Display panel, preparation method thereof and display device

Abstract

This disclosure provides a display panel and its fabrication method, as well as a display device, relating to the field of display technology. The display panel includes a hole region disposed in a display area. The display panel includes: a substrate; a partition structure disposed on one side of the substrate, and the partition structure surrounds the hole region; wherein the partition structure includes a first undercut structure and a second undercut structure stacked thereon; the first undercut structure is located on one side of the substrate, and the second undercut structure is located on the side of the first undercut structure facing away from the substrate; the first undercut structure includes a first main body portion and a first blocking portion stacked thereon, the first blocking portion being located on the side of the first main body portion facing away from the substrate; the second undercut structure includes a second main body portion and a second blocking portion stacked thereon, the second blocking portion being located on the side of the second main body portion facing away from the substrate; the first main body portion and the second main body portion are made of a first inorganic material, and the first blocking portion and the second blocking portion are made of a second inorganic material.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, specifically to a display panel and its manufacturing method, and a display device. Background Technology

[0002] To achieve a higher screen-to-body ratio, display panels often employ HIAA (Hole in Active Area) technology, which involves punching holes in the display area of ​​the panel and embedding devices such as cameras within these holes. To prevent external moisture from entering the display panel through the holes and affecting its normal operation, a partition structure is needed between the display area and the hole area. However, the reliability of the partition structure in these technologies is insufficient, making them prone to black spots in the hole area. Summary of the Invention

[0003] In view of this, the present disclosure provides a display panel, a method for manufacturing the same, and a display device.

[0004] In a first aspect, one embodiment of this disclosure provides a display panel including a hole region disposed in a display area. The display panel includes: a substrate; a partition structure disposed on one side of the substrate and surrounding the hole region; wherein the partition structure includes a first undercut structure and a second undercut structure stacked thereon; the first undercut structure is located on one side of the substrate, and the second undercut structure is located on the side of the first undercut structure opposite to the substrate; the first undercut structure includes a first main body portion and a first blocking portion stacked thereon, the first blocking portion being located on the side of the first main body portion opposite to the substrate; the orthographic projection of the first main body portion on the substrate is located within the orthographic projection range of the first blocking portion on the substrate; the second undercut structure includes a second main body portion and a second blocking portion stacked thereon, the second blocking portion being located on the side of the second main body portion opposite to the substrate; the orthographic projection of the second main body portion on the substrate is located within the orthographic projection range of the second blocking portion on the substrate; the materials of the first main body portion and the second main body portion include a first inorganic material, and the materials of the first blocking portion and the second blocking portion include a second inorganic material.

[0005] In conjunction with the first aspect, in some implementations of the first aspect, the orthogonal projection of the second blocking portion on the substrate is located within the orthogonal projection range of the first blocking portion on the substrate.

[0006] In conjunction with the first aspect, in some implementations of the first aspect, the first inorganic material includes silicon nitride, and the second inorganic material includes silicon oxide.

[0007] In conjunction with the first aspect, in some implementations of the first aspect, the first blocking portion includes a first surface and a second surface disposed opposite to each other, the first surface facing the substrate and the second surface facing the second undercut structure, the orthographic projection of the second surface on the substrate being located within the orthographic projection range of the first surface on the substrate; and / or, the second blocking portion includes a third surface and a fourth surface disposed opposite to each other, the third surface facing the substrate and the orthographic projection of the fourth surface on the substrate being located within the orthographic projection range of the third surface on the substrate.

[0008] In conjunction with the first aspect, in some implementations of the first aspect, the thickness of the first main body is greater than the thickness of the second main body.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the display panel further includes: a first inorganic insulating layer disposed on one side of the substrate, and a partition structure disposed on the side of the first inorganic insulating layer opposite to the substrate.

[0010] Secondly, one embodiment of this disclosure provides a method for fabricating a display panel, comprising: providing a substrate; sequentially forming a first insulating layer, a second insulating layer, a third insulating layer, and a fourth insulating layer on one side of the substrate, wherein the first and third insulating layers are made of a first inorganic material, and the second and fourth insulating layers are made of a second inorganic material; forming a first trench penetrating the first, second, third, and fourth insulating layers by an etching method, the first trench surrounding a hole region located in the display area of ​​the display panel; and, within the first trench, etching is performed on the side of the first insulating layer... The sidewalls of the first insulating layer and the third insulating layer are etched to form a stacked first undercut structure and a second undercut structure; wherein, the first undercut structure includes a first main body portion etched from the first insulating layer and a first blocking portion etched from the second insulating layer, and the orthographic projection of the first main body portion on the substrate is located within the orthographic projection range of the first blocking portion on the substrate; the second undercut structure includes a second main body portion etched from the third insulating layer and a second blocking portion etched from the fourth insulating layer, and the orthographic projection of the second main body portion on the substrate is located within the orthographic projection range of the second blocking portion on the substrate.

[0011] In conjunction with the second aspect, in some implementations of the second aspect, the first insulating layer includes a stacked inorganic insulating layer and a gate insulating layer, the second insulating layer includes a capacitor insulating layer, the third insulating layer includes a first interlayer dielectric layer, and the fourth insulating layer includes a second interlayer dielectric layer.

[0012] Thirdly, one embodiment of this disclosure provides a display device including the display panel provided in the first aspect above.

[0013] The display panel disclosed herein, compared to the partition structure in related technologies, features a partition structure that can create a larger gap, which is beneficial for blocking the vapor-deposited material. The partition structure is made of inorganic materials, which themselves do not absorb external moisture, preventing external moisture from invading the interior of the display panel along the partition structure, thus improving the reliability of the display panel and avoiding black spot problems in the hole area. Attached Figure Description

[0014] Figure 1 The diagram shown is a structural schematic of a display panel in the related art.

[0015] Figure 2 The diagram shown is a structural schematic of another display panel in the related technology.

[0016] Figure 3 The image shown is a top view of a display panel provided in an exemplary embodiment of this disclosure.

[0017] Figure 4 The diagram shown is a schematic representation of the structure of a display panel provided in an exemplary embodiment of this disclosure.

[0018] Figure 5 The diagram shown is a schematic diagram of a partition structure provided in an exemplary embodiment of this disclosure.

[0019] Figure 6 The diagram shown is a structural schematic of a display panel provided in another exemplary embodiment of this disclosure.

[0020] Figure 7 The diagram shows a flowchart of a method for manufacturing a display panel according to an exemplary embodiment of this disclosure.

[0021] Figure 8 The following is based on Figure 7 A schematic diagram of the intermediate structure formed by the provided preparation method.

[0022] Figure label:

[0023] 100. Substrate;

[0024] 200. Partition structure; 210. First undercut structure; 211. First main body part; 212. First blocking part; 220. Second undercut structure; 221. Second main body part; 222. Second blocking part;

[0025] 300. First inorganic insulating layer;

[0026] 410. First insulating layer; 420. Second insulating layer; 430. Third insulating layer; 440. Fourth insulating layer. Detailed Implementation

[0027] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0028] In the description of this disclosure, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0029] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0030] To achieve a higher screen-to-body ratio, display panels often employ HIAA (Hole in Active Area) technology, which involves punching holes in the display area of ​​the panel and embedding devices such as cameras within these holes. HIAA technology typically uses PI Asher or Ti / Al / Ti processes to create the separation structure between the display area and the hole area, but both of these structures have certain drawbacks.

[0031] Figure 1 The diagram shows a structural schematic of a display panel in the related art, which uses the PI Asher process. Figure 1 As shown, multiple narrow-top, wide-bottom grooves are etched into the polyimide (PI) layer between the display area and the via area using an asher process. The unetched film layer between these grooves isolates the functional display film layer, preventing external moisture from entering the display panel along the functional film layer. However, the narrow-top, wide-bottom grooves can easily cause uneven stress distribution, making the encapsulation layer in the display panel prone to cracking. Simultaneously, the PI material itself is hygroscopic, allowing external moisture to easily enter the display panel through cracks in the encapsulation layer along the PI layer, leading to reliability failure.

[0032] Figure 2 The diagram shows a structural schematic of another display panel in the related technology, which uses a Ti / Al / Ti process. Figure 2 As shown, the partition structure between the display area and the aperture area consists of stacked Ti layers, Al layers, and Ti layers, which isolate the functional film layers used for display. However, some photoresist material may remain between multiple partition structures, causing the functional film layers to deposit on the residual material, making it difficult for the partition structure to completely separate them. Furthermore, the polarizer in the display panel contains ions such as iodine ions, sodium ions, and potassium ions. For example, iodine ions have good polarizing properties, absorbing the electric field component of the beam parallel to its alignment direction and allowing only the perpendicular electric field component to pass through; iodine ions are a key polarizing material in the polarizer. During the fabrication of the polarizer, the addition of soluble inorganic salts such as sodium and potassium ions can improve the aggregation state of PVA segments, promoting tighter stacking of PVA segments. This effect helps form complexes between PVA and dyes, thereby improving the dyeing effect and polarization performance of the polarizer. Metal partition structures are susceptible to corrosion due to the influence of ions in the polarizer, leading to reliability failure.

[0033] To address the above problems, this disclosure provides a display panel, including: an aperture region disposed in a display area; the display panel includes: a substrate; a partition structure disposed on one side of the substrate and surrounding the aperture region; wherein the partition structure includes a first undercut structure and a second undercut structure stacked thereon; the first undercut structure is located on one side of the substrate, and the second undercut structure is located on the side of the first undercut structure facing away from the substrate; the first undercut structure includes a first main body portion and a first blocking portion stacked thereon, the first blocking portion being located on the side of the first main body portion facing away from the substrate; the orthographic projection of the first main body portion on the substrate is within the orthographic projection range of the first blocking portion on the substrate; the second undercut structure includes a second main body portion and a second blocking portion stacked thereon, the second blocking portion being located on the side of the second main body portion facing away from the substrate; the orthographic projection of the second main body portion on the substrate is within the orthographic projection range of the second blocking portion on the substrate; the materials of the first main body portion and the second main body portion include a first inorganic material, and the materials of the first blocking portion and the second blocking portion include a second inorganic material.

[0034] The following description, in conjunction with the accompanying drawings, illustrates the display panel provided in an embodiment of this disclosure.

[0035] Figure 3 The image shown is a top view of a display panel provided in an exemplary embodiment of this disclosure. Figure 3 As shown, the display panel includes a display area AA and a non-display area surrounding the display area AA. An aperture area H is provided in the display area AA. Multiple film layers of the display panel are perforated at the aperture area H to form openings that penetrate multiple film layers. These openings can accommodate devices such as cameras and sensors.

[0036] Figure 4The diagram shown is a structural schematic of a display panel provided in an exemplary embodiment of this disclosure. Figure 4 As shown, the display panel includes a substrate 100 and a partition structure 200. The partition structure 200 is disposed on one side of the substrate 100 and surrounds the hole area. The partition structure 200 is located between the display area and the hole area.

[0037] For example, there are multiple partition structures 200, which are spaced apart and all surround the hole area. The spacing between adjacent partition structures 200 can be set according to actual conditions, and this disclosure does not impose specific limitations on this.

[0038] The partition structure 200 includes a first undercut structure 210 and a second undercut structure 220 stacked together. The first undercut structure 210 is located on one side of the substrate 100, and the second undercut structure 220 is located on the side of the first undercut structure 210 opposite to the substrate 100.

[0039] The first undercut structure 210 includes a first main body portion 211 and a first blocking portion 212 stacked together. The first main body portion 211 is located on one side of the substrate 100, and the first blocking portion 212 is located on the side of the first main body portion 211 opposite to the substrate 100. Furthermore, the orthographic projection of the first main body portion 211 on the substrate 100 is within the orthographic projection range of the first blocking portion 212 on the substrate 100.

[0040] The second undercut structure 220 includes a second main body portion 221 and a second blocking portion 222 stacked together. The second main body portion 221 is located on the side of the first blocking portion 212 that is away from the substrate 100, and the second blocking portion 222 is located on the side of the second main body portion 221 that is away from the substrate 100. Furthermore, the orthographic projection of the second main body portion 221 onto the substrate 100 is within the orthographic projection range of the second blocking portion 222 onto the substrate 100.

[0041] Furthermore, the first main body portion 211 and the second main body portion 221 are made of a first inorganic material, while the first blocking portion 212 and the second blocking portion 222 are made of a second inorganic material. The first inorganic material and the second inorganic material are different. During the manufacturing process of the display panel, a specific etchant can be selected based on the etching selectivity ratio of the first inorganic material and the second inorganic material in different etchants, so that the etching rate of the specific etchant on the first inorganic material is higher than that on the second inorganic material. During the etching process of the film layer using the specific etchant, the etching rate of the first inorganic material is higher than that of the second inorganic material, making the overall width of the first main body portion 211 made of the first inorganic material narrower than the overall width of the first blocking portion 212 made of the second inorganic material. Similarly, the overall width of the second main body portion 221 made of the first inorganic material is narrower than the overall width of the second blocking portion 222 made of the second inorganic material, which facilitates the formation of the aforementioned first undercut structure 210 and second undercut structure 220.

[0042] Furthermore, during the etching stage, the first undercut structure 210 and the second undercut structure 220 are formed simultaneously. The process is similar to that of a partition structure that includes only one undercut structure. Without changing the process route, a partition structure including two undercut structures can be generated, which improves the reliability of the display panel.

[0043] After the partition structure 200 is formed, other functional film layers of the display panel, such as the light-emitting layer and electrode layer, can be fabricated on it. Functional film layers are typically prepared using a vapor deposition method. During the vapor deposition process, some of the vapor-deposited material of the functional film layer is deposited on the top of the partition structure 200 (i.e., the side of the second undercut structure 220 facing away from the substrate), while some of the vapor-deposited material is deposited on the substrate not shielded by the partition structure. This ensures that the vapor-deposited materials on the top of the partition structure and on the substrate do not overlap, and the functional film layer is isolated by the partition structure 200, preventing external moisture from entering the interior of the display panel along the functional film layer.

[0044] Compared to partition structures in related technologies, the partition structure in this embodiment can create a larger discontinuity. For example, Figure 2 The partition structure shown is typically made of the metal layer M4 of the display panel, and its height is limited, usually around 4000 angstroms. However, in this embodiment, a partition structure with a double-layer undercut structure is formed by etching multiple inorganic layers of the display panel, and its height can reach 9000 angstroms. This is beneficial for the partition structure to completely block the connection of vapor-deposited materials, even tandem structures.

[0045] Furthermore, the partition structure in this embodiment is made of inorganic materials, which do not absorb external moisture, thus preventing external moisture from invading the interior of the display panel along the partition structure and causing reliability failure.

[0046] As mentioned in the above embodiments, the isolation structure 200 is obtained by etching multiple inorganic layers of the display panel using an etching process. Exemplarily, the film layers in the display panel may include a stacked second inorganic insulating layer, a gate insulating layer, a capacitor insulating layer, a first interlayer dielectric layer, a second interlayer dielectric layer, etc. Metal layers are also disposed between the aforementioned film layers; for example, a metal layer M1 may be disposed between the gate insulating layer and the capacitor insulating layer, a metal layer M2 may be disposed between the capacitor insulating layer and the first interlayer dielectric layer, a metal layer M3 may be disposed between the first interlayer dielectric layer and the second interlayer dielectric layer, and a metal layer M4 may be disposed on top of the second interlayer dielectric layer, etc. In the display area, the function of the aforementioned film layers is to isolate the metal layers on both sides, preventing short circuits between the metal layers. The isolation structure 200 can be fabricated using the aforementioned film layer structure between the display area and the hole area.

[0047] For example, the capacitor insulating layer and the second interlayer dielectric layer are used as the materials for the first blocking portion 212 and the second blocking portion 222, respectively. The film layer below the capacitor insulating layer is used as the material for the first main body portion 211, and the film layer between the capacitor insulating layer and the second interlayer dielectric layer is used as the material for the second main body portion 221. Multiple film layers are etched to obtain the partition structure 200. Because the fabrication process involves many film layer structures, the partition structure 200 in this embodiment can achieve a higher height. Furthermore, the partition structure 200 can utilize the original film layer structure of the display panel without requiring additional or altered film layer structures.

[0048] exist Figure 2 In the display panel shown, the Ti layer at the top of the partition structure, fabricated using a Ti / Al / Ti process, is relatively thin, approximately 500 angstroms. When the Al layer is etched using a side-etching process, the top Ti layer is prone to warping. External moisture can easily penetrate the display panel through these warped cracks, leading to reliability issues. However, in this embodiment, the second barrier at the top of the partition structure is etched from a second interlayer dielectric layer, achieving a thickness of 2200 angstroms, thus avoiding the warping problem of the top layer of the partition structure.

[0049] In some embodiments, the partition structure has an overall shape that is narrower at the top and wider at the bottom. (Continue to refer to...) Figure 4 The orthographic projection of the second blocking portion 222 on the substrate 100 is within the orthographic projection range of the first blocking portion 212 on the substrate 100. The edge of the first blocking portion 212 slightly extends beyond the edge of the second blocking portion 222.

[0050] During the fabrication of the functional film, the vapor-deposited material is deposited along the direction from the second barrier 222 toward the substrate 100. Part of the vapor-deposited material is blocked by the second barrier 222 and deposited on the side of the second barrier 222 away from the substrate 100. Part of the vapor-deposited material is blocked by the first barrier 212 and deposited on the side of the first barrier 212 away from the substrate 100.

[0051] Both the first blocking part 212 and the second blocking part 222 of the partition structure 200 can block the vapor deposition material, increase the break point position of the vapor deposition material, and increase the probability of the partition structure 200 blocking the vapor deposition material from forming a film.

[0052] In some fabrication processes, the evaporation angle may not be perpendicular to the substrate 100, and the evaporation angle may change multiple times. With a larger evaporation angle, the evaporated material may be deposited obliquely on the sidewall of the main body, increasing the probability of film formation. In this embodiment, the first blocking portion 212 can block the evaporated material that obliquely enters between two adjacent partition structures, preventing the evaporated material from depositing along the sidewall of the partition structure, further increasing the probability of blocking the evaporated material.

[0053] In some embodiments, both the first inorganic material and the second inorganic material are non-metallic materials. For example, the first inorganic material includes silicon nitride (SiNx), and the second inorganic material includes silicon oxide (SiOx). Silicon nitride and silicon oxide have a high etching selectivity in certain etchants. For example, silicon oxide has an extremely high etching rate in hydrofluoric acid (HF) solution, while silicon nitride is hardly etched in hydrofluoric acid solution.

[0054] Silicon nitride or silicon oxide materials are frequently used in the film layer structure of display panels. For example, in a display panel, the second inorganic insulating layer, gate insulating layer, and first interlayer dielectric layer can be made of silicon oxide, while the capacitor insulating layer and second interlayer dielectric layer can be made of silicon nitride. During etching, hydrofluoric acid solution is used as the etchant. The second inorganic insulating layer, gate insulating layer, and first interlayer dielectric layer, which have a higher etching rate, form the first and second main bodies, respectively, while the capacitor insulating layer and second interlayer dielectric layer, which have a lower etching rate, form the first and second blocking portions, respectively. In this way, a barrier structure can be fabricated using each film layer without changing its original structure and materials. The original functions of each film layer in the display area can also be realized.

[0055] Furthermore, using non-metallic materials to fabricate the partition structure avoids the problem of metal corrosion caused by the reaction of ions in the polarizer with the metal, thus improving the reliability of the display panel. Additionally, silicon nitride and silicon oxide materials are inherently non-hygroscopic, preventing moisture from entering the display panel along the partition structure.

[0056] Figure 5 The diagram shown is a schematic representation of a partition structure provided in an exemplary embodiment of this disclosure. Figure 5 As shown, the first blocking portion includes a first surface 212A and a second surface 212B disposed opposite to each other. The first surface 212A faces the substrate, and the second surface 212B faces the second undercut structure 220. The orthographic projection of the second surface 212B onto the substrate is within the orthographic projection range of the first surface 212A onto the substrate. The sidewalls of the first blocking portion are inclined such that the intersection of the sidewalls and the first surface 212A forms an eaves-like structure.

[0057] The second blocking portion includes a third surface 222A and a fourth surface 222B disposed opposite to each other. The third surface 222A faces the substrate, and the fourth surface 222B faces away from the substrate. The orthographic projection of the fourth surface 222B onto the substrate is within the orthographic projection range of the third surface 222A onto the substrate. The sidewalls of the second blocking portion are inclined such that the intersection of the sidewalls and the third surface 222A forms an eaves-like structure.

[0058] During the vapor deposition process, the edges of the eaves-like structures in the first and second blocking sections can separate the vapor deposition material, allowing the vapor deposition material to be deposited smoothly on the substrate between adjacent blocking structures.

[0059] In some embodiments, continue to refer to Figure 5 The thickness H1 of the first main body is greater than the thickness H2 of the second main body. The thickness H1 of the first main body can be understood as the distance between the two opposing surfaces of the first main body in a direction perpendicular to the plane of the substrate. The thickness H2 of the second main body is similar.

[0060] Based on the film layer structure of the display panel described in the above embodiments, the first main body portion can be etched from the second inorganic insulating layer and the gate insulating layer of the display panel, while the second main body portion can be etched from the first interlayer dielectric layer of the display panel. Since the first main body portion is etched from two film layers, the thickness H1 of the first main body portion is greater than the thickness H2 of the second main body portion.

[0061] In this embodiment of the disclosure, by combining the material selection of each film layer of the display panel, multiple film layers are appropriately used to form the first main body, thereby increasing the height of the partition structure and increasing the probability of the partition structure blocking the vapor deposition material from forming a film.

[0062] The following section will introduce other film layer structures in the display panel.

[0063] Figure 6 The diagram shown is a structural schematic of a display panel provided in another exemplary embodiment of this disclosure. Figure 6As shown, the display panel also includes a first inorganic insulating layer 300. The first inorganic insulating layer 300 is disposed on one side of the substrate 100, and the partition structure 200 is disposed on the side of the first inorganic insulating layer 300 facing away from the substrate 100.

[0064] exist Figure 1 In the display panel shown, because the PI material itself is hygroscopic, external moisture is easily adsorbed along the PI layer and enters the interior of the display panel along the PI layer. However, in this embodiment, a first inorganic insulating layer 300 is provided below the partition structure 200. The first inorganic insulating layer 300 completely covers the underlying film layer, and the first inorganic insulating layer 300 is made of a non-hygroscopic inorganic material, preventing moisture from intruding into the underlying film layer and thus avoiding reliability failure caused by water absorption by the film layer.

[0065] The film layer below the first inorganic insulating layer may include a first flexible layer, a first barrier layer, a second flexible layer, and a second barrier layer stacked on the substrate. The first flexible layer faces the substrate, and the second barrier layer faces the first inorganic insulating layer.

[0066] The first and second flexible layers are typically made of polyimide (PI) material, which possesses high modulus, high strength, and resistance to high and low temperatures, providing a high-strength, low-weight flexible support structure for the display panel. The first and second barrier layers reduce the permeability of water vapor and oxygen, preventing them from entering the display panel and thus improving its reliability.

[0067] In addition to the film layers described above, other film layers may be provided on the display panel, and this disclosure does not impose specific restrictions on this.

[0068] Based on the same inventive concept, this disclosure also provides a method for manufacturing a display panel. Based on this method, the display panel described in the above embodiments can be obtained. It should be understood that the principle by which the manufacturing method addresses the problem is similar to that of the display panel embodiments described above. Therefore, the implementation of this embodiment can refer to the implementation of the display panel embodiments described above, and repeated details will not be elaborated further.

[0069] Figure 7 The diagram shows a flowchart of a method for manufacturing a display panel according to an exemplary embodiment of this disclosure. Figure 7 The method for preparing a display panel provided in this disclosure includes the following steps.

[0070] S710 provides a substrate.

[0071] The substrate can be a flexible substrate or a non-flexible substrate. For example, the substrate can be made of materials such as glass, quartz, sapphire, PI, PEN, etc., and this disclosure does not impose any specific limitations on it.

[0072] S720, a first insulating layer, a second insulating layer, a third insulating layer and a fourth insulating layer are sequentially formed on one side of the substrate.

[0073] like Figure 8 As shown in (a), the first insulating layer 410, the second insulating layer 420, the third insulating layer 430 and the fourth insulating layer 440 are stacked on the substrate 100.

[0074] The first insulating layer 410 and the third insulating layer 430 are made of a first inorganic material, and the second insulating layer 420 and the fourth insulating layer 440 are made of a second inorganic material. The first inorganic material and the second inorganic material are different.

[0075] S730 forms a first trench that penetrates the first insulating layer, the second insulating layer, the third insulating layer, and the fourth insulating layer through an etching method.

[0076] like Figure 8 As shown in (b), the first trench T penetrates the first insulating layer 410, the second insulating layer 420, the third insulating layer 430, and the fourth insulating layer 440, with the bottom of the first trench T exposing a portion of the substrate 100. Combined with Figure 3 The first groove T surrounds the hole area, which is located in the display area AA of the display panel.

[0077] The opening width of the first groove T is greater than the bottom width of the first groove T, so that the sidewall of the first groove T is inclined.

[0078] For example, during the etching process, a photomask can be formed on the surface of the fourth insulating layer 440 facing away from the substrate 100, and the first insulating layer 410, the second insulating layer 420, the third insulating layer 430, and the fourth insulating layer 440 can be etched simultaneously using the photomask to form the first trench T. During the etching process, the metal layer between the insulating layers above the hole area is not retained.

[0079] S740, in the first trench, the sidewalls of the first insulating layer and the sidewalls of the third insulating layer are etched to form a stacked first undercut structure and a second undercut structure.

[0080] like Figure 8 As shown in (c), the first undercut structure includes a first main body portion etched by a first insulating layer and a first blocking portion etched by a second insulating layer, wherein the orthographic projection of the first main body portion on the substrate is located within the orthographic projection range of the first blocking portion on the substrate; the second undercut structure includes a second main body portion etched by a third insulating layer and a second blocking portion etched by a fourth insulating layer, wherein the orthographic projection of the second main body portion on the substrate is located within the orthographic projection range of the second blocking portion on the substrate.

[0081] For example, the Halftone photomask process can be used to etch the hole area, forming an undercut structure through a wet etching method.

[0082] In this embodiment, the first, second, third, and fourth insulating layers are first etched simultaneously to form trenches. Within the trenches, the first and third insulating layers are selectively etched to form two undercut structures in one step, thus improving the reliability and failure issues of the hole area without changing the process route.

[0083] Compared to the partition structures in related technologies, the partition structure in this embodiment can create a larger gap. The gap can be increased from about 4000 angstroms in related technologies to 9000 angstroms, which is beneficial for the partition structure to completely block the connection of the vapor-deposited materials.

[0084] Furthermore, the partition structure in this embodiment is made of inorganic material. Inorganic material itself does not absorb external moisture, preventing external moisture from invading the interior of the display panel along the partition structure and causing reliability failure. A first inorganic insulating layer can also be further prepared between the partition structure and the substrate. This first inorganic insulating layer is also made of inorganic material, further improving the reliability of the display panel.

[0085] In some embodiments, the first insulating layer includes a stacked inorganic insulating layer and a gate insulating layer, the second insulating layer includes a capacitor insulating layer, the third insulating layer includes a first interlayer dielectric layer, and the fourth insulating layer includes a second interlayer dielectric layer.

[0086] In this embodiment, without altering the original structure and materials of each film layer in the display panel, a non-metallic partition structure can be fabricated using multiple insulating layers in the display panel. This non-metallic partition structure avoids the problem of metal corrosion caused by the reaction of ions in the polarizer with the metal, thus improving the reliability of the display panel. Simultaneously, the original structure and materials of each film layer in the display area remain unchanged, and their original functions can still be achieved.

[0087] Based on the same inventive concept, this disclosure also provides a display device, including the display panel provided in the above embodiments of this disclosure. It should be understood that the principle of solving the problem in the display device embodiments is similar to that in the above-described display panel embodiments. Therefore, the implementation of this embodiment can refer to the implementation of the above-described display panel embodiments, and repeated details will not be described again.

[0088] In embodiments of this disclosure, the display device may include electronic devices such as mobile phones, tablets, televisions, laptops, and monitors, as well as smart wearable devices with display functions such as smartwatches and health monitoring devices. This disclosure does not impose specific limitations on the specific form of the display device.

[0089] The display device may also include devices such as cameras and sensors. These devices are placed in openings in the display area of ​​the display panel to achieve a higher screen-to-body ratio.

[0090] Since the principle of solving the problem in the display device embodiment is similar to that in the above-described display panel embodiment, the implementation of the display device embodiment can refer to the implementation of the above-described display panel embodiment, and repeated details will not be described again.

[0091] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0092] The block diagrams of devices, apparatuses, and devices involved in this disclosure are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, and devices can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0093] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0094] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations therein.

Claims

1. A display panel, characterized in that, The display panel includes a perforated area disposed in the display area; the display panel includes: Substrate; A partition structure is disposed on one side of the substrate, and the partition structure surrounds the hole area; The partition structure includes a first undercut structure and a second undercut structure stacked together; the first undercut structure is located on one side of the substrate, and the second undercut structure is located on the side of the first undercut structure opposite to the substrate. The first undercut structure includes a first main body portion and a first blocking portion stacked together, the first blocking portion being located on the side of the first main body portion away from the substrate; the orthographic projection of the first main body portion on the substrate is located within the orthographic projection range of the first blocking portion on the substrate. The second undercut structure includes a second main body and a second blocking part stacked together, the second blocking part being located on the side of the second main body away from the substrate; the orthographic projection of the second main body on the substrate is located within the orthographic projection range of the second blocking part on the substrate. The first main body and the second main body are made of a first inorganic material, and the first blocking part and the second blocking part are made of a second inorganic material.

2. The display panel according to claim 1, characterized in that, The orthographic projection of the second blocking portion on the substrate is located within the orthographic projection range of the first blocking portion on the substrate.

3. The display panel according to claim 1, characterized in that, The first inorganic material includes silicon nitride, and the second inorganic material includes silicon oxide.

4. The display panel according to claim 1, characterized in that, The first blocking portion includes a first surface and a second surface disposed opposite to each other, the first surface facing the substrate, the second surface facing the second undercut structure, and the orthographic projection of the second surface on the substrate being located within the orthographic projection range of the first surface on the substrate. and / or The second blocking portion includes a third surface and a fourth surface disposed opposite to each other, the third surface facing the substrate, and the orthographic projection of the fourth surface on the substrate being located within the orthographic projection range of the third surface on the substrate.

5. The display panel according to claim 1, characterized in that, The thickness of the first main body is greater than the thickness of the second main body.

6. The display panel according to claim 1, characterized in that, Also includes: A first inorganic insulating layer is disposed on one side of the substrate, and the partition structure is disposed on the side of the first inorganic insulating layer opposite to the substrate.

7. A method for manufacturing a display panel, characterized in that, include: Provide substrates; A first insulating layer, a second insulating layer, a third insulating layer, and a fourth insulating layer are sequentially formed on one side of the substrate. The first insulating layer and the third insulating layer are made of a first inorganic material, and the second insulating layer and the fourth insulating layer are made of a second inorganic material. A first trench is formed by etching through the first insulating layer, the second insulating layer, the third insulating layer and the fourth insulating layer. The first trench surrounds the hole area, which is located in the display area of ​​the display panel. In the first trench, the sidewalls of the first insulating layer and the sidewalls of the third insulating layer are etched to form a stacked first undercut structure and a second undercut structure. The first undercut structure includes a first main body portion etched from a first insulating layer and a first blocking portion etched from a second insulating layer. The orthographic projection of the first main body portion on the substrate is located within the orthographic projection range of the first blocking portion on the substrate. The second undercut structure includes a second main body portion etched from a third insulating layer and a second blocking portion etched from a fourth insulating layer, wherein the orthographic projection of the second main body portion on the substrate is located within the orthographic projection range of the second blocking portion on the substrate.

8. The method for manufacturing a display panel according to claim 7, characterized in that, The first insulating layer includes a stacked inorganic insulating layer and a gate insulating layer, the second insulating layer includes a capacitor insulating layer, the third insulating layer includes a first interlayer dielectric layer, and the fourth insulating layer includes a second interlayer dielectric layer.

9. A display device, characterized in that, The display device includes a display panel as described in any one of claims 1 to 6.

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