LED holder

Abstract

This invention relates to the field of packaging technology and discloses an LED bracket, including a bracket body and multiple packaging areas formed on the bracket body. Each packaging area has multiple terminal areas arranged in an array. The bracket body is provided with stress-relieving structures located around each packaging area and resistance structures located around each packaging area to resist deformation forces. This invention utilizes the stress-relieving and resistance structures. The stress-relieving structures bear the global force during the overall thermal expansion and contraction process during packaging curing, blocking stress transmission between packaging areas and actively absorbing most of the displacement. The resistance structures reduce the tensile force on the bracket body when the plastic shrinks and form a reaction force with the plastic shrinkage to counteract stress. The resistance structures are used for localized stress resistance, precisely controlling the flow of injection molding stress in key packaging areas, thereby effectively reducing deformation.

Description

Technical Field

[0001] This invention relates to the field of packaging technology, and in particular to an LED bracket. Background Technology

[0002] QFN (Quad Flat No-lead Package) is a widely used packaging form in LED lighting and semiconductor devices. Traditionally, QFN LED brackets are manufactured using a monolithic injection molding process, where metal terminals are arranged on a carrier and then injection molded as a whole. With the continuous increase in LED power density, SMC (Sheet Molding Compound) thermosetting materials, due to their excellent heat resistance and aging resistance, are increasingly being used in the manufacture of high-power LED brackets.

[0003] However, SMC thermosetting materials face a technical bottleneck in the application of cut-and-place QFNLED brackets: plastic materials have a shrinkage rate, and will shrink in volume after high-temperature injection molding and curing. The shrinkage rate of the metal terminals used to bond the plastic on the LED bracket is significantly different from that of the plastic material. This mismatch in shrinkage rate causes the injection-molded product to warp and deform. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the technical problem to be solved by the present invention is to provide an LED bracket to solve the problem of warping and deformation of injection molded products caused by the different shrinkage rates of existing metal terminals and plastic materials.

[0005] To solve the above-mentioned technical problems, one technical solution adopted by the present invention is: to provide an LED bracket including a bracket body and a plurality of encapsulation areas formed on the bracket body, each of the encapsulation areas having a plurality of terminal areas arranged in an array; and to provide on the bracket body a stress-relieving structure located on the periphery of each encapsulation area and a resistance structure located on the periphery of each encapsulation area for resisting deformation forces.

[0006] Furthermore, the release structure is provided on at least one side of the support body located around each encapsulation area; each encapsulation area is arranged along a first arrangement direction, and the release structure is provided on the side of the encapsulation area arranged along the first arrangement direction.

[0007] Furthermore, the support body has a transition connection area located between any two adjacent packaging areas along the first arrangement direction. The transition connection area has a first release space, and the first release space is configured as at least two sets, which are staggered and each includes multiple first release slots. The support body has an outer connection area located around the periphery of the multiple packaging areas. The outer connection area adjacent to the packaging area along the first arrangement direction has a second release space close to the corresponding packaging area. The second release space includes a second release slot extending along the corresponding side of the packaging area. The first release slot and the second release slot are configured as the release structure.

[0008] Furthermore, the support body and each encapsulation area have a first surface, and the resistance structure includes a first resistance groove formed from the first surface of each encapsulation area; the depth of the first resistance groove is 0.3 to 0.5 times the thickness of the support body.

[0009] Furthermore, the bracket body and each encapsulation area have a second surface, and the resistance structure includes a second resistance groove formed on at least one side of the outer connecting material area corresponding to the periphery of each encapsulation area to resist deformation force during injection molding. The second resistance groove is formed from the second surface and extends along the corresponding side of the encapsulation area. The first release channel and the second resistance groove are staggered, and the depth of the second resistance groove is 0.3 to 0.5 times the thickness of the bracket body.

[0010] Furthermore, the bracket body also has an inner connecting area located between each encapsulation area, and the inner connecting area has an adhesive inlet hole.

[0011] Furthermore, a first locking hole is formed around the periphery of the injection hole, and a plurality of second locking holes are provided on the inner material connecting area. The first and second locking holes are configured together as a feeding area for uniformly conveying the molding compound to the encapsulation area during injection molding. A first locking groove surrounding the edge of each first locking hole and a second locking groove surrounding the edge of each second locking hole are sequentially formed on the first surface of the inner material connecting area. The first locking groove includes an annular groove segment surrounding the periphery of the injection hole, a radial groove segment extending radially from the annular groove segment, and a frame-shaped groove segment connecting each radial groove segment.

[0012] Furthermore, the inner connecting material area is provided with multiple branch channels connecting the packaging areas corresponding to each packaging area, and a third resistance channel is formed on the first surface of the inner connecting material area, which surrounds the edge of the branch channels and connects to the first resistance channel; the outer connecting material area is provided with multiple cold material channels connecting the packaging areas corresponding to each packaging area, and the cold material channels are located between the resistance structure and the packaging area, and a fourth resistance channel is formed on the first surface of the outer connecting material area, which surrounds the edge of the cold material channels and connects to the first resistance channel; the cold material channels include a confluence section connected to the packaging area and a crossflow section extending along the corresponding side of the packaging area away from the packaging area.

[0013] Furthermore, the encapsulation area includes a frame, a plurality of longitudinal isolation strips located inside the frame and arranged at equal intervals along a first arrangement direction, and a plurality of transverse isolation strips located inside the frame and arranged at equal intervals along a second arrangement direction perpendicular to the first arrangement direction. Each of the longitudinal isolation strips intersects with each of the transverse isolation strips to enclose a plurality of terminal areas distributed in a rectangular array. The encapsulation area also includes hierarchical perforation strips formed between each pair of adjacent longitudinal isolation strips to separate each terminal area into a cathode side and an anode side.

[0014] Furthermore, the transverse isolation strip includes a plurality of first isolation holes arranged sequentially along the first arrangement direction, each of the first isolation holes intersecting the graded hole strip; each of the first isolation holes has a connecting rib formed obliquely between its two sides relative to the graded hole strip, so that the connecting rib is respectively connected to the cathode side and anode side of the adjacent end sub-regions along the second arrangement direction; the longitudinal isolation strip includes a plurality of second isolation holes arranged sequentially along the second arrangement direction.

[0015] The LED bracket of the present invention has at least the following beneficial effects: The present invention sets up a release structure and a resistance structure. The release structure is used to bear the global force during the overall thermal expansion and contraction process during encapsulation and curing, blocking the stress transmission between each encapsulation area and actively absorbing most of the displacement. The resistance structure reduces the tension on the bracket body when the plastic shrinks and forms a reaction force with the plastic shrinkage to resist the stress. The resistance structure is used for local stress resistance and precisely controls the flow of injection molding stress in the key encapsulation area, thereby effectively reducing the amount of deformation. Attached Figure Description

[0016] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the structure of an embodiment of the LED bracket of the present invention; Figure 2 for Figure 1 An enlarged view of part A shown; Figure 3 for Figure 2 The partial sectional view shown is cut along the DD direction; Figure 4 for Figure 2 The partial sectional view shown is cut along the EE direction; Figure 5 for Figure 1 An enlarged view of part B shown; Figure 6 for Figure 5 The partial sectional view shown is cut along the FF direction; Figure 7 for Figure 5 Partial sectional view shown, cut along the GG direction. Figure 8 for Figure 1 An enlarged view of section C shown; Figure 9 for Figure 1 An enlarged view of section H shown; Figure 10 for Figure 1 An enlarged view of section I shown.

[0017] The meanings of the labels in the attached diagram are as follows: 1. Support body, 11. First surface, 12. Second surface, 13. Transition connecting area, 14. Outer connecting area, 14. Positioning hole, 141. Cutting groove, 142. Cold material channel, 143. Converging section, 1431. Crossflow section, 1432. Inner connecting area, 15. Glue inlet, 151. First fastening hole, 152. Second fastening hole, 153. Branch channel, 154. Encapsulation area, 21. Frame, 22. Longitudinal isolation strip, 221. Second isolation hole, 221. Transverse isolation strip. 23. First isolation hole 231, graded hole strip 24, connecting rib 241, terminal area 25, cathode side 251, anode side 252, first release space 31, first release through groove 311, second release space 32, second release through groove 321, first resistance groove 41, second resistance groove 42, first fastening groove 51, annular groove segment 511, radial groove segment 512, frame-shaped groove segment 513, third resistance groove 52, fourth resistance groove 53. Detailed Implementation

[0018] The invention will now be further described with reference to the accompanying drawings.

[0019] Please see Figure 1 The LED bracket of the present invention includes a bracket body 1, a plurality of encapsulation areas 2 formed on the bracket body 1, a release structure formed on the bracket body 1, and a resistance structure disposed on the bracket body 1 and located around each encapsulation area 2. The encapsulation injection is concentrated in the encapsulation area 2. The release structure is used to release stress, and the resistance structure is used to resist deformation force, so as to effectively reduce the deformation of the LED bracket during encapsulation injection.

[0020] Please see Figure 1 The support body 1 has a sheet or plate-like structure and is made of a conductive metal such as copper. Two oppositely distributed sides of the support body 1 along its thickness direction are respectively configured as a first surface 11 and a second surface 12. Each encapsulation region 2 is integrally formed on the support body 1, and each encapsulation region 2 located on the support body 1 also has a first surface 11 and a second surface 12 consistent with the support body 1. The encapsulation regions 2 are arranged in a certain array on the support body 1, with adjacent encapsulation regions 2 spaced apart.

[0021] The bracket body 1 has a transition material connection area 13 located between each two adjacent packaging areas 2, an outer material connection area 14 surrounding each packaging area 2, and an inner material connection area 15 located between each packaging area 2, relative to the packaging area 2.

[0022] The transition connecting area 13 is located between the arrangement directions of each encapsulation area 2 to separate adjacent encapsulation areas 2, achieving physical isolation between each packaging area and improving electrical performance and reliability. Considering each encapsulation area 2 as a whole, the outer connecting area 14 surrounds the entire encapsulation area 2 in a frame shape. In one embodiment, the outer connecting area 14 is rectangular with four sides, and multiple positioning holes 141 are formed on two opposite sides of the outer connecting area 14 for positioning the LED bracket during encapsulation. A cutting groove 142 is also formed on the outer connecting area 14 to facilitate image recognition. The inner connecting area 15 is located at the center of all encapsulation areas 2, and the distance from the inner connecting area 15 to each encapsulation area 2 is approximately the same.

[0023] Please see Figure 1 and Figure 5 To reduce voids and incomplete molding due to varying solidification times in the initial flow of molding compound into the encapsulation zone 2 (away from the injection port 151) during injection molding, multiple cold slug channels 143 are provided on the outer connecting area 14 corresponding to each encapsulation zone 2. These cold slug channels 143 extend along the thickness direction and are located between the resistive structure and the encapsulation zone 2, allowing the initially cooler molding compound to flow into them, thereby improving yield. Specifically, the cold slug channel 143 includes a confluence section 1431 connecting and communicating with the encapsulation zone 2, and a crossflow section 1432 extending along the corresponding side of the encapsulation zone 2 (away from the encapsulation zone 2). The crossflow section 1432 is wider than the confluence section 1431 to accommodate more molding compound while enhancing its ability to intercept the molding compound through the angle formed with the confluence section 1431.

[0024] Please see Figures 1 to 4 and Figure 10An injection hole 151 is formed on the inner bonding area 15 to uniformly deliver molding compound to each encapsulation area 2 during subsequent encapsulation. Specifically, two injection holes 151 can be provided and arranged symmetrically, with the injection holes 151 penetrating the inner bonding area 15 along the thickness direction. To increase the bonding force between the plastic and the bracket body 1, a plurality of first locking holes 152 are formed around the injection hole 151, with each first locking hole 152 spaced apart on the outer periphery of the injection hole 151, so that the inner bonding area 15 around the injection hole 151 is radially distributed. A plurality of second locking holes 153 are provided on the inner bonding area 15, with each second locking hole 153 evenly distributed in the inner bonding area 15. Each first locking hole 152 and each second locking hole 153 are configured together as a feeding area. When the entire LED bracket is injection molded, an injection space is left between each first locking hole 152 and each second locking hole 153 on the inner connecting area 15 and the encapsulation mold. That is, an injection space is formed between the feeding area and the mold to uniformly deliver the molding compound to the encapsulation area 2 during injection molding. The inner connecting area 15 is provided with a plurality of branch flow channels 154 corresponding to each encapsulation area 2. The branch flow channels 154 extend to the feeding area so that the molding compound in the feeding area can enter the branch flow channels 154 and flow into the encapsulation area 2.

[0025] Please see Figure 1 In one embodiment, each encapsulation area 2 can be arranged along a rectangular array, with multiple encapsulation areas 2 divided into two rows and multiple columns. Each row is arranged sequentially along a first arrangement direction, and the two rows of encapsulation areas are symmetrically arranged on both sides of the inner connecting material area 15 along a second arrangement direction. Each branch channel 154 extends inward on the side of each encapsulation area 2 facing the inner connecting material area 15, and each cold material channel 143 extends outward on the side of each encapsulation area 2 away from the inner connecting material area 15. The support body 1 can be correspondingly set as a rectangle. The first arrangement direction and the second arrangement direction are perpendicular to each other, and the transition connecting material area 13 is formed between each encapsulation area 2 adjacent along the first arrangement direction. In another embodiment, each encapsulation area 2 can be arranged along a circular array, with multiple encapsulation areas 2 distributed in a ring with the midpoint of the support body 1 as the center. The first arrangement direction is the corresponding ring direction or circumferential direction of its arrangement. The branch channel 154 also extends inward, and the cold material channel 143 is set outward. The support body 1 can be set as a circle.

[0026] Please see Figure 1 , Figure 2 , Figures 5 to 9In this embodiment, the encapsulation area 2 includes a frame 21, a plurality of longitudinal isolation strips 22 located inside the frame 21 and arranged at equal intervals along a first arrangement direction, a plurality of transverse isolation strips 23 located inside the frame 21 and arranged at equal intervals along a second arrangement direction, and a hierarchical perforation strip 24 formed between each pair of adjacent longitudinal isolation strips 22. Each longitudinal isolation strip 22 intersects with each transverse isolation strip 23 to form a grid. Between each longitudinal isolation strip 22 and transverse isolation strip 23, a plurality of terminal areas 25 distributed in a rectangular array are formed. The hierarchical perforation strip 24 intersects with each terminal area 25 and divides each terminal area 25 into a cathode side 251 and an anode side 252.

[0027] A frame 21 surrounds the perimeter of the longitudinal isolation strips 22, transverse isolation strips 23, and hierarchical perforation strips 24. Both ends of each longitudinal isolation strip 22, transverse isolation strip 23, and hierarchical perforation strip 24 extend to the frame 21. Between any two longitudinal isolation strips 22, there are multiple terminal areas 25 arranged along the second arrangement direction, and between any two transverse isolation strips 23, there are multiple terminal areas 25 arranged along the first arrangement direction.

[0028] Specifically, the two outermost transverse isolation strips 23 along the second arrangement direction are arranged adjacent to the frame 21. Each transverse isolation strip 23 includes a plurality of first isolation holes 231 arranged sequentially along the first arrangement direction. The first isolation holes 231 are spaced apart from each other, and the longitudinal isolation strips 22 intersect between corresponding adjacent first isolation holes 231, so that two adjacent first isolation holes 231 along the first arrangement direction are separated by the longitudinal isolation strips 22. The two outermost longitudinal isolation strips 22 along the first arrangement direction are arranged adjacent to the frame 21.

[0029] Each longitudinal isolation band 22 includes a plurality of second isolation holes 221 arranged sequentially along the second arrangement direction. The second isolation holes 221 are spaced apart from each other. Any two adjacent first isolation holes 231 distributed along the first arrangement direction are separated by a second isolation hole 221 so that the transverse isolation band 23 intersects with the longitudinal isolation band 22. The terminal area 25 is surrounded by the first isolation holes 231 and the second isolation holes 221, thereby separating and making each terminal area 25 independent of each other, achieving electrical isolation to a certain extent and improving electrical safety. When forming the finished product, the first isolation holes 231 and the second isolation holes 221 can also prevent light leakage to a certain extent. During encapsulation, the molding compound flows into each first isolation hole 231 and the second isolation hole 221, increasing the bonding force between the plastic and the LED bracket after sealing.

[0030] Between any two adjacent longitudinal isolation bands 22, a hierarchical perforation band 24 located in the middle is provided, and each hierarchical perforation band 24 intersects with each first isolation hole 231 of each transverse isolation band 23. The hierarchical perforation band 24 is narrower than the first isolation hole 231 and the second isolation hole 221 and divides the metal portion of the terminal area 25 into the anode side 252 and the cathode side 251 in a certain proportion (such as half). Since the graded hole band 24 intersects with each of the first isolation holes 231, each terminal area 25 arranged along the second arrangement direction is completely separated. In order to improve the connection strength, a connecting rib 241 is obliquely formed between the two sides of each first isolation hole 231 relative to the graded hole band 24. That is, the two ends of the connecting rib 241 are respectively connected to the cathode side 251 and anode side 252 of the adjacent two end sub-areas 25 along the second arrangement direction, realizing the staggered oblique connection between the adjacent two end sub-areas 25 along the second arrangement direction, so as to increase the strength between the terminal areas 25 and make the graded hole band 24 more stable and consistent during the injection molding process. Moreover, the connecting rib 241 can be decomposed into components in the first arrangement direction and the second arrangement direction, which can partially offset the warping stress caused by plastic shrinkage during injection molding to a certain extent.

[0031] Please see Figure 1 and Figure 5 The release structure is disposed on the periphery of each encapsulation area 2 to improve stress release capability during injection molding. Specifically, the release structure is provided on at least one side of the bracket body 1 located on the periphery of each encapsulation area 2, thereby providing a buffer space during injection molding. This helps to assist the molded material in releasing stress generated by heat, allowing it to contract freely and effectively preventing overall bracket warping.

[0032] In one embodiment, the release space is located on the side of the encapsulation area 2 arranged along the first arrangement direction. Specifically, a first release space 31 is provided on the transition material connection area 13. The first release space 31 is configured as at least two groups. In one embodiment, the first release space 31 is configured as three groups, one group located in the middle and the other two groups symmetrically arranged on both sides of the middle group. Each group includes multiple first release channels 311, thereby avoiding stress concentration on a straight line. To avoid stress transmission path concentration in a straight line, adjacent groups of first release channels 311 are staggered, thereby dispersing the concentrated tearing force to a larger area and increasing the bending and torsional strength of the encapsulation area 2. The staggered arrangement of the first release channels 311 forms mutually restrictive buffer zones in different directions to absorb expansion forces in different directions and cut off thermal stress in various local areas, avoiding stress accumulation in a certain direction and causing LED bracket warping, thus improving the life of the LED bracket. Each first release channel 311 is configured as the release structure.

[0033] In another embodiment, a second release space 32 is provided on the outer connecting area 14 adjacent to the encapsulation area 2 along the first arrangement direction, that is, on both sides of the outer connecting area 14 distributed along the first arrangement direction, close to the corresponding encapsulation area 2. The second release space 32 includes a second release groove 321 extending along the corresponding side of the encapsulation area 2 to improve the stress release capability of the outward side of the encapsulation area 2. The first release groove 311 and the second release groove 321 are configured as the release structure.

[0034] Please see Figures 1 to 8 The resistance structure includes a first resistance groove 41 formed from the first surface 11 of each encapsulation area 2 and a second resistance groove 42 formed on at least one side of the outer connecting material area 14 corresponding to the periphery of each encapsulation area 2. The first resistance groove 41 is used to achieve stress cancellation by generating stress opposite to the stress during internal injection molding, and the second resistance groove 42 is used to resist deformation force during injection molding.

[0035] In this embodiment, a first resistance groove 41 is formed from the first surface 11 in each encapsulation area 2. The first resistance groove 41 is formed on the encapsulation area 2, excluding the cathode side 251 and the anode side 252 and including the frame 21, so that the portion of the encapsulation area 2 other than the cathode side 251 and the anode side 252 is thinned. The first resistance groove 41 connects the first isolation hole 231, the second isolation hole 221 and the graded hole strip 24. During injection molding, the molding compound flows through the first isolation hole 231, the second isolation hole 221 and the graded hole strip 24 to the second surface 12 of the encapsulation area 2 and into the first resistance groove 41. When the plastic shrinks and generates stress, the first resistance groove 41 generates stress in the opposite direction, thereby canceling out the stress generated by the plastic shrinkage. At the same time, it avoids the superposition of stress in the same direction due to temperature changes or external forces, thus improving the stress release capability. In this embodiment, the groove depth of the first resistance groove 41 is 0.3 to 0.5 times the thickness of the bracket body 1. For example, if the groove depth of the first resistance groove 41 is 0.5 times the thickness of the bracket body 1, the formation and connection of the terminal area 25 are guaranteed.

[0036] In this embodiment, the second resistance groove 42 is formed from the second surface 12 and extends along the corresponding side of the encapsulation area 2. Specifically, the second resistance groove 42 is provided on the outer connecting area 14 and corresponds to each encapsulation area 2. That is, each encapsulation area 2 has a second resistance groove 42 on the outer connecting area 14 facing outward along the second arrangement direction. The outer connecting area 14 facing the encapsulation area 2 along the first arrangement direction also has a second resistance groove 42 on the same side as the second release channel 321. The cold material channel 143 is located between the frame 21 and the second resistance groove 42, and the second release channel 321 is located between the frame 21 and the second resistance groove 42. This allows the second resistance groove 42 to release the stress generated on the surface of the LED bracket due to the processing technology, preventing the LED bracket edge from deforming or cracking due to stress concentration. The second resistance groove 42 can also guide the stress release at this location to a certain extent, avoiding stress concentration, thereby reducing the pulling force of the plastic on the bracket body 1 and reducing the deformation of the LED bracket. In this embodiment, the first release groove 311 and the second resistance groove 42 are staggered and do not overlap, and the groove depth of the second resistance groove 42 is 0.3 to 0.5 times the thickness of the support body 1, such as the groove depth of the first resistance groove 41 being 0.5 times the thickness of the support body 1.

[0037] In another embodiment, a first securing groove surrounding the edge of each first securing hole 152, a second securing groove 51 surrounding the edge of each second securing hole 153, and a third resistance groove 52 surrounding the edge of the branch channel 154 and communicating with the first resistance groove 41 are sequentially formed on the first surface 11 of the inner connecting area 15. The first securing groove and the second securing groove 51 ensure the bonding force between the plastic and the connecting area after injection molding, and the third resistance groove 52 ensures the bonding force while allowing the molding compound to flow from the branch channel 154 into the first resistance groove 41. The first securing groove includes an annular groove segment surrounding the outer periphery of the injection hole 151, a radial groove segment extending radially from the annular groove segment, and a frame-shaped groove segment connecting each radial groove segment, to fit the injection hole and the first securing hole 152. A fourth resistance groove 53 is formed on the outer connecting material area 14, starting from the first surface 11. It surrounds the edge of the cold material channel 143 and connects to the first resistance groove 41. It is also used to improve the bonding force and assist in achieving the stress counteraction effect.

[0038] The LED bracket of the present invention operates as follows: The LED bracket is positioned in the corresponding mold, the first surface 11 is attached to the mold, and the encapsulation area 2 and the feeding area of ​​the second surface 12 are both formed with the mold to form a space for plastic molding. Molding material is injected from the feeding hole, and the molding material flows from the feeding port through the feeding area to the first fastening hole 152, the second fastening hole 153, the branch flow channel 154, the first resistance channel 41, the first isolation hole 231, the second isolation hole 221, the graded hole band 24 and the cold material channel 143 until the filling is completed and the shape is formed.

Claims

1. An LED bracket, characterized in that: It includes a support body and multiple encapsulation areas formed on the support body, each of the encapsulation areas having multiple terminal areas arranged in an array; the support body is provided with stress-relieving structures located around each encapsulation area and resistance structures located around each encapsulation area to resist deformation forces.

2. The LED bracket as described in claim 1, characterized in that: The release structure is located on at least one side of the support body on the periphery of each encapsulation area; Each of the encapsulation areas is arranged along a first arrangement direction, and the release structure is disposed on the side of the encapsulation area arranged along the first arrangement direction.

3. The LED bracket as described in claim 2, characterized in that: The support body has a transition connecting area between any two adjacent packaging areas along the first arrangement direction. The transition connecting area has a first release space. The first release space is set to at least two groups. The at least two groups of the first release space are staggered and each includes multiple first release slots. The bracket body has an outer connecting area around the periphery of multiple packaging areas. Along the first arrangement direction, the outer connecting area adjacent to the packaging area has a second release space close to the corresponding packaging area. The second release space includes a second release through groove extending along the corresponding side of the packaging area. The first release slot and the second release slot are configured as the release structure.

4. The LED bracket as described in claim 2, characterized in that: The support body and each encapsulation area have a first surface, and the resistance structure includes a first resistance groove formed from the first surface of each encapsulation area. The depth of the first resistance groove is 0.3 to 0.5 times the thickness of the support body.

5. The LED bracket as described in claim 3, characterized in that: The bracket body and each encapsulation area have a second surface. The resistance structure includes a second resistance groove formed on at least one side of the outer connecting material area corresponding to the periphery of each encapsulation area to resist deformation force during injection molding. The second resistance groove is formed from the second surface and extends along the corresponding side of the encapsulation area. The first release groove and the second resistance groove are staggered, and the depth of the second resistance groove is 0.3 to 0.5 times the thickness of the support body.

6. The LED bracket as described in claim 4, characterized in that: The bracket body also has an inner material connection area located between each encapsulation area, and the inner material connection area has a glue inlet hole.

7. The LED bracket as described in claim 6, characterized in that: A first locking hole is formed around the injection hole, and a plurality of second locking holes are provided on the inner material connecting area. The first locking hole and the second locking hole are configured together as a feeding area for uniformly feeding the encapsulation material into the encapsulation area during injection molding. On the first surface of the inner connecting material area, a first fastening groove surrounding the edge of each first fastening hole and a second fastening groove surrounding the edge of each second fastening hole are sequentially formed. The first fastening groove includes an annular groove segment surrounding the outer periphery of the glue inlet hole, a radial groove segment extending radially from the annular groove segment, and a frame-shaped groove segment connecting each radial groove segment.

8. The LED bracket as described in claim 6, characterized in that: The inner connecting material area is provided with multiple branch channels that connect the packaging areas respectively, and a third resistance channel is provided on the inner connecting material area from the first surface, which surrounds the edge of the branch channel and connects to the first resistance channel. The outer connecting material area is provided with multiple cold material channels that connect to each packaging area. The cold material channels are located between the resistance structure and the packaging area. A fourth resistance channel is formed on the outer connecting material area from the first surface, surrounding the edge of the cold material channel and connecting to the first resistance channel. The cold material channel includes a confluence section connected to the packaging area and a crossflow section extending away from the packaging area and along the corresponding side of the packaging area.

9. The LED bracket as described in claim 8, characterized in that: The encapsulation area includes a frame, a plurality of longitudinal isolation strips located inside the frame and arranged at equal intervals along a first arrangement direction, and a plurality of transverse isolation strips located inside the frame and arranged at equal intervals along a second arrangement direction perpendicular to the first arrangement direction. Each of the longitudinal isolation strips intersects with each of the transverse isolation strips to enclose a plurality of terminal areas distributed in a rectangular array. The encapsulation area also includes hierarchical perforations formed between each pair of adjacent longitudinal isolation strips to separate each terminal area into a cathode side and an anode side.

10. The LED bracket as described in claim 9, characterized in that: The transverse isolation strip includes a plurality of first isolation holes arranged sequentially along the first arrangement direction, and each of the first isolation holes intersects with the graded hole strip; Each of the first isolation holes has a connecting rib formed obliquely between the two sides of the hierarchical hole band, so that the connecting rib is respectively connected to the cathode side and anode side of the adjacent end sub-regions along the second arrangement direction; The longitudinal isolation strip includes a plurality of second isolation holes arranged sequentially along the second arrangement direction.

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