Electronic device

Abstract

This disclosure provides an electronic device. The electronic device includes: a heat dissipation plate; a first carrier partially embedded in the heat dissipation plate; and a first electronic component disposed above the first carrier and the heat dissipation plate. The heat dissipation plate has a higher thermal conductivity than the first carrier. The first electronic component is electrically connected to the first carrier.

Description

Technical Field

[0001] This disclosure relates to an electronic device. Background Technology

[0002] For power modules such as voltage regulator modules (VRMs), designed to provide a wide range of power rails (from a dozen to more than twenty types), a 3D stacked design is typically used to save space. Specifically, a VRM can utilize an upper PCB supported above a lower PCB, allowing components to be placed on two PCBs. However, this design can result in relatively high thermal resistance, leading to poor heat dissipation and causing the components sandwiched between the upper and lower PCBs to overheat. Summary of the Invention

[0003] In some arrangements, an electronic device includes: a heat dissipation plate; a first carrier partially embedded in the heat dissipation plate; and a first electronic component disposed above the first carrier and the heat dissipation plate. The heat dissipation plate has a higher thermal conductivity than the first carrier. The first electronic component is electrically connected to the first carrier.

[0004] In some arrangements, an electronic device includes: an electronic component; and a heat dissipation plate disposed above the electronic component and configured to provide a heat dissipation path for the electronic component. The electronic device also includes a connection element partially disposed in a recess in the heat dissipation plate and configured to provide an electrical connection path for the electronic component.

[0005] In some arrangements, an electronic device includes: a first carrier; a first electronic component disposed above the first carrier; a heat dissipation plate disposed above the first electronic component; and a second carrier disposed above the heat dissipation plate. The first electronic component is electrically connected to the second carrier via the first carrier. Attached Figure Description

[0006] Some aspects of the arrangements of this disclosure are best understood in conjunction with the accompanying drawings and the following detailed description. It should be noted that the various structures may not be drawn to scale, and the dimensions of the various structures may be arbitrarily increased or decreased for clarity of explanation.

[0007] Figure 1A Perspective views illustrating some arrangements of electronic devices according to this disclosure.

[0008] Figure 1B An exploded view illustrating some arrangements of the electronic device according to this disclosure.

[0009] Figure 1CPerspective views illustrating some arrangements of electronic devices according to this disclosure.

[0010] Figure 2A A top view illustrating some arrangements of the heat dissipation plates according to this disclosure.

[0011] Figure 2B A bottom view illustrating some arrangements of the heat dissipation plate according to this disclosure.

[0012] Figure 2C This illustration shows a cross-sectional view of a heat dissipation plate arranged according to some of the present disclosure.

[0013] Figure 2D A top view illustrating some of the arrangements of the carrier according to this disclosure.

[0014] Figure 2E A bottom view illustrating some of the arrangements of the carrier according to this disclosure.

[0015] Figure 2F A top view illustrating some arrangements of the heat dissipation plates and carriers according to this disclosure.

[0016] Figure 2G The illustration shows cross-sectional views of heat dissipation plates and carriers arranged according to some of the present disclosure.

[0017] Figure 3A An exploded view illustrating some arrangements of the electronic device according to this disclosure.

[0018] Figure 3B Perspective views illustrating some arrangements of electronic devices according to this disclosure.

[0019] Figure 4A A top view illustrating some arrangements of the heat dissipation plates according to this disclosure.

[0020] Figure 4B A bottom view illustrating some arrangements of the heat dissipation plate according to this disclosure.

[0021] Figure 4C A top view illustrating some of the arrangements of the carrier according to this disclosure.

[0022] Figure 4D A bottom view illustrating some of the arrangements of the carrier according to this disclosure.

[0023] Figure 4E A top view illustrating some arrangements of the heat dissipation plates and carriers according to this disclosure. Detailed Implementation

[0024] Figure 1AThe illustration shows a perspective view of an electronic device 1a according to some arrangements of this disclosure. In some arrangements, the electronic device 1a may include a package, such as a semiconductor device package. In some arrangements, the electronic device 1a may include a power supply module, such as a voltage regulator module (VRM). For example, the electronic device 1a may be configured to regulate an input voltage and convert it into a stable output voltage.

[0025] In some arrangements, electronic device 1a may include carrier 10, electronic component 11, connecting element 12, 13, heat dissipation plate 20, carrier 21, electronic component 22, connecting element 23 and heat dissipation element 24.

[0026] Figure 1B An exploded view of an electronic device 1a arranged according to this disclosure is shown. Electronic component 11 and connecting elements 12 and 13 may be disposed above carrier 10. Electronic component 11 and connecting elements 12 and 13 may be disposed below heat dissipation plate 20. Electronic component 11 and connecting elements 12 and 13 may be disposed between carrier 10 and heat dissipation plate 20. Heat dissipation plate 20 may be disposed between carrier 10 and carrier 21.

[0027] One or more of the electronic components 11 may be partially housed in the holes (or openings) 20h of the heat dissipation plate 20. The carrier 21, electronic components 22, connecting elements 23 and heat dissipation elements 24 may be positioned above the heat dissipation plate 20.

[0028] In some arrangements, carrier 10 may include a substrate. In some arrangements, carrier 10 may include, for example, a printed circuit board (PCB), such as a paper-based copper foil laminate, a composite copper foil laminate, or a polymer-impregnated glass fiber-based copper foil laminate.

[0029] The carrier 10 may include interconnect structures or circuit structures. The circuit structure may include a redistribution layer (RDL), circuit layers, conductive pillars, conductive pads, conductive traces, conductive vias, conductive lines, or other conductive elements. The circuit structure provides electrical connections for components connected to the carrier 10.

[0030] The carrier 10 may include a surface 101 and a surface 102 opposite to surface 101. The carrier 10 may include one or more conductive pads (not depicted in the figures) adjacent to, adjacent to, or embedded in and exposed by surfaces 101 and / or 102. The carrier 10 may contain solder resist on surfaces 101 and / or 102 to fully expose the conductive pads or expose at least a portion of the conductive pads for electrical connection.

[0031] In some arrangements, electrical contacts (not shown in the figures) may be positioned above surface 101 of carrier 10. The electrical contacts may include solder balls or solder bumps, such as controlled collapse chip interconnect (C4) bumps, ball grid array (BGA) or planar grid array (LGA).

[0032] Carrier 21 may be similar to carrier 10. For example, carrier 21 may include a substrate or PCB, as well as interconnect structures or circuit structures. For simplicity, the same description will not be repeated. Carrier 21 may have a shape different from that of carrier 10, see reference. Figure 2D and Figure 2E Further description.

[0033] Electronic component 11 and connecting elements 12 and 13 may each be electrically connected to carrier 10, and the electrical connection may be obtained by means of solder bonding, Cu-Cu bonding, wire bonding, or hybrid bonding. Electronic component 22 and connecting element 23 may each be electrically connected to carrier 21, and the electrical connection may be obtained by means of solder bonding, Cu-Cu bonding, wire bonding, or hybrid bonding. In some arrangements, carrier 10 may be electrically connected to carrier 21 via connecting element 13. In some arrangements, components mounted in carrier 10 (e.g., electronic component 11 and connecting elements 12 and 13) may be electrically connected to components mounted in carrier 21 (e.g., electronic component 22 and connecting element 23) via carrier 10, connecting element 13, and carrier 21.

[0034] In some arrangements, electronic component 11 may include a surface 111 facing the carrier 10 and a surface 112 opposite to the surface 111. Surface 111 may be an active surface, a front surface, or a front side. Surface 112 may be a back side surface or a back side.

[0035] In some arrangements, electronic component 22 may include a surface 221 facing the carrier 21 and a surface 222 opposite to the surface 221. Surface 221 may be an active surface, a front surface, or a front side. Surface 222 may be a back side surface or a back side.

[0036] In some arrangements, electronic components 11 and 22 may each include a power management integrated circuit (PMIC). In some embodiments, electronic components 11 and 22 may each include a voltage regulator, such as a linear regulator (configured to maintain a constant output voltage) or a switching regulator (configured to generate an output voltage higher or lower than the input voltage). In some embodiments, electronic components 11 and 22 may each include a step-down (buck) converter, a step-up (boost) converter, an analog-to-digital converter, a digital-to-analog converter, an AC-DC converter, a DC-DC converter, other types of converters, or combinations thereof.

[0037] In some arrangements, electronic components 11 and 22 may be configured to operate over different ranges of input or output voltages. In some arrangements, electronic components 11 and 22 may be configured to handle different power levels. For example, electronic component 22 may be designed to step down a first voltage to a second voltage, while electronic component 11 may be responsible for further stepping down the second voltage to a third voltage. Specifically, electronic component 22 may be configured to convert a higher voltage, such as 48 V, to a lower voltage, such as 12 V. Similarly, electronic component 11 may be configured to step down a higher voltage, such as 12 V, to a voltage suitable for the load, which may be higher or lower than 1 V.

[0038] In some arrangements, the electronic components 11 may vary in size, which may be influenced by a combination of power requirements, efficiency, thermal management, component selection, and specific application needs. For example, the electronic components 11 may have different heights, and one or more of these components may be higher than the distance between the carrier 10 and the heat dissipation plate 20. Thus, taller components may be fitted into the hole 20h and protrude above the heat dissipation plate 20. Additionally, some of the electronic components 11 may be shorter and able to be fitted into the space between the carrier 10 and the heat dissipation plate 20. Conversely, some of the electronic components 11 may be too large to be placed below the heat dissipation plate 20; therefore, larger components may be placed beside the heat dissipation plate 20.

[0039] In some arrangements, the connection element 12 may be configured to provide an electrical connection between the electronic device 1a and an external component (e.g., an external circuit or circuit board). The connection element 12 may be configured to receive electrical signals from the external component.

[0040] In some arrangements, the connecting element 13 may be configured to provide an electrical connection (or electrical connection path) between the carrier 10 and the carrier 21. The connecting element 13 may be configured along the side of the heat dissipation plate 20 (e.g., Figure 2A Side 203 provides a vertical electrical connection between carrier 10 and carrier 21. In some arrangements, some of the connecting elements 13 may be positioned along the side (or edge or physical boundary) of carrier 21. In some arrangements, some of the connecting elements 13 may be positioned around electronic assembly 11. For example, some of the connecting elements 13 may be closer to the side (or edge or physical boundary) of carrier 10 than electronic assembly 11. For example, some of the electronic assembly 11 may be positioned within the space defined by carrier 10, heat dissipation plate 20, and connecting elements 13.

[0041] In some arrangements, the connecting element 13 may each include a housing 13h and a pin 13p inserted into the housing 13h. The pin 13p may include a spring pin or a spring-loaded contact. However, the invention is not limited thereto. The connecting element 13 may include a conductive post, a conductive via, a wire, or other conductive element.

[0042] Figure 1C A perspective view illustrating an electronic device 1a arranged according to some of the present disclosure is provided. For clarity, Figure 1C Some components of electronic device 1a are not shown in the image.

[0043] The carrier 21 and the heat dissipation plate 20 can be used together to form a structure for... Figure 1A The support structure for the electronic component 22 is shown. For example, the conductive pads 20p2 of the heat dissipation plate 20 and the conductive pads 21p2 of the carrier 21 can be configured to interact with... Figure 1A The described electronic component 22 is electrically connected. For example, the conductive pad 20p2 of the heat dissipation plate 20 and the conductive pad 21p2 of the carrier 21 can be configured to... Figure 1A The described electronic component 22 is grounded. For example, the conductive pad 20p2 of the heat dissipation plate 20 and the conductive pad 21p2 of the carrier 21 can be grounded pads.

[0044] The connecting element 23 may be positioned above the carrier 21 and electrically connected to the carrier 21. The connecting element 23 may be positioned substantially perpendicular to the surface of the carrier 21 (e.g., ...). Figure 2D and Figure 2E The surfaces 211 and / or 212 shown overlap at least partially with the heat dissipation plate 20 and the carrier 21 in their orientation. For example, the connecting element 23 may overlap perpendicularly with the heat dissipation plate 20 and the carrier 21.

[0045] Connection element 23 can be configured to provide an electrical connection between electronic device 1a and external components (e.g., external circuitry or a circuit board). Connection element 23 can also be configured to connect to a power source (not shown in the figures).

[0046] The heat dissipation element 24 may be disposed above the heat dissipation plate 20 and thermally conductive with the heat dissipation plate 20. The heat dissipation element 24 may be disposed on a surface substantially perpendicular to the heat dissipation plate 20 (e.g., ...). Figure 2A and Figure 2B The surfaces 201 and / or 202 shown overlap at least partially with the heat dissipation plate 20 in their orientation. For example, the heat dissipation element 24 may overlap perpendicularly with the heat dissipation plate 20. In some arrangements, the heat dissipation element 24 and the heat dissipation plate 20 may be... Figure 1A The electronic components 11 and 22 shown provide heat dissipation paths.

[0047] The heat dissipation element 24 may be located on a surface substantially perpendicular to the carrier 21 (e.g., for example...). Figure 2D and Figure 2EThe surfaces 211 and / or 212 shown do not overlap with the carrier 21 in any direction. For example, the heat dissipation element 24 may not overlap perpendicularly with the carrier 21. For example, the heat dissipation element 24 may be laterally spaced from the carrier 21.

[0048] The heat dissipation element 24 can be attached to the heat dissipation plate 20 via an adhesive layer, such as a heat dissipation gel. Each of the heat dissipation elements 24 may possess a relatively high thermal conductivity. For example, each of the heat dissipation elements 24 may contain copper (Cu), aluminum (Al), graphite, ceramic, etc. Each of the heat dissipation elements 24 may comprise a block, conduit, radiator, fin, or other shape.

[0049] Figure 2A A top view illustrating a heat dissipation plate 20 arranged according to some of the present disclosure. Figure 2B A bottom view illustrating a heat dissipation plate 20 arranged according to some of the present disclosure. Figure 2C The illustration shows a cross-sectional view of the heat dissipation plate 20 according to some arrangements of this disclosure. For example, when cut along line AA', Figure 2A The structure in can have, for example Figure 2C The cross-sectional view shown.

[0050] The heat dissipation plate 20 may contain materials with relatively high thermal conductivity. For example, the heat dissipation plate 20 may contain copper (Cu), aluminum (Al), graphite, ceramics, etc. In some arrangements, the heat dissipation plate 20 may include a lead frame.

[0051] The heat dissipation plate 20 may include a surface 201, a surface 202 opposite to the surface 201, and a side surface 203 extending between the surface 201 and the surface 202. The thickness t1 of the heat dissipation plate 20 may be in the range of about 0.7 mm to about 0.5 mm.

[0052] The heat dissipation plate 20 may include a hole 20h penetrating its structure. The hole 20h may be located at the central portion of the heat dissipation plate 20. The hole 20h may extend between surfaces 201 and 202. The hole 20h may be configured to accommodate... Figure 2A The electronic component 11 shown. The hole 20h not only enhances the space utilization of the heat dissipation plate 20, but also helps to improve airflow and heat dissipation.

[0053] The heat dissipation plate 20 may include a recess 20g penetrating its structure. The recess 20g may extend between surfaces 201 and 202. The recess 20g may be located on the side (or edge or physical boundary, such as side 203) of the heat dissipation plate 20.

[0054] The groove 20g can be recessed into the heat dissipation plate 20 from the side 203. As can be seen from the top view, the groove 20g can be recessed from the side of the heat dissipation plate 20, thereby forming a gear-shaped edge of the heat dissipation plate 20.

[0055] The groove 20g can be configured to accommodate Figure 1A Pin 13p is shown. Pin 13p can extend along the groove 20g of the heat dissipation plate 20 and is electrically connected between the carrier 10 and the carrier 21, which is further electrically connected to Figure 1A The electronic component 22 and connecting element 23 are shown. For example, pin 13p may extend longitudinally along the recess 20g of the heat dissipation plate 20. For example, pin 13p may be aligned with the recess 20g of the heat dissipation plate 20. For example, a portion of the outline or shape of pin 13p may match or engage in the recess 20g.

[0056] Pin 13p may be spaced apart from heat dissipation plate 20. Pin 13p may not be electrically connected to heat dissipation plate 20. Pin 13p may be insulated from heat dissipation plate 20. In some arrangements, the inner surface of recess 20g may be insulated. For example, the inner surface of recess 20g may be insulated to prevent electrical conduction between pin 13p and heat dissipation plate 20. For example, the inner surface of recess 20g may have a coating (an insulating coating, such as an epoxy coating or a polyurethane coating). In some arrangements, a coating with low thermal conductivity can reduce heat transfer and improve energy efficiency. In some arrangements, by providing recess 20g for heat dissipation plate 20 and using pin 13p to connect carrier 10 and carrier 21, the device size can remain acceptable while improving heat dissipation efficiency. The location and number of recess 20g and pin 13p can be selected based on a combination of power requirements, efficiency, thermal management, component selection, and specific application needs.

[0057] The heat dissipation plate 20 may include a recessed portion 20r recessed from the surface 202. The outline of the recessed portion 20r is depicted with dashed lines. The recessed portion 20r may not penetrate the heat dissipation plate 20. In some arrangements, the depth of the recessed portion 20r may be approximately 0.2 mm. The recessed portion 20r may be configured to accommodate... Figure 2D The carrier 21 shown. The recessed portion 20r can be configured to facilitate heat transfer in the carrier 21.

[0058] The heat dissipation plate 20 may include conductive pads 20p1 and 20p2. The heat dissipation plate 20 may include solder resist (not shown in the figure) to prevent solder flow problems. The conductive pad 20p2 may be larger than the conductive pad 20p1.

[0059] Conductive pad 20p1 may be smaller than conductive pad 20p2. Conductive pad 20p2 may be configured to connect. Figure 1A The described electronic component 22, and the conductive pad 20p1 can be configured to connect Figure 2D The carrier 21 is shown. In some arrangements, the smaller pads used to connect the carrier 21 require less solder, allowing for better control of solder flow and helping to prevent solder bridging between adjacent pads.

[0060] In some arrangements, conductive pads 20p1 and 20p2 may be grounding pads or serve as grounding pads. In some arrangements, heat dissipation plate 20 may be configured to not only provide a heat dissipation path for carrier 21 but also serve as a ground plane. This dual functionality enhances the overall performance and reliability of the electronic device by ensuring effective thermal management while establishing a stable potential reference.

[0061] The conductive pad 20p1 can be disposed in the recess 20r. For example, when the carrier 21 is disposed in the recess 20r (e.g. Figure 2F and Figure 2G As shown, conductive pads 20p1 may be covered by carrier 21. Some of the conductive pads 20p1 may be disposed on the peripheral portion of heat dissipation plate 20. For example, from a top view, grooves 20g and protrusions may be arranged alternately. Conductive pads 20p1 may be disposed on protrusions.

[0062] The conductive pad 20p2 may not be placed in the recessed portion 20r. The conductive pad 20p2 may not be covered by the carrier 21. The conductive pad 20p2 may be either not covered by the carrier 21 or exposed by the carrier 21.

[0063] Figure 2D A top view illustrating some arrangements of the carrier 21 according to this disclosure. Figure 2E A bottom view illustrating a carrier 21 arranged according to some of the present disclosure.

[0064] The carrier 21 may have multiple separate segments. For example, the carrier 21 may have a strip structure and an L-shaped structure. The carrier 21 may be similar to the carrier 10, and for the sake of simplicity, the same description will not be repeated. The carrier 21 may be configured to be partially embedded in or accommodated in the recess 20r of the heat dissipation plate 20.

[0065] In some arrangements, the thermal conductivity of the heat dissipation plate 20 may be better or greater than that of the carrier 21. In some arrangements, the thermal resistance of the heat dissipation plate 20 may be lower than that of the carrier 21. In some arrangements, the thermal resistance of the carrier 21 may be higher than that of the heat dissipation plate 20.

[0066] The carrier 21 may have a surface 211 and a surface 212 opposite to the surface 211. The carrier 21 may have conductive pads 21p1, 21p2, 21p3 and 21p4.

[0067] The conductive pad 21p1 on surface 211 can be configured to connect with the heat dissipation plate 20. For example, the conductive pad 21p1 can be configured to connect with the conductive pad 20p1 of the heat dissipation plate 20. The conductive pad 21p2 on surface 212 can be configured to connect with... Figure 1AThe described electronic component 22 is connected. The conductive pad 21p3 on surface 212 can be configured to... Figure 1A The illustrated electronic component 22 receives electrical signals. For example, the conductive pad 21p3 can be configured to be further connected to the carrier 10. Figure 1A The electronic component 22 shown transmits data between itself and pin 13p. The conductive pad 21p4 on surface 211 can be configured to... Figure 1A The described pin 13p receives electrical signals.

[0068] Figure 2F A top view illustrating some arrangements of the heat dissipation plate 20 and carrier 21 according to this disclosure. Figure 2G The illustration shows cross-sectional views of the heat dissipation plate 20 and the carrier 21 arranged according to some configurations of this disclosure. For example, when cut along line AA', Figure 2F The structure in can have, for example Figure 2G The cross-sectional view shown.

[0069] The depth of the recessed portion 20r and the thickness t2 of the carrier 21 can be substantially the same, so that the carrier 21 and the heat dissipation plate 20 can be formed for installation. Figure 1A The described electronic component 22 has a substantially flat surface. In some arrangements, the thickness t2 of the carrier 21 may be approximately 0.2 mm. In some arrangements, Figure 1A The described electronic component 22 may partially overlap with the carrier 21 and the heat dissipation plate 20 in a direction substantially perpendicular to the surface 202 of the heat dissipation plate 20 and the surface 212 of the carrier 21.

[0070] The surface 202 of the heat dissipation plate 20 and the surface 212 of the carrier 21 can be substantially coplanar. When the carrier 21 is placed in the recessed portion 20r of the heat dissipation plate 20, the conductive pads 21p2 of the carrier 21 and the conductive pads 20p2 of the heat dissipation plate 20 can be located at positions for mounting. Figure 1A The substantially flat surface of the described electronic component 22.

[0071] The conductive pad 21p1 of the carrier 21 can be connected to the conductive pad 20p1 of the heat dissipation plate 20. The conductive pad 21p4 of the carrier 21 can be exposed by the groove 20g and can be connected to Figure 1A The described pin is 13p. For example, Figure 1A The illustrated pin 13p can be accommodated in the recess 20g and connected to the conductive pad 21p4 of the carrier 21. In some arrangements, the conductive pads 21p1 and 21p4 of the carrier 21 can be arranged or positioned alternately.

[0072] According to some arrangements of this disclosure, the present invention provides a combined design of a heat dissipation plate 20 and a carrier 21 to replace the original upper PCB, thereby effectively enhancing heat dissipation efficiency by utilizing the low thermal resistance of the heat dissipation plate 20. The heat dissipation plate 20 may be characterized by recesses or openings to accommodate electrical connectors (e.g., pins 13p), which act as pathways for transmitting electrical signals between the carrier 21 and the carrier 10. Additionally, heat dissipation elements 24 may be placed along the edges of the heat dissipation plate 20 to further aid heat dissipation.

[0073] Figure 3A An exploded view illustrating some arrangements of the electronic device 3a according to this disclosure. Figure 3B A perspective view illustrating some arrangements of the electronic device 3a according to this disclosure is provided. For clarity, Figure 3B Some components of electronic device 3a were not shown in the image.

[0074] Figure 3A The electronic device 3a in the middle may have, for example Figure 1A The perspective view shown. Figure 3A The electronic device 3a in the middle is similar to Figure 1A The electronic device 1a differs in that the electronic device 3a has a heat dissipation plate 40 and a carrier 41 instead of a heat dissipation plate 20 and a carrier 21.

[0075] Figure 4A A top view illustrating a heat dissipation plate 40 arranged according to some of the present disclosure. Figure 4B A bottom view illustrating a heat dissipation plate 40 arranged according to some of the present disclosure.

[0076] Figure 4A The heat dissipation plate 40 in the middle is similar to Figure 2A The heat dissipation plate 40 in the middle is different in that the heat dissipation plate 40 does not include a notch to accommodate Figure 4C The carrier 41 shown does not include a conductive pad for direct connection. Figure 3A The described electronic component 22.

[0077] The heat dissipation plate 40 may include a surface 401, a surface 402 opposite to the surface 401, and a side surface 403 extending between the surface 401 and the surface 402. The thickness of the heat dissipation plate 40 may be in the range of about 0.7 mm to about 0.5 mm.

[0078] The heat dissipation plate 40 may include a hole 40h penetrating its structure. The hole 40h may be located at the central portion of the heat dissipation plate 40. The hole 40h may extend between surfaces 401 and 402. The hole 40h may be configured to accommodate... Figure 3A Electronic component 11 is shown.

[0079] The heat dissipation plate 40 may include a recess 40g penetrating its structure. The recess 40g may extend between surfaces 401 and 402. The recess 40g may be located on the side (or edge or physical boundary, such as side 403) of the heat dissipation plate 40.

[0080] The heat dissipation plate 40 may include a conductive pad 40p1, the conductive pad being configured to connect... Figure 4C The carrier 41 is shown. When the carrier 41 is positioned above the heat dissipation plate 40, the conductive pad 40p1 may be covered by the carrier 41. In some arrangements, the conductive pad 40p1 may be a grounding pad or serve as a grounding pad. In some arrangements, the heat dissipation plate 40 may be configured to not only provide a heat dissipation path for the carrier 41, but also serve as a ground reference plane.

[0081] Figure 4C A top view illustrating some arrangements of the carrier 41 according to this disclosure. Figure 4D A bottom view illustrating a carrier 41 arranged according to some of the present disclosure.

[0082] Figure 4C The carrier 41 in the middle is similar to Figure 2D The carrier 21 differs from the carrier 41 in that the carrier 41 has a larger surface area. The carrier 41 may include a surface 411 and a surface 412 opposite to the surface 411. The carrier 41 may have conductive pads 41p1, 41p2, 41p3 and 41p4.

[0083] The conductive pad 41p1 on surface 411 can be configured to connect with the heat dissipation plate 40. For example, the conductive pad 41p1 can be configured to connect with the conductive pad 40p1 of the heat dissipation plate 40. The conductive pad 41p2 on surface 412 can be configured to connect with... Figure 3A The described electronic component 22 is connected. The conductive pad 41p3 on surface 412 can be configured to... Figure 3A The described electronic component 22 receives electrical signals. For example, the conductive pad 41p3 can be configured to be further connected to the carrier 10. Figure 3A The electronic component 22 shown transmits data between itself and pin 13p. The conductive pad 41p4 on surface 411 can be configured to transmit data from... Figure 3A The described pin 13p receives electrical signals.

[0084] Figure 4E The illustration shows a top view of the heat dissipation plate 40 and the carrier 41 according to some arrangements of this disclosure. In some arrangements, Figure 4E The structure in can have, for example Figure 2G The cross-sectional view shown.

[0085] In some arrangements, Figure 4EThe structure depicted offers advantages such as simpler manufacturing processes, reduced costs, and stronger support for the carrier 41. In comparison, Figure 2F The illustrated structure houses the heat dissipation plate 20 within the carrier 21, allowing for a greater thickness of the heat sink. This design choice significantly improves heat dissipation capabilities, making it more effective in managing thermal performance. Therefore, this structure is particularly advantageous in applications where effective thermal management is critical.

[0086] Unless otherwise specified, spatial descriptions such as “above,” “below,” “up,” “left,” “right,” “lower,” “top,” “bottom,” “vertical,” “horizontal,” “side,” “above,” “below,” “upper,” “above,” and “below” are relative to the orientation shown in the figures. It should be understood that the spatial descriptions used herein are for illustrative purposes only, and actual embodiments of the structures described herein can be arranged in space in any orientation or manner, provided that the advantages of the embodiments of this disclosure are not affected by such arrangement.

[0087] As used herein, the terms “approximately,” “generally,” “roughly,” and “about” are used to describe and explain minor variations. When used in conjunction with an event or situation, these terms may refer to examples where the event or situation occurred precisely or very approximately. For example, when used in conjunction with a numerical value, these terms may refer to a range of variation less than or equal to ±10% of the stated value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if a first value is within a range of variation less than or equal to ±10% of a second value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%, then the first value may be considered “generally” the same as or equal to the second value. For example, "roughly" vertical can refer to an angle variation of less than or equal to ±10° relative to 90°, such as less than or equal to ±5°, less than or equal to ±4°, less than or equal to ±3°, less than or equal to ±2°, less than or equal to ±1°, less than or equal to ±0.5°, less than or equal to ±0.1°, or less than or equal to ±0.05°.

[0088] If the displacement between two surfaces is no greater than 5 µm, 2 µm, 1 µm, or 0.5 µm, then the two surfaces are considered coplanar or substantially coplanar. If the displacement between the highest and lowest points of a surface is no greater than 5 µm, 2 µm, 1 µm, or 0.5 µm, then the surface is considered substantially flat.

[0089] As used herein, unless the context clearly indicates otherwise, the singular forms “a / an” and “the” may contain a plural or multiple indicators.

[0090] As used herein, the terms “conductive,” “electrically conductive,” and “conductivity” refer to the ability to conduct electric current. Conductive materials typically indicate materials that offer little or no resistance to the flow of electric current. One unit of measurement for conductivity is Siemens per meter (S / m). Generally, conductive materials have a conductivity greater than approximately 10. 4 S / m, for example, at least 10 5 S / m or at least 10 6 A material with conductivity of S / m. The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0091] In addition, quantities, ratios, and other numerical values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and brevity, and should be flexibly interpreted as including not only the numerical values ​​explicitly specified as the limits of the range, but also all individual numerical values ​​or subranges covered within the range, as if each numerical value and subrange were explicitly specified.

[0092] While this disclosure has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting. Those skilled in the art will understand that various changes and alternative equivalents may be made without departing from the true spirit and scope of this disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Due to manufacturing processes and tolerances, the process reproduction in this disclosure may differ from actual equipment. Other embodiments may exist that are not specifically described in this disclosure. The description and drawings should be considered illustrative rather than limiting. Modifications may be made to suit particular circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of this disclosure. All such modifications are considered to be included within the scope of the appended claims. Although the disclosed methods have been described herein with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of this disclosure.

Claims

1. An electronic device comprising: Heat dissipation plate; A first carrier, which is partially embedded in the heat dissipation plate, wherein the heat dissipation plate has a higher thermal conductivity than the first carrier; as well as A first electronic component is disposed above the first carrier and the heat dissipation plate, wherein the first electronic component is electrically connected to the first carrier.

2. The electronic device of claim 1, wherein the heat dissipation plate serves as a ground plane for the first electronic component.

3. The electronic device according to claim 1, further comprising: The second carrier, wherein the heat dissipation plate is disposed between the first carrier and the second carrier; as well as A connecting element extends along the side of the heat dissipation plate and is configured to electrically connect between the first carrier and the second carrier.

4. The electronic device of claim 3, wherein the connecting element is partially housed in a recess in the heat dissipation plate.

5. The electronic device according to claim 3, further comprising: A second electronic component is disposed above the second carrier, wherein the second electronic component is electrically connected to the first electronic component via the connecting element.

6. The electronic device of claim 5, wherein the second electronic component is partially housed in a hole in the heat dissipation plate.

7. The electronic device of claim 1, wherein the heat dissipation plate has a plurality of grooves located on the side of the heat dissipation plate.

8. The electronic device of claim 7, wherein a plurality of first conductive pads of the first carrier are exposed from the groove.

9. The electronic device of claim 8, wherein the plurality of second conductive pads of the first carrier are grounded through the heat dissipation plate, and wherein the plurality of first conductive pads and the plurality of second conductive pads are arranged in an alternating manner.

10. An electronic device comprising: Electronic components; A heat dissipation plate is disposed above the electronic components and configured to provide a heat dissipation path for the electronic components; as well as A connecting element, which is partially housed in a recess in the heat dissipation plate and configured to provide an electrical connection path for the electronic components.

11. The electronic device of claim 10, wherein the groove is recessed from the side of the heat dissipation plate.

12. The electronic device of claim 10, further comprising: The carrier is disposed in the recessed portion of the heat dissipation plate and is electrically connected to the electronic components via the connecting element.

13. The electronic device of claim 12, further comprising: A heat dissipation element is disposed above the heat dissipation plate and is laterally spaced from the carrier.

14. An electronic device comprising: First carrier; A first electronic component is disposed above the first carrier; A heat dissipation plate is positioned above the first electronic component; as well as A second carrier is disposed above the heat dissipation plate, wherein the first electronic component is electrically connected to the second carrier through the first carrier.

15. The electronic device of claim 14, wherein the first electronic component protrudes above the heat dissipation plate.

16. The electronic device of claim 14, further comprising: A second electronic component is disposed above the second carrier, wherein the second electronic component partially overlaps with the heat dissipation plate and partially overlaps with the second carrier.

17. The electronic device of claim 16, wherein the second electronic component is grounded via the heat dissipation plate.

18. The electronic device of claim 16, wherein the heat dissipation plate includes a first conductive pad configured to connect to the second carrier and a second conductive pad configured to connect to the second electronic component.

19. The electronic device of claim 18, wherein the first conductive pad is smaller than the second conductive pad.

20. The electronic device of claim 14, further comprising: A connecting element, which is spaced apart from the heat dissipation plate and housed in a groove of the heat dissipation plate.

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