulating film technology. The circuit board structure includes a printed circuit board, multiple electronic components, an insulating component, and an integrated circuit. Each of the electronic components is disposed on the printed circuit board. The insulating component seals and covers the side of the printed circuit board where the electronic components are located. The integrated circuit is electrically connected to the printed circuit board. The insulating component includes multiple first and second attachment films. Each first attachment film covers one of the electronic components, and the second attachment film is attached to the side of the first attachment film facing away from the electronic component, completely covering the printed circuit board and the integrated circuit. This application can prevent short circuits caused by sweat intruding into the surface of the electronic components.

Description

Technical Field

[0001] This application relates to the field of insulating film technology, and in particular to a circuit board structure, display screen, display device and attachment method. Background Technology

[0002] In displays, FPCs (Flexible Printed Circuits) often require the application of insulating tape for insulation protection. FPCs contain several components to meet operational requirements. Due to the height difference between the components and the FPC surface, gaps can appear between the insulating tape and the edges of the components during application. Workers' sweat can easily seep through these gaps and into the component surface, causing short circuits and ultimately resulting in abnormal display. Summary of the Invention

[0003] Therefore, it is necessary to provide a circuit board structure, display screen, display device, and attachment method to address the problem of gaps between insulating tape and the edges of FPC components.

[0004] To achieve the above objectives, the technical solution adopted in this application is as follows:

[0005] In a first aspect, embodiments of this application provide a circuit board structure, including:

[0006] Printed circuit boards;

[0007] Multiple electronic components, each of which is disposed on the printed circuit board;

[0008] An insulating component, which seals over the side of the printed circuit board on which the electronic components are located;

[0009] Integrated circuit, which is electrically connected to the printed circuit board;

[0010] The insulating component includes multiple first adhesive films and second adhesive films. Each first adhesive film is respectively covered on one of the electronic components. Each electronic component has at least one bonding surface that directly contacts the printed circuit board and multiple non-contact surfaces that do not directly contact the printed circuit board. Each first adhesive film is sealed and bonded to all the non-contact surfaces of the corresponding electronic component. The surface area of ​​each first adhesive film is greater than the sum of the areas of all the non-contact surfaces of the corresponding electronic component, so that after the first adhesive film covers the electronic component, the edge of the first adhesive film is bonded to the printed circuit board. The second adhesive film is attached to the side of the first adhesive film facing away from the electronic component and completely covers the printed circuit board and the integrated circuit.

[0011] In one embodiment of the first aspect, the first adhesive film includes a first adhesive portion and a second adhesive portion, the first adhesive portion sealingly covering each of the non-contact surfaces of the electronic component, and the second adhesive portion being disposed around the periphery of the first adhesive portion.

[0012] In one embodiment of the first aspect, the electronic component has a rectangular structure, and the first attachment portion is provided with a rectangular groove of the same size as the electronic component.

[0013] In one embodiment of the first aspect, the electronic component has a circular structure, and the first attachment portion is provided with a circular groove of the same size as the electronic component.

[0014] In one embodiment of the first aspect, the width of the second attachment portion is 2mm-5mm.

[0015] Secondly, embodiments of this application also provide a display screen, including the circuit board structure and display panel described in any of the above embodiments, wherein the display panel is electrically connected to the printed circuit board.

[0016] Thirdly, embodiments of this application also provide a display device, including the circuit board structure or display screen described in any of the above embodiments.

[0017] Fourthly, embodiments of this application also provide a method for attaching an insulating film to a printed circuit board, applied to the circuit board structure described in any of the above embodiments, the attachment method comprising:

[0018] The printed circuit board, on which the various electronic components are arranged, is placed flat at the film application station;

[0019] Each of the first adhesive films is sealed and attached to the corresponding electronic component;

[0020] The second adhesive film is laid flat on the side of the first adhesive film away from the printed circuit board, and the second adhesive film completely covers the printed circuit board.

[0021] In one embodiment of the fourth aspect, the sealing attachment of each of the first adhesive films to the corresponding electronic components includes:

[0022] The first adhesive film is pretreated, and a first adhesive portion with a depression is formed in the middle of the first adhesive film.

[0023] The first attachment portion covers the electronic component and completely accommodates the electronic component within the recess;

[0024] The first attachment part is pressed and sealed to the electronic component.

[0025] In one embodiment of the fourth aspect, the pretreatment of the first adhesive film includes:

[0026] Obtain a master film and scan to obtain the external dimensions of each electronic component;

[0027] Select a mold that matches the external dimensions of the electronic component;

[0028] The mold is placed on the mother film and pressed to form the corresponding first attachment portion on the mother film;

[0029] A cutting contour is formed by reserving the circumferential width of the first attachment portion, and the mother film is laser-cut along the cutting contour to obtain the first attachment film.

[0030] Compared to related technologies, the advantages of this application are as follows: This application provides a circuit board structure, a display screen, a display device, and an attachment method, which divides the insulating component into multiple smaller first attachment films and larger second attachment films. During the insulating attachment process of the printed circuit board, the first attachment films are first sealed and bonded to the surface of the electronic components, and then the circuit board is completely attached using the second attachment films. The second attachment films, together with the first attachment films, form an insulating protection for the circuit board, preventing short circuits caused by sweat intruding into the surface of the electronic components. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the circuit board structure in some embodiments of this application;

[0033] Figure 2 This is a schematic diagram of the circuit board structure in the related technology of this application;

[0034] Figure 3 This is a schematic diagram of the structure of the second attached film in some embodiments of this application;

[0035] Figure 4 These are schematic diagrams of the electronic components in some embodiments of this application;

[0036] Figure 5 This is a schematic diagram of the structure of the first attached film in some embodiments of this application;

[0037] Figure 6 This is a schematic diagram of the structure of the first attached film in some other embodiments of this application;

[0038] Figure 7 This is a schematic cross-sectional view of the first attached film in some embodiments of this application;

[0039] Figure 8 This is a flowchart illustrating the attachment method in some embodiments of this application;

[0040] Figure 9 This is a schematic diagram of the application process of the first adhesive film in some embodiments of this application;

[0041] Figure 10 This is a schematic diagram of the pretreatment process for the first attached film in some embodiments of this application.

[0042] Explanation of reference numerals in the attached figures:

[0043] 100. Circuit board structure; 110. Printed circuit board; 120. Electronic components; 130. Insulating component; 131. First attachment film; 1311. First attachment part; 1312. Second attachment part; 1313. Groove; 132. Second attachment film; 140. Integrated circuit. Detailed Implementation

[0044] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0045] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0046] Furthermore, where the term "and / or" appears, "and / or" merely describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship. Where the terms "first" and "second" appear, these terms are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" can explicitly or implicitly include at least one of those features. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0047] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0048] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0049] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0050] In related technologies, displays often require artificial sweat testing. However, due to the height difference between the FPC components and the FPC surface, gaps can appear between the insulating tape and the edges of the FPC components during application. Workers' sweat can easily seep through these gaps and into the FPC component surface, causing short circuits. This can easily lead to display defects during testing.

[0051] See Figure 1 and Figure 2 As shown, to improve the above-mentioned problems, embodiments of this application provide a circuit board structure 100, which can improve the insulation protection of electronic components 120 on the printed circuit board 110 through double sealing protection, thereby reducing display defects. It should be noted that the insulation protection structure provided in this application is only an example application scenario for the insulation protection of circuit boards, and can also be applied to the protection process of other electronic devices.

[0052] Specifically, the circuit board structure 100 includes a printed circuit board 110, multiple electronic components 120, an insulating component 130, and an integrated circuit 140. Each electronic component 120 is mounted on the printed circuit board 110, which serves as the mounting carrier for each component 120, ensuring their safe operation. The insulating component 130 seals and covers the side of the printed circuit board 110 where the electronic components 120 are located, providing insulation protection and preventing short circuits caused by sweat corrosion. The integrated circuit 140 is electrically connected to the printed circuit board 110 to ensure system operation.

[0053] For example, the PCB (Printed Circuit Board 110) is manufactured using electronic printing technology and is an important electronic component. It serves as the support for electronic components 120 and the carrier for the electrical interconnection of electronic components 120. It is a composite structure composed of multiple layers of materials and includes rigid PCBs, FPCs (Flexible Printed Circuit Boards), and rigid-flex boards. The specific selection can be made according to actual needs and is not specifically limited here.

[0054] In this specific embodiment, the printed circuit board 110 can be a flexible circuit board for use in space-constrained displays. Electronic components 120 can be capacitors, resistors, sensors, inductors, diodes, etc. After each electronic component 120 is mounted on the printed circuit board 110, its corresponding function is realized through the printed circuitry on the printed circuit board 110. In some embodiments, each electronic component 120 can be fixed to the printed circuit board 110 by soldering. Of course, in other embodiments, conductive adhesive, physical pressing, laser welding, ultrasonic welding, transient liquid phase welding, metal sintering, etc., can also be used to ensure the stable operation of the electronic components 120.

[0055] For example, the number of electronic components 120 can be two, three, four, five, six, etc., and can be reasonably set according to actual needs. In addition, in some embodiments, there may be only one electronic component 120, and its specific number is not limited.

[0056] Furthermore, the insulating component 130 can be insulating tape, used for waterproofing, dustproofing, insulation, and fixing of electronic components 120 and the printed circuit board 110, or to protect sensitive areas of the printed circuit board 110. When the insulating tape directly covers the printed circuit board 110 and the electronic components 120, because the electronic components 120 protrude from the surface of the printed circuit board 110, the insulating tape forms a slope with the side of the electronic components 120, thereby creating a gap between the insulating tape and the electronic components 120, which can easily allow sweat to seep in.

[0057] Please refer to both together. Figure 3 As shown, in this embodiment of the application, the insulating component 130 includes a plurality of first adhesive films 131 and second adhesive films 132. First, the first adhesive films 131 are sealed and bonded to the electronic components 120, and then the printed circuit board 110 and the electronic components 120 are bonded together by the second adhesive films 132 to achieve double-layer sealing protection of the printed circuit board 110.

[0058] For example, the number of first adhesive films 131 can be two, three, four, five, six, etc., corresponding to the electronic components 120, and can be reasonably set according to actual needs. In addition, in some embodiments, the first adhesive film 131 can also be one, and its specific number is not limited, as long as it can meet the sealing coverage of each electronic component 120.

[0059] Continue reading Figure 4 As shown, each first adhesive film 131 is respectively covered on an electronic component 120. Each electronic component 120 has at least one adhesive surface that is in direct contact with the printed circuit board 110 and multiple non-contact surfaces that are not in direct contact with the printed circuit board 110.

[0060] Understandable, Figure 4 For example, the surface of the electronic component 120 that is not exposed when it is bonded to the printed circuit board 110 is the bonding surface, while the peripheral and top surfaces of the electronic component 120 are non-contact surfaces. Therefore, the problem this application needs to solve is how to seal the non-contact surfaces of the electronic component 120. In this application, each first adhesive film 131 is bonded to all non-contact surfaces of the corresponding electronic component 120 to achieve peripheral sealing of the electronic component 120 and prevent sweat from seeping in and damaging the electronic component 120.

[0061] For example, the surface area of ​​each first adhesive film 131 is greater than the sum of the areas of all non-contact surfaces of the corresponding electronic component 120, so that after the first adhesive film 131 covers the top surface of the electronic component 120, there is still enough area reserved so that the edge of the first adhesive film 131 can be bonded to the printed circuit board 110.

[0062] Combination Figure 1 and Figure 2 As shown, Figure 1 This is a schematic diagram showing the first adhesive film 131 adhered to the electronic component 120. Figure 2 This is a schematic diagram showing the electronic component 120 without the first adhesive film 131 attached. After the first adhesive film 131 is attached to the electronic component, a second adhesive film 132 is attached to the side of the first adhesive film 131 facing away from the electronic component 120, completely covering the printed circuit board 110 and the integrated circuit 140. Thus, even if there is a gap caused by the slope between the second adhesive film 132 and the electronic component 120 during the adhesion process, the first adhesive film 131 still provides a sealing protection for the electronic component 120 and provides double-layer protection for the printed circuit board 110.

[0063] Continue reading Figure 5 and Figure 6 As shown, in some embodiments, the first adhesive film 131 includes a first adhesive portion 1311 and a second adhesive portion 1312. The first adhesive portion 1311 seals and covers each non-contact surface of the electronic component 120 to provide sealing protection for the surface of the electronic component 120. The second adhesive portion 1312 is disposed around the first adhesive portion 1311 so that after the first adhesive film 131 covers the electronic component 120, the second adhesive portion 1312 is bonded to the printed circuit board 110 to ensure that there is no exposed gap between the electronic component 120 and the printed circuit board 110.

[0064] Understandably, the first adhesive film 131 is relatively soft and has an adhesive layer on its surface. The first adhesive film 131 can be selected from one of the following: polyimide tape, polyester tape, silicone tape, fluororubber tape, acrylic foam tape, epoxy resin tape, etc. Specific selection is not limited, as long as it meets the sealing and attachment requirements of the electronic component 120. In this embodiment, the first adhesive film 131 can be made of polyester tape, which can meet the circuit sealing requirements in low-temperature environments and has a lower cost.

[0065] For example, after the surface release layer is peeled off, the first adhesive film 131 covers the electronic component 120 with its adhesive layer on one side. It is important to ensure that the electronic component 120 is bonded to the center of the first adhesive film 131, so that the first adhesive film 131 has sufficient area for adhering to the peripheral surface of the electronic component 120. The portion of the first adhesive film 131 bonded to the electronic component 120 is the first adhesive portion.

[0066] Specifically, due to its flexibility, the first adhesive film 131 can be bent and deformed under external force. Therefore, when the first adhesive film 131 is bonded to the top surface of the electronic component 120, the portion protruding from the electronic component 120 is pressed and bent by external force, causing the first adhesive film 131 to adhere to the side of the electronic component 120. Furthermore, through the reinforced sealing of the second adhesive film 132, even if a certain sealing gap still exists between the first adhesive film 131 and the side of the electronic component 120, the double isolation provided by the second adhesive film 132 maximizes the waterproof protection of the electronic component 120.

[0067] In some embodiments, the first adhesive film 131 may only have a first adhesive portion, thereby ensuring that after the first adhesive portion is sealed and bonded to the electronic component 120, it is fully covered by the second adhesive film 132, thus ensuring the sealing effect between the electronic component 120 and the printed circuit board 110.

[0068] In other embodiments, after the first adhesive film 131 is bonded to the electronic component 120 through the first adhesive portion, a second adhesive portion of a certain width is reserved on the periphery, and the second adhesive portion is bonded to the printed circuit board 110, thereby completely sealing the gap between the electronic component 120 and the printed circuit board 110, strengthening the adhesive strength of the first adhesive film 131, and finally achieving double-layer sealing protection of the printed circuit board 110 through the complete coverage of the second adhesive film 132.

[0069] Continue reading Figure 5 and Figure 7 As shown, in some embodiments, the electronic component 120 has a rectangular structure, and the first attachment portion 1311 is provided with a rectangular groove 1313 of the same size as the electronic component 120.

[0070] Specifically, when the electronic component 120 has a rectangular structure, the external dimensions of the electronic component 120, such as length, width, and height, can be obtained in advance. Then, the first attachment portion 1311 is subjected to contouring processing, forming a rectangular groove 1313 in the first attachment portion 1311 that is the same as or slightly larger than the length, width, and height of the electronic component 120. This ensures that when the electronic component 120 is attached to the first attachment portion 1311, the portion of the electronic component 120 that protrudes from the surface of the printed circuit board 110 can be completely accommodated in the groove 1313, and then sealed and bonded under subsequent pressure.

[0071] Continue reading Figure 6 As shown, in some other embodiments, the electronic component 120 has a circular structure, and the first attachment portion 1311 is provided with a circular groove 1313 of the same size as the electronic component 120.

[0072] Specifically, when the electronic component 120 has a circular structure, the external dimensions of the electronic component 120, such as diameter and height parameters, can be obtained in advance. Then, the first attachment portion 1311 is subjected to contouring processing to form a circular groove 1313 that is the same size as or slightly larger than that of the electronic component 120. This ensures that when the electronic component 120 is attached to the first attachment portion 1311, the portion of the electronic component 120 that protrudes from the surface of the printed circuit board 110 can be completely accommodated in the groove 1313 and sealed and bonded under subsequent pressure.

[0073] In some other embodiments, the electronic component 120 may also be other polygonal or irregular graphic structures, and the first attachment portion 1311 may be provided with a groove 1313 of the same size and shape as the electronic component 120 to accommodate the attachment of different electronic components 120.

[0074] Of course, in other embodiments, multiple electronic components 120 may simultaneously include circular, polygonal and irregular graphic structures. In this case, the first attachment portion 1311 of different first attachment films 131 needs to form different shaped grooves 1313 to meet the sealing and bonding requirements of different electronic components 120.

[0075] Understandably, the second adhesive film can use the same insulating tape as the first adhesive film 131. It can also be selected from polyimide tape, polyester tape, silicone tape, fluororubber tape, acrylic foam tape, epoxy resin tape, etc., without specific limitations, as long as it meets the sealing and adhesion requirements of the printed circuit board 110. Thus, after the surface release layer is peeled off, the side of the second adhesive film 132 with the adhesive layer covers the printed circuit board 110 and covers each of the first adhesive films 131, providing double-layer protection for the printed circuit board 110.

[0076] In some embodiments, the width of the second attachment portion 1312 is 2mm-5mm, so that after the first attachment portion 1311 is bonded to the electronic component 120, the second attachment portion 1312 has sufficient bonding width to connect to the printed circuit board 110.

[0077] Understandably, in this embodiment, the width direction of the second attachment portion 1312 is the direction in which the electronic component 120 extends outward from its periphery. Geometrically, the width of the second attachment portion 1312 is the offset between the edge of the projected image of the first attachment portion 1311 and the edge of the projected image of the second attachment portion 1312.

[0078] In one embodiment, the width of the second attachment portion 1312 is 2mm. While ensuring the adhesion of the second attachment portion 1312 to the printed circuit board 110, the area occupied by the second attachment portion 1312 is minimized to ensure the heat dissipation performance of each electronic component 120.

[0079] In another embodiment, the width of the second attachment portion 1312 is 5mm. While ensuring the heat dissipation performance of each electronic component 120, the area occupied by the second attachment portion 1312 is increased as much as possible to meet the bonding strength between the second attachment portion 1312 and the printed circuit board 110.

[0080] In other embodiments, the width of the second attachment portion 1312 may also be 2.1mm, 2.3mm, 2.4mm, 2.6mm, 2.8mm, 2.9mm, 3.2mm, 3.5mm, 3.7mm, 3.8mm, 4.1mm, 4.2mm, 4.5mm, 4.9mm, etc., and can be selected according to actual needs. There is no specific limitation here, as long as the second attachment portion 1312 can be attached to the printed circuit board 110.

[0081] An embodiment of this application also provides a display screen, including the circuit board structure 100 and display panel of any of the above embodiments, wherein the display panel is electrically connected to the printed circuit board 110.

[0082] Specifically, display panels are core components in electronic devices used for image and video display, and are widely used in smartphones, televisions, monitors, tablets, automotive screens, smart wearable devices, and other fields. Based on technology type, display panels can be categorized into LCD (Liquid Crystal Display), OLED (Organic Light-Emitting Diode), Micro LED (Micro Light-Emitting Diode), and Mini LED (Mini Light-Emitting Diode), among others.

[0083] After the display panel is connected to the printed circuit board 110, it performs light-emitting display operations when powered on. Understandably, the display screen may also include supporting components such as an outer frame to ensure the installation and fixation of the circuit board structure 100 and the display panel.

[0084] This embodiment has the circuit board structure 100 of any of the above embodiments, and therefore has all the beneficial effects of the circuit board structure 100 of any of the above embodiments, which will not be described in detail here.

[0085] Embodiments of this application also provide a display device, including the circuit board structure 100 or display screen in any of the above embodiments.

[0086] For example, the aforementioned display device can be an electronic device such as an optical projector or a head-up display (HUD), or any device with a display screen such as a smartphone, smartwatch, laptop, tablet, dashcam, navigator, or head-mounted device.

[0087] This embodiment has the circuit board structure 100 or display screen of any of the above embodiments, and therefore has all the beneficial effects of the circuit board structure 100 or display screen of any of the above embodiments, which will not be described in detail here.

[0088] Continue reading Figure 8 As shown, embodiments of this application also provide a method for attaching an insulating film to a printed circuit board 110, which is applied to the circuit board structure 100 in any of the above embodiments.

[0089] Specifically, the attachment methods include:

[0090] S100, the printed circuit board 110, on which various electronic components 120 are arranged, is placed flat at the film application station.

[0091] For example, each electronic component 120 is transported to the soldering station of the printed circuit board 110 via a conveyor line, and the electronic components 120 are soldered onto the printed circuit board 110 using a soldering process. Then, the printed circuit board 110 with the electronic components 120 mounted is placed as a whole at the film-applying station. Preferably, a corresponding fixture can be set to fix the printed circuit board 110 as a whole at the film-applying station. Optionally, the transfer of the printed circuit board 110 can be by conveyor belt transport or mechanical clamping transfer.

[0092] S200, each first adhesive film 131 is sealed and attached to the corresponding electronic component 120.

[0093] For example, a corresponding number of first adhesive films 131 are prepared according to the number of electronic components 120. Each first adhesive film 131 is placed on the top of the corresponding electronic component 120, and then the first adhesive portion 1311 of the first adhesive film 131 is adhered to the top of the electronic component 120 by pressing, and the first adhesive portion 1311 is further adhered to the periphery of the electronic component 120, and the second adhesive portion 1312 is adhered to the printed circuit board 110.

[0094] It should be noted that each electronic component 120 should be adhered sequentially. Only after the adhesion of the first adhesive film 131 to one electronic component 120 is completed should the adhesion of the next electronic component 120 be carried out. This is to ensure the steady progress of the process and avoid confusion and errors that could lead to a poor sealing effect.

[0095] In addition, during the application of the first adhesive film 131, it is necessary to ensure a complete seal between the first adhesive film 131 and the surface of the electronic component 120 to prevent damage caused by artificial sweat seeping into the electronic component 120. When applying the first adhesive film 131 to the edge of the electronic component 120, the first adhesive part can be pressed back and forth repeatedly with a scraper or fingers to improve the sealing strength of the electronic component 120.

[0096] S300, the second adhesive film 132 is laid flat on the side of the first adhesive film 131 away from the printed circuit board 110, and the second adhesive film 132 completely covers the printed circuit board 110.

[0097] For example, after all the electronic components 120 of a printed circuit board 110 are sealed and bonded to their corresponding first adhesive films 131, the release layer of the second adhesive film 132 is peeled off and placed on the printed circuit board 110, covering all the first adhesive films 131. Thus, from an external perspective, only the second adhesive film 132 is visible to the human eye, achieving an overall aesthetic effect. Simultaneously, the enhanced sealing of the first adhesive portion 1311 by the second adhesive portion 1312 strengthens the design against sweat penetration for the printed circuit board 110 and electronic components 120, improving the yield rate of the display product.

[0098] Continue reading Figure 9 As shown, in some embodiments, step S200 includes:

[0099] S210, the first adhesive film 131 is pretreated, and a first adhesive portion 1311 with a depression is formed in the middle of the first adhesive film 131.

[0100] Specifically, the preprocessing described in this application embodiment refers to forming a recess in the first attachment portion 1311 that has the same shape as the corresponding electronic component 120, so that the first attachment film 131 can be directly applied to the corresponding electronic component 120 in the future.

[0101] For example, when the electronic component 120 has a rectangular structure, the first attachment portion 1311 is pre-processed to form a rectangular groove 1313 with the same size as the electronic component 120. When the electronic component 120 has a circular structure, the first attachment portion 1311 is pre-processed to form a circular groove 1313 with the same size as the electronic component 120. When the electronic component 120 has an irregular polygonal structure, the first attachment portion 1311 is pre-processed to form an irregular polygonal groove 1313 with the same size as the electronic component 120.

[0102] S220, the first attachment portion 1311 covers the electronic component 120 and completely accommodates the electronic component 120 within the recess.

[0103] Specifically, after the recessed structure is formed, the first adhesive film 131 can be covered on the electronic component 120 by a clamping tool, and the first adhesive part 1311 can be aligned with the electronic component 120 by laser positioning or other means to ensure the bonding accuracy of the first adhesive part 1311.

[0104] S230, the first attachment part 1311 is pressed and sealed to the electronic component 120.

[0105] Specifically, after the first attachment portion 1311 covers the electronic component 120 to form a preliminary bond, external force is applied to the first attachment film 131 to firmly and seal it to the electronic component 120. Simultaneously, the second attachment portion 1312 is sealed and bonded to the printed circuit board 110 to ensure the sealing strength of the electronic component 120. Furthermore, a scraper or similar structure can be used to press back and forth between the first attachment portion 1311 and the sides of the electronic component 120 to ensure that no gaps are formed between them.

[0106] For example, during the adhesion process of the first adhesive film 131, a corresponding pressing workpiece can be used for pressing and bonding. The upper end of the pressing workpiece is connected to the output end of the telescopic workpiece, so as to move up and down under the drive of the telescopic workpiece. The telescopic workpiece can be one of a hydraulic cylinder, a pneumatic cylinder, or a linear motor, and there is no specific limitation. The lower end of the pressing workpiece is provided with a receiving groove that matches the outer size of the first adhesive part 1311, so that the first adhesive part 1311 can be received in the receiving groove during the pressing process. Then, under the drive of the telescopic workpiece, the pressing workpiece presses down, and the first adhesive film 131 is pressed and bonded tightly through the end face of the pressing workpiece.

[0107] Continue reading Figure 10 As shown, in some embodiments, step S210 includes:

[0108] S211, Obtain a master film, and scan to obtain the external dimensions of each electronic component 120.

[0109] Specifically, the master film can be the same insulating tape as the second attachment film 132, and multiple smaller first attachment films 131 are formed by cutting. Before cutting the first attachment films 131, the shape of each electronic component 120 can be scanned and determined by a CCD (charge coupled device) camera, and the external dimensions of different electronic components 120 can be calculated, such as the length, width and height of rectangular electronic components 120, the diameter of circular electronic components 120, etc., which facilitates the subsequent preprocessing of the first attachment films 131.

[0110] S212, Select a mold that matches the external dimensions of electronic component 120.

[0111] Specifically, after obtaining the external dimensions of the electronic component 120, the control system can select a mold of the corresponding size and shape to form a corresponding groove 1313 by pressing the first attachment film 131.

[0112] Understandably, automated production lines are equipped with corresponding control systems. These control systems include a central processing unit (CPU) and pre-programmed PLC (Programmable Logic Controller) programs to perform corresponding instruction control based on different acquired parameters and processes.

[0113] S213, after the mold is placed on the mother film, it is pressed to form the corresponding first attachment part 1311 on the mother film.

[0114] Specifically, a robotic arm can be used to grasp a mold of the appropriate size and apply pressure to the master film to form a groove 1313 on the master film that is compatible with the electronic component 120.

[0115] For example, the mold can be manufactured using 3D printing technology based on the shape of the electronic component 120 to ensure that the first attachment portion 1311 can be completely sealed and bonded to the electronic component 120. It is understood that the dimensions of each electronic component 120 are relatively fixed within the same batch of circuit board products. Therefore, corresponding molds can be prefabricated according to the dimensions of each electronic component 120, so that during the pretreatment of the first attachment film 131, only the corresponding mold needs to be changed according to the different electronic components 120.

[0116] S214, the peripheral width of the first attachment portion 1311 is reserved to form a cutting contour, and the mother film is laser-cut along the cutting contour to obtain the first attachment film 131.

[0117] Specifically, the area of ​​the second attachment portion 1312 is reserved according to the set width value of 2mm-5mm. The first attachment film 131 is obtained by laser cutting along the contour of the second attachment portion 1312, ensuring that the first attachment film 131 can be perfectly sealed with the electronic component 120.

[0118] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0119] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A circuit board structure, characterized in that, include: Printed circuit boards; Multiple electronic components, each of which is disposed on the printed circuit board; An insulating component, which seals over the side of the printed circuit board on which the electronic components are located; Integrated circuit, which is electrically connected to the printed circuit board; The insulating component includes multiple first adhesive films and second adhesive films. Each first adhesive film is respectively covered on one of the electronic components. Each electronic component has at least one bonding surface that directly contacts the printed circuit board and multiple non-contact surfaces that do not directly contact the printed circuit board. Each first adhesive film is sealed and bonded to all the non-contact surfaces of the corresponding electronic component. The surface area of ​​each first adhesive film is greater than the sum of the areas of all the non-contact surfaces of the corresponding electronic component, so that after the first adhesive film covers the electronic component, the edge of the first adhesive film is bonded to the printed circuit board. The second adhesive film is attached to the side of the first adhesive film facing away from the electronic component and completely covers the printed circuit board and the integrated circuit.

2. The circuit board structure according to claim 1, characterized in that, The first adhesive film includes a first adhesive portion and a second adhesive portion. The first adhesive portion seals and covers each of the non-contact surfaces of the electronic components, and the second adhesive portion is disposed on the periphery of the first adhesive portion.

3. The circuit board structure according to claim 2, characterized in that, The electronic component has a rectangular structure, and the first attachment portion has a rectangular groove with the same size as the electronic component.

4. The circuit board structure according to claim 2, characterized in that, The electronic component has a circular structure, and the first attachment portion has a circular groove of the same size as the electronic component.

5. The circuit board structure according to claim 2, characterized in that, The width of the second attachment portion is 2mm-5mm.

6. A display screen, characterized in that, The invention includes a display panel and a circuit board structure as described in any one of claims 1 to 5, wherein the display panel is electrically connected to the printed circuit board.

7. A display device, characterized in that, Includes the circuit board structure according to any one of claims 1 to 5 or the display screen according to claim 6.

8. A method for attaching an insulating film to a printed circuit board, characterized in that, The bonding method, applied to the circuit board structure of any one of claims 1 to 5, comprises: The printed circuit board, on which the various electronic components are arranged, is placed flat at the film application station; Each of the first adhesive films is sealed and attached to the corresponding electronic components; The second adhesive film is laid flat on the side of the first adhesive film away from the printed circuit board, and the second adhesive film completely covers the printed circuit board.

9. The attachment method according to claim 8, characterized in that, The sealing and bonding of each of the first adhesive films with the corresponding electronic components includes: The first adhesive film is pretreated, and a first adhesive portion with a depression is formed in the middle of the first adhesive film. The first attachment portion covers the electronic component and completely accommodates the electronic component within the recess; The first attachment part is pressed and sealed to the electronic component.

10. The attachment method according to claim 9, characterized in that, The pretreatment of the first attached film includes: Obtain a master film and scan to obtain the external dimensions of each of the electronic components; Select a mold that matches the external dimensions of the electronic component; The mold is placed on the mother film and pressed to form the corresponding first attachment portion on the mother film; A cutting contour is formed by reserving the circumferential width of the first attachment portion, and the mother film is laser-cut along the cutting contour to obtain the first attachment film.

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