Display panel and display device

Abstract

This application relates to the field of integrated circuit technology, and in particular to a display panel and a display device. The display panel includes an aperture region, a display region, and an edge, with the aperture region located between the display region and the edge. The aperture region is used to form an opening. The display panel includes: a substrate; a wiring layer located on one side of the substrate; a light-emitting material layer covering the surface of the wiring layer away from the substrate and the substrate within the aperture region; a first inorganic encapsulation layer covering the light-emitting material layer and the sidewalls of the wiring layer within the aperture region; an organic encapsulation layer covering the first inorganic encapsulation layer; and a plurality of spaced-apart crack-stopping structures connecting the first inorganic encapsulation layer located in the aperture region. The crack-stopping structures are located between the first inorganic encapsulation layer and the organic encapsulation layer, and / or between the first inorganic encapsulation layer and the light-emitting material layer. The material of the crack-stopping structures includes inorganic materials, and the height of the crack-stopping structures near the edge is greater than the height of the crack-stopping structures near the display region.

Description

Technical Field

[0001] This application relates to the field of integrated circuit technology, and in particular to a display panel and display device. Background Technology

[0002] Display panels are a key component of electronic devices, widely used in various electronic products such as smartphones, tablets, televisions, computer monitors, and automotive displays. As the direct interface for human-computer interaction, they are responsible for converting electronic signals into visual images or text information, enabling users to intuitively acquire and process data.

[0003] Currently, display panels are often equipped with components such as cameras. In related technologies, before assembling the camera, it is often necessary to use methods such as laser cutting to create an opening in the display panel, and then install the camera in this opening. However, when cutting to create the opening, cracks are often formed in the display panel. These cracks may even extend into the display area of ​​the display panel, leading to moisture intrusion, forming black spots in the hole area, and affecting the display effect. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel and display device that address the problem of cracks in existing display panels.

[0005] To achieve the above objectives, in one aspect, a display panel is provided, the display panel including a hole area, a display area, and an edge, the hole area being located between the display area and the edge, the hole area being used to form an opening, the display panel comprising:

[0006] Substrate;

[0007] The wiring layer is located on one side of the substrate;

[0008] A light-emitting material layer that covers the surface of the wiring layer away from the substrate and the substrate within the aperture region;

[0009] A first inorganic encapsulation layer covers the light-emitting material layer and the sidewall of the wiring layer within the hole area;

[0010] An organic encapsulation layer covers the first inorganic encapsulation layer;

[0011] Multiple spaced-apart crack-stopping structures are connected to the first inorganic encapsulation layer located in the hole area. The crack-stopping structures are located between the first inorganic encapsulation layer and the organic encapsulation layer, and / or, the crack-stopping structures are located between the first inorganic encapsulation layer and the light-emitting material layer. The material of the crack-stopping structures includes inorganic materials, and the height of the crack-stopping structures near the edge is greater than the height of the crack-stopping structures near the display area.

[0012] In one embodiment, the wiring layer includes a plurality of wiring portions spaced apart, the light-emitting material layer includes a first light-emitting portion and a second light-emitting portion, the first light-emitting portion covers the surface of the wiring portions away from the substrate, the second light-emitting portion covers the substrate between the wiring portions, and the crack-stopping structure includes a first crack-stopping portion located on the side of the second light-emitting portion away from the substrate.

[0013] In one embodiment, the surface of the first anti-crack portion away from the substrate has a first height with respect to the substrate, and the surface of the first inorganic encapsulation layer covering the first light-emitting portion away from the substrate has a second height with respect to the substrate, wherein the first height is less than the second height.

[0014] In one embodiment, the wiring layer includes a plurality of wiring portions spaced apart, the light-emitting material layer includes a first light-emitting portion and a second light-emitting portion, the first light-emitting portion covers the side of the wiring portions away from the substrate, the second light-emitting portion covers the substrate between the wiring portions, and the crack-stopping structure includes a second crack-stopping portion located on the side of the first light-emitting portion away from the substrate.

[0015] In one embodiment, the crack-stopping structure is an integral structure with the first inorganic encapsulation layer.

[0016] In one embodiment, the display panel further includes:

[0017] A barrier structure is located within the aperture area and on the side close to the display area. The surface of the barrier structure away from the substrate has a third height with the substrate. The surface of the crack-stopping structure away from the substrate has a fourth height with the substrate. The highest of the third height is the same as the highest of the fourth height.

[0018] In one embodiment, the material of the retaining wall structure is the same as the material of the crack-stopping structure.

[0019] In one embodiment, the material of the crack-stopping structure is the same as the material of the first inorganic encapsulation layer.

[0020] In one embodiment, the display panel further includes:

[0021] A touch layer that covers the organic encapsulation layer within the hole area.

[0022] On the other hand, a display device is also provided, the display device including the display panel as provided in any of the foregoing embodiments.

[0023] The display panel and display device of this application have the following beneficial effects: First, by providing a crack-stopping structure between the first inorganic encapsulation layer and the organic encapsulation layer, and / or by providing a crack-stopping structure between the first inorganic encapsulation layer and the light-emitting material layer, when drilling holes in the hole area of ​​the display panel, if a crack occurs in the first inorganic encapsulation layer, the crack can extend towards the crack-stopping structure, thereby preventing the crack from extending into the display area. Second, in this application, when a crack deflects at a large angle at the crack-stopping structure (e.g., the crack can deflect from a direction parallel to the substrate to a direction perpendicular to the substrate), more energy is required, thereby further preventing crack extension. Third, in this application, the height of the crack-stopping structure near the edge can be greater than the height of the crack-stopping structure near the display area, thereby ensuring sufficient organic encapsulation layer above the crack-stopping structure near the display area, thus improving the encapsulation reliability of the display area of ​​the display panel. In this application, by setting a crack-prevention structure, the probability of cracks appearing in the first inorganic encapsulation layer of the display area is reduced, thereby reducing the possibility of moisture intrusion, improving the encapsulation reliability of the display panel, reducing the possibility of black spots appearing in the hole area, and also improving the display effect of the display panel. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of a crack-arresting structure provided in one embodiment;

[0026] Figure 2 This is a schematic diagram of the first crack-stopping part provided in one embodiment;

[0027] Figure 3 This is a schematic diagram of the first crack-stopping part provided in another embodiment;

[0028] Figure 4 This is a schematic diagram of the second crack-stopping part provided in one embodiment;

[0029] Figure 5 This is a schematic diagram of the first crack-stopping part provided in another embodiment;

[0030] Figure 6 This is a schematic diagram of a retaining wall structure provided in one embodiment;

[0031] Figure 7 This is a schematic diagram of a retaining wall structure provided in another embodiment;

[0032] Figure 8 This is a flowchart of a method for manufacturing a display panel according to one embodiment.

[0033] Explanation of reference numerals in the attached drawings: Display panel - 10; Hole area - 11; Substrate - 111; Wiring layer - 112; Light-emitting material layer - 113; First light-emitting part - 1131; Second light-emitting part - 1132; First inorganic encapsulation layer - 114; Organic encapsulation layer - 115; Crack-stopping structure - 116; First crack-stopping part - 1161; Second crack-stopping part - 1162; Barrier structure - 117; Touch layer - 118.

[0034] To better describe and illustrate embodiments and / or examples of the inventions disclosed herein, reference may be made to one or more accompanying drawings. Additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed inventions, the currently described embodiments and / or examples, or the best mode of these inventions as currently understood. Detailed Implementation

[0035] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate preferred embodiments of the application. However, this application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0037] In each embodiment, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in each embodiment according to the specific circumstances.

[0038] It should be understood that when an element or layer is referred to as "on," "adjacent to," or "connected to" other elements or layers, it may be directly on, adjacent to, or connected to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," or "directly connected to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this embodiment, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion.

[0039] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0040] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that when the terms “comprise” and / or “comprising” are used in this specification, the presence of the stated feature, integer, step, operation, element, and / or part is established, but the presence or addition of one or more other features, integers, steps, operations, elements, parts, and / or groups is not excluded. Meanwhile, when used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0041] Embodiments of this application are described herein with reference to cross-sectional views illustrating preferred embodiments (and intermediate structures), thus allowing for the expectation of variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances. Therefore, embodiments of this application should not be limited to the specific shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing techniques. The regions shown in the figures are substantially schematic, and their shapes do not represent the actual shapes of regions of the device, nor do they limit the scope of embodiments of this application.

[0042] In one embodiment, see Figures 1 to 7 A display panel 10 is provided. The display panel 10 may include an aperture area 11, a display area, and an edge. The edge of the display panel 10 may surround the display area, and the aperture area 11 may be located between the display area and the edge of the display panel 10. The aperture area 11 may be used to form an opening, and the interior of the opening may be used to mount components such as a camera. This embodiment does not limit the specific dimensions of the aperture area 11, the display area, and the edge.

[0043] The display panel 10 may include a substrate 111, a wiring layer 112, a light-emitting material layer 113, a first inorganic encapsulation layer 114, an organic encapsulation layer 115, and a plurality of spaced crack-prevention structures 116.

[0044] The substrate 111 may include a substrate and a multilayer circuit on the substrate. Furthermore, electronic devices such as capacitors may also be disposed on the substrate 111.

[0045] The wiring layer 112 may be located on one side of the substrate 111. The material of the wiring layer 112 may include metal. As an example, the material of the wiring layer 112 may include tungsten, titanium, molybdenum, copper, aluminum, or alloys, etc. It is understood that the wiring layer 112 may include multiple wirings, some of which may extend from the display area through the via area 11 to the edge, and some of which may be located only in the display area, via area 11, or the edge.

[0046] In the cross-sectional view of the display panel 10, the wiring layer 112 may include a plurality of wiring portions spaced apart. The material of the plurality of wiring portions may be the same. A substrate 111 may be included between adjacent wiring portions. This embodiment does not limit the specific number or size of the wiring portions.

[0047] The light-emitting material layer 113 can cover the wiring layer 112 and the substrate 111. Specifically, the light-emitting material layer 113 includes a first light-emitting portion 1131 and a second light-emitting portion 1132. The first light-emitting portion 1131 can cover the wiring portion, and the second light-emitting portion 1132 can cover the substrate 111 between the wiring portions. As an example, when forming the light-emitting material layer 113, the light-emitting material can be deposited over the entire surface of the via region 11, so that the light-emitting material located on the side of the wiring portion away from the substrate 111 forms the first light-emitting portion 1131, and the light-emitting material located on the substrate 111 between the wiring portions forms the second light-emitting portion 1132.

[0048] Furthermore, in the display area, the light-emitting material layer 113 can be used to form an organic light-emitting diode (OLED) display panel 10. As an example, the light-emitting material layer 113 in the display area may include a red light layer, a green light layer, and a blue light layer. The red light layer, green light layer, and blue light layer can be arranged sequentially and repeatedly according to a predetermined order. Specifically, the red light layer, green light layer, and blue light layer in the display area can be fabricated using equipment such as a fine metal mask (FMM). For example, the fine metal mask may have multiple openings, and the red light layer, green light layer, and blue light layer can be formed based on these openings respectively. Of course, the fabrication method of the light-emitting material layer 113 is not limited to the fabrication method described in this application.

[0049] The first inorganic encapsulation layer 114 may cover the light-emitting material layer 113. Specifically, the first inorganic encapsulation layer 114 may cover the side of the first light-emitting part 1131 away from the substrate 111 and its sidewall, the side of the second light-emitting part 1132 away from the substrate 111 and its sidewall of the wiring portion. The material of the first inorganic encapsulation layer 114 may include silicon nitride, silicon oxide, silicon oxynitride, silicon carbonitride, aluminum oxide, or zirconium oxide, etc. It is understood that the first inorganic encapsulation layer 114 may be a single-layer structure or a multi-layer structure. As an example, the first inorganic encapsulation layer 114 may include two or three layers.

[0050] Furthermore, after forming the luminescent material layer 113, a first inorganic encapsulation layer 114 can be formed using a deposition process. The deposition process may include, but is not limited to, one or more of the following: chemical vapor deposition, atomic layer deposition, high-density plasma deposition, plasma-enhanced deposition, and spin-coating of a dielectric layer. This embodiment does not limit the specific material or formation method of the first inorganic encapsulation layer 114.

[0051] The organic encapsulation layer 115 may cover the first inorganic encapsulation layer 114. As an example, the material of the organic encapsulation layer 115 may include polymer materials such as epoxy resin, acrylic resin, polyimide, or silicone resin. In this case, a flatter surface can be obtained by forming the organic encapsulation layer 115, which is conducive to the formation of other film layer structures on the organic encapsulation layer 115.

[0052] The crack-stop structure 116 can connect to the first inorganic encapsulation layer 114 located in the via region 11. See, for example... Figure 2 In a direction perpendicular to the substrate 111, the crack-stopping structure 116 may be located between the first inorganic encapsulation layer 114 and the organic encapsulation layer 115, and / or, please refer to Figure 3 The crack-stopping structure 116 can be located between the first inorganic encapsulation layer 114 and the light-emitting material layer 113. It is understood that when the crack-stopping structure 116 is located between the first inorganic encapsulation layer 114 and the organic encapsulation layer 115, the crack-stopping structure 116 can be located on the side of the first inorganic encapsulation layer 114 facing away from the substrate 111, and the crack-stopping structure 116 can protrude in a direction away from the substrate 111. When the crack-stopping structure 116 is located between the first inorganic encapsulation layer 114 and the light-emitting material layer 113, the first inorganic encapsulation layer 114 covers the crack-stopping structure 116, and the portion of the first inorganic encapsulation layer 114 covering the crack-stopping structure 116 protrudes in a direction away from the substrate 111.

[0053] The crack arrest structure 116 is made of inorganic materials. As an example, the material of the crack arrest structure 116 is the same as the material of the first inorganic encapsulation layer 114. Specifically, the material of the crack arrest structure 116 includes silicon nitride, silicon oxide, silicon oxynitride, silicon carbonitride, aluminum oxide, or zirconium oxide, etc.

[0054] The hole area 11 of the display panel 10 may include a plurality of spaced-apart crack-stopping structures 116, and the height of the crack-stopping structures 116 near the edge may be greater than the height of the crack-stopping structures 116 near the display area. In one possible example, the height of the crack-stopping structures 116 gradually increases in the direction from the display area to the edge. In another possible example, the hole area 11 of the display panel 10 may have a first region and a second region continuously arranged, the first region being near the edge and far from the display area, and the second region being near the display area and far from the edge. The crack-stopping structures 116 located in the first region have a uniform height, the crack-stopping structures 116 located in the second region have a uniform height, and the height of the crack-stopping structures 116 in the first region may be greater than the height of the crack-stopping structures 116 in the second region. This embodiment does not limit the maximum and minimum height of the crack-stopping structures 116.

[0055] In this embodiment, firstly, by providing a crack-stopping structure 116 between the first inorganic encapsulation layer 114 and the organic encapsulation layer 115, and / or by providing a crack-stopping structure 116 between the first inorganic encapsulation layer 114 and the light-emitting material layer 113, when drilling holes in the hole area 11 of the display panel 10, if a crack appears in the first inorganic encapsulation layer 114, the crack can extend towards the crack-stopping structure 116, thereby preventing the crack from extending into the display area. Secondly, in this embodiment, when the crack deflects at a large angle at the crack-stopping structure 116 (for example, the crack can deflect from a direction parallel to the substrate 111 to a direction perpendicular to the substrate 111), more energy is required, thereby further preventing crack extension. Furthermore, in this embodiment, the height of the crack-stopping structure 116 near the edge can be greater than the height of the crack-stopping structure 116 near the display area, thereby ensuring sufficient organic encapsulation layer 115 above the crack-stopping structure 116 near the display area, thus improving the encapsulation reliability of the display area of ​​the display panel 10. In this embodiment, by setting the crack-prevention structure 116, the probability of cracks appearing in the first inorganic encapsulation layer 114 of the display area is reduced, thereby reducing the possibility of moisture intrusion, improving the encapsulation reliability of the display panel 10, reducing the possibility of black spots appearing in the hole area 11, and also improving the display effect of the display panel 10.

[0056] Furthermore, a second inorganic encapsulation layer can be formed on the side of the organic encapsulation layer 115 away from the substrate 111. As an example, the material of the second inorganic encapsulation layer can be the same as the material of the first inorganic encapsulation layer 114. In this embodiment, by sequentially providing the first inorganic encapsulation layer 114, the organic encapsulation layer 115, and the second inorganic encapsulation layer, the probability of moisture intrusion is reduced, thereby improving the encapsulation reliability of the display panel 10.

[0057] In one possible example, please see Figure 2 The crack-stopping structure 116 may include a first crack-stopping portion 1161. In a direction parallel to the substrate 111, the first crack-stopping portion 1161 is located on the side of the second light-emitting portion 1132 away from the substrate 111.

[0058] As an example, the wiring layer 112 may include a plurality of wiring portions spaced apart, and the second light-emitting portion 1132 of the light-emitting material layer 113 covers the substrate 111 between the wiring portions. Therefore, the first inorganic encapsulation layer 114 may form a recess between adjacent wiring portions. At this time, the first crack-stopping portion 1161 may be located at the recess.

[0059] Furthermore, when the first crack-stopping portion 1161 is located between the first inorganic encapsulation layer 114 and the organic encapsulation layer 115, the surface of the first crack-stopping portion 1161 away from the substrate 111 can have a first height ( Figure 2In h1), the surface of the first inorganic encapsulation layer 114 covering the first light-emitting part 1131 away from the substrate 111 may have a second height (h1), and the surface of the first inorganic encapsulation layer 114 away from the substrate 111 may have a second height (h1). Figure 2 In the example above (h2), the first height can be less than the second height. Firstly, by setting the height of the first anti-crack portion 1161 to a lower value, the organic encapsulation layer 115 on the side of the first anti-crack portion 1161 away from the substrate 111 is ensured to have a thicker thickness, thereby ensuring the encapsulation reliability of the hole area 11 of the display panel 10. Secondly, in this example, by placing the first anti-crack portion 1161 in the recess of the first inorganic encapsulation layer 114, the anti-crack structure 116 is prevented from increasing the thickness of the display panel 10, which is beneficial for making the display panel 10 thinner.

[0060] In another possible example, see Figure 4 The crack-stopping structure 116 may include a second crack-stopping part 1162, which may be located on the side of the first light-emitting part 1131 away from the substrate 111.

[0061] In this example, by setting the second anti-crack portion 1162 on the side of the first light-emitting portion 1131 away from the substrate 111, not only is the process simpler, but the anti-crack structure 116 also does not occupy the volume between adjacent traces, which is conducive to the organic material layer between adjacent traces filling the depression and avoiding the generation of gaps.

[0062] Of course, please see Figure 1 The display panel 10 can be provided with a first crack-stopping part 1161 and a second crack-stopping part 1162 simultaneously, thereby further preventing cracks from extending to the display area. In addition, the first crack-stopping part 1161 and the second crack-stopping part 1162 can each include multiple crack-stopping units, thereby increasing the possibility of crack deflection.

[0063] In yet another possible example, please refer to Figure 5 The crack-stopping structure 116 can be integrally formed with the first inorganic encapsulation layer 114. In this example, the crack-stopping structure 116 and the first inorganic encapsulation layer 114 can be integrated, thereby making the crack-stopping structure 116 and the first inorganic encapsulation layer 114 tightly connected. This is beneficial for the deflection of cracks towards the crack-stopping structure 116 and also reduces the probability of gaps appearing between the crack-stopping structure 116 and the first inorganic encapsulation layer 114, which could lead to moisture intrusion.

[0064] In one embodiment, see Figure 6 and Figure 7 The display panel 10 also includes multiple retaining wall structures 117.

[0065] The barrier structure 117 can be located within the aperture region 11 and on the side closer to the display area. The barrier structure 117 can also be located on the side of the first inorganic encapsulation layer 114 furthest from the substrate 111 (e.g., Figure 6 As shown), the barrier structure 117 can be located on the side of the substrate 111 where the first inorganic encapsulation layer 114 is disposed (e.g., Figure 7 (As shown). As an example, the barrier structure 117 may protrude to the side away from the substrate 111. Furthermore, the cross-sectional view of the barrier structure 117 may be trapezoidal, thereby improving the stability of the barrier structure 117.

[0066] The surface of the barrier structure 117 away from the substrate 111 can have a third height with the substrate 111. Figure 6 h3 or Figure 7 In h3), the surface of the crack-stopping structure 116 away from the substrate 111 can have a fourth height with the substrate 111, the highest of the plurality of third heights and the highest of the plurality of fourth heights ( Figure 6 h4 or Figure 7 The height of the multiple crack-stopping structures 116 and the multiple retaining wall structures 117 can be different. In this embodiment, the maximum height of the crack-stopping structure 116 can be the same as the maximum height of the retaining wall structure 117. This embodiment does not limit the specific maximum height of the crack-stopping structure 116 and the retaining wall structure 117.

[0067] The material of the retaining wall structure 117 can be the same as that of the crack arresting structure 116. As an example, the material of the retaining wall structure 117 may include silicon nitride, silicon oxide, silicon oxynitride, silicon carbonitride, aluminum oxide, or zirconium oxide, etc.

[0068] In this embodiment, by setting the maximum height of the crack-stopping structure 116 to be the same as the maximum height of the retaining wall structure 117, it is ensured that when the organic encapsulation layer 115 is formed, the organic encapsulation layer 115 can flow to the hole region 11, thereby covering the first inorganic encapsulation layer 114 of the hole region 11, and thus together with the first inorganic encapsulation layer 114, the encapsulation reliability of the hole region 11 can be improved.

[0069] Furthermore, the barrier structure 117 can also be located within the aperture region 11 and near the edge, where the barrier structure 117 can be used to prevent the organic encapsulation layer 115 from extending towards the edge. In this case, the height of the barrier structure 117 located within the aperture region 11 and near the edge can be higher than the maximum height of the crack-stopping structure 116.

[0070] In one embodiment, see Figure 1 The display panel 10 also includes a touch layer 118. The touch layer 118 may cover the organic encapsulation layer 115 located in the hole area 11. It is understood that the touch layer 118 may extend from the display area to the hole area 11, thereby covering the organic encapsulation layer 115 located in the hole area 11.

[0071] The touch layer 118 can be used for user touch input and to detect the touch position, thereby improving the efficiency of human-computer interaction. As an example, the touch layer 118 may include a resistive touch sensor, a capacitive touch sensor, etc. In one possible example, when the touch layer 118 is a resistive touch sensor, it may include two layers of transparent conductive material (e.g., an ITO film) with a gap between them. When a finger or stylus touches the display panel 10, the two conductive layers come into contact, causing a change in resistance. The touch position can then be determined by measuring the change in resistance, and feedback can be provided based on the content displayed at that location. In another possible example, when the touch layer 118 is a capacitive touch sensor, the human body's capacitance effect can be utilized; when a finger touches the display panel 10, it changes the capacitance distribution on the screen surface, thereby detecting the touch position.

[0072] In this embodiment, by setting the touch layer 118 to cover the organic encapsulation layer 115 of the hole area 11, the touch function is realized in the hole area 11, thereby increasing the touch area of ​​the display panel 10. Furthermore, in this embodiment, by setting an organic material layer in the hole area 11, support is added to the touch layer 118, which is beneficial to the formation of the touch layer 118.

[0073] Based on the same inventive concept, please refer to Figure 8 In one embodiment, a method for manufacturing a display panel 10 is provided. The display panel 10 includes an aperture region 11, a display area, and an edge. The aperture region 11 is located between the display area and the edge, and the aperture region 11 is used to form an opening. The method for manufacturing the display panel 10 may include the following steps:

[0074] Step S100: Provide substrate 111.

[0075] Step S200: Form a wiring layer 112 on one side of the substrate 111.

[0076] Step S300: A light-emitting material layer 113 is formed on the substrate 111 and the wiring layer 112 within the hole region 11.

[0077] Step S400: A first inorganic encapsulation layer 114 covering the sidewalls of the light-emitting material layer 113 and the wiring layer 112 is formed in the hole area 11, and a plurality of spaced crack-stopping structures 116 are formed. In the direction perpendicular to the substrate 111, the crack-stopping structures 116 are located between the first inorganic encapsulation layer 114 and the organic encapsulation layer 115, and / or, the crack-stopping structures 116 are located between the first inorganic encapsulation layer 114 and the light-emitting material layer 113. The material of the crack-stopping structures 116 includes inorganic materials, and the height of the crack-stopping structures 116 near the edge is greater than the height of the crack-stopping structures 116 near the display area.

[0078] Step S600: Form an organic encapsulation layer 115 covering the first inorganic encapsulation layer 114 and the crack-stopping structure 116.

[0079] In step S100, the substrate 111 may include a substrate and multilayer circuitry located on the substrate. Furthermore, electronic devices such as capacitors may also be disposed on the substrate 111.

[0080] In step S200, the material of the wiring layer 112 may include a metal. For example, the material of the wiring layer 112 may include tungsten, titanium, molybdenum, copper, aluminum, or an alloy. In a cross-sectional view of the display panel 10, the wiring layer 112 may include multiple wiring portions spaced apart. The materials of the multiple wiring portions may be the same. A substrate 111 may be included between adjacent wiring portions. It is understood that the wiring layer 112 may include multiple traces, some of which may extend from the display area through the via area 11 to the edge, and some traces may be located only in the display area, the via area 11, or the edge.

[0081] In step S300, the light-emitting material layer 113 includes a first light-emitting portion 1131 and a second light-emitting portion 1132. The first light-emitting portion 1131 may cover the wiring portion, and the second light-emitting portion 1132 may cover the substrate 111 between the wiring portions. As an example, when forming the light-emitting material layer 113, the light-emitting material can be deposited over the entire surface of the hole region 11, so that the light-emitting material located on the side of the wiring portion away from the substrate 111 forms the first light-emitting portion 1131, and the light-emitting material located on the substrate 111 between the wiring portions forms the second light-emitting portion 1132.

[0082] In step S400, the first inorganic encapsulation layer 114 may cover the light-emitting material layer 113. Specifically, the first inorganic encapsulation layer 114 may cover the side of the first light-emitting part 1131 away from the substrate 111 and its sidewall, the side of the second light-emitting part 1132 away from the substrate 111 and its sidewall of the wiring portion. The material of the first inorganic encapsulation layer 114 may include silicon nitride, silicon oxide, silicon oxynitride, silicon carbonitride, aluminum oxide, or zirconium oxide, etc.

[0083] The crack-stopping structure 116 can be made of the same material as the first inorganic encapsulation layer 114. For example, the material of the crack-stopping structure 116 and the material of the first inorganic encapsulation layer 114 can both be silicon nitride. When the crack-stopping structure 116 is located between the first inorganic encapsulation layer 114 and the organic encapsulation layer 115, the crack-stopping structure 116 can be located on the side of the first inorganic encapsulation layer 114 away from the substrate 111, and the crack-stopping structure 116 can protrude in a direction away from the substrate 111. When the crack-stopping structure 116 is located between the first inorganic encapsulation layer 114 and the light-emitting material layer 113, the first inorganic encapsulation layer 114 covers the crack-stopping structure 116, and the portion of the first inorganic encapsulation layer 114 covering the crack-stopping structure 116 protrudes in a direction away from the substrate 111.

[0084] Specifically, in one possible example, when forming the crack-stopping structure 116, a first inorganic encapsulation layer 114 can be formed over the entire surface of the hole region 11, and then the crack-stopping structure 116 can be formed on the side of the first inorganic encapsulation layer 114 away from the substrate 111, so that the crack-stopping structure 116 is located between the first inorganic encapsulation layer 114 and the organic encapsulation layer 115. In another possible example, the crack-stopping structure 116 can be formed on the second light-emitting part 1132 first, and then the first inorganic encapsulation layer 114 covering the crack-stopping structure 116 can be formed, so that the crack-stopping structure 116 is located between the first inorganic encapsulation layer 114 and the light-emitting material layer 113 (the second light-emitting part 1132). In yet another possible example, the first inorganic encapsulation material layer can be formed over the entire surface first, and the thickness of the first inorganic encapsulation material layer can be relatively thick. Subsequently, a mask and photoresist can be used to pattern the first inorganic encapsulation material layer, thereby forming the first inorganic encapsulation layer 114 and the crack-stopping structure 116 in one process. At this time, the first inorganic encapsulation layer 114 and the crack-stopping structure 116 are an integral structure, which makes the crack-stopping structure 116 and the first inorganic encapsulation layer 114 tightly connected. This is beneficial for cracks to deflect to the crack-stopping structure 116 and also reduces the probability of gaps appearing between the crack-stopping structure 116 and the first inorganic encapsulation layer 114, which could lead to moisture intrusion.

[0085] The hole area 11 of the display panel 10 may include a plurality of spaced-apart crack-stopping structures 116, and the height of the crack-stopping structures 116 closer to the display area may be greater than the height of the crack-stopping structures 116 closer to the edge. In one possible example, the height of the crack-stopping structures 116 gradually increases in the direction of the edge pointed to by the display area. In another possible example, the hole area 11 of the display panel 10 may have a first region and a second region continuously arranged, the first region being closer to the edge and farther from the display area, and the second region being closer to the display area and farther from the edge. The crack-stopping structures 116 located in the first region have a uniform height, the crack-stopping structures 116 located in the second region have a uniform height, and the height of the crack-stopping structures 116 in the first region may be greater than the height of the crack-stopping structures 116 in the second region.

[0086] For example, when forming crack-stopping structures 116 with different heights, a first inorganic encapsulation material layer can be formed on the entire surface first. The thickness of the first inorganic encapsulation material layer can be relatively thick. A half-tone mask can be used in conjunction with the first inorganic encapsulation material layer. The transmittance of the half-tone mask can be set to correspond to the height of the crack-stopping structure 116. Then, after the first inorganic encapsulation material layer is patterned, crack-stopping structures 116 with different heights can be formed.

[0087] In one possible example, the crack-stopping structure 116 may include a first crack-stopping portion 1161. In a direction parallel to the substrate 111, the first crack-stopping portion 1161 is located on the side of the second light-emitting portion 1132 away from the substrate 111. As an example, the wiring layer 112 may include a plurality of spaced-apart wiring portions, and the second light-emitting portion 1132 of the light-emitting material layer 113 covers the substrate 111 between adjacent wiring portions; therefore, the first inorganic encapsulation layer 114 may form a recess between adjacent wiring portions. In this case, the first crack-stopping portion 1161 may be located at this recess.

[0088] Furthermore, when the first anti-crack portion 1161 is located between the first inorganic encapsulation layer 114 and the organic encapsulation layer 115, the surface of the first anti-crack portion 1161 away from the substrate 111 can have a first height, and the surface of the first inorganic encapsulation layer 114 covering the first light-emitting portion 1131 away from the substrate 111 can have a second height, and the first height can be less than the second height. In this example, firstly, by setting the height of the first anti-crack portion 1161 to be relatively low, the organic encapsulation layer 115 on the side of the first anti-crack portion 1161 away from the substrate 111 is ensured to have a thicker thickness, thereby ensuring the encapsulation reliability of the hole area 11 of the display panel 10. Secondly, in this example, by setting the first anti-crack portion 1161 in the recess of the first inorganic encapsulation layer 114, the thickness of the display panel 10 can be prevented from increasing, which is beneficial to the thinning of the display panel 10.

[0089] In another possible example, the crack-stopping structure 116 may include a second crack-stopping portion 1162, which may be located on the side of the first light-emitting portion 1131 away from the substrate 111. In this example, by placing the second crack-stopping portion 1162 on the side of the first light-emitting portion 1131 away from the substrate 111, not only is the process simpler, but the crack-stopping structure 116 also does not occupy the volume between adjacent traces, which facilitates the organic encapsulation layer 115 between adjacent traces filling the recess and avoiding gaps.

[0090] In step S600, the material of the organic encapsulation layer 115 may include polymer materials such as epoxy resin, acrylic resin, polyimide, or silicone resin. Furthermore, by forming the organic encapsulation layer 115, a flatter surface is obtained, which facilitates the formation of other film structures on the organic encapsulation layer 115.

[0091] In this embodiment, firstly, by providing a crack-stopping structure 116 between the first inorganic encapsulation layer 114 and the organic encapsulation layer 115, and / or by providing a crack-stopping structure 116 between the first inorganic encapsulation layer 114 and the light-emitting material layer 113, when drilling holes in the hole area 11 of the display panel 10, if a crack appears in the first inorganic encapsulation layer 114, the crack can extend towards the crack-stopping structure 116, thereby preventing the crack from extending into the display area. Secondly, in this embodiment, when the crack deflects at a large angle at the crack-stopping structure 116 (for example, the crack can deflect from a direction parallel to the substrate 111 to a direction perpendicular to the substrate 111), more energy is required, thereby further preventing crack extension. Furthermore, in this embodiment, the height of the crack-stopping structure 116 near the edge can be greater than the height of the crack-stopping structure 116 near the display area, thereby ensuring sufficient organic encapsulation layer 115 above the crack-stopping structure 116 near the display area, thus improving the encapsulation reliability of the display area of ​​the display panel. In this embodiment, by setting the crack-prevention structure 116, the probability of cracks appearing in the first inorganic encapsulation layer 114 of the display area is reduced, thereby reducing the possibility of moisture intrusion, improving the encapsulation reliability of the display panel 10, reducing the possibility of black spots appearing in the hole area 11, and also improving the display effect of the display panel 10.

[0092] In one embodiment, prior to step S600, the following is included:

[0093] Step S500: A barrier structure 117 is formed on one side of the substrate 111 in the hole area 11 and close to the display area. The surface of the barrier structure 117 away from the substrate 111 has a third height with the substrate 111. The surface of the crack-stopping structure 116 away from the substrate 111 has a fourth height with the substrate 111. The highest height among the multiple third heights is the same as the highest height among the multiple fourth heights.

[0094] As an example, the barrier structure 117 may protrude to the side away from the substrate 111. Furthermore, the cross-sectional view of the barrier structure 117 may be trapezoidal, thereby improving the stability of the barrier structure 117. It is understood that the barrier structure 117 may also be located within the via region 11 and near the edge, where it can be used to prevent the organic encapsulation layer 115 from extending towards the edge during its formation.

[0095] The surface of the barrier structure 117 away from the substrate 111 can have a third height with the substrate 111. Figure 6 h3 or Figure 7 In h3), the surface of the crack-stopping structure 116 away from the substrate 111 can have a fourth height (h3) with the substrate 111. Figure 6 h4 or Figure 7In the example h4), the highest height among the multiple third heights is consistent with the highest height among the multiple fourth heights. It is understood that the heights of the multiple crack-stopping structures 116 and the multiple retaining wall structures 117 can be different. In this embodiment, the highest height of the crack-stopping structure 116 can be set to be the same as the highest height of the retaining wall structure 117. This embodiment does not limit the specific highest heights of the crack-stopping structure 116 and the retaining wall structure 117.

[0096] The material of the retaining wall structure 117 can be the same as that of the crack arresting structure 116. As an example, the material of the retaining wall structure 117 may include silicon nitride, silicon oxide, silicon oxynitride, silicon carbonitride, aluminum oxide, or zirconium oxide, etc.

[0097] In this embodiment, by setting the maximum height of the crack-stopping structure 116 to be the same as the maximum height of the retaining wall structure 117, it is ensured that when the organic encapsulation layer 115 is formed, the organic encapsulation layer 115 can flow to the hole region 11, thereby covering the first inorganic encapsulation layer 114 of the hole region 11, and thus together with the first inorganic encapsulation layer 114, the encapsulation reliability of the hole region 11 can be improved.

[0098] In one embodiment, after step S600, the following is included:

[0099] Step S700: A touch layer 118 covering the organic encapsulation layer 115 is formed in the hole area 11.

[0100] It is understood that the touch layer 118 can extend from the display area to the hole area 11, thereby covering the organic encapsulation layer 115 located in the hole area 11. The touch layer 118 can be used for user touch and to detect the touch position, thereby improving the efficiency of human-computer interaction.

[0101] In this embodiment, by setting the touch layer 118 to cover the organic encapsulation layer 115 of the hole area 11, the touch function is realized in the hole area 11, thereby increasing the touch area of ​​the display panel 10. Furthermore, in this embodiment, by setting an organic material layer in the hole area 11, support is added to the touch layer 118, which is beneficial to the formation of the touch layer 118.

[0102] It should be understood that, although Figure 8 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 8At least some of the steps in the process may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but may be executed at different times. The execution order of these steps or stages is not necessarily sequential, but may be executed in turn or alternately with other steps or at least some of the steps or stages in other steps.

[0103] Based on the same inventive concept, in one embodiment, a display device is provided. The display device may include a display panel 10 formed by any or more embodiments of this application and combinations thereof, or the display device may be manufactured using the manufacturing method of the display panel 10 provided in any or more embodiments of this application and combinations thereof.

[0104] In the description of this application, the references to terms such as "some embodiments," "other embodiments," "ideal embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this application, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It should be understood that the phrase "this embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of this application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment.

[0105] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this application.

[0106] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims. The above descriptions are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural transformations made based on the inventive concept of this application and the content of the specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this application.

Claims

1. A display panel, characterized in that, The display panel includes a hole area, a display area, and an edge. The hole area is located between the display area and the edge, and the hole area is used to form an opening. The display panel includes: Substrate; The wiring layer is located on one side of the substrate; A light-emitting material layer that covers the surface of the wiring layer away from the substrate and the substrate within the aperture region; A first inorganic encapsulation layer covers the light-emitting material layer and the sidewall of the wiring layer within the hole area; An organic encapsulation layer covers the first inorganic encapsulation layer; Multiple spaced-apart crack-stopping structures are connected to the first inorganic encapsulation layer located in the hole area. The crack-stopping structures are located between the first inorganic encapsulation layer and the organic encapsulation layer, and / or, the crack-stopping structures are located between the first inorganic encapsulation layer and the light-emitting material layer. The material of the crack-stopping structures includes inorganic materials, and the height of the crack-stopping structures near the edge is greater than the height of the crack-stopping structures near the display area.

2. The display panel according to claim 1, characterized in that, The wiring layer includes a plurality of wiring portions spaced apart, the light-emitting material layer includes a first light-emitting portion and a second light-emitting portion, the first light-emitting portion covers the surface of the wiring portion away from the substrate, the second light-emitting portion covers the substrate between the wiring portions, and the crack-stopping structure includes a first crack-stopping portion located on the side of the second light-emitting portion away from the substrate.

3. The display panel according to claim 2, characterized in that, The first anti-crack portion has a first height between its surface away from the substrate and the substrate, and the first inorganic encapsulation layer covering the first light-emitting portion has a second height between its surface away from the substrate and the substrate, wherein the first height is less than the second height.

4. The display panel according to claim 1, characterized in that, The wiring layer includes a plurality of wiring portions spaced apart, the light-emitting material layer includes a first light-emitting portion and a second light-emitting portion, the first light-emitting portion covers the side of the wiring portions away from the substrate, the second light-emitting portion covers the substrate between the wiring portions, and the crack-stopping structure includes a second crack-stopping portion located on the side of the first light-emitting portion away from the substrate.

5. The display panel according to claim 1, characterized in that, The crack-stopping structure is an integral structure with the first inorganic encapsulation layer.

6. The display panel according to claim 1, characterized in that, The display panel also includes: A barrier structure is located within the aperture area and on the side close to the display area. The surface of the barrier structure away from the substrate has a third height with the substrate. The surface of the crack-stopping structure away from the substrate has a fourth height with the substrate. The highest of the third height is the same as the highest of the fourth height.

7. The display panel according to claim 6, characterized in that, The material of the retaining wall structure is the same as the material of the crack-stopping structure.

8. The display panel according to claim 1, characterized in that, The material of the crack-stopping structure is the same as the material of the first inorganic encapsulation layer.

9. The display panel according to claim 1, characterized in that, The display panel also includes: A touch layer that covers the organic encapsulation layer within the hole area.

10. A display device, characterized in that, The display device includes a display panel as described in any one of claims 1-9.

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