Display panel, preparation method thereof and display device

Abstract

This application discloses a display panel, its fabrication method, and a display device. The display panel of this application includes a light-shielding structure comprising a first metal portion, a first insulating layer, and a second metal portion stacked together. In the light-shielding structure, the thicknesses of the first metal portion, the first insulating layer, and the second metal portion decrease progressively from the first substrate toward the display surface of the display panel. This application specifies that the second metal portion has the smallest thickness, so that a portion of external light is reflected by the second metal portion, while a portion of external light can pass through the second metal portion and be reflected by the first metal portion, resulting in destructive interference of the reflected light. Furthermore, the thickness of the first insulating layer is between the thicknesses of the first and second metal portions, which allows for better adjustment of the phase difference between the reflected light from the first and second metal portions, bringing it close to half a wavelength, thereby achieving efficient destructive interference.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Due to linewidth requirements, it is extremely difficult to fabricate a small-width black matrix layer on the color filter substrate side of current VR (Virtual Reality) products. Therefore, the light-shielding metal on the array substrate side is often used as the black matrix layer in the data line direction, and using a double-layer metal as the black matrix layer is one of the common solutions.

[0003] However, in existing structures with an insulating layer sandwiched between two metal layers, the thickness of the two metal layers is generally the same, which results in the reflectivity of the black matrix layer of the two metal layers being somewhat high. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the same, and a display device, which can reduce the reflectivity of a light-shielding structure.

[0005] This application provides a display panel, which includes an array substrate;

[0006] The array substrate includes a first substrate, a data line, and a light-shielding structure. The data line is disposed on the first substrate, and the data line and the light-shielding structure are disposed in different layers. The light-shielding structure is disposed on the side of the data line away from the first substrate, and the light-shielding structure correspondingly blocks the data line.

[0007] The light-shielding structure includes a first metal part, a first insulating layer, and a second metal part stacked sequentially. The first metal part is located on the side of the first insulating layer close to the first substrate. From the first substrate toward the display surface of the display panel, the thickness of the first metal part, the thickness of the first insulating layer, and the thickness of the second metal part decrease layer by layer.

[0008] Optionally, in some embodiments of this application, the ratio of the thickness of the first metal portion to the thickness of the second metal portion is between 10:1 and 20:1.

[0009] Optionally, in some embodiments of this application, the orthographic projection of the second metal portion onto the plane containing the first metal portion is located within the outline region of the first metal portion.

[0010] Optionally, in some embodiments of this application, the side surface of the first metal part, the side surface of the first insulating layer, and the side surface of the second metal part are sequentially connected to form a first inclined plane, and the inclination angle of the first inclined plane is between 20 degrees and 80 degrees.

[0011] Optionally, in some embodiments of this application, the thickness d of the first insulating layer satisfies the following formula:

[0012] d = λ / (4n), where λ is the target wavelength and n is the refractive index of the first insulating layer.

[0013] Optionally, in some embodiments of this application, the first insulating layer includes a first sub-layer and a second sub-layer stacked together, wherein the refractive index of the first sub-layer and the refractive index of the second sub-layer are different.

[0014] Optionally, in some embodiments of this application, the array substrate further includes a second insulating layer, which covers the side of the data line away from the first substrate, and the light-shielding structure is formed directly on the surface of the second insulating layer away from the first substrate;

[0015] The second insulating layer includes a first part and a second part connected together. In the thickness direction of the display panel, the first part corresponds to the light-shielding structure, and the first part and the light-shielding structure are at least partially overlapped. The second part corresponds to the area outside the light-shielding structure.

[0016] The thickness of the first part is greater than the thickness of the second part.

[0017] Optionally, in some embodiments of this application, the side of the portion of the first part protruding from the second part, the side of the first metal part, the side of the first insulating layer, and the side of the second metal part are connected to form a second inclined plane, and the inclination angle of the second inclined plane is between 20 degrees and 80 degrees.

[0018] Optionally, in some embodiments of this application, the thickness of the first part is between 2000 angstroms and 4000 angstroms, and the thickness of the second part is less than or equal to 1000 angstroms.

[0019] Accordingly, this application also provides a method for manufacturing a display panel, which includes preparing an array substrate. The preparation of the array substrate includes the following steps:

[0020] A data line and a second insulating layer are formed on a first substrate, the second insulating layer covering the side of the data line away from the first substrate;

[0021] A light-shielding structure is formed on the second insulating layer. The light-shielding structure includes a first metal part, a first insulating layer and a second metal part stacked sequentially. The first metal part is located on the side of the first insulating layer close to the first substrate. From the first substrate toward the light-shielding structure, the thickness of the first metal part, the thickness of the first insulating layer and the thickness of the second metal part decrease layer by layer.

[0022] Optionally, in some embodiments of this application, forming a light-shielding structure on the second insulating layer includes the following steps:

[0023] A patterned first metal portion is formed on the second insulating layer;

[0024] An insulating material layer and a metal material layer are sequentially formed on the first metal part;

[0025] A patterned photoresist portion is formed on the metal material layer, and the photoresist portion is disposed directly above the first metal portion. Based on the orthogonal projection direction of the first substrate, both sides of the first metal portion extend beyond the side edges of the photoresist portion.

[0026] Using the photoresist portion as a mask, the insulating material layer and the metal material layer are etched to form a first insulating layer and a second metal portion. Based on the orthogonal projection direction of the first substrate, both sides of the first metal portion extend beyond the side edges of the second metal portion.

[0027] Simultaneously, the exposed portion of the second insulating layer and the portion of the first metal portion extending beyond the first insulating layer are etched to thin the portion of the second insulating layer corresponding to the portion outside the second metal portion, such that the thinned portion of the second insulating layer is the second portion, the portion corresponding to the second metal portion is the first portion, and the side surface of the first portion, the side surface of the first metal portion, the side surface of the first insulating layer, and the side surface of the second metal portion are connected to form a second inclined plane.

[0028] Accordingly, this application also provides a display device, which includes a display panel as described in any of the above embodiments.

[0029] This application embodiment provides a light-shielding structure for the display panel, which includes a first metal portion, a first insulating layer, and a second metal portion stacked together. In the light-shielding structure, the thickness of the first metal portion, the thickness of the first insulating layer, and the thickness of the second metal portion decrease layer by layer from the first substrate toward the display surface of the display panel.

[0030] Understandably, the second metal portion has the smallest thickness so that some external light is reflected by the second metal portion, while the remaining external light can pass through the second metal portion and be reflected by the first metal portion, resulting in destructive interference of the reflected light. Secondly, the thickness of the first insulating layer is between the thicknesses of the first and second metal portions, which allows for better adjustment of the phase difference between the reflected light from the first and second metal portions, bringing it close to half a wavelength, thereby achieving efficient destructive interference. Furthermore, the maximum thickness of the first metal portion can better block external light from passing through, improving the light-shielding effect. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application;

[0032] Figure 2 yes Figure 1 An enlarged schematic diagram of part A in the middle;

[0033] Figure 3 yes Figure 1 Another enlarged schematic diagram of part A in the middle;

[0034] Figure 4 This is a schematic diagram of the light-shielding structure of a display panel based on related technologies;

[0035] Figure 5 This is a schematic diagram of step B01 of the method for manufacturing a display panel provided in this application embodiment;

[0036] Figure 6 This is a schematic diagram of step B02 of the method for manufacturing a display panel provided in this application embodiment;

[0037] Figure 7 This is a schematic diagram of the structure of the display device provided in the embodiments of this application. Detailed Implementation

[0038] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific implementation methods described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, the embodiments can be combined with each other but will not be described in detail one by one. Unless otherwise stated, the directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device; the terms "first," "second," "third," etc. are only used as markings and do not impose numerical requirements or establish a sequence.

[0039] This application provides a display panel, a method for manufacturing the same, and a display device, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments.

[0040] Please refer to Figure 1 and Figure 2 This application provides a display panel 100, which includes an array substrate 10.

[0041] The array substrate 10 includes a first substrate 101, a data line 102, and a light-shielding structure 11. The data line 102 is disposed on the first substrate 101, and the data line 102 and the light-shielding structure 11 are disposed on different layers. The light-shielding structure 11 is disposed on the side of the data line 102 away from the first substrate 101. The light-shielding structure 11 correspondingly blocks the data line 102.

[0042] Please refer to Figure 3 The light-shielding structure 11 includes a first metal part 111, a first insulating layer 113, and a second metal part 112 stacked sequentially. The first metal part 111 is located on the side of the first insulating layer 113 near the first substrate 101. From the direction from the first substrate 101 toward the display surface of the display panel 100, the thickness of the first metal part 111, the thickness of the first insulating layer 113, and the thickness of the second metal part 112 decreases layer by layer.

[0043] Understandably, the second metal portion 112 has the smallest thickness so that a portion of the external light is reflected by the second metal portion 112, while the remaining portion can pass through the second metal portion 112 and be reflected by the first metal portion 111, resulting in destructive interference of the reflected light. Secondly, the thickness of the first insulating layer 113 is between the thickness of the first metal portion 111 and the thickness of the second metal portion 112, which allows for better adjustment of the phase difference between the reflected light from the first metal portion 111 and the second metal portion 112, bringing it close to half a wavelength, thereby achieving efficient destructive interference. Furthermore, the maximum thickness of the first metal portion 111 can better block external light from passing through it, improving the light-shielding effect.

[0044] Optionally, in some embodiments, such as Figure 1 As shown, the display panel 100 is a liquid crystal display panel, but it is not limited to this. For example, the display panel 100 can be an electroluminescent panel or an electrophoretic panel, etc.

[0045] exist Figure 1 In the display panel 100, there is also a counter substrate 20 disposed on the light-emitting side of the array substrate 10. The counter substrate 20 includes a second substrate 201, a black matrix layer 202 disposed on the side of the second substrate 201 near the array substrate 10, and spacer pillars 203 disposed on the side of the black matrix layer 202 near the array substrate 10.

[0046] The array substrate 10 includes a light-shielding layer 103, a buffer layer 104, a thin film transistor t1, a planarization layer 105, a second insulating layer 106, a third insulating layer 107, a first common electrode layer 121, a fourth insulating layer 108, a pixel electrode layer 123, a fifth insulating layer 109, and a second common electrode layer 122.

[0047] A light-shielding layer 103 is disposed on a first substrate 101. A buffer layer 104 covers the light-shielding layer 103. A thin-film transistor t1 is disposed corresponding to the light-shielding layer 103, and a planarization layer 105 covers the thin-film transistor t1. A second insulating layer 106 covers the planarization layer 105. A light-shielding structure 11 is disposed on the second insulating layer 106. A third insulating layer 107 covers the light-shielding structure 11 and the second insulating layer 106. A first common electrode layer 121 is disposed on the third insulating layer 107. A fourth insulating layer 108 is disposed on the first common electrode layer 121. A pixel electrode layer 123 is disposed on the fourth insulating layer 108. A fifth insulating layer 109 is disposed on the pixel electrode layer 123, and a second common electrode layer 122 is disposed on the fifth insulating layer 109.

[0048] Optionally, the array substrate 10 further includes a contact hole k1 that penetrates the fourth insulating layer 108, the third insulating layer 107, the second insulating layer 106 and the planarization layer 105 and exposes the output electrode of the thin film transistor t1. The pixel electrode 123 covers the contact hole k1 and is connected to the output electrode of the thin film transistor t1.

[0049] The contact hole k1 is filled with a filling part 124, and a protrusion 125 is provided on the filling part 124. An auxiliary electrode layer 126 is also covered on the protrusion 125, and the auxiliary electrode layer 126 is connected to the pixel electrode 123.

[0050] The spacer 203 is provided corresponding to the protrusion 125.

[0051] Optionally, the thin-film transistor t1 can be a transistor of any structure, such as bottom-gate, top-gate, dual-gate, or vertical-channel.

[0052] Optionally, the materials of the first metal portion 111 and the second metal portion 112 may be the same or different. The materials of the first metal portion 111 and the second metal portion 112 may each include at least one of molybdenum, aluminum, silver, titanium, copper or chromium; for example, the materials of the first metal portion 111 and the second metal portion 112 may be metallic molybdenum.

[0053] Optionally, the material of the first insulating layer 113 may be at least one of silicon oxysilicon or silicon nitride.

[0054] The light-shielding structure 11 is used to shield the data line 102, replacing the black matrix layer in the opposing substrate 20 that shields the data line 102.

[0055] Optionally, in some embodiments, the array substrate 10 further includes a wiring structure 13, which is disposed on the second insulating layer 106 in the same layer as the light-shielding structure 11.

[0056] The wiring structure 13 includes a third metal part, a transparent insulating layer and a fourth metal part stacked in sequence. The thickness of the fourth metal part is equal to the thickness of the second metal part 112, the thickness of the transparent insulating layer is equal to the thickness of the first insulating layer 113, and the thickness of the third metal part is equal to the thickness of the first metal part 111.

[0057] The material of the first metal part 111 is the same as that of the third metal part, and the material of the second metal part 112 is the same as that of the fourth metal part.

[0058] The wiring section 141 passes through the third insulating layer 107, the fourth metal section, and the transparent insulating layer to connect to the third metal section.

[0059] Optionally, the wiring structure 13 and the light-shielding structure 11 are formed using the same process.

[0060] Optionally, in some embodiments of this application, the thickness d of the first insulating layer 113 satisfies the following formula:

[0061] d = λ / (4n), where λ is the target wavelength and n is the refractive index of the first insulating layer 113.

[0062] As can be seen from the formula, the wavelength of the light with destructive interference can be adjusted by adjusting the thickness of the first insulating layer 113.

[0063] Optionally, in some embodiments of this application, the ratio of the thickness of the first metal portion 111 to the thickness of the second metal portion 112 is between 10:1 and 20:1.

[0064] It is understandable that in the light-shielding structure 11, the first metal part 111 serves as the bottom reflective layer, which requires a larger thickness to provide high reflectivity; the second metal part 112 serves as the top reflective layer, which requires a thinner thickness to achieve partial light transmission and form interference cancellation of reflected light. The greater the ratio of the thickness of the first metal part 111 to the thickness of the second metal part 112, the greater the difference in their thicknesses, and the greater the difference in reflectivity between the first metal part 111 and the second metal part, which in turn reduces the effect of interference cancellation. Conversely, the smaller the ratio of the thickness of the first metal part 111 to the thickness of the second metal part 112, the smaller the difference in their thicknesses. When both are thinner, external light can easily penetrate the first metal part 111 and the second metal part 112, which reduces the light-shielding performance of the light-shielding structure 11. When both are thicker, external light cannot easily penetrate the second metal part 112, which further reduces the effect of interference cancellation. Therefore, based on considerations of the light-shielding performance and interference cancellation of the light-shielding structure 11, the ratio of the thickness of the first metal part 111 to the thickness of the second metal part 112 is set between 10:1 and 20:1.

[0065] Secondly, the greater the thickness of the second metal part 112, the greater the phase delay of the transmitted light in the second metal part 112, and the greater the phase difference between the reflected light and the transmitted light. Therefore, setting the thickness of the second metal part 112 to be smaller can reduce the risk of excessive shift of the interference cancellation wavelength to the long wavelength direction, thereby reducing the effect of interference cancellation.

[0066] For example, the ratio of the thickness of the first metal part 111 to the thickness of the second metal part 112 is 10 / 1, 11 / 1, 12 / 1, 13 / 1, 14 / 1, 15 / 1, 16 / 1, 17 / 1, 18 / 1, 19 / 1 or 20 / 1.

[0067] Optionally, the thickness of the first insulating layer 113 is between 400 angstroms and 800 angstroms, for example, it can be 400 angstroms, 500 angstroms, 600 angstroms, 700 angstroms or 800 angstroms.

[0068] Optionally, the thickness ratio of the first metal portion 111, the first insulating layer 113, and the second metal portion 112 is 14:6:1 to reduce reflectivity.

[0069] Optional, such as Figure 3 As shown, in some embodiments of this application, the first insulating layer 113 includes a first sub-layer 11a and a second sub-layer 11b stacked together, wherein the refractive index of the first sub-layer 11a is different from that of the second sub-layer 11b.

[0070] It is understandable that, compared to a single-layer first insulating layer 113, a first insulating layer 113 with at least two sub-layers has more reflective interfaces, thereby causing more reflected light to interfere and cancel each other out, further reducing the reflectivity of the light-shielding structure 11; and the arrangement of multiple sub-layers causes some light to be reflected multiple times in the first insulating layer 113, increasing the optical path and enhancing absorption to reduce the reflectivity of the light-shielding structure 11.

[0071] Optionally, the first sub-layer 11a and the second sub-layer 11b are sequentially disposed on the first metal part 111. The thickness of the second sub-layer 11b is different from the thickness of the first sub-layer 11a. Based on the difference in thickness between the first sub-layer 11a and the second sub-layer 11b, reflected light of different wavelengths can be interfered and canceled out, thereby reducing the reflectivity of the light-shielding structure 11.

[0072] Optionally, the thickness of the first metal part 111, the first sub-layer 11a, the second sub-layer 11b, and the second metal part 112 decreases layer by layer. The decrease in thickness can smooth the transition of optical impedance, reduce abrupt reflection at the interface, facilitate the control of interference cancellation of reflected light, and reduce the reflectivity of the light-shielding structure 11.

[0073] Optionally, in some embodiments of this application, the orthographic projection of the second metal part 112 onto the plane containing the first metal part 111 is located within the outline region of the first metal part 111.

[0074] This arrangement ensures that the second metal part 112 fully overlaps with the first metal part 111, avoiding the problem of increased reflectivity caused by the second metal part 112 extending beyond the first metal part 111 in a single layer.

[0075] Optionally, in some embodiments of this application, the side surface of the first metal part 111, the side surface of the first insulating layer 113, and the side surface of the second metal part 112 are sequentially connected to form a first inclined plane x1.

[0076] It should be noted that the side of the light-shielding structure 11 is a first inclined plane x1, which makes the first metal part 111 and the second metal part 112 overlap, thereby minimizing the risk that the first metal part 111 will exceed the second metal part 112 to form a single-layer reflective layer, and thus reducing the reflectivity of the light-shielding structure 11.

[0077] Optionally, the inclination angle a1 of the first inclined plane x1 is between 20 degrees and 80 degrees, for example, it can be 20 degrees, 25 degrees, 30 degrees, 35 degrees, 40 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, 65 degrees, 70 degrees, 75 degrees or 80 degrees.

[0078] It is understandable that the larger the tilt angle a1 of the first inclined plane x1, the smaller the thickness of the subsequent film layer covering the first inclined plane x1, and the greater the risk of breakage. On the other hand, the smaller the tilt angle a1 of the first inclined plane x1, the greater the difficulty of the process. Furthermore, the greater the difference in width between the first metal part 111 and the second metal part 112, the higher the reflectivity of the light-shielding structure 11. Therefore, the tilt angle a1 of the first inclined plane x1 is limited to between 20 degrees and 80 degrees, which can balance reducing the reflectivity of the light-shielding structure 11 with improving the coverage integrity of the subsequent film layer.

[0079] Optionally, in some embodiments of this application, the array substrate 10 further includes a second insulating layer 106, which covers the side of the data line 102 away from the first substrate 101, and the light-shielding structure 11 is directly formed on the surface of the second insulating layer 106 away from the first substrate 101.

[0080] The second insulating layer 106 includes a first portion 10a and a second portion 10b connected together. In the thickness direction of the display panel 100, the first portion 10a corresponds to the light-shielding structure 11, and the first portion 10a and the light-shielding structure 11 are at least partially overlapped. The second portion 10b corresponds to the area outside the light-shielding structure 11.

[0081] The thickness of part 10a is greater than the thickness of part 10b.

[0082] It is understandable that by using the light-shielding structure 11 as a mask to etch the second insulating layer 106, the area of ​​the second insulating layer 106 outside the light-shielding structure 11 that is exposed is thinned, thereby reducing the loss of light passing through the second insulating layer 106 and thus improving the light transmittance of the display panel 100.

[0083] Optionally, in some embodiments of this application, the side surface x01 of the portion of the first part 10a protruding from the second part 10b, the side surface of the first metal part 111, the side surface of the first insulating layer 113, and the side surface of the second metal part 112 are connected to form a second inclined plane x2. The inclination angle of the second inclined plane x2 is between 20 degrees and 80 degrees.

[0084] In other words, the side x01 of the portion of the first part 10a that protrudes from the second part 10b is flush with the first inclined plane x1 of the light-shielding structure 11 to form the second inclined plane x2. The formation of the second inclined plane x2 avoids the risk of a bottom cut-out below the light-shielding structure 11.

[0085] It should be noted that the inclination angle of the second inclined plane x2 is equal to the inclination angle a1 of the first inclined plane x1.

[0086] Understandably, the larger the tilt angle of the second inclined plane x2, the smaller the thickness of the subsequent film layer covering the second inclined plane x2, and the greater the risk of breakage. In particular, after adding the first part 10a, the height of the light-shielding structure 11 is greater, which increases the risk of breakage of the subsequent film layer covering the second inclined plane x2. On the other hand, the smaller the tilt angle of the second inclined plane x2, the greater the difficulty of the process, and the greater the difference in width between the first metal part 111 and the second metal part 112, the higher the reflectivity of the light-shielding structure 11. Therefore, limiting the tilt angle of the second inclined plane x2 to between 20 degrees and 80 degrees can simultaneously reduce the reflectivity of the light-shielding structure 11 and improve the coverage integrity of the subsequent film layer.

[0087] Optionally, in some embodiments of this application, the thickness of the first part 10a is between 2000 angstroms and 4000 angstroms, and the thickness of the second part 10b is less than or equal to 1000 angstroms.

[0088] Understandably, the smaller the thickness of the second part 10b, the greater the light transmittance of the display panel 100, but the worse its insulation effect. Therefore, the second part 10b should not be too small. For example, the second part 10b can be 1000 angstroms, 900 angstroms, 800 angstroms, 700 angstroms, 600 angstroms, or 500 angstroms. The thickness of the first part 10a can be 2000 angstroms, 2500 angstroms, 3000 angstroms, 3500 angstroms, or 4000 angstroms.

[0089] Additionally, it's important to understand that in related technologies, the light-shielding metal on the array substrate side serves as the black matrix layer in the data line direction, and using a double-layer metal as the black matrix layer is a common approach. However, when fabricating the black matrix layer of the double-layer metal on the array substrate, directly inserting the entire metal surface into a conventional chemical vapor deposition (CVD) machine can cause arc discharge. Therefore, only the first metal layer r1 can be patterned once using photolithography, followed by the formation of the inorganic film and the second metal layer r2, and then etching. Due to differences in linewidth and overlap between the two photolithographic patterning steps, the second metal layer r2 and the first metal layer r1 cannot be perfectly aligned, resulting in the exposure of a single metal layer (e.g., ...). Figure 4 As shown in the figure, the exposure of a single layer of metal will result in a higher overall reflectivity.

[0090] Accordingly, this application also provides a method for preparing a display panel 100, the method being used to prepare the display panel 100 of the above embodiments.

[0091] The manufacturing method includes preparing an array substrate and a counter substrate, and assembling the array substrate and the counter substrate to form the display panel 100.

[0092] The fabrication of the array substrate 10 includes the following steps:

[0093] In step B01, a data line 102 and a second insulating layer 106 are formed on the first substrate 101, and the second insulating layer 106 covers the side of the data line 102 away from the first substrate 101.

[0094] In step B02, a light-shielding structure 11 is formed on the second insulating layer 106. The light-shielding structure 11 includes a first metal portion 111, a first insulating layer 113, and a second metal portion 112 stacked sequentially. The first metal portion 111 is located on the side of the first insulating layer 113 closer to the first substrate 101. From the first substrate 101 toward the light-shielding structure 11, the thickness of the first metal portion 111, the thickness of the first insulating layer 113, and the thickness of the second metal portion 112 decreases layer by layer.

[0095] In step B01, please refer to... Figure 5 A data line 102 and a second insulating layer 106 are formed on the first substrate 101.

[0096] Optionally, step B01 includes forming a light-shielding layer 103, a buffer layer 104, a thin-film transistor t1, a planarization layer 105, and a second insulating layer 106 on the first substrate 101. The data line 102 and the source (input) of the thin-film transistor t1 are disposed on the same layer, and the data line 102 is connected to the source of the thin-film transistor t1.

[0097] Optionally, the second insulating layer 106 may be formed as a bilayer by stacking inorganic layers comprising at least one of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, magnesium oxide, and titanium oxide, or as a multilayer by alternately stacking inorganic layers comprising at least one of silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, magnesium oxide, and titanium oxide. However, this disclosure is not limited thereto, and the second insulating layer 106 may be formed as a single inorganic layer comprising the aforementioned insulating material.

[0098] Then proceed to step B02.

[0099] In step B02, please refer to Figure 6 A light-shielding structure 11 is formed on the second insulating layer 106.

[0100] Step B02 includes the following steps:

[0101] Step B021: A patterned first metal portion 111 is formed on the second insulating layer 106.

[0102] The process includes the following steps before forming the first metal portion 111: obtaining a safety distance based on the width of the set light-shielding structure 11 and the process error, and obtaining the initial width of the first metal portion 111 for the first patterning based on the safety distance and the set width of the light-shielding structure 11, so that the subsequent second metal portion 112 completely overlaps the first metal portion 111, thereby reducing the risk that the subsequent second metal portion 112 will exceed the first metal portion 111; subsequently, forming a metal layer on the second insulating layer 106, and forming the patterned first metal portion 111 based on the initial width of the first metal portion 111.

[0103] It is understood that in step B021, the initial width of the first metal part 111 has the safety distance to ensure that the subsequent second metal part 112 fully overlaps the first metal part 111.

[0104] Optionally, the safety distance may vary depending on the process and equipment, so it is not limited here, as long as the subsequent second metal part 112 can be fully overlapped with the first metal part 111.

[0105] Then proceed to step B022.

[0106] In step B022, an insulating material layer j1 and a metal material layer j2 are sequentially formed on the first metal portion 111. A patterned photoresist portion g1 is formed on the metal material layer j2, and the photoresist portion g1 is disposed directly above the first metal portion 111. Based on the orthogonal projection direction of the first substrate 101, both sides of the first metal portion 111 extend beyond the sides of the photoresist portion g1.

[0107] Optionally, the insulating material layer j1 and the metal material layer j2 completely cover the second insulating layer 106 and the first metal portion 111. The insulating material layer j1 can be made of at least one of silicon oxide, silicon nitride, and aluminum oxide. The metal material layer j2 is a metal material with high reflectivity.

[0108] Optionally, the first metal portion 111 and the metal material layer j2 are made of the same material, and both are made of molybdenum. The insulating material layer j1 is made of silicon nitride. The thickness of the first metal portion 111 is greater than the thickness of the insulating material layer j1, and the thickness of the insulating material layer j1 is greater than the thickness of the metal material layer j2.

[0109] It should be understood that the size of the photoresist g1 determines the size of the light-shielding structure 11. Therefore, the photoresist g1 is set to completely overlap the first metal part 111 to ensure that the subsequent second metal part 112 completely overlaps the first metal part 111.

[0110] Then proceed to step B023.

[0111] In step B023, using the photoresist layer g1 as a mask, the insulating material layer j1 and the metal material layer j2 are etched to form the first insulating layer 113 and the second metal layer 112. Based on the orthogonal projection direction of the first substrate 101, both sides of the first metal layer 111 extend beyond the sides of the second metal layer 112.

[0112] Optionally, the insulating material layer j1 and the metal material layer j2 can be etched using a dry etching method.

[0113] Then proceed to step B024.

[0114] In step B024, the exposed portion of the second insulating layer 106 and the portion of the first metal portion 111 extending beyond the first insulating layer 113 are simultaneously etched to thin the portion of the second insulating layer 106 outside the second metal portion 112, such that the thinned portion of the second insulating layer 106 is the second portion 10b, the portion corresponding to the second metal portion 112 is the first portion 10a, and the side surface of the first portion 10a, the side surface of the first metal portion 111, the side surface of the first insulating layer 113, and the side surface of the second metal portion 112 are connected to form a second inclined plane x2.

[0115] At this time, the first metal part 111, the first insulating layer 113, and the second metal part 112 are stacked to form a light-shielding structure 11.

[0116] It is understandable that, based on the fact that the first metal part 111 needs to be etched beyond the first insulating layer 113, when etching is performed using etching gas, the etching gas will also etch the exposed second insulating layer 106, thereby thinning the second insulating layer 106 to improve light transmittance.

[0117] Then proceed to step B03.

[0118] Reference Figure 1 In the middle array substrate 10, in step B03, a third insulating layer 107, a first common electrode layer 121, a fourth insulating layer 108, a pixel electrode layer 123, a fifth insulating layer 109, and a second common electrode layer 122 are formed on the second insulating layer 106.

[0119] The above are the relevant steps in the preparation method of the display panel 100.

[0120] Please refer to Figure 7 Accordingly, this application also provides a display device 1000, which includes a display panel 100 as described in any of the above embodiments.

[0121] It should be noted that the structure of the display panel 100 of the display device 1000 in this application embodiment is similar to or the same as the structure of the display panel 100 of any of the above embodiments. Please refer to [link / reference] for details. Figures 1 to 6 The relevant explanations will not be repeated here.

[0122] In some embodiments, the display device 1000 further includes a backlight module, and the display panel 100 is disposed on the light-emitting side of the backlight module.

[0123] The display device 1000 of this application embodiment is provided with a light-shielding structure 11, which includes a first metal part 111, a first insulating layer 113, and a second metal part 112 stacked together. In the light-shielding structure 11, the thickness of the first metal part 111, the thickness of the first insulating layer 113, and the thickness of the second metal part 112 decrease layer by layer in the direction from the first substrate 101 toward the display surface of the display panel 100.

[0124] Understandably, the second metal portion 112 has the smallest thickness so that a portion of the external light is reflected by the second metal portion 112, while the remaining portion can pass through the second metal portion 112 and be reflected by the first metal portion 111, resulting in destructive interference of the reflected light. Secondly, the thickness of the first insulating layer 113 is between the thickness of the first metal portion 111 and the thickness of the second metal portion 112, which allows for better adjustment of the phase difference between the reflected light from the first metal portion 111 and the second metal portion 112, bringing it close to half a wavelength, thereby achieving efficient destructive interference. Furthermore, the maximum thickness of the first metal portion 111 can better block external light from passing through it, improving the light-shielding effect.

[0125] Optionally, the display device 1000 can be applied to and used in a variety of products, including, for example, televisions, laptop computers, monitors, billboards, Internet of Things (IoT) devices, and portable electronic devices including mobile phones, smartphones, tablet computers, mobile communication terminals, electronic notebooks, e-books, portable multimedia players (PMPs), navigation devices, and ultra-mobile personal computers (UMPCs).

[0126] Furthermore, the display device 1000 according to some embodiments can be applied to wearable devices and can be used within wearable devices, including smartwatches, watch phones, glasses-type displays, and head-mounted displays (HMDs), such as VR or AR displays.

[0127] The above provides a detailed description of a display panel, its preparation method, and the display device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the methods and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A display panel, characterized in that, Including array substrate; The array substrate includes a first substrate, a data line, and a light-shielding structure. The data line is disposed on the first substrate, and the data line and the light-shielding structure are disposed in different layers. The light-shielding structure is disposed on the side of the data line away from the first substrate, and the light-shielding structure correspondingly blocks the data line. The light-shielding structure includes a first metal part, a first insulating layer, and a second metal part stacked sequentially. The first metal part is located on the side of the first insulating layer close to the first substrate. From the first substrate toward the display surface of the display panel, the thickness of the first metal part, the thickness of the first insulating layer, and the thickness of the second metal part decrease layer by layer.

2. The display panel according to claim 1, characterized in that, The ratio of the thickness of the first metal part to the thickness of the second metal part is between 10:1 and 20:

1.

3. The display panel according to claim 2, characterized in that, The orthographic projection of the second metal part onto the plane containing the first metal part lies within the outline region of the first metal part.

4. The display panel according to claim 3, characterized in that, The side surface of the first metal part, the side surface of the first insulating layer, and the side surface of the second metal part are sequentially connected to form a first inclined plane, and the inclination angle of the first inclined plane is between 20 degrees and 80 degrees.

5. The display panel according to any one of claims 1-4, characterized in that, The thickness d of the first insulating layer satisfies the following formula: d = λ / (4n), where λ is the target wavelength and n is the refractive index of the first insulating layer.

6. The display panel according to claim 5, characterized in that, The first insulating layer includes a first sub-layer and a second sub-layer stacked together, wherein the refractive index of the first sub-layer and the refractive index of the second sub-layer are different.

7. The display panel according to claim 1, characterized in that, The array substrate further includes a second insulating layer, which covers the side of the data line away from the first substrate, and the light-shielding structure is formed directly on the surface of the second insulating layer away from the first substrate. The second insulating layer includes a first part and a second part connected together. In the thickness direction of the display panel, the first part corresponds to the light-shielding structure, and the first part and the light-shielding structure are at least partially overlapped. The second part corresponds to the area outside the light-shielding structure. The thickness of the first part is greater than the thickness of the second part.

8. The display panel according to claim 7, characterized in that, The side of the portion of the first part protruding from the second part, the side of the first metal part, the side of the first insulating layer, and the side of the second metal part are connected to form a second inclined plane, and the inclination angle of the second inclined plane is between 20 degrees and 80 degrees.

9. The display panel according to claim 7, characterized in that, The thickness of the first part is between 2,000 and 4,000 angstroms, and the thickness of the second part is less than or equal to 1,000 angstroms.

10. A method for manufacturing a display panel, characterized in that, The process includes fabricating an array substrate, which comprises the following steps: A data line and a second insulating layer are formed on a first substrate, the second insulating layer covering the side of the data line away from the first substrate; A light-shielding structure is formed on the second insulating layer. The light-shielding structure includes a first metal part, a first insulating layer and a second metal part stacked sequentially. The first metal part is located on the side of the first insulating layer close to the first substrate. From the first substrate toward the light-shielding structure, the thickness of the first metal part, the thickness of the first insulating layer and the thickness of the second metal part decrease layer by layer.

11. The method for manufacturing a display panel according to claim 10, characterized in that, Forming a light-shielding structure on the second insulating layer includes the following steps: A patterned first metal portion is formed on the second insulating layer; An insulating material layer and a metal material layer are sequentially formed on the first metal part; A patterned photoresist portion is formed on the metal material layer, and the photoresist portion is disposed directly above the first metal portion. Based on the orthogonal projection direction of the first substrate, both sides of the first metal portion extend beyond the side edges of the photoresist portion. Using the photoresist portion as a mask, the insulating material layer and the metal material layer are etched to form a first insulating layer and a second metal portion. Based on the orthogonal projection direction of the first substrate, both sides of the first metal portion extend beyond the side edges of the second metal portion. Simultaneously, the exposed portion of the second insulating layer and the portion of the first metal portion extending beyond the first insulating layer are etched to thin the portion of the second insulating layer corresponding to the portion outside the second metal portion, such that the thinned portion of the second insulating layer is the second portion, the portion corresponding to the second metal portion is the first portion, and the side surface of the first portion, the side surface of the first metal portion, the side surface of the first insulating layer, and the side surface of the second metal portion are connected to form a second inclined plane.

12. A display device, characterized in that, Includes the display panel as described in any one of claims 1-9.

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