Display panel, method of manufacturing display panel, and display device

Abstract

This application discloses a display panel, a method for fabricating the display panel, and a display device. The display panel has a bent region and a non-bent region. The display panel includes: an array substrate located in the bent region and the non-bent region, including a substrate, a first planarization layer disposed on one side of the substrate, and a signal line layer disposed between the substrate and the first planarization layer; a pixel definition layer disposed on the side of the first planarization layer away from the array substrate, including a pixel defining portion located in the non-bent region and a protective portion located in the bent region, the pixel defining portion enclosing a plurality of pixel openings, and the first planarization layer, at least partially located in the bent region, being located between the protective portion and the signal line layer; a plurality of light-emitting devices, at least partially located in the corresponding pixel openings; and a touch function layer disposed on the side of the plurality of light-emitting devices away from the array substrate.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display panel, a method for preparing a display panel, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide application range, becoming the mainstream display devices. In the traditional display panel manufacturing process, a fine mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also has problems such as limited precision, high development costs, and long development cycles. Maskless technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN117580403A, CN118678743A, CN118660490A, CN118678724A, CN118678806A, CN118742084A, and CN118946184A describe relevant content of maskless technology and are provided for reference.

[0003] However, the current manufacturing process of OLED display products needs improvement. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the display panel, and a display device, which only improves the structural stability of the display panel.

[0005] An embodiment of the first aspect of this application provides a display panel having a bent area and a non-bent area. The display panel includes: an array substrate located in the bent area and the non-bent area, including a substrate, a first planarization layer disposed on one side of the substrate, and a signal line layer disposed between the substrate and the first planarization layer; a pixel definition layer disposed on the side of the first planarization layer away from the array substrate, including a pixel defining portion located in the non-bent area and a protective portion located in the bent area, the pixel defining portion enclosing a plurality of pixel openings, the first planarization layer at least partially located in the bent area being located between the protective portion and the signal line layer; a plurality of light-emitting devices, at least partially located in corresponding pixel openings; and a touch function layer disposed on the side of the plurality of light-emitting devices away from the array substrate.

[0006] According to an embodiment of the first aspect of this application, the bending area includes a main bending area and a first transition area located between the main bending area and the non-bending area, and the protective part is located in the first transition area.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the signal line layer extends from the first transition region to the bending main region, and the orthogonal projection of the signal line layer in the first transition region onto the substrate is located within the orthogonal projection of the protective portion onto the substrate.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the touch functional layer includes a first touch layer, a second touch layer, and a dielectric layer disposed between the first touch layer and the second touch layer, wherein the dielectric layer extends to the side of the protective portion away from the array substrate.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the dielectric layer has a connecting hole, and at least a portion of the first touch layer and the second touch layer are electrically connected through the connecting hole.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the material of the dielectric layer includes inorganic materials.

[0011] According to any of the foregoing embodiments of the first aspect of this application, at least a portion of the surface of the dielectric layer on the side away from the non-bending region is coplanar with at least a portion of the surface of the protective portion on the side away from the non-bending region.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the protective portion and the pixel limiting portion are provided at intervals.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes an encapsulation layer disposed between the light-emitting device and the touch function layer, the encapsulation layer extending to the space between the protective portion and the pixel limiting portion.

[0014] According to any of the foregoing embodiments of the first aspect of this application, in the direction away from the array substrate, the encapsulation layer includes a first encapsulation layer, a second encapsulation layer and a third encapsulation layer stacked sequentially, with the third encapsulation layer partially extending between the protection portion and the pixel defining portion.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the array substrate further includes a second planarization layer disposed between the substrate and the first planarization layer, and a signal line layer disposed between the first planarization layer and the second planarization layer.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the non-bending area includes a display area and a second transition area located between the display area and the bending area, the material of the pixel definition layer includes an inorganic material, and the pixel defining portion extends from the display area to the second transition area.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes an isolation structure disposed on one side of the array substrate. The isolation structure surrounds an isolation opening formed in communication with the pixel opening. The light-emitting device portion extends from the pixel opening to the isolation opening. The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the array substrate. The second isolation portion protrudes out of the first isolation portion toward the isolation opening.

[0018] A second aspect of this application provides a method for manufacturing a display panel, the display panel having a bending region and a non-bending region, the method comprising:

[0019] A signal line layer and a first planarization layer are sequentially fabricated on a substrate to form an array substrate located in the bending region and the non-bending region;

[0020] A pixel-defining material layer located in the bending region and the non-bending region is fabricated on the array substrate;

[0021] The pixel definition material layer is patterned and multiple light-emitting devices are formed to obtain a pixel defining part located in the non-bending area and a protective material part located in the bending area. The pixel defining part surrounds and forms multiple pixel openings. The multiple light-emitting devices are at least partially located in the corresponding pixel openings. The first planarization layer, which is at least partially located in the bending area, is located between the protective material part and the signal line layer.

[0022] A touch-enabled layer is fabricated on the side of the array substrate away from multiple light-emitting devices.

[0023] According to an embodiment of the second aspect of this application, after the step of fabricating a touch functional layer on the side of the plurality of light-emitting devices away from the array substrate, the method further includes:

[0024] Remove part of the protective material in the bending area to obtain the protective part.

[0025] According to any of the foregoing embodiments of the second aspect of this application, the bending region includes a main bending region and a first transition region located between the main bending region and the non-bending region, and removing at least a portion of the protective material portion within the bending region includes:

[0026] Remove the protective material from the main bending area.

[0027] According to any of the foregoing embodiments of the second aspect of this application, fabricating a touch functional layer on the side of the plurality of light-emitting devices away from the array substrate includes:

[0028] A first touch layer is fabricated on the side of the array substrate away from the multiple light-emitting devices;

[0029] A dielectric material layer is prepared on the side of the first touch layer away from the array substrate, and the dielectric material layer extends to the side of the protective material portion away from the array substrate.

[0030] A connecting hole is formed in the dielectric material layer, and at least a portion of the first touch layer is exposed through the connecting hole;

[0031] A second touch layer is fabricated on the side of the dielectric material layer facing away from the array substrate.

[0032] According to any of the foregoing embodiments of the second aspect of this application, forming a connecting hole on the dielectric material layer includes:

[0033] Remove part of the dielectric material layer in the bending area to obtain the dielectric layer.

[0034] According to any of the foregoing embodiments of the second aspect of this application, the bending region includes a main bending region and a first transition region located between the main bending region and the non-bending region, and removing at least a portion of the dielectric material layer within the bending region includes:

[0035] Remove the dielectric material layer within the bent main area.

[0036] According to any of the foregoing embodiments of the second aspect of this application, after the step of preparing a pixel-defining material layer located in the bending region and the non-bending region on the array substrate, the method further includes:

[0037] An isolation material layer is formed on the side of the pixel definition material layer away from the array substrate;

[0038] Patterning the pixel-defined material layer to form multiple light-emitting devices includes:

[0039] The isolation material layer is patterned to form a first opening, and the pixel definition material layer is patterned to form a pixel opening connected to the first opening.

[0040] The first device material is prepared across the entire surface.

[0041] Remove the first device material outside the first opening to form a first type of device.

[0042] According to any of the foregoing embodiments of the second aspect of this application, after the step of preparing the first device material across the entire surface, the method further includes:

[0043] The first packaging material is fabricated on the entire surface of the first device material;

[0044] Remove the first encapsulation material outside the first opening to form the first encapsulation unit.

[0045] According to any of the foregoing embodiments of the second aspect of this application, patterning a pixel-defining material layer to form a plurality of light-emitting devices includes:

[0046] The isolation material layer is patterned to form a second opening, and the pixel definition material layer is patterned to form a pixel opening connected to the second opening;

[0047] Fabrication of the second device material across the entire surface;

[0048] Remove the second device material outside the second opening to form a second type of device.

[0049] According to any of the foregoing embodiments of the second aspect of this application, after the step of preparing the second device material across the entire surface, the method further includes:

[0050] A second packaging material is fabricated on the entire surface of the second device material;

[0051] Remove the second encapsulation material outside the second opening to form a second encapsulation unit.

[0052] According to any of the foregoing embodiments of the second aspect of this application, patterning a pixel-defining material layer to form a plurality of light-emitting devices includes:

[0053] The isolation material layer is patterned to form a third opening, and the pixel definition material layer is patterned to form a pixel opening connected to the third opening.

[0054] The third device material is prepared on the entire surface;

[0055] Remove the third device material outside the third opening to form a third type of device.

[0056] According to any of the foregoing embodiments of the second aspect of this application, after the step of preparing the third device material across the entire surface, the method further includes:

[0057] A third packaging material is fabricated on the entire surface of the third device material;

[0058] Remove the second encapsulation material outside the third opening to form the third encapsulation unit.

[0059] According to any of the foregoing embodiments of the second aspect of this application, patterning the isolation material layer to form a third opening, and patterning the pixel definition material layer to form a pixel opening communicating with the third opening, includes:

[0060] Remove part of the pixel definition material layer to make the pixel limiting part and the protective material part spaced apart.

[0061] According to any of the foregoing embodiments of the second aspect of this application, after the step of removing the third device material outside the third opening to form the third type of device, the method further includes:

[0062] Fabricate the second encapsulation layer;

[0063] A third encapsulation layer is prepared, which extends to the space between the protective material portion and the pixel defining portion.

[0064] An embodiment of the third aspect of this application provides a display device, including a display panel of any of the above embodiments, or a display panel prepared by the preparation method of any of the above embodiments.

[0065] In a display panel provided in this application embodiment, the display panel has a bending area and a non-bending area. The display panel located in the bending area can be bent relative to the display panel located in the non-bending area. The display panel includes an array substrate, a pixel definition layer, light-emitting devices, and a touch function layer. The array substrate is located in the bending area and the non-bending area. The array substrate includes a substrate, a first planarization layer disposed on one side of the substrate, and a signal line layer disposed between the substrate and the first planarization layer. The first planarization layer can be used to protect the signal line layer. The pixel definition layer is disposed on the side of the first planarization layer away from the array substrate. The pixel definition layer includes a pixel defining portion located in the non-bending area and a protective portion located in the bending area. The pixel defining portion encloses to form a plurality of pixel openings. The light-emitting devices are at least partially located in the corresponding pixel openings. The pixel defining portion can be used to participate in dividing the sub-pixels of the display panel. The touch function layer is disposed on the side of the plurality of light-emitting devices away from the array substrate. The touch function layer can be used to realize the touch operation of the display panel.

[0066] By setting a first planarization layer, at least partially located in the bending region, between the protective portion and the signal line layer, the protective portion can be used to protect the underlying first planarization layer and signal line layer during the fabrication of the display panel. This effectively limits the etching material's damage to the first planarization layer and signal line layer, thereby improving the structural stability of the display panel. Attached Figure Description

[0067] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0068] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0069] Figure 2 This is a partial cross-sectional view of a display panel provided in an embodiment of this application;

[0070] Figure 3 This is a partial cross-sectional view of a display panel provided in another embodiment of this application;

[0071] Figure 4 This is a schematic flowchart of a method for preparing a display panel provided in an embodiment of this application;

[0072] Figures 5 to 25 This is a schematic diagram of the preparation process of a method for preparing a display panel provided in an embodiment of this application.

[0073] Explanation of reference numerals in the attached figures:

[0074] 10. Display panel; 11. Pixel defining material layer; 11a. Pixel limiting material section; 11b. Protective material section; 12. Isolation material layer; 12a. First isolation material layer; 12b. Second isolation material layer; 12c. Third isolation material layer; 13. Dielectric material layer;

[0075] 100, Array substrate; 110, Substrate; 120, First insulating layer; 130, Second insulating layer; 140, Second planarization layer; 150, Driving circuit; 151, Transistor; 151a, Gate; 151b, Source / drain; 152, Storage capacitor; 152a, First electrode; 152b, Second electrode; 160, First planarization layer; 170, Signal line layer;

[0076] 200, Pixel definition layer; 210, Pixel limiting section; 210a, Pixel opening; 220, Protection section;

[0077] 300, Isolation structure; 301, Isolation opening; 301a, First opening; 301b, Second opening; 301c, Third opening; 310, First isolation part; 320, Second isolation part; 330, Conductive part;

[0078] 400. Light-emitting device; 401. Type I device; 402. Type II device; 403. Type III device; 410. First electrode; 420. Light-emitting functional layer; 430. Second electrode;

[0079] 500, Encapsulation layer; 510, First encapsulation layer; 511, First encapsulation unit; 512, Second encapsulation unit; 513, Third encapsulation unit; 520, Second encapsulation layer; 530, Third encapsulation layer;

[0080] 600, Touch function layer; 610, First touch layer; 620, Second touch layer; 630, Dielectric layer; 630a, Connecting hole;

[0081] BA, bending zone; BA1, main bending zone; BA2, first transition zone;

[0082] PA, non-bending area; PA1, display area; PA2, second transition area;

[0083] CA, connection area. Detailed Implementation

[0084] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0085] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0086] It should be understood that when describing the structure of a component, when referring to a layer or area as being "above" or "on top of" another layer or area, it can mean that it is directly above the other layer or area, or that it contains other layers or areas between itself and the other layer or area. Furthermore, if the component is flipped over, that layer or area will be located "below" or "under" the other layer or area.

[0087] This application provides a display panel, a method for preparing the display panel, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, the method for preparing the display panel, and the display device.

[0088] Figure 1 This is a schematic diagram of the structure of a display panel 10 provided in an embodiment of this application. Figure 2 This is a partial cross-sectional view of a display panel 10 provided in an embodiment of this application. Figure 3 This is a partial cross-sectional view of a display panel 10 provided in another embodiment of this application. Exemplary, Figure 2 A partial cross-sectional view of the display panel 10 within the non-bending area PA can be shown. Figure 3 A partial cross-sectional view of the display panel 10 at the junction of the bent area BA and the non-bent area PA can be shown.

[0089] like Figures 1 to 3As shown, an embodiment of the first aspect of this application provides a display panel 10, which has a bent area BA and a non-bent area PA. The display panel 10 includes: an array substrate 100 located in the bent area BA and the non-bent area PA, including a substrate 110, a first planarization layer 160 disposed on one side of the substrate 110, and a signal line layer 170 disposed between the substrate 110 and the first planarization layer 160; a pixel definition layer 200 disposed on the side of the first planarization layer 160 away from the array substrate 100, including a pixel defining portion 210 located in the non-bent area PA and a protective portion 220 located in the bent area BA, wherein the pixel defining portion 210 encloses to form a plurality of pixel openings 210a, and the first planarization layer 160 located at least partially in the bent area BA is located between the protective portion 220 and the signal line layer 170; a plurality of light-emitting devices 400, at least partially located in the corresponding pixel openings 210a; and a touch function layer 600 disposed on the side of the plurality of light-emitting devices 400 away from the array substrate 100.

[0090] In a display panel 10 provided in this application embodiment, the display panel 10 has a bending area BA and a non-bending area PA. The display panel 10 located in the bending area BA can be bent relative to the display panel 10 located in the non-bending area PA.

[0091] The display panel 10 includes an array substrate 100, a pixel definition layer 200, a light-emitting device 400, and a touch function layer 600. The array substrate 100 is located in the bending region BA and the non-bending region PA. The array substrate 100 includes a substrate 110, a first planarization layer 160 disposed on one side of the substrate 110, and a signal line layer 170 disposed between the substrate 110 and the first planarization layer 160. The first planarization layer 160 can be used to protect the signal line layer 170.

[0092] Optionally, the signal line layer 170 may be located only in the bending region BA, or the signal line layer 170 may be partially located in the non-bending region PA and partially located in the bending region BA. This application does not specifically limit it.

[0093] Optionally, the first planarization layer 160 is located between the bending area BA and the non-bending area PA. The first planarization layer 160 located in the non-bending area PA can be used to perform a planarization function. The first planarization layer 160 located in the bending area BA can better follow the bending of the display panel 10 and provide better protection for the signal line layer 170.

[0094] Optionally, the material of the first planarization layer 160 may include an organic material, so that during the fabrication of the display panel 10, the surface of the first planarization layer 160 facing away from the substrate 110 can be relatively flat and smooth, facilitating subsequent fabrication on the first planarization layer 160. Furthermore, by including an organic material in the material of the first planarization layer 160, the first planarization layer 160 can have better bending performance, allowing for better bending within the bending region BA. This also ensures that when the signal line layer 170 located within the bending region BA is bent, the first planarization layer 160 does not easily interfere with the bending of the signal line layer 170, and provides better protection for the signal line layer 170.

[0095] Optionally, the array substrate 100 further includes a second planarization layer 140 disposed between the substrate 110 and the first planarization layer 160, and the signal line layer 170 may be disposed between the first planarization layer 160 and the second planarization layer 140. The first planarization layer 160 and the second planarization layer 140 on both sides of the signal line layer 170 can provide better protection for the signal line layer 170.

[0096] Optionally, the material of the second planarization layer 140 may include an organic material, so that the second planarization layer 140 has good bending performance, which makes it easy for the second planarization layer 140 in the bending region BA to be bent well, and makes it less likely for the second planarization layer 140 to interfere with the bending of the signal line layer 170 when the signal line layer 170 located in the bending region BA is bent, and can provide better protection for the signal line layer 170.

[0097] Optionally, the array substrate 100 can be configured in various ways. For example, the array substrate 100 may include a driving circuit 150 disposed between the first planarization layer 160 and the substrate 110. Exemplarily, the driving circuit 150 may include a transistor 151, a storage capacitor 152, and driving signal lines for connecting various devices. The transistor 151 may include a semiconductor, a gate 151a, and source / drain electrodes 151b. The storage capacitor 152 may include a first electrode 152a and a second electrode 152b.

[0098] As an example, in the direction away from the substrate 110, the array substrate 100 may further include a first insulating layer 120 and a second insulating layer 130 stacked on the substrate 110. The second planarization layer 140 and the first planarization layer 160 may both be located on the side of the second insulating layer 130 facing away from the substrate 110. The gate 151a and the first electrode 152a may be located on the side of the first insulating layer 120 facing the substrate 110, the second electrode 152b may be located between the first insulating layer 120 and the second insulating layer 130, and the source / drain electrode 151b may be located between the second insulating layer 130 and the second planarization layer 140.

[0099] Optionally, the signal line layer 170 can be used to transmit any signals required for the display panel 10 to operate. For example, the signal line layer 170 can be used to transmit data signals or control signals.

[0100] For example, the driving circuit 150 may include data signal lines, and the signal line layer 170 may be connected to the data signal lines and used to transmit data signals; and / or, the driving circuit 150 may include control signal lines, and the signal line layer 170 may be connected to the control signal lines and used to transmit control signals; and / or, the driving circuit 150 may include power lines, and the signal line layer 170 may be connected to the power lines and used to transmit power signals.

[0101] Optionally, the bending area BA may include a bending main area BA1 and a first transition area BA2 located between the bending main area BA1 and the non-bending area PA. The display panel 10 in the bending main area BA1 may have a greater degree of bending, while the display panel 10 located in the first transition area BA2 connected to the non-bending area PA may have a lower degree of bending, or the display panel 10 located in the first transition area BA2 connected to the non-bending area PA may not be bent.

[0102] Optionally, the signal line layer 170 may extend from the first transition region BA2 to the bending main region BA1. For example, the signal line layer 170 and other device structures (such as the signal lines in the aforementioned drive circuit 150) can be electrically connected within the first transition region BA2, which has a lower degree of bending, thereby improving the stability of the electrical connection between the signal line layer 170 and other device structures.

[0103] Optionally, the display panel 10 may also have a connection area CA, and a bending area BA may be located between the connection area CA and the non-bending area PA. The display panel 10 located in the connection area CA can be used to connect with a driver IC (Driver Integrated Circuit). For example, the signal line layer 170 may also extend from the bending area BA into the connection area CA, so that after the display panel 10 is connected to the driver chip, the signals used to participate in realizing the light emission of the display panel 10 can be transmitted to the driving circuit 150 in the display area PA1 through the signal line layer 170.

[0104] Optionally, the display panel 10 located in the connection area CA can be bent from the display panel 10 in the bending area BA to the side of the substrate 110 of the display panel 10 in the non-bending area PA that is away from the first planarization layer 160, so that the display panel 10 in the connection area CA can be electrically connected to the driving chip used to drive the display panel 10 to emit light.

[0105] The pixel definition layer 200 is disposed on the side of the first planarization layer 160 away from the array substrate 100. The pixel definition layer 200 includes a pixel limiting portion 210 located in the non-bending region PA and a protective portion 220 located in the bending region BA. The pixel limiting portion 210 surrounds and forms a plurality of pixel openings 210a. The light-emitting device 400 is at least partially located in the corresponding pixel opening 210a. The pixel limiting portion 210 can be used to participate in the division of sub-pixels of the display panel 10.

[0106] Optionally, in the direction away from the array substrate 100, the light-emitting device 400 may include a first electrode 410, a light-emitting functional layer 420 and a second electrode 430 stacked sequentially.

[0107] Optionally, the light-emitting functional layer 420 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting structure, an electron injection layer (EIL), and an electron transport layer (ETL).

[0108] Optionally, the first electrode 410 and the second electrode 430 can serve as pixel electrodes of the display panel 10. One of the first electrode 410 and the second electrode 430 can serve as an anode, and the other can serve as a cathode to drive the light-emitting functional layer 420 to emit light. In this embodiment, the first electrode 410 is used as the anode of the display panel 10, and the second electrode 430 is used as the cathode of the display panel 10 for illustrative purposes.

[0109] Optionally, the light-emitting device 400 may include a first type of device 401, a second type of device 402, and a third type of device 403 that emit different colors of light, so as to realize the color light-emitting display of the display panel 10. For example, the first type of device 401 may be a blue light-emitting device 400, the second type of device 402 may be a green light-emitting device 400, and the third type of device 403 may be a red light-emitting device 400.

[0110] Optionally, some transistors 151 in the array substrate 100 may be electrically connected to the light-emitting device 400 and used to provide driving current to the light-emitting device 400 to drive the light-emitting device 400 to emit light. For example, the source and drain terminals 151b of some transistors 151 may be electrically connected to the first electrode 410 of the light-emitting device 400.

[0111] Optionally, the light-emitting device 400 is at least partially located within the corresponding pixel opening 210a. This can mean that a single light-emitting device 400 can be provided for a single pixel opening 210a. The light-emitting functional layer 420 and the second electrode 430 of the light-emitting device 400 can be partially located within the pixel opening 210a. The pixel limiting portion 210 can be located between adjacent first electrodes 410. At least a portion of the surface of the first electrode 410 on the side facing away from the array substrate 100 can be exposed from the pixel opening 210a and connected to the light-emitting functional layer 420 within the pixel opening 210a.

[0112] Optionally, the display panel 10 may also include an isolation structure 300 disposed on one side of the array substrate 100. The isolation structure 300 surrounds an isolation opening 301 formed in communication with the pixel opening 210a. A portion of the light-emitting device 400 extends from the pixel opening 210a into the isolation opening 301. The isolation structure 300 may also be used to participate in dividing the sub-pixels of the display panel 10.

[0113] Optionally, the light-emitting device 400 may extend from the pixel opening 210a into the isolation opening 301. This may refer to the light-emitting functional layer 420 and the second electrode 430 of the light-emitting device 400 extending from the pixel opening 210a into the isolation opening 301.

[0114] Optionally, a single isolation opening 301 may be connected to a single pixel opening 210a. Optionally, both the isolation structure 300 and the pixel limiting portion 210 may be mesh-like, with at least a portion of the hollowed-out area in the mesh-like isolation structure 300 serving as the isolation opening 301, and at least a portion of the hollowed-out area in the mesh-like pixel limiting portion 210 serving as the pixel opening 210a.

[0115] Optionally, the isolation opening 301 may include a first opening 301a, a second opening 301b, and a third opening 301c. A first type of device 401 may be configured corresponding to the first opening 301a, a second type of device 402 may be configured corresponding to the second opening 301b, and a third type of device 403 may be configured corresponding to the third opening 301c.

[0116] Optionally, the relative positions of the pixel defining portion 210 and the isolation structure 300 can be arranged in various ways. For example, the isolation structure 300 can be disposed on the side of the pixel defining portion 210 facing away from the array substrate 100, that is, the isolation structure 300 can be directly disposed on the pixel defining portion 210. Or, for example, the pixel defining portion 210 can have a receiving groove (not shown in the figure), and at least a portion of the isolation structure 300 can be located in the receiving groove, so that the isolation structure 300 is less likely to have an excessive height relative to the array substrate 100, thereby effectively reducing the thickness of the display panel 10. For ease of description, the following embodiments will be described using the example of the isolation structure 300 being disposed on the side of the pixel defining portion 210 facing away from the array substrate 100.

[0117] Optionally, the isolation structure 300 includes a first isolation portion 310 and a second isolation portion 320 located on the side of the first isolation portion 310 away from the array substrate 100, the second isolation portion 320 being disposed protruding from the first isolation portion 310 toward the isolation opening 301.

[0118] By providing the second isolation portion 320 protruding from the first isolation portion 310 toward the isolation opening 301, when fabricating the light-emitting device 400 of the display panel 10, a portion of the material of the light-emitting device 400 (e.g., the material of the light-emitting functional layer 420 and the material of the second electrode 430) can be directly vapor-deposited over the entire surface. The second isolation portion 320 can block at least a portion of the material used to fabricate the light-emitting device 400, thereby isolating the material of the light-emitting device 400 between adjacent isolation openings 301. This facilitates the formation of multiple light-emitting devices 400 spaced apart and located within different isolation openings 301. As a result, when fabricating the light-emitting device 400 of the display panel 10, it is not necessary to use a high-precision mask. For example, when vapor-depositing a portion of the material of the light-emitting device 400, it is not necessary to use a high-precision fine metal mask (FMM), thereby significantly reducing the production cost of the display panel 10.

[0119] Optionally, the isolation structure 300 can be used to shield and isolate the light-emitting device 400 to achieve the individual fabrication of light-emitting devices 400 of different colors. For example, the isolation structure 300 can be used to sequentially fabricate the first packaging unit 511, the first type of device 401, the second packaging unit 512, the second type of device 402, the third packaging unit 513, and the third type of device 403.

[0120] For example, the first electrode 410 of each light-emitting device 400 can be prepared first. Then, the material of the light-emitting functional layer 420 and the second electrode 430 in the first type of device 401 can be vapor-deposited over the entire surface. The isolation structure 300 can isolate part of the material of the light-emitting functional layer 420 and the second electrode 430 in the first type of device 401. Then, the material of the first encapsulation layer 510 is prepared over the entire surface. Then, the material of the first encapsulation layer 510 outside the first opening 301a is removed to form the first encapsulation unit 511. Then, the material of the second electrode 430 of the first type of device 401 and the material of the light-emitting functional layer 420 of the first type of device 401 outside the first opening 301a are removed in sequence to form the first type of device 401 corresponding to the first opening 301a.

[0121] Then, the materials of the light-emitting functional layer 420 and the second electrode 430 in the second type of device 402 are vapor-deposited across the entire surface. The isolation structure 300 can isolate part of the materials of the light-emitting functional layer 420 and the second electrode 430 in the second type of device 402. Then, the material of the first encapsulation layer 510 is prepared across the entire surface. Then, the material of the first encapsulation layer 510 outside the second opening 301b is removed to form the second encapsulation unit 512. Then, the materials of the second electrode 430 and the light-emitting functional layer 420 of the second type of device 402 outside the second opening 301b are removed in sequence to form the second type of device 402 corresponding to the second opening 301b.

[0122] Then, the materials of the light-emitting functional layer 420 and the second electrode 430 in the third type device 403 can be vapor-deposited across the entire surface. The isolation structure 300 can isolate part of the materials of the light-emitting functional layer 420 and the second electrode 430 in the third type device 403. Then, the material of the first encapsulation layer 510 is prepared across the entire surface. Then, the material of the first encapsulation layer 510 outside the third opening 301c is removed to form the third encapsulation unit 513. Then, the materials of the second electrode 430 and the light-emitting functional layer 420 of the third type device 403 outside the third opening 301c are removed in sequence to form the third type device 403 corresponding to the third opening 301c.

[0123] Optionally, the pixel definition layer 200 may be made of inorganic materials, which makes the pixel definition layer 200 less likely to absorb moisture. This makes it less likely for the pixel definition layer 200 to absorb liquid etching materials and expand during the fabrication of the display panel 10, for example, during the fabrication of the light-emitting device 400 using the isolation structure 300, thus giving the display panel 10 better structural stability.

[0124] Optionally, the material of the isolation structure 300 may include a conductive material, and the second electrode 430 may be connected to the isolation structure 300 so that the second electrodes 430 of adjacent light-emitting devices 400 can be electrically connected through the isolation structure 300 to facilitate the control of the second electrode 430.

[0125] Optionally, the second electrode 430 can be connected to the first isolation portion 310, so that the second electrodes 430 of adjacent sub-pixels can be electrically connected through the first isolation portion 310.

[0126] Optionally, the isolation structure 300 further includes a conductive portion 330 disposed on the side of the first isolation portion 310 facing the array substrate 100. The conductive portion 330 may protrude from the first isolation portion 310 toward the isolation opening 301, and the second electrode 430 may be connected to the conductive portion 330. By disposing the conductive portion 330 protruding from the first isolation portion 310 toward the isolation opening 301, the conductive portion 330 can have a larger area and facilitate connection with the second electrode 430, thereby facilitating the electrical connection between the second electrode 430 and the isolation structure 300.

[0127] The touch function layer 600 is disposed on the side of the multiple light-emitting devices 400 away from the array substrate 100. The touch function layer 600 can be used to realize the touch operation of the display panel 10.

[0128] Optionally, the display panel 10 may further include an encapsulation layer 500 disposed between the light-emitting device 400 and the touch function layer 600, the encapsulation layer 500 being used to encapsulate the light-emitting device 400. By disposing the touch function layer 600 above the encapsulation layer 500, signal interference between the touch function layer 600 and the light-emitting device 400 can be effectively reduced, and the encapsulation layer 500 can provide better protection for the light-emitting device 400 during the fabrication of the touch function layer 600.

[0129] Optionally, in the direction away from the array substrate 100, the encapsulation layer 500 includes a first encapsulation layer 510, a second encapsulation layer 520 and a third encapsulation layer 530 stacked in sequence, so that the encapsulation layer 500 can have a better encapsulation effect.

[0130] Optionally, the material of the first encapsulation layer 510 may include inorganic materials, so that the first encapsulation layer 510 can better restrict the intrusion of water vapor into the light-emitting device 400, thereby improving the encapsulation effect of the first encapsulation layer 510.

[0131] For example, the first encapsulation layer 510 can be prepared by chemical vapor deposition (CVD).

[0132] Optionally, the first encapsulation layer 510 may include a first encapsulation unit 511, a second encapsulation unit 512, and a third encapsulation unit 513 arranged at intervals from each other. The first encapsulation unit 511 may be disposed on the side of the first type of device 401 facing away from the array substrate 100, the second encapsulation unit 512 may be disposed on the side of the second type of device 402 facing away from the array substrate 100, and the third encapsulation unit 513 may be disposed on the side of the third type of device 403 facing away from the array substrate 100. The first encapsulation unit 511, the second encapsulation unit 512, and the third encapsulation unit 513 can be used to encapsulate the first type of device 401, the second type of device 402, and the third type of device 403 relatively independently.

[0133] Optionally, the material of the second encapsulation layer 520 may include an organic material, which allows the second encapsulation layer 520 to have good flowability during the fabrication of the display panel 10, and allows the surface of the second encapsulation layer 520 facing away from the array substrate 100 to have good flatness, facilitating the formation of subsequent film layers. For example, the second encapsulation layer 520 can be fabricated using inkjet printing (IJP) technology.

[0134] Optionally, the material of the third encapsulation layer 530 may include inorganic materials, thereby reducing the impact of moisture on the operation of the light-emitting device 400. For example, the third encapsulation layer 530 may be prepared using a chemical vapor deposition process.

[0135] Optionally, the touch function layer 600 can implement the touch function of the display panel 10 based on a mutual capacitive touch architecture or a self-capacitive touch architecture.

[0136] Optionally, the touch function layer 600 may include a first touch layer 610, a second touch layer 620, and a medium layer 630 disposed between the first touch layer 610 and the second touch layer 620.

[0137] Optionally, the dielectric layer 630 has a connecting hole 630a, through which at least a portion of the first touch layer 610 and the second touch layer 620 are electrically connected.

[0138] For example, the first touch layer 610 can serve as a bridging conductive structure in the display panel 10, and the second touch layer 620 can serve as a touch electrode, so that the touch electrodes in the second touch layer 620 that need to be electrically connected can be electrically connected through the bridging conductive structure. For example, some touch sensing electrodes in the second touch layer 620 can be electrically connected through the bridging conductive structure, while some touch driving electrodes in the second touch layer 620 can be electrically connected above the bridging conductive structure.

[0139] Optionally, the non-bending area PA may include a display area PA1, and the display panel 10 located in the display area PA1 may be used for light emission display to realize the display operation of the display panel 10, and the display panel 10 located in the display area PA1 may have touch function.

[0140] For example, the light-emitting device 400 may be located within the display area PA1, and the driving circuit 150 may be at least partially located within the display area PA1. The light-emitting device 400 can be used to realize the light-emitting display of the display panel 10. The touch function layer 600 may also be at least partially located within the display area PA1, so that the display panel 10 within the display area PA1 can have touch functionality.

[0141] Optionally, the non-bending area PA includes a second transition area PA2 located between the display area PA1 and the bending area BA. The setting of the second transition area PA2 can better extend the path of moisture intrusion, which is beneficial to improving the working stability of the display panel 10.

[0142] Optionally, a dam structure (not shown in the figure) may be provided in the second transition zone PA2, and at least a portion of the encapsulation layer 500 may extend from the display area PA1 into the second transition zone PA2. For example, the first planarization layer 160 in the second transition zone PA2 may have a groove structure, and a dam structure spaced apart from the first planarization layer 160 may be provided in the groove structure. The second encapsulation layer 520 may extend from the display area PA1 to the dam structure in the second transition zone PA2, and the third encapsulation layer 530 may extend from the display area PA1 into the second transition zone PA2 on the side of the dam structure away from the display area PA1, so as to better improve the encapsulation effect of the display panel 10, thereby improving the working stability of the display panel 10.

[0143] Optionally, the pixel limiting portion 210 may extend from the display area PA1 to the second transition area PA2, so that the pixel limiting portion 210 can also be used to restrict the intrusion of water vapor into the display area PA1. For example, the pixel limiting portion 210 may extend from the display area PA1 into the second transition area PA2 on the side of the dam structure away from the display area PA1.

[0144] Optionally, the dielectric layer 630 may extend from the display area PA1 to the second transition area PA2, so that the dielectric layer 630 can also be used to restrict the intrusion of water vapor into the display area PA1. For example, the dielectric layer 630 may extend from the display area PA1 into the second transition area PA2 on the side of the dam structure away from the display area PA1.

[0145] Optionally, the material of the dielectric layer 630 may include inorganic materials, so that the dielectric layer 630 can better restrict the intrusion of moisture into the display area PA1.

[0146] Optionally, at least a portion of the dielectric layer 630 may extend to the side of the third encapsulation layer 530 away from the display area PA1, so that the dielectric layer 630 can better cover the edge of the third encapsulation layer 530, thereby better restricting the intrusion of moisture into the display area PA1.

[0147] By setting a first planarization layer 160, at least partially located in the bending region BA, between the protection section 220 and the signal line layer 170, the protection section 220 can be used to protect the underlying first planarization layer 160 and signal line layer 170 during the fabrication of the display panel 10. This effectively limits the etching material from damaging the first planarization layer 160 and signal line layer 170, thereby improving the structural stability of the display panel 10.

[0148] For example, during the fabrication of the light-emitting device 400 and the touch function layer 600, the protection part 220 can provide good protection for the first planarization layer 160 and the signal line layer 170, so that the etching material is not easy to cause etching damage to the first planarization layer 160 and the signal line layer 170, thereby effectively improving the bright line problem of the display panel 10.

[0149] Optionally, the orthographic projection of the protection portion 220 on the substrate 110 at least partially overlaps with the orthographic projection of the signal line layer 170 on the substrate 110, so that the protection portion 220 can protect the underlying signal line layer 170.

[0150] Optionally, the orthographic projection of the protective portion 220 on the substrate 110 is located within the orthographic projection of the first planarization layer 160 on the substrate 110, so that the protective portion 220 is not too large, thereby facilitating the bending of the display panel 10 within the bending area BA.

[0151] In some embodiments of this application, the arrangement range of the protection section 220 can be set in various ways, and the arrangement range of the protection section 220 can be set according to the fact that the display panel 10 in the bending area BA can be bent.

[0152] In some alternative embodiments, the protection section 220 may be located in the first transition region BA2.

[0153] Optionally, the orthographic projection of the signal line layer 170 in the first transition region BA2 onto the substrate 110 lies within the orthographic projection of the protective portion 220 onto the substrate 110.

[0154] In these optional embodiments, by placing the protection portion 220 only within the first transition region BA2, the protection portion 220 can better protect the signal line layer 170 within the first transition region BA2, allowing the signal line layer 170 within the first transition region BA2 to achieve better electrical connection with other device structures, thereby improving the operational stability of the display panel 10. Furthermore, the placement of the protection portion 220 makes it less likely to interfere with the bending of the display panel 10 within the bending main region BA1, which has a large degree of bending. For example, when the material of the pixel definition layer 200 includes inorganic materials, the protection portion 220 is less likely to extend into the bending main region BA1, which has a large degree of bending, thus giving the protection portion 220 better structural stability.

[0155] In some embodiments of this application, during the fabrication of the pixel definition layer 200, before bending the display panel 10 in the fabrication state, and when the material of the pixel definition layer 200 is needed to protect the first planarization layer 160 and the signal line layer 170, the material of the pixel definition layer 200 in the bending region BA is retained, so that the material of the pixel definition layer 200 can completely cover the first planarization layer 160 and the signal line layer 170 in the bending region BA. When the material of the pixel definition layer 200 is not needed to protect the first planarization layer 160 and the signal line layer 170, or when the display panel 10 in the fabrication state needs to be bent, the material of the pixel definition layer 200 in the bending main region BA1 is removed, so that only the first transition region BA2 in the bending region BA retains the material of the pixel definition layer 200 forming the protective part 220.

[0156] Optionally, after the pixel definition layer 200 material is fabricated on the entire surface of the array substrate 100, during the fabrication process of the first packaging unit 511, the first type of device 401, the second packaging unit 512, the second type of device 402, the third packaging unit 513, and the third type of device 403 in sequence using the isolation structure 300, the material located in the pixel definition layer 200 can cover the first planarization layer 160 and the signal line layer 170 in the bending region BA. This allows the material of the pixel definition layer 200 to better protect the first planarization layer 160 and the signal line layer 170 in the bending region BA, making it less likely for the etching material to cause etching damage to the first planarization layer 160 and the signal line layer 170 in the bending region BA.

[0157] Optionally, during the fabrication of the touch functional layer 600, for example, during the fabrication of the first touch layer 610, the dielectric layer 630, and the second touch layer 620, the material of the pixel definition layer 200 can cover the first planarization layer 160 and the signal line layer 170 within the bending region BA, so that the material of the pixel definition layer 200 can better protect the first planarization layer 160 and the signal line layer 170 within the bending region BA, making it less likely for the etching material to cause etching damage to the first planarization layer 160 and the signal line layer 170 within the bending region BA.

[0158] Optionally, after the touch function layer 600 is fabricated, the material of the pixel definition layer 200 in the bending main area BA1 can be removed so that only the first transition area BA2 in the bending area BA retains the material of the pixel definition layer 200 forming the protective part 220.

[0159] In some alternative embodiments, the dielectric layer 630 may extend partially to the side of the protection portion 220 opposite to the array substrate 100.

[0160] Optionally, the dielectric layer 630 may extend to the side of the protective portion 220 away from the array substrate 100. This can mean that the orthographic projection of the dielectric layer 630 on the substrate 110 may overlap with the orthographic projection of the protective portion 220 on the substrate 110. For example, the orthographic projection of the dielectric layer 630 on the substrate 110 within the bending region BA may be located within the orthographic projection of the protective portion 220 on the substrate 110.

[0161] In these optional embodiments, by providing a portion of the dielectric layer 630 extending to the side of the protective portion 220 away from the array substrate 100, the dielectric layer 630 can have a larger arrangement size, thereby better restricting the intrusion of moisture into the display area PA1. Furthermore, by providing a portion of the dielectric layer 630 extending to the side of the protective portion 220 away from the array substrate 100, when removing material from the pixel definition layer 200 within the bent main area BA1, the dielectric layer 630 can protect the material of the pixel definition layer 200 within the first transition area BA2, making it easier to retain the material of the pixel definition layer 200 within the first transition area BA2 to form the protective portion 220.

[0162] Optionally, at least a portion of the surface of the dielectric layer 630 on the side away from the non-bending area PA is coplanar with at least a portion of the surface of the protective part 220 on the side away from the non-bending area PA, so that the arrangement of the dielectric layer 630 and the protective part 220 does not easily affect the bending of the display panel 10 in the bending main area BA1.

[0163] In some alternative embodiments, the protection portion 220 may be spaced apart from the pixel limiting portion 210.

[0164] Optionally, the protective portion 220 may be spaced apart from the pixel limiting portion 210, which may refer to the presence of a gap between the protective portion 220 and the pixel limiting portion 210.

[0165] Optionally, the gap between the protection portion 220 and the pixel limiting portion 210 may be located within the second transition region PA2.

[0166] In these alternative embodiments, by setting the protective portion 220 and the pixel limiting portion 210 to be spaced apart, when the protective portion 220 located in the bending region BA has a certain degree of deformation, the deformation is not easily transmitted to the pixel limiting portion 210, so that the pixel limiting portion 210 can have better structural stability.

[0167] In some alternative embodiments, the encapsulation layer 500 extends between the protection portion 220 and the pixel defining portion 210.

[0168] Optionally, the third encapsulation layer 530 extends between the protection portion 220 and the pixel limiting portion 210.

[0169] In these alternative embodiments, by providing a portion of the encapsulation layer 500 extending between the protection portion 220 and the pixel limiting portion 210, at least a portion of the encapsulation layer 500 can effectively cover the edge of the pixel limiting portion 210 away from the display area PA1, which can better restrict moisture from invading into the display area PA1, thereby improving the working stability of the display panel 10.

[0170] Optionally, the dielectric layer 630 may also be partially located between the protective portion 220 and the pixel limiting portion 210. For example, the dielectric layer 630 may cover the edge of the third encapsulation layer 530 away from the display area PA1, so that the dielectric layer 630 can also better restrict moisture from entering the display area PA1 from the gap between the protective portion 220 and the pixel limiting portion 210.

[0171] Figure 4 This is a schematic flowchart of a method for manufacturing a display panel 10 provided in an embodiment of this application. Figures 5 to 25 This is a schematic diagram of the preparation process of a method for preparing a display panel 10 provided in an embodiment of this application.

[0172] The second aspect of this application provides a method for manufacturing a display panel 10. The display panel 10 manufactured by this method can be any of the display panels 10 provided in the first aspect of the application described above. Please refer to [link to relevant documentation]. Figure 4 and combined Figures 1 to 3 as well as Figures 5 to 25 The display panel 10 has a bent area BA and a non-bent area PA, and the method includes:

[0173] Step S10: As Figure 5 As shown, a signal line layer 170 and a first planarization layer 160 are sequentially fabricated on a substrate 110 to form an array substrate 100 located in the bending region BA and the non-bending region PA.

[0174] Optionally, after step S10, the following may be included: Figure 6 As shown, a plurality of first electrodes 410 are formed on the array substrate 100 at intervals.

[0175] Step S20: As Figure 7 and Figure 8 As shown, a pixel-defining material layer 11 located in the bending region BA and the non-bending region PA is prepared on the array substrate 100.

[0176] Optionally, the pixel defining material layer 11 may include a pixel defining material portion 11a located in the non-bending region PA and a protective material portion 11b located in the bending region BA.

[0177] Optionally, the pixel defining material layer 11 can be used to participate in forming the pixel defining layer 200 as described in any of the foregoing embodiments. For example, the pixel defining material portion 11a can be used to participate in forming the pixel defining portion 210 as described in any of the foregoing embodiments, and the protective material portion 11b can be used to participate in forming the protective portion 220 as described in any of the foregoing embodiments.

[0178] Step S30: As Figures 9 to 17 As shown, the pixel definition material layer 11 is patterned to form a plurality of light-emitting devices 400, resulting in a pixel limiting portion 210 located in the non-bending region PA and a protective material portion 11b located in the bending region BA. The pixel limiting portion 210 encloses to form a plurality of pixel openings 210a. The plurality of light-emitting devices 400 are at least partially located in the corresponding pixel openings 210a. The first planarization layer 160, which is at least partially located in the bending region BA, is located between the protective material portion 11b and the signal line layer 170.

[0179] Step S40: As Figures 18 to 24 As shown, a touch function layer 600 is prepared on the side of the multiple light-emitting devices 400 away from the array substrate 100.

[0180] In the preparation method provided in this application embodiment, by providing a protective material portion 11b in the bending region BA, the protective material portion 11b can better protect the first planarization layer 160 and the signal line layer 170 in the bending region BA during subsequent preparation processes, such as in steps S30 and S40. This can better limit the etching material from damaging the first planarization layer 160 and the signal line layer 170, thereby improving the structural stability of the display panel 10.

[0181] In some optional embodiments, after step S20, the method further includes: Figure 9 As shown, an isolation material layer 12 is formed on the side of the pixel definition material layer 11 away from the array substrate 100.

[0182] Optionally, the insulating material layer 12 can be used to form the insulating structure 300 in any of the foregoing embodiments.

[0183] Optionally, in the direction away from the array substrate 100, the isolation material layer 12 may include a first isolation material layer 12a, a second isolation material layer 12b, and a third isolation material layer 12c stacked sequentially, wherein the first isolation material layer 12a, the second isolation material layer 12b, and the third isolation material layer 12c may be used to form the conductive portion 330, the first isolation portion 310, and the second isolation portion 320 in any of the foregoing embodiments, respectively.

[0184] Optionally, step S30 includes:

[0185] Step S31: As Figure 10 As shown, the isolation material layer 12 is patterned to form a first opening 301a, and the pixel definition material layer 11 (e.g., the pixel defining material portion 11a in the pixel definition material layer 11) is patterned to form a pixel opening 210a connected to the first opening 301a.

[0186] Step S32: Prepare the first device material on the entire surface.

[0187] Optionally, the first device material may include a first type of light-emitting material and a first conductive material located on the side of the first type of light-emitting material facing away from the array substrate 100. The first type of light-emitting material and the first conductive material may be used to participate in forming the light-emitting functional layer 420 of the first type of device 401 in any of the foregoing embodiments and the second electrode 430 of the first type of device 401, respectively.

[0188] Optionally, after step S32, the method further includes:

[0189] The first packaging material is fabricated on the entire surface of the first device material;

[0190] Remove the first encapsulation material outside the first opening 301a to form the first encapsulation unit 511.

[0191] Optionally, the first encapsulation material may be used to participate in forming the first encapsulation unit 511 of the first encapsulation layer 510 in any of the foregoing embodiments.

[0192] Step S33: As Figure 11 As shown, the first device material outside the first opening 301a is removed to form the first type of device 401.

[0193] In some optional embodiments, step S30 includes: patterning the isolation material layer 12 to form a second opening 301b, and patterning the pixel definition material layer 11 (e.g., the pixel defining material portion 11a in the pixel definition material layer 11) to form a pixel opening 210a communicating with the second opening 301b.

[0194] Optional, such as Figure 10 As shown, the steps of patterning the isolation material layer 12 to form the second opening 301b and patterning the pixel definition material layer 11 to form the pixel opening 210a connected to the second opening 301b can be located in step S31 to improve the manufacturing efficiency of the display panel 10.

[0195] Alternatively, the steps of patterning the isolation material layer 12 to form the second opening 301b and patterning the pixel definition material layer 11 to form the pixel opening 210a connected to the second opening 301b may be located after step S31.

[0196] Optionally, step S30 includes:

[0197] Step S34: Prepare the second device material on the entire surface.

[0198] Optionally, the second device material may include a second type of light-emitting material and a second conductive material located on the side of the second type of light-emitting material facing away from the array substrate 100. The second type of light-emitting material and the second conductive material may respectively be used to participate in forming the light-emitting functional layer 420 of the second type of device 402 and the second electrode 430 of the second type of device 402 in any of the foregoing embodiments.

[0199] Optionally, after step S34, the method further includes:

[0200] A second packaging material is fabricated on the entire surface of the second device material;

[0201] Remove the second packaging material outside the second opening 301b to form the second packaging unit 512.

[0202] Optionally, the second encapsulation material may be used to participate in forming the second encapsulation unit 512 of the first encapsulation layer 510 in any of the foregoing embodiments.

[0203] Step S35: As Figure 12 As shown, the second device material outside the second opening 301b is removed to form the second type of device 402.

[0204] In some optional embodiments, step S30 includes: patterning the isolation material layer 12 to form a third opening 301c, and patterning the pixel definition material layer 11 (e.g., the pixel defining material portion 11a in the pixel definition material layer 11) to form a pixel opening 210a communicating with the third opening 301c.

[0205] Optional, such as Figure 10 As shown, the steps of patterning the isolation material layer 12 to form the third opening 301c and patterning the pixel definition material layer 11 to form the pixel opening 210a connected to the third opening 301c can be located in step S31 to improve the manufacturing efficiency of the display panel 10.

[0206] Alternatively, the steps of patterning the isolation material layer 12 to form the third opening 301c and patterning the pixel definition material layer 11 to form the pixel opening 210a connected to the third opening 301c can be located after step S31.

[0207] Optionally, step S30 includes:

[0208] Step S36: Prepare the third device material on the entire surface.

[0209] Optionally, the third device material may include a third type of light-emitting material and a third type of conductive material located on the side of the third type of light-emitting material facing away from the array substrate 100. The third type of light-emitting material and the third type of conductive material may be used to participate in forming the light-emitting functional layer 420 and the second electrode 430 of the third type of device 403 in any of the foregoing embodiments, respectively.

[0210] Optionally, after step S36, the method further includes:

[0211] A third packaging material is fabricated on the entire surface of the third device material;

[0212] The second packaging material outside the third opening 301c is removed to form the third packaging unit 513.

[0213] Optionally, a third encapsulation material may be used to participate in forming the third encapsulation unit 513 of the first encapsulation layer 510 in any of the foregoing embodiments.

[0214] Step S37: As Figure 13 As shown, the third device material outside the third opening 301c is removed to form a third type of device 403.

[0215] In some optional embodiments, the isolation material layer 12 is patterned to form a third opening 301c, and the pixel definition material layer 11 is patterned to form a pixel opening 210a communicating with the third opening 301c, including:

[0216] like Figure 14 As shown, a portion of the pixel definition material layer 11 (e.g., a portion of the pixel defining material layer 11a) is removed so that the pixel defining portion 210 and the protective material portion 11b are spaced apart.

[0217] Optionally, after step S37, the method further includes:

[0218] like Figure 15 As shown, the second encapsulation layer 520 is prepared;

[0219] like Figure 16 and Figure 17 As shown, a third encapsulation layer 530 is prepared, and the third encapsulation layer 530 extends partially between the protective material portion 11b and the pixel limiting portion 210.

[0220] In these alternative embodiments, by removing part of the pixel defining material layer 11 so that the pixel defining portion 210 and the protective material portion 11b are spaced apart, it is possible for a portion of the film layer to be subsequently prepared to fall between the pixel defining portion 210 and the protective material portion 11b, and for the subsequently prepared protective portion 220 to be spaced apart from the pixel defining portion 210, thereby achieving the beneficial effects described in the foregoing embodiments.

[0221] In some optional embodiments, step S40 includes:

[0222] Step S41: As Figure 18 As shown, a first touch layer 610 is prepared on the side of the plurality of light-emitting devices 400 away from the array substrate 100.

[0223] Optionally, when the first touch layer 610 is fabricated in step S41, the protective material portion 11b can better protect the underlying first planarization layer 160 and signal line layer 170. Optionally, when the first touch layer 610 is fabricated in step S41, the etching material may have a certain impact on the protective material portion 11b in the bending region BA. For example, the etching material may reduce the thickness of the protective material portion 11b in the bending region BA.

[0224] Step S42: As Figure 19 and Figure 20 As shown, a dielectric material layer 13 is prepared on the side of the first touch layer 610 away from the array substrate 100, and a portion of the dielectric material layer 13 extends to the side of the protective material portion 11b away from the array substrate 100.

[0225] Optionally, the dielectric material layer 13 may be used to participate in the formation of the dielectric layer 630 described in any of the foregoing embodiments.

[0226] Step S43: As Figure 21 As shown, a connecting hole 630a is formed on the dielectric material layer 13, and at least a portion of the first touch layer 610 is exposed from the connecting hole 630a.

[0227] Optionally, step S43 includes: as Figure 22 As shown, at least a portion of the dielectric material layer 13 within the bending region BA is removed to obtain the dielectric layer.

[0228] By removing at least a portion of the dielectric material layer 13 within the bending region BA, the bending effect of the dielectric layer 630 on the display panel 10 within the subsequently formed bending region BA can be better reduced.

[0229] For example, the bending region BA includes a bending main region BA1 and a first transition region BA2 located between the bending main region BA1 and the non-bending region PA. Removing at least a portion of the dielectric material layer 13 within the bending region BA includes removing the dielectric material layer 13 within the bending main region BA1.

[0230] Optionally, when preparing the connecting hole 630a and removing at least part of the dielectric material layer 13 in the bending area BA in step S43, the protective material part 11b can better protect the underlying first planarization layer 160 and signal line layer 170.

[0231] Optionally, when preparing the connecting hole 630a and removing at least part of the dielectric material layer 13 in the bending region BA in step S43, the etching material may have a certain impact on the protective material portion 11b in the bending region BA. For example, the etching material may reduce the thickness of the protective material portion 11b in the bending region BA.

[0232] Step S44: As Figure 23 As shown, a second touch layer 620 is prepared on the side of the dielectric material layer 13 facing away from the array substrate 100.

[0233] Optional, such as Figure 24 As shown, when the second touch layer 620 is fabricated in step S44, the protective material portion 11b can effectively protect the underlying first planarization layer 160 and signal line layer 170. Optionally, when the second touch layer 620 is fabricated in step S44, the etching material may have a certain impact on the protective material portion 11b in the bending region BA. For example, the etching material may reduce the thickness of the protective material portion 11b in the bending region BA.

[0234] In some optional embodiments, after step S40, the method further includes:

[0235] Step S50: As Figure 25 As shown, a portion of the protective material 11b within the bending area BA is removed to obtain the protective section.

[0236] Optionally, the bending area BA includes the main bending area BA1 and the first transition area BA2 located between the main bending area BA1 and the non-bending area PA. Step S50 includes: removing the protective material portion 11b in the main bending area BA1.

[0237] In these alternative embodiments, by removing at least a portion of the protective material portion 11b within the bending region BA, it is possible to facilitate bending of the display panel 10 within the bending region BA that has been subsequently manufactured.

[0238] An embodiment of the third aspect of this application provides a display device, which includes a display panel 10 of any of the above embodiments, or a display panel 10 prepared by the preparation method of any of the above embodiments. Since the display device provided by the third aspect of this application includes the display panel 10 of any of the first aspects, or a display panel 10 prepared by the preparation method of any of the second aspects, the display device provided by the third aspect of this application has the beneficial effects of the display panel 10 of any of the first aspects or the display panel 10 prepared by the preparation method of any of the second aspects, which will not be elaborated further here.

[0239] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0240] The embodiments described above are not exhaustive and do not limit the invention to specific examples. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, The display panel has a bent area and a non-bent area, and the display panel includes: An array substrate, located in the bending region and the non-bending region, includes a substrate, a first planarization layer disposed on one side of the substrate, and a signal line layer disposed between the substrate and the first planarization layer; A pixel definition layer is disposed on the side of the first planarization layer away from the array substrate, including a pixel defining portion located in the non-bending area and a protective portion located in the bending area. The pixel defining portion encloses and forms a plurality of pixel openings. The first planarization layer, which is at least partially located in the bending area, is located between the protective portion and the signal line layer. Multiple light-emitting devices are at least partially located within the corresponding pixel openings; A touch function layer is disposed on the side of the plurality of light-emitting devices facing away from the array substrate.

2. The display panel according to claim 1, characterized in that, The bending area includes a main bending area and a first transition area located between the main bending area and the non-bending area, and the protective part is located in the first transition area; Preferably, the signal line layer extends from the first transition region to the bending main region, and the orthographic projection of the signal line layer in the first transition region onto the substrate is located within the orthographic projection of the protective portion onto the substrate.

3. The display panel according to claim 1, characterized in that, The touch function layer includes a first touch layer, a second touch layer, and a dielectric layer disposed between the first touch layer and the second touch layer, wherein the dielectric layer extends to the side of the protective portion away from the array substrate. Preferably, the dielectric layer has a connecting hole, and at least a portion of the first touch layer and the second touch layer are electrically connected through the connecting hole; Preferably, the material of the dielectric layer includes inorganic materials.

4. The display panel according to claim 3, characterized in that, At least a portion of the surface of the dielectric layer on the side away from the non-bending area is coplanar with at least a portion of the surface of the protective portion on the side away from the non-bending area.

5. The display panel according to claim 1, characterized in that, The protective portion and the pixel defining portion are spaced apart.

6. The display panel according to claim 5, characterized in that, The display panel further includes an encapsulation layer disposed between the light-emitting device and the touch function layer, wherein the encapsulation layer extends to the space between the protective portion and the pixel defining portion; Preferably, in the direction away from the array substrate, the encapsulation layer includes a first encapsulation layer, a second encapsulation layer and a third encapsulation layer stacked sequentially, the third encapsulation layer extending partially between the protective portion and the pixel defining portion.

7. The display panel according to claim 1, characterized in that, The array substrate further includes a second planarization layer disposed between the substrate and the first planarization layer, and the signal line layer is disposed between the first planarization layer and the second planarization layer.

8. The display panel according to claim 1, characterized in that, The non-bending area includes a display area and a second transition area located between the display area and the bending area. The material of the pixel definition layer includes an inorganic material, and the pixel defining portion extends from the display area to the second transition area.

9. The display panel according to any one of claims 1 to 8, characterized in that, The display panel further includes an isolation structure disposed on one side of the array substrate. The isolation structure surrounds an isolation opening that is connected to the pixel opening. The light-emitting device extends from the pixel opening into the isolation opening. The isolation structure includes a first isolation portion and a second isolation portion located on the side of the first isolation portion away from the array substrate. The second isolation portion protrudes from the first isolation portion toward the isolation opening.

10. A method for manufacturing a display panel, characterized in that, The display panel has a bent area and a non-bent area, and the method includes: A signal line layer and a first planarization layer are sequentially fabricated on a substrate to form an array substrate located in the bending region and the non-bending region; A pixel-defining material layer located in the bending region and the non-bending region is prepared on the array substrate; The pixel definition material layer is patterned to form a plurality of light-emitting devices, resulting in a pixel defining portion located in the non-bending region and a protective material portion located in the bending region. The pixel defining portion encloses a plurality of pixel openings, and the plurality of light-emitting devices are at least partially located in the corresponding pixel openings. The first planarization layer, which is at least partially located in the bending region, is located between the protective material portion and the signal line layer. A touch-sensitive functional layer is prepared on the side of the plurality of light-emitting devices away from the array substrate.

11. The method according to claim 10, characterized in that, After the step of fabricating a touch functional layer on the side of the plurality of light-emitting devices away from the array substrate, the method further includes: Remove a portion of the protective material within the bending area to obtain the protective portion; Preferably, the bending area includes a main bending area and a first transition area located between the main bending area and the non-bending area, and the removal of a portion of the protective material within the bending area includes: Remove the protective material portion within the main bending area.

12. The method according to claim 10, characterized in that, The step of fabricating a touch-enabled layer on the side of the plurality of light-emitting devices away from the array substrate includes: A first touch layer is prepared on the side of the plurality of light-emitting devices away from the array substrate; A dielectric material layer is prepared on the side of the first touch layer away from the array substrate, and the dielectric material layer extends to the side of the protective material portion away from the array substrate. A connecting hole is formed in the dielectric material layer, and at least a portion of the first touch layer is exposed from the connecting hole; A second touch layer is prepared on the side of the dielectric material layer opposite to the array substrate; Preferably, the step of creating a connecting hole in the dielectric material layer includes: Remove a portion of the dielectric material layer within the bending area to obtain the dielectric layer; Preferably, the bending region includes a main bending region and a first transition region located between the main bending region and the non-bending region, and removing at least a portion of the dielectric material layer within the bending region includes: Remove the dielectric material layer within the bending main area.

13. The method according to any one of claims 10 to 12, characterized in that, After the step of fabricating a pixel-defining material layer located in the bent region and the non-bent region on the array substrate, the method further includes: An isolation material layer is formed on the side of the pixel definition material layer away from the array substrate; The step of patterning the pixel-defined material layer to form multiple light-emitting devices includes: The isolation material layer is patterned to form a first opening, and the pixel definition material layer is patterned to form a pixel opening connected to the first opening. The first device material is prepared across the entire surface. Remove the first device material outside the first opening to form a first type of device.

14. The method according to claim 13, characterized in that, After the step of preparing the first device material over the entire surface, the method further includes: A first packaging material is prepared on the entire surface of the first device material; Remove the first encapsulation material outside the first opening to form a first encapsulation unit.

15. The method according to claim 13, characterized in that, The step of patterning the pixel-defined material layer to form multiple light-emitting devices includes: The isolation material layer is patterned to form a second opening, and the pixel definition material layer is patterned to form a pixel opening connected to the second opening; Fabrication of the second device material across the entire surface; Remove the second device material outside the second opening to form a second type of device.

16. The method according to claim 15, characterized in that, After the step of preparing the second device material over the entire surface, the method further includes: A second packaging material is fabricated on the entire surface of the second device material; Remove the second encapsulation material outside the second opening to form a second encapsulation unit.

17. The method according to claim 15, characterized in that, The step of patterning the pixel-defined material layer to form multiple light-emitting devices includes: The isolation material layer is patterned to form a third opening, and the pixel definition material layer is patterned to form a pixel opening connected to the third opening; The third device material is prepared on the entire surface; The third device material outside the third opening is removed to form a third type of device.

18. The method according to claim 17, characterized in that, After the step of preparing the third device material across the entire surface, the method further includes: A third encapsulation material is fabricated on the entire surface of the third device material; The second encapsulation material outside the third opening is removed to form a third encapsulation unit.

19. The method according to claim 17, characterized in that, The step of patterning the isolation material layer to form a third opening, and patterning the pixel definition material layer to form a pixel opening connected to the third opening, includes: Remove part of the pixel definition material layer to make the pixel defining portion and the protective material portion spaced apart; Preferably, after the step of removing the third device material outside the third opening to form a third type of device, the method further includes: Fabricate the second encapsulation layer; A third encapsulation layer is prepared, wherein the third encapsulation layer extends to the space between the protective material portion and the pixel defining portion.

20. A display device, characterized in that, It includes a display panel as described in any one of claims 1 to 9, or a display panel prepared by the method as described in any one of claims 10 to 19.

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