Electromagnetic compatibility case and electronic device

Abstract

This invention discloses an electromagnetic compatibility (EMC) chassis and electronic device, belonging to the field of electronic equipment technology. It includes a sealed main frame and a heat dissipation duct. A device housing cavity is formed inside the sealed main frame. The heat dissipation duct is disposed within the sealed main frame, and an airflow channel is formed inside the duct, which is physically isolated from the device housing cavity. An airflow driving component is provided at the end of the airflow channel to form a through airflow within the channel. A heat conduction interface is provided on the outer wall of the heat dissipation duct to conduct heat from the heat-generating devices in the device housing cavity to the heat dissipation duct. The chassis of this invention constructs an independent heat dissipation flow field through physically isolated independent heat dissipation ducts, achieving efficient heat dissipation while ensuring the device housing cavity is sealed to meet EMC and dustproof requirements, effectively resolving the physical conflict between heat dissipation ventilation and electromagnetic shielding.

Description

Technical Field

[0001] This invention belongs to the field of electronic equipment technology, specifically relating to an electromagnetic compatibility chassis and electronic equipment. Background Technology

[0002] As electronic devices develop towards higher integration, miniaturization, and higher frequency, electronic chassis, as the physical infrastructure of the system, face the dual challenges of heat dissipation and electromagnetic compatibility (EMC).

[0003] In engineering practice, heat dissipation requirements and electromagnetic shielding requirements often conflict physically. To meet heat dissipation requirements, traditional chassis typically have ventilation windows on the side walls and install fans for forced convection cooling. However, this open or semi-open ventilation structure can compromise the electromagnetic shielding integrity of the chassis, leading to electromagnetic leakage. Simultaneously, external dust, impurities, and other foreign objects can easily enter the chassis through the ventilation openings, affecting the reliability of electronic components. Conversely, if a fully enclosed structure is used to ensure electromagnetic compatibility and dustproof performance, heat will accumulate inside the chassis, failing to meet the heat dissipation requirements of high-power devices.

[0004] Therefore, there is an urgent need for a chassis structure that can achieve efficient heat dissipation while ensuring electromagnetic compatibility and dustproof performance. Summary of the Invention

[0005] In view of one or more of the above-mentioned defects or improvement needs of the prior art, the present invention provides an electromagnetic compatibility chassis and electronic equipment, which can maintain electromagnetic compatibility and dustproof performance by ensuring that the internal component housing cavity is sealed, while efficiently dissipating heat from heat-generating components through independent heat dissipation channels, thereby achieving efficient heat dissipation of the chassis.

[0006] To achieve the above objectives, the present invention provides an electromagnetic compatibility enclosure, comprising: A sealed main frame, comprising multiple side plates, wherein adjacent side plates are seamlessly welded to form a sealed splicing structure, which is used to form a device receiving cavity to eliminate electromagnetic leakage gaps; A heat dissipation duct is provided within the sealed main frame. An airflow channel is formed inside the heat dissipation duct, and the airflow channel is physically isolated from the device receiving cavity. An airflow driving component is provided at the end of the airflow channel to form a through airflow within the airflow channel. A heat conduction interface is provided on the outer wall of the heat dissipation duct to conduct the heat from the heat-generating device in the device receiving cavity to the heat dissipation duct.

[0007] As a further preferred embodiment of the present invention, the heat dissipation duct divides the internal space of the sealed main frame into the device receiving cavity and the airflow channel; The airflow driving component includes a first airflow driving unit and a second airflow driving unit. The first airflow driving unit is disposed at the first end of the airflow channel and is used to supply air into the airflow channel. The second airflow driving unit is disposed at the second end of the airflow channel and is used to draw air from the airflow channel to form a through airflow.

[0008] As a further preferred embodiment of the present invention, the outer wall of the heat dissipation duct is provided with heat dissipation fins; The thermal conduction interface includes a thermally conductive boss and a thermally conductive pad. The thermally conductive boss is disposed on the bottom surface of the heat dissipation channel facing the device receiving cavity, and the thermally conductive pad is disposed between the thermally conductive boss and the heat-generating device to exchange heat through thermal conduction.

[0009] As a further preferred embodiment of the invention, a conductive seal is also included, which is disposed at the detachable interface of the sealed main frame and configured to fill the gaps in the detachable interface to achieve electromagnetic shielding.

[0010] As a further preferred embodiment of the present invention, the bottom surface or detachable cover plate of the sealed main frame is provided with an annular sealing groove, and the conductive sealing element is an electromagnetic shielding rubber strip, which is embedded in the annular sealing groove. When the removable cover or the heat dissipation duct is installed on the sealed main frame, the electromagnetic shielding rubber strip is deformed under pressure to seal the removable interface.

[0011] As a further preferred embodiment of the present invention, both the front and rear faces of the heat dissipation duct are provided with electromagnetic shielding grooves, and electromagnetic shielding strips are installed in the electromagnetic shielding grooves. The electromagnetic shielding strips are used to achieve electromagnetic isolation between the airflow channel and the external environment when the heat dissipation duct is assembled with the sealed main frame.

[0012] As a further preferred embodiment of the present invention, the first airflow drive unit and the second airflow drive unit are axial flow fans, respectively. The front and rear panels of the sealed main frame are provided with cooling fan mounting interfaces. The cooling fan mounting interfaces are equipped with dustproof mesh structures to block external impurities from entering the airflow channel.

[0013] As a further preferred embodiment of the present invention, the front panel of the sealed main frame is provided with metal handles on both sides, the rear panel is provided with guide pins, and the bottom is provided with a grounding post. The left and right sides of the sealed main frame have reserved mounting rail interfaces.

[0014] As a further preferred embodiment of the present invention, the seamless welding adopts a brazing process, and the adjacent side plates are brazed together by welding plates to form the sealed splicing structure.

[0015] The present invention also discloses an electronic device, including the aforementioned electromagnetic compatibility enclosure; and A functional module is installed inside the device housing cavity of the electromagnetic compatibility enclosure, and the heating surface of the functional module is thermally coupled to the heat conduction interface.

[0016] In summary, the beneficial effects of the above-described technical solutions conceived by this invention compared with the prior art include: (1) The electromagnetic compatibility chassis of the present invention constructs a heat dissipation flow field independent of the device housing cavity by setting a heat dissipation air duct that is physically isolated from the device housing cavity and configuring an airflow driving component at the end of the airflow duct to form a through airflow. This physical isolation design fundamentally cuts off the direct communication path between the heat dissipation vent and the device housing cavity, so that while maintaining the high sealing of the device housing cavity to meet electromagnetic compatibility and dustproof requirements, the chassis can use forced convection in the independent air duct to remove heat, effectively resolving the physical conflict between heat dissipation ventilation and electromagnetic shielding.

[0017] (2) The electromagnetic compatibility chassis of the present invention forms a sealed splicing structure by seamless welding between the side plates of the sealed main frame, eliminating the overlapping gaps caused by traditional screwing or riveting methods and blocking the electromagnetic leakage path on the surface of the chassis shell; in conjunction with the conductive seals set at the detachable interface, the assembly gaps are filled, ensuring the continuity of the overall electromagnetic shielding of the chassis. At the same time, the heat dissipation fins on the outer wall of the heat dissipation duct increase the heat exchange area, and combined with the heat conduction interface formed by the heat-conducting boss and the heat-conducting pad, the contact thermal resistance between the heat-generating device and the airflow channel is reduced, and the heat conduction efficiency is improved, thereby significantly enhancing the heat dissipation capacity of the chassis while ensuring electromagnetic compatibility performance. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of the electromagnetic compatibility chassis according to an embodiment of this application; Figure 2 This is a schematic diagram of the enclosed main frame structure according to an embodiment of this application; Figure 3 This is a three-dimensional structural diagram of the heat dissipation air duct according to an embodiment of this application; Figure 4 This is a schematic diagram of the lower base plate structure according to an embodiment of this application.

[0019] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically: 1. Right side panel; 2. Heat dissipation duct; 3. Axial fan; 4. Rear panel; 5. Top cover; 6. Guide pin; 7. First heat dissipation module; 8. Left side panel; 9. Bottom plate; 10. Second heat dissipation module; 11. Front panel; 12. Metal handle; 13. Grounding post. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0021] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0023] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0024] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0025] Example: Please see Figures 1-4 The electromagnetic compatibility chassis and electronic equipment in the preferred embodiment of the present invention can achieve efficient heat dissipation of the chassis by means of independent heat dissipation channels while ensuring that the internal component housing cavity is sealed to maintain electromagnetic compatibility and dustproof performance.

[0026] Specifically, in a preferred embodiment of this application, the electromagnetic compatibility chassis includes a sealed main frame and a heat dissipation duct 2.

[0027] The sealed main frame contains a device housing cavity. Preferably, the sealed main frame is the outer shell of the chassis and the electromagnetic shielding boundary. The sealed main frame is enclosed by the front panel 11, rear panel 4, left side panel 8, right side panel 1, upper cover 5, and lower bottom plate 9 to form a closed rectangular space. This device housing cavity is used to install various electronic components or functional modules, completely isolating them from the external environment.

[0028] It should be understood that although the electromagnetic compatibility enclosure in the preferred embodiment is a standard cuboid box structure, in other embodiments, the sealed main frame can also be designed as a cylindrical, irregular, or other polyhedral structure according to the actual application scenario, as long as it can form a relatively independent sealed space to meet the requirements of electromagnetic shielding and dust prevention.

[0029] Furthermore, the heat dissipation duct 2 is set inside the sealed main frame, and an airflow channel is formed inside the heat dissipation duct 2. The airflow channel is physically isolated from the device housing cavity, so that the external cooling airflow only flows inside the heat dissipation duct 2 and does not directly enter the device housing cavity, thereby avoiding electromagnetic leakage and dust intrusion problems caused by opening ventilation holes.

[0030] Preferably, the heat dissipation duct 2 can be a tunnel-like structure with a closed pipe wall, the outer wall of which faces the device housing cavity, while the inner wall defines the airflow channel. This design completely decouples the heat dissipation flow field from the device operating area in space, enabling the chassis to achieve efficient heat dissipation through forced convection while maintaining a high protection level and high electromagnetic compatibility performance.

[0031] Furthermore, an airflow driving component is provided at the end of the airflow channel to form a through airflow within the airflow channel. The airflow driving component can be an axial fan 3, a centrifugal fan, or other types of air supply and exhaust equipment, and its installation position can be located at one or both ends of the airflow channel. In this embodiment, by establishing a stable through airflow within the airflow channel, it is ensured that heat can be continuously and rapidly transported to the outside of the chassis, avoiding the accumulation of heat within the air duct.

[0032] Furthermore, the outer wall of the heat dissipation duct 2 is provided with a heat conduction interface for conducting heat from the heat-generating device inside the device housing cavity to the heat dissipation duct 2. Since the airflow channel is physically isolated from the device housing cavity, heat cannot be directly exchanged through convection, so the heat conduction interface plays a crucial "thermal bridge" role.

[0033] Specifically, the heat conduction interface is located on the side of the heat dissipation duct 2 facing the device housing cavity. Through direct or indirect contact with the heat-generating device, it transfers heat energy across the isolation wall to the duct body in the form of solid conduction, and then the duct body dissipates it into the airflow channel and is carried away by the airflow.

[0034] For example, the heat conduction interface can be a raised heat-conducting platform on the outer wall of the air duct, a fitted heat-conducting pad, or a coated thermal grease. This solid-based heat transfer-based thermal management method fundamentally solves the technical problem of compromised electromagnetic shielding integrity in traditional open heat dissipation structures, achieving synergistic optimization of heat dissipation performance and electromagnetic compatibility performance.

[0035] More preferably, in the preferred embodiment of this application, the heat dissipation duct 2 divides the internal space of the sealed main frame into a device receiving cavity and an airflow channel.

[0036] Specifically, the heat dissipation duct 2, serving as a functional partition within the chassis, has its outer wall and the inner wall of the sealed main frame jointly enclosing a device housing cavity for mounting electronic components. The hollow area inside forms a dedicated airflow channel for the cooling medium. This spatial division logic completely decouples the working area of ​​the heat-generating components from the flow area of ​​the cooling airflow, ensuring the airtightness of the device housing cavity to meet electromagnetic compatibility requirements while providing an independent and controllable flow field space for forced convection cooling.

[0037] Furthermore, in a preferred embodiment of this application, the airflow driving component includes a first airflow driving unit and a second airflow driving unit. The first airflow driving unit is disposed at the first end of the airflow channel and is used to supply air into the airflow channel; the second airflow driving unit is disposed at the second end of the airflow channel and is used to draw air from the airflow channel to form a push-pull through airflow. Preferably, both the first airflow driving unit and the second airflow driving unit can be axial flow fans 3.

[0038] Combination Figure 1 and Figure 3 As shown, the first and second airflow drive units can both be axial fans 3, respectively installed on the front panel 11 and the rear panel 4 at the corresponding airflow channel ports. The axial fan 3 on the front panel 11 is mounted upright to force cold air into the airflow channel, while the axial fan 3 on the rear panel 4 is mounted in reverse to extract hot air from the airflow channel. The two work together to form a directional airflow that runs through the entire airflow channel. Compared to traditional solutions that rely solely on a single-end fan for air delivery or extraction, this push-pull aerodynamic layout can establish a more uniform and stable air pressure distribution within the airflow channel, effectively avoiding airflow stagnation or vortex dead zones caused by excessive local resistance, thereby significantly improving convective heat transfer efficiency. Simultaneously, the synergistic effect of the two fans reduces the speed requirement of a single fan, helping to reduce noise and vibration while ensuring equivalent heat dissipation performance.

[0039] More preferably, in a preferred embodiment of this application, the outer wall of the heat dissipation duct 2 is provided with heat dissipation fins. For example... Figure 3 As shown, the heat dissipation fins can be arranged longitudinally and parallel to each other on the top and sides of the heat dissipation duct 2, which greatly increases the effective heat exchange area between the inner wall of the airflow duct and the cooling airflow. When the through airflow flows over the surface of the heat dissipation fins, heat can be transferred more efficiently from the duct body to the airflow and carried away.

[0040] It should be understood that the specific shape, height, spacing and arrangement of the heat dissipation fins can be optimized according to the actual heat dissipation requirements and wind resistance characteristics. For example, corrugated, needle-shaped or staggered arrangements can also be used. This application does not limit this.

[0041] More specifically, in a preferred embodiment of this application, the thermal conduction interface includes a thermally conductive boss and a thermally conductive pad. The thermally conductive boss is disposed on the bottom surface of the heat dissipation duct 2 facing the device receiving cavity, and the thermally conductive pad is disposed between the thermally conductive boss and the heat-generating device to exchange heat through thermal conduction.

[0042] Specifically, the thermally conductive protrusion is a solid structure that protrudes from the bottom of the heat dissipation channel 2 towards the device housing cavity. It can be distributed in a rectangular block, cylindrical, or grid-like array, and its core function is to provide a concentrated heat conduction path and increase the effective contact area with the heat-generating device. The thermally conductive pad fills the space between the thermally conductive protrusion and the surface of the heat-generating device. On the one hand, it compensates for the microscopic gaps caused by machining tolerances or assembly errors; on the other hand, it achieves a tight fit through its own elastic deformation, thereby significantly reducing contact thermal resistance.

[0043] During operation, the heat generated by the heat-generating device is sequentially conducted through the thermal pad and thermal protrusions to the body of the heat dissipation duct 2, and then dissipated into the through-flow within the airflow channel via the heat dissipation fins. This composite heat conduction interface, composed of thermal protrusions and thermal pads, establishes a low thermal resistance and high reliability solid heat transfer path while ensuring physical isolation of the device housing cavity. It is a key structure for achieving efficient heat dissipation in a sealed chassis. For example, the thermal pad can be made of materials with good thermal conductivity and electrical insulation properties, such as thermal grease, phase change materials, or flexible thermally conductive silicone sheets, to adapt to the heat dissipation requirements of different power densities and installation conditions.

[0044] Furthermore, in a preferred embodiment of this application, the sealed main frame includes multiple side panels, and adjacent side panels are seamlessly welded to form a sealed splicing structure to eliminate electromagnetic leakage gaps. Preferably, the sealed main frame is spliced ​​from four side panels: front panel 11, rear panel 4, left side panel 8, and right side panel 1. At the splicing points of the four side panels, the metal at the joints of adjacent panels is fused together using a welding process, thereby physically eliminating the gap antenna effect caused by mechanical overlap.

[0045] In practical applications, this seamless welding can be achieved using processes such as brazing, laser welding, or argon arc welding. Vacuum brazing with aluminum-silicon-magnesium alloy sheets is preferred to obtain a dense and electrically continuous weld. Since electromagnetic waves are highly susceptible to coupling and leakage through gaps in the chassis, especially when the gap length is close to an integer multiple of the electromagnetic wave wavelength, severe resonant leakage can occur. Therefore, changing the connection method between the side panels from mechanical fastening to seamless metallurgical welding is a crucial measure to block electromagnetic leakage paths on the chassis surface at the source, ensuring the integrity of the sealed main frame as the foundation of the electromagnetic shield.

[0046] Further preferably, in a preferred embodiment of this application, the electromagnetic compatibility (EMC) chassis further includes conductive seals. These conductive seals are disposed at the detachable interfaces of the sealed main frame to fill gaps in the detachable interfaces and achieve electromagnetic shielding. Although permanent sealing is achieved through welding between the side panels, the chassis inevitably has detachable interfaces that require opening for maintenance or assembly of internal components during actual use. These interfaces cannot be sealed by welding and thus become weak points in the electromagnetic shielding. Preferably, this embodiment provides conductive seals on all detachable mating surfaces, utilizing their conductivity and elasticity to fill assembly gaps, ensuring electrical continuity between the detachable interfaces and the welded shell, thereby maintaining overall shielding effectiveness.

[0047] Furthermore, in a preferred embodiment of this application, an annular sealing groove is provided on the bottom surface of the sealed main frame or the detachable cover plate, and the conductive sealing element is an electromagnetic shielding rubber strip, which is embedded in the annular sealing groove; when the detachable cover plate or heat dissipation duct 2 is installed on the sealed main frame, the electromagnetic shielding rubber strip is deformed under pressure to seal the detachable interface.

[0048] Combination Figure 2 and Figure 4 As shown, for example, on the mating surfaces of the lower base plate 9 and the sealed main frame, and on the mating surfaces of the upper cover plate 5 and the sealed main frame, annular sealing grooves extending along the contours of the mating surfaces are machined. Electromagnetic shielding rubber strips are pre-placed in these annular sealing grooves, and their cross-sectional shape can be circular, rectangular, or irregular. The material is usually silicone rubber or fluororubber filled with conductive particles such as silver powder, nickel powder, or copper powder.

[0049] When the upper cover plate 5 or the lower base plate 9 is installed by fasteners, the electromagnetic shielding rubber strip undergoes elastic deformation under axial pressure. On the one hand, it fully fills the micro gaps between the mating surfaces caused by machining tolerances or surface roughness. On the other hand, it establishes stable contact pressure on the contact surface through its own rebound force, ensuring low impedance electrical conduction across the entire frequency band.

[0050] It should be understood that although the figure shows the annular sealing groove disposed on the lower base plate 9 and the upper cover plate 5, in other embodiments, the annular sealing groove can also be disposed on the corresponding mating surfaces of the sealed main frame, or simultaneously disposed on two mating surfaces to form a double seal, as long as the function of sealing under pressure deformation can be achieved. This sealing mechanism based on the compression deformation of an elastic body effectively solves the problem of local gaps caused by flatness errors when rigid metal surfaces are in direct contact, ensuring the reliability of the electromagnetic shielding of the detachable interface.

[0051] More preferably, in the preferred embodiment of this application, both the front end and rear end of the heat dissipation duct 2 are provided with electromagnetic shielding grooves, and electromagnetic shielding strips are installed in the electromagnetic shielding grooves. The electromagnetic shielding strips are configured to achieve electromagnetic isolation between the airflow channel and the external environment when the heat dissipation duct 2 is assembled with the sealed main frame.

[0052] Combination Figure 3 As shown, since the heat dissipation duct 2 penetrates the sealed main frame and is connected to the external environment, its front and rear ports are potential channels through which electromagnetic waves may bypass the shell shielding layer and directly invade the device housing cavity. Therefore, electromagnetic shielding grooves are respectively opened on the front and rear faces of the heat dissipation duct 2, and electromagnetic shielding strips are installed in the grooves. When the heat dissipation duct 2 is assembled to the sealed main frame, the electromagnetic shielding strips are compressed between the duct end face and the inner wall of the panel, forming a closed conductive ring around the airflow channel inlet and outlet, thereby cutting off the path of electromagnetic waves propagating along the gap between the outer wall of the airflow channel and the inner wall of the chassis.

[0053] For example, electromagnetic shielding strips can take the form of conductive foam, finger-shaped springs, or metal mesh pads, the choice depending on the operating frequency range and the size of the compression space. This design, together with the aforementioned seamless welding of the side panels and the removable conductive seal at the interface, constitutes a multi-layered, comprehensive electromagnetic shielding system—a complete Faraday cage structure. The absence of any single component can lead to overall electromagnetic compatibility performance failure; the synergistic effect of these three elements ensures that the chassis maintains a high level of electromagnetic shielding effectiveness while meeting the requirements of forced air cooling.

[0054] Furthermore, in a preferred embodiment of this application, both the front panel 11 and the rear panel 4 of the sealed main frame are provided with cooling fan mounting interfaces, and the cooling fan mounting interfaces are provided with dustproof mesh structures, which are configured to block external impurities from entering the airflow channel.

[0055] Specifically, a dust filter structure covers the outside of the air inlet or outlet of the axial fan 3. It can be made of materials such as stainless steel wire mesh, nylon filter, or perforated metal plate, with the mesh size selectable from 0.5mm to 2mm depending on the required protection level. This dust filter structure allows for smooth airflow while effectively intercepting dust, fibers, metal debris, and other particles, preventing them from entering the heat dissipation duct 2 and depositing on the surface of the heat dissipation fins. This avoids reduced heat exchange efficiency and the risk of localized overheating due to dust accumulation.

[0056] More preferably, in the preferred embodiment of this application, the front panel 11 of the sealed main frame is provided with metal handles 12 on both sides, the rear panel 4 is provided with guide pins 6, and the bottom is provided with grounding post 13; the left side plate 8 and the right side plate 1 of the sealed main frame are provided with mounting rail interfaces.

[0057] Combination Figure 1 and Figure 2 As shown, metal handles 12 are symmetrically installed on the left and right sides of the front panel 11, facilitating the handling, insertion, removal, and securing of the chassis within the rack. Guide pins 6 are located in the upper area of ​​the rear panel 4, providing precise positioning and guidance when the chassis is pushed into the rack, preventing connector damage due to misalignment. Grounding posts 13 are located at the bottom of the chassis, used to connect the system protective ground wire, conducting induced charges or interference currents from the chassis to the ground, ensuring electrical safety and signal integrity of the equipment. Mounting rail interfaces are distributed on the outer surfaces of the left side panel 8 and the right side panel 1, used to adapt to the mounting rails of standard 19-inch racks, enabling quick rack mounting and locking of the chassis. Although these auxiliary structures do not directly participate in the core functions of heat dissipation or electromagnetic shielding, they collectively constitute the complete usability of the chassis as an engineering product, ensuring its ease of installation, operational safety, and maintenance friendliness in actual deployment environments.

[0058] More specifically, in the preferred embodiment of this application, the seamless welding adopts a brazing process, and adjacent side plates are brazed together by AlSiMg4004 welding sheets to form a closed splicing structure.

[0059] Specifically, AlSiMg4004 is an aluminum-silicon-magnesium brazing filler metal with a melting point of approximately 570°C to 590°C, which matches the melting point of commonly used 6061 or 6063 aluminum alloy base materials. It can achieve uniform wetting and capillary filling in a vacuum or inert atmosphere.

[0060] During brazing, molten solder flows spontaneously along the gaps in the side plate joints, forming a metallurgical bond. Upon cooling, this results in a dense, non-porous weld structure. This material selection not only ensures the mechanical strength of the weld but, more importantly, maintains the electrical continuity at the joint, making the entire enclosed frame an electrically low-impedance conductor. This effectively suppresses the leakage of high-frequency electromagnetic waves through the weld interface. Compared to ordinary fusion welding or mechanical connections, the AlSiMg4004 brazing process ensures electromagnetic shielding performance while avoiding assembly accuracy loss due to excessive thermal deformation, making it the preferred manufacturing path for high EMC performance chassis housings.

[0061] Furthermore, in another preferred embodiment of this application, an electronic device is disclosed, which includes the aforementioned electromagnetic compatibility (EMC) chassis and a functional module. The functional module is installed within the device housing cavity of the EMC chassis, and the heating surface of the functional module is thermally coupled to the heat conduction interface.

[0062] More preferably, in the preferred embodiment of this application, the functional modules are specifically embodied as a first heat dissipation module 7 and a second heat dissipation module 10, which are fixedly installed on the lower base plate 9 and completely contained in the device receiving cavity formed by the enclosed main body frame.

[0063] During assembly, the heating surface of the functional module is tightly fitted with the heat-conducting protrusion at the bottom of the heat dissipation duct 2 via a thermally conductive pad, thereby establishing a low-thermal-resistance solid heat transfer path. Specifically, when the first heat dissipation module 7 or the second heat dissipation module 10 is installed, a thermally conductive pad is sandwiched between its top heating surface and the corresponding heat-conducting protrusion. Under the axial pressure applied by the fasteners, the thermally conductive pad undergoes elastic deformation, fully filling the microscopic gaps between the metal contact surfaces, eliminating the air insulation layer, and ensuring that heat can be efficiently conducted from the functional module to the body of the heat dissipation duct 2. This thermal coupling method not only ensures heat transfer efficiency but also absorbs the mechanical stress caused by assembly tolerances and differences in thermal expansion coefficients through the buffering effect of the thermally conductive pad, improving the reliability of the connection.

[0064] During operation, heat enters the cooling duct 2 via the aforementioned heat conduction interface and rapidly diffuses to the surface of the heat dissipation fins on the inner wall of the duct. Simultaneously, axial fans 3 located at both ends of the airflow duct work together to form a push-pull through-flow, continuously scouring the heat dissipation fins and carrying the accumulated heat out of the chassis. Since the airflow duct and the device housing are physically completely isolated, the cooling airflow only flows within the cooling duct 2 and does not exchange with the air inside the device housing. Therefore, the functional modules are always in a sealed, clean, and electromagnetically shielded controlled environment. This complete thermal management process demonstrates that the electronic device provided in this application can effectively dissipate heat from high-power-density functional modules while meeting stringent electromagnetic compatibility standards and high-level dustproof requirements. It solves the technical contradictions of severe electromagnetic leakage in traditional open-chassis cooling systems and the difficulty of heat dissipation in fully enclosed chassis, demonstrating significant engineering practical value and broad industrial applicability.

[0065] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. An electromagnetic compatibility enclosure, characterized in that, include: A sealed main frame, comprising multiple side plates, wherein adjacent side plates are seamlessly welded to form a sealed splicing structure, which is used to form a device receiving cavity to eliminate electromagnetic leakage gaps; A heat dissipation duct is provided within the sealed main frame. An airflow channel is formed inside the heat dissipation duct, and the airflow channel is physically isolated from the device receiving cavity. An airflow driving component is provided at the end of the airflow channel to form a through airflow within the airflow channel. A heat conduction interface is provided on the outer wall of the heat dissipation duct to conduct the heat from the heat-generating device in the device receiving cavity to the heat dissipation duct.

2. The electromagnetic compatibility enclosure according to claim 1, characterized in that, The heat dissipation duct divides the internal space of the sealed main frame into the device receiving cavity and the airflow channel; The airflow driving component includes a first airflow driving unit and a second airflow driving unit. The first airflow driving unit is disposed at the first end of the airflow channel and is used to supply air into the airflow channel. The second airflow driving unit is disposed at the second end of the airflow channel and is used to draw air from the airflow channel to form a through airflow.

3. The electromagnetic compatibility enclosure according to claim 2, characterized in that, The outer wall of the heat dissipation duct is provided with heat dissipation fins; The thermal conduction interface includes a thermally conductive boss and a thermally conductive pad. The thermally conductive boss is disposed on the bottom surface of the heat dissipation channel facing the device receiving cavity, and the thermally conductive pad is disposed between the thermally conductive boss and the heat-generating device to exchange heat through thermal conduction.

4. The electromagnetic compatibility enclosure according to any one of claims 1 to 3, characterized in that, It also includes a conductive seal, which is disposed at the detachable interface of the sealed main frame and configured to fill the gaps in the detachable interface to achieve electromagnetic shielding.

5. The electromagnetic compatibility enclosure according to claim 4, characterized in that, The bottom surface or detachable cover plate of the sealed main frame is provided with an annular sealing groove, and the conductive sealing element is an electromagnetic shielding rubber strip, which is embedded in the annular sealing groove. When the removable cover or the heat dissipation duct is installed on the sealed main frame, the electromagnetic shielding rubber strip is deformed under pressure to seal the removable interface.

6. The electromagnetic compatibility enclosure according to claim 2 or 3, characterized in that, Both the front and rear faces of the heat dissipation duct are provided with electromagnetic shielding grooves, and electromagnetic shielding strips are installed in the electromagnetic shielding grooves. The electromagnetic shielding strips are used to achieve electromagnetic isolation between the airflow channel and the external environment when the heat dissipation duct is assembled with the sealed main frame.

7. The electromagnetic compatibility enclosure according to claim 2 or 3, characterized in that, The first airflow drive unit and the second airflow drive unit are axial flow fans, respectively; The front and rear panels of the sealed main frame are provided with cooling fan mounting interfaces. The cooling fan mounting interfaces are equipped with dustproof mesh structures to block external impurities from entering the airflow channel.

8. The electromagnetic compatibility enclosure according to any one of claims 1 to 3, characterized in that, The sealed main frame is equipped with metal handles on both sides of the front panel, guide pins on the rear panel, and a grounding post at the bottom. The left and right sides of the sealed main frame have reserved mounting rail interfaces.

9. The electromagnetic compatibility enclosure according to claim 4, characterized in that, The seamless welding adopts a brazing process, and the adjacent side plates are brazed together by welding plates to form the sealed splicing structure.

10. An electronic device, characterized in that, Includes an electromagnetic compatibility enclosure as described in any one of claims 1 to 9; as well as A functional module is installed inside the device housing cavity of the electromagnetic compatibility enclosure, and the heating surface of the functional module is thermally coupled to the heat conduction interface.

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