Display module, method for manufacturing a display module, and electronic device comprising a display module
Patent Information
- Application Number
- CN202610417906.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2025-04-11
- Filing Date
- 2026-04-01
- Publication Date
- 2026-10-20
Smart Images

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Abstract
Description
[0001] Cross-references to related applications
[0002] This application claims priority to Korean Patent Application No. 10-2025-0047377, filed on April 11, 2025, the contents of which are incorporated herein by reference in their entirety. Technical Field
[0003] The embodiments of this disclosure described herein relate to a display module, a method of manufacturing a display module, and an electronic device including a display module, and more specifically, to a display module including a lower light-blocking layer, a method for manufacturing a display module, and an electronic device including a display module. Background Technology
[0004] Multimedia electronic devices (such as televisions, mobile phones, tablet computers, car navigation systems, game consoles, and wearable devices) may include display modules that generate images. These display modules can improve image quality by using a light-blocking layer attached to a surface opposite the light-emitting surface, reducing the reflection of external light and preventing undesirable exposure of internal light sources. The light-blocking layer can reduce interference that may occur within the display device, thereby ensuring accurate color reproduction and sharpness.
[0005] In the manufacturing process of display devices, when the mother substrate includes glass, an etching solution containing fluorine can be used to etch the mother substrate. A plasma process can be performed to remove fluorine atoms remaining on the etched surface of the mother substrate. Summary of the Invention
[0006] Embodiments of this disclosure provide a display module with improved light-blocking effect and intensity, and an electronic device including the display module.
[0007] Embodiments of this disclosure provide a method for manufacturing a display module with improved light-blocking effect and intensity.
[0008] According to an embodiment, the display module includes: a base substrate; a display layer disposed on the base substrate, wherein the display layer includes a light-emitting element; an edge fluorine film disposed on an outer portion of the lower surface of the base substrate, the lower surface of the base substrate facing the upper surface of the base substrate; and a light-blocking layer including an edge light-blocking portion overlapping the edge fluorine film and an inner light-blocking portion disposed on the lower surface of the base substrate that does not overlap with the edge fluorine film.
[0009] In an embodiment, the edge light blocking portion may include: a first edge light blocking portion, which is directly disposed on the lower surface of the edge fluorine film; and a second edge light blocking portion, which is directly disposed on the lower surface of the first edge light blocking portion.
[0010] In one embodiment, the second edge light-blocking portion and the inner light-blocking portion can be integrally formed into a single, inseparable component.
[0011] In one embodiment, the lower surface of the light-blocking layer may be a flat surface.
[0012] In one embodiment, the edge light-blocking portion may have a smaller thickness than the inner light-blocking portion.
[0013] In one embodiment, the base substrate may include glass.
[0014] In one embodiment, the light-blocking layer may include a black colorant.
[0015] In one embodiment, the inner light-blocking portion may have a rectangular shape in a plan view, and the edge light-blocking portion may be configured to surround the inner light-blocking portion, such that the light-blocking layer has a rectangular shape in the plan view.
[0016] In an embodiment, the edge light-blocking portion may have a width greater than or equal to about 0.1 mm and less than about 2 mm in a plan view.
[0017] According to an embodiment, a method for manufacturing a display module includes: forming a preliminary base substrate and a fluorine film on the lower surface of the preliminary base substrate by etching a lower surface of a mother substrate with a fluorine solution; forming a display layer including a light-emitting element on an upper surface of the preliminary base substrate, the upper surface of the preliminary base substrate facing the lower surface of the preliminary base substrate; forming a first edge light-blocking portion on a portion of the lower surface of the fluorine film; treating the fluorine film from below the preliminary base substrate with N2 plasma; forming a light-blocking layer including the first edge light-blocking portion, a second edge light-blocking portion overlapping the first edge light-blocking portion, and an inner light-blocking portion not overlapping the first edge light-blocking portion by providing black resin to the lower surface of the first edge light-blocking portion and the lower surface of the preliminary base substrate exposed after the N2 plasma process; and forming a base substrate by removing the portion of the preliminary base substrate not overlapping the light-blocking layer.
[0018] In one embodiment, when forming the light-blocking layer, the exposed lower surface of the second edge light-blocking portion and the exposed lower surface of the inner light-blocking portion can be formed on the same plane.
[0019] In one embodiment, the mother substrate may include glass.
[0020] In one embodiment, forming the first edge light-blocking portion and forming the light-blocking layer may include printing the black resin.
[0021] In one embodiment, when forming the light-blocking layer, the inner light-blocking portion may have a rectangular shape in a plan view, and the first edge light-blocking portion and the second edge light-blocking portion may be formed to surround the inner light-blocking portion, so that the light-blocking layer has a rectangular shape in the plan view.
[0022] In an embodiment, when forming the first edge light blocking portion, the first edge light blocking portion may have a width greater than or equal to about 0.1 mm and less than about 2 mm in a plan view.
[0023] According to one embodiment, the electronic device includes a display module for generating images. In such an embodiment, the display module includes: a base substrate; a display layer disposed on the base substrate, wherein the display layer includes a light-emitting element; an edge fluorine film disposed on an outer portion of a lower surface of the base substrate, the lower surface of the base substrate facing an upper surface of the base substrate; and a light-blocking layer including an edge light-blocking portion overlapping the edge fluorine film and an inner light-blocking portion disposed on the lower surface of the base substrate that does not overlap with the edge fluorine film.
[0024] In an embodiment, the edge light blocking portion may include: a first edge light blocking portion, which is directly disposed on the lower surface of the edge fluorine film; and a second edge light blocking portion, which is directly disposed on the lower surface of the first edge light blocking portion.
[0025] In one embodiment, the second edge light-blocking portion and the inner light-blocking portion can be integrally formed into a single, inseparable component.
[0026] In some embodiments, the electronic device may further include at least one selected from processors, memory, and power modules.
[0027] In some embodiments, the electronic device may be a television, monitor, billboard, personal computer, laptop computer, personal digital assistant, vehicle device, game console, smartphone, tablet computer, smartwatch, or camera. Attached Figure Description
[0028] The above and other features of the embodiments of this disclosure will become apparent from the detailed description of the embodiments with reference to the accompanying drawings, in which: Figure 1A It is a block diagram of an electronic device according to an embodiment; Figure 1BSchematic diagrams of electronic devices according to various embodiments are shown; Figure 2 This is a perspective view of the electronic device according to the embodiment; Figure 3 This is a perspective view of the display module according to the implementation method; Figure 4 This is a cross-sectional view of the display module according to the implementation method; Figure 5 This is a cross-sectional view of a portion of the display module according to the embodiment; Figure 6 This is a plan view of the display module according to the implementation method; Figure 7 This is a perspective view of the light-blocking layer according to the embodiment; Figure 8 This is a cross-sectional view of the light-blocking layer according to the embodiment; Figure 9 This is a flowchart illustrating a method for manufacturing a display module according to an embodiment; and Figures 10 to 13 This is a cross-sectional view showing the process of manufacturing a display module according to an embodiment. Detailed Implementation
[0029] The invention will be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
[0030] It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element, or there can be an intermediate element between the element and the other element. Conversely, when an element is referred to as being "directly on" another element, there is no intermediate element. In this specification, when a component (or area, layer, part, etc.) is referred to as being "connected to" or "attached to" another component, this means that the component can be directly connected to or directly attached to the other component, or there can be a third component between the component and the other component.
[0031] The same reference numerals refer to the same components. Furthermore, in the accompanying drawings, the thickness, scale, and size of the components are exaggerated for effective description. As used herein, the term "and / or" includes all of one or more combinations defined by the relevant components.
[0032] It will be understood that while the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, areas, layers, and / or parts, these elements, components, areas, layers, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, one component, one area, one layer, or one part from another element, another component, another area, another layer, or another part. Therefore, without departing from the teachings herein, “first element,” “first component,” “first area,” “first layer,” or “first part” discussed below may be referred to as “second element,” “second component,” “second area,” “second layer,” or “second part.”
[0033] Furthermore, relative terms such as “lower” or “bottom” and “upper” or “top” may be used herein to describe the relationship between one element and another, as shown in the accompanying drawings. It will be understood that these relative terms are intended to cover different orientations of the device beyond those depicted in the drawings. For example, if a device in one of the multiple drawings is flipped, an element described as being “below” the other elements will then be located “above” the other elements. Thus, the term “lower” can encompass both “lower” and “upper” orientations, depending on the specific orientation of the drawing. Similarly, if a device in one of the multiple drawings is flipped, an element described as being “below” or “under” another element will then be located “above” the other elements. Thus, the terms “below” or “under” can encompass both upper and lower orientations.
[0034] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a (a)”, “an (a)”, “the”, and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. Thus, a reference to an element “a” in a claim followed by a reference to an element includes one element and multiple elements. For example, “a element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “a (a)” or “an (a)”. “Or” means “and / or”. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will be further understood that when the terms “comprises” and / or “comprising” or “includes” and / or “including” are used in this specification, they specify the presence of the stated features, areas, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, areas, integers, steps, operations, elements, components and / or combinations thereof.
[0035] As used herein, the term "direct setting" can mean that there is no additional layer, membrane, region, or plate between one part (such as a layer, membrane, region, or plate) and another part. For example, the term "direct setting" can mean setting two layers or two components without any additional components such as adhesive components between the two layers or two components.
[0036] The expression “regions / parts correspond to each other” as used herein may mean “overlapping each other”, and is not limited to having the same area and / or the same shape. Furthermore, the expression “regions / parts overlap each other” as used herein includes regions / parts that are indicated to overlap each other when viewed from above the plane and regions that at least partially overlap each other when viewed from above the plane.
[0037] As used herein, “about” or “approximately” includes the value and the average of the value within an acceptable range of deviations from the particular value, as determined by a person skilled in the art in view of the measurement in question and the error associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, or ±5% of the value.
[0038] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms, such as those defined in general dictionaries, shall be interpreted as having the same meaning as they have in the relevant field and in the context of this disclosure, and shall not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
[0039] Embodiments are described herein with reference to sectional views, which are schematic illustrations of preferred embodiments. Therefore, variations in the shape of the figures should be expected due to factors such as manufacturing techniques and / or tolerances. Consequently, the embodiments described herein should not be construed as limited to the specific shapes of the regions shown herein, but should include deviations in shape, for example, due to manufacturing processes. For instance, regions shown or described as flat may generally have rough and / or non-linear characteristics. Furthermore, sharp corners shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show precise shapes of the regions, nor are they intended to limit the scope of the claims.
[0040] In the following description, embodiments of the display module, the method of manufacturing the display module, and the electronic device will be described with reference to the accompanying drawings.
[0041] Figure 1A This is a block diagram of an electronic device according to an embodiment. (Reference) Figure 1AAccording to the embodiments, the electronic device EA may include a display module DM, a processor PR, a memory MR, and a power module PM.
[0042] The processor PR may include at least one selected from a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.
[0043] Data used for the operation of the processor PR or display module DM can be stored in the memory MR. When the processor PR executes the application stored in the memory MR, image data signals and / or input control signals can be transmitted to the display module DM, and the display module DM can process the provided signals and output image information through the display screen.
[0044] The power module PM may include a power supply module (such as a power adapter or battery device) and a power conversion module that converts the power supplied by the power supply module and generates power for the operation of the electronic device EA.
[0045] At least one of the components of the aforementioned electronic device EA may be included in the display device according to the embodiment. Furthermore, some of the separate modules functionally included in a single module may be included in the display device, and other modules may be provided separately from the display device. For example, in an embodiment, the display device may include an embodiment of the display module DM described below. The processor PR, memory MR, and power module PM may be provided as other devices in the electronic device EA besides the display device.
[0046] Figure 1B A schematic diagram of an electronic device according to various embodiments is shown.
[0047] refer to Figure 1B The various electronic devices that apply the display device according to the implementation method may include not only electronic devices for displaying images (such as smartphones EA_1a, tablet PCs EA_1b, laptops EA_1c, televisions (TVs) EA_1d, and desktop monitors EA_1e), but also wearable electronic devices (such as smart glasses EA_2a, head-mounted displays EA_2b, and smartwatches EA_2c) and vehicle electronic devices EA_3 (such as central information displays (CIDs) installed on the dashboard, central trim panels, and vehicle instrument panels and rearview mirror displays) that include display modules.
[0048] The display device according to the embodiments can be applied to various electronic devices. In addition to the display device, the electronic device according to the embodiments may also include modules or devices with other additional functions.
[0049] Figure 2 This is a perspective view of an electronic device according to an embodiment.
[0050] An embodiment of the electronic device EA may include a display device DD that displays an image via a display surface EA-IS. The display device DD may be disposed in or housed in a housing HAU. The electronic device EA may include the display device DD and a controller for controlling the operation of the display device DD.
[0051] When viewed from above the plane (or in a plan view), the display surface EA-IS of the electronic device EA can have a rectangular shape, having a long side extending in a first direction DR1 and a short side extending in a second direction DR2 intersecting the first direction DR1. However, it is not limited to this, and the display surface EA-IS can have various shapes, such as circular and polygonal shapes.
[0052] In this specification, the third direction DR3 can be defined as a direction substantially perpendicular to the plane defined by the first direction DR1 and the second direction DR2. The front (or upper) and rear (or lower) surfaces of the components constituting the electronic device EA can be opposite each other on the third direction DR3, and the normal directions of the front and rear surfaces can be substantially parallel to the third direction DR3. The third direction DR3 can be the thickness direction of the electronic device EA. The spacing between the front and rear surfaces defined on the third direction DR3 can correspond to the thickness of the component.
[0053] The expressions "when viewed from above the plane" or "in a plan view" as used herein may refer to observation in the third direction DR3. That is, the expressions "when viewed from above the plane" or "in a plan view" may be described based on the plane defined by the first direction DR1 and the second direction DR2. The expression "in a section" as used herein may refer to observation in the first direction DR1 or the second direction DR2. The directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 may be relative concepts and may be changed to other directions.
[0054] exist Figure 2The following illustration shows an implementation of an electronic device EA as a tablet terminal. An electronic module, camera module, and power module mounted on a motherboard can be housed together with a display device DD in a bracket / housing HAU to constitute a tablet terminal. The implementation is not limited to this, and the display device DD and display module according to the embodiments described below can be applied to small and medium-sized electronic devices (such as personal computers, laptops, personal digital assistants, car navigation units, game consoles, smartphones, tablet computers, smartwatches, and cameras) and large electronic devices (such as televisions, monitors, and billboards). However, these are merely illustrative, and the display device DD according to the embodiments can be used as other electronic devices without departing from the spirit and scope of this disclosure. The electronic device EA including the display device DD can be referred to as a display device.
[0055] In one embodiment, an electronic device EA is shown comprising a display device DD having a flat display surface, but this disclosure is not limited thereto. The electronic device EA may include a curved display surface or a three-dimensional display surface. For example, a three-dimensional display surface may include multiple display areas indicating different directions and may include a curved display surface. The electronic device EA according to the embodiment may be a flexible electronic device. A flexible electronic device may be a foldable electronic device capable of being folded.
[0056] In the implementation method, such as Figure 2 As shown, the display surface EA-IS includes an effective image display area AA and a border area NAA adjacent to the effective image display area AA. The border area NAA is an area where no image is displayed. Figure 2 In the image shown, the icon is an example of an image. The active area AA can be referred to as the display area of the display device DD, and the border area NAA can be referred to as the non-display area of the display device DD.
[0057] In the implementation method, such as Figure 2 As shown, the effective region AA can have a substantially quadrilateral shape. “Substantially quadrilateral shape” includes not only quadrilateral shapes in the mathematical sense, but also quadrilateral shapes in which the boundaries of the vertex region (or corner region) are defined as curves rather than vertices.
[0058] The border region NAA can surround the effective region AA. However, it is not limited to this and the shape of the border region NAA can be modified. For example, in one implementation, the border region NAA can be set only on one side of the effective region AA.
[0059] Figure 3 This is a perspective view of a display module according to an embodiment of the present disclosure. Figure 4 This is a cross-sectional view of the display module according to the implementation method. Figure 5This is a detailed cross-sectional view showing a portion of the display module according to an embodiment. Figure 4 Is with Figure 3 The sectional view corresponding to line I-I', and Figure 5 Is with Figure 3 The sectional view corresponding to line II-II'. (Based on reference...) Figure 3 The display module DM of the described implementation may include in Figure 2 The display device DD shown is shown.
[0060] refer to Figure 3 The implementation of the display module DM may include a display surface IS. The display module DM can display images through the display surface IS. The display surface IS of the display module DM may correspond to the display surface EA-IS of the electronic device EA.
[0061] The display surface IS may include a display area DA and a non-display area NDA. Multiple pixel areas PXA may be set within the display area DA. In a planar view, a peripheral area NPXA is set to surround the pixel areas PXA. The pixel areas PXA may be referred to as luminescent areas, and the peripheral area NPXA may be referred to as non-luminescent areas.
[0062] The display module DM according to the embodiment may include a plurality of pixel regions PXA repeatedly disposed throughout the display area DA. When viewed from above the plane, the pixel regions PXA in the display module DM according to the embodiment may be arranged in a stripe pattern. Reference Figure 3 In one implementation, multiple pixel regions PXA can be aligned along a first direction DR1 or a second direction DR2. However, the implementation is not limited to this, and the pixel regions PXA can be in pentiline configuration. ® Form or DiamondPixel ® Arrangement of form.
[0063] In the implementation method, the pixel region PXA can have, for example... Figure 3 The planar regions shown are similar to each other, but the implementation is not limited to this, and the pixel region PXA can have different planar regions depending on the wavelength range of the emitted light.
[0064] The pixel region PXA may not be located in the non-display region NDA of the display surface IS, and the non-display region NDA may surround the display region DA. However, it is not limited to this; in embodiments of this disclosure, the non-display region NDA may be omitted or may be located only on one side of the display region DA.
[0065] refer to Figure 4 and Figure 5According to the embodiment, the display module DM includes a base substrate BS, a display layer EDL, an edge fluorine film FF-E, and a light blocking layer LSL.
[0066] refer to Figure 4 and Figure 5 According to an embodiment, the display module DM may include a display panel DP. The base substrate BS and the display layer EDL may be components of the display panel DP. The display panel DP may be a component that substantially generates image data. Embodiments of the display panel DP may include it in an electronic device EA (refer to...). Figure 2 The display panel DP is an embodiment of the component that displays images. An embodiment of the display panel DP can be an emitting display panel. In an embodiment, the display panel DP may include inorganic light-emitting materials such as quantum dots.
[0067] The display panel DP may include a base substrate BS, a circuit layer DP-CL, a display layer EDL, and a packaging layer TFE, which are stacked sequentially on the third-direction DR3. That is, the display layer EDL can be disposed on the base substrate BS.
[0068] The display layer (EDL) may include light-emitting elements (ED-R, ED-G, and ED-B). Multiple pixel regions (PXA-R, PXA-G, and PXA-B) may be areas that emit light generated by the light-emitting elements ED-R, ED-G, and ED-B.
[0069] In this implementation, the encapsulation layer TFE can be directly disposed on the display layer EDL. The encapsulation layer TFE can cover the light-emitting elements ED-R, ED-G, and ED-B of the display layer EDL.
[0070] refer to Figure 3 and Figure 5 The pixel region PXA may include a first pixel region PXA-R, a second pixel region PXA-G, and a third pixel region PXA-B. In the display module DM according to the embodiment, when viewed from above the plane, the first pixel region PXA-R, the second pixel region PXA-G, and the third pixel region PXA-B can be distinguished from each other and can emit light of different wavelength ranges.
[0071] Furthermore, the display module DM according to the embodiment may include a peripheral region NPXA configured to surround a first pixel region PXA-R, a second pixel region PXA-G, and a third pixel region PXA-B. The peripheral region NPXA may define or define the boundaries between the first pixel regions PXA-R, the second pixel regions PXA-G, and the third pixel regions PXA-B. The peripheral region NPXA may surround each of the first pixel regions PXA-R, the second pixel regions PXA-G, and the third pixel regions PXA-B. Within the peripheral region NPXA, a structure (e.g., a pixel definition layer PDL) for preventing color mixing between the first pixel regions PXA-R, the second pixel regions PXA-G, and the third pixel regions PXA-B may be configured to overlap with the peripheral region NPXA.
[0072] The first pixel region PXA-R, the second pixel region PXA-G, and the third pixel region PXA-B can be regions that are separated from each other by a pixel definition layer (PDL). The outer region NPXA can be the region between the first pixel region PXA-R, the second pixel region PXA-G, and the third pixel region PXA-B that are adjacent to each other, and can be the region corresponding to the pixel definition layer (PDL).
[0073] The first pixel region PXA-R, the second pixel region PXA-G, and the third pixel region PXA-B can be regions that emit light generated by the first light-emitting element ED-R, the second light-emitting element ED-G, and the third light-emitting element ED-B. When viewed from above the plane, the first pixel region PXA-R, the second pixel region PXA-G, and the third pixel region PXA-B can be spaced apart from each other.
[0074] The pixel defining layer (PDL) can distinguish or separate the first light-emitting element (ED-R), the second light-emitting element (ED-G), and the third light-emitting element (ED-B) from each other. The light-emitting layer EML-R of the first light-emitting element (ED-R), the light-emitting layer EML-G of the second light-emitting element (ED-G), and the light-emitting layer EML-B of the third light-emitting element (ED-B) can be disposed in the pixel opening OH defined by the pixel defining layer (PDL) to distinguish them from each other.
[0075] The pixel defining layer (PDL) may include or be formed of a polymer resin. For example, in one embodiment, the pixel defining layer (PDL) may include, or be formed of, a polyacrylate resin or a polyimide resin. Furthermore, the pixel defining layer (PDL) may also include inorganic materials other than polymer resins. The pixel defining layer (PDL) may include light-absorbing materials or may include black pigments or black dyes. A pixel defining layer (PDL) including black pigments or black dyes can achieve a black pixel defining layer.
[0076] The first pixel region PXA-R, the second pixel region PXA-G, and the third pixel region PXA-B can be distinguished from each other based on the color of the light generated by the first light-emitting element ED-R, the second light-emitting element ED-G, and the third light-emitting element ED-B. For example, in the display module DM according to the embodiment, the first pixel region PXA-R can correspond to the red light-emitting region, the second pixel region PXA-G can correspond to the green light-emitting region, and the third pixel region PXA-B can correspond to the blue light-emitting region.
[0077] In the display module DM according to the embodiment, the light-emitting elements ED-R, ED-G, and ED-B can emit light in different wavelength ranges. For example, in the embodiment, the first light-emitting element ED-R can correspond to a red light-emitting element that emits red light, the second light-emitting element ED-G can correspond to a green light-emitting element that emits green light, and the third light-emitting element ED-B can correspond to a blue light-emitting element that emits blue light.
[0078] Despite Figure 5 The diagram shows three pixel regions PXA-R, PXA-G, and PXA-B that are distinct from each other, but the implementation is not limited to this, and the display module DM according to the implementation may include four or more light-emitting regions with different emission characteristics from each other.
[0079] In a display panel (DP), the base substrate (BS) can be a component providing the base surface, on which the edge fluorine film (FF-E), light-blocking layer (LSL), display layer (EDL), and circuit layer (DP-CL) are disposed. The base substrate (BS) can be a glass substrate, a metal substrate, or a plastic substrate. However, the implementation is not limited to these, and the base substrate (BS) can be an inorganic layer, an organic layer, or a composite layer.
[0080] The base substrate BS may include glass. In an embodiment, the display module DM may include a glass-based base substrate BS and a light-blocking layer LSL, as described below, and may exhibit strong durability. In an embodiment of the manufacturing process for the glass-based base substrate BS, an etching solution including fluorine may be used to etch the mother substrate. The edge fluorine film FF-E may be formed using an etching solution including fluorine. The edge fluorine film FF-E may be formed on the outer portion BSd-E of the lower surface BSd of the base substrate BS. A detailed description of the edge fluorine film FF-E is given below.
[0081] In embodiments, the base substrate BS may have a thickness greater than or equal to about 0.1 mm and less than about 0.3 mm. For example, in embodiments, the base substrate BS may have a thickness of about 0.2 mm. In embodiments, even if the display module DM includes a thin base substrate BS having a thickness greater than or equal to about 0.1 mm and less than about 0.3 mm, the display module DM may also include an edge fluorine film FF-E and a light-blocking layer LSL disposed on one surface of the base substrate BS, and may exhibit improved intensity characteristics.
[0082] In one embodiment, the circuit layer DP-CL may be disposed on the base substrate BS. The circuit layer DP-CL may include a plurality of transistors (not shown). Each of the transistors (not shown) may include a control electrode, an input electrode, and an output electrode. For example, in one embodiment, the circuit layer DP-CL may include switching transistors and driving transistors for driving the light-emitting elements ED-R, ED-G, and ED-B of the display layer EDL.
[0083] The encapsulation layer TFE can cover the light-emitting elements ED-R, ED-G, and ED-B. The encapsulation layer TFE can seal the display layer EDL. The encapsulation layer TFE can be a thin-film encapsulation layer. The encapsulation layer TFE can include multiple layers stacked on top of one layer. According to embodiments, the encapsulation layer TFE can include at least one inorganic film and at least one organic film.
[0084] The display module DM according to the embodiment may further include an optical component PP. The optical component PP may be a reflection reduction layer that reduces reflectivity due to external light. For example, in the embodiment, the optical component PP may include a polarizing film containing a phase retarder and / or a polarizer, multiple reflective layers that allow reflected beams to interfere destructively with each other, or a color filter arranged corresponding to the pixel arrangement and emitted color of the display panel DP. In the embodiment, the optical component PP may be omitted.
[0085] In an embodiment of the display module DM, each of the first light-emitting element ED-R, the second light-emitting element ED-G, and the third light-emitting element ED-B may include a first electrode AE, a hole transport region HTR, a light-emitting layer EML-R, EML-G, or EML-B, an electron transport region ETR, and a second electrode CE. Furthermore, each of the light-emitting elements ED-R, ED-G, and ED-B may also include a cover layer CPL disposed on the second electrode CE.
[0086] The first electrode AE can be exposed through the pixel opening OH of the pixel-limiting layer PDL.
[0087] The second electrode CE can be disposed above the first electrode AE. The second electrode CE can be positioned facing the first electrode AE, and the light-emitting layer EML-R, EML-G, or EML-B is located between the second electrode CE and the first electrode AE. The second electrode CE can be a cathode or an anode. In an embodiment, when the first electrode AE is an anode, the second electrode CE can be a cathode, and when the first electrode AE is a cathode, the second electrode CE can be an anode. The second electrode CE can be a common electrode. The second electrode CE can be a transmission electrode, a transmission-reflection electrode, or a reflection electrode.
[0088] The first electrode AE can be individually configured to correspond to each of the pixel regions PXA-R, PXA-G, and PXA-B. The second electrode CE can be configured as a common layer in all pixel regions PXA-R, PXA-G, and PXA-B.
[0089] The hole transport region HTR can be located between the first electrode AE and the light-emitting layers EML-R, EML-G, or EML-B, and the electron transport region ETR can be located between the light-emitting layers EML-R, EML-G, or EML-B and the second electrode CE. (Reference) Figure 5 The hole transport region (HTR) and electron transport region (ETR) can each be set as a common layer in all pixel regions PXA-R, PXA-G, and PXA-B. However, the implementation is not limited to this, and the hole transport region (HTR) and electron transport region (ETR) can be set to correspond independently to each of the pixel regions PXA-R, PXA-G, and PXA-B.
[0090] In this embodiment, each of the first light-emitting element ED-R, the second light-emitting element ED-G, and the third light-emitting element ED-B may further include a capping layer CPL. The capping layer CPL may be disposed on the second electrode CE. The capping layer CPL may comprise multiple layers or a single layer (or be defined by multiple layers or a single layer). Reference Figure 5 In the implementation of the display module DM, the overlay layer CPL can be set as a common layer in all pixel areas PXA-R, PXA-G and PXA-B.
[0091] refer to Figure 4 and Figure 5In an embodiment of the display module DM, an edge fluorine film FF-E is disposed on the outer portion BSd-E of the lower surface BSd of the base substrate BS, which faces the upper surface BSu of the base substrate BS. In this embodiment, the edge fluorine film FF-E on the lower surface BSd of the base substrate BS can be disposed adjacent to an edge portion including the periphery to surround an inner empty region. In this specification, fluorine film means a film comprising fluorine atoms. In the manufacturing process of the display module DM, when etching the mother substrate using a fluorine (F)-based etching solution (such as HF, CF4, or SF6), the edge fluorine film FF-E can be formed by forming a film comprising fluorine compounds (such as Si-F or AlF3) on the surface of the glass substrate. However, the method of manufacturing the edge fluorine film FF-E is not limited to this.
[0092] In an embodiment of the display module DM, the light-blocking layer LSL includes an edge light-blocking portion LSL-E and an inner light-blocking portion LSL-I. The edge light-blocking portion LSL-E is disposed below and overlaps with the edge fluorine film FF-E. The inner light-blocking portion LSL-I is disposed on the lower surface BSd of the base substrate BS so as not to overlap with the edge fluorine film FF-E. That is, the inner light-blocking portion LSL-I can be disposed on the inner portion BSd-I of the lower surface BSd of the base substrate BS. Specifically, the edge light-blocking portion LSL-E can have a shape that surrounds a portion of the side surface of the inner light-blocking portion LSL-I (see reference). Figure 7 ).
[0093] A light-blocking layer (LSL) can be a layer that blocks external light and effectively prevents internal light leakage. Furthermore, the LSL can be a layer that mitigates impacts occurring beneath the display module (DM) to prevent damage to the display panel (DP). The LSL can completely overlap with the lower surface (BSd) of the base substrate (BS).
[0094] The light-blocking layer LSL may include a black colorant. The light-blocking layer LSL may also include a base resin, and the black colorant may be mixed into the base resin. The light-blocking layer LSL can be formed by curing a black resin comprising the base resin and the black colorant. The black colorant may include a black pigment or a black dye and can exhibit a black color. Because the light-blocking layer LSL including the black colorant is entirely disposed on the lower surface BSd of the base substrate BS on the underside of the display module DM, the display module DM can have high light-blocking properties and high durability against impacts occurring below.
[0095] Figure 6 This is a plan view of the display module as seen from below, according to one embodiment. Figure 7 This is a perspective view of the light-blocking layer according to the embodiment. Figure 8 This is a cross-sectional view of the light-blocking layer according to an embodiment. Figure 8 Is with Figure 7 The cross-sectional view corresponding to line III-III'. The light-blocking layer LSL according to the embodiment includes, according to... Figure 6 The embodiment shown is in the display module DM. Figure 8 yes Figure 4 A detailed view of the light-blocking layer LSL shown.
[0096] refer to Figure 4 , Figure 7 and Figure 8 In the light-blocking layer LSL according to the embodiment, the edge light-blocking portion LSL-E may include a first edge light-blocking portion LSL-E1 directly disposed on (i.e., directly disposed on) the lower surface FF-Ed of the edge fluorine film FF-E and a second edge light-blocking portion LSL-E2 directly disposed on the lower surface LSL-E1d of the first edge light-blocking portion LSL-E1. The first edge light-blocking portion LSL-E1 and the second edge light-blocking portion LSL-E2 may include the same or different materials from each other. For example, in the embodiment, the first edge light-blocking portion LSL-E1 and the second edge light-blocking portion LSL-E2 may include a black colorant, and the type or content of the black colorant included in the first edge light-blocking portion LSL-E1 and the second edge light-blocking portion LSL-E2 may be different from each other. The first edge light-blocking portion LSL-E1 and the second edge light-blocking portion LSL-E2 may be distinguishable from each other according to the time sequence in which the first edge light-blocking portion LSL-E1 and the second edge light-blocking portion LSL-E2 are formed in the manufacturing process. However, regardless of the manufacturing sequence in the manufacturing process, the portion directly disposed on the edge fluorine film FF-E can be called the first edge light blocking portion LSL-E1, and the portion spaced apart from the edge fluorine film FF-E can be called the second edge light blocking portion LSL-E2, and the first edge light blocking portion LSL-E1 is between the second edge light blocking portion LSL-E2 and the edge fluorine film FF-E.
[0097] In this embodiment, the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I can be integrally formed into a single, inseparable component. That is, the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I can be configured as a single structure without requiring a separate joining process. The second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I can be formed in the same process. In this embodiment where the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I are integrally formed into a single, inseparable component, the display module DM exhibits increased durability characteristics because the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I are configured as a single structure.
[0098] refer to Figure 4 and Figure 6 The internal light-blocking portion LSL-I can have a rectangular shape on a plane parallel to the lower surface BSd of the base substrate BS. Furthermore, the edge light-blocking portion LSL-E can be configured to surround the internal light-blocking portion LSL-I, such that the light-blocking layer LSL has a rectangular shape on the plane. The planar shapes of the internal light-blocking portion LSL-I and the light-blocking layer LSL can correspond to the shapes of the display area DA of the display module DM and the display module DM, respectively. In another embodiment, the shapes of the light-blocking layer LSL, the internal light-blocking portion LSL-I, and the display area DA can be various shapes on a plane parallel to the lower surface BSd of the base substrate BS, and are not limited to these. Figure 6 Those shapes shown.
[0099] refer to Figure 8 On the plane defined by the first direction DR1 and the third direction DR3 (e.g., in a side view or when viewed in the second direction DR2), the edge light blocking portion LSL-E, the first edge light blocking portion LSL-E1, the second edge light blocking portion LSL-E2, and the inner light blocking portion LSL-I may each have a substantially rectangular shape. In such an embodiment where each of the first edge light blocking portion LSL-E1 and the second edge light blocking portion LSL-E2 has a substantially rectangular shape, the edge light blocking portion LSL-E may also have a substantially rectangular shape. "Substantially rectangular shape" includes not only a rectangular shape in a mathematical sense, but also a rectangular shape in which the boundary defined as a curve in the vertex region (or corner region) is not a vertex.
[0100] refer to Figure 8 The thickness H of the LSL-E at the edge light blocking portion E It can be smaller than the thickness H of the internal light-blocking part LSL-I. I The thickness H of the LSL-E at the edge light blocking portion.E It can be equal to the thickness H of the first edge light-blocking portion LSL-E1. E1 The thickness H of the second edge light-blocking portion LSL-E2 E2 The sum. The thickness H of the LSL-E at the edge of the light-blocking portion. E The thickness H of the fluorine film FF-E at the edge FF The sum can be equal to the thickness H of the internal light-blocking portion LSL-I. I And therefore the thickness H of the edge light-blocking portion of LSL-E E It can be smaller than the thickness H of the internal light-blocking part LSL-I. I Therefore, a step (or step structure) can be formed or defined between the edge light-blocking portion LSL-E and the inner light-blocking portion LSL-I. This step can have a thickness H equal to that of the edge fluorine film FF-E. FF The length (or vertical height difference) of the steps.
[0101] refer to Figure 4 and Figure 8 The lower surface LSLd of the light-blocking layer LSL can be a flat surface. The lower surface LSLd of the light-blocking layer LSL can include the lower surface LSL-Ed of the edge light-blocking portion LSL-E and the lower surface LSL-Id of the inner light-blocking portion LSL-I. That is, the lower surface LSL-Ed of the edge light-blocking portion LSL-E and the lower surface LSL-Id of the inner light-blocking portion LSL-I can be on the same plane or coplanar (i.e., jointly defining the same planar surface). The lower surface LSL-Ed of the edge light-blocking portion LSL-E can be referred to as being the same as the lower surface of the second edge light-blocking portion LSL-E2. When the lower surface LSLd of the light-blocking layer LSL is a flat surface, due to the structure of the edge fluorine film FF-E and the first edge light-blocking portion LSL-E1 in the display module DM, edge control is facilitated when forming the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I. "Edge control" can refer to controlling the application of an ink (e.g., black resin) with a specific viscosity to the target area during the process of forming the light-blocking layer LSL. This ink is the material of the light-blocking layer LSL before curing. When the structure of the edge fluorine film FF-E and the first edge light-blocking portion LSL-E1 is absent, edge control may be difficult, and therefore the thickness of the light-blocking layer LSL may decrease from the interior towards the edge. When edge control is difficult, the thickness of the light-blocking layer LSL may be uneven, potentially leading to partial light leakage or uneven light-blocking effect. Therefore, the display quality of the display module DM may deteriorate. In this embodiment, the lower surface LSLd of the light-blocking layer LSL is a flat surface, allowing the display module DM to exhibit high display quality due to improved light leakage.
[0102] The lower surface LSLd of the light-blocking layer LSL can be a substantially flat surface. "Substantially flat surface" includes not only a mathematically flat surface but also a generally uniform surface. Due to the structure of the edge fluorine film FF-E and the first edge light-blocking portion LSL-E1, the slope at the edge of the light-blocking layer LSL can be reduced. That is, the slope at the edge of the light-blocking layer LSL can be shortened, allowing the lower surface LSLd of the light-blocking layer LSL to have a shape close to a flat surface. When the lower surface LSLd of the light-blocking layer LSL is a substantially flat surface, the display module DM can exhibit high display quality due to improved light leakage.
[0103] Return to reference Figure 4 In an embodiment of the display module DM, the internal light-blocking portion LSL-I can be configured to overlap with the display area DA. That is, in an embodiment of the display module DM, the area corresponding to the internal light-blocking portion LSL-I on a plane parallel to the lower surface BSd of the base substrate BS can include the display area DA. Due to the thickness H of the edge light-blocking portion LSL-E... E The thickness H of the internal light-blocking part LSL-I I Because they differ from each other, the display quality of the display module DM may be uneven when both the internal light-blocking portion LSL-I and the edge light-blocking portion LSL-E are configured to overlap with the display area DA. In this embodiment, only the internal light-blocking portion LSL-I is configured to overlap with the display area DA, allowing the display module DM to exhibit high display quality.
[0104] refer to Figure 6 and Figure 8 The width W of the edge light-blocking portion LSL-E on a plane parallel to the lower surface BSd of the base substrate BS. E It can be greater than or equal to approximately 0.1 mm and less than approximately 2 mm. If the width W of the edge light-blocking portion of LSL-E... E If the width is less than 0.1 mm, edge control may be difficult when forming the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I. If the width W of the edge light-blocking portion LSL-E is less than 0.1 mm, edge control may be difficult. E If the edge light blocking portion LSL-E is 2mm or more, the edge light blocking portion may be too large, and therefore the display quality of the display module DM may be reduced.
[0105] In this embodiment, the display module DM may include an edge fluorine film FF-E disposed on the outer portion BSd-E of the lower surface BSd of the base substrate BS, and a light-blocking layer LSL comprising an edge light-blocking portion LSL-E and an inner light-blocking portion LSL-I, exhibiting high light-blocking characteristics. In this embodiment, due to the structure of the edge fluorine film FF-E and the first edge light-blocking portion LSL-E1, edge control is facilitated when forming the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I. Therefore, the light-blocking layer LSL can be formed to a thickness reaching or exceeding a predetermined thickness, and the occurrence of slope at the edge of the light-blocking layer LSL can be reduced. Therefore, the embodiment of the display module DM can exhibit characteristics of reduced light leakage and increased intensity.
[0106] refer to Figures 3 to 6 The description of the display module DM and reference Figure 7 and Figure 8 The light-blocking layer LSL described may be included in electronic devices.
[0107] Return to reference Figure 2 An embodiment of the electronic device EA may include a display module DM for generating images, and the display module DM may include the aforementioned base substrate, display layer, edge fluorine film and light blocking layer, and may have the characteristics of the aforementioned display module DM.
[0108] Electronic devices may include the aforementioned display module and may exhibit improved durability, high display quality, and high reliability.
[0109] In the following text, reference will be made to Figures 9 to 13 This describes an implementation method for manufacturing a display module. In the description of the implementation method for manufacturing a display module, references to the above-mentioned methods will be omitted. Figures 3 to 6 The description of the display module DM and the above references Figure 7 and Figure 8 The light-blocking layer LSL described herein is a repetition of the detailed description of the same or similar elements, and the following description will focus on the differences.
[0110] Figure 9 This is a flowchart illustrating a method for manufacturing a display module according to an embodiment. Figures 10 to 13 This is a cross-sectional view showing the process of manufacturing a display module according to an embodiment.
[0111] refer to Figure 9The implementation of the display module manufacturing method S10 includes a process S100 for forming a preliminary base substrate and a fluorine film, a process S200 for forming a display layer, a process S300 for forming a first edge light blocking portion, a process S400 for performing an N2 plasma process, a process S500 for forming a light blocking layer, and a process S600 for forming a base substrate.
[0112] In process S100, which forms a preliminary base substrate and a fluorine film, a preliminary base substrate P-BS and a fluorine film FF on the lower surface of the preliminary base substrate P-BS are formed by etching the lower surface of the mother substrate with a fluorine solution.
[0113] The mother substrate may include glass. The thickness of the mother substrate, including glass, can be adjusted to make it thinner by etching with a fluorine solution. In this specification, the preliminary base substrate P-BS refers to the substrate obtained by etching the mother substrate. In the process S600 for forming the base substrate, which will be described below, the base substrate BS can be formed by removing the portion of the preliminary base substrate P-BS that does not overlap with the light-blocking layer LSL. The thickness of the preliminary base substrate P-BS can be greater than or equal to about 0.1 mm and less than about 0.3 mm. For example, in an embodiment, the preliminary base substrate P-BS can have a thickness of about 0.2 mm. In the etching process, the fluorine solution, as the etchant, can be applied only to the lower surface of the mother substrate. In the etching process, the upper surface of the mother substrate can be protected by a protective film, or the etchant can be provided only to the lower surface of the mother substrate. Therefore, only the target surface, such as the lower surface of the mother substrate, can be etched.
[0114] In process S200, the display layer EDL, including the light-emitting element, is formed on the upper surface of the preliminary base substrate P-BS, with the upper surface of the preliminary base substrate P-BS facing the lower surface of the preliminary base substrate P-BS. Prior to process S200, a process for forming the circuit layer DP-CL may be performed. After process S200, a process for forming the encapsulation layer TFE and / or a process for forming the optical component PP may be performed.
[0115] refer to Figure 10 The initial base substrate P-BS can be divided into layers that are not the final light-blocking layer LSL (see [link to relevant documentation]). Figure 13 The outer preliminary base substrate P-BS-O overlaps with the edge light-blocking portion LSL-E (see...). Figure 12 The overlapping edges of the initial base substrate P-BS-E and the internal light-blocking portion LSL-I (see) Figure 12 The overlapping internal preliminary base substrate P-BS-I.
[0116] Based on their overlapping positions with the initial base substrate P-BS, fluorine films FF can be divided into external fluorine films FF-O (overlapping with the external initial base substrate P-BS-O), edge fluorine films FF-E (overlapping with the edge initial base substrate P-BS-E), and internal fluorine films FF-I (overlapping with the internal initial base substrate P-BS-I).
[0117] Figure 10 This is a view showing process S300, which forms the first edge light-blocking portion. (Reference) Figure 10 In process S300, which forms the first edge light-blocking portion, the first edge light-blocking portion LSL-E1 is formed on a portion of the lower surface of the fluorine film FF. This portion may overlap with the initial base substrate P-BS-E and the edge fluorine film FF-E. The first edge light-blocking portion LSL-E1 can be formed by providing a portion of the fluorine film FF with black resin BR.
[0118] Figure 11 This is a view showing process S400, which performs the N2 plasma process. (Reference) Figure 11 In process S400, which performs the N2 plasma process, the fluorine film FF is treated with N2 plasma from below the preliminary base substrate P-BS (i.e., in the direction toward the lower surface of the preliminary base substrate P-BS). Since nitrogen free radicals generated in the plasma state combine with fluorine to form volatile compounds such as NF3, the fluorine film in the areas exposed to the N2 plasma can be removed. Specifically, when the fluorine film FF is treated with N2 plasma from below the preliminary base substrate P-BS, the outer fluorine film FF-O and the inner fluorine film FF-I, except for the edge fluorine film FF-E which is covered by the first edge light-blocking portion LSL-E1, can be removed.
[0119] For example, in an embodiment of the display module manufacturing method, process S400, which performs the N2 plasma process, can be performed under conditions where N2 is generated at 400 liters per minute (LPM), clean dry air (CDA) at 4 liters per minute (LPM), and a plasma generation power of 1.36 kilowatts (kW). In process S400, the fluorine film in the areas exposed to the N2 plasma can be removed.
[0120] Figure 12 This is a view showing process S500 for forming the light-blocking layer. (Reference) Figure 12In process S500, which forms the light-blocking layer, a light-blocking layer LSL is formed by providing black resin BR to the lower surface of the first edge light-blocking portion LSL-E1 and the lower surface of the preliminary base substrate P-BS exposed after the N2 plasma process. This light-blocking layer includes the first edge light-blocking portion LSL-E1, a second edge light-blocking portion LSL-E2 overlapping with the first edge light-blocking portion LSL-E1, and an inner light-blocking portion LSL-I that does not overlap with the first edge light-blocking portion LSL-E1. Specifically, the second edge light-blocking portion LSL-E2 can overlap with the first edge light-blocking portion LSL-E1, the edge fluorine film FF-E, and the edge preliminary base substrate P-BS-E, and the inner light-blocking portion LSL-I can overlap with the inner preliminary base substrate P-BS-I. In the process of providing the black resin BR, the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I can be integrally formed into a single, inseparable component. In embodiments where the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I are integrally formed as a single, indivisible component to create a single structure, the light-blocking layer LSL can exhibit high durability characteristics.
[0121] refer to Figure 12 In process S500, the lower surface LSL-Ed of the exposed second edge light-blocking portion LSL-E2 and the lower surface LSL-Id of the inner light-blocking portion LSL-I can be formed on the same plane or coplanar. Due to the structure of the edge fluorine film FF-E and the first edge light-blocking portion LSL-E1, edge control of the black resin BR is facilitated when forming the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I. Therefore, the lower surface LSL-Ed of the exposed second edge light-blocking portion LSL-E2 and the lower surface LSL-Id of the inner light-blocking portion LSL-I can be formed on the same plane or coplanar. That is, the lower surface LSLd of the light-blocking layer LSL can be formed as a flat surface. In this embodiment where the lower surface LSLd of the light-blocking layer LSL is a flat surface, light leakage in the display module can be improved. Therefore, the display module can exhibit high display quality, and edge margin can be increased during the manufacturing process of the display module. The phrase "increased edge margin" can mean that by improving the slope at the edge of the light-blocking layer, waste material at the edge of the light-blocking layer is reduced in the manufacturing process of the display module, and thus the display module can be manufactured more efficiently.
[0122] Figure 13 This is a view showing process S600 for forming the base substrate. (Reference) Figure 13In process S600, which forms the base substrate, the base substrate BS can be formed by removing the portion of the preliminary base substrate P-BS that does not overlap with the light-blocking layer LSL. The portion of the preliminary base substrate P-BS that does not overlap with the light-blocking layer LSL and is removed can be the outer preliminary base substrate P-BS-O. Therefore, the protruding portion of the preliminary base substrate that does not overlap with other components of the display module can be removed from the final manufactured display module.
[0123] In this embodiment, process S300, which forms the first edge light-blocking portion, and process S500, which forms the light-blocking layer, may each include a process of printing black resin BR. Therefore, the first edge light-blocking portion LSL-E1, the second edge light-blocking portion LSL-E2, and the inner light-blocking portion LSL-I may each include a black colorant. In this embodiment, because it includes a process of printing black resin, the light-blocking layer can be easily formed in the desired area.
[0124] In this embodiment, process S300, which forms the first edge light-blocking portion, and process S500, which forms the light-blocking layer, may each include a process of curing the printed black resin after the process of printing the black resin. In the process of curing the printed black resin, ultraviolet (UV) light or heat can be used to cure the black resin.
[0125] In one embodiment, during process S500 of forming the light-blocking layer, the inner light-blocking portion LSL-I can be formed in a rectangular shape on a plane parallel to the lower surface of the initial base substrate P-BS. In another embodiment, the edge light-blocking portion LSL-E can be formed around the inner light-blocking portion LSL-I, such that the light-blocking layer LSL has a rectangular shape on the plane.
[0126] In an embodiment of the display module manufacturing method S10, a first edge light-blocking portion LSL-E1 is formed under a fluorine film FF, and then an N2 plasma process is performed from under a preliminary base substrate P-BS. In the process of forming the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I, the edge fluorine film FF-E and the first edge light-blocking portion LSL-E1 can serve as structures for edge control. Therefore, this structure facilitates edge control of the material (e.g., black resin) of the second edge light-blocking portion LSL-E2 and the inner light-blocking portion LSL-I. Consequently, the occurrence of slopes at the edges of the light-blocking layer LSL can be improved, and edge margin can be increased during the manufacturing process.
[0127] In this embodiment, as described above, the display module may include an edge fluorine film disposed on an outer portion of the lower surface of the base substrate and a light-blocking layer comprising an edge light-blocking portion and an inner light-blocking portion. Therefore, light leakage of the display module can be reduced, and its intensity can be improved.
[0128] The implementation of the display module manufacturing method may include a process for forming a first edge light-blocking portion, a process for performing an N2 plasma process, and a process for forming a light-blocking layer. Therefore, edge control of the light-blocking layer can be facilitated. Therefore, the occurrence of slopes at the edges of the light-blocking layer can be improved.
[0129] The implementation of the electronic device may include the above-described display module, and may exhibit improved durability and high display quality.
[0130] This invention should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.
[0131] While the invention has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made herein without departing from the spirit or scope of the invention as defined by the appended claims.
Claims
1. A display module, comprising: Basic substrate; A display layer is disposed on the base substrate, wherein the display layer includes a light-emitting element; An edge fluorine film is disposed on the outer portion of the lower surface of the base substrate, the lower surface of the base substrate facing the upper surface of the base substrate; and The light-blocking layer includes an edge light-blocking portion that overlaps with the edge fluorine film and an inner light-blocking portion disposed on the lower surface of the base substrate that does not overlap with the edge fluorine film.
2. The display module according to claim 1, wherein, The edge light-blocking portion includes: The first edge light-blocking portion is directly disposed on the lower surface of the edge fluorine film; and The second edge light blocking portion is directly disposed on the lower surface of the first edge light blocking portion.
3. The display module according to claim 2, wherein, The second edge light-blocking portion and the inner light-blocking portion are integrally formed into a single, inseparable component.
4. The display module according to claim 1, wherein, The lower surface of the light-blocking layer is a flat surface.
5. The display module according to claim 1, wherein, The edge light-blocking portion has a smaller thickness than the inner light-blocking portion.
6. The display module according to claim 1, wherein, The base substrate includes glass.
7. The display module according to claim 1, wherein, The light-blocking layer includes a black colorant.
8. The display module according to claim 1, wherein, The internal light-blocking portion has a rectangular shape in the plan view, and The edge light-blocking portion is configured to surround the inner light-blocking portion, such that the light-blocking layer has a rectangular shape in the plan view.
9. The display module according to claim 1, wherein, The edge light-blocking portion has a width greater than or equal to 0.1 mm and less than 2 mm in the plan view.
10. A method for manufacturing a display module, the method comprising: A preliminary base substrate and a fluorine film on the lower surface of the preliminary base substrate are formed by etching the lower surface of the mother substrate with a fluorine solution. A display layer including light-emitting elements is formed on the upper surface of the preliminary base substrate, the upper surface of the preliminary base substrate facing the lower surface of the preliminary base substrate; A first edge light-blocking portion is formed on a portion of the lower surface of the fluorine film; The fluorine film is treated with N2 plasma from below the initial base substrate; A light-blocking layer is formed by providing black resin to the lower surface of the first edge light-blocking portion and the lower surface of the preliminary base substrate exposed after the fluorine film has been treated with N2 plasma. The light-blocking layer includes the first edge light-blocking portion, a second edge light-blocking portion overlapping the first edge light-blocking portion, and an inner light-blocking portion not overlapping the first edge light-blocking portion. as well as The base substrate is formed by removing the portion of the preliminary base substrate that does not overlap with the light-blocking layer.
11. The method according to claim 10, wherein, When the light-blocking layer is formed, the exposed lower surface of the second edge light-blocking portion and the exposed lower surface of the inner light-blocking portion are formed on the same plane.
12. The method according to claim 10, wherein, The mother substrate includes glass.
13. The method according to claim 10, wherein, Forming the first edge light-blocking portion and forming each of the light-blocking layers includes printing the black resin.
14. The method of claim 10, wherein, When the light blocking layer is formed, the inner light blocking portion has a rectangular shape in the plan view, and the first edge light blocking portion and the second edge light blocking portion are respectively formed to surround the inner light blocking portion, so that the light blocking layer has a rectangular shape in the plan view.
15. The method according to claim 10, wherein, When the first edge light blocking portion is formed, the first edge light blocking portion has a width greater than or equal to 0.1 mm and less than 2 mm in the plan view.
16. An electronic device comprising: Display module, generates images. The display module includes: Basic substrate; A display layer is disposed on the base substrate, wherein the display layer includes a light-emitting element; An edge fluorine film is disposed on the outer portion of the lower surface of the base substrate, the lower surface of the base substrate facing the upper surface of the base substrate; and The light-blocking layer includes an edge light-blocking portion that overlaps with the edge fluorine film and an inner light-blocking portion disposed on the lower surface of the base substrate that does not overlap with the edge fluorine film.
17. The electronic device according to claim 16, wherein, The edge light-blocking portion includes: The first edge light-blocking portion is directly disposed on the lower surface of the edge fluorine film; and The second edge light blocking portion is directly disposed on the lower surface of the first edge light blocking portion.
18. The electronic device according to claim 17, wherein, The second edge light-blocking portion and the inner light-blocking portion are integrally formed into a single, inseparable component.
19. The electronic device according to claim 16, wherein, The electronic device also includes: It is selected from at least one of the processor, memory, and power module.
20. The electronic device according to claim 16, wherein, The electronic device is a television, monitor, billboard, personal computer, laptop computer, personal digital assistant, vehicle device, game console, smartphone, tablet computer, smartwatch, or camera.
Citation Information
Patent Citations
Communication methods and devices
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