A method for manufacturing a membrane base LED grid conductive circuit screen body

Abstract

A method for manufacturing a crystal film-based LED grid conductive circuit screen includes: a crystal film lamp board comprising a flexible transparent insulating substrate, a grid-like conductive circuit, and LED beads; bonding and fixing the back of the crystal film lamp board to the upper surface of a rigid support plate using double-sided adhesive film; applying a rectangular frame-shaped damming adhesive; performing plasma cleaning on the upper surface of the lamp board; injecting transparent adhesive into the area defined by the damming adhesive; placing the entire support plate into a vacuum chamber for vacuum degassing; curing to form an encapsulation layer; laser cutting to remove waste edges and laser-drilling micropores on the encapsulation layer to form venting micropores; performing mechanical dynamic screening on the screen through impact and vibration tests; and applying reinforcing adhesive to the HUB board connection area and curing to obtain the finished product. This method effectively improves the manufacturing precision of the screen, the long-term anti-bulging capability of the encapsulation layer, product quality reliability, and interface fatigue resistance, and is suitable for the large-scale production of flexible transparent LED displays.

Description

Technical Field

[0001] This invention relates to the field of LED display equipment technology, and in particular to a method for manufacturing a crystal film substrate LED grid conductive circuit screen. Background Technology

[0002] With the rapid development of smart display technology, flexible transparent displays have gained increasingly widespread application in wearable devices, foldable terminals, outdoor advertising, exhibition halls, and glass curtain walls due to their advantages such as bendability, high transparency, and ease of integration with buildings or equipment. These displays require good light transmission and flexibility while ensuring high-definition LED display effects.

[0003] As market demands for the performance and reliability of LED soft film transparent screens continue to increase, the existing manufacturing methods still have the following shortcomings in practice: the release film surface is smooth and non-adhesive, and the crystal film lamp board is prone to slight displacement during subsequent coating of damming adhesive, potting, and transportation, affecting the alignment accuracy of the multi-layer structure. Especially for large-size or high-density LED bead screens, positioning deviations will directly affect the yield of finished products; the existing method uses ultrasonic cleaning, which can remove surface dust, but drying is required after cleaning, and liquid cleaning may introduce residues or secondary pollution; the vacuum mold using the combined model requires the configuration of upper and lower molds and a sealed mold cavity, resulting in high equipment costs, poor adaptability to different screen sizes, and inconvenience in mold replacement or adjustment; the encapsulation layer after the transparent adhesive has cured is completely sealed. Under subsequent use or extreme environmental changes, trace amounts of gas may be released inside or at the interface of the adhesive layer due to temperature and humidity changes, causing local bulging or delamination of the screen, affecting transparency and display effect. Summary of the Invention

[0004] In order to overcome the above-mentioned shortcomings of the prior art, the purpose of this invention is to provide a method for manufacturing a crystal film substrate LED grid conductive circuit screen.

[0005] The technical solution adopted by this invention to solve its technical problem is: a method for manufacturing a crystal film substrate LED grid conductive circuit screen, comprising the following steps: Step 1: Board fabrication: including a crystal film lamp board, which includes a flexible transparent insulating substrate, a grid-like conductive line formed on the flexible transparent insulating substrate, and a plurality of LED beads mounted on the grid-like conductive line; Step 2: Secure the back of the crystal film lamp panel to the upper surface of the rigid support plate using double-sided adhesive film. Step 3: Apply a rectangular frame-shaped damming adhesive to the outer perimeter of the crystal film lamp panel and the upper surface of the double-sided adhesive film. Step 4: Perform plasma cleaning on the upper surface of the crystal film lamp panel; Step 5: Pour transparent adhesive into the rectangular area enclosed by the dammed adhesive, ensuring that the liquid level of the transparent adhesive submerges all LED beads; Step Six: Place the rigid support plate carrying the crystal film lamp panel into a vacuum chamber and evacuate the vacuum chamber to remove air bubbles from the transparent adhesive. Step 7: Allow the transparent adhesive to cure, forming an encapsulation layer; Step 8: Laser-cut the cured screen to remove excess waste edges, and simultaneously or in stages form several venting micropores that penetrate or do not penetrate the encapsulation layer by laser dotting on the encapsulation layer. Step 9: Perform mechanical dynamic screening on the screen body that has been laser-cut and perforated. The mechanical dynamic screening includes at least a tapping test and a vibration test. Step 10: Apply a layer of reinforcing adhesive to the HUB board connection area of ​​the screen body that has passed the mechanical dynamic screening, and obtain the finished product after curing.

[0006] As a further improvement of the present invention: the flexible transparent insulating substrate in step one is a fully transparent PET sheet or a fully transparent CPI sheet with a thickness of less than 0.5 mm.

[0007] As a further improvement of the present invention: the grid-like conductive line in step one is composed of a first grid line inclined at 45° and a second grid line inclined at 135° interlaced.

[0008] As a further improvement of the present invention: in step two, the lower surface of the double-sided adhesive film is adhered to the rigid support plate, and the upper surface is adhered to the back of the crystal film lamp plate.

[0009] As a further improvement of the present invention: the height of the dammed adhesive in step three is greater than the height of the LED beads.

[0010] As a further improvement of the present invention: in step four, the plasma cleaning uses an atmospheric pressure plasma cleaning head, the working gas is compressed air or nitrogen, the cleaning power is 300-800W, and the cleaning scanning speed is 10-50mm / s.

[0011] As a further improvement of the present invention: the transparent adhesive in step five is AB adhesive.

[0012] As a further improvement of the present invention: in step six, the vacuum is drawn to reduce the absolute pressure inside the vacuum chamber to 100-1000 Pa and is maintained for 5-15 minutes.

[0013] As a further improvement of the present invention: in step eight, the diameter of the exhaust micropores is 20-100μm, the spacing between the pores is 5-20mm, and the depth of the pores penetrates the encapsulation layer.

[0014] As a further improvement of the present invention: the reinforcing adhesive in step ten is UV-curable silicone or acrylic adhesive, and the coating position is the junction between the root of the HUB board connector and the flexible transparent insulating substrate.

[0015] Compared with the prior art, the beneficial effects of the present invention are: A double-sided adhesive film is used to bond and fix the back of the crystal film lamp board to the rigid support plate. This ensures that the crystal film lamp board maintains precise alignment during subsequent processes such as applying damming adhesive, injecting adhesive, transportation, and placing it into the vacuum box. This effectively avoids problems such as circuit misalignment and uneven adhesive injection caused by minute displacement. It is especially suitable for the manufacturing of flexible screens with large-size, high-density LED beads, thus improving the yield of finished products. Plasma cleaning is performed after the damming adhesive is applied and before the glue is poured, which significantly improves the activation energy of the crystal film lamp panel surface, enhances its wettability and adhesion to the transparent adhesive, thereby improving the adhesion reliability of the encapsulation layer to the lamp panel. While laser cutting and shaping, or in stages, laser dots are made on the cured transparent adhesive layer to form several venting micropores; this allows for the timely release of trace amounts of gas that may be generated inside the adhesive layer or at the interface, preventing gas accumulation that could cause local bulging, delamination, or decreased transparency of the screen, thus significantly improving the product's environmental adaptability and long-term service life. Attached Figure Description

[0016] To more clearly illustrate the technical solution, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the process of the present invention. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0019] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0020] With the rapid development of wearable devices, foldable terminals, outdoor advertising, and glass curtain walls, the market demand for LED soft film transparent screens that combine high transparency, flexibility, and high-definition display is increasing. Current methods use a release film as the base layer to support the crystal film lamp panel, fixed solely by edge adhesion or negative pressure adsorption. Because the release film surface is smooth and non-adhesive, the crystal film lamp panel is prone to slight displacement during subsequent application of damming adhesive, potting, and transportation. For large-size or high-density LED screens, this displacement directly leads to conductive line misalignment and inaccurate potting areas, reducing product yield. Current methods employ two ultrasonic liquid cleaning processes, which not only require subsequent drying but also easily introduce liquid residue or secondary contamination, affecting the reliability of the bond between the adhesive layer and the lamp panel. Meanwhile, the two cleaning processes are carried out in separate steps, which increases the complexity of the process and the production cycle. The existing technology uses a combined vacuum mold, which requires the configuration of upper and lower molds and a precision sealing structure, resulting in high equipment costs. Furthermore, different sizes of screens require different molds, which leads to poor adaptability. Existing inspection and testing are mostly static appearance inspections or power-on tests, without quantitative reliability screening for flexible screens in dynamic scenarios such as bending, vibration, and impact during actual use. In the HUB board area where the flexible soft film transparent screen is connected to the external control card, the solder joints and circuits at this connection are prone to fatigue fracture or peeling under flexural stress because the screen itself can be repeatedly bent and rolled.

[0021] To address the aforementioned problems, this application provides a method for manufacturing a crystalline film substrate LED grid conductive circuit screen. The invention is further described below with reference to the accompanying drawings and embodiments, and includes the following steps: Step 1: Board fabrication: including a crystal film lamp board, which includes a flexible transparent insulating substrate, a grid-like conductive line formed on the flexible transparent insulating substrate, and a plurality of LED beads mounted on the grid-like conductive line; Step 2: Secure the back of the crystal film lamp panel to the upper surface of the rigid support plate using double-sided adhesive film. Step 3: Apply a rectangular frame-shaped damming adhesive to the outer perimeter of the crystal film lamp panel and the upper surface of the double-sided adhesive film. Step 4: Perform plasma cleaning on the upper surface of the crystal film lamp panel; Step 5: Pour transparent adhesive into the rectangular area enclosed by the dammed adhesive, ensuring that the liquid level of the transparent adhesive submerges all LED beads; Step Six: Place the rigid support plate carrying the crystal film lamp panel into a vacuum chamber and evacuate the vacuum chamber to remove air bubbles from the transparent adhesive. Step 7: Allow the transparent adhesive to cure, forming an encapsulation layer; Step 8: Laser-cut the cured screen to remove excess waste edges, and simultaneously or in stages form several venting micropores that penetrate or do not penetrate the encapsulation layer by laser dotting on the encapsulation layer. Step 9: Perform mechanical dynamic screening on the screen body that has been laser-cut and perforated. The mechanical dynamic screening includes at least a tapping test and a vibration test. Step 10: Apply a layer of reinforcing adhesive to the HUB board connection area of ​​the screen body that has passed the mechanical dynamic screening, and obtain the finished product after curing.

[0022] The use of double-sided adhesive film for integral bonding and fixing of the crystal film lamp board significantly improves the positioning accuracy and stability during the manufacturing process; plasma dry cleaning enhances the adhesion of the adhesive layer; vacuum chamber simplifies the defoaming equipment and improves process versatility; laser drilling creates venting micropores that effectively prevent bulging and delamination of the encapsulation layer during long-term use; the introduction of tapping and vibration mechanical dynamic screening quantitatively eliminates potential defective products, ensuring the dynamic reliability of the products leaving the factory; finally, reinforcing adhesive is applied to the HUB board connection area, significantly enhancing the fatigue strength of the interface.

[0023] Implementation Case 1: As a specific embodiment of the present invention, the following steps are included: Step 1: Board fabrication, providing crystal film lamp boards A 0.125mm thick fully transparent PET sheet was used as the flexible transparent insulating substrate. A copper metal film was formed on this substrate using magnetron sputtering, followed by photolithography and etching to create a grid-like conductive circuit. This grid-like conductive circuit consists of several groups of parallel conductive circuit units. Each group of conductive circuit units includes a positive power line and a negative power line, both of which are formed by alternating first grid lines at a 45° angle and second grid lines at a 135° angle. Several LED positions were arrayed on the grid conductive circuit. Then, RGB LEDs were mounted on the LED positions using SMT (Surface Mount Technology) to form a crystal film LED board. The crystal film LED board was then subjected to 24 hours of power-on aging, and early-failed LEDs were discarded.

[0024] Step 2: Underlayer Coating and Fixing Provide a tempered glass plate larger than the crystal film lamp panel as a rigid support plate. Clean the upper surface of the tempered glass plate. Cut a double-sided adhesive film slightly larger than the crystal film lamp panel, peel off one side of the release paper, and attach the bottom surface of the double-sided adhesive film to the upper surface of the tempered glass plate, removing any air bubbles. The double-sided adhesive film uses acrylic optically transparent double-sided adhesive with an optical transparency ≥90%, a peel force of 10 N / inch to the PET substrate, and a peel force of 15 N / inch to the glass plate. Then, peel off the release paper from the top surface of the double-sided adhesive film, place the crystal film lamp panel face down, align it, and attach it entirely to the top surface of the double-sided adhesive film, pressing lightly to ensure complete adhesion and fixation.

[0025] Step 3: Apply dam sealant Approximately 2-5mm outside the outer edge of the crystal film lamp panel, a rectangular damming adhesive is applied to the upper surface of the double-sided adhesive film using an automatic dispensing machine. The damming adhesive is an AB adhesive compatible with the subsequent transparent adhesive. The height of the damming adhesive is set to 2.5 times the thickness of the LED chip; for example, if the LED chip thickness is 1.2mm, the damming adhesive application height is approximately 3mm. A gap of approximately 1mm is left between the inner edge of the rectangular damming adhesive frame and the edge of the crystal film lamp panel to prevent the adhesive from directly impacting the LED chip.

[0026] Step 4: Plasma Cleaning The tempered glass plate with the fixed crystal film lamp panel was placed on the worktable of an atmospheric pressure plasma cleaner. Compressed air was used as the working gas, the cleaning power was set to 500W, and the scanning speed of the cleaning head was 30mm / s. The cleaning head scanned twice evenly above the crystal film lamp panel in a zigzag pattern, covering the entire surface of the lamp panel and the gaps between the lamp beads. After plasma cleaning, the water contact angle on the upper surface of the crystal film lamp panel decreased from approximately 70° before treatment to below 15°, and the surface activation energy was significantly improved.

[0027] Step 5: Applying adhesive Using a comb-shaped multi-head injection nozzle, inject transparent AB adhesive into the rectangular area enclosed by the damming adhesive. During injection, control the injection speed and flow rate to allow the adhesive to slowly and evenly fill the entire defined area until the adhesive surface completely submerges all LED beads and is approximately level with the top surface of the damming adhesive. After injection, allow it to stand for 5-10 minutes to allow the adhesive to level naturally.

[0028] Step Six: Vacuum Defoaming Place the tempered glass plate containing the crystal film lamp panel horizontally onto the stage of the large vacuum chamber. Close the vacuum chamber door and start the vacuum pump. Set the absolute pressure inside the vacuum chamber to 500 Pa and maintain this low pressure for 10 minutes. During this time, observe the bubbles in the adhesive as they gradually expand, rise, and burst. A "vacuum-re-vacuum" cycle can be set: after maintaining the pressure for 10 minutes, quickly fill with dry air to atmospheric pressure, then re-evacuate to 500 Pa and maintain it for 5 minutes. After degassing, slowly release the vacuum to atmospheric pressure, open the chamber door, and remove the component.

[0029] Step 7: Curing The removed components are transferred to a constant temperature drying rack and left to stand for 24 hours at 25℃±2℃ and relative humidity≤60% to allow the transparent AB adhesive to fully cure and form an encapsulation layer. After curing, the encapsulation layer has a uniform thickness and adheres tightly to the crystal film lamp panel and the surrounding adhesive.

[0030] Step 8: Laser cutting and drilling The cured screen, along with the underlying double-sided adhesive film and tempered glass plate, is sent to the laser cutting station. Using a CO2 laser cutting machine, it is cut according to the pre-defined outer contour of the finished screen, removing excess waste edges. After cutting, the same laser machine is used to create micro-holes in a dot matrix pattern on the encapsulation layer. Micro-hole parameters are set as follows: diameter 50μm, hole spacing 10mm, and hole depth controlled to penetrate the encapsulation layer but just below the PET substrate and conductive lines. The perforated area covers the entire display area but excludes the HUB board connection area.

[0031] Step Nine: Mechanical Dynamic Screening The cut and punched screen body is carefully peeled off from the tempered glass plate. First, a tapping test is performed: the screen body is laid flat on the worktable of the tapping tester, and a flexible tapping head is used to continuously tap the screen surface 300 times at a frequency of 1.5Hz and a stroke of 100mm. After tapping, check for any detached, flickering, or non-lit LED beads. Next, a vibration test is performed: the screen body is fixed to an electric vibration table, a random vibration mode is set, the frequency range is 10-500Hz, the acceleration is 3G, and there is a 1-minute pause every 2 minutes of vibration, for a total vibration time of 12 hours. After the vibration is completed, the screen is powered on again for testing, and defective products with degraded electrical performance or mechanical damage are screened out.

[0032] Step 10: HUB Board Reinforcement and Finished Product For the screens that pass the above dynamic screening, a layer of UV-curable silicone is applied at the junction of the HUB board connector root and the PET substrate using a precision dispensing machine. The silicone coating width is approximately 1.2 times the connector width, and the thickness is approximately 0.5-1.0 mm, forming an arc-shaped reinforcing rib. It is then cured by UV irradiation. After curing, the tensile strength between the HUB board connector and the screen is increased by approximately 50% compared to the unreinforced state. The final product is a crystal film substrate LED grid conductive circuit screen, which is packaged and stored after passing inspection.

[0033] Implementation Case 2: As a specific embodiment of the present invention, the following steps are included: In step one, the flexible transparent insulating substrate uses a 0.2mm thick fully transparent CPI board, and the grid conductive lines are formed by etching through composite copper foil.

[0034] In step two, the peel force of the double-sided adhesive film is set as follows: 8 N / inch for CPI substrate and 12 N / inch for glass plate.

[0035] In step four, the plasma cleaning uses nitrogen as the working gas, with a power of 800W and a scanning speed of 50mm / s, and cleans once.

[0036] In step six, vacuum degassing is performed by evacuating to 200 Pa in a single cycle and maintaining it for 15 minutes, without any vacuum breaking cycle.

[0037] In step eight, the diameter of the exhaust micropores is 80μm, the spacing between pores is 15mm, and the depth of the pores is 80% of the thickness of the encapsulation layer (not penetrating).

[0038] In step nine, the tapping test is conducted at a frequency of 2Hz, a stroke of 150mm, and 300 taps; the vibration test uses a sinusoidal sweep frequency of 10-500Hz, an acceleration of 2G, and continuous vibration for 12 hours.

[0039] In step ten, the reinforcing adhesive is an acrylic thermosetting adhesive, which is cured in an oven at 80°C for 30 minutes.

[0040] The other steps and parameters are the same as in Implementation Case 1.

[0041] The main functions of this invention are: The back of the crystal film lamp panel is bonded to the tempered glass support plate using a double-sided adhesive film, ensuring that the lamp panel maintains its initial alignment throughout subsequent processes such as applying damming adhesive, potting, transportation, and vacuum treatment. This method eliminates circuit misalignment or uneven potting due to displacement, making it particularly suitable for large-size, high-density LED bead screens and effectively improving manufacturing yield.

[0042] After plasma cleaning, the water contact angle on the upper surface of the crystal film lamp board decreased from approximately 70° to below 15°, and the surface activation energy was significantly improved. This directly enhanced the wettability and adhesion of the subsequently injected transparent AB adhesive to the lamp board surface. After curing, there was no peeling or air gap between the encapsulation layer and the lamp board, and the bonding reliability was superior to that of uncleaned or liquid cleaning methods.

[0043] Example 1 uses a large vacuum chamber, maintaining a pressure of 500 Pa for 10 minutes with a single air-breaking cycle to effectively remove air bubbles from the transparent adhesive. The process of bubble expansion, rising, and bursting was observed in this embodiment; after curing, no visible air bubbles remained inside the encapsulation layer. Laser-drilled micropores with a diameter of 50 μm and a spacing of 10 mm were formed on the encapsulation layer, penetrating the entire layer. These micropores can promptly release trace amounts of gas that may be generated inside the adhesive layer or at the interface during subsequent use of the screen or changes in ambient temperature and humidity, preventing localized bulging or delamination caused by gas accumulation. Example 2 uses non-penetrating micropores, which also allow for slow gas escape, extending the product's lifespan.

[0044] A UV-curable silicone coating is applied to the base of the HUB board connector to form an arc-shaped reinforcing rib. After curing, the tensile strength is increased by approximately 50% compared to the unreinforced version. In Example 2, an acrylic thermosetting adhesive is used, which also provides reinforcement. This effectively disperses the stress on the connector base when the screen is bent or rolled, significantly reducing the probability of solder joint peeling or circuit breakage caused by repeated bending, thus improving the overall durability and interface reliability.

[0045] From lamp board fixing, cleaning, potting, debubbling, curing, cutting and drilling, dynamic screening to reinforcement, a complete closed loop is formed. Each step works in tandem, avoiding inefficient operations such as multiple transfers and repetitive positioning, thus facilitating automated continuous production. The final product, a crystal film substrate LED grid conductive circuit screen, is packaged and stored after passing inspection, exhibiting comprehensive performance characteristics of high precision, high light transmittance, high reliability, and bend resistance.

[0046] In summary, after reading this invention document, those skilled in the art can make various other corresponding modifications to the technical solutions and concepts based on this invention without creative mental effort, and all of these modifications fall within the scope of protection of this invention.

Claims

1. A method for manufacturing a crystalline film substrate LED grid conductive circuit screen, characterized in that, Includes the following steps: Step 1: Board fabrication: including a crystal film lamp board, which includes a flexible transparent insulating substrate, a grid-like conductive line formed on the flexible transparent insulating substrate, and a plurality of LED beads mounted on the grid-like conductive line; Step 2: Secure the back of the crystal film lamp panel to the upper surface of the rigid support plate using double-sided adhesive film. Step 3: Apply a rectangular frame-shaped damming adhesive to the outer perimeter of the crystal film lamp panel and the upper surface of the double-sided adhesive film. Step 4: Perform plasma cleaning on the upper surface of the crystal film lamp panel; Step 5: Pour transparent adhesive into the rectangular area enclosed by the dammed adhesive, ensuring that the liquid level of the transparent adhesive submerges all LED beads; Step Six: Place the rigid support plate carrying the crystal film lamp panel into a vacuum chamber and evacuate the vacuum chamber to remove air bubbles from the transparent adhesive. Step 7: Allow the transparent adhesive to cure, forming an encapsulation layer; Step 8: Laser-cut the cured screen to remove excess waste edges, and simultaneously or in stages form several venting micropores that penetrate or do not penetrate the encapsulation layer by laser dotting on the encapsulation layer. Step 9: Perform mechanical dynamic screening on the screen body that has been laser-cut and perforated. The mechanical dynamic screening includes at least a tapping test and a vibration test. Step 10: Apply a layer of reinforcing adhesive to the HUB board connection area of ​​the screen body that has passed the mechanical dynamic screening, and obtain the finished product after curing.

2. The method for manufacturing a crystalline film substrate LED grid conductive circuit screen according to claim 1, characterized in that, In step one, the flexible transparent insulating substrate is a fully transparent PET sheet or a fully transparent CPI sheet with a thickness of less than 0.5 mm.

3. The method for manufacturing a crystalline film substrate LED grid conductive circuit screen according to claim 2, characterized in that, In step one, the grid-like conductive circuit is composed of alternating first grid lines inclined at 45° and second grid lines inclined at 135°.

4. The method for manufacturing a crystalline film substrate LED grid conductive circuit screen according to claim 1, characterized in that, In step two, the lower surface of the double-sided adhesive film is adhered to the rigid support plate, and the upper surface is adhered to the back of the crystal film lamp plate.

5. The method for manufacturing a crystalline film substrate LED grid conductive circuit screen according to claim 1, characterized in that, In step three, the height of the dammed adhesive is greater than the height of the LED beads.

6. The method for manufacturing a crystalline film substrate LED grid conductive circuit screen according to claim 1, characterized in that, In step four, the plasma cleaning uses an atmospheric pressure plasma cleaning head, with compressed air or nitrogen as the working gas, a cleaning power of 300-800W, and a cleaning scanning speed of 10-50mm / s.

7. The method for manufacturing a crystalline film substrate LED grid conductive circuit screen according to claim 1, characterized in that, The transparent adhesive used in step five is AB adhesive.

8. The method for manufacturing a crystalline film substrate LED grid conductive circuit screen according to claim 1, characterized in that, In step six, a vacuum is drawn to reduce the absolute pressure inside the vacuum chamber to 100-1000 Pa and maintain this pressure for 5-15 minutes.

9. The method for manufacturing a crystalline film substrate LED grid conductive circuit screen according to claim 1, characterized in that, In step eight, the diameter of the exhaust micropores is 20-100μm, the spacing between the pores is 5-20mm, and the depth of the pores penetrates the encapsulation layer.

10. The method for manufacturing a crystalline film substrate LED grid conductive circuit screen according to claim 1, characterized in that, In step ten, the reinforcing adhesive is a UV-curable silicone or acrylic adhesive, and it is applied at the junction of the root of the HUB board connector and the flexible transparent insulating substrate.

Images