A packaged device

Abstract

This application relates to the field of light-emitting device technology, specifically to a packaging device, including a chip and a conductive substrate. An insulating frame is connected to the substrate to cooperate with the substrate to form a chip mounting cavity. The substrate is located at the bottom of the chip mounting cavity, and the insulating frame forms the opening of the chip mounting cavity. The chip is located inside the chip mounting cavity. The insulating frame has an extension portion that is attached to the substrate and extends toward the chip location. The extension portion is not in contact with the chip. The extension portion has a recess, and a reflective adhesive layer is formed in the recess. The reflective adhesive layer is separated from the substrate at least at its periphery by the extension portion. The reflectivity of the reflective adhesive layer is higher than that of the insulating frame. The insulating frame and the substrate have a larger bonding surface and a longer penetration path, resulting in stronger reliability and increasing the difficulty for external moisture to penetrate into the chip. The reflectivity of the reflective adhesive layer is greater than that of the insulating frame, ensuring that the packaged device has a reliable light output.

Description

Technical Field

[0001] This application relates to the field of light-emitting device technology, and specifically to a packaging device. Background Technology

[0002] Packaged devices have wide applications in displays, lighting, and other fields. A typical packaged device includes a support and a light-emitting chip. The support comprises a substrate and an insulating frame mounted on the substrate. The insulating frame protrudes from the substrate and has a ring-shaped structure, allowing the insulating frame and substrate to fit together to form a chip mounting cavity for mounting the light-emitting chip. During packaging, the light-emitting chip is mounted on the bottom of the chip mounting cavity and electrically connected to the substrate. Because the light-emitting chip needs to be isolated from the external environment, the packaged device also encapsulates the chip within the support using encapsulating adhesive. Generally, the interface between the insulating frame and the substrate is prone to moisture penetration, creating a path that allows water vapor to seep into the chip and affect its normal operation. One optimization method is to use an insulating material with strong adhesion to the substrate to form the insulating frame. However, this introduces a new technical problem: insulating materials with strong adhesion to the substrate generally have weak reflectivity, affecting the light intensity of the packaged device. Summary of the Invention

[0003] The present invention provides a packaging device to solve at least one of the above-mentioned technical problems.

[0004] To achieve one of the above objectives, some embodiments of this application provide a packaging device, including: A chip that emits light when powered on; A substrate, wherein the substrate is capable of conducting electricity; An insulating frame is connected to a substrate to form a chip mounting cavity with the substrate. The substrate is located at the bottom of the chip mounting cavity, and the insulating frame forms the opening of the chip mounting cavity. The chip is located inside the chip mounting cavity and is electrically connected to the substrate. The insulating frame has an extension portion that is attached to the substrate and extends toward the location of the chip. The side of the extension portion closest to the chip does not directly contact the chip, and the extension portion has a recess. And a reflective adhesive layer formed within the recess, the reflective adhesive layer being separated from the substrate at least peripherally by the extended portion, the reflectivity of the reflective adhesive layer being higher than that of the insulating frame.

[0005] In one embodiment, the chip is mounted via a flip-chip method, and the reflective adhesive layer is separated from the substrate by the extended portion; or, The chip is mounted either upright or vertically. A wire is connected between the chip and the substrate. The extended portion has a wire hole. The wire passes through the reflective adhesive layer and the wire hole and is electrically connected to the substrate.

[0006] In one embodiment, the insulating frame has two opposing extensions, each extension having a high point on the side closer to the chip, the high point not exceeding the upper surface of the chip.

[0007] In one embodiment, the recess has an arcuate concave surface, such that at least a portion of the bonding surface between the reflective adhesive layer and the extended portion is an arcuate concave surface, and / or, the side of the reflective adhesive layer facing away from the substrate is an arcuate concave surface.

[0008] In one embodiment, the extended portion has a side facing the chip, and along the direction from the substrate to the cavity, the side is inclined away from the chip.

[0009] In one embodiment, the surface where the substrate and the extended portion are joined has a roughened structure.

[0010] In one embodiment, the roughened structure includes a groove provided on the substrate, wherein the lowest point of the groove is not higher than the opening of the groove.

[0011] In one embodiment, the substrate includes a positive electrode portion and a negative electrode portion, and an insulating strip that insulates and separates the positive electrode portion and the negative electrode portion, the insulating strip being coupled to a portion of the extended portion located within the groove.

[0012] In one embodiment, the chip is mounted either upright or vertically, and the portion of the extended portion located within the groove has the through hole. The distance between the isolation strip and the chip is greater than the distance between the isolation strip and the through hole.

[0013] In one embodiment, the insulating frame is made of resin, and / or the reflective adhesive layer is made of silicone and reflective particles, and / or the minimum distance between the extended portion and the chip is between 0.05-0.6 mm, and / or the chip is mounted either upright or vertically, and the area of ​​the substrate exposed through the via is between 0.01-1 mm. 2 between.

[0014] According to the packaging device of the above embodiment, the insulating frame has an extension portion that extends from the substrate to the chip location, resulting in a larger bonding surface between the insulating frame and the substrate. The higher bonding force between the insulating frame and the substrate makes it difficult for external moisture to penetrate the chip location through the bonding surface between the substrate and the insulating frame, improving the packaging device's resistance to external environmental pollution. The extension portion has a recess in which a reflective adhesive layer is formed. This reflective adhesive layer reflects the light emitted from the chip, reducing the amount of light reaching the substrate and thus reducing light loss due to substrate absorption. This ensures the packaging device has the maximum possible light emission. Simultaneously, the extension portion at least separates the periphery of the reflective adhesive layer from the substrate, resulting in a larger bonding surface between the insulating frame and the substrate. This reduces or eliminates the bonding between the reflective adhesive layer and the substrate (the bonding force between the insulating frame and the substrate is greater than the bonding force between the reflective adhesive layer and the substrate). Furthermore, since the reflectivity of the reflective adhesive layer is greater than that of the insulating frame, the packaging device ensures a reliable light emission. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of a flip-chip packaging device in one embodiment of this application; Figure 2 This is a schematic diagram of the structure of the chip-flip packaged device in one embodiment of this application, showing the fit between the support and the chip. Figure 3 for Figure 1 A top view of the packaged device; Figure 4 This is a schematic diagram of the structure of a flip-chip packaging device in one embodiment of this application where the reflective adhesive layer does not completely fill the recess; Figure 5 for Figure 4 A top view of the packaged device; Figure 6 This is a schematic diagram of the structure of a chip-mounted packaging device in one embodiment of this application; Figure 7 This is a schematic diagram of the structure of the chip mounting device in one embodiment of the present application, showing the fit between the support and the chip. Figure 8 for Figure 6 A top view of the packaged device; Figure 9 This is a schematic diagram of the structure of a chip-mounted encapsulation device in one embodiment of this application where the reflective adhesive layer does not completely fill the recess; Figure 10 for Figure 9 A top view of the packaged device; Figure 11 This is a schematic diagram of the structure of a packaged device with a chip vertically mounted in one embodiment of this application; Figure 12 for Figure 11 A top view of the packaged device; Figure 13 This is a schematic diagram of the structure of a packaged device in which the chip is vertically mounted in one embodiment of this application, where the reflective adhesive layer on one side of the recess is not fully filled with the reflective adhesive layer. Figure 14 for Figure 13 A top view of the packaged device; Figure 15 This is a schematic diagram of the structure of a packaging device in which the reflective adhesive layer on both sides of the chip is not fully filled in the recess in one embodiment of this application. Figure 16 for Figure 15 A top view of the packaged device.

[0016] Label Explanation: 10. Support; 101. Substrate; 1011. Positive electrode portion; 1012. Negative electrode portion; 1013. Isolation strip; 102. Insulating frame; 1021. Extension portion; 10211. Recess; 10212. High point; 10213. Arc-shaped concave surface; 10214. Side surface; 10215. Groove; 10216. Through hole; 103. Chip mounting cavity; 1031. Cavity opening; 104. Reflective adhesive layer; 20. Chip; 30. Encapsulating adhesive layer; 40. Wire. Detailed Implementation

[0017] The present invention will now be described in further detail with reference to specific embodiments and accompanying drawings. Similar elements in different embodiments are referred to by associated similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the invention. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present invention are not shown or described in the specification. This is to avoid obscuring the core parts of the invention with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0018] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0019] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this invention, unless otherwise specified, include both direct and indirect connections (linkages).

[0020] Packaged devices emit light by passing electricity through a chip, and are widely used in display and lighting fields as light-emitting devices. However, chips are susceptible to external moisture; therefore, the structural design of packaged devices must prioritize their resistance to external moisture. Simultaneously, ensuring a reliable light output from the packaged device is also a key consideration for designers during the structural design process.

[0021] This application proposes a collaborative design for the insulating support and reflective adhesive layer of the packaged device to improve the packaged device's tolerance to the external environment and ensure reliable light output.

[0022] Some embodiments of this application provide a packaged device that can be used as a light-emitting device in lighting, display, and other fields. For details regarding the structure of the packaged device, please refer to [link / reference needed]. Figure 1 The packaging device includes a bracket 10 and a chip 20, as well as an encapsulating adhesive layer 30 that encapsulates the chip 20 within the bracket 10.

[0023] Please continue to refer to this. Figure 1 The support 10 has a cup-shaped structure, including a substrate 101 and an insulating frame 102. The substrate 101 is conductive. Regarding the form of the substrate 101, it can be, for example, a metal plate, also referred to as a metal frame. Of course, the substrate 101 can also be a circuit board, with printed circuits on the circuit board enabling the substrate 101 to conduct electricity.

[0024] An insulating frame 102 is connected to a substrate 101 and is made of an insulating material. It includes an annular portion protruding upwards relative to the substrate 101 to form a dam on the substrate 101, such that the insulating frame 102 and the substrate 101 cooperate to form a chip mounting cavity 103. The cavity wall of the chip mounting cavity 103 is formed by the insulating frame 102, and the insulating frame 102 forms the cavity opening 1031 of the chip mounting cavity 103, while the cavity bottom is formed by the substrate 101. The substrate 101 enables external circuitry to transmit power to the interior of the chip mounting cavity 103.

[0025] Regarding the molding method of the insulating frame 102 on the substrate 101, for example, the insulating frame 102 can be molded on the substrate 101 by compression molding. Of course, the molding method of the insulating frame 102 on the substrate 101 is not limited to this, and any feasible method in the prior art can be used to achieve the connection between the insulating frame 102 and the substrate 101. Generally, the insulating frame 102 is made of a material with strong adhesion to the substrate 101, which can be, but is not limited to, EMC (Epoxy Molding Compound).

[0026] Chip 20 is disposed within chip mounting cavity 103, and the bottom of chip mounting cavity 103 has a chip mounting area for mounting chip 20. Specifically, chip 20 can be mounted onto substrate 101 by die bonding, and chip 20 is electrically connected to substrate 101. Through the conductivity of substrate 101, external circuitry of support 10 can supply power to chip 20, enabling chip 20 to emit light when powered. In some embodiments, please refer to... Figure 1 Chip 20 is a flip-chip, meaning that the electrode pins of chip 20 are facing downwards and electrically connected to substrate 101, eliminating the need for wires between chip 20 and substrate 101.

[0027] Please continue to refer to this. Figure 1 The insulating frame 102 has an extension portion 1021 that adheres to the substrate 101 and extends toward the location of the chip 20, thus giving the insulating frame 102 a larger coverage area over the substrate 101. The strong bonding force between the insulating frame 102 and the substrate 101 makes it more difficult for external moisture to penetrate the location of the chip 20 through the bonding surface between the substrate 101 and the insulating frame 102.

[0028] In practical engineering, while substrate 101 and insulating frame 102 have the ability to reflect light, their primary function is not reflection. Instead, they each have their own focus. The initial purpose of substrate 101 is to form a cup-like structure with other components, with substrate 101 serving as a conductive plate and supporting base. Therefore, the reflective performance of the insulating frame 102 is not particularly outstanding. To ensure the light emission capability of the packaged device, please refer to [reference needed]. Figure 1 Furthermore, a reflective adhesive layer 104 is provided inside the packaged device. The reflective adhesive layer 104 has a higher reflectivity than the substrate 101 and the insulating frame 102, that is, it has a higher reflective ability. The reflective adhesive layer 104 can reflect more of the light emitted by the chip 20 outward, thereby increasing the light output of the packaged device.

[0029] Please continue to refer to this. Figure 1The extension portion 1021 of the insulating frame 102 covers the substrate 101, so the reflective adhesive layer 104 is disposed on the extension portion 1021 based on the extension portion 1021, and is orthographically projected along the direction from the cavity opening 1031 to the substrate 101. The orthographic projection of the reflective adhesive layer 104 is located within the orthographic projection range of the substrate 101. Definition Figure 1 The cavity opening 1031 faces upwards, with the substrate 101 below. The direction from the cavity opening 1031 to the substrate 101 is downwards, which is also the depth direction of the chip mounting cavity 103, perpendicular to the substrate 101. This allows the reflective adhesive layer 104 to cover the extension portion 1021 and the corresponding portion of the bottom of the chip mounting cavity 103, reducing light loss caused by light absorption by the insulating frame 102 and the substrate 101. For flip-chip packaged devices with chip 20, since no wires are needed between the chip 20 and the substrate 101, there are no openings on the extension portion 1021, and the reflective adhesive layer 104 is completely separated from the substrate 101 by the extension portion 1021.

[0030] Based on this technical concept, those skilled in the art will understand that, while ensuring the installation and normal operation of the chip 20, the edge of the extension portion 1021 should be as close as possible to the chip 20 to minimize the difficulty of external moisture penetrating to the location of the chip 20, while simultaneously allowing the reflective adhesive layer 104 to have the largest possible area, thereby increasing the light emission of the packaged device. In some embodiments, the distance between the edge of the extension portion 1021 and the chip 20 is between 0.05 and 0.6 mm.

[0031] Generally, in the manufacturing process of packaged devices, the production of the bracket 10 is a single stage; that is, after the bracket 10 is manufactured, it is stored as raw material to supply materials for subsequent packaging. The molding process of the insulating frame 102 and the molding process of the reflective adhesive layer 104 are not continuous. The insulating frame 102 is molded during the bracket 10 production stage, and the reflective adhesive layer 104 is molded during the packaging stage. Therefore, in some embodiments, please refer to the following... Figure 1 and Figure 2 The extension portion 1021 of the support 10 has a recess 10211. The recess 10211 serves as a receiving and constraining structure, which can hold the uncured reflective adhesive layer 104 within the recess 10211 during the encapsulation stage, so that the reflective adhesive layer 104 can be in a preset position and have a preset shape after curing.

[0032] The material of the reflective adhesive layer 104 can be, for example, silicone with reflective particles incorporated into it. These reflective particles can be titanium dioxide micropowder or other powders. Of course, the material of the reflective adhesive layer 104 is not limited to this; it can be any other material in the prior art, provided that the reflective adhesive layer 104 has a reflectivity greater than that of the insulating frame 102 and the substrate 101. In some other embodiments, the reflective adhesive layer 104 can also be disposed within the chip mounting cavity 103 by a mounting method, i.e., the reflective adhesive layer 104 is pre-formed outside the chip mounting cavity 103, and then the formed reflective adhesive layer 104 is mounted on the extension portion 1021.

[0033] Regarding the coverage of the reflective adhesive layer 104 on the extended portion 1021, please refer to... Figure 1 and Figure 3 The outer edge of the recess 10211 is the edge of the cavity opening 1031, and the inner edge is the high point 10212 near the chip 20. The high point 10212 is not higher than the upper surface of the chip 20. The coverage area of ​​the reflective adhesive layer 104 extends from the outer edge of the recess 10211 to the inner edge. For other embodiments, please refer to... Figure 4 and Figure 5 The reflective adhesive layer 104 covers a portion of the recess 10211, i.e., one side starts from the inner edge and the other side does not reach the outer edge. In some embodiments, the insulating frame 102 has two opposing extensions 1021, each extension 1021 having a high point 10212 on the side near the chip 20.

[0034] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 4 The recess 10211 has an arc-shaped concave surface 10213, such that the bonding surface between the reflective adhesive layer 104 and the extended portion 1021 is an arc-shaped concave surface, and the side of the reflective adhesive layer 104 facing away from the substrate 101 is also an arc-shaped concave surface. By forming an arc-shaped concave surface, the light reflected by the reflective adhesive layer 104 has a larger light emission range. Of course, in some other embodiments, the recess 10211 may not have an arc-shaped concave surface 10213, and by control (e.g., using a mold), only the side of the reflective adhesive layer 104 facing away from the substrate 101 may be formed into an arc-shaped concave surface.

[0035] Since the extension portion 1021 extends towards the location of the chip 20, in order to avoid the side 10214 of the extension portion 1021 facing the chip 20 affecting the propagation of the light emitted from the chip 20, in some embodiments, please refer to... Figure 1 , Figure 2 and Figure 4The side 10214 of the extension portion 1021 facing the chip 20 is inclined along the direction from the substrate 101 to the cavity 1031, and this side 10214 is inclined away from the chip 20.

[0036] In some embodiments, to enhance the bonding strength between the extended portion 1021 and the substrate 101, a roughening structure is provided at the location where the substrate 101 bonds with the extended portion 1021. Please refer to... Figure 1 , Figure 2 and Figure 4 In some embodiments, the roughened structure is a groove 10215 provided on the substrate 101. The groove 10215 can be formed by electro-etching. The bottom of the extension portion 1021 is embedded in the groove 10215, which increases the bonding force between the extension portion 1021 and the substrate 101, and increases the path length of external moisture penetrating along the bonding surface between the extension portion 1021 and the substrate 101 to the location of the chip 20.

[0037] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 4 The lowest point of the recess 10211 is lower than the depth of the groove opening of the recess 10215, that is, below the groove opening of the recess 10215. This avoids the structure formed by the stacked reflective adhesive layer 104 and the extended portion 1021 protruding too high relative to the substrate 101, which would affect the light emission effect of the chip 20. Of course, in some other embodiments, the lowest point of the recess 10211 may be at the same height as the groove opening of the recess 10215.

[0038] Please refer to Figures 1-5 The substrate 101 includes a positive electrode portion 1011 and a negative electrode portion 1012, and an insulating strip 1013 that insulates and separates the positive electrode portion 1011 and the negative electrode portion 1012. The description of the positive and negative electrodes 1011 and 1012 here is merely a distinction between the two portions and does not indicate any structural difference between them. When electrically connected to the chip 20, the positive electrode pin of the chip 20 is electrically connected to the positive electrode portion 1011, and the negative electrode pin is electrically connected to the negative electrode portion 1012.

[0039] The isolation strip 1013 is made of insulating material. In some embodiments, please refer to... Figure 1 , Figure 2 and Figure 4 The cross-section of the isolation strip 1013 is a trapezoidal structure with a larger bottom and a smaller top. This increases the bonding surface between the isolation strip 1013 and the positive electrode portion 1011 and the negative electrode portion 1012, thereby increasing the penetration path of external water vapor through the bonding surface between the isolation strip 1013 and the positive electrode portion 1011 and the negative electrode portion 1012 to the location of the chip 20.

[0040] In some embodiments, please refer to Figure 1 , Figure 2 and Figure 4 The isolation strip 1013 is located directly below the chip 20. In some other embodiments, the isolation strip 1013 may be offset relative to the chip 20, such as being located below the groove 10215. The isolation strip 1013 is combined with the portion of the extension 1021 located within the groove 10215, increasing the distance between the isolation strip 1013 and the chip and extending the moisture permeation path.

[0041] In other embodiments, please refer to Figures 6-10 The chip 20 in the packaged device is a standard-mount chip 20. For a standard-mount chip 20, it needs to be electrically connected to the substrate 101 via wires 40. Generally, one chip 20 requires two wires 40 to be electrically connected to the substrate 101. The wires 40 can generally be copper wires, gold wires, etc.

[0042] Under the basic concept of this application, the extension portion 1021 extends as close as possible to the chip 20. Therefore, in order to achieve conductive connection between the wire 40 and the substrate 101, please refer to... Figures 6-10 The extended portion 1021 of the packaged chip 20 has a through-hole 10216. The wire 40 passes through the reflective adhesive layer 104 and the through-hole 10216 to be electrically connected to the substrate 101. Since the packaged chip 20 needs to be electrically connected to the substrate 101 through two wires 40, a through-hole 10216 is provided on each of the extended portions 1021 on both sides of the chip 20, so that the two wires 40 can be electrically connected to the positive electrode portion 1011 and the negative electrode portion 1012 of the substrate 101, respectively.

[0043] As those skilled in the art will understand, under the basic concept of this application, in order to ensure good resistance to external environments for the packaged device, the size of the via 10216 should be as small as possible while still meeting the requirements of wire bonding operations. In some embodiments, the via 10216 is a circular hole. Preferably, the area of ​​the via 10216 is 0.01-1 mm². 2 between.

[0044] Similar to some embodiments of the flip-chip packaged device, in some embodiments of the upright-mount packaged device, the extended portion 1021 has a recess 10211, and a via 10216 is formed at the lowest point of the recess 10211. The corresponding position of the substrate 101 is exposed through the via 10216, enabling the bonding connection between the conductor 40 and the substrate 101. After bonding, reflective adhesive 104 material is injected into the recess 10211 and cured to form the reflective adhesive 104. Generally, the portion of the substrate 101 exposed through the via 10216 serves as the bonding wire placement area, and its surface is treated, such as by silver plating or nickel-palladium-gold plating, to achieve oxidation prevention.

[0045] In this type of packaged device, although part of the reflective adhesive layer 104 is bonded to the substrate 101 through the through hole 10216, the periphery of the reflective adhesive layer 104 (all peripheries, except the part bonded to the substrate 101) is still separated from the substrate 101 by the extension portion 1021. This makes it difficult for external moisture to enter the area where the reflective adhesive layer 104 is bonded to the substrate 101. Even if moisture does enter the area, it is difficult for it to seep out from the area due to the surrounding of the extension portion 1021.

[0046] Please refer to Figure 6 and Figure 9 For a packaged device with chip 20 mounted in the correct orientation, when the substrate 101 has a groove 10215, the portion of the substrate 101 exposed through the wire hole 10216 is the bottom portion of the groove 10215.

[0047] Please refer to Figure 6 and Figure 8 Part of the recess 10211 is an arc-shaped concave surface 10213, so that the surface of the reflective adhesive layer 104 that adheres to the recess 10211 is an arc-shaped concave surface, and the surface of the reflective adhesive layer 104 facing away from the substrate 101 is also an arc-shaped concave surface. Please refer to... Figure 6 and Figure 8 In some embodiments, for a packaged device in which chip 20 is mounted, the reflective adhesive layer 104 fully covers the space between the inner and outer edges of the recess 10211. In some embodiments, please refer to... Figure 9 and Figure 10 The reflective adhesive layer 104 partially fills the recess 10211, meaning that the reflective adhesive layer 104 only fills the recess 10211 to a certain depth.

[0048] For flip-chip packaged devices, please refer to some embodiments. Figure 6 and Figure 9 The isolation strip 1013 is offset relative to the chip 20 and is partially located below the groove 10215. The isolation strip 1013 and the extension portion 1021 located within the groove 10215 are combined. Further, in some embodiments, the distance between the isolation strip 1013 and the chip 20 is greater than the distance between the isolation strip 1013 and the via 10216. By utilizing the weaker bonding force between the reflective adhesive layer 104 and the substrate 101, the bonding surface between the reflective adhesive layer 104 and the substrate 101 is utilized. This allows moisture that has seeped in through the junction of the isolation strip 1013 with the positive electrode portion 1011 and the negative electrode portion 1012 to penetrate along a shorter path to the junction of the reflective adhesive layer 104 and the substrate 101, reducing the penetration of moisture into the location of the chip 20.

[0049] In other embodiments, please refer to Figures 11-16The chip 20 of the packaged device is a vertically mounted chip 20. For the vertically mounted chip 20, one of its electrodes needs to be electrically connected to the substrate 101 via a wire 40. The wire 40 can generally be a copper wire, gold wire, etc.

[0050] As mentioned above, under the basic concept of this application, the extension portion 1021 extends towards the chip 20, and as close to the chip 20 as possible. Therefore, similar to the packaged device with the chip 20 mounted upright, in order to achieve the conductive connection between the wire 40 and the substrate 101, please refer to... Figures 11-13 The packaged device vertically mounted on the chip 20 has a through hole 10216 on the extension portion 1021 on one side of the chip 20. The wire 40 passes through the corresponding reflective adhesive layer 104 and the through hole 10216 and is electrically connected to the substrate 101.

[0051] As those skilled in the art will understand, under the basic concept of this application, in order to ensure good resistance to external environments for the packaged device, the size of the via 10216 should be as small as possible while still meeting the requirements of wire bonding operations. In some embodiments, the via 10216 is a circular hole. Preferably, the area of ​​the via 10216 is 0.01-1 mm². 2 between.

[0052] Similar to some embodiments of packaged devices with flip-chip and upright chip 20, in some embodiments of packaged devices with vertically mounted chip 20, the extended portion 1021 has a recess 10211, and a through-hole 10216 is formed at the lowest point of the recess 10211. The corresponding position of the substrate 101 is exposed through the through-hole 10216, enabling the soldering connection between the conductor 40 and the substrate 101. After soldering, reflective adhesive 104 material is injected into the recess 10211 and cured to form the reflective adhesive 104. Generally, the portion of the substrate 101 exposed through the through-hole 10216 serves as the bonding wire placement area, and its surface is treated, such as by silver plating or nickel-palladium-gold plating, to achieve oxidation prevention. The portion of the extended portion 1021 without the through-hole 10216 also has a recess 10211.

[0053] In this type of packaged device, although a portion of the corresponding reflective adhesive layer 104 is bonded to the substrate 101 through the through hole 10216, the periphery of the reflective adhesive layer 104 (except for the portion bonded to the substrate 101) is still separated from the substrate 101 by the extension portion 1021. This makes it difficult for external moisture to enter the area where the reflective adhesive layer 104 is bonded to the substrate 101. Even if moisture does enter the area, it is difficult for it to seep out from the area due to the surrounding of the extension portion 1021.

[0054] Please refer to Figure 10 , Figure 12 and Figure 14For a packaged device in which chip 20 is vertically mounted, when the substrate 101 has a groove 10215, the portion of the substrate 101 exposed through the wire hole 10216 is the bottom portion of the groove 10215.

[0055] Please refer to Figure 10 , Figure 12 and Figure 14 Part of the recess 10211 is an arc-shaped concave surface 10213, so that the surface of the reflective adhesive layer 104 that adheres to the recess 10211 is an arc-shaped concave surface, and the surface of the reflective adhesive layer 104 facing away from the substrate 101 is also an arc-shaped concave surface. Please refer to... Figure 10 and Figure 11 In some embodiments, for a packaged device in which chip 20 is vertically mounted, the reflective adhesive layer 104 fully covers the space between the inner and outer edges of the recess 10211. In some embodiments, please refer to... Figure 12 and Figure 14 The recess 10211 of the extended portion 1021 without the wire through hole 10216 is fully covered by the reflective adhesive layer 104. For the recess 10211 of the extended portion 1021 with the wire through hole 10216, the reflective adhesive layer 104 partially fills the recess 10211, that is, the reflective adhesive layer 104 only fills the recess 10211 to a certain depth. In some embodiments, please refer to Figure 15 and Figure 16 Each reflective adhesive layer 104 partially fills the corresponding recess 10211.

[0056] For packaged devices with chip 20 vertically mounted, please refer to some embodiments. Figure 11 , Figure 13 and Figure 15 The isolation strip 1013 is offset relative to the chip 20 and is partially located below the groove 10215. The isolation strip 1013 and the extension portion 1021 located within the groove 10215 are combined. Further, in some embodiments, the distance between the isolation strip 1013 and the chip 20 is greater than the distance between the isolation strip 1013 and the via 10216. By utilizing the weaker bonding force between the reflective adhesive layer 104 and the substrate 101, the bonding surface between the reflective adhesive layer 104 and the substrate 101 is utilized. This allows moisture that has seeped in through the junction of the isolation strip 1013 with the positive electrode portion 1011 and the negative electrode portion 1012 to penetrate along a shorter path to the junction of the reflective adhesive layer 104 and the substrate 101, reducing the penetration of moisture into the location of the chip 20.

[0057] Please refer to Figure 1 , Figure 4 , Figure 5 , Figure 8 , Figure 11 , Figure 13 and Figure 15The encapsulating adhesive layer 30 fills the chip mounting cavity 103, achieving encapsulation and protection for the chip 20. The encapsulating adhesive layer 30 is light-transmitting and can be doped with light-converting materials to achieve the desired light emission.

[0058] This document describes various exemplary embodiments with reference to them. However, those skilled in the art will recognize that changes and modifications can be made to the exemplary embodiments without departing from the scope of this document. For example, various operational steps and components for performing operational steps can be implemented in different ways depending on the specific application or considering any number of cost functions associated with the operation of the system (e.g., one or more steps can be deleted, modified, or combined with other steps).

[0059] While the principles herein have been illustrated in various embodiments, numerous modifications to the structures, arrangements, proportions, elements, materials, and components, particularly suited to specific environments and operational requirements, may be used without departing from the principles and scope of this disclosure. These modifications and other alterations or alterations will be included within the scope of this document. Those skilled in the art will recognize that many changes can be made to the details of the above embodiments without departing from the fundamental principles of the invention.

Claims

1. A packaged device, characterized in that, include: A chip that emits light when powered on; A substrate, wherein the substrate is capable of conducting electricity; An insulating frame is connected to a substrate to form a chip mounting cavity with the substrate. The substrate is located at the bottom of the chip mounting cavity, and the insulating frame forms the opening of the chip mounting cavity. The chip is located inside the chip mounting cavity and is electrically connected to the substrate. The insulating frame has an extension portion that is attached to the substrate and extends toward the location of the chip. The side of the extension portion closest to the chip does not directly contact the chip, and the extension portion has a recess. And a reflective adhesive layer formed within the recess, the reflective adhesive layer being separated from the substrate at least peripherally by the extended portion, the reflectivity of the reflective adhesive layer being higher than that of the insulating frame.

2. The packaged device as described in claim 1, characterized in that, The chip is mounted by flip-chip, and the reflective adhesive layer is separated from the substrate by the extended portion; or, The chip is mounted either upright or vertically. A wire is connected between the chip and the substrate. The extended portion has a wire hole. The wire passes through the reflective adhesive layer and the wire hole and is electrically connected to the substrate.

3. The packaged device as described in claim 1, characterized in that, The insulating frame has two opposing extensions, each extension having a high point on the side closer to the chip, the high point not exceeding the upper surface of the chip.

4. The packaged device as claimed in claim 1, characterized in that, The recess has an arc-shaped concave surface, such that at least a portion of the bonding surface between the reflective adhesive layer and the extended portion is an arc-shaped concave surface; And / or, The side of the reflective adhesive layer facing away from the substrate is an arc-shaped concave surface.

5. The packaged device as claimed in claim 1, characterized in that, The extended portion has a side facing the chip, and along the direction from the substrate to the cavity, the side is inclined away from the chip.

6. The packaged device as described in any one of claims 1-5, characterized in that, The surface where the substrate and the extended portion are joined has a roughened structure.

7. The packaged device as claimed in claim 6, characterized in that, The roughened structure includes a groove provided on the substrate, wherein the lowest point of the groove is not higher than the opening of the groove.

8. The packaged device as claimed in claim 7, characterized in that, The substrate includes a positive electrode portion and a negative electrode portion, and an insulating strip that insulates and separates the positive electrode portion and the negative electrode portion, the insulating strip being coupled to the portion of the extended portion located within the groove.

9. The packaged device as claimed in claim 8, characterized in that, The chip is mounted either upright or vertically. The portion of the extended part located within the groove has the through hole. The distance between the isolation strip and the chip is greater than the distance between the isolation strip and the through hole.

10. The packaged device as claimed in claim 2, characterized in that, The insulating frame is made of resin; And / or, The material of the reflective adhesive layer includes silicone and reflective particles; And / or, The minimum distance between the extended portion and the chip is between 0.05 and 0.6 mm; And / or, The chip is mounted either upright or vertically, and the area of ​​the substrate exposed by the via is 0.01-1 mm. 2 between.

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