Display device and electronic device including the same

Abstract

The present invention discloses a display device and an electronic device including the display device. The display device includes: a display panel; a panel support member overlapping the display panel; a connecting member connected to the display panel; a circuit board connected to the connecting member and including a touch integrated circuit; and a heat dissipation member for dissipating heat generated in the touch integrated circuit.

Description

[0001] This application claims priority to and all benefits derived therefrom of Korean Patent Application No. 10-2025-0047315, filed on April 11, 2025, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] This disclosure relates to a display device and an electronic device including the display device. Background Technology

[0003] Typically, electronic devices such as smartphones, tablet PCs, digital cameras, laptops, navigation devices, and smart TVs include display devices for displaying images.

[0004] Display devices may include multiple light-emitting elements. These elements can display images using electricity applied from an external source. Some of the electricity applied to the light-emitting elements may not be converted into light energy, but may instead accumulate as heat within the display device. This accumulated heat is one of the main causes of display quality degradation.

[0005] As display devices become more powerful and smaller, the electronic components inside them are becoming more highly integrated, and consequently, the heat density is increasing. In this context, technologies that can more effectively dissipate the generated heat are desired. Summary of the Invention

[0006] This disclosure provides a display device capable of effectively dissipating heat generated in electronic components within the display device, as well as an electronic device including the display device.

[0007] However, the aspects of this disclosure are not limited to those set forth herein. These and other aspects of the disclosure will become more apparent to those skilled in the art from the following detailed description of the disclosure.

[0008] According to an aspect of this disclosure, a display device includes: a display panel; a panel support member overlapping the display panel; a connecting member connected to the display panel; a circuit board connected to the connecting member and including a touch integrated circuit; and a heat dissipation member for dissipating heat generated in the touch integrated circuit.

[0009] The touch integrated circuit protrudes from the circuit board, and the heat dissipation component covers at least a portion of the touch integrated circuit.

[0010] The heat dissipation component completely covers the protruding surface and side surface of the touch integrated circuit.

[0011] The heat dissipation component includes: a first heat dissipation component covering the protruding surface of the touch integrated circuit; and a second heat dissipation component covering the side surface of the touch integrated circuit and the side surface of the first heat dissipation component.

[0012] The side surface of the touch integrated circuit, which is covered by the second heat dissipation member, protrudes from the circuit board.

[0013] When the connecting member is bent, the circuit board overlaps with the panel support member, and the heat dissipation member is placed inside the panel support member.

[0014] The heat dissipation component overlaps with the touch integrated circuit.

[0015] The display device further includes an adhesive sheet, which is disposed between the panel support member and the circuit board when the connecting member is bent, wherein the heat dissipation member contacts the adhesive sheet.

[0016] The display device further includes an adhesive sheet that overlaps with the panel support member, wherein the circuit board contacts the adhesive sheet when the connecting member is bent, and the heat dissipation member is placed inside the adhesive sheet.

[0017] The heat dissipation component overlaps with the touch integrated circuit.

[0018] The heat dissipation component is in contact with the panel support component and the circuit board.

[0019] According to an aspect of this disclosure, a display device includes: a display panel; a panel support member overlapping the display panel; a connecting member connected to the display panel; and a circuit board connected to the connecting member and including a touch integrated circuit, wherein a heat release area formed in the circuit board overlaps with the touch integrated circuit.

[0020] The display device further includes an adhesive sheet that overlaps with the panel support member, wherein the circuit board contacts the adhesive sheet when the connecting member is bent.

[0021] The heat release area is recessed from the surface of the circuit board into the circuit board, and the surface of the circuit board contacts the adhesive sheet when the connecting member is bent.

[0022] A portion of the adhesive sheet is removed to form a removal area, and the removal area overlaps with the heat release area.

[0023] The display device further includes a heat dissipation component placed inside the heat release area.

[0024] The heat dissipation component overlaps with the touch integrated circuit.

[0025] According to an aspect of this disclosure, an electronic device includes: a display panel; a panel support member overlapping the display panel; a connecting member connected to the display panel; a circuit board connected to the connecting member and including a touch integrated circuit; and a heat dissipation member dissipating heat generated in the touch integrated circuit.

[0026] The touch integrated circuit protrudes from the circuit board, and the heat dissipation component covers at least a portion of the touch integrated circuit.

[0027] The electronic device further includes at least one of the following: a processor; a memory in which data relating to one or more of the display panel and the processor is stored; and a power module for supplying power to the display panel, the processor, and the memory.

[0028] According to embodiments of this disclosure, by arranging heat dissipation components inside the display device, heat generated in the electronic components of the display device can be effectively dissipated.

[0029] The effects of embodiments according to this disclosure are not limited to those mentioned above, and many more effects are included in the following description of this disclosure. Attached Figure Description

[0030] The above and other aspects and features of this disclosure will become more apparent from the detailed description of exemplary embodiments thereof with reference to the accompanying drawings.

[0031] Figure 1 This is a plan view illustrating a display device according to a first embodiment of the present disclosure when the connecting members are unfolded.

[0032] Figure 2 yes Figure 1 The rear view of the display device shown in the example.

[0033] Figure 3 This illustrates what happens when the connecting component bends. Figure 2 The image shows a view of the display device.

[0034] Figure 4 This is an example Figure 1 A side view of a portion of the display device illustrated in the image.

[0035] Figure 5 This is an example Figure 4 A cross-sectional view of the display panel.

[0036] Figure 6 yes Figure 1 A magnified view of part A.

[0037] Figure 7 It is along Figure 6 The cross-sectional view taken by line B-B'.

[0038] Figure 8 This is a plan view illustrating a display device according to a second embodiment of the present disclosure when the connecting members are unfolded.

[0039] Figure 9 This illustrates what happens when the connecting component bends. Figure 8 The image shows a view of the display device.

[0040] Figure 10 yes Figure 9 A magnified view of part C.

[0041] Figure 11 It is along Figure 10 The cross-sectional view taken by line D-D'.

[0042] Figure 12 This is an example of placing... Figure 11 A view of the heat dissipation components in the heat dissipation space.

[0043] Figure 13 This is a view illustrating a heat dissipation component placed inside the adhesive sheet.

[0044] Figure 14 This is a view illustrating a heat dissipation component placed inside the panel support member.

[0045] Figure 15 This is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0046] Figure 16 This is a view illustrating various embodiments of an electronic device according to the present disclosure. Detailed Implementation

[0047] The advantages and features of this disclosure, as well as methods of implementing them, will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein, but can be implemented in a variety of different ways. These exemplary embodiments are provided to complete the disclosure and to fully convey the scope of this disclosure to those skilled in the art. It should be noted that the scope of this disclosure is defined by the claims.

[0048] As used herein, the phrase "element A on element B" means that element A can be directly disposed on element B and / or element A can be indirectly disposed on element B via another element C. Throughout the specification, similar reference numerals denote similar elements. The shapes, dimensions, scales, angles, and quantities of elements given in the drawings are illustrative and not limiting.

[0049] Although terms such as first, second, etc., are used to arbitrarily distinguish between elements described by such terms, these terms are not necessarily intended to indicate the temporal order or other priority of such elements. These terms are used to distinguish one element from another. Accordingly, as used herein, within the scope of the technology disclosed, a first element may be a second element.

[0050] Features of the various exemplary embodiments of this disclosure can be combined in part or in whole. As will be clearly understood by those skilled in the art, various technical interactions and operations are possible. The various exemplary embodiments can be practiced individually or in combination.

[0051] In the following, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0052] Figure 1 This is a plan view illustrating a display device according to a first embodiment of the present disclosure when the connecting members are unfolded. Figure 2 yes Figure 1 The rear view of the display device shown in the example. Figure 3 This illustrates what happens when the connecting component bends. Figure 2 The image shows a view of the display device. Figure 4 This is an example Figure 1 A side view of a portion of the display device illustrated in the image.

[0053] As used herein, the display device 10 according to an exemplary embodiment of this disclosure is used to display moving or still images. The display device 10 can be used as a display screen for portable electronic devices such as mobile phones, smartphones, tablet PCs, smartwatches, watch phones, mobile communication terminals, electronic notebook computers, e-books, portable multimedia players (PMPs), navigation devices, and ultra-mobile PCs (UMPCs), as well as for displays for various products such as televisions, laptop computers, monitors, billboards, and Internet of Things (IoT) devices. Alternatively, the display device 10 can be used as a display screen for a vehicle's center console.

[0054] Display device 10 may be a light-emitting display device, such as an organic light-emitting display device using organic light-emitting diodes (LEDs), a quantum dot light-emitting display device including a quantum dot light-emitting layer, an inorganic light-emitting display device including inorganic semiconductors, and a micro light-emitting display device using micro light-emitting diodes. In the following description, organic light-emitting display devices are described as examples of display device 10. However, it should be understood that the embodiments of this disclosure are not limited thereto.

[0055] The first direction D1 can refer to a direction parallel to one side of the display device 10, for example, the horizontal direction of the display device 10 when viewed from above. The second direction D2 can refer to a direction parallel to the other side of the display device 10 that intersects with that side, for example, the vertical direction of the display device 10 when viewed from above. The third direction D3 can refer to the thickness direction of the display device 10.

[0056] When viewed from above, the display device 10 can have a quadrilateral shape, such as a rectangle. For example, when viewed from above, the display device 10 can have a shape similar to a rectangle with a shorter side in the first direction D1 and a longer side in the second direction D2. The corners where the shorter side in the first direction D1 and the longer side in the second direction D2 intersect can be rounded to have a predetermined curvature, or they can be right angles. When viewed from above, the shape of the display device 10 is not limited to a rectangular shape, but can be formed into other polygonal shapes, circular shapes, or elliptical shapes.

[0057] The display device 10 may include a display area and a non-display area. When viewed from above, the shape of the display area may conform to the shape of the display device 10. In an example where the display device 10 has a rectangular shape when viewed from above, the display area may also have a rectangular shape when viewed from above.

[0058] The display area may include multiple pixels to display an image. The non-display area may not contain pixels and therefore may not display an image. The non-display area may be located around the display area. The non-display area may surround the display area, but embodiments of this disclosure are not limited thereto. The display area may also be partially surrounded by the non-display area.

[0059] refer to Figures 1 to 4 The display device 10 according to the first embodiment of the present disclosure may include a cover window 100, a display panel 200, a panel support member 300, a connecting member 400, a circuit board 500, a touch integrated circuit 600, and a heat dissipation member 700.

[0060] Cover window 100 may contain a material with high light transmittance. Cover window 100 may contain a polymer resin such as polyimide or glass. Cover window 100 may be attached to the polarizing film PF of display panel 200 by an adhesive member such as an optically clear adhesive (OCA) film.

[0061] The display panel 200 can be disposed below the cover window 100. When viewed from above, the display panel 200 can have a rectangular shape, having a shorter side in a first direction D1 and a longer side in a second direction D2. In the display panel 200, the corners where the shorter side in the first direction D1 and the longer side in the second direction D2 intersect can be formed at right angles or can be rounded to have a predetermined curvature. When viewed from above, the display panel 200 can have a quadrilateral shape other than a rectangle, a polygonal shape other than a quadrilateral shape, a circular shape, an elliptical shape, or an irregular shape.

[0062] The display panel 200 may include a display area in which multiple emitting regions for emitting light are arranged, and a non-display area disposed around the display area. The non-display area may surround the display area. Multiple display pads may be disposed in the non-display area at one edge of the display panel 200.

[0063] The display panel 200 may include a substrate SUB, a display unit PAL, a sensor unit SENL, and a polarizing film PF.

[0064] The substrate SUB can be formed from insulating materials such as glass, quartz, and polymer resin. The substrate SUB can be a rigid substrate or a flexible substrate that can be bent, folded, rolled, etc.

[0065] The display unit (PAL) can be placed on the substrate (SUB). The display unit (PAL) can be a layer including multiple emitting regions for emitting light. The display unit (PAL) can include a buffer film, a thin-film transistor layer in which thin-film transistors are disposed, a light-emitting element layer for emitting light, and an encapsulation layer for encapsulating the light-emitting element layer.

[0066] The sensor unit SENL can be placed on the display unit PAL. The sensor unit SENL may include sensor electrodes and can sense whether a user is touching the device.

[0067] A polarizing film PF can be placed on the sensor unit SENL. The polarizing film PF prevents degradation of the image visibility of the display panel 200 due to reflection of external light. The polarizing film PF may include a linear polarizer and a phase retardation film such as a λ / 4 (quarter wavelength) plate. The phase retardation film can be placed on the sensor unit SENL, and the linear polarizer can be placed on the phase retardation film. A cover window 100 can be placed on the polarizing film PF.

[0068] The panel support member 300 may be located below the substrate SUB. The panel support member 300 may be attached to the lower surface of the substrate SUB via an adhesive member, which may be a pressure-sensitive adhesive (PSA). The panel support member 300 may include at least one of the following: a light-absorbing member for absorbing light incident from the outside, a cushioning member for absorbing external impacts, and a heat-dissipating member for effectively dissipating heat from the display panel 200. In one embodiment, the panel support member 300 may overlap with the display panel 200.

[0069] The light-absorbing component can be located below the substrate SUB. The light-absorbing component blocks light transmission to prevent components (such as the circuit board 500) located below the substrate SUB from being seen from above the display panel 200. The light-absorbing component can contain light-absorbing materials such as black pigments and black dyes.

[0070] The buffer member can be located below the light-absorbing member. The buffer member absorbs external impacts to prevent damage to the display panel 200. The buffer member can consist of a single layer or multiple layers. For example, the buffer member can be formed from polymer resins such as polyurethane, polycarbonate, polypropylene, and polyethylene, or it can be formed from elastic materials such as rubber and sponges obtained by foaming urethane or acrylic materials.

[0071] The heat dissipation component can be located below the buffer component. The heat dissipation component may include a first heat dissipation layer comprising graphite or carbon nanotubes and a second heat dissipation layer formed of a thin metal film such as copper, nickel, ferrite, and silver, which is capable of blocking electromagnetic waves and has high thermal conductivity.

[0072] The connecting member 400 can be connected to a plurality of display pads of the display panel 200 via a conductive adhesive member such as an anisotropic conductive film. Accordingly, the display panel 200 and the connecting member 400 can be electrically connected to each other.

[0073] In some aspects, the connecting member 400 can be attached to multiple circuit pads of the circuit board 500 via a conductive adhesive member such as an anisotropic conductive film. As a result, the connecting member 400 and the circuit board 500 can be electrically connected to each other.

[0074] The connecting component 400 can be a flexible printed circuit board or a chip on film.

[0075] Figure 5 This is an example Figure 4 A cross-sectional view of the display panel.

[0076] refer to Figure 5 The display unit PAL may include a buffer layer 202 (also referred to herein as a buffer film), a thin film transistor layer 203, a light-emitting element layer 204, and an encapsulation layer 205.

[0077] A buffer layer 202 can be formed on the substrate SUB to protect the thin-film transistor 235 and the light-emitting element, which are susceptible to moisture penetration, from moisture that permeates through the substrate SUB. The buffer layer 202 can be formed from multiple inorganic layers stacked alternately. For example, the buffer layer 202 can be made of silicon oxide (SiO2). x ) layer, silicon nitride (SiN) x It is a multilayer composition consisting of one or more inorganic layers, including SiON layers, stacked alternately. Buffer layer 202 can be eliminated.

[0078] Thin-film transistor layer 203 is formed on buffer layer 202. Thin-film transistor layer 203 includes thin-film transistor 235, gate insulator 236, interlayer dielectric layer 237, protective layer 238 and organic layer 239.

[0079] Each of the thin-film transistors 235 includes an active layer 231, a gate electrode 232, a source electrode 233, and a drain electrode 234. Figure 5 In this embodiment, the thin-film transistor 235 is implemented as a top-gate transistor in which the gate electrode 232 is located above the active layer 231. However, it should be understood that the embodiments of this disclosure are not limited thereto. That is, the thin-film transistor 235 may be implemented as a bottom-gate transistor in which the gate electrode 232 is located below the active layer 231, or as a dual-gate transistor in which the gate electrode 232 is located both above and below the active layer 231.

[0080] An active layer 231 is formed on a buffer layer 202. The active layer 231 can be formed of a silicon-based semiconductor material or an oxide-based semiconductor material. For example, the active layer 231 can be formed of polycrystalline silicon, amorphous silicon, or an oxide semiconductor. A light-blocking layer for blocking external light incident on the active layer 231 can be formed between the buffer layer 202 and the active layer 231.

[0081] Gate insulator 236 can be formed on active layer 231. Gate insulator 236 can be made of inorganic layer (e.g., silicon oxide (SiO2)). x ) layer, silicon nitride (SiN) x It is formed by (a) layer or multiple layers.

[0082] The gate electrode 232 may be formed on the gate insulator 236. The gate electrode 232 and the gate line may consist of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or their alloys.

[0083] An interlayer dielectric layer 237 can be formed on the gate electrode 232 and the gate line. The interlayer dielectric layer 237 can be formed as an inorganic layer, such as silicon oxide (SiO2). x ) layer, silicon nitride (SiN)x (1) layers or multiple layers thereof.

[0084] Source electrode 233 and drain electrode 234 may be formed on interlayer dielectric layer 237. Each of source electrode 233 and drain electrode 234 may be connected to active layer 231 through contact holes penetrating gate insulator 236 and interlayer dielectric layer 237. Source electrode 233 and drain electrode 234 may consist of a single layer or multiple layers of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof.

[0085] A protective layer 238 can be formed on the source electrode 233 and the drain electrode 234 to insulate the thin-film transistor 235. The protective layer 238 can be composed of an inorganic layer (e.g., silicon oxide (SiO2)). x ) layer, silicon nitride (SiN) x It is formed by (a) layer or multiple layers.

[0086] An organic layer 239 may be formed on the protective layer 238 to provide a flat surface over the thin-film transistor 235 having a height difference. The organic layer 239 may be implemented as an organic film such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0087] The light-emitting element layer 204 is formed on the thin-film transistor layer 203. The light-emitting element layer 204 includes a light-emitting element and a diaphragm.

[0088] The light-emitting element and the embankment are formed on the organic layer 239. As an example of the light-emitting element, an organic light-emitting device including an anode electrode 241, an emitting layer 242 and a cathode electrode 243 is used.

[0089] The anode electrode 241 can be formed on the organic layer 239. The anode electrode 241 can be connected to the drain electrode 234 of the thin-film transistor 235 via a contact hole penetrating the protective layer 238 and the organic layer 239.

[0090] A dam can be formed such that it covers the edge of the anode electrode 241 on the organic layer 239 and defines the emission region EA of the pixel. That is, the dam can define the emission region EA of the pixel. In each pixel, the anode electrode 241, the emission layer 242, and the cathode electrode 243 are stacked on top of each other in sequence, such that holes from the anode electrode 241 and electrons from the cathode electrode 243 recombine in the emission layer 242 to emit light.

[0091] An emitting layer 242 is formed on the anode electrode 241 and the embankment. The emitting layer 242 can be an organic emitting layer. The emitting layer 242 can emit one of red, green, and blue light. Alternatively, the emitting layer 242 can be a white emitting layer that emits white light. In this case, the red, green, and blue emitting layers can be stacked on top of each other, or they can be formed together as a common layer across pixels. In this case, the display panel 200 can further include additional color filters for representing red, green, and blue colors.

[0092] The emitting layer 242 may include a hole transport layer, a light-emitting layer, and an electron transport layer. In some aspects, the emitting layer 242 may be formed as two or more stacked series structures, in which case a charge-generating layer may be formed between these stacks.

[0093] A cathode electrode 243 is formed on the emitter layer 242. The cathode electrode 243 can be formed such that it covers the emitter layer 242. The cathode electrode 243 can be a common layer formed across pixels.

[0094] When the light-emitting element layer 204 is a top-emitting type in which light is emitted upwards, the anode electrode 241 can be formed of a metallic material with high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu). The cathode electrode 243 can be formed of a transparent conductive material (TCP) capable of transmitting light, such as ITO and IZO, or a semi-transmissive conductive material, such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). In the example where the cathode electrode 243 is formed of a semi-transmissive conductive material, the light extraction efficiency can be increased by using a microcavity.

[0095] When the light-emitting element layer 204 is a bottom-emitting type in which light is emitted downwards, the anode electrode 241 can be formed of a transparent conductive material (TCP) capable of transmitting light, such as ITO and IZO, or a semi-transmissive conductive material, such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag). The cathode electrode 243 can be formed of a metallic material with high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of APC alloy and ITO (ITO / APC / ITO). In the example where the anode electrode 241 is formed of a semi-transmissive conductive material, the light extraction efficiency can be increased by using a microcavity.

[0096] An encapsulation layer 205 is formed on the light-emitting element layer 204. The encapsulation layer 205 serves to prevent oxygen or moisture from penetrating into the emitting layer 242 and the cathode electrode 243. For this purpose, the encapsulation layer 205 may include at least one inorganic film. The inorganic film may be formed of silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, or titanium oxide. In some aspects, the encapsulation layer 205 may further include at least one organic film. The organic film may have sufficient thickness to prevent particles from penetrating into the encapsulation layer 205 and entering the emitting layer 242 and the cathode electrode 243. The organic film may contain one of epoxy resin, acrylate, and urethane acrylate.

[0097] The sensor unit SENL can be formed on the encapsulation layer 205. In the example where the sensor unit SENL is formed directly on the encapsulation layer 205, the thickness of the display device 10 can be reduced compared to a display device where a separate touch panel is attached to the encapsulation layer 205.

[0098] The sensor unit SENL may include sensor electrodes for sensing a user's touch via capacitive sensing, and touch lines for connecting pads to the sensor electrodes. For example, the sensor unit SENL can sense a user's touch via self-capacitance sensing or mutual capacitance sensing. Figure 5 In the example illustrated, the sensor unit SENL consists of two layers including a driving electrode TE for mutual capacitance sensing, a sensing electrode RE, and a bridging electrode BE connected between adjacent driving electrodes TE.

[0099] The bridging electrode BE can be formed on the encapsulation layer 205. The bridging electrode BE can be composed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy and / or a stacked structure of APC alloy and ITO (ITO / APC / ITO), but is not limited to the stacked structure of aluminum and titanium (Ti / Al / Ti), the stacked structure of aluminum and ITO (ITO / Al / ITO), the stacked structure of APC alloy and / or the stacked structure of APC alloy and ITO (ITO / APC / ITO). For example, the bridging electrode BE can be composed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or ITO.

[0100] The first sensing insulating layer TINS1 is formed on the bridging electrode BE. The first sensing insulating layer TINS1 may be formed of an inorganic film (e.g., silicon nitride film, silicon oxynitride film, silicon oxide film, titanium oxide film, or aluminum oxide film).

[0101] The driving electrode TE and the sensing electrode RE can be formed on the first sensing insulating layer TINS1. The driving electrode TE and the sensing electrode RE can be composed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy and / or a stacked structure of APC alloy and ITO (ITO / APC / ITO), but are not limited to these. For example, the driving electrode TE and the sensing electrode RE can be composed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or ITO.

[0102] A contact hole may be formed in the first sensing insulating layer TINS1, extending through the first sensing insulating layer TINS1 to expose the bridging electrode BE. The driving electrode TE can be connected to the bridging electrode BE through the contact hole.

[0103] A second sensing insulating layer, TINS2, is formed on the driving electrode TE and the sensing electrode RE. The second sensing insulating layer TINS2 can provide a flat surface on the driving electrode TE, the sensing electrode RE, and the bridging electrode BE, which have different heights. The second sensing insulating layer TINS2 can be formed from an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0104] The bridging electrode BE connecting adjacent driving electrodes TE can be located on the encapsulation layer 205, and the driving electrode TE and the sensing electrode RE can be located on the first sensing insulating layer TINS1. Therefore, the driving electrode TE and the sensing electrode RE can be electrically isolated from each other at their intersection, while the sensing electrode RE can be electrically connected to each other in one direction, and the driving electrode TE can be electrically connected to each other in the other direction.

[0105] The polarizing film PF can be placed on the second sensing insulating layer TINS2 and can prevent the image visibility of the display panel 200 from being degraded due to the reflection of external light.

[0106] Figure 6 yes Figure 1 A magnified view of part A. Figure 7 It is along Figure 6 The cross-sectional view taken by line B-B'.

[0107] refer to Figures 1 to 7The circuit board 500 can be electrically connected to the display panel 200 via the connecting member 400. The circuit board 500 can be a flexible printed circuit board (FPCB) that can be bent, a rigid printed circuit board (PCB) that is not easily bent, or a composite printed circuit board that includes both rigid and flexible printed circuit boards. When the connecting member 400 is bent, the circuit board 500 can overlap with the panel support member 300.

[0108] The circuit board 500 can process signals converted by the control circuit board (not shown) and transmit the signals to the display panel 200. In one embodiment, the circuit board 500 may include a touch integrated circuit 600.

[0109] The touch integrated circuit 600 can detect a user's touch and generate a touch drive signal. The touch integrated circuit 600 may protrude from the circuit board 500 on the third direction D3. When viewed from above, the touch integrated circuit 600 may have a rectangular shape, but embodiments of this disclosure are not limited thereto. For example, when viewed on the third direction D3, the touch integrated circuit 600 may have a rectangular protruding surface.

[0110] The heat dissipation component 700 can cover at least a portion of the touch integrated circuit 600 and can dissipate heat generated in the touch integrated circuit 600. The heat dissipation component 700 can completely cover the protruding surface and side surface of the touch integrated circuit 600. The heat dissipation component 700 may include a first heat dissipation component 710 and a second heat dissipation component 720.

[0111] The first heat sink 710 can cover the protruding surface of the touch integrated circuit 600. When viewed from above, the shape of the first heat sink 710 can conform to the shape of the touch integrated circuit 600. The first heat sink 710 can cover the entire protruding surface of the touch integrated circuit 600. The first heat sink 710 can be provided as a heat sink with thickness.

[0112] The second heat sink 720 may cover the side surface of the touch integrated circuit 600 and the side surface of the first heat sink 710. The second heat sink 720 may be provided as a heat sink with thickness. The side surface of the touch integrated circuit 600 on the circuit board 500 covered by the second heat sink 720 may protrude from the circuit board 500. The second heat sink 720 may cover the side surface of the first heat sink 710.

[0113] Instead of a heat sink, the second heat dissipation member 720 can be provided as a heat dissipation resin. In an example where the second heat dissipation member 720 is provided as a heat dissipation resin, the second heat dissipation member 720 can be applied to the side surface of the first heat dissipation member 710 and the side surface of the touch integrated circuit 600, and covers the side surface of the first heat dissipation member 710 and the side surface of the touch integrated circuit 600.

[0114] Although the first heat sink 710 and the second heat sink 720 can be provided as separate sheets, both the first heat sink 710 and the second heat sink 720 can be provided as a heat-dissipating resin. In the example where the first heat sink 710 and the second heat sink 720 are provided as heat-dissipating resin, the heat-dissipating resin can be applied to the touch integrated circuit 600 and cover all areas of the touch integrated circuit 600 that protrude from the circuit board 500.

[0115] As described herein, since the heat dissipation component 700 covers the touch integrated circuit 600, the heat dissipation component 700 is able to dissipate the heat generated in the touch integrated circuit 600.

[0116] Figure 8 This is a plan view illustrating a display device according to a second embodiment of the present disclosure when the connecting members are unfolded. Figure 9 This illustrates what happens when the connecting component bends. Figure 8 The image shows a view of the display device. Figure 10 yes Figure 9 A magnified view of part C. Figure 11 It is along Figure 10 The cross-sectional view taken by line D-D'. Figure 12 This is an example of placing... Figure 11 A view of the heat dissipation components in the heat dissipation space.

[0117] refer to Figures 8 to 12 The display device 10 according to the second embodiment of the present disclosure may include a cover window 100, a display panel 200, a panel support member 300, a connecting member 400, a circuit board 500, a touch integrated circuit 600, a heat dissipation member 700, and an adhesive sheet 800.

[0118] The cover window 100, display panel 200, panel support member 300, connecting member 400, and touch integrated circuit 600 are the same as those in the first embodiment; and therefore, redundant descriptions will be omitted.

[0119] The circuit board 500 can be electrically connected to the display panel 200 via the connecting member 400. The circuit board 500 can be a flexible printed circuit board (FPCB) that can be bent, a rigid printed circuit board (PCB) that is not easily bent, or a composite printed circuit board that includes both rigid and flexible printed circuit boards. When the connecting member 400 is bent, the circuit board 500 can overlap with the panel support member 300.

[0120] The circuit board 500 can process the signals converted by the control circuit board (not shown) and transmit the signals to the display panel 200.

[0121] A heat release area (HRA) can be formed at (or in) the circuit board 500. The heat release area (HRA) can be formed from the surface of the circuit board 500. Figure 12 The heat dissipation area HRA is recessed into a groove in the circuit board 500 (the lower surface of the third-party circuit is facing upwards). When viewed from above, the shape of the heat dissipation area HRA can conform to the shape of the touch integrated circuit 600. Figure 12 The third-party D3 is formed under the touch integrated circuit 600, so that the heat release area HRA is aligned with the touch integrated circuit 600.

[0122] The heat sink 700 can be located (or placed) inside the heat release area HRA. The heat sink 700 can be provided as a heat sink with thickness. When viewed from above, the shape of the heat sink 700 can conform to the shape of the touch integrated circuit 600. The heat sink 700 can overlap with the touch integrated circuit 600 inside the heat release area HRA. The heat sink 700 can... Figure 12 The third-party D3 is placed on the upper inner surface of the heat release area HRA.

[0123] The adhesive sheet 800 can overlap with the panel support member 300. When the connecting member 400 is bent, the adhesive sheet 800 can be placed between the panel support member 300 and the circuit board 500. For example, the panel support member 300 is... Figure 12 The third party on the upper surface of D3 and the circuit board 500 on Figure 12 The lower surface of the third-party D3 can contact the adhesive sheet 800. Accordingly, the panel support member 300 and the circuit board 500 can be connected to each other.

[0124] A portion of the adhesive sheet 800 can be removed, creating a removal area. When viewed from above, the shape of the removal area of ​​the adhesive sheet 800 can correspond to the shape of the heat release area HRA. The removal area of ​​the adhesive sheet 800 can overlap with the heat release area HRA.

[0125] As described herein, the heat release area HRA and heat dissipation component 700 overlap with the touch integrated circuit 600, and the heat release area HRA and heat dissipation component 700 are arranged between the display panel 200 and the touch integrated circuit 600, so that the heat release area HRA and heat dissipation component 700 can prevent the heat generated in the touch integrated circuit 600 from being directly transferred to the display panel 200.

[0126] Figure 13 This is a view illustrating a heat dissipation component placed inside the adhesive sheet. Figure 14 This is a view illustrating a heat dissipation component placed inside the panel support member.

[0127] refer to Figure 13 and Figure 14 The display device 10 according to the third embodiment of the present disclosure may include a cover window 100, a display panel 200, a panel support member 300, a connecting member 400, a circuit board 500, a touch integrated circuit 600, a heat dissipation member 700, and an adhesive sheet 800.

[0128] The cover window 100, display panel 200, panel support member 300, connecting member 400, circuit board 500, touch integrated circuit 600, and adhesive sheet 800 are the same as those in the second embodiment; and therefore, redundant descriptions will be omitted. However, it should be noted that, according to the third embodiment, no heat release area HRA is formed in the circuit board 500.

[0129] The heat dissipation component 700 can be placed inside the adhesive sheet 800. For example, a portion of the adhesive sheet 800 is removed, and the heat dissipation component 700 can be placed in that portion. The thickness of the heat dissipation component 700 can be equal to the thickness of the adhesive sheet 800.

[0130] When viewed from above, the shape of the heat sink 700 can conform to the shape of the touch integrated circuit 600. The heat sink 700 can be positioned as follows: Figure 13 The third-party component D3, as illustrated, is located below the touch integrated circuit 600, such that the heat sink 700 is aligned with the touch integrated circuit 600. The heat sink 700 can contact the panel support component 300 and the circuit board 500.

[0131] Alternatively, the heat sink 700 can be placed inside the panel support member 300. The heat sink 700 can be provided as a heat sink with thickness. When viewed from above, the shape of the heat sink 700 can be consistent with the shape of the touch integrated circuit 600, and the area of ​​the heat sink 700 when viewed from above can be larger than the area of ​​the touch integrated circuit 600.

[0132] Heat dissipation component 700 can be used in, for example Figure 14 The third component, as illustrated, is embedded from the upper surface into the panel support member 300 on the surface of D3. Accordingly, the heat dissipation member 700 can contact the adhesive sheet 800.

[0133] The heat sink 700 can overlap with the touch integrated circuit 600. For example, the heat sink 700 can be... Figure 14 The third-party D3 is located below the touch integrated circuit 600, so that the heat dissipation component 700 is aligned with the touch integrated circuit 600.

[0134] As described herein, the heat dissipation component 700 overlaps with the touch integrated circuit 600 and is placed between the display panel 200 and the touch integrated circuit 600, so that the heat dissipation component 700 can prevent the heat generated in the touch integrated circuit 600 from being directly transferred to the display panel 200.

[0135] The display device according to embodiments of this disclosure can be applied to various electronic devices. The electronic device according to embodiments includes the display device described herein, and may further include modules or devices with additional features in addition to the display device.

[0136] Figure 15 This is a block diagram of an electronic device according to an embodiment of the present disclosure.

[0137] refer to Figure 15 The electronic device 10000 according to embodiments of the present disclosure may include a display module 10001, a processor 10002, a memory 10003, and a power module 10004.

[0138] The processor 10002 may include at least one of the following: a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0139] The memory 10003 can store data information supporting the operation of the processor 10002 or the display module 10001. In an example where the processor 10002 executes an application stored in the memory 10003, image data signals and / or input control signals can be transmitted to the display module 10001. The display module 10001 can process the received signals and output image information through the display screen.

[0140] The power module 10004 may include a power module such as a power adapter and a battery device, as well as a power conversion module that converts the power supplied by the power module to generate power for the operation of the electronic device 10000.

[0141] At least one of the elements of the electronic device 10000 described herein may be included in the display device according to the embodiments described herein. In some aspects, some of the various modules that serve as a single module may be included in the display device, while some other modules may be provided separately from the display device. For example, the display device may include a display module 10001, and a processor 10002, a memory 10003, and a power module 10004 may be implemented as other means within the electronic device 10000 that replace the display device.

[0142] Figure 16 This is a view illustrating various embodiments of an electronic device according to the present disclosure.

[0143] refer to Figure 16 The various electronic devices employing the display device according to the embodiments may include not only image display electronic devices such as smartphones 10000_1a, tablet PCs 10000_1b, laptop computers 10000_1c, TVs 10000_1d, and desktop monitors 10000_1e, but also wearable electronic devices including display modules such as smart glasses 10000_2a, head-mounted displays 10000_2b, and smartwatches 10000_2c, as well as vehicle electronic devices 10000_3 including display modules, such as central information displays (CIDs) placed on the vehicle's instrument panel, center console, and dashboard, and in-vehicle mirror displays.

[0144] However, it should be understood that the aspects and features of the embodiments of this disclosure are not limited to those set forth herein. The above and other aspects of this disclosure will become more apparent to those skilled in the art to which this disclosure pertains by referring to the claims (including their equivalents).

Claims

1. A display device, comprising: Display panel; A panel support member overlaps with the display panel; Connecting components are attached to the display panel; A circuit board connected to the connecting member and including a touch integrated circuit; as well as A heat dissipation component dissipates the heat generated in the touch integrated circuit.

2. The display device according to claim 1, wherein: The touch integrated circuit protrudes from the circuit board, and The heat dissipation component covers at least a portion of the touch integrated circuit.

3. The display device according to claim 2, wherein the heat dissipation component completely covers the protruding surface and side surface of the touch integrated circuit.

4. The display device according to claim 3, wherein the heat dissipation component comprises: A first heat dissipation component covers the protruding surface of the touch integrated circuit; as well as The second heat dissipation component covers the side surface of the touch integrated circuit and the side surface of the first heat dissipation component.

5. The display device of claim 4, wherein the side surface of the touch integrated circuit covered by the second heat dissipation member protrudes from the circuit board.

6. The display device according to claim 1, wherein: When the connecting member bends, the circuit board overlaps with the panel support member, and The heat dissipation component is placed inside the panel support component.

7. The display device according to claim 6, wherein the heat dissipation component overlaps with the touch integrated circuit.

8. The display device according to claim 6, further comprising: An adhesive sheet is provided between the panel support member and the circuit board when the connecting member is bent. The heat dissipation component is in contact with the adhesive sheet.

9. The display device according to claim 1, further comprising: The adhesive sheet overlaps with the panel support member. in: When the connecting member is bent, the circuit board contacts the adhesive sheet, and The heat dissipation component is placed inside the adhesive sheet.

10. The display device of claim 9, wherein the heat dissipation component overlaps with the touch integrated circuit.

11. The display device according to claim 9, wherein the heat dissipation member is in contact with the panel support member and the circuit board.

12. A display device, comprising: Display panel; A panel support member overlaps with the display panel; Connecting components are attached to the display panel; as well as A circuit board, connected to the connecting member, and including a touch integrated circuit. The heat release area formed in the circuit board overlaps with the touch integrated circuit.

13. The display device according to claim 12, further comprising: The adhesive sheet overlaps with the panel support member. When the connecting member is bent, the circuit board comes into contact with the adhesive sheet.

14. The display device according to claim 13, wherein: The heat release area is recessed from the surface of the circuit board into the circuit board, and When the connecting member is bent, the surface of the circuit board comes into contact with the adhesive sheet.

15. The display device according to claim 14, wherein: A portion of the adhesive sheet is removed to form a removal area, and The removal area overlaps with the heat release area.

16. The display device according to claim 12, further comprising: A heat dissipation component is placed inside the heat release area.

17. The display device of claim 16, wherein the heat dissipation component overlaps with the touch integrated circuit.

18. An electronic device comprising a display device according to any one of claims 1 to 17.

19. The electronic device of claim 18, further comprising at least one of the following: processor; The memory stores data relating to one or more of the display panel and the processor. as well as The power module supplies power to the display panel, the processor, and the memory.

Images